Light-emitting device

Abstract

To realize a reduction of a size of a light-emitting device having a light-emitting device and a light detection device.SOLUTION: A light detection device is arranged on an upper surface of a substrate so that a virtual line vertical to an emission end surface while passing through a first point as one point of two points crossed to an outer edge of a first light-emitting device by the virtual line passing through an inner side of the outer edge of the first light-emitting device in parallel to the emission end surface of the first light-emitting device in an upper view and a virtual line vertical to the emission end surface while passing through a second point as the other point. At least one part of a first wiring region is provided to a first region between the virtual line vertical to the emission end surface while passing through a third point as one point of the two points crossed to the outer edge of the light detection device by the virtual line passing through the inner side of the outer edge of the light detection device in parallel to the emission end surface in the upper surface view and the virtual line vertical to the emission end surface of a fourth point as the other point.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a light emitting device. [Background technology]

[0002] Patent Document 1 discloses an optical pickup device having a semiconductor laser element, a photodetector element, and a substrate on which a center electrode is formed. In the optical pickup device of Patent Document 1, the photodetector element for detecting return light is arranged at a position spaced apart laterally from the optical axis of the laser light emitted from the semiconductor laser element. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 7-161065 Summary of the Invention [Problem to be solved by the invention]

[0004] A light-emitting device equipped with a light-emitting element and a photodetector is miniaturized. [Means for solving the problem]

[0005] In an exemplary, non-limiting embodiment, the light emitting device of the present disclosure includes a base having an upper surface and a first wiring region provided on the upper surface, a first light emitting element disposed on the upper surface of the base and having an emission end surface that emits light, a photodetector disposed on the upper surface of the base and having a light receiving surface that receives at least a portion of the light emitted from the emission end surface, and a second wiring region; a first wiring that electrically connects the first wiring region and the second wiring region;and one or more wirings, wherein the photodetector is disposed on the upper surface of the base so that, in a top view, a virtual line passing through a first point, which is one of two points where a virtual line parallel to the emission edge surface and passing inside the outer edge of the first light-emitting element intersects with the outer edge of the first light-emitting element, and a virtual line passing through a second point, which is the other point, and is perpendicular to the emission edge surface, passes through the first point; and at least a part of the first wiring region is provided in a first region between a virtual line passing through a third point, which is one of two points where a virtual line parallel to the emission edge surface and passing inside the outer edge of the photodetector intersects with the outer edge of the photodetector, and a virtual line passing through a fourth point, which is the other point, and is perpendicular to the emission edge surface. [Effects of the Invention]

[0006] According to the light emitting device of the present disclosure, it is possible to achieve miniaturization of the light emitting device. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a perspective view of the light emitting device according to the first embodiment. [Figure 2] FIG. 2 is a perspective view of the light emitting device according to the first embodiment with the package cap removed. [Figure 3] FIG. 3 is a top view of the light emitting device according to the first embodiment with the package cap removed. [Figure 4] FIG. 4 is a front view of the light emitting device according to the first embodiment with the package cap removed. [Figure 5] FIG. 5 is a diagram for assisting in the description of predetermined points, virtual lines, regions, etc. in the light emitting device according to the first embodiment. [Figure 6] FIG. 6 is a perspective view of the light emitting device according to the second embodiment with the cap of the package removed. [Figure 7] FIG. 7 is a top view of the light emitting device according to the second embodiment with the package cap removed. [Figure 8]FIG. 8 is a diagram for assisting in the explanation of predetermined points, virtual lines, regions, etc. in the light emitting device according to the second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] In this specification and claims, polygons such as triangles and quadrilaterals are not limited to polygons in the strict mathematical sense, but also include shapes in which the corners of the polygon have been processed, such as rounded, chamfered, corner-cut, or rounded. Furthermore, shapes in which processing has been applied not only to the corners (edges) of a polygon, but also to the middle portions of the edges are also referred to as polygons. In other words, shapes in which partial processing has been applied while retaining the polygon as a base are included in the "polygon" described in this specification and claims.

[0009] This is not limited to polygons, but also applies to words that describe specific shapes such as trapezoids, circles, and irregularities. The same applies when dealing with the sides that form the shape. In other words, even if the corners or middle part of a side have been processed, the "side" includes the processed part. When distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" should be added, for example, "strict quadrangle."

[0010] In this specification or claims, when there are multiple elements identified by a certain name and each element needs to be distinguished, an ordinal number such as "first" or "second" may be added to the beginning of each element. For example, if a claim states that "two light-emitting elements are arranged on a substrate," the specification may state that "a first light-emitting element and a second light-emitting element are arranged on a substrate." The ordinal numbers "first" and "second" are used simply to distinguish between two light-emitting elements. The order of these ordinal numbers has no particular significance. Element names with the same ordinal number may not refer to the same element between the specification and the claims. For example, if elements identified with the terms "first light-emitting element," "second light-emitting element," and "third light-emitting element" are described in the specification, the "first light-emitting element" and "second light-emitting element" in the claims may correspond to the "first light-emitting element" and "third light-emitting element" in the specification. Furthermore, if the term "first light-emitting element" is used but the term "second light-emitting element" is not used in claim 1 described in the claims, the invention according to claim 1 may be sufficient as long as it includes one light-emitting element, and the light-emitting element is not limited to the "first light-emitting element" in the specification, but may correspond to the "second light-emitting element" or the "third light-emitting element."

[0011] In this specification or claims, terms indicating specific directions or positions (for example, "up," "down," "right," "left," and other terms including these terms) may be used. These terms are used merely to facilitate understanding of relative directions or positions in the referenced drawings. As long as the relationship of relative directions or positions indicated by terms such as "up" and "down" in the referenced drawings is the same, drawings other than those of this disclosure, actual products, manufacturing equipment, etc. may not be arranged in the same manner as in the referenced drawings.

[0012] The dimensions, dimensional ratios, shapes, spacing, etc. of elements or components shown in the drawings may be exaggerated for clarity, and some elements may be omitted to avoid overly complicated drawings.

[0013] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The embodiments embody the technical ideas of the present invention, but do not limit the present invention. The numerical values, shapes, materials, steps, and the order of steps shown in the description of the embodiments are merely examples, and various modifications are possible as long as no technical contradiction occurs. In the following description, elements identified by the same names and symbols are the same or similar elements, and redundant descriptions of these elements may be omitted.

[0014] First Embodiment A light emitting device 100 according to a first embodiment will be described with reference to the drawings. FIGS. 1 to 5 are drawings for explaining an exemplary embodiment of the light emitting device 100. FIG. 1 is a perspective view of the light emitting device 100 according to this embodiment. FIG. 2 is a perspective view of the light emitting device 100 with the cap 16 of the package 10 removed. FIG. 3 is a top view in the same state as FIG. 2. FIG. 4 is a front view in the same state as FIG. 2. FIG. 5 is a diagram for assisting in the description of specific points, virtual lines, regions, etc. in the light emitting device 100 according to this embodiment.

[0015] The light emitting device 100 includes a plurality of components, including a package 10, one or more light emitting elements 20, a submount 30, an optical member 40, a photodetector 50, a protection element 60A, a temperature measurement element 60B, and one or more wirings 70.

[0016] First, each component will be described.

[0017] (Package 10) The package 10 has a base 11 including a mounting surface 11M and sidewalls 12 surrounding the mounting surface 11M. The mounting surface 11M of the base 11 is an area on which other components are arranged. The package 10 also has a substrate 15 and a cap 16 fixed to the substrate 15. The substrate 15 has the base 11, and the cap 16 has the sidewalls 12.

[0018] When viewed from above, the outer shapes of both the base 11 and the cap 16 are rectangular. However, these outer shapes do not necessarily have to be rectangular, and may be polygonal shapes other than quadrangles, or shapes that include curves, bends, or irregularities in part or in whole.

[0019] The base 11 has one or more upper surfaces. The one or more upper surfaces of the base 11 include a mounting surface 11M. The one or more upper surfaces of the base 11 include a peripheral region 11P surrounding the mounting surface 11M. In the example of the light emitting device 100 shown in the figure, the mounting surface 11M and the peripheral region 11P are located on the same plane. However, they do not have to be on the same plane; for example, the mounting surface 11M and the peripheral region 11P may be provided on different upper surfaces having a difference in height.

[0020] The peripheral region 11P is a region to which the cap 16 is bonded. The peripheral region 11P is provided between the outline of the base 11 and the outline of the mounting surface 11M in a top view. In the example of the light emitting device 100 shown in the figure, the outline of the mounting surface 11M is rectangular in a top view, and the peripheral region 11P is provided over the four sides of this rectangle. The lower surface of the side portion of the cap 16 is bonded to the upper surface of the peripheral region 11P. A metal film for bonding to the cap 16 may be provided in the peripheral region 11P.

[0021] The package 10 has a light-transmitting region 13, which is a region that has light-transmitting properties. The package 10 also has a light-extraction surface 10A that includes the light-transmitting region 13. This light-extraction surface 10A is included in one of one or more outer surfaces of the side wall portion 12 of the package 10. Having light-transmitting properties means that the transmittance of the main light incident thereon is 80% or more. For example, if infrared light is the main light, then a material can be said to have light-transmitting properties if it has a transmittance of 80% or more for infrared light.

[0022] The entire cap 16 may be made of a light-transmitting material, or only the side surface may be made of a light-transmitting material. A portion including the light extraction surface 10A may be made of a first light-transmitting material, and the other portion may be made of a second light-transmitting material or a non-light-transmitting material.

[0023] The cap 16 may be formed integrally with its top and side portions. For example, it is possible to fabricate the cap 16 into a desired shape, such as a box-like shape, from a translucent material such as glass, plastic, or quartz using processing techniques such as molding or etching. The cap 16 may also be formed by joining a top portion (lid portion) and a side portion (frame portion) formed separately from different materials. For example, the top portion may be primarily made of monocrystalline or polycrystalline silicon, while the side portions may be primarily made of glass. The cap 16 may have, for example, a height of 2.5 mm or less and a rectangular outer side length of 8 mm or less when viewed from above. It may also have, for example, a height of 2 mm or less and a rectangular outer side length of 4 mm or less when viewed from above.

[0024] In the illustrated example of the light emitting device 100, the light extraction surface 10A is perpendicular to the direction in which the mounting surface 11M extends. Note that the term "perpendicular" here includes a difference of ±5 degrees or less. Furthermore, the light extraction surface 10A does not need to be perpendicular to the direction in which the mounting surface 11M of the base 11 extends, and may be inclined.

[0025] A plurality of wiring regions 14 are provided on the upper surface of the base 11. The plurality of wiring regions 14 are provided on the mounting surface 11M of the base 11. In FIG. 3, instead of assigning reference numerals to all of the wiring regions 14, all of the wiring regions 14 are similarly hatched. The plurality of wiring regions 14 may pass through the inside of the base 11 and be electrically connected to a wiring region provided on the lower surface of the base 11. A wiring region electrically connected to the wiring region 14 is not limited to being provided on the lower surface of the base 11, but may also be provided on another outer surface (upper surface or outer surface) of the base 11. The plurality of wiring regions 14 may be patterned films, layers, or vias formed from a conductor such as a metal.

[0026] The substrate 15 can be formed primarily from ceramic. Examples of ceramics that can be used for the substrate 15 include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide.

[0027] In this embodiment, the substrate 15 may be formed, for example, from a ceramic substrate having a plurality of metal vias therein. The substrate 15 preferably includes a material with better heat dissipation properties (higher thermal conductivity) than ceramic in the portion that comes into thermal contact with the heat-generating component. Examples of such materials include copper, aluminum, iron, copper molybdenum, copper tungsten, and a copper-diamond composite.

[0028] (Light-emitting element 20) The light-emitting element 20 has an emission end face 21 from which light is emitted. An example of the light-emitting element 20 is a semiconductor laser element. The light-emitting element 20 may have a rectangular outer shape when viewed from above. When the light-emitting element 20 is an edge-emitting semiconductor laser element, the side surface that intersects with one of the two short sides of the rectangle when viewed from above is the light-emitting end face 21. In this example, the upper and lower surfaces of the light-emitting element 20 have a larger area than the emission end face 21. The light-emitting element 20 is not limited to an edge-emitting semiconductor laser element, but may also be a surface-emitting semiconductor laser element, a light-emitting diode (LED), or the like.

[0029] The light-emitting element 20 is a single-emitter element having at least one emitter. However, the light-emitting element 20 may be a multi-emitter element having two or more emitters. When the light-emitting element 20 is a semiconductor laser element having multiple emitters, one common electrode can be provided on either the top or bottom surface of the light-emitting element 20, and two electrodes corresponding to the respective emitters can be provided on the other surface.

[0030] The light emitted from the light emitting end surface 21 of the light emitting element 20 is divergent light having a spread. However, it does not have to be divergent light. When the light emitting element 20 is a semiconductor laser element, the divergent light (laser light) emitted from the semiconductor laser element forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light emitting surface. The FFP refers to the shape and light intensity distribution of the emitted light at a position away from the light emitting surface.

[0031] The light passing through the center of the elliptical shape of the FFP, in other words, the light with peak intensity in the light intensity distribution of the FFP, is called the light traveling along the optical axis. Also, the optical path of the light traveling along the optical axis is called the optical axis of that light. Also, in the light intensity distribution of the FFP, the light with a peak intensity of 1 / e 2 Light having an intensity equal to or greater than this will be referred to as the "main portion" of light.

[0032] In the elliptical shape of the FFP of light emitted from the light emitting element 20, which is a semiconductor laser element, the minor axis direction of the ellipse is the parallel direction of the FFP, and the major axis direction is the vertical direction of the FFP. Multiple layers, including an active layer, that make up the semiconductor laser element are stacked in the vertical direction of the FFP.

[0033] Based on the light intensity distribution of the FFP, the angle equivalent to the full width at half maximum of the light intensity distribution is defined as the light divergence angle of the semiconductor laser element. The light divergence angle in the direction perpendicular to the FFP is called the perpendicular divergence angle, and the light divergence angle in the direction parallel to the FFP is called the parallel divergence angle.

[0034] For example, a semiconductor laser element that emits blue light, a semiconductor laser element that emits green light, or a semiconductor laser element that emits red light can be used as the light emitting element 20. Also, a semiconductor laser element that emits light other than these may be used.

[0035] Here, blue light refers to light whose peak emission wavelength is in the range of 420 nm to 494 nm, green light refers to light whose peak emission wavelength is in the range of 495 nm to 570 nm, and red light refers to light whose peak emission wavelength is in the range of 605 nm to 750 nm.

[0036] Examples of semiconductor laser elements that emit blue light or green light include semiconductor laser elements that contain nitride semiconductors. Examples of nitride semiconductors that can be used include GaN, InGaN, and AlGaN. Examples of semiconductor laser elements that emit red light include those that contain InAlGaP-based, GaInP-based, GaAs-based, and AlGaAs-based semiconductors.

[0037] (Submount 30) The submount 30 has two bonding surfaces and is configured in the shape of a rectangular parallelepiped. One bonding surface is provided on the opposite side of the other bonding surface. The distance between the two bonding surfaces is smaller than the distance between the other two opposing surfaces. The shape of the submount 30 is not limited to a rectangular parallelepiped. The submount 30 can be formed using, for example, silicon nitride, aluminum nitride, or silicon carbide. A metal film for bonding is provided on the bonding surfaces.

[0038] (Optical member 40) The optical member 40 has a partially reflective surface 41. The partially reflective surface 41 reflects a portion of the incident light and transmits the remaining light. The light incident on the partially reflective surface 41 is split into two beams of light traveling in different directions. The two split beams contain light of the same wavelength. The optical member 40 splits the same wavelength component of the incident light into two beams at a predetermined ratio.

[0039] For example, one of the two lights separated by the optical member 40 can be used as a main light, and the other can be used as a monitor light for controlling the main light. Alternatively, for example, each of the two lights can be used as a main light.

[0040] When incident light is split into main light and monitor light, the intensity of the monitor light is smaller than that of the main light. The partially reflective surface 41, for example, transmits 80% or more of the incident light to be used as the main light, and reflects 20% or less of the incident light to be used as the monitor light. The intensity of the monitor light may be 5% to 10% of the intensity of the main light. For example, it may be about 5% or less.

[0041] The reflectance of partially reflective surface 41 can change depending on the wavelength of the incident light. Therefore, when light of different colors is incident on one partially reflective surface 41, the reflectance may differ depending on the color. It is not necessary to make the reflectance equal for all colors of light. It is sufficient to design the partially reflective surface 41 so that it has an appropriate reflectance for the light to be reflected by it.

[0042] The partially reflective surface 41 is inclined with respect to the lower surface of the optical member 40. The partially reflective surface 41 is configured as a flat surface that forms an inclination angle of, for example, 40 degrees or more and 50 degrees or less with respect to the lower surface of the optical member 40. In the example of the light-emitting device 100 shown in the figures, the partially reflective surface 41 is configured as a flat surface that forms an inclination angle of 45 degrees with respect to the lower surface.

[0043] The optical member 40 is formed in the shape of a rectangular parallelepiped. However, the shape of the optical member 40 is not limited to a rectangular parallelepiped. The optical member 40 has an upper surface parallel to its lower surface. It is preferable that the optical member 40 includes a bonding surface for fixing the optical member 40 to another member. For example, the lower surface of the optical member 40 can function as a bonding surface.

[0044] (Photodetector 50) The photodetector 50 has a light receiving surface 52. The photodetector 50 has an upper surface, a lower surface, and one or more side surfaces. The light receiving surface 52 is provided on the upper surface of the photodetector 50. The outer shape of the photodetector 50 is a rectangular parallelepiped. However, the outer shape of the photodetector 50 may be different from a rectangular parallelepiped.

[0045] The light receiving surface 52 is provided with one or more light receiving regions 53. Each of the one or more light receiving regions 53 is a photoelectric conversion element that outputs an electrical signal in accordance with the intensity or amount of incident light. A typical example of such a photoelectric conversion element is a photodiode.

[0046] The photodetector 50 may be configured to have a plurality of light-receiving regions 53, including a first light-receiving region 53a and a second light-receiving region 53b. The photodetector 50 may also be configured to have a plurality of light-receiving regions 53, further including a third light-receiving region 53c. The number of light-receiving regions 53 does not need to be limited to three.

[0047] The multiple light receiving regions 53 are arranged side by side at a predetermined interval. Here, the direction in which the multiple light receiving regions 53 are arranged is referred to as the "first direction." Furthermore, the direction perpendicular to the first direction in a top view is referred to as the "second direction." Furthermore, the direction perpendicular to the first direction and the second direction is referred to as the "third direction." In the figure, 1D is an example of the "first direction," 2D is an example of the "second direction," and 3D is an example of the "third direction."

[0048] The light-receiving surface 52 has a rectangular outer shape. The length of the light-receiving surface 52 in the first direction is greater than the length of the light-receiving surface 52 in the second direction. The length of the light-receiving surface of the photodetector 50 in the first direction may be the same as or smaller than the length of the light-receiving surface in the second direction.

[0049] The multiple light receiving regions 53 are arranged at intervals. That is, when viewed from above, the light receiving regions 53 are spaced apart and do not overlap. The intervals do not have to be constant. The multiple light receiving regions 53 are also arranged close to each other.

[0050] Each light receiving region 53 has a rectangular outer shape on the light receiving surface 52. The shape of the light receiving region 53 is not limited to a rectangle and can be designed appropriately depending on the shape of light incident on the light receiving surface 52. In the example of the photodetector 50 shown in the figure, each light receiving region 53 has a rectangular outer shape. Two of the four sides constituting the rectangle (the shorter sides in the case of a rectangle) are parallel to the first direction. Here, "parallel" includes a difference of ±5 degrees or less.

[0051] The photodetector 50 has one or more wiring regions 54. The one or more wiring regions 54 are provided on the top surface of the photodetector 50. The wiring regions 54 may be provided on a surface other than the top surface of the photodetector 50. Each wiring region 54 is electrically connected to the light-receiving region 53.

[0052] In the illustrated example of the photodetector 50, electrical connection to all of the light-receiving regions 53 arranged on the light-receiving surface 52 is achieved by the multiple wiring regions 54. Specifically, three of the four wiring regions 54 do not overlap with one another and serve as anode electrodes for any of the three light-receiving regions 53. The remaining one is a cathode electrode common to the three light-receiving regions 53.

[0053] (protective element 60A) The protective element 60A is a circuit element that prevents a specific element (e.g., the light-emitting element 20) from being destroyed by excessive current. A typical example of the protective element 60A is a constant voltage diode such as a Zener diode. A Si diode can be used as the Zener diode.

[0054] (Temperature measuring element 60B) The temperature measuring element 60B is an element used as a temperature sensor for measuring the ambient temperature, and may be, for example, a thermistor.

[0055] (Wiring 70) The wiring 70 is made of a conductor having a linear shape with joints at both ends. In other words, the wiring 70 has joints at both ends of the linear portion for joining to other components. The wiring 70 is, for example, a metal wire. Examples of metals include gold, aluminum, silver, copper, etc.

[0056] (Light emitting device 100) Next, the light emitting device 100 will be described.

[0057] In the example of the light-emitting device 100 described below, one or more light-emitting elements 20 are edge-emitting semiconductor laser elements. The multiple wirings 70 include one or more wirings 71 electrically connected to the light-emitting elements 20 and one or more wirings 72 electrically connected to the photodetector 50. In the illustrated light-emitting device 100, the wirings 72a, 72b, 72c, and 72d are each the wirings 72 electrically connected to the photodetector 50.

[0058] In the light emitting device 100, one or more light emitting elements 20 are arranged on the mounting surface 11M. The one or more light emitting elements 20 are surrounded by the sidewall portion 12. Each light emitting element 20 is arranged on the mounting surface 11M via a submount 30. Note that multiple light emitting elements 20 may be arranged on one submount 30. Alternatively, one or more light emitting elements 20 may be arranged directly on the mounting surface 11M without using a submount 30.

[0059] The one or more light-emitting elements 20 may include a first light-emitting element 20a and a second light-emitting element 20b. Furthermore, the one or more light-emitting elements 20 may include a third light-emitting element 20c. In top view, the first light-emitting element 20a is sandwiched between the second light-emitting element 20b and the third light-emitting element 20c.

[0060] The light emitted from the first light-emitting element 20a has a peak wavelength different from that of the light emitted from the second light-emitting element 20b. The light emitted from the third light-emitting element 20c has a peak wavelength different from that of the light emitted from the first light-emitting element 20a and the light emitted from the second light-emitting element 20b.

[0061] For example, the first light-emitting element 20a is a semiconductor laser element that emits green light. The second light-emitting element 20b is a semiconductor laser element that emits red light. The third light-emitting element 20c is a semiconductor laser element that emits blue light. Note that the color of light emitted by each light-emitting element 20 is not limited to this, and is not limited to visible light.

[0062] The first light-emitting element 20a and the second light-emitting element 20b are arranged side by side in a first direction in a top view. The first light-emitting element 20a and the second light-emitting element 20b are arranged side by side so that the light-emitting end surface 21a of the first light-emitting element 20a and the light-emitting end surface 21b of the second light-emitting element 20b are parallel to each other. The light-emitting end surface 21a and the light-emitting end surface 21b face in the same direction. Note that the light-emitting end surface 21a and the light-emitting end surface 21b do not have to be parallel to each other or face in the same direction.

[0063] The first light-emitting element 20a and the third light-emitting element 20c are arranged side by side in the first direction in a top view. The light-emitting end surface 21a of the first light-emitting element 20a and the light-emitting end surface 21c of the third light-emitting element 20c are arranged side by side so as to be parallel to each other. The light-emitting end surface 21a and the light-emitting end surface 21c face in the same direction. Note that the light-emitting end surface 21a and the light-emitting end surface 21c do not have to be parallel to each other or face in the same direction.

[0064] The one or more light-emitting elements 20 emit light from an output end face 21 toward the light extraction surface 10A. The one or more light-emitting elements 20 emit divergent light. The light emitted from the output end face 21 travels along an optical axis parallel to the mounting surface 11M.

[0065] In the light emitting device 100, the submount 30 is disposed on the mounting surface 11M. One bonding surface of the submount 30 is bonded to the light emitting element 20. The other bonding surface on the opposite side is bonded to the mounting surface 11M. The light emitting device 100 may have multiple submounts 30.

[0066] In the light emitting device 100, the photodetector 50 is disposed on the mounting surface 11M. The photodetector 50 is surrounded by the sidewall portion 12. In top view, the photodetector 50 is disposed between the light extraction surface 10A and the light emitting element 20. The photodetector 50 is disposed so that the light receiving surface 52 faces upward. In the illustrated example of the light emitting device 100, the light receiving surface 52 is parallel to the mounting surface 11M. Here, "parallel" includes a difference of ±5 degrees or less.

[0067] The multiple wiring regions 14 provided on the upper surface of the base 11 include a wiring region 14 electrically connected to the light-emitting element 20 and a wiring region 14 electrically connected to the photodetector 50. Wiring regions 14a1, 14b1, 14c1, and 14d1 shown in FIG. 3 are wiring regions 14 electrically connected to the photodetector 50. Hereinafter, one or more wiring regions 14 electrically connected to the photodetector 50 will be collectively referred to as a first wiring region. It can be said that the light-emitting device 100 is provided with a first wiring region having multiple wiring regions 14 spaced apart from one another.

[0068] The photodetector 50 is disposed on the upper surface of the substrate 15 so that, in top view, a virtual line L1 that is parallel to the emitting end surface 21a and passes inside the outer edge of the first light-emitting element 20a intersects with the outer edge of the first light-emitting element 20a at two points, one of which is point p1a, and a virtual line L11 that is perpendicular to the emitting end surface 21a passes through this point.Furthermore, the photodetector 50 is disposed on the upper surface of the substrate 15 so that, in top view, a virtual line L12 that is perpendicular to the emitting end surface 21a and passes through the other point p2a passes through this point.

[0069] Furthermore, at least a portion of the first wiring region is provided in region A1 between two points where imaginary line L2, which is parallel to emitting end face 21a and passes inside the outer edge of photodetector 50, intersects with the outer edge of photodetector 50: imaginary line L13 passing through point p3 and perpendicular to emitting end face 21, and imaginary line L14 passing through point p4 and perpendicular to emitting end face 21. This allows the light emitting device 100 to be miniaturized in the first direction 1D.

[0070] The photodetector 50 is disposed on the upper surface of the substrate 15 so that, in a top view, imaginary line L1, which is parallel to the output end surface 21b and / or the output end surface 21c and passes through the inside of the outer edges of the second light-emitting element 20b and / or the third light-emitting element 20c, respectively, and imaginary lines L21 and / or L31, which are perpendicular to the output end surface 21b and / or c, pass through point p1b and / or point p1c, which is one of two points where the imaginary line L1 intersects with the outer edges of the second light-emitting element 20b and / or the third light-emitting element 20c. The photodetector 50 is also disposed on the upper surface of the substrate 15 so that imaginary lines L22 and / or L32, which are perpendicular to the output end surface 21b and / or the output end surface 21c, pass through point p2b and / or point p2c, which is the other point, in a top view.

[0071] The photodetector 50 is disposed on the upper surface of the substrate 15 so that, in top view, a virtual line L41 that is perpendicular to the output end surface 21a passes through point p1d, one of two points where a virtual line L1 that is parallel to the output end surface 21a and passes inside the outer edge of the submount 30 intersects with the outer edge of the submount 30. In addition, the photodetector 50 is disposed on the upper surface of the substrate 15 so that a virtual line L42 that is perpendicular to the output end surface 21a passes through the other point p2d, in top view.

[0072] At least a portion of each of the plurality of wiring regions 14 included in the first wiring region is provided in the region A1. In the light emitting device 100 shown in the figure, at least a portion of each of the wiring regions 14a1, 14b1, 14c1, and 14d1 is provided in the region A1.

[0073] The plurality of wiring regions 14 included in the first wiring region include, in top view, a wiring region 14 provided in a region including point p2a, and a wiring region 14 provided in a region not including point p2a, with virtual line L11 as the boundary. By distributing the plurality of wiring regions 14 across these two regions in this way, the space on the upper surface of base 11 can be effectively utilized, contributing to the miniaturization of light emitting device 100.

[0074] The first wiring region includes two wiring regions 14, at least a portion of which is provided in an area separated by the virtual line L11 and not including the point p2a. In the illustrated light emitting device 100, the wiring region 14a1 and the wiring region 14b1 correspond to these two wiring regions 14. Furthermore, the entirety of these two wiring regions 14 is provided in an area separated by the virtual line L11 and not including the point p2a.

[0075] The first wiring region also includes two wiring regions 14, at least a portion of which is provided in an area separated by the virtual line L12 and not including point p1a. In the illustrated light emitting device 100, wiring region 14c1 and wiring region 14d1 correspond to these two wiring regions 14. Furthermore, the entirety of these two wiring regions 14 is provided in an area separated by the virtual line L12 and not including point p1a.

[0076] In a top view, the second light-emitting element 20b is arranged in a region separated by the imaginary line L11 and not including point p2a, and the third light-emitting element 20c is arranged in a region separated by the imaginary line L12 and not including point p1a. The second light-emitting element 20b is arranged at a position closer to the wiring region 14 provided in the region separated by the imaginary line L11 and not including point p2a than the wiring region 14 provided in the region separated by the imaginary line L12 and not including point p1a. The third light-emitting element 20c is arranged at a position closer to the wiring region 14 provided in the region separated by the imaginary line L12 and not including point p1a than the wiring region 14 provided in the region separated by the imaginary line L11 and not including point p2a.

[0077] The multiple wiring regions 14 included in the first wiring region include two wiring regions 14 that are spaced apart in a direction perpendicular to the light-emitting end surface 21. These two wiring regions 14 are arranged side by side in a direction perpendicular to the light-emitting end surface 21. At least a portion of each of these two wiring regions 14 is provided in region A1. In the illustrated light-emitting device 100, wiring region 14a1 and wiring region 14b1 correspond to these two wiring regions 14. Wiring region 14c1 and wiring region 14d1 also correspond to these two wiring regions 14. Both the two wiring regions 14, wiring region 14a1 and wiring region 14b1, and the two wiring regions 14, wiring region 14c1 and wiring region 14d1, are partially provided in region A1.

[0078] Region A1 may be defined as the region between imaginary lines L13 and L14, and between imaginary lines L10, which is perpendicular to the light-emitting end face 21a and passes inside the outer edge of the first light-emitting element 20a in a top view, and imaginary line L3, which passes through point p5 and is parallel to the light-emitting end face 21a, and imaginary line L4, which passes through point p6 and is parallel to the light-emitting end face 21a (see FIG. 5). In this case, the above description of the first wiring region also applies.

[0079] The first wiring region is electrically connected to a wiring region 54 of the photodetector 50. Wiring regions 54a, 54b, 54c, and 54d shown in FIG. 3 are each a wiring region 54 electrically connected to the first wiring region. Hereinafter, one or more wiring regions 54 electrically connected to the first wiring region will be collectively referred to as a second wiring region. The photodetector 50 can be said to have a second wiring region having a plurality of wiring regions 54 spaced apart from one another.

[0080] The plurality of wiring regions 54 in the second wiring region include a wiring region 54 provided between the virtual lines L11 and L13, and a wiring region 54 provided between the virtual lines L12 and L14.

[0081] The wiring region 54 provided between the virtual lines L11 and L13 may be provided between the virtual lines L21 and L13. The wiring region 54 may also be provided between the virtual lines L41 and L13. The virtual line L13 passes through a wiring region 14 that is electrically connected to the wiring region 54. The wiring region 14 extends further in the first direction 1D than the wiring region 54.

[0082] The wiring region 54 provided between the virtual lines L12 and L14 may be provided between the virtual lines L32 and L14. The wiring region 54 may also be provided between the virtual lines L42 and L14. The virtual line L14 passes through a wiring region 14 that is electrically connected to the wiring region 54. The wiring region 14 extends further in the first direction 1D than the wiring region 54.

[0083] Of the multiple wiring regions 14 provided on the upper surface of the base 11, one or more wiring regions 14 electrically connected to the light emitting element 20 will be collectively referred to as a third wiring region. It can be said that the light emitting device 100 is provided with a third wiring region having multiple wiring regions 14 spaced apart from one another.

[0084] The distance from the third wiring region to the photodetector 50 is greater than the distance from the first wiring region to the photodetector 50. The third wiring region is provided in a region that does not include the photodetector 50, with a virtual line L3 that passes through the output end face 21 and is parallel to the output end face 21 as a boundary, in a top view, and is not provided in a region that includes the photodetector 50.

[0085] The wiring region 14 included in the first wiring region and the wiring region 14 included in the third wiring region are arranged side by side in the second direction 2D. The length in the second direction of the first wiring region is smaller than the length in the second direction of the third wiring region. Of these two wiring regions 14 arranged side by side, the length in the first direction of the wiring region 14 included in the first wiring region is equal to or shorter than the length in the first direction of the wiring region 14 included in the third wiring region.

[0086] In the light emitting device 100, a protective element 60A is arranged on the third wiring region. The protective element 60A is provided to protect the light emitting elements 20. The protective element 60A that protects the first light emitting element 20a is arranged across two wiring regions 14 that are electrically connected to the first light emitting element 20a. The protective element 60A that protects the second light emitting element 20b is arranged across two wiring regions 14 that are electrically connected to the second light emitting element 20b. The protective element 60A that protects the third light emitting element 20c is arranged across two wiring regions 14 that are electrically connected to the third light emitting element 20c.

[0087] The length in the second direction of the wiring region 14 included in the first wiring region is smaller than the length in the second direction of the wiring region 14 included in the third wiring region. Making the length in the second direction of the wiring region 14 included in the first wiring region smaller than that of the wiring region 14 in the third wiring region in which components such as the protection element 60A are arranged can contribute to miniaturization of the light emitting device 100.

[0088] Of the multiple wiring regions 14 provided on the upper surface of the base 11, one or more wiring regions 14 electrically connected to the temperature measuring element 60B will be collectively referred to as a fourth wiring region. It can be said that the light emitting device 100 is provided with a fourth wiring region having multiple wiring regions 14 spaced apart from one another.

[0089] The distance from the fourth wiring region to the photodetector 50 is greater than the distance from the first wiring region to the photodetector 50. The fourth wiring region is provided in a region that does not include the photodetector 50, with a virtual line L3 that passes through the output end face 21 and is parallel to the output end face 21 as a boundary, in a top view, and is not provided in a region that includes the photodetector 50.

[0090] In the light emitting device 100, the wiring 71 electrically connects the light emitting element 20 and the third wiring region. The wiring 71 is joined to the third wiring region. The wiring 72 is joined to the first wiring region and the second wiring region. One wiring 72 is joined to one of the multiple wiring regions 14 included in the first wiring region and one of the multiple wiring regions 14 included in the second wiring region. The light emitting device 100 has the same number of wirings 72 as the number of wiring regions 14 included in the first wiring region. Note that the light emitting device 100 may have a greater number of wirings 72.

[0091] In the light emitting device 100, a wiring 72a is joined to one of two wiring regions 14a1, 14b1, and a wiring 72b is joined to the other. In a top view, of the regions divided into two by a virtual line L3, the wiring 72a is joined to the first wiring region in one region, and the wiring 72b is joined to the first wiring region in the other region. The wiring 72a, which is joined to the wiring region 14a1, which is closer to the photodetector 50, of the two wiring regions 14, is joined to the wiring region 54a, which is farther from the first wiring region, of the two wiring regions 54a, 54b.

[0092] In the light emitting device 100, a wiring 72c is joined to one of two wiring regions 14c1, 14d1, and a wiring 72d is joined to the other. In a top view, of the regions divided into two by a virtual line L3, the wiring 72c is joined to the first wiring region in one region, and the wiring 72d is joined to the first wiring region in the other region. The wiring 72c, which is joined to the wiring region 14c1, which is closer to the photodetector 50, of the two wiring regions 14, is joined to the wiring region 54c, which is farther from the first wiring region, of the two wiring regions 54c, 54d.

[0093] The distance in the first direction 1D between the position where the wiring 72a is joined to the wiring region 54a and the position where the wiring 72b is joined to the wiring region 54b is smaller than the distance in the first direction 1D between the position where the wiring 72a is joined to the wiring region 14a1 and the position where the wiring 72b is joined to the wiring region 14b1. This allows electrical connection to be achieved in a small first wiring region, which can contribute to miniaturization of the light emitting device 100.

[0094] In the light emitting device 100, the optical member 40 is disposed above the photodetector 50. The optical member 40 is disposed on the upper surface of the photodetector 50. The optical member 40 is bonded to the photodetector 50. The optical member 40 is mounted so that the lower surface of the optical member 40 faces the light receiving surface 52 of the photodetector 50.

[0095] The optical member 40 is disposed at a position where the virtual lines L11 and L12 pass in a top view. The optical member 40 is disposed at a position where the virtual lines L21 and L22 pass in a top view. The optical member 40 is disposed at a position where the virtual lines L31 and L32 pass in a top view. The optical member 40 is disposed at a position where the virtual lines L41 and L42 pass in a top view. The optical member 40 is disposed between two wiring regions 54 included in the second wiring region in a top view.

[0096] In top view, any imaginary line that is perpendicular to the emitting end surface 21a and passes through the optical member 40 does not pass through the wiring region 14 that is included in the first wiring region. By arranging the optical member 40 in this manner, the second wiring region and the first wiring region can be brought closer to each other, which can contribute to miniaturization of the light emitting device 100.

[0097] Light emitted from one or more light-emitting elements 20 is incident on the optical member 40. A major portion of the light emitted from one or more light-emitting elements 20 is incident on the optical member 40. Divergent light emitted from one or more light-emitting elements 20 is incident on the optical member 40.

[0098] The optical member 40 reflects a portion of the incident divergent light and transmits the remaining light. The incident light is separated into transmitted light and reflected light by the partially reflecting surface 41 of the optical member 40. The transmitted light is emitted from the light extraction surface 10A, and the reflected light is irradiated onto the light receiving surface 52 of the photodetector 50. Of the transmitted light and reflected light separated by the optical member 40, the transmitted light can be used as main light, and the reflected light can be used as monitor light.

[0099] The light receiving surface 52 of the photodetector 50 receives at least a portion of the light emitted from the emission end surface of the light emitting element 20. Note that instead of receiving light optically controlled by the optical member 40, the photodetector 50 may also receive a portion of the light emitted from the light emitting element 20 without passing through the optical member 40.

[0100] The first light receiving region 53a of the photodetector 50 receives a portion of the light emitted from the first light-emitting element 20a. In a top view, the first light receiving region 53a is disposed so that the imaginary lines L11 and L12 pass through it. In the photodetector 50, only the first light receiving region 53a receives a major portion of the light emitted from the first light-emitting element 20a.

[0101] The second light receiving region 53b of the photodetector 50 receives a portion of the light emitted from the second light emitting element 20b. In a top view, the second light receiving region 53b is disposed so that the imaginary lines L21 and L22 pass through it. In the photodetector 50, only the second light receiving region 53b receives a major portion of the light emitted from the second light emitting element 20b.

[0102] The third light receiving region 53c of the photodetector 50 receives a portion of the light emitted from the third light emitting element 20c. In a top view, the third light receiving region 53c is disposed so that the imaginary lines L31 and L32 pass through the third light receiving region 53c. In the photodetector 50, only the third light receiving region 53c receives a major portion of the light emitted from the third light emitting element 20c.

[0103] In a direction parallel to the emission end surface 21a of the first light-emitting element 20a in a top view, the length of the submount 30 is smaller than the length of the photodetector 50. In addition, in a direction perpendicular to the emission end surface 21a of the first light-emitting element 20a in a top view, the length of the submount 30 is greater than the length of the photodetector 50. By providing a photodetector 50 with such a shape, a compact light-emitting device 100 can be realized. Note that the direction parallel to the emission end surface 21a of the first light-emitting element 20a can be the same as the first direction 1D.

[0104] Light-receiving surface 52 is provided at a position lower than the light emission point of light-emitting element 20. With this arrangement, light-receiving region 53 can be provided directly below partially reflecting surface 41, and the size of light-emitting device 100 in second direction 2D can be reduced.

[0105] In top view, the length of the photodetector 50 in the first direction 1D is greater than the length of the submount 30 in the first direction 1D. In top view, the difference between the length of the photodetector 50 in the first direction 1D and the length of the submount 30 in the first direction 1D is smaller than the length of the submount 30 in the first direction 1D. By satisfying this relationship, it is possible to prevent the relative size ratio of the photodetector 50 to the submount 30 from becoming too large, which can contribute to miniaturization of the light emitting device 100.

[0106] In top view, one or more light receiving regions 53 are arranged within an area sandwiched between two straight lines that are parallel to the second direction 2D and pass through both ends of the submount 30 in the first direction 1D. In top view, one or more wiring regions 54 are arranged outside the area sandwiched between these two straight lines. By satisfying this relationship, the size of the light emitting device 100 in the first direction can be reduced.

[0107] In the light emitting device 100, one or more light emitting elements 20 are arranged in a sealed closed space inside the package 10. By bonding the substrate 15 and the cap 16 under a predetermined atmosphere, a hermetically sealed closed space is created inside the package 10. By hermetically sealing the space in which the light emitting elements 20 are arranged, quality deterioration due to dust collection can be suppressed.

[0108] Second Embodiment A light emitting device 200 according to a second embodiment will now be described. Fig. 6 is a perspective view of the light emitting device according to the second embodiment, with the package cap removed. Fig. 7 is a top view of the light emitting device according to the second embodiment, with the package cap removed. Fig. 8 is a diagram for assisting in the description of specific points, virtual lines, regions, etc. in the light emitting device according to the second embodiment.

[0109] The light emitting device 200 of the second embodiment is the same as the light emitting device 100 of the first embodiment, except for the way in which the first wiring region is provided. Therefore, the light emitting device 200 is as described in the first embodiment, except for the way in which the first wiring region is provided. Furthermore, among the descriptions of the first embodiment, the descriptions related to the first wiring region that are inconsistent with FIGS. 7 and 8 also apply to the second embodiment. Wiring regions 14a1, 14b1, 14c1, and 14d1 shown in FIG. 7 are wiring regions 14 included in the first wiring region of the light emitting device 200.

[0110] In the light emitting device 200, the multiple wiring regions 14 included in the first wiring region include two wiring regions 14 that are spaced apart in a direction parallel to the light emitting end surface 21. These two wiring regions 14 are arranged side by side in a direction parallel to the light emitting end surface 21. At least a portion of one of these two wiring regions 14 is provided in region A1. Furthermore, at least a portion of the other of these two wiring regions 14 is provided outside region A1. In the illustrated light emitting device 200, wiring region 14a2 and wiring region 14b2 correspond to these two wiring regions 14. Furthermore, wiring region 14c2 and wiring region 14d2 also correspond to these two wiring regions 14. In both of the two wiring areas 14, wiring area 14a2 and wiring area 14b2, and the two wiring areas 14, wiring area 14c2 and wiring area 14d2, the entirety of one of the two wiring areas 14 is located between virtual line L13 and virtual line L14.

[0111] In the light emitting device 200, the length in the second direction of the wiring region 14 included in the first wiring region is greater than the length in the second direction of the wiring region 14 included in the third wiring region. On the other hand, the length in the first direction of the wiring region 14 included in the first wiring region is smaller than the length in the first direction of the wiring region 14 included in the third wiring region. Arranging the wiring region 14 included in the first wiring region and the wiring region 14 included in the third wiring region in this manner can also contribute to miniaturization of the light emitting device 200.

[0112] Although the embodiments of the present invention have been described above, the light-emitting device according to the present invention is not strictly limited to the light-emitting device of the embodiments. In other words, the present invention can be realized without being limited to the external shape and structure of the light-emitting device disclosed in the embodiments. For example, a light-emitting device without a protective element may be used. Furthermore, the present invention may be applied without necessarily including all necessary and sufficient components. For example, if the claims do not recite some of the components of a light-emitting device disclosed in the embodiments, the claims allow for the design freedom of those components by those skilled in the art, such as substitution, omission, modification of shape, and change of material, and specify that the invention described in the claims is applicable. [Industrial Applicability]

[0113] The light emitting device according to each embodiment can be used in head-mounted displays, projectors, lighting, displays, and the like. [Explanation of symbols]

[0114] 10 packages 10A light extraction surface 11 Base 11M mounting surface 11P surrounding area 12 Side wall 13 Translucent area 14 Wiring area 14a1, 14b1, 14c1, 14d1, 14a2, 14b2, 14c2, 14d2 1st wiring area 15 PCB 16 Cap 20 Light-emitting element 20a First light-emitting element 20b Second light-emitting element 20c Third light-emitting element 21, 21a, 21b, 21c Output end face 30 Submount 40 Optical Components 41 Partially reflective surface 50 Photodetector 52 Photosensitive surface 53 Light receiving area 53a 1st light receiving area 53b 2nd light receiving area 53c 3rd light receiving area 54 Wiring area 54a, 54b, 54c, 54d 2nd wiring area 60A protection element 60B Temperature measuring element 70 Wiring 71 Wiring 72, 72a, 72b, 72c, 72d wiring 100, 200 Light-emitting device

Claims

1. a base having an upper surface and a first wiring region provided on the upper surface; a first light-emitting element disposed on an upper surface of the base and having an emission end surface for emitting light; a photodetector disposed on an upper surface of the base, the photodetector having a light receiving surface that receives at least a portion of the light emitted from the light emitting end surface, and a second wiring region; one or more wirings including a first wiring that electrically connects the first wiring region and the second wiring region; Equipped with the photodetector is disposed on the upper surface of the base so that, in a top view, a virtual line that is parallel to the light emitting end surface and passes through the inside of an outer edge of the first light emitting element intersects with the outer edge of the first light emitting element at two points, one of which is a first point and is perpendicular to the light emitting end surface, and the other of which is a second point and is perpendicular to the light emitting end surface, passes through the first point; A light-emitting device in which at least a portion of the first wiring region is provided in a first region between two points where a virtual line parallel to the light-emitting end face and passing inside the outer edge of the photodetector intersects with the outer edge of the photodetector: a virtual line passing through a third point, which is one of the two points, and perpendicular to the light-emitting end face; and a virtual line passing through a fourth point, which is the other point, and perpendicular to the light-emitting end face.

2. 2. The light-emitting device of claim 1, wherein the first region is a region between two points where a virtual line perpendicular to the light-emitting end face and passing inside the outer edge of the first light-emitting element intersects with the outer edge of the first light-emitting element: a virtual line passing through one point and parallel to the light-emitting end face, and a virtual line passing through the other point and parallel to the light-emitting end face.

3. the first wiring region includes a plurality of wiring regions spaced apart from one another; The light emitting device according to claim 1 , wherein at least a portion of each of the plurality of wiring regions is provided in the first region.

4. The light emitting device according to claim 3 , wherein the plurality of wiring regions include two wiring regions spaced apart from each other in a direction perpendicular to the light emitting end surface.

5. the first wiring region has a plurality of wiring regions spaced apart from one another; the plurality of wiring regions include two wiring regions spaced apart in a direction parallel to the light-emitting end face, The light emitting device according to claim 1 , wherein at least a portion of one of the two wiring regions is provided in the first region.

6. The light emitting device according to claim 5 , wherein at least a portion of the other of the two wiring regions is provided outside the first region.

7. 7. The light-emitting device according to claim 4, wherein at least a portion of each of the two wiring regions is provided in an area that does not include the second point, separated by a virtual line that passes through the first point and is perpendicular to the light-emitting end surface in a top view.

8. The light-emitting device described in claim 7, wherein the plurality of wiring regions further include two wiring regions, at least a portion of which is provided in an area that does not include the first point, separated by a virtual line that passes through the second point and is perpendicular to the light-emitting end surface in a top view.

9. the one or more wirings further include a second wiring; the first wiring is joined to one of the two wiring regions, and the second wiring is joined to the other of the two wiring regions; 9. The light-emitting device according to claim 4, wherein, in a top view, the light-emitting device is divided into two regions by a virtual line that passes through the light-emitting end surface and is parallel to the light-emitting end surface, and in one region, the first wiring is joined to the first wiring region, and in the other region, the second wiring is joined to the first wiring region.

10. the base further includes a third wiring region provided on the top surface; the one or more wirings further include a third wiring joined to the third wiring region; the first wiring and the second wiring electrically connect the first wiring region and the second wiring region; the third wiring electrically connects the first light-emitting element and the third wiring region; The light emitting device according to claim 9 , wherein a distance from the third wiring region to the photodetector is greater than a distance from the first wiring region to the photodetector.

11. a second light-emitting element disposed on the upper surface of the base and having an emission end surface for emitting light; the photodetector has a first light receiving region that receives a portion of the light emitted from the first light emitting element and a second light receiving region that receives a portion of the light emitted from the second light emitting element; the first light receiving region is provided so that a virtual line passing through the first point and perpendicular to the light emitting end surface in a top view and a virtual line passing through the second point and perpendicular to the light emitting end surface in a top view pass through the first light receiving region; The second light receiving region is provided such that, in a top view, a virtual line that is parallel to the light emitting end surface of the second light emitting element and passes through the inside of the outer edge of the second light emitting element intersects with the outer edge of the second light emitting element at two points, a virtual line that passes through one point and is perpendicular to the light emitting end surface of the second light emitting element, and a virtual line that passes through the other point and is perpendicular to the light emitting end surface of the second light emitting element pass through the second light emitting element, the second wiring region has a plurality of wiring regions spaced apart from one another; the plurality of wiring regions included in the first wiring region include a wiring region provided in a region including the second point and a wiring region provided in a region not including the second point, with a virtual line passing through the first point and perpendicular to the light emitting end face in a top view as a boundary; 9. The light-emitting device of claim 3, wherein the plurality of wiring regions of the second wiring region include a wiring region provided between a virtual line passing through the first point and perpendicular to the light-emitting end surface in a top view and a virtual line passing through the third point and perpendicular to the light-emitting end surface in a top view, and a wiring region provided between a virtual line passing through the second point and perpendicular to the light-emitting end surface in a top view and a virtual line passing through the fourth point and perpendicular to the light-emitting end surface in a top view.

12. a submount on which the first light emitting element and the second light emitting element are disposed and which is disposed on the base; a length of the submount in a direction parallel to an emission end surface of the first light-emitting element in a top view is shorter than a length of the photodetector; The light emitting device according to claim 11 , wherein a length of the submount is greater than a length of the photodetector in a direction perpendicular to an emission end surface of the first light emitting element in a top view.

13. A light-emitting device described in any one of claims 1 to 12, wherein the photodetector is arranged a predetermined distance away in a direction perpendicular to the emission end surface of the first light-emitting element, and receives the main portion of the light emitted from the first light-emitting element.

Images