Circulation device and method for controlling circulation device

Abstract

To bring the temperature and / or flow rate of the treatment liquid to respective desired values quickly.SOLUTION: A circulation device includes a first pipe where a liquid flows in from a storage tank that stores a liquid and is used for supplying a liquid, a heater installed in the first pipe that heats the liquid, a pump installed in the first pipe that pumps out the liquid, a first valve connected to the pump via the heater in the first pipe and can be opened and closed, a second pipe connected to the first pipe between the heater and the first valve, and through which the liquid flows out to the storage tank, and a third pipe used for liquid recovery where the liquid flows out to the storage tank. In a state in which the heater heats the liquid, the first valve is closed in a first period, the first valve is opened in the second period after the end of the first period, and a pressure loss value of the second pipe increases, and the first valve opens in the third period after the end of the second period, and the pressure loss value of the second pipe decreases.SELECTED DRAWING: Figure 10

Description

[Technical Field]

[0001] The present disclosure relates to a circulation device and a method for controlling the same. [Background technology]

[0002] In the manufacturing process of semiconductor devices, the surface of a substrate such as a semiconductor wafer is treated with a chemical solution. An example of such a treatment is a cleaning treatment, and an example of such a chemical solution (hereinafter, also referred to as a "treatment solution", including a rinse solution and an organic solvent) is an acidic liquid.

[0003] For example, in a single-substrate processing apparatus, in which substrates are processed one by one, the substrates are rotated while being held substantially horizontally, and a processing solution is supplied to the surface of the rotating substrate. Such processing is carried out in a processing enclosure commonly referred to as a chamber.

[0004] The processing liquid is supplied to the substrate, then collected and reused. Specifically, the processing liquid is supplied to the chamber, and after being used for processing, the processing liquid is collected. Such supply and collection of the processing liquid is performed by a circulation device provided outside the chamber.

[0005] When a plurality of chambers are provided, each chamber is housed in a processing unit. The processing units are stacked in a substantially vertical direction and are included in a configuration commonly called a tower. A plurality of towers may be provided.

[0006] The supply of the processing liquid from the circulation device and the recovery of the processing liquid to the circulation device are performed for each tower, and the supply and recovery of the processing liquid to the multiple chambers are performed for each tower.

[0007] The circulation device performs a circulation process (tentatively referred to as "external circulation") in which the treatment liquid is supplied to and recovered from the tower, as well as a circulation process (tentatively referred to as "internal circulation") in which the treatment liquid is circulated inside the circulation device without passing through the tower.

[0008] External circulation and internal circulation for each of these towers are mentioned, for example, in the following Patent Document 1. Furthermore, the use of sulfuric acid as the treatment liquid is mentioned, for example, in the following Patent Document 2. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] Patent Publication No. 2021-052038 [Patent Document 2] Japanese Patent Publication No. 2020-088208 Summary of the Invention [Problem to be solved by the invention]

[0010] Before externally circulating the processing liquid to supply it to the tower, internal circulation is performed to raise the processing liquid to a desired temperature and achieve a desired flow rate, which contributes to the processing of substrates using the processing liquid.

[0011] In the case of internal circulation, as in the case of external circulation, the treatment liquid is circulated using a pump, for example, a rotary pump, which rotates at a predetermined rotation speed at which the circulation is properly performed, thereby performing the internal circulation.

[0012] When external circulation is performed, internal circulation is also performed, which reduces fluctuations in the pressure of the treatment liquid in the circulation device caused by fluctuations in the flow rate of the treatment liquid flowing through the tower.

[0013] Even after the treatment liquid has risen to the desired temperature through internal circulation alone without external circulation, if external circulation is started, the external circulation may not proceed smoothly. The reason for this is presumed to be as follows: When external circulation is stopped, the temperature of the treatment liquid remaining in the tower is low. Generally, the lower the temperature of the liquid, the higher the viscosity of the liquid. In particular, sulfuric acid has a large viscosity change depending on the temperature. For example, the viscosity of 98% concentrated sulfuric acid at a liquid temperature of 25°C is 23.8 x 10 -3While it exhibits a high viscosity of Pa·s, the viscosity at a liquid temperature of 100°C is 4.1×10 -3 When circulating a treatment liquid whose viscosity change is highly temperature-dependent, such as sulfuric acid, even if external circulation begins, the treatment liquid does not easily flow into the tower, and internal circulation takes priority.

[0014] The amount of treatment liquid remaining in the tower and the temperature of the treatment liquid vary depending on the situation. In order for the temperature and flow rate of the treatment liquid supplied to the tower in the external circulation to be the desired values, it is desirable to replace the treatment liquid remaining in the tower with treatment liquid supplied from the circulation device. The time at which this replacement is completed (hereinafter referred to as the "replacement completion time") varies depending on the situation. It is desirable for the treatment liquid supplied to the tower to have the desired temperature and flow rate before treatment using chemical solutions is performed.

[0015] The present disclosure has been made in view of the above-mentioned problems, and aims to provide a technique for enabling the temperature and / or flow rate of a treatment liquid to reach their respective desired values ​​in an early stage. [Means for solving the problem]

[0016] A first aspect of a circulation device according to the present disclosure supplies and recovers a liquid to and from an external path, the circulation device comprising: a storage tank for storing the liquid; a first pipe having a first inlet end through which the liquid flows from the storage tank and used for supplying the liquid; a heater provided in the first pipe for heating the liquid; a pump provided in the first pipe for pressurizing the liquid, having an inlet connected to the first inlet end and an outlet connected to the heater; a first valve connected to the outlet through the heater in the first pipe and capable of opening and closing; a second pipe between the heater and the first valve, having a second inlet end connected to the first pipe and a second outlet end through which the liquid flows to the storage tank and having a variable pressure loss; a third pipe having a third outlet end through which the liquid flows to the storage tank and used for recovering the liquid; and a controller for controlling the opening and closing of the first valve and the pressure loss value.

[0017] The control unit, while causing the heater to heat the liquid, closes the first valve for a first period; opens the first valve and increases the pressure loss value for a second period after the end of the first period; and opens the first valve and decreases the pressure loss value for a third period after the end of the second period.

[0018] A second aspect of the circulation device according to the present disclosure is the first aspect, further comprising a second valve provided in the second pipe and capable of adjusting a flow rate, and the control unit controls the second valve to control the pressure loss value.

[0019] A third aspect of the circulation device according to the present disclosure is the second aspect, wherein the second valve is an on-off valve.

[0020] A fourth aspect of the circulation device according to the present disclosure is the second aspect thereof, wherein the second valve is a relief valve.

[0021] A fifth aspect of the circulation device according to the present disclosure is any one of the first to fourth aspects, wherein the control unit ends the second period and starts the third period when the load on the pump transitions from a state greater than a predetermined value to a state less than a predetermined value.

[0022] A sixth aspect of the circulation device according to the present disclosure is any one of the first to fourth aspects, wherein the control unit ends the second period and starts the third period when the temperature of the liquid flowing through the third pipe transitions from a temperature lower than a predetermined value to a temperature higher than a predetermined value.

[0023] A seventh aspect of the circulation device according to the present disclosure is any of the first to sixth aspects, further comprising a fourth pipe having a fourth inlet end connected to the side of the first valve opposite the heater and used for supplying the liquid. The second period includes a fourth period and a fifth period. During the fourth period, the control unit controls the supply of the liquid from the first pipe and not the supply of the liquid from the fourth pipe, and during the fifth period, controls the supply of the liquid from the fourth pipe and not the supply of the liquid from the first pipe.

[0024] A first aspect of a method for controlling a circulation device according to the present disclosure is a method for controlling a circulation device that supplies and recovers a liquid to and from an external path, the circulation device comprising: a storage tank for storing the liquid; a first pipe having a first inlet end through which the liquid flows from the storage tank and used for supplying the liquid; a heater provided in the first pipe for heating the liquid; a pump provided in the first pipe for pressing the liquid, having an inlet connected to the first inlet end and an outlet connected to the heater; a first valve connected to the outlet via the heater in the first pipe and capable of opening and closing; a second pipe between the heater and the first valve, having a second inlet end connected to the first pipe and a second outlet end through which the liquid flows into the storage tank, the second pipe having a variable pressure loss; and a third pipe having a third outlet end through which the liquid flows into the storage tank and used for recovering the liquid.

[0025] The method includes the following steps, while the heater is heating the liquid: a first step of closing the first valve for a first period; a second step of opening the first valve for a second period after the first period ends and increasing the pressure loss value; and a third step of opening the first valve for a third period after the second period ends and decreasing the pressure loss value.

[0026] A second aspect of the method for controlling a circulation device according to the present disclosure is the first aspect, wherein the circulation device further comprises a second valve provided in the second piping and capable of adjusting the flow rate, and the pressure loss value is controlled using the second valve.

[0027] A third aspect of the control method for a circulation device according to the present disclosure is the second aspect, wherein the second valve is an on-off valve.

[0028] A fourth aspect of the control method for a circulation device according to the present disclosure is the second aspect thereof, wherein the second valve is a relief valve.

[0029] A fifth aspect of the method for controlling a circulation device according to the present disclosure is any one of the first to fourth aspects, wherein the second period ends and the third period starts when the load on the pump transitions from a state greater than a predetermined value to a state less than a predetermined value.

[0030] A sixth aspect of the control method for a circulation device according to the present disclosure is any one of the first to fourth aspects, wherein the second period ends and the third period starts when the temperature of the liquid flowing through the third pipe transitions from a temperature lower than a predetermined value to a temperature higher than a predetermined value.

[0031] A seventh aspect of the method for controlling a circulation device according to the present disclosure is any of the first to sixth aspects, wherein the circulation device further includes a fourth inlet connected to the side of the first valve opposite to the heater, and a fourth pipe used for supplying the liquid. The second step includes a fourth step in which the liquid is supplied from the first pipe but not from the fourth pipe, and a fifth step in which the liquid is supplied from the fourth pipe but not from the first pipe.

[0032] For example, the liquid is sulfuric acid or a diluted solution of sulfuric acid. [Effects of the Invention]

[0033] According to the first aspect of the circulation device of the present disclosure and the first aspect of the control method for a circulation device of the present disclosure, the temperature and / or flow rate of the treatment liquid each reach a desired value early.

[0034] The second, third, and fourth aspects of the circulation device according to the present disclosure contribute to realizing the first aspect of the circulation device. The second, third, and fourth aspects of the control method for a circulation device according to the present disclosure contribute to realizing the first aspect of the control method for a circulation device.

[0035] The third aspect of the circulation device is preferable compared to the fourth aspect of the circulation device, and the third aspect of the control method for the circulation device is preferable compared to the fourth aspect of the control method for the circulation device, both from the perspective of significantly increasing the pressure loss value of the second piping.

[0036] The fifth, sixth and seventh aspects of the circulation device according to the present disclosure, and the fifth, sixth and seventh aspects of the control method for the circulation device according to the present disclosure, contribute to ending the second period and starting the third period. [Brief explanation of the drawings]

[0037] [Figure 1] FIG. 1 is a cross-sectional view schematically showing a substrate processing apparatus. [Figure 2] 1 is a vertical cross-sectional view schematically showing a substrate processing apparatus. [Figure 3] FIG. 3 is a longitudinal cross-sectional view schematically showing a longitudinal cross-section of the substrate processing apparatus taken along line III-III. [Figure 4] FIG. 10 is a side view schematically illustrating an example of a configuration of the left part of the processing block as viewed in the left direction. [Figure 5] FIG. 10 is a side view schematically illustrating an example of a configuration of the right part of the processing block as viewed in the right direction. [Figure 6] FIG. 2 is a cross-sectional view schematically showing the configuration of a processing unit. [Figure 7] FIG. 2 is a vertical cross-sectional view schematically showing the configuration of a processing unit. [Figure 8]FIG. 2 is a block diagram showing a functional configuration for controlling the operation of each component of the substrate processing apparatus. [Figure 9] FIG. 2 is a block diagram showing an example of the configuration of a control unit. [Figure 10] FIG. 2 is a piping diagram illustrating the configuration of a circulation device. [Figure 11] FIG. 2 is a block diagram showing an outline of the functions of a control unit. [Figure 12] FIG. 2 is a piping diagram illustrating the configuration of a circulation device. [Figure 13] FIG. 2 is a piping diagram illustrating the configuration of a circulation device. [Figure 14] 10 is a timing chart illustrating the execution of external circulation and internal circulation. [Figure 15] FIG. 10 is a piping diagram illustrating the configuration of a first modified example of the circulation device. [Figure 16] FIG. 10 is a piping diagram illustrating the configuration of a first modified example of the circulation device. [Figure 17] 10 is a flowchart illustrating the operation of the circulation device. [Figure 18] FIG. 2 is a piping diagram illustrating the configuration of a circulation device. [Figure 19] FIG. 2 is a piping diagram illustrating the configuration of a circulation device. [Figure 20] 10 is a flow chart illustrating, in part, a variation of the operation of the circulation device. DETAILED DESCRIPTION OF THE INVENTION

[0038] Hereinafter, each embodiment of the present disclosure will be described with reference to the accompanying drawings. The components described in each embodiment are merely examples, and the scope of the present disclosure is not intended to be limited to these examples. The drawings are merely schematic. In the drawings, the dimensions and number of each part may be exaggerated or simplified as necessary to facilitate understanding. In the drawings, parts having similar configurations and functions are assigned the same reference numerals, and duplicate explanations will be omitted as appropriate.

[0039] In the following explanation, a right-handed XYZ Cartesian coordinate system is used to explain the positional relationships of each element. Specifically, it is assumed that the X-axis and Y-axis extend horizontally and the Z-axis extends vertically (up and down). In the drawings, the direction in which the tip of the arrow points is indicated as the + (plus) direction, and the opposite direction is indicated as the - (minus) direction. Specifically, the vertically upward direction is the +Z direction, and the vertically downward direction is the -Z direction.

[0040] In this specification, expressions indicating relative or absolute positional relationships (e.g., "parallel," "orthogonal," "center") not only indicate the exact positional relationship, but also indicate a state including tolerances and a state in which the same level of functionality is obtained. Expressions indicating that two or more things are equal (e.g., "identical," "equal," "homogeneous") not only indicate a state in which they are strictly equal quantitatively, but also indicate a state in which there is a difference that allows for tolerances or similar functionality, unless otherwise specified.

[0041] Unless otherwise specified, expressions indicating a shape (such as "rectangular shape" or "cylindrical shape") not only represent a strict geometric shape, but also represent shapes that have, for example, irregularities or chamfers, within the scope of achieving the same effect.

[0042] The expressions "comprises," "includes," "has," "includes," or "has" of one element are not exclusive expressions that exclude the presence of other elements.

[0043] Unless otherwise specified, the expression "connected" includes not only a state in which two elements are in contact with each other, but also a state in which two elements are separated by another element.

[0044] Unless otherwise specified, "moving" in a certain direction may include not only moving parallel to this direction, but also moving in a direction having a component in this direction.

[0045] <1. Configuration of the substrate processing apparatus> Fig. 1 is a cross-sectional view schematically showing the substrate processing apparatus 790. Fig. 2 is a longitudinal cross-sectional view schematically showing the longitudinal section of the substrate processing apparatus 790 taken along the front-rear direction (±X direction).

[0046] The substrate processing apparatus 790 processes a substrate (e.g., a semiconductor wafer) W using a processing liquid that is supplied to and recovered from the circulation apparatus according to the present disclosure. The circulation apparatus and a control method thereof will be described in detail later. The circulation apparatus and the substrate processing apparatus 790 may be collectively understood as a substrate processing system.

[0047] For example, a thin, flat plate having a substantially disk shape is applied to the substrate W. In Fig. 1, the outer edge of the substrate W stored in a carrier C (described later) and the outer edge of the substrate W held by a holder 711 (described later) are both indicated by dashed lines.

[0048] The substrate processing apparatus 790 includes, for example, an indexer unit 792 and a processing block 793. The processing block 793 is connected to the indexer unit 792.

[0049] The indexer unit 792 and the processing block 793 are aligned in the horizontal direction. The indexer unit 792, for example, supplies a substrate W to the processing block 793. The processing block 793, for example, processes the substrate W. The indexer unit 792, for example, retrieves the substrate W from the processing block 793.

[0050] In this specification, for convenience, the horizontal direction in which the indexer unit 792 and the processing block 793 are aligned is taken as the ±X direction (also referred to as the front-to-back direction). Of the ±X directions (front-to-back direction), the direction from the processing block 793 to the indexer unit 792 is taken as the -X direction (also referred to as the front direction or forward), and the direction from the indexer unit 792 to the processing block 793 is taken as the +X direction (also referred to as the rear direction or backward).

[0051] The horizontal direction perpendicular to the ±X directions (front-to-back directions) is used as the ±Y direction (also called the width direction). Within the ±Y directions (width directions), the direction toward the right when facing the -X direction (front direction) is used as the +Y direction (also called the right direction or rightward), and the direction toward the left when facing the -X direction (front direction) is used as the -Y direction (also called the left direction or leftward).

[0052] The direction perpendicular to the horizontal direction is taken as the ±Z direction (also called the up-down direction). Of the ±Z directions (up-down direction), the direction of gravity is taken as the -Z direction (also called the down direction or downward), and the direction opposite to the direction of gravity is taken as the +Z direction (also called the up direction or upward). When no particular distinction is made between front, rear, right, and left, these are all simply referred to as lateral directions.

[0053] <1-1. Indexer Configuration> As shown in FIG. 1, the indexer section 792 includes a plurality of (for example, four) carrier placement sections 721, a transport space 722, and one or more (for example, one) first transport mechanisms (also referred to as indexer mechanisms) 723.

[0054] The multiple carrier placement sections 721 are arranged in the width direction (±Y direction). One carrier C is placed on each carrier placement section 721. The carrier C accommodates multiple substrates W. For example, a FOUP (front opening unified pod) is used as the carrier C.

[0055] The transport space 722 is located behind (in the +X direction) the carrier placement unit 721. The transport space 722 extends in the width direction (in the ±Y direction). The first transport mechanism 723 is located in the transport space 722.

[0056] The first transport mechanism 723 is located behind (in the +X direction) the carrier platform 721. The first transport mechanism 723 transports substrates W. The first transport mechanism 723 accesses the carriers C placed on the carrier platform 721.

[0057] The first transport mechanism 723 includes a hand 7231 and a hand driver 7232. The hand 7231 supports one substrate W in a horizontal position. The hand driver 7232 is connected to the hand 7231 and moves the hand 7231. Specifically, the hand driver 7232 moves the hand 7231 in the front-to-rear directions (±X directions), width directions (±Y directions), and up-down directions (±Z directions). The hand driver 7232 has multiple electric motors.

[0058] As shown in FIGS. 1 and 2, the hand driving unit 7232 includes, for example, a rail 7232a, a horizontal moving unit 7232b, a vertical moving unit 7232c, a rotating unit 7232d, and an advancing / retreating moving unit 7232e.

[0059] The rail 7232a is fixed, for example, to the bottom of the transport space 722. The rail 7232a extends in the width direction (±Y direction).

[0060] The horizontal movement section 7232b is supported by the rail 7232a and moves in the width direction (±Y direction) relative to the rail 7232a.

[0061] The vertical movement section 7232c is supported by the horizontal movement section 7232b and moves up and down relative to the horizontal movement section 7232b.

[0062] The rotating portion 7232d is supported by the vertical moving portion 7232c. The rotating portion 7232d rotates relative to the vertical moving portion 7232c. The rotating portion 7232d rotates about a rotation axis A1. The rotation axis A1 is an imaginary line extending in the vertical direction.

[0063] The advancing and retreating moving unit 7232e moves relative to the rotating unit 7232d. The advancing and retreating moving unit 7232e moves back and forth along a horizontal direction determined by the orientation of the rotating unit 7232d. The advancing and retreating moving unit 7232e is connected to the hand 7231.

[0064] The hand driving unit 7232 allows the hand 7231 to move in parallel in the vertical direction, in any horizontal direction, and rotate about the rotation axis A1.

[0065] <1-2. Processing block configuration> Fig. 3 is a longitudinal cross-sectional view schematically illustrating an example of the longitudinal cross-section of the substrate processing apparatus 790 taken along line III-III in Fig. 1, viewed toward the rear (+X direction). Fig. 4 is a side view schematically illustrating an example of the configuration of the left (-Y direction) portion (also referred to as the left part) of the processing block 793, viewed along the left (-Y direction). Fig. 5 is a side view schematically illustrating an example of the configuration of the right (+Y direction) portion (also referred to as the right part) of the processing block 793, viewed along the right (+Y direction).

[0066] For example, as shown in Figures 1 to 5, the processing block 793 includes two transport spaces 74A, 74B, two second transport mechanisms 75A, 75B, a plurality of (here, 24) processing units 76, two substrate placement portions 77A, 77B, one partition wall 73w, and a horizontal exhaust system 780.

[0067] The transport space 74A is located at the center of the processing block 793 in the width direction (±Y direction). The transport space 74A extends in the front-rear direction (±X direction). The front portion (also referred to as the front part) of the transport space 74A is connected to the transport space 722 of the indexer unit 792.

[0068] The transport space 74B has substantially the same shape as the transport space 74A. Specifically, the transport space 74B is located in the center of the processing block 793 in the width direction (±Y direction). The transport space 74B extends in the front-rear direction (±X direction). A front portion (also referred to as a front part) of the transport space 74B is connected to the transport space 722 of the indexer unit 792.

[0069] The transport space 74B is located below the transport space 74A. The transport space 74B is located so as to overlap the transport space 74A in a plan view. When the transport spaces 74A and 74B are not distinguished from each other, they are both simply referred to as the transport space 74.

[0070] The partition wall 73w has, for example, a horizontal plate shape. The partition wall 73w is located below the transport space 74A and above the transport space 74B. The partition wall 73w separates the transport space 74A from the transport space 74B.

[0071] The substrate platform 77A is located in the transport space 74A. The substrate platform 77A is located at the front of the transport space 74A. The first transport mechanism 723 of the indexer unit 792 also accesses the substrate platform 77A. One or more substrates W are placed on the substrate platform 77A.

[0072] The substrate placing portion 77B is located in the transport space 74B. The substrate placing portion 77B is located below the substrate placing portion 77A. The substrate placing portion 77B is located at the front of the transport space 74B. The substrate placing portion 77B is located so as to overlap with the substrate placing portion 77A in a plan view. The substrate placing portion 77B is located at the same position as the substrate placing portion 77A in a plan view.

[0073] The first transport mechanism 723 of the indexer unit 792 also accesses the substrate platform 77B. One or more substrates W are placed on the substrate platform 77B. When the substrate platform 77A, 77B are not distinguished from each other, they are both simply referred to as the substrate platform 77.

[0074] The second transport mechanism 75A is located in the transport space 74A. The second transport mechanism 75A transports the substrate W. The second transport mechanism 75A has access to the substrate platform 77A.

[0075] The second transport mechanism 75B is located in the transport space 74B. The second transport mechanism 75B transports the substrate W. The second transport mechanism 75B has the same structure as the second transport mechanism 75A. The second transport mechanism 75B accesses the substrate placement section 77B. When the second transport mechanisms 75A and 75B are not to be distinguished from each other, they are both simply referred to as the second transport mechanism 75.

[0076] Each of the second transport mechanisms 75 includes a hand 751 and a hand driver 752. The hand 751 supports one substrate W in a horizontal position. The hand driver 752 is connected to the hand 751. The hand driver 752 moves the hand 751 in the front-to-rear directions (±X directions), width directions (±Y directions), and up-down directions. The hand driver 752 includes multiple electric motors.

[0077] Specifically, the hand driving unit 752 includes, for example, two support columns 752a, a vertical moving unit 752b, a horizontal moving unit 752c, a rotating unit 752d, and an advancing / retreating moving unit 752e.

[0078] The two support columns 752a are fixed, for example, to the side portions of the transport space 722. The two support columns 752a are aligned in the front-rear direction (±X direction). Each support column 752a extends in the up-down direction.

[0079] The vertical movement section 752b is supported by two support columns 752a. The vertical movement section 752b extends in the front-rear direction (±X direction) and is installed between the two support columns 752a. The vertical movement section 752b moves in the up-down direction relative to the two support columns 752a.

[0080] The horizontal movement section 752c is supported by the vertical movement section 752b. The horizontal movement section 752c moves in the front-to-back directions (±X directions) relative to the vertical movement section 752b. The horizontal movement section 752c moves in the front-to-back directions (±X directions) between the two support columns 752a.

[0081] The rotating portion 752d is supported by the horizontal moving portion 752c. The rotating portion 752d rotates relative to the horizontal moving portion 752c. The rotating portion 752d rotates about a rotation axis A2. The rotation axis A2 is an imaginary line that extends in the vertical direction.

[0082] The advancing and retreating moving unit 752e moves relative to the rotating unit 752d. The advancing and retreating moving unit 752e moves back and forth in a horizontal direction determined by the orientation of the rotating unit 752d. The advancing and retreating moving unit 752e is connected to the hand 751.

[0083] Such a hand driving unit 752 allows the hand 751 to perform translation in the vertical direction, translation in any horizontal direction, and rotation around the rotation axis A2.

[0084] Each of the 24 processing units 76 performs a predetermined processing on the substrate W transported by the second transport mechanism 75 .

[0085] The processing block 793 includes six processing units 76A, six processing units 76B, six processing units 76C, and six processing units 76D. When the processing units 76A, 76B, 76C, and 76D are not distinguished from one another, they are all simply referred to as processing units 76.

[0086] The six processing units 76A are positioned so as to be stacked in the vertical direction. In other words, the six processing units 76A are lined up in a row in the vertical direction. The six processing units 76B are positioned so as to be stacked in the vertical direction. In other words, the six processing units 76B are lined up in a row in the vertical direction. The six processing units 76C are positioned so as to be stacked in the vertical direction. In other words, the six processing units 76C are lined up in a row in the vertical direction. The six processing units 76D are positioned so as to be stacked in the vertical direction. In other words, the six processing units 76D are lined up in a row in the vertical direction.

[0087] Each of the six processing units 76A, six processing units 76B, six processing units 76C, and six processing units 76D is included in the towers mentioned above (four towers in this case).

[0088] The six processing chambers 761 in the six processing units 76A are stacked in the vertical direction. The six processing chambers 761 in the six processing units 76B are stacked in the vertical direction. The six processing chambers 761 in the six processing units 76C are stacked in the vertical direction. The six processing chambers 761 in the six processing units 76D are stacked in the vertical direction.

[0089] The six processing units 76A and the six processing units 76B are located to the left (-Y direction) of the transport spaces 74A and 74B. The six processing units 76A and the six processing units 76B are lined up in the front-to-back direction (±X direction) along the transport spaces 74A and 74B. The six processing units 76B are located behind the six processing units 76A (+X direction).

[0090] The six processing units 76C and the six processing units 76D are located to the right (+Y direction) of the transport spaces 74A and 74B. The six processing units 76C and the six processing units 76D are lined up in the front-to-back direction (±X direction) along the transport spaces 74A and 74B. The six processing units 76D are located behind the six processing units 76C (+X direction).

[0091] The six processing units 76A and the six processing units 76C face each other across the transport spaces 74A and 74B. The six processing units 76B and the six processing units 76D face each other across the transport spaces 74A and 74B.

[0092] The second transport mechanism 75 accesses the holder 711 of the processing unit 76. The second transport mechanism 75A, located above the partition wall 73w, transports substrates W to the upper 12 processing units 76 (4 units x upper 3 tiers) of the 24 processing units 76, and unloads the substrates W from these upper 12 processing units 76. The second transport mechanism 75B, located below the partition wall 73w, transports substrates W to the lower 12 processing units 76 (4 units x lower 3 tiers) of the 24 processing units 76, and unloads the substrates W from these lower 12 processing units 76.

[0093] <1-3. Processing unit configuration> 6 is a cross-sectional view showing a schematic configuration of the processing unit 76, taking processing unit 76A as an example. Each processing chamber 761 is adjacent to the transfer space 74.

[0094] FIG. 7 is a vertical cross-sectional view showing a schematic configuration of the processing unit 76, taking the processing unit 76C as an example.

[0095] 6 and 7, each processing unit 76 includes a processing chamber 761 (also referred to as a chamber or a processing housing), a supply pipe space 762, and an exhaust pipe space 763. For example, the multiple processing units 76 have the same structure.

[0096] <1-4. Processing chamber configuration> The processing chamber 761 has, for example, a substantially box shape. The processing chamber 761 has, for example, a substantially rectangular shape in plan view, front view, and side view. The processing chamber 761 has a processing space 761s therein. The processing unit 76 processes the substrate W in the processing space 761s. In FIG. 6, the outer edge of the substrate W held by the holder 711 is indicated by a dashed line.

[0097] The processing chamber 761 has a substrate transfer opening 761o on the transfer space 74 side. The substrate transfer opening 761o is formed in a side wall of the processing chamber 761. The substrate transfer opening 761o has a size that allows the substrate W to pass through. The second transfer mechanism 75 moves the substrate W between the outside of the processing chamber 761 (specifically, the transfer space 74) and the inside of the processing chamber 761 (specifically, the processing space 761s) via the substrate transfer opening 761o. Each processing unit 76 has a shutter (not shown) that opens and closes the substrate transfer opening 761o.

[0098] Each of the processing units 76 includes, for example, a holder 711 and a fluid supply unit 712 .

[0099] The holder 711 is located inside the processing chamber 761. The holder 711 holds a substrate W. More specifically, the holder 711 holds one substrate W in a horizontal position. The holder 711 includes a part (also referred to as a drive part) that rotates the substrate W held by the holder 711, for example, around an imaginary rotation axis A3 along the vertical direction.

[0100] A spin chuck is applied to the holder 711. The spin chuck rotates the substrate W, for example, about a rotation axis A3 that passes through the center of the substrate W and extends in the up-down direction.

[0101] Specifically, the spin chuck includes a chuck pin (chuck member) 711p, a spin base 711b, a rotation shaft 711s coupled to the center of the lower surface of the spin base 711b, and an electric motor 711m as a drive unit that applies a rotational force to the rotation shaft 711s.

[0102] The rotation shaft 711s extends in the vertical direction along the rotation axis A3. For example, the rotation shaft 711s is a hollow shaft.

[0103] A spin base 711b is coupled to the upper end of the rotation shaft 711s. The spin base 711b has a disk shape that is aligned in the horizontal direction. In a plan view, the spin base 711b is circular, centered on the rotation axis A3, and has a diameter larger than that of the substrate W. A plurality of (e.g., six) chuck pins 711p are positioned at intervals in the circumferential direction on the periphery of the upper surface of the spin base 711b.

[0104] The multiple chuck pins 711p can be opened and closed between a closed state in which they contact the peripheral edge of the substrate W to grip the substrate W, and an open state in which they are retracted from the peripheral edge of the substrate W. In the open state, for example, the multiple chuck pins 711p contact the lower surface of the peripheral edge of the substrate W to support the substrate W from below.

[0105] The chuck pin 711p is driven to open and close by a unit including, for example, a link mechanism built into the spin base 711b and a drive source located outside the spin base 711b. The drive source includes, for example, a ball screw mechanism and an electric motor that provides a driving force to the ball screw mechanism.

[0106] Each of the processing units 76 includes, for example, a heater unit 719. The heater unit 719 is located above the spin base 711b. An elevator shaft 719r extending vertically along the rotation axis A3 is coupled to the lower surface of the heater unit 719.

[0107] The lift shaft 719r is inserted through a through-hole that passes through the center of the spin base 711b in the vertical direction and through a hollow portion that passes through the rotation shaft 711s in the vertical direction.

[0108] The lower end of the lift shaft 719r extends further downward than the lower end of the rotation shaft 711s. A lift unit 719m is coupled to the lower end of the lift shaft 719r. By operating the lift unit 719m, the heater unit 719 moves up and down between a lower position close to the upper surface of the spin base 711b and an upper position where the heater unit 719 supports the lower surface of the substrate W and lifts the substrate W from the chuck pins 711p.

[0109] The lifting unit 719m includes, for example, a ball screw mechanism and an electric motor that provides driving force to the ball screw mechanism, which allows the lifting unit 719m to position the heater unit 719 at any intermediate position between the lower position and the upper position.

[0110] For example, the substrate W can be heated by radiant heat from the heating surface 719u, which is the upper surface of the heater unit 719, in a state where the heating surface 719u is disposed at a position separated by a predetermined distance from the lower surface of the substrate W. For example, if the substrate W is lifted by the heater unit 719, the heating surface 719u is brought into contact with the lower surface of the substrate W, and the substrate W is heated with a greater amount of heat by heat conduction from the heating surface 719u.

[0111] The heater unit 719 has the form of a disk-shaped hot plate. The heater unit 719 includes a plate body, a plurality of support pins, and a heater. The upper surface of the plate body is a flat surface that is aligned with the horizontal plane. In a plan view, the plate body has a circular shape similar to that of the substrate W and a diameter slightly smaller than that of the substrate W.

[0112] The outer peripheral edge of the plate body is located inside the chuck pins 711p. In other words, the plate body is surrounded by the chuck pins 711p in the horizontal direction. This prevents the heater unit 719 from interfering with the chuck pins 711p when the heater unit 719 moves up and down.

[0113] Each of the support pins is, for example, a hemispherical pin that protrudes slightly upward from the upper surface of the plate body. The support pins are arranged approximately evenly on the upper surface of the plate body. The upper surface (heating surface 719u) of the plate body does not necessarily need to have support pins.

[0114] For example, when multiple substrates W are supported by contacting the support pins, the lower surfaces of the substrates W and the upper surface (heating surface 719u) of the plate body face each other with a small gap between them, which allows the heater unit 719 to heat the substrates W efficiently and uniformly.

[0115] The heater may be, for example, a resistor built into the plate body. The upper surface of the plate body (heating surface 719u) can be heated to a temperature higher than the boiling point of the organic solvent by energizing the heater. A power supply line to the heater is passed through the lift shaft 719r. A power supply unit 719e that supplies power to the heater is connected to the power supply line.

[0116] Each of the processing units 76 includes, for example, a cylindrical cup 717 surrounding a holder 711 inside a processing chamber 761 .

[0117] The fluid supply unit 712 supplies, for example, a plurality of types of fluids to the substrate W held by the holder 711. The plurality of types of fluids include, for example, processing liquids such as chemical liquids, rinse liquids, and organic solvents. The chemical liquids include, for example, etching liquids and cleaning liquids. The chemical liquids used include, for example, acidic liquids (acid-based liquids) and alkaline liquids (alkaline-based liquids).

[0118] The acidic solution contains, for example, at least one of hydrofluoric acid (hydrofluoric acid), a mixed solution of hydrochloric acid and hydrogen peroxide (SC2), sulfuric acid, a mixed solution of sulfuric acid and hydrogen peroxide (SPM), hydrofluoric nitric acid (a mixed solution of hydrofluoric acid and nitric acid), and hydrochloric acid.

[0119] The alkaline solution includes, for example, at least one of ammonia hydrogen peroxide solution (SC1), ammonia water, ammonium fluoride solution, and tetramethylammonium hydroxide (TMAH).

[0120] The rinse liquid is, for example, a liquid for washing away a chemical liquid on the substrate W. For example, deionized water (DIW) is used as the rinse liquid.

[0121] The organic solvent is, for example, a liquid for removing the rinse liquid on the substrate W. As the organic solvent, for example, isopropyl alcohol (IPA) or the like is used.

[0122] The plurality of fluids include, for example, gases such as inert gases, for example, nitrogen gas.

[0123] The fluid supply unit 712 includes, for example, a first moving nozzle 71n, a second moving nozzle 72n, and a third moving nozzle 73n, each of which ejects a predetermined fluid.

[0124] The first movable nozzle 71n is moved in the horizontal direction by the first moving unit 71M. By moving in the horizontal direction, the first movable nozzle 71n can be moved between a position facing the center of rotation of the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "first discharge position") and a position not facing the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "first home position").

[0125] The first discharge position may be, for example, a position where the first processing liquid discharged from the first movable nozzle 71n lands on the center of rotation of the upper surface of the substrate W. The first home position is a position outside the holder 711 in a plan view. More specifically, the first home position may be a position outside the cup 717 in a plan view.

[0126] The first moving nozzle 71n may be moved up or down by the first moving unit 71M to approach the upper surface Wa of the substrate W held by the holding part 711, or may be moved upward away from the upper surface Wa of the substrate W held by the holding part 711.

[0127] The first moving unit 71M includes, for example, a first rotation shaft 71s extending in the vertical direction, a first arm 71a coupled to the first rotation shaft 71s and extending horizontally, and a first arm driving mechanism 71m that drives the first arm 71a.

[0128] The first arm drive mechanism 71m swings the first arm 71a by rotating the first rotation shaft 71s about a virtual rotation axis A4 that extends in the vertical direction. The first movable nozzle 71n is attached to the first arm 71a at a position horizontally spaced from the rotation axis A4.

[0129] In response to the swinging of the first arm 71a, the first moving nozzle 71n moves along an arc-shaped trajectory in the horizontal direction, as indicated by the two-dot chain arrow in Fig. 6. The first arm driving mechanism 71m may move the first arm 71a up and down, for example, by raising and lowering the first rotation shaft 71s in the vertical direction.

[0130] The first moving nozzle 71n has a function of supplying a first processing liquid (also referred to as a first processing liquid) to the upper surface Wa of the substrate W held by the holder 711. A first processing liquid supply pipe P1 that functions as a pipe for supplying the first processing liquid is connected to the first moving nozzle 71n.

[0131] A first processing liquid on-off valve V1 that functions as a valve for opening and closing the flow path of the first processing liquid supply pipe P1 is installed in the first processing liquid supply pipe P1. The first processing liquid is supplied to the first processing liquid supply pipe P1 from a processing liquid distribution unit 701 or a processing liquid distribution unit 702, which will be described later. Here, an acidic liquid such as sulfuric acid (HSO) is used as the first processing liquid. The first moving nozzle 71n may be a straight nozzle that ejects the first processing liquid, or may be a two-fluid nozzle that ejects a mixture of the first processing liquid and an inert gas.

[0132] The second movable nozzle 72n is moved in the horizontal direction by the second movable unit 72M. By moving in the horizontal direction, the second movable nozzle 72n can be moved between a position facing the center of rotation of the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "second discharge position") and a position not facing the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "second home position").

[0133] The second discharge position may be, for example, a position where the second processing liquid discharged from the second movable nozzle 72n lands on the center of rotation of the upper surface of the substrate W. The second home position is a position outside the holder 711 in a plan view. More specifically, the second home position may be a position outside the cup 717 in a plan view.

[0134] The second moving nozzle 72n may be moved upward or downward by the second moving unit 72M to approach the upper surface Wa of the substrate W held by the holding portion 711, or may be moved upward away from the upper surface Wa of the substrate W held by the holding portion 711.

[0135] The second moving unit 72M includes, for example, a second rotation shaft 72s extending in the vertical direction, a second arm 72a coupled to the second rotation shaft 72s and extending horizontally, and a second arm driving mechanism 72m that drives the second arm 72a.

[0136] The second arm drive mechanism 72m swings the second arm 72a by rotating the second rotation shaft 72s about a virtual rotation axis A5 that extends in the vertical direction. The second movable nozzle 72n is attached to the second arm 72a at a position horizontally spaced from the rotation axis A5.

[0137] In response to the swinging of the second arm 72a, the second movable nozzle 72n moves along an arc-shaped trajectory in the horizontal direction, as indicated by the two-dot chain arrow in Fig. 6. The second arm drive mechanism 72m may move the second arm 72a up and down, for example, by raising and lowering the second rotation shaft 72s in the vertical direction.

[0138] The second moving nozzle 72n has a function of supplying a second processing liquid (also referred to as a second processing liquid) to the upper surface Wa of the substrate W held by the holder 711. A second processing liquid supply pipe P2 that functions as a pipe for supplying the second processing liquid is connected to the second moving nozzle 72n.

[0139] A second processing liquid on-off valve V2 that functions as a valve for opening and closing the flow path of the second processing liquid supply pipe P2 is installed in the second processing liquid supply pipe P2. The second processing liquid is supplied to the second processing liquid supply pipe P2 from a processing liquid distribution unit 701 or a processing liquid distribution unit 702, which will be described later. Here, an alkaline liquid such as an ammonia-hydrogen peroxide solution (SC1) is used as the second processing liquid. The second moving nozzle 72n may be a straight nozzle that discharges the second processing liquid, or may be a two-fluid nozzle that discharges a mixture of the second processing liquid and an inert gas.

[0140] The third movable nozzle 73n is moved in the horizontal direction by the third movable unit 73M. By moving in the horizontal direction, the third movable nozzle 73n can be moved between a position facing the center of rotation of the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "third discharge position") and a position not facing the upper surface Wa of the substrate W held by the holder 711 (hereinafter also referred to as the "third home position").

[0141] The third discharge position may be, for example, a position where the third processing liquid discharged from the third movable nozzle 73n lands on the center of rotation of the upper surface of the substrate W. The third home position is a position outside the holder 711 in a plan view. More specifically, the third home position may be a position outside the cup 717 in a plan view.

[0142] The third moving nozzle 73n may be moved up and down by the third moving unit 73M to approach the upper surface Wa of the substrate W held by the holding portion 711, or may be moved upward away from the upper surface Wa of the substrate W held by the holding portion 711.

[0143] The third moving unit 73M includes, for example, a third rotation shaft 73s extending in the vertical direction, a third arm 73a coupled to the third rotation shaft 73s and extending horizontally, and a third arm driving mechanism 73m that drives the third arm 73a.

[0144] The third arm drive mechanism 73m swings the third arm 73a by rotating the third rotation shaft 73s about a virtual rotation axis A6 that extends in the vertical direction. The third movable nozzle 73n is attached to the third arm 73a at a position horizontally spaced from the rotation axis A6.

[0145] In response to the swing of the third arm 73a, the third movable nozzle 73n moves along an arc-shaped trajectory in the horizontal direction, as indicated by the two-dot chain arrow in Fig. 6. The third arm drive mechanism 73m may move the third arm 73a up and down by raising and lowering the third rotation shaft 73s in the vertical direction.

[0146] The third moving nozzle 73n has a function of supplying a third processing liquid (also referred to as a third treatment liquid) to the upper surface Wa of the substrate W held by the holder 711. A third processing liquid supply pipe P3 that functions as a pipe for supplying the third treatment liquid is connected to the third moving nozzle 73n.

[0147] A third processing liquid on-off valve V3 that functions as a valve for opening and closing the flow path of the third processing liquid supply pipe P3 is installed in the third processing liquid supply pipe P3. The third processing liquid supply pipe P3 is supplied with the third processing liquid from a processing liquid distribution unit 701 or a processing liquid distribution unit 702, which will be described later. Here, a rinse liquid such as deionized water (DIW) is used as the third processing liquid. The third moving nozzle 73n may be a straight nozzle that discharges the third processing liquid, or may be a two-fluid nozzle that discharges a mixture of the third processing liquid and an inert gas.

[0148] The processing unit 76 includes, for example, a fan filter unit (FFU) as an air supply section 718. The FFU can further purify the air in a clean room in which the substrate processing apparatus 790 is installed and supply the purified air into the processing chamber 761.

[0149] The FFU is attached, for example, to the ceiling wall of the processing chamber 761. The FFU is equipped with a fan and a filter (e.g., a HEPA filter) for taking in air from within the clean room and sending it into the processing chamber 761, and can form a downflow of clean air within the processing chamber 761. In order to more uniformly distribute the clean air supplied from the FFU within the processing chamber 761, a punched plate with a large number of blow-out holes may be placed directly below the ceiling wall.

[0150] For example, an exhaust port 762o is provided in a part of the side wall of the processing chamber 761 near the floor wall of the processing chamber 761, and is connected to communicate with the outside of the substrate processing apparatus 790 (such as a factory exhaust facility). For example, of the clean air supplied from the FFU and flowing down inside the processing chamber 761, the air that passes near the cup 717 and the like is exhausted to the outside of the substrate processing apparatus 790 via the exhaust port 762o. For example, a configuration for introducing an inert gas such as nitrogen gas into the upper part of the processing chamber 761 may be added.

[0151] <1-5. Supply pipe space configuration> As shown in Figures 4 and 5, four supply pipe spaces 762 extend vertically. For example, one supply pipe space 762A extends vertically from the lowest (first) processing unit 76A to the highest (sixth) processing unit 76A. For example, one supply pipe space 762B extends vertically from the lowest (first) processing unit 76B to the highest (sixth) processing unit 76B. For example, one supply pipe space 762C extends vertically from the lowest (first) processing unit 76C to the highest (sixth) processing unit 76C. For example, one supply pipe space 762D extends vertically from the lowest (first) processing unit 76D to the highest (sixth) processing unit 76D. When the supply pipe spaces 762A to 762D are not distinguished from one another, they are all simply referred to as supply pipe spaces 762.

[0152] The supply pipe space 762 is an area where pipes are arranged to supply fluids to the processing chamber 761. For example, a first processing liquid supply pipe P1, a second processing liquid supply pipe P2, a third processing liquid supply pipe P3, a first processing liquid on-off valve V1, a second processing liquid on-off valve V2, and a third processing liquid on-off valve V3 are arranged in the supply pipe space 762. The first processing liquid supply pipe P1, the second processing liquid supply pipe P2, and the third processing liquid supply pipe P3 are drawn from the supply pipe space 762 into the processing chamber 761 and connected to a first moving nozzle 71n, a second moving nozzle 72n, and a third moving nozzle 73n.

[0153] <1-6. Exhaust pipe space configuration> As shown in FIGS. 4 and 5, four exhaust pipe spaces 763 extend vertically. For example, one exhaust pipe space 763A extends vertically from the lowest (first) processing unit 76A to the highest (sixth) processing unit 76A. For example, one exhaust pipe space 763B extends vertically from the lowest (first) processing unit 76B to the highest (sixth) processing unit 76B. For example, one exhaust pipe space 763C extends vertically from the lowest (first) processing unit 76C to the highest (sixth) processing unit 76C. For example, one exhaust pipe space 763D extends vertically from the lowest (first) processing unit 76D to the highest (sixth) processing unit 76D. When the exhaust pipe spaces 763A to 763D are not distinguished from one another, they are all simply referred to as exhaust pipe spaces 763.

[0154] Each exhaust pipe space 763 is an area where piping is arranged to exhaust gas from the processing chamber 761. As shown in Figures 4 to 7, each exhaust pipe space 763 is provided with, for example, an exhaust path switching mechanism 770, a first vertical exhaust pipe 771, a second vertical exhaust pipe 772, and a third vertical exhaust pipe 773.

[0155] For example, in the exhaust pipe space 763A, an exhaust path switching mechanism 770 is provided for each of the processing chambers 761 of the processing unit 76A at the lowest stage (first stage) to the processing chamber 761 of the processing unit 76A at the highest stage (sixth stage). For example, in the exhaust pipe space 763B, an exhaust path switching mechanism 770 is provided for each of the processing chambers 761 of the processing unit 76B at the lowest stage (first stage) to the processing chamber 761 of the processing unit 76B at the highest stage (sixth stage). For example, in the exhaust pipe space 763C, an exhaust path switching mechanism 770 is provided for each of the processing chambers 761 of the processing unit 76C at the lowest stage (first stage) to the processing chamber 761 of the processing unit 76C at the highest stage (sixth stage). For example, in the exhaust pipe space 763D, exhaust path switching mechanisms 770 are arranged for each of the processing chambers 761 of the processing units 76D from the lowest (first) to the highest (sixth) processing units 76D.

[0156] There are, for example, four sets of the first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773. The first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773 are pipes for discharging gas, which is discharged from the processing chamber 761 via the exhaust path switching mechanism 770, to the outside of the substrate processing apparatus 790.

[0157] In each exhaust pipe space 763, for example, the first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773 extend from the side of the lowest (first) processing chamber 761 to the side of the highest (sixth) processing chamber 761. In each exhaust pipe space 763, for example, the first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773 are aligned in the width direction (±Y direction). In each exhaust pipe space 763, the first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773 have the function of exhausting gases flowing in via the exhaust path switching mechanism 770 from each of the processing chambers 761 of the six vertically stacked processing units 76.

[0158] When the first vertical exhaust pipes 771 are used to distinguish between the processing units 76A to 76D, they are referred to as first vertical exhaust pipes 771A to 771D. When the second vertical exhaust pipes 772 are used to distinguish between the processing units 76A to 76D, they are referred to as second vertical exhaust pipes 772A to 772D. When the third vertical exhaust pipes 773 are used to distinguish between the processing units 76A to 76D, they are referred to as third vertical exhaust pipes 773A to 773D.

[0159] The first set (first group) of first vertical exhaust pipes 771A, second vertical exhaust pipes 772A, and third vertical exhaust pipes 773A are configured to exhaust gas from each of the six stages of processing units 76A. The second set (second group) of first vertical exhaust pipes 771B, second vertical exhaust pipes 772B, and third vertical exhaust pipes 773B are configured to exhaust gas from each of the six stages of processing units 76B. The third set (third group) of first vertical exhaust pipes 771C, second vertical exhaust pipes 772C, and third vertical exhaust pipes 773C are configured to exhaust gas from each of the six stages of processing units 76C. The fourth set (fourth group) of first vertical exhaust pipes 771D, second vertical exhaust pipes 772D, and third vertical exhaust pipes 773D are configured to exhaust gas from each of the six stages of processing units 76D.

[0160] The exhaust path switching mechanism 770 is a mechanism for switching the gas exhaust path from the processing chamber 761 to the outside of the substrate processing apparatus 790 via one of the vertical exhaust pipes, namely, the first vertical exhaust pipe 771, the second vertical exhaust pipe 772, and the third vertical exhaust pipe 773.

[0161] The exhaust path switching mechanisms 770 are disposed on either side of the processing chamber 761. The exhaust path switching mechanisms 770 are connected to the processing chamber 761 via exhaust ports 762o, for example, to exhaust gas from the processing chamber 761. The exhaust path switching mechanisms 770 are also connected to, for example, a first vertical exhaust pipe 771, a second vertical exhaust pipe 772, and a third vertical exhaust pipe 773 that extend in the vertical direction.

[0162] 6, the exhaust path switching mechanism 770 has, for example, a first opening / closing unit 71d and a second opening / closing unit 72d. The first opening / closing unit 71d and the second opening / closing unit 72d have, for example, a door-like structure and operate like a swinging door.

[0163] The first open / close unit 71d and the second open / close unit 72d rotate about a rotation axis driven by a motor, etc. The exhaust path switching mechanism 770 is set to one of the following states by opening and closing the first open / close unit 71d and the second open / close unit 72d: a state in which gas flows from the processing space 761s into the first vertical exhaust pipe 771 (also referred to as a first state), a state in which gas flows from the processing space 761s into the second vertical exhaust pipe 772 (also referred to as a second state), and a state in which gas flows from the processing space 761s into the third vertical exhaust pipe 773 (also referred to as a third state).

[0164] For example, during a period in which a first chemical liquid is discharged from first movable nozzle 71n, exhaust path switching mechanism 770 is set to the first state. For example, during a period in which a second chemical liquid is discharged from second movable nozzle 72n, exhaust path switching mechanism 770 is set to the second state. For example, during a period in which a third chemical liquid is discharged from third movable nozzle 73n, exhaust path switching mechanism 770 is set to the third state.

[0165] <1-7. Horizontal exhaust system configuration> As shown in Figures 3 to 5, the horizontal exhaust system 780 includes a first horizontal exhaust pipe 781A, a second horizontal exhaust pipe 782A, a third horizontal exhaust pipe 783A, a first horizontal exhaust pipe 781B, a second horizontal exhaust pipe 782B, and a third horizontal exhaust pipe 783B.

[0166] 3 and 4, the first horizontal exhaust pipe 781A, the second horizontal exhaust pipe 782A, and the third horizontal exhaust pipe 783A are positioned above the two uppermost (sixth) processing units 76A and 76B so as to extend in the front-to-rear direction (±X direction). The first horizontal exhaust pipe 781A, the second horizontal exhaust pipe 782A, and the third horizontal exhaust pipe 783A are aligned, for example, in the width direction (±Y direction).

[0167] For example, a first vertical exhaust pipe 771A for the processing unit 76A and a first vertical exhaust pipe 771B for the processing unit 76B are connected to the first horizontal exhaust pipe 781A so as to communicate with each other. The first horizontal exhaust pipe 781A exhausts gas from the first vertical exhaust pipes 771A and 771B.

[0168] For example, the second horizontal exhaust pipe 782A is connected to a second vertical exhaust pipe 772A for the processing unit 76A and a second vertical exhaust pipe 772B for the processing unit 76B so that they communicate with each other. The second horizontal exhaust pipe 782A exhausts gas from the second vertical exhaust pipes 772A and 772B.

[0169] For example, a third vertical exhaust pipe 773A for the processing unit 76A and a third vertical exhaust pipe 773B for the processing unit 76B are connected to the third horizontal exhaust pipe 783A so as to communicate with each other. The third horizontal exhaust pipe 783A exhausts gas from the third vertical exhaust pipes 773A and 773B.

[0170] 3 and 5, the first horizontal exhaust pipe 781B, the second horizontal exhaust pipe 782B, and the third horizontal exhaust pipe 783B are positioned above the two uppermost (sixth) processing units 76C and 76D so as to extend in the front-to-rear direction (±X direction). The first horizontal exhaust pipe 781B, the second horizontal exhaust pipe 782B, and the third horizontal exhaust pipe 783B are aligned, for example, in the width direction (±Y direction).

[0171] For example, a first vertical exhaust pipe 771C for the processing unit 76C and a first vertical exhaust pipe 771D for the processing unit 76D are connected to the first horizontal exhaust pipe 781B so as to communicate with each other. The first horizontal exhaust pipe 781B exhausts gas from the first vertical exhaust pipes 771C and 771D.

[0172] For example, the second horizontal exhaust pipe 782B is connected to a second vertical exhaust pipe 772C for the processing unit 76C and a second vertical exhaust pipe 772D for the processing unit 76D so that they communicate with each other. The second horizontal exhaust pipe 782B exhausts gas from the second vertical exhaust pipes 772C and 772D.

[0173] For example, the third horizontal exhaust pipe 783B is connected to a third vertical exhaust pipe 773C for the processing unit 76C and a third vertical exhaust pipe 773D for the processing unit 76D so as to communicate with each other. The third horizontal exhaust pipe 783B exhausts gas from the third vertical exhaust pipes 773C and 773D.

[0174] The first horizontal exhaust pipe 781A, the second horizontal exhaust pipe 782A, and the third horizontal exhaust pipe 783A are longer than the first horizontal exhaust pipe 781B, the second horizontal exhaust pipe 782B, and the third horizontal exhaust pipe 783B.

[0175] Gas flows backward (in the +X direction) inside each of the first horizontal exhaust pipe 781A, the second horizontal exhaust pipe 782A, the third horizontal exhaust pipe 783A, the first horizontal exhaust pipe 781B, the second horizontal exhaust pipe 782B, and the third horizontal exhaust pipe 783B.

[0176] The substrate processing apparatus 790 has an exhaust section 768 including, for example, four exhaust pipe spaces 763 and a horizontal exhaust system 780, and this exhaust section 768 can exhaust gas from the processing chamber 761 to the outside of the substrate processing apparatus 790 (such as the factory's exhaust equipment).

[0177] A processing liquid storage unit 705 is provided at the rear (+X direction) of the substrate processing apparatus 790. The processing liquid storage unit 705 stores processing liquid distributors 701 and 702 and processing liquid supply sources 703 and 704. For example, the processing liquid supply source 703 stores a chemical liquid, and the processing liquid supply source 704 stores a rinse liquid.

[0178] Both processing liquid distributors 701 and 702 obtain processing liquids, specifically, a chemical liquid from a processing liquid supply source 703 and a rinse liquid from a processing liquid supply source 704. The processing liquid distributor 701 distributes the processing liquid to processing units 76C and 76D. The processing liquid distributor 702 distributes the processing liquid to processing units 76A and 76B.

[0179] Pipes for supplying the processing liquid from the processing liquid distributor 701 to the processing units 76C and 76D are provided in supply pipe spaces 762C and 762D, respectively. Pipes for supplying the processing liquid from the processing liquid distributor 702 to the processing units 76A and 76B are provided in supply pipe spaces 762A and 762B, respectively.

[0180] <1-8. Control system of substrate processing equipment> 1, the substrate processing apparatus 790 includes a control unit 79. The control unit 79 is a part for controlling the operation of each component of the substrate processing apparatus 790, for example.

[0181] 8 is a block diagram showing a functional configuration for controlling the operation of each component of the substrate processing apparatus 790. A control unit 79 is communicatively connected to the first transfer mechanism 723, the second transfer mechanism 75, the plurality of processing units 76, and the horizontal exhaust system 780.

[0182] More specifically, the control unit 79 is communicably connected to each of the elements to be controlled, for example, the plurality of processing units 76 and the horizontal exhaust system 780. This allows the control unit 79 to control the operations of, for example, the first transfer mechanism 723, the second transfer mechanism 75, the plurality of processing units 76, and the horizontal exhaust system 780.

[0183] 9 is a block diagram showing an example configuration of the control unit 79. The control unit 79 is realized by, for example, a general computer, etc. The control unit 79 has, for example, a communication unit 791, an input unit 797, an output unit 798, a storage unit 794, a processing unit 795, and a drive 796, which are connected via a bus line 79Bu.

[0184] The communication unit 791 transmits and receives signals via communication lines between, for example, the first transport mechanism 723, the second transport mechanism 75, the plurality of processing units 76, and the horizontal exhaust system 780. The communication unit 791 may receive signals from, for example, a management server for managing the substrate processing apparatus 790.

[0185] The input unit 797 inputs, for example, a signal corresponding to an operator's action, etc. The input unit 797 includes, for example, an operation unit such as a mouse and a keyboard that can input a signal corresponding to an operation, a microphone that can input a signal corresponding to a voice, and various sensors that can input a signal corresponding to a movement.

[0186] The output unit 798 outputs, for example, various types of information in a form that can be recognized by an operator. The output unit 798 includes, for example, a display unit that visibly outputs various types of information and a speaker that audibly outputs various types of information. The display unit may have the form of a touch panel that is integrated with at least a part of the input unit 797, for example.

[0187] The storage unit 794 stores, for example, the program Pg1 and various information. The storage unit 794 is configured with, for example, a non-volatile storage medium such as a hard disk or a flash memory. The storage unit 794 may have, for example, one storage medium, two or more integrated storage media, or two or more separate storage media. The storage medium stores, for example, information regarding the operating conditions of the first transport mechanism 723, the second transport mechanism 75, the multiple processing units 76, and the horizontal exhaust system 780. The information regarding the operating conditions of the processing units 76 includes, for example, a processing recipe for processing the substrate W.

[0188] The processing unit 795 includes, for example, an arithmetic processing unit 795a functioning as a processor and a memory 795b serving as a work area for arithmetic processing. The arithmetic processing unit 795a may include, for example, an electronic circuit such as a central processing unit (CPU), and the memory 795b may include, for example, a random access memory (RAM). The processing unit 795 realizes the functions of the control unit 79 by, for example, reading and executing a program Pg1 stored in the storage unit 794. Therefore, in the control unit 79, various functional units that control the operation of each unit of the substrate processing apparatus 790 are realized by, for example, the processing unit 795 performing arithmetic processing according to the procedures described in the program Pg1. That is, the functions and operations of the substrate processing apparatus 790 can be realized by the control unit 79 included in the substrate processing apparatus 790 executing the program Pg1. Some or all of the functional units realized by the control unit 79 may be realized in hardware, for example, using dedicated logic circuits.

[0189] The drive 796 is, for example, a part to which a portable storage medium Sm1 can be attached and detached. For example, when the storage medium Sm1 is attached to the drive 796, the drive 796 exchanges data between the storage medium Sm1 and the processing unit 795. When the storage medium Sm1 storing the program Pg1 is attached to the drive 796, the drive 796 reads the program Pg1 from the storage medium Sm1 into the storage unit 794 and stores it therein.

[0190] The following describes an example of the overall operation of the substrate processing apparatus 790. In the substrate processing apparatus 790, for example, the control unit 79 controls each unit of the substrate processing apparatus 790 in accordance with a recipe that describes the transport procedure, processing conditions, etc. of the substrate W, thereby performing a series of operations described below.

[0191] When a carrier C accommodating an unprocessed substrate W is placed on the carrier platform 721, the first transport mechanism 723 removes the unprocessed substrate W from the carrier C. The first transport mechanism 723 transports the unprocessed substrate W to the substrate platform 77. The second transport mechanism 75 transports the unprocessed substrate W from the substrate platform 77 to a processing unit 76 specified by a recipe or the like. The transfer of the substrate W between the first transport mechanism 723 and the second transport mechanism 75 may be performed directly between the hand 7231 and the hand 751, for example, without going through the substrate platform 77.

[0192] The processing unit 76 into which the substrate W has been loaded performs a predetermined series of substrate processing steps on the substrate W. In this series of substrate processing steps, for example, a chemical liquid and a rinse liquid are supplied to the upper surface Wa of the substrate W held by the holder 711 in this order.

[0193] After the treatment using the rinse liquid, an organic solvent may be supplied. After the treatment using the organic solvent, for example, a treatment (also referred to as a drying treatment) is performed in which the organic solvent is removed from the upper surface Wa of the substrate W and the upper surface Wa of the substrate W is dried. In the drying treatment, for example, the substrate W held by the holder 711 is rotated about the rotation axis A3 by an electric motor 711m serving as a drive unit.

[0194] When a series of substrate processing steps for the substrate W are completed in the processing unit 76, the second transport mechanism 75 removes the processed substrate W from the processing unit 76. The second transport mechanism 75 transports the processed substrate W to the substrate mounting part 77. The first transport mechanism 723 transports the substrate W from the substrate mounting part 77 to the carrier C on the carrier mounting part 721.

[0195] In the substrate processing apparatus 790, the first transport mechanism 723 and the second transport mechanism 75 repeatedly perform the above-described transport operation in accordance with the recipe, and each processing unit 76 performs a series of substrate processing on the substrate W in accordance with the processing recipe. In this way, the series of substrate processing on the substrate W is performed one after another.

[0196] <2. Explanation of the circulation device> Figures 10, 12, 13, 15, 16, 18, and 19 are all piping diagrams illustrating the configuration of the circulation device 100. Figure 10 shows a situation where only internal circulation is performed, Figure 12 shows a situation where only external circulation is performed, and Figure 13 shows a situation where external circulation is performed together with internal circulation. Figures 15, 16, 18, and 19 show situations involving modifications, which will be described in detail later.

[0197] The circulation device 100 can be used in either of the processing liquid distribution units 701, 702. External paths 71, 72 connected to the circulation device 100 from outside the circulation device 100 are also shown in Fig. 10. The circulation device 100 supplies and recovers the processing liquid to and from the external paths 71, 72.

[0198] When the circulation device 100 is employed as the processing liquid distribution section 701, for example, the external path 71 is a pipe through which the processing liquid flows in the six processing units 76C, and the external path 72 is a pipe through which the processing liquid flows in the six processing units 76D.

[0199] For example, the processing liquid is supplied to and collected between external path 71 and six processing units 76C via pipe 71b. For example, the processing liquid is supplied to and collected between external path 72 and six processing units 76D via pipe 72b. Pipe 71b is provided in supply pipe space 762C, and pipe 72b is provided in supply pipe space 762D.

[0200] When the circulation device 100 is employed as the processing liquid distribution section 702, for example, the external path 71 is a pipe through which the processing liquid flows in six processing units 76A, and the external path 72 is a pipe through which the processing liquid flows in six processing units 76B.

[0201] For example, the processing liquid is supplied to and collected between the external path 71 and the six processing units 76A via a pipe 71b. For example, the processing liquid is supplied to and collected between the external path 72 and the six processing units 76B via a pipe 72b. The pipe 71b is provided in the supply pipe space 762A, and the pipe 72b is provided in the supply pipe space 762B.

[0202] The circulation device 100 includes a storage tank T. The storage tank T stores a liquid Q. The liquid Q is the above-mentioned processing liquid, for example, sulfuric acid or a diluted solution thereof (diluted sulfuric acid).

[0203] The circulation device 100 includes a pipe 1. The pipe 1 has an inlet end 101 and is used to supply the liquid Q to the external path 71. The liquid Q flows into the inlet end 101.

[0204] The circulation device 100 includes a heater 11. The heater 11 is provided in the pipe 1. The heater 11 heats the liquid Q.

[0205] The circulation device 100 includes a pump 12. The pump 12 is provided in the pipe 1. The pump 12 has an intake port 12a and an outlet port 12b. The intake port 12a is connected to the inlet end 101. The pump 12 pumps the liquid Q from the intake port 12a to the outlet port 12b. The pump 12 is, for example, a rotary type, and a magnetically levitated centrifugal pump is used as the pump 12. For example, a bearingless pump manufactured by Levitronix is ​​used as the magnetically levitated centrifugal pump.

[0206] The circulation device 100 includes a valve 13. The valve 13 is provided in the pipe 1. The valve 13 is connected to the discharge port 12b via a heater 11. The valve 13 controls the supply of the liquid Q to the external paths 71 and 72. For example, an on-off valve is used as the valve 13.

[0207] The circulation device 100 includes a pipe 2. The pipe 2 has an inlet end 201 and an outlet end 202. The inlet end 201 is connected to the pipe 1 between the heater 11 and the valve 13. The liquid Q flows out from the outlet end 202 into the storage tank T.

[0208] Valves 21 and 22 are provided in the pipe 2. For example, an on-off valve or a regulation valve that regulates the flow rate is used as the valve 21. A relief valve is used as the valve 22. The pressure loss value of the pipe 2 can be varied by the operation of the valve 21.

[0209] The circulation device 100 includes pipes 3 and 4. The pipe 3 has an outlet end 302. The pipe 3 is used to recover the liquid Q from the external paths 71 and 72. Specifically, the pipe 3 has an inlet end 301 on the opposite side to the outlet end 302, and the pipe 3 is connected to the external paths 71 and 72 at the inlet end 301.

[0210] The circulation device 100 includes a pipe 4. The pipe 4 has an inlet end 401. The inlet end 401 is connected to the valve 13 on the opposite side to the heater 11. The pipe 4 is used to supply the liquid Q to the external path 72.

[0211] The circulation in which the liquid Q flows out of the reservoir T via the pipes 1, 3, 4 and the valve 13 and flows into the reservoir T via the external path 71 and / or the external path 72 is called "external circulation." In the external circulation, the liquid Q flows through the valve 13, and therefore the valve 13 will also be referred to as the external circulation valve 13 hereinafter.

[0212] The circulation device 100 includes a pipe 6. The pipe 6 is a path for the liquid Q stored in the reservoir T from outside the circulation device 100. For example, when the circulation device 100 is employed as a processing liquid distribution unit 701, the pipe 6 is connected to a processing liquid supply source 703. For example, when the circulation device 100 is employed as a processing liquid distribution unit 702, the pipe 6 is connected to a processing liquid supply source 704.

[0213] The circulation in which liquid Q flows out of storage tank T and into storage tank T via pipes 1 and 2 and valves 21 and 22 is called "internal circulation." In the internal circulation, liquid Q flows through valve 21, so hereinafter valve 21 is also referred to as internal circulation valve 21.

[0214] The circulation device 100 includes a filter 16. The filter 16 is provided in the pipe 1, for example, between the heater 11 and the inlet end 201. The filter 16 has a function of removing impurities from the liquid Q.

[0215] The circulation device 100 includes a flow meter 15. The flow meter 15 is provided, for example, between the discharge port 12b and the heater 11. The flow meter 15 measures the flow rate of the liquid Q in the pipe 1.

[0216] The circulation device 100 includes a thermometer 31. The thermometer 31 is provided, for example, on the external paths 71, 72 side of the outflow end 302 in the pipe 3. The thermometer 31 measures the temperature of the liquid Q in the pipe 3.

[0217] A valve 71c is provided in the external path 71 between the pipe 1 and the pipe 71b. A valve 72c is provided in the external path 72 between the pipe 1 and the pipe 72b. For example, an on-off valve is used as the valves 71c and 72c. In external circulation, the valves 71c and 72c are opened, and the liquid Q is supplied from the pipe 1 to the external path 71 and from the pipe 4 to the external path 72, respectively.

[0218] It can be said that the external paths 71 and 72 are paths for the treatment liquid in different towers, and the valves 71c and 72c are the valves through which the liquid Q supplied from the circulation device 100 to the external paths 71 and 72, respectively, first passes. For this reason, hereinafter, the valves 71c and 72c are also referred to as tower main valves 71c and 72c, respectively.

[0219] A valve 71e is provided between the pipe 2 and the pipe 71b in the external path 71. A valve 72e is provided between the pipe 2 and the pipe 72b in the external path 72. The valves 71e and 72e are relief valves.

[0220] The circulation device 100 includes a valve 61 provided in the pipe 6. The valve 61 controls the outflow of the liquid Q into the storage tank T. The valve 61 may be, for example, an on-off valve.

[0221] 11 is a block diagram showing an outline of the functions of the control unit 5. The control unit 5 controls the operations of the valves 13, 21, 71c, 72c, and 61. For example, the control unit 5 supplies a control signal Sv to the valves 13, 21, 71c, 72c, and 61 to control the opening and closing of these valves.

[0222] The control unit 5 controls the operation of the heater 11 and the pump 12. For example, the control unit 5 supplies a control signal Sh to the heater 11 to control the heating of the liquid Q by the heater 11. For example, the control unit 55 supplies a control signal Sp to the pump 12 to control the flow rate of the liquid Q by the pump 12.

[0223] The control unit 5 receives input of data Fd from the flowmeter 15, which indicates the flow rate of the liquid Q flowing through the pipe 1. The control unit 5 receives input of data Td from the thermometer 31, which indicates the temperature of the liquid Q in the pipe 3 (hereinafter simply referred to as "liquid temperature"). The control unit 5 receives input of data Pd from the pump 12, which indicates the current flowing through the pump 12. When a magnetically levitated centrifugal pump is used as the pump 12, the data Pd indicates the current flowing through the pump 12 and / or the position of the impeller of the magnetically levitated centrifugal pump (hereinafter referred to as "impeller position").

[0224] The control of the rotation speed of the pump 12 by the control unit 5 using the control signal Sp based on the data Fd, and the control of the heating of the liquid Q by the heater 11 by the control signal Sh based on the data Td are realized using well-known techniques, so details of the techniques for realizing such control of the pump 12 and the heater 11 will be omitted.

[0225] The control unit 5 can be realized, for example, by a part or the whole of the control unit 79. The control unit 5 can also be understood as a part of the circulation device 100.

[0226] The following explains the relationship between the valve opening and closing operation, the liquid temperature, and the state of the pump 12. In the following explanation, the pair of triangles that make up the symbol representing the valve are represented by a black triangle when the valve is open and a white triangle when the valve is closed.

[0227] However, as will be described later, when the valve 21 functions as an adjusting valve, the triangle shown in the valve 21 is hatched with dots (hereinafter tentatively referred to as "dotted hatching").

[0228] However, the white triangles shown for the valves 71e, 72e, and 22 that employ relief valves indicate a closed state in the sense that they are not relieving the liquid Q. Therefore, in the following description, the valve 71e does not obstruct the flow of the liquid Q in the external path 71, the valve 72e does not obstruct the flow of the liquid Q in the external path 72, and the valve 22 does not obstruct the flow of the liquid Q in the pipe 2.

[0229] However, as will be described later, when the valve 22 is used as a regulating valve, the triangle shown on the valve 22 is dot-hatched.

[0230] In the following description, the storage of the liquid Q in the storage tank T will be omitted. This explains the situation in which the valve 61 is in the closed state.

[0231] <2-1. Internal circulation> Before supplying the processing liquid (here, liquid Q) to the external paths 71 and 72, internal circulation is performed to raise the processing liquid to a predetermined temperature, which contributes to temperature control of the processing liquid when used for processing. When internal circulation is performed, referring to Fig. 10, valves 13, 71c, and 72c are closed and valve 21 is opened. Liquid Q is heated by heater 11.

[0232] In the internal circulation, the liquid Q flows from the reservoir T through the pump 12, the flow meter 15, the heater 11, the filter 16, the inlet end 201, the valves 22 and 21, and the outlet end 202 in this order, and returns to the reservoir T. In the internal circulation, the liquid Q is heated by the heater 11 to a desired value.

[0233] 10, a flow F1 of liquid Q (hereinafter referred to as "liquid flow") flows through the pump 12, flow meter 15, and filter 16 in this order in the pipe 1, and reaches the inlet end 201. In FIG. 10, a liquid flow F2 flows from the inlet end 201 through the valves 22 and 21 in this order to the outlet end 202 in the pipe 2. Since the valve 13 is closed, the liquid flows F1 and F2 are substantially continuous at the inlet end 201.

[0234] <2-2.External circulation> 12, when external circulation is performed, valves 13, 71c, and 72c are opened, and valve 21 is closed. A processing liquid (here, liquid Q) is supplied to external paths 71 and 72. Liquid Q is heated by heater 11.

[0235] In this embodiment, after internal circulation is performed, only external circulation is performed for a time. This makes it easy to avoid the phenomenon that the treatment liquid has difficulty flowing to the external paths 71, 72 when internal circulation is accompanied by external circulation. This is because the liquid Q does not flow through the pipe 2, which is the path for internal circulation.

[0236] 12, liquid flow F1 flows through pipe 1, passing through pump 12, flow meter 15, heater 11, filter 16, and valve 13 in this order, before reaching inlet end 401. In FIG. 12, liquid flow F1 is branched into liquid flows F711 and F721. Liquid flow F711 flows into external path 71, specifically into valve 71c. Liquid flow F721 flows into external path 72, specifically into valve 72c.

[0237] A liquid flow F721 flows into the inlet end 301 from the external path 71, and a liquid flow F722 flows into the inlet end 301 from the external path 72. The liquid flows F721 and F722 join at the inlet end 301 to become a liquid flow F3 which flows through the pipe 3. The liquid flow F3 flows from the inlet end 301 toward the outlet end 302.

[0238] <2-3.External circulation with internal circulation> By performing external circulation without internal circulation, the temperature and velocity of the liquid Q in the external paths 71 and 72 quickly reach the desired values. The liquid Q is heated by the heater 11.

[0239] When external circulation with internal circulation is performed, valves 13, 21, 71c, and 72c are opened, as shown in FIG. 13. Liquid Q is supplied to external paths 71 and 72. During the period when external circulation with internal circulation is performed, the temperature and flow rate of Liquid Q in the tower are at desired values. During this period, processing in the tower is performed normally, and from that perspective, this period is also referred to as "tower circulation" hereinafter.

[0240] 13, liquid flow F1 flows through pipe 1, in this order, through pump 12, flow meter 15, heater 11, and filter 16, and reaches inlet end 201. At inlet end 201, a portion of liquid flow F1 becomes liquid flow F2 and flows through pipe 2, and the remainder of liquid flow F1 is branched at inlet end 401 into liquid flows F711 and F721.

[0241] In the pipe 2, the liquid flow F2 flows from the inlet end 201 to the outlet end 202 via the valves 22 and 21 in this order.

[0242] The liquid flow F711 flows into the external path 71, specifically into the valve 71c, and the liquid flow F721 flows into the external path 72, specifically into the valve 72c.

[0243] A liquid flow F721 flows into the inlet end 301 from the external path 71, and a liquid flow F722 flows into the inlet end 301 from the external path 72. The liquid flows F721 and F722 join at the inlet end 301 to become a liquid flow F3 which flows through the pipe 3. The liquid flow F3 flows from the inlet end 301 toward the outlet end 302.

[0244] <2-4. Timing of start and end of internal circulation> As described above, the process flow of internal circulation, external circulation, and external circulation (tower circulation) accompanied by internal circulation contributes to the temperature and velocity of the liquid Q in the external paths 71 and 72 quickly reaching their desired values.

[0245] For example, when the liquid temperature reaches a predetermined temperature or higher (hereinafter also referred to as "internal circulation target temperature T1"), the internal circulation is switched to the external circulation. Such a switch contributes to replacing the processing liquid remaining in the external paths 71, 72 with the processing liquid at the desired temperature in the subsequent external circulation.

[0246] When external circulation is being carried out, internal circulation is started in parallel after it is estimated that the treatment liquid flowing through the external paths 71, 72 has reached the desired temperature and / or the desired temperature.

[0247] Figure 14 is a timing chart illustrating the execution of external circulation and internal circulation. The horizontal axis represents time. The vertical axis represents the states of the external circulation valve 13, the internal circulation valve 21, and the tower main valves 71c and 72c, and the value of the current flowing through the pump 12. Furthermore, when a magnetically levitated centrifugal pump is used as the pump 12, the impeller position of the pump 12 is also used on the vertical axis.

[0248] The states of the external circulation valve 13, the internal circulation valve 21, and the tower main valves 71c and 72c are indicated as "open" when they are open and "closed" when they are closed. "H" and "L" are shown as indicators of the value of the current flowing through the pump 12 (hereinafter referred to as "pump current"). The closer the graph is to the indicator "H," the larger the pump current is, and the closer the graph is to the indicator "L," the smaller the pump current is. For example, the indicator "L" indicates a state in which the pump current is zero and the pump 12 is stopped. The higher the viscosity of the liquid Q, the larger the pump current required to make the liquid flow F1 the desired flow rate.

[0249] The impeller position is indicated by indicators "a" and "b." The closer the graph is to indicator "a," the closer the impeller position is to suction port 12a, and the closer the graph is to indicator "b," the farther the impeller position is from suction port 12a. The higher the viscosity of liquid Q, the greater the load (pressure) the impeller receives from inlet end 101, and the farther its position is from inlet end 101.

[0250] The pump current and / or impeller position are provided to the control unit 5 by data Pd. The temperature of the liquid Q is provided to the control unit 5 by data Td. The control unit 5 controls the opening and closing of the pump 12 and the valves 13, 21, 71c, and 72c based on the data Td and Pd.

[0251] At time t1, internal circulation, heating by heater 11, and operation of pump 12 begin. At time t1, valve 21 opens. Valves 13, 71c, and 72c have been closed since before time t1, and liquid Q is not being supplied to external paths 71 and 72 of circulation device 100. During the period from time t1 to time t2 (hereinafter also referred to as the "first period"), valves 13, 71c, and 72c are closed, and valve 21 remains open. It can be said that Figure 10 shows the state of circulation device 100 during the first period.

[0252] At the beginning of the first period, the liquid temperature is low and the viscosity of liquid Q is high. Heating by heater 11 increases the temperature of liquid Q and decreases its viscosity. Therefore, the pump current rises at time t1 and then decreases. The impeller position moves away from suction port 12a at time t1 and then approaches suction port 12a. Figure 14 illustrates an example where the pump current decreases and the impeller position approaches suction port 12a at time t11, which is after time t1 and before time t2.

[0253] Time t2 is, for example, the time when the liquid temperature reaches the internal circulation target temperature T1. External circulation begins at time t2. Heating by the heater 11 and driving of the pump 12 are maintained. During the period from time t2 to time t3 (hereinafter also referred to as the "second period"), the valves 13, 71c, and 72c are open, and the valve 21 is closed. FIG. 12 can be said to show the state of the circulation device 100 during the second period.

[0254] At the beginning of the second period, the temperature of the liquid Q remaining in the external paths 71 and 72 is low, and the viscosity of the liquid Q is high. Heating by the heater 11 increases the temperature of the liquid Q and decreases its viscosity. Therefore, the pump current increases again at time t2 and then decreases. At time t2, the impeller position again moves away from the suction port 12a and then approaches the suction port 12a. Figure 14 illustrates a case where the pump current decreases in stages and the impeller position approaches the suction port 12a in stages at times t21 and t22 (>t21), which are after time t2 and before time t3.

[0255] In the second period, if it is detected that the pump current falls below the threshold value Th1 and / or that the impeller position is closer to the suction port 12a than position Th2, internal circulation is resumed while maintaining external circulation. The period from time t3 onward can be considered to be a third period in which external circulation is performed together with internal circulation. Figure 13 can be considered to show the state of the circulation device 100 in the third period (in which tower circulation is performed).

[0256] 14 illustrates a case where the pump current falls below threshold value Th1 at time t22, the impeller position is closer to suction port 12a than position Th2, and valve 21 opens at time t3 after time t22. The above detection is performed between time t22 and time t3. In this case, the replacement completion point can be said to be between time t22 and time t3.

[0257] Once it is confirmed that the processing liquid remaining in the external lines 71 and 72 has been replaced with the processing liquid at the desired temperature, the tower circulation is started. When the processing liquid in the external lines 71 and 72 reaches the desired temperature, the viscosity of the processing liquid also decreases, and the desired flow rate is achieved.

[0258] <2-5. First transformation> One of the causes of this problem is that when the processing liquid remaining in the external paths 71, 72 is replaced with the processing liquid supplied from the circulation device 100, the processing liquid flows preferentially into the internal circulation path. In view of this cause, external circulation without internal circulation is not essential. For example, if it is more difficult for the liquid Q to flow into the internal circulation path than through the internal circulation performed in the third period, internal circulation may be performed in the second period.

[0259] FIG. 15 illustrates a case in which external circulation accompanied by internal circulation is performed in the second period. The valve 21 is a valve that can not only open and close but also adjust the flow rate of the liquid Q. In FIG. 15, the pair of triangles that make up the symbol for the valve 21 are hatched to indicate that the flow rate of the liquid Q is adjusted. The opening of the valve 21 in the second period is smaller than the opening of the valve 21 in the third period. The example illustrated in FIG. 12 can be seen as a case in which the opening of the valve 21 takes a typical value of zero. In this case, the pressure loss value of the pipe 2 is significantly large.

[0260] Unlike the second period illustrated in Fig. 12, in Fig. 15, liquid flows F1, F2, F3, F721, and F722, similar to Fig. 13 illustrating the third period, except that the liquid flow F2 in the second period is smaller than the liquid flow F2 in the third period.

[0261] Such a function of the valve 21 can be seen as a function of adjusting the pressure loss value of the pipe 2. The valve 21 contributes to realizing the adjustment of the pressure loss value of the pipe 2. The pressure loss value of the pipe 2 in the second period is greater than the pressure loss value of the pipe 2 in the second period.

[0262] When attention is paid to such pressure loss values, the operations shown in FIGS. 10, 12, 13, 14, and 15 can be explained as follows.

[0263] With the heater 11 heating the liquid Q, Step J1: The valve 13 is closed during a first period (time t1 to t2), Step J2: In a second period (time t2 to t3) after the end of the first period, the valve 13 is opened and the pressure loss value of the pipe 2 is increased. Step J3: In a third period (after time t3) after the end of the second period, the valve 13 is opened and the pressure loss value of the pipe 2 is reduced.

[0264] More specifically, the valve 21, which is provided in the pipe 2 of the circulation device 100 and is capable of adjusting the flow rate, is controlled, and the pressure loss value of the pipe 2 is controlled.

[0265] For example, when the load on the pump 12 transitions from a state greater than a predetermined value to a state less than a predetermined value, the second period ends and the third period begins.

[0266] After it is confirmed that the processing liquid (liquid Q) in the external paths 71, 72 has been replaced with a processing liquid having a desired temperature or higher, the second period ends and the third period begins. The greater the viscosity of the liquid Q, the greater the load on the pump 12. Since the lower the temperature of the liquid Q, the greater the viscosity of the liquid Q, there is a negative correlation between the load on the pump 12 and the temperature of the liquid Q. Therefore, control based on the load on the pump 12 contributes to ending the second period and starting the third period, and / or ending step J2 and starting step J3.

[0267] The load on the pump 12 can be detected by the pump current. Specifically, the greater the load on the pump 12, the greater the pump current. The load on the pump 12 can also be detected by the impeller position. Specifically, the greater the load on the pump 12, the farther the impeller position is from the suction port 12a. The control unit 5 controls the valve 13 based on the data Pd, and steps J1, J2, and J3 are executed.

[0268] Because the liquid Q recovered from the external paths 71 and 72 flows through the pipe 3, the temperature measured by the thermometer 31 reflects the temperature of the liquid Q recovered from the external paths 71 and 72. Therefore, the replacement completion time can be set by utilizing the rise in this temperature. For example, when the liquid temperature transitions from a temperature lower than a predetermined value to a temperature higher than a predetermined value, the second period ends and the third period begins. The control unit 5 controls the valve 13 based on the data Td, and steps J1, J2, and J3 are executed. Control based on the temperature measured by the thermometer 31 contributes to ending the second period and starting the third period, and / or ending step J2 and starting step J3.

[0269] 16 illustrates a case in which external circulation is performed in conjunction with internal circulation in which the pressure loss value of the pipe 2 is higher in the second period than in the third period. An on-off valve is used for the internal circulation valve 21, and the internal circulation valve 21 is open in the second period as in the first and third periods. However, the opening degree of the valve 22 differs between the second and third periods, and the pressure loss value of the pipe 2 in the second period is made larger than the pressure loss value of the pipe 2 in the third period. The pair of triangles that make up the symbol representing the valve 22 are hatched to indicate that the flow rate of the liquid Q is adjusted.

[0270] 15 is applicable to such a configuration, with the valve 21 replaced with the valve 22. The valve 22 contributes to the realization of adjustment of the pressure loss value of the pipe 2.

[0271] 17 is a flowchart illustrating the operations of the above-described embodiment and the first variant. These operations can be seen as starting up the tower circulation, and therefore the flowchart is labeled "Starting up the tower circulation."

[0272] In step S11, process J1 is executed. In the above example, the internal circulation valve 21 opens at time t1. Thereafter, in step S12, it is determined whether the liquid temperature Qt of the liquid Q is equal to or higher than the internal circulation target temperature T1. If the result of the determination is negative, the process flow returns to step S11, and process J1 is repeatedly executed.

[0273] When the liquid temperature Qt reaches the internal circulation target temperature T1, if the result of the determination in step S12 is affirmative, step J2 is executed in step S13. In the flowchart, "internal circulation reduction" indicates that the amount of liquid Q circulating internally in step J2 is less than the amount of liquid Q circulating internally in step J1. This is achieved by increasing the pressure loss value of the pipe 2, as described above. In the above example, at time t2, the internal circulation valve 21 typically closes.

[0274] Thereafter, in step S14, it is determined whether the processing liquid in the external paths 71, 72 has been replaced. In the above example, this determination gives a positive result because the load on the pump 12 has transitioned from a state in which it is greater than the predetermined value to a state in which it is smaller than the predetermined value.

[0275] To give a more specific example, if it is detected that the pump current falls below threshold value Th1 after time t2 (which is a prerequisite because step S13 is executed before step S14 is executed), the judgment result of step S14 will be positive.

[0276] To give another specific example, if it is detected after time t2 (which is a prerequisite that step S13 is executed before step S14 is executed) that the impeller position is closer to the intake port 12a than position Th2, the judgment result of step S14 will be positive.

[0277] If the result of the determination in step S14 is negative, the process flow returns to step S13, and step J2 is repeatedly executed.

[0278] If the result of the determination in step S14 is affirmative, the process J3 is executed in step S15. More specifically, the tower circulation is executed. By executing step S15, the tower circulation is started.

[0279] Compared to the first modification, employing an on-off valve as the valve 21 and closing the valve 21 in the second period is desirable from the viewpoint of significantly increasing the pressure loss value of the pipe 2.

[0280] <2-6. Second transformation> In the above example, in the second period, external circulation (or external circulation accompanied by internal circulation in which the flow rate of the liquid Q is more limited than in the tower circulation) is performed in both the external paths 71 and 72. However, it is assumed that, for example, the treatment liquid remaining in the external path 71 and the treatment liquid remaining in the external path 72 may have different liquid temperatures Qt from each other. In such a case, external circulation corresponding to the second period may be performed for each of the external paths 71 and 72.

[0281] Fig. 18 shows external circulation when the liquid Q is supplied to the external path 71 without being supplied to the external path 72. Fig. 19 shows external circulation when the liquid Q is supplied to the external path 72 without being supplied to the external path 71.

[0282] Fig. 20 is a flowchart partially illustrating the operation of the second modification. Steps S13 and S14 of the flowchart shown in Fig. 17 are replaced with this flowchart to illustrate the operation of the second modification.

[0283] In Fig. 20, step S13 corresponding to process J2 can be seen as being decomposed into steps S132, S134, and S135. In Fig. 20, step S14 can be seen as being decomposed into steps S141 and S142.

[0284] If the determination in step S12 (see FIG. 17) is affirmative, step S132 is executed. The process executed in step S132 is to throttle the internal circulation valve 21 (reduce the opening of the internal circulation valve 21) or to close the internal circulation valve 21.

[0285] Thereafter, in step S133, the external circulation valve 13 opens, and in step S134, the tower main valve 71c opens. The tower main valve 72c closes. This achieves external circulation through the external path 71. Here, the external circulation through the external path 71 is exemplified as step J4.

[0286] Thereafter, in step S141, it is determined whether the processing liquid in the external path 71 has been replaced. This determination is made in the same manner as in step S14. If the result of the determination in step S141 is negative, the process flow returns to step S134, and process J4 is repeatedly executed.

[0287] If the result of the determination in step S141 is affirmative, in step S135, the tower main valve 71c is closed and the tower main valve 72c is opened, thereby realizing external circulation through the external path 72. Here, the external circulation through the external path 72 is exemplified as step J5.

[0288] Thereafter, in step S142, it is determined whether the processing liquid in the external path 72 has been replaced. This determination is made in the same manner as in step S142. If the result of the determination in step S142 is negative, the process flow returns to step S135, and process J5 is repeatedly executed.

[0289] If the result of the determination in step S142 is affirmative, step S15 is executed. However, when step S15 is executed in the second modification, steps S141 and S142 are executed separately, unlike when step S14 is executed. Therefore, in the second modification, execution of step S15 is accompanied by processing to open the tower main valve 71c.

[0290] In the second variation, the second period can be considered to include a fourth period in which step J4 is performed and a fifth period in which step J5 is performed. Specifically, this can be explained as follows.

[0291] The second period is: a fourth period in which the liquid Q is supplied from the pipe 1 (supplied to the external path 71) and the liquid Q is not supplied from the pipe 4 (not supplied to the external path 72); a fifth period in which the liquid Q is supplied from the pipe 4 (supplied to the external path 72) and the liquid Q is not supplied from the pipe 1 (not supplied to the external path 71); Alternatively, it can be said that step J2 includes steps J4 and J5.

[0292] The control unit 5 In a fourth period, supply of the liquid Q from the pipe 1 is performed, and supply of the liquid Q from the pipe 4 is not performed; In a fifth period, the supply of the liquid Q from the pipe 4 is performed, and the supply of the liquid Q from the pipe 1 is not performed; It can also be said that this control is carried out.

[0293] According to the second modification, appropriate external circulation is performed depending on the situation outside the circulation device 100, that is, depending on the situation of each of the external paths 71 and 72 in the above example.

[0294] All or part of the components constituting each of the above-described embodiments and various modified examples can be combined as appropriate within the scope of not being inconsistent. [Explanation of symbols]

[0295] 1 Pipe (1st Pipe) 2 Piping (2nd Piping) 3 Pipe (3rd Pipe) 4 Pipe (4th Pipe) 5. Control section 11 Heater 12 Pump 12a Inlet 12b Discharge port 13 Valve (External circulation valve, first valve) 21 valve (internal circulation valve, second valve) 22 valve (relief valve, second valve) 71,72 External pathway 100 Circulation device 101 Inflow end (1st inflow end) 201 Inflow end (second inflow end) 202 Outlet end (second outlet end) 302 Outlet end (third outlet end) 401 Inflow end (4th inflow end) J1 process (1st process) J2 process (2nd process) J3 Project (Project 3) J4 Project (Project 4) J5 Project (Project 5) Q liquid T storage tank

Claims

1. 1. A circulation device for supplying and withdrawing liquid to an external pathway, comprising: a reservoir for storing the liquid; a first pipe having a first inlet end through which the liquid flows from the reservoir tank and used for supplying the liquid; a heater provided in the first pipe for heating the liquid; a pump provided in the first pipe, the pump having an intake port connected to the first inlet end and an outlet port connected to the heater, the pump pumping the liquid; a first valve connected to the discharge port via the heater in the first pipe and capable of opening and closing; a second pipe having a second inlet end connected to the first pipe between the heater and the first valve and a second outlet end through which the liquid is discharged to the reservoir, the second pipe having a variable pressure drop; a third pipe having a third outlet end through which the liquid flows into the reservoir and used for recovering the liquid; and a control unit that controls the opening and closing of the first valve and the pressure loss value; Equipped with The control unit With the heater heating the liquid: closing the first valve for a first period of time; opening the first valve and increasing the pressure loss value during a second period after the end of the first period; the circulation device opens the first valve and reduces the pressure loss value during a third period after the second period ends.

2. a second valve provided in the second pipe and capable of adjusting the flow rate; Further provided with The circulation device according to claim 1 , wherein the control unit controls the second valve to control the pressure loss value.

3. The circulation system according to claim 2 , wherein the second valve is an on-off valve.

4. 3. The circulation system of claim 2, wherein the second valve is a relief valve.

5. The control unit when the load of the pump transitions from a state greater than a predetermined value to a state less than a predetermined value, the second period ends and the third period begins. The circulation device according to any one of claims 1 to 4.

6. The control unit when the temperature of the liquid flowing through the third pipe transitions from a temperature lower than a predetermined value to a temperature higher than a predetermined value, the second period ends and the third period begins. The circulation device according to any one of claims 1 to 4.

7. a fourth pipe having a fourth inlet end connected to the side of the first valve opposite to the heater, the fourth pipe being used for supplying the liquid; Further provided with the second period includes a fourth period and a fifth period; The control unit during the fourth period, the supply of the liquid from the first pipe is performed, and the supply of the liquid from the fourth pipe is not performed; during the fifth period, the supply of the liquid from the fourth pipe is performed, and the supply of the liquid from the first pipe is not performed; The circulation device according to any one of claims 1 to 6.

8. 8. The circulation system according to claim 1, wherein the liquid is sulfuric acid or a diluted solution of sulfuric acid.

9. 1. A method for controlling a circulation device that supplies and recovers liquid to an external path, comprising: The circulation device comprises: a reservoir for storing the liquid; a first pipe having a first inlet end through which the liquid flows from the reservoir tank and used for supplying the liquid; a heater provided in the first pipe for heating the liquid; a pump provided in the first pipe, the pump having an intake port connected to the first inlet end and an outlet port connected to the heater, the pump pumping the liquid; a first valve connected to the discharge port via the heater in the first pipe and capable of opening and closing; a second pipe having a second inlet end connected to the first pipe between the heater and the first valve and a second outlet end through which the liquid is discharged to the reservoir, the second pipe having a variable pressure drop; and a third pipe having a third outlet end through which the liquid flows into the storage tank and used for recovering the liquid; Equipped with The method comprises: With the heater heating the liquid: a first step of closing the first valve for a first period of time; a second step of opening the first valve and increasing the pressure loss value during a second period after the end of the first period; a third step of opening the first valve and reducing the pressure loss value during a third period after the second period has ended; A method for controlling a circulation device, comprising:

10. The circulation device a second valve provided in the second pipe and capable of adjusting the flow rate; Further provided with The method for controlling a circulation device according to claim 9 , further comprising controlling the pressure loss value using the second valve.

11. The method for controlling a circulation system according to claim 10 , wherein the second valve is an on-off valve.

12. The method for controlling a circulation system according to claim 10, wherein the second valve is a relief valve.

13. when the load of the pump transitions from a state greater than a predetermined value to a state less than a predetermined value, the second period ends and the third period begins. A method for controlling the circulation device according to any one of claims 9 to 12.

14. when the temperature of the liquid flowing through the third pipe transitions from a temperature lower than a predetermined value to a temperature higher than a predetermined value, the second period ends and the third period begins. A method for controlling the circulation device according to any one of claims 9 to 12.

15. The circulation device a fourth inlet end connected to the first valve on the opposite side to the heater; and a fourth pipe used for supplying the liquid. Further provided with The second step comprises: a fourth step in which the supply of the liquid is performed from the first pipe and the supply of the liquid is not performed from the fourth pipe; a fifth step in which the supply of the liquid from the fourth pipe is performed and the supply of the liquid from the first pipe is not performed; 15. A method for controlling the circulation device according to claim 9, comprising:

16. 16. The method for controlling a circulation device according to claim 9, wherein the liquid is sulfuric acid or a diluted solution of sulfuric acid.

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