Production support system and production support method

Abstract

Provided is a production support system including: a setting unit that in a test mounting process for mounting a testing component, which is a production component or a test component, on a testing board that is a production board or a test board, sets a target position in which the testing component is mounted on the testing board, on the basis of multiple mounting positions indicated by a control program; an execution unit that executes the test mounting process; a measuring unit that measures a position error of the mounted testing component on the basis of image data obtained by capturing the testing component mounted by the test mounting process on the testing board so that at least a part of the testing component is included in the field of view of the imaging device; and a calculation unit that calculates a position correction value for each of the multiple mounting positions indicated by the control program on the basis of the position error measured by the measuring unit.

Description

[Technical Field]

[0001] The present invention relates to a production support system and a production support method. [Background technology]

[0002] The production support system is applied to a component placement machine that places components on a circuit board. The accuracy of the placement process by the component placement machine is affected by lost motion caused by factors such as backlash in the drive unit. Patent Document 1 discloses a component placement machine that calibrates the operation of the drive unit. Patent Document 2 discloses a configuration in which, when a holding member that holds a component is moved by the drive unit, the holding member passes through a preparation position that is located in a predetermined direction and distance from the target position. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-86687 [Patent Document 2] International Publication No. 2016 / 199241 Summary of the Invention [Problem to be solved by the invention]

[0004] However, the amount of position error can vary depending on the position, movement direction, and movement speed of the drive unit within its movable range. Therefore, in the configuration of Cited Document 1, even if the operation of the drive unit is calibrated under predetermined operating conditions, if the placement process is performed under operating conditions different from those used in the calibration process, the position error of the component at the placement position may not necessarily be small enough to meet the required accuracy. Furthermore, while Patent Document 2 is expected to improve the accuracy of the placement process, it uses a movement path other than the shortest path and may require a temporary stop at the preparation position, which raises concerns about a decrease in production efficiency from the perspective of speeding up the placement process.

[0005] An object of the present specification is to provide a production support system and a production support method that can improve the accuracy of mounting processing by a component mounting machine. [Means for solving the problem]

[0006] This specification discloses a production support system that is applicable to a component mounting machine that mounts components at mounting positions on a board indicated by a control program, and that includes: a setting unit that sets target positions at which test components, which are production components or test components, are to be mounted on a test board, which is a production board or a test board, in a test mounting process based on the plurality of mounting positions indicated by the control program; an execution unit that executes the test mounting process; a measurement unit that measures position errors of the mounted test components based on image data acquired by capturing images of the test components mounted on the test board by the test mounting process so that at least a portion of the test components falls within the field of view of an imaging device; and a calculation unit that calculates position correction values ​​for each of the plurality of mounting positions indicated by the control program based on the position errors measured by the measurement unit. [Effects of the Invention]

[0007] According to this configuration, the test mounting process is executed based on the control program to be used for the scheduled mounting process, and the position correction values ​​for each of the multiple mounting positions are acquired. By executing the mounting process using the position correction values ​​for each of the multiple mounting positions, it is possible to improve the accuracy of the mounting process. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a schematic diagram showing a production line configured by component mounting machines to which a production support system according to an embodiment is applied; [Figure 2] FIG. 2 is a top view schematically showing the component mounting machine. [Figure 3] FIG. 2 is a functional block diagram showing a control device of a component mounting machine and a production support system. [Figure 4] FIG. [Figure 5] FIG. 1 is a diagram showing a virtual arrangement of board products on a test board. [Figure 6] FIG. 10 is a diagram showing a test board that has undergone test mounting processing and image data superimposed on each other. [Figure 7] 10 is a flowchart showing a production support process. DETAILED DESCRIPTION OF THE INVENTION

[0009] 1. Overview of Production Support System 50 Hereinafter, an embodiment of a production support system will be described with reference to the drawings. The production support system 50 is applied to a component mounting machine 12 used in the production of circuit board products. As shown in Figure 1, the component mounting machine 12 is applied to a production line Ln. The production line Ln is configured by arranging a plurality of substrate-related operation machines that perform predetermined substrate-related operations.

[0010] 2. Configuration of production line Ln As shown in FIG. 1, the production line Ln is configured by installing a plurality of substrate-related performing machines in the transport direction of the substrates 91. Each of the plurality of substrate-related performing machines is communicably connected to a management device 40 and a host computer 60. The management device 40 manages the production line Ln on which it is installed. The management device 40 keeps track of the progress of production on the production line Ln, necessary maintenance work, and the like, in accordance with a production plan that indicates the types of substrate products to be produced, the planned production quantities, and the production sequence thereof, and issues instructions to operators, etc. as necessary.

[0011] The host computer 60 controls multiple production lines Ln in an integrated manner. Various data such as production plans are stored in the host computer 60 and are downloaded in response to requests from the management device 40. The various data such as production plans may be stored only in the management device 40, or may be stored only in the host computer 60 and accessed by the management device 40 as needed.

[0012] The production line Ln includes a plurality of substrate-related work machines, namely a printer 11, a plurality of component mounting machines 12, an appearance inspection machine 13, a reflow furnace 14, and a function inspection machine 15. The printer 11 prints solder paste onto the component mounting positions on the board 91 that has been carried in. Each of the plurality of component mounting machines 12 mounts a component onto the board 91 that has been transported from the upstream side of the production line Ln. The configuration of the component mounting machine 12 will be described later.

[0013] The appearance inspection machine 13 inspects whether the positions and angles of the components mounted by the multiple component mounting machines 12 are within the acceptable range in appearance. The reflow furnace 14 heats the board 91 transported from the upstream side of the production line Ln to melt the solder on the board 91 and perform soldering. The function inspection machine 15 inspects whether the functions of the board products produced on the production line Ln are normal.

[0014] In this embodiment, a factory for producing substrate products may be configured with multiple production lines Ln. The configuration of each of the multiple production lines Ln may be appropriately added to or modified depending on, for example, the type of substrate product being produced. Specifically, the multiple production lines Ln may be appropriately equipped with substrate-related processing devices such as a buffer device for temporarily holding the substrates 91 being transported, a substrate supply device, a substrate inverting device, various inspection devices, a shield mounting device, an adhesive application device, and an ultraviolet irradiation device.

[0015] 3. Configuration of component placement machine 12 2, the component mounting machine 12 includes a board transport device 21. The board transport device 21 sequentially transports the board 91 in a transport direction and positions the board 91 at a predetermined position within the machine. The component mounting machine 12 also includes a component supply device 22. The component supply device 22 supplies components to be mounted on the board 91. The component supply device 22 is equipped with feeders 222 for each of the multiple slots 221. The feeders 222 may be, for example, tape feeders that feed and move a carrier tape containing a large number of components to supply the components so that they can be picked.

[0016] The component mounting machine 12 is equipped with a component transfer device 23. The component transfer device 23 transfers components supplied by the component supply device 22 to predetermined mounting positions on the board 91. The component transfer device 23 is equipped with a head drive device 231, a movable table 232, and a mounting head 233. The head drive device 231 moves the movable table 232 in horizontal directions (X and Y directions) using a linear motion mechanism. The mounting head 233 is detachably fixed to the movable table 232 by a clamp member (not shown), and is provided so as to be movable horizontally within the machine.

[0017] The mounting head 233 supports multiple holding members so that they can move up and down and rotate around their respective rotation axes. In this embodiment, the holding members are suction nozzles 234 that hold components by suction using supplied negative pressure air. Note that the holding members may also be chucks that grip and hold components.

[0018] The component mounting machine 12 is equipped with a component camera 24 and a board camera 25. The component camera 24 and the board camera 25 are digital imaging devices having imaging elements such as CMOS. The component camera 24 and the board camera 25 capture images based on control signals and send image data acquired by the images. The component camera 24 is mounted on a base fixed to the installation floor and is configured to be able to capture images of components held by the suction nozzles 234 from below. The board camera 25 is mounted on a movable stage 232 so as to be movable horizontally integrally with the mounting head 233. The board camera 25 is configured to be able to capture images of the board 91 from above.

[0019] The component mounting machine 12 includes a control device 30. The control device 30 is mainly composed of a CPU, various memories, and a control circuit. As shown in FIG. 3, the control device 30 includes a storage device 31, a state recognition unit 32, and a mounting control unit 33. The storage device 31 is composed of an optical drive such as a hard disk drive, a flash memory, or the like. The storage device 31 stores various data such as a control program D1 used to control the mounting process and component data D2.

[0020] As shown in FIG. 4, the control program D1 indicates the type, placement position, placement angle, and placement order of components to be placed on the board 91 during the placement process. The component data D2 is information specific to each type of component. The component data D2 includes parameter information M1 indicating the conditions for placing components on the board 91, and accuracy information M2 indicating the placement accuracy required for each type of component. In this embodiment, the parameter information M1 may include the maximum allowable movement speed (which may also be the allowable acceleration) for each component, the pick-up position (for example, the position at which the component comes into contact with the suction nozzle 234), etc.

[0021] The accuracy information M2 may indicate the allowable positional error and allowable angular error as the required accuracy, or may indicate a rank of the required accuracy preset in the component placement machine 12. In addition to the above, the component data D2 may also include shape information indicating the shape of the component used to recognize the appearance of the component. Specifically, the shape information may include the outer edge shape of the component, the shape of the characteristic part of the component, and the dimensions of the component. The test program D3 and the correction data D4 shown in FIG. 4 will be described in detail later.

[0022] The state recognition unit 32 executes a process for recognizing the holding state of the components held by each of the multiple holding members (holding members 234). Specifically, the state recognition unit 32 processes image data acquired by imaging with the component camera 24, and recognizes the position and angle of each component relative to the reference position of the mounting head 233. Note that, in addition to the component camera 24, the state recognition unit 32 may also process image data acquired by, for example, a head camera unit integrally provided on the mounting head 233 capturing an image of the component from the side, below, or above.

[0023] The control device 30 includes a placement control unit 33. Based on the control program D1, the placement control unit 33 controls the component placement operation by the placement head 233 to execute the placement process. Here, the placement process includes a pick-and-place cycle (PP cycle) that repeatedly executes a pickup operation in which a component supplied by the component supply device 22 is picked up by a holding member (suction nozzle 234) and a placement operation in which the component is placed at a predetermined placement position on the board 91 at a predetermined placement angle.

[0024] During the mounting process, the mounting control unit 33 controls the operation of the mounting head 233 based on information output from various sensors, image processing results (including the recognition results by the state recognition unit 32), the control program D1, etc. This controls the positions and angles of the multiple suction nozzles 234 supported by the mounting head 233. Furthermore, the mounting control unit 33 controls the operation of the mounting head 233 based on parameter information M1 in the component data D2 so that the movement speed and acceleration of the component fall within an allowable range.

[0025] 4. Production Support System 50 In the above-described mounting process, when components are placed at the placement positions on the board 91 indicated by the control program D1, some positional and angular errors may occur. This is thought to be due in part to errors occurring depending on the position within the movable range of a drive device that moves the mounting head 233, such as the component transfer device 23. To address this, it is conceivable to calibrate the movement of the mounting head 233 by, for example, dividing the movable range of the mounting head 233 into multiple sections and applying a pre-calculated calibration value to each section.

[0026] However, even within the same category, the amount of position error can vary depending on the position, movement direction, and movement speed of the mounting head 233. Therefore, even if the operation of the drive device is calibrated under predetermined operating conditions, if the mounting process is executed under operating conditions (conditions specified by the control program D1 or the component data D2) that differ from the calibrated process, the position error of the component at the mounting position may not necessarily be small enough to satisfy the required accuracy.

[0027] Furthermore, it is believed that the positional error and angle error in the placement process are partly caused by the lost motion of the drive device (component transfer device 23). In response to this, it is assumed that the placement control unit 33 will perform the placement operation in the PP cycle in high precision mode for components that require high placement accuracy (small tolerance error) in the accuracy information M2, for example, in order to suppress the effects of lost motion.

[0028] Specifically, when moving the placement head 233 in high-precision mode, the placement control unit 33 moves the placement head 233 via a predetermined preparation position so that the head approaches the placement position from a predetermined direction and distance. However, while high-precision mode operation as described above is expected to improve the precision of the placement process, it adopts a movement path that is different from the shortest path and may require a temporary stop at the preparation position, which raises concerns about reduced production efficiency from the perspective of speeding up the placement process.

[0029] Here, when the placement process is performed multiple times in high-speed mode, which prioritizes productivity rather than high-precision mode, some degree of position error occurs on average in the placement position, as described above. On the other hand, the difference between the maximum and minimum values ​​of the position error that occurs multiple times may be smaller than the range of position error allowable for the placement accuracy required for that component. In other words, in high-speed mode, although the average value and occurrence range of the position error do not meet the required placement accuracy, the variation in the position error itself was observed to be sufficiently small. It was thus concluded that such phenomena occur due to individual differences in the component placement machine 12.

[0030] Therefore, the production support system 50 of this embodiment is configured to apply appropriate correction data when performing the placement process in high-speed mode, thereby enabling higher accuracy and speed of the placement process. Specifically, as shown in FIG. 7, the production support system 50 executes a test placement process in advance during the production support process. As shown in FIG. 3, the production support system 50 includes a setting unit 51, an execution unit 52, a measurement unit 53, and a calculation unit 54. In this embodiment, an example in which the production support system 50 is incorporated into the control device 30 of the component placement machine 12 will be described.

[0031] 4-1.Settings section 51 The setting unit 51 sets the target positions at which the test components 81 are to be mounted on the test board 70 in the test mounting process based on a plurality of mounting positions indicated by the control program D1. Here, the test mounting process is a process of mounting the test components 81 on the test board 70. The test board 70 may be a production board used in actual production, or may be a master board for testing (test board) on whose upper surface a plurality of reference marks 71 are arranged in a predetermined pattern, as shown in FIG.

[0032] In this embodiment, each of the multiple reference marks 71 has a circular shape and is arranged in a matrix on the upper surface of a test substrate 70 serving as a master substrate. The multiple reference marks 71 are formed so that their shapes, their positional relationships with each other, and their positional relationships with the two substrate marks 72 are highly accurate. The two substrate marks 72 are fiducial marks that serve as references for detecting the position of the test substrate 70, and are arranged at two diagonal corners of the test substrate 70.

[0033] An adhesive layer is formed on the test substrate 70 as described above when the test mounting process is performed. The adhesive layer may be formed by coating or spraying an adhesive material onto the upper surface, or by attaching an adhesive sheet to the upper surface. A test component 81 is mounted on the adhesive layer of the test substrate 70. The test component 81 may be an electronic component (production component) used in actual production, or may be a dummy component (test component) that imitates an electronic component, as shown in FIG. 5. In this embodiment, the test component 81 is a dummy component for measurement whose external shape is generated with high precision, and is made of, for example, ceramic.

[0034] In this embodiment, the setting unit 51 sets a reference at a predetermined position on the test board 70, sets multiple target positions relative to the reference, and models the placement operation using the control program D1 to generate a test program D3 that indicates the multiple target positions. Specifically, the setting unit 51 first analyzes the control program D1 (S11 in FIG. 7). At this time, the setting unit 51 takes into account the content indicated by the component data D2. As a result, the setting unit 51 determines the board origin based on the two board marks 72 and sets this position as the reference for the test board 70. Then, as shown in FIG. 5, for example, the setting unit 51 recognizes multiple positions (ideal target positions) where test components 81 should be placed on a single test board 70, assuming that four board products C1-C4 are virtually arranged on the test board 70.

[0035] Next, the setting unit 51 executes a target position setting step (S12 in FIG. 7). When the ideal target position is not appropriate for a later step in the modeling of the mounting operation, the setting unit 51 shifts the target position appropriately to set the final target position. Specifically, when the test component 81 is virtually mounted at the multiple positions recognized in S11 where the test component 81 should be mounted, and at least a portion of the test component 81 overlaps the reference mark in a top view, the setting unit 51 sets the target position shifted from the mounting position based on the degree of overlap between the reference mark 71 and the test component 81. Note that if the overlap between the reference mark 71 and the test component 81 is eliminated by shifting the multiple target positions as a whole, the board origin may be shifted.

[0036] As a result, in a later process, the test component 81 will be shifted from the closest reference mark 71 to an extent that they can be recognized in image data acquired by capturing images of the reference mark 71 and the test component 81. In addition to the above-mentioned circumstances, the setting unit 51 may set a target position shifted from the mounting position when, for example, two or more reference marks 71 and test components 81 do not fit within the field of view of the imaging device (board camera 25) when viewed from above when the test component 81 is mounted at the mounting position indicated by the control program D1 using a predetermined position on the test board 70 as a reference.

[0037] When setting a target position shifted from the mounting position as described above, the setting unit 51 may, for example, set the target position for each test component 81 so that it is between adjacent reference marks 71 on the master substrate 70. Alternatively, the setting unit 51 may, for example, set the target position for each test component 81 so that it is within an area N1 (see FIG. 6) surrounded by the four reference marks 71 that are closest to each other on the master substrate 70. This makes it possible to determine the target position from the multiple reference marks 71 included in the image data D5 in a later process, and further makes it possible to measure the position error of the test component 81 included in the same image data D5.

[0038] The setting step (S12) described above models the placement operation using the control program, as shown in FIG. 4, and generates a test program D3 that indicates multiple target positions. In the test program D3, the order in which the test components 81 are placed and the placement angle match those in the control program D1. In the test program D3, some or all of the multiple target positions for placing the test components 81 may be shifted by a predetermined adjustment amount from those in the control program D1, and when this adjustment amount is zero, the test program D3 matches those in the control program D1. Furthermore, for those items in the accuracy information M2 of the referenced component data D2 where the required placement accuracy is below a threshold, the setting unit 51 sets the test program D3 to skip ("○" in FIG. 7) since it determines that generation of correction data is unnecessary.

[0039] 4-2. Executive Department 52 The execution unit 52 executes the test placement process (S13 in FIG. 7). More specifically, in the test placement process, the execution unit 52 places the test component 81 based on the test program D3. In other words, the execution unit 52 places the test component 81 by moving the placement head 233 along a movement path of the placement head 233 that corresponds to the component placement order indicated by the control program D1. Therefore, in the test placement process, the execution unit 52 places the test component 81 at a placement angle indicated by the control program D1 as a target angle.

[0040] In this embodiment, the execution unit 52 executes the test placement process under the same conditions as those of the placement process to be executed. Therefore, the execution unit 52 references the parameter information M1 of the component data D2, and places the test components 81 by moving the placement head 233 at the same speed as when the component placement machine 12 places components on the board 91 using the control program D1 in the test placement process.

[0041] The execution unit 52 switches between performing test placement or skipping for the multiple placement positions indicated by the control program D1 based on accuracy information M2 that indicates the type of component or the placement accuracy required for each of the multiple placement positions indicated by the control program D1. Specifically, the execution unit 52 switches between performing a skip operation or a placement operation according to whether or not a skip is set in the test program D3.

[0042] The skip operation in the test mounting process does not omit the entire mounting operation, but rather moves the suction nozzle 234 at least to above the target position. Whether or not to perform the lifting and lowering operation of the suction nozzle 234 is determined based on whether or not it will affect the subsequent occurrence of lost motion in the drive device. In the skip operation, the execution unit 52 moves the mounting head 233 at a movement speed that is the same as that of the mounting process to be executed.

[0043] 4-3.Measuring part 53 The measurement unit 53 executes a position error (angular error) measurement step (S15 in FIG. 7). First, after the test mounting process described above has been executed, the measurement unit 53 acquires image data D5 (see FIG. 6) that has been acquired by capturing an image of the test component 81 mounted on the test board 70 by the test mounting process so that at least a portion of the test component 81 falls within the field of view of the imaging device (hereinafter, "camera field of view Vf").

[0044] In this embodiment, the image data D5 is acquired by imaging the test board 70 positioned inside the machine with the board camera 25 after the test mounting process using the mounting head 233 is completed. Specifically, the positioned test board 70 is maintained without being unclamped, and multiple pieces of image data D5 are acquired by an imaging cycle (S14 in FIG. 7) in which the component camera 25 is repeatedly moved and images are taken so that each of the multiple test components 81 fits within the board 70.

[0045] The measurement unit 53 measures the position error of the mounted test component 81 based on the image data D5. In this embodiment, the measurement unit 53 measures the position error of the mounted test component 81 based on the image data D5 acquired by capturing an image of the test component 81 mounted on the test board 70 by the test mounting process and two or more (four in FIG. 6) reference marks 71 so that they fit within the camera field of view Vf.

[0046] Specifically, the measurement unit 53 uses image processing to measure the position error of the actually mounted test component 81 relative to the target position indicated by the multiple fiducial marks 71. In this way, when the same image data D5 includes the fiducial marks 71 and the test component 81, the measurement unit 53 can measure the position error without using position information from the board camera 25 when capturing the image to acquire the image data D5. In this embodiment, the measurement unit 53 measures the angular error of the mounted test component 81 based on the image data D5. As a result, the direction and magnitude of the position error and angular error are measured for each test component 81 included in each of the multiple image data D5.

[0047] The positional and angular errors measured in this manner occur at each mounting position due to individual differences in the component mounting machine 12 when the mounting process is executed under the conditions specified by the control program D1 and the component data D2. In other words, the measurement unit 53 has measured in advance the positional and angular errors that are estimated to occur in the actual mounting process.

[0048] It should be noted that, for example, if a large production component or a test dummy component simulating the dimensions of the large component is used as the test component 81 used in the test mounting process, it is expected that the test component 81 will not fit within the camera field of view Vf. In such a case, the image data D5 is generated by concatenating multiple pieces of image data acquired by capturing images multiple times while changing the position of the board camera 25 so that different portions of the test component 81 each fit within the camera field of view Vf. The measurement unit 53 may measure the position error of the mounted test component 81 based on this image data D5.

[0049] Furthermore, for example, if a production board or a dummy board (test board) without reference marks 71 is used as the test board 70 used in the test mounting process, the target position cannot be determined from image data D5 alone. In such a case, when the test mounting process is performed, the target position may be determined based on the board origin determined using the two board marks 72 as references and the position information of board camera 25 when imaging is performed to obtain image data D5. Then, measurement unit 53 may measure the position error based on this target position and the position of test component 81 in image data D5.

[0050] 4-4. Calculation unit 54 The calculation unit 54 calculates a position correction value for each of the multiple wearing positions indicated by the control program D1 based on the position error (angular error) measured by the measurement unit 53 (S16 in FIG. 7). That is, the calculation unit 54 calculates a position correction value of the same magnitude and in the opposite direction to the position error measured for one wearing position so that the position error is canceled out. In this way, one position correction value corresponding to one wearing position is calculated individually. Similarly, the calculation unit 54 calculates an angle correction value for each wearing position indicated by the control program D1 based on the angle error measured by the measurement unit 53. In this way, one angle correction value corresponding to one wearing position is calculated individually.

[0051] In the above, for the sake of simplicity, the position correction values ​​are calculated from a single test mounting process and measurement step. Alternatively, the production support system 50 may repeat steps S13-S15 a specified number of times. In this case, the test board 81 is loaded and unloaded for each of the multiple test mounting processes. The calculation unit 54 then statistically calculates (e.g., average or median) position correction values ​​for each of the multiple mounting positions based on the multiple position errors measured for the same target position for each of the multiple test mounting processes. The same applies to the angle correction values.

[0052] The calculation unit 54 generates correction data D4 by associating the position correction value and angle correction value for each target position calculated as described above with each mounting position in the control program D1 (S17 in FIG. 7). Note that for mounting positions set to be skipped in the test program D3, the correction amount in the correction data D4 is 0 (FH3=0, FR3=0). The generated correction data D4 is stored in the storage device 31 of the control device 30 in association with the control program D1, as shown in FIG.

[0053] When the placement process using the control program D1 is executed as the production plan progresses, the placement control unit 33 references the component data D2 and the correction data D4. During the placement process, the placement control unit 33 applies the position correction value and angle correction value set for each placement position indicated by the correction data D4, in addition to the correction based on the component holding state by the state recognition unit 32, to place components on the board 91. In this way, the placement control unit 33 can correct for positional and angular errors that occur for each placement position due to individual differences between component placement machines 12, thereby enabling high-precision placement of components in high-speed mode.

[0054] In this embodiment, the production support method is applied to a component mounting machine 12 that mounts components at mounting positions on a board 91 indicated by a control program D1. The production support method includes a setting step (S11), an execution step (S13), a measurement step (S15), and a calculation step (S16). The production support method achieves the same effects as the above-mentioned production support system.

[0055] 5. Modifications of the embodiment In the embodiment, the test mounting process exemplifies a mode in which a master substrate on which a plurality of reference marks 71 are arranged in a predetermined pattern is used as the test substrate 70. The master substrate is appropriately selected from a plurality of different types of predetermined patterns depending on the quantity, dimensions, and density of the test parts (production parts or dummy parts) to be mounted.

[0056] In the embodiment, the calculation unit 54 statistically calculates the position correction value and the angle correction value from the results of multiple test fitting processes. However, the production support system 50 may calculate the position correction value and the angle correction value for each test fitting process, apply them to the next test fitting process, and gradually bring the position correction value and the angle correction value closer to the appropriate value.

[0057] In the embodiment, the production support system 50 is incorporated into the control device 30 of the component mounting machine 12. However, each of the units 51-54 constituting the production support system 50 may be provided in an external device of the control device 30. For example, the production support system 50 may be incorporated into the management device 40 or the host computer 60 of the production line Ln.

[0058] In the embodiment, the imaging device that captures images of the test components 81 mounted on the test board 70 by the test mounting process is the board camera 25 that is movable integrally with the mounting head 233. However, the camera may be a dedicated camera provided inside the component mounting machine 12, or an inspection camera provided in an external device (e.g., the visual inspection machine 13) of the component mounting machine 12. However, from the standpoint of work efficiency and high accuracy, it is preferable to capture images inside the machine without transporting the test board 70 between the test mounting and the imaging process. [Explanation of symbols]

[0059] Ln: production line, 11: printing machine, 12: component placement machine, 13: appearance inspection machine, 14: reflow oven, 15: function inspection machine, 23: component transfer device, 233: placement head, 234: suction nozzle (holding member), 24: component camera, 25: board camera (imaging device), 30: control device, 50: production support system, 51: setting unit, 52: execution unit, 53: measurement unit, 54: calculation unit, 70: test board (master board), 71: reference mark, 72: board mark, 81: test component, 91: board, D1: control program, D2: component data, M1: parameter information, M2: accuracy information, D3: test program, M3: skip information, D4: correction data, D5: image data

Claims

1. This is applied to a component placement machine that places components on a board at placement positions indicated by a control program, a setting unit that sets target positions at which test components, which are production components or test components, are to be mounted on a test board, which is a production board or a test board, based on a plurality of mounting positions indicated by the control program in a test mounting process in which the test components, which are production components or test components, are to be mounted on the test board, which is a test board or a test board; an execution unit that executes the test fitting process; a measurement unit that measures a position error of the test component mounted on the test board by the test mounting process based on image data acquired by capturing an image of the test component so that at least a portion of the test component falls within the field of view of an imaging device; a calculation unit that calculates a position correction value for each of the plurality of mounting positions indicated by the control program based on the position error measured by the measurement unit; and Equipped with the setting unit sets a reference at a predetermined position on the test board, and models a mounting operation using the control program by setting a plurality of target positions relative to the reference, thereby generating a test program indicating the plurality of target positions; the test substrate is a master substrate for testing, on whose upper surface a plurality of reference marks are arranged in a predetermined pattern; The setting unit sets the target position shifted from the mounting position when the test component is virtually mounted at the mounting position indicated by the control program using the predetermined position of the test board as the reference and when at least a portion of the test component overlaps the reference mark when viewed from above.

2. This is applied to a component placement machine that places components on a board at placement positions indicated by a control program, a setting unit that generates a test program indicating a plurality of target positions by setting target positions at which test components, which are test components, are to be mounted on a test board, which is a production board or a test board, based on the plurality of mounting positions indicated by the control program in a test mounting process in which the test components, which are test components, are mounted on the test board, which is a production board or a test board; an execution unit that executes the test fitting process; a measurement unit that measures a position error of the test component mounted on the test board by the test mounting process based on image data acquired by capturing an image of the test component so that at least a portion of the test component falls within the field of view of an imaging device; a calculation unit that calculates a position correction value for each of the plurality of mounting positions indicated by the control program based on the position error measured by the measurement unit; and Equipped with the control program is an operation program for mounting a plurality of types of production components onto the production board, The test program is an operating program for replacing each of the multiple types of production parts set as test targets among the multiple production parts with a single type of test part, indicating the target positions corresponding to the respective mounting positions, and mounting the test parts, which are the single type of test part, on the test board.

3. the component mounting machine includes a mounting head that supports a holding member that holds the component so that the holding member can be raised and lowered and is movable in a horizontal direction; 3. The production support system according to claim 1, wherein the execution unit, in the test mounting process, moves the mounting head along a movement path of the mounting head that corresponds to the mounting order of the components indicated by the control program, to mount the test components.

4. 4. The production support system according to claim 3, wherein the execution unit, in the test placement process, places the test component by moving the placement head at a movement speed of the placement head when the component placement machine places the component on the board using the control program.

5. The production support system according to any one of claims 1 to 4, wherein the execution unit switches between performing test placement or skipping the placement for the plurality of placement positions indicated by the control program based on accuracy information indicating the type of the component or the placement accuracy required for each of the plurality of placement positions indicated by the control program.

6. The production support system according to any one of claims 2 to 5, wherein the setting unit sets a reference at a predetermined position on the test board, sets a plurality of target positions relative to the reference, thereby modeling the mounting operation using the control program, and generates a test program indicating the plurality of target positions.

7. the test substrate is a master substrate for testing, on whose upper surface a plurality of reference marks are arranged in a predetermined pattern; 10. The production support system according to claim 1, wherein the setting unit sets the target position shifted from the mounting position when two or more of the reference marks and the test component do not fit within the field of view of the imaging device when viewed from above when the test component is mounted at the mounting position indicated by the control program using the predetermined position of the test board as the reference.

8. 8. The production support system according to claim 7, wherein the measurement unit measures the position error of the mounted test component based on image data acquired by capturing an image of the test component mounted on the test board by the test mounting process and two or more of the reference marks so that they fall within the field of view of the imaging device.

9. 9. The production support system according to claim 1, wherein the setting unit sets the target position for each test component so that the target position is between a plurality of adjacent reference marks on the master board.

10. A production support system as described in any one of claims 1, 7-9, wherein the setting unit sets the target position for each test component so that it is within an area surrounded by four of the reference marks that are closest to each other on the master board.

11. 11. The production support system according to claim 1, wherein the measurement unit measures the position error of the test component actually mounted relative to the target position indicated by the plurality of reference marks.

12. 12. The production support system according to claim 1, wherein each of the plurality of reference marks is circular and arranged in a matrix on the upper surface of the master substrate.

13. The production support system according to any one of claims 1 to 12, wherein the calculation unit statistically calculates the position correction value for each of the plurality of mounting positions based on a plurality of position errors measured for the same target position for each of the test mounting processes executed multiple times.

14. the control program indicates a mounting angle of the component for each of the plurality of mounting positions; the execution unit mounts the test component in the test mounting process at the mounting angle indicated by the control program as a target angle; the measurement unit measures an angle error of the attached test component based on the image data; The production support system according to any one of claims 1 to 13, wherein the calculation unit calculates an angle correction value for each mounting position indicated by the control program based on the angle error measured by the measurement unit.

15. The component mounting machine includes: a mounting head that supports a holding member that holds the component so that the holding member can be raised and lowered and is movable in a horizontal direction; the imaging device is provided so as to be movable integrally with the mounting head, and the imaging device is a board camera that images the board positioned inside the machine from above, The production support system according to any one of claims 1 to 14, wherein the image data is obtained by capturing an image of the test board positioned within the machine using the board camera after the test mounting process using the mounting head is completed.

16. This is applied to a component placement machine that places components on a board at placement positions indicated by a control program, a setting step of generating a test program indicating a plurality of target positions by setting target positions at which test components, which are test components, are to be mounted on a test board, which is a production board or a test board, based on the plurality of mounting positions indicated by the control program in a test mounting process in which the test components, which are test components, are mounted on the test board, which is a production board or a test board; an execution step of executing the test fitting process; a measurement step of measuring a position error of the test component mounted on the test board by the test mounting process based on image data acquired by capturing an image of the test component so that at least a portion of the test component falls within the field of view of an imaging device; a calculation step of calculating a position correction value for each of the plurality of mounting positions indicated by the control program based on the position error measured in the measurement step; Equipped with the control program is an operation program for mounting a plurality of types of production components onto the production board, The test program is an operating program that replaces each of the multiple types of production parts set as test targets among the multiple production parts with a single type of test part, indicates the target positions corresponding to the respective mounting positions, and mounts the test parts that are the single type of test part on the test board.

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