Substrate Processing Equipment

Abstract

The present invention is characterized in that the apparatus comprises a front end having a load opening for loading production workpieces into the apparatus, a process section coupled to the front end via an internal transport path configured to transport workpieces between the front end and the process section and offset in distance, and a load lock provided between the front end and the process section, the transport path extending through the load lock, the load lock having an intermediate entry with an opening that shunts the transport path to an outside separate from the front end, and a predetermined exchangeable transport carrier cassette configured to enter the load lock from the outside through the opening of the intermediate entry, wherein entry and exit of the cassette through the opening loads and unloads the load lock, interfacing with the transport path that corresponds to the cassette loaded in the load lock.

Description

[Technical Field]

[0001] [CROSS-REFERENCE TO RELATED APPLICATIONS] This application is a non-provisional application of U.S. Provisional Patent Application No. 62 / 861,543, filed June 14, 2019, the disclosure of which is incorporated herein in its entirety and claims the benefit of the same.

[0002] [Technical field] FIELD OF THE INVENTION The exemplary embodiments relate generally to controlled atmosphere environments, and in particular to increasing throughput in those environments. [Background technology]

[0003] [Brief description of related developments] In the manufacture of electronic devices, particularly in the manufacture of semiconductor devices that form an ever-increasing portion of electronic devices, there is a desire to increase efficiency. Generally, a semiconductor substrate processing system includes a transfer chamber to which a processing module and an atmospheric interface are coupled. To increase efficiency (e.g., to extend the manufacturing time between maintenance), trends in semiconductor substrate processing include the use of multiple serviceable parts that are introduced into the processing modules. The use of these serviceable parts can increase or extend the time between extensive maintenance procedures of at least the processing modules (e.g., when extensive maintenance is performed, the time between long intervals between process chamber cleanings can be extended).

[0004] In general, the atmospheric interface of a semiconductor substrate processing system typically includes one or more substrate-holding positions, such as a substrate-holding cassette or a load lock having a fixed support structure for supporting semiconductor substrates transferred into the load lock from an atmospheric front-end module. The support structures for semiconductor substrates within the substrate-holding positions and throughout the semiconductor processing system are specifically configured for the predetermined shape and size of the semiconductor substrates to be held thereby and processed by a processing module coupled to the transfer chamber. Multiple substrate processing systems and their component configurations typically include serviceable parts, which are introduced into a processing module by breaking the vacuum of the semiconductor substrate processing system to directly insert the serviceable part into the processing module (e.g., physically opening the processing module and inserting a consumable). Breaking the vacuum of a semiconductor substrate processing system typically results in increased downtime and maintenance costs for the semiconductor substrate processing system, at least associated with pumping and evacuating (e.g., circulating the internal atmosphere) the semiconductor substrate processing system. Breaking the vacuum also typically means that the process must be requalified before actual production can begin again, again increasing downtime and maintenance costs. A series of substrates must be run and inspected to ensure that the process is operating as it did before the vacuum in the semiconductor substrate processing system was broken. Summary of the Invention

[0005] The foregoing aspects and other features of the disclosed embodiments are explained in the following description taken in conjunction with the accompanying drawings. [Brief explanation of the drawings]

[0006] [Figure 1A] 1 is a schematic diagram of an exemplary process apparatus incorporating aspects of the present disclosure. [Figure 1B] 1 is a schematic diagram of an exemplary process apparatus incorporating aspects of the present disclosure. [Figure 1C] FIG. 1 is a schematic diagram of an exemplary processing device incorporating aspects of the present disclosure. [Figure 1D] 1 is a schematic diagram of an exemplary process apparatus incorporating aspects of the present disclosure. [Figure 1E] 1 is a schematic diagram of an exemplary process apparatus incorporating aspects of the present disclosure. [Figure 1F] 1 is a schematic diagram of an exemplary process apparatus incorporating aspects of the present disclosure. [Figure 2A] 1 is a schematic diagram of an exemplary substrate transport according to aspects of the present disclosure. [Figure 2B] 1 is a schematic diagram of an exemplary substrate transport according to aspects of the present disclosure. [Figure 2C] 1 is a schematic diagram of an exemplary substrate transport according to aspects of the present disclosure. [Figure 2D]1 is a schematic diagram of an exemplary substrate transport according to aspects of the present disclosure. [Figure 2E] 1 is a schematic diagram of an exemplary substrate transport according to aspects of the present disclosure. [Figure 3A] FIG. 1B is a schematic diagram of a chamber of the process apparatus of FIGS. 1A-1F incorporating aspects of the present disclosure. [Figure 3B] FIG. 1B is a schematic diagram of a chamber of the process apparatus of FIGS. 1A-1F incorporating aspects of the present disclosure. [Figure 3C] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 3D] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 4] FIG. 3C is a schematic diagram of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 5A] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 5B] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 5C] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 5D] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 5E] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 5F] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 6A] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 6B] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 6C] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 6D] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 6E] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 6F] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 7] FIG. 3C is a schematic diagram of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 8A] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 8B] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 8C] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 9A] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 9B] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 10A] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 10B] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 10C] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 11A] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 11B] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 11C] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 11D] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 12] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 13]FIG. 3C is a schematic diagram of a portion of the lock chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. [Figure 14] FIG. 1 is a schematic diagram of a method according to an aspect of the present disclosure. [Figure 15] FIG. 3C is a schematic diagram of a portion of the chamber of FIGS. 3A and 3B according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0007] 1A-1F illustrate exemplary semiconductor substrate processing systems / apparatuses according to embodiments of the present disclosure. Although embodiments of the present disclosure will be described with reference to the drawings, it should be understood that embodiments of the present disclosure can be embodied in many forms. Additionally, any suitable size, shape, or type of elements or materials can be used.

[0008] Aspects of the present disclosure provide a reconfigurable substrate holding position that can be used to introduce and / or modify temporary features and / or structures to introduce non-manufacturing materials (which may have physical form factors, i.e., shape, size, weight, etc., different from semiconductor substrates) into a semiconductor substrate processing system, substantially without breaking the vacuum atmosphere at the vacuum back end of the semiconductor substrate processing system. Aspects of the present disclosure provide a substrate holding position that includes a plurality of interchangeable transport carrier cassettes that can be inserted into and removed from the substrate holding position. At least one of the plurality of interchangeable transport carrier cassettes is configured to hold an item of non-manufacturing material that can be inserted into the substrate holding position with the item of non-manufacturing material thereon, without breaking the vacuum atmosphere of the semiconductor substrate processing system. The item of non-manufacturing material can then be transported by a substrate transport apparatus of the semiconductor substrate processing system to a desired location, such as a processing module, within a processing environment (e.g., vacuum or other suitable environment). Aspects of the present disclosure provide for reduced downtime of a semiconductor substrate processing system, such that only a small volume (e.g., compared to the volume of the transfer chamber and its associated process module(s)) of those substrate holding locations into which interchangeable carriers are inserted is cycled between atmospheric conditions and a vacuum atmosphere. Aspects of the present disclosure may also provide for the introduction of non-production materials during short intervals of routine process maintenance of the semiconductor substrate processing system (e.g., when minor maintenance is performed).

[0009] It should be noted that although aspects of the present disclosure are described herein with respect to load locks, aspects of the present disclosure are equally applicable to any suitable load lock used to transfer "production" substrates within a semiconductor processing system, load locks dedicated to the introduction and removal of non-production materials to and from a semiconductor processing system, and / or vacuum or atmospheric pressure transport chambers.

[0010] 1A and 1B, a substrate processing apparatus 11090 (also referred to herein as a substrate processing system or tool), such as a semiconductor tool station, is shown in accordance with aspects of the disclosed embodiments. Although the figures show a semiconductor tool station, aspects of the disclosed embodiments described herein may be applied to any tool station or application that uses a robotic manipulator. In this example, the substrate processing apparatus 11090 is shown as a cluster tool, but aspects of the disclosed embodiments may be applied to any suitable tool station, such as a linear tool station, such as that shown in FIGS. 1C and 1D and described in U.S. Pat. No. 8,398,355, entitled "Linearly Distributed Semiconductor Workpiece Processing Tool," issued March 19, 2013, the disclosure of which is incorporated herein by reference in its entirety.

[0011] The substrate processing apparatus 11090 generally includes an atmospheric front end 11000 (also referred to herein as a workpiece load chamber), a vacuum load lock 11010 (also generally referred to herein as a load lock), and a vacuum back end 11020 (also referred to herein as a processing section). In other embodiments, the substrate processing apparatus 11090 may have any suitable configuration. It should be noted that, for illustrative purposes only, aspects of the present disclosure are described herein with respect to a load lock (see, for example, load lock 300 in FIG. 3), but aspects of the disclosed embodiments may be applied to any suitable chamber of any suitable processing apparatus (such as those described with respect to FIGS. 1A-1F or any other suitable processing apparatus), which may be one or more of a metrology chamber, load lock chamber, inspection station, aligner station, buffer station, transfer chamber, or any other suitable substrate holding area (e.g., lock chamber) whose atmosphere may be selectively isolated from other portions of the processing apparatus (see FIGS. 1C and 1D, below).

[0012] Each component of the atmospheric front end 11000, vacuum load lock 11010, and vacuum back end 11020 may be connected to a controller 11091, which may be part of any suitable control architecture, such as, for example, a clustered architecture control. The control system may be a closed-loop controller having a master controller, a cluster controller, and autonomous remote controllers, such as that disclosed in U.S. Patent No. 7,904,182, entitled "Scalable Motion Control System," issued March 8, 2011, the disclosure of which is incorporated herein by reference in its entirety. In other embodiments, any suitable controller and / or control system may be utilized. The controller 11091 includes any suitable memory and processor(s) containing non-transitory program code for operating the substrate processing apparatus 11090 to process substrates S (see FIG. 1C) as described herein. The controller 11091 is configured to determine the position of the substrate relative to the end effector and / or substrate holding station for picking and placing the substrate S (FIG. 1C). In one aspect, the control device 11091 is configured to receive detection signals corresponding to one or more characteristics of the end effector and / or transport arm of the substrate transport device / robot and determine the position of the substrate relative to the end effector and / or substrate holding station and / or the position of one or more end effector tines in order to pick and place the substrate.

[0013] In one aspect, the atmospheric front end 11000 generally includes a plurality of load port modules 11005 and a mini-environment 11060, such as a front end equipment module (EFEM). Each of the plurality of load port modules 11005 defines a loading port 11999 for loading production substrates (also referred to herein as workpieces) into the substrate processing apparatus 11090 from outside the substrate processing apparatus 11090. The plurality of load port modules 11005 may be a Box opener / loader to tool standard (BOLTS) interface conforming to SEMI standards E15.1, E47.1, E62, E19.5, or E1.9 for 300 mm load ports, front-opening or bottom-opening boxes / pods, and cassettes. In other embodiments, the load port modules 11005 may be configured as a 200 mm substrate interface or a 450 mm substrate interface, or any other suitable substrate interface, such as, for example, larger or smaller substrates, or flat panels for flat panel displays. While two load port modules 11005 are shown in FIG. 1A , in other embodiments, any suitable number of load port modules 11005 may be incorporated within the atmospheric front end 11000. The load port modules 11005 may be configured to receive substrate carriers or cassettes 11005 from an overhead transport system, an automated guided vehicle (AGV), a human guided vehicle, a rail-guided vehicle, or any other suitable transport method. The load port modules 11005 may be connected to the minienvironment 11060 via a load port 11040. In one embodiment, the load port 11040 allows for the passage of substrates between the substrate cassette 11050 and the minienvironment 11060.

[0014] In one aspect, the mini-environment 11060 generally includes any suitable substrate transport apparatus 11013 incorporating one or more aspects of the disclosed embodiments described herein. In one aspect, the substrate transport apparatus 11013 is a track-mounted robot such as, for example, that described in U.S. Pat. No. 6,002,840 (the disclosure of which is incorporated herein by reference in its entirety), or in other aspects, may be any other suitable substrate transport apparatus 11013 having any suitable configuration. The mini-environment 11060 may include a controlled clean zone for substrate transport between the multiple load port modules and the vacuum back end 11020.

[0015] The vacuum back end or process section 11020 has a process environment configured to process manufacturing workpieces S (which may include, for example, wafers or other substrates that constitute the product of the processing system). The vacuum back end 11020 is offset from the atmospheric front end 11000 by a distance D (shown generally in FIGS. 1A, 1B, 1E, and 1F). The vacuum back end 11020 is coupled to the atmospheric front end 11000 via an internal transfer path 11998 (shown generally in FIGS. 1B and 1C) configured for transport of manufacturing substrates S between the atmospheric front end 11000 and the vacuum back end 11020. The vacuum back end 11020 generally includes a transfer chamber 11025, one or more processing station(s) or module(s) 11030, and any suitable transfer robot or device 11014. The substrate transport apparatus 11014, described below, can be disposed within the transfer chamber 11025 to transport substrates between the vacuum load lock 11010 and various processing stations 11030. The processing stations 11030 can operate on substrates by various deposition, etching, or other types of processes to form electrical circuits or other desired structures on the substrate. Typical processes include, but are not limited to, thin film processes using vacuum, such as plasma etching or other etching processes, chemical vapor deposition (CVD), plasma vapor deposition (PVD), implantation such as ion implantation, metrology, rapid thermal processing (RTP), dry strip atomic layer deposition (ALD), oxidation / diffusion, nitride formation, vacuum lithography, epitaxy (EPI), wire bonder and evaporation, or other thin film processes using vacuum pressure. The processing stations 11030 are connected to the transfer chamber 11025 to allow substrates to be passed from the transfer chamber 11025 to the processing stations 11030 or vice versa.In one embodiment, the load port module 11005 and load port 11040 are substantially directly coupled to the vacuum rear end 11020, such that a cassette 11050 attached to the load port interface is substantially directly connected to the vacuum environment of the transfer chamber 11025 and / or the processing vacuum of the processing station 11030 (e.g., the processing vacuum and / or vacuum environment extends between and is common between the processing station 11030 and the cassette 11050) (e.g., in one embodiment at least the mini-environment 11060 is omitted, while in another embodiment the vacuum load lock 11010 is also omitted so that the cassette 11050 is pumped down to vacuum in a manner similar to the vacuum load lock 11010).

[0016] The vacuum load lock 11010 is disposed between the atmospheric front end 11000 and the vacuum back end 11020, with the internal transfer path 11998 extending through the load lock 11010. For example, the vacuum load lock 11010 may be disposed between and connected to both the mini-environment 11060 and the vacuum back end 11020. Note that as used herein, the term vacuum refers to the atmospheric air in which substrates are processed. -5 This may indicate a high vacuum, such as Torr or less. The load lock 11010 has an intermediate inlet 11995 (see FIGS. 1A, 4A, 7) with openings 666, 667 (e.g., providing an inlet / outlet to the substrate processing equipment between the atmospheric front end 11000 and the vacuum back end 11020 separate from the substrate inlet(s) opening(s) in the atmospheric front end 11000) that diverts the internal transfer path 11998 to an exterior separated from the atmospheric front end 11000 within a distance D that offsets the vacuum back end 11020 from the atmospheric front end 11000. The vacuum load lock 11010 typically includes an atmospheric and vacuum slot valve 307 (see, e.g., FIG. 3C). The slot valve 307 can provide environmental isolation used to evacuate the load lock 11010 after loading a substrate through the atmospheric front end 11000 and to maintain a vacuum in the transfer chamber 11025 when evacuating the load lock 11010 with an inert gas such as nitrogen. In one embodiment, the load lock 11010 includes an aligner 11011 for aligning a substrate fiducial to a desired position for processing. In other embodiments, the vacuum load lock 11010 can be located in any suitable location in the substrate processing equipment 11090 and can have any suitable configuration and / or metrology equipment.

[0017] As described herein, aspects of the present disclosure provide an exchangeable transport carrier cassette 401 (see FIG. 4 , generally referred to herein as transport carrier cassette 401) having an exchangeable cassette frame 450 (see FIG. 4 ) and configured to enter the load lock 11010 from the outside through openings 666, 667 of an intermediate entrance 11995. Entry and removal of the transport carrier cassette 401 through openings 666, 667 of the intermediate entrance 11995 loads and unloads the load lock 11010 through a transport path interface 455 (described in more detail herein) that connects with an internal transport path 11998 within the load lock 11010. As described herein, the transport path interface 455 is a non-manufactured workpiece processing component coupled to the interchangeable cassette frame 450 and held by the transport carrier cassette 401 to transport the transport path interface 455 to and from the substrate processing apparatus 11090 and to repeatably position the transport path interface 455 relative to the transport planes X1, X2 (see FIG. 3C) of the internal transport path 11998 so as to connect the transport path interface 455 to the internal transport path 11998 at a repeatable position upon entry into the load lock 11010 via the openings 666, 667 of the intermediate entrance 11995. Here, the load lock 11010 has selectable configurations that are selectable via openings 666, 667 in the intermediate entrance 11995 between different (temporary) predetermined configurations, each having different (temporary) non-production workpiece process components (e.g., different shelf configurations, processing equipment, etc.) within the load lock 11010. The term "temporal" is used herein to indicate that predetermined features are of a temporary nature that are added to and / or removed from the lock chamber (as described further herein) via the access openings, and that the lock chamber can be installed within the process apparatus and without substantial disassembly.The selectable configuration of the load lock 11010 is effected by the introduction of at least one transport carrier cassette 401 holding one of a number of different non-manufacturing workpiece process components into the load lock 11010 through openings 666, 667 of the intermediate entrance 11995.

[0018] 1C , there is shown a schematic plan view of a linear substrate processing system 2010 in which a tool interface section 2012 (which in this embodiment may be configured as a load lock substantially similar to those described herein) is mounted to a transport chamber module 3018 such that the tool interface section 2012 faces substantially toward (e.g., inwardly from) the longitudinal axis LXA of the transport chamber module 3018, but is offset from the longitudinal axis LXA of the transport chamber module 3018. The transport chamber module 3018 can be extended in any suitable direction by attaching other transport chamber modules 3018A, 3018I, 3018J to interfaces 2050, 2060, 2070, as described in U.S. Pat. No. 8,398,355, previously incorporated by reference herein. Each transport chamber module 3018, 3018A, 3018I, 3018J includes any suitable substrate transport 2080 that may include one or more aspects of the disclosed embodiments described herein for transporting substrates S, for example, to and from processing modules PM (which in one aspect may be substantially similar to processing station 11030 described above), throughout the linear substrate processing system 2010. As can be appreciated, each transport chamber module 3018, 3018A, 3018I, 3018J may hold an isolated or controlled atmosphere (e.g., N, clean air, vacuum) and may operate as a load lock including aspects of the disclosure described herein.

[0019] Referring to FIG. 1D , a schematic elevation view of an exemplary processing tool 410, as may be taken along the longitudinal axis LXB of the linear transport chamber 416, is shown. In the aspects of the disclosed embodiment shown in FIG. 1D , the tool interface section 12 (which may be the atmospheric front end in this aspect) may typically be connected to the linear transport chamber 416. In this aspect, the tool interface section 12 may define one end of the linear transport chamber 416. As seen in FIG. 1D , the linear transport chamber 416 may have another substrate entry / exit station 412, for example, at an end opposite the tool interface section 12. In other aspects, other entry / exit stations may be included for inserting / removing substrates from the linear transport chamber 416. In one aspect, the tool interface section 12 and the substrate entry / exit station 412 may enable substrates to be loaded and unloaded from the processing tool 410. In other aspects, substrates may be loaded into the processing tool 410 from one end and unloaded from the other end. In one embodiment, the linear transport chamber 416 may include one or more transfer chamber modules 18B, 18i. Each transfer chamber module 18B, 18i may be capable of holding an isolated or controlled atmosphere (e.g., N2, clean air, vacuum). As previously mentioned, the configuration / arrangement of the transfer chamber modules 18B, 18i, chambers 56A, 56 (one or more of the chambers 56A, 56 may be metrology chambers, load lock chambers, inspection stations, aligner stations, buffer stations, or any other suitable substrate holding areas whose atmospheres may be selectively isolated from other portions of the processing equipment, or any other suitable substrate holding areas (e.g., lock chambers) may be isolated from other portions of the processing equipment), and substrate stations forming the linear transport chamber 416 shown in FIG. 1D is merely exemplary; in other embodiments, the transport chamber may have more or fewer modules arranged in any desired modular arrangement. In the embodiment shown, the substrate entry / exit station 412 may be a load lock.In other embodiments, a load lock module may be located between end entry / exit stations (similar to substrate entry / exit station 412), or an adjacent transport chamber module (similar to module 18i) may be configured to operate as a load lock.

[0020] As previously mentioned, the transfer chamber modules 18B, 18i have one or more corresponding substrate transport apparatuses 26B, 26i disposed therein, which may include one or more aspects of the disclosed embodiments described herein. The substrate transport apparatuses 26B, 26i of the respective transfer chamber modules 18B, 18i may cooperate to provide a linear distributed substrate transport system within the linear transport chamber 416. In this aspect, the substrate transport apparatuses 26B, 26i (which may be substantially similar to the substrate transport apparatuses 11013, 11014 of the cluster tool illustrated in FIGS. 1A and 1B) may have a typical SCARA arm configuration (although in other aspects, the substrate transport apparatus may have any other desired arrangement, such as, for example, a linear sliding arm 214 as shown in FIG. 2B or other suitable arm with any suitable arm linkage). Suitable examples of arm linkages are described, for example, in U.S. Patent Nos. 7,578,649 issued August 25, 2009, 5,794,487 issued August 18, 1998, 7,946,800 issued May 24, 2011, 6,485,250 issued November 26, 2002, 7,891,935 issued February 22, 2011, and 8,419,341 issued April 16, 2011, as well as U.S. patent application Ser. No. 13 / 293,717, entitled "Dual Arm Robot," filed November 10, 2011, and "Linear Vacuum Robot with Z Motion and Articulated Wire," filed September 5, 2013. No. 13 / 861,693, entitled "Arm," the entire disclosure of which is incorporated herein by reference.

[0021] In aspects of the disclosed embodiments, the at least one substrate transport apparatus may have the general configuration known as a SCARA (Selectively Compliant Articulated Robot Arm) type design, including an upper arm, a forearm, and an end effector, or a telescoping arm or any other suitable arm design. In one aspect, the arm may have a band-drive configuration, a continuous loop configuration, or any other suitable configuration as further described below. Suitable examples of transfer arms can be found, for example, in U.S. Patent Application No. 12 / 117,415, entitled "Substrate Transport Apparatus with Multiple Movable Arms Utilizing a Mechanical Switch Mechanism," filed May 8, 2008, and U.S. Patent No. 7,648,327, issued January 19, 2010, the disclosures of which are incorporated herein by reference in their entireties. The movement of the multiple transfer arms may be independent of one another (e.g., each arm extends / retracts independently of the other arms), may operate via a lost motion switch, or may be operably coupled in any suitable manner so that the multiple arms share at least one common drive axis. The SCARA arm(s) may have one link, two links, or any suitable number of links, and may have any suitable drive pulley arrangement, such as a 2:1 shoulder-to-elbow pulley arrangement and a 1:2 elbow-to-wrist pulley arrangement. In still other embodiments, the substrate transport apparatus may have any other desired arrangement, such as a frog-leg arm 216 ( FIG. 2A ) configuration, a leap-frog arm 217 ( FIG. 2D ) configuration, a symmetric arm 218 ( FIG. 2C ) configuration, or any other suitable configuration.

[0022] In another embodiment, referring to FIG. 2E, the transfer arm 219 includes at least first and second articulated arms 219A, 219B, each arm 219A, 219B including an end effector 219E configured to hold at least two substrates S1, S2 side-by-side in a common transfer plane (each substrate holding position of the end effector 219E sharing a common drive for picking and placing substrates S1, S2), and the spacing DX between the substrates S1, S2 corresponds to a fixed spacing between the side-by-side substrate holding positions. Suitable examples of substrate transport devices are disclosed in U.S. Patent Nos. 6,231,297 issued May 15, 2001, 5,180,276 issued January 19, 1993, 6,464,448 issued October 15, 2002, 6,224,319 issued May 1, 2001, 5,447,409 issued September 5, 1995, and 5,464,448 issued August 15, 2009. Nos. 7,578,649, issued May 25, 1998, 5,794,487, issued August 18, 1998, 7,946,800, issued May 24, 2011, 6,485,250, issued November 26, 2002, and 7,891,935, issued February 22, 2011, as well as U.S. patent application Ser. No. 13 / 293,717, entitled "Dual Arm Robot," filed November 10, 2011, and U.S. patent application Ser. No. 13 / 270,844, entitled "Coaxial Drive Vacuum Robot," filed October 11, 2011, the disclosures of which are incorporated herein by reference in their entirety. Aspects of the disclosed embodiments are, in one aspect, incorporated into a substrate transport apparatus of a linear transport shuttle, such as those described in U.S. Pat. Nos. 8,293,066 and 7,988,398, the disclosures of which are incorporated herein by reference in their entireties.

[0023] 1D , in aspects of the disclosed embodiment, the arms of the substrate transport apparatus 26B, 26i can be configured to provide what may be referred to as a fast-swap configuration, which allows the transport to quickly swap substrates from a pick / place position (e.g., pick a substrate from a substrate holding position and immediately thereafter place the substrate at the same substrate holding position). The substrate transport apparatus 26B, 26i can have any suitable drive section (e.g., coaxially arranged drive shafts, side-by-side drive shafts, horizontally adjacent motors, vertically stacked motors) to impart kinematic movement to each arm in any suitable number (N) of degrees of freedom (DOF) (e.g., manifested as independent axes of motion (Ri, Φi, etc.) of the arm links (e.g., upper / forearm) and independent axes of motion of each end effector of the arm 110, defined by each arm link (upper, forearm, and end effector) each having an independent axis of rotation about its corresponding support joint). 1D , in this embodiment, chambers / substrate stations 56A, 56, 30i (substantially similar to those described herein) may be interposed between transfer chamber modules 18B, 18i and may define suitable processing modules, load lock(s) LL, buffer station(s), metrology station(s), or any other desired station(s) as described herein. For example, intervening modules such as chambers 56A, 56 and substrate station 30i may each have fixed substrate supports / shelves 56S1, 56S2, 30S1, 30S2 that may cooperate with a substrate transport apparatus to provide transport of substrates through the length of the linear transport chamber 416 along the longitudinal axis LXB of the linear transport chamber 416.

[0024] As an example, substrate(s) may be loaded into linear transport chamber 416 by tool interface section 12. The substrate(s) may be placed on support(s) in chamber 56A by interface section transport arm 15. The substrate(s) in chamber 56A may be moved sequentially between chamber 56A and chamber 56 by substrate transport apparatus 26B in module 18B, and similarly between chamber 56 and substrate station 30i (which may be a load lock) by substrate transport apparatus 26i (in module 18i), and between substrate station 30i and substrate entry / exit station 412 by substrate transport apparatus 26i in module 18i. This process may be reversed in whole or in part to move substrate(s) in the opposite direction. Thus, in one embodiment, substrates may be moved in any direction along longitudinal axis LXB to any position along linear transport chamber 416 and may be transferred to and from any desired module (processing or otherwise) in communication with linear transport chamber 416. In other embodiments, intervening transfer chamber modules with fixed substrate supports or shelves may not be provided between the transfer chamber modules 18B, 18i. In such embodiments, the transfer arms of adjacent transfer chamber modules may move substrates through the linear transfer chamber 416 by handing off the substrate to an end effector or directly from one transfer arm to the end effector of another transfer arm.

[0025] The processing station modules can operate on the substrates by various deposition, etching, or other types of processes to form electrical circuits or other desired structures on the substrates. The processing station modules are connected to the transfer chamber modules to allow substrates to be passed from the linear transport chamber 416 to the processing stations, or vice versa. A suitable example of a processing tool having similar general features to the processing apparatus depicted in FIG. 1D is described in U.S. Patent No. 8,398,355, previously incorporated by reference in its entirety.

[0026] 1E is a schematic diagram of a substrate processing apparatus 11090A that may be substantially similar to the semiconductor tool station described above. Here, the substrate processing apparatus 11090A includes independent / separate in-line processing sections 11030SA, 11030SB, 11030SC connected to a common atmospheric front end 11000. Each of the processing sections 11030SA, 11030SB, 11030SC includes a process module 11030 (e.g., forming a vacuum back end 11020) and a load lock 11010 (substantially similar to those described herein). In this embodiment, at least one of the in-line processing sections 11030SA, 11030SB, 11030SC is configured to process substrates S1, S2, S3 that have predetermined characteristics that differ from substrates processed in the other in-line processing sections 11030SA, 11030SB, 11030SC. For example, the predetermined characteristic may be the size of the substrate. In one embodiment, and by way of example only, the inline processing section 11030SA may be configured to process 200 mm diameter substrates, the inline processing section 11030SB may be configured to process 150 mm substrates, and the inline processing section 11030SC may be configured to process 300 mm substrates. In one embodiment, at least one of the substrate transport apparatuses 11013, 11014 is configured to transport substrates S1, S2, S3 of different sizes with a common end effector. In one embodiment, each of the load port modules 11050 may be configured to hold and connect cassettes 11050 holding substrates S1, S2, S3 of different sizes on a common load port module. In other embodiments, each load port module 11050 may be configured to hold a predetermined cassette corresponding to a predetermined size substrate. Processing substrates of different sizes using at least one common transport apparatus 11013, 11014 may increase throughput and reduce machine downtime for single substrate batch processing.

[0027] 1F is a schematic diagram of a substrate processing apparatus 11090B that is substantially similar to the substrate processing apparatus 11090. However, in this embodiment, the process modules 11030 and load port modules 11005 are configured to process substrates having different sizes, as described above with respect to the substrate processing apparatus 11090A. In this embodiment, the process modules 11030 may be configured to process substrates having different sizes, or in other embodiments, process modules may be provided to accommodate substrates of different sizes to be processed in the substrate processing apparatus 11090B.

[0028] 3A and 3B, an exemplary chamber, such as a load lock 300, is illustrated according to an embodiment of the present disclosure. The vacuum load lock 300 (referred to herein for convenience as a "load lock") may be similar to those described above with respect to FIGS. 1A-1F and may provide for the introduction of temporary structures and / or features, such as non-production materials, into semiconductor substrate processing system(s), such as those described above with respect to FIGS. 1A-1F, without substantially breaking the vacuum atmosphere at the vacuum back end 301 of the semiconductor substrate processing system. The load lock 300 may be located between the vacuum back end 301 and a front end module (or mini-environment / atmospheric front end) 302. While, in other embodiments, the load lock 300 may be located in any suitable location in the substrate processing systems described herein. The load lock 300 includes one or more substrate-holding chambers 305. In the embodiment shown in FIGS. 3A and 3B, the load lock 300 includes two substrate-holding chambers 305A, 305B. However, in other embodiments, there may be more or fewer than two substrate holding chambers 305. Each of the substrate holding chambers 305 includes an atmospheric and vacuum slot valve 307 configured to seal the sealable aperture 397 of the respective substrate holding chamber 305A, 305B, such as when transferring substrates between the vacuum back end 301 and the front end module 602 via the load lock 300. Suitable examples of slot valves can be found, for example, in U.S. Pat. No. 8,272,825, issued September 25, 2012 (entitled "Load Lock Fast Pump Vent"), the disclosure of which is incorporated herein by reference in its entirety. Each slot valve 307 of the substrate holding chamber(s) 305 may be independently closable by a suitable door for the respective slot valve 307.The slot valve 307 may provide environmental isolation used to evacuate the load lock 300 after loading a substrate from the (atmospheric) front end 302 and maintain a vacuum in the (vacuum) back end 301, for example, when a substrate is transferred from the load lock 300 to a transfer chamber (such as in Figures 1A-1D and 1F) or when a substrate is transferred substantially directly from the load lock 300 to a processing module (such as in Figure 1E).

[0029] 3A, 3B, and 4, as described above, the interior of the load lock 300 may define one or more independently separable and / or circulatable substrate holding chambers 305. When two or more substrate holding chambers 305A, 305B are present, the substrate holding chambers 305A, 305B are arranged in a stacked configuration (e.g., one on top of the other). In other embodiments, the substrate holding chambers 305 may be arranged side-by-side or in any other suitable spatial relationship relative to one another. Either substrate holding chamber 305A, 305B may be a compact chamber that allows for rapid circulation of the chamber atmosphere. Suitable examples of compact chambers can be found in U.S. Pat. No. 8,272,825, previously incorporated by reference herein, as well as U.S. Pat. No. 7,374,386 (entitled "Fast Swap Dual Substrate Transport For Load Lock"), issued May 20, 2008, and U.S. Pat. No. 6,918,731 (entitled "Fast Swap Dual Substrate Transport For Load Lock"), issued July 19, 2005, the disclosures of which are incorporated by reference in their entireties. The substrate-holding chambers 305A, 305B may each have independently closable transfer openings 311, 312 (see FIGS. 3A and 3B ), such as by suitable slot valves 307 (e.g., atmospheric and vacuum slot valves), on either side of the load lock 300. Thus, the direction of substrate transport through each substrate holding chamber 305A, 305B is along substantially parallel axes or transport planes X1, X2 (see FIG. 3C). In one embodiment, the substrate holding chambers 305A, 305B may be configured such that the direction of substrate transport through each substrate holding chamber 305A, 305B is bidirectional. In other embodiments, the substrate holding chambers may be configured such that the direction of substrate transport through one of the substrate holding chambers 305A, 305B is different from the direction of substrate transport through the other substrate holding chamber 305A, 305B.As a non-limiting example, substrate holding chamber 305A can enable transfer of substrates from a front end unit to a processing chamber at the back end of a substrate processing system / tool, while substrate holding chamber 305B can enable transfer of substrates from the processing chamber to the front end unit. In other embodiments, the substrate holding chambers may have corresponding transfer openings on different sides of the module, as described above with respect to FIG. 1C. Each of the substrate holding chambers 305A, 305B and their respective slot valves 307 may be independently operable, such that, for example, when a substrate has cooled in one substrate holding chamber 305A, 305B, the substrate can be placed into or removed from the other substrate holding chamber 305A, 305B.

[0030] In embodiments of the present disclosure, the slot valve 307, which may be configured, for example, as a removably connectable (e.g., bolt-on or other suitable releasable connection) module, may be located externally relative to the substrate-holding chamber 305 defined by the load lock 300. In other embodiments, the slot valve 307 may be removably integrated within a wall of the load lock 300. Examples of suitable slot valve / load lock doors can be found in U.S. Pat. No. 8,272,825, the disclosure of which was previously incorporated by reference in its entirety. In other embodiments, the valve, or a portion of the valve, may not be removable from the load lock 300.

[0031] 3A, 3B, and 4, the load lock 300 may include a generic core or skeletal frame section 30, as well as a top closure 32 (FIGS. 3A-5F, also referred to herein as a cover) and a bottom closure 34 (FIGS. 3C and 6A-7, also referred to herein as a cover). The frame section 30 may be a unitary member (e.g., a one-piece structure) made of any suitable material, such as an aluminum alloy. In other embodiments, the frame section 30 may be an assembly, comprised of any suitable material or any number of sections. In embodiments of the present disclosure, the frame section 30 may generally define the outer surface of the load lock 300 as well as the boundaries of the substrate-holding chambers 305 defined therein. A web member W, as seen in FIGS. 3A-3C, may partition the load lock 300 to form a chamber stack. In other embodiments, the load lock 300 may have more than one web member W, such as when more than two substrate-holding chambers 305 are present. In other embodiments, the chamber stack may be formed in any suitable manner. For example, the load lock 300 may have a general-purpose opening into which a chamber sub-module including a chamber stack having any suitable number of chambers may fit. As can be appreciated, the substrate-holding chambers 305A, 305B may each be closed at the top and bottom by closures 32, 34, as described herein. The interface for the slot valve 307 may be fitted to the frame section 30 in any suitable manner. Examples of suitable interfaces for the slot valve 307 can be found in U.S. Pat. No. 8,272,825, previously incorporated by reference.

[0032] As can be appreciated, the load lock 300 is a communication module that serves as a through transfer of substrates between tool sections coupled by the load lock 300. In other embodiments, the load lock 300 is a communication module that serves as an inlet or outlet to an adjacent tool section (see, e.g., FIG. 1A , where the load lock 300 can be coupled to a facet of the transport chamber 11025 (e.g., the load lock 300 can at least couple to the transport chamber 11025 and have a slot valve for providing passage to and from the transport chamber 11025)). Thus, the height of the load lock 300 can be related to the height of an adjacent section or module of the substrate processing system / tool ​​and can depend on factors such as the z-axis travel of the substrate transport apparatus in the adjacent module (which is responsible for throughput through the load lock module and can in turn be bounded by factors such as the size or z-drive of the module and / or structural considerations). As can be appreciated, providing a load lock 300 with a height greater than the available z-travel of the transport apparatus can result in an unstable load lock volume that increases pump-down / evacuation times. Similarly, providing a module height less than the available z-travel prevents the full travel bandwidth available from the transport apparatus, thus unduly limiting the throughput of the load lock module. In embodiments of the present disclosure, features of the substrate-holding chamber(s) 305 of the load lock 300 can result in a configuration with a height that allows a stack of substrate-holding chambers 305A, 305B to be defined within the load lock 300. While, as discussed above and shown in FIGS. 3A-3C , in embodiments of the present disclosure, two substrate-holding chambers 305A, 305B are formed in a stacked arrangement within the load lock 300, in other embodiments, the substrate-holding chamber stack within a single load lock 300 may include more (or fewer) substrate-holding chambers, such as three or more.As can be appreciated, providing multiple independent substrate-holding chambers 305A, 305B within the compact spatial envelope of a common load lock 300 provides multiple independent, unrestricted transfer paths through the common load lock 300, each having a small internal volume (e.g., compared to a load lock having a single substrate-holding chamber provided at the front-end module and back-end of a substrate processing system / tool ​​substantially identical to that provided by the load lock 300), correspondingly increasing the throughput of the load lock 300. In embodiments of the present disclosure, each substrate-holding chamber 305A, 305B can be generally similar to one another. In one embodiment, the substrate-holding chambers 305A, 305B can have opposite configurations along the midplane separating the substrate-holding chambers. In other embodiments, the substrate-holding chambers can be different, such as for handling different sizes and / or types of substrates. In embodiments of the present disclosure, each of the substrate-holding chambers 305A, 305B can have a height sufficient to hold several stacked substrates as described herein. While in other embodiments, the substrate holding chambers 305A, 305B may be capable of holding one or more laminate substrates as needed.

[0033] Referring to Figures 3A and 3B, in embodiments of the present disclosure, each substrate-holding chamber 305A, 305B may have a corresponding vacuum control valve 333A, 333B and exhaust valve 334A, 334B (e.g., with or without a diffuser) that allows for independent circulation of the respective chamber atmosphere. The vacuum control valves 333A, 333B and exhaust valves 334A, 334B may be arranged in modules that may be interchangeable with one another, for example, as described in U.S. Patent No. 8,272,825, previously incorporated by reference. Any suitable gauge 335A, 335B may be coupled to each substrate-holding chamber 305A, 305B to sense the pressure of the atmosphere within each substrate-holding chamber 305A, 305B. Referring also to Figure 5C, the frame section 30 of the load lock 300 may have a vacuum port 500R and an exhaust port 500V formed therein for each substrate-holding chamber 305A, 305B. The arrangement of vacuum port 500R and exhaust port 500V shown in FIGS. 3A, 3B, and 5C is exemplary, and in other embodiments, the vacuum and exhaust ports may have any other suitable arrangement. Vacuum port 500R may be located on one side of frame section 30, while exhaust port 500V may be located on another side of frame section 30. In other embodiments, the vacuum port and exhaust port may be located on a common (i.e., the same) side of frame section 30. For example, as shown in FIGS. 3A and 3B, vacuum ports 500VA, 500VB may be vertically offset from one another. In other embodiments, vacuum ports 500VA, 500VB may be vertically aligned with one another or have any other suitable spatial relationship to one another. Similarly, exhaust ports 500RA, 500RB may be vertically offset from one another. In other embodiments, exhaust ports 500RA, 500RB may be vertically aligned with one another or have any other suitable spatial relationship to one another.

[0034] As shown in Figures 3A-3C, the load lock 300 may have a modular arrangement, allowing load locks to be constructed with similar or different configurations by attaching desired modules. For example, each of the vacuum ports 500VA, 500VA and each of the exhaust ports 500RA, 500RB may have any suitable mating interface (e.g., substantially similar mating interface 501 surrounding each port) to facilitate connection of the desired vacuum control valves 333A, 333B and / or the desired exhaust valves 334A, 334B to the port (and thus to the frame section 30 of the load lock 300). In one embodiment, two or more of the mating interfaces 501, 502 for the respective ports (the multiple mating interfaces for the vacuum port 500R are substantially similar) may be configured with substantially similar mating structures (e.g., mapping flanges, sealing surfaces, bolt patterns) that allow any valve with a complementary mating interface to mate with the mating interface of either port. By way of example, as best seen in FIG. 3A , exhaust valves 334A, 334B may be integrated into an exhaust valve module, each having a similar mating interface that allows either module to be interchangeably attached to the exhaust port interface of either substrate-holding chamber 305A, 305B, in a manner similar to that described in U.S. Patent No. 8,272,825, previously incorporated by reference in its entirety. Similarly, by way of example, as best seen in FIG. 3B , vacuum control valves 333A, 333B may be integrated into a vacuum valve module, each having a similar mating interface that allows either module to be interchangeably attached to the vacuum port interface of either substrate-holding chamber 305A, 305B. Note that while aspects of the present disclosure may be described with respect to separate exhaust and vacuum ports, in other exemplary embodiments, the valves may be configured to evacuate and pump out the chamber through a single port.For example, the valves may be configured with suitable valve characteristics to switch between a vacuum source and an exhaust source. In other alternative embodiments, each module may have exhaust and vacuum ports so that the chamber(s) may be evacuated and / or pumped down by a single exhaust / vacuum module.

[0035] 5C, 6B, 6C-6F, and 7, as described above, the load lock 300 can be configured to increase or maximize the throughput of substrates that can pass through the load lock 300 and the substrate processing tool to which it is coupled. As described herein, the load lock 300 can communicate between different sections of a substrate processing system / tool ​​(such as those shown in FIGS. 1A-1F), each of which can have, for example, a different atmosphere (e.g., inert gas on one side and vacuum on the other, or clean air at atmospheric pressure on one side and vacuum / inert gas on the other). In this example, the load lock 300 can define one or more substrate-holding chambers 305, 305A, 305B therein for holding substrates. Each of the one or more substrate-holding chambers 305, 305A, 305B can be isolable and can have a chamber atmosphere cycle that matches the atmosphere in the tool section adjacent to the load lock 300. In aspects of the present disclosure, each of the substrate holding chamber(s) 305, 305A, 305B of the load lock 300 is compact to allow for rapid cycling of the atmosphere in the substrate holding chamber 305, 305A, 305B.

[0036] 5, 6B, 6C-6F, and 7, each of the substrate holding chambers 305, 305A, 305B of the load lock 300 is configured to have an interior volume that is minimized relative to, for example, the path of movement of components within the respective substrate holding chamber 305, 305A, 305B and / or the path of the substrate(s) passing through the respective substrate holding chamber 305, 305A, 305B. In one aspect, the sidewalls SW of the substrate holding chambers 305, 305A, 305B may be contoured to follow the path PTH of the substrate S while only allowing a minimum clearance MC between the substrate S and the sidewalls SW (note that the minimum clearance may also include any transport carrier cassette 401 (see FIG. 4) inserted within the respective substrate holding chamber 305, 305A, 305B). While the path PTH in this embodiment is shown as a substantially linear path for illustrative purposes, in other embodiments, the path may be curved or may have both linear and curved portions. In this example, the bottom wall BW and / or top wall TW of each substrate holding chamber 305, 305A, 305B may be contoured to provide only a minimal clearance MC between the substrate S and / or portions of the substrate transport (e.g., end effector, etc.) passing through the load lock 300 and the top wall TW and / or bottom wall BW of the substrate holding chamber 305, 305A, 305B. For the upper substrate holding chamber 305B, the top wall TW and its contour may be formed, at least in part, by the top closure 32. For the bottom substrate holding chamber 305B, the bottom wall BW and its contour may be formed, at least in part, by the bottom closure 34. Each of the miniature chambers 305, 305A, 305B has a selectable configuration that allows for substantially free selection (i.e., with minimal process equipment / system downtime) between different predefined configurations of different temporary structures and characteristics, as further described.

[0037] For example, with reference to substrate holding chamber 305A (chamber 305B can be substantially similar), the surface of bottom section B1 of substrate holding chamber 305A can be raised relative to the surface of bottom section B2 of substrate holding chamber 305A (see FIGS. 6C and 6D). For example, section B1 merely provides clearance for a substrate S seated on substrate supports 699, while section B2 can provide clearance for the tines of an end effector of a transport apparatus (such as those described above) to reach underneath the substrate S to pick and place the substrate S to or from substrate supports 699. As can be appreciated, the top of substrate holding chamber 305A (substrate holding chamber 305B can be substantially similar) can also be contoured in a manner similar to that described above with respect to the bottom of substrate holding chamber 305A. Suitable examples of load lock chambers with contoured interior surfaces include U.S. Pat. No. 7,374,386, issued May 20, 2008 (entitled "Fast Swap Dual Substrate Transport For Load Lock"), and U.S. Pat. No. 6,918,731, issued July 19, 2005 (entitled "Fast Swap Dual Substrate Transport For Load Lock"), the disclosures of which are incorporated herein by reference in their entireties. In alternative embodiments, the substrate-holding chamber(s) 305, 305A, 305B can have any suitable shape and contour for minimizing internal volume. As can be appreciated, this minimized internal volume of the substrate-holding chamber(s) 305, 305A, 305B minimizes the volume of gas transferred to and from each substrate-holding chamber(s) 305, 305A, 305B during pump-down and evacuation cycles. This reduced gas volume can reduce the cycle time for transferring substrate(s) through the load lock 300 because less gas must be evacuated or introduced into each substrate holding chamber(s) 305, 305A, 305B.

[0038] 3A, 3B, and 4, as previously described, aspects of the present disclosure provide a reconfigurable substrate-holding position that can be used to introduce temporary structures, such as non-production (or other) materials, into a semiconductor substrate processing system (such as those described above) without substantially breaking the vacuum atmosphere at the back end of the semiconductor substrate processing system. While aspects of the present disclosure are described with respect to load lock 300, aspects of the present disclosure equally apply to any suitable load lock disposed between at least two modules of a substrate processing system for transferring substrates between the at least two modules, load locks for the introduction and removal of non-production materials, and / or vacuum or atmospheric transfer chambers (all of which are included in the expression "substrate-holding position" as used herein). One or more transport carrier cassettes 401A-401n (where the suffix "n" represents any suitable integer defining an upper limit on the number of transport carrier cassettes) may be introduced into and removed from the substrate holding position through any suitable closable / sealable opening(s) 666, 667 of the load lock 300 (see Figures 4, 5C, 6E, 6F, and 7) in a manner substantially similar to that described herein.

[0039] 5D, 6A, 6B, 6E, and 6F, one or more of the openings 666, 667 may be sealed by a respective removable closure 32R, 34R that may be completely removable from the frame section 30 of the load lock 300. The removable closure 32R, 34R may have any suitable shape and size to engage with the frame section 30 of the load lock 300 around the periphery of the respective opening 666, 667 (e.g., the removable closure extends beyond the periphery of the respective opening 666, 667 to engage / couple with the frame section 30 of the load lock 300). Any suitable seal 698 may be disposed around the periphery of the respective opening 666, 667 such that the seal 698 is compressed between the frame section 30 and the removable closure 32R, 34R to seal the respective opening 666, 667. The removable closures 32R, 34R may include one or more handles 32H, 34H configured to enable a user and / or any suitable automated equipment to couple and separate the respective removable closures 32R, 34R to and from the frame section 30. In one embodiment, the one or more handles 32H, 34H are configured for engagement by a human hand. Here, the one or more handles 32H, 34H may extend from the respective removable closure 32R, 34R at any suitable angle α (in a manner similar to that shown in FIG. 5B ) relative to a major surface of the respective removable closure 32R, 34R. In other embodiments, the one or more handles 32H, 34H include an automation interface 32HA, 34HA (e.g., having suitable kinematic / positioning features) configured to positionally and repeatably engage a robotic handler (see FIG. 6A ).

[0040] In one embodiment, the removable closures 32R, 34R include locating pins 590 that are received by respective locating apertures 591 in the frame sections 30 (see FIGS. 5D, 6B, 6E, and 6F). However, in other embodiments, the locating pins may be located on the frame sections 30 and the locating apertures 591 may be located on the removable closures 32R, 34R. The locating pins 590 and locating apertures 591 may provide guided movement between the removable closures 32R, 34R and the frame sections 30 prior to ejection of the removable closures 32R, 34R into the respective substrate-holding chambers 305A, 305B. The removable closures 32R, 34R may be coupled to the frame sections 30 in any suitable manner, such as by any suitable removable fasteners, clips, snaps, etc., to seal / close the respective openings 666, 667. In one aspect, the removable closures 32R, 34R include thumb / knob screws 515 (substantially similar to those shown in Figures 5A-5C) secured on the removable closures 32R, 34R, which may be configured to couple the respective removable closures 32R, 34R to the frame section 30.

[0041] 3A, 3B, 4, 5A-5F, 6E, 6F, and 7, one or more of the openings 666, 667 may be sealed by a respective hinged closure 32G, 34G. The hinged closures 32G, 34G may be substantially similar except that they are coupled to the frame section 30 by a hinge assembly. For example, the hinged closures 32G, 34G may have any suitable shape and size to engage the frame section 30 of the load lock 300 around the periphery of the respective openings 666, 667. Any suitable seal 698 (see FIGS. 4, 5C, and 5D) may be disposed around the periphery of the respective openings 666, 667 such that the seal 698 is compressed between the frame section 30 and the hinged closure 32G, 34G to seal the respective openings 666, 667. The hinged closures 32G, 34G may include one or more handles 32H configured to enable a user and / or any suitable automated equipment to pivot the hinged closures 32G, 34G about the hinge axis 570 to open and close (e.g., unseal and seal) the respective openings 666, 667 in the frame section 30. In one embodiment, the one or more handles 32H, 34H are configured for engagement by a human hand. Here, the one or more handles 32H, 34H may extend from the respective hinged closures 32G, 34G at any suitable angle α (see FIG. 5B ) relative to a major plane of the respective hinged closures 32G, 34G. In other embodiments, the one or more handles 32H, 34H comprise an automation interface 32HA, 34HA (see FIG. 3B ) configured to positionally repeatably engage a robotic handler (e.g., via suitable kinematic / positioning features).

[0042] 3A, 3B, 4, and 5A-5F, each of the hinged closures 32G, 34G is pivotally coupled to the frame section 30 at a respective hinge assembly 350. In one embodiment, with reference to FIGS. 3A and 3B, the hinge assembly 350 includes a first hinge member 351, a second hinge member 352, at least one hinge pin 353, and at least one stop 354. The first hinge member 351 and the second hinge member 352 are coupled to the frame section 30 of the load lock 300 in any suitable manner (e.g., by suitable chemical and / or mechanical fasteners, welding, etc.). In one embodiment, the first hinge member 351 and the second hinge member 352 may be integrally formed with the frame section 30. In the illustrated embodiment, the first hinge member 351 and the second hinge member 352 are spaced apart from one another such that at least a portion of the respective hinged closure 32G, 34G is disposed between the first hinge member 351 and the second hinge member 352, and at least one hinge pin 353 extends from the hinged closure 32G, 34G into one elongated slot 355 in each of the first hinge member 351 and the second hinge member 352. However, in other embodiments, the first and second hinge members 351, 352 and the hinged closures 32G, 34G may have any suitable configuration that forms a hinged connection between the first and second hinge members 351, 352 and the respective hinged closures 32G, 34G. At least one of the first hinge member 351 and the second hinge member 352 includes a recess 356 configured to receive a respective one of the at least one stops 354. Here, the at least one stop 354 is configured as a pin protruding from a surface of the hinged closure 32G, 34G, and the recess 356 is shaped to receive and retain the pin to retain the hinged closure 32G, 34G in the open position (see FIG. 4). However, in other embodiments, the at least one stop 354 and the recess 356 can have any suitable configuration for retaining the hinged closure 32G, 34G in the open position.It should be noted that the open position of the hinged closures 32G, 34G positions the hinged closures 32G, 34G relative to the frame section 30 of the load lock 300 so as to not impede the movement of the transport carrier cassette 401 between the respective substrate holding chambers 305A, 305B. In one embodiment, the hinge assembly 350 may provide for approximately 90° of rotation of the hinged closures 32G, 34G about their respective hinge axes 570 (accounting for manufacturing tolerances of the hinge components), while in other embodiments, the hinge assembly 350 may provide for more or less than approximately 90° of rotation of the hinged closures 32G, 34G about their respective hinge axes 570.

[0043] 3A, 3B, and 4, in this embodiment, to open the hinged closures 32G, 34G, a user grasps the handle 32H, or an automated device engages the automation interface 32HA, and rotates the hinged closures 32G, 34G in a respective direction 381 about the hinge axis 570. The hinged closures 32G, 34G may be moved in a direction 382 such that at least one stop 354 enters and seats within the recess 356, retaining the hinged closures 35G, 34G in the open position shown in FIG. To close the hinged closures 32G, 34G, the hinged closures 32G, 34G may move in direction 382 such that the at least one stop 354 exits the recess 356 so that the hinged closures 32G, 34G may rotate about the hinge axis 570 in direction 381 to a closed position (e.g., as shown in FIGS. 3A and 2B ). As can be appreciated, the hinge axis 570 may “float” (e.g., move) in direction 382 within the elongated slot 355 such that the at least one stop 354 moves into and out of the recess 356. As can also be appreciated, the recess 356 may be configured (e.g., with an “L” shape, or any other suitable configuration, etc.) as shown in FIGS. 3D and 7 to retain or otherwise prevent rocking of the hinged closure 34G disposed on the bottom of the load lock 300. The recess 356 may be configured such that the at least one stop 354 is retained within the recess 356 at least partially by, for example, the Earth's gravity (or any suitable biasing force) acting on the hinged closure 32G, 34G.

[0044] 5A-5F, hinge assembly 566 includes first hinge member 551, second hinge member 552, at least one hinge pin 553, and bias assembly 567. Hinge assembly 566 is described herein with reference to top closure 32. However, it should be understood that bottom closure 34 may have a substantially similar hinge assembly 566 unless otherwise noted. In this embodiment, first hinge member 551 and second hinge member 552 are positioned relative to respective hinged closures 32G, 34G in a manner similar to that described above, with at least one hinge pin 553 extending through respective hinged closures 32G, 34G and into one recess 555 in each of first hinge member 551 and second hinge member 552. As can be seen, hinged closures 32G, 34G pivot in direction 381 about hinge axis 570 formed by a mating interface between at least one hinge pin 553 and recess 555. In one aspect, any suitable bushing 561 may be provided within recess 555 with hinge pin 553 inserted within bushing 561. In one aspect, bushing 561 may be constructed of any suitable material (e.g., polytetrafluoroethylene, etc.) that provides a smooth surface on / along which hinge pin 553 rotates.

[0045] Each of the first hinge member 551 and the second hinge member 552 may be coupled to the frame section 30 of the load lock in any suitable manner, such as by any suitable mechanical or chemical fasteners. In one embodiment, the first hinge member 551 and the second hinge member 552 may be integrally formed with the frame section 30. In one embodiment, as shown in FIGS. 5E and 5F , each of the first hinge member 551 and the second hinge member 552 may be coupled to the frame section using shoulder bolts 571, 572 such that a spacing SP between the bottom of the bolt head and each of the first hinge member 551 and the second hinge member 552 is substantially equal to the amount of compression of any suitable resilient member 577 (e.g., an O-ring, etc.) disposed between each of the first hinge member 551 and the second hinge member 552. The spacing SP and resilient member 577 provide corresponding movement between the hinged closures 32G, 34G and the frame section 30, such as during / up pumping and evacuation (e.g., atmospheric circulation) of the load lock 300.

[0046] The biasing assembly 567 includes a closure bracket 530, a frame bracket 531, and a biasing member 532. The closure bracket 530 is coupled to the respective hinged closure 32G, 34G in any suitable manner (e.g., by any suitable mechanical and / or chemical fasteners, welding, etc.), while in other embodiments, the closure bracket 530 is integrally formed with the respective hinged closure 32G, 34G. The frame bracket 531 is coupled to the frame section 30 in any suitable manner (e.g., by any suitable mechanical and / or chemical fasteners, welding, etc.), while in other embodiments, the frame bracket 531 is integrally formed with the frame section 30. The biasing member 532 is pivotally coupled to the closure bracket 530 at one end 532E1 and to the frame bracket 531 at the other end 532E2. The closure bracket 530, the frame bracket 531, and / or the biasing member 532 may be shaped and sized to provide approximately 90° rotation (as described above) of the hinged closures 32G, 34G about their respective hinge axes 570, while in other embodiments, the frame bracket 531 and / or the biasing member 532 may be shaped and sized to provide greater than or less than approximately 90° rotation of the hinged closures 32G, 34G about their respective hinge axes 570.

[0047] The biasing member 532 is illustrated as a linear biasing member. However, in other embodiments, any suitable torsional biasing member may be used. Here, the biasing member 532 may be a gas spring or any other suitable linear biasing member, such as a biased tension damper or a biased compression damper. In one embodiment, with respect to the upper closure 32, the biasing member 532 is configured to reduce the amount of operator-applied opening force applied to the hinged closure 32G to open the hinged closure 32G. In another embodiment, with respect to the upper closure 32, the biasing member 532 is configured to open the hinged closure 32G substantially without operator-applied force. In one embodiment, the biasing member 532 may include an internal or external lock configured to hold the hinged closure 32G in the open position. While, in other embodiments, the first and second hinge members may include recesses, and the hinged closure 32G may include at least one stop for holding the hinged closure 32G in the open position instead of or in addition to the force applied by the biasing member 532. In one embodiment, as shown in FIG. 5D , any suitable stop 520 may be provided on the frame section 30, which may contact, for example, a closure bracket 530, to define the open position or otherwise limit rotation of the hinged closure 32G relative to the frame section 30. The biasing member 532 may also provide for controlled / braked movement of the hinged closure 32G to close the hinged closure 32G.

[0048] In one embodiment, with respect to the bottom closure 34, the biasing member 532 is configured to reduce the amount of operator-applied closing force applied to the hinged closure 34G to close the hinged closure 34G. In another embodiment, with respect to the bottom closure 34, the biasing member 532 is configured to close the hinged closure 34G substantially without operator-applied force. In one embodiment, the biasing member 532 may include an internal or external lock configured to hold the hinged closure 34G in the open position. Meanwhile, in other embodiments, the first and second hinge members may include recesses, and the hinged closure 34G may include at least one stop to hold the hinged closure 34G in the open position instead of or in addition to the force applied by the biasing member 532. 5D , any suitable stop 520 may be provided on the frame section 30, which may contact, for example, a closure bracket 530, to define an open position or otherwise limit rotation of the hinged closure 34G relative to the frame section 30. A biasing member 532 provides controlled / braked movement of the hinged closure 34G to open the hinged closure 34G, which controlled / braked movement may counteract gravity acting on the hinged closure 34G.

[0049] The hinged closures 32G, 34G may be coupled to the frame section 30 in any suitable manner, such as by any suitable removable fasteners, clips, snaps, etc., to seal / close the respective openings 666, 667. In one aspect, the hinged closures 32G, 34G include thumb / knob screws 515 (see FIGS. 5A-5C ) secured thereon, which may be configured to couple the respective hinged closures 32G, 34G to the frame section 30 to seal / close the respective openings 666, 667.

[0050] 4, 8A-8C, 9A, 9B, and 10A-10C, the transport carrier cassette(s) 401 are described in more detail. In one aspect, the transport carrier cassette(s) 401 are configured to interchangeably change the shelf geometry of the load lock 300 for semiconductor substrate manufacturing, maintenance procedures, setup / calibration procedures, or other suitable manufacturing / maintenance procedures of the semiconductor processing system / tool ​​(examples of which include, but are not limited to, shelf configurations for holding non-manufacturing materials, including specialty substrates, process chuck covers, end effectors, transport robot wrists, teaching / setup fixtures / instruments, inspection equipment, calibration wafers, metrology devices, transport chamber-related components such as slots / gate valve doors, and process-related components such as consumable rings, consumable ring support plates, chucks, and shelves). The shelf geometry change may be a temporary change resulting from maintenance or other non-manufacturing procedures. 15 , the load lock 300 may include a fixed (e.g., stationary) shelf 15000 (which may be used for substrate manufacturing), and one or more transport carrier cassettes 401 may be inserted into the load lock 300 (as described herein) to supplement the fixed auxiliary shelf 15000 (e.g., with additional manufacturing substrate supports) or to provide different supports (for holding items other than manufacturing substrates). In other aspects, the load lock 300 may lack a fixed substrate support 15000, and a transport carrier cassette 401 with substrate supports may be inserted into the load lock 300 for substrate manufacturing, as described herein. In yet other embodiments, the load lock 300 may be configured with a fixed support / shelf 15000 to hold non-manufacturing workpieces, and a transport carrier cassette 401 may be inserted into the load lock 300 (e.g., in addition to the fixed support shelf already in the load lock 300) to provide supports / shelves for manufacturing substrates.

[0051] Each transport carrier cassette 401 includes a replaceable cassette frame 450 constructed of any suitable material, including, but not limited to, metal, plastic, and ceramic. In some embodiments, any suitable coating(s) are applied to the replaceable cassette frame 450, for example, to protect the transport carrier cassette(s) 401 from a corrosive environment. In one embodiment, the replaceable cassette frame 450 has a shape and size to substantially fit the interior of the load lock 300 (see FIG. 4 ) and is replaceably inserted into either the top substrate holding chamber 305B or the bottom substrate holding chamber 305A, as described herein; thus, the replaceable cassette frame 450 may enter the load lock 300 from the outside through the openings 666, 667 of the middle entrance 11995. As described herein, the loading and unloading of the interchangeable transport carrier cassette 401 through the openings 666, 667 of the intermediate entrance 11995 loads and unloads a transport path interface 455 within the load lock 300 that connects with the internal transport path 11998 (see, e.g., FIGS. 1B, 1C, 1E, and 1F) corresponding to the interchangeable transport carrier cassette 401 loaded into the load lock 300. As can be understood, one or more of the temporary structures or features (e.g., consumables, shelves, end effectors, teaching equipment / furniture, etc.) that are loaded and unloaded via the loading and unloading of different transport carrier cassettes 401 define the transport path interface 455 (i.e., one or more of the above features connect directly or indirectly to the transport path).

[0052] In one aspect, the transport carrier cassette 401 is configured to be inserted into an operator carrier case or box 467 configured to enclose and stably hold (using any suitably configured cassette supports) the transport carrier cassette 401 for one or more of storage and transport of the transport carrier cassette 401. In another aspect, the transport carrier cassette 401 may be configured as a sealable carrier 401SC (see FIG. 12 ) that includes at least one removable door 1201, 1200 that is removed to open the sealable carrier 401SC for placement into the load lock 300, such that the internal transport path 11998 extends into (e.g., in the case of a sealable carrier 401SC having one door) and / or through (e.g., in the case of a sealable carrier 401SC having more than one door) the open sealable carrier 401SC. The sealable carrier 401SC may have a shape and size to substantially fit the interior of the load lock 300 (e.g., substantially similar to that shown in Figure 4 for the transport carrier cassette 401) and may be interchangeably inserted into either the upper substrate holding chamber 305B or the bottom substrate holding chamber 305A.

[0053] The transport carrier cassette 401, operator carrier case 467, and sealable carrier 401SC may have any suitable features that allow for operator and / or automated handling of the transport carrier cassette 401, operator carrier case 467, and sealable carrier 401SC. For example, with reference to Figures 8A-8C and 10A-10C, the exchangeable cassette frame 450 of the transport carrier cassette 401 may include one or more operator handles 850, which may be coupled to or integrated with the exchangeable cassette frame 450 in any suitable manner to facilitate transfer of the transport carrier cassette 401 to and from the load lock 300. The replaceable cassette frame 450 may also include, in place of or in addition to the operator handle 850, one or more automation interfaces 851 configured to provide automated gripping / engagement of the replaceable cassette frame 450 by automated equipment (e.g., robotic arms, aerial transport, etc.) in a positionally repeatable manner to facilitate transfer of the transport carrier cassettes 401 to and from the load lock 300. Similarly, with reference to FIG. 12 , the sealable carrier 401SC may include any suitable operator handle(s) 1250 and / or automation interface(s) 1251 configured to provide operator and / or automated transfer of the sealable carrier 401SC and the transport carrier cassettes 401 therein to and from the load lock 300 or any suitable storage location. Referring to FIG. 4, the operator carrier case 467 may include any suitable operator handle(s) 468 configured to provide for operator transport of the operator carrier case 467 and the transport carrier cassette 401 therein.

[0054] In one embodiment, one or more of the transport carrier cassettes 401 may include any suitable identification feature 890 that identifies the type of transport path interface 455 defined by the respective transport carrier cassette 401. In another embodiment, one or more of the operator carrier case 467 and the sealable carrier 401SC may include any suitable identification feature 891 that identifies the type of transport path interface 455 defined by the respective transport carrier cassette 401 held therein. The identification feature 890 may provide for identification of the transport carrier cassette 401, such as by an automated transport device (e.g., a robot, an aerial transport, etc.). In examples where the transport carrier cassette 401 is enclosed within the operator carrier case 467 and the sealable carrier 401SC, the identification features 890, 891 may provide for identification of the transport carrier cassette 401 without opening the operator carrier case 467 and the sealable carrier 401SC. The identification features 890, 891 may be radio frequency identification tags, bar codes, text, or other suitable human / machine readable indicia or transmitters.

[0055] 4, 8A-8, 10A-10C, and 13, the transport path interface 455 is coupled to the replaceable cassette frame 450 in any suitable manner, such as by mechanical or chemical fasteners, while in other embodiments, the transport path interface 455 may be integrally formed with the replaceable cassette frame 450. Here, the transport path interface 455 is coupled to the exchangeable cassette frame 450 and held by the transport carrier cassette 401 so as to repeatably position the transport path interface 455 relative to the transport surfaces X1, X2 (see Figure 3C) of the internal transport path 11998 (see, for example, Figures 1B, 1C, 1E, and 1F) so as to transport the transport path interface 455 toward and from the process equipment (such as those described herein) and so as to connect the transport path interface 455 to the internal transport path 11998 at a repeatable position when the transport carrier cassette 401 is loaded into the load lock 300 via the openings 666, 667 of the intermediate entrance 11995.

[0056] 4 and 13 , as previously described, the transport path interface 455 is a temporary structure or feature, such as a non-manufacturing workpiece process component 1300. The non-manufacturing workpiece process component 1300 is a process component that is not a manufacturing workpiece and, for convenience, will be referred to herein as a non-manufacturing workpiece process component 1300. The non-manufacturing workpiece process component may process manufacturing workpieces or handle other suitable articles placed in or transferred through the load lock 300. In one embodiment, the non-manufacturing workpiece process component 1300 is a manufacturing support, such as a shelf / shelves 1301 configured to hold manufacturing substrate(s) S (examples of which are illustrated in FIGS. 10A-10C ). In another embodiment, the non-manufacturing workpiece process component 1300 is a temporary support, such as a shelf / shelves 1302 configured to hold any suitable non-manufacturing article, setup / calibration equipment, and / or processing equipment (examples of which are illustrated in FIGS. 8A-8C ). In yet another embodiment, the non-production workpiece process component 1300 is a substrate aligner 1303. As can be seen in FIG. 4 , different non-production workpiece process components 1300, 1301, 1303 may be incorporated into respective transport carrier cassettes 401, 401A-401n, e.g., at least one of transport carrier cassettes 401A may be configured to hold non-production materials. Another of transport carrier cassettes 401B may be configured to hold production semiconductor substrates S. Another of transport carrier cassettes 401C may be configured to hold calibration / setup substrates SC. Yet another of substrate holding modules 401D may be configured with a substrate aligner 1303 for aligning substrates for processing. In other embodiments, transport carrier cassette 401 may have any suitable configuration and / or any suitable processing equipment (e.g., aligner, optical character recognition, barcode reader, camera, etc.) mounted thereon.In one embodiment, there may be a transport carrier cassette 401 for holding substrates having a first size and another transport carrier cassette 401 for holding substrates having a different size, and the transport carrier cassette 401 for holding substrates of a different size may be used within the load lock 300 to change the size of the substrates that may be circulated through the load lock (e.g., from 300 mm substrates to 250 mm substrates, or any other suitable size).

[0057] In one embodiment, non-manufacturing workpiece process component 1300 is interchangeably coupled to an interchangeable cassette frame 450 with other non-manufacturing workpiece process components, where the other non-manufacturing workpiece process components may be held by or otherwise coupled to non-manufacturing workpiece process component 1300. For example, the temporary support shelf / shelf(s) 1302 may be configured to hold one or more other non-manufacturing workpiece process components, including, but not limited to, transport chamber apparatus components 1304 (e.g., slot valve doors, etc.), transport apparatus components 1306 configured to transport manufacturing workpieces on the internal transport path (e.g., end effectors, wrist joints, etc. that are detached / reattached to / from the substrate transport section using passive or active decoupling / coupling mechanisms), non-manufacturing part(s) or workpiece(s) 1305 of the process within the vacuum back end 11020 (e.g., wear rings, ring supports, chucks, multiple shelves, etc.), process chuck covers 1307, and teaching / setup equipment 1308 (e.g., inspection equipment, calibration wafers, measurement devices, etc.).

[0058] 8A-8C, 9A, and 9B, an exemplary transport carrier cassette 401, such as transport carrier cassette 401A, will be described in more detail. Here, the transport path interface 455 comprises one or more temporary support shelves 1302 coupled to an exchangeable cassette frame 450, as described above. The exchangeable cassette frame 450 (and thus each transport carrier cassette 401) includes a deterministic coupling 870 connected to the exchangeable cassette frame 450, which couples the exchangeable cassette frame 450 to the load lock 300 (FIG. 3) and, at least in part, provides a repeatable position of the transport path interface 455 when a given exchangeable transport carrier cassette 401, 401A is loaded into the load lock 300. The deterministic coupling 870 is a kinematic coupling that kinematically couples the interchangeable transport carrier cassette 401, 401A to the load lock 300 substantially coincident with loading. Here, the transport path interface 455 (and corresponding one of the different non-manufacturing workpiece process components) is deterministically set by the kinematic coupling in a predetermined, repeatable position relative to a positioning feature (such as one or more of the substrate transport surfaces X1, X3 (see FIG. 3C) and the cassette seating surface 661 (see FIGS. 6E and 6F) of the load lock 300). Deterministically setting the transport path interface 455 in a predetermined, repeatable position positions the sealable aperture 397 (e.g., sealed by a respective slot valve 307 (see FIGS. 3A-3C)) relative to the internal transport path 11998.

[0059] The deterministic coupling 870 kinematically couples the exchangeable transport carrier cassette 401, 401A to the transport path interface 455 relative to the transport planes X1, X2 (see FIG. 3C) in at least two orthogonal constraint axes (e.g., at least the lateral and yaw directions, and in other embodiments, the longitudinal direction as well (see FIG. 6E)). The deterministic coupling 870 is positioned within the load lock 300 with the exchangeable transport carrier cassette 401, 401A loaded into the load lock 300. The load lock frame section 30 includes a mating portion 870M1 (Figures 6E and 6F - e.g., pin(s) or recess(es)) of the deterministic coupling portion 870, and the exchangeable cassette frame 450 has another mating portion 870M2 (see Figures 8C, 10B, and 12 - e.g., pin(s) or recess(es)) of the deterministic coupling portion 870, which deterministically couples the exchangeable transport carrier cassette 401, 401A to each of the different multiple non-manufacturing workpiece process components carried by the transport carrier cassette 401, 401A substantially in sync with the transport carrier cassette 401, 401A being loaded into the load lock 300. For example, the deterministic coupling 870 includes at least one pin 870P depending from the replaceable cassette frame 450 (see Figures 8A-8C, 10A-10C, and 9A) or the load lock 300 (see Figure 9B) and configured to matingly engage within the load lock 300 with a complementary receptacle 870R (see Figures 6E, 6F, and 9A) of the load lock 300 or the replaceable cassette frame 450 (see Figure 9B). Here, at least one pin 870P includes more than one pin (in the illustrated example, there are three pins, but in other embodiments there may be two pins or more than three pins) in a deterministic pin arrangement on the interchangeable cassette frame 450 or load lock 300 (such as on frame section 30) that is positionally deterministic with respect to the transport path interface 455 held by the transport carrier cassette 401, 401A and results in a repeatable position of the transport path interface 455.At least one pin 870P may be press-fit / friction-fit into the frame section 30 of the replaceable cassette frame 450 or load lock 300, threaded into the frame section 30 of the replaceable cassette frame 450 or load lock 300, or otherwise coupled to the frame section 30 of the replaceable cassette frame 450 or load lock 300 in any suitable manner.

[0060] 8A, 8B, 9A, 9B, 10A, and 10B, the deterministic coupling 870 is disposed within the load lock 300 so as to be sealed from the interior of the load lock 300. In the example described above, each of the at least one pin 870P mated with each of the complementary receptacles 870R is sealed from the interior of the load lock 300. Sealing the at least one pin 870P mated with each of the complementary receptacles 870R from the interior of the load lock 300 substantially prevents particles that may be generated by the deterministic coupling from entering the interior of the load lock 300. Here, any suitable resilient member 888 may be disposed on the replaceable cassette frame 450 (or on the frame section 30 of the load lock 300 in other embodiments) so as to surround the periphery of each one of the pins 870P. The resilient member 888 may be an O-ring or any other member that provides a seal between two surfaces. Here, the elastic member 888 is positioned on the replaceable cassette frame 450 (or, in other embodiments, on the frame section 30 of the load lock 300) to form a seal around the periphery of the interface between the pins 870P and their respective complementary receptacles 870R between the replaceable cassette frame 450 and the cassette seating surface 661 of the frame section 30 of the load lock 300.

[0061] A suitable other resilient member 889 may be disposed on the surface of the replaceable cassette frame 450 opposite the resilient member 888, with the other resilient member 889 positioned so as to be substantially collinear or otherwise substantially concentric with the pin 870P and the resilient member 888. The other resilient member 889 may be an O-ring or any other member that provides a seal between two surfaces. The other resilient member 889 may seal the through-hole in the replaceable cassette frame 450 through which the pin 870P is disposed. The other resilient member 889 is disposed on the replaceable cassette frame 450 (or on the closures 32, 34 in other embodiments) so as to be compressed between the replaceable cassette frame 450 and the closures 32, 34 in the closed position, with compression of the other resilient member 889 at least partially causing compression of the resilient member 888 and sealing of the definitive connection 870 within the load lock. In one embodiment, as described above with respect to FIG. 5E, corresponding movement of the hinged closures 32G, 34G, such as during / during pumping and evacuation (e.g., atmospheric circulation) of the load lock 300, can further compress the elastic members 888, 889.

[0062] Referring again to Figures 4, 8A-8C and 10A-10C, the interchangeable cassette frame 450 has supports 830, 840 connected to the cassette frame 450 (e.g., at least partially forming a portion of the transport path interface 455), and in one or more embodiments, the supports 830, 840 are configured to engage with and stably hold at least one of a plurality of different non-manufacturing workpiece process components (e.g., substrate aligner 1303, transport chamber apparatus component 1304, non-manufacturing part 1305, and transport apparatus component 1306, etc.) held by the transport carrier cassettes 401, 401A, 401B. The different interchangeable transport carrier cassettes 401A-401n have different supports connected to the interchangeable cassette frame 450, and each of the different supports is configured (e.g., shaped and sized) to engage and stably hold a corresponding number of different non-manufacturing workpiece process components (e.g., substrate aligner 1303, transport chamber apparatus components 1304, non-manufacturing parts 1305, and transport apparatus components 1306, etc.) within the load lock 300 for transport by the transport carrier cassette 401A-401n and when the transport carrier cassette 401A-401n is loaded into the load lock 300.

[0063] 8A-8C and 11A-11D, transport carrier cassette 401A is configured with transport path interface 455 having supports 830 configured to support at least non-manufactured parts 1305. Here, the supports have a (first) support surface 831 configured to support non-manufactured parts 1305 when transport carrier cassette 401A is in upper substrate holding chamber 305B, and a (second) support surface 832 configured to support non-manufactured parts 1305 when transport carrier cassette 401A is in lower substrate holding chamber 305A. In this example, non-manufactured parts 1305 have the form of rings positioned on plate 1110, which forms the interface between supports 830 and non-manufactured parts 1305. The plate 1110 may be configured to provide any suitable clearance between the non-manufactured component 1305 and the supports 830, while providing a suitable lift clearance 1111Z between the non-manufactured component 1305 and the sealable aperture 397 (which may be sized for passage of the non-manufactured component) and / or the interior top surface of the substrate-holding chambers 305A, 305B. Any suitable lateral / radial clearance 1111Y may comprise a valve size within the small chamber. The plate 1110 may be shaped and sized to be stably held on the support surface(s) 831, 831 of the supports 830. In one embodiment, the plate 1110 is configured to engage a support surface of the supports 830 configured to hold a production substrate, while in other embodiments, the plate 1110 is configured to engage any suitable portion of the supports 830 configured to stably hold the plate 1110. The plate 1110 may include any suitable retention feature 1115 (such as a ledge, protrusion, or other surface) that engages with a mating surface(s) on the non-manufactured part 1305 so that the non-manufactured part 1305 is positioned on the plate 1110 and stably held in a predetermined position relative to the plate 1110.

[0064] Any suitable substrate transport (such as those described above) of the process apparatus may remove the plate 1110 and the non-manufactured component 1305 thereon from the transport carrier cassette 401A. The substrate transport may load the non-manufactured component 1305 into the process chamber or other suitable location in any suitable manner. In one embodiment, the non-manufactured component 1305 is removed from the plate 1110 once the non-manufactured component 1305 is loaded, and the substrate transport returns the plate 1110 to the transport carrier cassette 401A, which then removes the plate 1110 from the process apparatus.

[0065] In the embodiment shown in Figures 8A-8C and 11A-11D, the supports 830 of the transport carrier cassette 401A may also be configured to stably hold substantially rectangular production substrates RS (Figures 8C and 11A) in a stacked arrangement, regardless of whether the transport carrier cassette 401A is disposed in the upper substrate holding chamber 305B or the lower substrate holding chamber 305A. In Figure 8C, the substantially rectangular production substrates RS depicted in solid lines indicate the substrate holding position when the transport carrier cassette 401A is disposed in the upper substrate holding chamber 305B, while the substantially rectangular production substrates RS depicted in dashed lines indicate the substrate holding position when the transport carrier cassette 401A is disposed in the lower substrate holding chamber 305A. Here, the transport carrier cassette 401A is configured to hold two substantially rectangular production substrates, although in other embodiments, the transport carrier cassette 401A may be configured to hold fewer or more than two rectangular production substrates. As can be appreciated, one of the transport carrier cassettes 401A-4011n can be configured to hold two generally rectangular manufactured substrates, while another of the transport carrier cassettes 401A-401n is configured to hold a different number of generally rectangular manufactured substrates.

[0066] 10A-10C, transport carrier cassette 401B comprises a transport path interface 455 having supports 840 configured to support at least a circular or disc-shaped production substrate S. Transport carrier 401B may otherwise be substantially similar to that described above with respect to transport carrier cassette 401A, where substrates S depicted in solid lines in FIG. 10C are shown in a substrate holding position with transport carrier cassette 401A disposed within upper substrate holding chamber 305B, and substrates S depicted in dashed lines are shown in a substrate holding position with transport carrier cassette 401A disposed within bottom substrate holding chamber 305A.

[0067] As can be appreciated, the supports of the non-manufacturing workpiece process components 1300, formed at least in part by the transport path interface 455, conform to the shape of the article being held by the supports. Thus, for example, the supports for supporting each transport chamber apparatus component 1304 or each transport apparatus component 1306 have a suitable shape and size for supporting such components. A transport carrier cassette, such as transport carrier cassette 401C (FIG. 4), configured to hold at least one transport apparatus component 1306 may be configured to receive an end effector removed from a substrate transport on one support of the transport path interface 455 and provide another end effector on another support of the transport path interface 455 for coupling with the substrate transport, so that the substrate transport can replace the end effector as needed. Similarly, a transport carrier cassette such as transport carrier cassette 401E (FIG. 4) configured to hold at least one transport chamber apparatus component 1304 may be configured to receive on one support of the transport path interface 455 a transport chamber apparatus carried by the substrate transport for replacement, and to provide on another support of the transport path interface 455 a replacement transport chamber apparatus to be carried for installation by the substrate transport, so that the transport chamber apparatus may be replaced according to a preventative maintenance schedule or as needed. In one or more embodiments, the different shelves described herein may be used on a common transport carrier cassette 401 such that different items are carried on / by the common transport carrier cassette 401.

[0068] 4, 8A-8C, and 10A-10C, the illustrated transport carrier cassettes 401, 401A-401n are configured for multi-directional substrate transport access. For example, the transport carrier cassettes 401, 401A-401n are configured to allow substrates or other articles carried by the transport carrier cassettes 401, 401A-401n to pass through (e.g., enter on one side and exit on the other side) the load lock 300 (and the transport carrier cassettes 401, 401A-401n). In other embodiments, the transport carrier cassettes 401, 401A-401n may be configured in any suitable manner such that access is provided to substrates or other articles held by the transport carrier cassettes 401, 401A-401n on the load lock 300 (and transport carrier cassettes 401, 401A-401n), but on a single side of the load lock 300 (and transport carrier cassettes 401, 401A-401n).

[0069] 1A-1F, 4, 13, and 14, an exemplary method according to an embodiment of the present disclosure is described. According to the method, a workpiece load chamber 11000 is provided (FIG. 14, block 1400). A processing section 11020 is also included (FIG. 14, block 1410). A lock chamber 11010 is provided (FIG. 14, block 1420), coupling the load chamber 11000 to the processing section 11020 as described herein. At least one exchangeable transport carrier cassette 401 is inserted into the lock chamber 11010 (FIG. 14, block 1430) to provide selectable configurations of the lock chamber 11010, the selectable configurations being selectable between a plurality of different predetermined configurations, each having a different temporary structure or feature, such as a non-manufacturing workpiece process component 1300 within the lock chamber 11010, via openings 666, 667 of an intermediate entrance 11995. The selectable configuration is effected by the introduction of at least one interchangeable transport carrier cassette 401, housing one of a plurality of different non-manufacturing workpiece process components 1300, into the lock chamber 11010 via the openings 666, 667 of the intermediate entrance 11995. The at least one interchangeable transport carrier cassette 401 is deterministically coupled to the lock chamber 11010 by a deterministic connection as described herein ( FIG. 14 , block 1480).

[0070] One of multiple different temporary structures or features, such as non-production workpiece process components 1300, may be replaced from the lock chamber 11010 by replacing at least one interchangeable transport carrier cassette 401 in the lock chamber 11010 with another of at least one interchangeable transport carrier cassette 401A-401N via the openings 666, 667 of the intermediate entrance 11995 (FIG. 14, block 1440). Replacing at least one interchangeable transport carrier cassette 401 can enable the replacement of non-production workpieces, such as replaceable parts or consumables (located in a process module or another part of the substrate processing system / apparatus), for example, where the transport carrier cassette 401 with a new non-production workpiece therein is positioned in the load lock to facilitate routine maintenance. The substrate transport retrieves the new non-production workpiece from the transport carrier cassette 401 and replaces the used non-production workpiece with the new non-production workpiece in the process module 11030. The substrate transport returns the used non-manufactured workpieces to the transport carrier cassette 401, which is then swapped with another transport carrier cassette 401A-N holding new non-manufactured workpieces to replace the used non-manufactured workpieces in another process module 11030 in a manner similar to that described above. The swapping of transport carrier cassettes 401A-N holding new non-manufactured workpieces continues until all of the used non-manufactured workpieces have been replaced. Once routine maintenance is completed, the transport carrier cassettes 401A-N with their production substrate supports may be placed in the load lock 11010 to continue manufacturing. In some embodiments, also referring to FIG. 15 , “dirty” / used workpieces / substrates may be placed on the bottom shelf 15000 (see chamber 305B) and “clean” / new workpieces / substrates may be placed on the top shelf 15401 (e.g., provided by the transport carrier cassette 401). In other embodiments, separate chambers 305A, 305B may be used for dirty and clean workpieces, respectively.15 , a contamination barrier 15500, such as a plate or screen, may be positioned on the transport carrier cassette 401 between the shelf 15401 and the shelf 15000. The contamination barrier 15500 may extend from wall to wall within the chamber 305B (e.g., an edge of the barrier 15500 is at the immediately adjacent sidewall of the chamber 305B), or the barrier 15500 may be sized to be larger than the workpieces held within the chamber 305B. The barrier 15500 may be positioned spaced apart from and between the support shelves 15401, 15000.

[0071] At least one exchangeable transport carrier cassette 401 may be exchanged between each of the lock chambers 11010 of the process apparatus (FIG. 14, block 1450). At least one exchangeable transport carrier cassette 401 may be exchanged between the lock chamber 11010 of the process apparatus and another sealed or unsealed chamber of the process apparatus (e.g., a process chamber, a transfer chamber, a front end module, etc.) (FIG. 14, block 1460). At least one exchangeable transport carrier cassette 401 may be exchanged between the lock chamber 11010 of the process apparatus (e.g., one of the process apparatuses in FIGS. 1A-1F) and another sealed or unsealed chamber of another process apparatus (e.g., another of the process apparatuses in FIGS. 1A-1F) (FIG. 14, block 1470).

[0072] According to one or more aspects of the present disclosure, a process apparatus includes: a front end having an entrance for loading a manufacturing workpiece into the process equipment from outside the process equipment; a process section including a process environment configured to process the manufacturing workpieces, the process section being offset from the front end by a predetermined distance and coupled to the front end via an internal transport path configured to transport at least the manufacturing workpieces to and from the front end; a load lock between the front end and the process section, the internal transport path extending through the load lock, the load lock having an intermediate entrance with an opening within the distance offsetting the process section from the front end that diverts the internal transport path to the exterior separated from the front end; a predetermined exchangeable transport carrier cassette having an exchangeable cassette frame configured to enter the load lock from the outside through the opening of the intermediate entrance, wherein insertion and removal of the predetermined exchangeable transport carrier cassette through the opening of the intermediate entrance causes a transport path interface to be loaded into and removed from the load lock, the transport path interface connecting to the internal transport path within the load lock, and the internal transport path is connected to a predetermined exchangeable transport carrier cassette that matches the predetermined exchangeable transport carrier cassette loaded into the load lock; Equipped with.

[0073] According to one or more aspects of the present disclosure, the transport path interface comprises: transporting the transport path interface to and from the process device; and repeatably positioning the transport path interface relative to a transport surface of the internal transport path so as to connect the internal transport path with the transport path interface at a repeatable position upon entry into the load lock through the opening of the intermediate entrance; A non-production workpiece handling component coupled to the interchangeable cassette frame and held by the given interchangeable transport carrier cassette.

[0074] According to one or more aspects of the present disclosure, the non-production workpiece process components are coupled to the interchangeable cassette frame so as to be interchangeable with other non-production workpiece process components.

[0075] According to one or more aspects of the present disclosure, the non-manufacturing workpiece process component is replaced from the load lock by replacing the given interchangeable transport carrier cassette in the load lock with another interchangeable transport carrier cassette through the opening in the intermediate entrance.

[0076] According to one or more aspects of the present disclosure, the non-manufacturing workpiece process component is a consumable of a process in the process section.

[0077] According to one or more aspects of the present disclosure, the non-production workpiece process component is a temporary shelf of the load lock.

[0078] According to one or more aspects of the present disclosure, the non-manufactured workpiece process component is a component of a transport apparatus configured to transport the manufactured workpiece on the internal transport path.

[0079] According to one or more aspects of the present disclosure, the process apparatus further includes a deterministic coupling connected to the exchangeable cassette frame, the deterministic coupling coupling the exchangeable cassette frame to the load lock when the given exchangeable transport carrier cassette is loaded into the load lock, and at least partially providing a repeatable position of the transport path interface.

[0080] According to one or more aspects of the present disclosure, the deterministic coupling kinematically couples the given interchangeable transport carrier cassette and the transport path interface relative to the transport surface in at least two orthogonal constraint axes, and the given interchangeable transport carrier cassette is positioned within the load lock when loaded into the load lock.

[0081] According to one or more aspects of the present disclosure, the deterministic connection is sealed from the interior of the load lock.

[0082] According to one or more aspects of the present disclosure, the deterministic coupling has at least one pin depending from the replaceable cassette frame or the load lock and configured to matingly engage a complementary receptacle on the load lock or the replaceable cassette frame within the load lock, and each of the at least one pin mated to each of the complementary receptacles is sealed from the interior of the load lock.

[0083] According to one or more aspects of the present disclosure, the at least one pin includes more than one pin in a deterministic pin arrangement on the interchangeable cassette frame or the load lock, the deterministic pin arrangement being positionally deterministic with respect to the transport path interface held by the given interchangeable transport carrier cassette, resulting in a repeatable position of the transport path interface.

[0084] According to one or more aspects of the present disclosure, the predetermined replaceable transport carrier cassette comprises: The load locks of the process apparatus are interchangeable with each other; being interchangeable between the load lock of the process apparatus and another sealed or unsealed chamber of the process apparatus; and The load lock of the process apparatus is interchangeable with another sealed or unsealed chamber of another process apparatus; One or more of the following:

[0085] According to one or more aspects of the present disclosure, a process apparatus includes: a workpiece load chamber having an entrance for loading a manufacturing workpiece into the process apparatus from outside the process apparatus; a process section including a process environment configured to process the manufacturing workpieces, the process section being offset a predetermined distance from the workpiece load chamber and coupled to the workpiece load chamber via an internal transport path configured to transport at least the manufacturing workpieces to and from the loading entrance; a lock chamber between the entry port and the process section, the lock chamber having a sealable aperture communicating with a sealed interior of the process section, the internal transport path extending into the process section through the sealable aperture of the lock chamber, the lock chamber having an intermediate entrance within the offset distance of the process section from the workpiece load chamber, the intermediate entrance having an opening diverting the internal transport path to the exterior separating the workpiece load chamber; Equipped with The lock chamber has a selectable configuration that is selectable between a plurality of different predetermined configurations having a different plurality of non-manufactured workpiece process components within the lock chamber through the opening of the intermediate entrance, and the selectable configuration is achieved by loading at least one interchangeable transport carrier cassette carrying one of the different plurality of non-manufactured workpiece process components into the lock chamber through the opening of the intermediate entrance.

[0086] According to one or more aspects of the present disclosure, the lock chamber has a kinematic coupling that kinematically couples substantially in sync with the loading of the at least one interchangeable transport carrier cassette into the lock chamber, and the one of the different non-manufacturing workpiece process components is deterministically set in a predetermined repeatable position by the kinematic coupling relative to a positioning feature that positions the sealable aperture relative to the internal transport path.

[0087] According to one or more aspects of the present disclosure, the at least one interchangeable transport carrier cassette has an interchangeable cassette frame, the interchangeable cassette frame including a fitting portion of the kinematic coupling that deterministically couples the interchangeable transport carrier cassette and one of the different non-manufacturing workpiece process components held by the interchangeable transport carrier cassette substantially in sync with the entry of the at least one interchangeable transport carrier cassette into the lock chamber.

[0088] According to one or more aspects of the present disclosure, the exchangeable cassette frame has a plurality of supports connected to the exchangeable cassette frame, the supports configured to engage with and stably hold one of the different plurality of non-manufactured workpiece process components carried by the exchangeable transport carrier cassette, and the different plurality of exchangeable transport carrier cassettes have a plurality of different supports connected to the exchangeable cassette frame, each of the different plurality of supports configured to engage with and stably hold a corresponding different plurality of non-manufactured workpiece process component for transport by the exchangeable transport carrier cassette within the lock chamber when the exchangeable transport carrier cassette is loaded into the lock chamber.

[0089] According to one or more aspects of the present disclosure, the one of the different plurality of non-manufacturing workpiece process components comprises: to transport one of the different plurality of non-manufacturing workpiece process components to and from the process equipment; and repeatably positioning the one of the different non-production workpiece process components relative to a transport surface of the internal transport path so as to connect the internal transport path with the one of the different non-production workpiece process components at a repeatable position upon loading of the lock chamber through the opening of the intermediate entrance; A carrier is coupled to the interchangeable cassette frame and is carried by the at least one interchangeable transport carrier cassette.

[0090] According to one or more aspects of the present disclosure, the one of the different non-manufacturing workpiece process components is interchangeably coupled to the interchangeable cassette frame with the other non-manufacturing workpiece process components.

[0091] According to one or more aspects of the present disclosure, each of the different non-manufacturing workpiece process components is interchangeably held by an interchangeable transport carrier cassette and is configured to be deterministically positioned within the lock chamber by the interchangeable transport carrier cassette brought in through the opening of the intermediate entrance.

[0092] According to one or more aspects of the present disclosure, one of the different non-manufacturing workpiece process components is replaced from the lock chamber by replacing the at least one interchangeable transport carrier cassette in the lock chamber with another of the at least one interchangeable transport carrier cassette through the opening in the intermediate entrance.

[0093] According to one or more aspects of the present disclosure, the one of the different non-manufacturing workpiece process components is a replaceable part or consumable of a process in the process section.

[0094] According to one or more aspects of the present disclosure, the one of the different non-manufacturing workpiece process components is a temporary shelf in the lock chamber.

[0095] According to one or more aspects of the present disclosure, the one of the different non-manufacturing workpiece process components is a component of a transport apparatus configured to transport the manufacturing workpiece on the internal transport path.

[0096] According to one or more aspects of the present disclosure, the process apparatus further includes a deterministic coupling connected to an exchangeable cassette frame of the at least one exchangeable transport carrier cassette, the deterministic coupling coupling the exchangeable cassette frame to the lock chamber when the at least one exchangeable transport carrier cassette is loaded into the lock chamber, and at least partially providing the one predetermined repeatable position of the different plurality of non-manufacturing workpiece process components.

[0097] According to one or more aspects of the present disclosure, the deterministic connection kinematically couples the at least one interchangeable transport carrier cassette and a non-manufactured workpiece process component to a transport surface of the internal transport path in at least two orthogonal constraint axes, and is positioned within the lock chamber when the at least one interchangeable transport carrier cassette is loaded into the lock chamber.

[0098] According to one or more aspects of the present disclosure, the positive connection is sealed from the interior of the lock chamber.

[0099] According to one or more aspects of the present disclosure, the deterministic coupling has at least one pin depending from the replaceable cassette frame or the lock chamber and configured to matingly engage a complementary receptacle on the lock chamber or the replaceable cassette frame within the lock chamber, and each of the at least one pin mated to each of the complementary receptacles is sealed from the interior of the lock chamber.

[0100] According to one or more aspects of the present disclosure, the at least one pin includes more than one pin in a deterministic pin arrangement on the exchangeable cassette frame or the lock chamber, the deterministic pin arrangement being positionally deterministic with respect to the one of the different non-manufacturing workpiece process components held by the at least one exchangeable transport carrier cassette, resulting in a predetermined, repeatable position of the one of the different non-manufacturing workpiece process components.

[0101] According to one or more aspects of the present disclosure, the at least one replaceable transport carrier cassette comprises: The lock chambers of the process apparatus are interchangeable with each other; being interchangeable between the lock chamber of the process device and another sealed or unsealed chamber of the process device; and The lock chamber of the process device can be interchanged with another sealed or unsealed chamber of another process device. One or more of:

[0102] According to one or more aspects of the present disclosure, the lock chamber comprises one of a metrology chamber, a load lock chamber, an inspection station, an aligner station, a buffer station, and a transfer chamber.

[0103] According to one or more aspects of the present disclosure, a method includes: providing a workpiece load chamber having an entrance for loading a manufacturing workpiece into the process tool from outside the process tool; providing a process section having a process environment configured to process the manufacturing workpieces, the process section being offset a predetermined distance from the workpiece load chamber and coupled to the workpiece load chamber via an internal transport path configured to transport at least the manufacturing workpieces to and from the loading entrance; providing a lock chamber between the loading port and the process section, the lock chamber having a sealable aperture communicating with a sealed interior of the process section, the internal transport path extending into the process section through the sealable aperture of the lock chamber, the lock chamber having an intermediate entrance within the offset distance of the process section from the workpiece load chamber, the intermediate entrance having an opening for diverting the internal transport path to the exterior separating the workpiece load chamber; inserting at least one exchangeable transport carrier cassette into the lock chamber to provide a selectable configuration of the lock chamber, the selectable configuration being selectable through the opening of the intermediate entrance between a plurality of different predetermined configurations each having a different plurality of non-production workpiece process components within the lock chamber, the selectable configuration being provided by loading the at least one exchangeable transport carrier cassette carrying one of the different plurality of non-production workpiece process components into the lock chamber through the opening of the intermediate entrance; Includes.

[0104] According to one or more aspects of the present disclosure, the lock chamber has a kinematic coupling that kinematically couples substantially in sync with the loading of the at least one interchangeable transport carrier cassette into the lock chamber, and the one of the different non-manufacturing workpiece process components is deterministically set in a predetermined repeatable position by the kinematic coupling relative to a positioning feature that positions the sealable aperture relative to the internal transport path.

[0105] According to one or more aspects of the present disclosure, the at least one interchangeable transport carrier cassette has an interchangeable cassette frame, the interchangeable cassette frame having a fitting portion of the kinematic coupling that deterministically couples the interchangeable transport carrier cassette and the one of the different non-manufacturing workpiece process components held by the interchangeable transport carrier cassette substantially in sync with the entry of the at least one interchangeable transport carrier cassette into the lock chamber.

[0106] According to one or more aspects of the present disclosure, the exchangeable cassette frame has a plurality of supports connected to the exchangeable cassette frame, the supports configured to engage with and stably hold one of the different plurality of non-manufactured workpiece process components carried by the exchangeable transport carrier cassette, and the different plurality of exchangeable transport carrier cassettes have a plurality of different supports connected to the exchangeable cassette frame, each of the different plurality of supports configured to engage with and stably hold a corresponding different plurality of non-manufactured workpiece process component for transport by the exchangeable transport carrier cassette within the lock chamber when the exchangeable transport carrier cassette is loaded into the lock chamber.

[0107] According to one or more aspects of the present disclosure, the one of the different plurality of non-manufacturing workpiece process components comprises: to transport one of the different plurality of non-manufacturing workpiece process components to and from the process equipment; and repeatably positioning the one of the different non-production workpiece process components relative to a transport surface of the internal transport path so as to connect the internal transport path with the one of the different non-production workpiece process components at a repeatable position upon entry of the lock chamber through the intermediate entrance opening; A carrier is coupled to the interchangeable cassette frame and is carried by the at least one interchangeable transport carrier cassette.

[0108] According to one or more aspects of the present disclosure, the one of the different non-manufacturing workpiece process components is interchangeably coupled to the interchangeable cassette frame with the other non-manufacturing workpiece process components.

[0109] According to one or more aspects of the present disclosure, each of the different non-manufacturing workpiece process components is interchangeably held by the interchangeable transport carrier cassette and is configured to be deterministically positioned within the lock chamber by the interchangeable transport carrier cassette brought in through the opening of the intermediate entrance.

[0110] According to one or more aspects of the present disclosure, the method further includes replacing the one of the different non-manufactured workpiece process components from the lock chamber by replacing the at least one interchangeable transport carrier cassette in the lock chamber with another of the at least one interchangeable transport carrier cassette through the opening of the intermediate entrance.

[0111] According to one or more aspects of the present disclosure, the one of the different non-manufacturing workpiece process components is a replaceable part or consumable of a process in the process section.

[0112] According to one or more aspects of the present disclosure, the one of the different non-manufacturing workpiece process components is a temporary shelf in the lock chamber.

[0113] According to one or more aspects of the present disclosure, the one of the different non-manufacturing workpiece process components is a component of a transport apparatus configured to transport the manufacturing workpiece on the internal transport path.

[0114] According to one or more aspects of the present disclosure, the method further includes a step of deterministically coupling the at least one exchangeable transport carrier cassette to the lock chamber by a deterministic coupling connected to an exchangeable cassette frame of the at least one exchangeable transport carrier cassette, the deterministic coupling connecting the exchangeable cassette frame to the lock chamber when the at least one exchangeable transport carrier cassette is loaded into the lock chamber, and at least partially providing the one predetermined repeatable position of the plurality of different non-manufacturing workpiece process components.

[0115] According to one or more aspects of the present disclosure, the deterministic connection kinematically couples the at least one interchangeable transport carrier cassette and a non-manufactured workpiece process component to a transport surface of the internal transport path in at least two orthogonal constraint axes, and is positioned within the lock chamber when the at least one interchangeable transport carrier cassette is loaded into the lock chamber.

[0116] According to one or more aspects of the present disclosure, the positive connection is sealed from the interior of the lock chamber.

[0117] According to one or more aspects of the present disclosure, the deterministic coupling has at least one pin depending from the replaceable cassette frame or the lock chamber and configured to matingly engage a complementary receptacle on the lock chamber or the replaceable cassette frame within the lock chamber, and each of the at least one pin mated to each of the complementary receptacles is sealed from the interior of the lock chamber.

[0118] According to one or more aspects of the present disclosure, the at least one pin includes more than one pin in a deterministic pin arrangement on the exchangeable cassette frame or the lock chamber, the deterministic pin arrangement being positionally deterministic with respect to the one of the different non-manufacturing workpiece process components held by the at least one exchangeable transport carrier cassette, resulting in a predetermined, repeatable position of the one of the different non-manufacturing workpiece process components.

[0119] According to one or more aspects of the present disclosure, the method further includes exchanging the at least one exchangeable transport carrier cassette between each of the lock chambers of the process apparatus.

[0120] According to one or more aspects of the present disclosure, the method further includes exchanging the at least one exchangeable transport carrier cassette between the lock chamber of the process apparatus and another sealed or unsealed chamber of the process apparatus.

[0121] According to one or more aspects of the present disclosure, the method further includes exchanging the at least one exchangeable transport carrier cassette between the lock chamber of the process apparatus and another sealed or unsealed chamber of another process apparatus.

[0122] According to one or more aspects of the present disclosure, the lock chamber comprises one of a metrology chamber, a load lock chamber, an inspection station, an aligner station, a buffer station, and a transfer chamber.

[0123] According to one or more aspects of the present disclosure, a process apparatus includes: a front end having an entrance for loading a manufacturing workpiece into the process equipment from outside the process equipment; a process section including a process environment configured to process the manufacturing workpieces, the process section being offset from the front end by a predetermined distance and coupled to the front end via an internal transport path configured to transport at least the manufacturing workpieces to and from the front end; a load lock between the front end and the process section, the internal transport path extending through the load lock, the load lock having an intermediate entrance with an opening within the distance offsetting the process section from the front end that diverts the internal transport path to the exterior separated from the front end; a removable transport carrier cassette having a cassette frame configured for placement into the load lock from the exterior through the opening of the intermediate entrance, wherein the placement of the removable transport carrier cassette through the opening of the intermediate entrance positions a transport path interface of the removable transport carrier cassette in line with the internal transport path; Equipped with.

[0124] According to one or more aspects of the present disclosure, a process apparatus includes: a loadlock having an internal workpiece transfer path extending through the loadlock between a first valve for connection to a first atmosphere external to the loadlock at a first pressure and a second valve for connection to a second atmosphere external to the loadlock at a second, lower pressure, the loadlock having a closable inlet intermediate the first and second valves with an opening to the ambient atmosphere external to the loadlock; a removable transport carrier cassette having a cassette frame configured for placement into the load lock from the exterior through the closable entrance opening, the placement of the removable transport carrier cassette through the closable entrance opening positions a transport path interface of the removable transport carrier cassette in line with the internal workpiece transport path; Equipped with.

[0125] According to one or more aspects of the present disclosure, the replaceable transport carrier cassette comprises: a frame having a transport path interface; a handle coupled to the frame; Insertion and removal of interchangeable transport carrier cassettes, selectable from several different interchangeable transport carrier cassettes, each of which can be selected for insertion into the lock chamber from outside the lock chamber through the opening of the intermediate entrance of the lock chamber, is carried in and out of the lock chamber by the transport path interface that connects within the lock chamber to an internal transport path that proceeds into the lock chamber in accordance with the interchangeable transport carrier cassette that has been brought into the housing.

[0126] According to one or more aspects of the present disclosure, the handle includes an automation interface.

[0127] According to one or more aspects of the present disclosure, the frame includes a deterministic connection that connects the replaceable cassette frame and the lock chamber with the replaceable transport carrier cassette loaded into the lock chamber and at least partially provides a repeatable position of the transport path interface.

[0128] According to one or more aspects of the present disclosure, the deterministic connection comprises one of a plurality of pins and a plurality of apertures disposed on a frame of the replaceable transport carrier cassette configured to engage with complementary pins or apertures disposed on the housing.

[0129] According to one or more aspects of the present disclosure, the replaceable transport carrier cassette further includes at least one seal coupled to the frame that surrounds a periphery of each of the plurality of pins and the plurality of apertures.

[0130] According to one or more aspects of the present disclosure, the frame includes a support configured to stably hold at least one non-manufactured workpiece.

[0131] According to one or more aspects of the present disclosure, the frame comprises a support configured to stably hold at least one workpiece process component.

[0132] According to one or more aspects of the present disclosure, the frame forms a sealable enclosure having at least one sealable opening.

[0133] According to one or more aspects of the present disclosure, the sealable enclosure has a shape and size to be inserted into and coupled to the lock chamber, and the lock chamber is separate from the interchangeable transport carrier cassette and contains a separate substrate support.

[0134] According to one or more aspects of the present disclosure, the frame has a shape and size to be inserted into and coupled to the lock chamber, and the lock chamber is separate from the interchangeable transport carrier cassette and contains a separate substrate support.

[0135] It should be understood that the foregoing description is merely illustrative of aspects of the present disclosure. Various substitutions and modifications may be devised by those skilled in the art without departing from the scope of the present disclosure. Accordingly, aspects of the present disclosure are intended to embrace all such substitutions, modifications, and variations that fall within the scope of any claims appended hereto. Furthermore, the mere fact that different features are recited in mutually different dependent or independent claims does not indicate that a combination of these features cannot be advantageously used, and such combinations are within the scope of the aspects of the present disclosure.

Claims

1. A process device comprising: a front end having an entrance for loading a manufacturing workpiece into the process equipment from outside the process equipment; a process section including a process environment configured to process the manufacturing workpieces, the process section being offset from the front end by a predetermined distance and coupled to the front end via an internal transport path configured to transport at least the manufacturing workpieces to and from the front end; a load lock between the front end and the process section, the internal transport path extending through the load lock, the load lock having an intermediate entrance with an opening that redirects the internal transport path to the exterior separated from the front end within the distance offsetting the process section from the front end; a predetermined exchangeable carrier cassette selectable from a plurality of predetermined exchangeable carrier cassettes and exchangeable with a plurality of the predetermined exchangeable carrier cassettes, the predetermined exchangeable carrier cassette having an exchangeable cassette case frame, configured to enter the load lock from the outside through the opening of the intermediate entrance, wherein insertion and removal of the predetermined exchangeable carrier cassette through the opening of the intermediate entrance loads and removes the predetermined exchangeable carrier cassette into and from the load lock a transport path interface that exchangeably changes the geometry of a shelf of the load lock, and the load lock is configured to receive a predetermined exchangeable carrier cassette that matches the predetermined exchangeable carrier cassette loaded into the load lock; A process device comprising:

2. The transport path interface is transporting the transport path interface to and from the process device; and repeatably positioning the transport path interface relative to a transport surface of the internal transport path so as to connect the internal transport path with the transport path interface at a repeatable position upon entry into the load lock through the opening of the intermediate entrance; 10. The process apparatus of claim 1, wherein a non-manufactured workpiece process component is coupled to said interchangeable cassette frame and carried by said given interchangeable transport carrier cassette.

3. 3. The process apparatus of claim 2, wherein the non-production workpiece process components are coupled to the interchangeable cassette frame so as to be interchangeable with other non-production workpiece process components.

4. 3. The process apparatus of claim 2, wherein the non-manufacturing workpiece process component is replaced from the load lock by replacing the given interchangeable transport carrier cassette in the load lock with another interchangeable transport carrier cassette through the opening in the intermediate entrance.

5. The process apparatus of claim 2 , wherein the non-manufacturing workpiece process component is a consumable for a process in the process section.

6. The process apparatus of claim 2 , wherein the non-production workpiece process component is a temporary shelf in the load lock.

7. The process apparatus of claim 2 , wherein the non-manufacturing workpiece process component is a component of a transport apparatus configured to transport the manufacturing workpiece on the internal transport path.

8. 3. The process apparatus of claim 2, further comprising a deterministic coupling connected to the exchangeable cassette frame, the deterministic coupling coupling the exchangeable cassette frame to the load lock when the given exchangeable transport carrier cassette is loaded into the load lock, and at least partially providing a repeatable position of the transport path interface.

9. 9. The process apparatus of claim 8, wherein the deterministic coupling kinematically couples the predetermined exchangeable transport carrier cassette and the transport path interface relative to the transport surface in at least two orthogonal constraint axes, and the predetermined exchangeable transport carrier cassette is positioned within the load lock when loaded into the load lock.

10. 9. The process apparatus of claim 8, wherein the deterministic connection is sealed from the interior of the load lock.

11. 9. The process apparatus of claim 8, wherein the deterministic connection has at least one pin depending from the replaceable cassette frame or the load lock and configured to matingly engage a complementary receptacle on the load lock or the replaceable cassette frame within the load lock, and wherein each of the at least one pin mated to each of the complementary receptacles is sealed from the interior of the load lock.

12. 12. The process apparatus of claim 11, wherein the at least one pin comprises more than one pin in a deterministic pin arrangement on the interchangeable cassette frame or the load lock, the deterministic pin arrangement being positionally deterministic with respect to the transport path interface carried by the given interchangeable transport carrier cassette, resulting in a repeatable position of the transport path interface.

13. The predetermined replaceable transport carrier cassette is The load locks of the process apparatus are interchangeable with each other; being interchangeable between the load lock of the process apparatus and another sealed or unsealed chamber of the process apparatus; and The load lock of the process apparatus is interchangeable with another sealed or unsealed chamber of another process apparatus; 10. The process device of claim 1, wherein the process device is one or more of:

14. A process device comprising: a workpiece load chamber having an entrance for loading a manufacturing workpiece into the process apparatus from outside the process apparatus; a process section including a process environment configured to process the manufacturing workpieces, the process section being offset a predetermined distance from the workpiece load chamber and coupled to the workpiece load chamber via an internal transport path configured to transport at least the manufacturing workpieces to and from the loading entrance; a lock chamber between the loading entrance and the process section, the lock chamber having a sealable aperture communicating with a sealed interior of the process section, the internal transport path extending into the process section through the sealable aperture of the lock chamber, the lock chamber having an intermediate entrance with an opening that redirects the internal transport path to the exterior separating the workpiece load chamber within the distance that offsets the process section from the workpiece load chamber; Equipped with a lock chamber having a selectable configuration selectable through the opening of the intermediate entrance between a plurality of different predetermined configurations each having a different plurality of non-manufactured workpiece process components within the lock chamber, the selectable configuration being effected by loading at least one exchangeable transport carrier cassette carrying one of the different plurality of non-manufactured workpiece process components into the lock chamber through the opening of the intermediate entrance along the redirected internal transport path, the at least one exchangeable transport carrier cassette exchangeably changing the geometry of a shelf in the lock chamber and being selectable from a plurality of predetermined exchangeable transport carrier cassettes and being interchangeable with the plurality of predetermined exchangeable transport carrier cassettes.

15. 15. The process apparatus of claim 14, wherein the lock chamber has a kinematic coupling that kinematically couples substantially in concert with the loading of the at least one interchangeable transport carrier cassette into the lock chamber, and the one of the different non-manufactured workpiece process components is deterministically set in a predetermined repeatable position by the kinematic coupling relative to a positioning feature that positions the sealable aperture relative to the internal transport path.

16. 16. The process apparatus of claim 15, wherein the at least one interchangeable transport carrier cassette has an interchangeable cassette case frame, the interchangeable cassette case frame providing interchangeability for the at least one interchangeable transport carrier cassette, and the interchangeable cassette case frame includes a fitting portion of the kinematic coupling that deterministically couples the interchangeable transport carrier cassette and one of the different non-manufacturing workpiece process components held by the interchangeable transport carrier cassette substantially in sync with entry of the at least one interchangeable transport carrier cassette into the lock chamber.

17. 17. The process apparatus of claim 16, wherein the exchangeable cassette frame has a plurality of supports connected to the exchangeable cassette frame, the supports configured to engage and stably hold the one of the different plurality of non-manufacturing workpiece process components carried by the exchangeable transport carrier cassette, and the different plurality of exchangeable transport carrier cassettes have a plurality of different supports connected to the exchangeable cassette frame, each of the different plurality of supports configured to engage and stably hold a corresponding different plurality of non-manufacturing workpiece process components for transport by the exchangeable transport carrier cassette through the lock chamber when the exchangeable transport carrier cassette is loaded into the lock chamber.

18. The one of the different plurality of non-manufacturing workpiece process components comprises: to transport one of the different plurality of non-manufacturing workpiece process components to and from the process equipment; and repeatably positioning the one of the different non-manufactured workpiece process components relative to a transport surface of the internal transport path so as to connect the internal transport path with the one of the different non-manufactured workpiece process components at a repeatable position upon loading of the lock chamber through the opening of the intermediate entrance; 17. The process apparatus of claim 16, coupled to the exchangeable cassette frame and carried by the at least one exchangeable transport carrier cassette.

19. 17. The process apparatus of claim 16, wherein the one of the different non-production workpiece process components is coupled to the interchangeable cassette frame interchangeably with other non-production workpiece process components.

20. 15. The process apparatus of claim 14, wherein each of the different non-manufacturing workpiece process components is replaceably held by an exchangeable transport carrier cassette and is configured to be deterministically positioned within the lock chamber by the exchangeable transport carrier cassette brought in through the opening of the intermediate entrance.

21. 15. The process apparatus of claim 14, wherein the one of the different non-manufactured workpiece process components is replaced from the lock chamber by replacing the at least one interchangeable transport carrier cassette in the lock chamber with another of the at least one interchangeable transport carrier cassette through the opening in the intermediate entrance.

22. 15. The process apparatus of claim 14, wherein the one of the different non-manufacturing workpiece process components is a consumable for a process in the process section.

23. 15. The process apparatus of claim 14, wherein said one of said different plurality of non-production workpiece process components is a temporary shelf in said lock chamber.

24. 15. The process apparatus of claim 14, wherein the one of the different non-manufacturing workpiece process components is a component of a transport apparatus configured to transport the manufacturing workpiece on the internal transport path.

25. 15. The process apparatus of claim 14, further comprising a deterministic coupling connected to an exchangeable cassette case frame of the at least one exchangeable transport carrier cassette, the exchangeable cassette case frame providing exchangeability for the at least one exchangeable transport carrier cassette, the deterministic coupling connecting the exchangeable cassette frame to the lock chamber when the at least one exchangeable transport carrier cassette is loaded into the lock chamber, and at least partially providing a predetermined repeatable position of one of the plurality of different non-manufacturing workpiece process components.

26. 26. The process apparatus of claim 25, wherein the deterministic connection kinematically couples the at least one interchangeable transport carrier cassette and a non-manufactured workpiece process component relative to a transport surface of the internal transport path in at least two orthogonal constraint axes, and the at least one interchangeable transport carrier cassette is positioned within the lock chamber when loaded into the lock chamber.

27. 26. The process apparatus of claim 25, wherein the positive connection is sealed from the interior of the lock chamber.

28. 26. The process apparatus of claim 25, wherein the deterministic connection has at least one pin depending from the replaceable cassette frame or the lock chamber and configured to matingly engage a complementary receptacle on the lock chamber or the replaceable cassette frame within the lock chamber, wherein each of the at least one pin mated with each of the complementary receptacles is sealed from the interior of the lock chamber.

29. 29. The process apparatus of claim 28, wherein the at least one pin comprises more than one pin in a deterministic pin arrangement on the exchangeable cassette frame or the lock chamber, the deterministic pin arrangement being positionally deterministic with respect to the one of the plurality of different non-manufacturing workpiece process components carried by the at least one exchangeable transport carrier cassette, resulting in a predetermined, repeatable position of the one of the plurality of different non-manufacturing workpiece process components.

30. The at least one replaceable transport carrier cassette comprises: The lock chambers of the process apparatus are interchangeable with each other; being interchangeable between the lock chamber of the process device and another sealed or unsealed chamber of the process device; and The lock chamber of the process device can be interchanged with another sealed or unsealed chamber of another process device.

15. The process device of claim 14, wherein the process device is one or more of:

31. 15. The process apparatus of claim 14, wherein the lock chamber comprises one of a metrology chamber, a load lock chamber, an inspection station, an aligner station, a buffer station, and a transfer chamber.

32. providing a workpiece load chamber having an entrance for loading a manufacturing workpiece into the process tool from outside the process tool; providing a process section having a process environment configured to process the manufacturing workpieces, the process section being offset a predetermined distance from the workpiece load chamber and coupled to the workpiece load chamber via an internal transport path configured to transport at least the manufacturing workpieces to and from the loading entrance; providing a lock chamber between the loading entrance and the process section, the lock chamber having a sealable aperture communicating with a sealed interior of the process section, the internal transport path extending into the process section through the sealable aperture of the lock chamber, the lock chamber having an intermediate entrance with an opening that redirects the internal transport path to the exterior separated from the workpiece load chamber within the distance offsetting the process section from the workpiece load chamber; inserting at least one exchangeable transport carrier cassette into the lock chamber to provide a selectable configuration of the lock chamber, the at least one exchangeable transport carrier cassette exchangeably changing a shelf geometry of the lock chamber and being selectable from and interchangeable with a plurality of predetermined exchangeable transport carrier cassettes, the selectable configuration being selectable through the opening of the intermediate entrance between a plurality of different predetermined configurations each having a different plurality of non-production workpiece process components within the lock chamber, the selectable configuration being provided by transporting the at least one exchangeable transport carrier cassette carrying one of the different plurality of non-production workpiece process components through the opening of the intermediate entrance along the redirected internal transport path into the lock chamber; A method comprising:

33. 33. The method of claim 32, wherein the lock chamber has a kinematic coupling that kinematically couples substantially in sync with the loading of the at least one interchangeable transport carrier cassette into the lock chamber, and the one of the different non-manufactured workpiece process components is deterministically set in a predetermined repeatable position by the kinematic coupling relative to a positioning feature that positions the sealable aperture relative to the internal transport path.

34. 34. The method of claim 33, wherein the at least one interchangeable transport carrier cassette has an interchangeable cassette case frame, the interchangeable cassette case frame including a fitting portion of the kinematic coupling that deterministically couples the interchangeable transport carrier cassette and the one of the different non-manufacturing workpiece process components carried by the interchangeable transport carrier cassette substantially coincident with entry of the at least one interchangeable transport carrier cassette into the lock chamber, the interchangeable cassette case frame providing interchangeability of the at least one interchangeable transport carrier cassette.

35. 35. The method of claim 34, wherein the exchangeable cassette frame has a plurality of supports connected to the exchangeable cassette frame, the supports configured to engage and stably hold the one of the different plurality of non-manufacturing workpiece process components carried by the exchangeable transport carrier cassette, and the different plurality of exchangeable transport carrier cassettes have a different plurality of supports connected to the exchangeable cassette frame, each of the different plurality of supports configured to engage and stably hold a corresponding different plurality of non-manufacturing workpiece process component for transport by the exchangeable transport carrier cassette through the lock chamber when the exchangeable transport carrier cassette is loaded into the lock chamber.

36. The one of the different plurality of non-manufacturing workpiece process components comprises: to transport one of the different plurality of non-manufacturing workpiece process components to and from the process equipment; and repeatably positioning the one of the different non-production workpiece process components relative to a transport surface of the internal transport path so as to connect the internal transport path with the one of the different non-production workpiece process components at a repeatable position upon loading of the lock chamber through the intermediate entrance opening; 35. The method of claim 34, wherein the interchangeable cassette frame is coupled to and carried by the at least one interchangeable transport carrier cassette.

37. 35. The method of claim 34, wherein the one of the different non-production workpiece process components is coupled to the interchangeable cassette frame interchangeably with other non-production workpiece process components.

38. 33. The method of claim 32, wherein each of the different non-manufacturing workpiece process components is replaceably held by the replaceable transport carrier cassette and is configured to be deterministically positioned within the lock chamber by the replaceable transport carrier cassette brought in through the opening of the intermediate entrance.

39. 33. The method of claim 32, further comprising replacing the one of the different plurality of non-manufacturing workpiece process components from the lock chamber by replacing the at least one interchangeable transport carrier cassette in the lock chamber with another of the at least one interchangeable transport carrier cassette through the opening in the intermediate entrance.

40. 33. The method of claim 32, wherein the one of the different non-manufacturing workpiece process components is a consumable for a process in the process section.

41. 33. The method of claim 32, wherein the one of the different non-manufacturing workpiece process components is a temporary shelf in the lock chamber.

42. 33. The method of claim 32, wherein the one of the different non-manufacturing workpiece process components is a component of a transport apparatus configured to transport the manufacturing workpiece on the internal transport path.

43. 33. The method of claim 32, further comprising deterministically coupling the at least one exchangeable transport carrier cassette to the lock chamber by a deterministic coupling connected to an exchangeable cassette frame of the at least one exchangeable transport carrier cassette, the at least one exchangeable transport carrier cassette providing exchangeability of the at least one exchangeable transport carrier cassette, the deterministic coupling connecting the exchangeable cassette frame to the lock chamber when the at least one exchangeable transport carrier cassette is loaded into the lock chamber, and at least partially providing a predetermined repeatable position of one of the plurality of different non-manufacturing workpiece process components.

44. 44. The method of claim 43, wherein the deterministic connection kinematically couples the at least one interchangeable transport carrier cassette and a non-manufactured workpiece process component relative to a transport surface of the internal transport path in at least two orthogonal constraint axes, and the at least one interchangeable transport carrier cassette is positioned within the lock chamber when loaded into the lock chamber.

45. 44. The method of claim 43, wherein the positive connection is sealed from the interior of the lock chamber.

46. 44. The method of claim 43, wherein the positive connection has at least one pin depending from the replaceable cassette frame or the lock chamber and configured to matingly engage a complementary receptacle on the lock chamber or the replaceable cassette frame within the lock chamber, wherein each of the at least one pin mated to each of the complementary receptacles is sealed from the interior of the lock chamber.

47. 47. The method of claim 46, wherein the at least one pin comprises more than one pin in a deterministic pin arrangement on the exchangeable cassette frame or the lock chamber, the deterministic pin arrangement being positionally deterministic with respect to the one of the different non-manufacturing workpiece process components carried by the at least one exchangeable transport carrier cassette, resulting in a predetermined, repeatable position of the one of the different non-manufacturing workpiece process components.

48. 33. The method of claim 32, further comprising: exchanging the at least one exchangeable transport carrier cassette between each of the lock chambers of the process apparatus.

49. 33. The method of claim 32, further comprising exchanging the at least one exchangeable transport carrier cassette between the lock chamber of the process apparatus and another sealed or unsealed chamber of the process apparatus.

50. 33. The method of claim 32, further comprising exchanging the at least one exchangeable transport carrier cassette between the lock chamber of the process apparatus and another sealed or unsealed chamber of another process apparatus.

51. 33. The method of claim 32, wherein the lock chamber comprises one of a metrology chamber, a load lock chamber, an inspection station, an aligner station, a buffer station, and a transfer chamber.

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