Image capture device and method for cooling heat source in image capture device

Abstract

An imaging device capable of efficiently cooling a plurality of heat sources and a method for cooling the heat sources in the imaging device are provided. [Solution] The imaging device comprises a fan that operates to draw in air through an intake port provided on the outer surface of the imaging device and exhaust the air through an exhaust port provided on the outer surface, a first flow path member having a first flow path between the intake port and the fan, a second flow path member having a second flow path between the intake port and the fan, a third flow path member having a third flow path between the fan and the exhaust port, a first heat source that is cooled by air in the second flow path, and a second heat source that is cooled by air in the third flow path.

Description

[Technical Field]

[0001] The present disclosure relates to an imaging device and a method for cooling a heat source in the imaging device. [Background technology]

[0002] BACKGROUND ART Conventionally, imaging devices having a cooling structure for cooling a heat source such as an IC are known (see, for example, Patent Document 1).

[0003] The imaging device of Patent Document 1 has an intake hole and an exhaust hole provided in the housing, and a fan that operates to draw air through the intake hole and expel it through the exhaust hole. In this configuration, the intake hole has a first intake hole and a second intake hole, and a first electronic component is provided in a first duct that communicates with the first intake hole, and a second electronic component is provided in a second duct that communicates with the second intake hole, thereby cooling multiple electronic components (heat sources). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2020-113889 Summary of the Invention [Problem to be solved by the invention]

[0005] However, there is a need to cool multiple heat sources more efficiently.

[0006] An object of the present disclosure is to provide an imaging device capable of efficiently cooling multiple heat sources and a method for cooling heat sources in an imaging device. [Means for solving the problem]

[0007] The imaging device according to the present disclosure includes a fan that operates to draw in air through an intake port provided on the outer surface of the imaging device and discharge the air through an exhaust port provided on the outer surface, a first flow path member having a first flow path between the intake port and the fan, a second flow path member having a second flow path between the intake port and the fan, a third flow path member having a third flow path between the fan and the exhaust port, a first heat source that is cooled by air in the second flow path, and a second heat source that is cooled by air in the third flow path.

[0008] The heat source cooling method for an imaging device according to the present disclosure operates a fan to draw in air through an intake port provided on the outer surface of the imaging device and discharge the air through an exhaust port provided on the outer surface, thereby causing the air to flow through a first flow path between the intake port and the fan, causing the air to flow through a second flow path between the intake port and the fan to cool a first heat source, and causing the air to flow through a third flow path between the fan and the exhaust port to cool a second heat source. [Effects of the Invention]

[0009] According to the present disclosure, multiple heat sources can be cooled more efficiently. [Brief explanation of the drawings]

[0010] [Figure 1] Perspective view of an imaging device [Figure 2] FIG. 1 is a perspective view of the periphery of a cover member; [Figure 3] FIG. 3 is a perspective view showing a state in which a cover member is removed from the configuration of FIG. 2; [Figure 4] FIG. 4 is a perspective view showing a state in which a first support member is further removed from the configuration of FIG. 3; [Figure 5] FIG. 5 is a cross-sectional view schematically showing the flow channel configurations of FIGS. 3 and 4. [Figure 6] FIG. 6 is a diagram illustrating the configuration of FIG. 5 more schematically. [Figure 7] Schematic diagram showing a modified example [Figure 8] Schematic diagram showing another modified example DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. However, more detailed explanation than necessary may be omitted. For example, detailed explanation of well-known matters or redundant explanation of substantially the same configuration may be omitted.

[0012] The applicant provides the accompanying drawings and the following description to enable those skilled in the art to fully understand the present disclosure, and does not intend for them to limit the subject matter described in the claims.

[0013] (Embodiment) Hereinafter, the imaging device and the heat source cooling method in the imaging device according to this embodiment will be described with reference to the drawings.

[0014] Fig. 1 is a perspective view showing an imaging device of this embodiment. As shown in Fig. 1, the imaging device 2 of this embodiment includes a main body 4, a lens barrel 6, a viewfinder 8, an imaging unit (not shown) having an imaging element that converts light into an electrical signal, and a control unit (not shown) that controls these.

[0015] The main body 4 is a part that constitutes the outer shell of the imaging device 2. Various switches and the like are provided on the exterior of the main body 4, and various components such as an imaging unit, a control unit, and a fan are built into the main body 4. The lens barrel 6 holds the lens 7 and is provided at the front (subject side) of the main body 4. The viewfinder 8 is a component that allows the imaging status to be confirmed by an image displayed on a display unit (not shown) based on information acquired by the imaging unit (not shown). If the lens 7 side of the main body 4 is considered the front, the viewfinder 8 is provided at the rear of the main body 4. The viewfinder 8 may be located not only at the rear of the main body 4 but also on the side of the main body 4, for example. The viewfinder 8 may be configured, for example, as having an eyepiece or eyepiece; as having a display unit (e.g., LCD) instead of the viewfinder 8; as having an external device (e.g., PC, mobile phone, smartphone, tablet terminal, etc.) equipped with a display unit via a wired or wireless communication interface to display the content being captured; or as a combination of these.

[0016] 1, a cover member 10 is provided as a member that constitutes the outer surface of the main body 4. In addition, as a cooling structure for cooling the heat source, an intake port 12 is formed at the rear of the cover member 10, and an exhaust port 14 is formed at the front of the cover member 10.

[0017] FIG. 2 is a perspective view of the periphery of the cover member 10. As shown in FIG.

[0018] 2, an intake block 16 and an exhaust block 18 are attached to the cover member 10. The intake block 16 is a block member having an intake port 12, and the exhaust block 18 is a block member having an exhaust port 14.

[0019] A fan 20 is built into the inside of the cover member 10. In Figure 2, the fan 20 is indicated schematically by a dotted line.

[0020] The fan 20 operates to generate a flow of air for cooling the heat source. When the fan 20 operates, air is drawn in through the intake port 12 (arrow A1), passes through the inside of the imaging device 2, and is discharged from the exhaust port 14 (arrow A2).

[0021] The imaging device 2 of this embodiment has a structure for efficiently cooling a plurality of heat sources, such as ICs and communication modules, built in. This structure will be described with reference to FIG. 3 and subsequent drawings.

[0022] FIG. 3 is a perspective view showing a state in which the cover member 10 is removed from the configuration shown in FIG.

[0023] As shown in FIG. 3, a first support member 22 is provided inside the cover member 10.

[0024] The first support member 22 is a member that supports the board 24 and the communication module 26. The board 24 is a board on which the communication module 26 is mounted. The communication module 26 is a module with a communication function, and operates while mounted on the board 24. By attaching the board 24 to the support member 22, the board 24 and the communication module 26 are integrally supported by the support member 22. The first support member 22 of this embodiment has a plate-like shape.

[0025] In order to improve the communication function of the communication module 26, it is preferable to place the communication module 26 as far outside as possible from the imaging device 2 without shielding it with a metal plate or the like. In this embodiment, only the cover member 10 is located outside the communication module 26, and the cover member 10 is made of resin and has low radio wave shielding function. This can improve the communication function of the communication module 26.

[0026] 3, an opening 28 is formed in the first support member 22. The opening 28 is a hole for generating a flow of air that cools the communication module 26.

[0027] FIG. 4 is a perspective view showing a state in which the first support member 22 is further removed from the configuration shown in FIG.

[0028] 4, the fan 20 (FIG. 2) and the second support member 30 are arranged inside the first support member 22. The second support member 30 is a plate-shaped member that supports the fan 20.

[0029] The fan 20 has a fan inlet 32 ​​and a fan outlet 34 .

[0030] The fan inlet 32 ​​is an opening through which air is drawn into the interior of the fan 20, and the fan outlet 34 is an opening through which the air drawn into the interior of the fan 20 is discharged.

[0031] A heat dissipation member 36 is disposed at a position facing the fan outlet 34. The heat dissipation member 36 is a member to which a plurality of heat sources such as ICs 38, which will be described later, are thermally connected, and may also be called a "heat sink."

[0032] When the fan 20 operates, the air drawn in through the air intake 12 flows mainly toward the fan inlet 32 ​​of the fan 20 (arrow A3) and is discharged from the fan outlet 34 (arrow A4). The air discharged from the fan outlet 34 flows along the surface of the heat dissipation member 36, thereby cooling the heat dissipation member 36 and cooling heat sources such as ICs 38 that are thermally connected to the heat dissipation member 36.

[0033] 3, another flow path is formed outside the first support member 22, i.e., in the space between the first support member 22 and the cover member 10. A portion of the air drawn in through the air intake 12 branches downward and flows along the plate-shaped member 39, then flows along the outer surface of the first support member 22 and enters the opening 28 (arrow A5). This air flows along the surface of the communication module 26, thereby cooling the communication module 26.

[0034] The flow path configurations shown in FIGS. 3 and 4 will be described with reference to FIGS. 5 and 6. FIG.

[0035] FIG. 5 is a cross-sectional view that schematically shows the flow channel configuration shown in FIGS. 3 and 4, and FIG. 6 is a diagram that more schematically shows the configuration of FIG.

[0036] 5, an IC 38 and a memory 40 are provided as heat sources thermally connected to the heat dissipation member 36. Of the heat sources built into the imaging device 2, the IC 38 generates the most heat.

[0037] In this embodiment, both the IC 38 and the memory 40 are attached to the back surface of the second support member 30. The second support member 30 in this embodiment is made of a material with high thermal conductivity, such as metal, and functions as a heat transfer member that transfers heat. Note that the IC 38 and the memory 40 may be attached to the back surface of the second support member 30 via a heat transfer member.

[0038] In this specification, the term "heat transfer member" refers to a member made of a material with high thermal conductivity such as metal (for example, a metal plate or a graphite sheet), and does not include a member made of a material with low thermal conductivity such as resin. The heat transfer member includes a TIM (Thermal Interface Material).

[0039] The fan 20 is not directly attached to the second support member 30, but is indirectly attached via an intermediate attachment member 37. Heat from the IC 38 and memory 40 is transferred mainly to the heat dissipation member 36, not to the fan 20.

[0040] The heat dissipation member 36 may be thermally connected to a heat source (for example, a storage medium) other than the IC 38 and the memory 40.

[0041] 5 and 6, air flowing in through the intake port 12 flows through a first flow path B1. The first flow path B1 is a flow path that extends from the intake port 12 to the fan inlet 32 ​​and is defined by at least a first support member 22 and a second support member 30. The first support member 22 and the second support member 30 are first flow path members that define the first flow path B1.

[0042] An opening 42 is provided midway along the first flow path B1. The opening 42 allows a portion of the air flowing through the first flow path B1 to flow into the second flow path B2. The second flow path B2 is a flow path extending from the opening 42 to the opening 28, and is defined by at least the first support member 22 and the cover member 10. The first support member 22 and the cover member 10 are second flow path members that define the second flow path B2.

[0043] The second flow path B2 in this embodiment is a flow path that branches off from the first flow path B1 midway and then merges with the first flow path B1 again.

[0044] As shown in Figures 5 and 6, the communication module 26 is disposed in the second flow path B2 as a heat source. In contrast, no heat source or heat dissipation member thermally connected to the heat source is disposed in the first flow path B1. With this arrangement, the communication module 26 is cooled by the airflow in the second flow path B2, while the airflow in the first flow path B1 can be maintained at a low temperature (approximately room temperature). Therefore, even if the airflow in the second flow path B2 that has absorbed heat from the communication module 26 merges with the first flow path B1, an overall temperature increase can be suppressed, and low-temperature air can be sent to the fan 20.

[0045] Furthermore, in this embodiment, the area of ​​the opening 42 on the upstream side of the second flow path B2 is made smaller than the area of ​​the opening 28 on the downstream side.

[0046] By reducing the size of the upstream opening 42, it becomes easier to control the amount of airflow flowing from the first flow path B1 to the second flow path B2 to be relatively small. Since the communication module 26 generates less heat than the IC 38, by keeping the amount of airflow through the second flow path B2 small, the communication module 26 can be cooled with an appropriate amount of airflow.

[0047] By enlarging the downstream opening 28, it becomes easier to control the wind pressure at the opening 42 to be higher than the wind pressure at the opening 28. This makes it possible to stably generate a flow from the opening 42 toward the opening 28, and to suppress backflow.

[0048] Air discharged from the fan outlet 34 flows through the third flow path B3. The third flow path B3 is a flow path that extends from the fan outlet 34 to the exhaust port 14 and is defined by at least the first support member 22 and the second support member 30. The first support member 22 and the second support member 30 are third flow path members that define the third flow path B3.

[0049] The heat dissipation member 36 is disposed in the third flow path B3. As described above, the air taken in by the fan 20 is relatively low temperature, so the heat dissipation member 36 can be cooled by a large volume of low-temperature air. This allows the ICs 38 and memory 40, which generate a large amount of heat, to be effectively cooled.

[0050] In the imaging device 2 having the above configuration and functions, when the fan 20 is operated, an air flow is generated in which air is drawn in through the intake port 12 and expelled from the exhaust port 14. In this air flow, air flows through a first flow path B1 and a second flow path B2 between the intake port 12 and the fan 20, and air flows through a third flow path B3 between the fan 20 and the exhaust port 14. Here, the air in the first flow path B1 does not cool the heat source, the air in the second flow path B2 cools the communication module 26 (first heat source), and the air in the third flow path B3 cools the IC 38 and the memory 40 (second heat source). This makes it possible to efficiently cool each heat source according to the difference in the heat generation amount of each heat source.

[0051] (Actions and Effects) As described above, the imaging device 2 of this embodiment includes a fan 20 that operates to draw in air through an intake port 12 provided on the outer surface of the imaging device 2 and exhaust the air from an exhaust port 14 provided on the outer surface, a first flow path member (e.g., a first support member 22, a second support member 30) having a first flow path B1 between the intake port 12 and the fan 20, a second flow path member (e.g., a first support member 22, a cover member 10) having a second flow path B2 between the intake port 12 and the fan 20, a third flow path member (e.g., a first support member 22, a second support member 30) having a third flow path B3 between the fan 20 and the exhaust port 14, a first heat source (e.g., a communication module 26) that is cooled by air through the second flow path B2, and a second heat source (e.g., an IC 38) that is cooled by air through the third flow path B3.

[0052] With this configuration, it is possible to efficiently cool a plurality of heat sources.

[0053] Furthermore, in the imaging device 2 of this embodiment, a heat source or a heat dissipation member 36 thermally connected to a heat source is not disposed in the first flow path B1. With this configuration, by sending low-temperature air from the first flow path B1 to the third flow path B3, the cooling effect of the second heat source can be improved.

[0054] Furthermore, in the imaging device 2 of this embodiment, the first heat source (for example, the communication module 26) is arranged in the second flow path B2. With this configuration, the first heat source can be directly cooled, thereby enhancing the cooling effect of the first heat source.

[0055] Moreover, the imaging device 2 of this embodiment further includes a heat dissipation member 36 thermally connected to a second heat source (e.g., IC 38), and the heat dissipation member 36 is disposed in the third flow path B3. With this configuration, the second heat source can be indirectly cooled via the heat dissipation member 36.

[0056] Furthermore, in the imaging device 2 of this embodiment, a plurality of second heat sources (e.g., IC 38, memory 40) are provided, and the plurality of second heat sources are thermally connected to the heat dissipation member 36. With this configuration, the plurality of second heat sources can be efficiently cooled by the airflow through the third flow path B3, which has a large air volume.

[0057] Furthermore, in the imaging device 2 of this embodiment, the first heat source includes the communication module 26. With this configuration, the communication module 26, which generates less heat than the IC 38, can be efficiently cooled by the air flowing through the second flow path B2.

[0058] Furthermore, in the imaging device 2 of this embodiment, the second flow path member having the second flow path B2 includes a cover member 10 that forms the outer surface, and a first support member 22 that is disposed inside the cover member 10 and supports the first heat source. With this configuration, by disposing the first heat source including the communication module 26 close to the outer surface of the imaging device 2, the communication function of the communication module 26 can be improved.

[0059] Furthermore, in the imaging device 2 of this embodiment, the second heat source includes an IC 38. With this configuration, the second heat source, which generates a large amount of heat, can be efficiently cooled by the airflow through the third flow path B3, which has a large air volume. Note that the second heat source may include an imaging unit (not shown) or may be thermally connected to the imaging unit.

[0060] Furthermore, in the imaging device 2 of this embodiment, the second heat source (e.g., IC 38) generates more heat than the first heat source (e.g., communication module 26). With this configuration, the second heat source, which generates more heat, can be efficiently cooled by the airflow through the third flow path B3, which has a large airflow rate.

[0061] In the imaging device 2 of this embodiment, the second flow path B2 is a flow path that branches off from the first flow path B1 and then merges with the first flow path B1 again. With this configuration, the air volume of the second flow path B2 can be easily adjusted, for example, by relatively reducing the air volume.

[0062] Furthermore, in the imaging device 2 of this embodiment, the second flow path member having the second flow path B2 has an upstream opening 42 (first opening) and a downstream opening 28 (second opening) that communicate with the first flow path B1 of the first flow path member, and the area of ​​the opening 42 is smaller than the area of ​​the opening 28. With this configuration, by narrowing the opening 42, the amount of air flowing through the second flow path B2 is relatively small, while by widening the opening 28, a pressure difference is more likely to occur between the opening 42 and the opening 28, allowing air to flow stably through the second flow path B2.

[0063] As described above, the heat source cooling method for the imaging device 2 of this embodiment involves operating the fan 20 to draw in air through the intake port 12 provided on the outer surface of the imaging device 2 and expelling the air from the exhaust port 14 provided on the outer surface, thereby causing the air to flow through the first flow path B1 between the intake port 12 and the fan 20, causing the air to flow through the second flow path B2 between the intake port 12 and the fan 20 to cool the first heat source (e.g., the communication module 26), and causing the air to flow through the third flow path B3 between the fan 20 and the exhaust port 14 to cool the second heat source (e.g., the IC 38).

[0064] According to this method, multiple heat sources can be cooled efficiently. Note that, as long as this method is achieved, the positions of the intake port 12 and the exhaust port 14 in the imaging device 2 are not important. For example, the intake port 12 and the exhaust port 14 may be arranged in opposite directions. Furthermore, in the above-described embodiment, the intake port 12 and the exhaust port 14 are arranged in the front and rear of the imaging device 2, but they may also be arranged in any physically possible direction, such as up and down, left and right.

[0065] (Other embodiments) The present disclosure is not limited to the above-described embodiment, and various embodiments are possible.

[0066] In the above embodiment, the case where the volume of air flowing through each of the three flow paths B1 to B3 is constant has been described, but this is not limiting and an "air volume change member" that can change the volume of air may be provided. For example, in the example shown in Fig. 7, an air volume change member 100 that can change the volume of air flowing through the second flow path B2 is provided.

[0067] 7 is provided adjacent to the opening 42, which is the inlet of the second flow path B2, and is movable to change the amount of air flowing into the opening 42. Specifically, the air volume change member 100 is movable between a first position where the flow rate of air flowing into the second flow path B2 is relatively increased, and a second position where the flow rate of air flowing into the second flow path B2 is relatively decreased. The movement of the air volume change member 100 may be electrically controlled by a control unit (not shown), or may be controlled by any other method.

[0068] According to this configuration, by controlling the position of the air volume change member 100, the flow rate of air flowing into the second flow path B2 can be changed depending on the usage state of the communication module 26, and multiple heat sources can be cooled more efficiently. For example, the position of the air volume change member 100 may be controlled so that the flow rate of air flowing into the second flow path B2 is relatively small when the communication module 26 is not in use (when the amount of heat generated is low), and the flow rate is relatively large when the communication module 26 is in use (when the amount of heat generated is high).

[0069] In the above embodiment, the second flow path B2 is a flow path that branches off from the first flow path B1 and then merges with the first flow path B1, but the present invention is not limited to this. For example, as shown in Fig. 8, the first flow path B4 and the second flow path B5 may extend in parallel from the intake port 12 to the fan 20. The air drawn into the fan 20 is blown out toward the third flow path B6 and flows along the surface of the heat dissipation member 36 connected to a heat source such as an IC 38 (not shown).

[0070] Therefore, the components shown in the accompanying drawings and detailed description may include not only essential components for solving the problem, but also components that are not essential for solving the problem in order to illustrate the above technology. Therefore, the fact that these non-essential components are shown in the accompanying drawings or detailed description should not be interpreted as immediately indicating that these non-essential components are essential.

[0071] Furthermore, since the above-described embodiments are intended to illustrate the technology of the present disclosure, various modifications, substitutions, additions, omissions, etc. may be made within the scope of the claims or their equivalents.

[0072] The present disclosure is widely applicable to imaging devices. [Explanation of symbols]

[0073] 2. Imaging device 10 Cover member (second flow path member) 12 Air intake 14 Exhaust port 16 Intake block 18 Exhaust block 20 fans 22 First support member (first flow path member, second flow path member, third flow path member) 24 PCB 26 Communication Module 28 Aperture 30 second support member (first flow path member, third flow path member) 32 Fan Entrance 34 Fan outlet 36 Heat dissipation material 38 IC 40 memory 42 Aperture 100 Air volume change member B1 First flow path B2 Second flow path B3 Third flow path B4 First flow path B5 Second flow path B6 Third flow path

Claims

1. a fan that operates to draw air through an intake port provided on an outer surface of the imaging device and to discharge the air through an exhaust port provided on the outer surface; a first flow path member having a first flow path between the intake port and the fan; a second flow path member having a second flow path between the intake port and the fan; a third flow path member having a third flow path between the fan and the exhaust port; a first heat source that is cooled by air in the second flow path and is disposed in the second flow path; a second heat source cooled by the air in the third flow path.

2. a fan that operates to draw air through an intake port provided on an outer surface of the imaging device and to discharge the air through an exhaust port provided on the outer surface; a first flow path member having a first flow path between the intake port and the fan; a second flow path member having a second flow path between the intake port and the fan; a third flow path member having a third flow path between the fan and the exhaust port; a first heat source cooled by the air in the second flow path; a second heat source cooled by the air in the third flow path, an imaging device, wherein the second flow path member includes a cover member that forms the outer surface, and a support member that is disposed inside the cover member and supports the first heat source;

3. a fan that operates to draw air through an intake port provided on an outer surface of the imaging device and to discharge the air through an exhaust port provided on the outer surface; a first flow path member having a first flow path between the intake port and the fan; a second flow path member having a second flow path between the intake port and the fan; a third flow path member having a third flow path between the fan and the exhaust port; a first heat source cooled by the air in the second flow path; a second heat source cooled by the air in the third flow path, the second flow path is a flow path that branches off from the first flow path and then merges with the first flow path again, the second flow path member has a first opening on an upstream side and a second opening on a downstream side that communicate with the first flow path of the first flow path member, An imaging device, wherein an area of ​​the first opening is smaller than an area of ​​the second opening.

4. a fan that operates to draw air through an intake port provided on an outer surface of the imaging device and to discharge the air through an exhaust port provided on the outer surface; a first flow path member having a first flow path between the intake port and the fan; a second flow path member having a second flow path between the intake port and the fan; a third flow path member having a third flow path between the fan and the exhaust port; a first heat source cooled by the air in the second flow path; a second heat source cooled by the air in the third flow path, The imaging device further includes an air volume change member that operates to change the volume of air flowing through the second flow path.

5. The imaging device according to claim 1 , wherein a heat source or a heat dissipation member thermally connected to a heat source is not disposed in the first flow path.

6. a heat dissipation member thermally connected to the second heat source; The imaging device according to claim 1 , wherein the heat dissipation member is disposed in the third flow path.

7. a plurality of the second heat sources are provided; The imaging device according to claim 6 , wherein a plurality of the second heat sources are thermally connected to the heat dissipation member.

8. The imaging device according to claim 1 , wherein the first heat source includes a communication module.

9. The imaging device according to claim 1 , wherein the second heat source includes an IC.

10. The imaging device according to claim 1 , wherein the second heat source generates a larger amount of heat than the first heat source.

11. By operating the fan, air is drawn in through an intake port provided on the outer surface of the imaging device and the air is discharged through an exhaust port provided on the outer surface, air is passed through a first flow path between the intake port and the fan; air is caused to flow through a second flow path between the intake port and the fan to cool a first heat source disposed in the second flow path; a cooling method for a heat source in an imaging device, the method comprising: cooling a second heat source by flowing air through a third flow path between the fan and the exhaust port;

12. By operating the fan, air is drawn in through an intake port provided on the outer surface of the imaging device and the air is discharged through an exhaust port provided on the outer surface, air is passed through a first flow path between the intake port and the fan; cooling a first heat source by flowing air through a second flow path between the intake port and the fan; cooling the second heat source by flowing air through a third flow path between the fan and the exhaust port; A method for cooling a heat source in an imaging device, wherein the second flow path branches off from the first flow path midway through a first opening and joins the first flow path through a second opening having a larger area than the first opening.

13. By operating the fan, air is drawn in through an intake port provided on the outer surface of the imaging device and the air is discharged through an exhaust port provided on the outer surface, air is passed through a first flow path between the intake port and the fan; cooling a first heat source by flowing air through a second flow path between the intake port and the fan; cooling the second heat source by flowing air through a third flow path between the fan and the exhaust port; A method for cooling a heat source in an imaging device, comprising: operating an air volume change member to change the volume of air flowing through the second flow path.

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