Processing equipment

Abstract

To clean the front side and the back side of a wafer without causing the front side and the back side of the wafer and the holding surface of a chuck table to be contacted and without turning over the front side and the back side of the wafer after the edge trimming, and reduce the degree in which the progress of the entire process is limited due to the progress of a cleaning process.SOLUTION: A processing device includes a first transfer unit that transfers a wafer to a holding table, a cutting unit that cuts the wafer held by suction on the holding table, a first cleaning unit having a cleaning edge clamping mechanism and cleaning the back side of the cut wafer, a second transfer unit having a second transfer edge clamping mechanism and transferring the wafer between the holding table and the first cleaning unit, a second cleaning unit that has a movement restricting mechanism and cleans the front side of the wafer that has been cleaned by the first cleaning unit, and a third transfer unit having a third transfer edge clamping mechanism and transferring the wafer between the first cleaning unit and the second cleaning unit.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing device for removing a chamfer on the front side of a wafer having chamfered portions formed on the outer periphery of each of the front and back sides, or removing the chamfered portions on both the front and back sides. [Background technology]

[0002] For example, silicon wafers are used in the manufacture of semiconductor device chips. Chamfers are formed on the outer periphery of the front and back surfaces of the wafer to prevent chipping or other damage to the outer periphery of the wafer during processing or transportation.

[0003] In the manufacturing process of semiconductor device chips, after devices are formed on the front side of the wafer, the back side of the wafer is ground to thin the semiconductor device chips. However, when the wafer is thinned to, for example, half or less of its original thickness, a sharp edge (also called a knife edge) is formed on the outer periphery of the wafer.

[0004] Sharp edges can lead to chipping or breakage of the thinned wafer, so before grinding the backside, the chamfered portion on the front side is removed (also called edge trimming) (see, for example, Patent Document 1).

[0005] In edge trimming, for example, the entire backside of the wafer is suction-held on the holding surface of a chuck table, and the chuck table is rotated in a predetermined direction while a cutting blade is cut into the outer periphery of the front side of the wafer to a predetermined depth. However, holding the entire backside by suction on the holding surface can cause contamination of the backside, which can cause problems in subsequent processes.

[0006] For example, if the cleanliness of a wafer that has undergone edge trimming is relatively low and fine dust (particles) are attached to the backside of the wafer, cracks will occur in the wafer when another wafer is bonded to the backside of the wafer.

[0007] Therefore, in order to improve the cleanliness of the wafer, it has been proposed to limit the area in which the wafer is suction-held during edge trimming to an annular area near the outer periphery on the back surface side, and further to clean the annular area near the outer periphery on the back surface side together with the front surface side of the wafer after edge trimming (see, for example, Patent Document 2).

[0008] Specifically, edge trimming is first performed on the front side while the annular region near the outer periphery of the back side is held by suction with an annular suction part, and then the central portion of the back side of the wafer is held by suction with a chuck table having a holding surface with an outer diameter smaller than that of the annular suction part, exposing the area of ​​the back side that was held by the annular suction part.

[0009] In this state, the chuck table is rotated while cleaning water is sprayed onto the backside of the wafer to clean it. However, even with this method, the center of the backside comes into contact with the holding surface, which can cause minute scratches on the backside or particles to adhere to it.

[0010] Therefore, in order to avoid contact between the back side of the wafer and the holding surface, a cleaning device has been proposed that uses four rollers to clamp the wafer in the radial direction of the wafer and rotates each roller to clean the wafer while rotating it (see, for example, Patent Document 3).

[0011] However, if the backside of the wafer is cleaned first using this cleaning device and then the frontside, the time required to clean the wafer using the cleaning device becomes longer, and the progress of the entire processing process is limited by the progress of the cleaning process in the cleaning device.In addition, a separate mechanism for flipping the wafer over is required. [Prior art documents] [Patent documents]

[0012] [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-173961 [Patent Document 2] Japanese Patent Application Laid-Open No. 2012-64872 [Patent Document 3] Japanese Patent Application Laid-Open No. 2015-179742 Summary of the Invention [Problem to be solved by the invention]

[0013] The present invention has been made in consideration of the above problems, and has an object to clean the front and back sides of the wafer after edge trimming without bringing the front and back sides into contact with the holding surface of a chuck table and without turning the wafer over, and to reduce the degree to which the progress of the entire processing process is restricted by the progress of the cleaning process. [Means for solving the problem]

[0014] According to one aspect of the present invention, there is provided a processing apparatus for removing a chamfered portion on a front surface side of a wafer, or the chamfered portion on both the front surface side and the back surface side opposite the front surface, the processing apparatus comprising: a cassette table on which a cassette containing the wafer is placed; a carry-in / out robot capable of transferring the wafer to and from the cassette placed on the cassette table; a holding table that holds the wafer by suction; a first transport unit that transports the wafer removed by the carry-in / out robot to the holding table; a cutting unit having a spindle that cuts and removes the chamfered portion on the front surface side of the wafer held by suction on the holding table, or the chamfered portion on both the front surface side and the back surface side, with a cutting blade attached to the spindle; and a cleaning edge clamping mechanism that cleans the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer, a first cleaning unit that cleans the back side of the wafer that has been cut by the cutting unit; a second transport unit that has a second transport edge clamp mechanism for transporting the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer, and that transports the wafer between the holding table and the first cleaning unit; a second cleaning unit that has a movement restricting mechanism for cleaning the wafer while restricting the movement of the wafer within a predetermined range without holding the wafer by suction, and that cleans the front side of the wafer that has been cleaned by the first cleaning unit; and a third transport edge clamp mechanism for transporting the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer, and that transports the wafer between the first cleaning unit and the second cleaning unit, Applicable The wafer support device has a disk-shaped base member located at a position lower than the annular support surface, and a disk-shaped push-up portion provided in a disk-shaped recess located at the center in the radial direction of the base member, and when the push-up portion does not push up the wafer, the upper surface of the push-up portion is ApplicableAlthough the push-up portion is located at a position lower than the annular support surface, when the push-up portion pushes up the wafer, The thrust portion Air or water is discharged from the flow path provided on the upper surface. The thrust portion Supply to the upper surface At the same time, the thrust-up portion is raised. So, The thrust portion The upper surface does not come into direct contact with the wafer due to the air or water layer, and the pushing-up portion pushes up the wafer. The second cleaning unit has a disk-shaped base on which the movement restriction mechanism is provided, and the movement restriction mechanism has a plurality of pins provided on the upper surface of the base for supporting the outer periphery of the back side of the wafer, three or more hook-shaped restriction members provided on the sides of the base for restricting movement of the wafer in the radial direction and thickness direction of the base, and three or more drive mechanisms for moving the restriction members provided corresponding to each other, and each restriction member has an edge restriction portion capable of contacting the outermost periphery of the wafer, and an upper surface restriction portion provided in a manner protruding a predetermined amount from the upper end of the edge restriction portion toward the center of the base. A processing device is provided.

[0015] Preferably, the transfer robot has a robot hand provided with an edge clamping mechanism for clamping and holding the edge of the wafer.

[0016] Preferably, the first transfer unit has a first transfer edge clamp mechanism for transferring the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer.

[0018] Preferably, at least one of the second transfer unit and the third transfer unit has a water supply unit capable of supplying water to the wafer.

[0019] According to another aspect of the present invention, there is provided a processing apparatus for removing a chamfered portion on a front surface side of a wafer having a chamfered portion formed on the outer periphery of each of the front surface side and the back surface side located opposite the front surface, or the chamfered portion on both the front surface side and the back surface side, the processing apparatus comprising: a cassette table on which a cassette containing the wafer is placed; a carry-in / out robot capable of carrying the wafer into and out of the cassette placed on the cassette table; a holding table that holds the wafer by suction; a first transport unit that transports the wafer carried out by the carry-in / out robot to the holding table; a cutting unit having a spindle that cuts and removes the chamfered portion on the front surface side of the wafer held by suction on the holding table, or the chamfered portion on both the front surface side and the back surface side, with a cutting blade attached to the spindle; and a cleaning edge clamp mechanism for cleaning the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer, and a second transfer unit having a second transfer edge clamp mechanism for transporting the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer, and for transporting the wafer between the holding table and the first cleaning unit; a second cleaning unit having a movement restricting mechanism for cleaning the wafer while restricting the movement of the wafer within a predetermined range without holding the wafer by suction, and for cleaning the front side of the wafer cleaned in the first cleaning unit; and a third transfer unit having a third transfer edge clamp mechanism for transporting the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer, and for transporting the wafer between the first cleaning unit and the second cleaning unit, wherein at least one of the second transfer unit and the third transfer unit has an ultrasonic vibrator and an ultrasonic water discharge nozzle for discharging water ultrasonically vibrated by the ultrasonic vibrator onto the wafer. The second and third transfer units each have an edge clamp mechanism that clamps and holds the edge of the wafer at at least three points in the radial direction of the wafer while transferring the wafer. A processing device is provided.

[0020] Preferably, the second transport edge clamping mechanism of the second transport unit and the third transport edge clamping mechanism of the third transport unit have the same structure.

[0021] Preferably, the second cleaning unit has a disk-shaped base with the movement restriction mechanism provided on its outer periphery, and the movement restriction mechanism has a plurality of pins provided on the upper surface of the base for supporting the outer periphery of the back side of the wafer, and hook-shaped restriction members provided at at least three locations on the side of the base for restricting movement of the wafer in the radial direction of the base and the thickness direction of the base. Preferably, the holding table has an annular support portion having an annular support surface provided with an annular groove and capable of supporting the outer periphery of the wafer, and a suction path connected to the annular groove for suction-holding the outer periphery of the back side of the wafer supported by the annular support surface, and a push-up portion located inside the annular support portion for pushing up the back side of the wafer supported by the annular support surface and lifting the wafer above the annular support surface. [Effects of the Invention]

[0022] A processing apparatus according to one aspect of the present invention includes two cleaning units for cleaning wafers: a first cleaning unit for cleaning the backside of the wafer cut by the cutting unit, and a second cleaning unit for cleaning the frontside of the wafer cleaned by the first cleaning unit.

[0023] The first cleaning unit has a cleaning edge clamping mechanism for cleaning the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer, and the second cleaning unit has a movement restriction mechanism for cleaning the wafer while restricting the movement of the wafer within a predetermined range without holding the wafer by suction.

[0024] Therefore, after edge trimming of the wafer, the back side of the wafer can be cleaned without contacting the back side of the wafer with the holding surface of the chuck table, and further, the front side of the wafer can be cleaned without contacting the front side of the wafer with the holding surface of the chuck table, and there is no need to turn the wafer over.

[0025] In addition, while the front side of the first wafer is being cleaned in the second cleaning unit, the back side of the second wafer can be cleaned in the first cleaning unit, which reduces the degree to which the progress of the cleaning process limits the progress of the entire processing process compared to when one cleaning unit is used to sequentially clean the back and front sides of the wafers.

[0026] Furthermore, the second and third transfer units, which respectively transfer wafers, transfer the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer. This reduces contact with the front and back sides of the wafer during transfer, thereby preventing scratches and particle adhesion to the front and back sides of the wafer during transfer.

[0027] In this way, after edge trimming, the wafer is transported while its edge is clamped, the back side of the wafer is cleaned in the first cleaning unit having a cleaning edge clamping mechanism, and the front side of the wafer is cleaned in the second cleaning unit having a movement restriction mechanism, thereby increasing the cleanliness of the wafer after edge trimming. [Brief explanation of the drawings]

[0028] [Figure 1] FIG. [Figure 2] FIG. 2(A) is a perspective view of the wafer, and FIG. 2(B) is a cross-sectional view of the wafer. [Figure 3] FIG. 3(A) is a perspective view of the carry-in / out robot, and FIG. 3(B) is a front view of the robot hand. [Figure 4] FIG. 4(A) is a diagram showing center alignment, and FIG. 4(B) is a diagram showing wafer orientation adjustment. [Figure 5] FIG. 5(A) is a front view of the first transfer unit, and FIG. 5(B) is a diagram showing how the first transfer unit transfers wafers. [Figure 6] FIG. [Figure 7]FIG. 7(A) is a partial cross-sectional side view of the holding table etc. during edge trimming, and FIG. 7(B) is a partial cross-sectional side view of the holding table etc. during lifting of the wafer. [Figure 8] FIG. [Figure 9] FIG. 9(A) is a partial cross-sectional side view of the second transfer edge clamp mechanism and the like, and FIG. 9(B) is a diagram showing wafer cleaning in the second transfer unit. [Figure 10] FIG. 2 is a partial cross-sectional side view of the ultrasonic water discharge nozzle. [Figure 11] FIG. 11(A) is a perspective view of the holding unit, and FIG. 11(B) is a side view of the holding unit. [Figure 12] FIG. 12(A) is a perspective view of a holding unit holding a wafer, and FIG. 12(B) is a side view of the holding unit holding a wafer. [Figure 13] FIG. 13(A) is a top view of the holding unit during cleaning, and FIG. 13(B) is a side view of the holding unit during cleaning. DETAILED DESCRIPTION OF THE INVENTION

[0029] An embodiment according to one aspect of the present invention will be described with reference to the accompanying drawings. Fig. 1 is a perspective view of a processing apparatus 2 that performs edge trimming on the outer periphery of a wafer 11. Note that the X-axis direction, Y-axis direction, and Z-axis direction shown in Fig. 1 are perpendicular to one another.

[0030] The processing device 2 has a rectangular parallelepiped base 4 including a frame (not shown), a cover member, etc. The base 4 supports each component of the processing device 2. Two cassette tables 6a and 6b are provided at the front end of the base 4 (one end in the Y-axis direction).

[0031] A cassette 8 containing a plurality of wafers 11 is placed on one (or both) of the two cassette tables 6a, 6b. The cassette 8 is provided with a plurality of shelves (not shown) on which the wafers 11 are placed.

[0032] Here, the wafer 11 will be described with reference to Figures 2(A) and 2(B). Figure 2(A) is a perspective view of the wafer 11, and Figure 2(B) is a cross-sectional view of the wafer 11. The wafer 11 is, for example, a semiconductor wafer made mainly of silicon.

[0033] However, there are no limitations on the material, structure, size, etc. of the wafer 11. For example, wafers or substrates made of other semiconductor materials, glass, SOI (Silicon on Insulator), etc. may also be used.

[0034] The diameter of the wafer 11 is, for example, 300 mm (12 inches). A plurality of planned division lines 13 are set on the front surface 11a side of the wafer 11. A device 15 such as an IC (Integrated Circuit) is formed in each rectangular area defined by the plurality of planned division lines 13.

[0035] However, there are no limitations on the type, number, shape, structure, size, arrangement, etc. of the devices 15. The wafer 11 may be a wafer on which no devices 15 are formed (for example, a bare wafer).

[0036] A peripheral excess area 17b, which is substantially flat and does not include any devices 15, exists on the periphery of the device area 17a, surrounding the device area 17a where a plurality of devices 15 are formed. The back surface 11b, which is located on the opposite side to the front surface 11a, is substantially flat.

[0037] 2(B), a chamfered portion 11c (also called a bevel portion) is formed on each outer periphery of the front surface 11a and the back surface 11b. In the thickness direction of the wafer 11, an outermost periphery 11d that defines the diameter of the wafer 11 exists between the chamfered portion 11c on the front surface 11a side and the chamfered portion 11c on the back surface 11b side.

[0038] The outermost periphery 11d is located, for example, at a position approximately halfway through the thickness of the wafer 11. In this embodiment, the chamfered portions 11c on the front surface 11a side and the back surface 11b side and the outermost periphery 11d are collectively referred to as the edge 11e of the wafer 11.

[0039] No resin protective tape is attached to the back surface 11b of the wafer 11, and the back surface 11b is exposed. The wafer 11 is accommodated in the cassette 8 with, for example, the front surface 11a facing upward and the back surface 11b facing downward.

[0040] Returning to Fig. 1, a rectangular opening 4a is formed behind the two cassette tables 6a, 6b (the other side in the Y-axis direction). A horizontally articulated carry-in / out robot 10 having an open-loop structure is provided in the opening 4a. Fig. 3(A) is a perspective view of the carry-in / out robot 10.

[0041] The carry-in / out robot 10 carries out unprocessed wafers 11 from the cassette 8 and carries processed wafers 11 into the cassette 8. The carry-in / out robot 10 has multiple (e.g., three) arms, and a robot hand 12 is attached to the tip of the uppermost arm.

[0042] The thickness of the robot hand 12 in the Z-axis direction is thin enough to allow it to enter between two wafers 11 arranged on adjacent shelves in the height direction of the cassette 8. The robot hand 12 has two elongated longitudinal portions 12a arranged approximately parallel to each other.

[0043] The base ends of the two longitudinal portions 12a are connected by a connecting portion 12b. One clamp claw 12c is provided on each of the distal end and proximal end of each longitudinal portion 12a. In the example shown in Fig. 3(A), a total of four clamp claws 12c are provided.

[0044] However, it is sufficient that three or more clamping claws 12c are provided, and the number of clamping claws 12c is not limited to four. Fig. 3(B) is a front view of the robot hand 12. As shown in Fig. 3(B), the clamping claw 12c has a waisted shape in which small diameter circles of a truncated cone and an inverted truncated cone are connected.

[0045] The outer surface of the clamp claw 12c is coated with a fluororesin such as polytetrafluoroethylene (PTFE). A pin (not shown) is provided at the bottom of the clamp claw 12c, and this pin is movable along an elongated hole 12d (see FIG. 3(A)) formed in the upper surface of the longitudinal portion 12a.

[0046] For example, the four clamp claws 12c are moved by a first drive unit (not shown) along the elongated hole 12d by approximately the same distance. The four clamp claws 12c, the first drive unit, etc. constitute an edge clamp mechanism 12e that holds the wafer 11.

[0047] The first drive unit includes, for example, a first actuator such as an air cylinder that moves the two clamp claws 12c on the tip side along the longitudinal portion 12a, and a second actuator such as an air cylinder that moves the two clamp claws 12c on the base side along the longitudinal portion 12a.

[0048] To hold the wafer 11 with the robot hand 12, the two clamp claws 12c at the tip end and the two clamp claws 12c at the base end are brought close to each other, and the edge 11e of the wafer 11 is clamped in the radial direction using the four clamp claws 12c.

[0049] In this way, the robot hand 12 can hold the wafer 11 without contacting the front surface 11 a and the back surface 11 b, thereby preventing scratches on the front surface 11 a and the back surface 11 b and particles from adhering to them. Note that instead of the clamp claws 12 c, the wafer 11 may be sucked and held in a non-contact manner by a Bernoulli-type non-contact suction pad (not shown).

[0050] The wafer 11 carried out from the cassette 8 by the carrying-in / out robot 10 is transferred to the alignment table 14 (see FIG. 1). As shown in FIG. 4(A), the alignment table 14 has a substantially square table 14a.

[0051] A camera (not shown) is provided on the table 14a to use red light or near-infrared light to detect the notch position of the wafer 11. Four position adjustment units 16 are provided on the table 14a in an area different from the camera.

[0052] The four position adjustment units 16 are arranged at approximately equal intervals on the periphery of a circle centered at a point on the top surface of the table 14a. The table 14a has elongated holes (not shown) formed in accordance with the movement directions of the position adjustment units 16.

[0053] Each position adjustment unit 16 is configured to be movable by approximately the same distance along the radial direction of this circle by a second drive unit (not shown). The second drive unit has, for example, a disk-shaped rotating plate.

[0054] An air cylinder for rotating the rotating plate is connected to the rotating plate. The rotating plate is also provided with a plurality of protrusions at approximately equal intervals along the circumferential direction of the rotating plate, protruding in the radial direction of the rotating plate. A linear arm is rotatably connected to the tip of each protrusion via a pin.

[0055] A position adjustment unit 16 is fixed to the tip of the arm. When the rotating plate is rotated by an air cylinder, each position adjustment unit 16 can be moved the same distance so that they move closer to or farther away from each other. Note that the mechanism of the second drive unit is not limited to this example, and other mechanisms may also be used.

[0056] The position adjustment unit 16 has a disk-shaped support base 16a. The support base 16a has a built-in motor (not shown), and a cylindrical roller 16b made of synthetic rubber such as urethane rubber is provided at the upper end of the motor shaft.

[0057] 4(A) is a diagram showing the center alignment of the wafer 11. When performing the center alignment, the carry-in / out robot 10 transports the wafer 11 to the alignment table 14 so that the outer periphery of the wafer 11 is supported by the four support bases 16a.

[0058] At this time, the area on the rear surface 11b side of the wafer 11 that is within a predetermined length (for example, 2.5 mm) inward from the outermost periphery 11d in the radial direction of the wafer 11 contacts the support base 16a.

[0059] After transportation, each support base 16a is moved toward the center of the upper surface of the table 14a to adjust the center position of the surface 11a of the wafer 11 to a predetermined position, and the edge 11e of the wafer 11 is clamped on all sides by the four rollers 16b.

[0060] After center alignment, the rollers 16b are rotated in a predetermined direction to rotate the wafer 11, while the outer periphery of the wafer 11 is observed with a camera. Figure 4(B) shows the adjustment of the orientation of the wafer 11. When the notch 11f reaches the predetermined position, the rotation of the rollers 16b is stopped, thereby adjusting the orientation of the wafer 11 to the predetermined orientation.

[0061] The wafer 11, whose position and orientation have been adjusted, is transported by a first transport unit 18 (see FIG. 1) to a loading / unloading area A located behind the alignment table 14. The first transport unit 18 is movable along a guide rail 20 that is arranged substantially parallel to the Y-axis direction.

[0062] A moving block 22 is slidably attached to the guide rail 20 (see FIG. 5(B)). A nut portion (not shown) is provided on the back side of the moving block 22, and a ball screw (not shown) arranged substantially parallel to the Y-axis direction is rotatably connected to this nut portion.

[0063] The moving block 22 has an actuator (not shown) such as an air cylinder. The movable part of the actuator moves up and down along the Z-axis direction (see FIG. 5(A)). The base end of the arm 24 is connected to the movable part.

[0064] A hand 26 is provided at the tip of the arm 24. The hand 26 has a rectangular parallelepiped palm 26a. One finger 26b is provided on one side surface of the tip of the palm 26a and on both side surfaces adjacent to the one side surface.

[0065] In a top view, the three fingers 26b are arranged radially around one point on the palm 26a, and the tips of the fingers 26b are spaced apart from one another by approximately 120° in the circumferential direction of a circle centered on the point (see FIG. 5(B)). The number of fingers 26b is not limited to three, as long as it is three or more.

[0066] As shown in Fig. 5(A), a moving pin 28 that is movable along the longitudinal direction of the finger portion 26b is provided at the tip of the lower surface of the finger portion 26b. Fig. 5(A) is a front view of the first transport unit 18.

[0067] Each moving pin 28 is configured to be movable by approximately the same distance along the radial direction of a predetermined circle by a third drive unit (not shown) having an air cylinder, a rotating plate, a link, etc. Note that the mechanism of the third drive unit is not limited to this example, and other mechanisms may also be used.

[0068] The lower end of the movable pin 28 is provided with a clamp claw 30. The clamp claw 30 has a constricted shape formed by connecting small diameter circles of a truncated cone and an inverted truncated cone. The outer surface of the clamp claw 30 is coated with a fluororesin such as PTFE. The hand unit 26 in this example has three sets of clamp claws 30 and movable pins 28.

[0069] The three sets of clamping claws 30, the movable pin 28, the third drive unit, etc. constitute a first transport edge clamping mechanism 32 for transporting the wafer 11 while clamping and holding the edge 11e of the wafer 11 at at least three points in the radial direction.

[0070] The arm 24 arranged above the table 14a is lowered, and each clamp claw 30 is positioned at a different position on the XY plane from the position adjustment unit 16 and at approximately the same height as the wafer 11, and then the moving pins 28 are brought closer to each other.

[0071] The first transfer unit 18 can hold the wafer 11 with the three clamp claws 30 without contacting the front surface 11a and the back surface 11b, thereby preventing scratches on the front surface 11a and the back surface 11b and adhesion of particles.

[0072] The first transfer unit 18 may clamp the wafer 11 with four or more clamp claws 30. The first transfer unit 18 may also suction and hold the wafer 11 in a non-contact manner using a Bernoulli-type non-contact suction pad (not shown) instead of the clamp claws 30.

[0073] 5(B) is a diagram showing how the wafer 11 is transported by the first transport unit 18. After clamping the wafer 11, the arm 24 is raised and the moving block 22 is slid in the Y-axis direction. The first transport unit 18 transports the wafer 11 to the holding table 36 in the loading / unloading area A (see FIG. 1).

[0074] The holding table 36 is moved by a ball screw type X-axis movement mechanism (not shown) between a loading / unloading area A and a cutting area B, which are arranged along the X-axis direction. As shown enlarged in Figure 6, the holding table 36 has a cylindrical annular support part 38 made of ceramics.

[0075] 6 is a perspective view of the holding table 36, etc. The upper surface of the annular support portion 38 is an annular support surface 38a that can support the outer periphery on the back surface 11b side of the wafer 11. The outer periphery on the back surface 11b that contacts the annular support surface 38a is within a range of a predetermined length (for example, 2.5 mm) inward from the outermost periphery 11d in the radial direction of the wafer 11.

[0076] An annular groove 38b is provided in the annular support surface 38a. In this example, the annular groove 38b is formed continuously around the entire circumference of the annular support surface 38a. As shown in Figure 7(A), a suction path 40 is connected to the annular groove 38b.

[0077] The suction path 40 is connected to a suction source 44, such as an ejector, via a solenoid valve 42. When the solenoid valve 42 is opened while the suction source 44 is operating, a negative pressure is generated in the annular groove 38b. This negative pressure suction-holds the outer periphery of the back surface 11b side of the wafer 11 supported by the annular support surface 38a.

[0078] A disk-shaped base member 46 is provided inside the annular support portion 38. An upper surface 46a of the base member 46 is fixed at a position lower than the annular support surface 38a. A disk-shaped recess 46b is formed in the center of the base member 46.

[0079] A disk-shaped push-up portion 48 is disposed in the recess 46b. An actuator (not shown), such as an air cylinder, is connected to the bottom of the push-up portion 48, and the push-up portion 48 can be raised and lowered along the Z-axis direction.

[0080] When the push-up portion 48 is in the lowered state, the upper surface 48a of the push-up portion 48 is approximately flush with the upper surface 46a of the base member 46 (see Figure 7(A)), and when the push-up portion 48 is in the raised state, the upper surface 48a is at a higher position than the annular support surface 38a (see Figure 7(B)).

[0081] A flow path 50 is formed in approximately the center of the upper surface 48a so as to penetrate the push-up portion 48 along the thickness direction of the push-up portion 48. The flow path 50 is connected via an electromagnetic valve 52 to a fluid supply source 54 such as an air supply source or a pure water supply source.

[0082] The air supply source is, for example, connected to an air compressor and has an air tank filled with clean air from which particles etc. have been removed. The pure water supply source is, for example, connected to a pump and has a water tank in which pure water is stored.

[0083] When the push-up portion 48 is raised above the annular support surface 38a, air or pure water is supplied to the upper surface 48a to form an air layer or a water layer (neither is shown) on the upper surface 48a.

[0084] As a result, the push-up portion 48 can push up the back surface 11b side of the wafer 11, whose outer periphery is supported by the annular support surface 38a, via an air layer or a water layer, without the upper surface 48a coming into direct contact with the wafer 11.

[0085] A first rotary drive source (not shown), such as a motor, is provided below the holding table 36. When the first rotary drive source is operated, the holding table 36 rotates around a rotation axis that is approximately parallel to the Z-axis direction.

[0086] 1, a cutting unit 56 is provided above the holding table 36. The cutting unit 56 has a cylindrical spindle housing 58 whose longitudinal portion is arranged substantially parallel to the Y-axis direction.

[0087] A ball screw type cutting feed unit (not shown) that moves the spindle housing 58 along the Z-axis direction is connected to the cutting unit 56. A ball screw type Y-axis direction moving unit (not shown) is connected to the cutting feed unit.

[0088] The cutting unit 56 can move in the Z-axis direction and the Y-axis direction relative to the holding table 36 by the cutting feed unit and the Y-axis movement unit. A cylindrical spindle 60 (see FIG. 7(A)) is rotatably housed in the spindle housing 58.

[0089] A second rotation drive source (not shown), such as a motor, is provided at the base end of the spindle 60, and a cutting blade 62 is attached to the tip end of the spindle 60. The cutting blade 62 is, for example, a washer-type (hubless-type) blade that is clamped between a mount flange and a pressing flange, but it may also be a hub-type blade.

[0090] The cutting blade 62 is covered from above by a blade cover 64 (see FIG. 1). As shown in FIG. 1, the blade cover 64 is provided with a plurality of cutting water nozzles 66. The plurality of cutting water nozzles 66 supply cutting water such as pure water to the processing point where the cutting blade 62 and the wafer 11 come into contact with each other.

[0091] A microscope camera unit 68 is provided on one side in the X-axis direction of the blade cover 64. The microscope camera unit 68 has a predetermined optical system such as a lens, and an imaging element such as a CMOS (Complementary Metal-Oxide-Semiconductor) or CCD (Charge-Coupled Device) image sensor.

[0092] In the cutting process in which the wafer 11 is cut, first, the holding table is placed in the carry-in / carry-out area A. Then, the first transfer unit transfers the wafer 11 and places it on the holding table .

[0093] Next, by opening the solenoid valve 42, the outer periphery of the back surface 11b side of the wafer 11 is suction-held by the holding table 36. After the holding table 36 is moved to the cutting area B, the holding table 36 is rotated at a predetermined speed while the microscope camera unit 68 captures images of at least three locations on the outer periphery of the wafer 11.

[0094] This detects the deviation (center deviation) between the center of the surface 11a and the center of the holding table 36. Then, while supplying cutting water to the processing point, the lower end of the cutting blade 62, which is rotated at a predetermined rotation speed, cuts into the chamfered portion 11c on the surface 11a (see FIG. 7(A)).

[0095] For example, the lower end of the cutting blade 62 is cut to a depth of approximately half the thickness of the wafer 11. The holding table 36 is rotated, and the relative position of the lower end of the cutting blade 62 with respect to the holding table 36 is adjusted in accordance with the detected center deviation, thereby cutting and removing the chamfered portion 11c on the front surface 11a side (edge ​​trimming).

[0096] 7(A) is a partial cross-sectional side view of the holding table 36 etc. during edge trimming. In edge trimming, the lower end of the cutting blade 62 may be cut into the annular support surface 38a to remove the chamfered portion 11c on both the front surface 11a side and the back surface 11b side.

[0097] After the edge trimming is completed, the holding table 36 is moved to the loading / unloading area A. Then, as shown in Fig. 7(B), the electromagnetic valve 42 is closed and the electromagnetic valve 52 is opened, forming an air layer or a water layer (neither is shown) on the upper surface 48a, and the push-up portion 48 is lifted upward.

[0098] 7(B) is a partial cross-sectional side view of the holding table 36 etc. during lifting. The wafer 11 lifted by the push-up part 48 is transported to the cleaning area C by the second transport unit 70 waiting above the loading / unloading area A.

[0099] 8 is an enlarged perspective view of the cleaning area C. First, the second transport unit 70 provided in the cleaning area C will be described. The second transport unit 70 has a rectangular parallelepiped arm 72. A moving block 74 is connected to the base end of the arm 72.

[0100] A third rotation drive source (not shown), such as a motor, is built into the moving block 74. The third rotation drive source rotates the arm 72 within a range of a predetermined angle (for example, approximately 90 degrees) (see double-headed arrow 74a in FIG. 8).

[0101] An actuator (not shown), such as an air cylinder, for moving the moving block 74 along the Z-axis direction is connected to the lower part of the moving block 74. The operation of the actuator causes the arm 72 to move along the Z-axis direction (see the double-headed arrow 74b in FIG. 8).

[0102] A ball screw type X-axis direction moving unit (not shown) is provided below the actuator. The X-axis direction moving unit moves moving block 74 along the X-axis direction, thereby moving arm 72 along the X-axis direction (see double arrow 74c in FIG. 8).

[0103] A hand 76 is provided at the tip of the arm 72. The hand 76 has a rectangular parallelepiped palm 76a. One finger 76b is provided on one side surface of the tip of the palm 76a and on both side surfaces adjacent to the one side surface.

[0104] The three fingers 76b are arranged radially from a single point on the palm 76a in a top view, and the tips of the fingers 76b are spaced apart from each other by approximately 120° in the circumferential direction of a circle centered on the single point. The number of fingers 76b is not limited to three, and may be three or more.

[0105] 9(A), movable pins 78 are provided at the tips of the undersides of the fingers 76b, and are movable along the longitudinal direction of the fingers 76b. Each movable pin 78 is configured to be movable by approximately the same distance along the radial direction of a predetermined circle by a fourth drive unit (not shown) having an air cylinder, a rotating plate, a link, etc. Note that the mechanism of the fourth drive unit is not limited to this example, and other mechanisms may also be used.

[0106] A clamp claw 80 is provided at the lower end of the movable pin 78. The clamp claw 80 has a constricted shape formed by connecting small diameter circles of a truncated cone and an inverted truncated cone. The outer surface of the clamp claw 80 is coated with a fluororesin such as PTFE. The hand unit 76 in this example has three sets of clamp claws 80 and movable pins 78.

[0107] The three sets of clamping claws 80, the movable pin 78, the fourth drive unit, etc. constitute a second transport edge clamp mechanism 82 for transporting the wafer 11 while clamping and holding the edge 11e of the wafer 11 at at least three points in the radial direction of the wafer 11.

[0108] 9(A) is a partial cross-sectional side view of the second transport edge clamp mechanism 82, etc. The second transport unit 70 lowers the arm 72 and moves the moving pins 78 closer to each other, thereby clamping the wafer 11 on the holding table 36 using the three clamp claws 80.

[0109] The second transfer unit 70 may clamp the wafer 11 with four or more clamp claws 80. The second transfer unit 70 may also suction and hold the wafer 11 in a non-contact manner using a Bernoulli-type non-contact suction pad (not shown) instead of the clamp claws 80.

[0110] In either case, the second transfer unit 70 can hold the wafer 11 without contacting the front surface 11a and the back surface 11b, thereby preventing scratches on the front surface 11a and the back surface 11b and adhesion of particles thereto.

[0111] A flow path 76a1 that passes through the palm portion 76a is formed in the hand portion 76. A pure water supply source 88 that supplies pure water 86 (see FIG. 9B) via a tube 84 is connected to the flow path 76a1.

[0112] The pure water supply source 88 has, for example, a water tank in which pure water is stored. A pump is connected to the water tank to send pure water 86 to the tube 84. A solenoid valve 90 is connected to the tube 84, and when the solenoid valve 90 is opened, pure water is supplied downward from the flow path 76a1.

[0113] The flow path 76a1, the tube 84, the pure water supply source 88, the solenoid valve 90, etc. constitute a water supply unit 92 for supplying pure water 86 to the wafer 11 when the wafer 11 is transported by the second transport unit 70 (see Figure 9(A)).

[0114] If cutting debris and the like adhering to the wafer 11 after edge trimming dries and sticks, it may not be possible to remove it even by cleaning, but the pure water 86 supplied from the flow path 76a1 can prevent the wafer 11 from drying out during transportation.

[0115] An ultrasonic water-discharging nozzle 96 is fixed to the palm portion 76a via a fastener 94. Figure 10 is a partial cross-sectional side view of the ultrasonic water-discharging nozzle 96. The ultrasonic water-discharging nozzle 96 has a cylindrical housing 96a.

[0116] A cylindrical first space 96b1 is formed inside the housing 96a. A disk-shaped ultrasonic vibrator 98 is provided at the top of the first space 96b1. The ultrasonic vibrator 98 has piezoelectric ceramics such as lead zirconate titanate (PZT).

[0117] A power supply unit 100 is connected to the ultrasonic vibrator 98. The power supply unit 100 includes an oscillator (not shown) that generates high-frequency power for driving the ultrasonic vibrator 98. A predetermined value of power, for example, between 40 W and 100 W, is supplied from the power supply unit 100 to the ultrasonic vibrator 98.

[0118] The ultrasonic vibrator 98 converts this power into mechanical vibrations, which vibrate at a predetermined frequency of 500 kHz to 1.5 MHz. A flow path 102 connected to the first space 96b1 is provided on the side of the housing 96a. The pure water supply source 88 is connected to the flow path 102 via an electromagnetic valve 104.

[0119] A large diameter portion of a second space 96b2 having an inverted truncated cone shape is connected to the lower portion of the first space 96b1. The small diameter portion of the second space 96b2 corresponds to an opening 96b3 exposed on the bottom surface of the housing 96a.

[0120] The pure water supplied to the first space 96b1 is vibrated by an ultrasonic vibrator 98, and the pure water is sprayed from an opening 96b3 located on the bottom surface of the housing 96a at a predetermined flow rate of, for example, 0.5 L / min or more and 1.5 L / min or less.

[0121] 9(B) is a diagram showing cleaning of the wafer 11 in the second transfer unit 70. During transfer, pure water 86 is supplied to the wafer 11 from the flow path 76a1, and pure water 98a to which ultrasonic vibrations have been applied is discharged from the ultrasonic water discharge nozzle 96 onto the wafer 11.

[0122] By discharging the pure water 98a to which ultrasonic vibrations have been applied, the wafer 11 can be cleaned during transportation. Cleaning with the pure water 98a can contribute to reducing the time, flow rate, etc. required for cleaning in the front surface side cleaning unit 140, which will be described later.

[0123] 8, other components arranged in the cleaning region C will now be described. A circular opening 4b having a diameter equal to or larger than that of the wafer 11 is formed near the second transfer unit 70. A back surface side cleaning unit (first cleaning unit) 106 is provided in the opening 4b.

[0124] The back surface cleaning unit 106 has a cylindrical roll brush 108. The roll brush 108 has a cylindrical base. The length between the two circular faces of the cylindrical base is approximately the same as the diameter of the opening 4b. Fiber bundles made of a resin such as polyamide synthetic resin are discretely fixed to the side of the base. The multiple bundles are uniformly arranged across the entire side of the base.

[0125] The roll brush 108 is disposed in the opening 4b so that its rotation axis is approximately parallel to the XY plane. A cleaning nozzle 110 that sprays pure water (not shown) upward is disposed in the opening 4b near the roll brush 108.

[0126] In addition, in an area within the opening 4b different from the roll brush 108 and the cleaning nozzle 110, one or more suction units (not shown) for sucking the back surface 11b side of the wafer 11 without contact may be provided.

[0127] Four rotation units 112 are provided around the opening 4b at approximately equal intervals along the circumferential direction of the opening 4b (note that two rotation units 112 are shown in FIG. 8). Similar to the position adjustment unit 16, the rotation unit 112 has a disk-shaped support base 112a.

[0128] Around the opening 4b, elongated holes (not shown) are formed in accordance with the movement direction of the rotation unit 112, and each support base 112a is configured to be movable by approximately the same distance along the radial direction of a predetermined circle by a fifth drive unit (not shown) having an air cylinder, a rotating plate, a link, etc. Note that the mechanism of the fifth drive unit is not limited to this example, and other mechanisms may also be used.

[0129] The support base 112a incorporates a motor (not shown), and a cylindrical roller 112b made of synthetic rubber such as urethane rubber is provided on the upper end of the shaft of the motor.

[0130] The four rotation units 112, the fifth drive unit, etc. constitute a cleaning edge clamping mechanism 114 for cleaning the wafer 11 by clamping and holding the edge 11e of the wafer 11 at four points (at least three points) in the radial direction of the wafer 11.

[0131] After the edge trimming, the wafer 11 is transferred by the second transfer unit 70 from the holding table 36 to the back surface side cleaning unit 106, where the back surface 11b side of the wafer 11 is cleaned. In the back surface side cleaning step, first, the second transfer unit 70 transfers the wafer 11 so that the outer periphery of the wafer 11 is supported by the four support stages 112a.

[0132] After the transfer, each support stage 112a moves toward the center of the opening 4b, thereby placing the wafer 11 inside the opening 4b, and clamping the four sides of the edge 11e with the four rollers 112b.

[0133] At this time, a range on the back surface 11b of the wafer 11 that is within a predetermined length (e.g., 2.5 mm) from the outermost periphery 11d in the radial direction of the wafer 11 contacts the support base 112a. By rotating each roller 112b in a predetermined direction, the wafer 11 is rotated around a rotation axis that is approximately parallel to the Z-axis direction (see FIG. 4(B) for a similar example).

[0134] While rotating the wafer 11 and spraying pure water from a cleaning nozzle 110, the bristles of the rotating roll brush 108 are brought into contact with the rear surface 11b of the wafer 11 in the radial direction, thereby cleaning the rear surface 11b.

[0135] In the back surface cleaning process, the wafer 11 is not held by suction on the holding surface of the chuck table using negative pressure, but the wafer 11 with its edge 11e clamped is rotated, thereby cleaning the entire back surface 11b, including the area of ​​the back surface 11b that is in contact with the annular support portion 38.

[0136] After the predetermined cleaning time, the spraying of the pure water and the rotation of the roll brush 108 and the roller 112b are stopped. After the back surface side cleaning process, the third transfer unit 120 transfers the wafer 11 from the back surface side cleaning unit 106 to the front surface side cleaning unit (second cleaning unit) 140.

[0137] Here, a description will be given of the third transport unit 120. The third transport unit 120 has an arm 122. A moving block 124 is connected to the base end of the arm 122.

[0138] An actuator (not shown), such as an air cylinder, is connected to the lower part of the moving block 124. By the operation of the actuator, the arm 122 moves along the Z-axis direction (see the double-headed arrow 124a in FIG. 8).

[0139] A ball screw type Y-axis movement unit (not shown) that moves the moving block 124 along the Y-axis direction is provided below the actuator. The Y-axis movement unit moves the arm 122 along the Y-axis direction (see double arrow 124b in FIG. 8).

[0140] A hand 126 is provided at the tip of the arm 122. One finger 126b is provided on one side surface of the tip of the palm 126a and on both side surfaces adjacent to the one side surface. The number of finger 126b may be three or more.

[0141] A movable pin (not shown) that can move along the longitudinal direction of the finger 126b is provided at the tip of the lower surface of the finger 126b. Each movable pin is configured to be movable by approximately the same distance along the radial direction of a predetermined circle by a sixth drive unit (not shown) that has an air cylinder, a rotating plate, a link, etc. Note that the mechanism of the sixth drive unit is not limited to this example, and other mechanisms may also be used.

[0142] Clamp claws 128 are provided at the lower ends of the moving pins. The clamp claws 128 have a constricted shape formed by connecting small diameter circles of a truncated cone and an inverted truncated cone. The outer surfaces of the clamp claws 128 are coated with a fluororesin such as PTFE. The hand unit 126 in this example has three sets of clamp claws 128 and moving pins.

[0143] The three sets of clamping claws 128, the movable pin, the sixth drive unit, etc. constitute a third transport edge clamp mechanism 130 for transporting the wafer 11 while clamping and holding the edge 11e on the back surface 11b side of the wafer 11 at at least three points in the radial direction of the wafer 11.

[0144] In this way, the third transfer edge clamping mechanism 130 has the same structure as the second transfer edge clamping mechanism 82. Also, a flow path (not shown) is formed in the palm portion 126a, and the tube 132, the solenoid valve (not shown), the pure water supply source 88, etc. constitute a water supply unit 134 for supplying pure water.

[0145] The third transfer unit 120 has an ultrasonic water discharge nozzle 136 having the same configuration as the ultrasonic water discharge nozzle 96. The ultrasonic water discharge nozzle 136 is the same as the ultrasonic water discharge nozzle 96 described above, and therefore a description thereof will be omitted.

[0146] The operation of the third transfer unit 120 will be described. By lowering the arm 122 and bringing the moving pins closer to each other, the third transfer unit 120 clamps the wafer 11 positioned above the opening 4b in the radial direction of the wafer 11 using the three clamp claws 128.

[0147] The third transfer unit 120 may clamp the wafer 11 with four or more clamp claws 128. The third transfer unit 120 may also suction and hold the wafer 11 in a non-contact manner using a Bernoulli-type non-contact suction pad (not shown) instead of the clamp claws 128.

[0148] In any case, the third transfer unit 120 can hold the wafer 11 without contacting the front surface 11a and the back surface 11b, thereby preventing scratches on the front surface 11a and the back surface 11b and adhesion of particles thereto.

[0149] During transportation, the wafer 11 is prevented from drying by the pure water 86, and the wafer 11 can be cleaned by discharging the pure water to which ultrasonic vibrations have been applied from the ultrasonic water discharge nozzle 136. This allows the time and flow rate required for cleaning to be further reduced in the front surface side cleaning unit 140, which will be described later.

[0150] A disk-shaped front surface side cleaning unit (second cleaning unit) 140 is provided in front of the back surface side cleaning unit 106. A sliding first shutter (not shown) is provided between the front surface side cleaning unit 140 and the back surface side cleaning unit 106.

[0151] In addition, a sliding second shutter (not shown) is provided between the front surface side cleaning unit 140 and the carry-in / out robot 10. In this way, the front surface side cleaning unit 140 is isolated by the first and second shutters and is placed in a space where a high degree of cleanliness can be maintained.

[0152] The front surface side cleaning unit 140 has a disk-shaped holding unit 142 for holding the wafer 11. A fourth rotation drive source (not shown) such as a motor is provided below the holding unit 142.

[0153] The fourth rotary drive source rotates the holding unit 142 around a rotation axis approximately parallel to the Z-axis direction at a low speed (e.g., a predetermined value of 50 rpm or more and 100 rpm or less) or at a high speed (e.g., a predetermined value of 1000 rpm or more and 2000 rpm or less).

[0154] An elevator mechanism (not shown) is provided below the fourth rotary drive source. The elevator mechanism positions the holding unit 142 above the cylindrical cover member 140a when loading and unloading the wafer 11 (see FIG. 8), and positions the holding unit 142 in the internal space of the cover member 140a when cleaning the wafer 11.

[0155] 11(A) is a perspective view of the holding unit 142. The holding unit 142 includes a disk-shaped base 144. The upper surface of the base 144 is coated with a fluororesin such as PTFE.

[0156] A plurality of (six in this embodiment) support pins 146 are arranged at predetermined intervals along the outer periphery of the upper surface of the base 144. Each support pin 146 is made of a fluororesin such as PTFE.

[0157] The multiple support pins 146 have their upper ends set to the same height (e.g., approximately 20 mm) relative to the upper surface of the base 144, and support the outer periphery of the back surface 11b of the wafer 11 (see Figure 12(B), etc.).

[0158] The outer periphery of the back surface 11b that comes into contact with the support pins 146 is within a range of a predetermined length (e.g., 2.5 mm) inward from the outermost periphery 11d in the radial direction of the wafer 11. Each support pin 146 makes point contact with the back surface 11b within this range, and therefore the contact area can be significantly reduced compared to when the wafer is held by suction on the holding surface of a chuck table.

[0159] A plurality of (three in this embodiment) hook-shaped restricting members 148 are arranged at predetermined intervals on the side of the base 144 along the outer periphery of the base 144. The number of restricting members 148 is not limited to three, and may be three or more.

[0160] A drive mechanism 150 such as an air actuator is provided at the lower end of the restricting member 148. The drive mechanism 150 moves the restricting member 148 between a closed position (see FIG. 11(A)) and an open position (see FIG. 11(B)).

[0161] 11(B) is a side view of the holding unit 142 when the regulating member 148 is in the open position. The regulating member 148 has a rectangular parallelepiped edge regulating portion 148a made of fluororesin such as PTFE.

[0162] When in the closed position, the edge restriction portions 148a come into contact with the outermost peripheral portion 11d of the wafer 11 supported by the support pins 146, and restrict movement of the wafer 11 in the radial direction of the base 144. For example, three edge restriction portions 148a can clamp the edge 11e of the wafer 11 in the radial direction.

[0163] A rectangular parallelepiped upper surface restricting portion 148b made of a fluororesin such as PTFE is provided at the upper end of the edge restricting portion 148a in a manner that it protrudes a predetermined amount (for example, 0.5 mm) toward the center of the base 144. When in the closed position, the upper surface restricting portion 148b restricts movement of the wafer 11 supported by the support pins 146 in the thickness direction of the base 144.

[0164] When the base 144 is stationary, the support pins 146 support the wafer 11, and the regulating member 148 is in the closed position, a gap 148c is formed between the lower surface of the upper surface regulating portion 148b and the surface 11a of the wafer 11 (see Figure 12(B)).

[0165] The multiple support pins 146, the multiple regulating members 148, and the drive mechanism 150 constitute a movement regulating mechanism 152 provided on the outer periphery of the base 144, which regulates the movement of the wafer 11 in the radial and thickness directions of the base 144 within a predetermined range when the base 144 rotates.

[0166] 8, a cleaning nozzle 154 is provided above the center of the base 144, with its nozzle facing downward. A chemical liquid supply source (not shown) is connected to the cleaning nozzle 154.

[0167] The chemical liquid supply source has a tank (not shown) that stores the chemical liquid 154a (see FIG. 13(B)). The chemical liquid 154a is ozone water, a mixture of hydrofluoric acid and nitric acid (so-called fluoronitric acid), citric acid water, or the like. A solenoid valve (not shown) that controls the supply of the chemical liquid 154a to the cleaning nozzle 154 is provided in a flow path between the chemical liquid supply source and the cleaning nozzle 154.

[0168] A swing mechanism 156 is provided at a position a predetermined distance to the side of the base 144. The swing mechanism 156 has a rectangular parallelepiped base 156a that is arranged substantially parallel to the Z-axis direction. A drive source (not shown), such as a motor, is connected to the bottom of the base 156a.

[0169] The drive source swings the base 156a within a predetermined angular range in the XY plane. An actuator (not shown) is provided below the drive source to raise and lower the drive source and the base 156a along the Z-axis direction.

[0170] The upper end of base 156a is located above base 144, and the base end of arm 158 is connected to the upper end so as to protrude toward the center of base 144. A cleaning tool 160 is provided on the bottom surface of the tip of arm 158.

[0171] The cleaning tool 160 is a sponge that is approximately flat and disc-shaped and has relatively high flexibility and water absorption. The sponge is made of, for example, PVA (polyvinyl alcohol). The cleaning tool 160 may also be a sponge brush with multiple protrusions on the underside of the disc.

[0172] The front surface side cleaning step will be described below. First, the first shutter is opened, and the third transfer unit 120 transfers the wafer 11, whose back surface 11b side has been cleaned in the back surface side cleaning unit 106, to the front surface side cleaning unit 140, whose regulating member 148 is in the open position.

[0173] Thereafter, the first shutter is closed, and the restricting member 148 is set to the closed position. At this time, the edge restricting portion 148a contacts the outermost periphery 11d of the wafer 11, and the wafer 11 is held in the radial direction of the wafer 11.

[0174] At this time, the upper surface restricting portion 148b is located above the outer periphery on the front surface 11a side. Fig. 12(A) is a perspective view of the holding unit 142 holding the wafer 11, and Fig. 12(B) is a side view of the holding unit 142 holding the wafer 11.

[0175] After holding the wafer 11, the holding unit 142 is placed in the internal space of the cover member 140a. Then, while the base 144 is rotated in a predetermined direction at a low speed (e.g., 60 rpm), the chemical solution 154a is sprayed onto the front surface 11a from the cleaning nozzle 154. At the same time, the arm 158 is swung within a predetermined angle range with the cleaning tool 160 in contact with the front surface 11a.

[0176] Even if the wafer 11 is slightly lifted in the thickness direction (Z-axis direction) of the base 144 when the base 144 rotates, the upward movement of the wafer 11 is restricted by the upper surface restricting portion 148b.

[0177] In this way, substantially the entire front surface 11a side of the wafer 11 is cleaned while restricting the movement of the wafer 11 without suction-holding the wafer 11 on the holding surface of the chuck table. Figure 13(A) is a top view of the holding unit 142 during cleaning, and Figure 13(B) is a side view of the holding unit 142 during cleaning.

[0178] After cleaning of the front surface 11a side is completed, spraying of the chemical solution 154a is stopped, the cleaning tool 160 is retracted, and the base 144 is rotated in a predetermined direction at high speed (for example, 2000 rpm) to dry the wafer 11.

[0179] In this way, spin drying can be performed following cleaning of the front surface 11a side in the front surface side cleaning unit 140. After spin drying, the base 144 is moved above the cover member 140a, the second shutter is opened, and the transfer robot 10 transfers the wafer 11 from the front surface side cleaning unit 140 to the cassette 8.

[0180] The operation of each component of the processing device 2 is controlled by a control unit 162 (see FIG. 1). The control unit 162 is configured by a computer including, for example, a processor (processing device) represented by a CPU (Central Processing Unit), a main memory device, and an auxiliary memory device.

[0181] The main storage device includes, for example, a dynamic random access memory (DRAM), a static random access memory (SRAM), a read only memory (ROM), etc. The auxiliary storage device includes, for example, a flash memory, a hard disk drive, a solid state drive, etc.

[0182] The auxiliary storage device stores software including a predetermined program. The functions of the control unit 162 are realized by operating the processing device and the like in accordance with this software.

[0183] In this embodiment, by using the back surface side cleaning unit 106 and the front surface side cleaning unit 140, the back surface 11b and the front surface 11a of the wafer 11 after edge trimming can be cleaned without contacting the back surface 11b and the front surface 11a with the holding surface of the chuck table. In addition, there is no need to turn the wafer 11 over.

[0184] Furthermore, the back surface 11b side is cleaned in the back surface side cleaning unit 106, and then the front surface 11a side is cleaned in the front surface side cleaning unit 140, so that while the front surface 11a side of the first wafer 11 is being cleaned in the front surface side cleaning unit 140, the back surface 11b side of the second wafer 11 can be cleaned in the back surface side cleaning unit 106.

[0185] Therefore, compared to the case where the back surface 11b side and the front surface 11a side of the wafer 11 are sequentially cleaned using one cleaning unit, the degree to which the progress of the entire processing process is restricted by the progress of the cleaning process can be reduced.

[0186] The entire processing process includes cutting processing for edge trimming, water supply and ultrasonic cleaning during transport in the second transport unit 70 and the third transport unit 120, a back side cleaning process in the back side cleaning unit 106, and a front side cleaning process in the front side cleaning unit 140.

[0187] Furthermore, the second transfer unit 70 and the third transfer unit 120 transfer the wafer 11 while clamping and holding the edge 11e of the wafer 11 at at least three points in the radial direction of the wafer 11. Since contact with the front surface 11a and the back surface 11b during transfer can be suppressed, it is possible to prevent scratches from being formed on the front surface 11a and the back surface 11b and particles from adhering to them.

[0188] In this way, after edge trimming, the wafer 11 is transported while clamping the edge 11e, the back surface 11b side is cleaned in the back surface side cleaning unit 106 having the cleaning edge clamping mechanism 114, and the front surface 11a side is cleaned in the front surface side cleaning unit 140 having the movement restricting mechanism 152, thereby increasing the cleanliness of the wafer 11 after edge trimming.

[0189] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the object of the present invention.

[0190] In the above embodiment, an example has been described in which the second transport unit 70 has the water supply unit 92, and the third transport unit 120 has the water supply unit 134. However, either the second transport unit 70 or the third transport unit 120 may have a water supply unit.

[0191] In the above embodiment, an example has been described in which the second conveying unit 70 has the ultrasonic water discharge nozzle 96, and the third conveying unit 120 has the ultrasonic water discharge nozzle 136. However, either the second conveying unit 70 or the third conveying unit 120 may have the ultrasonic water discharge nozzle. [Explanation of symbols]

[0192] 2: Processing equipment, 4: Base, 4a, 4b: Opening 6a, 6b: Cassette table, 8: Cassette, 10: Carry-in / out robot 11: wafer, 11a: front surface, 11b: back surface 11c: chamfered portion, 11d: outermost periphery, 11e: edge, 11f: notch 12: Robot hand, 12a: Long arm, 12b: Connection part 12c: Clamping claw, 12d: Slot, 12e: Edge clamping mechanism 13: planned division line, 15: device, 17a: device area, 17b: peripheral excess area 14: Alignment table, 14a: Table 16: position adjustment unit, 16a: support base, 16b: roller 18: First transport unit, 20: Guide rail, 22: Moving block, 24: Arm 26: hand portion, 26a: palm portion, 26b: finger portion 28: moving pin, 30: clamping claw, 32: first conveying edge clamping mechanism 36: holding table, 38: annular support portion, 38a: annular support surface, 38b: annular groove 40: suction path, 42: solenoid valve, 44: suction source 46: base member, 46a: upper surface, 46b: recess, 48: push-up portion, 48a: upper surface 50: flow path, 52: solenoid valve, 54: fluid supply source 56: Cutting unit, 58: Spindle housing, 60: Spindle 62: Cutting blade, 64: Blade cover, 66: Cutting water nozzle 68: microscope camera unit, 70: second transport unit, 72: arm 74: Moving block, 74a, 74b, 74c: Double arrow 76: hand portion, 76a: palm portion, 76a1: flow path, 76b: finger portion 78: moving pin, 80: clamping claw, 82: second conveying edge clamping mechanism 84: Tube, 86: Pure water, 88: Pure water supply source, 90: Solenoid valve 92: Water supply unit, 94: Fastener, 96: Ultrasonic water discharge nozzle 96a: housing, 96b1: first space, 96b2: second space, 96b3: opening 98: ultrasonic vibrator, 98a: pure water 100: power supply unit, 102: flow path, 104: solenoid valve 106: Back side cleaning unit (first cleaning unit), 108: Roll brush 110: cleaning nozzle, 112: rotation unit, 112a: support base, 112b: roller 114: Cleaning edge clamp mechanism 120: third transport unit, 122: arm, 124: moving block 124a, 124b: double arrow 126: hand portion, 126a: palm portion, 126b: finger portion, 128: clamp claw 130: Third conveying edge clamp mechanism, 132: Tube, 134: Water supply unit 136: ultrasonic water discharge nozzle, 140: front surface side cleaning unit (second cleaning unit) 140a: Cover member, 142: Holding unit, 144: Base, 146: Support pin 148: Restriction member, 148a: Edge restriction portion, 148b: Upper surface restriction portion, 148c: Gap 150: driving mechanism, 152: movement restriction mechanism, 154: cleaning nozzle, 154a: chemical solution 156: swing mechanism, 156a: base, 158: arm, 160: cleaning tool 162: Control unit, A: Loading / unloading area, B: Cutting area, C: Cleaning area

Claims

1. A processing apparatus for removing a chamfered portion on a front surface side or both the front surface side and the back surface side of a wafer, the chamfered portion being formed on the outer periphery of each of the front surface side and the back surface side, the processing apparatus comprising: a cassette table on which a cassette containing the wafers is placed; a carry-in / out robot capable of carrying the wafer into and out of the cassette placed on the cassette table; a holding table that holds the wafer by suction; a first transfer unit that transfers the wafer carried out by the carry-in / out robot to the holding table; a cutting unit having a spindle, which cuts and removes the chamfered portion on the front surface side of the wafer held by suction on the holding table, or the chamfered portions on both the front surface side and the back surface side of the wafer, using a cutting blade attached to the spindle; a first cleaning unit having a cleaning edge clamping mechanism for cleaning the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer, and for cleaning the back side of the wafer cut by the cutting unit; a second transfer unit having a second transfer edge clamp mechanism for transferring the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer, and for transferring the wafer between the holding table and the first cleaning unit; a second cleaning unit having a movement restriction mechanism for cleaning the wafer in a state where the movement of the wafer is restricted within a predetermined range without suction holding the wafer, and for cleaning the front surface side of the wafer cleaned in the first cleaning unit; a third transfer unit having a third transfer edge clamp mechanism for transferring the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer, and for transferring the wafer between the first cleaning unit and the second cleaning unit; The holding table is an annular support portion including an annular support surface; a disk-shaped base member located inside the annular support portion in the radial direction of the annular support portion, the upper surface of the base member being located lower than the annular support surface; a disc-shaped push-up portion provided in a disc-shaped recess located at a radial center portion of the base member, When the push-up portion does not push up the wafer, the upper surface of the push-up portion is located at a position lower than the annular support surface. When the push-up portion pushes up the wafer, air or water is supplied to the upper surface of the push-up portion from a flow path provided on the upper surface of the push-up portion, and the push-up portion is raised, so that the push-up portion pushes up the wafer without the upper surface of the push-up portion coming into direct contact with the wafer due to the layer of air or water, the second cleaning unit has a disk-shaped base on which the movement restriction mechanism is provided, the movement restriction mechanism includes a plurality of pins provided on the upper surface of the base for supporting the outer periphery of the back surface side of the wafer, three or more hook-shaped restriction members provided on the sides of the base for restricting movement of the wafer in the radial direction and the thickness direction of the base, and three or more drive mechanisms for moving the restriction members provided corresponding to the restriction members, A processing apparatus characterized in that each regulating member has an edge regulating portion that can contact the outermost periphery of the wafer, and an upper surface regulating portion that is arranged in a manner that protrudes a predetermined amount from the upper end of the edge regulating portion toward the center of the base.

2. 2. The processing apparatus according to claim 1, wherein the transfer robot has a robot hand provided with an edge clamping mechanism for clamping and holding the edge of the wafer.

3. The processing apparatus according to claim 1 or 2, characterized in that the first transport unit has a first transport edge clamping mechanism for transporting the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer.

4. 4. The processing apparatus according to claim 1, wherein at least one of the second transfer unit and the third transfer unit has a water supply unit capable of supplying water to the wafer.

5. A processing apparatus for removing a chamfered portion on a front surface side or both the front surface side and the back surface side of a wafer, the chamfered portion being formed on the outer periphery of each of the front surface side and the back surface side, the processing apparatus comprising: a cassette table on which a cassette containing the wafers is placed; a carry-in / out robot capable of carrying the wafer into and out of the cassette placed on the cassette table; a holding table that holds the wafer by suction; a first transfer unit that transfers the wafer carried out by the carry-in / out robot to the holding table; a cutting unit having a spindle, which cuts and removes the chamfered portion on the front surface side of the wafer held by suction on the holding table, or the chamfered portions on both the front surface side and the back surface side of the wafer, using a cutting blade attached to the spindle; a first cleaning unit having a cleaning edge clamping mechanism for cleaning the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer, and for cleaning the back side of the wafer cut by the cutting unit; a second transfer unit having a second transfer edge clamp mechanism for transferring the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer, and for transferring the wafer between the holding table and the first cleaning unit; a second cleaning unit having a movement restriction mechanism for cleaning the wafer in a state where the movement of the wafer is restricted within a predetermined range without suction holding the wafer, and for cleaning the front surface side of the wafer cleaned in the first cleaning unit; a third transfer unit having a third transfer edge clamp mechanism for transferring the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer, and for transferring the wafer between the first cleaning unit and the second cleaning unit; At least one of the second transfer unit and the third transfer unit has an ultrasonic vibrator and an ultrasonic water discharge nozzle for discharging water to which ultrasonic vibrations have been applied from the ultrasonic vibrator onto the wafer; The processing apparatus is characterized in that the second transport unit and the third transport unit each have an edge clamping mechanism that transports the wafer while clamping and holding the edge of the wafer at at least three points in the radial direction of the wafer.

6. 6. The processing apparatus according to claim 1, wherein the second transport edge clamping mechanism of the second transport unit and the third transport edge clamping mechanism of the third transport unit have transport edge clamping mechanisms of the same structure.

7. the second cleaning unit has a disk-shaped base on the outer periphery of which the movement restriction mechanism is provided; The movement restriction mechanism includes: a plurality of pins provided on the upper surface of the base for supporting the outer periphery of the back surface side of the wafer; Hook-shaped restricting members are provided at least at three positions on the side of the base, and restrict movement of the wafer in the radial direction and the thickness direction of the base; 6. The processing apparatus according to claim 5, further comprising:

8. The holding table is an annular support part having an annular support surface provided with an annular groove and capable of supporting an outer periphery of the wafer, and a suction path connected to the annular groove and suction-holding the outer periphery of the back surface side of the wafer supported by the annular support surface; a push-up portion located inside the annular support portion and configured to push up the back surface of the wafer supported by the annular support surface, thereby lifting the wafer above the annular support surface; 6. The processing apparatus according to claim 5, further comprising:

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