Battery thermal management using large area planar heat pipes
The thermal management system with planar heat pipes and heat sinks addresses uneven temperature distribution in battery packs, enhancing performance and lifespan by maintaining uniform temperatures and enabling larger battery designs.
Patent Information
- Application Number
- JP2021164021
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Priority Date
- 2020-10-08
- Filing Date
- 2021-10-05
- Publication Date
- 2025-11-18
- Estimated Expiration
- 2041-10-05
AI Technical Summary
Conventional thermal management systems for battery packs struggle with uneven temperature distribution and overheating, which adversely affect battery performance and lifespan.
A thermal management system utilizing a planar heat pipe arrangement and heat sink structure with multiple heat pipes and heat sinks in thermal contact with battery packs to maintain uniform temperature distribution and dissipate heat effectively.
The system achieves improved battery performance and extended lifespan by reducing temperature gradients across battery packs while maintaining optimal operating temperatures, allowing for larger battery sizes and flexible design without size limitations.
Smart Images

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Abstract
Description
[Technical Field]
[0001] SUMMARY OF THE INVENTION Embodiments generally relate to a thermal management system for cooling one or more battery packs of a battery. [Background technology]
[0002] A battery system including one or more battery packs, each having one or more batteries, generates heat during operation. Because overall battery performance is adversely affected by overheating and uneven temperature distribution within the battery pack, a thermal management system is provided. Conventional thermal management systems may include, for example, air cooling, liquid cooling, phase change cooling, fan cooling, and fin cooling.
[0003] An example of a thermal management system is a heat pipe, which can be used to maintain an appropriate temperature within a battery system. A heat pipe is a heat transfer device that generally includes a sealed housing with an inner wall of a wick-like capillary material and a small amount of working fluid under a partial vacuum. Conventional heat pipe structures are generally tubular in cross section and include evaporator and condenser regions. Heat is absorbed in the evaporator section by evaporation of the working fluid and released in the condenser section by condensation of the vapor. Summary of the Invention
[0004] Embodiments relate to a thermal management system for cooling a battery system including one or more battery packs. The thermal management system, according to one or more embodiments, is configured to provide uniform temperature distribution within the battery packs by reducing the temperature gradient (ΔT) across each battery pack while maintaining operation of the one or more battery packs within a desired optimal temperature range. In this manner, the thermal management system facilitates improved battery performance and increased operating life of the batteries.
[0005] According to one or more embodiments, a battery system may include one or more battery packs and a thermal management system for cooling the one or more battery packs, the thermal management system including a heat pipe arrangement having a planar structure and including a plurality of heat pipes in thermal contact with and removing heat from the one or more battery packs, and a heat sink arrangement including a plurality of heat sinks in thermal contact with two or more ends of the heat pipe arrangement and dissipating heat from the heat pipe arrangement.
[0006] According to one or more embodiments, a thermal management system for cooling one or more battery packs of a battery system may include a heat pipe arrangement having a planar structure and including a plurality of heat pipes in thermal contact with and for removing heat from the one or more battery packs, and a heat sink arrangement including a plurality of heat sinks in thermal contact with two or more ends of the heat pipe arrangement and for dissipating heat from the heat pipe arrangement.
[0007] According to one or more embodiments, a method for cooling one or more battery packs of a battery system may include disposing a heat pipe arrangement having a planar structure and including a plurality of heat pipes in thermal contact with and removing heat from the one or more battery packs, and disposing a heat sink arrangement including a plurality of heat sinks in thermal contact with two or more ends of the heat pipe arrangement and dissipating heat from the heat pipe arrangement.
[0008] According to one or more embodiments, a motor vehicle may include a motor that provides propulsion to the vehicle, a battery system including one or more battery packs to serve as a power source for the motor, and a thermal management system that cools the one or more battery packs, wherein the thermal management system includes a heat pipe arrangement having a planar structure and including a plurality of heat pipes in thermal contact with the one or more battery packs and that removes heat from the one or more battery packs, and a heat sink arrangement including a plurality of heat sinks in thermal contact with two or more ends of the heat pipe arrangement and that dissipate heat from the heat pipe arrangement.
[0009] According to one or more embodiments, the heat pipe arrangement comprises one or more first heat pipes in thermal contact with the one or more battery packs at a first thermal contact area and one or more second heat pipes in thermal contact with the one or more battery packs at a second thermal contact area opposite the first thermal contact area.
[0010] According to one or more embodiments, the heat sink arrangement comprises one or more first liquid cold plates in thermal contact with the one or more first heat pipes at the third thermal contact area.
[0011] According to one or more embodiments, the heat sink arrangement comprises one or more second liquid cold plates in thermal contact with the one or more first heat pipes at a fourth thermal contact area.
[0012] According to one or more embodiments, the heat sink arrangement comprises one or more third liquid cooling plates in thermal contact with the one or more first heat pipes at a fifth thermal contact area opposite the third thermal contact area.
[0013] According to one or more embodiments, the heat sink arrangement comprises one or more fourth liquid cooling plates in thermal contact with the one or more first heat pipes at a sixth thermal contact area opposite the fourth thermal contact area.
[0014] According to one or more embodiments, the one or more third liquid cold plates have a better cooling performance than the one or more first cold plates.
[0015] According to one or more embodiments, the one or more fourth liquid cold plates have a better cooling performance than the one or more second cold plates.
[0016] According to one or more embodiments, the heat sink arrangement comprises one or more fifth liquid cold plates in thermal contact with the one or more second heat pipes at seventh thermal contact areas.
[0017] According to one or more embodiments, the heat sink arrangement comprises one or more sixth liquid cold plates in thermal contact with the one or more second heat pipes at an eighth thermal contact area.
[0018] According to one or more embodiments, the heat sink arrangement comprises one or more seventh liquid cooling plates in thermal contact with the one or more second heat pipes at a ninth thermal contact area opposite the seventh thermal contact area.
[0019] According to one or more embodiments, the heat sink arrangement comprises one or more eighth liquid cooling plates in thermal contact with the one or more second heat pipes at a tenth thermal contact area opposite the eighth thermal contact area.
[0020] According to one or more embodiments, the one or more fifth liquid cooling plates have better cooling performance than the one or more first seventh plates.
[0021] According to one or more embodiments, the one or more sixth liquid cooling plates have better cooling performance than the one or more eighth liquid cooling plates. [Brief explanation of the drawings]
[0022] Various advantages of embodiments of the present invention will become apparent to those skilled in the art upon reading the following specification and appended claims, and upon reviewing the following drawings.
[0023] [Figure 1] 1 is a diagram of an electric vehicle according to one or more embodiments. [Figure 2] FIG. 2 is a diagram of a battery system of the electric vehicle of FIG. 1 according to one or more embodiments. [Figure 3] FIG. 3 is a diagram of a thermal management system for the battery system of FIG. 2. [Figure 4] 1 illustrates a vertical cross-sectional view of a battery system according to one or more embodiments. [Figure 5] 1 illustrates a vertical cross-sectional view of a battery system according to one or more embodiments. [Figure 6]1 shows a schematic diagram of a battery system according to one or more embodiments. [Figure 7] 1 illustrates a top view of an example battery system according to one or more embodiments. [Figure 8] 1 illustrates a top view of an example battery system according to one or more embodiments. [Figure 9] 1 is a flowchart of a method for cooling a battery system according to one or more embodiments. DETAILED DESCRIPTION OF THE INVENTION
[0024] FIG. 1 shows an example of an electric vehicle 10 that includes a motor 20 for propulsion of the vehicle 10 and a battery system 30 for serving as a power source for the motor 20 .
[0025] As shown in FIG. 2, the battery system 30 may include one or more battery packs 40 that are in thermal contact / thermal coupling with a thermal management system 50 to provide uniform temperature distribution within the battery packs 40 in a manner that reduces temperature gradients (ΔT) across each battery pack 40 while maintaining operation of the battery packs 40 within a desired optimal temperature range.
[0026] One or more embodiments of the battery system 30 may be applied to vehicles 10, such as electric vehicles (EVs), including electric air vehicles, electric marine vehicles, electric spacecraft, and ground vehicles (e.g., hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), battery electric vehicles (BEVs), fuel cell electric vehicles (FCEVs), and electric rail vehicles (REVs)). While embodiments of the battery system 30 and thermal management system 50 may be incorporated for mobile applications such as vehicles, the embodiments are not so limited and thus may be incorporated in non-mobile or stationary applications.
[0027] 3, an example of the thermal management system 50 may include a heat pipe arrangement and a heat sink arrangement. The heat pipe arrangement includes one or more heat pipes 51 in thermal contact with the battery pack 40 and passively cools the battery pack 40 by removing heat from the battery pack 40 during operation. The heat sink arrangement includes one or more heat sinks 52 in thermal contact with the heat pipes 51 and passively dissipate heat from the heat pipes 51.
[0028] An example embodiment of the battery system 30 is shown in Figure 4, in which a thermal management system 50 is attached to one flat surface of the battery pack 40 to cool the battery pack 40. In particular, the example shown includes one or more heat pipes 51 in thermal contact with the battery pack 40 at the flat surface. One or more heat sinks 52a-52d are in thermal contact with the one or more heat pipes 51.
[0029] Another example embodiment of the battery system 30 is shown in FIG. 5 , in which thermal management systems 50 are attached to opposite flat surfaces of the battery pack 40 to cool the battery pack 40 on both sides. In particular, the example shown includes one or more heat pipes 51a and one or more heat pipes 51b in thermal contact with the battery pack 40 on each flat surface. One or more heat sinks 52a-52h are in thermal contact with the one or more heat pipes 51a and one or more heat pipes 51b. The size of the battery, e.g., height or thickness, is largely determined by the performance of the cooling solution. The thermal management system 50 shown in FIG. 5 not only affects battery performance in providing uniform cooling on both sides of the battery pack 40, but also does not limit the physical size of the battery pack 40. In particular, unlike the use of one-sided battery cooling, which limits the physical size of the battery, the thermal management system 50 shown in FIG. 5 allows for the use of batteries with larger sizes and / or capacities.
[0030] While the illustrated examples of FIGS. 4 and 5 each include one battery pack 40, embodiments are not limited thereto, and may include two or more battery packs 140 arranged in a stack, as shown in FIG. n , 140 n+1According to one or more embodiments, the battery pack 140 may include a battery system 130 having n , 140 n+1 The battery packs 40 may be arranged or oriented in vertical stacks or horizontal stacks. The stacks may be cooled via a thermal management system 150 having the same technical features and structure as the thermal management system 50 of Figures 4 and 5. Thermal management system 50 according to embodiments allows for stacking of battery packs 40 in a manner that reduces heat transfer distances by at least half.
[0031] As shown in FIG. 7 , an example battery system 30 according to one or more embodiments may include one or more battery packs 40 in thermal contact / thermal coupling with a thermal management system including one or more heat pipes 51 and one or more heat sinks 52, with the heat sinks 52 positioned in physical and thermal contact with the exposed end regions (i.e., the planar and peripheral / peripheral sides) of the heat pipes 51 to locally cool the heat pipes 51. In the example shown, the heat pipes 51 may each comprise a single large-area heat pipe HP1 having a planar geometric shape. The single large-area heat pipe HP1 may have a predetermined total surface area greater than the total surface area of the corresponding battery pack 40. That is, the single large-area heat pipe HP1 extends beyond the size of the battery 140. In this manner, the heat sinks 52 are strategically positioned in the regions of the heat pipes 51 where heat transfer occurs (i.e., the ends of the heat pipes 51). According to one or more embodiments, the predetermined total surface area of the single large area heat pipe HP1 may be in the range of approximately 20 cm x 10 cm to 200 cm x 100 cm.
[0032] Alternatively, as shown in FIG. 8 , an example battery system 130 according to one or more embodiments may include a battery pack 140 in thermal contact / thermal coupling with a thermal management system including one or more heat pipes 151 and one or more heat sinks 152, the heat sinks 152 being positioned in physical and thermal contact with the exposed end regions (i.e., the planar and peripheral / peripheral sides) of the heat pipes 151 to locally cool the heat pipes 151. In the example shown, the heat pipes 151 may comprise a heat pipe array consisting of multiple large-area heat pipes HP1-HP10, each having a planar geometric shape. The large-area heat pipes HP1-HP10 may have a predetermined combined total surface area greater than the total surface area of the battery pack 140. That is, the array of large-area heat pipes HP1-HP10 extends beyond the dimensions of the battery pack 140. As such, the heat sink 152 is strategically placed in the area of the heat pipe 151 where heat transfer occurs (i.e., at the end of the heat pipe 151). According to one or more embodiments, the predetermined combined total surface area of the heat pipes HP1-HP10 may be in the range of approximately 20 cm x 10 cm to 200 cm x 100 cm.
[0033] While the illustrated example battery system 130 shows ten large area heat pipes HP1-HP10, embodiments are not limited and may therefore include any number of heat pipes within the spirit and scope of the principles of the present disclosure as set forth herein. Ultimately, the selection of the overall number of heat pipes per battery pack may take into account one or more design variables, including, but not limited to, cost, performance requirements, manufacturing requirements, etc.
[0034] The temperature distribution on the surface of the corresponding battery is more uniform when using a single large-area flat heat pipe structure HP1 compared to using multiple large-area flat heat pipes HP1-HP10, because the thermal resistance between the heat pipes HP1-HP10 prevents the heat from spreading laterally between the heat pipes HP1-HP10.
[0035] In terms of scale, the total surface area of the heat pipes (H1 or HP1-HP10) far exceeds that of conventional heat pipes, thereby improving overall cooling of the corresponding battery pack 40, 140. In particular, compared to the use of tubular heat pipes, the use of large-area, planar heat pipes 51, 151 with such total surface area provides a larger contact interface with the heat source (i.e., the battery pack) 40, 140. Furthermore, due to the two-phase heat transfer characteristics, compared to the use of tubular heat pipes, cooling the battery via one or more large-area, planar heat pipes can provide improved temperature regulation of the battery pack 40 by reducing the temperature gradient (ΔT) across the battery pack 40, thereby providing a more uniform temperature distribution within the battery pack 40 while maintaining operation of the battery pack 40 within a desired optimal temperature range. Furthermore, providing a thermal management system that sandwiches both planar sides of the battery pack 40 provides greater battery design flexibility without limiting the size of the battery pack.
[0036] 4 , one or more heat pipes 51 are in thermal contact with the flat exterior surface of the battery pack 40 at a thermal contact area or interface 54 and are configured to conduct heat generated by the battery pack 40 during operation. A thermal interface material (TIM) 55 may be added to fill any small spaces or gaps between the battery pack 40 and the heat pipes 51 at the thermal contact area 54, thereby improving heat transfer between the battery pack 40 and the heat pipes 51. According to one or more embodiments, the TIM 55 may include a ceramic, graphite, or boron nitride (BN)-filled polymer matrix (e.g., alumina, graphite-filled silicone), or may take the form of a gap pad or filler. However, embodiments are not so limited, and thus the TIM 55 may be composed of other materials within the spirit and scope of the principles of the present disclosure as set forth herein.
[0037] According to one or more embodiments, the heat sink arrangement 52 may include one or more heat sinks 52a-52d that are in physical and thermal contact with two or more exposed end regions (i.e., the flat and peripheral / outer periphery sides) of the heat pipe 51 and locally cool the heat pipe 51 by transferring heat from the heat pipe 51 to a coolant, which dissipates the heat from the heat sinks 52a-52d. As used herein, the end region of the heat pipe refers to an exposed region that is not in physical contact with the battery pack. As used herein, the "side" of the end region of the heat pipe 51 extends along a plane substantially perpendicular to the upper and lower planes of the heat pipe 51. In the illustrated embodiment, the side end regions each extend along a generally horizontal plane, while the upper end region and the lower end region each extend along a generally vertical plane. Covering all four end regions (e.g., top, bottom, and sides) of the heat pipe 51 can further localize cooling. A TIM (not shown) may be added to fill minute spaces or gaps between one or more heat pipes 51 and one or more heat sinks 52a-52d at their respective thermal contact areas, thereby improving heat transfer therebetween.
[0038] 4, a pair of heat sinks 52a, 52b are arranged on the same plane at a distance from each other on the outer surface of the heat pipe 51, while another pair of heat sinks 52c, 52d are arranged on the same plane at a distance from each other on the opposite outer surface of the heat pipe 51. Each of the heat sinks 52a to 52d has one or more internal flow passages 53a. n ~53d n , 53a n+1 ~53d n+1 a liquid cooling plate including a cooling plate body having an internal flow passage 53a n ~53d n , 53a n+1 ~53d n+1 The internal flow passages 53a extend through the cold plate body and facilitate the flow of coolant that dissipates heat from the cold plate body. n ~53d n , 53a n+1 ~53dn+1 Each of the internal channels 53a may include a channel inlet and a channel outlet through which the coolant enters the cooling plate body and through which the coolant exits the cooling plate body. n ~53d n , 53a n+1 ~53d n+1 may each be sized to have a diameter within the spirit and scope of the principles of the present disclosure as set forth herein. While embodiments have shown internal flow channels having a generally annular configuration, one or more embodiments disclosed herein are not so limited and, therefore, may include internal flow channels having any geometric shape within the spirit and scope of the principles of the present disclosure as set forth herein.
[0039] It can be seen that the operating temperature profile of the heat pipe arrangement results in regions of the heat pipes 51 located within the battery system 30 being more exposed to heat than regions outside. Accordingly, heat sinks located in more exposed regions may have a structural design that achieves better cooling performance. For example, to achieve such better cooling performance, such heat sinks may have a larger overall size or surface area than the overall size and surface area of respective heat sinks not located in more exposed regions. Additionally, or alternatively, to achieve such better cooling performance, such heat sinks may contain a greater overall number of internal flow passages than heat sinks not located in more exposed regions, thereby enabling a larger volume of coolant. Additionally, or alternatively, to achieve such better cooling performance, such heat sinks may have larger diameter internal flow passages than heat sinks not located in more exposed regions, thereby enabling a larger volume of coolant.
[0040] 5, one or more heat pipes 51a are in thermal contact with the flat outer surface of the battery pack 40 at a first thermal contact area or interface 54a and are configured to conduct heat generated by the battery pack 40 during operation. A first thermal interface material (TIM) 55a may be added to fill any minute spaces or gaps between the battery pack 40 and the heat pipes 51a at the first thermal contact area 54a, thereby improving heat transfer between the battery pack 40 and the heat pipes 51a. According to one or more embodiments, the first TIM 55a may include a ceramic, graphite, or boron nitride (BN)-filled polymer matrix (e.g., alumina, graphite-filled silicone), or may take the form of a gap pad or filler. However, embodiments are not so limited, and thus the first TIM 55a may be composed of other materials within the spirit and scope of the principles of the present disclosure as set forth herein.
[0041] Additionally, one or more heat pipes 51b are in thermal contact with the opposite outer planar surface of the battery pack 40 at a second thermal contact area or interface 54b and are configured to conduct heat generated by the battery pack 40 during operation. A second TIM 55b may be added to fill any minute spaces or gaps between the battery pack 40 and the heat pipes 51b at the second thermal contact area 54b, thereby improving heat transfer between the battery pack 40 and the heat pipes 51b. According to one or more embodiments, the second TIM 55b may include a ceramic, graphite, or boron nitride (BN)-filled polymer matrix (e.g., alumina, graphite-filled silicone), and may take the form of a gap pad or filler. However, embodiments are not so limited, and thus the second TIM 55b may be composed of other materials within the spirit and scope of the principles of the present disclosure as set forth herein.
[0042] According to one or more embodiments, the heat sink arrangement 52 may include a first heat sink group including one or more heat sinks 52a-52d that are in physical and thermal contact with two or more exposed end regions (i.e., the flat and peripheral / outer lateral surfaces) of the heat pipe 51a and locally cool the heat pipe 51a by transferring heat from the heat pipe 51a to a coolant, which then dissipates the heat from the heat sinks 52a-52d. As used herein, the end region of the heat pipe refers to an exposed region that is not in physical contact with the battery pack. As used herein, the "side" of the end region of the heat pipe 51a extends along a plane substantially perpendicular to the upper and lower planes of the heat pipe 51a. In the illustrated embodiment, the side end regions each extend along a generally horizontal plane, while the upper end region and lower end region each extend along a generally vertical plane. Coating all four end regions (e.g., top, bottom, and sides) of the heat pipe 51a can provide further localized cooling. Thermally conductive material (TIM) (not shown) may be added to fill minute spaces or gaps between one or more heat pipes 51a and one or more heat sinks 52a-52d at their respective thermal contact areas, thereby improving heat transfer therebetween.
[0043] 5, a pair of heat sinks 52a, 52b are arranged coplanarly and spaced apart on the outer surface of the heat pipe 51a, while another pair of heat sinks 52c, 52d are arranged coplanarly and spaced apart on the outer surface of the opposite side of the heat pipe 51a. Each of the heat sinks 52a-52d has one or more internal flow passages 53a. n ~53d n , 53a n+1 ~53d n+1 a liquid cooling plate including a cooling plate body having an internal flow passage 53a n ~53d n , 53a n+1 ~53d n+1 The internal flow passages 53a extend through the cold plate body and facilitate the flow of coolant that dissipates heat from the cold plate body. n ~53dn , 53a n+1 ~53d n+1 Each of the internal channels 53a may include a channel inlet and a channel outlet through which the coolant enters the cooling plate body and through which the coolant exits the cooling plate body. n ~53d n , 53a n+1 ~53d n+1 may each be sized to have a diameter within the spirit and scope of the principles of the present disclosure as set forth herein.
[0044] According to one or more embodiments, the heat sink arrangement 52 may further include one or more heat sinks 52e-52h that are in physical and thermal contact with two or more end regions (i.e., the flat and peripheral / peripheral sides) of the heat pipe 51a and locally cool the heat pipe 51a by transferring heat from the heat pipe 51a to a coolant, which dissipates the heat from the heat sinks 52e-52h. A thermal interface material (TIM) (not shown) may be added to fill any minute spaces or gaps between the one or more intermediate heat pipes 51b and the one or more second heat sinks 52e-52h at the thermal contact regions, thereby improving heat transfer therebetween.
[0045] In the illustrated embodiment, a pair of heat sinks 52e, 52f are arranged on the same plane at a distance apart on the outer surface of the heat pipe 51b, while another pair of second heat sinks 52g, 52h are arranged on the same plane at a distance apart on the outer surface of the opposite side of the heat pipe 51b. Each of the heat sinks 52e to 52h has a plurality of internal flow passages 53e n ~53h n , 53e n+1 ~53h n+1 a liquid cooling plate including a cooling plate body having an internal flow passage 53e n ~53h n , 53e n+1 ~53h n+1 The internal flow passages 53e extend through the cold plate body and facilitate the flow of coolant that dissipates heat from the cold plate body. n ~53hn , 53e n+1 ~53h n+1 Each of the internal channels 53e may include a channel inlet and a channel outlet through which the coolant enters the cooling plate body and through which the coolant exits the cooling plate body. n ~53h n , 53e n+1 ~53h n+1 may each be sized to have a diameter within the spirit and scope of the principles of the present disclosure as set forth herein.
[0046] The operating temperature profile of the heat pipe arrangement indicates that regions of heat pipe 51a and heat pipe 51b located within battery system 30 are exposed to more heat than regions outside. Accordingly, heat sinks 52c-52f may have a structural design that achieves superior cooling performance than heat sinks 52a, 52b, 52g, and 52h. By way of example, to achieve such superior cooling performance, heat sinks 52c-52f may have a larger overall size or total surface area than heat sinks 52a, 52b, 52g, and 52h, respectively. Additionally or alternatively, to achieve such superior cooling performance, heat sinks 52c-52f may include a greater overall number of internal flow passages than heat sinks 52a, 52b, 52g, and 52h to allow for a larger volume of coolant. Additionally or alternatively, heat sinks 52c-52f may have larger diameter internal flow passages than heat sinks 52a, 52b, 52g, 52h to allow for a larger volume of coolant to obtain such better cooling performance.
[0047] According to one or more embodiments, each cold plate body may be constructed of a metal or metal composite that exhibits high thermal conductivity. By way of example, such metal or metal composite may include aluminum, copper, or stainless steel. The coolant may include a high thermal conductivity fluid that is thermally stable and compatible with the material composition of the respective heat sink through which the fluid flows.
[0048] 9, a method 200 for cooling one or more battery packs of a battery system is provided. Method 200 may be performed, for example, by logic instructions (e.g., software), configurable logic, fixed function hardware logic, etc., or a combination thereof.
[0049] Block 202 includes disposing a heat pipe arrangement, which may, for example, have a planar structure and include one or more heat pipes in thermal contact with an outer planar surface of one or more battery packs of the battery system to remove heat from the one or more battery packs.
[0050] According to one or more embodiments of method 100, the heat pipe arrangement includes one or more first heat pipes in thermal contact with the one or more battery packs at a first thermal contact area, and one or more second heat pipes in thermal contact with the one or more battery packs at a second thermal contact area opposite the first thermal contact area.
[0051] Block 204 includes disposing a heat sink arrangement, which may include, for example, one or more heat sinks in thermal contact with two or more ends of the heat pipe arrangement and dissipate heat from the heat pipe arrangement. The operations of block 204 may occur simultaneously, sequentially, or in parallel with the operations of block 202.
[0052] According to one or more embodiments of method 200, the heat sink arrangement comprises one or more first liquid cooling plates in thermal contact with the one or more first heat pipes at a third thermal contact area, and one or more second liquid cooling plates in thermal contact with the one or more first heat pipes at a fourth thermal contact area.
[0053] According to one or more embodiments of method 200, the heat sink arrangement comprises one or more third liquid cooling plates in thermal contact with the one or more first heat pipes at a fifth thermal contact area opposite the third thermal contact area, and one or more fourth liquid cooling plates in thermal contact with the one or more first heat pipes at a sixth thermal contact area opposite the fourth thermal contact area.
[0054] According to one or more embodiments of method 200, the one or more third liquid cooling plates may have better cooling performance than the one or more first cooling plates, and the one or more fourth liquid cooling plates may have better cooling performance than the one or more second cooling plates.
[0055] According to one or more embodiments of method 200, the heat sink arrangement comprises one or more fifth liquid cooling plates in thermal contact with the one or more second heat pipes at a seventh thermal contact area, and one or more sixth liquid cooling plates in thermal contact with the one or more second heat pipes at an eighth thermal contact area.
[0056] According to one or more embodiments of method 200, the heat sink arrangement comprises one or more seventh liquid cooling plates in thermal contact with the one or more second heat pipes at a ninth thermal contact area opposite the seventh thermal contact area, and one or more eighth liquid cooling plates in thermal contact with the one or more second heat pipes at a tenth thermal contact area opposite the eighth thermal contact area.
[0057] According to one or more embodiments of method 200, the one or more fifth liquid cooling plates may have better cooling performance than the one or more first seventh plates, and the one or more sixth liquid cooling plates may have better cooling performance than the one or more eighth cooling plates.
[0058] As used herein, the terms "coupled," "attached," or "connected" may be used to refer to any kind of direct or indirect relationship between the components in question and may apply to electrical, mechanical, fluid, optical, electromagnetic, electromechanical, or other connections. Also, as used herein, terms such as "first," "second," etc. are used for ease of discussion only and do not have a particular temporal or chronological meaning unless otherwise indicated.
[0059] From the foregoing description, those skilled in the art will appreciate that the broad techniques of embodiments of the present invention can be embodied in a variety of forms. Thus, while embodiments of the present invention have been described in connection with specific examples thereof, the true scope of embodiments of the present invention should not be so limited, as other variations will become apparent to those skilled in the art upon perusal of the drawings, the specification, and the following claims. The invention disclosed in this specification includes the following aspects. [Aspect 1] one or more battery packs; a thermal management system that cools the one or more battery packs; A battery system comprising: The thermal management system includes: a heat pipe arrangement including a plurality of heat pipes having a planar structure and in thermal contact with the one or more battery packs to remove heat from the one or more battery packs; a heat sink arrangement including a plurality of heat sinks in thermal contact with two or more ends of the heat pipe arrangement and dissipating heat from the heat pipe arrangement; a battery system including: [Aspect 2] The heat pipe arrangement comprises: one or more first heat pipes in thermal contact with the one or more battery packs at a first thermal contact area; one or more second heat pipes in thermal contact with the one or more battery packs at a second thermal contact area opposite the first thermal contact area; 2. The battery system of claim 1, comprising: Aspect 3 The heat sink arrangement comprises: one or more first liquid cold plates in thermal contact with the one or more first heat pipes at a third thermal contact area; one or more second liquid cold plates in thermal contact with the one or more first heat pipes at a fourth thermal contact area; 3. The battery system of claim 2, comprising: Aspect 4 The heat sink arrangement comprises: one or more third liquid cold plates in thermal contact with the one or more first heat pipes at a fifth thermal contact area opposite the third thermal contact area; one or more fourth liquid cold plates in thermal contact with the one or more first heat pipes at a sixth thermal contact area opposite the fourth thermal contact area; The battery system of embodiment 3, Aspect 5 the one or more third liquid cooling plates have a cooling performance superior to that of the one or more first cooling plates; A battery system as described in aspect 4, wherein the one or more fourth liquid cooling plates have better cooling performance than the one or more second cooling plates. Aspect 6 The heat sink arrangement comprises: one or more fifth liquid cold plates in thermal contact with the one or more second heat pipes at a seventh thermal contact area; one or more sixth liquid cold plates in thermal contact with the one or more second heat pipes at an eighth thermal contact area; The battery system of embodiment 2, Aspect 7 The heat sink arrangement comprises: one or more seventh liquid cold plates in thermal contact with the one or more second heat pipes at a ninth thermal contact area opposite the seventh thermal contact area; one or more eighth liquid cold plates in thermal contact with the one or more second heat pipes at a tenth thermal contact area opposite the eighth thermal contact area; 7. The battery system of claim 6, Aspect 8 the one or more fifth liquid-cooled plates have a cooling performance greater than the one or more first seventh plates; A battery system as described in aspect 6, wherein the one or more sixth liquid cooling plates have better cooling performance than the one or more eighth liquid cooling plates. Aspect 9 1. A thermal management system for cooling one or more battery packs of a battery system, comprising: a heat pipe arrangement including a plurality of heat pipes having a planar structure and in thermal contact with the one or more battery packs to remove heat from the one or more battery packs; a heat sink arrangement including a plurality of heat sinks in thermal contact with two or more ends of the heat pipe arrangement and dissipating heat from the heat pipe arrangement; 1. A thermal management system comprising: Aspect 10 The heat pipe arrangement comprises: one or more first heat pipes in thermal contact with the one or more battery packs at a first thermal contact area; one or more second heat pipes in thermal contact with the one or more battery packs at a second thermal contact area opposite the first thermal contact area; 10. The thermal management system of embodiment 9, comprising: Aspect 11 The heat sink arrangement comprises: one or more first liquid cold plates in thermal contact with the one or more first heat pipes at a third thermal contact area; one or more second liquid cold plates in thermal contact with the one or more first heat pipes at a fourth thermal contact area; 11. The thermal management system of embodiment 10, comprising: Aspect 12 The heat sink arrangement comprises: one or more third liquid cold plates in thermal contact with the one or more first heat pipes at a fifth thermal contact area opposite the third thermal contact area; one or more fourth liquid cold plates in thermal contact with the one or more first heat pipes at a sixth thermal contact area opposite the fourth thermal contact area; 12. The thermal management system of embodiment 11, comprising: Aspect 13 the one or more third liquid cooling plates have a cooling performance superior to that of the one or more first cooling plates; 13. The thermal management system of claim 12, wherein the one or more fourth liquid cooling plates have greater cooling performance than the one or more second cooling plates. Aspect 14 The heat sink arrangement comprises: one or more fifth liquid cold plates in thermal contact with the one or more second heat pipes at a seventh thermal contact area; one or more sixth liquid cold plates in thermal contact with the one or more second heat pipes at an eighth thermal contact area; 11. The thermal management system of embodiment 10, comprising: Aspect 15 The heat sink arrangement comprises: one or more seventh liquid cold plates in thermal contact with the one or more second heat pipes at a ninth thermal contact area opposite the seventh thermal contact area; one or more eighth liquid cold plates in thermal contact with the one or more second heat pipes at a tenth thermal contact area opposite the eighth thermal contact area; 15. The thermal management system of embodiment 14, comprising: Aspect 16 the one or more fifth liquid-cooled plates have a cooling performance greater than the one or more first seventh plates; 16. The thermal management system of claim 15, wherein the one or more sixth liquid cooling plates have greater cooling performance than the one or more eighth liquid cooling plates. Aspect 17 1. A method for cooling one or more battery packs of a battery system, comprising: disposing a heat pipe arrangement having a planar structure, the heat pipe arrangement including a plurality of heat pipes in thermal contact with the one or more battery packs and adapted to remove heat from the one or more battery packs; providing a heat sink arrangement including a plurality of heat sinks in thermal contact with two or more ends of the heat pipe arrangement and dissipating heat from the heat pipe arrangement; A method comprising:
Claims
1. one or more battery packs; a thermal management system that cools the one or more battery packs; A battery system comprising: The thermal management system includes: a heat pipe arrangement including a plurality of heat pipes having a planar structure and in thermal contact with the one or more battery packs to remove heat from the one or more battery packs; a heat sink arrangement including a plurality of heat sinks in thermal contact with two or more ends of the heat pipe arrangement and dissipating heat from the heat pipe arrangement; Including, The heat pipe arrangement comprises: one or more first heat pipes in thermal contact with the one or more battery packs at first thermal contact areas; one or more second heat pipes in thermal contact with the one or more battery packs at a second thermal contact area opposite the first thermal contact area; Equipped with The heat sink arrangement comprises: one or more first liquid cold plates in thermal contact with the one or more first heat pipes at a third thermal contact area; one or more second liquid cold plates in thermal contact with the one or more first heat pipes at a fourth thermal contact area; one or more third liquid cold plates in thermal contact with the one or more first heat pipes at a fifth thermal contact area opposite the third thermal contact area; one or more fourth liquid cold plates in thermal contact with the one or more first heat pipes at a sixth thermal contact area opposite the fourth thermal contact area; Equipped with a battery system.
2. the one or more third liquid cooling plates have a cooling performance superior to the one or more first liquid cooling plates; The battery system of claim 1 , wherein the one or more fourth liquid cooling plates have a cooling performance superior to that of the one or more second liquid cooling plates.
3. The heat sink arrangement comprises: one or more fifth liquid cold plates in thermal contact with the one or more second heat pipes at a seventh thermal contact area; one or more sixth liquid cold plates in thermal contact with the one or more second heat pipes at an eighth thermal contact area; The battery system according to claim 1 .
4. The heat sink arrangement comprises: one or more seventh liquid cold plates in thermal contact with the one or more second heat pipes at a ninth thermal contact area opposite the seventh thermal contact area; one or more eighth liquid cold plates in thermal contact with the one or more second heat pipes at a tenth thermal contact area opposite the eighth thermal contact area; The battery system according to claim 3 .
5. the one or more fifth liquid cooling plates have a cooling performance greater than the one or more seventh liquid cooling plates; The battery system of claim 4 , wherein the one or more sixth liquid cooling plates have a cooling performance superior to that of the one or more eighth liquid cooling plates.
6. 1. A thermal management system for cooling one or more battery packs of a battery system, comprising: a heat pipe arrangement including a plurality of heat pipes having a planar structure and in thermal contact with the one or more battery packs to remove heat from the one or more battery packs; a heat sink arrangement including a plurality of heat sinks in thermal contact with two or more ends of the heat pipe arrangement and dissipating heat from the heat pipe arrangement; and The heat pipe arrangement comprises: one or more first heat pipes in thermal contact with the one or more battery packs at first thermal contact areas; one or more second heat pipes in thermal contact with the one or more battery packs at a second thermal contact area opposite the first thermal contact area; and The heat sink arrangement comprises: one or more first liquid cold plates in thermal contact with the one or more first heat pipes at a third thermal contact area; one or more second liquid cold plates in thermal contact with the one or more first heat pipes at a fourth thermal contact area; one or more third liquid cold plates in thermal contact with the one or more first heat pipes at a fifth thermal contact area opposite the third thermal contact area; one or more fourth liquid cold plates in thermal contact with the one or more first heat pipes at a sixth thermal contact area opposite the fourth thermal contact area; A thermal management system comprising:
7. the one or more third liquid cooling plates have a cooling performance superior to the one or more first liquid cooling plates; The thermal management system of claim 6 , wherein the one or more fourth liquid cold plates have a greater cooling performance than the one or more second liquid cold plates.
8. The heat sink arrangement comprises: one or more fifth liquid cold plates in thermal contact with the one or more second heat pipes at a seventh thermal contact area; one or more sixth liquid cold plates in thermal contact with the one or more second heat pipes at an eighth thermal contact area; The thermal management system of claim 6 , comprising:
9. The heat sink arrangement comprises: one or more seventh liquid cold plates in thermal contact with the one or more second heat pipes at a ninth thermal contact area opposite the seventh thermal contact area; one or more eighth liquid cold plates in thermal contact with the one or more second heat pipes at a tenth thermal contact area opposite the eighth thermal contact area; The thermal management system of claim 8 , comprising:
10. the one or more fifth liquid cooling plates have a cooling performance greater than the one or more seventh liquid cooling plates; The thermal management system of claim 9 , wherein the one or more sixth liquid cold plates have greater cooling performance than the one or more eighth liquid cold plates.
11. 1. A method for cooling one or more battery packs of a battery system, comprising: disposing a heat pipe arrangement having a planar structure, the heat pipe arrangement including a plurality of heat pipes in thermal contact with the one or more battery packs and adapted to remove heat from the one or more battery packs; providing a heat sink arrangement including a plurality of heat sinks in thermal contact with two or more ends of the heat pipe arrangement and dissipating heat from the heat pipe arrangement; Including, The heat pipe arrangement includes: one or more first heat pipes in thermal contact with the one or more battery packs at first thermal contact areas; one or more second heat pipes in thermal contact with the one or more battery packs at a second thermal contact area opposite the first thermal contact area; [0023] The heat sink disposing step comprises: one or more first liquid cold plates in thermal contact with the one or more first heat pipes at a third thermal contact area; one or more second liquid cold plates in thermal contact with the one or more first heat pipes at a fourth thermal contact area; one or more third liquid cold plates in thermal contact with the one or more first heat pipes at a fifth thermal contact area opposite the third thermal contact area; one or more fourth liquid cold plates in thermal contact with the one or more first heat pipes at a sixth thermal contact area opposite the fourth thermal contact area; The method of claim 1, further comprising:
Citation Information
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