Mounting pad, mounting mechanism, and substrate transport mechanism

Abstract

To provide a mounting pad, a mounting mechanism, and a substrate transport mechanism that can reduce sticking of a substrate to the mounting mechanism.SOLUTION: A mounting pad for mounting an object includes a base and an annular outer edge provided on one surface of the base, protruding in a direction intersecting the surface direction of the surface so as to surround the outer edge of the surface, and capable of contacting an object, and at least one portion of the outer edge has a thickness that is different from the thickness of another portion of the outer edge.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a mounting pad, a mounting mechanism, and a substrate transport mechanism. [Background technology]

[0002] Substrate processing apparatuses having multiple substrate processing chambers are known that perform substrate processing such as film formation and etching on substrates (hereinafter also referred to as wafers) in a vacuum atmosphere. In such substrate processing apparatuses, substrates are transferred from a container containing multiple substrates placed in the atmosphere to a load lock module by a substrate transfer mechanism in an atmospheric transfer chamber maintained in an atmospheric atmosphere. The load lock module can switch its interior between vacuum and atmospheric pressure, and substrates are transferred between the atmospheric transfer chamber and the vacuum transfer chamber. Substrates are transferred to each substrate processing chamber by a substrate transfer mechanism in a vacuum transfer chamber maintained in a vacuum atmosphere.

[0003] The substrate transfer mechanism in the atmospheric transfer chamber holds the substrate using, for example, a mounting mechanism provided at the tip of a transfer arm. The mounting mechanism is provided with a vacuum suction pad that holds the substrate by vacuum suction (Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-029388 Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a mounting pad, a mounting mechanism, and a substrate transport mechanism that can reduce sticking of a substrate to the mounting mechanism. [Means for solving the problem]

[0006] A mounting pad according to one aspect of the present disclosure is a mounting pad for placing an object on it, and comprises a base and an annular outer edge portion provided on one surface of the base, protruding in a direction intersecting the surface direction so as to surround the outer edge of the surface, and capable of contacting the object, wherein the thickness of at least one portion of the outer edge portion is different from the thickness of other portions of the outer edge portion. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to reduce the sticking of a substrate to a mounting mechanism. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram illustrating an example of a processing system according to a first embodiment of the present disclosure. [Figure 2] FIG. 2 is a diagram showing an example of the relative position between the placement mechanism of the atmospheric transfer robot and the substrate in the first embodiment. [Figure 3] FIG. 3 is a diagram showing an example of a cross section near the mounting pad of the mounting mechanism in the first embodiment. [Figure 4] FIG. 4 is a diagram showing an example of the mounting pad and its variations in the first embodiment. [Figure 5] FIG. 5 is a diagram showing an example of a variation of the mounting pad. [Figure 6] FIG. 6 is a diagram showing an example of a variation of the mounting pad. [Figure 7] FIG. 7 is a diagram showing an example of a deformation image of the mounting pad. [Figure 8] FIG. 8 is a diagram showing an example of a starting point of peeling of the substrate due to the teeth. [Figure 9] FIG. 9 is a diagram showing an example of the relationship between the orientation of the teeth and the mounting pads. [Figure 10] FIG. 10 is a diagram showing an example of the relationship between the center of the substrate and the orientation of the mounting pads. [Figure 11] FIG. 11 is a diagram showing an example of a variation of the mounting pad in the first modification. [Figure 12] FIG. 12 is a diagram showing an example of the relative positions of the mounting mechanism, the substrate, and the support table in the second modification. [Figure 13] FIG. 13 is a diagram showing another example of a cross section near the mounting pad of the mounting mechanism in the third modification. [Figure 14] FIG. 14 is a diagram showing an example of a cross section near the mounting pad of the mounting mechanism in the second embodiment. [Figure 15] FIG. 15 is a diagram showing an example of a mounting pad in the second embodiment. [Figure 16] FIG. 16 is a diagram showing an example of displacement of the outer edge of the mounting pad. [Figure 17] FIG. 17 is a diagram showing an example of a mounting pad in the fourth modification. [Figure 18] FIG. 18 is a graph showing an example of the displacement amount in the Z-axis direction in the second embodiment and the fourth modification. [Figure 19] FIG. 19 is a graph showing an example of the amount of displacement in the radial direction in the second embodiment and the fourth modification. [Figure 20] FIG. 20 is a diagram showing an example of a mounting pad in the fifth modification. [Figure 21] FIG. 21 is a diagram showing an example of a mounting pad in the sixth modification. [Figure 22] FIG. 22 is a diagram showing an example of a mounting pad in the seventh modification. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the mounting pad, mounting mechanism, and substrate transport mechanism will be described in detail with reference to the accompanying drawings. However, the disclosed technology is not limited to the following embodiments.

[0010] The substrate transport mechanism in the atmospheric transfer chamber, for example, in a container that accommodates multiple substrates, releases vacuum suction and moves the placement mechanism downward to place a substrate on a tee. The tee is a platform on which a substrate is placed inside the container that accommodates multiple substrates. At this time, the substrate must be quickly released from the vacuum suction pad of the placement mechanism. However, even after releasing the vacuum suction, the substrate may remain stuck to the vacuum suction pad. In this state, if the transfer arm attempts to transport another substrate, the previous substrate may still be stuck to the placement mechanism while it is still attached to the placement mechanism. This can result in the substrates colliding with each other and breaking, or the previous substrate may become dislodged midway, causing a transport error. Therefore, it is desirable to reduce substrate sticking to the placement mechanism.

[0011] (First embodiment) [Processing system configuration] Fig. 1 is a diagram showing an example of a processing system according to a first embodiment of the present disclosure. As shown in Fig. 1, the processing system PS is a system capable of performing various processes such as plasma processing on a substrate. The processing system PS includes vacuum transfer modules TM1 and TM2, process modules PM1 to PM12, load lock modules LL1 and LL2, an atmospheric transfer module LM, an aligner AN, a storage SR, and the like.

[0012] Each of the vacuum transfer modules TM1 and TM2 has a substantially rectangular shape in a plan view. The vacuum transfer module TM1 has two opposing side surfaces to which process modules PM1 to PM6 are connected. Of the other two opposing side surfaces of the vacuum transfer module TM1, one side surface is connected to load lock modules LL1 and LL2, and the other side surface is connected to a path (not shown) for connection to the vacuum transfer module TM2. The side surface of the vacuum transfer module TM1 to which the load lock modules LL1 and LL2 are connected is angled in accordance with the two load lock modules LL1 and LL2. The vacuum transfer module TM2 has two opposing side surfaces to which process modules PM7 to PM12 are connected. Of the other two opposing side surfaces of the vacuum transfer module TM2, one side surface is connected to a path (not shown) for connection to the vacuum transfer module TM1. The vacuum transfer modules TM1 and TM2 each have a vacuum chamber with a vacuum atmosphere, and vacuum transfer robots TR1 and TR2 are disposed inside the vacuum transfer module TM1, respectively.

[0013] The vacuum transfer robots TR1 and TR2 are configured to be able to rotate, extend, and move up and down freely. The vacuum transfer robots TR1 and TR2 transfer objects based on operation instructions output by a control unit CU, which will be described later. For example, the vacuum transfer robot TR1 holds the object on placement mechanisms EE11 and EE12 located at its tip, and transfers the object between load lock modules LL1 and LL2, process modules PM1 to PM6, and paths (not shown). For example, the vacuum transfer robot TR2 holds the object on placement mechanisms EE21 and EE22 located at its tip, and transfers the object between process modules PM7 to PM12 and paths (not shown). The placement mechanisms are also called end effectors, picks, or forks.

[0014] The objects to be transferred include substrates and consumable parts. The substrates are, for example, semiconductor wafers. The consumable parts are replaceably installed in the process modules PM1 to PM12 and are consumed by various processes such as plasma processing performed in the process modules PM1 to PM12. The consumable parts include, for example, members constituting the ring assemblies and showerheads arranged in the process modules PM1 to PM12.

[0015] Each of the process modules PM1 to PM12 has a processing chamber and a stage (mounting table) located inside. After a substrate is placed on the stage, each of the process modules PM1 to PM12 reduces the pressure inside, introduces processing gas, applies RF power to generate plasma, and performs plasma processing on the substrate. The vacuum transfer modules TM1 and TM2 and the process modules PM1 to PM12 are separated by a gate valve G1 that can be opened and closed.

[0016] The load-lock modules LL1 and LL2 are located between the vacuum transfer module TM1 and the atmospheric transfer module LM. The load-lock modules LL1 and LL2 have internal pressure-variable chambers whose interiors can be switched between vacuum and atmospheric pressure. The load-lock modules LL1 and LL2 have stages located inside. When transferring substrates from the atmospheric transfer module LM to the vacuum transfer module TM1, the load-lock modules LL1 and LL2 maintain atmospheric pressure inside the modules, receive the substrates from the atmospheric transfer module LM, and then reduce the pressure inside the modules before transferring the substrates into the vacuum transfer module TM1. When transferring substrates from the vacuum transfer module TM1 to the atmospheric transfer module LM, the load-lock modules LL1 and LL2 maintain vacuum inside the modules, receive the substrates from the vacuum transfer module TM1, and then increase the pressure inside the modules to atmospheric pressure before transferring the substrates into the atmospheric transfer module LM. The load-lock modules LL1 and LL2 and the vacuum transfer module TM1 are separated by a gate valve G2 that can be freely opened or closed. The load-lock modules LL1 and LL2 and the atmospheric transfer module LM are separated by a gate valve G3 that can be freely opened or closed.

[0017] The atmospheric transfer module LM is disposed opposite the vacuum transfer module TM1. The atmospheric transfer module LM may be, for example, an EFEM (Equipment Front End Module). The atmospheric transfer module LM is a rectangular parallelepiped atmospheric transfer chamber equipped with an FFU (Fan Filter Unit) and maintained at atmospheric pressure. Two load lock modules LL1 and LL2 are connected to one longitudinal side of the atmospheric transfer module LM. Load ports LP1 to LP4 are connected to the other longitudinal side of the atmospheric transfer module LM. A container C that contains multiple substrates (e.g., 25 substrates) is placed on the load ports LP1 to LP4. The container C may be, for example, a FOUP (Front-Opening Unified Pod). An atmospheric transfer robot TR3 that transfers the transfer target is disposed within the atmospheric transfer module LM.

[0018] The atmospheric transfer robot TR3 is configured to be movable along the longitudinal direction of the atmospheric transfer module LM, and is also configured to be able to rotate, extend, and move up and down freely. The atmospheric transfer robot TR3 transfers the transfer target object based on operation instructions output by a control unit CU, which will be described later. For example, the atmospheric transfer robot TR3 holds the transfer target object on a placement mechanism EE31 located at the tip, and transfers the transfer target object between the load ports LP1 to LP4, the load lock modules LL1 and LL2, the aligner AN, and the storage SR.

[0019] The aligner AN is connected to one side surface of the atmospheric transfer module LM along the short side. However, the aligner AN may also be connected to a side surface of the atmospheric transfer module LM along the long side. The aligner AN may also be provided inside the atmospheric transfer module LM. The aligner AN includes a support base, an optical sensor (neither of which are shown), and the like. The aligner here is a device that detects the position of the transfer target object.

[0020] The support table is a table that can rotate around an axis extending in the vertical direction and is configured to support a substrate thereon. The support table is rotated by a drive unit (not shown). The drive unit is controlled by a control unit CU, which will be described later. When the support table is rotated by the power from the drive unit, the substrate placed on the support table also rotates.

[0021] The optical sensor detects the edge of the substrate while it rotates. Based on the edge detection result, the optical sensor detects the amount of deviation of the angular position of the substrate's notch (or another marker) relative to a reference angular position and the amount of deviation of the substrate's center position relative to the reference position. The optical sensor outputs the amount of deviation of the notch's angular position and the amount of deviation of the substrate's center position to the control unit CU (described later). Based on the amount of deviation of the notch's angular position, the control unit CU calculates the amount of rotation of the rotary support table to correct the notch's angular position to the reference angular position. The control unit CU controls a drive device (not shown) to rotate the rotary support table by this amount. This allows the notch's angular position to be corrected to the reference angular position. Furthermore, the control unit CU controls the position of the placement mechanism EE31 of the atmospheric transfer robot TR3 when receiving the substrate from the aligner AN, based on the amount of deviation of the substrate's center position, so that the center position of the substrate coincides with a predetermined position on the placement mechanism EE31 of the atmospheric transfer robot TR3.

[0022] The storage SR is connected to a side surface along the longitudinal direction of the atmospheric transfer module LM. However, the storage SR may be connected to a side surface along the lateral direction of the atmospheric transfer module LM. The storage SR may also be provided inside the atmospheric transfer module LM. The storage SR stores objects to be transferred.

[0023] The processing system PS is provided with a control unit CU. The control unit CU may be, for example, a computer. The control unit CU includes a CPU (Central Processing Unit), RAM (Random Access Memory), ROM (Read Only Memory), an auxiliary storage device, etc. The CPU operates based on a program stored in the ROM or the auxiliary storage device and controls each part of the processing system PS. For example, the control unit CU outputs operation instructions to the vacuum transfer robots TR1 and TR2, the atmospheric transfer robot TR3, etc. The operation instructions include, for example, instructions to hold the transfer target on the placement mechanisms EE11, EE12, EE21, EE22, and EE31 arranged at the tip and transfer the transfer target between each module, etc.

[0024] [Details of the EE31 mounting mechanism] Next, the details of the placement mechanism EE31 of the atmospheric transfer robot TR3 will be described with reference to Figures 2 and 3. Figure 2 is a diagram showing an example of the relative position between the placement mechanism of the atmospheric transfer robot and the substrate in the first embodiment. Figure 2(a) is a plan view of the placement mechanism EE31 holding a substrate W. Figure 2(b) is a cross-sectional view of the placement mechanism EE31 holding a substrate W, showing the cross-section taken along dashed line 5B-5B in Figure 2(a).

[0025] The mounting mechanism EE31 has a substantially U-shape in plan view. The mounting mechanism EE31 includes a plurality of suction holes V1, a suction path V2, etc. The suction path V2 is an example of an exhaust path. The mounting mechanism EE31 holds the underside of the substrate W by vacuum suction using the plurality of suction holes V1. A mounting pad 10 is provided in the suction hole V1. The mounting pad 10 is made of, for example, engineering plastic, and its mounting direction can be changed and it can be replaced. The plurality of suction holes V1 are connected to an exhaust device V4 via the suction path V2 and an exhaust pipe V3. The exhaust device V4 includes a valve, a regulator, a vacuum pump, etc., and sucks air from the suction path V2 and the exhaust pipe V3 while adjusting the pressure.

[0026] FIG. 3 is a diagram showing an example of a cross section of the mounting pad and its vicinity of the mounting mechanism in the first embodiment. FIG. 3 shows a portion of the cross section taken along dashed line 6B-6B in FIG. 2(a). As shown in FIG. 3, the mounting pad 10 corresponds to the suction hole V1 and is attached to a pad attachment portion V11 provided on one surface (e.g., the upper surface) of the mounting mechanism EE31 via a bracket 20. The bracket 20 is fastened to the mounting mechanism EE31 with a screw 22 while an O-ring 21 keeps the suction hole V1 airtight. The mounting pad 10 is fastened to the bracket 20 with a screw (not shown). Note that the portion 23 of the mounting pad 10 that contacts the bracket 20 may be glued. In this case, the area of ​​the base 11 of the mounting pad 10 can be reduced because a screw hole (not shown) is not required.

[0027] Next, the mounting pad 10 and its variations will be described with reference to Fig. 4 to Fig. 6. Fig. 4 is a diagram showing an example of the mounting pad and its variations in the first embodiment. Fig. 5 and Fig. 6 are diagrams showing an example of the mounting pad variations.

[0028] The mounting pad 10 and mounting pad 30 shown in FIG. 4 have a shape that includes a portion where the thickness of the outer edge is different from the thickness of the remaining portion of the outer edge in the circumferential direction of the outer edge, creating a peeling starting point. The thickness of the outer edge is the dimension across the inner and outer edges of the outer edge. The mounting pad 10 has an outer edge 12 that is annular and higher than the circular base 11. That is, the outer edge 12 is provided on one surface of the base 11 and protrudes in a direction intersecting the surface direction so as to surround the outer edge of the surface, making it annular and capable of contacting the target object (substrate W). Here, the direction intersecting the surface direction may be a direction between 30 and 150 degrees relative to the surface, a direction between 60 and 120 degrees relative to the surface, a direction approximately perpendicular to the surface (approximately 90 degrees), or a direction at 90 degrees. As a result, when the mounting pad 10 vacuum-sucks the substrate W, the space within the base 11 surrounded by the outer edge 12 is sucked. The mounting pad 10 has an opening 13 in the center of a base 11. The opening 13 communicates with a suction hole V1 and a suction path V2 via a bracket 20. The base 11 also has a plurality of screw holes 14 formed on the outer periphery of the opening 13. The opening 13 and the screw holes 14 are examples of through holes. The diameter of the through holes is preferably 1 to 5 mm, and more preferably 2 to 3 mm.

[0029] The mounting pad 10 is fastened to the bracket 20 with screws (not shown) that correspond to the screw holes 14. In the mounting pad 10, six screw holes 14 are provided to form a circular base 11, but other shapes are also possible. For example, three screw holes 14 may be provided to form a triangular base 11. The mounting pad 10 has one or more recesses 16 on the inner circumferential surface 15 of the outer edge 12. In the example shown in FIG. 4, two recesses 16 are provided at opposing positions. Furthermore, two or more portions of the outer edge 12 with different thicknesses (recesses 16) may be provided at positions rotationally symmetrical with respect to the center of the base 11 as the rotation axis. In the mounting pad 10, the thickness of the outer edge 12, i.e., the thickness of the outer edge 12 that comes into contact with the substrate W, differs between a region 17 where the recesses 16 are present and a region 18 where the recesses 16 are not present. That is, in at least one portion (region 17) of the outer edge 12, the thickness of the outer edge 12 is different from the thickness of the other portion (region 18) of the outer edge 12. In the case of the mounting pad 10, the region 17 is the starting point of peeling. That is, by providing the recessed portion 16 in the mounting pad 10, it is possible to reduce the sticking of the substrate W to the mounting mechanism EE31.

[0030] The mounting pad 30 is one example of a variation of the mounting pad 10. The mounting pad 30 has an outer edge 32 that is annular and higher than a circular base 31. Like the mounting pad 10, the mounting pad 30 has an opening 33 in the center of the base 31, and multiple screw holes 34 on the outer periphery of the opening 33. Like the mounting pad 10, the mounting pad 30 is fastened to the bracket 20 with screws (not shown) that correspond to the screw holes 34. The mounting pad 30 has one or more convex portions 36 on the outer circumferential surface 35 of the outer edge 32. In the example shown in FIG. 4, three convex portions 36 are provided at equal intervals around the circumference, forming an outline resembling a triangular rice ball. In the mounting pad 30, the thickness of the outer edge 32, i.e., the thickness of the outer edge 32 that comes into contact with the substrate W, differs between a region 37 where the convex portions 36 are present and a region 38 where the convex portions 36 are not present. In the case of the mounting pad 30, peeling starts from the region 38. That is, by providing the region 38 on the mounting pad 30, it is possible to reduce the sticking of the substrate W to the mounting mechanism EE31.

[0031] The mounting pads 40 and 50 shown in FIG. 5 have shapes that create peeling starting points by providing corners on the outer periphery. The mounting pads 40 and 50 also include portions with varying thicknesses along the periphery where the outer periphery contacts the substrate W. The mounting pad 40 has an outer periphery 42 that is annularly elevated relative to a circular base 41. Like the mounting pad 10, the mounting pad 40 has an opening 43 in the center of the base 41, and multiple screw holes 44 on the outer periphery of the opening 43. Like the mounting pad 10, the mounting pad 40 is fastened to the bracket 20 with screws (not shown) that correspond to the screw holes 44. The mounting pad 40 has one or more corners 46 on the outer periphery 45 of the outer periphery 42. In the example shown in FIG. 5, five corners 46 are provided at equally spaced positions along the periphery, giving the outer periphery 42 a pentagonal shape. That is, the inner peripheral surface of the outer edge 42 is circular, and the outer peripheral surface is formed by corners 46 and flat surfaces. The inner peripheral surface of the outer edge 42 may be elliptical. Furthermore, the outer shape of the outer edge 42 is not limited to a pentagon, but may be polygonal. By providing the corners 46 in the mounting pad 40, the corners 46 become the starting points of peeling, making it easier for the substrate W to peel off. Note that in the mounting pad 40 as well, the thickness of the outer edge 42, i.e., the thickness of the outer edge 42 that comes into contact with the substrate W, differs between a region 47 where the corners 46 are present and a region where the corners 46 are not present. Therefore, it can be understood that the region 47 or the region where the corners 46 are not present becomes the starting point of peeling.

[0032] The mounting pad 50 has an outer edge 52 that is annular and higher than the circular base 51. Similar to the mounting pad 10, the mounting pad 50 has an opening 53 in the center of the base 51, and multiple screw holes 54 around the opening 53. Similarly to the mounting pad 10, the mounting pad 50 is fastened to the bracket 20 with screws (not shown) that correspond to the screw holes 54. The mounting pad 50 has one or more corners 56 on the outer peripheral surface 55 of the outer edge 52. In the example shown in FIG. 5 , six corners 56 are provided at equally spaced positions around the periphery, and the angles forming the corners 56 are smaller than those of the corners 46 of the mounting pad 40. Lines 57 connecting both sides of the outer peripheral surface 55 are provided between the corners 56. In other words, the outer edge 52 has a star-shaped outline. The corners 56 of the mounting pad 50 serve as starting points for peeling, making the substrate W more likely to peel off. Furthermore, in the mounting pad 50, the thickness of the outer edge 52, i.e., the thickness of the outer edge 52 that comes into contact with the substrate W, differs between the region 58 where the corner 56 exists and the region where the corner 56 does not exist, for example, the region where the line 57 exists, and therefore it can be said that the region 58 or the region where the line 57 exists is the starting point of peeling.

[0033] The mounting pads 60 and 70 shown in FIG. 6 have recessed portions on the outer periphery of their outer edges, which serve as deformation points, making the entire mounting pad more susceptible to deformation and creating peeling starting points. The mounting pads 60 and 70 also include portions with varying thicknesses along the periphery where the outer edges come into contact with the substrate W. The mounting pad 60 has an outer edge 62 that is higher than a circular base 61. Like the mounting pad 10, the mounting pad 60 has an opening 63 in the center of the base 61 and multiple screw holes 64 on the outer periphery of the opening 63. Like the mounting pad 10, the mounting pad 60 is fastened to the bracket 20 with screws (not shown) that correspond to the screw holes 64. The mounting pad 60 has one or more recessed portions 66 on the outer periphery 65 of the outer edge 62. In the example shown in FIG. 6, two recessed portions 66 are provided at opposing positions. By providing the recessed portion 66 in the mounting pad 60, the mounting pad 60 deforms with the recessed portion 66 as a starting point.

[0034] Here, the deformation of the mounting pad 60 in the direction of the arrow 68 will be described with reference to FIG. 7 . FIG. 7 is a diagram showing an example of deformation of the mounting pad. As shown in FIG. 7 , when the mounting mechanism EE31 mounts the substrate W, the mounting pad 60 is viewed from the side. As shown in FIG. 7 , the mounting pad 60 deforms from a region 67, where the opposing recessed portion 66 is located, to a downwardly convex shape, as shown in state 80 to state 81. In this case, the region 67 separates from the substrate W before other portions. That is, in the mounting pad 60, the region 67 where the recessed portion 66 is located serves as the starting point for peeling, making the substrate W more likely to peel off. Note that, in the mounting pad 60, the thickness of the outer edge 62, i.e., the thickness of the outer edge that comes into contact with the substrate W, differs between the region 67 where the recessed portion 66 is located and the region where the recessed portion 66 is not located. Therefore, the region 67 can also be considered as the starting point for peeling.

[0035] Returning to the description of FIG. 6 , the mounting pad 70 has an outer edge 72 that is formed in a circular shape and higher than the circular base 71. Similar to the mounting pad 10, the mounting pad 70 has an opening 73 in the center of the base 71, and multiple screw holes 74 on the outer periphery of the opening 73. Similar to the mounting pad 10, the mounting pad 70 is fastened to the bracket 20 with screws (not shown) that correspond to the screw holes 74. The mounting pad 70 has one or more recessed portions 76 on the outer periphery 75 side of the outer edge 72. In the example of FIG. 6 , two recessed portions 76 are provided at opposing positions. The mounting pad 70 also has an annular groove 78 formed near the boundary between the base 71 and the outer edge 72. By providing the grooves 78 in addition to the recessed portions 76 in the mounting pad 70, the mounting pad 70 is more likely to deform starting from the recessed portions 76. The deformation of the mounting pad 70 is similar to that of the mounting pad 60 shown in FIG. 7 when viewed from the arrow 79. That is, in the mounting pad 70, the region 77 where the recessed portion 76 exists becomes the starting point of peeling, making it easier for the substrate W to peel off. In the mounting pad 70, the thickness of the outer edge 72, i.e., the thickness of the outer edge that comes into contact with the substrate W, differs between the region 77 where the recessed portion 76 exists and the region where the recessed portion 76 does not exist. Therefore, it can be understood that the region 77 becomes the starting point of peeling. In addition, in the mounting pads 60, 70, screw holes 64, 74 far from the region 67, 77 that is the deformation point, for example, screw holes 64, 74 located approximately 90 degrees circumferentially from the region 67, 77, may not be provided so that the mounting pad itself is more likely to deform.

[0036] Next, the relationship between the orientations of the teeth 90 and the various mounting pads, and the orientations of the various mounting pads and the center of the substrate W will be described with reference to FIGS. 8 to 10. FIG. 8 is a diagram showing an example of a peeling start point of a substrate caused by the teeth. FIG. 8 shows, for example, a state in which a substrate W is placed on the teeth 90 of a container C placed on a load port LP1. In FIG. 8, when the mounting mechanism EE31 is moved downward, both ends of the substrate W come into contact with the teeth 90, becoming peeling start points 91. At this time, it is possible that the directions in which peeling starts on the mounting pads at the tip 92 and the base 93 of the mounting mechanism EE31 are different. Note that the peeling start points are set by breaking the symmetry of the mounting pads at the suction holes V1 at both the tip 92 and the base 93. Furthermore, the positions of the suction holes V1 at the tip 92 and the base 93 are assumed to be equidistant from the center of the substrate W. The line 94 connects the center of the substrate W to the suction hole V1 in the base portion 93. The region 90a represents the portion where the substrate W can come into contact with the teeth 90.

[0037] FIG. 9 is a diagram showing an example of the relationship between the orientations of the teeth and the mounting pads. Examples 95 and 96 shown in FIG. 9 show an example of the direction from which peeling begins at the tip 92 on the right side in FIG. 8. Note that the tip 92 on the left side in FIG. 8 is the same except that it is inverted laterally, so it is omitted. In Examples 95 and 96, three or more mounting pads 30 or 70 are provided at positions equidistant from the center of the substrate W, as shown in FIG. 8. In Example 95, when a mounting pad 30 is used, the mounting pad is arranged so that the region 38 faces the tooth 90. In Example 96, when a mounting pad 70 is used, the mounting pad is arranged so that the region 77 faces the tooth 90. In other words, at least two mounting pads 30 or 70 are arranged so that the outer edge 32 or 72 (region 38 or region 77) with the thinnest outer edge thickness that comes into contact with the substrate W, which is the transport target, faces the tooth 90. The direction of the teeth 90 includes the direction in the range where an extension of a straight line connecting the center of the mounting pad 30 or the mounting pad 70 with the region 38 or the region 77 passes through the region 90a. In other words, the mounting pad 30 or the mounting pad 70 is arranged so that at least one of the thinnest portions of the outer edge 32 or the outer edge 72 faces the portion (region 90a) where the substrate W placed on the mounting mechanism EE31 can come into contact with the teeth 90, which serve as a base. That is, in Examples 95 and 96, by bringing the peeling start point 91 of the teeth 90 closer to the regions 38 and 77, which are the peeling start points of the mounting pads 30 and 70, sticking of the substrate W can be reduced. Note that, at the tip 92 in FIG. 8 , the direction toward the center of the substrate W is different from the direction toward the peeling start point of the mounting pads 30 and 70.

[0038] FIG. 10 is a diagram showing an example of the relationship between the substrate center and the orientation of the mounting pad. Meanwhile, Examples 97 to 99 shown in FIG. 10 show examples of the direction in which peeling begins at the base portion 93. In Example 97, when a mounting pad 30 is used, the region 38 is oriented on a line 94 representing the center direction of the substrate W, and is arranged so that the region 38 faces the center of the substrate W. In Example 98, when a mounting pad 30 is used, the region 38 is oriented on a line 94 representing the center direction of the substrate W, and is arranged so that the region 38 faces the outer edge of the substrate W. In other words, Example 98 shows the mounting pad 30 of Example 97 rotated 180 degrees. In Example 99, when a mounting pad 70 is used, the region 77 is oriented on a line 94 representing the center direction of the substrate W. That is, at least one mounting pad 30 or mounting pad 70 is arranged so that the outer edge 32 or outer edge 72 (region 38 or region 77) having the smallest thickness in contact with the substrate W is positioned on a straight line connecting the center of the substrate W and the mounting pad 30 or mounting pad 70. That is, in Examples 97 to 99, by aligning the center of the substrate W with the regions 38 and 77, which are the starting points for peeling of the mounting pads 30 and 70, sticking of the substrate W can be reduced.

[0039] Next, Modifications 1 to 3 will be described with reference to Figs. 11 to 13. Fig. 11 is a diagram showing an example of a variation of the mounting pad in Modification 1. Similar to the mounting pad 70, the mounting pad 100 of Modification 1 shown in Fig. 11 has a shape in which recesses are provided on the outer periphery of the outer edge as deformation points, making the entire mounting pad more likely to deform and creating starting points for peeling. Note that the mounting pad 100 also includes portions in which the thickness of the outer edge that comes into contact with the substrate W varies in the circumferential direction of the outer edge.

[0040] The mounting pad 100 has an outer edge 102 that is formed in a circular shape and higher than a circular base 101. Similar to the mounting pad 10, the mounting pad 100 has an opening 103 in the center of the base 101, and multiple screw holes 104 are provided around the opening 103. Similar to the mounting pad 10, the mounting pad 100 is fastened to the bracket 20 with screws (not shown) that correspond to the screw holes 104. The mounting pad 100 has one or more recessed portions 106 provided on the outer peripheral surface 105 of the outer edge 102. In the example of FIG. 11 , two recessed portions 106 are provided at opposing positions. Furthermore, two screw holes 104 are provided on a straight line connecting the two opposing recessed portions 106. In other words, in the mounting pad 100, the portions of the outer edge 102 where the thickness varies (recessed portions 106) and the through-holes (openings 103, screw holes 104) are arranged on a straight line. Furthermore, the mounting pad 100 has an annular groove 108 formed near the boundary between the base 101 and the outer edge 102. By providing the groove 108 along with the recessed portion 106, the mounting pad 100 is more likely to deform, with the recessed portion 106 serving as the starting point. The deformation of the mounting pad 100 is similar to that of the mounting pad 60 shown in FIG. 7 as viewed by an arrow 109. In other words, in the mounting pad 100, the region 107 where the recessed portion 106 exists serves as the starting point for peeling, making it easier for the substrate W to peel off. In the mounting pad 100, the thickness of the outer edge 102, i.e., the thickness of the outer edge that comes into contact with the substrate W, differs between the region 107 where the recessed portion 106 exists and the region where the recessed portion 106 does not exist. Therefore, the region 107 can also be regarded as the starting point for peeling.

[0041] FIG. 12 is a diagram showing an example of the relative positions of the mounting mechanism, substrate, and support table in Modification 2. The support table 110 of Modification 2 shown in FIG. 12 is a support table for the aligner AN and has a mounting pad 10 at its center, similar to that of the mounting mechanism EE31. In other words, the support table 110 is an example of a mounting mechanism. Note that the mounting pad 10 is not shown in FIG. 12. FIG. 12 also shows a state in which the substrate W placed on the mounting mechanism EE31 has been transferred to the support table 110 of the aligner AN. In the support table 110, similar to the mounting mechanism EE31, the suction holes of the mounting pad 10 (not shown) are connected to an exhaust device via a suction path and an exhaust pipe, and the substrate W is sucked and held by suction. Thereafter, when the substrate W is unloaded from the aligner AN and lifted by the mounting mechanism EE31, the recessed portion 16 of the mounting pad 10 becomes the starting point of peeling, thereby reducing the sticking of the substrate W to the support table 110.

[0042] FIG. 13 is a diagram showing another example of a cross section near the mounting pad of the mounting mechanism in Modification 3. As shown in FIG. 13, mounting pad 120 of Modification 3 corresponds to suction hole V1 and is attached by screw 121 to pad attachment portion V12 provided on one surface (e.g., the upper surface) of mounting mechanism EE31a. The mounting pad 120 has an upper portion of suction hole V1 connected to a central opening 126. An O-ring 123 is provided as a sealing member on the rear surface of mounting pad 120 (corresponding to the rear surface of base 11) around mounting hole 122 of screw 121. Screw 121 is an example of a fastening member, and mounting hole 122 is an example of a through-hole. That is, in mounting pad 120, at least one of the through-holes is a fastening hole for a fastening member (screw 121). 13, an O-ring 123, which is a sealing member, is disposed between the base of the mounting pad 120 and the pad attachment portion V12 and so as to surround all of the through-holes. By disposing the O-ring 123 so as to surround the screw 121 in this manner, it is possible to ensure close contact between the mounting pad 120 and the pad attachment portion V12 in a contact region 124 between the mounting pad 120 and the pad attachment portion V12, which is from the center of the mounting pad 120 to the O-ring 123. Furthermore, a gap 125 is formed between the pad attachment portion V12 and the outer edge of the mounting pad 120, which is located on the outer periphery side of the O-ring 123. By providing this gap 125, a flexure is provided in the mounting pad 120, allowing the outer edge of the mounting pad 120 to be more closely attached to the substrate W.

[0043] (Second embodiment) In the above-described third modification, the central opening 126 of the mounting pad 120, to which the suction hole V1 is connected, and the mounting hole 122 of the mounting pad 120 are provided separately. However, the mounting pad may be attached to the mounting mechanism with a fastening member such as a screw having a through-hole. This embodiment will be described as the second embodiment. Note that the processing system in the second embodiment is similar to that of the first embodiment, and therefore a description of the overlapping configuration and operation will be omitted.

[0044] Fig. 14 is a diagram showing an example of a cross section near the mounting pad of the mounting mechanism in the second embodiment. As shown in Fig. 14, the mounting mechanism EE31b of the second embodiment has a pad mounting portion V13, a mounting pad 200, and a screw 201 instead of the pad mounting portion V12, mounting pad 120, and screw 121 of Modification Example 3. Furthermore, the mounting mechanism EE31b of the second embodiment has a suction hole V1a formed in the screw 201 and a plurality of suction holes V1b formed in the mounting pad 200 instead of the suction hole V1 of Modification Example 3. Note that the suction hole V1a is an example of a first through-hole.

[0045] The mounting pad 200 is attached by a screw 201 to a pad attachment portion V13 provided on one surface (e.g., the upper surface) of the mounting mechanism EE31b. The mounting pad 200 is fastened to the mounting mechanism EE31b by the screw 201 at a central opening 202. The screw 201 is an example of a fastening member. The screw 201 has a suction hole V1a at its center, which is connected to the suction path V2. In other words, the suction hole V1a of the screw 201 is an example of a second through hole extending along the fastening direction of the screw 201. The mounting pad 200 has a plurality of through holes 213 corresponding to the suction holes V1b, formed around the periphery of the opening 202. The through holes 213 are an example of a second through hole. The suction hole V1b is connected to the suction path V2. In the following description, when the mounting pad 200 is attached to the mounting mechanism EE31b, the through-hole 213 and the suction hole V1b may be collectively referred to as the suction hole V1b. In the mounting pad 200, by providing a plurality of suction holes V1b in addition to the suction hole V1a, the pressure applied to the back surface of the substrate W can be dispersed.

[0046] Furthermore, an O-ring 203 is provided as a sealing member on the back surface of the mounting pad 200, around the periphery of the suction hole V1b. In the example of FIG. 14, the O-ring 123 is provided as a sealing member between a base 211 (described later) of the mounting pad 200 and the pad attachment portion V13, and surrounding all of the through-holes (suction holes V1a, V1b). That is, the O-ring 203 is an example of a sealing member provided between the base 211 of the mounting pad 200 and one surface of the mounting mechanism EE31b, surrounding all of the through-holes (suction holes V1a, V1b) in a plan view. By providing the O-ring 203 so as to surround the suction holes V1a, V1b, it is possible to ensure close contact between the mounting pad 200 and the pad attachment portion V13 in a contact region 204 between the center of the mounting pad 200 and the O-ring 203, where the mounting pad 200 and the pad attachment portion V13 come into contact with each other.

[0047] Furthermore, a gap 205 is formed between the outer edge of the mounting pad 200, located on the outer periphery of the mounting pad 200, and the pad attachment portion V13, at a position closer to the O-ring 203. The gap 205 is longer than the gap 125 in the mounting pad 120 of Modification 3, allowing for a larger deflection of the mounting pad 200. Providing the gap 205 in this manner allows the outer edge of the mounting pad 200 to be more closely attached to the substrate W. Furthermore, when the mounting mechanism EE31b transfers the substrate W to the teeth 90, the O-ring 203 acts as a cushion when the mounting pad 200, which has been attached to the substrate W, peels off and returns to its original position. Therefore, even if the deflection of the mounting pad 200 becomes larger, the O-ring 203 can prevent stress cracking of the mounting pad 200, thereby extending the life of the mounting pad 200.

[0048] Next, the mounting pad 200 will be described in detail with reference to FIGS. 15 and 16. FIG. 15 is a diagram illustrating an example of a mounting pad according to the second embodiment. The mounting pad 200 shown in FIG. 15 has recessed portions on the outer and inner peripheries of its outer edge as deformation points, which facilitate deformation of the entire mounting pad and create peeling starting points. The mounting pad 200 also includes a portion where the thickness of the outer edge that comes into contact with the substrate W varies along the periphery. The mounting pad 200 has an outer edge 212 that is higher than a circular base 211. The mounting pad 200 has an opening 202 in the center of the base 211 and multiple through-holes 213 on the outer periphery of the opening 202. When the mounting pad 200 is attached to the pad attachment portion V13, each of the multiple through-holes 213 communicates with a corresponding one of the multiple suction holes V1b on the mounting mechanism EE31b. That is, one of the multiple through holes (opening 202, through hole 213) provided in base 211 may be a fastening hole. For example, as in mounting pad 200, the multiple through holes may be configured such that opening 202, which is a through hole at the center of base 211, is provided as a fastening hole, and other through holes 213 are provided around opening 202. Furthermore, opening 202 (first through hole), which is a fastening hole, and the other through holes 213 (second through holes) may have different diameters. Here, the "diameter" refers to the diameter when the cross-sectional shape of the through hole is circular, and refers to the longest diameter across the hole when the cross-section shape is other than circular. Furthermore, it is preferable that the diameter of opening 202, which is a fastening hole, is larger than the diameter of the other through holes 213.

[0049] In the mounting pad 200, an annular groove 214 is formed between each through-hole 213 of the base 211 and the outer edge 212. A protrusion 215 is provided in a part of the groove 214. The protrusion 215 has the same thickness as the protrusion 215 in the vicinity of each through-hole 213 of the base 211, and has a difference in thickness between the protrusion 215 and the groove 214 in the circumferential direction of the groove 214. In other words, the thickness (width) of the groove 214 is different in at least one part of the groove 214 (the part where the protrusion 215 is provided) from the thickness of the other part of the groove 214. Furthermore, the protrusions 215 are provided, for example, on a line passing through the center of the mounting pad 200, at positions facing each other across the center.

[0050] The mounting pad 200 has one or more recessed portions 216 formed on the outer peripheral surface side of the outer edge portion 212. That is, the recessed portions 216 are formed in at least one portion of the outer edge portion 212 so that the outer periphery of the outer edge portion 212 approaches the center of the base 211, and it can be said that the distance between the outer periphery and the inner periphery of the outer edge portion 212 in this portion is smaller than in other portions of the outer edge portion 212. Furthermore, the mounting pad 200 has one or more recessed portions 217 formed on the inner periphery side of the outer edge portion 212. That is, the recessed portions 217 are formed in at least one portion of the outer edge portion 212 so that the inner periphery of the outer edge portion 212 is farther away from the center of the base 211, and it can be said that the distance between the outer periphery and the inner periphery of the outer edge portion 212 in this portion is smaller than in other portions of the outer edge portion 212. 15, four recessed portions 216 are provided at 90° intervals in the circumferential direction of outer edge portion 212, and four recessed portions 217 are provided at 90° intervals in the circumferential direction of outer edge portion 212, at positions offset by 45° from recessed portions 216. That is, recessed portions 216 and 217 are alternately arranged in the circumferential direction of outer edge portion 212. Furthermore, in mounting pad 200, at least one portion of outer edge portion 212 (e.g., recessed portion 216), at least one portion of groove 214 (e.g., protrusion 215), and opening 202 may be arranged on a straight line.

[0051] In the mounting pad 200, of the four recesses 216, regions 218 where two recesses 216 exist in a direction that does not have a protrusion 215 between them and the center of the mounting pad 200 become the starting points for peeling, making it easier for the substrate W to peel off. In other words, the mounting pad 200 is more likely to deform in the two recesses 216 in a direction that does not have a protrusion 215 than in the two recesses 216 in a direction that does have a protrusion 215.

[0052] FIG. 16 is a diagram showing an example of displacement of the outer edge of the mounting pad. In FIG. 16, arrows 220-222 indicate the tendency of displacement (displacement in the X and Y axes) of outer edge 212 at positions P1-P16, which are 16 divisions of the circumferential direction of mounting pad 200 clockwise in a plan view. Note that in FIG. 16, position P1 is one of the recessed portions 216 in a direction that does not have a protruding portion 215. For arrows 220-222, the length of the arrow roughly indicates the amount of displacement, and the direction of the arrow indicates the direction of displacement. Arrow 220 indicates displacement at positions P1 and P9, arrow 221 indicates displacement at positions P5 and P13, and arrow 222 indicates displacement at positions P3, P7, P11, and P15. Note that arrows have been omitted for positions P2, P4, P6, P8, P10, P12, P14, and P16 to avoid complication.

[0053] 16, on the mounting pad 200, the displacement is greatest at positions P1 and P9 indicated by arrow 220, and the displacement is smallest at positions P3, P7, P11, and P15 indicated by arrow 222. In this way, on the mounting pad 200, by biasing the displacement applied to the contact surface of the outer edge 212 with the substrate W, positions P1 and P9 become the starting points for peeling, making it easier for the substrate W to peel off.

[0054] Next, Modification 4 will be described with reference to FIG. 17. FIG. 17 is a diagram showing an example of a mounting pad in Modification 4. The mounting pad 230 shown in FIG. 17 is a variation that combines the mounting pad 70 shown in FIG. 6 with the base 211 of the mounting pad 200 shown in FIG. 15. Note that the mounting pad 230 also includes a portion where the thickness of the outer edge that contacts the substrate W varies along the circumferential direction of the outer edge. The mounting pad 230 has an outer edge 232 that is formed higher in an annular shape than the circular base 231. The mounting pad 230 has an opening 202a in the center of the base 231, and multiple through holes 233 are formed on the outer periphery of the opening 202a. The opening 202a is an example of a through hole similar to the opening 202. When the mounting pad 230 is attached to the pad attachment portion V13, each of the multiple through holes 233 communicates with a corresponding one of the multiple suction holes V1b on the mounting mechanism EE31b.

[0055] In the mounting pad 230, an annular groove 234 is formed between each through-hole 233 of the base 231 and the outer edge 232. The groove 234 is narrower than the groove 214 of the mounting pad 200, and the distance from the center of the base 231 on the inner periphery side is the same in the circumferential direction. In other words, the mounting pad 230 does not have a portion corresponding to the protrusion 215 of the mounting pad 200.

[0056] The mounting pad 230 has one or more recessed portions 235 on the outer peripheral surface side of the outer edge portion 232. That is, the recessed portions 235 are provided in at least one portion of the outer edge portion 232 so that the outer periphery of the outer edge portion 232 approaches the center of the base 231, and it can be said that the distance between the outer periphery and inner periphery of the outer edge portion 232 in this portion is smaller than in other portions of the outer edge portion 232. In the example of FIG. 17 , two recessed portions 235 are provided at 180° intervals in the circumferential direction of the outer edge portion 232. That is, the recessed portions 235 are provided at opposing positions on a line passing through the center of the mounting pad 230. In the mounting pad 230, regions 236 where the two recessed portions 235 exist respectively become the starting points of peeling, making the substrate W more likely to peel off.

[0057] Next, a comparison of the amount of displacement between the mounting pad 200 of the second embodiment and the mounting pad 230 of Modification 4 will be described with reference to Figures 18 and 19. Note that Figures 18 and 19 compare the amount of displacement when the substrate W is placed on the mounting pads 200, 230 and pulled in the positive direction of the Z axis (upward in the vertical direction) with a force of 1 [N].

[0058] 18 is a graph showing an example of the displacement amount in the Z-axis direction in the second embodiment and the fourth modified example. Graph 240 shown in FIG. 18 represents the displacement amount in the Z-axis direction of mounting pad 200, and graph 241 represents the displacement amount in the Z-axis direction of mounting pad 230. In FIG. 18, the horizontal axis represents positions P1 to P16 (corresponding to positions P1 to P16 in FIG. 16 ) obtained by dividing the circumferential direction of outer edge portions 212, 232 into 16 parts, and the vertical axis represents the normalized displacement amount within the range within which the displacement amount falls. Position P1 corresponds to position P1 in FIG. 16 on mounting pad 200, and corresponds to one of recessed portions 235 on mounting pad 230. Graph 240 shows that the displacement amount in the Z-axis direction is large at positions P1 and P9, and small at positions P5 and P13. In graph 241, the change in displacement amount is less than in graph 240, but like graph 240, it can be seen that the displacement amount in the Z-axis direction increases at positions P1 and P9 and decreases at positions P5 and P13.

[0059] 19 is a graph showing an example of the radial displacement amount in the second embodiment and Modification 4. Graph 242 shown in FIG. 19 represents the radial displacement amount (XY axis direction) of mounting pad 200, and graph 243 represents the radial displacement amount (XY axis direction) of mounting pad 230. Note that in FIG. 19, similar to FIG. 18, the horizontal axis represents positions P1 to P16, and the vertical axis represents the normalized displacement amount within the range of the displacement amount. Graph 242 shows that the radial displacement amount is large at positions P1 and P9 and small at positions P4 to P7 and P11 to P15. Graph 243 shows less change in the displacement amount than graph 242, but similar to graph 242, it shows that the radial displacement amount is large at positions P1 and P9 and small at positions P4 to P6 and P12 to P14. Comparing graphs 242 and 243, it can be seen that the radial displacement is significantly affected by the convex portions 215 of mounting pad 200. Graph 243 also shows that the concave portions 235 of mounting pad 230 are significantly affected. Graph 242 also shows that the slopes are steep from positions P1 to P4, P7 to P9, P9 to P11, and P15 to P1. These slopes suggest that positions P1 and P9 are the starting points for peeling on outer edge 212 of mounting pad 200.

[0060] Next, Modifications 5 to 7 will be described with reference to FIGS. 20 to 22. FIG. 20 is a diagram showing an example of a mounting pad in Modification 5. The mounting pad 250 shown in FIG. 20 is a variation of the mounting pad 200 shown in FIG. 15, in which the convex portion 215 is not provided, and the edges of the two concave portions 216 in the direction of the convex portion 215 between the center of the mounting pad 200 and the mounting pad 200 are not chamfered. Note that the mounting pad 250 also includes a portion where the thickness of the outer edge that comes into contact with the substrate W varies in the circumferential direction of the outer edge. The mounting pad 250 has an outer edge 252 that is formed in an annular shape and higher than a circular base 251. The mounting pad 250 has an opening 202b in the center of the base 251, and multiple through holes 253 are provided on the outer periphery of the opening 202b. The opening 202b is an example of a through hole similar to the opening 202. When attached to the pad attachment portion V13, the plurality of through holes 253 communicate with the plurality of suction holes V1b on the placement mechanism EE31b side, respectively.

[0061] The mounting pad 250 has annular grooves 254 formed between each through-hole 253 of the base 251 and the outer edge 252. The distance from the center of the base 251 on the inner periphery of the grooves 254 is the same in the circumferential direction. In other words, the mounting pad 250 does not have a portion corresponding to the protrusion 215 of the mounting pad 200.

[0062] The mounting pad 250 has one or more recesses 255 and 255a provided on the outer peripheral surface side of the outer edge 252. That is, the one or more recesses 255 and 255a are provided in at least one portion of the outer edge 252 so that the outer periphery of the outer edge 252 approaches the center of the base 251, and it can be said that the distance between the outer periphery and the inner periphery of the portion is smaller than that of the other portions of the outer edge 252. The recess 255a does not have a chamfered edge portion. Note that the mounting pad 250 may have a recess 255 instead of the recess 255a. The mounting pad 250 also has one or more recesses 256 provided on the inner periphery side of the outer edge 252. That is, the recessed portions 256 are provided in at least one portion of the outer edge portion 252 such that the inner periphery of the outer edge portion 252 is away from the center of the base 251, and it can be said that the distance between the outer periphery and the inner periphery of the outer edge portion 252 is smaller in this portion than in other portions of the outer edge portion 252. In the example of FIG. 20 , the recessed portions 255 and the recessed portions 255a are provided two by two (four in total) alternately at 90° intervals in the circumferential direction of the outer edge portion 252. Furthermore, the recessed portions 256 are provided four by four at 90° intervals in the circumferential direction of the outer edge portion 252, at positions shifted 45° from the recessed portions 255 and the recessed portions 255a. That is, the recessed portions 255 and the recessed portions 255a and the recessed portions 256 are alternately arranged along the circumferential direction of the outer edge portion 252. In the mounting pad 250, regions 257 where the two recessed portions 255 exist become the starting points of peeling, making it easier for the substrate W to peel off. Note that the two recessed portions 255a can also become the starting points of peeling.

[0063] FIG. 21 shows an example of a mounting pad in Modification Example 6. The mounting pad 260 shown in FIG. 21 is a variation of the mounting pad 250 shown in FIG. 20 in which two grooves 254 are provided. The mounting pad 260 also includes a portion where the thickness of the outer edge that contacts the substrate W varies along the circumferential direction of the outer edge. The mounting pad 260 has an outer edge 262 that is formed higher in an annular shape than a circular base 261. The mounting pad 260 has an opening 202c in the center of the base 261, and multiple through holes 263 are provided on the outer periphery of the opening 202c. The opening 202c is an example of a through hole similar to the opening 202. When the mounting pad 260 is attached to the pad attachment part V13, each of the multiple through holes 263 communicates with a corresponding one of the multiple suction holes V1b on the mounting mechanism EE31b.

[0064] In the mounting pad 260, annular grooves 264 and 266 are formed between each through-hole 263 of the base 261 and the outer edge portion 262. An annular portion 265 having the same thickness as the vicinity of each through-hole 263 of the base 261 is formed between the grooves 264 and 266. The groove 264 is at the same distance from the center of the base 261 on the inner side as it is at the same distance from the center of the base 261 on the outer side in the circumferential direction. The groove 266 is at the same distance from the center of the base 261 on the inner side as it is at the same distance from the center of the base 261 on the outer side as it is at the same distance in the circumferential direction.

[0065] The mounting pad 260 has one or more recesses, selected from recesses 267 and 267a, provided on the outer peripheral surface of the outer edge 262. That is, one or more recesses, selected from recesses 267 and 267a, are provided in at least one portion of the outer edge 262 so that the outer periphery of the outer edge 262 approaches the center of the base 261, and the distance between the outer periphery and inner periphery of the portion is smaller than that of the other portions of the outer edge 262. The recesses 267a are not chamfered at the edge portion of the recesses 267. The mounting pad 260 may have recesses 267 instead of recesses 267a. The mounting pad 260 also has one or more recesses 268 provided on the inner periphery of the outer edge 262. That is, the recessed portions 268 are provided in at least one portion of the outer edge portion 262 such that the inner periphery of the outer edge portion 262 is away from the center of the base 261, and it can be said that the distance between the outer periphery and the inner periphery of the outer edge portion 262 in this portion is smaller than in other portions of the outer edge portion 262. In the example of FIG. 21 , the recessed portions 267 and the recessed portions 267a are provided two by two (four in total) alternately at 90° intervals in the circumferential direction of the outer edge portion 262. Furthermore, the recessed portions 268 are provided four by four at 90° intervals in the circumferential direction of the outer edge portion 262, at positions shifted 45° from the recessed portions 267 and the recessed portions 267a. That is, the recessed portions 267 and the recessed portions 267a and the recessed portions 268 are alternately arranged along the circumferential direction of the outer edge portion 262. In the mounting pad 260, regions 269 where the two recessed portions 267 exist become the starting points of peeling, making it easier for the substrate W to peel off. Note that the two recessed portions 267a can also become the starting points of peeling.

[0066] FIG. 22 is a diagram showing an example of a mounting pad according to Modification Example 7. The mounting pad 270 shown in FIG. 22 is a variation of the mounting pad 250 shown in FIG. 20 in which the width of the groove 254 is narrowed and multiple rectangular recesses having the same thickness as the groove 254 are provided from the groove 254 toward the center of the base 251, thereby providing multiple fan-shaped protrusions. Note that the mounting pad 270 also includes a portion where the thickness of the outer edge that comes into contact with the substrate W varies in the circumferential direction of the outer edge. The mounting pad 270 has an outer edge 272 that is formed in an annular shape and is higher than the circular base 271. The mounting pad 270 has an opening 202d in the center of the base 271, and multiple through holes 273 are provided on the outer periphery of the opening 202d. The opening 202d is an example of a through hole similar to the opening 202. When attached to the pad attachment portion V13, the plurality of through holes 273 communicate with the plurality of suction holes V1b on the placement mechanism EE31b side, respectively.

[0067] The mounting pad 270 has annular grooves 274 formed between each through-hole 273 of the base 271 and the outer edge 272. A plurality of rectangular recesses 275 having the same thickness as the groove 274 are provided in the groove 274 from the groove 274 toward the center of the base 271, thereby providing a plurality of fan-shaped protrusions 276. The recesses 275 are provided, for example, in each direction obtained by dividing the circumference of the base 271 into eight parts. The protrusions 276 have the same thickness as those in the vicinity of each through-hole 273 of the base 271, and have a difference in thickness between them in the circumferential direction of the groove 274. The protrusions 276 are provided alternately with the recesses 275. That is, the thickness (width) of the groove 274 is different in at least one portion of the groove 274 (the portion where the protrusions 276 are provided) from the thickness of the other portions of the groove 274.

[0068] The mounting pad 270 has one or more recesses, selected from recesses 277 and 277a, provided on the outer peripheral surface side of the outer edge 272. That is, one or more recesses, selected from recesses 277 and 277a, are provided in at least one portion of the outer edge 272 so that the outer periphery of the outer edge 272 approaches the center of the base 271, and it can be said that the distance between the outer periphery and inner periphery of the portion is smaller than that of the other portions of the outer edge 272. The recesses 277a do not have chamfered edges. Note that the mounting pad 270 may have recesses 277 instead of recesses 277a. The mounting pad 270 also has one or more recesses 278 provided on the inner periphery side of the outer edge 272. That is, the recessed portions 278 are provided in at least one portion of the outer edge portion 272 such that the inner periphery of the outer edge portion 272 is away from the center of the base 271, and it can be said that the distance between the outer periphery and the inner periphery of the outer edge portion 272 in this portion is smaller than in other portions of the outer edge portion 272. In the example of FIG. 22 , the recessed portions 277 and the recessed portions 277a are provided two by two (four in total) alternately at 90° intervals in the circumferential direction of the outer edge portion 272. The recessed portions 278 are provided four by four at 90° intervals in the circumferential direction of the outer edge portion 272, at positions shifted 45° from the recessed portions 277 and the recessed portions 277a. That is, the recessed portions 277 and the recessed portions 277a and the recessed portions 278 are alternately arranged along the circumferential direction of the outer edge portion 272. In the mounting pad 270, regions 279 where the two recessed portions 277 exist become the starting points of peeling, making it easier for the substrate W to peel off. Note that the two recessed portions 277a can also become the starting points of peeling.

[0069] In the above-described embodiments, the mounting pads 10, 30, 40, 50, 60, 70, 100, 120, 200, 230, 250, 260, and 270 are configured as separate bodies from the mounting mechanisms EE31, EE31a, and EE31b, but this is not limiting. For example, the mounting pads 10, 30, 40, 50, 60, 70, 100, 120, 200, 230, 250, 260, and 270 may be configured to be integrally molded (as a single-piece molded product) on one surface of the mounting mechanism EE31, EE31a, and EE31b.

[0070] According to each embodiment described above, the mounting pad (e.g., mounting pad 10, 200) is a mounting pad for placing an object (substrate W) on, and includes a base (e.g., base 11, 211) and an annular outer edge portion (e.g., outer edge portion 12, 212) that is provided on one surface of the base, protrudes in a direction intersecting the surface direction so as to surround the outer edge of the surface, and is capable of contacting the object, and at least one portion of the outer edge portion (e.g., recessed portion 16, 216) has a thickness that is different from the thickness of the remaining portion of the outer edge. As a result, it is possible to reduce sticking of the object (substrate W) to the mounting mechanism EE31, etc.

[0071] Moreover, according to each embodiment, the base further includes at least one through-hole (for example, openings 13, 202, screw hole 14, through-hole 213) provided in the base. As a result, for example, when the through-hole is opening 13, the substrate W can be sucked. Also, for example, when the through-hole is screw hole 14, the mounting pad 10 can be fixed to the mounting mechanism EE31b. Also, for example, the mounting pad 200 can be fixed to the mounting mechanism EE31b by a screw 201 at the opening 202, and the substrate W can be sucked by a suction hole V1a of the screw 201 and a suction hole V1b communicating with the through-hole 213.

[0072] Furthermore, according to each embodiment, two or more portions having different thicknesses at the outer edge are provided at positions that are rotationally symmetrical with respect to the center of the base as the axis of rotation, thereby reducing the sticking of the object to the mounting mechanism EE31, etc.

[0073] Furthermore, according to each embodiment, the portions of the outer edge where the thickness varies and the through holes are arranged on a straight line, which can further reduce the sticking of the object to the mounting mechanism EE31, etc.

[0074] Furthermore, according to each embodiment, two portions (e.g., recessed portions 66, 76, 235) of different thicknesses of the outer edge portion (e.g., outer edge portion 62, 72, 232) are provided at opposing positions. As a result, the mounting pad 60, 70, 230 becomes more easily deformed, and it is possible to further reduce the sticking of the object to the mounting mechanism EE31, etc.

[0075] Furthermore, according to each embodiment, the through-hole includes a first through-hole (for example, opening 202) and a second through-hole (for example, through-hole 213) having different diameters. As a result, a through-hole suitable for fastening and suction can be provided.

[0076] According to each embodiment, the first through hole is disposed at the center of the base, and two or more second through holes are disposed around the first through hole, and the diameter of the first through hole is larger than the diameter of the second through hole, thereby providing through holes suitable for fastening and suction.

[0077] Furthermore, according to each embodiment, at least one portion (e.g., recessed portion 66, 76, 216) of the outer edge portion (e.g., outer edge portion 62, 72, 212) is provided so that the outer periphery of the outer edge approaches the center of the base, and the distance between the outer periphery and the inner periphery of the portion of the outer edge that is provided so that the outer periphery of the outer edge approaches the center of the base is smaller than that of other portions of the outer edge. As a result, it is possible to further reduce the sticking of the object to the mounting mechanism EE31, etc.

[0078] Furthermore, according to each embodiment, at least one portion of the outer edge (for example, the recessed portion 16, 217) is provided such that the inner periphery of the outer edge is away from the center of the base, and the distance between the outer periphery and the inner periphery of the portion of the outer edge that is away from the center of the base is smaller than that of the other portions of the outer edge. As a result, it is possible to further reduce the sticking of the object to the mounting mechanism EE31, etc.

[0079] Furthermore, according to each embodiment, a first portion (e.g., recessed portion 216), which is at least one portion of the outer edge portion (e.g., 212), is provided so that the outer periphery of the outer edge approaches the center of the base, and a second portion (e.g., recessed portion 217), which is at least one portion of the outer edge portion, is provided so that the inner periphery of the outer edge moves away from the center of the base, and the first portion and the second portion are alternately arranged along the circumferential direction of the outer edge. As a result, by biasing the displacement applied to the contact surface of the outer edge with the object, it is possible to generate a starting point for peeling, making it easier for the object to peel off.

[0080] Furthermore, according to each embodiment, the base (e.g., base 71, 211) has an annular groove (e.g., groove 78, 214) near the boundary with the outer edge (e.g., outer edge 72, 212). As a result, the mounting pad 70 and the like become more easily deformed, and the sticking of the object to the mounting mechanism EE31 and the like can be further reduced.

[0081] Furthermore, according to each embodiment, the thickness of the groove is different in at least one portion of the groove (for example, groove 214 where convex portion 215 is located) from the thickness of the other portion of the groove. As a result, by biasing the displacement applied to the contact surface of the outer edge with the object, it is possible to generate a starting point for peeling, making the object more likely to peel.

[0082] Furthermore, according to each embodiment, at least one portion of the outer edge (for example, the recessed portion 216) and at least one portion of the groove (for example, the groove 214 where the protruding portion 215 is located) are arranged on a straight line. As a result, by biasing the displacement applied to the contact surface of the outer edge with the object, a starting point for peeling can be generated, making it easier for the object to peel off.

[0083] According to each embodiment, the inner peripheral surface of the outer peripheral portion (outer peripheral portion 42, 52) is circular or elliptical, and the outer peripheral surface (outer peripheral surface 45, 55) is polygonal. As a result, it is possible to further reduce the sticking of the object to the mounting mechanism EE31, etc.

[0084] Furthermore, according to each embodiment, the mounting mechanism (e.g., mounting mechanism EE31, EE31b) is a mounting mechanism for placing an object thereon, and includes an exhaust flow path (suction path V2) provided within the mounting mechanism, and a mounting pad (e.g., mounting pad 10, 200) located on one side of the mounting mechanism, and the mounting pad includes a base (e.g., base 11, 211), at least one first through hole (e.g., opening 13, 202, through hole 213 (suction hole V1b)) provided in the base and communicating with the exhaust flow path, and an annular outer edge portion (e.g., outer edge portion 12, 212) provided on one side of the base, protruding in a direction intersecting the surface direction of the surface so as to surround the outer edge of the surface, and capable of contacting the object, and in at least one portion of the outer edge portion (e.g., concave portion 16, 216), the thickness of the outer edge portion is different from the thickness of other portions of the outer edge portion. As a result, it is possible to reduce the sticking of the object (substrate W) to the mounting mechanism EE31 and the like.

[0085] Furthermore, according to each embodiment, the mounting mechanism is the support table 110 that can hold the object by suction thereon. As a result, it is possible to reduce the sticking of the object (substrate W) to the support table 110 of the aligner AN.

[0086] Furthermore, according to each embodiment, a gap (for example, gap 125, 205) is provided between the outer edge and one surface of the mounting mechanism, which allows the mounting pad 120, etc., to flex, allowing the outer edge to be more closely attached to the object (substrate W).

[0087] Furthermore, according to each embodiment, the mounting mechanism further includes pad mounting portions (for example, pad mounting portions V11 to V13) provided on one surface thereof, and the mounting pads are mounted to the pad mounting portions. As a result, the mounting pads 10 and the like can be easily replaced.

[0088] Furthermore, according to each embodiment, the mounting pad is integrally formed on one surface of the mounting mechanism, which simplifies the configuration of the mounting mechanism.

[0089] Furthermore, according to each embodiment, the placement mechanism is an end effector for transporting a substrate, which can reduce the sticking of the substrate W to the end effector.

[0090] Furthermore, according to each embodiment, the mounting pad further includes at least one fastening hole (for example, mounting hole 122, opening 202) for a fastening member in the base, so that the mounting pad 120 and the like can be attached to the mounting mechanism EE31a and the like.

[0091] Furthermore, according to each embodiment, the mounting pad (e.g., mounting pad 200) has at least one fastening hole (e.g., opening 202) for a fastening member in the base (e.g., base 211), and a fastening member (e.g., screw 201) for fastening the mounting pad to a pad attachment portion (e.g., pad attachment portion V13) is fitted into the fastening hole, and the fastening member has a second through-hole (e.g., suction hole V1a) along the fastening direction. As a result, the fastening hole can serve as both a fastening hole and a suction hole.

[0092] Furthermore, according to each embodiment, a sealing member (e.g., O-ring 123, 203) is further provided between the base and one surface of the mounting mechanism so as to surround all of the first through-holes (e.g., openings 13, 202, through-hole 213 (suction hole V1b)) in a plan view. As a result, it is possible to ensure close contact between the base and one surface of the mounting mechanism. Furthermore, even if the deflection of the mounting pad 200 etc. becomes larger, the O-ring 203 can suppress stress cracking of the mounting pad 200 etc., thereby extending the life of the mounting pad 200 etc.

[0093] Furthermore, according to each embodiment, a part of the back surface of the base (for example, the base 11) and the pad attachment part (for example, the pad attachment part V11) are bonded together. As a result, the area of ​​the base 11 and the like can be reduced.

[0094] Furthermore, according to each embodiment, the substrate transfer mechanism (e.g., atmospheric transfer robot TR3) is a substrate transfer mechanism that transfers the substrate W to or receives the substrate W from a table (e.g., teeth 90) on which the substrate W is placed, and has a placement mechanism (e.g., placement mechanism EE31, EE31b). In the placement mechanism, the placement pad (e.g., placement pad 10, 200) is provided so that at least one of the thinnest portions of the outer edge (e.g., outer edge 12, 212) faces a portion (e.g., region 90a) where the substrate W placed on the placement mechanism can come into contact with the table. As a result, it is possible to further reduce the sticking of the substrate W to the placement mechanism.

[0095] Furthermore, according to each embodiment, the substrate transfer mechanism (atmospheric transfer robot TR3) has a mounting mechanism EE31 in which three or more mounting pads (e.g., mounting pads 10, 30, 60, 70, 100, 200) are provided at positions equidistant from the center of the target object, and at least two of the mounting pads are provided such that the outer edge portions (e.g., recessed portions 16, 66, 76, 106, 216, regions 38, 218) that have the smallest thickness and that come into contact with the target object are positioned toward the teeth 90. As a result, by bringing peeling starting point 91 on the teeth 90 closer to the region (e.g., regions 17, 38, 67, 77, 107, 218) that is the peeling starting point of the mounting pad, sticking of the substrate W to the mounting mechanism EE31 can be further reduced.

[0096] Furthermore, according to each embodiment, at least one mounting pad (e.g., mounting pads 10, 30, 60, 70, 100, 200) is provided so that the position of the outer edge that comes into contact with the target object and has the smallest thickness (e.g., recessed portions 16, 66, 76, 106, 216, regions 38, 218) is oriented on the straight line (line 94) connecting the center of the target object and the mounting pad. As a result, by aligning the orientation of the center of the substrate W with the region that is the starting point for peeling of the mounting pad (e.g., regions 17, 38, 67, 77, 107, 218), it is possible to further reduce the sticking of the substrate W to the mounting mechanism EE31.

[0097] Furthermore, according to each embodiment, the outer edge portion 12 is formed in an annular shape, and the portion of the outer edge portion 12 where the thickness varies is one or more recessed portions (recessed portions 16) provided on the annular inner circumferential surface 15. As a result, it is possible to reduce the sticking of the substrate W to the mounting mechanism EE31.

[0098] Furthermore, according to each embodiment, the outer edge portion (e.g., outer edge portion 62, 72, 102) is formed in an annular shape, and the portion of the outer edge portion where the thickness varies is one or more recessed portions (e.g., recessed portions 66, 76, 106) provided on the annular outer peripheral surface (e.g., outer peripheral surface 65, 75, 105). As a result, the mounting pads 60, 70, 100, etc. become more easily deformed, and the sticking of the substrate W to the mounting mechanism EE31 can be further reduced.

[0099] Furthermore, according to each embodiment, the outer edge portion (e.g., outer edge portions 32, 42, 52) is formed in an annular shape, and the portion of the outer edge portion where the thickness varies is one or more convex portions (e.g., convex portion 36, corners 46, 56) provided on the annular outer peripheral surface (e.g., outer peripheral surface 35, 45, 55). As a result, it is possible to reduce the sticking of the substrate W to the mounting mechanism EE31.

[0100] Furthermore, according to each embodiment, three convex portions (for example, the convex portions 36) are provided at equally spaced positions in the circumferential direction, which can reduce the sticking of the substrate W to the platform mechanism EE31.

[0101] Furthermore, according to each embodiment, the convex portion (for example, the corners 46, 56) includes a corner, which can further reduce the sticking of the substrate W to the mounting mechanism EE31.

[0102] Furthermore, according to each embodiment, the outer edge portion (for example, the outer edge portions 42 and 52) has a circular or elliptical inner circumferential surface side, and an outer circumferential surface (for example, the outer circumferential surfaces 45 and 55) side formed of corners (for example, the corners 46 and 56) and flat surfaces. As a result, it is possible to further reduce the sticking of the substrate W to the mounting mechanism EE31.

[0103] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive, and the above embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims.

[0104] In addition, in each of the above-described embodiments, the outer edge portion 12 etc. that comes into contact with the substrate W is a single ring-shaped portion, but this is not limiting. For example, the outer edge portion may be two or more concentric ring-shaped portions.

[0105] In addition, in each of the above-described embodiments, the case where the substrate W is placed in the container C placed on the load ports LP1 to LP4 has been described, but the present invention is not limited to this. For example, when the substrate W is placed on the support table of the aligner AN, the stage of the load lock modules LL1 and LL2, etc., the peeling origin will be at the center of the substrate W, but the present invention can be similarly applied.

[0106] In addition, in each of the above-described embodiments, the object to be transported is a substrate W, but the present invention is not limited to this. For example, the present invention may be applied to a mounting mechanism capable of transporting a ring assembly or the like housed in a storage SR.

[0107] The present disclosure can also be configured as follows. (1) A placement pad for placing an object, The base and a ring-shaped outer edge portion provided on one surface of the base, protruding in a direction intersecting the surface direction so as to surround the outer edge of the surface, and capable of coming into contact with the object; The thickness of at least one portion of the outer edge is different from the thickness of the other portion of the outer edge. Mounting pad. (2) Further comprising at least one through hole provided in the base; The mounting pad according to (1) above. (3) The portion having the different thickness of the outer edge portion is provided at two or more rotationally symmetric positions when the center of the base is the rotation axis. The mounting pad according to (1) or (2) above. (4) The portion of the outer edge portion where the thickness varies and the through hole are arranged on a straight line. The mounting pad according to (2) above. (5) The portion having different thicknesses of the outer edge portion is provided in two opposing positions. The mounting pad according to any one of (1) to (4) above. (6) The base has an annular groove formed in the vicinity of the boundary with the outer edge portion. The mounting pad according to any one of (1) to (5) above. (7) The outer edge portion has an inner peripheral surface side that is circular or elliptical, and an outer peripheral surface side that is polygonal. The mounting pad according to any one of (1) to (6) above. (8) A placement mechanism for placing an object, an exhaust flow path provided inside the mounting mechanism; a pad attachment portion provided on an upper surface of the mounting mechanism; a mounting pad attached to the pad attachment portion, The mounting pad is The base and At least one through hole provided in the base and communicating with the exhaust flow path; a ring-shaped outer edge portion provided on one surface of the base, protruding in a direction intersecting the surface direction so as to surround the outer edge of the surface, and capable of coming into contact with the object; The thickness of at least one portion of the outer edge is different from the thickness of the other portion of the outer edge. Mounting mechanism. (9) the mounting mechanism is a support table capable of suction-holding the object thereon; The mounting mechanism according to (8) above. (10) a gap between the outer edge and the pad attachment portion; The mounting mechanism according to (8) or (9) above. (11) At least one of the through holes is a fastening hole for a fastening member, a sealing member is disposed between the base and the pad attachment portion and surrounding all of the through holes; The mounting mechanism according to any one of (8) to (10) above. (12) a part of the rear surface of the base and the pad attachment portion are bonded to each other; The mounting mechanism according to any one of (8) to (10) above. (13) Three or more of the placement pads are provided at equal distances from the center of the object, At least two of the placement pads are provided such that the positions of the outer edge portions where the thickness of the outer edge portions that come into contact with the object is the smallest are aligned in the direction of the teeth. The mounting mechanism according to any one of (8) to (12) above is included. Substrate transport mechanism. (14) At least one of the placement pads is provided so that the position of the outer edge portion that comes into contact with the object and has the smallest thickness is on a straight line connecting the center of the object and the placement pad. The substrate transport mechanism according to (13) above.

[0108] The present disclosure can also be configured as follows. (1) A placement pad for placing an object, The base and a ring-shaped outer edge portion provided on one surface of the base, protruding in a direction intersecting the surface direction so as to surround the outer edge of the surface, and capable of coming into contact with the object; The thickness of at least one portion of the outer edge is different from the thickness of the other portion of the outer edge. Mounting pad. (2) Further comprising at least one through hole provided in the base; The mounting pad according to (1) above. (3) The portion having the different thickness of the outer edge portion is provided at two or more rotationally symmetric positions when the center of the base is the rotation axis. The mounting pad according to (1) or (2) above. (4) The through hole is The first through hole and the second through hole have different diameters. The mounting pad according to (2) above. (5) the first through-hole is disposed at the center of the base; Two or more of the second through holes are arranged around the first through hole, The diameter of the first through hole is larger than the diameter of the second through hole. The mounting pad according to (4) above. (6) At least one of the portions of the outer edge is provided such that the outer periphery of the outer edge approaches the center of the base, the portion of the outer edge portion where the outer periphery is closer to the center of the base has a smaller distance between the outer periphery and the inner periphery than the other portions of the outer edge portion; The mounting pad according to any one of (1) to (5) above. (7) At least one of the portions of the outer edge is provided such that an inner periphery of the outer edge is away from the center of the base, In the portion where the inner periphery of the outer edge portion is provided so as to be away from the center of the base, the distance between the outer periphery and the inner periphery of the outer edge portion is smaller than that of the other portion of the outer edge portion. The mounting pad according to any one of (1) to (6) above. (8) a first portion, which is at least one of the portions of the outer edge portion, is provided so that an outer periphery of the outer edge portion approaches a center of the base; a second portion, which is at least one of the portions of the outer edge portion, is provided such that an inner periphery of the outer edge portion is away from a center of the base; The first portions and the second portions are alternately arranged along the circumferential direction of the outer edge portion. The mounting pad according to any one of (1) to (7) above. (9) The base has an annular groove near the boundary with the outer edge. The mounting pad according to any one of (1) to (8) above. (10) The thickness of the groove is different in at least one portion of the groove from the thickness of another portion of the groove. The mounting pad according to (9) above. (11) the at least one portion of the outer edge and the at least one portion of the groove are arranged on a straight line. The mounting pad according to (10) above. (12) A placement mechanism for placing an object, an exhaust flow path provided inside the mounting mechanism; a mounting pad located on one surface of the mounting mechanism, The mounting pad is The base and at least one first through-hole provided in the base and communicating with the exhaust flow path; a ring-shaped outer edge portion provided on one surface of the base, protruding in a direction intersecting the surface direction so as to surround the outer edge of the surface, and capable of coming into contact with the object; The thickness of at least one portion of the outer edge is different from the thickness of the other portion of the outer edge. Mounting mechanism. (13) a gap is provided between the outer edge portion and the one surface of the mounting mechanism; The mounting mechanism according to (12) above. (14) a pad attachment portion provided on the one surface of the mounting mechanism; The mounting pad is attached to the pad attachment portion. The mounting mechanism according to (12) or (13) above. (15) the mounting pad is integrally formed on the one surface of the mounting mechanism; The mounting mechanism according to (12) or (13) above. (16) the placement mechanism is an end effector for transporting a substrate; The mounting mechanism according to any one of (12) to (15) above. (17) The mounting pad further includes at least one fastening hole in the base for a fastening member. The mounting mechanism according to any one of (12) to (14) above. (18) The mounting pad has at least one fastening hole in the base for a fastening member, a fastening member for fastening the placement pad and the pad attachment portion is fitted into the fastening hole; The fastening member has a second through hole along the fastening direction. The mounting mechanism according to (14) above. (19) a sealing member provided between the base and the one surface of the mounting mechanism so as to surround all of the first through holes in a plan view; The mounting mechanism according to any one of (12) to (14) above. (20) A substrate transport mechanism that transfers a substrate to a table on which the substrate is placed or receives the substrate from the table, The mounting mechanism according to (12) is provided, In the mounting mechanism, the mounting pad is provided such that at least one of the portions of the outer edge having the smallest thickness faces a portion where the substrate placed on the mounting mechanism can come into contact with the platform. Substrate transport mechanism. [Explanation of symbols]

[0109] 10, 30, 40, 50, 60, 70, 100, 120, 200, 230, 250, 260, 270 Mounting pad 11,31,41,51,61,71,101,211,231,251,261,271 Foundation 12,32,42,52,62,72,102,212,232,252,262,272 outer edge 13,33,43,53,63,73,103,202,202a~202d opening 14 screw holes 15 Inner surface 16,66,76,106,216,217,235,255,255a,256,267,267a,268,277,277a,278 Concave part 20 Bracket 35,45,55,65,75,105 Outer surface 36 Convex part 38 areas 46,56 angle 78,108,214,234,254,264,266,274 groove 90 Teeth 90a area 110 Support stand 122 Mounting hole 123,203 O-rings 124 areas 125,205 void 201 Screw 213,233,253,263,273 Through holes 215,276 convex part C container EE31, EE31a, EE31b Mounting mechanism LM Atmospheric Transfer Module PS Processing System TR3 Atmospheric Transfer Robot V1,V1a,V1b Suction hole V11, V12, V13 pad mounting parts V2 suction path W substrate

Claims

1. A placement pad for placing an object, The base and a ring-shaped outer edge portion provided on one surface of the base, protruding in a direction intersecting the surface direction so as to surround the outer edge of the surface, and capable of coming into contact with the object; The thickness of at least one portion of the outer edge is different from the thickness of the other portion of the outer edge. Mounting pad.

2. Further comprising at least one through hole provided in the base. The mounting pad of claim 1 .

3. Two or more portions of the outer edge portion having different thicknesses are provided at positions rotationally symmetrical with respect to a rotation axis that is the center of the base. The mounting pad of claim 1 .

4. The through hole is The first through hole and the second through hole have different diameters. The mounting pad according to claim 2 .

5. the first through-hole is disposed at the center of the base; two or more second through holes are arranged around the first through hole, The diameter of the first through hole is larger than the diameter of the second through hole. The mounting pad according to claim 4 .

6. At least one of the portions of the outer edge is provided such that the outer periphery of the outer edge approaches the center of the base, the portion of the outer edge portion where the outer periphery is closer to the center of the base has a smaller distance between the outer periphery and the inner periphery than the other portions of the outer edge portion; The mounting pad according to claim 1 or 2.

7. At least one of the portions of the outer edge is provided such that an inner periphery of the outer edge is away from the center of the base, In the portion where the inner periphery of the outer edge portion is provided so as to be away from the center of the base, the distance between the outer periphery and the inner periphery of the outer edge portion is smaller than that of the other portion of the outer edge portion. The mounting pad according to claim 1 or 2.

8. a first portion, which is at least one of the portions of the outer edge portion, is provided so that an outer periphery of the outer edge portion approaches a center of the base; a second portion, which is at least one of the portions of the outer edge portion, is provided such that an inner periphery of the outer edge portion is away from a center of the base; The first portions and the second portions are alternately arranged along the circumferential direction of the outer edge portion. The mounting pad according to claim 1 or 2.

9. The base has an annular groove near the boundary with the outer edge. The mounting pad of claim 1 .

10. The thickness of the groove is different in at least one portion of the groove from the thickness of another portion of the groove. The mounting pad of claim 9.

11. the at least one portion of the outer edge and the at least one portion of the groove are arranged on a straight line. The mounting pad of claim 10.

12. A placement mechanism for placing an object, an exhaust flow path provided inside the mounting mechanism; a mounting pad located on one surface of the mounting mechanism, The mounting pad is The base and at least one first through-hole provided in the base and communicating with the exhaust flow path; a ring-shaped outer edge portion provided on one surface of the base, protruding in a direction intersecting the surface direction so as to surround the outer edge of the surface, and capable of coming into contact with the object; The thickness of at least one portion of the outer edge is different from the thickness of the other portion of the outer edge. Mounting mechanism.

13. a gap is provided between the outer edge portion and the one surface of the mounting mechanism; The mounting mechanism according to claim 12.

14. a pad attachment portion provided on the one surface of the mounting mechanism; The mounting pad is attached to the pad attachment portion. The mounting mechanism according to claim 12 or 13.

15. the mounting pad is integrally formed on the one surface of the mounting mechanism; The mounting mechanism according to claim 12 or 13.

16. the placement mechanism is an end effector for transporting a substrate; The mounting mechanism according to claim 12 or 13.

17. The mounting pad further includes at least one fastening hole in the base for a fastening member. The mounting mechanism according to claim 12 or 13.

18. The mounting pad has a base provided with at least one fastening hole for a fastening member, a fastening member for fastening the placement pad and the pad attachment portion is fitted into the fastening hole; The fastening member has a second through hole along the fastening direction. The mounting mechanism according to claim 14.

19. a sealing member provided between the base and the one surface of the mounting mechanism so as to surround all of the first through holes in a plan view; The mounting mechanism according to claim 12 or 13.

20. A substrate transport mechanism that transfers a substrate to a table on which the substrate is placed or receives the substrate from the table, The mounting mechanism according to claim 12, In the mounting mechanism, the mounting pad is provided such that at least one of the portions of the outer edge having the smallest thickness faces a portion where the substrate placed on the mounting mechanism can come into contact with the platform. Substrate transport mechanism.

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