Substrate fixing device, electrostatic chuck, and method of manufacturing electrostatic chuck

Abstract

To provide a substrate fixing device, an electrostatic chuck, and a method for manufacturing an electrostatic chuck that can improve manufacturing efficiency.SOLUTION: A substrate fixing device 100 has a base plate 110, and an electrostatic chuck 120 that is fixed to the base plate and adsorbs a substrate with an electrostatic force. The electrostatic chuck has: a ceramic layer 130 that is formed by using ceramics and is in contact with the substrate to adsorb the substrate; a first heater pattern 141 that is laminated on the ceramic layer and is a heat-generating electrode; a first insulating resin layer 140 that is laminated on the first heater pattern and covers the first heater pattern; a second heater pattern 151 that is laminated on the second insulating resin layer 150 and is a heat-generating electrode; and a conductive member 170 that is in contact at both ends with opposing surfaces of the first heater pattern and the second heater pattern, and penetrates the second insulating resin layer.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a substrate fixing device, an electrostatic chuck, and a method for manufacturing an electrostatic chuck. [Background technology]

[0002] Generally, a substrate clamping device that attracts and holds a wafer, for example, when manufacturing semiconductor parts, is equipped with an electrostatic chuck (ESC) configured using a ceramic plate with a built-in electrode. The substrate clamping device has a structure in which the electrostatic chuck is fixed to a base plate, and by applying a voltage to the electrode built into the ceramic plate, the wafer is attracted to the electrostatic chuck using electrostatic force. By attracting and holding the wafer on the electrostatic chuck, processes such as micromachining and etching can be performed efficiently on the wafer.

[0003] Such electrostatic chucks may be provided with a temperature control function for controlling the temperature of the wafer. Specifically, heater electrodes may be formed by screen printing a metal paste such as tungsten, and the heater electrodes may be fired simultaneously with the formation of the ceramic plate. To achieve high thermal uniformity on the wafer-mounting surface, a technique has also been devised in which external heater electrodes are formed by etching a rolled metal foil on an insulating resin using photolithography.

[0004] One electrostatic chuck that uses an external heater electrode is being considered, in which the heater electrode is stacked in two layers on a ceramic plate and connected by vias. Dividing the heater electrode into two layers increases the degree of freedom in the design of the heater wiring, and by placing the heater electrodes in complementary positions on each layer, it is possible to further improve heat uniformity. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-100474 [Patent Document 2] Japanese Patent Application Publication No. 2018-026427 [Patent Document 3] Japanese Patent Application Laid-Open No. 2001-028036 Summary of the Invention [Problem to be solved by the invention]

[0006] However, providing an electrostatic chuck with two layers of external heater electrodes requires a process for forming vias connecting the heater electrodes of each layer, which reduces the manufacturing efficiency of the electrostatic chuck. Specifically, to form the vias, via holes are formed in the insulating resin between the two layers of heater electrodes using, for example, a laser, and then filled with a metal paste. Because the above process is performed to form one via, as the number of vias increases, the formation of the via holes and the filling of the metal paste must be repeated, which reduces the manufacturing efficiency of the electrostatic chuck.

[0007] The disclosed technology has been made in consideration of the above points, and aims to provide a substrate fixing device, an electrostatic chuck, and a method for manufacturing an electrostatic chuck that can improve manufacturing efficiency. [Means for solving the problem]

[0008] In one aspect, the substrate fixing device disclosed in the present application includes a base plate and an electrostatic chuck fixed to the base plate and configured to attract a substrate by electrostatic force, the electrostatic chuck including: a ceramic layer formed using ceramic and configured to contact and attract the substrate; a first heater pattern laminated on the ceramic layer and including a heat-generating electrode; an insulating resin layer laminated on the first heater pattern and covering the first heater pattern; a second heater pattern laminated on the insulating resin layer and including a heat-generating electrode; and a conductive member having both ends in contact with opposing surfaces of the first heater pattern and the second heater pattern, respectively, and penetrating the insulating resin layer. [Effects of the Invention]

[0009] According to one aspect of the substrate fixing device, the electrostatic chuck, and the method for manufacturing an electrostatic chuck disclosed in the present application, it is possible to achieve an effect of improving manufacturing efficiency. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view showing the configuration of a substrate fixing device according to one embodiment. [Figure 2] FIG. 2 is a schematic diagram showing a cross section of a substrate fixing device according to one embodiment. [Figure 3] FIG. 3 is a flow diagram showing a method for manufacturing a substrate fixing device according to one embodiment. [Figure 4] FIG. 4 is a diagram showing a specific example of the ceramic layer forming step. [Figure 5] FIG. 5 is a diagram showing a specific example of the first insulating resin layer laminating step. [Figure 6] FIG. 6 is a diagram showing a specific example of the first heater pattern forming step. [Figure 7] FIG. 7 is a diagram showing a specific example of the conductive member arranging step. [Figure 8] FIG. 8 is a diagram showing a specific example of the second insulating resin layer laminating step. [Figure 9] FIG. 9 is a diagram showing a specific example of the second heater pattern forming step. [Figure 10] FIG. 10 is a diagram showing a specific example of the first heater pattern. [Figure 11] FIG. 11 is a diagram showing a specific example of the second heater pattern. [Figure 12] FIG. 12 is a diagram showing a specific example of the third insulating resin layer laminating step. [Figure 13] FIG. 13 is a diagram showing a specific example of the opening forming step. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, an embodiment of a substrate fixing device, an electrostatic chuck, and a method for manufacturing an electrostatic chuck disclosed in the present application will be described in detail with reference to the drawings. However, the present invention is not limited to this embodiment.

[0012] 1 is a perspective view showing the configuration of a substrate fixing device 100 according to one embodiment. The substrate fixing device 100 shown in FIG.

[0013] The base plate 110 is a circular member made of metal such as aluminum. The base plate 110 is a base material for fixing the electrostatic chuck 120. The base plate 110 is attached to, for example, a semiconductor manufacturing device, and causes the substrate fixing device 100 to function as a semiconductor holding device for holding a wafer.

[0014] The electrostatic chuck 120 uses electrostatic force to attract an object, such as a wafer, while adjusting the temperature of the object. Specifically, the electrostatic chuck 120 is formed by stacking a ceramic layer that attracts the object and a heater layer that heats the object. The diameter of the electrostatic chuck 120 is smaller than the diameter of the base plate 110, and the electrostatic chuck 120 is fixed to the center of the base plate 110. The heater layer of the electrostatic chuck 120 is adhered to the base plate 110, thereby fixing the electrostatic chuck 120 to the base plate 110. A ceramic layer is stacked on the upper surface of the heater layer, and the attracting surface of the ceramic layer that attracts the object is exposed.

[0015] Fig. 2 is a schematic cross-sectional view taken along line II in Fig. 1. As shown in Fig. 2, the substrate fixing device 100 is configured by bonding an electrostatic chuck 120 to a base plate 110.

[0016] The base plate 110 is a metal member having a thickness of, for example, about 20 to 50 mm and having cooling water channels 111 therein that serve as flow paths for cooling water. The base plate 110 cools the electrostatic chuck 120 with cooling water that flows into the cooling water channels 111 from the outside of the substrate fixing device 100. As a result of the cooling of the electrostatic chuck 120, an object such as a wafer that is attracted to the electrostatic chuck 120 is cooled.

[0017] The base plate 110 may have a cooling gas passage that serves as a flow path for cooling gas instead of the cooling water passage 111. In short, the base plate 110 has a refrigerant passage that allows a refrigerant such as cooling water and cooling gas to pass through.

[0018] The electrostatic chuck 120 has a ceramic layer 130 , a first insulating resin layer 140 , a second insulating resin layer 150 , and a third insulating resin layer 160 , and the third insulating resin layer 160 is bonded to the base plate 110 .

[0019] Ceramic layer 130 has conductive electrode 131 inside and is a layer made of ceramic, for example, approximately 4.5 mm thick. Ceramics are obtained by firing a green sheet made of, for example, aluminum oxide. When a voltage is applied to electrode 131 of ceramic layer 130, an electrostatic force is generated, causing ceramic layer 130 to contact and adhere to an object, such as a substrate. That is, in FIG. 2, the upper surface of ceramic layer 130 serves as the adhesion surface that contacts the object, and when a voltage is applied to electrode 131, the object is attracted to the adhesion surface.

[0020] The first insulating resin layer 140 is laminated on the ceramic layer 130 and is made of an insulating resin having high thermal conductivity and high heat resistance, such as an epoxy resin or a bismaleimide triazine resin. The thickness of the first insulating resin layer 140 is, for example, about 40 to 100 μm. A first heater pattern 141 is formed on one surface of the first insulating resin layer 140 opposite to the ceramic layer 130 (the lower surface in FIG. 2).

[0021] The first heater pattern 141 is an electrode made of an alloy such as CN49 (constantan) (an alloy of Cu / Ni / Mn / Fe), geranine (an alloy of Cu / Mn / Sn), or manganin (an alloy of Cu / Mn / Ni). The first heater pattern 141 generates heat when a voltage is applied. The thickness of the first heater pattern 141 is, for example, about 25 to 50 μm, which is in the range of 15 to 200 μm.

[0022] The second insulating resin layer 150 is laminated on the first insulating resin layer 140 and covers the first heater pattern 141. Like the first insulating resin layer 140, the second insulating resin layer 150 is a layer made of an insulating resin having high thermal conductivity and high heat resistance, such as an epoxy resin or a bismaleimide triazine resin. The thickness of the second insulating resin layer 150 is, for example, about 40 to 300 μm, and is thicker than that of the first insulating resin layer 140. The second heater pattern 151 is formed on one surface of the second insulating resin layer 150 opposite to the first insulating resin layer 140 (the lower surface in FIG. 2).

[0023] The second heater pattern 151 is an electrode made of an alloy such as CN49 (constantan) (an alloy of Cu / Ni / Mn / Fe), geranine (an alloy of Cu / Mn / Sn), or manganin (an alloy of Cu / Mn / Ni). The second heater pattern 151 generates heat when a voltage is applied. The thickness of the second heater pattern 151 is, for example, about 25 to 50 μm, falling within the range of 15 to 200 μm. The second heater pattern 151 is electrically connected to the first heater pattern 141 by a conductive member 170, which will be described later.

[0024] The third insulating resin layer 160 is laminated on the second insulating resin layer 150 and covers the second heater pattern 151. Like the first insulating resin layer 140 and the second insulating resin layer 150, the third insulating resin layer 160 is a layer made of an insulating resin having high thermal conductivity and high heat resistance, such as an epoxy resin or a bismaleimide triazine resin. The thickness of the third insulating resin layer 160 is, for example, about 40 to 300 μm. A power supply portion 161 that supplies power from the base plate 110 to the second heater pattern 151 is formed in the third insulating resin layer 160.

[0025] The power supply unit 161 is a conductive member that electrically connects the base plate 110 and the second heater pattern 151. The power supply unit 161 applies a voltage supplied from the base plate 110 to the second heater pattern 151.

[0026] The conductive member 170 is embedded in the second insulating resin layer 150 and is a conductive member with one end abutting the surface of the first heater pattern 141 and the other end abutting the surface of the second heater pattern 151. The conductive member 170 is formed by cutting out a conductive adhesive sheet, which is formed by adding a conductive filler to a resin such as acrylic or urethane, into, for example, a cylindrical or rectangular shape. The diameter of the bottom surface of the conductive member 170 that abuts the first heater pattern 141 and the second heater pattern 151 is, for example, approximately 0.1 to 3 mm. The height of the conductive member 170 is equal to the distance between the opposing surfaces of the first heater pattern 141 and the second heater pattern 151, and is, for example, approximately 60 to 70 μm.

[0027] The conductive member 170 is formed from a material that can be adhered to the first heater pattern 141 in a semi-cured state and that has a higher hardness in a semi-cured state than the insulating resin that constitutes the second insulating resin layer 150. Therefore, when the second insulating resin layer 150 is laminated and pressurized with one end of the conductive member 170 adhered to the first heater pattern 141, the other end of the conductive member 170 penetrates the second insulating resin layer 150. As a result, the other end of the conductive member 170 reaches the surface of the second heater pattern 151, and both ends of the conductive member 170 come into contact with the opposing surfaces of the first heater pattern 141 and the second heater pattern 151.

[0028] In the substrate fixing device 100 configured as described above, when power is supplied from the base plate 110 to the second heater pattern 151 via the power supply unit 161, power is also supplied to the first heater pattern 141 via the conductive member 170. When a voltage is applied to the first heater pattern 141 and the second heater pattern 151, the first heater pattern 141 and the second heater pattern 151 generate heat, heating the ceramic layer 130 and the object attracted to the ceramic layer 130.

[0029] The substrate fixing device 100 adjusts the temperature of the ceramic layer 130 by heating with the first heater pattern 141 and the second heater pattern 151 and cooling with the base plate 110, and adjusts the temperature of the object to be adsorbed to the ceramic layer 130 to a desired temperature. Note that the second heater pattern 151 may function as a bypass electrode that electrically connects the electrodes of the first heater pattern 141 or electrically connects the first heater pattern 141 and the power supply unit 161, instead of functioning as a heater electrode that generates heat.

[0030] When the second heater pattern 151 is made to function as a bypass electrode, the second heater pattern 151 may be formed using a low-resistance conductor such as copper or a copper alloy. In the substrate fixing device 100, the first insulating resin layer 140, the second insulating resin layer 150, and the third insulating resin layer 160 may contain a filler such as alumina or aluminum nitride to improve the thermal conductivity of these insulating resin layers.

[0031] Next, a method for manufacturing the substrate fixing device 100 configured as above will be described with reference to the flow chart shown in FIG.

[0032] First, a ceramic layer 130 that adsorbs an object is formed (step S101). Specifically, a plurality of green sheets, each of which is primarily made of aluminum oxide, are fabricated, and an electrode 131 is formed on one surface of the green sheet as appropriate. The electrode 131 can be formed, for example, by screen-printing a metal paste on the surface of the green sheet. The plurality of green sheets are then stacked and fired to form the ceramic layer 130. The ceramic layer 130 has a layer of electrode 131 inside, as shown in FIG. 4, for example.

[0033] After the ceramic layer 130 is formed, a first insulating resin layer 140 is laminated on the surface of the ceramic layer 130 (step S102). A metal foil layer is formed on the surface of the first insulating resin layer 140 opposite the ceramic layer 130. That is, as shown in Fig. 5, for example, a metal foil layer 141a having a thickness of, for example, about 25 to 50 µm is formed on one surface of the first insulating resin layer 140 having a thickness of, for example, about 40 to 100 µm is laminated on the surface of the ceramic layer 130. The first insulating resin layer 140 and the metal foil layer 141a are bonded to the ceramic layer 130 by vacuum lamination and vacuum heating and pressure bonding using a press.

[0034] The first insulating resin layer 140 is formed using an insulating resin with high thermal conductivity and high heat resistance, such as epoxy resin or bismaleimide triazine resin. The thermal conductivity may be improved by adding a filler, such as alumina or aluminum nitride, to the first insulating resin layer 140. The metal foil layer 141a may be made of the same rolled alloys as those exemplified as the materials for the first heater pattern 141 and the second heater pattern 151. Specifically, the metal foil layer 141a may be made of an alloy such as CN49 (constantan) (an alloy of Cu / Ni / Mn / Fe), geranine (an alloy of Cu / Mn / Sn), or manganin (an alloy of Cu / Mn / Ni).

[0035] After the first insulating resin layer 140 is laminated, the metal foil layer 141a is etched using, for example, photolithography to form the first heater pattern 141 having a desired pattern (step S103). That is, a resist is formed on the upper surface of the metal foil layer 141a, and the resist is exposed and developed to form a resist pattern that covers the portion to be left as the first heater pattern 141. Then, the exposed metal foil layer 141a that is not covered by the resist pattern is removed by etching to form the first heater pattern 141 having a desired shape, as shown in FIG. 6, for example. FIG. 6 shows a cross section of the first heater pattern 141 having, for example, a double concentric circle shape.

[0036] Once the first heater pattern 141 is formed, a conductive member 170 is placed on the surface of the first heater pattern 141 (step S104). Specifically, the conductive member 170 is formed by cutting out a cylindrical shape with a bottom diameter of approximately 0.1 to 3 mm from a conductive adhesive sheet with a thickness of 40 to 100 μm, which is made of a resin such as acrylic or urethane containing a conductive filler, and is then adhered to the upper surface of the first heater pattern 141. Note that the conductive member 170 may also be formed by cutting out a cylindrical or prismatic shape from a plurality of conductive adhesive sheets that are stacked and bonded together.

[0037] 7, the conductive member 170 is disposed at a position where it is electrically connected to the second heater pattern 151 of the first heater pattern 141. Because the conductive member 170 is formed by cutting out a conductive adhesive sheet, it can be easily fixed in position by adhering the conductive member 170 to the upper surface of the first heater pattern 141. Furthermore, when the conductive member 170 is adhered to the first heater pattern 141, the resin constituting the conductive member 170 is in a semi-cured state, and the semi-cured conductive member 170 is harder than the semi-cured insulating resin laminated as the second insulating resin layer 150. Note that in order to increase the hardness of the semi-cured conductive member 170, the conductive member 170 may be heated to a certain degree after being adhered to the first heater pattern 141.

[0038] Once the conductive member 170 is placed, a second insulating resin layer 150 is laminated to cover the first heater pattern 141 (step S105). A metal foil layer is formed on the surface of the second insulating resin layer 150 opposite the first heater pattern 141. That is, as shown in FIG. 8, for example, a metal foil layer 151a having a thickness of, for example, about 25 to 50 μm is provided on one surface, and a second insulating resin layer 150 having a thickness of, for example, about 40 to 100 μm is laminated on the upper surfaces of the first insulating resin layer 140 and the first heater pattern 141. The second insulating resin layer 150 and the metal foil layer 151a are bonded to the first insulating resin layer 140 by vacuum lamination and vacuum heating and pressure bonding using a press.

[0039] The second insulating resin layer 150 is formed using an insulating resin with high thermal conductivity and high heat resistance, such as epoxy resin or bismaleimide triazine resin. The thermal conductivity may be improved by adding a filler, such as alumina or aluminum nitride, to the second insulating resin layer 150. The metal foil layer 151a may be made of the same rolled alloys as those exemplified as the materials for the first heater pattern 141 and the second heater pattern 151. Specifically, the metal foil layer 151a may be made of an alloy such as CN49 (constantan) (an alloy of Cu / Ni / Mn / Fe), geranine (an alloy of Cu / Mn / Sn), or manganin (an alloy of Cu / Mn / Ni).

[0040] Instead of functioning as a heater electrode that generates heat, the second heater pattern 151 may function as a bypass electrode that electrically connects the electrodes of the first heater pattern 141 or electrically connects the first heater pattern 141 and the power supply unit 161. When the second heater pattern 151 is made to function as a bypass electrode, a metal with low electrical resistance, such as copper or a copper alloy, may be used as the material for the metal foil layer 151a.

[0041] When the second insulating resin layer 150 is laminated, the insulating resin constituting the second insulating resin layer 150 is in a semi-cured state and has a lower hardness than the conductive member 170, so the conductive member 170 pushes away the insulating resin constituting the second insulating resin layer 150. As a result, the conductive member 170 penetrates the second insulating resin layer 150, and the upper end of the conductive member 170 abuts against the lower surface of the metal foil layer 151a formed on the surface of the second insulating resin layer 150. Therefore, one end of the conductive member 170 abuts against the upper surface of the first heater pattern 141, and the other end of the conductive member 170 abuts against the lower surface of the metal foil layer 151a. Furthermore, when the second insulating resin layer 150 is vacuum heated and pressurized and bonded, the second insulating resin layer 150 and the conductive member 170 are cured by the heat and pressure. During lamination, the second insulating resin layer 150 is pressurized and the conductive member 170 hardens, so that the conductive member 170 reliably contacts the lower surface of the metal foil layer 151a, improving the interlayer connection reliability of the two heater patterns.

[0042] After the second insulating resin layer 150 is laminated, the metal foil layer 151a is etched using, for example, photolithography to form the second heater pattern 151 having a desired pattern (step S106). That is, a resist is formed on the upper surface of the metal foil layer 151a, and the resist is exposed and developed to form a resist pattern that covers the portion to be left as the second heater pattern 151. Then, the exposed metal foil layer 151a that is not covered by the resist pattern is removed by etching to form the second heater pattern 151 having a desired shape, as shown in FIG. 9, for example. As shown in FIG. 9, the second heater pattern 151 is disposed in a position where at least a portion does not overlap with the first heater pattern 141. That is, the second heater pattern 151 is formed in a position that overlaps with the region where the first heater pattern 141 is not formed in a plan view. Furthermore, the second heater pattern 151 is formed in a region including the conductive member 170 in a position that overlaps with the first heater pattern 141 in a plan view.

[0043] Fig. 10 is a diagram showing a specific example of the first heater pattern 141. Fig. 11 is a diagram showing a specific example of the second heater pattern 151. When the first heater pattern 141 is formed in a double concentric circle shape as shown in Fig. 10, the conductive member 170 is formed in a position where it contacts each of the electrodes forming the concentric circles. When the second heater pattern 151 is formed in a position where it partially overlaps with the first heater pattern 141 in a plan view and partially does not overlap with the first heater pattern 141 as shown in Fig. 11, the conductive member 170 is formed in the part that overlaps with the first heater pattern 141 in a plan view.

[0044] As described above, in a region including the position of the conductive member 170, the first heater pattern 141 and the second heater pattern 151 overlap in a plan view, one end of the conductive member 170 abuts on the upper surface of the first heater pattern 141, and the other end of the conductive member 170 abuts on the lower surface of the second heater pattern 151. Therefore, the first heater pattern 141 and the second heater pattern 151 are electrically connected by the conductive member 170 without going through a process of forming a via. In other words, the interlayer connection between the two layers of heater patterns can be made through a simple process, and the manufacturing efficiency of the electrostatic chuck 120 and the substrate fixing device 100 can be improved.

[0045] Once the second heater pattern 151 connected to the first heater pattern 141 by the conductive member 170 is formed, a third insulating resin layer 160 is laminated to cover the second heater pattern 151 (step S107). Specifically, the semi-cured third insulating resin layer 160 is laminated so as to cover the second insulating resin layer 150 and the second heater pattern 151, and is then heated and pressurized to cure the third insulating resin layer 160. As a result, a two-layer heater is formed in which the first heater pattern 141 and the second heater pattern 151 are connected by the conductive member 170, as shown in FIG. 12, for example.

[0046] Then, openings are formed in the third insulating resin layer 160 at positions corresponding to the electrode pads of the second heater pattern 151 (step S108). That is, in order to expose the second heater pattern 151 at positions that will become the electrode pads that contact the power supply part 161, openings 161a are formed in the third insulating resin layer 160, as shown in Fig. 13, for example. This results in an electrostatic chuck 120 having two layers of heater electrodes connected by the conductive member 170.

[0047] The electrostatic chuck 120 is bonded to the base plate 110 with an adhesive (step S109). Specifically, the surface of the third insulating resin layer 160 on which the opening 161a is formed is bonded to the base plate 110 with, for example, a silane coupling agent and an adhesive. At this time, by aligning the position of the opening 161a with the position of the power supply portion 161, the power supply portion 161 and the second heater pattern 151 come into contact with each other, enabling power to be supplied to the second heater pattern 151. Furthermore, since the second heater pattern 151 is connected to the first heater pattern 141 via the conductive member 170, power can also be supplied to the first heater pattern 141. By bonding the electrostatic chuck 120 to the base plate 110, the substrate fixing device 100 is completed.

[0048] As described above, according to this embodiment, an insulating resin layer covering the first heater pattern is laminated with a conductive member disposed on the surface of the first heater pattern, and the conductive member penetrates the insulating resin layer. Then, the tip of the conductive member that penetrates the insulating resin layer is brought into contact with the second heater pattern. This allows the first heater pattern and the second heater pattern to be electrically connected by the conductive member without forming vias connecting the first heater pattern and the second heater pattern. This eliminates the need for processes such as forming via holes in the insulating resin layer and filling the via holes with metal paste, thereby improving manufacturing efficiency.

[0049] In the above embodiment, two layers of heater electrodes, the first heater pattern 141 and the second heater pattern 151, are provided on the electrostatic chuck 120. However, three or more layers of heater patterns can also be provided on the electrostatic chuck 120. Even when three or more layers of heater patterns are provided, a conductive member is disposed on the surface of each heater pattern layer, and an insulating resin layer is laminated from above, so that the conductive member penetrates the insulating resin layer and contacts the heater pattern of the upper layer. This makes it possible to easily electrically connect the heater patterns of the upper and lower layers, thereby improving manufacturing efficiency.

[0050] In the above embodiment, electrode pads are formed on the portion of the first heater pattern 141 that contacts the conductive member 170 and the portion of the second heater pattern 151 that contacts the power supply unit 161. The electrode pads are areas that have a certain diameter or more to ensure reliable connection to the conductive member 170 and the power supply unit 161, and the areas around the electrode pads tend to be blank areas of the heater pattern. This can cause the temperature around the electrode pads to drop, which can lead to a decrease in thermal uniformity.

[0051] Therefore, in the above embodiment, the electrode pads of one heater pattern may be overlapped with the other heater pattern to prevent a drop in temperature around the electrode pads and improve thermal uniformity.

[0052] Furthermore, in the above embodiment, the conductive member 170 is formed from a material in which a conductive filler is contained in a resin, but the conductive member 170 may be formed from another conductor. However, the conductive member 170 is formed from a material that is harder than the insulating resin that constitutes the second insulating resin layer 150. Therefore, when the second insulating resin layer 150 is laminated so as to cover the first heater pattern 141 on which the conductive member 170 is arranged, the end of the conductive member 170 penetrates the second insulating resin layer 150 and comes into contact with the metal foil layer 151a. [Explanation of symbols]

[0053] 110 base plate 120 Electrostatic Chuck 130 ceramic layer 131 Electrode 140 First insulating resin layer 141a, 151a Metal foil layer 141 First heater pattern 150 Second insulating resin layer 151 Second heater pattern 160 Third insulating resin layer 161 Power supply unit 161a aperture 170 Conductive materials

Claims

1. A base plate and an electrostatic chuck fixed to the base plate and configured to attract the substrate by electrostatic force; The electrostatic chuck comprises: a ceramic layer formed using ceramic and in contact with the substrate to adsorb the substrate; a first heater pattern laminated on the ceramic layer and including a heat-generating electrode; an insulating resin layer laminated on the first heater pattern and covering the first heater pattern; a second heater pattern laminated on the insulating resin layer and having a heat-generating electrode; a conductive member whose both ends contact the opposing surfaces of the first heater pattern and the second heater pattern, respectively, and which penetrates the insulating resin layer; and The conductive member is a conductive adhesive sheet containing a resin containing a conductive filler, the conductive adhesive sheet having a hardness in a semi-cured state higher than that of the insulating resin constituting the insulating resin layer; The conductive adhesive sheet is the hardness of the insulating resin layer is such that the conductive member penetrates the insulating resin layer and contacts the second heater pattern when the insulating resin layer is laminated to cover the first heater pattern with the conductive member disposed on the surface of the first heater pattern; A substrate fixing device characterized by:

2. The conductive member is The diameter of the surface in contact with the first heater pattern and the second heater pattern is in the range of 0.1 to 3 mm.

2. The substrate fixing device according to claim 1.

3. The conductive member is 2. The substrate fixing device according to claim 1, wherein the substrate fixing device is arranged at a position overlapping the first heater pattern and the second heater pattern in a plan view.

4. The ceramic layer is an electrode to which a voltage can be applied; a ceramic surrounding the electrode; 2. The substrate fixing device according to claim 1, further comprising:

5. a ceramic layer formed using ceramic and adapted to adsorb an object; a first heater pattern laminated on the ceramic layer and including a heat-generating electrode; an insulating resin layer laminated on the first heater pattern and covering the first heater pattern; a second heater pattern laminated on the insulating resin layer and having a heat-generating electrode; a conductive member whose both ends contact the opposing surfaces of the first heater pattern and the second heater pattern, respectively, and which penetrates the insulating resin layer; and The conductive member is a conductive adhesive sheet containing a resin containing a conductive filler, the conductive adhesive sheet having a hardness in a semi-cured state higher than that of the insulating resin constituting the insulating resin layer; The conductive adhesive sheet is the hardness of the insulating resin layer is such that the conductive member penetrates the insulating resin layer and contacts the second heater pattern when the insulating resin layer is laminated to cover the first heater pattern with the conductive member disposed on the surface of the first heater pattern; Electrostatic chuck characterized by:

6. forming an electrode and a ceramic layer made of ceramic surrounding the electrode; forming a first heater pattern having a heat-generating electrode laminated on the ceramic layer; a conductive member is disposed on a surface of the first heater pattern; an insulating resin layer having a metal layer on one surface thereof is laminated so as to cover the surface of the first heater pattern on which the conductive member is arranged; forming a second heater pattern on the metal layer; The step of laminating the insulating resin layer includes: The conductive member is caused to penetrate the insulating resin layer and come into contact with the metal layer. Electrostatic chuck manufacturing method.

7. The step of disposing the conductive member includes: a conductive member formed of a material harder than the insulating resin constituting the insulating resin layer, and disposed on the surface of the first heater pattern; 7. The method for manufacturing an electrostatic chuck according to claim 6.

8. The step of disposing the conductive member includes: A semi-cured conductive member made of a material containing a conductive filler in a resin is adhered to the surface of the first heater pattern.

7. The method for manufacturing an electrostatic chuck according to claim 6.

9. The step of disposing the conductive member includes: The conductive material adhered to the surface of the first heater pattern is heated and cured to a predetermined degree.

9. The method for manufacturing an electrostatic chuck according to claim 8.

Images