Substrate transfer device capable of layer movement

Abstract

To provide a substrate transfer device capable of moving a layer of a substrate to increase the processing amount in a limited area.SOLUTION: The substrate transfer device according to the invention of the present application includes: a first moving plate; a second moving plate located below the first moving plate; a shuttle for storing the substrate, the shuttle moving on the first moving plate and the second moving plate; and a first layer transfer connected to the first moving plate and the second moving plate, the first layer transfer moving the shuttle on one of the first moving plate and the second moving plate to the other of the first moving plate and the second moving plate.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a substrate transfer device, and more particularly to a substrate transfer device capable of layer-by-layer movement of a substrate. [Background technology]

[0002] Reducing the area of ​​equipment used in semiconductor or display processes is extremely important. For example, by reducing the area occupied by a substrate transfer device, more equipment can be installed and operated within a factory, thereby improving productivity and production capacity. Furthermore, by optimizing space usage within a factory through area reduction, space utilization efficiency increases, which is advantageous for cost reduction. By shortening transfer paths, production lines can be optimized by reducing transfer time during the production process. Therefore, a technology is needed to increase the throughput per unit area of ​​equipment used in semiconductor processes. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Korean Patent Registration No. 10-1757865 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide a substrate transfer device capable of layer-by-layer substrate movement to increase throughput in a limited area. [Means for solving the problem]

[0005] According to one embodiment, a substrate transfer device may include a first moving plate, a second moving plate located below the first moving plate, a shuttle configured to move on the first moving plate or the second moving plate and accommodate a substrate, and a first layer transfer connected to the first moving plate and the second moving plate and configured to move the shuttle from one of the first moving plate to the other of the second moving plate.

[0006] Here, one end of the first layer transfer may be connected to the first moving plate, and the other end may be connected to the second moving plate.

[0007] Here, the first layer transfer may be configured in a spiral shape including a curved surface.

[0008] Here, the first moving plate includes a first side and a second side, the second moving plate includes a third side corresponding to the first side and a fourth side corresponding to the second side, one end of the first layer transfer may be connected to the first moving plate so as to be closer to the first side than the second side, and the other end of the first layer transfer may be connected to the second moving plate so as to be closer to the fourth side than the third side.

[0009] Here, the first moving plate and the second moving plate include magnetic levitation rails, and the shuttle can be magnetically levitated by the magnetic levitation rails and move on the first moving plate or the second moving plate.

[0010] Here, the device may further include a third moving plate disposed adjacent to the first moving plate, and a first link connected to the first moving plate and the third moving plate and configured to move the shuttle above one of the first moving plate and the third moving plate and above the other.

[0011] Here, the device may further include a second layer transfer connected to the second moving plate and the third moving plate and configured to move the shuttle from one of the second moving plate and the third moving plate to the other.

[0012] Here, the second moving plate may include a third side and a fourth side, the first layer transfer may be connected to the first moving plate so as to be closer to the fourth side than the third side, and the second layer transfer may be connected to the first moving plate so as to be closer to the third side than the fourth side.

[0013] Here, the device may further include a fourth moving plate disposed adjacent to the second moving plate, and a second link connected to the second moving plate and the fourth moving plate and configured to move the shuttle above one of the second moving plate and the fourth moving plate and above the other.

[0014] Here, the device may further include a third layer transfer connected to the first moving plate and the fourth moving plate and configured to move the shuttle from one of the first moving plate and the fourth moving plate to the other.

[0015] Here, the first moving plate may include a first side and a second side, the first layer transfer may be connected to the first moving plate so as to be closer to the first side than the second side, and the third layer transfer may be connected to the first moving plate so as to be closer to the second side than the first side.

[0016] Here, the first layer transfer may include a protector for preventing the shuttle from colliding or crashing. [Effects of the Invention]

[0017] According to one embodiment of the present invention, a substrate transfer device capable of layer-by-layer movement of a substrate is provided, thereby increasing the throughput in a limited area. [Brief explanation of the drawings]

[0018] [Figure 1] 1 is a diagram illustrating a substrate transfer process using a substrate transfer apparatus according to an embodiment; [Figure 2] 10 is a view illustrating a substrate transfer process using a substrate transfer apparatus according to another embodiment; [Figure 3] 1 is a view illustrating a substrate transfer device capable of moving a layer according to an embodiment; [Figure 4] 1 illustrates a side view of a substrate transfer apparatus capable of layer movement according to one embodiment. [Figure 5] 10 is a view illustrating a substrate transfer device capable of moving a layer according to another embodiment; [Figure 6] 10 is a view illustrating a substrate transfer device capable of moving a layer according to another embodiment; DETAILED DESCRIPTION OF THE INVENTION

[0019] The embodiments described in this specification are intended to clearly explain the concept of the present invention to those having ordinary skill in the art to which the present invention pertains, and therefore the present invention is not limited to the embodiments described in this specification, and the scope of the present invention should be interpreted as including modifications or variations that do not deviate from the concept of the present invention.

[0020] The terms used in this specification are currently widely used and general terms that are selected in consideration of their functions in the present invention, but these terms may change depending on the intentions of those skilled in the art to which the present invention pertains, precedents, the emergence of new technologies, etc. However, when a specific term is defined and used with an arbitrary meaning, the meaning of the term will be separately described. Therefore, the terms used in this specification should be defined based on the substantive meaning of the term and the overall content of this specification, rather than simply by the name of the term.

[0021] The drawings attached to this specification are intended to facilitate the explanation of the present invention, and the shapes illustrated in the drawings are exaggerated as necessary to facilitate understanding of the present invention, and therefore the present invention is not limited by the drawings.

[0022] In this specification, if it is determined that a detailed description of a known structure or function related to the present invention may obscure the gist of the present invention, the detailed description thereof will be omitted as necessary.

[0023] FIG. 1 is a view illustrating a substrate transfer process using a substrate transfer apparatus according to an embodiment.

[0024] Referring to FIG. 1, an embodiment of a substrate transfer apparatus may include at least one of a plurality of processing chambers 112-138, a moving plate 140, magnetic levitation rails 142-148, a plurality of arms 152, 154, and a plurality of shuttles 162, 164.

[0025] The first shuttle 162 and / or the second shuttle 164 can each move along the magnetic levitation rails 142-148 to transfer a substrate (the following description will focus on the first shuttle 162). Specifically, the first shuttle 162 can acquire a substrate from any one of the plurality of processing chambers 112-138 and transfer the acquired substrate along the magnetic levitation rails 142-146. The substrate can then be transferred to the load lock chamber 170 by at least one of the plurality of arms 152, 154.

[0026] The magnetic levitation rails 142 to 148 may include a plurality of regions. Specifically, the magnetic levitation rails 142 to 148 may include a first rail region 142 arranged along the vertical direction on one side edge of the moving plate 140 and / or a second rail region 146 arranged along the vertical direction on the other side edge of the moving plate 140.

[0027] The magnetic levitation rails 142 to 148 may include a third rail section 144 and / or a fourth rail section 148 configured to connect the first rail section 142 and the second rail section 146. In this case, the third rail section 144 and / or the fourth rail section 148 may be arranged along the lateral direction of the moving plate 140 as shown in FIG.

[0028] Meanwhile, the magnetic levitation rails 142 to 148 may include an area for stopping one of the shuttles 162, 164 to prevent the shuttles from colliding with each other while the shuttles are moving. In this manner, the area for stopping may be included in a specific area of ​​the magnetic levitation rails 142 to 148. Alternatively, the area for stopping may be selected as a specific area of ​​the magnetic levitation rails 142 to 148 based on the moving direction and / or position of the shuttles 162, 164.

[0029] Additionally or alternatively, the magnetic levitation rails 142-148 may include a third rail region 144 and / or a fourth rail region 148 for moving one of the plurality of shuttles 162, 164 from one side edge of the moving plate 140 (i.e., the first rail region 142) to the other side edge of the moving plate 140 (i.e., the second rail region 146).

[0030] The plurality of shuttles 162, 164 may include a first shuttle 162 and / or a second shuttle 164. While the plurality of shuttles 162, 164 is illustrated in Figure 1 as including two shuttles, this is not limiting. For example, the plurality of shuttles 162, 164 may include three or more shuttles.

[0031] Each of the multiple shuttles 162, 164 can accommodate one or more substrates. For example, any of the multiple shuttles 162, 164 can load a substrate to be processed in any one of the multiple processing chambers 112 to 138 and transfer the substrate to that processing chamber. For another example, any of the shuttles can load a substrate that has been processed in any one of the processing chambers and transfer the substrate to the load lock chamber 170.

[0032] The second shuttle 164 can stop at a predetermined other area among the magnetic levitation rails 142-148 so that a route including one area among the magnetic levitation rails 142-148 is provided for the first shuttle 162. In this case, the shuttle among the multiple shuttles 162, 164 that stops at the other area can be determined to be a shuttle located relatively close to the other area.

[0033] Specifically, the first shuttle 162 is moving upward along the first rail area 142, and the second shuttle 164 is moving downward along the first rail area 142. In this case, the second shuttle 164, which is located relatively close to the fourth rail area 148 set in another area, can move to the fourth rail area 148 and stop there.

[0034] Therefore, the first shuttle 162 can continue to move along the first rail area 142. However, the area where the second shuttle 164 stops is not limited to the fourth rail area 148. For example, if the first shuttle 162 needs to be provided with a route that includes another area, the second shuttle 166 may stop in another area.

[0035] 1 illustrates an example in which multiple shuttles 162, 164 move along the same rail region, but is not limited to this. For example, the first shuttle 162 may be moving from the first rail region 142 to the second rail region 146 via the third rail region 144, and the second shuttle 164 may be moving from the second rail region 146 to the first rail region 142 via the third rail region 144.

[0036] In this case, the first shuttle 162 located relatively close to the fourth rail area 148 can move to the second rail area 146 via the fourth rail area 148. Accordingly, the second shuttle 164 can move to the first rail area 142 via the third rail area 144. That is, the movement direction and / or stopping position of the multiple shuttles 162, 164 can be controlled so that they do not collide with each other.

[0037] In this case, the movement direction and / or stopping position of each of the shuttles 162, 164 may be determined so as to minimize the total movement direction of the shuttles 162, 164. With this configuration, the substrate transfer apparatus can provide an efficient flow path for the shuttles 162, 164, thereby improving throughput and reducing energy consumption.

[0038] FIG. 2 is a view illustrating a substrate transfer process using a substrate transfer apparatus according to another embodiment.

[0039] 2, a substrate transfer apparatus according to another embodiment may include a first moving plate 100, another moving plate 102, and a link 110 connecting the first and second moving plates. In addition, the substrate transfer apparatus may include multiple processing chambers, magnetic levitation rails, multiple arms, and multiple shuttles, as in the substrate transfer apparatus of FIG.

[0040] The substrate throughput can be improved through the substrate transfer apparatus of Figure 2. Specifically, one of the processing chambers connected to the movable plate 100 can fail. In this case, the shuttle can move onto another movable plate 102 connected to the movable plate 100 via a link 110. The shuttle transfers the substrate to a normal processing chamber connected to the other movable plate 102, allowing the substrate to undergo processing that would have been performed in the failed processing chamber.

[0041] In this way, the link 110 can act as a bridge connecting the moving plates. The shuttle can move between the moving plates via the link 110, thereby increasing the throughput through efficient substrate processing. Although Fig. 2 illustrates a rectangular link 110, the shape of the link 110 is not limited thereto and may be various shapes such as a circle, an ellipse, a wave shape, an arch shape, a step shape, a diagonal shape, a sliding shape, etc.

[0042] According to one embodiment, the link 110 may be embodied to have an adjustable length. Since the distance between the moving plates may not be fixed at a specific value, the link 110 may be adjustable to an appropriate length. For example, the link 110 may be embodied as a slide type, a type including multiple ends, etc., but is not limited thereto.

[0043] To increase the substrate throughput, the movable plates may be connected adjacently or vertically. Specifically, by using a second movable plate disposed below the first movable plate, it is possible to move to an alternative processing chamber in the event of a processing chamber failure or to a processing chamber for performing another process. In this case, a structure capable of moving a shuttle between the movable plates disposed above and below is required.

[0044] The present invention provides a substrate transfer device capable of layer movement, which includes a layer transfer mechanism that enables layer movement of a shuttle. The substrate transfer device capable of layer movement will be described in detail below with reference to FIGS. 3 to 7.

[0045] FIG. 3 is a view illustrating a substrate transfer device capable of moving a layer according to an embodiment.

[0046] 3, a substrate transfer device capable of layer movement according to one embodiment may include a first moving plate 100, a second moving plate 101, a third moving plate 102, and a fourth moving plate 103. The substrate transfer device may also include a plurality of processing chambers disposed adjacent to each moving plate, a plurality of arms disposed on each moving plate, a magnetic levitation rail, and a plurality of shuttles.

[0047] A second moving plate 101 may be located below the first moving plate 100. In this case, the second moving plate 101 may be disposed to correspond to the first moving plate 100. Specifically, when viewed from above, the central axes or central points of the first moving plate 100 and the second moving plate 101 may overlap. However, the present invention is not limited thereto, and the position of the second moving plate 101 does not have to correspond to the first moving plate 100 and may be disposed freely.

[0048] The first moving plate 100 and the third moving plate 102 may be arranged on the same layer. The first moving plate 100 and the third moving plate 102 may be connected to a first link 196. Therefore, the shuttle positioned on the first moving plate 100 can move onto the third moving plate 102 via the first link 196.

[0049] The third moving plate 102 may be disposed in a straight line with the first moving plate 100. Specifically, when viewed from the front, the center points or axes of the first moving plate 100 and the third moving plate 102 may overlap. However, this is not limited thereto, and the third moving plate 102 may be freely disposed in a position other than in a straight line with the first moving plate 100.

[0050] A fourth moving plate 103 may be located below the third moving plate 102. The fourth moving plate 103 may be disposed to correspond to the third moving plate 102. Specifically, when viewed from above, the central axes or central points of the third moving plate 102 and the fourth moving plate 103 may overlap. However, the present invention is not limited thereto, and the position of the third moving plate 102 does not have to correspond to the position of the fourth moving plate 103, and may be disposed freely.

[0051] The second moving plate 101 and the fourth moving plate 103 may be arranged on the same layer. The second moving plate 101 and the fourth moving plate 103 may be connected to a second link (not shown). Therefore, the shuttle positioned on the second moving plate 101 can move onto the fourth moving plate 103 through the second link.

[0052] The first moving plate 100 and the second moving plate 101 may be connected by a first layer transfer 191. The first layer transfer 191 may be connected to the first moving plate 100 and the second moving plate 101 and configured to move the shuttle from one of the first moving plate 100 and the second moving plate 101 to the other.

[0053] The first moving plate 100 may include a first side surface 181 and a second side surface 182. The first side surface 181 may be disposed adjacent to a first processing chamber group including a plurality of processing chambers. The second side surface 182 may be disposed adjacent to a second processing chamber group including a plurality of processing chambers. In this case, the first processing chamber group and the second processing chamber group may be disposed facing each other.

[0054] Similar to the first moving plate 100, the second moving plate 101 may include a third side 183 corresponding to the first side 181 and a fourth side 184 corresponding to the second side 182. The third side 183 may be disposed adjacent to a third processing chamber group including a plurality of processing chambers. The fourth side 184 may be disposed adjacent to a fourth processing chamber group including a plurality of processing chambers. In this case, the third processing chamber group and the fourth processing chamber group may be disposed opposite each other. In this case, the third processing chamber group may be disposed below the first processing chamber group, and the fourth processing chamber group may be disposed below the second processing chamber group.

[0055] One end of the first layer transfer 191 may be connected to the first moving plate 100, and the other end may be connected to the second moving plate 101. The first layer transfer 191 may be configured in a spiral shape including a curved surface as shown in FIG. 3. However, the first layer transfer 191 is not limited to this and may have various shapes such as a stepped shape or a rectangular shape. Furthermore, although the spiral shape in FIG. 3 is illustrated as a half-turn, the first layer transfer 191 is not limited to this and may be a spiral shape twisted multiple times, such as one and a half turns.

[0056] The first layer transfer 191 may include a protector (not shown) to prevent the shuttles from colliding or falling. Specifically, two or more shuttles may move on the first layer transfer 191. In this case, the movement direction on the first layer transfer 191 may be set to prevent the two or more shuttles from colliding with each other.

[0057] For example, like a highway, shuttles moving from the upper layer to the lower layer along the left / right traffic and shuttles moving from the lower layer to the upper layer can follow a certain path. At this time, a protector to prevent collisions between shuttles can be placed along the certain path (e.g., the center of the first layer transfer 191) like the center line guardrail of a highway. At this time, the shape of the protector can be various, such as a guardrail shape or a rod shape. In addition, the material of the protector can be various, such as a sponge material or a cushion material that can absorb impact force.

[0058] The first layer transfer 191 may also include a protector (not shown) disposed to prevent the shuttle from falling outward while in motion. For example, the protector may be disposed on the outer side of the first layer transfer 191, but is not limited to this. The shape of the protector may be various, such as a guardrail or a rod shape. The material of the protector may also be various, such as a sponge material or a cushion material that can absorb impact force.

[0059] One end of the first layer transfer 191 may be connected to the first moving plate 100 so as to be closer to the first side 181 than to the second side 182 of the first moving plate 100. In addition, the other end of the first layer transfer 191 may be connected to the second moving plate 101 so as to be closer to the fourth side 184 than to the third side 183 of the second moving plate 101. Therefore, when viewed from above, one end and the other end of the first layer transfer 191 may be located close to different sides of the first moving plate 100 or the second moving plate 101.

[0060] A magnetic levitation rail may be disposed on one side of the first layer transfer 191. The shuttle may be magnetically levitated by the magnetic levitation rail of the first layer transfer 191 and move to the second moving plate 101 on the first moving plate 100, or vice versa. For example, a first processing chamber disposed adjacent to the first moving plate 100 may be broken. In this case, the shuttle may use the first layer transfer 191 to move the substrate to the second processing chamber disposed adjacent to the second moving plate 101.

[0061] The shuttle can move from the layer (upper layer) of the first moving plate 100 to the layer (lower layer) of the second moving plate 101 through the first layer transfer 191. The shuttle can transfer substrates to a second processing chamber that performs the same process as the first processing chamber. In this way, since layers can be switched through the first layer transfer 191, the substrate throughput can be improved.

[0062] The third moving plate 102 and the fourth moving plate 103 may also be connected by a layer transfer 190. The layer transfer 190 may be connected to the third moving plate 102 and the fourth moving plate 103 and configured to move the shuttle from one of the third moving plate 102 and the fourth moving plate 103 to the other.

[0063] The third moving plate 102 may include a fifth side 185 and a sixth side 186, similar to the first moving plate 100. The fifth side 185 may be disposed adjacent to a fifth processing chamber group including a plurality of processing chambers. The sixth side 186 may be disposed adjacent to a sixth processing chamber group including a plurality of processing chambers. In this case, the fifth processing chamber group and the sixth processing chamber group may be disposed facing each other.

[0064] Like the third moving plate 102, the fourth moving plate 103 may include a seventh side 187 corresponding to the fifth side 185 and an eighth side 188 corresponding to the sixth side 186. The seventh side 187 may be disposed adjacent to a seventh processing chamber group including a plurality of processing chambers. The eighth side 188 may be disposed adjacent to an eighth processing chamber group including a plurality of processing chambers. In this case, the seventh processing chamber group and the eighth processing chamber group may be disposed opposite each other. In this case, the seventh processing chamber group may be disposed below the fifth processing chamber group, and the eighth processing chamber group may be disposed below the sixth processing chamber group.

[0065] One end of the layer transfer 190 connected to the third moving plate 102 and the fourth moving plate 103 may be connected to the third moving plate 102, and the other end may be connected to the fourth moving plate 103. The layer transfer 190 may be configured in a spiral shape including a curved surface as shown in Fig. 3. However, the shape of the layer transfer is not limited thereto, and may be various other shapes such as a step shape, a rectangle shape, etc.

[0066] One end of the layer transfer 190 may be connected to the third moving plate 102 so as to be closer to the fifth side 185 than to the sixth side 186 of the third moving plate 102. In addition, the other end of the layer transfer 190 may be connected to the fourth moving plate 103 so as to be closer to the eighth side 188 than to the seventh side 187 of the fourth moving plate 103. Therefore, when viewed from above, one end and the other end of the layer transfer 190 may be located close to different sides of the third moving plate 102 or the fourth moving plate 103.

[0067] Furthermore, the layer transfer 190 may be disposed symmetrically with the first layer transfer 191. Specifically, although Fig. 3 illustrates one end of the layer transfer 190 being closely connected to the fifth side 185 corresponding to the first side 181, one end of the layer transfer 190 may alternatively be closely connected to the sixth side 186. In this case, the other end of the layer transfer 190 may be connected to the seventh side 187 rather than the eighth side 188. In this case, the layer transfer 190 and the first layer transfer 191 may be disposed symmetrically with each other.

[0068] A magnetic levitation rail may be disposed on one side of the layer transfer 190. The shuttle may be magnetically levitated by the magnetic levitation rail of the layer transfer 190 and move from the third moving plate 102 to the fourth moving plate 103, or vice versa. For example, the fifth processing chamber disposed adjacent to the third moving plate 102 may be damaged. In this case, the shuttle may use the layer transfer 190 to move the substrate to the seventh processing chamber disposed adjacent to the fourth moving plate 103.

[0069] The shuttle can move from the layer (upper layer) of the third moving plate 102 to the layer (lower layer) of the fourth moving plate 103 through the layer transfer 190. The shuttle can transfer the substrate to the seventh processing chamber, which performs the same process as in the fifth processing chamber. In this way, since layers can be switched through the layer transfer 190, the substrate throughput can be improved.

[0070] Also, for example, the fifth processing chamber arranged adjacent to the third moving plate 102 and the first processing chamber arranged adjacent to the first moving plate 100 may fail. In this case, the shuttle may move onto the first moving plate 100 via the first link 196 on the third moving plate 102 to move the substrate to the seventh processing chamber arranged adjacent to the fourth moving plate 103. Also, the shuttle may move onto the second moving plate 101 on the first moving plate 100 using the first layer transfer 191.

[0071] In this way, the shuttle can move freely between the moving plates horizontally using the first link 196 and the second link, and can move freely between the moving plates vertically using the layer transfer 190 and the first layer transfer 191.

[0072] Conventional substrate transfer devices utilize additional equipment such as elevators for layer movement. However, the substrate transfer device capable of layer movement of the present invention has an advantage of having a simple structure using magnetic levitation rails arranged on a moving plate and a layer transfer connected to the moving plate. Therefore, hardware design and installation are easy, and costs can be reduced.

[0073] FIG. 4 is a side view of a substrate transfer device capable of layer movement according to one embodiment.

[0074] 4, a substrate transfer device capable of layer movement according to an embodiment may include an upper moving plate 401, a lower moving plate 402, and a layer transfer 430. The substrate transfer device may also include a first magnetic levitation rail 410 disposed on the upper moving plate 401, a second magnetic levitation rail 420 disposed on the lower moving plate 402, and a shuttle 300 configured to be movable on the magnetic levitation rails.

[0075] One side of the layer transfer 430 may be connected to the upper moving plate 401, and the other side may be connected to the lower moving plate 402. A magnetic levitation rail is disposed on one side of the layer transfer 430, so that the shuttle 300 can move between the upper moving plate 401 and the lower moving plate 402 by the magnetic levitation rail.

[0076] Although FIG. 4 illustrates the layer transfer 430 having a spiral shape including a curved surface, the shape of the layer transfer 430 is not limited to this and may be various other shapes such as a slide shape or a step shape.

[0077] The shuttle 300 may be configured to accommodate a substrate therein. The shuttle 300 may include permanent magnets 340 arranged to face the magnetic levitation rails. While FIG. 4 illustrates two permanent magnets arranged on the bottom of the shuttle 300, the number of permanent magnets is not limited thereto and may be one, three, four, etc. The permanent magnets 340 magnetically levitate the shuttle 300 by the attractive or repulsive force with the electromagnets of the magnetic levitation rails 410 and 420. The shuttle 300 magnetically levitates on the first magnetic levitation rail 410 or the second magnetic levitation rail 420 using the permanent magnets 340 to deliver substrates to a processing chamber or move substrates processed in the processing chamber.

[0078] The shuttle 300 may include a first space 310 and a second space 320 configured to accommodate at least one substrate. In this case, the first space 310 and the second space 320 may be separated from each other. The environments of the first space 310 and the second space 320 may be set to be different from each other. For example, the first space 310 may be set to a vacuum state, and the second space 320 may be set to a non-vacuum state. Furthermore, for example, the environments of the first space 310 and the second space 320, such as temperature and / or humidity, may be set to be different from each other.

[0079] The first space 310 and the second space 320 may be arranged along one axis. For example, as shown in Fig. 4, the first space 310 and the second space 320 may be arranged along an axis perpendicular to the ground. In this case, the first space 310 may be arranged above the second space 320. In this case, the lateral area occupied by the shuttle 300 on the moving plate is small, which may result in efficient movement.

[0080] Alternatively, the first space 310 and the second space 320 may be arranged along an axis parallel to the ground. Specifically, unlike Fig. 4, the first space 310 and the second space 320 may be arranged side by side. In this case, the vertical area occupied by the moving plate may be reduced.

[0081] The first space 310 and the second space 320 may accommodate different types of substrates. Specifically, the first space 310 may accommodate substrates to be processed in the processing chamber, and the second space 320 may accommodate substrates that have been processed in the processing chamber. The shuttle 300 accommodates substrates before and after processing in the processing chamber separately, thereby preventing confusion between the pre- and post-processing substrates.

[0082] Furthermore, since the first space 310 and the second space 320 of the shuttle 300 are separated from each other, it is possible to provide an optimized environment for each of the substrates before and after processing. For example, the first space 310 accommodates the substrate before processing in a vacuum state, and the second space 320 accommodates the substrate after processing in a non-vacuum state, so that the shuttle 300 can provide an optimized environment for each substrate.

[0083] The shuttle 300 may include a support 350 capable of supporting a substrate accommodated therein. Specifically, the first space 310 and / or the second space 320 of the shuttle 300 may include a support 350 configured to support a substrate. The substrate is placed on the support 350 and can be moved via the shuttle 300. The support 350 may support an unprocessed substrate, a processed substrate, a dummy substrate, or a substrate-shaped sensor. In this case, the dummy substrate may refer to a test substrate for evaluating the stability, performance, etc. of the entire device.

[0084] According to an embodiment, a friction member may be disposed on one surface of the support 350. Specifically, the friction member may be disposed on one surface of the support 350 that contacts the rear surface of the substrate. In this case, the friction member may include a material with a high friction coefficient so that the supported substrate does not vibrate due to minute vibrations of the shuttle 300. For example, the friction member may be made of neoprene or rubber, but is not limited to these.

[0085] The shuttle 300 may include at least one sensor (not shown) therein. Specifically, a sensor for sensing the internal environment may be disposed in the first space 310 and / or the second space 320 of the shuttle 300. The sensor may be, but is not limited to, a temperature sensor, a humidity sensor, a vibration sensor, a weight sensor, or a gradient sensor.

[0086] For example, the first space 310 or the second space 320 may include a sensor that can measure the weight or tilt of the substrate. Also, for example, the first space 310 or the second space 320 may include a sensor that can check whether the temperature / humidity or vacuum state of each space is properly set. In this case, the sensor may have the same shape as the substrate, but is not limited to this.

[0087] The sensor can sense not only the environment inside the shuttle 300 but also the overall environmental information of the substrate transfer device. Specifically, when the shuttle 300 enters a processing chamber, the sensor can sense environmental information inside the processing chamber. Also, when the shuttle 300 enters a load lock chamber, the sensor can sense environmental information inside the load lock chamber. In this way, the substrate transfer device can sense environmental information inside the device using the sensor of the shuttle 300.

[0088] FIG. 5 is a view illustrating a substrate transfer device capable of moving layers according to another embodiment.

[0089] Referring to FIG. 5, a substrate transfer apparatus capable of layer movement according to another embodiment may include a moving plate and a transfer having another shape in addition to the substrate transfer apparatus of FIG.

[0090] The substrate transfer device may include a layer transfer that connects two diagonally positioned moving plates. Specifically, the substrate transfer device may include a second layer transfer 192 that is connected to the second moving plate 101 and the third moving plate 102 and configured to move the shuttle from one of the second moving plate 101 and the third moving plate 102 to the other.

[0091] The second moving plate 101 may be connected to the first layer transfer 191 and the second layer transfer 192 so that they are adjacent to different sides of each other. Specifically, the first layer transfer 191 may be disposed adjacent to the fourth side 184 of the second moving plate 101, and the second layer transfer 192 may be disposed adjacent to the third side 183 of the second moving plate 101.

[0092] The third moving plate 102 may be closely connected to the layer transfer 190 and the second layer transfer 192 on different sides. Specifically, the layer transfer 190 may be disposed close to the fifth side 185 of the third moving plate 102, and the second layer transfer 192 may be closely connected to the sixth side 186.

[0093] The second layer transfer 192 may be disposed so as to cross the layer transfer 190 and the first layer transfer 191. When viewed from the front of the substrate transfer device, the second layer transfer 192 has a point where it crosses the layer transfer 190 and the first layer transfer 191.

[0094] By introducing the second layer transfer 192, the substrate transfer device of the present invention can provide movement not only between the moving plates located above and below the shuttle, but also between the moving plates located diagonally.

[0095] FIG. 6 is a view illustrating a substrate transfer device capable of moving layers according to another embodiment.

[0096] Referring to FIG. 6, a substrate transfer apparatus capable of layer movement according to another embodiment may include a moving plate and a transfer having another shape in addition to the substrate transfer apparatus of FIG.

[0097] The substrate transfer device may include a layer transfer connecting two diagonally positioned moving plates. Specifically, the substrate transfer device may include a third layer transfer 193 connected to the first moving plate 100 and the fourth moving plate 103 and configured to move the shuttle from one of the first moving plate 100 and the fourth moving plate 103 to the other.

[0098] The first moving plate 100 may be connected to the first layer transfer 191 and the third layer transfer 193 so that they are close to different sides of each other. Specifically, the first layer transfer 191 may be disposed close to the first side 181 of the first moving plate 100, and the third layer transfer 193 may be disposed close to the second side 182 of the first moving plate 100.

[0099] The fourth moving plate 103 may be closely connected to the layer transfer 190 and the third layer transfer 193 on different sides. Specifically, the layer transfer 190 may be disposed close to the eighth side 188 of the fourth moving plate 103, and the third layer transfer 193 may be closely connected to the seventh side 187.

[0100] The third layer transfer 193 may be positioned so as not to cross the layer transfer 190 and the first layer transfer 191. When viewed from the front of the substrate transfer device, the second layer transfer 192 may not have a point where it crosses the layer transfer 190 and the first layer transfer 191. However, if the layer transfer 190 is symmetrical to the first layer transfer 191, the position and connection form of the third layer transfer 193 may also vary depending on the situation.

[0101] By introducing the third layer transfer 193, the substrate transfer device of the present invention can provide movement not only between the movable plates located above and below the shuttle, but also between the movable plates located diagonally.

[0102] Methods according to the embodiments may be embodied in the form of program instructions that can be executed by various computer means and recorded on a computer-readable medium. The computer-readable medium may include, alone or in combination, program instructions, data files, data structures, and the like. The program instructions recorded on the computer-readable medium may be specially designed and constructed for the embodiments, or may be known and available to those skilled in the art of computer software. Examples of computer-readable mediums include magnetic media such as hard disks, flexible disks, and magnetic tapes, optical media such as CD-ROMs and DVDs, magneto-optical media such as floptical disks, and hardware devices specially configured to store and execute program instructions, such as ROM, RAM, flash memory, and the like. Examples of program instructions include not only machine language code, such as produced by a compiler, but also high-level language code that can be executed by a computer using an interpreter, etc. The hardware devices may be configured to operate as one or more software modules to perform processes according to the present invention, or vice versa.

[0103] Although the embodiments have been described above with reference to limited examples and drawings, those skilled in the art will appreciate that various modifications and variations may be made to the foregoing description. For example, the techniques described may be performed in a different order than described, and / or the components of the described systems, structures, devices, circuits, etc. may be combined or combined in a different manner than described, or may be replaced or substituted by other components or equivalents, and still achieve suitable results.

[0104] Accordingly, other implementations, other embodiments, and equivalents of the claims are within the scope of the following claims. [Explanation of symbols]

[0105] 100 First moving plate 101 Second moving plate 102 Third moving plate 103 4th Moving Plate 191 1st Layer Transfer 192 Second Layer Transfer

Claims

1. A first moving plate; a second moving plate that is spaced apart from the first moving plate and is positioned below the first moving plate with at least a portion overlapping the first moving plate in a plan view; a shuttle configured to move on the first moving plate or the second moving plate and to receive a substrate; a first layer transfer coupled to the first moving plate and the second moving plate and configured to move the shuttle from one of the first moving plate to the other of the second moving plate; a fourth moving plate disposed adjacent to the second moving plate; a second link connected to the second moving plate and the fourth moving plate and configured to move the shuttle from one of the second moving plate to the other of the fourth moving plate; the first moving plate includes a first side and a second side; the second moving plate includes a third side surface on the same side as the first side surface in a plan view and a fourth side surface on the same side as the second side surface in a plan view, one end of the first layer transfer is connected to the first moving plate so as to be closer to the first side than to the second side; The other end of the first layer transfer plate is connected to the second moving plate so as to be closer to the fourth side than to the third side.

2. The substrate transfer apparatus of claim 1 , wherein the first layer transfer member has a spiral shape including a curved surface.

3. the first moving plate and the second moving plate include magnetic levitation rails; The substrate transfer device of claim 1 , wherein the shuttle is magnetically levitated by the magnetic levitation rails and moves on the first moving plate or the second moving plate.

4. a third moving plate disposed adjacent to the first moving plate; 2. The substrate transfer device of claim 1, further comprising a first link connected to the first moving plate and the third moving plate to move the shuttle from one of the first moving plate to the other of the third moving plate.

5. 5. The substrate transfer apparatus of claim 4, further comprising a second layer transfer coupled to the second moving plate and the third moving plate to move the shuttle from one of the second moving plate to the other of the third moving plate.

6. 6. The substrate transfer apparatus of claim 5, wherein the second layer transfer member is connected to the second moving plate so as to be closer to the third side than to the fourth side.

7. 2. The substrate transfer apparatus of claim 1, further comprising a third layer transfer coupled to the first moving plate and the fourth moving plate to move the shuttle from one of the first moving plate to the other of the fourth moving plate.

8. 8. The substrate transfer apparatus of claim 7, wherein the third layer transfer member is connected to the first moving plate so as to be closer to the second side than to the first side.

9. 2. The substrate transfer apparatus of claim 1, wherein the first layer transfer includes a protector for preventing the shuttle from colliding with or falling.

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