Management device and management method

Abstract

To provide a management device capable of specifying temperature or oxygen concentration when a substrate is located in a furnace, and provide a reflow device, and a management method.SOLUTION: A management method for specifying temperature or oxygen concentration in a furnace when a substrate is positioned in the furnace of a reflow device for heating the substrate while conveying the substrate, acquires (ST1) atmosphere history information including measurement results of temperature or oxygen concentration in the furnace and conveyance history information of the substrate in the reflow device, and specifies (ST2 to ST3) temperature or oxygen concentration when the substrate is positioned in the furnace based on the atmosphere history information and the conveyance history information.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present invention relates to a management device for a mounting substrate manufacturing line including a reflow device and Pipe Regarding the method of analysis. [Background technology]

[0002] In a mounting board production line, a printing device prints solder onto a board, a component mounting device mounts components onto the board with the solder printed on it, and a reflow device heats the board while transporting it to solder the components to the board, thereby manufacturing a mounting board (see, for example, Patent Document 1). The reflow device described in Patent Document 1 is equipped with a heating device that can adjust the temperature for each of multiple furnaces, and an atmosphere adjustment unit that adjusts the atmosphere, including the oxygen concentration, and the temperature and oxygen concentration of each furnace are controlled to match preset reflow conditions based on the measurement results of the temperature and oxygen concentration. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-219636 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in conventional technologies including Patent Document 1, although the temperature and oxygen concentration inside the furnace of the reflow device are controlled to match specified reflow conditions, the actual temperature and oxygen concentration fluctuate due to the influence of the substrates that are sequentially placed into the furnace, and since it is not possible to detect the position of the substrate inside the reflow device, there is room for further improvement in order to manage the quality of the mounted substrate based on the temperature and oxygen concentration when the substrate was located in the furnace, or to more precisely control the temperature and oxygen concentration of the reflow device.

[0005] Therefore, the present invention provides a control device and a method for determining the temperature or oxygen concentration when a substrate is placed in a furnace. Pipe The purpose of this paper is to provide a method for the analysis of [Means for solving the problem]

[0006] The management device of the present invention is a management device for a mounting substrate manufacturing line that includes at least a reflow device that heats a substrate while transporting it, and includes an acquisition unit that acquires atmospheric history information including measurement results of at least the temperature or oxygen concentration inside a furnace of the reflow device and transportation history information of the substrate in the reflow device, and an identification unit that identifies the temperature or the oxygen concentration when the substrate was located in the furnace based on the atmospheric history information and the transportation history information. an analysis unit that analyzes a tendency of fluctuation in the oxygen concentration relative to a transfer interval of the substrate based on the oxygen concentration included in the atmosphere history information and the transfer history information; Equipped with When the analysis unit determines that the oxygen concentration is on the rise, it issues a command to at least one of increasing the intervals between boards being loaded into the reflow device and decreasing the oxygen concentration in the furnace. . Furthermore, the management device of the present invention is a management device for a mounting substrate manufacturing line that includes at least a reflow device that heats a substrate while transporting it, and includes an acquisition unit that acquires atmospheric history information including measurement results of at least the temperature or oxygen concentration inside a furnace of the reflow device and transport history information of the substrate in the reflow device, an identification unit that identifies the temperature or the oxygen concentration when the substrate was located in the furnace based on the atmospheric history information and the transport history information, and an analysis unit that analyzes the trend of temperature fluctuations relative to the transport interval of the substrate based on the temperature included in the atmospheric history information and the transport history information, and when the analysis unit determines that the temperature is on a decreasing trend, it commands the reflow device to increase the interval at which substrates are loaded.

[0009] The management method of the present invention is a management method for identifying the temperature or oxygen concentration inside a furnace of a reflow apparatus that heats a substrate while transporting the substrate when the substrate was located in the furnace, and includes acquiring atmospheric history information including measurement results of at least the temperature or oxygen concentration inside the furnace and transportation history information of the substrate in the reflow apparatus, and identifying the temperature or oxygen concentration when the substrate was located in the furnace based on the atmospheric history information and the transportation history information. and analyzing the tendency of fluctuations in the oxygen concentration relative to the interval between transfers of the substrate based on the oxygen concentration included in the atmospheric history information and the transfer history information, and when it is determined that the oxygen concentration is on the rise, issuing a command to at least one of increasing the interval between transfers of the substrates into the reflow device or decreasing the oxygen concentration in the furnace. . The management method of the present invention is a management method for identifying the temperature or oxygen concentration inside a furnace of a reflow apparatus that heats a substrate while transporting it, when the substrate was located in the furnace, and includes acquiring atmospheric history information including measurement results of at least the temperature or oxygen concentration inside the furnace and transport history information of the substrate in the reflow apparatus, identifying the temperature or oxygen concentration when the substrate was located in the furnace based on the atmospheric history information and the transport history information, analyzing the tendency of temperature fluctuations relative to the transport interval of the substrate based on the temperature included in the atmospheric history information and the transport history information, and instructing the reflow apparatus to increase the interval between loading substrates if it is determined that the temperature is on a decreasing trend. . [Effects of the Invention]

[0010] According to the present invention, the temperature or oxygen concentration when the substrate was placed in the furnace can be determined. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a diagram illustrating the configuration of a mounting substrate manufacturing system according to an embodiment of the present invention; [Figure 2] FIG. 1 is an explanatory diagram showing the structure of a main part of a reflow device provided in a mounting substrate manufacturing line according to an embodiment of the present invention; [Figure 3] FIG. 1 is a block diagram showing a configuration of a mounting substrate manufacturing system according to an embodiment of the present invention. [Figure 4] FIG. 10 is an explanatory diagram of an example of atmosphere history information used in the management device according to an embodiment of the present invention. [Figure 5] FIG. 10 is an explanatory diagram of an example of transport history information used in the management device according to an embodiment of the present invention; [Figure 6] FIG. 1 is an explanatory diagram of the relationship between a substrate being transported in a furnace of a reflow apparatus according to an embodiment of the present invention and measurement time. [Figure 7] (a) and (b) are explanatory diagrams illustrating an example of a method for determining the oxygen concentration of a substrate being transported in a furnace of a reflow apparatus according to an embodiment of the present invention. [Figure 8] FIG. 10 is an explanatory diagram of an example of board-specific history information created by the management device according to an embodiment of the present invention; [Figure 9] FIG. 1 is an explanatory diagram of an example of a method for managing the oxygen concentration in the furnace of a reflow apparatus according to an embodiment of the present invention. [Figure 10] 1 is a flow diagram of a management method according to an embodiment of the present invention; [Figure 11] FIG. 10 is a block diagram showing the configuration of a mounting substrate manufacturing system including another example of the reflow apparatus according to the embodiment of the present invention. [Figure 12] FIG. 10 is a block diagram showing the configuration of a mounting substrate manufacturing system including another example of the reflow apparatus according to the embodiment of the present invention. [Figure 13] FIG. 10 is an explanatory diagram of the relationship between the substrate being transported in the furnace of another example of the reflow apparatus according to the embodiment of the present invention and the measurement time. [Figure 14] FIG. 10 is a flow chart of another example of the management method according to the embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0012] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for the purpose of explanation and can be modified as appropriate depending on the specifications of the mounting substrate manufacturing system, management device, and reflow device. In the following, corresponding elements in all drawings will be given the same reference numerals, and duplicated explanations will be omitted. In FIG. 2, the X-axis (the left-right direction in FIG. 2) in the substrate transport direction and the Z-axis (the up-down direction in FIG. 2) as the height direction perpendicular to the horizontal plane are shown. The Z-axis is the up-down direction or perpendicular direction when the reflow device is installed on a horizontal plane.

[0013] First, the configuration of a mounted board manufacturing system 1 will be described with reference to Figure 1. Mounted board manufacturing system 1 is configured to connect mounted board manufacturing lines PL1 via a communication network 2 and be managed by a management device 3. Mounted board manufacturing system 1 has the function of continuously manufacturing mounted boards, each having components mounted on a board. Mounted board manufacturing line PL1 is configured by connecting production equipment that performs production work, such as a board supply device M1, a printing device M2, component mounting devices M3 to M6, a reflow device M7, and a board recovery device M8, in series from upstream (left side of the page) to downstream (right side of the page) in the board transport direction.

[0014] The board supply device M1, printing device M2, component mounting devices M3 to M6, reflow device M7, and board removal device M8 are connected to a management device 3 via a communication network 2. The management device 3 stores production data including the control programs used by each device, and controls the manufacturing work performed by each device in an integrated manner. Note that the mounted board production line PL1 is a group of production equipment connected via the communication network 2, and the production equipment does not have to be physically connected to each other.

[0015] 1, board supply device M1 has a storage unit such as a rack that stores multiple boards, and performs a board supplying operation by removing boards from the storage unit and supplying them to downstream equipment. Board supply device M1 also has a built-in reader (not shown) that reads board labels such as barcodes or two-dimensional codes attached to the boards to read board identification information (board ID) that identifies the board. Board supply device M1 reads the board identification information from the board label of the board and transmits it to management device 3. Printing device M2 performs a solder printing operation by printing solder on boards carried in from upstream using a screen mask attached to the printing operation unit.

[0016] The component mounting devices M3 to M6 perform a component mounting operation in which components supplied by component supply devices are mounted onto boards on which solder has been printed using mounting heads. The mounted board manufacturing system 1 is not limited to a configuration in which the number of component mounting devices M3 to M6 is four, and may include one to three, or five or more component mounting devices M3 to M6. The reflow device M7 performs a substrate heating operation in which a heating unit heats a substrate carried into the device to melt and then harden the solder on the substrate, thereby joining the electrode portions of the substrate and the electrodes of the components. The substrate recovery device M8 has a storage unit such as a rack for storing multiple substrates, and performs a substrate recovery operation in which it receives substrates carried out by upstream devices and recovers them in the storage unit.

[0017] Next, the configuration and functions of the reflow apparatus M7 will be described with reference to FIG. 2. The reflow apparatus M7 is equipped with six furnaces F1 to F6. A substrate transport unit 5 that moves substrates B from upstream to downstream in the reflow apparatus M7 is arranged along the X-axis on a base 4 of the reflow apparatus M7. Each furnace F1 to F6 is equipped with heating units H1 to H6 that heat the interior of the furnace F1 to F6 and temperature sensors S1 to S6 that measure the temperature within the furnace F1 to F6. Hereinafter, furnaces F1 to F6 are referred to in order from upstream to downstream as the first furnace F1, second furnace F2, third furnace F3, fourth furnace F4, fifth furnace F5, and sixth furnace F6. Furthermore, within each furnace F1 to F6, the areas where substrates B are heated while moving are referred to as zones Z1 to Z6. The distances that substrates B are transported within each zone Z1 to Z6 (the lengths of zones Z1 to Z6) are transport distances L1 to L6, respectively.

[0018] The substrate B unloaded from the component mounting device M6 is loaded into the reflow device M7 through the loading entrance 6. The substrate B loaded through the loading entrance 6 is heated while being transported sequentially through zones Z1 to Z6 at a constant transport speed V by the substrate transport unit 5, and then unloaded through the unloading exit 7 toward the substrate removal device M8. The fifth furnace F5 is equipped with a gas inlet 8 that introduces an inert gas such as nitrogen into the fifth furnace F5, and an oxygen concentration sensor 9 that measures the oxygen concentration within the fifth furnace F5. That is, the gas inlet 8 introduces the inert gas into the fifth furnace F5, where the oxygen concentration is measured. The gas inlet 8 and the oxygen concentration sensor 9 may also be installed in furnaces other than the fifth furnace F5 (for example, the fourth furnace F4).

[0019] 2, an inlet sensor 10 such as a light-shielding sensor is disposed above the inlet 6 for detecting a substrate B being introduced through the inlet 6. The inlet sensor 10 may be disposed below the inlet 6 or to the side of the inlet 6. A sensor may also be disposed in each of the furnaces F1 to F6 for detecting that a substrate B has passed a predetermined position within the furnace F1 to F6.

[0020] Next, the configuration of the control system of the mounted substrate manufacturing system 1 will be described with reference to Fig. 3. Here, we will mainly describe the functions of the mounted substrate manufacturing system 1, which specify the temperature and oxygen concentration in the furnaces F1 to F6 of the reflow apparatus M7 and manage them so that they are maintained at a predetermined state. The management device 3, substrate supply device M1, printing device M2, component mounting devices M3 to M6, reflow apparatus M7, and substrate recovery device M8 are connected to each other via a communication network 2.

[0021] The reflow apparatus M7 includes a reflow control device 20, a substrate transport unit 5, heating units H1 to H6, a gas introduction unit 8, an oxygen concentration sensor 9, a carry-in sensor 10, temperature sensors S1 to S6, and a touch panel 27. The reflow control device 20 includes a reflow memory unit 21, a substrate detection processing unit 22, a temperature measurement processing unit 23, an oxygen measurement processing unit 24, a reflow control unit 25, and a reflow communication unit 26. The reflow communication unit 26 transmits and receives data via the communication network 2 between the management device 3 and the component mounting device M6, which carries out the substrate B toward the reflow apparatus M7. The touch panel 27 displays various information on its display unit, and an operator inputs data and operates the reflow apparatus M7 using operation buttons and the like displayed on the display unit.

[0022] 3, reflow storage unit 21 is a storage device that stores reflow conditions 21a, temperature history 21b, oxygen concentration history 21c, substrate carry-in history 21d, etc. Reflow conditions 21a store the set value of the temperature inside each of furnaces F1 to F6 (set furnace temperature), the set value of the oxygen concentration inside fifth furnace F5 equipped with gas inlet 8 and oxygen concentration sensor 9 (set oxygen concentration), the set value of transport speed V (set transport speed) at which substrate transport unit 5 of reflow apparatus M7 transports substrate B, and the minimum interval (set loading interval) for loading substrate B from load entrance 6 into reflow apparatus M7.

[0023] The substrate detection processing unit 22 detects the substrate B passing through the carry-in entrance 6 of the reflow apparatus M7 based on the detection result of the carry-in sensor 10. The substrate detection processing unit 22 associates the identification information of the substrate B to be input into the reflow apparatus M7, which is sent from the management device 3, with the time (second time) at which the substrate B is detected at the carry-in entrance 6, and stores this as the substrate carry-in history 21d in the reflow storage unit 21. In this way, the carry-in sensor 10 and the substrate detection processing unit 22 constitute the substrate detection unit 30 that detects the substrate B passing through a predetermined position (substrate detection position DP) of the reflow apparatus M7 before the furnaces F1 to F6.

[0024] 3, the temperature measurement processing unit 23 measures the temperature inside each of the furnaces F1 to F6 from the temperature measurement results of the temperature sensors S1 to S6 installed in each of the furnaces F1 to F6. The temperature measurement processing unit 23 measures the temperature inside the furnace at predetermined times (for example, every minute) and stores the measured temperature in the reflow storage unit 21 as a temperature history 21b in association with the measurement time. In this way, the temperature sensors S1 to S6 and the temperature measurement processing unit 23 constitute a temperature measurement unit 31 that measures the temperatures (furnace temperatures) inside the furnaces F1 to F6 (zones Z1 to Z6).

[0025] The oxygen measurement processing unit 24 measures the oxygen concentration inside the fifth furnace F5 based on the oxygen concentration measurement results obtained by the oxygen concentration sensor 9 installed in the fifth furnace F5. The oxygen measurement processing unit 24 measures the oxygen concentration inside the furnace at predetermined times (for example, every minute) and stores the measured oxygen concentration in the reflow storage unit 21 as an oxygen concentration history 21c in association with the measurement time. In this way, the oxygen concentration sensor 9 and the oxygen measurement processing unit 24 constitute an oxygen concentration measurement unit 32 that measures the oxygen concentration (in-furnace oxygen concentration) inside the fifth furnace F5 (in zone Z5). Note that the measurement times and measurement intervals of the temperature measurement unit 31 and the oxygen concentration measurement unit 32 do not necessarily have to be the same.

[0026] In FIG. 3, the reflow control unit 25 controls the substrate transport unit 5, the gas introduction unit 8, and the heating units H1 to H6 based on various set values ​​included in the reflow conditions 21a, the furnace temperature measured by the temperature measurement unit 31, the furnace oxygen concentration measured by the oxygen concentration measurement unit 32, and various commands sent from the management device 3.

[0027] Specifically, the reflow control unit 25 controls the substrate transport unit 5 so that the transport speed V of the substrate B transported through the reflow device M7 becomes the set transport speed included in the reflow conditions 21a. Furthermore, the reflow control unit 25 performs feedback control of the heating units H1 to H6 based on the furnace temperatures measured by the temperature measurement unit 31 so that the furnace temperatures of the respective furnaces F1 to F6 are maintained at the set furnace temperatures included in the reflow conditions 21a.

[0028] Furthermore, the reflow control unit 25 performs feedback control of the amount of inert gas introduced by the gas introduction unit 8 so that the oxygen concentration in the fifth furnace F5 is maintained at the set oxygen concentration included in the reflow conditions 21a, based on the oxygen concentration in the furnace measured by the oxygen concentration measurement unit 32. Furthermore, the reflow control unit 25 increases the amount of inert gas introduced from the gas introduction unit 8, based on a command sent from the management device 3 to decrease the oxygen concentration in the fifth furnace F5.

[0029] In this way, the reflow device M7 is equipped with furnaces F1 to F6 for heating the board B, measurement units (temperature measurement unit 31, oxygen concentration measurement unit 32) that measure at least the temperature or oxygen concentration within the furnaces F1 to F6, a board transport unit 5 that transports the board B, and a board detection unit 30 that detects the board B passing through a predetermined position (board detection position DP) before the furnaces F1 to F6, and heats the board B with components mounted on it while transporting it to solidify the solder.

[0030] 3, the management processing device 40 included in the management device 3 includes a management storage unit 41, an acquisition unit 42, an identification unit 43, a calculation unit 44, an analysis unit 45, an input unit 46, a display unit 47, and a management communication unit 48. The input unit 46 is an input device such as a keyboard, a touch panel, or a mouse, and is used to input operation commands and data. The display unit 47 is a display device such as a liquid crystal panel, and displays various information such as various screens, including an operation screen for operation using the input unit 46. The management communication unit 48 is a communication interface, and transmits and receives signals and data between the board supply device M1, the printing device M2, the component mounting devices M3 to M6, the reflow device M7, and the board recovery device M8 via the communication network 2.

[0031] The management memory unit 41 is a storage device that stores production data 41a, board information 41b, atmosphere history information 41c, transport history information 41d, transport speed information 41e, transport distance information 41f, board-specific history information 41g, etc. The production data 41a includes information such as the name of the manufactured model of the mounted board (board name), the type of component (component name) to be mounted on board B, the size of the component, the mounting position (XY coordinates), the mounting direction (θ direction), etc.

[0032] 3, board information 41b stores the position of board B in mounted board manufacturing line PL1 linked to the identification information based on identification information of board B transported toward printing device M2 transmitted from board supply device M1, and carry-in and carry-out information of board B transmitted from printing device M2, component mounting devices M3 to M6, reflow device M7, and board recovery device M8. Management communication unit 48 transmits the identification information of board B transported from upstream devices to printing device M2, component mounting devices M3 to M6, reflow device M7, and board recovery device M8 based on board information 41b. For example, identification information of board B transported from upstream component mounting device M6 is transmitted to reflow device M7.

[0033] The acquisition unit 42 acquires the temperature history 21b and the oxygen concentration history 21c from the reflow soldering apparatus M7 and stores them as atmosphere history information 41c in the management storage unit 41. The acquisition unit 42 may acquire only one of the temperature history 21b and the oxygen concentration history 21c, rather than both, and store them as atmosphere history information 41c. That is, the acquisition unit 42 acquires the atmosphere history information 41c including measurement results of at least the temperature (furnace temperature) or the oxygen concentration (furnace oxygen concentration) inside the furnaces F1 to F6 of the reflow soldering apparatus M7, measured at predetermined time intervals.

[0034] An example of the atmosphere history information 41c will now be described with reference to Fig. 4. The atmosphere history information 41c records, for each measurement time 50, an in-furnace temperature 51 of the first furnace F1, an in-furnace temperature 52 of the second furnace F2, an in-furnace temperature 53 of the third furnace F3, an in-furnace temperature 54 of the fourth furnace F4, an in-furnace temperature 55 of the fifth furnace F5, an in-furnace oxygen concentration 56 of the fifth furnace F5, and an in-furnace temperature 57 of the sixth furnace F6.

[0035] 3, the acquisition unit 42 acquires the board carry-in history 21d from the reflow apparatus M7 and stores it as transport history information 41d in the management storage unit 41. That is, the acquisition unit 42 acquires the passage time (second time) when the board B passes through the carry-in entrance 6 (board detection position DP) of the reflow apparatus M7 as the transport history information 41d of the board B in the reflow apparatus M7.

[0036] An example of the transfer history information 41d will now be described with reference to Fig. 5. In the transfer history information 41d, the passage time 59 at which the board B passed through the carry-in entrance 6 (board detection position DP) is recorded for each piece of identification information 58 of the board B. In this example, the identification information 58 of the board B is displayed in the order in which the board B passed through the carry-in entrance 6. In this way, the transfer history information 41d includes the second time (passage time 59) at which the board B passed through the predetermined position (board detection position DP) of the reflow device M7.

[0037] If the purpose is only to create the board-specific history information 41g described below, the acquisition unit 42 acquires the atmosphere history information 41c and the transport history information 41d at the time of completion of production of the mounted board, etc. If the purpose is to control the temperature and oxygen concentration in the furnace of the reflow device M7 in addition to creating the board-specific history information 41g, the acquisition unit 42 acquires the atmosphere history information 41c and the transport history information 41d at predetermined intervals (for example, every time the temperature and oxygen concentration in the furnace are measured).

[0038] 3, the transport speed information 41e stores the transport speed V at which the reflow apparatus M7 transports the substrate B. That is, the transport speed information 41e includes information related to the transport speed V of the substrate B in the reflow apparatus M7. The transport distance information 41f stores transport distances L1 to L6 (see FIG. 2) over which the substrate B is transported while being heated in each of the furnaces F1 to F6, and the transport distance L0 from the substrate detection position DP where the input sensor 10 detects the substrate B to the first furnace F1. That is, the transport distance information 41f includes information related to the transport distances L0 to L6 of the substrate B in the reflow apparatus M7.

[0039] The calculation unit 44 calculates a first time when the substrate B passed a predetermined position in the furnaces F1 to F6 based on a second time when the substrate B, which is included in the transport history information 41d, passed a predetermined position (substrate detection position DP) in the reflow apparatus M7, the transport speed V of the substrate B, which is included in the transport speed information 41e, and the transport distances L0 to L6, which are included in the transport distance information 41f. The identification unit 43 identifies the furnace temperature (specific furnace temperature) or the furnace oxygen concentration (specific oxygen concentration) when the substrate B was located in the multiple furnaces F1 to F6, based on the first time calculated from the atmosphere history information 41c and the transport history information 41d.

[0040] 6, a method for calculating the first time by the calculation unit 44 and a method for identifying the in-furnace temperature when the substrate B is located in multiple furnaces F1 to F6 and the in-furnace oxygen concentration when the substrate B is located in the fifth furnace F5 will be described. Here, an example will be described in which the transport distances L1 to L6 of the substrate B in each of the zones Z1 to Z6 of the reflow device M7 are equal. Also, the time when the substrate B passes a predetermined position in each furnace F1 to F6 (for example, the boundary between the first furnace F1 and the second furnace F2, or the center of the first furnace F1) will be defined as the first time.

[0041] In FIG. 6, the positional relationship from the entrance 6 to the exit 7 in the reflow device M7 is shown from top to bottom on the page. Time is also shown from left to right on the page. FIG. 6 shows the relationship between the positions and time within the reflow device M7 of five boards B that were carried into the reflow device M7. Hereinafter, the board B with identification information 58 of "B01" will be simply referred to as "board B01", etc.

[0042] In this example, zones Z1 to Z3 are preheating zones with a set furnace temperature of 160°C. Zones Z4 and Z5 are main heating zones, with the set furnace temperature of zone Z4 being 240°C, the set furnace temperature of zone Z5 being 230°C, and the set oxygen concentration of zone Z5 being 1000 ppm. Zone Z6 is a cooling zone with a set furnace temperature of 150°C. The set furnace temperatures and set oxygen concentrations of zones Z1 to Z6 are merely examples and can be changed as appropriate depending on the board, solder, etc.

[0043] 6, the calculation unit 44 calculates that the substrate B01, which is detected at the substrate detection position DP at the second time TD01 by the incoming sensor 10, will pass through the zone Z1 at the first time TC11, which is ((transport distance L0+transport distance L1) / transport speed V) after the second time TD01. Similarly, the calculation unit 44 calculates that the substrate B01 will pass through the zone Z2 at the first time TC21, which is ((transport distance L0+transport distance L1+transport distance L2) / transport speed V) after the second time TD01. The same applies below, and detailed explanations will be omitted. That is, the calculation unit 44 calculates the first times TC11-TC65 assuming that the substrates B01-B05 will pass through the respective zones Z1-Z6 after the transport time (transport distance / transport speed V) from the second times TD01-TD05, when they passed the substrate detection position DP.

[0044] The identifying unit 43 identifies the temperature or oxygen concentration when the substrate B was located in the furnace F1-F6 based on the temperature or oxygen concentration inside the furnaces F1-F6 measured at the first time or at least before and after the first time. For example, the substrate B01 passes through the fifth furnace F5 at the first time between measurement times TM03 and TM04. Therefore, the identifying unit 43 identifies the furnace temperature when the substrate B01 was located in the fifth furnace F5 (specific furnace temperature) based on the furnace temperatures (230°C and 228°C) of the fifth furnace F5 at measurement times TM03 and TM04. The identifying unit 43 also identifies the furnace oxygen concentration (specific oxygen concentration) when the substrate B01 was located in the fifth furnace F5 based on the furnace oxygen concentrations (1000 ppm and 1200 ppm) of the fifth furnace F5 at measurement times TM03 and TM04.

[0045] 7(a) and 7(b), an example of a method by which the identifying unit 43 identifies the specific oxygen concentration when the substrates B01-B05 were located in the fifth furnace F5 based on the in-furnace oxygen concentration (vertical axis) of the fifth furnace F5 measured at measurement times TM01-TM10 (horizontal axis) will be described. That is, a method of identifying (approximating) the in-furnace oxygen concentration (specific oxygen concentration) of the fifth furnace F5 at first times TC51-TC55 when the substrates B01-B05 were located in the fifth furnace F5 will be described.

[0046] 7(a), the in-furnace oxygen concentration of the fifth furnace F5 at first times TC51 to TC55 is determined in a stepwise manner based on the in-furnace oxygen concentration measurement values ​​at measurement times TM01 to TM10. That is, the determination unit 43 determines the in-furnace oxygen concentrations measured just before (or at) the first times TC51 to TC55 when the substrates B01 to B05 pass through the fifth furnace F5 as the specific oxygen concentrations CC51 to CC55 when the substrates B01 to B05 were located in the fifth furnace F5. For example, the determination unit 43 determines the in-furnace oxygen concentration C53 measured at measurement time TM03 just before the first time TC51 as the specific oxygen concentration CC51 when the substrate B01 was located in the fifth furnace F5.

[0047] 7(b), the in-furnace oxygen concentration in the fifth furnace F5 at first times TC51 to TC55 is determined by linear interpolation based on the in-furnace oxygen concentration measurement values ​​at measurement times TM01 to TM10. That is, the determination unit 43 linearly interpolates the in-furnace oxygen concentrations measured before and after the first times TC51 to TC55 when the substrates B01 to B05 pass through the fifth furnace F5, to determine the specific oxygen concentrations CC51 to CC55 when the substrates B01 to B05 were located in the fifth furnace F5. For example, the determination unit 43 linearly interpolates the in-furnace oxygen concentration C53 measured at measurement time TM03, just before the first time TC51, and the in-furnace oxygen concentration C54 measured at measurement time TM04, just after the first time TC51, to determine the specific oxygen concentration CC51 when the substrate B01 was located in the fifth furnace F5.

[0048] 3, the identification unit 43 associates the identified specific furnace temperatures HC11 to HC65 or specific oxygen concentrations CC51 to CC55 with the identification information 58 of the boards B01 to B05, and stores the associated information as board-specific history information 41g in the management memory unit 41. That is, the management memory unit 41 is a memory unit that stores the identified temperatures (specific furnace temperatures HC11 to HC65) or oxygen concentrations (specific oxygen concentrations CC51 to CC55) in association with the identification information 58 of the boards B01 to B05. The stored board-specific history information 41g is used as trace information for quality control of the mounted boards, etc.

[0049] An example of the substrate-specific history information 41g will now be described with reference to Fig. 8. The substrate-specific history information 41g stores, for each identification information 58 of substrate B, a specific furnace temperature 60 of zone Z1, a specific furnace temperature 61 of zone Z2, a specific furnace temperature 62 of zone Z3, a specific furnace temperature 63 of zone Z4, a specific furnace temperature 64 of zone Z5, and a specific furnace temperature 65 of zone Z6. The substrate-specific history information 41g also stores, for each identification information 58 of substrate B, a specific oxygen concentration 66 of zone Z5.

[0050] 3, the analysis unit 45 analyzes the fluctuation tendency of the oxygen concentration in the furnace relative to the transfer interval of the substrate B, based on the oxygen concentration in the furnace included in the atmosphere history information 41c and the transfer interval of the substrate B calculated from the transfer history information 41d. Then, when the analysis unit 45 determines that the oxygen concentration in the furnace is on the rise, it issues a command to at least one of increasing the interval at which the substrate B is loaded into the reflow device M7 or decreasing the oxygen concentration in the furnace in the fifth furnace F5.

[0051] The reflow control unit 25 of the reflow device M7, which has received the command to increase the interval between feeding the boards B, changes its control so that the interval between sending board removal permission commands to the upstream component mounting device M6 increases. Also, the reflow control unit 25 of the reflow device M7, which has received the command to decrease the oxygen concentration in the fifth furnace F5, changes its control so that the amount of inert gas introduced by the gas introduction unit 8 of the fifth furnace F5 increases.

[0052] Here, referring to FIG. 9, a method for analyzing the fluctuation trend of the oxygen concentration in the fifth furnace F5 relative to the transfer interval of substrates B passing through the fifth furnace F5, using the analysis unit 45, is described. Here, the oxygen concentration in the fifth furnace F5 is measured at predetermined time intervals. In FIG. 9, rectangles represent the time when substrates B11 to B25 are present in the fifth furnace F5. That is, the left edge of the rectangle indicates the time when the front ends of substrates B11 to B25 enter the fifth furnace F5, and the right edge of the rectangle indicates the time when the rear ends of substrates B11 to B25 exit the fifth furnace F5. Substrates B13 to B22 are introduced into the reflow furnace M7 from the upstream component mounting device M6 at 30-second intervals. Substrates B23 to B25 are introduced into the reflow furnace M7 at 45-second intervals.

[0053] The analysis unit 45 analyzes whether the in-furnace oxygen concentration 56 of the fifth furnace F5 included in the atmosphere history information 41c is higher or lower than the set oxygen concentration (1000 (ppm)). The analysis unit 45 also analyzes whether the in-furnace oxygen concentration 56 of the fifth furnace F5 exceeds an upper limit value (2000 (ppm)). The analysis unit 45 also analyzes whether the in-furnace oxygen concentration 56 of the fifth furnace F5 is continuously increasing or continuously decreasing.

[0054] In FIG. 9, if the oxygen concentration 56 in the fifth furnace F5 is greater than the set oxygen concentration and increases three consecutive times (measurement value indicated by ellipse a), the analysis unit 45 determines that the oxygen concentration is on the rise. That is, during this time period, the amount of oxygen flowing into the fifth furnace F5 when the substrate B enters the furnace exceeds the amount of inert gas introduced through the gas introduction unit 8. Therefore, the analysis unit 45 commands the reflow unit M7 to increase the interval between introductions of the substrate B or to decrease the oxygen concentration in the fifth furnace F5. In this example, the introduction interval is changed from 30 seconds to 45 seconds from the time when the substrate B23 is introduced into the reflow unit M7. Furthermore, as soon as it is determined that the oxygen concentration is on the rise, the amount of inert gas introduced through the gas introduction unit 8 of the fifth furnace F5 is increased.

[0055] Subsequently, the oxygen concentration 56 in the fifth furnace F5 tends to decrease due to the increased amount of inert gas being introduced (measurement value indicated by ellipse b). When the oxygen concentration 56 in the fifth furnace F5 decreases after the increase in the amount of inert gas and falls below the set oxygen concentration (measurement value indicated by circle c), the analysis unit 45 commands the gas introduction unit 8 of the fifth furnace F5 to return the amount of inert gas introduced to its original state. At this time, the interval between introductions of substrate B is maintained at 45 seconds. This prevents the oxygen concentration 56 in the fifth furnace F5 from decreasing excessively. Thereafter, the analysis unit 45 commands changes to the interval between introductions of substrates into the reflow device M7 and the amount of inert gas introduced by the gas introduction unit 8 based on the trend in the oxygen concentration in the furnace.

[0056] In FIG. 3, the analysis unit 45 analyzes the fluctuation trend of the furnace temperature relative to the transfer interval of the substrate B based on the furnace temperature included in the atmosphere history information 41c and the transfer interval of the substrate B calculated from the transfer history information 41d. Then, if the analysis unit 45 determines that the furnace temperature of the furnaces F1 to F6 is on a decreasing trend, it instructs the reflow device M7 to increase the interval at which the substrate B is introduced. This prevents the decrease in the furnace temperature of the furnaces F1 to F6. In other words, if the furnace temperature is on a decreasing trend due to the substrates B entering the furnaces F1 to F6, the number of substrates B entering the furnaces F1 to F6 per unit time is reduced to prevent further decrease in the furnace temperature. The analysis of the fluctuation trend of the furnace temperature by the analysis unit 45 is similar to the analysis of the fluctuation trend of the oxygen concentration in the furnace, and a detailed description thereof will be omitted.

[0057] As described above, the management device 3 of this embodiment includes an acquisition unit 42 that acquires atmosphere history information 41c including measurement results of at least furnace temperatures 51-55, 57 or furnace oxygen concentration 56 in furnaces F1-F6 of reflow apparatus M7, and transport history information 41d of substrate B in reflow apparatus M7, and an identification unit 43 that identifies a specific furnace temperature 60-65 or a specific oxygen concentration 66 when substrate B was located in furnaces F1-F6 based on atmosphere history information 41c and transport history information 41d, and manages a mounting substrate production line PL1 that includes at least reflow apparatus M7 that heats substrate B while transporting it. This makes it possible to identify the temperature or oxygen concentration when substrate B was located in furnaces F1-F6.

[0058] Next, a control method for identifying the temperature or oxygen concentration inside the furnaces F1 to F6 of the reflow equipment M7 when the substrate B is located in one of the furnaces F1 to F6 will be described, following the flow of Fig. 10. Here, a control method will be described in which the temperature or oxygen concentration inside the furnaces F1 to F6 of the reflow equipment M7 is identified while a mounted substrate is being manufactured in the mounted substrate manufacturing line PL1, and the information is fed back to the manufacturing operation of the mounted substrate manufacturing line PL1.

[0059] First, the acquisition unit 42 of the management device 3 acquires the temperature history 21b and the oxygen concentration history 21c from the reflow apparatus M7 and stores them as atmosphere history information 41c including the measurement results of the furnace temperatures 51-55, 57 or the furnace oxygen concentration 56 in the furnaces F1-F6. The acquisition unit 42 also acquires the substrate carry-in history 21d from the reflow apparatus M7 and stores them as transport history information 41d of the substrate B in the reflow apparatus M7 (ST1: acquisition step). The acquisition step (ST1) is executed at the timing when the furnace temperature or the furnace oxygen concentration is measured in the reflow apparatus M7, for example.

[0060] 10, the calculation unit 44 of the management device 3 then calculates the first times TC11 to TC61 at which the substrates B01 to B05 passed through predetermined positions in the furnaces F1 to F6 based on the second times TD01 to TD05 at which the substrates B01 to B05 included in the transport history information 41d passed through predetermined positions (substrate detection positions DP) in the reflow device M7, the transport speed V of the substrates B01 to B05 in the reflow device M7, and the transport distances L0 to L6 of the substrates B01 to B05 in the reflow device M7 (ST2: calculation step) (see FIG. 6).

[0061] Next, the identifying unit 43 of the management device 3 identifies the specific in-furnace temperatures 60-65 or the specific oxygen concentration 66 when the substrates B01-B05 were located in the furnaces F1-F6 based on the calculated first times TC51-TC55 or the in-furnace temperatures 51-55, 57 or the in-furnace oxygen concentration 56 measured in the furnaces F1-F6 before and after the first times TC51-TC55 (ST3: identifying step) (see FIGS. 7 and 8). That is, in the identifying step (ST3), the specific in-furnace temperatures 60-65 or the specific oxygen concentration 66 when the substrates B01-B05 were located in the furnaces F1-F6 are identified based on the atmosphere history information 41c and the transfer history information 41d.

[0062] 10, the identifying unit 43 associates the identified specific furnace temperature 60-65 or specific oxygen concentration 66 with the identification information 58 of the substrates B01-B05 and stores it as substrate-specific history information 41g (ST4: first storage step). This makes it possible to identify the temperature or oxygen concentration when the substrates B01-B05 were located in the furnaces F1-F6 for each of the substrates B01-B05.

[0063] Next, the analysis unit 45 of the management device 3 analyzes the fluctuation trend of the in-furnace oxygen concentration 56 relative to the transfer interval of the substrates B11 to B25 based on the in-furnace oxygen concentration 56 included in the atmosphere history information 41c and the transfer history information 41d (ST5: oxygen concentration analysis step) (see FIG. 9). If the analysis results in an increasing trend of the in-furnace oxygen concentration 56 (Yes in ST5) (oval a in FIG. 9), the analysis unit 45 commands the reflow device M7 to at least one of increasing the interval between the introduction of the substrates B23 to B25 and decreasing the oxygen concentration in the fifth furnace F5 (ST6: first command step). Based on this command, the introduction interval is changed from 30 seconds to 45 seconds, and the amount of inert gas introduced by the gas introduction unit 8 of the fifth furnace F5 is increased.

[0064] 10, the analysis unit 45 then analyzes the fluctuation tendency of the furnace temperatures 51-55, 57 relative to the transfer interval of the substrates B11-B25 based on the furnace temperatures 51-55, 57 included in the atmosphere history information 41c and the transfer history information 41d (ST7: temperature analysis step). If the analysis shows that the furnace temperatures 51-55, 57 are on a downward trend (Yes in ST7), the analysis unit 45 commands the reflow device M7 to increase the interval at which the substrates B19-B25 are loaded (ST8: second command step).

[0065] In this way, the interval at which boards B19-B25 are loaded into reflow equipment M7 or the amount of inert gas introduced by gas inlet 8 of fifth furnace F5 is changed (ST6, ST8) based on the tendency of fluctuations in furnace oxygen concentration 56 or furnace temperatures 51-55, 57 relative to the transfer interval of boards B11-B25 analyzed based on atmosphere history information 41c, including atmospheric history information 41c, and transfer history information 41d (ST5, ST7). This precisely controls fluctuations in furnace oxygen concentration 56 and furnace temperatures 51-55, 57, suppressing fluctuations in the quality of the manufactured mounted boards.

[0066] In FIG. 10, if the production of mounting boards in the mounting board manufacturing line PL1 has not been completed (No in ST9), the process returns to the acquisition step (ST1), and the processes of acquiring atmosphere history information 41c and transport history information 41d (ST1), creating and storing board-specific history information 41g (ST2 to ST4), and providing feedback (ST5 to ST8) on the interval at which boards B19 to B25 are introduced into the reflow device M7 and the amount of inert gas to be introduced into the fifth furnace F5, etc. are repeatedly executed.

[0067] Next, with reference to Fig. 11, the configuration of a reflow apparatus according to another embodiment of the present invention (hereinafter simply referred to as "reflow apparatus M7A") will be described using a block diagram of a mounted board manufacturing system 1A equipped with the reflow apparatus M7A. The reflow apparatus M7A differs from the reflow apparatus M7 shown in Fig. 3 in that it is equipped with a function for creating per-board history information 41g equipped in the management apparatus 3 shown in Fig. 3. Hereinafter, the same parts as those in the reflow apparatus M7 will be assigned the same reference numerals, and detailed description thereof will be omitted.

[0068] The reflow control device 20A included in the reflow device M7A includes a reflow memory unit 21A, a substrate detection processing unit 22, a temperature measurement processing unit 23, an oxygen measurement processing unit 24, a reflow control unit 25, a reflow communication unit 26, as well as an identification unit 33, a calculation unit 34, and an analysis unit 35. The reflow memory unit 21A also stores reflow conditions 21a, temperature history 21b, oxygen concentration history 21c, substrate carry-in history 21d, substrate information 21e, transport distance information 21f, and substrate-specific history information 21g. The substrate information 21e and transport distance information 21f are the same as the substrate information 41b and transport distance information 41f stored in the management memory unit 41 of the management device 3, and detailed description thereof will be omitted.

[0069] 11, the calculation unit 34 calculates the first time based on the second time included in the substrate carry-in history 21d, the transport speed V included in the reflow conditions 21a, and the transport distances L0 to L6 included in the transport distance information 21f, and other than that, the calculation unit 34 is the same as the calculation unit 44 of the management device 3, and a detailed description thereof will be omitted. The identification unit 33 is the same as the identification unit 43 of the management device 3, and a detailed description thereof will be omitted, other than that the identification unit 33 identifies a specific furnace temperature and a specific oxygen concentration based on the furnace temperatures of the furnaces F1 to F6 included in the temperature history 21b, the furnace oxygen concentration of the fifth furnace F5 included in the oxygen concentration history 21c, and the substrate carry-in history 21d.

[0070] The analysis unit 35 is the same as the analysis unit 45 of the management device 3, except that it analyzes the fluctuation trends of the furnace temperature and the furnace oxygen concentration relative to the substrate transport interval based on the furnace temperatures in the furnaces F1 to F6 contained in the temperature history 21b, the furnace oxygen concentration of the fifth furnace F5 contained in the oxygen concentration history 21c, and the substrate loading history 21d, and therefore detailed explanations will be omitted.

[0071] As described above, the reflow apparatus M7A according to another example of this embodiment includes furnaces F1-F6 for heating substrates, measurement units (temperature measurement unit 31, oxygen concentration measurement unit 32) for measuring at least the furnace temperature or oxygen concentration in the furnaces F1-F6, and an identification unit 33 for identifying a specific furnace temperature or specific oxygen concentration when the substrate was located in the furnaces F1-F6 based on the measured furnace temperature or furnace oxygen concentration and substrate transport information (substrate carry-in history 21d) in the reflow apparatus M7A. This allows the reflow apparatus M7A to independently identify the temperature or oxygen concentration when the substrate was located in the furnaces F1-F6.

[0072] Next, with reference to Figure 12, the configuration of a reflow apparatus according to another embodiment of the present invention (hereinafter simply referred to as "reflow apparatus M7B") will be described using a block diagram of a mounting board manufacturing system 1B equipped with reflow apparatus M7B. Reflow apparatus M7B differs from reflow apparatus M7 and reflow apparatus M7A in that it measures the temperature and oxygen concentration inside the furnace when a substrate is transported into furnaces F1 to F6. Hereinafter, the same parts as those in reflow apparatus M7 and reflow apparatus M7A will be assigned the same reference numerals, and detailed description will be omitted.

[0073] The reflow control device 20B included in the reflow device M7B includes a reflow storage unit 21B, a substrate detection processing unit 22, a temperature measurement processing unit 23B, an oxygen measurement processing unit 24B, a reflow control unit 25, a reflow communication unit 26, and an analysis unit 35B. The reflow storage unit 21A stores reflow conditions 21a, substrate information 21e, and substrate-specific history information 21g, as well as measurement conditions 21h.

[0074] 12, measurement condition 21h stores transport distances L1B to L6B from substrate detection position DP, where input sensor 10 detects substrates B08 to B09 introduced into reflow apparatus M7B, to temperature sensors S1 to S6 or oxygen concentration sensor 9 installed in each furnace F1 to F6 (see FIG. 13). Alternatively, measurement condition 21h stores transport time (transport distances L1B to L6B / transport speed V), calculated from transport distances L1B to L6B and transport speed V of substrates B08 to B09 included in reflow condition 21a, for substrates B08 to B09 that have passed substrate detection position DP to reach temperature sensors S1 to S6 or oxygen concentration sensor 9.

[0075] Temperature measurement unit 31B measures the temperature inside the furnace a predetermined time (transport time) after substrate detection unit 30 detects substrates B08-B09 passing through substrate detection position DP. Oxygen concentration measurement unit 32B measures the oxygen concentration inside the furnace a predetermined time (transport time) after substrate detection unit 30 detects substrates B08-B09 passing through substrate detection position DP. The predetermined time (transport time) is calculated based on the transport speed V at which substrate transport unit 5 transports substrates B08-B09 and transport distances L1B-L6B from substrate detection position DP at which substrate detection unit 30 detects substrates B08-B09 to positions measured by sensors (temperature sensors S1-S6, oxygen concentration sensor 9) of the measurement units (temperature measurement unit 31, oxygen concentration detection unit 32).

[0076] The second time when substrate detection unit 30 detects substrates B08-B09, the furnace temperature and measurement time measured by temperature measurement unit 31B, and the furnace oxygen concentration and measurement time measured by oxygen concentration measurement unit 32B are linked to identification information 58 of measured substrates B08-B09 and stored in reflow memory unit 21B as substrate-specific history information 21g. In other words, reflow memory unit 21B is a memory unit that stores the second time when substrates B08-B09 were detected and the measurement time when the furnace temperature or furnace oxygen concentration was measured, linked to identification information 58 of measured substrates B08-B09.

[0077] 13, a method for measuring the furnace temperature and the furnace oxygen concentration by the temperature measurement unit 31B and the oxygen concentration measurement unit 32B will be described. Substrate B08 is detected by the substrate detection unit 30 (incoming sensor 10) at substrate detection position DP at second time TD08. Thereafter, at measurement time TM18 when substrate B10 reaches the position of temperature sensor S1 in zone Z1, the furnace temperature HC18 is measured by the temperature measurement unit 31B (temperature sensor S1).

[0078] Similarly, at measurement times TM28 to TM68 when substrate B10 reaches the positions of temperature sensors S2 to S6 in zones Z2 to Z6, temperature measurement unit 31B (temperature sensors S2 to S6) measures furnace temperatures HC28 to HC68. Furthermore, at measurement time TM58 when substrate B10 reaches the position of oxygen concentration sensor 9 in zone Z5, oxygen concentration measurement unit 32B (oxygen concentration sensor 9) measures furnace oxygen concentration CC58.

[0079] 12, analysis unit 35B analyzes the tendency of furnace temperatures HC18-HC69 relative to the transfer interval of substrates B08-B09 based on the second times TD08-TD09, furnace temperatures HC18-HC69, and measurement times TM18-TM69 for substrates B08-B09 included in substrate-specific history information 21g stored in reflow memory unit 21B (memory unit). If analysis unit 35B determines that furnace temperatures HC18-HC69 are on a downward trend, it commands reflow equipment M7B to increase the interval at which substrates B08-B09 are loaded.

[0080] Furthermore, analysis unit 35B analyzes the fluctuation tendency of the in-furnace oxygen concentrations CC58-CC69 with respect to the transfer interval of substrates B08-B09, based on the second times TD08-TD09, the in-furnace oxygen concentrations CC58-CC69, and the measurement times TM18-TM69 for substrates B08-B09 included in substrate-specific history information 21g stored in reflow memory unit 21B (memory unit). Then, when analysis unit 35B determines that the in-furnace oxygen concentrations CC58-CC69 are on the rise, it instructs reflow device M7B to at least one of increasing the interval at which substrates B08-B09 are loaded or increasing the amount of inert gas introduced by gas introduction unit 8.

[0081] Next, a control method for measuring the temperature or oxygen concentration in the furnaces F1 to F6 of the reflow device M7B when substrates B08 to B09 are located in the furnaces F1 to F6 will be described with reference to the flow chart in Fig. 14. Hereinafter, the same steps as those in the control method shown in Fig. 10 will be assigned the same reference numerals, and detailed description thereof will be omitted.

[0082] First, when the substrate detection unit 30 detects the substrates B08-B09 being loaded into the reflow apparatus M7B (Yes in ST11), the measurement times TM18-TM69 at which the substrates B08-B09 will reach the temperature sensors S1-S6 or oxygen concentration sensor 9 of the furnaces F1-F6 are calculated (ST12: measurement time calculation step). Next, the temperature measurement unit 31B and the oxygen concentration measurement unit 32B measure the in-furnace temperatures HC18-HC69 and the in-furnace oxygen concentrations CC58-CC69 at the measurement times TM18-TM69 (ST13: third measurement step).

[0083] 14, the second time when substrate detection unit 30 next detected substrates B08-B09, the measured furnace temperatures HC18-HC69, the furnace oxygen concentrations CC58-CC69, and the measurement times TM18-TM69 are linked to identification information 58 of substrates B08-B09 and stored as substrate-specific history information 21g (ST14: second storage step). Thereafter, based on substrate-specific history information 21g, an oxygen concentration analysis step (ST5), a first command step (ST6), a temperature analysis step (ST7), and a second command step (ST8) are executed, and the interval at which substrates B08-B09 are loaded into reflow apparatus M7B or the amount of inert gas introduced by gas introduction unit 8 of fifth furnace F5 is changed.

[0084] As described above, the reflow apparatus M7B of another example of this embodiment includes furnaces F1 to F6 for heating the substrates B08 to B09, measurement units (temperature measurement unit 31B, oxygen concentration measurement unit 32B) for measuring at least the furnace temperatures HC18 to HC69 or the furnace oxygen concentrations CC58 to CC69 in the furnaces F1 to F6, a substrate transport unit 5 for transporting the substrates B08 to B09, and a substrate detection unit 30 for detecting the substrates B08 to B09 passing through a predetermined position (substrate detection position DP) before the furnaces F1 to F6.

[0085] Then, the measurement unit measures the in-furnace temperatures HC18-HC69 or the in-furnace oxygen concentrations CC58-CC69 a predetermined time (measurement times TM18-TM69) after substrate detection unit 30 detects substrates B08-B09. This makes it possible to identify (measure) in real time the temperatures or oxygen concentrations when substrates B08-B09 were located in furnaces F1-F6. [Industrial Applicability]

[0086] The control device, reflow device, and control method of the present invention have the effect of being able to identify the temperature or oxygen concentration when a substrate was placed in a furnace, and are useful in the field of mounting components onto substrates. [Explanation of symbols]

[0087] 1, 1A, 1B Mounting Board Manufacturing System 3 Management device 5. Board transport section 8 Gas inlet B, B01~B05, B08~B09, B11~B25 board DP PCB detection position (predetermined position for reflow device) F1 1st reactor F2 2nd furnace F3 3rd reactor F4 No. 4 reactor F5 No. 5 reactor F6 No. 6 reactor L0~L6, L1B~L6B Conveying distance M7, M7A, M7B reflow equipment PL1 Mounting board production line V Conveying speed

Claims

1. A management device for a mounting substrate manufacturing line including at least a reflow device that heats a substrate while transporting it, an acquisition unit that acquires atmospheric history information including measurement results of at least the temperature or oxygen concentration in a furnace of the reflow apparatus and transport history information of the substrate in the reflow apparatus; an identifying unit that identifies the temperature or the oxygen concentration when the substrate was located in the furnace based on the atmosphere history information and the transfer history information; an analysis unit that analyzes a tendency of fluctuation in the oxygen concentration relative to a transfer interval of the substrate based on the oxygen concentration included in the atmosphere history information and the transfer history information, When the analysis unit determines that the oxygen concentration is on the rise, it instructs the management device to at least one of increasing the interval between placing substrates in the reflow device or decreasing the oxygen concentration in the furnace.

2. The management device according to claim 1 , further comprising a storage unit that stores the specified temperature or oxygen concentration in association with identification information of the substrate.

3. the reflow apparatus has a plurality of the furnaces, The management device according to claim 1 , wherein the specifying unit specifies the temperature or the oxygen concentration when the substrate was located in each of the plurality of furnaces.

4. 4. The management device according to claim 1, wherein the identification unit identifies the temperature or the oxygen concentration when the substrate was located in the furnace based on a first time when the substrate passed a predetermined position in the furnace.

5. A calculation unit is further provided, the transport history information includes a second time when the substrate passed through a predetermined position in the reflow apparatus; 5. The management device according to claim 4, wherein the calculation unit calculates the first time based on the second time, transport speed information relating to a transport speed of the substrate in the reflow apparatus, and transport distance information relating to a transport distance of the substrate in the reflow apparatus.

6. 6. The management device according to claim 4, wherein the determination unit determines the temperature or the oxygen concentration when the substrate was located in the furnace based on the temperature or the oxygen concentration inside the furnace measured at the first time or at least before and after the first time.

7. The management device according to claim 1 , wherein the atmospheric history information includes at least the temperature or the oxygen concentration measured at predetermined time intervals.

8. A management device for a mounting substrate manufacturing line including at least a reflow device that heats a substrate while transporting it, an acquisition unit that acquires atmospheric history information including measurement results of at least the temperature or oxygen concentration in a furnace of the reflow apparatus and transport history information of the substrate in the reflow apparatus; an identifying unit that identifies the temperature or the oxygen concentration when the substrate was located in the furnace based on the atmosphere history information and the transfer history information; an analysis unit that analyzes a tendency of fluctuation in the temperature relative to a transfer interval of the substrate based on the temperature included in the atmosphere history information and the transfer history information, When the analysis unit determines that the temperature is decreasing, the management device instructs the reflow device to increase the interval at which the boards are loaded.

9. 1. A management method for identifying a temperature or an oxygen concentration in a furnace of a reflow device that heats a substrate while transporting the substrate, when the substrate is positioned in the furnace, comprising: Acquire atmospheric history information including measurement results of at least the temperature or oxygen concentration inside the furnace and transportation history information of the substrate in the reflow apparatus; Identifying the temperature or the oxygen concentration when the substrate was located in the furnace based on the atmosphere history information and the transport history information; analyzing a variation trend of the oxygen concentration relative to a transfer interval of the substrate based on the oxygen concentration included in the atmosphere history information and the transfer history information; When it is determined that the oxygen concentration is on the rise, the control method instructs at least one of increasing the intervals between placing substrates in the reflow device and lowering the oxygen concentration in the furnace.

10. A management method for determining a temperature or an oxygen concentration in a furnace of a reflow device that heats a substrate while transporting the substrate, when the substrate is positioned in the furnace, comprising: Acquire atmospheric history information including measurement results of at least the temperature or oxygen concentration inside the furnace and transportation history information of the substrate in the reflow apparatus; Identifying the temperature or the oxygen concentration when the substrate was located in the furnace based on the atmosphere history information and the transport history information; analyzing a tendency of fluctuation in the temperature relative to a transfer interval of the substrate based on the temperature included in the atmosphere history information and the transfer history information; When it is determined that the temperature is decreasing, a control method is provided in which an instruction is given to increase the interval at which the boards are put into the reflow device.

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