Heat storage board

Abstract

To provide a heat storage board capable of achieving both heat storage properties and sound insulation properties.SOLUTION: A heat storage board 1A includes at least a wooden base material 11 having a plurality of sound insulation grooves 21, 21, ... formed on a back surface 11g, a flexible heat storage sheet 12 attached to the back surface 11g of the wooden base material 11, and a back surface material 13 attached to a back surface 12g of the heat storage sheet 12. A wide groove 22 wider than the groove width of the sound insulation groove 21 and shallower than the depth of the sound insulation groove 21 is formed on the back surface 11g of the wooden base material 11. The heat storage sheet 12 is attached to the back surface 11g of the wooden base material 11 so as to leave the groove space formed in the wide groove 22.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a heat storage board having sound insulation properties. [Background technology]

[0002] To improve sound insulation, a sound-insulating floor has been proposed that includes a wooden base material with multiple sound-insulating grooves formed on the back surface and a buffer sheet attached to the back surface of the wooden base material (see, for example, Patent Document 1). With this sound-insulating floor, when an impact sound occurs on the surface of the wooden base material, the impact sound can be reduced by the sound-insulating grooves formed from the surface of the wooden base material to the back surface of the wooden base material. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-135017 Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, a heat storage sheet is sometimes used to enhance the heat storage capacity of a board. When a heat storage sheet is applied to a sound-insulating board such as the sound-insulating floor shown in Patent Document 1, heat enters from the surface side of the wooden substrate, so the heat storage sheet is placed between the wooden substrate and the buffer sheet. In this case, the heat storage sheet is attached to the back side of the wooden substrate, but it has been found that the impact noise generated on the surface of the board cannot be sufficiently reduced.

[0005] The present invention has been made in view of the above points, and an object of the present invention is to provide a heat storage board that can achieve both heat storage properties and sound insulation properties. [Means for solving the problem]

[0006] In view of the above-mentioned problems, the inventors conducted extensive research and found that it is particularly difficult to reduce low-frequency impact noise (for example, noise in the frequency range around 125 Hz to 250 Hz) when a heat storage sheet is used. Furthermore, as the inventors continued their research, they found that this impact noise is easily reduced by the bending (deformation) of the wood base material. However, as described above, they discovered that if a heat storage sheet is attached to the entire back surface of the wood base material, when a low-frequency impact noise occurs on the surface of the heat storage board, the heat storage sheet will restrict the bending of the wood base material, and the impact noise cannot be sufficiently reduced.

[0007] The present invention is based on new findings by the inventors, and is characterized in that the heat storage board according to the first invention comprises at least a wooden base material having a plurality of sound-insulating grooves formed on its back surface, a flexible heat storage sheet attached to the back surface of the wooden base material, and a backing material attached to the back surface of the heat storage sheet, wherein wide grooves that are wider than the groove width of the sound-insulating grooves and shallower than the depth of the sound-insulating grooves are formed on the back surface of the wooden base material, and the heat storage sheet is attached to the back surface of the wooden base material so as to leave groove spaces formed in the wide grooves.

[0008] According to the first invention, by adhering a heat storage sheet to the back surface of a wooden base material, it is possible to store heat input from the wooden base material. When a heat storage sheet is adhered to a wooden base material, the sound insulation of the heat storage board is likely to decrease. However, according to the present invention, by providing wide grooves on the back surface of the wooden base material, separate from the sound insulation grooves, that are wider and shallower than the sound insulation grooves, a groove space is formed by the wide groove between the heat storage sheets. This groove space can improve the sound insulation of the heat storage board.

[0009] Furthermore, because the heat storage sheet is attached to the back surface of the wood substrate so as to leave the groove spaces formed in the wide grooves, the area of ​​the back surface of the wood substrate where the heat storage sheet is attached can be reduced. This makes it difficult for the wood substrate to be restrained by the heat storage sheet. As a result, the impact energy acting on the wood substrate is absorbed by the deflection of the wood substrate, reducing the generated noise.

[0010] In a preferred embodiment of the first invention, the sound-insulating grooves and the wide grooves are formed in multiple numbers along at least the short side direction of the wood base material, and the sound-insulating grooves and the wide grooves are formed so as to overlap each other.

[0011] According to this aspect, by forming multiple sound-insulating grooves along the short side, the impact energy acting on the wood base material is absorbed by the deflection of the wood base material, thereby reducing the generated sound. In addition, since the sound-insulating groove space and the wide groove space are formed continuously, the sound generated within these spaces can be effectively absorbed.

[0012] In a preferred embodiment of the first invention, the surface of the heat storage sheet that is attached to the wooden base material has a plurality of ridges formed thereon, and the heat storage sheet has the ridges attached to the back surface of the wooden base material so as to leave recessed spaces between adjacent ridges.

[0013] According to this aspect, the recessed spaces formed between adjacent ridges enhance the sound insulation of the heat storage board. Furthermore, since the heat storage sheet is attached to the back surface of the wooden base material so as to leave recessed spaces in the heat storage sheet, the area of ​​contact with the heat storage sheet on the back surface of the wooden base material can be reduced. Therefore, the wooden base material is less likely to be restrained by the heat storage sheet. As a result, the impact energy acting on the wooden base material is absorbed by the deflection of the wooden base material, reducing the sound generated by the heat storage board.

[0014] The following describes a heat storage board according to the second invention. The heat storage board according to the second invention comprises at least a wooden base material having a plurality of sound-insulating grooves formed on the back surface thereof, a flexible heat storage sheet attached to the back surface of the wooden base material, and a backing material attached to the back surface of the heat storage sheet, wherein a plurality of ridges are formed on the surface of the heat storage sheet that is attached to the wooden base material, and the ridges of the heat storage sheet are attached to the back surface of the wooden base material so as to leave recessed spaces formed between adjacent ridges.

[0015] According to the second aspect of the present invention, by attaching a heat storage sheet to the back surface of the wooden base material, it is possible to store heat input from the wooden base material. When such a heat storage sheet is provided, the sound insulation of the heat storage board is likely to decrease. However, according to the present invention, in addition to the sound insulation grooves, the heat storage sheet has ridges attached to the back surface of the wooden base material so as to leave recessed spaces formed between adjacent ridges. This recessed space effectively absorbs sound, thereby improving the sound insulation of the heat storage board.

[0016] Furthermore, because the heat storage sheet is attached to the back surface of the wooden substrate so as to leave a recessed space in the heat storage sheet, the area of ​​the back surface of the wooden substrate where the heat storage sheet is attached can be reduced. As a result, the wooden substrate is less likely to be restrained by the heat storage sheet. As a result, the impact energy acting on the wooden substrate is absorbed by the deflection of the wooden substrate, reducing the generated noise.

[0017] In a preferred embodiment of the second aspect of the present invention, the sound-insulating grooves and the protruding strips are formed in multiple locations along at least the short side of the wood base material, and the protruding strips along the short side are attached at positions away from the sound-insulating grooves along the short side.

[0018] According to this aspect, since the sound-insulating grooves and ridges are formed along at least the short side of the wooden base material, the wooden base material is restrained by the ridges along the short side, making the wooden base material more likely to flex in the longitudinal direction. As a result, the impact energy acting on the wooden base material is absorbed by the flexure of the wooden base material, thereby reducing the generated noise.

[0019] The heat storage sheet according to the first and second aspects of the present invention is not particularly limited as long as it has heat storage properties, but in a more preferred embodiment, the heat storage sheet is an elastic sheet in which a heat storage material is dispersed in a base material made of foamed resin. According to this embodiment, by making the heat storage sheet an elastic sheet, the heat storage sheet absorbs impact energy from the wood base material by compressive deformation, thereby reducing the noise generated by the heat storage board. [Effects of the Invention]

[0020] The heat storage board according to the present invention can achieve both heat storage and sound insulation properties. [Brief explanation of the drawings]

[0021] [Figure 1] 1 is an exploded perspective view of a heat storage board according to a first embodiment, viewed from above. FIG. [Figure 2] FIG. 2 is an exploded perspective view of the heat storage board according to FIG. 1 as viewed from below. [Figure 3] 1, (b) is a modified example of (a), and (c) is another modified example of (a). [Figure 4] FIG. 2 is an enlarged view for explaining a main part of the heat storage sheet shown in FIG. [Figure 5] FIG. 10 is an exploded perspective view of a heat storage board according to a second embodiment, viewed from above. [Figure 6] FIG. 6 is an exploded perspective view of the heat storage board according to FIG. 5 when viewed from below. [Figure 7] 6(a) is an enlarged view of a main part of the thermal storage board shown in FIG. 5, and (b) to (f) are modified examples of (a). [Figure 8] FIG. 10 is an exploded perspective view of a heat storage board according to a third embodiment, viewed from above. [Figure 9] 9 is an exploded perspective view of the heat storage board in FIG. 8 when viewed from below. FIG. [Figure 10] 9(a) is an enlarged view of a main part of the thermal storage board shown in FIG. 8, and (b) and (c) are modified examples of (a). DETAILED DESCRIPTION OF THE INVENTION

[0022] The thermal storage board according to an embodiment of the present invention and its modified examples will be described with reference to FIGS.

[0023] [First embodiment (first invention)] The configuration of the thermal storage board 1A according to the first embodiment will be briefly described below. Fig. 1 is an exploded perspective view of the thermal storage board according to the first embodiment as viewed from above. Fig. 2 is an exploded perspective view of the thermal storage board according to Fig. 1 as viewed from below. Fig. 3(a) is an enlarged view of a main part of the thermal storage board shown in Fig. 1, Fig. 3(b) is a modified example of Fig. 3(a), and Fig. 3(c) is another modified example of Fig. 3(a). Fig. 4 is an enlarged view for explaining a main part of the thermal storage sheet shown in Fig. 1.

[0024] As shown in Fig. 1, the heat storage board 1A according to the first embodiment is included in the first invention and is a board having sound insulation and heat storage properties. Fig. 1 shows an example in which the heat storage board 1A is applied to a floor material, but it may also be applied to building materials such as wall materials.

[0025] As shown in Figures 1 and 2, the heat storage board 1A at least comprises a wooden base material 11 having a plurality of sound-insulating grooves 21 formed on its back surface 11g, a flexible heat storage sheet 12 attached to the back surface 11g of the wooden base material 11, and a back surface material 13 attached to the back surface 12g of the heat storage sheet 12.

[0026] 1. Wood-based material 11 The wooden substrate 11 is a wood-based substrate having a short side direction X and a long side direction Y. In this embodiment, the surface decorative material and the base material are laminated, for example, by bonding, but the surface decorative material does not necessarily have to be laminated. For example, the surface decorative material can be a decorative veneer, a resin decorative sheet, a sawn board, or a sliced ​​veneer. Instead of the surface decorative material, the surface of the base material may be subjected to decorative printing, such as UV-curable inkjet printing or gravure printing after appropriate surface treatment.

[0027] Examples of base materials include plywood, particle board (PB), wood fiberboard (MDF, insulation board, hardboard, etc.), oriented strand board, OSB, LVL, laminated wood, and solid wood, and these may be heat-treated or chemically treated, or may be composite wood base materials made by laminating two or more types of these.

[0028] 1 and 2, male and female inseams 11a and 11b are formed on the periphery of the wooden substrate 11 (specifically, the base material). When laying the thermal storage boards 1A on the subfloor ground, the male and female inseams 11a and 11b of adjacent thermal storage boards 1A can be joined together to connect multiple thermal storage boards 1A. The thickness (apparent thickness) of the wooden substrate 11 from the front to the back is preferably 6 to 12 mm, and more preferably 8 to 10 mm.

[0029] Furthermore, in this embodiment, a plurality of sound insulating grooves 21, 21, ... are formed on the back surface 11g of the wooden base material 11. The plurality of sound insulating grooves 21, 21, ... are formed at a predetermined pitch along the short-side direction X and long-side direction Y of the wooden base material 11. It is preferable that the pitch of the sound insulating grooves 21 is in the range of 3 to 1000 mm, the groove width is in the range of 0.3 to 10 mm, and the depth is in the range of 1 to 10 mm. This allows the wooden base material 11 to bend favorably when a load such as an impact load acts on the surface of the heat storage board 1A (i.e., the surface of the wooden base material 11).

[0030] In this embodiment, multiple sound insulation grooves 21, 21, ... are formed so that sound insulation grooves 21 along the longitudinal direction Y intersect with sound insulation grooves 21 along the lateral direction X, but as long as the above-mentioned bending effect can be expected, multiple sound insulation grooves 21 may be formed along only one of the directions, or multiple sound insulation grooves 21 may be formed along a direction intersecting the lateral direction X and the longitudinal direction Y, and the widths, depths, etc. of each sound insulation groove 21 may be different. Note that wide grooves 22 are also formed in the wood base material 11, and details of this will be described later.

[0031] 2. About the heat storage sheet 12 The heat storage sheet 12 is disposed so as to cover the back surface 11g of the wooden base material 11. In this embodiment, the heat storage sheet 12 is a heat storage sheet having flat surfaces on the front surface 12f and the back surface 12g.

[0032] The heat storage sheet 12 is a sheet containing a latent heat storage material that stores heat by converting from a liquid phase to a solid phase. Preferably, the latent heat storage material does not leach out of the heat storage sheet 12 when in the liquid phase. In this embodiment, as shown in FIG. 4, the heat storage sheet 12 is a sheet-like member in which heat storage particles 12b, in which the latent heat storage material is encapsulated in microcapsules, are dispersed in a resin substrate 12a. The heat storage sheet 12 is preferably flexible. The microcapsules and the resin substrate 12a may be either a thermosetting resin or a thermoplastic resin. The resin is not limited as long as the latent heat storage material does not leak out of the microcapsules. The resin substrate 12a may be a thermoplastic resin that softens at or below the heating temperature during molding. Examples of the thermoplastic resin constituting the resin substrate 12a include vinyl chloride, and the heat storage sheet 12 may be a foamed sheet obtained by foaming the resin substrate 12a.

[0033] The phase change temperature (melting point) of the latent heat storage material from the liquid phase to the solid phase is preferably 18 to 25°C. Examples of latent heat storage materials include saturated aliphatic hydrocarbons such as n-paraffin and paraffin wax, typically having 16 to 24 carbon atoms, composed of n-hexadecane, n-heptadecane, n-octadecane, n-nonadecane, etc., or mixtures thereof; mono- or polyunsaturated aliphatic hydrocarbons such as linear α-olefins, typically having 16 to 24 carbon atoms, composed of 1-hexadecene, 1-heptadecene, 1-octadecene, 1-nonadecene, 1-eicosene, etc., or mixtures thereof; long-chain fatty acids such as octanoic acid, capric acid, lauric acid, myristic acid, etc., or mixtures thereof; esters of the above fatty acids, polyether compounds such as polyethylene glycol, etc. For example, if the latent heat storage material melts at 28°C, n-octadecane is selected, and if the latent heat storage material melts at 18°C, n-hexadecane is selected. Furthermore, a plurality of latent heat storage materials having different melting points may be mixed and used.

[0034] The heat storage sheet 12 may also be formed by sealing the above-mentioned latent heat storage material in a bag made of, for example, metal, resin, or a film laminated with these. Alternatively, the heat storage sheet 12 may be made of a latent heat storage material that becomes gel-like at or above its phase change temperature. In this embodiment, the latent heat storage material changes from a solid state to a gel-like state at or above its phase change temperature, so that the shape of the latent heat storage material can easily be maintained even when the temperature exceeds the phase change temperature.

[0035] Furthermore, as disclosed in International Publication No. 2015 / 174523 already filed by the applicant, a heat storage material composition containing a latent heat storage material and a hydrogenated styrene-based thermoplastic elastomer may be contained in the heat storage sheet 12. Examples of the hydrogenated styrene-based thermoplastic elastomer include at least one type (which may be a mixture of two or more types) selected from the group consisting of styrene-ethylene / butylene-styrene block copolymer (SEBS), styrene-ethylene / propylene block copolymer (SEP), styrene-ethylene / propylene-styrene block copolymer (SEPS), and styrene-ethylene-ethylene / propylene-styrene block copolymer (SEEPS).

[0036] 3. Regarding backing material 13 The back surface material 13 is disposed on the back surface side of the heat storage sheet 12. The back surface material 13 may be a nonwoven fabric or a woven fabric.

[0037] The back surface material 13 may be made of resin fibers such as polyolefin resins such as polyethylene and polypropylene, polyester resins such as polyethylene terephthalate and polybutylene terephthalate, and polyamide resins including nylon, or natural fibers such as cotton and wool. Alternatively, the back surface material 13 may be a non-porous resin sheet. For example, the back surface material 13 may be an impact-absorbing sheet (a sheet with cushioning properties). Examples of impact-absorbing sheets include foamed resin sheets, and examples of the resins used for foamed resins include polyurethane resins, polystyrene resins, polyethylene resins, and polypropylene resins. Among these, polyurethane resins, which have a high elastic deformation rate in the compression direction, are preferred.

[0038] 4. Soundproofing structure In this embodiment, a soundproof structure is formed by the wooden base material 11 and the heat storage sheet 12. Specifically, wide grooves 22 that are wider than the groove width of the sound insulation grooves 21 but shallower than the depth of the sound insulation grooves 21 are formed on the back surface 11g of the wooden base material 11. Specifically, as shown in FIG. 3(a), the depth D2 of the wide grooves 22 is shallower than the depth D1 of the sound insulation grooves 21, and the groove width W2 of the wide grooves 22 is wider than the groove width W1 of the sound insulation grooves 21. For example, it is preferable that the depth D2 of the wide grooves 22 is in the range of 0.05 to 0.50 times the depth D1 of the sound insulation grooves 21, and the groove width W2 of the wide grooves 22 is in the range of 2 to 30 times the groove width W1 of the sound insulation grooves 21.

[0039] 2 and 3(a), in this embodiment, a plurality of sound-insulating grooves 21 and a plurality of wide grooves 22 are formed at least along the lateral direction X of the wood substrate 11, and the sound-insulating grooves 21 and the wide grooves 22 are formed so as to overlap. In this embodiment, the wide grooves 22 are formed along the lateral direction X, but the wide grooves 22 may also be formed, for example, along the longitudinal direction Y. In this case, the sound-insulating grooves 21 and the wide grooves 22 along the longitudinal direction are formed so as to overlap.

[0040] The wooden base material 11 and the heat storage sheet 12 are bonded together with an adhesive. Specifically, as shown in Fig. 3, the heat storage sheet 12 is bonded to the back surface 11g of the wooden base material 11 so as to leave the groove spaces S2 formed in the wide grooves 22. The heat storage sheet 12 and the back surface material 13 are also bonded together with an adhesive.

[0041] There are no particular restrictions on the adhesive that bonds the wood base material 11 and the heat storage sheet 12, and the adhesive that bonds the heat storage sheet 12 and the backing material 13, as long as it can ensure adhesion. Therefore, it is sufficient that the adhesive is formed as an adhesive layer at the interface between these, and it is preferable that no adhesive is attached to the surface 12f of the heat storage sheet 12 that faces the wide groove 22. As a result, the surface 12f of the heat storage sheet 12 that faces the wide groove 22 is not hardened by the adhesive, and the surface 12f of the heat storage sheet 12 can absorb sound that is transmitted to the space S2 of the wide groove 22.

[0042] Examples of adhesives include water-based adhesives such as urea-melamine resin adhesives or ethylene-vinyl acetate co-condensation resin adhesives such as modified vinyl acetate adhesives; adhesives that harden through a chemical reaction with moisture, such as one-component polyurethane adhesives and silicone adhesives; and hot-melt adhesives such as polyamide adhesives and EVA adhesives. Other adhesives include those prepared by dissolving the adhesive resin in a hydrocarbon organic solvent.

[0043] According to this embodiment, by adhering a heat storage sheet 12 to the back surface 11g of the wooden base material 11, it is possible to store heat input from the wooden base material 11. When a heat storage sheet 12 is adhered to the wooden base material 11, the sound insulation of the heat storage board 1A is likely to decrease, but according to this embodiment, in addition to the sound insulation grooves 21, wide grooves 22 that are wider and shallower than the sound insulation grooves 21 are provided on the back surface 11g of the wooden base material 11. This forms a groove space S2 between the wooden base material 11 and the heat storage sheet 12, in addition to the space S1 formed by the sound insulation grooves 21, due to the wide grooves 22. This groove space S2 can improve the sound insulation of the heat storage board 1A.

[0044] In particular, by forming a plurality of sound-insulating grooves 21, 21, ... along the short-side direction X, the impact energy acting on the wooden base material 11 is absorbed by the deflection of the wooden base material 11, thereby reducing the sound generated on the surface side of the wooden base material 11. In addition, as shown in Fig. 3(a), the space S1 of the sound-insulating groove 21 and the space S2 of the wide groove are formed continuously (communicate), so that the sound generated in these spaces S1 and S2 can be effectively absorbed.

[0045] For this reason, for example, as shown in the modified example of Fig. 3(b), wide grooves 22 may be formed so as to extend to one side of the sound insulation groove 21, but if wide grooves 22 are provided so as to extend to both sides of the sound insulation groove 21 as shown in Fig. 3(a), the sound transmitted from the sound insulation groove 21 will be dispersed in the space S2 of the wide groove 22, thereby improving the sound insulation of the heat storage board 1A. Note that the sound insulation groove 21 shown in Fig. 3(b) may be further formed along the longitudinal direction Y of the wood base material 11.

[0046] The heat storage sheet 12 shown in FIGS. 3(a) and 3(b) is attached to the back surface 11g of the wooden base material 11 so as to leave the groove spaces S2 formed in the wide grooves 22. This makes it possible to reduce the area of ​​the back surface 11g of the wooden base material 11 where the heat storage sheet 12 is attached, compared to conventional designs (designs with only sound-insulating grooves 21). This makes it difficult for the wooden base material 11 to be constrained by the heat storage sheet 12. As a result, the impact energy acting on the wooden base material 11 is absorbed by the bending of the wooden base material 11, reducing the amount of noise generated. To achieve this effect, the area of ​​the heat storage sheet 12 attached to the back surface 11g of the wooden base material 11 when viewed from above is preferably 30% to 70%, and more preferably 40% to 60%.

[0047] Therefore, for example, as shown in the modified heat storage board 1A in Fig. 3(c), the same effect can be obtained even if the wide grooves 22 are formed in positions that are offset from the sound insulation grooves 21. Even if the wide grooves 22 are formed in positions that are offset from the sound insulation grooves 21 as shown in Fig. 3(c), the spaces S2 of the wide grooves 22 intersect with the sound insulation grooves 21 formed along the longitudinal direction of the wooden base material 11 and are continuous with the spaces of the sound insulation grooves 21 in the longitudinal direction, and these spaces can improve sound absorption. Furthermore, the wide grooves 22 may be formed along the longitudinal direction of the wooden base material 11 as shown in Fig. 3(c).

[0048] [Second embodiment (first invention)] A thermal storage board 1B according to a second embodiment will be described below with reference to Figures 5 to 7. The second embodiment is an embodiment included in the first invention, and differs from the first embodiment in the thermal storage sheet. Therefore, in the following Figures 5 to 7, the same components as those of the thermal storage board 1A of the first embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0049] Fig. 5 is an exploded perspective view of a thermal storage board according to a second embodiment, viewed from above. Fig. 6 is an exploded perspective view of the thermal storage board according to Fig. 5, viewed from below. Fig. 7(a) is an enlarged view of a main part of the thermal storage board shown in Fig. 5, and Figs. 7(b) to (f) are modified examples of (a).

[0050] As shown in Fig. 5, the heat storage board 1B of the second embodiment has a plurality of ridges 31, 31, ... formed on the surface 12f of the heat storage sheet 12 that is attached to the wooden base material 11. Each ridge 31 shown in Fig. 5 is a wide ridge whose width is greater than its height, but this shape is not limited to this and the width of the ridge may be equal to or narrower than its height. Grooves 32 are formed between the ridges 31, 31, and the grooves 32 form recessed spaces S3.

[0051] For convenience, Fig. 5 shows a small number of ridges 31, but the width of the ridges 31 is preferably in the range of 4 to 60 mm, and the width of the grooves 32 is also preferably in the range of 4 to 60 mm. Here, as shown in Fig. 7(a), the ridges 31 of the heat storage sheet 12 are attached to the back surface 11g of the wood base material 11 so as to leave recessed spaces S3 formed between adjacent ridges 31, 31. In this embodiment, the groove width of the grooves 32 of the heat storage sheet 12 is wider than the groove width of the sound-insulating grooves 21.

[0052] Here, the heat storage sheet 12 having the ridges 31 may be integrally molded from the material shown in the first embodiment, for example, from a material in which heat storage material is dispersed in a base material made of foamed resin as shown in Figure 4, but the heat storage sheet 12 may also be produced by attaching string-like or linear members corresponding to the ridges 31 to a sheet material having a flat surface.

[0053] Alternatively, only the ridges 31 may be made of nonwoven fabric, and the other parts may be made of a material having heat storage properties. The density of the nonwoven fabric of the ridges 31 may be, for example, 0.4 g / cm 3 ~1.0g / cm 3 The fiber diameter of the nonwoven fabric is preferably in the range of, for example, 0.5 μm to 15 μm.

[0054] According to this embodiment, the sound insulation of the heat storage board 1A can be improved by the recessed spaces S3 of the recessed grooves 32 formed between adjacent ridges 31, 31. Furthermore, since the heat storage sheet 12 is attached to the back surface 11g of the wooden base material 11 so as to leave the recessed spaces S3 in the heat storage sheet 12, the adhesion area of ​​the back surface 11g of the wooden base material 11 with the heat storage sheet 12 can be reduced. For this reason, the wooden base material 11 is less likely to be restrained by the heat storage sheet 12. As a result, impact energy acting on the wooden base material 11 is absorbed by the bending of the wooden base material 11, and the sound generated by the heat storage board 1B can be reduced.

[0055] 7(a), the recessed grooves 32 formed in the heat storage sheet 12 are formed so as to overlap the wide grooves 22 in the wooden base material 11, so that the recessed spaces S3 of the recessed grooves 32 in the heat storage sheet 12 are continuous with the spaces S1 of the sound insulation grooves 21 and the spaces S2 of the wide grooves 22 in the wooden base material 11. As a result, these continuous spaces S1 to S3 can improve the sound insulation of the heat storage board 1B.

[0056] Here, as shown in Fig. 7(b), the groove width of the recessed groove 32 may be narrower than the groove width of the wide groove 22. However, as shown in Fig. 7(a), by making the groove width of the recessed groove 32 wider than the groove width of the wide groove 22, it is possible to reduce the adhesion area of ​​the thermal storage sheet 12 on the back surface 11g of the wooden substrate 11. Furthermore, as shown in Fig. 7(c), the recessed groove 32 may be formed so as to protrude beyond the wide groove 22. Even in this case, it is possible to reduce the adhesion area of ​​the thermal storage sheet 12 on the back surface 11g of the wooden substrate 11 compared to the thermal storage board 1B of Fig. 7(b). This reduces the constraint of the thermal storage sheet 12 on the wooden substrate 11 when the wooden substrate 11 bends, thereby improving the sound insulation of the thermal storage board 1B.

[0057] Furthermore, as shown in Fig. 7(d), the recessed grooves 32 formed in the heat storage sheet 12 may be formed so as to deviate from the wide grooves 22 of the wooden base material 11. Even in this case, the adhesion area of ​​the heat storage sheet 12 on the back surface 11g of the wooden base material 11 can be reduced compared to the heat storage board 1A of the first embodiment shown in Fig. 3(b). In this case as well, when the wooden base material 11 bends, the constraint of the heat storage sheet 12 on the wooden base material 11 can be reduced, thereby improving the sound insulation of the heat storage board 1B.

[0058] 7(e), wide grooves 22 may be formed at positions away from the sound insulation grooves 21, and recessed grooves 32 may be formed in the heat storage sheet 12 so as to overlap the sound insulation grooves 21. This makes the space S1 of the sound insulation groove 21 and the recessed space S3 of the recessed groove 32 continuous, and these spaces can improve the sound insulation of the heat storage board 1B. In addition, as shown in FIG. 7(f), if wide grooves 22 are formed at positions away from the sound insulation grooves 21, and the recessed grooves 32 of the heat storage sheet 12 are formed so as to overlap the sound insulation grooves 21 and the wide grooves 22, these spaces can further improve the sound insulation of the heat storage board 1B.

[0059] In this way, the heat storage board 1B may be provided with any one of the sound insulating structures shown in Figures 7(a) to 7(f), or may include several of them. Furthermore, the heat storage board 1B may be formed by applying any one of the heat storage sheets 12 shown in Figures 7(a) to 7(f) to the wood base material 11 shown in Figures 3(a) to 3(c) of the first embodiment.

[0060] [Third embodiment (second invention)] A heat storage board 1C according to a third embodiment will be described below with reference to Figures 8 to 10. The third embodiment is an embodiment included in the second invention, and differs from the second embodiment in the wood base material. Therefore, in the following Figures 8 to 10, the same components as those of the heat storage board 1B of the second embodiment are given the same reference numerals, and detailed description thereof will be omitted.

[0061] Fig. 8 is an exploded perspective view of a heat storage board according to a third embodiment as viewed from above. Fig. 9 is an exploded perspective view of the heat storage board according to Fig. 8 as viewed from below. Fig. 10(a) is an enlarged view of a main part of the heat storage board shown in Fig. 8, and Fig. 10(b) and Fig. 10(c) are modified examples of Fig. 10(a).

[0062] As shown in Figures 8 to 10, the heat storage board 1C according to the third embodiment comprises a wooden base material 11 having a plurality of sound insulating grooves 21 formed on its back surface 11g, a flexible heat storage sheet 12 attached to the back surface 11g of the wooden base material 11, and a back surface material 13 attached to the back surface 12g of the heat storage sheet 12.

[0063] In this embodiment, the back surface 11g of the wooden base material 11 has sound-insulating grooves 21 but no wide grooves 22. In this embodiment, similar to the heat storage sheet 12 of the second embodiment, a plurality of ridges 31, 31, ... are formed on the surface 12f of the heat storage sheet 12 that is attached to the wooden base material 11.

[0064] 8 is a wide ridge 31 having a width greater than its height, as in the second embodiment, but is not limited to this shape and may have a width equal to or smaller than its height. Grooves 32 are formed between the ridges 31, 31, and recessed spaces S3 are formed in the grooves 32. The dimensions of the ridges 31 and the grooves 32 are the same as those in the second embodiment.

[0065] In this embodiment, as shown in Figures 8, 10(a), etc., the ridges 31 extending along the short side direction X are attached at positions away from the sound insulation grooves 21 extending along the short side direction X. Therefore, the ridges 31 of the heat storage sheet 12 are attached to the back surface 11g of the wood substrate 11 so as to leave recessed spaces S3 formed between adjacent ridges 31. Here, as in the second embodiment, the groove width of the recessed grooves 32 of the heat storage sheet 12 is wider than the groove width of the sound insulation grooves 21. Furthermore, the groove depth of the recessed grooves 32 may be shallower than the groove depth of the sound insulation grooves 21.

[0066] Here, the heat storage sheet 12 having the ridges 31 may be integrally formed from the material shown in the first embodiment, for example, a material in which heat storage material is dispersed in a base material made of foamed resin as shown in Fig. 4, but the heat storage sheet 12 may also be produced by attaching string-like or linear members corresponding to the ridges 31 to a sheet material with a flat surface. Alternatively, as shown in the second embodiment, only the ridges 31 may be made of nonwoven fabric, and the other parts may be made of a material with heat storage properties.

[0067] According to this embodiment, the sound insulation of the heat storage board 1C can be improved by the recessed spaces S3 of the recessed grooves 32 formed between adjacent ridges 31, 31. Furthermore, since the heat storage sheet 12 is attached to the back surface 11g of the wooden base material 11 so as to leave the recessed spaces S3 in the heat storage sheet 12, the adhesion area of ​​the back surface 11g of the wooden base material 11 with the heat storage sheet 12 can be reduced compared to when the recessed grooves 32 are not provided. For this reason, the wooden base material 11 is less likely to be restrained by the heat storage sheet 12. As a result, the deflection of the wooden base material 11 absorbs impact energy acting on the wooden base material 11, and the sound generated by the heat storage board 1C can be reduced.

[0068] Similarly, in the third embodiment, by adhering a heat storage sheet 12 to the back surface 11g of the wooden base material 11, it is possible to store heat input from the wooden base material 11. When a heat storage sheet 12 is adhered to the wooden base material 11, the sound insulation of the heat storage board 1C tends to decrease, but according to the present embodiment, in addition to the sound insulation grooves 21, recessed grooves 32 are arranged in a position facing the back surface 11g of the wooden base material 11, so that in addition to the space S1 defined by the sound insulation grooves 21, a recessed space S3 defined by the recessed grooves 32 is formed between the wooden base material 11 and the heat storage sheet 12. This groove space S3 can improve the sound insulation of the heat storage board 1C.

[0069] Furthermore, in this embodiment, in particular, a plurality of sound insulation grooves 21 and protrusions 31 are formed at least along the short-side direction X of the wood base material 11, and the protrusions 31 along the short-side direction are attached at positions away from the sound insulation grooves 21 along the short-side direction X. Therefore, as shown in Fig. 10(a), in this embodiment, the space S1 of the sound insulation groove 21 and the recessed space S3 of the heat storage sheet 12 are continuous. These continuous spaces can improve the sound insulation of the heat storage board.

[0070] Here, the heat storage sheet 12 is attached to the back surface 11g of the wooden base material 11 so as to leave a recessed space S3 in the heat storage sheet 12, which reduces the area of ​​the back surface 11g of the wooden base material 11 to which the heat storage sheet 12 is attached. This makes it difficult for the wooden base material 11 to be restrained by the heat storage sheet 12. As a result, the impact energy acting on the wooden base material 11 is absorbed by the bending of the wooden base material 11, reducing the generated noise.

[0071] Here, for example, as shown in a modified example in Fig. 10(b), the recessed groove 32 may be formed so as to extend to one side of the sound insulation groove 21, but if the recessed grooves 32 are provided so as to extend to both sides of the sound insulation groove 21 as shown in Fig. 10(a), the sound transmitted from the sound insulation groove 21 is dispersed in the recessed space S3 of the recessed groove 32, thereby improving the sound insulation of the heat storage board 1C. Note that the sound insulation groove 21 shown in Fig. 3(b) may be further formed along the longitudinal direction Y of the wood base material 11.

[0072] The heat storage sheet 12 shown in FIGS. 10(a) and 10(b) is attached to the back surface 11g of the wooden base material 11 so as to leave the groove spaces S3 formed in the recessed grooves 32. This makes it possible to reduce the area of ​​the back surface 11g of the wooden base material 11 where the heat storage sheet 12 is attached, compared to conventional designs (designs with only sound-insulating grooves 21). This makes it difficult for the wooden base material 11 to be constrained by the heat storage sheet 12. As a result, impact energy acting on the wooden base material 11 is absorbed by the bending of the wooden base material 11, reducing the amount of noise generated. To achieve this effect, the area of ​​the heat storage sheet 12 attached to the back surface 11g of the wooden base material 11 when viewed from above is preferably 30% to 70%, and more preferably 40% to 60%.

[0073] Therefore, for example, as shown in a modified heat storage board 1C in Fig. 10(c), the same effect can be obtained even if the recessed groove 32 is formed in a position that is offset from the sound insulation groove 21. Note that even if the recessed groove 32 is formed in a position that is offset from the sound insulation groove 21 as shown in Fig. 10(c), the recessed space S3 of this recessed groove 32 intersects the sound insulation groove 21 formed along the longitudinal direction of the wooden base material 11 and is continuous with the space S1 of the sound insulation groove 21 in the longitudinal direction, so these spaces can improve sound absorption. Furthermore, the recessed groove 32 may be formed along the longitudinal direction Y of the wooden base material 11 as shown in Fig. 10(c). [Example]

[0074] An embodiment of the present invention will be described below.

[0075] Example 1 A heat storage board corresponding to the first embodiment was fabricated. Specifically, a 9.0 mm thick wooden substrate, a 3.0 mm thick heat storage sheet, and a 3.0 mm thick backing material were prepared. The wooden substrate was made by laminating a decorative material to the surface of plywood, and the backing had multiple sound-insulating grooves 6.0 mm deep formed thereon. Wide grooves 0.6 mm deep were formed at 10 mm intervals along the short side direction on the backing of the wooden substrate. The heat storage sheet was an elastic sheet in which microcapsules encapsulating a latent heat storage material were dispersed in a urethane foam resin. Next, these were bonded together with an adhesive so that the wide grooves remained open, to fabricate a heat storage board.

[0076] Example 2 A thermal storage board was produced in the same manner as in Example 1. The difference from Example 1 is that wide grooves were not provided in the wooden base material, and instead, as in the third embodiment, multiple ridges, each 10 mm wide, 10 mm pitch, and 1.7 mm high, were formed on the surface of the thermal storage sheet that was to be attached to the wooden base material. These ridges were also made by dispersing microcapsules in a urethane foam resin.

[0077] Comparative Example 1 A thermal storage board was produced in the same manner as in Example 1. The difference from Example 1 is that a wood base material without wide grooves was used.

[0078] (Sound insulation test) The thermal storage boards according to Examples 1 to 5 and Comparative Example 1 were measured for floor impact sound level reduction (hereinafter referred to as reduction) in accordance with JIS A 1418. The results are shown in Table 1.

[0079] [Table 1]

[0080] It was found that the reduction in floor impact sound level of the heat storage boards according to Examples 1 and 2 was greater in the frequency range of 125 Hz to 1 kHz than that of Comparative Example 1. In particular, when the frequency was 125 Hz, the reduction in the heat storage boards according to Examples 1 and 2 was about four times that of Comparative Example 1. This is thought to be because the heat storage board of Comparative Example 1 has less space for absorbing sound, and the wood base material is more firmly bound by the heat storage sheet than in Examples 1 and 2.

[0081] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various design modifications can be made without departing from the spirit of the present invention as set forth in the claims. [Explanation of symbols]

[0082] 1A, 1B, 1C: heat storage board, 11: wood base material, 12: heat storage sheet, 13: backing material, 21: sound insulation groove, 22: wide groove, 31: ridge, X: short side direction, Y: long side direction

Claims

1. A wood base material having a plurality of sound-insulating grooves formed on the back surface thereof; A flexible heat storage sheet attached to the back surface of the wood base material; A backing material attached to the back surface of the heat storage sheet, A plurality of ridges are formed on the surface of the heat storage sheet that is attached to the wood base material, The heat storage sheet has the protrusions attached to the back surface of the wood base material so as to leave recessed spaces between adjacent protrusions, The sound-insulating grooves and the protrusions are formed in plural along at least the short side direction of the wood base material, The heat storage board, characterized in that the convex stripes extending along the short side direction are attached at positions that are out of alignment with the sound insulating grooves extending along the short side direction.

2. A heat storage board as described in Claim 1, characterized in that the heat storage sheet is an elastic sheet in which heat storage material is dispersed in a base material made of foamed resin.

3. A wide groove that is wider than the groove width of the sound-insulating groove and shallower than the depth of the sound-insulating groove is formed on the back surface of the wood base material, 3. The heat storage board according to claim 1, wherein the heat storage sheet is attached to the back surface of the wood base material so as to leave a groove space formed in the wide groove.

4. The sound-insulating grooves and the wide grooves are formed in plurality along at least the short side direction of the wood base material, The heat storage board according to claim 3, wherein the sound insulating groove and the wide groove are formed so as to overlap each other.

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