Electronic device including a flexible printed circuit board

Abstract

According to one embodiment, an electronic device includes a housing including a frame, a first temple connected to one side of the frame, and a second temple connected to the other side of the frame, a first PCB located on the first temple, and a first FPCB and a second FPCB electrically connected to the first PCB, the first FPCB including a first overlapping portion drawn from the first PCB in a first direction and overlapping with the second FPCB, and a first branch portion extending from the first overlapping portion and non-overlapping with the second FPCB, and the second FPCB including a second overlapping portion drawn from the first PCB in the first direction and overlapping with the first FPCB, and a second branch portion extending from the second overlapping portion and not overlapping with the first FPCB.

Description

[Technical Field]

[0001] Various embodiments of this document may generally relate to electronic devices that include flexible printed circuit boards. [Background technology]

[0002] Developments have been made regarding electronic devices that can be worn on a user's head and display images directly in front of the user's eyes. For example, a head-mounted display (HMD) can display virtual reality or augmented reality content in front of the user's eyes, allowing the user to feel as if they are in virtual reality or augmented reality. Electronic devices that can be worn on a user's head may include goggle-type or eyeglass-type devices.

[0003] An electronic device wearable on a user's head may include various components necessary to provide content to the user, as well as electrical elements for driving the components. Summary of the Invention [Problem to be solved by the invention]

[0004] The electronic device includes a housing that can be worn on a user's head, and various configurations can be arranged inside the housing. In the case of an eyeglass-type electronic device, the area inside the housing is limited, and the area for mounting various configurations of the electronic device may be insufficient. In addition, in the case of a wearable electronic device, reduction in weight and size of the electronic device is preferred to improve comfort while wearing the electronic device.

[0005] Various embodiments are directed to providing electronic devices that include miniaturized printed circuit boards (PCBs) and increased flexibility in PCB mounting area.

[0006] Additionally, various embodiments are directed to providing an electronic device in which the space occupied by electrical structures connecting components of the electronic device is minimized.

[0007] Additionally, various embodiments are directed to providing electronic devices that are compact and comfortable to wear. [Means for solving the problem]

[0008] According to an embodiment, an electronic device includes a housing including a frame, a first temple connected to one side of the frame, and a second temple connected to the other side of the frame; a first PCB located on the first temple; and a first flexible printed circuit board and a second flexible printed circuit board electrically connected to the first PCB, wherein the first flexible printed circuit board includes a first overlapping portion drawn from the first PCB in a first direction and overlapping with the second flexible printed circuit board, and a first branch portion extending from the first overlapping portion and non-overlapping with the second flexible printed circuit board, and the second flexible printed circuit board includes a second overlapping portion drawn from the first PCB in the first direction and overlapping with the first flexible printed circuit board, and a second branch portion extending from the second overlapping portion and not overlapping with the first flexible printed circuit board.

[0009] According to one embodiment, an electronic device includes a housing including a frame, a first temple connected to one side of the frame, and a second temple connected to the other side of the frame, a first PCB located on the first temple, and a connection member including a plurality of flexible printed circuit boards electrically connected to the first PCB, wherein the connection member may include an overlapping portion where at least two of the plurality of flexible printed circuit boards overlap, and a branching portion branching from the overlapping portion. [Effects of the Invention]

[0010] According to various embodiments, an electronic device can reduce the size of a PCB by reducing the space required for connections (e.g., connectors) for connecting to other components on the PCB, thereby increasing the flexibility of the PCB mounting area.

[0011] Additionally, various embodiments allow for a reduction in the space occupied by electrical structures connecting components of an electronic device.

[0012] Furthermore, various embodiments allow for a smaller electronic device and improved comfort when worn.

[0013] In addition, various other effects can be provided that can be understood directly or indirectly through this document.

[0014] The above and other aspects, features and advantages of particular embodiments of the present document will become more apparent from the following description taken in conjunction with the accompanying drawings.

[0015] In connection with the description of the drawings, the same or similar reference numerals may be used to refer to the same or similar components. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 is a block diagram of an electronic device in a network environment according to one embodiment. [Figure 2] 1 is a schematic diagram of an electronic device according to one embodiment. [Figure 3] FIG. 1 is a schematic diagram of an eye-tracking and display method using transparency according to one embodiment. [Figure 4] FIG. 1 is a block diagram illustrating an electronic device according to one embodiment. [Figure 5] FIG. 1 is a perspective view illustrating an electronic device according to an embodiment. [Figure 6] FIG. 1 is a plan view showing a configuration of a part included in an electronic device according to an embodiment. [Figure 7] 7 is a cross-sectional view of the electronic device according to the embodiment taken along line CC' in FIG. 6. [Figure 8] 7 is a cross-sectional view of the electronic device according to the embodiment taken along line DD' in FIG. 6. [Figure 9] 5A to 5C illustrate an example of a method for forming a first branch portion of an electronic device according to an embodiment. [Figure 10] 7 is a cross-sectional view of the electronic device according to the embodiment taken along line EE' in FIG. 6. [Figure 11] 7 is a cross-sectional view of the electronic device according to the embodiment taken along line FF' in FIG. 6. [Figure 12] 1 is a cross-sectional view of an electronic device according to one embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0017] Various embodiments of the present invention will now be described with reference to the accompanying drawings, but it should be understood that the present invention is not limited to the particular embodiments, but also includes various modifications, equivalents, and / or alternatives to the embodiments of the present invention.

[0018] 1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments. Referring to FIG. 1 , in the network environment 100, the electronic device 101 may communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network) or with an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 via the server 108. According to one embodiment, the electronic device 101 may include a processor 120, a memory 130, an input module 150, an acoustic output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identity module 196, or an antenna module 197. In some embodiments, at least one of these components (e.g., connection terminal 178) may be omitted from electronic device 101, and one or more other components may be added. In some embodiments, some of these components (e.g., sensor module 176, camera module 180, or antenna module 197) may be integrated into a single component (e.g., display module 160).

[0019] Processor 120 may, for example, execute software (e.g., program 140) to control at least one other component (e.g., a hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculations, processor 120 may store instructions or data received from other components (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the instructions or data stored in volatile memory 132, and store resulting data in non-volatile memory 134. According to one embodiment, processor 120 may include a main processor 121 (e.g., a central processing unit or application processor) or a sub-processor 123 (e.g., a graphics processing unit, a neural network processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that may operate independently of or in conjunction with main processor 121. For example, if the electronic device 101 includes a main processor 121 and a sub-processor 123, the sub-processor 123 may be configured to use less power than the main processor 121 or to be specialized for a designated function. The sub-processor 123 may be implemented separately from the main processor 121 or as part of the main processor 121.

[0020] The sub-processor 123 can, for example, control at least a portion of the functions or states associated with at least one component of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) instead of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or together with the main processor 121 while the main processor 121 is in an active (e.g., executing an application) state. According to one embodiment, the sub-processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another functionally related component (e.g., the camera module 180 or the communication module 190). According to one embodiment, the sub-processor 123 (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated by machine learning. Such learning may, for example, be performed within the electronic device 101 itself, where the artificial intelligence is executed, or by a separate server (e.g., the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the foregoing examples. The artificial intelligence model may include multiple artificial neural network layers.The artificial neural network may be one of, but is not limited to, a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more thereof. The artificial intelligence model may additionally or alternatively include a software structure in addition to a hardware structure.

[0021] Memory 130 may store various data used by at least one component (e.g., processor 120 or sensor module 176) of electronic device 101. The data may include, for example, input or output data related to software (e.g., program 140) and its associated instructions. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0022] The programs 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 or applications 146 .

[0023] Input module 150 can receive instructions or data from outside (e.g., a user) electronic device 101 for use by components (e.g., processor 120) of electronic device 101. Input module 150 can include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus).

[0024] The audio output module 155 can output audio signals external to the electronic device 101. The audio output module 155 can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as playing multimedia or playing recordings. The receiver can be used to receive incoming phone calls. According to one embodiment, the receiver can be implemented separately from or as part of the speaker.

[0025] Display module 160 can visually present information to an external (e.g., user) of electronic device 101. Display module 160 can include, for example, a display, a holographic device or projector, and control circuitry for controlling the device. According to one embodiment, display module 160 can include a touch sensor configured to detect a touch or a pressure sensor configured to measure the strength of a force generated by the touch.

[0026] Audio module 170 can convert sound into electrical signals or vice versa. According to one embodiment, audio module 170 can acquire sound via input module 150 or output sound via audio output module 155 or an external electronic device (e.g., electronic device 102) (e.g., speakers or headphones) connected directly or wirelessly to electronic device 101.

[0027] The sensor module 176 may sense an operating state (e.g., power or temperature) of the electronic device 101 or an external environmental state (e.g., a user state) and generate an electrical signal or data value corresponding to the sensed state. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0028] Interface 177 may support one or more specified protocols that can be used to directly or wirelessly connect electronic device 101 to external electronic devices (e.g., electronic device 102). According to one embodiment, interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0029] Connection terminal 178 may include a connector through which electronic device 101 can be physically connected to an external electronic device (e.g., electronic device 102). According to one embodiment, connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0030] Haptic module 179 can convert electrical signals into mechanical (e.g., vibration or movement) or electrical stimuli that can be perceived by a user through a tactile or kinesthetic sense. According to one embodiment, haptic module 179 can include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0031] Camera module 180 is capable of capturing still and moving images. According to one embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0032] The power management module 188 may manage the power supplied to the electronic device 101. According to one embodiment, the power management module 188 may be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0033] Battery 189 may provide power to at least one component of electronic device 101. According to one embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0034] Communications module 190 can support establishing a direct (e.g., wired) or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108) and performing communication over the established communication channel. Communications module 190 can include one or more communication processors that operate independently of processor 120 (e.g., an application processor) and support direct (e.g., wired) or wireless communication. According to one embodiment, communications module 190 can include wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or wired communication module 194 (e.g., a local area network (LAN) communication module, or a power line communication module). The communication modules may communicate with an external electronic device 104 via a first network 198 (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network 199 (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). The various communication modules may be integrated into a single component (e.g., a single chip) or may be implemented as multiple separate components (e.g., multiple chips). The wireless communication module 192 may use subscriber information (e.g., an International Mobile Subscriber Identity (IMSI)) stored in the subscriber identity module 196 to identify or authenticate the electronic device 101 within a communication network such as the first network 198 or the second network 199.

[0035] The wireless communication module 192 may support 5G networks and next-generation communication technologies, such as new radio access technologies (NR). NR access technologies may support high-speed transmission of large amounts of data (eMBB (enhanced mobile broadband)), terminal power minimization and access for multiple terminals (mMTC (massive machine-type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module 192 may support, for example, high-frequency bands (e.g., mmWave bands) to achieve high data rates. The wireless communication module 192 may support various technologies for ensuring performance in high-frequency bands, such as beamforming, massive multiple-input and multiple-output (massive MIMO), full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, and large-scale antennas. The wireless communication module 192 can support various requirements defined by the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to one embodiment, the wireless communication module 192 can support a peak data rate (e.g., 20 Gbps or more) for implementing eMBB, a loss coverage (e.g., 164 dB or less) for implementing mMTC, or a U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0036] The antenna module 197 can transmit or receive signals or power to or from an external device (e.g., an external electronic device). According to one embodiment, the antenna module 197 can include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module 197 can include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network 198 or a second network 199, can be selected from the multiple antennas by, for example, the communication module 190. Signals or power can be transmitted or received between the communication module 190 and an external electronic device via the selected at least one antenna. According to one embodiment, other components (e.g., a radio frequency integrated circuit (RFIC)) besides the radiator can be further formed as part of the antenna module 197.

[0037] According to various embodiments, antenna module 197 can form an mmWave antenna module. According to one embodiment, the mmWave antenna module can include a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., an mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second side (e.g., a top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0038] At least some of the above components are connected to each other via a peripheral communication method (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and can exchange signals (e.g., commands or data) with each other.

[0039] According to one embodiment, instructions or data may be sent or received between the electronic device 101 and the external electronic device 104 via a server 108 connected to a second network 199. Each of the external electronic devices 102 or 104 may be the same type of device as the electronic device 101 or a different type of device. According to one embodiment, all or part of the operations performed by the electronic device 101 may be performed by one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 performs a function or service automatically or in response to a request from a user or another device, the electronic device 101 may request one or more external electronic devices to perform at least part of the function or service instead of or in addition to performing the function or service itself. The one or more external electronic devices receiving the request may perform at least part of the requested function or service or a further function or service related to the request and communicate the results of that execution to the electronic device 101. The electronic device 101 may provide the results, either directly or after further processing, as at least part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used. The electronic device 101 can provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 can include an Internet of Things (IoT) device. The server 108 can be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device 104 or the server 108 can be included in the second network 199. The electronic device 101 can be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technologies.

[0040] FIG. 2 is a schematic diagram of an electronic device 201 according to one embodiment.

[0041] The electronic device 201 in Fig. 2 may be referred to as a head mounted display (HMD) device, a wearable device, smart glasses, or eyewear. The form of the electronic device 201 shown in Fig. 2 is exemplary, and embodiments of this document are not limited thereto. For example, the electronic device 201 may be any electronic device configured to provide augmented reality (AR) or virtual reality (VR).

[0042] According to one embodiment, electronic device 201 may include at least some of the components of electronic device 101 of Figure 1. For example, electronic device 201 may include at least one of a display (e.g., display module 160 of Figure 1), a camera (e.g., camera module 180 of Figure 1), at least one sensor (e.g., sensor module 176 of Figure 1), a processor (e.g., processor 120 of Figure 1), a battery (e.g., battery 189 of Figure 1), memory (e.g., 130 of Figure 1), and communication circuitry (e.g., communication module 190 of Figure 1). At least some of the components of electronic device 201 may be located inside a housing of electronic device 201 or may be exposed to the outside of the housing.

[0043] 2, the electronic device 201 may include a housing 290. The housing 290 may include a first temple 298-1, a second temple 298-2, and a frame 297. The frame 297 may include a first frame 297-1 connected to the first temple 298-1, a second frame 297-2 connected to the second temple 298-2, and a bridge 297-3 connecting the first frame 297-1 and the second frame 297-2. The first temple 298-1, the second temple 298-2, and the frame 297 may be referred to as a housing. The first temple 298-1 is physically connected to the first frame 297-1 by a first hinge portion 299-1 and may support the first frame 297-1 when worn. The second temple 298-2 is physically connected to the second frame 297-2 by a second hinge portion 299-2 and can support the second frame 297-2 when worn. The bridge 297-3 may have one end connected to the first frame 297-1 and the other end connected to the second frame 297-2.

[0044] The bridge 297-3 may be integrally formed with the first frame 297-1 and the second frame 297-2 or may be omitted. The electronic device 201 may include a display. For example, the electronic device 201 may include a first display 261-1 and / or a second display 261-2. The first display 261-1 and / or the second display 261-2 may include at least one of a liquid crystal display (LCD), a digital mirror device (DMD), a liquid crystal on silicon device (LCoS device), an organic light emitting diode (OLED), and a micro light emitting diode (micro LED). For example, the display of the electronic device 201 may include at least one light source for emitting light. If the first display 261-1 and / or the second display 261-2 include at least one of a liquid crystal display, a digital mirror device, and a silicon liquid crystal display, the electronic device 201 may include at least one light source that irradiates light onto the screen output areas 260-1 and / or 260-2 of the displays. As another example, if the displays of the electronic device 201 can generate light independently, the displays may not include a separate light source in addition to the light source included in the displays. If the first display 261-1 and / or the second display 261-2 include at least one of an organic light-emitting diode and a micro LED, the electronic device 201 can provide an image to a user without including a separate light source. If the displays are implemented with organic light-emitting diodes or micro LEDs, the weight of the electronic device 201 can be reduced due to the omission of a separate light source.

[0045] According to one embodiment, electronic device 201 may include first transparent member 296-1 and / or second transparent member 296-2. For example, when a user wears electronic device 201, the user can see through first transparent member 296-1 and / or second transparent member 296-2. First transparent member 296-1 and / or second transparent member 296-2 may be formed of at least one of a glass plate, a plastic plate, and a polymer, and may be transparent or translucent. First transparent member 296-1 may be fixed to first frame 297-1, and second transparent member 296-2 may be fixed to second frame 297-2. For example, when worn, first transparent member 296-1 may be positioned facing the user's right eye, and second transparent member 296-2 may be positioned facing the user's left eye.

[0046] According to one embodiment, at least a portion of the first transparent member 296-1 and / or the second transparent member 296-2 may be a light guide. The light guide can transmit images generated by the first display 261-1 and / or the second display 261-2 to a user's eye. The light guide may be made of glass, plastic, or polymer. The light guide may include a nanopattern (e.g., a polygonal or curved grating structure) formed inside or on one surface. Light incident on one end of the light guide may be propagated inside the light guide by the nanopattern and provided to the user's eye. A light guide formed of a free-form prism may be configured to provide the incident light to a user via a reflective mirror.

[0047] According to one embodiment, the light guide may include at least one of a diffractive element (e.g., a DOE (Diffractive Optical Element) or an HOE (Holographic Optical Element)) and a reflective element (e.g., a reflector). The light guide may guide display light emitted from the light source unit to a user's eye using at least one diffractive or reflective element included in the light guide. For example, the diffractive element may include a first input optical member 262-1, a second input optical member 262-2, and / or an output optical member. The first input optical member 262-1 and / or the second input optical member 262-2 may be referred to as an input grating area, and the output optical member may be referred to as an output grating area.

[0048] The input grating region can diffract or reflect light output from a light source (e.g., a Micro LED) to transmit it to the first transparent member 296-1 and / or the second transparent member 296-2 of the screen display unit. The output grating region can diffract or reflect the light transmitted to the first transparent member 296-1 and / or the second transparent member 296-2 toward the user's eyes. For example, the reflective element can include a total internal reflection (TIR) ​​optical element or a total internal reflection waveguide. Total internal reflection can refer to a method of guiding light, and can refer to creating an incident angle such that light (e.g., an image) input through the input grating region is reflected by one surface (e.g., a specific surface) of the light guide and transmitted to the output grating region. In one embodiment, the optical path of light emitted from the display can be guided to the light guide by the input optical member. Light traveling inside the light guide can be guided toward the user's eyes by the output optical members 262-1 and / or 262-2. Screen output areas 260-1 and / or 260-2 may be determined based on light emitted in the direction of the eyes. Screen output areas 260-1 and / or 260-2 may be included in a light guide.

[0049] 2 illustrates electronic device 201 as providing images to a user using optical waveguides, embodiments herein are not limited thereto. According to one embodiment, first display 261-1 and / or second display 261-2 of electronic device 201 may be transparent or translucent displays. In that case, the displays may be positioned to face the eyes of the user (e.g., corresponding to first screen output area 260-1 and / or second screen output area 260-2).

[0050] According to one embodiment, the electronic device 201 may include at least one camera. For example, the electronic device 201 may include a first camera 280-1, a second camera 280-2, and / or a third camera 280-3. For example, the first camera 280-1 and the second camera 280-2 may be used to recognize an external image. The first camera 280-1 and the second camera 280-2 may be configured to acquire an image corresponding to a direction corresponding to the user's line of sight (e.g., the +x direction). The electronic device 201 may perform head tracking (e.g., three- or six-degree-of-freedom (DoF) tracking), hand image detection, hand image tracking, and / or spatial recognition using the first camera 280-1 and the second camera 280-2. For example, the first camera 280-1 and the second camera 280-2 may be global shutter (GS) cameras having the same specifications and capabilities (e.g., specifications and capabilities corresponding to the angle of view, shutter speed, resolution, and / or color bit depth). The electronic device 201 may support simultaneous localization and mapping (SLAM) technology by performing spatial recognition (e.g., six-degree-of-freedom spatial recognition) and / or acquiring depth information using left / right stereo cameras. The electronic device 201 may also recognize a user's gestures using the left / right stereo cameras. The electronic device 201 may detect faster hand movements and finer movements by using a GS camera, which has relatively less distortion than an RS (rolling shutter) camera. For example, the third camera 280-3 may be used to recognize an external image and may be configured to acquire an image corresponding to a direction (e.g., +x direction) corresponding to the user's line of sight.

[0051] In one embodiment, the third camera 280-3 may be a camera with a relatively higher resolution than the first camera 280-1 and the second camera 280-2. The third camera 280-3 may be referred to as a high resolution (HR) camera or a photo video (PV) camera. The third camera 280-3 may support functions for acquiring high-quality images, such as autofocus (AF) and / or optical image stabilization (OIS). The third camera 280-3 may be a GS camera or an RS camera.

[0052] According to one embodiment, the electronic device 201 may include at least one eye-tracking sensor. For example, the electronic device 201 may include a first eye-tracking sensor 276-1 and a second eye-tracking sensor 276-2. The first eye-tracking sensor 276-1 and the second eye-tracking sensor 276-2 may be, for example, cameras configured to acquire images in directions corresponding to the user's eyes. The first eye-tracking sensor 276-1 and the second eye-tracking sensor 276-2 may be configured to acquire a user's right eye image and a user's left eye image, respectively. The electronic device 201 may be configured to detect the user's pupil using the first eye-tracking sensor 276-1 and the second eye-tracking sensor 276-2. The electronic device 201 may acquire the user's gaze from the user's pupil image and provide an image based on the acquired gaze. For example, the electronic device 201 may display an image such that the image is positioned in the user's gaze direction. For example, the first gaze tracking sensor 276-1 and the second gaze tracking sensor 276-2 may be GS cameras having the same specifications and capabilities (e.g., specifications and capabilities corresponding to the angle of view, shutter speed, resolution and / or color bit rate, etc.).

[0053] According to one embodiment, the electronic device 201 may include at least one illumination unit. The illumination unit may include at least one LED. In FIG. 2 , the electronic device 201 may include a first illumination unit 281-1 and a second illumination unit 281-2. The electronic device 201 may use the first illumination unit 281-1 and the second illumination unit 281-2 to provide supplemental illumination for the first camera 280-1, the second camera 280-2, and / or the third camera 280-3. In one embodiment, the electronic device 201 may use the illumination units to provide illumination for acquiring pupil images. The electronic device 201 may use an infrared wavelength LED to provide illumination for the eye tracking sensor. In this case, the eye tracking sensor may include an image sensor for acquiring images at the infrared wavelength.

[0054] According to one embodiment, the electronic device 201 may include at least one PCB. For example, the electronic device 201 may include a first PCB 287-1 located on a first temple 298-1 and a second PCB 287-2 located on a second temple 298-2. The first PCB 287-1 and / or the second PCB 287-2 may be electrically connected to other components of the electronic device 201 via signal lines and / or a flexible printed circuit board (FPCB). A communication circuit, a memory, at least one sensor, and / or a processor may be disposed on the first PCB 287-1 and / or the second PCB 287-2. Each of the first PCB 287-1 and the second PCB 287-2 may be composed of multiple PCBs separated by an interposer.

[0055] According to one embodiment, the electronic device 201 may include at least one battery. For example, the electronic device 201 may include a first battery 289-1 located at one end of the first temple 298-1 and a second battery 289-2 located at one end of the second temple 298-2. The first battery 289-1 and the second battery 289-2 may be configured to provide power to the components of the electronic device 201.

[0056] According to one embodiment, the electronic device 201 may include at least one speaker. For example, the electronic device 201 may include a first speaker 270-1 and a second speaker 270-2. The electronic device 201 may be configured to provide stereo sound using speakers located on the left and right sides.

[0057] According to one embodiment, the electronic device 201 may include at least one microphone. For example, the electronic device 201 may include a first microphone 271-1, a second microphone 271-2, and / or a third microphone 271-3. The first microphone 271-1 may be located on the right side of the frame 297, the second microphone 271-2 may be located on the left side of the frame 297, and the third microphone 271-3 may be located on a bridge 297-3 of the frame 297. The electronic device 201 may perform beamforming using the first microphone 271-1, the second microphone 271-2, and / or the third microphone 271-3.

[0058] The above-described configuration of the electronic device 201 is exemplary, and the embodiments of this document are not limited thereto. For example, the electronic device 201 may not include at least some of the components described with reference to FIG. 2, or may further include other components in addition to the described components. For example, the electronic device 201 may include at least one sensor (e.g., an acceleration sensor, a gyro sensor, and / or a touch sensor) and / or an antenna.

[0059] FIG. 3 is a schematic diagram of an eye tracking and display method using a transparent member according to one embodiment.

[0060] Referring to FIG. 3 , a display 361 (e.g., the first display 261-1 or the second display 261-2 in FIG. 2 ) can provide an image through a transparent member 396 (e.g., the first transparent member 296-1 or the second transparent member 296-2 in FIG. 2 ). According to one embodiment, the display 361 can input light corresponding to the image to an input optical member 362 (e.g., the first input optical member 262-1 or the second input optical member 262-2 in FIG. 2 ) through a lens 351. The input optical member 362 can reflect or diffract the incident light and input it to the light guide 360. The output optical member 364 can output the light transmitted through the light guide 360 ​​toward a user's eye 399. In one embodiment, the lens 351 can be included in the display 361. In one example, the position of the lens 351 can be determined based on the distance between the transparent member 396 and the user's eye 399.

[0061] The eye tracking sensor 371 (e.g., the first eye tracking sensor 276-1 or the second eye tracking sensor 276-2 in FIG. 2) can acquire an image corresponding to at least a portion of a user's eye 399. For example, light corresponding to the image of the user's eye 399 may be reflected and / or diffracted by a first splitter 381 and input to an optical waveguide 382. The light transmitted to a second splitter 383 via the optical waveguide 382 may be reflected and / or diffracted by the second splitter 383 and output in the direction of the eye tracking sensor 371.

[0062] According to one embodiment, at least some of the input optical element 362, output optical element 364, first splitter 381, optical waveguides 360, 382 and / or second splitter 383 may be integrated.

[0063] FIG. 4 is a block diagram illustrating an electronic device according to one embodiment.

[0064] 4, electronic device 400 may include a first PCB 410, a second PCB 420, and components electrically connected to first PCB 410 or second PCB 420. For example, the components of electronic device 400 may include a first speaker 441, a second speaker 452, a first battery 442, a second battery 453, a touchpad, a first camera 431, a second camera 432, a first display 433, a second display 434, and a sensor 461. Sensor 461 may include a third camera (e.g., third camera 280-3 in FIG. 2) or a microphone (e.g., third microphone 271-3 in FIG. 2).

[0065] According to an embodiment, the first PCB 410, the first speaker 441, and the first battery 442 may be located in a first temple area A1. For example, the first temple area A1 may refer to an area within or on the first temple (e.g., the first temple 298-1 in FIG. 2). According to an embodiment, the second PCB 420, the second speaker 452, and the second battery 453 may be located in a second temple area A2. For example, the second temple area A2 may refer to an area within or on the second temple (e.g., the second temple 298-2 in FIG. 2). According to an embodiment, the first camera 431 and the first display 433 may be located in a first frame area A3. For example, the first frame area A3 may refer to an area within or on the first frame (e.g., the first frame 297-1 in FIG. 2). According to one embodiment, the second camera 432 and the second display 434 may be located in a second frame area A4. For example, the second frame area A4 may refer to an area within or on the second frame (e.g., the second frame 297-2 in FIG. 2). According to one embodiment, the sensor 261 may be located in a bridge area A5 between the first frame area A3 and the second frame area A4.

[0066] According to one embodiment, the first PCB 410 may include a processor 411, a first power management module 412, a memory 413, a first display driving circuit 414, a camera power management circuit 415, a first audio output circuit 416, a touch circuit 417 and a second power management module 418.

[0067] The processor 411 can execute a program (e.g., program 140 in FIG. 1 ) stored in the memory 413 to control at least one other component (e.g., a hardware or software component) and perform various data processing or calculations. The first power management module 412 can manage power supplied to the electronic device 400. For example, the first power management module 412 can be directly connected to the processor 411 and supply power to the processor 411. The first display drive circuit 414 is electrically connected to the first display 433 and can transmit image data related to display information and signals for driving the first display 433 to the first display 433. The camera power management circuit 415 is electrically connected to the first camera 431 and the second camera 432 and can transmit power for driving the first camera 431 and the second camera 432. The first audio output circuit 416 is electrically connected to the first speaker 441 and can transmit audio data to the first speaker 441. The touch circuitry 417 can detect a user's touch input. For example, the touch circuitry 417 can be electrically connected to a touch pad and send a touch signal to the touch pad for touch detection. The second power management module 418 can be electrically connected to the first battery 442 and manage the charging power of the first battery 442.

[0068] According to one embodiment, the second PCB 420 may include a communication module 421 , a second audio output circuit 423 , a second display driver circuit 424 and a third power management module 425 .

[0069] The second audio output circuit 423 is electrically connected to the second speaker 452 and can transmit audio data to the second speaker 452. The second display drive circuit 424 is electrically connected to the second display 434 and can transmit image data related to display information and a signal for driving the second display 434 to the second display 434. The third power management module 425 is electrically connected to the second battery 453 and can manage the charging power of the second battery 453.

[0070] The first PCB 410 and the second PCB 420 are electrically connected to each other and can transmit and receive signals or data. For example, the first PCB 410 can transmit data for screen output (e.g., image data related to display information), communication data (e.g., Bluetooth signals, WiFi signals), acoustic data, or touch data to or receive it from the second PCB 420. The first PCB 410 located in the first temple area A1 and the second PCB 420 located in the second temple area A2 may be electrically connected via an FPCB.

[0071] The first PCB 410 may be electrically connected via an FPCB to a first camera 431 and a first display 433 located in the first frame area A3, a second camera 432 located in the second frame area A4, and at least one sensor 461 located in the bridge area A5.

[0072] An electronic device 500 according to an embodiment will now be described with reference to Fig. 5. Fig. 5 is a perspective view showing an electronic device 500 according to an embodiment.

[0073] Referring to FIG. 5, the electronic device 500 may include a first PCB 510, a second PCB 520, and a connection member 530 that electrically connects the first PCB 510 to other components of the electronic device 500 (e.g., the first camera 431, the second camera 432, the first display 433, the second display 434, and / or the sensor 461 in FIG. 4).

[0074] The connection member 530 may include multiple FPCBs. For example, the connection member 530 may include a first FPCB 531, a second FPCB 532, and a third FPCB 533. The FPCBs 531, 532, and 533 in FIG. 5 are merely examples, and the number and shape of the FPCBs are not limited to those shown in FIG. Each of the FPCBs 531, 532, and 533 may include a flexible substrate and a conductive layer patterned on the flexible substrate, and may electrically connect one component to another.

[0075] The connecting member 530 may include an overlapping portion OP where at least two or more FPCBs 531, 532, and 533 overlap, and branch portions 531b, 532b, and 533b branching from the overlapping portion OP. The overlapping portion OP of the connecting member 530 may extend such that the FPCBs 531, 532, and 533 are pulled out from one surface of the first PCB 510. Hereinafter, "overlapping" may mean overlapping in one direction (e.g., the thickness direction). The overlapping portion OP may include a first portion OP1 located on the first temple (e.g., the first temple 298-1 in FIG. 2 ) and a second portion OP2 located on the frame (e.g., the frame 297 in FIG. 2 ). In the first portion OP1 of the overlapping portion OP, the first FPCB 531, the second FPCB 532, and the third FPCB 533 may overlap in a second direction Dr2 (e.g., the thickness direction of the FPCBs). The first FPCB 531, the second FPCB 532, and the third FPCB 533 drawn out from the first PCB 510 may overlap each other and extend along the extension direction (e.g., first direction Dr1) of the first temple (e.g., first temple 298-1 in FIG. 2). In the second portion OP2 of the overlapping portion OP, the second FPCB 532 and the third FPCB 533 may overlap each other in the thickness direction of the FPCBs 532 and 533. The second FPCB 532 and the third FPCB 533 may overlap each other and extend along the extension direction of at least a portion of the frame (e.g., frame 297 in FIG. 2).

[0076] For example, the first FPCB 531 may include a first overlapping portion 531a extending from the first PCB 510 in the first direction Dr1 and overlapping with at least one of the second FPCB 532 and the third FPCB 533, and a first branch portion 531b extending from the first overlapping portion 531a so as not to overlap with the second FPCB 532 and the third FPCB 533. The second FPCB 532 may include a second overlapping portion 532a extending from the first PCB 510 in the first direction Dr1 and overlapping with at least one of the first FPCB 531 and the third FPCB 533, and a second branch portion 532b extending from the second overlapping portion 532a so as not to overlap with the first FPCB 531 and the third FPCB 533. The third FPCB 533 may include a third overlapping portion 533a that is pulled out from the first PCB 510 in the first direction Dr1 and extends overlapping with at least one of the first FPCB 531 and the second FPCB 532, and a third branch portion 533b that extends from the third overlapping portion 533a so as not to overlap with the first FPCB 531 and the second FPCB 532.

[0077] A portion of the overlapping portion OP of the connection member 530 may be located in a hinge region HA, which is a region adjacent to a hinge portion (e.g., first hinge portion 299-1 in FIG. 2 ) of the electronic device 500. For example, the overlapping portion OP may partially overlap the hinge portion of the electronic device 500. According to an embodiment, the connection member 530 of the electronic device 500 includes overlapping portions OP that are drawn out in one direction from the first PCB 510 and extend to overlap each other, and portions of the overlapping portions OP may be located at the first temple (e.g., first temple 298-1 in FIG. 2 ) and the hinge region HA, so that the first PCB 510 and the connection member 530 connected to the first PCB 510 may be located at the first temple of the narrow electronic device 500.

[0078] Each of the branch portions 531b, 532b, and 533b may extend from the overlapping portion OP to a position of a component of the electronic device 500 electrically connected to the first PCB 510. For example, the first FPCB 531 may electrically connect the first PCB 510 to a first camera (e.g., the first camera 431 in FIG. 4). The first FPCB 531 may extend from the first PCB 510 through the first temple region and the hinge region HA to the position of the first camera. One end of the first FPCB 531 may be connected to the first PCB 510 and the other end may be connected to the first camera. The first overlapping portion 531a of the first FPCB 531 may be connected to the first PCB 510, and the first branch portion 531b may be connected to the first camera. The first overlapping portion 531a of the first FPCB 531 may be located at the first temple. The first branch 531b of the first FPCB 531 may be located along an area of ​​the first frame (eg, the first frame 297-1 in FIG. 2) and may extend to the position of the first camera.

[0079] The second FPCB 532 may electrically connect the first PCB 510 and the second PCB 520. The second FPCB 532 may extend from the first PCB 510 through the first temple region and the hinge region HA to the second PCB 520 located in the second temple region (e.g., the second temple region A2 in FIG. 4). The second FPCB 532 may have one end connected to the first PCB 510 and the other end connected to the second PCB 520. The second FPCB 532 may have a second overlapping portion 532a connected to the first PCB 510 and a second branch portion 532b connected to the second PCB 520. The second overlapping portion 532a of the second FPCB 532 may be located in a region (e.g., the upper end of the first frame) of the first temple and the first frame (e.g., the first frame 297-1 in FIG. 2). The second branch portion 532b of the second FPCB 532 may be located along an area (e.g., the upper end of the second frame) of the second frame (e.g., the second frame 297-2 in FIG. 2) and may extend to the position of the second PCB 520.

[0080] The third FPCB 533 may electrically connect the first PCB 510 and the second camera (e.g., the second camera 432 in FIG. 4). The third FPCB 533 may extend from the first PCB 510 through the first temple region and the hinge region HA to the position of the second camera. The third FPCB 533 may have one end connected to the first PCB 510 and the other end connected to the second camera. The third FPCB 533 may have a third overlapping portion 533a connected to the first PCB 510 and a third branching portion 533b connected to the second camera. The third overlapping portion 533a of the third FPCB 533 may be located in a region (e.g., the upper end of the first frame) of the first temple and the first frame (e.g., the first frame 297-1 in FIG. 2). The third branch portion 533b of the third FPCB 533 may be located along an area (e.g., the lower end of the second frame) of the second frame (e.g., the second frame 297-2 in Figure 2) and may extend to the position of the second camera.

[0081] In some embodiments, the second portion OP2 of the overlapping portion OP may be omitted. For example, the overlapping portion OP may be located on the first temple, and the branch portions 531b, 532b, and 533b of the first FPCB 531, the second FPCB 532, and the third FPCB 533 may not overlap in the frame. Also, in some embodiments, the first FPCB 531, the second FPCB 532, and the third FPCB 533 may all overlap in the second portion OP2 of the overlapping portion OP located on the frame.

[0082] An electronic device according to an embodiment will be described below with reference to Fig. 6. Fig. 6 is a plan view showing a partial configuration included in an electronic device according to an embodiment.

[0083] 6, the electronic device may include a first PCB 510 and a connection member 530 connected to the first PCB 510. The connection member 530 may include an overlapping portion OP where at least two or more FPCBs 531, 532, and 533 overlap, branch portions 531b, 532b, and 533b extending from the overlapping portion OP, and rigid members 611, 612, and 613 connected to the branch portions 531b, 532b, and 533b.

[0084] At least a portion of the overlapping portion OP of the connecting member 530 may be located in the hinge region HA. For example, the connecting member 530 may include a first FPCB 531, a second FPCB 532, and a third FPCB 533. The overlapping portion OP of the connecting member 530 may include a first portion OP1 located on the first temple (e.g., the first temple 298-1 in FIG. 2 ) and a second portion OP2 located on the frame (e.g., the frame 297 in FIG. 2 ). In the first portion OP1 of the overlapping portion OP, the first overlapping portion 531a of the first FPCB 531, the second overlapping portion 532a of the second FPCB 532, and the third overlapping portion 533a of the third FPCB 533 may overlap. The first FPCB 531 may include a first branch portion 531b extending from the overlapping portion OP (or the first portion OP1 of the overlapping portion OP) and branching from the second FPCB 532 and the third FPCB 533 at a first branch point B1. The first branched portion 531b may be a portion of the first FPCB 531 that does not overlap with the second FPCB 532 and the third FPCB 533. The second portion OP2 of the overlapping portion OP may extend from the first portion OP1 in a direction different from the branched first FPCB 531. In the second portion OP2, the second overlapping portion 532a of the second FPCB 532 and the third overlapping portion 533a of the third FPCB 533 may overlap. In the second portion OP2, the second overlapping portion 532a of the second FPCB 532 and the third overlapping portion 533a of the third FPCB 533 do not have to overlap with the first FPCB 531.

[0085] The second FPCB 532 may include a second branch portion 532b extending from a second portion OP2 of the overlapping portion OP and branching from the third FPCB 533 at a second branch point B2. The second branch portion 532b may be a portion of the second FPCB 532 that does not overlap with the first FPCB 531 and the third FPCB 533. The third FPCB 533 may include a third branch portion 533b extending from the second portion OP2 of the overlapping portion OP and branching from the second FPCB 532 at a third branch point B3. The third branch portion 533b may be a portion of the third FPCB 533 that does not overlap with the first FPCB 531 and the second FPCB 532.

[0086] The rigid members 611, 612, and 613 may include a first rigid member 611 connected to an end of the first branch portion 531b, a second rigid member 612 connected to an end of the second branch portion 532b, and a third rigid member 613 connected to an end of the third branch portion 533b. Connectors to be connected to components of an electronic device may be mounted on the first rigid member 611, the second rigid member 612, and the third rigid member 613.

[0087] Hereinafter, the connection member 530 connected to the first PCB 510 will be described with reference to Fig. 7. Fig. 7 is a cross-sectional view of an electronic device according to an embodiment taken along line CC' in Fig. 6.

[0088] 7, the electronic device may include a first PCB 510 and a connection member 530 connected to the first PCB 510. The first PCB 510 may include a plurality of stacked substrates 711, 712, 713, 714, 715, 716, 717, and 718, an opening H penetrating at least one of the plurality of substrates 711, 712, 713, 714, 715, 716, 717, and 718, a through-hole TH penetrating the first PCB 510, a conductive layer, and an adhesive layer 720. A patterned conductive layer may be located on each of the plurality of substrates 711, 712, 713, 714, 715, 716, 717, and 718. The multiple substrates 711, 712, 713, 714, 715, 716, 717, and 718 may each include an opening H, and a conductive layer of one of the multiple substrates 711, 712, 713, 714, 715, 716, 717, and 718 may be electrically connected to a conductive layer of another of the multiple substrates via a conductive pattern 731 located in the opening H. The first PCB 510 may include through holes TH that entirely penetrate the multiple substrates 711, 712, 713, 714, 715, 716, 717, and 718, and the conductive layers of the multiple substrates 711, 712, 713, 714, 715, 716, 717, and 718 may be electrically connected to each other via a conductive pattern 732 located on a sidewall of the through hole TH. The adhesive layer 720 may be positioned between and bond the multiple substrates 711, 712, 713, 714, 715, 716, 717, 718. For example, the adhesive layer 720 may be positioned as multiple layers between the multiple substrates 711, 712, 713, 714, 715, 716, 717, 718.

[0089] The connecting member 530 may include a first FPCB 531, a second FPCB 532, and a third FPCB 533. The first FPCB 531 may include a first overlapping portion 531a. The second FPCB 532 may include a second overlapping portion 532a. The third FPCB 533 may include a third overlapping portion 533a. The first overlapping portion 531a, the second overlapping portion 532a, and the third overlapping portion 533a may overlap. For example, an adhesive layer may be located between the first overlapping portion 531a and the second overlapping portion 532a and between the second overlapping portion 532a and the third overlapping portion 533a. As another example, the first overlapping portion 531a, the second overlapping portion 532a, and the third overlapping portion 533a may be spaced apart from one another.

[0090] The connecting member 530 may be directly connected to a conductive layer or conductive pattern 731, 732 of the first PCB 510. The first overlapping portion 531a of the first FPCB 531 may be connected to a conductive layer of one of the substrates of the first PCB 510. The second overlapping portion 532a of the second FPCB 532 may be connected to a conductive layer of another of the substrates of the first PCB 510. The third overlapping portion 533a of the third FPCB 533 may be connected to a conductive layer of yet another of the substrates of the first PCB 510.

[0091] Hereinafter, the first branch portion 531b of the connection member 530 will be described with reference to Figure 8. Figure 8 is a cross-sectional view of an electronic device according to an embodiment taken along line DD' in Figure 6.

[0092] Referring to FIG. 8, the connection member 530 may include a first FPCB 531, a second FPCB 532, a third FPCB 533, cover layers 811, 812, and 813, and adhesive layers 821 and 822.

[0093] The first FPCB 531 may include a first substrate 8311, a first conductive layer 8312 located above the first substrate 8311 (e.g., in the +Z-axis direction), and a second conductive layer 8313 located below the first substrate 8311 (e.g., in the -Z-axis direction). The first conductive layer 8312 and the second conductive layer 8313 may be connected through an opening H in the first substrate 8311. In a first portion OP1 of the overlapping portion OP, a first overlapping portion 531a of the first FPCB 531 may overlap with the second FPCB 532 and the third FPCB 533. A first branch portion 531b of the first FPCB 531 may branch and extend from the first portion OP1 of the overlapping portion OP. The first branch portion 531b of the first FPCB 531 may extend from the first overlapping portion 531a and not overlap with the second FPCB 532 and the third FPCB 533. Based on the direction in which the first branch portion 531b of the first FPCB 531 branches off from the first portion OP1 of the overlapping portion OP, the second FPCB 532 and the third FPCB 533 may extend only up to a first branch point B1 where the first branch portion 531b of the first FPCB 531 branches off from the second FPCB 532 and the third FPCB 533. At the first branch point B1, the second FPCB 532 and the third FPCB 533 may include a cutting plane CP.

[0094] The second FPCB 532 may be located below the first FPCB 531 (e.g., in the −Z-axis direction). The second FPCB 532 may include a second substrate 8321, a third conductive layer 8322 located above the second substrate 8321 (e.g., in the +Z-axis direction), and a fourth conductive layer 8323 located below the second substrate 8321 (e.g., in the −Z-axis direction). The third conductive layer 8322 and the fourth conductive layer 8323 may be connected through an opening H in the second substrate 8321. In a first portion OP1 of the overlapping portion OP, the second overlapping portion 532a of the second FPCB 532 may overlap the first FPCB 531 and the third FPCB 533.

[0095] The third FPCB 533 may be located below the second FPCB 532 (e.g., in the −Z-axis direction). The third FPCB 533 may include a third substrate 8331, a fifth conductive layer 8332 located above the third substrate 8331 (e.g., in the +Z-axis direction), and a sixth conductive layer 8333 located below the third substrate 8331 (e.g., in the −Z-axis direction). The fifth conductive layer 8332 and the sixth conductive layer 8333 may be connected through an opening H in the third substrate 8331. In a first portion OP1 of the overlapping portion OP, the third overlapping portion 533a of the third FPCB 533 may overlap the first FPCB 531 and the second FPCB 532.

[0096] The first adhesive layer 821 is located between the first overlapping portion 531a of the first FPCB 531 and the second overlapping portion 532a of the second FPCB 532, and can bond the first overlapping portion 531a of the first FPCB 531 to the second overlapping portion 532a of the second FPCB 532. The second adhesive layer 822 is located between the second overlapping portion 532a of the second FPCB 532 and the third overlapping portion 533a of the third FPCB 533, and can bond the second overlapping portion 532a of the second FPCB 532 to the third overlapping portion 533a of the third FPCB 533.

[0097] The cover layers 811, 812, and 813 may be positioned on at least one surface of the connecting member 530 to protect the connecting member 530. The cover layers 811, 812, and 813 may include a first cover layer 811, a second cover layer 812, and a third cover layer 813. The first cover layer 811 may be positioned above the first FPCB 531 (e.g., in the +Z axis direction). The second cover layer 812 may be positioned below the third FPCB 533 (e.g., in the −Z axis direction). For example, the first cover layer 811 may cover an upper surface (e.g., the surface in the +Z axis direction) of the first portion OP1 of the overlapping portion of the connecting member 530 and an upper surface of the first branch portion 531b, and the second cover layer 812 may cover a lower surface (e.g., the surface in the −Z axis direction) of the first portion OP1 of the overlapping portion. The third cover layer 813 may be located below the first branch portion 531b of the first FPCB 531 (eg, in the −Z axis direction).

[0098] The connection member 530 may include a through hole TH and a conductive layer 8411 located on the inner wall of the through hole TH. The first FPCB 531, the second FPCB 532, and the third FPCB 533 may be electrically connected via the conductive layer 8411 located on the inner wall of the through hole TH.

[0099] Hereinafter, an example of a method for forming the first branch portion 531b of the electronic device according to an embodiment will be described with reference to Fig. 9. Fig. 9 is a diagram illustrating an example of a method for forming the first branch portion of the electronic device according to an embodiment.

[0100] 9, the second FPCB 532 and the third FPCB 533 are cut (e.g., laser cut) at the first branch point B1, and the second FPCB 532 and the third FPCB 533 may include a cut surface CP. The second FPCB 532 and the third FPCB 533 overlapping the first branch portion 531b of the first FPCB 531 may be removed. The first FPCB 531 may not be cut at the first branch point B1, and the first branch portion 531b of the first FPCB 531 may branch and extend from a first portion OP1 of the overlapping portion OP. FIG. 9 illustrates an example of a method for forming the first branch portion 531b, and the method for forming the first branch portion 531b of an electronic device according to an embodiment is not limited thereto.

[0101] The second branch portion 532b of the connection member 530 will now be described with reference to Figure 10. Figure 10 is a cross-sectional view of an electronic device according to an embodiment taken along line EE' in Figure 6.

[0102] Referring to FIG. 10, the connecting member 530 can include a second FPCB 532, a third FPCB 533, cover layers 812, 1011, 1012, and an adhesive layer 822.

[0103] The second FPCB 532 may include a second substrate 8321, a third conductive layer 8322 located above the second substrate 8321 (e.g., in the +Z-axis direction), and a fourth conductive layer 8323 located below the second substrate 8321 (e.g., in the -Z-axis direction). The third conductive layer 8322 and the fourth conductive layer 8323 may be connected through an opening H in the second substrate 8321. In the second portion OP2 of the overlapping portion OP, the second overlapping portion 532a of the second FPCB 532 may overlap the third overlapping portion 533a of the third FPCB 533. The second branch portion 532b of the second FPCB 532 may branch and extend from the second portion OP2 of the overlapping portion OP. The second branch portion 532b of the second FPCB 532 extends from the second overlapping portion 532a and may not overlap the first FPCB 531 or the third FPCB 533. Based on the direction in which the second branch portion 532b of the second FPCB 532 branches off from the second portion OP2 of the overlapping portion OP, the third FPCB 533 may extend only to a second branch point B2 where the second branch portion 532b of the second FPCB 532 branches off from the second portion OP2 of the overlapping portion OP. For example, the third FPCB 533 may be cut at the second branch point B2, and the portion of the third FPCB 533 that overlaps with the second branch portion 532b of the second FPCB 532 may be removed. At the second branch point B2, the third FPCB 533 may include a cut surface CP.

[0104] The third FPCB 533 may include a third substrate 8331, a fifth conductive layer 8332 located above the third substrate 8331 (e.g., in the +Z-axis direction), and a sixth conductive layer 8333 located below the third substrate 8331 (e.g., in the −Z-axis direction). The fifth conductive layer 8332 and the sixth conductive layer 8333 may be connected via an opening H in the third substrate 8331. A third overlapping portion 533a of the third FPCB 533 may overlap the second FPCB 532.

[0105] The second adhesive layer 822 is located between the second overlapping portion 532a of the second FPCB 532 and the third overlapping portion 533a of the third FPCB 533, and can bond the second FPCB 532 and the third FPCB 533 together.

[0106] The cover layers 812, 1011, 1012 may include a second cover layer 812, a fourth cover layer 1011, and a fifth cover layer 1012. The second cover layer 812 may be located below the third FPCB 533 (e.g., in the −Z axis direction). For example, the second cover layer 812 may cover a lower surface (e.g., a surface in the −Z axis direction) of the second portion OP2 of the overlapping portion. The fourth cover layer 1011 may be located above the second portion OP2 of the overlapping portion and the second branch portion 532b of the connecting member 530 (e.g., in the +Z axis direction). The fifth cover layer 1012 may be located below the second branch portion 532b (e.g., in the −Z axis direction). For example, the fourth cover layer 1011 may cover the upper surfaces (e.g., surfaces in the +Z axis direction) of the second overlapping portion 532a and the second branching portion 532b of the second FPCB 532, and the fifth cover layer 1012 may cover the lower surface (e.g., surfaces in the -Z axis direction) of the second branching portion 532b.

[0107] The connection member 530 may include a through hole TH and a conductive layer 8411 located on the inner wall of the through hole TH. The second FPCB 532 and the third FPCB 533 may be electrically connected via the conductive layer 8411 located on the inner wall of the through hole TH.

[0108] Hereinafter, the third branch portion 533b of the connection member 530 will be described with reference to Fig. 11. Fig. 11 is a cross-sectional view of an electronic device according to an embodiment taken along line FF' in Fig. 6.

[0109] Referring to FIG. 11, the connecting member 530 can include a second FPCB 532, a third FPCB 533, cover layers 812, 1011, 1111, and an adhesive layer 822.

[0110] The second FPCB 532 may include a second substrate 8321, a third conductive layer 8322 located above the second substrate 8321 (e.g., in the +Z-axis direction), and a fourth conductive layer 8323 located below the second substrate 8321 (e.g., in the −Z-axis direction). The third conductive layer 8322 and the fourth conductive layer 8323 may be connected through an opening H in the second substrate 8321. In a second portion OP2 of the overlapping portion OP, the second overlapping portion 532a of the second FPCB 532 may overlap the third overlapping portion 533a of the third FPCB 533.

[0111] The third FPCB 533 may include a third substrate 8331, a fifth conductive layer 8332 located above the third substrate 8331 (e.g., in the +Z-axis direction), and a sixth conductive layer 8333 located below the third substrate 8331 (e.g., in the -Z-axis direction). The fifth conductive layer 8332 and the sixth conductive layer 8333 may be connected through an opening H in the third substrate 8331. In the second portion OP2 of the overlapping portion OP, the third overlapping portion 533a of the third FPCB 533 may overlap the second overlapping portion 532a of the second FPCB 532. The third branch portion 533b of the third FPCB 533 may branch and extend from the second portion OP2 of the overlapping portion OP. The third branch portion 533b of the third FPCB 533 extends from the third overlapping portion 533a and may not overlap the first FPCB 531 or the second FPCB 532. Based on the direction in which the third branch portion 533b of the third FPCB 533 branches off from the second portion OP2 of the overlapping portion OP, the second FPCB 532 may extend only to a third branch point B3 where the third branch portion 533b of the third FPCB 533 branches off from the second portion OP2 of the overlapping portion OP. For example, the second FPCB 532 may be cut at the third branch point B3, and the portion of the second FPCB 532 that overlaps with the third branch portion 533b of the third FPCB 533 may be removed. At the third branch point B3, the second FPCB 532 may include a cut surface CP.

[0112] The second adhesive layer 822 is located between the second overlapping portion 532a of the second FPCB 532 and the third overlapping portion 533a of the third FPCB 533, and can bond the second FPCB 532 and the third FPCB 533 together.

[0113] The cover layers 812, 1011, 1111 may include a second cover layer 812, a fourth cover layer 1011, and a sixth cover layer 1111. The second cover layer 812 may be located below the third FPCB 533 (e.g., in the −Z axis direction). The fourth cover layer 1011 may be located above the second portion OP2 of the overlapping portion of the connecting member 530 (e.g., in the +Z axis direction). The sixth cover layer 1111 may be located above the third branch portion 533b (e.g., in the +Z axis direction).

[0114] The connection member 530 may include a through hole TH and a conductive layer 8411 located on the inner wall of the through hole TH. The second FPCB 532 and the third FPCB 533 may be electrically connected via the conductive layer 8411 located on the inner wall of the through hole TH.

[0115] An electronic device according to an embodiment will now be described with reference to Fig. 12. Fig. 12 is a cross-sectional view of the electronic device according to the embodiment. Referring to Fig. 12, the electronic device may include a first PCB 510 and a connection member 1200 electrically connected to the first PCB 510 via connectors 1221 and 1222.

[0116] The connecting member 1200 may include a rigid member 1210 and FPCBs 531, 532, and 533 connected to the rigid member 1210. The FPCBs 531, 532, and 533 may include a first FPCB 531, a second FPCB 532, and a third FPCB 533. The connecting member 1200 may include an overlapping portion OP where the first FPCB 531, the second FPCB 532, and the third FPCB 533 are pulled out in one direction from the rigid member 1210 and overlap each other.

[0117] The first PCB 510 and the connection member 1200 may be electrically connected via connectors 1221 and 1222. For example, the first connector member 1221 mounted on the rigid member 1210 of the connection member 1200 may be in contact with and electrically connected to the second connector member 1222 mounted on the first PCB 510.

[0118] According to one embodiment, an electronic device (e.g., electronic device 500) includes a frame (e.g., frame 297), a housing (e.g., housing 290) including a first temple (e.g., first temple 298-1) connected to one side of the frame and a second temple (e.g., second temple 298-2) connected to the other side of the frame, a first PCB (e.g., first PCB 510) located on the first temple, and a first FPCB (e.g., first FPCB 531) and a second FPCB (e.g., second FPCB 532) electrically connected to the first PCB, and the first FPCB is The second FPCB may include a first overlapping portion (e.g., first overlapping portion 531a) drawn from the first PCB in a first direction and overlapping with the second FPCB, and a first branch portion (e.g., first branch portion 531b) extending from the first overlapping portion and non-overlapping with the second FPCB, and the second FPCB may include a second overlapping portion (e.g., second overlapping portion 532a) drawn from the first PCB in the first direction and overlapping with the first FPCB, and a second branch portion (e.g., second branch portion 532b) extending from the second overlapping portion and non-overlapping with the first FPCB.

[0119] According to one embodiment, the first branch may be located in one area of ​​the housing, and the second branch may be located in another area of ​​the housing.

[0120] According to one embodiment, the first overlapping portion and the second overlapping portion may be located on the first temple.

[0121] The electronic device according to one embodiment may further include a hinge portion (e.g., first hinge portion 299-1) connecting the frame and the first temple, and the first overlapping portion and the second overlapping portion may overlap the hinge portion.

[0122] According to one embodiment, the electronic device may further include a camera (e.g., first camera 431) located in one area of ​​the frame and a second PCB (e.g., second PCB 520) located in the second temple, and the first branch of the first FPCB may be connected to the camera and the second branch of the second FPCB may be connected to the second PCB.

[0123] According to one embodiment, the electronic device may further include an adhesive layer (e.g., first adhesive layer 821) positioned between the first overlapping portion and the second overlapping portion and adhering the first overlapping portion and the second overlapping portion.

[0124] According to one embodiment, the first PCB may include a plurality of stacked substrates (e.g., a plurality of substrates 711, 712, 713, 714, 715, 716, 717, 718) and conductive layers patterned on the plurality of substrates, and the first overlapping portion of the first FPCB may be connected to one of the conductive layers, and the second overlapping portion of the second FPCB may be connected to another one of the conductive layers.

[0125] According to one embodiment, the electronic device may further include a rigid member (e.g., rigid member 1210) connected to the first overlapping portion and the second overlapping portion, a first connector member (e.g., first connector member 1221) located on the rigid member, and a second connector member (e.g., second connector member 1222) located on the first PCB, and the first FPCB and the second FPCB may be electrically connected to the first PCB via the first connector member and the second connector member.

[0126] According to one embodiment, the electronic device may further include a first hard member (e.g., first hard member 611) connected to the first branch portion of the first FPCB, and a second hard member (e.g., second hard member 612) connected to the second branch portion of the second FPCB.

[0127] According to one embodiment, the electronic device may further include a first cover layer (e.g., first cover layer 811) covering at least one side of the first branch portion, and a second cover layer (e.g., fourth cover layer 1011) covering at least one side of the second branch portion.

[0128] An electronic device (e.g., electronic device 500) according to one embodiment includes a frame (e.g., frame 297), a housing (e.g., housing 290) including a first temple (e.g., first temple 298-1) connected to one side of the frame and a second temple (e.g., second temple 298-2) connected to the other side of the frame, a first PCB (e.g., first PCB 510) located on the first temple, and a connection member (e.g., connection member 530) including multiple FPCBs (e.g., multiple FPCBs 531, 532, 533) electrically connected to the first PCB, and the connection member may include an overlapping portion (e.g., overlapping portion OP) where at least two or more FPCBs of the multiple FPCBs overlap, and branching portions (e.g., branching portions 531b, 532b, 533b) branching from the overlapping portion.

[0129] According to one embodiment, the plurality of FPCBs may include a first FPCB (e.g., first FPCB 531), a second FPCB (e.g., second FPCB 532) and a third FPCB (e.g., third FPCB 533), and in the overlapping portion, the second FPCB may be located between the first FPCB and the third FPCB.

[0130] According to one embodiment, the first FPCB includes a first overlapping portion (e.g., first overlapping portion 531a) located at the overlapping portion, and a first branching portion (e.g., first branching portion 531b) branching from the second FPCB and the third FPCB at a first branching point (e.g., first branching point B1) and extending from the first overlapping portion, and the second FPCB includes a second overlapping portion (e.g., second overlapping portion 532a) located at the overlapping portion, and a second branching point (e.g., second branching point B2). ) and includes a second branch portion (e.g., second branch portion 532b) branching from the first FPCB and the third FPCB and extending from the second overlapping portion, and the third FPCB may include a third overlapping portion (e.g., third overlapping portion 533a) located at the overlapping portion, and a third branch portion (e.g., third branch portion 533b) branching from the first FPCB and the second FPCB at a third branch point (e.g., third branch point B3) and extending from the third overlapping portion.

[0131] According to an embodiment, the overlapping portion may be connected to the first PCB, and the first branch portion, the second branch portion, and the third branch portion may be connected in different configurations.

[0132] According to one embodiment, the electronic device may further include a first camera (e.g., first camera 431) and a second camera (e.g., second camera 432) located on the frame, and a second PCB (e.g., second PCB 420) located on the second temple, wherein the first branch portion of the first FPCB extends to the position of the first camera and is connected to the first camera, the second branch portion of the second FPCB extends to the position of the second PCB and is connected to the second PCB, and the third branch portion of the third FPCB extends to the position of the second camera and is connected to the second camera.

[0133] According to one embodiment, the first PCB includes a plurality of stacked substrates (e.g., a plurality of substrates 711, 712, 713, 714, 715, 716, 717, 718) and conductive layers patterned on the plurality of substrates, and each of the first overlapping portion of the first FPCB, the second overlapping portion of the second FPCB, and the third overlapping portion of the third FPCB may be connected to any one of the conductive layers.

[0134] In one embodiment, the electronic device further includes a connector (e.g., connectors 1221, 1222) that electrically connects the connection member and the first PCB, and the connection member further includes a rigid member (e.g., rigid member 1210) on which the connector is mounted, and the rigid member may be connected to the overlapping portion.

[0135] The electronic device according to an embodiment may further include a hinge portion (eg, first hinge portion 299-1) connecting the frame and the first temple, and a portion of the overlapping portion may overlap the hinge portion.

[0136] According to an embodiment, the electronic device may further include at least one adhesive layer (eg, first adhesive layer 821 or second adhesive layer 822) positioned between the FPCBs at the overlapping portion.

[0137] According to one embodiment, the electronic device may further include a display (e.g., first display 261-1 or second display 261-2) located in a region of the frame, a first transparent member (e.g., first transparent member 296-1) and a second transparent member (e.g., second transparent member 296-2), the frame including a first frame (e.g., first frame 297-1) connected to the first temple and fixing the first transparent member, and a second frame (e.g., second frame 297-2) connected to the second temple and fixing the second transparent member, and the display may display a screen using a screen output area (e.g., first screen output area 260-1 and / or second screen output area 260-2) located in at least one of the first transparent member and the second transparent member.

[0138] Electronic devices according to various embodiments disclosed herein may take various forms. The electronic devices may include, for example, portable communication devices (e.g., smartphones), computing devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or consumer electronic devices. Electronic devices according to embodiments of this document are not limited to the aforementioned devices.

[0139] The various embodiments and terms used in this document should not be understood to limit the technical features described in this document to a specific embodiment, but should be understood to include various modifications, equivalents, or alternatives of the embodiment. In the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the item, unless the context clearly dictates otherwise. In this document, each of phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" may include any one of the items listed in the phrase, or all possible combinations thereof. Terms such as "first," "second," "first," and "second" may be used simply to distinguish a corresponding component from other corresponding components and do not limit the corresponding component in other respects (e.g., importance or procedure). When a (e.g., first) component is referred to as being "coupled" or "connected" to another (e.g., second) component, with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., by wire), wirelessly, or through a third component.

[0140] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, and circuit. A module may be an integrated component, or the smallest unit or portion of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0141] Various embodiments of this document may be implemented as software (e.g., program 140) including one or more instructions stored in a storage medium (e.g., internal memory 136 or external memory 138) readable by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can retrieve and execute at least one instruction from the one or more stored instructions, allowing the machine to perform at least one function according to the retrieved at least one instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic wave), and the term does not distinguish between data being stored semi-permanently and data being temporarily stored in the storage medium.

[0142] According to one embodiment, the methods according to the various embodiments disclosed herein may be provided in a computer program product. The computer program product may be traded as a commodity between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., CD-ROM) (compact disc read only memory) or may be available through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a part of the computer program product may be at least temporarily stored or temporarily generated on a machine-readable storage medium such as the memory of a manufacturer's server, an application store server, an intermediary server, or the like.

[0143] According to various embodiments, each of the above-described components (e.g., modules or programs) may include one or more individuals, and some of the individuals may be located separately in other components. According to various embodiments, one or more components or operations of the above-described corresponding components may be omitted, and one or more other components or operations may be added. Alternatively or additionally, multiple components (e.g., modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as performed by the corresponding component of the multiple components before the integration. According to various embodiments, operations performed by a module, program, or other component may be performed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be performed in a different order, omitted, or one or more other operations may be added. [Explanation of symbols]

[0144] 201 Electronic equipment 260-1 1st screen output area 260-1 Screen output area 260-2 2nd screen output area 261 Sensors 261-1 Display 1 261-2 Second Display 262-1 First input optical member 262-1 Output optical components 262-2 Second input optical member 270-1 1st Speaker 270-2 2nd Speaker 271-1 First microphone 271-2 Second microphone 271-3 Third microphone 276-1 First Eye Tracking Sensor 276-2 Second eye tracking sensor 280-1 Camera 1 280-2 Second Camera 280-3 Third Camera 281-1 First Lighting Unit 281-2 Second lighting unit 287-1 1st PCB 287-2 2nd PCB 289-1 Battery No. 1 289-2 Second Battery 290 Housing 296-1 First transparent member 296-2 Second transparent member 297 frames 297-1 1st Frame 297-2 2nd Frame 297-3 Bridge 298-1 First Temple 298-2 Second Temple 299-1 First hinge part 299-2 Second hinge part 351 Lens 360 optical waveguide 361 Display 362 Input optical components 364 Output Optical Components 371 Eye Tracking Sensor 381 First Splitter 382 Optical waveguide 383 Second Splitter 396 Transparent Materials 399 eyes 500 Electronic equipment 510 1st PCB 520 2nd PCB 530 Connecting member 531 1st FPCB 531a First overlapping section 531b First branch 532 2nd FPCB 532a Second overlapping section 532b Second branch 533 3rd FPCB 533a Third overlapping section 533b Third branch 611 First rigid member 612 Second rigid member 613 Third rigid member 711~718 PCB 720 Adhesive layer 731 Conductive Pattern 732 Conductive Pattern 811 First cover layer 812 Second Cover Layer 813 Third Cover Layer 821 1st adhesive layer 822 Second adhesive layer 1011 4th cover layer 1012 5th cover layer 1111 6th cover layer 1200 Connecting parts 1210 Rigid parts 1221 First connector member 1222 Second connector member 8311 First board 8312 First conductive layer 8313 Second conductive layer 8321 Second board 8322 Third conductive layer 8323 4th conductive layer 8331 3rd board 8332 5th conductive layer 8333 6th conductive layer 8411 Conductive layer

Claims

1. In an electronic device, The frame and a housing including a first temple connected to one side of the frame and a second temple connected to the other side of the frame; a first PCB located on the first temple; a first FPCB, a second FPCB, and a third FPCB electrically connected to the first PCB; the first FPCB includes a first overlapping portion drawn from the first PCB in a first direction to overlap the second FPCB and the third FPCB, and a first branch portion extending from the first overlapping portion to not overlap the second FPCB and the third FPCB; the second FPCB includes a second overlapping portion drawn from the first PCB in the first direction and overlapping the first FPCB and the third FPCB, and a second branch portion extending from the second overlapping portion and not overlapping the first FPCB and the third FPCB, the third FPCB includes a third overlapping portion that is pulled out from the first PCB in the first direction and overlaps the first FPCB and the second FPCB, and a third branch portion that extends from the third overlapping portion and does not overlap the first FPCB and the second FPCB.

2. The electronic device of claim 1 , wherein the first branch is located in one area of ​​the housing and the second branch is located in another area of ​​the housing.

3. The electronic device according to claim 1 , wherein the first overlapping portion and the second overlapping portion are located on the first temple.

4. The frame further includes a hinge portion connecting the frame and the first temple, The electronic device according to claim 3 , wherein the first overlapping portion and the second overlapping portion overlap the hinge portion.

5. a camera positioned in an area of ​​the frame; a second PCB located on the second temple, The electronic device of claim 1 , wherein the first branch of the first FPCB is connected to the camera, and the second branch of the second FPCB is connected to the second PCB.

6. The electronic device according to claim 1 , further comprising an adhesive layer located between the first overlapping portion and the second overlapping portion, and adhering the first overlapping portion and the second overlapping portion to each other.

7. the first PCB includes a plurality of stacked substrates and conductive layers patterned on the plurality of substrates; the first overlapping portion of the first FPCB is connected to one of the conductive layers; The electronic device of claim 1 , wherein the second overlapping portion of the second FPCB is connected to another one of the conductive layers.

8. a rigid member connected to the first overlapping portion and the second overlapping portion; a first connector member located on the rigid member; a second connector member located on the first PCB; The electronic device according to claim 1 , wherein the first FPCB and the second FPCB are electrically connected to the first PCB via the first connector member and the second connector member.

9. a first rigid member connected to the first branch portion of the first FPCB; The electronic device according to claim 1 , further comprising: a second rigid member connected to the second branch portion of the second FPCB.

10. a first cover layer covering at least one surface of the first branch portion; The electronic device according to claim 1 , further comprising: a second cover layer covering at least one surface of the second branch portion.

11. In an electronic device, The frame and a housing including a first temple connected to one side of the frame and a second temple connected to the other side of the frame; a first PCB located on the first temple; a connection member including a plurality of FPCBs electrically connected to the first PCB; the connection member includes an overlapping portion where at least two or more FPCBs of the plurality of FPCBs overlap, and a branching portion branching from the overlapping portion, the plurality of FPCBs include a first FPCB, a second FPCB, and a third FPCB; the second FPCB is located between the first FPCB and the third FPCB at the overlapping portion; the first FPCB includes a first overlapping portion located at the overlapping portion, and a first branching portion branching from the second FPCB and the third FPCB at a first branching point and extending from the first overlapping portion; the second FPCB includes a second overlapping portion located at the overlapping portion, and a second branching portion branching from the first FPCB and the third FPCB at a second branching point and extending from the second overlapping portion; The third FPCB includes a third overlapping portion located at the overlapping portion, and a third branching portion branching from the first FPCB and the second FPCB at a third branching point and extending from the third overlapping portion.

12. the overlapping portion is connected to the first PCB, The electronic device according to claim 11 , wherein the first branch, the second branch, and the third branch are connected in different configurations.

13. a display located in a region of the frame; further comprising a first transparent member and a second transparent member; The frame is a first frame connected to the first temple and fixing the first transparent member; a second frame connected to the second temple and fixing the second transparent member; The electronic device according to claim 11 , wherein the display displays a screen using a screen output area located on at least one of the first transparent member and the second transparent member.

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