Printed circuit board manufacturing method and printed circuit board

Abstract

To provide a method for manufacturing printed circuit boards that can easily manufacture different types of printed circuit boards, and the printed circuit boards.SOLUTION: In a mounting process S20, mounting components 8 are mounted at the same positions between when mounting the mounting components 8 on an AC-type printed circuit board 100A and when mounting the mounting components 8 on an A-type printed circuit board 100B. In this case, if the AC-type printed circuit board 100A and the A-type printed circuit board 100B are made separately, it is possible to mount mounting components on the AC-type printed circuit board 100A and the A-type printed circuit board 100B with the same mounting program in the mounting process S20. As a result, there is no need to switch the mounting program for the mounting components 8 when making different types of the printed circuit boards 100A and 100B. As described above, different types of the printed circuit boards 100A and 100B can be easily manufactured.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a method for manufacturing a printed circuit board and a printed circuit board. [Background technology]

[0002] There are two types of earth leakage circuit breakers: AC-type earth leakage circuit breakers, which detect leakage when it occurs in sine wave AC power, and A-type earth leakage circuit breakers, which can detect leakage even when it occurs in pulsating current that contains DC components in addition to sine wave AC. For example, in an electrical circuit equipped with a solar power generation system, the solar power generation system outputs DC power, so even if a leakage occurs before the conversion to AC, the use of an A-type earth leakage circuit breaker can effectively detect it. However, because it can also detect leakage in sine wave AC, it can also be used as an AC-type earth leakage circuit breaker (see, for example, Patent Document 1), and it is becoming increasingly popular because it can be installed in any environment. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-14478 Summary of the Invention [Problem to be solved by the invention]

[0004] As mentioned above, Type A earth leakage current circuit breakers are required to detect leakage current caused by pulsating currents, and are required to detect and interrupt current waveforms with a narrow waveform per wave, such as a delay angle of 135 degrees (JIS C8201-2-2). Because of this capability, Type A earth leakage current circuit breakers can malfunction in environments prone to noise with similar narrow waveform characteristics. Therefore, Type A earth leakage current circuit breakers could not be used as AC earth leakage current circuit breakers in such special environments. As such, there are environments where only AC earth leakage current circuit breakers can be used, and even though Type A earth leakage current circuit breakers can be used as AC earth leakage current circuit breakers, there was a certain demand for AC earth leakage current circuit breakers.

[0005] However, because the market size and absolute number of AC-type earth leakage circuit breakers are small, it has not been possible to reduce manufacturing costs, making them more expensive than Type A. On the other hand, in recent years, AC-type and Type A-type earth leakage detection circuits have been made into ICs and are becoming more compact, so that even if both are mounted on the same board, there is no longer a large increase in cost.

[0006] Here, for example, a common printed circuit board that combines an AC-type printed circuit board and an A-type printed circuit board can be prepared, and the positions of the mounted components on the AC-type printed circuit board and the positions of the mounted components on the A-type printed circuit board can be made different to manufacture the AC-type printed circuit board and the A-type printed circuit board. However, in this type of printed circuit board manufacturing method, it is necessary to change the mounting program for the mounted components between the AC-type printed circuit board and the A-type printed circuit board, which requires stopping the manufacturing line. Therefore, there is a need for a method to easily manufacture different types of printed circuit boards.

[0007] An object of the present disclosure is to provide a method for manufacturing a printed circuit board that can easily manufacture different types of printed circuit boards, and the printed circuit board. [Means for solving the problem]

[0008] A method for manufacturing a printed circuit board according to one aspect of the present disclosure is a method for manufacturing a printed circuit board for a ground fault circuit interrupter, and includes a printed circuit board preparation step for preparing one of a first printed circuit board and a second printed circuit board that is a different type from the first printed circuit board, and a mounting step for mounting components on one of the printed circuit boards, in which the components are placed in the same positions when mounting the components on the first printed circuit board and when mounting the components on the second printed circuit board.

[0009] According to this method for manufacturing printed circuit boards, in the mounting process, components are placed in the same positions when mounting components on the first printed circuit board and when mounting components on the second printed circuit board. In this case, if the first printed circuit board and the second printed circuit board are separately manufactured, in the mounting process, components can be mounted on the first printed circuit board and the second printed circuit board using the same mounting program. This eliminates the need to switch component mounting programs when manufacturing different types of printed circuit boards. As a result, different types of printed circuit boards can be easily manufactured.

[0010] In the printed circuit board preparation process, the first printed circuit board and the second printed circuit board may have the same circuit configuration, component configuration, and number of components, but different electrical path patterns may be formed. In this case, by separating the electrical path patterns between the first printed circuit board and the second printed circuit board, the printed circuit boards can be manufactured using the same mounting program.

[0011] In the printed circuit board preparation step, the first printed circuit board and the second printed circuit board may have different outer shapes, which makes it easy to visually distinguish the first printed circuit board from the second printed circuit board by their outer shapes.

[0012] In the printed circuit board preparation step, different visual information may be printed on the first printed circuit board and the second printed circuit board, so that the first printed circuit board and the second printed circuit board can be easily visually distinguished from each other by the visual information.

[0013] A printed circuit board according to one aspect of the present invention is a printed circuit board for a ground fault circuit interrupter, and comprises one of a first printed circuit board and a second printed circuit board of a different type from the first printed circuit board, and mounted components mounted on one of the printed circuit boards, and the mounted components are arranged in the same position on the first printed circuit board and the second printed circuit board.

[0014] This printed circuit board can provide the same functions and effects as the above-described method for manufacturing a printed circuit board. [Effects of the Invention]

[0015] According to the method for manufacturing a printed circuit board and the printed circuit board of the present disclosure, different types of printed circuit boards can be easily manufactured. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a circuit block diagram showing an example of a printed circuit board of an earth leakage breaker according to the present invention. [Figure 2] 1 is a circuit block diagram showing an example of a printed circuit board of an earth leakage breaker according to the present invention. [Figure 3] FIG. 1 is a plan view showing the physical configuration of an AC-type printed circuit board. [Figure 4] FIG. 1 is a plan view showing the physical configuration of an A-type printed circuit board. [Figure 5] 1(a) is a schematic plan view of an AC-type printed circuit board, and FIG. 1(b) is a schematic plan view of an A-type printed circuit board. [Figure 6] 1A to 1C are process diagrams showing a method for manufacturing a printed circuit board according to the present invention. [Figure 7] 10A to 10C are process diagrams showing a method for manufacturing a printed circuit board according to a comparative example. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. Figures 1 and 2 are circuit block diagrams showing an example of a printed circuit board 100 of an earth leakage circuit breaker according to the present invention, and show printed circuit boards 100A and 100B of earth leakage circuit breakers equipped with three terminals. Figure 1 shows an AC-type printed circuit board 100A (first printed circuit board), and Figure 2 shows an A-type printed circuit board 100B (second printed circuit board).

[0018] As shown in Fig. 1, an earth leakage interruption circuit is assembled to three electric circuits M arranged between a power supply side terminal 10 and a load side terminal 11. The printed circuit boards 100A and 100B include a zero-phase current transformer 1, contacts 2, a tripping coil 3, an amplifier 4, earth leakage determination circuits (AC-type earth leakage determination circuit 5a, A-type earth leakage determination circuit 5b), an output unit 7, and mounted components 8.

[0019] The zero-phase current transformer 1 is a current transformer that is installed in the electric circuit M to be detected and outputs a zero-phase current. The contacts 2 are a mechanism that opens and closes the electric circuit M. The tripping coil 3 is a coil that opens the contacts 2. The amplifier 4 amplifies the zero-phase current output by the zero-phase current transformer 1. The leakage current determination circuit 5 is a circuit that determines the occurrence of conduction. The leakage current determination circuit 5a includes an AC-type leakage current determination circuit 5a that determines leakage in the AC-type printed circuit board 100A, and an A-type leakage current determination circuit 5b that determines leakage in the A-type printed circuit board 100B. The output unit 7 drives the tripping coil 3. The mounted component 8 is a component that is mounted on the printed circuit board 100.

[0020] The AC-type leakage current determination circuit 5a detects and determines leakage of AC current. The A-type leakage current determination circuit 5b detects and determines leakage of pulsating current containing a DC component. The AC-type leakage current determination circuit 5a and the A-type leakage current determination circuit 5b are each implemented as an IC and are supplied with power from a power supply circuit (not shown). The AC-type leakage current determination circuit 5a and the A-type leakage current determination circuit 5b are arranged in parallel, and the zero-phase current information amplified by the amplifier unit 4 is branched into two and input to each circuit. The leakage current determination circuit 5 receives the zero-phase current information and determines that a leakage current has occurred if the magnitude of the input leakage current information exceeds a threshold set in each circuit.

[0021] When the leakage current detection circuit 5 determines that a leakage current has occurred, it sends a command signal to the output unit 7. The output unit 7 drives the tripping coil 3 to open the contact 2. This electrically disconnects the power supply side terminal 10 and the load side terminal 11.

[0022] 1, the AC-type printed circuit board 100A includes a line L1 that electrically connects the amplifier 4 and the mounted component 8, and a line L2 that electrically connects the mounted component 8 and the AC-type earth leakage determination circuit 5a. As a result, the amplifier 4 and the AC-type earth leakage determination circuit 5a are connected via the line L1, the mounted component 8, and the line L2. The AC-type printed circuit board 100A does not include a line L3 (see FIG. 2) that electrically connects the mounted component 8 and the A-type earth leakage determination circuit 5b.

[0023] The physical configuration of the AC-type printed circuit board 100A will be described with reference to Fig. 3. As shown in Fig. 3, the AC-type printed circuit board 100A includes a circuit board 20, an IC element 21, electrical path patterns 22A, 22B, and 22D, and mounted components 8. Note that Fig. 3 shows only a portion of the AC-type printed circuit board 100A, and omits other electrical path patterns and mounted electronic components.

[0024] The circuit board 20 is a plate-like member that serves as the base member of the AC-type printed circuit board 100A. The electrical path pattern of the AC-type printed circuit board 100A is printed on the top surface of the circuit board 20, and various electronic components are mounted on it. The IC element 21 is an element that includes the circuit of the amplifier unit 4, the A-type determination circuit 5b, and the AC-type determination circuit 5a. The IC element 21 also includes a first terminal 23A, a second terminal 23B, a third terminal 23C, and a fourth terminal 23D. The first terminal 23A is connected to a power supply circuit inside the IC element 21. The second terminal 23B is connected to the circuit of the amplifier unit 4 inside the IC element 21. The third terminal 23C is connected to the A-type determination circuit 5b inside the IC element 21. The fourth terminal 23D is connected to the AC-type determination circuit 5a inside the IC element 21. The direction in which the terminals 23A to 23D are arranged is defined as the Y-axis direction, and the direction perpendicular to the Y-axis direction is defined as the X-axis direction.

[0025] The electric circuit patterns 22A, 22B, and 22D are formed by printing a conductive material on the upper surface of the circuit board 20. The electric circuit pattern 22A extends from the first terminal 23A along the X-axis direction. The electric circuit pattern 22A corresponds to the line L1 (see FIGS. 1 and 2). The electric circuit pattern 22B has a portion 22Ba extending from the second terminal 23B along the X-axis direction and a portion 22Bb extending from the tip of the portion 22Ba along the Y-axis direction. The electric circuit pattern 22D extends from the fourth terminal 23D along the X-axis direction. The electric circuit pattern 22D corresponds to the line L2 (see FIG. 1). The tip 22Bc of the portion 22Bb of the electric circuit pattern 22B and the tip 22Da of the electric circuit pattern 22D are arranged to be spaced apart from each other in the X-axis direction.

[0026] The mounted component 8 is electrically connected to the electric path pattern 22B and the electric path pattern 22D on the upper surface of the circuit board 20. The mounted component 8 is formed of an electronic component such as a resistor chip. The mounted component 8 has one terminal 8a and the other terminal 8b. The mounted component 8 is mounted at a mounting position PG1 on the circuit board 20. The terminal 8a of the mounted component 8 is connected to the tip 22Bc of the portion 22Bb of the electric path pattern 22B. The terminal 8b of the mounted component 8 is connected to the tip 22Da of the electric path pattern 22D.

[0027] 2, the A-type printed circuit board 100B includes a line L1 that electrically connects the amplifier 4 and the mounted component 8, and a line L3 that electrically connects the mounted component 8 and the A-type leakage determination circuit 5b. This connects the amplifier 4 and the A-type leakage determination circuit 5b via the line L1, the mounted component 8, and the line L3. The A-type printed circuit board 100B does not include the line L2 (see FIG. 1) that electrically connects the mounted component 8 and the AC-type leakage determination circuit 5a.

[0028] The physical configuration of the A-type printed circuit board 100B will be described with reference to Fig. 4. As shown in Fig. 4, the A-type printed circuit board 100B includes a circuit board 20, an IC element 21, electrical path patterns 22A, 22B, and 22C, and mounted components 8. Note that Fig. 4 shows only a portion of the A-type printed circuit board 100B, and omits other electrical path patterns and mounted electronic components.

[0029] The A-type printed circuit board 100B has a circuit board 20, an IC element 21, and electric path patterns 22A and 22B similar to those of the AC-type printed circuit board 100A. The electric path pattern 22C has a portion 22Ca extending from the third terminal 23C along the X-axis direction, a portion 22Cb extending from the tip of portion 22Ca along the Y-axis direction, and a portion 22Cc extending from the tip of portion 22Cb along the X-axis direction. The electric path pattern 22C corresponds to line L3 (see FIG. 2). The tip 22Bc of portion 22Bb of electric path pattern 22B and the tip 22Cd of portion 22c of electric path pattern 22C are arranged to be spaced apart from each other in the X-axis direction.

[0030] The mounted component 8 is electrically connected to the electric path pattern 22B and the electric path pattern 22C on the upper surface of the circuit board 20. The mounted component 8 is mounted at a mounting position PG2 on the circuit board 20. A terminal 8a of the mounted component 8 is connected to an end 22Bc of a portion 22Bb of the electric path pattern 22B. A terminal 8b of the mounted component 8 is connected to an end 22Cd of the electric path pattern 22C.

[0031] As described above, the AC-type printed circuit board 100A and the A-type printed circuit board 100B have the same circuit configuration, component configuration, and number of components (excluding lines L2 and L3), but have different electrical path patterns. The AC-type printed circuit board 100A has the electrical path pattern 22D but not the electrical path pattern 22C, while the A-type printed circuit board 100B has the electrical path pattern 22C but not the electrical path pattern 22D.

[0032] The mounted components 8 are arranged at the same positions on the AC-type printed circuit board 100A and the A-type printed circuit board 100B. That is, the mounting position PG1 of the mounted components 8 set on the AC-type printed circuit board 100A and the mounting position PG2 of the mounted components 8 set on the A-type printed circuit board 100B are the same position. When the XY coordinate system is set with the reference position of the circuit board 20 as the origin, the coordinates of the reference position of the mounted components 8 on the AC-type printed circuit board 100A and the coordinates of the reference position of the mounted components 8 on the A-type printed circuit board 100B are the same.

[0033] As shown in FIG. 5, the AC-type printed circuit board 100A and the A-type printed circuit board 100B have different external shapes. The circuit board 20 of the AC-type printed circuit board 100A shown in FIG. 5(a) has a rectangular external shape. The circuit board 20 of the A-type printed circuit board 100B shown in FIG. 5(b) has a shape with notched corners. However, there is no particular limitation on how the AC-type printed circuit boards 100A and the A-type printed circuit boards 100B are made to differ in shape. In addition, different visual information is printed on the AC-type printed circuit boards 100A and the A-type printed circuit boards 100B. The visual information is not particularly limited as long as it allows visual identification of the type of printed circuit board 100, and may be information in the form of letters, symbols, or the like. For example, the circuit board 20 of the AC-type printed circuit board 100A shown in FIG. 5(a) has "AC type" written on it. The circuit board 20 of the A-type printed circuit board 100B shown in FIG. 5(b) has "A type" written on it.

[0034] Next, a method for manufacturing the printed circuit board 100 according to the embodiment of the present invention will be described with reference to FIG.

[0035] 6, first, a printed circuit board preparation step is performed to prepare one of the AC-type printed circuit board 100A and the A-type printed circuit board 100B, which is a different type from the AC-type printed circuit board 100A (step S10). Next, a mounting step is performed to mount components 8 on the one printed circuit board 100 (step S20).

[0036] In the mounting process S20, a process of setting the mounted components 8 on a mounting device is executed (step S30). Next, in the mounting process S20, a mounting program for the mounted components 8 is executed (step S40). This completes the production of one of the AC-type printed circuit board 100A and the A-type printed circuit board 100B (step S50).

[0037] When manufacturing the other printed circuit board 100 of the AC-type printed circuit board 100A and the A-type printed circuit board 100B, the other printed circuit board 100 is prepared in a printed circuit board preparation process S10. In the printed circuit board preparation process S100, the AC-type printed circuit board 100A and the A-type printed circuit board 100B have the same circuit configuration, component configuration, and number of components, but different electrical circuit patterns are formed.

[0038] In the mounting process S20, the components 8 are placed in the same positions when mounting the components 8 on the AC-type printed circuit board 100A and when mounting the components 8 on the A-type printed circuit board 100B. Therefore, in step S40, the same mounting program can be used for the AC-type printed circuit board 100A and the A-type printed circuit board 100B.

[0039] Next, a method for manufacturing a printed circuit board according to this embodiment, and the functions and effects of the printed circuit board will be described.

[0040] First, with reference to FIG. 7, a method for manufacturing a printed circuit board according to a comparative example will be described. In the method for manufacturing a printed circuit board according to the comparative example, a printed circuit board common to AC and A types is prepared, and the mounting positions of mounted components on the common printed circuit board are changed to remake the AC-type printed circuit board and the A-type printed circuit board. As shown in FIG. 7, first, a printed circuit board preparation process is executed to prepare a common printed circuit board (step S110). Next, a process to set mounted components on a mounting device is executed (step S120). Next, an AC-type mounting program for mounted components to manufacture the AC-type printed circuit board is executed (step S130). This completes the AC-type printed circuit board (step S140). Next, a printed circuit board preparation process is executed to prepare a common printed circuit board to manufacture the A-type printed circuit board (step S150). Next, a process to set mounted components on a mounting device is executed (step S160). Next, an A-type mounting program for mounted components to manufacture the A-type printed circuit board is executed (step S170). This completes the A-type printed circuit board (step S180).

[0041] On the other hand, according to the manufacturing method of the printed circuit board 100 according to this embodiment, in the mounting process S20, the components 8 are placed in the same positions when mounting the components 8 on the AC-type printed circuit board 100A and when mounting the components 8 on the A-type printed circuit board 100B. In this case, if the AC-type printed circuit board 100A and the A-type printed circuit board 100B are separately manufactured, the components can be mounted on the AC-type printed circuit board 100A and the A-type printed circuit board 100B using the same mounting program in the mounting process S20. This eliminates the need to switch the mounting program for the components 8 when different types of printed circuit boards 100A and 100B are manufactured separately. As a result, different types of printed circuit boards 100A and 100B can be easily manufactured. This reduces manufacturing costs and allows the model with a smaller production volume to be offered at a lower price.

[0042] In the printed circuit board preparation step S10, the AC-type printed circuit board 100A and the A-type printed circuit board 100B may have different electrical path patterns formed thereon while having the same circuit configuration, component configuration, and number of components. In this case, by separating the electrical path patterns between the AC-type printed circuit board 100A and the A-type printed circuit board 100B, the printed circuit boards 100A and 100B can be manufactured using the same mounting program.

[0043] In the printed circuit board preparation step S10, the AC-type printed circuit board 100A and the A-type printed circuit board 100B may have different external shapes, which allows the AC-type printed circuit board 100A and the A-type printed circuit board 100B to be easily visually distinguished from each other by their external shapes.

[0044] In the printed circuit board preparation step S10, different visual information may be printed on the AC-type printed circuit board 100A and the A-type printed circuit board 100B. In this case, the AC-type printed circuit board 100A and the A-type printed circuit board 100B can be easily visually distinguished from each other by the visual information.

[0045] The printed circuit board 100 of this embodiment is a printed circuit board 100 of an earth leakage circuit breaker, and comprises one of the printed circuit boards 100, an AC-type printed circuit board 100A and an A-type printed circuit board 100B which is a different type from the AC-type printed circuit board 100A, and mounted components 8 mounted on the one printed circuit board 100, and the mounted components 8 are arranged in the same position on the AC-type printed circuit board 100A and the A-type printed circuit board 100B.

[0046] According to this printed circuit board 100, the same functions and effects as those of the method for manufacturing the printed circuit board 100 described above can be obtained.

[0047] The present invention is not limited to the above-described embodiments.

[0048] For example, the types of printed circuit boards are not limited to classification based on the operation when a DC component is present, as in the above-described embodiment, but may also be classified based on the time delay operation or the magnitude of the sensitivity current. [Explanation of symbols]

[0049] 8...mounted components, 100...printed circuit board, 100A...AC type printed circuit board (first printed circuit board), 100B...A type printed circuit board (second printed circuit board).

Claims

1. A method for manufacturing a printed circuit board for manufacturing a printed circuit board for an earth leakage circuit breaker, a printed circuit board preparation step of preparing one of a first printed circuit board and a second printed circuit board different in type from the first printed circuit board; a mounting step of mounting components on the one printed circuit board, In the mounting step, the mounting component is disposed at the same position when mounting the mounting component on the first printed circuit board and when mounting the mounting component on the second printed circuit board; A method for manufacturing a printed circuit board, wherein in the printed circuit board preparation step, the first printed circuit board and the second printed circuit board have the same circuit configuration, component configuration, and number of components, but different electrical circuit patterns are formed.

2. The method for manufacturing a printed circuit board according to claim 1 , wherein in the printed circuit board preparation step, the first printed circuit board and the second printed circuit board have different outer shapes.

3. 3. The method for manufacturing a printed circuit board according to claim 1, wherein different visual information is printed on the first printed circuit board and the second printed circuit board in the printed circuit board preparation step.

4. A printed circuit board for an earth leakage circuit breaker, one of a first printed circuit board and a second printed circuit board different in type from the first printed circuit board; a mounting component mounted on the one printed circuit board, the mounted components are arranged at the same positions on the first printed circuit board and the second printed circuit board, The first printed circuit board and the second printed circuit board have the same circuit configuration, component configuration, and component number, but have different electrical path patterns formed thereon.

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