Information processing device, imprint device, computer program, and article manufacturing method

Abstract

To provide an information processing device, etc. that can reduce the cost and time required for adjusting the profile of imprinting of an imprinting device.SOLUTION: An information processing device is for simulating an imprint on an imprint device. The information processing device has curvature acquisition means for acquiring a change in curvature of a pattern portion on the periphery of a contact surface when the pattern portion and an imprint material are brought into contact in the imprint and profile adjusting means for adjusting the profile of the imprint of the pattern portion so that the curvature does not fall below a predetermined threshold value.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to an information processing apparatus, an imprint apparatus, a computer program, and a method for manufacturing an article. [Background technology]

[0002] Imprinting technology has attracted attention as a new pattern formation technology for manufacturing semiconductor devices. In imprinting equipment, the force with which a mold is pressed against a substrate such as a silicon wafer or glass plate (imprinting force), the pressure with which the mold expands during pressing (cavity pressure), and the contact speed between the mold and the imprinting agent are controlled over time according to a predetermined profile.

[0003] Patent document 1 describes that the behavior of the imprinting force and cavity pressure during imprinting is controlled based on a time-series imprinting profile, but if this imprinting profile is not properly adjusted, it may cause pattern defects due to the inclusion of air bubbles during imprinting.

[0004] In recent years, the occurrence of pattern defects has also been predicted by calculating the amount of gas remaining in the mold and substrate during imprinting, as described in Patent Document 2. By using such a simulator, it is possible to confirm imprint performance under any conditions without performing imprinting on an actual machine. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 5433584 [Patent Document 2] Patent Publication No. 2021-89987 Summary of the Invention [Problem to be solved by the invention]

[0006] The above-mentioned imprinting profile is finely adjusted to conditions that do not cause pattern defects by performing imprinting multiple times under the conditions each time the external environment, such as the mold or substrate, changes. Furthermore, pattern defects are detected over time by direct observation using a defect inspection device or the like after each imprint. This trial-and-error adjustment method has the problem that it requires a great deal of time and cost for adjustment each time the external environment changes.

[0007] An object of the present invention is to provide an information processing apparatus and the like that can reduce the cost and time required for adjusting the imprint profile of an imprint apparatus. [Means for solving the problem]

[0008] An information processing device according to one aspect of the present invention that solves the above problem comprises: An information processing apparatus for performing a simulation of imprinting in an imprinting apparatus, a curvature acquisition means for acquiring a change in curvature of the pattern portion near the outer periphery of the contact surface when the pattern portion and the imprint material are brought into contact with each other during the imprinting; a profile adjusting means for adjusting a profile of the imprint of the pattern portion so that the curvature does not fall below a predetermined threshold; a defect position acquisition means for acquiring a defect position of the imprint; With death, The profile adjustment means acquires the predetermined threshold value based on the defect position acquired by the defect position acquisition means and the change in the curvature acquired by the curvature acquisition means. It is characterized by: [Effects of the Invention]

[0009] According to the present invention, it is possible to realize an information processing apparatus and the like that can reduce the cost and time required for adjusting the imprint profile of an imprint apparatus. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a diagram illustrating a configuration of an imprint apparatus according to a first embodiment. [Figure 2] 10 is a flowchart showing a procedure for determining a threshold value of curvature according to the first embodiment. [Figure 3] FIG. 10 is a diagram showing an example of interference fringes captured by a spread camera. [Figure 4] 4 is a diagram showing the shape of the contact surface of the pattern portion in the vicinity of the outer periphery according to Example 1. FIG. [Figure 5] FIG. 4 is a diagram showing experimental data of defect distribution output by the defect inspection device according to the first embodiment. [Figure 6] FIG. 10 is a diagram showing an example of experimental data showing a time series change in curvature calculated from an image of a spread camera according to the first embodiment. [Figure 7] 10 is a flowchart showing a flow of adjustment of an imprint profile according to the first embodiment. [Figure 8] FIG. 10 is a block diagram showing a hardware configuration of an information processing device used in a simulation according to a second embodiment. [Figure 9] 10 is a flowchart showing a flow of determining a threshold value of curvature according to the second embodiment. [Figure 10] 10 is a flowchart showing a flow of adjustment of an imprint profile according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiments. In each drawing, the same members or elements are designated by the same reference numerals, and duplicate descriptions will be omitted or simplified.

[0012] Example 1 FIG. 1 is a diagram illustrating the configuration of an imprint apparatus according to a first embodiment. The imprinting apparatus 100 according to the first embodiment brings an imprinting material 105 supplied onto a substrate 103 into contact with a mold 106. Then, by applying energy for curing to the imprinting material 105, a pattern of a cured material to which the concave-convex pattern of the mold 106 is transferred is formed.

[0013] The imprint material 105 is a curable composition that is cured when curing energy is applied. Electromagnetic waves, heat, or the like can be used as the curing energy. Electromagnetic waves are, for example, light having a wavelength selected from the range of 10 nm to 1 mm, such as infrared light, visible light, or ultraviolet light. The curable composition is a composition that is cured by irradiation with light or by heating.

[0014] Among these, the photocurable composition that is cured by irradiation with light contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent, as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal mold release agent, a surfactant, an antioxidant, a polymer component, etc.

[0015] The substrate 103 is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass, and the material of the substrate 103 is, for example, glass, ceramics, metal, semiconductor, resin, etc. If necessary, a member made of a material different from that of the substrate may be provided on the surface of the substrate.

[0016] In FIG. 1, in this embodiment, the imprinting apparatus 100 employs a photo-curing method in which the imprinting material 105 is cured by irradiating it with ultraviolet light, but this is not limited to this, and it is also possible to employ, for example, a thermal curing method in which the imprinting material is cured by heat input.

[0017] The imprinting apparatus 100 shown in FIG. 1 imprints (impresses) a pattern of a pattern portion 108 onto an imprinting material 105 on a substrate 103 using a mold 106 on which a pattern portion 108 is formed.

[0018] The substrate holder 102 is disposed on the substrate stage 101, and a substrate 103 is held by suction on the substrate holder 102. By observing an alignment mark provided on the substrate 103 with an alignment optical system (not shown), it is possible to detect misalignment of the substrate 103.

[0019] Meanwhile, the mold 106 is held by a mold holding unit 107. A dispenser 104 supplies an imprint material 105, which is a photocurable resin, onto the substrate 103. When the mold 106 is lowered by a mold driving unit 109 and brought into contact with the imprint material 105 supplied onto the substrate 103, the imprint material 105 flows into pattern grooves engraved in a pattern unit 108.

[0020] At this time, positive pressure is applied as cavity pressure to the cavity between the mold 106 and the mold holding unit 107, causing the pattern unit 108 to bend convexly as shown in Fig. 1. This allows the imprint material 105 supplied onto the substrate 103 to come into contact with the center of the pattern unit 108. Note that the mold driving unit 109 is a mechanism for moving the mold 106 up and down relative to the substrate 103, but any mechanism that can relatively change the distance between the mold 106 and the substrate 103 will do.

[0021] The spread camera 110 has a sensor, an image acquisition unit, and a monochromatic light beam irradiation unit, and the beam irradiation unit irradiates the monochromatic light so that it passes through the transparent pattern unit 108. The sensor can then capture an image of the gradual expansion of the contact area between the pattern unit 108 and the imprint material 105. The sensor also captures an image of interference fringes (Newton's rings) formed on the outside near the periphery of the contact surface between the pattern unit 108 and the imprint material 105.

[0022] The control unit 111 functions as a control means for controlling the entire imprint apparatus, and has a CPU as a built-in computer. The CPU of the control unit 111 controls the operation of each part of the entire imprint apparatus based on a computer program stored in a memory (not shown) serving as a storage medium.

[0023] In the first embodiment, the imprinting profile is adjusted using an imprinting apparatus. Note that the imprinting profile (imprinting profile) in this embodiment refers to a time-series change pattern of various control parameters required when performing an imprinting operation. Details will be described later.

[0024] In Example 1, the process of adjusting the imprint profile is roughly divided into two processes: a curvature threshold determination process and an imprint profile adjustment process. In the curvature threshold determination process, a mask curvature threshold that does not affect filling performance is obtained from environmental information about the wafer, mask, etc. used and the target filling time.

[0025] FIG. 2 is a flowchart illustrating a flow of determining a threshold value of curvature according to the first embodiment. The computer in the control unit 111 executes a computer program stored in the memory to perform the operations of the steps in the flowchart of FIG.

[0026] First, in step S201, a time-series profile of the base (reference) imprinting force, cavity pressure, etc. is set as the imprinting profile. If the maximum imprinting force is too weak relative to the cavity pressure, imprinting will end without part of the pattern portion coming into contact with the imprinting material. Therefore, it is desirable to use a time-series imprinting profile with a relatively high maximum imprinting force as the base.

[0027] Next, in step S202, imprinting is performed using the set imprinting profile. At this time, control parameters other than the imprinting profile and the device environment (temperature, humidity, etc.) are set to appropriate optimal conditions.

[0028] In step S203, an image is acquired from the spread camera, and in step S204, the curvature in the Z direction of the pattern part during imprinting is acquired from the image from the spread camera by calculation, etc. Here, steps S203 and S204 function as a curvature acquisition step (curvature acquisition means) that acquires the change in curvature of the pattern part near the periphery of the contact surface when the pattern part and the imprint material are brought into contact during imprinting.

[0029] Figure 3 is a diagram showing an example of interference fringes captured by the spread camera, and is a schematic representation of the fringe pattern (Newton's rings) captured by the spread camera 110 during imprinting. Schematically, dark area 302 and light area 303 are separated into two patterns, but in reality, there is a gradient from white to black between the light and dark areas. Figure 3 shows the imprint material being spread from the center of the pattern area 108, and the shaded area 301 represents the part of the imprint material that has already been spread by the pattern area 108.

[0030] In areas where the illumination beam of the spread camera is monochromatic and the gap between the pattern and the substrate is sufficiently narrow, light interference causes alternating dark areas 302 and light areas 303. This striped pattern is called "interference fringes" or "Newton rings."

[0031] Interference fringes appear due to differences in the optical path length of the beams, that is, in this embodiment, differences in the height between the substrate surface and the mold surface. Therefore, by knowing the coordinates of the dark and light portions 302 and 303 of the interference fringes, it is possible to know the height of the pattern portion 108 relative to the substrate surface at those coordinates. The height information of the pattern portion 108 relative to the upper surface of the substrate 103 at any coordinate obtained in this way can be used to determine the shape of the pattern portion 108 during imprinting (height distribution in the Z direction).

[0032] In step S204, based on the coordinates of the dark and bright portions 302 and 303 of the interference fringes, the curvature of the pattern portion 108 near the periphery of the contact surface between the pattern portion 108 and the imprint material 105 (or the substrate 103) at the periphery of the hatched portion 301 is calculated. Then, information on the time-series change in the distribution of the curvature is stored in a memory (not shown).

[0033] FIG. 4 is a diagram showing the shape of the vicinity of the periphery of the contact surface of the pattern portion according to the first embodiment, and shows the vicinity of the periphery of the contact surface between the substrate 103, the imprint material 105, and the pattern portion . The curvature of the pattern in the Z direction is calculated based on the shape of the area near the periphery of the contact surface as shown in the figure, which is calculated from interference fringes. The width in the X direction of the area near the periphery of the contact surface used to calculate the curvature can be set to any width d. However, the width d is fixed for one imprint profile adjustment.

[0034] The curvature (curvature information) in this embodiment may be expressed as the reciprocal of the radius of curvature r in Fig. 4, or as the angle θ of a tangent to the pattern portion 108 at width d relative to the angle of a tangent to the pattern portion 108 at the outer periphery of the contact surface in Fig. 4. Alternatively, the curvature may be expressed as the height h of the pattern portion 108 at the position of width d relative to the height of the pattern portion 108 at the outer periphery of the contact surface in Fig. 4. Alternatively, the curvature may be expressed as a slope h / d using h. That is, the curvature (curvature information) in this embodiment includes any one of the reciprocal of the radius of curvature r, the angle θ, the height h, the slope h / d, etc.

[0035] Meanwhile, in step S205, the substrate is transported to a defect inspection device. The defect inspection device then identifies the coordinates of defects (unfilled defects) that have occurred on the substrate imprinted in step S202 due to residual air bubbles or the like hindering filling of the imprint material. Here, the defect inspection device functions as a measurement means for measuring the position of the imprint defect.

[0036] Furthermore, in step S206, the defect distribution within the shot is acquired. Here, steps S205 and S206 function as a defect position acquiring step (defect position acquiring means) for acquiring the defect position of the imprint.

[0037] In FIG. 2, steps S203 and S204 and steps S205 and S206 are shown in parallel, but steps S205 and S206 may be performed after steps S203 and S204, for example.

[0038] 5 is a diagram showing experimental data of the defect distribution output by the defect inspection apparatus according to Example 1, and shows experimental data of the distribution of unfilled defects measured using a defect inspection apparatus (KLA-Tencor KT2905). Note that the defect inspection apparatus is not limited to the above-described defect inspection apparatus. Furthermore, the defect inspection apparatus may be provided inside or outside the imprint apparatus.

[0039] As shown in Figure 5, unfilled defects often appear in concentric circles centered on the initial contact point between the substrate and the pattern. This is because, as the contact surface expands concentrically as imprinting progresses, trapped air bubbles, which are caused by factors such as the contact surface expanding too quickly, also appear concentrically.

[0040] In step S207, the curvature at the position where the unfilled defect occurs is obtained from the time series change in the curvature distribution calculated from the spread camera image in step S204 and the defect distribution obtained in step S206. FIG. 6 is a diagram showing an example of experimental data showing a time series change in curvature calculated from an image of the spread camera according to the first embodiment.

[0041] The transition of curvature at the location where the unfilled defect occurred is extracted by referring to the time-series change of curvature as shown in Fig. 6. Note that Fig. 6 shows the transition of curvature during imprint operation under the same conditions as the distribution of unfilled defects shown in Fig. 5, and the range from time T1 to T2 corresponds to the area where the unfilled defect occurred.

[0042] In step S208, the maximum value of the curvature transition extracted in step S207 is found and stored as the curvature threshold (curvature threshold) at the position of the unfilled defect. For example, the threshold in Fig. 6 is found to be the maximum curvature Cmin within the range from time T1 to T2. Note that the maximum curvature Cmin within the range from time T1 to T2 at which the unfilled defect occurs can also be said to be the minimum curvature at which the unfilled defect does not occur.

[0043] In this way, in steps S207 and S208, a curvature threshold is obtained based on the defect position obtained in step S206 and the change in curvature obtained in step S204. Once the curvature threshold (curvature threshold) has been determined, an imprint profile adjustment process is performed to optimize the imprint process. That is, an imprint profile is created so that the pattern part 108 does not fall below the curvature threshold determined in step S208 during imprinting.

[0044] FIG. 7 is a flowchart showing the flow of adjustment of the impression profile according to the first embodiment, and shows a workflow for optimizing the impression profile. The computer in the control unit 111 executes a computer program stored in the memory to perform the operations of the steps in the flowchart of FIG.

[0045] In steps S701, S702, S703, and S704, as in the curvature threshold determination flow, imprinting is performed using an arbitrary imprint profile, and the curvature transition is obtained using interference fringes of time-series images from the spread camera.

[0046] First, in step S701, a time series profile of the imprinting force, cavity pressure, etc. to be adjusted is set as an imprinting profile. Note that the imprinting profile set in step S701 may be the same as or different from the base imprinting profile set in step S201.

[0047] Next, in step S702, imprinting is performed using the profile set in step S701, and in step S703, time-series images during the imprinting operation are acquired from the spread camera. Furthermore, in step S704, the time transition of the curvature near the periphery of the contact surface between the imprint material 105 (or substrate 103) and the pattern portion 108 is calculated based on the position of the interference fringes.

[0048] Next, in step S705, it is determined whether there is any area in the acquired curvature transition that is below the curvature threshold determined in step S208. If there is an area below the threshold in step S705, the occurrence of unfilled defects is high, so the imprint profile is adjusted in steps S706 and onwards. If there is no section below the curvature threshold in step S705, the imprint profile optimization flow in Figure 7 ends.

[0049] In step S706, it is determined at what time (region) the curvature falls below the threshold value in the determination of S705, that is, the time (region) in which the curvature falls below the curvature threshold value is determined. In step S707, the behavior of the imprinting force and cavity pressure specified by the imprinting profile set in step S701 is adjusted in the time (region) specified in step S706 so as not to fall below the curvature threshold value.

[0050] That is, the pattern unit 108 creates an imprint profile that prevents the curvature from falling below the curvature threshold determined in step S208 during imprinting. To achieve this, for example, the imprinting speed, cavity pressure, etc. are adjusted for areas where the mask curvature falls below the threshold, and an optimal imprinting method (imprinting profile) is generated.

[0051] Specifically, for example, the imprinting speed in that region is slowed down. Since the main cause of the reduction in curvature is deformation of the pattern portion 108 due to gas pressure generated between the imprint material 105 on the substrate and the pattern portion 108, the reduction in curvature can be suppressed by slowing down the imprinting speed in that region. Alternatively, the cavity pressure can be increased. This increases the rigidity of the pattern portion 108, making it less likely for deformation of the pattern portion 108 to occur, and preventing the reduction in curvature.

[0052] Steps S207, S208, S705, S706, etc. function as a profile adjustment step (profile adjustment means) for adjusting the imprint profile of the pattern portion so that the curvature does not fall below a predetermined threshold value.

[0053] The imprinting profile adjusted in step S707 may include, for example, a time series profile of the imprinting force used to press the pattern portion against the imprinting material during the imprinting operation. It may also include a time series profile of the positional relationship (e.g., speed, etc.) between the pattern portion and the imprinting material, or a time series profile of the pressure used to deform the pattern portion into a convex shape toward the imprinting material. That is, the imprinting profile includes at least one of a time series profile of the imprinting force, a time series profile of the positional relationship (e.g., speed, etc.), and a time series profile of the pressure used to deform the pattern portion into a convex shape.

[0054] After adjusting the imprint profile, the process returns to step S701, and imprinting is performed again using the adjusted imprint profile. Finally, if the curvature falls below the curvature threshold value in all sections in step S705, optimization of the imprint profile is completed.

[0055] Then, the control unit 111 of the imprint apparatus 100 performs the actual imprinting operation (the operation of imprinting the pattern portion 108 into the imprint material 105) using the imprinting profile adjusted as described above. Therefore, it is possible to achieve imprinting with few unfilled defects.

[0056] As described above, the method for optimizing the imprinting profile in Example 1 enables adjustment of the imprinting profile based on image information acquired by the spread camera during the imprinting operation. Therefore, compared to the conventional trial-and-error method in which a defect inspection is performed to check for the presence or absence of defects every time the imprinting profile is adjusted, it is possible to significantly reduce the time and cost required for adjustment.

[0057] Example 2 In Example 1, a pattern was actually formed using an imprinting device, and the imprinting behavior was adjusted by comparing the mold curvature distribution and defect distribution over time. In Example 2, an imprinting simulation was performed using an information processing device, and the imprinting profile was adjusted.

[0058] FIG. 8 is a block diagram illustrating a hardware configuration of an information processing device used in a simulation according to the second embodiment. The information processing device 800 performs calculations to predict (simulate) the shape of the pattern portion 108 and the behavior of the imprint material 105 in the processing executed by the imprint apparatus 100.

[0059] The information processing device 800 is configured, for example, by incorporating a simulation program 805 into a general-purpose or dedicated computer. The information processing device 800 includes a processor 801 as a computer, a memory 804 as a storage medium in which the simulation program 805 is stored, a display 802, and an input device 803. The display 802 includes, for example, a liquid crystal display, and the input device 803 includes, for example, a keyboard, a mouse, a touch panel, etc.

[0060] The memory 804 may be a semiconductor memory, a disk such as a hard disk, or other types of memory. The simulation program 805 is stored in a memory medium readable by the processor 801 as a computer. Alternatively, the simulation program 805 is provided to the information processing device 800 from outside the information processing device 800 via communication facilities such as telecommunications lines. Note that the individual blocks shown in Fig. 8 do not have to be built into the same housing, and may be configured as separate devices connected to each other via signal paths.

[0061] The process of adjusting the imprint profile includes two processes, a curvature threshold value determination process and an imprint profile adjustment process, as in the first embodiment. FIG. 9 is a flowchart showing a flow of determining a threshold value of curvature according to the second embodiment. The flow of determining a threshold value of curvature using simulation by the information processing device 800 will be described with reference to FIG.

[0062] The processor 801 as a computer executes a simulation program 805 as a computer program stored in a memory 804, thereby performing the operations of the steps in the flowchart of FIG.

[0063] First, in step S901, a time series profile of the base (reference) imprinting force, cavity pressure, etc. is set as an imprinting profile. Next, in step S902, a simulation of the imprint operation is performed using the imprint profile that has been set up, with the control parameters other than the imprint profile and the device environment (temperature, humidity, etc.) being set to optimal conditions.

[0064] In step S903, the shape of the pattern portion 108 during imprinting is obtained by simulation. Specifically, for example, the pressure of the gas between the pattern portion 108 and the imprint material is calculated by simulation, and the shape of the pattern portion 108 during imprinting is calculated and obtained based on the gas pressure and the physical property values ​​of the pattern portion 108.

[0065] Then, in step S904, the curvature of the pattern portion 108 near the periphery of the contact surface is calculated from the information. Here, steps S903 and S904 function as a curvature acquisition step (curvature acquisition means) that acquires the change in curvature of the pattern portion near the periphery of the contact surface when the pattern portion and the imprint material are brought into contact during imprinting. Incidentally, the curvature (curvature information) in the second embodiment includes any one of the reciprocal of the radius of curvature r, the angle θ, the height h, the inclination h / d, and the like, as explained in the first embodiment.

[0066] Furthermore, by calculating the curvature at any time interval from the start of imprinting, it is possible to obtain the time transition of the curvature. In the case of Example 2, it is possible to obtain data with higher accuracy than the method of Example 1, which indirectly obtains the mold shape from the spread camera.

[0067] In step S905, a simulation is performed to predict the occurrence of unfilled defects or to obtain the distribution of unfilled defects at any time within the imprinted area. Note that step S905 functions as a defect position acquisition step (defect position acquisition means) that acquires the positions of imprint defects.

[0068] The occurrence of unfilled defects is predicted by, for example, using a simulation to determine the time series of the gas pressure between the pattern portion 108 and the substrate 103. Then, the amount of gas remaining between the pattern portion 108 and the imprint material 105 when imprinting is completed is determined based on the gas pressure, and the defect position is predicted based on the amount of residual gas.

[0069] That is, similar to the imprinting apparatus 100, the amount of bubbles remaining between the pattern portion 108 and the substrate 103 when the mold imprinting operation is input and operated on the simulator is calculated. Then, based on the remaining amount of bubbles, the unfilled areas (defect distribution) of the imprinting material 105 remaining at the end of imprinting can be obtained.

[0070] Instead of obtaining the unfilled defect distribution by simulation, the unfilled defect distribution may be obtained using an imprint apparatus and a defect inspection apparatus in the same manner as in the first embodiment. In FIG. 9, steps S903, S904, and step S905 are shown to be performed in parallel, but the processing of step S905 may be performed after steps S903 and S904, for example.

[0071] In step S906, the curvature at the position where the unfilled defect occurs is obtained from the time series change in the curvature distribution calculated in step S904 and the defect distribution obtained in step S904.

[0072] In S907, the maximum value of the change in curvature extracted in step S906 is found in the same manner as in step S208, and is stored as the curvature threshold value (curvature threshold value) at the unfilled defect position. In this way, in steps S906 and S907, the curvature threshold value is obtained based on the defect position obtained in step S905 and the change in curvature obtained in step S904.

[0073] Next, Fig. 10 is a flowchart showing the flow of adjusting an impression profile according to the second embodiment, and the flow of adjusting an impression profile using a curvature threshold will be described with reference to Fig. 10. Note that the operation of each step in the flowchart of Fig. 10 is performed by a processor 801 as a computer executing a simulation program 805 as a computer program stored in a memory 804.

[0074] First, in step S1001, a time series profile of the imprinting force, cavity pressure, etc. to be adjusted is set as an imprinting profile. Note that the imprinting profile set in step S1001 may be the same as or different from the base imprinting profile set in step S901.

[0075] Next, in step S1002, a simulation calculation is performed using the profile set in step S1001 to obtain output data. In step S1003, the shape of the pattern portion 108 during imprinting is obtained by simulation, and time transition data of the curvature near the periphery of the contact surface between the pattern portion 108 and the imprint material 105 is obtained.

[0076] Thereafter, in step S1004, it is determined whether or not there is a region where the curvature is below the threshold value, as in Example 1. If there is no section where the curvature is below the threshold value in step S1004, the flow of optimizing the impression profile in FIG. 10 ends.

[0077] If there is a region where the curvature is below the threshold in step S1004, the time (region) at which the curvature is below the threshold is identified in step S1005. That is, the time (region) at which the curvature is below the threshold is identified.

[0078] Then, in step S1006, the imprinting profile is adjusted by adjusting the imprinting force, cavity pressure, etc. for the specified time (region). Here, the imprinting profile includes at least one of a time series profile of the imprinting force, a time series profile of the positional relationship (e.g., speed, etc.), and a time series profile of the pressure for deforming the pattern portion into a convex shape, as in the first embodiment.

[0079] The adjustment method is the same as in Example 1, for example, by slowing down the imprint speed in that area, or by increasing the cavity pressure in that area. Note that steps S906, S907, S1005, and S1006 function as a profile adjustment step (profile adjustment means) that adjusts the imprint profile of the pattern portion so that the curvature does not fall below a predetermined threshold.

[0080] After making the adjustment, the process returns to step S1001 and performs simulation calculations again. This is repeated until it is determined in step S1004 that there are no areas where the curvature is below the threshold value, and when it is determined in step S1004 that there are no areas where the curvature is below the threshold value, the flow of Fig. 10 ends. Then, the control unit 111 of the imprint apparatus 100 performs the actual imprinting operation (the operation of imprinting the pattern portion 108 into the imprinting material 105) using the imprinting profile adjusted as described above. Therefore, imprinting with few unfilled defects can be achieved.

[0081] In the second embodiment, the adjustment flow is roughly the same as in the first embodiment, but it is characterized in that it does not involve the conversion of the spread camera image or the inspection work by the defect inspection device. In this way, it is possible to further reduce the time and cost required for the problem of adjusting the imprint profile.

[0082] Furthermore, the judgments and adjustments in the curvature threshold determination flow and the impression profile adjustment flow do not necessarily have to be performed by a person, but can be performed automatically by an information processing device based on a predetermined algorithm, thereby further shortening the time required for impression profile adjustment.

[0083] By using a lithography apparatus such as the imprint apparatus according to the first and second embodiments, productivity and quality can be improved when manufacturing articles such as microdevices such as semiconductor devices and elements having fine structures. Next, a method for manufacturing a device (semiconductor device, magnetic storage medium, liquid crystal display element, etc.) as an article using the imprint apparatus according to the first and second embodiments will be described.

[0084] This manufacturing method includes a pattern formation process (pattern formation step) in which a pattern of a pattern portion is formed on an imprint material on the surface of a substrate (such as a wafer, glass plate, or film-like substrate) using the imprint apparatus according to Examples 1 and 2. Here, the process of transferring the mold pattern includes a pattern formation process in which a flat pattern is formed. Furthermore, the substrate is not limited to a single base material, but may include a multilayer structure. Alternatively, the method may include a pattern formation process in which a photosensitive body on the substrate is exposed to a pattern using a lithography apparatus.

[0085] The manufacturing method further includes a step of processing the substrate before or after the pattern forming step. For example, the processing step includes a step of removing a residual film on the substrate on which the pattern has been formed and a development step. The manufacturing method may also include well-known manufacturing steps such as a step of etching the substrate using the pattern as a mask, a step of cutting out chips from the substrate (dicing), a step of placing the chips on a frame and electrically connecting them (bonding), and a step of sealing with resin (molding).

[0086] The method for manufacturing an article using the imprint apparatus, information processing apparatus, etc. in this embodiment can efficiently reduce unfilled defects compared to conventional methods, and is therefore advantageous in terms of article performance, quality, productivity, and production costs.

[0087] The present invention has been described in detail above based on its preferred embodiments, but the present invention is not limited to the above embodiments, and various modifications are possible based on the gist of the present invention, and these modifications are not excluded from the scope of the present invention.

[0088] Note that a computer program that realizes part or all of the control in this embodiment and the functions of the above-described embodiment may be supplied to an information processing device, imprinting apparatus, etc. via a network or various storage media. Then, a computer (or a CPU, MPU, etc.) in the information processing device, imprinting apparatus, etc. may read and execute the program. In this case, the program and the storage medium storing the program constitute the present invention. [Explanation of symbols]

[0089] 100: Imprint device 101: Board holding part 102: Stage 103: Substrate 104: Dispenser 105: Imprint material 106: Mold 107: Mold holding part 108: Pattern section 109: Mold drive unit 110: Spread Camera 111: Control unit

Claims

1. An information processing apparatus for performing a simulation of imprinting in an imprinting apparatus, a curvature acquisition means for acquiring a change in curvature of the pattern portion near the outer periphery of the contact surface when the pattern portion and the imprint material are brought into contact with each other during the imprinting; a profile adjusting means for adjusting a profile of the imprint of the pattern portion so that the curvature does not fall below a predetermined threshold; a defect position acquisition unit for acquiring a defect position of the imprint, The information processing apparatus is characterized in that the profile adjustment means acquires the predetermined threshold value based on the defect position acquired by the defect position acquisition means and the change in the curvature acquired by the curvature acquisition means.

2. The information processing apparatus according to claim 1, characterized in that the defect position acquisition means calculates the pressure of the gas between the pattern portion and the imprint material, calculates the amount of residual gas between the pattern portion and the imprint material when the imprinting is completed based on the gas pressure, and acquires the defect position based on the amount of residual gas.

3. 3. The information processing device according to claim 1, wherein the profile includes at least one of a time series profile of the imprinting force pressing the pattern portion against the imprint material, a time series profile of the positional relationship between the pattern portion and the imprint material, and a time series profile of the pressure for deforming the pattern portion into a convex shape toward the imprint material.

4. The information processing device according to any one of claims 1 to 3, characterized in that the curvature acquisition means acquires the curvature by determining the gas pressure between the pattern portion and the imprint material and calculating the shape of the pattern portion during the imprint based on the gas pressure.

5. 5. An imprinting apparatus that imprints a pattern of the pattern portion onto the imprinting material using the profile adjusted by the information processing apparatus according to claim 1.

6. An imprinting apparatus that imprints a pattern of a pattern unit onto an imprinting material, a curvature acquisition unit that acquires a change in curvature of the pattern portion near the outer periphery of the contact surface when the pattern portion and the imprint material are brought into contact with each other during the imprinting; a profile adjusting means for adjusting a profile of the imprint of the pattern portion so that the curvature does not fall below a predetermined threshold; a control unit that imprints the pattern of the pattern portion onto the imprint material using the profile; a defect position acquisition unit for acquiring a defect position of the imprint, an imprinting apparatus, characterized in that the profile adjustment means acquires the predetermined threshold value based on the defect position acquired by the defect position acquisition means and the change in curvature acquired by the curvature acquisition means;

7. 7. The imprint apparatus according to claim 6, wherein the defect position acquisition means includes a measurement means for measuring the defect position.

8. The imprinting apparatus of claim 6 or 7, characterized in that the profile includes at least one of a time series profile of the imprinting force pressing the pattern portion against the imprinting material, a time series profile of the positional relationship between the pattern portion and the imprinting material, and a time series profile of the pressure for deforming the pattern portion into a convex shape toward the imprinting material.

9. The curvature acquisition means a beam irradiation unit that irradiates monochromatic light through the pattern unit; The imprinting apparatus according to any one of claims 6 to 8, further comprising: a sensor that captures an image of interference fringes formed near the outer periphery of the contact surface during imprinting by the monochromatic light; and the curvature is calculated based on the interference fringes.

10. A computer program for controlling the information processing device according to any one of claims 1 to 4 or the imprinting apparatus according to any one of claims 5 to 9 by a computer.

11. a pattern forming step of forming the pattern in the imprint material using the imprint apparatus according to any one of claims 5 to 9; and developing the substrate on which the pattern has been formed by the pattern forming step.

Images