Water circulation device, cutting device and method for manufacturing cut products

Abstract

To provide a water circulation device capable of continuously supplying water even when an anomaly in circulation occurs, and to provide a cutting device, and a method for manufacturing a cut product.SOLUTION: A water circulation device 30 that cools, with first water W1 or second water W2, a spindle portion 6 that rotationally drives a blade 8 for cutting a to-be-cut object Sb, includes: a tank 31 in which the first water W1 is stored; a pump 32 connected to the tank 31 and configured to pump the first water W1 toward the spindle portion 6; a circulating flow passage F configured such that the first water W1 flowing out from the tank 31 flows into the tank 31 again via the pump 32 and the spindle portion 6; a switch valve 34 capable of switching the first water W1 flowing through the circulating flow passage F to the second water W2; and a control unit 50 configured to control operations of the pump 32 and the switch control valve 34. The control unit 50 controls the switch valve 34 to cause the second water W2 to flow through the circulating flow passage F when an anomaly in circulation of the first water W1 is detected.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a water circulation device, a cutting device, and a method for producing a cut product. [Background technology]

[0002] Generally, a substrate on which semiconductor chips or the like are fixed is sealed with resin, and then cut into individual pieces using a cutting device to be used as an electronic component. Conventionally, cutting devices for cutting resin-sealed substrates are known. When cutting a substrate with a cutting device, water (cutting water) is used to cool the cutting blade and the substrate and to remove cutting debris. In addition, water (cooling water) separate from the cutting water is used to cool the spindle that rotates the blade. From the viewpoint of water conservation, this water is sometimes circulated and reused.

[0003] Patent Document 1 discloses a water circulation device for circulating and reusing water (processing water in Patent Document 1) used for cooling the blade and removing processing debris when cutting a resin-encapsulated substrate with a cutting device (processing device in Patent Document 1). The water used after cutting the substrate contains impurities such as processing debris, and cannot be reused as is. The water circulation device disclosed in Patent Document 1 filters the water used after cutting the substrate, irradiates it with ultraviolet light, removes impurity ions, and so on, thereby regenerating and reusing water that can be used for cutting substrates. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-122794 Summary of the Invention [Problem to be solved by the invention]

[0005] In order to circulate the water (waste liquid in Patent Document 1) after cutting the substrates, the water is pressure-fed using pumps (a waste liquid supply pump and a clean water supply pump in Patent Document 1). The pressure-fed water is filtered, irradiated with ultraviolet light, and has impurity ions removed, etc., to regenerate water that can be used for cutting substrates. However, if a water circulation abnormality occurs due to a pump malfunction or the like, the water cannot be pressure-fed. In this case, water circulation stops, so water for cutting cannot be supplied to the substrates, and the cutting device cannot cut the substrates.

[0006] Although not mentioned in Patent Document 1, the water used to cool the spindle that rotates the blades is sometimes reused by circulating it using a pump. However, even in this case, if a circulation abnormality occurs due to pump failure or the like, the water will no longer circulate, and the spindle will no longer be able to be cooled appropriately.

[0007] Therefore, there is a demand for a water circulation device, a cutting device, and a method for manufacturing cut products that are capable of continuously supplying water even when a circulation abnormality occurs. [Means for solving the problem]

[0008] One embodiment of a water circulation device according to the present disclosure is a water circulation device that uses first water or second water to cool a spindle unit that rotates and drives a blade that cuts an object to be cut, and includes a tank in which the first water is stored, a pump connected to the tank and pressurizing the first water stored in the tank toward the spindle unit, a circulation flow path configured so that the first water flowing out of the tank flows back into the tank via the pump and the spindle unit, a switching valve that can switch the first water circulating through the circulation flow path to the second water, and a control unit that controls the operation of the pump and the switching valve, and when the control unit detects a circulation abnormality in the first water, it controls the switching valve to circulate the second water through the circulation flow path.

[0009] One embodiment of the cutting device according to the present disclosure comprises the water circulation device described above, a mounting table on which the object to be cut is placed, and a cutting mechanism including the blade that cuts the object to be cut placed on the mounting table and the spindle portion that rotates the blade.

[0010] One embodiment of the method for manufacturing cut products according to the present disclosure is a method for manufacturing cut products using the cutting device described above, and includes a cooling process in which the water circulation device circulates the first water through the circulation flow path to cool the spindle portion, a fixing process in which the object to be cut is placed on the mounting table and then a water-sealed vacuum pump is operated to fix the object to the mounting table, and a cutting process in which the cutting mechanism cuts the object to be cut to obtain a cut product. [Effects of the Invention]

[0011] According to the embodiments of the present disclosure, it is possible to provide a water circulation device, a cutting device, and a method for manufacturing cut products that are capable of continuously supplying water even when a circulation abnormality occurs. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 2 is a perspective view showing a molded substrate and an electronic component. [Figure 2] FIG. [Figure 3] FIG. 1 is a diagram illustrating a configuration of a water circulation device. DETAILED DESCRIPTION OF THE INVENTION

[0013]

[0023] Below, embodiments of the water circulation system, cutting system, and method for manufacturing cut pieces according to the present disclosure will be described in detail with reference to the drawings. Note that the embodiments described below are merely examples for explaining the water circulation system, cutting system, and method for manufacturing cut pieces, and are not intended to limit the water circulation system, cutting system, and method for manufacturing cut pieces to these embodiments. Therefore, the water circulation system, cutting system, and method for manufacturing cut pieces according to the present disclosure can be implemented in various forms without departing from the spirit and scope of the present disclosure.

[0014] A substrate on which elements such as semiconductor chips are fixed is sealed with resin, and then cut into individual pieces to be used as electronic components. A dedicated cutting device is used to cut the resin-sealed substrate.

[0015] Resin sealing of a substrate is performed by placing the substrate on a molding die (not shown) of a resin molding device and supplying liquid molten resin into the molding die. The molten resin may be a thermoplastic resin or a thermosetting resin. Thermosetting resin reduces in viscosity when heated, and when further heated, it polymerizes and hardens to become a hardened resin. When resin sealing a substrate on which elements such as semiconductor chips are fixed, it is desirable to use a thermosetting resin. The elements fixed to the substrate are protected by the sealing resin.

[0016] [Configuration of molded substrate] As shown in FIG. 1, a molded substrate Sb (an example of an object to be cut) serving as an object to be cut by the cutting apparatus 1 (see FIG. 2) in this embodiment is formed by resin-sealing a substrate 63 on which multiple elements 61 are fixed and forming a resin package 65 on the side of the elements 61. The elements 61 are, for example, integrated circuits (semiconductor chips). The electrodes 61a are part of the elements 61 and are exposed on the side of the substrate 63 opposite the resin package 65. In this embodiment, multiple elements 61 are fixed to one substrate 63, and each element 61 has multiple electrodes 61a. In the example of FIG. 1, the number of elements 61 fixed to one substrate 63 is 21, and each element 61 has four electrodes 61a. However, the number of elements 61 fixed to one substrate 63 is not limited to 21, and the number of electrodes 61a per element 61 is not limited to four. The dashed lines in FIG. 1 indicate the areas to be cut by the cutting apparatus 1, which will be described later. In FIG. 1 , the three items diagonally above right represent electronic components Sc (examples of cut products) cut from the molded substrate Sb by the cutting device 1 of this embodiment. Each electronic component Sc has one element 61. Examples of electronic components Sc include a BGA (Ball Grid Array) substrate, an LGA (Land Grid Array) substrate, a CSP (Chip Size Package) substrate, an LED (Light Emitting Diode) substrate, and a QFN (Quad Flat No-leaded) substrate. Furthermore, the molded substrate Sb according to this embodiment is not limited to the substrate 63 to which the elements 61 are fixed and resin-sealed. The molded substrate Sb may also be, for example, a wiring substrate to which the elements 61 are not fixed and to which single-layer or multiple-layer wiring is applied.

[0017] [Configuration of cutting device] 2 is a plan view schematically showing a cutting device 1 according to the present embodiment. The cutting device 1 is configured to cut a molded substrate Sb to separate it into a plurality of electronic components Sc (see FIG. 1). Hereinafter, of the two surfaces of the molded substrate Sb, the surface sealed with resin (the surface on which the resin package 65 is arranged; the lower surface in FIG. 1) will be referred to as the front surface, and the surface opposite to the front surface (the upper surface in FIG. 1) will be referred to as the back surface.

[0018] The cutting device 1 is configured to include a cutting module A1 (an example of a cutting mechanism) and an inspection and storage module B1. The cutting module A1 manufactures a plurality of electronic components Sc by cutting a molded substrate Sb. The inspection and storage module B1 inspects each of the manufactured electronic components Sc, and then stores the electronic components Sc in a tray for non-defective products 15a or a tray for defective products 15b. In the cutting device 1, the cutting module A1 and the inspection and storage module B1 are each detachable and replaceable.

[0019] The control unit 50 of the cutting device 1 includes a processor such as a CPU (Central Processing Unit) and a storage device such as a RAM (Random Access Memory) or a ROM (Read Only Memory). The control unit 50 controls the operation of each part of the cutting module A1 and the inspection storage module B1 of the cutting device 1 by executing a control program stored in the storage device with the processor. The operation of the cutting device 1 described below is performed based on operation commands from the control unit 50, unless otherwise specified. In the following description, explanations of the operation commands from the control unit 50 will be omitted in principle, and the operation commands from the control unit 50 will be explained as necessary.

[0020] The cutting module A1 mainly includes a substrate supply unit 3, a positioning unit 4, a cutting table 5, a spindle unit 6, a transport unit 7, and a water circulation device 30. The cutting module A1 also includes a part of a first vacuum pump D1 and a second vacuum pump D2 (an example of a water ring vacuum pump).

[0021] The substrate supply unit 3 supplies the shaped substrates Sb one by one to the positioning unit 4 by pushing out the shaped substrates Sb one by one from a magazine M1 that stores a plurality of shaped substrates Sb.

[0022] The positioning unit 4 positions the shaped substrate Sb by placing the shaped substrate Sb pushed out from the substrate supply unit 3 on the rail unit 4a. Thereafter, the positioning unit 4 transports the positioned shaped substrate Sb to the cutting table 5.

[0023] The cutting table 5 holds the shaped substrate Sb to be cut. In this embodiment, the cutting module A1 has two cutting tables 5. Each of the two cutting tables 5 is connected to a second vacuum pump D2 via a second suction path VR2. That is, the cutting module A1 is provided with two second suction paths VR2 and two second vacuum pumps D2. The second vacuum pumps D2 are water-sealed vacuum pumps. The configuration of water-sealed vacuum pumps is well known, so a detailed description thereof will be omitted.

[0024] Each cutting table 5 includes a holding member 5a, a rotating mechanism 5b, and a moving mechanism 5c. The holding member 5a places the shaped substrate Sb transported to the positioning unit 4 on it, and holds the shaped substrate Sb by sucking air from below using the second vacuum pump D2 to create suction. In this way, the shaped substrate Sb is fixed to the cutting table 5. The detailed configuration of the cutting table 5 and the configuration for fixing the shaped substrate Sb to the holding member 5a by suction will be described later.

[0025] The rotation mechanism 5b can rotate the holding member 5a in the θ1 direction in Fig. 2. The movement mechanism 5c can move the holding member 5a along the Y axis in Fig. 2. Note that the Z direction shown in Fig. 2 is the up-down direction, the arrangement direction of the cutting module A1 and the testing storage module B1 is the X direction, and the direction perpendicular to the X and Z directions (the depth direction of each module) is the Y direction. The θ1 direction is the rotation direction around the Z axis.

[0026] The spindle unit 6 includes a motor 6a and a rotary shaft 6b that outputs the rotational driving force of the motor 6a. A blade 8 is disposed at the tip of the rotary shaft 6b. The spindle unit 6 rotates the rotary shaft 6b by the rotational driving force, and the blade 8 rotates as the rotary shaft 6b rotates. The blade 8 cuts the molded substrate Sb by rotating at high speed, and separates the molded substrate Sb into a plurality of electronic components Sc.

[0027] In this embodiment, the cutting module A1 has two spindle units 6. The spindle units 6 are movable along the X-axis and Z-axis in Fig. 2. However, the cutting module A1 may have a single spindle unit 6.

[0028] The spindle unit 6 is provided with a cutting water nozzle, a cooling water nozzle, a cleaning water nozzle (none of which are shown), and the like. The cutting water nozzle sprays cutting water onto the blade 8 which rotates at high speed. The cooling water nozzle sprays cooling water onto the blade 8 which is heated by cutting and onto the formed substrate Sb. The cleaning water nozzle sprays cleaning water to wash away cutting chips and the like. After being sprayed, the cutting water, cooling water, and cleaning water are discharged outside the cutting module A1.

[0029] The motor 6a of the spindle unit 6 generates heat when driven, so it is cooled with water such as industrial water while in operation. The cutting device 1 is equipped with a water circulator 30 that circulates water, and circulates and reuses first cooling water W1 (an example of first water) that cools the motor 6a (see FIG. 3). The detailed configuration of the water circulator 30 will be described later.

[0030] The conveying unit 7 picks up the cut electronic components Sc held on the cutting table 5 from above and conveys them to the inspection table 11 of the inspection storage module B1. A first vacuum pump D1 is connected to the conveying unit 7 through a first suction path VR1. The first vacuum pump D1 is a water-sealed vacuum pump. The conveying unit 7 sucks air using the first vacuum pump D1 to pick up the electronic components Sc.

[0031] The inspection storage module B1 is mainly composed of an inspection table 11, a first optical inspection camera 12, a second optical inspection camera 13, a placement unit 14, and an extraction unit 15. The first optical inspection camera 12 may be provided in the cutting module A1. The inspection storage module B1 also includes a part of a first vacuum pump D1. That is, the first vacuum pump D1 is present across both the cutting module A1 and the inspection storage module B1.

[0032] The inspection table 11 holds the electronic components Sc for optical inspection of the electronic components Sc by the first optical inspection camera 12 and the second optical inspection camera 13. The inspection table 11 is movable along the X-axis in Fig. 2. The inspection table 11 is provided with a holding member (not shown) that sucks and holds the electronic components Sc by suction from the first vacuum pump D1.

[0033] The first optical inspection camera 12 and the second optical inspection camera 13 capture images of both sides (front and back sides) of the electronic component Sc. Various inspections of the electronic component Sc are performed based on the image data captured by the first optical inspection camera 12 and the second optical inspection camera 13. The first optical inspection camera 12 and the second optical inspection camera 13 are each positioned near the inspection table 11 so as to capture images above.

[0034] In the placement section 14, inspected electronic components Sc (see FIG. 1) are placed by the inspection table 11. A first vacuum pump D1 is connected to the placement section 14 through a first suction path VR1.

[0035] The extraction unit 15 transfers the electronic components Sc placed in the placement unit 14 to a tray. The electronic components Sc (see FIG. 1) are sorted into "good products" or "defective products" by the extraction unit 15 based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13.

[0036] The cutting device 1 further includes a monitor 20 and a sound output unit 25. The monitor 20 is configured to display an image. The monitor 20 is configured as a display device such as a liquid crystal monitor or an organic EL (Electro Luminescence) monitor. The sound output unit 25 is configured to output sound. The sound output unit 25 is configured as a sound output device such as a speaker, buzzer, or bell.

[0037] [Configuration of the water circulation system] Next, the water circulation device 30 will be described with reference to FIG. 3. As described above, the water circulation device 30 has the function of circulating and reusing the first cooling water W1 that cools the spindle portion 6 (particularly the motor 6a). The water circulation device 30 has a tank 31, a water pump 32 (an example of a pump), a cooler 33, a switching valve 34, a sensor group 35, a first vacuum pump D1, a second vacuum pump D2, a separator 37, a filter 38, and a circulation flow path F that circulates the first cooling water W1 through these components. The water circulation device 30 has one first vacuum pump D1 and two second vacuum pumps D2, but because the three vacuum pumps have the same configuration, including the flow paths, only one second vacuum pump D2 is shown in FIG. 3 and will be described.

[0038] The circulation flow path F includes a first flow path F1, a second flow path F2, a third flow path F3, a fourth flow path F4, and a fifth flow path F5. The first flow path F1 is disposed between the water pump 32 and the motor 6a. The second flow path F2 is disposed between the motor 6a and the tank 31. The third flow path F3 is disposed between the first flow path F1 and the second vacuum pump D2. The fourth flow path F4 is disposed between the second vacuum pump D2 and the separator 37. The fifth flow path F5 is disposed between the separator 37 and the tank 31. The third flow path F3 branches off from the first flow path F1, and the fifth flow path F5 merges with the second flow path F2 just before the tank 31.

[0039] The tank 31 stores first cooling water W1, which is water to be circulated. The first cooling water W1 is, for example, industrial water, tap water, or pure water. The water pump 32 is arranged downstream of the tank 31 in the first flow path F1. The water pump 32 draws in and pressurizes the first cooling water W1 stored in the tank 31 to circulate the first cooling water W1 through the circulation flow path F. The cooler 33 is arranged downstream of the water pump 32 in the first flow path F1, and cools the first cooling water W1 that flows in from the water pump 32 by heat exchange with a refrigerant and then discharges it. The first cooling water W1 is, for example, water that is lower in temperature than room temperature. The configurations of the water pump 32 and the cooler 33 are known, so detailed description thereof will be omitted.

[0040] A sensor group 35 for detecting the flow rate, water pressure, water temperature, etc. of the first cooling water W1 is arranged downstream of the cooler 33 in the first flow path F1. The sensor group 35 is composed of, for example, a flow rate sensor, a water pressure sensor, and a water temperature sensor. The sensor group 35 constantly detects the state of the first cooling water W1 flowing through the first flow path F1 and sends the detection results to the control unit 50.

[0041] A sixth flow path F6 that merges with the first flow path F1 is disposed between the cooler 33 and the sensor group 35 of the first flow path F1. Unlike the first cooling water W1 stored in the tank 31, second cooling water W2 (an example of second water) supplied from outside the water circulation device 30 flows through the sixth flow path F6. The second cooling water W2 is, for example, industrial water, tap water, or pure water, and is preferably the same type of water as the first cooling water W1. The second cooling water W2 cools the spindle portion 6 in the same manner as the first cooling water W1. The sixth flow path F6 is not connected to the cooler 33, and the second cooling water W2 merges with the first flow path F1 downstream of the cooler 33. Therefore, the second cooling water W2 is not cooled by the cooler 33. The second cooling water W2 is, for example, water at room temperature. A switching valve 34, which is configured by an electromagnetic valve or the like that switches between opening and closing the sixth flow path F6, is disposed in the sixth flow path F6. When the switching valve 34 is closed, the second cooling water W2 does not merge into the first flow path F1. When the switching valve 34 is open, the second cooling water W2 merges into the first flow path F1. The switching valve 34 is opened and closed by the control unit 50. When the cutting device 1 is operating normally, the switching valve 34 is closed.

[0042] 3, the water circulation device 30 may have a flow path branching from the sixth flow path F6 to supply the second cooling water W2 to the tank 31. In this case, the second cooling water W2 stored in the tank 31 becomes the first cooling water W1.

[0043] The downstream end of the first flow path F1 is connected to a flow path that cools the motor 6a of the spindle portion 6. The first cooling water W1 that has flowed through the first flow path F1 cools the motor 6a by flowing, for example, through an outer circumferential flow path (not shown) formed on the outer periphery of the motor 6a or an internal flow path (not shown) formed inside the motor 6a and near the stator. The first cooling water W1 that has flowed through the external flow path and / or the internal flow path of the motor 6a flows through the second flow path F2 and returns to the tank 31. A filter 38 that removes foreign matter and the like that has become contained in the first cooling water W1 during flow is disposed in the second flow path F2 near the tank 31.

[0044] As described above, the spindle unit 6 rotates the blade 8 by the rotational driving force of the motor 6a, cutting the molded substrate Sb into a plurality of individual electronic components Sc. The molded substrate Sb is held by suction on the holding member 5a of the cutting table 5. The holding member 5a is made of an elastic member such as rubber, and has a suction hole 5a1 which is a through hole and a blade relief groove 5a2 which is a bottomed groove.

[0045] The suction holes 5a1 are formed on the holding member 5a at locations facing each of the electronic components Sc so that the multiple electronic components Sc obtained by cutting the molded substrate Sb can be individually sucked. By sucking air through the suction holes 5a1, the molded substrate Sb can be sucked and fixed to the holding member 5a. The blade relief grooves 5a2 are relief grooves that prevent the blade 8 from cutting the holding member 5a when the molded substrate Sb is cut. Therefore, the blade relief grooves 5a2 are formed between adjacent electronic components Sc on the molded substrate Sb.

[0046] The holding member 5a is placed on a mesh member 5f and a base 5g. A first air flow path 5f1 communicating with the suction holes 5a1 is formed in the mesh member 5f. A second air flow path 5g1 communicating with the first air flow path 5f1 is formed in the base 5g. An exhaust hole 5g2 is formed in the bottom wall of the base 5g, which exhausts air sucked through the suction holes 5a1 to the outside of the base 5g. In FIG. 3, only the central second air flow path 5g1 of the five second air flow paths 5g1 appears to be connected to the exhaust hole 5g2, but in reality, all five second air flow paths 5g1 are connected to the exhaust hole 5g2.

[0047] The exhaust hole 5g2 is connected to the third air flow path 5h. That is, air sucked in through the suction hole 5a1 flows through the first air flow path 5f1 and the second air flow path 5g1, is discharged through the exhaust hole 5g2, and flows through the third air flow path 5h. The downstream end (the end opposite the exhaust hole 5g2) of the third air flow path 5h is connected to the second vacuum pump D2. By operating the second vacuum pump D2, air is sucked in through the suction hole 5a1, and the shaped substrate Sb is thereby sucked and fixed to the holding member 5a (cutting table 5).

[0048] Returning to the explanation of the circulation flow path F, a third flow path F3 branches off from the first flow path F1 between the sensor group 35 and the motor 6a. That is, the first cooling water W1 before flowing into the motor 6a also flows through the third flow path F3. The downstream end of the third flow path F3 is connected to a second vacuum pump D2. The second vacuum pump D2 is a water-sealed vacuum pump that uses the driving force of a trochoid pump or the like to circulate the first cooling water W1, generating negative pressure and thereby sucking in air.

[0049] As described above, the second vacuum pump D2 sucks air through the suction holes 5a1 of the holding member 5a, thereby adsorbing the molded substrate Sb to the holding member 5a. The first cooling water W1 that flows into the second vacuum pump D2 functions as seal water. The air sucked by the second vacuum pump D2 through the suction holes 5a1 of the holding member 5a is discharged together with the first cooling water W1 into the fourth flow path F4 and flows into the separator 37. That is, water-containing air containing the first cooling water W1, which serves as seal water, and the air sucked through the suction holes 5a1 flows through the fourth flow path F4. In this embodiment, the first cooling water W1 is supplied to the second vacuum pump D2 as seal water, so that the first cooling water W1 can cool the driving source (not shown) of the second vacuum pump D2. Alternatively, the first cooling water W1 flowing through the third flow path F3 may cool the driving source of the second vacuum pump D2 before flowing into the second vacuum pump D2.

[0050] In the separator 37, the water-containing air that has flowed through the fourth flow path F4 is separated into the first cooling water W1 and the air, and the first cooling water W1 is stored below the separator 37 and the air is stored above the separator 37. The first cooling water W1 that has been stored in the separator 37 flows out and flows through the fifth flow path F5, merges with the second flow path F2, is filtered by the filter 38, and returns to the tank 31.

[0051] The air stored in the separator 37 flows through the fourth air flow path 39 and into the tank 31. The fourth air flow path 39 is disposed vertically above the separator 37 and vertically above the tank 31 so as to prevent the first cooling water W1 from accidentally flowing inside the fourth air flow path 39.

[0052] When the first cooling water W1 is circulating through the circulation flow path F, the flow paths between the separator 37 and the tank 31 (the fifth flow path F5 and the second flow path F2 after merging) are filled with the first cooling water W1. Since the air pressure inside the tank 31 and the air pressure inside the separator 37 are equal to atmospheric pressure, the water surface height of the first cooling water W1 stored in the tank 31 and the water surface height of the first cooling water W1 stored in the separator 37 are the same. Furthermore, the separator 37 needs a space sufficient to store the air separated from the water-containing air. If the water surface height of the first cooling water W1 rises and reaches the upper wall 37a, which is the highest point in the vertical direction of the separator 37, there will be no space to store the air, and there is a risk that the second vacuum pump D2 will not be able to adequately adsorb the molded substrate Sb.

[0053] Therefore, the tank 31 is provided with a drain outlet 31a for discharging the excess first cooling water W1 to the outside of the tank 31 at a position lower than the upper wall 37a of the separator 37 (see the dashed line in FIG. 3). By providing the drain outlet 31a in the tank 31, the water level of the first cooling water W1 in the tank 31 and the separator 37 will not be higher than the drain outlet 31a. Therefore, the water level of the first cooling water W1 will not reach the upper wall 37a of the separator 37, and a space sufficient for storing the air separated from the first cooling water W1 is secured in the separator 37.

[0054] An exhaust port 31b is disposed at a position higher in the vertical direction than the drain port 31a of the tank 31. The air that flows from the separator 37 through the fourth air flow path 39, enters the tank 31, and is stored in the tank 31 is discharged to the outside from the exhaust port 31b. By connecting the fourth air flow path 39 to the tank 31 in this way, even if the first cooling water W1 accidentally gets mixed in with the air separated by the separator 37 and flows out into the fourth air flow path 39, the mixed first cooling water W1 can be stored in the tank 31.

[0055] As described above, when the cutting device 1 is operating normally, the first cooling water W1 stored in the tank 31 is circulated through the circulation flow path F, thereby making it possible to appropriately cool the motor 6a of the spindle unit 6 and to adsorb the shaped substrate Sb to the holding members 5a of the cutting table 5. However, if a circulation abnormality occurs in which the first cooling water W1 does not circulate through the circulation flow path F for some reason, such as a malfunction of the water pump 32, it may become impossible to appropriately cool the motor 6a of the spindle unit 6 or to adsorb the shaped substrate Sb to the holding members 5a of the cutting table 5.

[0056] The control unit 50 determines whether circulation is normal or whether a circulation abnormality has occurred based on the detection results sent from the sensor group 35. Detections from the sensor group 35 that cause the control unit 50 to determine a circulation abnormality include, for example, deviation of the flow rate of the first coolant W1 from a normal range detected by a flow sensor, deviation of the water pressure of the first coolant W1 from a normal range detected by a water pressure sensor, and deviation of the water temperature of the first coolant W1 from a normal range detected by a water temperature sensor. Deviations from the normal ranges of the flow rate sensor and the water pressure sensor indirectly detect a malfunction of the water pump 32. Deviations from the normal range of the water temperature sensor indirectly detect a malfunction of the cooler 33.

[0057] When the control unit 50 determines that a circulation abnormality has occurred based on the detection results of the sensor group 35, it opens the switching valve 34 and controls the second cooling water W2 to flow through the first flow path F1 of the circulation flow path F instead of the first cooling water W1. As a result, the second cooling water W2 flows from the first flow path F1 to the fifth flow path F5, appropriately cooling the motor 6a of the spindle unit 6 and adsorbing the shaped substrate Sb to the holding member 5a of the cutting table 5. As a result, even if a circulation abnormality has occurred, the second cooling water W2 can be continuously supplied from the first cooling water W1, so that cutting of the shaped substrate Sb can be continued without stopping the operation of the cutting device 1. However, because the second cooling water W2 cannot circulate through the circulation flow path F, it flows from the fifth flow path F5 into the tank 31, where it is stored, and then discharged to the outside through the drain outlet 31a.

[0058] [Method for manufacturing electronic components] Next, a method for manufacturing electronic components Sc by cutting the molded substrate Sb using the cutting device 1 will be described with reference to Figures 2 and 3. The method for manufacturing electronic components Sc includes a cooling step in which the water circulation device 30 circulates first cooling water W1 through the circulation flow path F to cool the spindle portion 6, a fixing step in which the molded substrate Sb is placed on the cutting table 5 and then the second vacuum pump D2 is operated to fix the molded substrate Sb to the cutting table 5, and a cutting step in which the cutting module A1 cuts the molded substrate Sb to obtain electronic components Sc.

[0059] 2, the substrate supply unit 3 pushes out the shaped substrates Sb one by one from a magazine M1 that stores a plurality of shaped substrates Sb, and supplies the shaped substrates Sb one by one to the positioning unit 4. At this time, the shaped substrates Sb are arranged with their back surfaces facing upward.

[0060] The positioning unit 4 positions the shaped substrate Sb by placing the shaped substrate Sb pushed out from the substrate supply unit 3 on the rail unit 4a. Thereafter, the positioning unit 4 transports the positioned shaped substrate Sb to the cutting table 5.

[0061] After or before the shaped substrate Sb is transported to the cutting table 5, the water pump 32 and cooler 33 of the water circulation device 30 are operated to circulate the first cooling water W1 stored in the tank 31 through the circulation flow path F, thereby circulating the first cooling water W1. This starts cooling the motor 6a and rotating shaft 6b of the spindle unit 6 (cooling process). Note that the first cooling water W1 is stored in the tank 31 in advance in an amount necessary to circulate through the circulation flow path F.

[0062] Furthermore, the second vacuum pump D2 is operated. When the second vacuum pump D2 is operated, air is sucked through the suction holes 5a1 of the holding member 5a of the cutting table 5. As a result, the shaped substrate Sb is sucked onto the holding member 5a and fixed to the cutting table 5 (fixing step).

[0063] When the molded substrate Sb is suction-fixed onto the cutting table 5, the first position confirmation camera 5d captures an image of the molded substrate Sb, and the position of the molded substrate Sb is confirmed. The cutting table 5 then moves toward the spindle unit 6 along the Y-axis in FIG. 2. After the cutting table 5 moves below the spindle unit 6, the cutting table 5 and the spindle unit 6 are moved relative to each other, thereby cutting the molded substrate Sb into individual electronic components Sc (cutting process). The molded substrate Sb remains suction-fixed while the cutting table 5 moves and the molded substrate Sb is diced into individual electronic components Sc with the blade 8. The spindle unit 6 is provided with a cutting water nozzle, a cooling water nozzle, and a cleaning water nozzle (none of which are shown). Therefore, when cutting the molded substrate Sb, cutting water is sprayed onto the blade 8, which is rotating at high speed, from the cutting water nozzle. Cooling water is sprayed onto the blade 8 and the molded substrate Sb, which are heated by cutting, from the cooling water nozzle. Cleaning water is sprayed from the cleaning water nozzle to wash away cutting chips and the like. Thereafter, the second position confirmation camera 6c takes an image of the electronic components Sc as required, and the positions of the electronic components Sc are confirmed.

[0064] After cutting of the molded substrate Sb is completed, the cutting table 5, with the plurality of singulated electronic components Sc held by suction, moves along the Y axis in Fig. 2 in a direction away from the spindle unit 6. During this movement, the first cleaner 5e cleans and dries the top surfaces (rear surfaces) of the electronic components Sc.

[0065] Next, the transport unit 7 picks up the electronic components Sc held on the cutting table 5 from above. The transport unit 7 picks up the electronic components Sc and transports them to the inspection table 11 of the inspection storage module B1. During this transport process, the second cleaner 7a cleans and dries the lower surfaces (surfaces) of the electronic components Sc.

[0066] Inspection table 11 holds electronic components Sc for optical inspection of the electronic components Sc by first optical inspection camera 12 and second optical inspection camera 13. Inspection table 11 is movable along the X-axis in Fig. 2. In addition, inspection table 11 can be turned upside down.

[0067] The first optical inspection camera 12 captures an image of the front surface of the electronic component Sc being transported to the inspection table 11 by the transport unit 7. Thereafter, the transport unit 7 places the electronic component Sc on a holding member of the inspection table 11. After the holding member adsorbs the electronic component Sc, the inspection table 11 is turned upside down. After the inverted inspection table 11 moves above the second optical inspection camera 13, the back surface of the electronic component Sc is captured by the second optical inspection camera 13.

[0068] The placement unit 14 places the inspected electronic component Sc. The placement unit 14 sucks the inspected electronic component Sc by suction with the first vacuum pump D1. The placement unit 14 is movable along the Y axis in FIG. 2. The inspection table 11 places the inspected electronic component Sc on the placement unit 14.

[0069] The extraction unit 15 transfers the electronic components Sc placed in the placement unit 14 to a tray. The electronic components Sc are sorted into "good products" or "defective products" based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13. The extraction unit 15 transfers each electronic component Sc to a tray for good products 15a or a tray for defective products 15b based on the results of the sorting. That is, the good electronic components Sc are stored in the tray for good products 15a, and the defective electronic components Sc are stored in the tray for defective products 15b.

[0070] [Another embodiment] Hereinafter, an embodiment different from the embodiment described above will be described. Note that the same terms and symbols will be used to describe the same components as those in the embodiment described above for ease of understanding.

[0071] In the above embodiment, the separator 37 is arranged downstream of the second vacuum pump D2 to separate the water-containing air into the first cooling water W1 and air, but if separation can be performed in the tank 31, the separator 37 may not be necessary.

[0072] In the above embodiment, the sensor group 35 is composed of a flow rate sensor, a water pressure sensor, and a water temperature sensor, but the flow rate sensor, water pressure sensor, and water temperature sensor may be arranged separately. Also, the sensor group 35 may be configured so that only at least one of the flow rate sensor, water pressure sensor, and water temperature sensor is arranged.

[0073] <c>In the above embodiment, the parameters used by the control unit 50 to determine whether a circulation abnormality has occurred are the flow rate, water pressure, and water temperature of the first cooling water W1, but the parameters are not limited to these. For example, the parameters may be an abnormality in the drive circuit or drive current of the water pump 32, an abnormality in the flow rate, pressure, or temperature of the cooling fluid supplied to the cooler 33 to cool the first cooling water W1, or an abnormality in the amount of the first cooling water W1 stored in the tank 31. Any abnormality that makes it impossible to properly cool the motor 6a of the spindle unit 6 and / or makes it impossible to fix the molded substrate Sb to the cutting table 5 may all be included in the circulation abnormality.

[0074] <d>In the above embodiment, the sixth flow path F6 is configured to merge with the first flow path F1 between the cooler 33 and the sensor group 35, but this is not limiting. The sixth flow path F6 may be configured to merge with the first flow path F1, for example, between the water pump 32 and the cooler 33. With this configuration, even if the water pump 32 fails and the second cooling water W2 flows through the first flow path F1, the second cooling water W2 can be cooled to a low temperature by the cooler 33 and then supplied to the spindle unit 6, thereby cooling the motor 6a of the spindle unit 6 in the same way as in the case of the first cooling water W1.

[0075] [Summary of the above embodiment] The water circulation device 30, the cutting device 1, and the method for producing the cut product Sc described in the above embodiment will be outlined below.

[0076] <1> One aspect of the water circulation device (30) is a water circulation device (30) that cools a spindle unit (6) that rotates and drives a blade (8) that cuts a cutting object (Sb) including a substrate (63) with first water (W1) or second water (W2), and includes a tank (31) that stores the first water (W1), a pump (32) connected to the tank (31) that pressure-feeds the first water (W1) stored in the tank (31) toward the spindle unit (6), and a pump (32) that pumps the first water (W1) flowing out of the tank (31) toward the spindle unit (6). The circulation flow path (F) is configured so that the first water (W1) flows into the tank (31) again via the pump (32) and the spindle portion (6), a switching valve (34) that can switch the first water (W1) circulating in the circulation flow path (F) to the second water (W2), and a control unit (50) that controls the operation of the pump (32) and the switching valve (34), and when the control unit (50) detects a circulation abnormality in the first water (W1), it controls the switching valve (34) to cause the second water (W2) to flow through the circulation flow path (F).

[0077] In the water circulation device (30) of this embodiment, when the control unit (50) detects a circulation abnormality in the first water (W1), it controls the switching valve (34) from a closed state to an open state to circulate the second water (W2) through the circulation flow path (F).This allows the second water (W2) to be continuously supplied to the circulation flow path (F) from the first water (W1), thereby allowing the spindle portion (6) to be continuously cooled.

[0078] <2> the above <1> In the described water circulation system (30), the second water (W2) is preferably industrial water.

[0079] This allows the second water (W2) to be supplied to the circulation flow path (F) simply by connecting to an industrial water supply, eliminating the need for special equipment for producing the second water (W2), and therefore the water circulation device (30) can be constructed inexpensively.

[0080] <3> the above <1> or <2> The water circulation device (30) described above further comprises a water ring vacuum pump (D2) that is arranged in the middle of the circulation flow path (F) and sucks in air to adsorb the workpiece (Sb) to the mounting table (5), and it is preferable that the water ring vacuum pump (D2) uses the first water (W1) or the second water (W2) as seal water.

[0081] When the workpiece Sb is sucked onto the mounting table 5 and cut, cutting water, cooling water, and cleaning water are sprayed onto it. In this embodiment, the water ring vacuum pump D2 is used to suck the workpiece Sb onto the mounting table 5. Therefore, even if cutting water or the like seeps into the air suction hole used to suck the workpiece Sb, the operation of the water ring vacuum pump D2 is not affected, and the workpiece Sb can be stably and continuously sucked onto the mounting table 5. Furthermore, the first water W1 or the second water W2 used to cool the spindle 6 is used as the seal water for the water ring vacuum pump D2. Therefore, a separate water source is not required to supply seal water to the water ring vacuum pump D2, and the configuration of the water circulation device 30 can be simplified and made inexpensive.

[0082] <4> the above <3> The water circulation device (30) described above further includes a separator (37) into which water-containing air containing seal water (W1, W2) and air discharged from the water ring vacuum pump (D2) flows, and which separates the water into air and the seal water (W1, W2) and discharges each of the water and the seal water (W1, W2). The separator (37) is arranged in the circulation flow path (F) between the water ring vacuum pump (D2) and the tank (31). The tank (31) has a drain outlet (31a) for discharging excess first water (W1) or second water (W2) to the outside. The drain outlet (31a) is preferably located vertically lower than an upper wall (37a), which is the highest vertical position of the separator (37).

[0083] This prevents the water level of the first water (W1) or the second water (W2) in the tank (31) and the separator (37) from becoming higher than the drain port (31a). Therefore, the water level of the first water (W1) or the second water (W2) does not reach the upper wall (37a) of the separator (37), and therefore, a space sufficient to store the air separated from the first water (W1) or the second water (W2) can be secured in the separator (37).

[0084] <5> the above <4> In the water circulation system (30) described above, the tank (31) has an exhaust port (31b) through which the air separated by the separator (37) and flowing out is discharged from the tank (31) to the outside after entering the tank (31), and it is preferable that the exhaust port (31b) is positioned vertically higher than the drain port (31a).

[0085] This allows the air separated by the separator (37) to be discharged to the outside of the tank (31) without being affected by the first water (W1) or the second water (W2) stored in the tank (31). Furthermore, with this configuration, even if the first water (W1) or the second water (W2) accidentally mixes with the air separated by the separator (37) and flows out of the separator (37), the first water (W1) or the second water (W2) can be stored in the tank 31.

[0086] <6> the above <1> from <5> In the water circulation device (30) described in any one of the above, the circulation abnormality is preferably a malfunction of the pump (32).

[0087] The pump (32) is an essential component for pumping the first water (W1) and circulating it through the circulation flow path (F). Therefore, if the pump (32) breaks down, the first water (W1) will no longer circulate, and the spindle portion (6) will not be able to be properly cooled. However, according to this embodiment, a failure of the pump (32) is considered to be a circulation abnormality, so that even if the first water (W1) is no longer pumped, the second water (W2) can be circulated to properly cool the spindle portion (6).

[0088] <7> the above <1> from <5> Preferably, the water circulation device (30) described in any one of the above items further comprises a cooler (33) that cools the first water (W1) stored in the tank (31), and the circulation abnormality is a malfunction of the cooler (33).

[0089] The cooler (33) is an essential component for lowering the temperature of the first water (W1) to cool the spindle portion (6). Therefore, if the cooler (33) breaks down, even if the first water (W1) circulates, the water temperature remains high and the spindle portion (6) cannot be properly cooled. However, according to this embodiment, since a breakdown of the cooler (33) is considered to be a circulation abnormality, even if the first water (W1) is no longer cooled, the second water (W2) can be circulated to properly cool the spindle portion (6).

[0090] <8> One embodiment of the cutting device (1) is <1> from <7> and a cutting mechanism (A1) including a mounting table (5) on which an object to be cut (Sb) is placed, a blade (8) that cuts the object to be cut (Sb) placed on the mounting table (5), and a spindle portion (6) that rotates the blade (8).

[0091] The cutting device 1 of this embodiment is provided with the water circulation device 30, and therefore, even if a circulation abnormality occurs, the second water W2 can be continuously supplied from the first water W1. This makes it possible to provide a cutting device 1 that can continue to cut the workpiece Sb while appropriately cooling the spindle 6.

[0092] <9> the above <8> One aspect of the method for manufacturing a cut product (Sc) using the cutting device (1) described above includes a cooling process in which a water circulation device (30) circulates first water (W1) through a circulation flow path (F) to cool the spindle portion (6), a fixing process in which the object to be cut (Sb) is placed on a mounting table (5) and then a water ring vacuum pump (D2) is operated to fix the object to be cut (Sb) to the mounting table (5), and a cutting process in which the object to be cut (Sb) is cut by a cutting mechanism (A1) to obtain a cut product (Sc).

[0093] The method for producing the cut products (Sc) of this embodiment includes a cooling step in which the water circulation device (30) circulates the first water (W1) through the circulation flow path (F) to cool the spindle portion (6), a fixing step in which the workpiece (Sb) is placed on the mounting table (5) and then the water ring vacuum pump (D2) is operated to fix the workpiece (Sb) to the mounting table (5), and a cutting step in which the cutting mechanism (A1) cuts the workpiece (Sb) to obtain the cut products (Sc). Therefore, even if a circulation abnormality occurs, the second water (W2) can be continuously supplied from the first water (W1). This allows the spindle portion (6) to be appropriately cooled while continuing to cut the workpiece (Sb), thereby allowing the production of the cut products (Sc) to be continued. [Industrial Applicability]

[0094] The present disclosure can be used in a water circulation device, a cutting device, and a method for manufacturing a cut product. [Explanation of symbols]

[0095] 1: Cutting device 5: Cutting table (mounting table) 6: Spindle part 8: Blade 30:Water circulation device 31: Tank 31a: Drain port 31b: Exhaust port 32: Water pump (pump) 33:Cooler 34: Switching valve 37: Separator 37a: Upper wall 50: Control unit 61: Element 63: Substrate A1: Cutting module (cutting mechanism) D2: Second vacuum pump (water ring vacuum pump) F: Circulation flow path Sb: Preformed substrate (object to be cut) Sc:Electronic parts (cut products) W1: 1st cooling water (1st water) W2:Second cooling water (second water)< / d> < / c>

Claims

1. A water circulation device that cools a spindle that rotates a blade that cuts an object to be cut with first water or second water, a tank in which the first water is stored; a pump connected to the tank and pressure-feeding the first water stored in the tank toward the spindle portion; a circulation flow path configured so that the first water flowing out of the tank flows back into the tank via the pump and the spindle portion; a switching valve capable of switching the first water circulating in the circulation flow path to the second water; a control unit that controls the operation of the pump and the switching valve; a water-sealed vacuum pump that is disposed in the circulation flow path and sucks air to adsorb the workpiece onto a mounting table; The second water is supplied from an external source, When the control unit detects a circulation abnormality of the first water, the control unit controls the switching valve to circulate the second water through the circulation flow path, The water ring vacuum pump is a water circulation device that uses the first water or the second water as seal water.

2. The water circulation system according to claim 1 , wherein the second water is industrial water.

3. a separator into which water-containing air containing the seal water and the air discharged from the water ring vacuum pump flows, and which separates the water and the seal water and discharges them, the separator is disposed in the circulation flow path between the water ring vacuum pump and the tank, the tank has a drain port for discharging excess first water or second water to the outside, 2. The water circulation device according to claim 1, wherein the drain outlet is located at a vertical position lower than the upper wall, which is the highest position in the vertical direction of the separator.

4. the tank has an exhaust port through which the air separated by the separator and flowing out flows into the tank and then is discharged from the tank to the outside, The water circulation device according to claim 3 , wherein the exhaust port is positioned higher in the vertical direction than the drain port.

5. The water circulation system according to claim 1 , wherein the circulation abnormality is a failure of the pump.

6. The water supply system further includes a cooler that cools the first water stored in the tank, The water circulation system according to claim 1 , wherein the circulation abnormality is a malfunction of the cooler.

7. The water circulation device according to any one of claims 1 to 6; a cutting mechanism including a mounting table on which the object to be cut is placed, and the blade that cuts the object to be cut placed on the mounting table, and the spindle portion that rotates the blade.

8. A method for manufacturing a cut product using the cutting device according to claim 7, a cooling step of circulating the first water through the circulation flow path by the water circulator to cool the spindle portion; a fixing step of placing the workpiece on the stage and then operating a water ring vacuum pump to fix the workpiece to the stage; a cutting step of cutting the object to be cut by the cutting mechanism to obtain a cut product.

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