Sensor Device

Abstract

In this sensor device (100), an interior space that houses a sensor (2z), a sensor placement member (1), a first substrate (6z), and a second substrate (5) is defined by a shielding cover member (4) and a base member (3), and the sensor device (100) can be attached to another device (200) by bringing the bottom surface of the base member (3) into close contact with the other device (200).

Description

[Technical Field]

[0001] The present invention relates to a sensor device, and more particularly to a sensor device including a sensor arrangement member on which a sensor is arranged. [Background technology]

[0002] A sensor device including a sensor arrangement member on which a sensor is arranged is known. Such a sensor device is disclosed in, for example, Japanese Patent Application Laid-Open No. 2021-56197.

[0003] Japanese Patent Application Publication No. 2021-56197 discloses an inertial measurement device (sensor device) including an inertial sensor and a case (sensor placement section) in which the inertial sensor is placed. In the above-mentioned Japanese Patent Application Publication No. 2021-56197, a first substrate on which a processing section that performs processing based on detection information from the inertial sensor is placed is disposed on the upper surface of the case. In addition, Japanese Patent Application Publication No. 2021-56197 also discloses a second substrate on which a display section that displays measurement results is placed. The second substrate is stacked on the first substrate. Specifically, the second substrate is supported by a support section. The support section is disposed on the upper surface of the first substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-56197 Summary of the Invention [Problem to be solved by the invention]

[0005] An inertial measurement unit (sensor device) such as that disclosed in JP 2021-56197 A is housed in a space enclosed between a box-shaped cover member and a base member that covers the opening of the box-shaped cover member. Even if the space is not sealed, air circulation is difficult, making it difficult for heat generated on the first and second substrates of the sensor device to escape. Furthermore, during use, the space inside the cover member may become a vacuum, making it even more difficult to dissipate heat generated on the first and second substrates via air.

[0006] The present invention has been made to solve the above-mentioned problems, and one object of the present invention is to provide a sensor device that can easily dissipate heat generated from the first substrate and the second substrate even when the first substrate and the second substrate are arranged inside the cover member. [Means for solving the problem]

[0007] In order to achieve the above object, a sensor device according to one aspect of the present invention is a sensor device comprising: a sensor; a sensor placement member in which the sensor is placed; a first substrate placed on the sensor placement member; a second substrate placed so as to be stacked parallel to the first substrate; a shielding cover member provided to cover the sensor placement member and having at least one opening; and a base member that is in close contact with the sensor placement member and fixes the sensor placement member, wherein the first substrate and the second substrate are directly attached to the sensor placement member, and the openings of the shielding cover member face the base member, Shielding cover member to base member By fixing the shielding cover member and the base member, an internal space in which the sensor, the sensor placement member, the first board, and the second board are accommodated is defined, and the bottom surface of the base member is brought into close contact with another device, thereby enabling the sensor device but Can be attached to other devices.

[0008] In a sensor device according to one aspect of the present invention, as described above, the first and second substrates are directly attached to the sensor placement member. This allows heat generated in the first and second substrates to be dissipated directly to the sensor placement member. Furthermore, the heat dissipated to the sensor placement member is dissipated to another device via the base member. This allows heat generated from the first and second substrates to be easily dissipated even when the first and second substrates are disposed inside the cover member.

[0009] In the sensor device according to the above aspect, preferably, the sensor placement member has a projected area equal to or greater than the area of ​​the second substrate when viewed from a direction perpendicular to the surface of the second substrate, and includes a flat, predetermined surface, a plurality of first protrusions protruding from the predetermined surface and to which the first substrate is attached, and a plurality of second protrusions protruding from the predetermined surface and to which the second substrate is attached, wherein first flat top surfaces that contact the first substrate are formed at the tops of the plurality of first protrusions and are independent of one another, and second flat top surfaces that contact the second substrate are formed at the tops of the plurality of second protrusions and are independent of one another, the first flat top surfaces and the second flat top surfaces are parallel to the predetermined surface and are parallel to one another, and the second protrusions protrude more from the predetermined surface than the first protrusions. Thus, since the first substrate is attached to the first protrusions that protrude from the predetermined surface, a gap is formed between the first substrate and the predetermined surface. Therefore, even if the first substrate is deformed due to vibration, etc., it is possible to prevent the first substrate from coming into contact with the predetermined surface. Furthermore, since the second substrate is attached to the second protrusion, which has a larger protrusion amount from the predetermined surface than the first protrusion, the first substrate and the second substrate can be easily stacked.

[0010] In this case, the first substrate is preferably provided with a cutout portion for avoiding the second protrusion portion. This makes it possible to prevent interference between the first substrate and the second protrusion portion. As a result, unlike when the second protrusion portion is arranged on the outside of the first substrate without a cutout portion, it is possible to prevent the sensor device (sensor arrangement member) from becoming larger.

[0011] In the sensor device having the cutout portion in the first substrate, the sensor placement member and the first protrusion are preferably made of metal, the first substrate includes a multilayer substrate on which at least one of a wiring pattern and a through hole is provided, and the attachment portion of the first substrate that is attached to the first top flat surface of the first protrusion is provided at a position that avoids at least one of the wiring pattern and the through hole, thereby preventing a short circuit between the sensor placement member and at least one of the wiring pattern and the through hole.

[0012] In this case, the first substrate is preferably provided with a ground pattern electrically connected to the sensor placement member so as to have the same potential as the sensor placement member, and the mounting portion of the first substrate is located on the portion of the first substrate where the ground pattern is provided. As a result, since the sensor placement member and the ground pattern are both made of metal, heat can be efficiently dissipated from the first substrate to the sensor placement member. [Effects of the Invention]

[0013] According to the present invention, even when the first substrate and the second substrate are disposed inside the cover member as described above, the heat generated from the first substrate and the second substrate can be easily dissipated. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is an exploded perspective view showing an entire sensor device according to an embodiment; [Figure 2] FIG. 2 is an exploded perspective view illustrating a sensor mount, a control board, and a power supply board according to one embodiment. [Figure 3] FIG. 2 is an exploded perspective view illustrating a sensor mount, a gyroscope, and a plate member according to one embodiment. [Figure 4] FIG. 1 is a perspective view of a sensor mount according to an embodiment, viewed obliquely from below. [Figure 5]1 is a block diagram showing a configuration of a sensor device according to an embodiment. [Figure 6] 10 is a schematic cross-sectional view showing the relationship between connection wiring and a notch according to an embodiment. FIG. [Figure 7] 1 is a perspective view showing a configuration of a gyroscope according to an embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0016] First, a sensor device 100 according to an embodiment will be described with reference to FIGS.

[0017] (Overall configuration of the sensor device) As shown in FIG. 1, the sensor device 100 includes a sensor mount 1, a gyroscope 2 (see FIG. 3), a base member 3, a cover member 4, a power supply board 5, a control board 6, and a plate member 7. The sensor mount 1 and the gyroscope 2 are examples of a "sensor placement member" and a "sensor" in the claims, respectively. The power supply board 5 is an example of a "second board" in the claims. The cover member 4 is an example of a "shielding cover member" in the claims.

[0018] Two connectors 8 are attached to the sensor mount 1 to connect the power supply board 5 to an external power source (not shown) and to transmit and receive signals. The connectors 8 and the power supply board 5 are connected by a flexible cable 8a. The flexible cable 8a is provided in a bent state in the sensor device 100. Either an FPC (Flexible Printed Circuit) or an FFC (Flexible Flat Cable) can be used as the flexible cable 8a.

[0019] As shown in Fig. 2, the sensor mount 1 has a rectangular parallelepiped shape. The sensor mount 1 also includes a pair of X-axis surfaces 1x extending perpendicular to the X-axis, a pair of Y-axis surfaces 1y extending perpendicular to the Y-axis, and a pair of Z-axis surfaces 1z extending perpendicular to the Z-axis. Of the pair of Z-axis surfaces 1z, the Z-axis surface 1z on the Z2 side is an example of the "predetermined surface" in the claims. In this embodiment, the Z-axis is an axis extending vertically.

[0020] In this embodiment, the Z-axis surface 1z extends flat and has a projected area equal to or larger than the area of ​​the power supply substrate 5 when viewed from a direction (Z direction) perpendicular to the surface of the power supply substrate 5. In other words, the area of ​​the Z-axis surface 1z is equal to or larger than the area of ​​the power supply substrate 5.

[0021] In this embodiment, the sensor mount 1 includes an X-axis protrusion 1d that protrudes from the X-axis surface 1x and to which an X-axis control board 6x (described later) is attached. A plurality of X-axis protrusions 1d are provided on the X-axis surface 1x. The plurality of X-axis protrusions 1d are arranged on the outer periphery of the substantially rectangular X-axis surface 1x. Each of the plurality of X-axis protrusions 1d has a hole 21x into which a screw 20 (see FIG. 1) is fastened for attaching the X-axis control board 6x to the X-axis protrusion 1d. An X-axis protrusion 1d is provided on each of the pair of X-axis surfaces 1x. The X-axis protrusion 1d is integrally formed with the sensor mount 1 and is made of metal.

[0022] In this embodiment, the sensor mount 1 includes a Y-axis protrusion 1a that protrudes from the Y-axis surface 1y and to which a Y-axis control board 6y (described later) is attached. A plurality of Y-axis protrusions 1a are provided on the Y-axis surface 1y. The plurality of Y-axis protrusions 1a are arranged on the outer periphery of the substantially rectangular Y-axis surface 1y. Each of the plurality of Y-axis protrusions 1a has a hole 21y into which a screw 20 (see FIG. 1) is fastened for attaching the Y-axis control board 6y to the Y-axis protrusion 1a. A Y-axis protrusion 1a is provided on each of the pair of Y-axis surfaces 1y. The Y-axis protrusion 1a is integrally formed with the sensor mount 1 and is made of metal. The Y-axis protrusion 1a has a rectangular columnar shape.

[0023] In this embodiment, the sensor mount 1 includes a Z-axis protrusion 1c that protrudes from the Z-axis surface 1z on the Z1 side and to which a Z-axis control board 6z (described later) is attached. A plurality of Z-axis protrusions 1c are provided on the Z-axis surface 1z. The plurality of Z-axis protrusions 1c are arranged on the outer periphery of the substantially rectangular Z-axis surface 1z, as well as in the center of the Z-axis surface 1z. Each of the plurality of Z-axis protrusions 1c has a hole 21z1 into which a screw 20 (see FIG. 1) is fastened to attach the Z-axis control board 6z to the Z-axis protrusion 1c. The Z-axis protrusion 1c is integrally formed with the sensor mount 1 and is made of metal. The Z-axis control board 6z is an example of a "first board" in the claims. The Z-axis protrusion 1c is an example of a "first protrusion" in the claims.

[0024] In this embodiment, the sensor mount 1 includes a Z-axis protrusion 1b that protrudes from the Z1-side Z-axis surface 1z and has a protrusion amount L2 greater than the protrusion amount L1 of the Z-axis protrusion 1c from the Z-axis surface 1z, to which the power supply substrate 5 is attached. Multiple Z-axis protrusions 1b are provided on the Z-axis surface 1z. The multiple Z-axis protrusions 1b are arranged on the outer periphery of the substantially rectangular Z-axis surface 1z, with one Z-axis protrusion 1b located in the center of the Z-axis surface 1z. Each of the multiple Z-axis protrusions 1b has a hole 21z2 into which a screw 20 (see FIG. 1) is fastened to attach the power supply substrate 5 to the Z-axis protrusion 1b. The Z-axis protrusion 1b is integrally formed with the sensor mount 1 and is made of metal. The Z-axis protrusion 1b has a rectangular columnar shape. The Z-axis protrusion 1b is an example of a "second protrusion" in the claims.

[0025] In this embodiment, the tops of the multiple Z-axis protrusions 1c are formed with top planes S1 that contact the Z-axis control board 6z, and the multiple top planes S1 are independent of each other. In other words, the multiple top planes S1 are spaced apart from each other. The tops of the multiple Z-axis protrusions 1b are formed with top planes S2 that contact the power supply board 5, and the multiple top planes S2 are independent of each other. In other words, the multiple top planes S2 are spaced apart from each other. The top planes S1 and S2 are parallel to the Z-axis plane 1z and to each other. The Z-axis protrusion 1b has a larger protrusion amount L2 relative to the Z-axis plane 1z than the Z-axis protrusion 1c. The top planes S1 and S2 are examples of the "first top plane" and "second top plane" in the claims, respectively.

[0026] Furthermore, the amount of protrusion L1 of Z-axis protrusion 1c from Z-axis surface 1z is approximately the same as the amount of protrusion L3 of X-axis protrusion 1d from X-axis surface 1x. The amount of protrusion L2 of Z-axis protrusion 1b from Z-axis surface 1z is smaller than the amount of protrusion L4 of Y-axis protrusion 1a from Y-axis surface 1y.

[0027] The sensor mount 1 is made of metal. Specifically, the sensor mount 1 is made of a non-magnetic metal (for example, an aluminum alloy). That is, the sensor mount 1 shields against electromagnetic noise (magnetic flux).

[0028] The sensor mount 1 is fastened to the base member 3 by screws or the like (not shown), thereby being fixed to the base member 3. That is, the base member 3 is in close contact with the sensor mount 1, and fixes the sensor mount 1 in place.

[0029] As shown in FIG. 1, the cover member 4 is provided to cover the sensor mount 1 and has at least one opening 4d. Specifically, the cover member 4 has a box shape that houses the sensor mount 1. The Z2 side of the cover member 4 is open. Specifically, the sensor mount 1 is housed in a housing space formed by the cover member 4 and the base member 3. That is, the cover member 4, the base member 3, and the connector 8 cover the sensor mount 1 so that it is not exposed. Note that the sensor mount 1 may also be covered by the cover member 4 that does not have the cutout portion 4c (described later) and the base member 3 so that it is not exposed.

[0030] The cover member 4 is made of metal. Specifically, the cover member 4 is made of a non-magnetic metal (for example, an aluminum alloy). That is, the cover member 4 blocks electromagnetic noise (magnetic flux).

[0031] The cover member 4 is fastened to the base member 3. Specifically, a flange portion 4a that comes into surface contact with the base member 3 is provided at the end of the cover member 4 on the base member 3 side (Z2 side). The cover member 4 is fixed to the base member 3 by fastening the flange portion 4a to the base member 3 with screws 4b or the like. That is, by facing the opening 4d of the cover member 4 to the base member 3 and fixing it, the cover member 4 and the base member 3 define an internal space that houses the gyroscope 2, the sensor mount 1, the power supply board 5, and the control board 6. The cover member 4 also has two cutout portions 4c for exposing the two connectors 8. The sensor device 100 is attached to another device 200 by closely contacting the bottom surface (Z2 side surface) of the base member 3 to the other device 200. A gasket for blocking electromagnetic noise is provided at the interface between the connector 8 and the cutout portion 4c of the cover member 4. The gasket is made of a conductive material.

[0032] The sensor device 100 also includes a pair of sensor sets 10. The sensor sets 10 are configured with a gyroscope 2, an acceleration sensor 9, a power supply circuit 5b, and a control board 6 (control circuit 6b). The pair of sensor sets 10 have the same configuration. The pair of sensor sets 10 are arranged side by side in the Y direction.

[0033] Each of the pair of sensor groups 10 (see FIG. 1) includes a control board set consisting of an X-axis control board 6x, a Y-axis control board 6y, and a Z-axis control board 6z. In each control board set, the X-axis control board 6x and the Y-axis control board 6y, and the Y-axis control board 6y and the Z-axis control board 6z are connected by wiring 6a.

[0034] In this embodiment, a pair of X-axis control boards 6x are attached to each of a pair of X-axis surfaces 1x of the sensor mount 1. The X-axis control boards 6x are attached directly to the X-axis protrusions 1d of the X-axis surfaces 1x. The X-axis control boards 6x are attached to the X-axis protrusions 1d with screws 20.

[0035] The X1-side X-axis control board 6x is disposed on the Y1 side of the X1-side X-axis surface 1x, and the X2-side X-axis control board 6x is disposed on the Y2 side of the X2-side X-axis surface 1x.

[0036] In this embodiment, the pair of Y-axis control boards 6y are attached to the pair of Y-axis surfaces 1y of the sensor mount 1. The Y-axis control boards 6y are attached directly to the Y-axis protrusions 1a of the Y-axis surfaces 1y. The Y-axis control boards 6y are attached to the Y-axis protrusions 1a with screws 20.

[0037] In this embodiment, the Z-axis control board 6z of each of the pair of sensor sets 10 is attached to the Z-axis surface 1z on the Z1 side of the pair of Z-axis surfaces 1z of the sensor mount 1. The two Z-axis control boards 6z attached to the Z-axis surface 1z are arranged side by side in the Y direction. The two Z-axis control boards 6z are arranged adjacent to each other on the Z-axis surface 1z. The Z-axis control board 6z is directly attached to the Z-axis protrusion 1c of the Z-axis surface 1z. The Z-axis control board 6z is attached to the Z-axis protrusion 1c with screws 20.

[0038] In this embodiment, the Z-axis control board 6z includes a multilayer board on which at least one of a wiring pattern 61 and a through hole 62 is provided. In the Z-axis control board 6z, a hole 63 attached to the top flat surface S1 of the Z-axis protrusion 1c is provided at a position that avoids at least one of the wiring pattern 61 and the through hole 62. Specifically, both the wiring pattern 61 and the through hole 62 are provided, and the hole 63 is provided at a position that avoids both the wiring pattern 61 and the through hole 62. For example, the through hole 62 is located in an area other than the outer edge of the Z-axis control board 6z. The hole 63 is located at the outer edge of the Z-axis control board 6z, avoiding the through hole 62. The through hole 62 is used to connect different layers in the multilayer board. The hole 63 is an example of a "mounting portion" in the claims.

[0039] In this embodiment, the Z-axis control board 6z is provided with a ground pattern 64 that is electrically connected to the sensor mount 1 so as to have the same potential as the sensor mount 1. Hole 63 of the Z-axis control board 6z is arranged in the portion of the Z-axis control board 6z where the ground pattern 64 is arranged. The ground pattern 64 is called an FG (frame ground) pattern. The ground pattern 64 is arranged, for example, along the outer edge of the Z-axis control board 6z. Hole 63 is arranged on the outer edge of the Z-axis control board 6z. When the Z-axis control board 6z is attached to the Z-axis protrusion 1c with screws 20, the ground pattern 64 and the sensor mount 1 have the same potential.

[0040] Although not shown in FIG. 2, the X-axis control board 6x and the Y-axis control board 6y are also provided with wiring patterns 61, through holes 62, and ground patterns 64, respectively.

[0041] In this embodiment, as shown in Fig. 2, the Z-axis control board 6z has a cutout 65 that avoids the Z-axis protrusion 1b. The cutout 65 is provided on the outer edge of the Z-axis control board 6z. By forming the cutout 65 in the Z-axis control board 6z, it becomes possible to attach the Z-axis control board 6z to the Z-axis protrusion 1c while suppressing interference between the Z-axis control board 6z and the Z-axis protrusion 1b. Furthermore, the cutout 65 has a substantially rectangular shape that corresponds to the shape of the Z-axis protrusion 1b when viewed from the Z direction.

[0042] Furthermore, a microcomputer, a power supply, etc. (not shown) are mounted on the control board 6. Furthermore, an acceleration sensor 9 is mounted on the control board 6. Note that the acceleration sensor 9 is shown schematically in Fig. 2.

[0043] In this embodiment, the power supply board 5 is arranged so as to be stacked on the Z-axis control board 6z. The power supply board 5 is arranged so as to be stacked on a pair of Z-axis control boards 6z that are arranged adjacent to each other on the Z-axis plane 1z. The power supply board 5 is attached directly to the sensor mount 1. The power supply board 5 is attached directly to the Z-axis protrusion 1b. The power supply board 5 is attached to the Z-axis protrusion 1b with screws 20.

[0044] The power supply board 5 is disposed so as to cover the two Z-axis control boards 6z from the Z1 side. The power supply board 5 is connected to the control board 6 (to each of the pair of Y-axis control boards 6y) by wiring 5a. Specifically, the power supply board 5 includes a power supply circuit 5b (see FIG. 5) that supplies power to a control circuit 6b (see FIG. 5) provided on the control board 6 via wiring 5a. The power supply circuit 5b also supplies power to the gyroscope 2 and the acceleration sensor 9. The power supply circuit 5b and the control circuit 6b are each provided in each of the pair of sensor sets 10. The control circuit 6b also receives information (detection values) from the gyroscope 2, the acceleration sensor 9, etc.

[0045] As shown in FIG. 3, multiple gyroscopes 2 are arranged in a sensor mount 1. The sensor mount 1 includes multiple recesses 11 in which the multiple gyroscopes 2 are arranged. Specifically, the recesses 11 are provided on each of the pair of X-axis surfaces 1x, the pair of Y-axis surfaces 1y, and the Z2-side Z-axis surface 1z of the sensor mount 1. One recess 11 is provided on each of the pair of X-axis surfaces 1x. Also, one recess 11 is provided on each of the pair of Y-axis surfaces 1y. Also, as shown in FIG. 4, two recesses 11 are provided on the Z2-side Z-axis surface 1z. The two recesses 11 on the Z-axis surface 1z are arranged side by side in the Y direction (see FIG. 4).

[0046] Each of the plurality of gyroscopes 2 is housed in the recess 11. Specifically, the gyroscope 2 is housed in the recess 11 so as not to protrude from the open end 11a of the recess 11.

[0047] The gyroscope 2 is fixed to the recess 11 by fastening screws 2 a provided at the four corners of the gyroscope 2 into screw insertion holes 11 b provided in the recess 11 .

[0048] The gyroscope 2 includes an X-axis gyroscope 2x, a Y-axis gyroscope 2y, and a Z-axis gyroscope 2z, which correspond to the mutually orthogonal X-axis, Y-axis, and Z-axis. Two of each of the X-axis gyroscope 2x, Y-axis gyroscope 2y, and Z-axis gyroscope 2z are provided. That is, a pair of sensor sets 10 each consisting of the X-axis gyroscope 2x, the Y-axis gyroscope 2y, and the Z-axis gyroscope 2z are provided. One of the pair of sensor sets 10 is provided as a spare (redundant) for the other sensor set 10. The X-axis gyroscope 2x is an example of a "second-axis sensor" in the claims. The Y-axis gyroscope 2y is an example of a "third-axis sensor" in the claims. The Z-axis gyroscope 2z is an example of a "first-axis sensor" in the claims.

[0049] The pair of sensor sets 10 are arranged on a common sensor mount 1. That is, the sensor device 100 is provided with a single sensor mount 1 on which the pair of sensor sets 10 are commonly arranged.

[0050] The pair of X-axis gyroscopes 2x, the pair of Y-axis gyroscopes 2y, and the pair of Z-axis gyroscopes 2z are arranged rotationally symmetrically with respect to an axis α that passes through the center of gravity of the sensor mount 1 and extends along the Z axis. As a result, the absolute values ​​of the detection values ​​of the pair of sensor groups 10 are the same. This eliminates the need for an interface board that performs calculations based on the detection values ​​of each of the pair of sensor groups 10. The sensor mount 1 has a rotationally symmetric shape with respect to the axis α. The term "rotationally symmetric" is a broad concept that includes not only perfect rotational symmetry but also rotational symmetry with a small error within a range in which the absolute values ​​of the detection values ​​of the pair of sensor groups 10 are the same. In other words, in a sensor mount 1 that has a rotationally symmetric shape with respect to the axis α, the pair of X-axis gyroscopes 2x, the pair of Y-axis gyroscopes 2y, and the pair of Z-axis gyroscopes 2z may be arranged asymmetrically with respect to the axis α within a range in which the detection values ​​of the pair of sensor groups 10 are not affected.

[0051] Specifically, the pair of X-axis gyroscopes 2x are disposed at the same height in the Z direction. The pair of X-axis gyroscopes 2x are also disposed with their positions shifted from each other in the Y direction. Specifically, the X1-side X-axis gyroscope 2x is disposed in a recess 11 provided on the Y2 side of the X1-side X-axis plane 1x. The X2-side X-axis gyroscope 2x is also disposed in a recess 11 provided on the Y1 side of the X2-side X-axis plane 1x.

[0052] The pair of Y-axis gyroscopes 2y are disposed at the same height in the Z direction. The pair of Y-axis gyroscopes 2y are disposed with their positions shifted from each other in the X direction. Specifically, the Y1-side Y-axis gyroscope 2y is disposed in a recess 11 provided on the X1 side of the Y1-side Y-axis plane 1y. The Y2-side Y-axis gyroscope 2y is disposed in a recess 11 provided on the X2 side of the Y2-side Y-axis plane 1y.

[0053] The pair of Z-axis gyroscopes 2z are disposed at the same height in the Z direction. The pair of Z-axis gyroscopes 2z are disposed with their positions shifted from each other in the X direction. The Z-axis gyroscope 2z on the Y1 side is disposed in a recess 11 provided closer to the X1 side in the Z-axis plane 1z on the Z2 side. The Z-axis gyroscope 2z on the Y2 side is disposed in a recess 11 provided closer to the X2 side in the Z-axis plane 1z on the Z2 side.

[0054] Since the pair of sensor sets 10 are arranged rotationally symmetrically with respect to each other, the positive and negative detected values ​​of the pair of sensor sets 10 are reversed. The control board 6 (control circuit 6b) adjusts the detected values ​​of the pair of sensor sets 10 so that they are either positive or negative. Furthermore, since the pair of sensor sets 10 are arranged rotationally symmetrically with respect to each other, it is possible for the pair of control boards 6 to have a common configuration. In other words, the pair of control boards 6 have a common configuration in that they are made up of an X-axis control board 6x, a Y-axis control board 6y, and a Z-axis control board 6z.

[0055] The pair of X-axis gyroscopes 2x are disposed in the recesses 11 of the pair of X-axis surfaces 1x that are disposed on opposite sides of each other. The pair of Y-axis gyroscopes 2y are disposed in the recesses 11 of the pair of Y-axis surfaces 1y that are disposed on opposite sides of each other. That is, one gyroscope 2 (2x, 2y) is disposed on each of the four side surfaces (1x, 1y) of the sensor mount 1.

[0056] The Z-axis gyroscopes 2z are disposed in two recesses 11 provided in the Z-axis surface 1z on the Z2 side. Note that no recesses 11 are provided in the Z-axis surface 1z on the Z1 side.

[0057] Furthermore, the plate member 7 is provided between the recess 11 and the cover member 4, and is arranged to cover the recess 11 so that the gyroscope 2 placed in the recess 11 of the sensor mount 1 is not exposed. Specifically, the plate member 7 is arranged to overlap the entire recess 11. Furthermore, the plate member 7 is fixed to the sensor mount 1 by inserting screws 7a provided at the four corners of the plate member 7 into screw insertion holes 11c provided on the outside of the recess 11.

[0058] Furthermore, the plate member 7 shields against electromagnetic noise. Specifically, the plate member 7 is made of metal. More specifically, the plate member 7 is made of a non-magnetic metal (for example, aluminum).

[0059] The plate member 7 has a plate-like shape and is disposed along each of the pair of X-axis surfaces 1x or the pair of Y-axis surfaces 1y of the sensor mount 1. Specifically, the plate member 7 is formed in a square shape. The plate member 7 is attached to the Y2 side of the X1-side X-axis surface 1x, which is formed in a rectangular shape. The plate member 7 is also attached to the Y1 side of the X2-side X-axis surface 1x, which is formed in a rectangular shape.

[0060] The plate member 7 also includes an X-axis plate member 7x that covers the recessed portion 11 provided in the X-axis surface 1x, and a Y-axis plate member 7y that covers the recessed portion 11 provided in the Y-axis surface 1y. The X-axis plate member 7x is arranged side by side with the X-axis control board 6x in the Y direction without overlapping with the X-axis control board 6x (see FIG. 1). The Y-axis plate member 7y is arranged so as to overlap with the Y-axis control board 6y (see FIGS. 1 and 2).

[0061] The Y-axis plate member 7y is provided with a plurality of notches 7b to avoid the Y-axis protrusion 1a of the sensor mount 1. It should be noted that the X-axis plate member 7x is not provided with any notches.

[0062] The base member 3 (see FIG. 1) is provided so as to cover a recess 11 (see FIG. 4) provided in the Z-axis surface 1z on the Z2 side. Specifically, the base member 3 is provided so as to cover the entire surface of the Z-axis surface 1z on the Z2 side. That is, the two recesses 11 in which the two Z-axis gyroscopes 2z are arranged are covered by a common (single) base member 3 on the Z-axis surface 1z.

[0063] Furthermore, the base member 3 shields against electromagnetic noise. Specifically, the base member 3 is made of metal. More specifically, the base member 3 is formed of a non-magnetic metal (for example, an aluminum alloy). That is, the cover member 4, the plate member 7, the sensor mount 1, and the base member 3 are all formed of the same material.

[0064] Furthermore, the thickness t1 (see FIG. 1) of the base member 3 is greater than the thickness t2 (see FIG. 1) of the cover member 4. Specifically, the thickness t1 of the base member 3 is at least twice (for example, three times) the thickness t2 of the cover member 4.

[0065] Furthermore, the thickness t1 of the base member 3 (see FIG. 1) is greater than the thickness t3 of the plate member 7 (see FIG. 3). Specifically, the thickness t1 of the base member 3 is at least twice (for example, three times) the thickness t3 of the plate member 7. No plate member that blocks electromagnetic noise is disposed between the base member 3 and the Z-axis gyroscope 2z. In other words, the base member 3 and the Z-axis gyroscope 2z are disposed so as to face each other without a plate member in between. By surrounding the Z-axis gyroscope 2z between the recess 11 and the base member 3, electromagnetic noise to the Z-axis gyroscope 2z is blocked.

[0066] Furthermore, the gyroscope 2 (2x to 2z) includes a sensor body 2b and a connection wiring 2c that connects the sensor body 2b and the control board 6 (Y-axis control board 6y). The gyroscope 2 and the control board 6 (Y-axis control board 6y) included in a common sensor set 10 are connected by the connection wiring 2c.

[0067] Furthermore, the recess 11 of the sensor mount 1 is provided with a cutout 11d for drawing out the connection wiring 2c. The cutout 11d is provided at the open end 11a of the recess 11. That is, the connection wiring 2c is drawn out through the cutout 11d with the recess 11 covered by the plate member 7 (base member 3) (see FIG. 6). The cutout 11d may be provided in the plate member 7, or may be provided in both the recess 11 and the plate member 7.

[0068] As shown in FIG. 6, the connection wiring 2c has a thickness t3 (for example, 0.8 mm). The notch 11d has a depth h (for example, 1 mm) that is greater than the thickness t3. The connection wiring 2c has a width W1. The notch 11d has a width W2 that is greater than the width W1. The multiple notches 11d have the same size.

[0069] Furthermore, the connection wiring 2c of the gyroscope 2 includes a flexible cable. That is, the connection wiring 2c is flexible (flexible). The connection wiring 2c is formed of, for example, polyimide. Since the connection wiring 2c includes a flexible cable, even if vibration occurs, the flexible cable can absorb impact. As a result, it is possible to prevent the connection wiring 2c from being disconnected from the control board 6. Furthermore, since the connection wiring 2c includes a flexible cable, it is possible to bend the connection wiring 2c within the recess 11 at an angle that makes it easy to pull out the connection wiring 2c from the cutout portion 11d. As a result, even if the clearance between the cutout portion 11d and the connection wiring 2c is reduced, the connection wiring 2c can be easily pulled out from the cutout portion 11d. By reducing the clearance, it is possible to broaden the frequency range of electromagnetic noise shielded by each of the plate member 7 and the base member 3 (increase the upper limit on the high-frequency side).

[0070] In each of the pair of sensor sets 10, the connection wires 2c drawn out from the X-axis gyroscope 2x, the Y-axis gyroscope 2y, and the Z-axis gyroscope 2z are connected to the Y-axis control board 6y in a bent (flexed) state.

[0071] As shown in FIG. 7, the gyroscope 2 includes a rigid-flexible substrate. A rigid-flexible substrate refers to a substrate including a rigid portion and a flexible portion. The sensor main body 2b includes two rigid portions 2d and a flexible portion 2e connecting the rigid portions 2d to each other. The two rigid portions 2d are arranged to face each other by bending the flexible portion 2e. The connection wiring 2c is led out from one of the two rigid portions 2d. The flexible portion 2e is made of the same material as the connection wiring 2c (i.e., polyimide).

[0072] The sensor main body 2b also includes a spacer member 2f provided between a pair of rigid portions 2d arranged to face each other. The spacer member 2f forms a predetermined space between the two rigid portions 2d. The spacer members 2f are provided at the four corners of the rectangular (square) rigid portion 2d. The spacer member 2f also has a cylindrical shape. The screws 2a are provided so as to penetrate the cylindrical spacer member 2f. The dotted line in FIG. 7 indicates the sensor head 2g. The sensor head 2g is, for example, an electromagnetic type that uses MEMS technology. The sensor head 2g may also be a piezoelectric type or an electrostatic type.

[0073] (Effects of this embodiment) In this embodiment, the following effects can be obtained.

[0074] In this embodiment, as described above, the Z-axis control board 6z and the power supply board 5 are directly attached to the sensor mount 1. This allows heat generated in the Z-axis control board 6z and the power supply board 5 to be dissipated directly to the sensor mount 1. Furthermore, the heat dissipated to the sensor mount 1 is dissipated to another device 200 via the base member 3. This allows the heat generated from the Z-axis control board 6z and the power supply board 5 to be easily dissipated even when the Z-axis control board 6z and the power supply board 5 are arranged inside the cover member 4.

[0075] Furthermore, similar to the heat generated in the Z-axis control board 6z, the heat generated in the X-axis control board 6x and the Y-axis control board 6y is dissipated to the other device 200 via the sensor mount 1 and the base member 3.

[0076] In this embodiment, as described above, Z-axis protrusion 1b has a larger protrusion amount L2 from Z-axis surface 1z than Z-axis protrusion 1c. As a result, Z-axis control board 6z is attached to Z-axis protrusion 1c, which is provided so as to protrude from Z-axis surface 1z, creating a gap between Z-axis control board 6z and Z-axis surface 1z. Therefore, even if Z-axis control board 6z is deformed due to vibration or the like, contact between Z-axis control board 6z and Z-axis surface 1z can be prevented. Furthermore, power supply board 5 is attached to Z-axis protrusion 1b, which has a larger protrusion amount L2 than Z-axis protrusion amount L1 from Z-axis surface 1z, so Z-axis control board 6z and power supply board 5 can be easily stacked.

[0077] In this embodiment, as described above, the Z-axis control board 6z is provided with the cutout 65 that avoids the Z-axis protrusion 1b. This makes it possible to prevent interference between the Z-axis control board 6z and the Z-axis protrusion 1b. As a result, unlike when the Z-axis protrusion 1b is disposed outside the Z-axis control board 6z without the cutout 65, it is possible to prevent the sensor device 100 (sensor mount 1) from becoming larger.

[0078] In this embodiment, as described above, the sensor mount 1 and the Z-axis protrusion 1c are made of metal, the Z-axis control board 6z includes a multilayer board on which at least one of the wiring pattern 61 and the through-hole 62 is provided, and in the Z-axis control board 6z, the hole 63 attached to the top flat surface S1 of the Z-axis protrusion 1c is provided at a position that avoids at least one of the wiring pattern 61 and the through-hole 62. This makes it possible to prevent a short circuit between the sensor mount 1 and at least one of the wiring pattern 61 and the through-hole 62.

[0079] In this embodiment, as described above, the Z-axis control board 6z is provided with a ground pattern 64 that is electrically connected to the sensor mount 1 so as to have the same potential as the sensor mount 1, and the hole 63 of the Z-axis control board 6z is located in the portion of the Z-axis control board 6z where the ground pattern 64 is provided. As a result, since the sensor mount 1 and the ground pattern 64 are both made of metal, heat can be efficiently dissipated from the Z-axis control board 6z to the sensor mount 1.

[0080] In this embodiment, as described above, the power supply board 5 is arranged so as to be stacked on the Z-axis control board 6z. This prevents the sensor device 100 from becoming large, unlike when a plurality of power supply boards 5 are provided and arranged so that the power supply board 5 is stacked on all of the Z-axis control board 6z, the X-axis control board 6x, and the Y-axis control board 6y.

[0081] In this embodiment, as described above, the power supply board 5 supplies power to the Z-axis gyroscope 2z. Here, the power supply board 5 that supplies power to the Z-axis gyroscope 2z tends to become hot. Therefore, directly attaching the power supply board 5 to the sensor mount 1 is particularly effective in preventing the temperature of the power supply board 5, which tends to become hot, from increasing.

[0082] It is not necessary for the opposing contact surfaces of the sensor mount 1 and the base member 3 to be in contact over the entire surface. It is sufficient that the contact surfaces between the sensor mount 1 and the base member 3 have an area large enough to transfer heat sufficiently to enable the sensor device 100 to function normally, regardless of its own heat generation. The same applies to between the sensor mount 1 and other devices.

[0083] In this embodiment, as described above, multiple Z-axis protrusions 1c and multiple Z-axis protrusions 1b are provided, which allows the Z-axis control board 6z and the power supply board 5 to be attached in a stable state.

[0084] As described above, this embodiment includes Z-axis protrusion 1c that protrudes from Z-axis surface 1z and to which Z-axis control board 6z is attached, X-axis protrusion 1d that protrudes from X-axis surface 1x and to which X-axis control board 6x is attached, and Y-axis protrusion 1a that protrudes from Y-axis surface 1y and to which Y-axis control board 6y is attached. This makes it possible to prevent Z-axis control board 6z, X-axis control board 6x, and Y-axis control board 6y from contacting Z-axis surface 1z, X-axis surface 1x, and Y-axis surface 1y, respectively, even if Z-axis control board 6z, X-axis control board 6x, and Y-axis control board 6y are deformed due to vibration or the like.

[0085] In this embodiment, the power supply board 5 is arranged so as to be stacked on a pair of Z-axis control boards 6z that are arranged adjacent to each other on the Z-axis surface 1z. This prevents the configuration of the sensor device 100 from becoming complicated, unlike when a power supply board 5 is provided for each sensor set 10 and attached to different surfaces.

[0086] [Variations] The embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present invention is defined by the claims, not by the description of the above embodiments, and includes all modifications (variations) within the meaning and scope of the claims.

[0087] For example, in the above embodiment, an example was shown in which the Z-axis control board 6z was used as the "first board" of the present invention and the power supply board 5 was used as the "second board" of the present invention, but the present invention is not limited to this. For example, a board other than the Z-axis control board 6z may be used as the "first board" of the present invention, and a board other than the power supply board 5 may be used as the "second board" of the present invention.

[0088] In the above embodiment, the Z-axis control board 6z is attached to the Z-axis protrusion 1c, but the present invention is not limited to this. For example, the Z-axis control board 6z may be attached to the surface of the Z-axis surface 1z without providing the Z-axis protrusion 1c.

[0089] In the above embodiment, the Z-axis protrusion 1b has a prismatic shape, but the present invention is not limited to this. For example, the Z-axis protrusion 1b may have a cylindrical shape.

[0090] Furthermore, instead of Z-axis protrusion 1b and Z-axis protrusion 1c, one or more protrusions that come into contact with the surface or interior of Z-axis control board 6z and power supply board 5 may be provided on the surface of sensor mount 1 in order to absorb heat generated by Z-axis control board 6z and power supply board 5 without fixing or supporting Z-axis control board 6z and power supply board 5. Furthermore, base member 3 may include members that directly support Z-axis control board 6z and power supply board 5 that are arranged one on top of the other and directly absorb heat from Z-axis control board 6z and power supply board 5. Furthermore, Z-axis control board 6z and power supply board 5 may include portions where they are fastened to and supported by protrusions via spacers.

[0091] In the above embodiment, the Z-axis protrusions 1c and 1b are provided in plural numbers, but the present invention is not limited to this. For example, the Z-axis protrusions 1c and 1b may be provided in single numbers.

[0092] In addition, other components that do not hinder the transfer of heat generated in the Z-axis control board 6z and the power supply board 5 to other devices may be present between the Z-axis control board 6z and the Z-axis protrusion 1b, between the power supply board 5 and the Z-axis protrusion 1c, between the sensor mount 1 and the base member 3, and between the base member 3 and other devices.

[0093] In the above embodiment, the sensor mount 1 and the base member 3 are configured from a single component, but the present invention is not limited to this. The sensor mount 1 and the base member 3 may each be configured from two or more components. Furthermore, the sensor mount 1 and the base member 3 may be integrated.

[0094] In the above embodiment, the sensor mount 1 and the base member 3 are separate components based on one or more functions that each component performs, but it is sufficient that all of the functions described in the claims are performed when the sensor mount 1 and the base member 3 are assembled, and the functions do not have to be performed on a component-by-component basis. Also, some of the functions described in the claims may be transferred, exchanged, or shared between the sensor mount 1 and the base member 3.

[0095] In the above embodiment, the Z-axis control board 6z includes a multi-layer board provided with the through-holes 62, but the present invention is not limited to this. For example, the Z-axis control board 6z may be composed of a single-layer board.

[0096] In the above embodiment, the hole 63 of the Z-axis control board 6z is disposed in the portion of the Z-axis control board 6z where the ground pattern 64 is provided, but the present invention is not limited to this. For example, the hole 63 may be disposed in a portion of the Z-axis control board 6z other than the portion where the ground pattern 64 is provided.

[0097] In the above embodiment, the Z-axis control board 6z is provided with the cutout 65 to avoid the Z-axis protrusion 1b, but the present invention is not limited to this. For example, the Z-axis control board 6z may be provided with a hole through which the Z-axis protrusion 1b passes. Alternatively, the Z-axis control board 6z may not be provided with the cutout 65, and the Z-axis protrusion 1b may be disposed outside the Z-axis control board 6z.

[0098] In the above embodiment, the power supply board 5 is disposed so as to be stacked on the Z-axis control board 6z, but the present invention is not limited to this. For example, the power supply board 5 may be disposed so as to be stacked on the X-axis control board 6x or the Y-axis control board 6y.

[0099] In the above embodiment, a pair of sensor sets 10 each consisting of an X-axis gyroscope 2x, a Y-axis gyroscope 2y, and a Z-axis gyroscope 2z is provided, but the present invention is not limited to this. For example, only one sensor set 10 or three or more sensor sets 10 may be provided.

[0100] In the above embodiment, the gyroscope 2 (sensor) is disposed in the recess 11 of the sensor mount 1 (sensor mounting member), but the present invention is not limited to this. For example, a sensor other than a gyroscope (for example, an acceleration sensor 9 or a temperature sensor) may be disposed in the recess 11. [Explanation of symbols]

[0101] 1. Sensor mount (sensor placement component) 1b Z-axis protrusion (second protrusion) 1c Z-axis protrusion (1st protrusion) 1z Z-axis surface (specified surface) 2 Gyroscope (sensor) 5 Power supply board (second board) 4 Covering material (shielding covering material) 4d opening 6z Z-axis control board (first board) 61 Wiring Pattern 62 through holes 63 Hole (mounting part) 64 Ground Pattern 65 Notch 100 Sensor device 200 Other devices L1 (first protrusion) protrusion amount L2 (Second protrusion) protrusion amount S1 top plane (first top plane) S2 top plane (second top plane)

Claims

1. A sensor, a sensor placement member in which the sensor is placed; a first substrate disposed on the sensor arrangement member; a second substrate arranged to be stacked parallel to the first substrate; a shielding cover member provided to cover the sensor placement member and having at least one opening; a base member that is in close contact with the sensor placement member and fixes the sensor placement member, the first substrate and the second substrate are directly attached to the sensor placement member; By placing the opening of the shielding cover member opposite the base member and fixing the shielding cover member to the base member, an internal space is defined by the shielding cover member and the base member to accommodate the sensor, the sensor placement member, the first board, and the second board, and The sensor device is attached to another device by bringing the bottom surface of the base member into close contact with the other device.

2. The sensor arrangement member is A predetermined surface; a plurality of first protrusions provided to protrude from the predetermined surface and to which the first substrate is attached; a plurality of second protrusions provided to protrude from the predetermined surface and to which the second substrate is attached; a first flat top surface that contacts the first substrate is formed on the tops of the plurality of first protrusions; the plurality of first top planes are independent of one another, a second top plane that contacts the second substrate is formed on tops of the second protrusions; the second top planes are independent of one another; the first top plane and the second top plane are parallel to the predetermined plane and to each other; The second protrusion has a larger protrusion amount with respect to the predetermined surface than the first protrusion. The sensor device according to claim 1 .

3. The sensor device according to claim 2 , wherein the first substrate is provided with a notch for avoiding the second protrusion.

4. the sensor arrangement member and the first protrusion are made of metal, the first substrate includes a multilayer substrate provided with at least one of a wiring pattern and a through hole; 4. The sensor device according to claim 3, wherein the mounting portion of the first substrate that is attached to the first top flat surface of the first protrusion is provided at a position that avoids at least one of the wiring pattern and the through hole.

5. a ground pattern provided on the first substrate, the ground pattern being electrically connected to the sensor placement member so as to have the same potential as the sensor placement member; The sensor device according to claim 4 , wherein the mounting portion of the first substrate is disposed on a portion of the first substrate where the ground pattern is provided.

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