Capacitors, capacitor banks, and capacitor outer cases

Abstract

A capacitor 1A comprises: a capacitor element 10 having an element body 11 and an external electrode 12a (12b) provided on an end surface of the element body 11; a lead-out terminal 20a (20b) that is electrically connected to the external electrode 12a (12b) and that is for weld-connecting the capacitor element 10 to a mounting object; an outer case 30A having accommodated therein the capacitor element 10 such that the lead-out terminal 20a (20b) projects outward; and a filled resin 40 that has been filled inside the outer case 30A so as to embed the capacitor element 10. The outer surface of the outer case 30A includes a mounting surface 34 that faces the mounting object in a first direction D1 when the lead-out terminal 20a (20b) has been weld-connected to the mounting object. The outer surface of the outer case 30A has a mounting fixture leg 50 for weld-connecting the outer case 30A to the mounting object at the mounting surface 34 side. The mounting fixture leg 50 is electrically insulated from the lead-out terminal 20a (20b) and formed from a metal material of the same kind as the lead-out terminal 20a (20b).

Description

[Technical Field]

[0001] The present invention relates to a capacitor, a capacitor bank, and an outer case for a capacitor. [Background technology]

[0002] Patent Document 1 discloses a case-molded capacitor in which a plurality of elements, each with a pair of electrodes on both end surfaces, are arranged in parallel, each connected to a bus bar with a terminal section for external connection at one end, and the entire capacitor is housed in a case and resin-molded except for at least the terminal section of the bus bar. The case has mounting legs located at the open end of the case and in positions that do not overlap with the elements when viewed from above, for attaching the case to an object to be mounted.

[0003] Patent Document 2 discloses a chip-type multiple electronic component in which a storage hole for storing multiple electronic components is formed in an outer case made of heat-resistant insulating resin and having a mounting surface at the bottom, and lead wires of the electronic components are led out from openings communicating with this storage hole and these lead wires are bent along locking walls provided on the outer case so that their tips form terminal portions, and the terminal portions are bent so that they are flush with the bottom surface of the outer case, and dummy terminals are formed integrally with the bottom surface of the outer case. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-252935 [Patent Document 2] Japanese Patent Application Laid-Open No. 2000-306770 Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, various industries have been working to conserve energy from the perspective of environmental protection. For example, in the automotive industry, development of energy-saving technologies is progressing, as seen in electrically powered vehicles such as electric vehicles, hybrid vehicles, and fuel cell vehicles.

[0006] Given this background, electrical and electronic components used in automotive applications, such as power conversion devices for electric vehicles, are naturally required to be energy-efficient. However, because they are used in automotive applications, they also require high vibration and shock resistance. Therefore, electrical and electronic components used in automotive applications must be firmly fixed to the mounting object. For example, smoothing capacitors used in DC-Links of electric systems are relatively large and heavy, making it even more necessary for them to be firmly fixed to the mounting object.

[0007] In the case-molded capacitor described in Patent Document 1, as shown in FIG. 1 and other figures of Patent Document 1, the case housing the capacitor element is provided with mounting legs for mounting the case to an attached body. Although Patent Document 1 does not describe a specific method for mounting the case to an attached body, the shape of the mounting legs shown in FIG. 1 and other figures of Patent Document 1 suggests that screw fastening is used. However, in the case-molded capacitor described in Patent Document 1, when the case is fastened to an attached body with screws, there is a risk that the screws will come loose due to vibration, impact, and the like, so there is room for improvement in terms of vibration and impact resistance.

[0008] In the chip-type multiple electronic component described in Patent Document 2, as shown in Figure 1 etc. of Patent Document 2, a plurality of electrolytic capacitors as electronic components are housed in an outer case, and dummy terminals provided on the bottom surface of such an outer case are fixed to a printed circuit board by soldering. However, in the chip-type multiple electronic component described in Patent Document 2, there is a risk that the solder may be damaged by vibration, impact, etc., so there is room for improvement in terms of vibration and impact resistance.

[0009] The present invention has been made to solve the above problems, and has as its object to provide a capacitor that can improve vibration and shock resistance when mounted on a mounting object. It is also an object of the present invention to provide a capacitor bank having the above capacitor. A further object of the present invention is to provide a capacitor outer case for use with the above capacitor. [Means for solving the problem]

[0010] The capacitor of the present invention comprises a capacitor element having a base body and an external electrode provided on an end face of the base body, a lead terminal electrically connected to the external electrode and for welding-connecting the capacitor element to an object to be mounted, an outer case in which the capacitor element is housed so that the lead terminal protrudes outward, and a filling resin filled in the outer case so as to embed the capacitor element, wherein the outer surface of the outer case includes a mounting surface that faces the object to be mounted in a first direction when the lead terminal is welded-connected to the object to be mounted, and the outer surface of the outer case is provided with a mounting attachment leg for welding-connecting the outer case to the mounting surface side, and the mounting attachment leg is electrically insulated from the lead terminal and is made of the same type of metal material as the lead terminal.

[0011] The capacitor bank of the present invention is characterized by comprising: the capacitor of the present invention; and the mounting object to which the lead terminals of the capacitor and the mounting legs are welded.

[0012] The capacitor outer casing of the present invention is an outer casing for a capacitor that houses a capacitor element having a base body and external electrodes provided on end faces of the base body, and a lead-out terminal that is electrically connected to the external electrode and is used to weld-connect the capacitor element to an object to be mounted, with the lead-out terminal protruding outward, characterized in that the outer surface of the outer casing includes a mounting surface that faces the object to be mounted in a first direction when the lead-out terminal is weld-connected to the object to be mounted, and the outer surface of the outer casing is provided with mounting mounting legs for weld-connecting the outer casing to the object on the mounting surface side. [Effects of the Invention]

[0013] According to the present invention, it is possible to provide a capacitor that can improve vibration and shock resistance when mounted on a mounting object. Also, according to the present invention, it is possible to provide a capacitor bank having the above-mentioned capacitor. Furthermore, according to the present invention, it is possible to provide a capacitor outer case used for the above-mentioned capacitor. [Brief explanation of the drawings]

[0014] [Figure 1] FIG. 1 is a schematic perspective view of an example of a capacitor according to the present invention. [Figure 2] FIG. 2 is a schematic perspective view of the capacitor shown in FIG. 1, viewed from a different direction than that in FIG. [Figure 3] FIG. 3 is a schematic perspective view of the capacitor shown in FIGS. 1 and 2, viewed from a different direction than in FIGS. [Figure 4] FIG. 4 is a schematic diagram showing the capacitor shown in FIGS. 1, 2, and 3 as viewed from the second surface side of the exterior case. [Figure 5] FIG. 5 is a schematic perspective view of one example of the capacitor element shown in FIGS. 1, 2, 3, and 4. In FIG. [Figure 6] FIG. 6 is a schematic diagram showing an example of a cross section of the capacitor element shown in FIG. 5 taken along line a1-a2. [Figure 7]FIG. 7 is a schematic perspective view of another example of the capacitor of the present invention. [Figure 8] FIG. 8 is a schematic diagram showing the capacitor shown in FIG. 7 as viewed from the first surface side of the exterior case. [Figure 9] FIG. 9 is a schematic perspective view of an example of a capacitor bank of the present invention. [Figure 10] FIG. 10 is a schematic diagram showing the capacitor bank shown in FIG. 9 in a perspective view from a different direction than that in FIG. [Figure 11] FIG. 11 is a schematic diagram showing the capacitor bank shown in FIGS. 9 and 10 as viewed from the second surface side of the exterior case. [Figure 12] FIG. 12 is a schematic diagram showing an enlarged view of a part of the capacitor bank shown in FIG. [Figure 13] FIG. 13 is a schematic diagram showing a part of the capacitor bank shown in FIG. 12 as viewed from the first surface side of the exterior case. DETAILED DESCRIPTION OF THE INVENTION

[0015] The capacitor of the present invention, the capacitor bank of the present invention, and the capacitor outer case of the present invention will be described below. Note that the present invention is not limited to the following configurations and may be modified as appropriate without departing from the spirit of the present invention. Furthermore, a combination of multiple individual preferred configurations described below also constitutes the present invention.

[0016] Although a film capacitor will be described below as an example of the capacitor of the present invention, the capacitor of the present invention can also be applied to capacitors other than film capacitors.

[0017] The drawings shown below are schematic diagrams, and the dimensions, aspect ratio, scale, etc. may differ from those of the actual product.

[0018] The capacitor of the present invention comprises a capacitor element having a base body and an external electrode provided on an end face of the base body, a lead terminal electrically connected to the external electrode and for welding-connecting the capacitor element to an object to be mounted, an outer case in which the capacitor element is housed so that the lead terminal protrudes outward, and a filling resin filled in the outer case so as to embed the capacitor element, wherein the outer surface of the outer case includes a mounting surface that faces the object to be mounted in a first direction when the lead terminal is welded-connected to the object to be mounted, and the outer surface of the outer case is provided with a mounting attachment leg for welding-connecting the outer case to the mounting surface side, and the mounting attachment leg is electrically insulated from the lead terminal and is made of the same type of metal material as the lead terminal.

[0019] Furthermore, a capacitor outer casing used in the capacitor of the present invention described below also constitutes one aspect of the present invention. That is, the capacitor outer casing of the present invention is a capacitor outer casing for accommodating a capacitor element having an element body and external electrodes provided on end faces of the element body, and lead terminals electrically connected to the external electrodes and for connecting the capacitor element to a mounting object by welding, such that the lead terminals protrude outward, wherein an outer surface of the outer casing includes a mounting surface that faces the mounting object in a first direction when the lead terminals are connected to the mounting object by welding, and the outer surface of the outer casing is provided with mounting attachment legs for connecting the outer casing to the mounting object on the mounting surface side by welding.

[0020] Fig. 1 is a schematic diagram showing an oblique view of an example of a capacitor of the present invention. Fig. 2 is a schematic diagram showing the capacitor shown in Fig. 1 as viewed from a different perspective than Fig. 1. Fig. 3 is a schematic diagram showing the capacitor shown in Figs. 1 and 2 as viewed from a different perspective than Figs. 1 and 2. Fig. 4 is a schematic diagram showing the capacitor shown in Figs. 1, 2, and 3 as viewed from the second surface side of the exterior case.

[0021] The capacitor 1A shown in Figures 1, 2, 3, and 4 has a capacitor element 10 (see Figure 5 described later), a first lead terminal 20a, a second lead terminal 20b, an outer case 30A, and a filling resin 40.

[0022] In FIG. 1 and other figures, the first direction D1, the second direction D2, and the third direction D3 are perpendicular to one another.

[0023] Fig. 5 is a schematic perspective view of an example of the capacitor element shown in Fig. 1, Fig. 2, Fig. 3, and Fig. 4. Fig. 6 is a schematic view showing an example of a cross section of the capacitor element shown in Fig. 5 taken along line a1-a2.

[0024] The capacitor element 10 shown in FIGS. 5 and 6 has an element body 11, a first external electrode 12a, and a second external electrode 12b.

[0025] Body 11 is a wound body in which first metallized film 13a and second metallized film 13b are wound in a stacked state in first direction D1. That is, capacitor 1A, more specifically, capacitor element 10, is a wound-type film capacitor in which metallized films are wound in a stacked state.

[0026] Capacitor 1A, more specifically capacitor element 10, may be a laminated film capacitor in which metallized films are laminated.

[0027] From the viewpoint of reducing the height of capacitor element 10, it is preferable that element body 11 has a flat cross-sectional shape when viewed in a cross section perpendicular to the winding axis direction (third direction D3 in FIG. 5) of element body 11. More specifically, it is preferable that element body 11 be pressed into a flattened shape such as an ellipse or oval, and that the cross-sectional shape of element body 11 be a shape that is thinner than when the cross-sectional shape of element body 11 is a perfect circle.

[0028] Whether or not the element body has been pressed to have a flat cross-sectional shape can be confirmed, for example, by checking whether or not there are press marks on the element body.

[0029] Capacitor element 10 may have a cylindrical winding shaft that is disposed on the central axis of first metallized film 13a and second metallized film 13b in a wound state and serves as the winding shaft when first metallized film 13a and second metallized film 13b are wound.

[0030] First metallized film 13a includes first dielectric film 14a and first metal layer 15a.

[0031] The first dielectric film 14a has a first main surface 14aa and a second main surface 14ab facing each other in the first direction D1.

[0032] The first metal layer 15a is provided on the first main surface 14aa of the first dielectric film 14a. More specifically, the first metal layer 15a is provided on the first main surface 14aa of the first dielectric film 14a so as to reach one side edge of the first dielectric film 14a in the third direction D3 but not to reach the other side edge of the first dielectric film 14a.

[0033] Second metallized film 13b includes second dielectric film 14b and second metal layer 15b.

[0034] The second dielectric film 14b has a first main surface 14ba and a second main surface 14bb that face each other in the first direction D1.

[0035] The second metal layer 15b is provided on the first main surface 14ba of the second dielectric film 14b. More specifically, the second metal layer 15b is provided on the first main surface 14ba of the second dielectric film 14b so as not to reach one side edge of the second dielectric film 14b in the third direction D3 but to reach the other side edge of the second dielectric film 14b.

[0036] In element body 11, adjacent first metallized films 13a and second metallized films 13b are shifted in third direction D3 so that the end of first metal layer 15a that reaches the side edge of first dielectric film 14a is exposed at one end surface of element body 11, and the end of second metal layer 15b that reaches the side edge of second dielectric film 14b is exposed at the other end surface of element body 11. That is, in adjacent first metallized films 13a and second metallized films 13b, first metallized film 13a protrudes toward first external electrode 12a relative to second metallized film 13b. In addition, in adjacent first metallized films 13a and second metallized films 13b, second metallized film 13b protrudes toward second external electrode 12b relative to first metallized film 13a. In this state, first metal layer 15a is connected to first external electrode 12a but not to second external electrode 12b. The second metal layer 15b is connected to the second external electrode 12b, and is not connected to the first external electrode 12a.

[0037] In element body 11, adjacent first metallized films 13a and second metallized films 13b are shifted in third direction D3 as described above, so that, among adjacent first dielectric films 14a and second dielectric films 14b, first dielectric film 14a having first metal layer 15a provided on first main surface 14aa protrudes toward first external electrode 12a relative to second dielectric film 14b having no first metal layer 15a provided on its main surface. Also, among adjacent first dielectric films 14a and second dielectric films 14b, second dielectric film 14b having second metal layer 15b provided on first main surface 14ba protrudes toward second external electrode 12b relative to first dielectric film 14a having no second metal layer 15b provided on its main surface.

[0038] Since element body 11 is formed by winding first metallized film 13a and second metallized film 13b in a stacked state in first direction D1, it can be said that element body 11 includes first dielectric film 14a, first metal layer 15a, second dielectric film 14b, and second metal layer 15b in this order in first direction D1. It can also be said that element body 11 is a wound body formed by winding first dielectric film 14a, first metal layer 15a, second dielectric film 14b, and second metal layer 15b in this order in first direction D1.

[0039] In element body 11, first main surface 14aa of first dielectric film 14a and second main surface 14bb of second dielectric film 14b face each other in first direction D1, and second main surface 14ab of first dielectric film 14a and first main surface 14ba of second dielectric film 14b face each other in first direction D1. Thus, in element body 11, first metallized film 13a and second metallized film 13b are wound in a stacked state in first direction D1. In other words, in element body 11, first metallized film 13a and second metallized film 13b are wound in a stacked state in first direction D1 so that second metallized film 13b is on the inside of first metallized film 13a, more specifically, so that first metal layer 15a is on the inside of first dielectric film 14a and second metal layer 15b is on the inside of second dielectric film 14b. That is, in element body 11, first metal layer 15a and second metal layer 15b face each other with first dielectric film 14a or second dielectric film 14b sandwiched therebetween.

[0040] The first metal layer 15a may be provided with a fuse portion. The fuse portion provided in the first metal layer 15a is, for example, a portion that connects a divided electrode portion formed by dividing a portion of the first metal layer 15a that faces the second metal layer 15b into multiple portions with an electrode portion that does not face the second metal layer 15b. Examples of electrode patterns of the first metal layer 15a provided with a fuse portion include the electrode patterns disclosed in JP 2004-363431 A and JP 5-251266 A.

[0041] Similar to the first metal layer 15a, the second metal layer 15b may also be provided with a fuse portion.

[0042] The first dielectric film 14a may contain a curable resin as a main component.

[0043] In this specification, the term "major component" means the component with the highest weight percentage, preferably a component with a weight percentage greater than 50% by weight.

[0044] The curable resin may be a thermosetting resin or a photocurable resin.

[0045] In this specification, thermosetting resin refers to a resin that can be cured by heat, but the curing method is not limited thereto. Therefore, thermosetting resins also include resins that can be cured by methods other than heat (e.g., light, electron beams, etc.) as long as they are resins that can be cured by heat. Furthermore, depending on the material, a reaction may be initiated due to the reactivity of the material itself, and resins that proceed to cure without necessarily being subjected to external heat or the like are also considered thermosetting resins. The same applies to photocurable resins; as long as they are resins that can be cured by light, they also include resins that can be cured by methods other than light (e.g., heat, etc.).

[0046] The curable resin is preferably a cured product of a first organic material having a hydroxyl group (OH group) and a second organic material having an isocyanate group (NCO group). In this case, the curable resin is a cured product having a urethane bond obtained by reacting the hydroxyl group of the first organic material with the isocyanate group of the second organic material.

[0047] The presence of urethane bonds in the dielectric film can be confirmed by analysis with a Fourier transform infrared spectrophotometer (FT-IR).

[0048] When the curable resin is obtained by the above-described reaction, uncured portions of the starting material may remain in the first dielectric film 14a. For example, the first dielectric film 14a may contain at least one of a hydroxyl group and an isocyanate group. In this case, the first dielectric film 14a may contain either a hydroxyl group or an isocyanate group, or may contain both a hydroxyl group and an isocyanate group.

[0049] The presence of hydroxyl groups and / or isocyanate groups in the dielectric film can be confirmed by FT-IR analysis.

[0050] Examples of the first organic material include phenoxy resin, polyvinyl acetoacetal resin, and polyvinyl butyral resin.

[0051] As the first organic material, a plurality of types of organic materials may be used in combination.

[0052] Examples of the second organic material include aromatic polyisocyanates such as diphenylmethane diisocyanate (MDI) and tolylene diisocyanate (TDI), and aliphatic polyisocyanates such as hexamethylene diisocyanate (HDI). As the second organic material, at least one modified product of these polyisocyanates may be used, or a mixture of at least one modified product of these polyisocyanates may be used.

[0053] As the second organic material, a plurality of types of organic materials may be used in combination.

[0054] The first dielectric film 14a may contain a thermoplastic resin as a main component.

[0055] Examples of the thermoplastic resin include polypropylene, polyethersulfone, polyetherimide, and polyarylate.

[0056] The first dielectric film 14a may contain additives to impart various functions.

[0057] The additives include, for example, a leveling agent for imparting smoothness.

[0058] The additive preferably has a functional group that reacts with a hydroxyl group and / or an isocyanate group and forms part of the crosslinked structure of the cured product. Examples of such additives include resins having at least one functional group selected from the group consisting of a hydroxyl group, an epoxy group, a silanol group, and a carboxyl group.

[0059] Like the first dielectric film 14a, the second dielectric film 14b may contain a curable resin or a thermoplastic resin as a main component, and like the first dielectric film 14a, the second dielectric film 14b may also contain an additive.

[0060] The first dielectric film 14a and the second dielectric film 14b may have different compositions, but preferably have the same composition.

[0061] The thickness of the first dielectric film 14a and the second dielectric film 14b is preferably 1 μm or more and 10 μm or less, and more preferably 3 μm or more and 5 μm or less.

[0062] The thicknesses of the first dielectric film 14a and the second dielectric film 14b may be different from each other, but are preferably the same.

[0063] The thickness of the dielectric film is measured using an optical film thickness gauge.

[0064] The first dielectric film 14a and the second dielectric film 14b are each preferably produced by forming a resin solution containing the above-mentioned resin material into a film, and then curing it by heat treatment.

[0065] Examples of materials that can be used to form the first metal layer 15a and the second metal layer 15b include metals such as aluminum, zinc, titanium, magnesium, tin, and nickel.

[0066] The compositions of the first metal layer 15a and the second metal layer 15b may be different from each other, but are preferably the same.

[0067] The thickness of the first metal layer 15a and the second metal layer 15b is preferably 5 nm or more and 40 nm or less.

[0068] The thickness of the first metal layer 15a and the second metal layer 15b may be different from each other, but it is preferable that they are the same.

[0069] The thickness of the metal layer is measured by observing a cross section of the metallized film along the first direction using a transmission electron microscope (TEM).

[0070] The first metal layer 15a and the second metal layer 15b are preferably formed by depositing the metals described above on the major surfaces of the first dielectric film 14a and the second dielectric film 14b, respectively.

[0071] The first external electrode 12a is provided on one end surface of the element body 11. More specifically, the first external electrode 12a is connected to the first metal layer 15a by contacting the end of the first metal layer 15a exposed on one end surface of the element body 11. On the other hand, the first external electrode 12a is not connected to the second metal layer 15b.

[0072] The second external electrode 12b is provided on the other end surface of the element body 11. More specifically, the second external electrode 12b is connected to the second metal layer 15b by contacting the end of the second metal layer 15b exposed on the other end surface of the element body 11. On the other hand, the second external electrode 12b is not connected to the first metal layer 15a.

[0073] Examples of materials that can be used to form the first external electrode 12a and the second external electrode 12b include metals such as zinc, aluminum, tin, and zinc-aluminum alloys.

[0074] The first external electrode 12a and the second external electrode 12b may have different compositions, but preferably have the same composition.

[0075] The first external electrode 12a and the second external electrode 12b are preferably formed by spraying the above-mentioned metal onto one end surface and the other end surface of the element body 11, respectively.

[0076] The first extraction terminal 20a is electrically connected to the first external electrode 12a (see FIGS. 5 and 6). For example, the first extraction terminal 20a is electrically connected to the first external electrode 12a via a joining member such as solder.

[0077] The second extraction terminal 20b is electrically connected to the second external electrode 12b (see FIGS. 5 and 6). For example, the second extraction terminal 20b is electrically connected to the second external electrode 12b via a joining member such as solder.

[0078] The first lead-out terminal 20a and the second lead-out terminal 20b are each a lead-out terminal for connecting the capacitor element 10 to a mounting object by welding.

[0079] When mounting capacitor 1A on a mounting object, first lead-out terminal 20a and second lead-out terminal 20b are connected to the mounting object by welding, so capacitor 1A, and in particular capacitor element 10, can be more firmly fixed to the mounting object than when first lead-out terminal 20a and second lead-out terminal 20b are fixed to the mounting object by screw fastening, soldering, etc. This improves the vibration and shock resistance of capacitor 1A when mounted on the mounting object.

[0080] Furthermore, when the capacitor 1A is mounted on a mounting object, the first lead-out terminal 20a and the second lead-out terminal 20b are connected to the mounting object by welding, which reduces the connection resistance between the first lead-out terminal 20a and the mounting object and between the second lead-out terminal 20b and the mounting object, thereby improving the conductivity between the capacitor 1A and the mounting object.

[0081] The first and second lead-out terminals 20a and 20b may each have a plate-like or linear (rod-like) shape, for example. In this case, the first and second lead-out terminals 20a and 20b may each have a partially bent shape.

[0082] Capacitor element 10 (see FIGS. 5 and 6) is housed inside outer case 30A so that first lead-out terminal 20a and second lead-out terminal 20b protrude outward. Although not shown in FIG. 1 etc., capacitor element 10 is preferably housed in the center of the interior of outer case 30A, away from the inner surface of outer case 30A.

[0083] The shape of the exterior case 30A is, for example, as shown in FIG. 1 etc., a cylindrical shape with a bottom and an opening 31 provided at one end in the second direction D2.

[0084] In the example shown in Figure 1, etc., the outer surface of the outer case 30A includes a first surface 32 facing the opening 31 in the second direction D2, and a second surface 33 (in the example shown in Figure 1, etc., including four surfaces) extending from the first surface 32 toward the opening 31 in the second direction D2.

[0085] The exterior case 30A may be, for example, a resin case or a metal case.

[0086] When the exterior case 30A is a resin case, examples of the resin that constitutes the resin case include liquid crystal polymer (LCP), polyphenylene sulfide, polybutylene terephthalate, etc. Among these, it is preferable that the resin case contains a liquid crystal polymer.

[0087] The liquid crystal polymer contained in the resin case may be, for example, a liquid crystal polymer having p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid groups in its skeleton. Liquid crystal polymers formed as polycondensates using various components other than p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid groups, such as phenol, phthalic acid, and ethylene terephthalate, may also be used. Liquid crystal polymers can also be classified into types I, II, and III, but these types refer to the same materials as the liquid crystal polymers formed from the above-mentioned components.

[0088] The resin case preferably further contains an inorganic filler in addition to the liquid crystal polymer.

[0089] The inorganic filler contained in the resin case can be a material with a higher strength than the liquid crystal polymer. The inorganic filler is preferably a material with a higher melting point than the liquid crystal polymer, and more preferably a material with a melting point of 680°C or higher.

[0090] The shape of the inorganic filler is not particularly limited, and examples thereof include a shape having a longitudinal direction, such as a fibrous or plate-like shape. As the inorganic filler having such a shape, multiple types of inorganic materials may be used in combination. It is preferable that the resin case contains at least one of a fibrous inorganic material and a plate-like inorganic material as the inorganic filler.

[0091] In this specification, a filler being fibrous means that the relationship between the longitudinal dimension and the cross-sectional diameter in a cross section perpendicular to the longitudinal direction is longitudinal dimension / cross-sectional diameter ≥ 5 (i.e., the aspect ratio is 5:1 or more). Here, the cross-sectional diameter is the distance between the longest two points on the periphery of the cross section. If the cross-sectional diameter varies in the longitudinal direction, the measurement is taken at the point where the cross-sectional diameter is largest.

[0092] In this specification, a filler being plate-shaped means that the relationship between the cross-sectional diameter of the surface with the largest projected area and the maximum height in a direction perpendicular to this cross section is cross-sectional diameter / maximum height ≧3.

[0093] It is preferable that at least a portion of the inorganic filler has, on the second surface 33 of the outer case 30A, a portion oriented from the first surface 32 toward the opening 31 and a portion oriented toward the adjacent second surface 33, and is dispersed inside the outer case 30A.

[0094] The size of the inorganic filler is preferably 5 μm or more in diameter and 50 μm or more in length.

[0095] It is preferable that the inorganic filler be dispersed throughout the exterior case 30A without agglomerating.

[0096] Examples of inorganic fillers include inorganic materials such as fibrous glass filler, plate-like talc or mica, etc. Among these, it is preferable that the inorganic filler contains fibrous glass filler as a main component.

[0097] Even when the resin case contains another resin (for example, polyphenylene sulfide) instead of the liquid crystal polymer, it is preferable that the resin case further contains an inorganic filler as described above.

[0098] The resin case is manufactured by a method such as injection molding.

[0099] When the exterior case 30A is a metal case, examples of the metal constituting the metal case include simple metals such as aluminum, magnesium, iron, stainless steel, and copper, and alloys containing at least one of these simple metals. Of these, it is preferable that the metal case contains aluminum or an aluminum alloy.

[0100] The metal case is manufactured by a method such as impact molding.

[0101] In the example shown in Figure 1 etc., one capacitor element 10 is housed inside one exterior case 30A, but multiple capacitor elements 10 may also be housed inside one exterior case 30A.

[0102] Filling resin 40 is filled inside exterior case 30A so as to embed capacitor element 10. By filling filling resin 40 in this manner, capacitor element 10 is held inside exterior case 30A.

[0103] When capacitor element 10 is housed inside outer case 30A so as to be spaced apart from the inner surface of outer case 30A, filled resin 40 is filled between capacitor element 10 and outer case 30A, more specifically, between the outer surface of capacitor element 10 and the inner surface of outer case 30A. Furthermore, filled resin 40 is filled inside outer case 30A not only between capacitor element 10 and outer case 30A, but also in the region from opening 31 of outer case 30A to capacitor element 10.

[0104] From the viewpoint of suppressing the penetration of moisture into capacitor element 10, it is preferable to appropriately select a resin with low moisture permeability as filling resin 40, such as epoxy resin, silicone resin, urethane resin, etc. Examples of the curing agent for epoxy resin include an amine curing agent, an imidazole curing agent, etc.

[0105] The above-mentioned resin alone may be used as the filling resin 40, but to improve strength, a resin to which a reinforcing agent is added may also be used. Examples of the reinforcing agent include silica and alumina.

[0106] From the viewpoint of preventing moisture from penetrating into capacitor element 10, it is preferable that the thickness of filling resin 40 at opening 31 of outer case 30A is large. The thickness of filling resin 40 at opening 31 of outer case 30A is preferably sufficiently large within the range allowed by the overall volume (physical size) of capacitor 1A, and specifically, is preferably 2 mm or more, and more preferably 4 mm or more. In particular, it is preferable that, inside outer case 30A, capacitor element 10 is disposed closer to first surface 32 than to opening 31 of outer case 30A, so that the thickness of filling resin 40 relative to capacitor element 10 is larger on the opening 31 side of outer case 30A than on the first surface 32 side.

[0107] The thickness of the filled resin 40 is measured, for example, using a soft X-ray device if it is in a non-destructive state, and using a length measuring device such as a vernier caliper if it is in a destructive state.

[0108] The relationship between the height of the outer case 30A and the height of the filling resin 40 in the second direction D2 is such that the thickness of the filling resin 40 at the opening 31 of the outer case 30A is as large as possible, and it may be up to a position inside the outer case 30A, or it may be just about to the top, or it may overflow slightly due to surface tension.

[0109] The outer surface of the outer case 30A includes a mounting surface 34 that faces the mounting object in the first direction D1 when the first lead-out terminal 20a and the second lead-out terminal 20b are welded and connected to the mounting object. In the example shown in FIG. 1 etc., the outer surface of the outer case 30A includes the mounting surface 34 as part of the second surface 33.

[0110] Mounting legs 50 are provided on the outer surface of the exterior case 30A.

[0111] 1 etc., the mounting feet 50 are attached to the outer surface of the exterior case 30A, in this case, the first rib 35a provided on the mounting surface 34 (second surface 33). Thus, in the example shown in Fig. 1 etc., the mounting feet 50 are provided on the mounting surface 34 of the exterior case 30A.

[0112] The mounting legs 50 are attached to the first ribs 35a by, for example, insert molding or other methods.

[0113] The shape of the first rib 35a is not particularly limited.

[0114] The first rib 35a does not have to be provided on the outer surface of the exterior case 30A, that is, the location where the mounting feet 50 are provided is not limited to the first rib 35a of the exterior case 30A.

[0115] The mounting legs 50 are used to weld the exterior case 30A to an object to be mounted on the mounting surface 34 side.

[0116] When mounting capacitor 1A on a mounting object, mounting legs 50 are welded to the mounting object, which allows capacitor 1A, and in particular outer case 30A, to be more firmly fixed to the mounting object than when mounting legs 50 are fixed to the mounting object by screwing, soldering, etc. This improves the vibration and shock resistance of capacitor 1A when mounted on the mounting object.

[0117] Furthermore, when mounting capacitor 1A on a mounting object, mounting attachment leg 50 can be welded to the mounting object in the same process as welding first lead-out terminal 20a and second lead-out terminal 20b to the mounting object. This eliminates the need for a conventional fixing process, such as fastening the capacitor to the mounting object with screws, when mounting capacitor 1A on a mounting object, thereby reducing the time, cost, etc. required to fix the capacitor to the mounting object.

[0118] In the capacitor 1A, the mounting leg 50 is electrically insulated from the first lead-out terminal 20a and the second lead-out terminal 20b. That is, in the capacitor 1A, the mounting leg 50 is electrically insulated from the capacitor element 10 to which the first lead-out terminal 20a and the second lead-out terminal 20b are electrically connected.

[0119] The mounting legs 50 are made of the same metal material as the first and second lead-out terminals 20a and 20b, so that when the capacitor 1A is mounted on an object to be mounted, the mounting legs 50 can be welded to the object using the same welding method as that used for the first and second lead-out terminals 20a and 20b.

[0120] In this specification, "multiple components are composed of the same type of metallic material" means that the metallic materials have the same type of metallic element in their basic components. The basic component of a metallic material may be composed of only one type of metallic element or multiple types of metallic elements. When the basic component of a metallic material is composed of multiple types of metallic elements, for example, when comparing two components, if the metallic elements in the basic component of one component are E1 and E2 and the metallic elements in the basic component of the other component are E1 and E2, both components are said to be composed of the same type of metallic material. The same applies when comparing three or more components. Note that the content of the basic component in the metallic material may be the same among multiple components, different among multiple components, or may be partially different. When the basic component of a metallic material is composed of multiple types of metallic elements, the weight ratios of the multiple metallic elements in the basic component may be the same among multiple components, different among multiple components, or may be partially different. Furthermore, the metallic material may contain 1 wt% or less of an additive component in addition to the basic component. The types of metal elements in the additive components of the metallic material may be the same among multiple components, may be different among multiple components, or may be partially different. The additive components of the metallic material may be composed of only one type of metal element, or may be composed of multiple types of metal elements. The content of the additive components in the metallic material may be the same among multiple components, may be different among multiple components, or may be partially different. When the additive components of the metallic material are composed of multiple types of metal elements, the weight ratios of the multiple metal elements in the additive components may be the same among multiple components, may be different among multiple components, or may be partially different. Note that the metallic material does not have to contain the additive component. Among the multiple components, the metallic materials of all components may contain the additive component, or the metallic materials of some components may contain the additive component, or the metallic materials of none of the components may contain the additive component.

[0121] Examples of metal materials constituting the first and second lead-out terminals 20a, 20b, and mounting legs 50 include copper, oxygen-free copper, aluminum, and alloys containing at least one of these. Among these, the metal materials constituting the first and second lead-out terminals 20a, 20b, and mounting legs 50 are preferably copper or oxygen-free copper. When the metal materials constituting the first and second lead-out terminals 20b, and mounting legs 50 are copper-based materials, examples of usable metal materials include oxygen-free copper (copper: 99.96% by weight or more), tough pitch copper (copper: 99.90% by weight or more), and phosphorus-deoxidized copper (copper: 99.90% by weight or more, phosphorus: 0.015% by weight or more, 0.040% by weight or less).

[0122] As a method for welding and connecting the first lead terminal 20a, the second lead terminal 20b, and the mounting leg 50 to the mounting object, a welding method such as laser welding or resistance welding is used. In particular, compared to other welding methods, laser welding has the advantage that welding can be completed in a short time by localized heating, and therefore welding distortion can be reduced.

[0123] As shown in FIG. 1 and other figures, the mounting legs 50 preferably protrude beyond the mounting surface 34 of the outer case 30A in the first direction D1. In this case, when the capacitor 1A is mounted on a mounting target, a gap can be provided between the mounting surface 34 of the outer case 30A and the mounting target. Furthermore, when the capacitor 1A is mounted on the mounting target, the gap provided between the mounting surface 34 of the outer case 30A and the mounting target can be used to place a connecting member such as a heat dissipation paste or an underfill adhesive (e.g., an adhesive containing an epoxy resin). For example, by placing a heat dissipation paste between the mounting surface 34 of the outer case 30A and the mounting target, it is easy to achieve the desired heat dissipation performance of the capacitor 1A. Furthermore, by placing an underfill adhesive between the mounting surface 34 of the outer case 30A and the mounting target, the capacitor 1A, particularly the outer case 30A, can be sufficiently firmly fixed to the mounting target.

[0124] From the same viewpoint, as shown in FIG. 1 and other figures, it is preferable that the first lead-out terminal 20a and the second lead-out terminal 20b each protrude beyond the mounting surface 34 of the exterior case 30A in the first direction D1.

[0125] When the capacitor 1A is mounted on an object to be mounted, the distance between the mounting surface 34 of the outer case 30A and the object to be mounted can be adjusted by the shapes of the first lead-out terminal 20a, the second lead-out terminal 20b, and the mounting feet 50.

[0126] As shown in Fig. 4, a space F is preferably provided between the mounting surface 34 of the exterior case 30A and the mounting foot 50. In the example shown in Fig. 4, the space F is provided between the first surface 35aa of the first rib 35a included in the mounting surface 34 of the exterior case 30A and the mounting foot 50. In this case, by using the space F when welding the mounting foot 50 to the mounting target, welding operations such as irradiating a laser onto a welding portion of the mounting foot 50 during laser welding or contacting an electrode with the mounting foot 50 during resistance welding can be facilitated.

[0127] The distance between the mounting surface 34 of the exterior case 30A and the mounting legs 50 can be adjusted by changing the shape of the mounting legs 50.

[0128] It should be noted that the space F does not necessarily have to be provided between the mounting surface 34 of the exterior case 30A and the mounting feet 50. In this case, the mounting feet 50 may be provided along the mounting surface 34 of the exterior case 30A so as to be in contact with the mounting surface 34 of the exterior case 30A.

[0129] It is preferable that the mounting legs 50 do not protrude from the exterior case 30A when viewed from the first direction D1. When the mounting legs 50 do not protrude from the exterior case 30A when viewed from the first direction D1, the mounting area of ​​the capacitor 1A can be reduced compared to when the mounting legs 50 protrude from the exterior case 30A. Furthermore, when multiple capacitors 1A are lined up in a direction perpendicular to the first direction D1 (a direction that includes the second direction D2 and the third direction D3 in the example shown in FIG. 1 etc.) and mechanically connected, adjacent capacitors 1A are less likely to interfere with each other when compared to when the mounting legs 50 protrude from the exterior case 30A when viewed from the first direction D1.

[0130] The mounting legs 50 may protrude from the exterior case 30A when viewed from the first direction D1. In this case, the portions of the mounting legs 50 that protrude from the exterior case 30A can be used as welding locations, so there does not need to be a space between the mounting surface 34 of the exterior case 30A and the mounting legs 50.

[0131] The mounting leg 50 may have, for example, a plate-like shape or a linear (rod-like) shape. In this case, the mounting leg 50 may have a shape with a partially bent portion.

[0132] Only one mounting leg 50 may be provided as shown in FIG. 1, etc., or multiple mounting legs may be provided.

[0133] Fig. 7 is a schematic perspective view of another example of the capacitor of the present invention, and Fig. 8 is a schematic view of the capacitor shown in Fig. 7 as viewed from the first surface side of the exterior case.

[0134] The capacitor 1B shown in FIGS. 7 and 8 differs from the capacitor 1A shown in FIG. 1 and other figures in that it has an outer case 30B instead of the outer case 30A.

[0135] In addition to the mounting legs 50, a first fixing leg 60a and a second fixing leg 60b are further provided on the outer surface of the exterior case 30B.

[0136] In the example shown in FIG. 7 and other figures, the first fixing mounting leg 60a is attached to the outer surface of the exterior case 30B, in this case, the second rib 35b provided on the second surface 33.

[0137] The first fixing mounting leg 60a is attached to the second rib 35b by, for example, insert molding or the like.

[0138] In the example shown in FIG. 7 and other figures, the second fixing mounting leg 60b is attached to the outer surface of the exterior case 30B, in this case, the third rib 35c provided on the second surface 33.

[0139] The second fixing mounting leg 60b is attached to the third rib 35c by, for example, insert molding or the like.

[0140] The shapes of the second rib 35b and the third rib 35c are not particularly limited.

[0141] The second rib 35b and the third rib 35c do not necessarily have to be provided on the outer surface of the outer case 30B. In other words, the locations where the fixing mounting legs 60 are provided are not limited to the second rib 35b and the third rib 35c of the outer case 30B.

[0142] The first fixing mounting leg 60a and the second fixing mounting leg 60b are mounting legs for connecting the outer case 30B to another outer case by welding.

[0143] 9, which will be described later, when multiple capacitors 1B are mechanically connected, the first fixing mounting leg 60a of one capacitor 1B is connected to the second fixing mounting leg 60b of the other capacitor 1B by welding, which makes it possible to more firmly connect adjacent capacitors 1B, particularly adjacent outer cases 30B, than when the first fixing mounting leg 60a and the second fixing mounting leg 60b are connected by screw fastening, soldering, etc. This improves vibration and shock resistance when multiple capacitors 1B are mechanically connected.

[0144] The first fixing mounting leg 60a is provided at a position different from the mounting mounting leg 50 so as to be electrically insulated from the first lead-out terminal 20a and the second lead-out terminal 20b. In other words, the first fixing mounting leg 60a is electrically insulated from the capacitor element 10 to which the first lead-out terminal 20a and the second lead-out terminal 20b are electrically connected.

[0145] The second fixing mounting leg 60b is provided at a position different from the mounting mounting leg 50 so as to be electrically insulated from the first lead-out terminal 20a and the second lead-out terminal 20b. In other words, the second fixing mounting leg 60b is electrically insulated from the capacitor element 10 to which the first lead-out terminal 20a and the second lead-out terminal 20b are electrically connected.

[0146] The first and second fixing mounting legs 60a and 60b are preferably electrically insulated from each other.

[0147] The first and second fixing mounting legs 60a and 60b are preferably electrically insulated from the mounting legs 50, respectively.

[0148] The first and second fixing legs 60a, 60b are preferably made of the same metal material as the first and second lead-out terminals 20a, 20b. In other words, the first and second fixing legs 60a, 60b are preferably made of the same metal material as the mounting leg 50. In this case, the first and second fixing legs 60a, 60b can be welded together using the same welding method as used to weld the first and second lead-out terminals 20a, 20b, and mounting leg 50 to the mounting object.

[0149] Examples of metal materials that can be used to form the first and second fixing mounting legs 60a and 60b include copper, oxygen-free copper, aluminum, and alloys containing at least one of these. Among these, copper or oxygen-free copper is preferred as the metal material that forms the first and second fixing mounting legs 60a and 60b. When the metal material that forms the first and second fixing mounting legs 60a and 60b is a copper-based material, examples that can be used include oxygen-free copper (copper: 99.96% by weight or more), tough pitch copper (copper: 99.90% by weight or more), and phosphorus-deoxidized copper (copper: 99.90% by weight or more, phosphorus: 0.015% by weight or more, 0.040% by weight or less).

[0150] The first and second fixing mounting legs 60a and 60b can be connected by welding using welding techniques such as laser welding and resistance welding.

[0151] As shown in Fig. 7 and other figures, the mounting foot 50 and the first fixing foot 60a are preferably provided at different heights in the first direction D1. Furthermore, as shown in Fig. 7 and other figures, the mounting foot 50 and the second fixing foot 60b are preferably provided at different heights in the first direction D1. In this case, when multiple capacitors 1B are mechanically connected and mounted on a mounting target, each capacitor 1B, particularly each outer case 30B, can be fixed at multiple locations at different heights, thereby sufficiently improving vibration and shock resistance when the multiple capacitors 1B are mechanically connected.

[0152] The first fixing mounting leg 60a and the second fixing mounting leg 60b may be provided at the same height position in the first direction D1, or may be provided at different height positions in the first direction D1.

[0153] When the first fixing mounting leg 60a and the second fixing mounting leg 60b are provided at different height positions in the first direction D1, the surfaces of the first fixing mounting leg 60a and the second fixing mounting leg 60b facing the first direction D1 can be easily welded together, as shown in Figure 13 described below.

[0154] As shown in Fig. 7 and other figures, the mounting leg 50 and the first fixing leg 60a preferably extend in different directions. Furthermore, as shown in Fig. 7 and other figures, the mounting leg 50 and the second fixing leg 60b preferably extend in different directions. In this case, it becomes easier to weld the first fixing leg 60a and the second fixing leg 60b while welding the mounting leg 50 to the mounting object.

[0155] When the mounting leg 50 and the first fixing leg 60a extend in different directions, the mounting leg 50 and the first fixing leg 60a may extend in directions that intersect each other while being perpendicular to the first direction D1. When the mounting leg 50 and the second fixing leg 60b extend in different directions, the mounting leg 50 and the second fixing leg 60b may extend in directions that intersect each other while being perpendicular to the first direction D1. For example, as shown in FIG. 7 , the mounting leg 50 may extend in the second direction D2, and the first fixing leg 60a and the second fixing leg 60b may extend in the third direction D3. In this case, with multiple capacitors 1B lined up in the third direction D3, it becomes easier to weld the mounting leg 50 to the mounting target and to weld the first fixing leg 60a and the second fixing leg 60b together.

[0156] The mounting legs 50 and the first fixing legs 60a do not have to extend in directions perpendicular to each other.Furthermore, the mounting legs 50 and the second fixing legs 60b do not have to extend in directions perpendicular to each other.

[0157] The first and second fixing mounting legs 60a and 60b may each have a plate-like or linear (rod-like) shape, for example. In this case, the first and second fixing mounting legs 60a and 60b may each have a partially bent shape.

[0158] Only one first fixing mounting leg 60a and one second fixing mounting leg 60b may be provided, as shown in FIG. 7, or multiple first fixing mounting legs 60a and multiple second fixing mounting legs 60b may be provided.

[0159] The capacitor bank of the present invention is characterized by comprising: the capacitor of the present invention; and the mounting object to which the lead terminals of the capacitor and the mounting legs are welded.

[0160] Fig. 9 is a schematic perspective view of an example of a capacitor bank of the present invention. Fig. 10 is a schematic perspective view of the capacitor bank shown in Fig. 9 from a different direction than Fig. 9. Fig. 11 is a schematic view of the capacitor bank shown in Figs. 9 and 10 as viewed from the second surface side of the exterior case.

[0161] The capacitor bank 100 shown in FIGS. 9, 10, and 11 includes a plurality of capacitors 1B (see FIGS. 7 and 8), a first bus bar 70a, and a second bus bar 70b.

[0162] The first bus bar 70a and the second bus bar 70b are included in the mounting object on which the plurality of capacitors 1B are mounted.

[0163] The first bus bar 70a and the second bus bar 70b are stacked in the first direction D1. More specifically, the first bus bar 70a is located closer to the capacitor 1B than the second bus bar 70b in the first direction D1. In other words, the second bus bar 70b is located on the opposite side of the first bus bar 70a from the capacitor 1B in the first direction D1.

[0164] The first bus bar 70a and the second bus bar 70b may be made of a metal such as copper.

[0165] An insulating member 80 is provided between the first bus bar 70a and the second bus bar 70b to ensure insulation therebetween.

[0166] The insulating member 80 may be made of a resin or the like.

[0167] 9 and 11, the first bus bar 70a and the insulating member 80 are both hollowed out in some areas. In the hollowed-out areas of the first bus bar 70a and the insulating member 80, the second bus bar 70b is exposed from the first bus bar 70a and the insulating member 80 as exposed portions 71b.

[0168] Each of the plurality of capacitors 1B is mounted on a mounting object including first bus bar 70a and second bus bar 70b on the mounting surface 34 side of outer case 30B. More specifically, this is as follows.

[0169] As shown in Figures 9 and 11, in each capacitor 1B, the first lead-out terminal 20a is welded to the first bus bar 70a, and the second lead-out terminal 20b is welded to the second bus bar 70b, in this case, the exposed portion 71b of the second bus bar 70b.

[0170] 10 and 11, in each capacitor 1B, the mounting legs 50 are welded to the first bus bar 70a. When the capacitor 1B is in a standalone state, the mounting legs 50 are electrically insulated from the first lead-out terminals 20a, but when the capacitor 1B is in a capacitor bank 100 state, the mounting legs 50 are electrically connected to the first lead-out terminals 20a via the first bus bar 70a.

[0171] As described above, in the capacitor bank 100, the first lead-out terminal 20a, the second lead-out terminal 20b, and the mounting legs 50 of each capacitor 1B are connected by welding to the mounting object including the first bus bar 70a and the second bus bar 70b. Therefore, in the capacitor bank 100, each capacitor 1B is firmly fixed to the mounting object. This improves the vibration and impact resistance of the capacitor bank 100 in which multiple capacitors 1B are mounted on the mounting object.

[0172] Furthermore, the capacitor bank 100 having the above-described configuration can be manufactured inexpensively.

[0173] 11, in the capacitor bank 100, the first lead-out terminal 20a, the second lead-out terminal 20b, and the mounting legs 50 of each capacitor 1B preferably protrude beyond the mounting surface 34 of the outer case 30B in the first direction D1. In this case, in the capacitor bank 100, a gap G is provided between the mounting surface 34 of the outer case 30B of each capacitor 1B and the mounting object, in this case, the first bus bar 70a.

[0174] As shown in FIG. 11 , in the capacitor bank 100, the connecting members 90 are preferably provided in the gaps G so as to contact the mounting surface 34 of the exterior case 30B of each capacitor 1B and the first bus bar 70a. In this case, in the capacitor bank 100, each capacitor 1B and the first bus bar 70a are also connected via the connecting members 90. For example, using a heat dissipation paste as the connecting members 90 makes it easy to achieve the desired heat dissipation performance of each capacitor 1B. Furthermore, using an underfill adhesive as the connecting members 90 makes it possible to sufficiently firmly fix each capacitor 1B, and in particular the exterior case 30B of each capacitor 1B, to the first bus bar 70a.

[0175] The capacitors 1B are mechanically connected to each other as follows.

[0176] Fig. 12 is a schematic enlarged view of a portion of the capacitor bank shown in Fig. 10. Fig. 13 is a schematic view of a portion of the capacitor bank shown in Fig. 12 as viewed from the first surface side of the exterior case.

[0177] 12 and 13, in the capacitor bank 100, the first fixing mounting leg 60a of one capacitor 1B and the second fixing mounting leg 60b of the other capacitor 1B are welded together in adjacent capacitors 1B. As shown in Fig. 13, in the capacitor bank 100, the first fixing mounting leg 60a and the second fixing mounting leg 60b are provided at different height positions in the first direction D1, and the surfaces of the first fixing mounting leg 60a and the second fixing mounting leg 60b that face each other in the first direction D1 are welded together.

[0178] As described above, in the capacitor bank 100, adjacent capacitors 1B, particularly adjacent outer cases 30B, are welded together via the first fixing mounting legs 60a and the second fixing mounting legs 60b. Therefore, in the capacitor bank 100, adjacent capacitors 1B, particularly adjacent outer cases 30B, are firmly connected together. This improves the vibration and impact resistance of the capacitor bank 100 when multiple capacitors 1B are mechanically connected together.

[0179] 12, in the capacitor bank 100, the first fixing mounting legs 60a and the second fixing mounting legs 60b are preferably provided at a different height in the first direction D1 from the mounting mounting legs 50. In this case, in the capacitor bank 100, each capacitor 1B, and in particular each outer case 30B, is fixed at multiple locations at different heights, thereby sufficiently improving vibration and shock resistance when multiple capacitors 1B are mechanically connected.

[0180] As shown in Fig. 12, it is preferable that the mounting legs 50 and the first fixing legs 60a extend in different directions in the capacitor bank 100. Furthermore, as shown in Fig. 12, it is preferable that the mounting legs 50 and the second fixing legs 60b extend in different directions in the capacitor bank 100. In this case, when manufacturing the capacitor bank 100, it becomes easier to weld the first fixing legs 60a and the second fixing legs 60b while welding the mounting legs 50 to the first bus bar 70a.

[0181] 12, in the capacitor bank 100, the mounting legs 50 may extend in the second direction D2, and the first and second fixing legs 60a, 60b may extend in the third direction D3. In this case, when manufacturing the capacitor bank 100, with multiple capacitors 1B lined up in the third direction D3, it becomes easier to weld the mounting legs 50 to the mounting object while welding the first and second fixing legs 60a, 60b.

[0182] The capacitor bank 100 has a plurality of capacitors 1B, but the number of capacitors 1B that the capacitor bank 100 has is not limited to six as shown in FIG. 9 and the like.

[0183] The capacitor bank 100 includes a plurality of capacitors 1B, but may include only one capacitor 1B.

[0184] In the capacitor bank 100, all of the multiple capacitors 1B may be replaced with capacitors 1A (see Figures 1, 2, 3, and 4), or some of them may be replaced with capacitors 1A.

[0185] In the capacitor bank 100, bus bars such as the first bus bar 70a and the second bus bar 70b are used as mounting objects, but other than bus bars, a substrate, a housing, etc. may also be used as mounting objects.

[0186] The capacitor of the present invention can improve the vibration and shock resistance when mounted on a mounting object, and is therefore useful as a smoothing capacitor for in-vehicle applications that require particularly high vibration and shock resistance.

[0187] The capacitor bank of the present invention can improve vibration and impact resistance when the capacitor of the present invention is mounted on an object to be mounted, and is therefore useful for power conversion devices (e.g., inverters) for automotive applications that require particularly high vibration and impact resistance.

[0188] The present specification discloses the following:

[0189] <1> a capacitor element having an element body and external electrodes provided on end surfaces of the element body; lead-out terminals electrically connected to the external electrodes and for connecting the capacitor element to a mounting object by welding; an outer case in which the capacitor element is housed so that the lead terminals protrude outward; a filling resin filled in the exterior case so as to embed the capacitor element, an outer surface of the exterior case includes a mounting surface that faces the mounting object in a first direction when the lead-out terminal is welded to the mounting object; mounting legs for welding and connecting the outer case to the mounting object on the mounting surface side are provided on the outer surface of the outer case; The capacitor is characterized in that the mounting legs are electrically insulated from the lead terminals and are made of the same type of metal material as the lead terminals.

[0190] <2> the mounting legs protrude beyond the mounting surface of the exterior case in the first direction; <1> The capacitor according to claim 1.

[0191] <3> a space is provided between the mounting surface of the exterior case and the mounting legs; <2> The capacitor according to claim 1.

[0192] <4> the mounting legs do not protrude from the exterior case when viewed from the first direction; <1> ~ <3> 10. The capacitor according to claim 9, wherein

[0193] <5> Fixing legs for welding the outer case to another outer case are further provided on the outer surface of the outer case at positions different from the mounting legs so as to be electrically insulated from the lead-out terminals. <1> ~ <4> 10. The capacitor according to claim 9, wherein

[0194] <6> the mounting legs and the fixing legs are provided at different height positions in the first direction; <5> The capacitor according to claim 1.

[0195] <7> The mounting legs and the fixing legs extend in different directions. <5> or <6> The capacitor according to claim 1.

[0196] <8> the mounting leg extends in a second direction perpendicular to the first direction; The fixing mounting leg extends in a third direction perpendicular to the first direction and the second direction. <7> The capacitor according to claim 1.

[0197] <9> <1> ~ <8> a capacitor according to any one of the above items; and the mounting object to which the lead terminals of the capacitor and the mounting legs are welded.

[0198] <10> An outer case for a capacitor for accommodating a capacitor element having an element body and external electrodes provided on end faces of the element body, and lead terminals electrically connected to the external electrodes and for connecting the capacitor element to a mounting object by welding, the lead terminals protruding outward, an outer surface of the exterior case includes a mounting surface that faces the mounting object in a first direction when the lead-out terminal is welded to the mounting object; The capacitor outer case is characterized in that the outer surface of the outer case is provided with mounting legs for welding and connecting the outer case to the mounting object on the mounting surface side. [Explanation of symbols]

[0199] 1A, 1B capacitors 10 Capacitor element 11 Base 12a 1st external electrode 12b 2nd external electrode 13a First metallized film 13b Second metallized film 14a First dielectric film 14aa: First main surface of first dielectric film 14ab: second main surface of first dielectric film 14b Second dielectric film 14ba: First main surface of second dielectric film 14bb: second main surface of second dielectric film 15a 1st metal layer 15b 2nd metal layer 20a First lead-out terminal 20b 2nd extraction terminal 30A, 30B outer case 31 Aperture 32 First side of outer case 33 Second side of outer case 34 Mounting surface of outer case 35a 1st Rib 35aa First surface of first rib 35b 2nd rib 35c 3rd rib 40 Filled Resin 50 Mounting feet 60a First fixed mounting leg 60b Second fixing mounting leg 70a 1st bus bar 70b Second bus bar 71b Exposed portion of second bus bar 80 Insulating material 90 Connecting member 100 Capacitor Bank D1 1st direction D2 2nd direction D3 Third direction F space G Gap

Claims

1. a capacitor element having an element body and external electrodes provided on end surfaces of the element body; lead-out terminals electrically connected to the external electrodes and for connecting the capacitor element to a mounting object by welding; an outer case in which the capacitor element is housed so that the lead-out terminals protrude outward; a filling resin filled in the exterior case so as to embed the capacitor element, an outer surface of the exterior case including a mounting surface that faces the mounting object in a first direction when the lead terminal is welded to the mounting object; mounting legs for welding the outer case to the mounting surface of the outer case are provided on the outer surface of the outer case, the mounting legs are electrically insulated from the lead terminals, are made of the same metal material as the lead terminals, and protrude beyond the mounting surface of the exterior case in the first direction; A capacitor characterized in that a space is provided between the mounting surface of the exterior case and the mounting legs.

2. A capacitor element having an element body and external electrodes provided on end faces of the element body; lead-out terminals electrically connected to the external electrodes and for connecting the capacitor element to a mounting object by welding; an outer case in which the capacitor element is housed so that the lead-out terminals protrude outward; a filling resin filled in the exterior case so as to embed the capacitor element, an outer surface of the exterior case including a mounting surface that faces the mounting object in a first direction when the lead terminal is welded to the mounting object; mounting legs for welding the outer case to the mounting surface of the outer case are provided on the outer surface of the outer case, The mounting legs are electrically insulated from the lead-out terminals, are made of the same type of metal material as the lead-out terminals, and do not protrude from the outer case when viewed from the first direction.

3. The capacitor according to claim 1 , wherein the mounting legs do not protrude from the exterior case when viewed from the first direction.

4. The capacitor according to any one of claims 1 to 3, wherein fixing mounting legs for welding the outer case to another outer case are further provided on the outer surface of the outer case at positions different from the mounting mounting legs so as to be electrically insulated from the lead-out terminals.

5. The capacitor according to claim 4 , wherein the mounting legs and the fixing legs are provided at different height positions in the first direction.

6. The capacitor according to claim 4 , wherein the mounting legs and the fixing legs extend in different directions.

7. The mounting leg extends in a second direction perpendicular to the first direction, The capacitor according to claim 6 , wherein the fixing mounting legs extend in a third direction perpendicular to the first direction and the second direction.

8. A capacitor according to any one of claims 1 to 3; and the mounting object to which the lead terminals and the mounting legs of the capacitor are welded.

9. An outer case for a capacitor for accommodating a capacitor element having an element body, external electrodes provided on end faces of the element body, and lead terminals electrically connected to the external electrodes and for connecting the capacitor element to a mounting object by welding, the lead terminals protruding outward, an outer surface of the exterior case including a mounting surface that faces the mounting object in a first direction when the lead terminal is welded to the mounting object; mounting legs for welding the outer case to the mounting surface of the outer case are provided on the outer surface of the outer case, the mounting legs protrude beyond the mounting surface of the exterior case in the first direction; The capacitor outer case is characterized in that a space is provided between the mounting surface of the outer case and the mounting attachment legs.

10. An outer case for a capacitor for storing a capacitor element therein, the capacitor element having a base body, an external electrode provided on an end face of the base body, and a lead terminal electrically connected to the external electrode and for connecting the capacitor element to an object to be mounted by welding, the lead terminal protruding outward, an outer surface of the exterior case including a mounting surface that faces the mounting object in a first direction when the lead terminal is welded to the mounting object; mounting legs for welding the outer case to the mounting surface of the outer case are provided on the outer surface of the outer case, The capacitor outer case is characterized in that the mounting legs do not protrude from the outer case when viewed from the first direction.

11. An outer case for a capacitor as described in Claim 9, wherein the mounting legs for implementation do not protrude from the outer case when viewed from the first direction.

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