Liquid ejection head, liquid ejection unit, and liquid ejection device

Abstract

To enhance liquid discharging performance of a liquid discharge head compared to that of the related art.SOLUTION: A liquid discharge head 1 includes: a pressure chamber actuator substrate 70 including a pressure chamber communicating with a nozzle from which a liquid is to be discharged and pressure generation means for applying pressure to the liquid in the pressure chamber; a frame member 80 for holding the pressure chamber actuator substrate 70; and temperature detection means 221, 220 for detecting a temperature of the pressure chamber actuator substrate. The frame member 80 includes a hole 200, which the temperature detection means 221, 220 are inserted into and attached to through a resin 210. The resin 210 includes: one portion 211 uncured and contacting the pressure chamber actuator substrate 70; and the other portion 212 cured.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a liquid ejection head, a liquid ejection unit, and an apparatus for ejecting liquid. [Background technology]

[0002] Conventionally, a liquid ejection head is known that includes a pressure chamber through which a nozzle that ejects liquid communicates, a pressure chamber actuator substrate that includes a pressure generating means that pressurizes the liquid in the pressure chamber, a frame member that holds the pressure chamber actuator substrate, and a temperature detecting means that detects the temperature of the pressure chamber actuator substrate.

[0003] For example, Patent Document 1 describes such a liquid ejection head, in which a through hole is provided in a frame member, into which a temperature detection means is inserted when the temperature detection means is attached to a pressure chamber actuator substrate. Summary of the Invention [Problem to be solved by the invention]

[0004] However, the method disclosed in Patent Document 1 has the problem that the liquid ejection performance of the liquid ejection head may be reduced when the temperature detection means is attached and fixed. The present invention has been made in consideration of the above problem, and aims to improve the liquid ejection performance of the liquid ejection head. [Means for solving the problem]

[0005] In order to solve the above-mentioned problems, the present invention provides a liquid ejection device comprising: a pressure chamber actuator substrate including a pressure chamber through which a nozzle for ejecting liquid communicates; a pressure generating means for pressurizing the liquid in the pressure chamber; a frame member for holding the pressure chamber actuator substrate; and a temperature detecting means for detecting the temperature of the pressure chamber actuator substrate. In the liquid ejection head, the frame member has a hole into which the temperature detection means is inserted and attached via resin, When using the liquid ejection head,The resin has an uncured portion that is in contact with the pressure chamber actuator substrate and another portion that is cured. [Effects of the Invention]

[0006] According to the present invention, the liquid ejection performance of the liquid ejection head can be maintained better than in the past. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 2 is an exploded perspective view illustrating the liquid ejection head according to the embodiment. [Figure 2] FIG. 2 is an explanatory perspective view of the appearance of the liquid ejection head. [Figure 3] An explanatory diagram of the procedure for installing and fixing a temperature measuring device. [Figure 4] 10A and 10B are explanatory diagrams of a mounting and fixing structure according to a modified example. [Figure 5] 10A and 10B are explanatory diagrams of a mounting and fixing structure according to another modified example. [Figure 6] FIG. 4 is an explanatory diagram of the distance between a temperature measuring device and the surface of a pressure chamber actuator substrate. [Figure 7] 10A and 10B are explanatory diagrams illustrating modified examples of the shape of the inner circumferential surface of the through hole. [Figure 8] FIG. 2 is an exploded perspective view illustrating a head module according to the embodiment. [Figure 9] FIG. 2 is an exploded perspective view illustrating the head module according to the embodiment, as viewed from the nozzle surface side. [Figure 10] FIG. 1 is a schematic diagram illustrating a printing apparatus according to an embodiment. [Figure 11] FIG. 2 is an explanatory plan view of an example of a head unit of a printing device. [Figure 12] FIG. 1 is an explanatory plan view of a main part of an example of a printing apparatus. [Figure 13] FIG. 1 is an explanatory side view of a main part of an example of a printing device. [Figure 14] FIG. 2 is a plan view illustrating a main part of an example of a liquid ejection unit. [Figure 15] FIG. 2 is a front view illustrating an example of a liquid ejection unit. DETAILED DESCRIPTION OF THE INVENTION

[0008] An embodiment in which the present invention is applied to a liquid ejection head provided in a device for ejecting liquid will be described below. Figure 1 is an exploded perspective view of the liquid ejection head in this embodiment. Figure 2 is an external perspective view of the liquid ejection head.

[0009] The liquid ejection head 1 of this embodiment includes a nozzle plate 10, a flow path plate (individual flow path member) 20, a diaphragm member 30, a common flow path member 50, a damper member 60, a frame member 80, and a substrate (flexible wiring substrate) 101 on which a drive circuit 102 is mounted. The nozzle substrate constituting the nozzle plate 10, the actuator substrate constituting the individual flow path member 20 and the diaphragm member 30, the subframe substrate constituting the common flow path member 50, and the damper substrate constituting the damper member 60 are all made of single-crystal Si wafers as substrate materials. Multiple chips (liquid ejection heads) are simultaneously fabricated on the Si wafer using microfabrication technology for MEMS and semiconductor devices, and the resulting chipped substrates are bonded together to form a pressure chamber actuator substrate 70. This pressure chamber actuator substrate 70 is bonded to and held in place by a frame member 80.

[0010] The nozzle plate 10 is provided with a plurality of nozzles that eject liquid. The individual flow path member 20 forms a plurality of pressure chambers (individual liquid chambers) that each communicate with the plurality of nozzles, a plurality of individual supply flow paths that each communicate with the plurality of pressure chambers, and a plurality of individual recovery flow paths that each communicate with the plurality of pressure chambers. A pressure chamber and the individual supply flow path and individual recovery flow path that communicate with it are collectively referred to as an individual flow path.

[0011] The vibration plate member 30 forms a vibration plate that is a deformable wall surface of the pressure chamber, and a piezoelectric element is integrally provided on the vibration plate. The vibration plate member 30 also has a supply-side opening that communicates with the individual supply flow path and a recovery-side opening that communicates with the individual recovery flow path. The piezoelectric element is an electromechanical conversion element and is pressure generating means that deforms the vibration plate to pressurize the liquid in the pressure chamber.

[0012] The individual flow path member 20 and the diaphragm member 30 are not limited to being separate members. For example, the individual flow path member 20 and the diaphragm member 30 can be integrally formed from the same member using an SOI (Silicon On Insulator) substrate. That is, an SOI substrate having a silicon oxide film, a silicon layer, and a silicon oxide film formed in this order on a silicon substrate can be used, with the silicon substrate serving as the individual flow path member 20 and the diaphragm formed from the silicon oxide film, the silicon layer, and the silicon oxide film. In this configuration, the layer configuration of the silicon oxide film, the silicon layer, and the silicon oxide film of the SOI substrate becomes the diaphragm member 30. In this way, the diaphragm member 30 includes one made of a material formed on the surface of the individual flow path member 20.

[0013] The damper member 60 has a supply-side damper that faces (opposes) the supply port of the common supply flow path branch, and a recovery-side damper that faces (opposes) the recovery port of the common recovery flow path branch. The damper substrate that forms the surface of the damper member 60 that is joined to the frame member 80 is a silicon substrate.

[0014] A flow path connected to the common supply flow path of the common flow path member 50 penetrates the frame member 80 vertically in the figure, with the opening on the top surface serving as a supply port 81. A flow path connected to the common recovery flow path of the common flow path member 50 also penetrates the frame member 80 vertically, with the opening on the top surface serving as a recovery port 82. A through hole 200 is provided that penetrates the frame member 80 in the vertical direction up to the top surface of the damper member 60 in the figure. This through hole 200 is fixedly joined by filling it with adhesive resin 210 with a temperature measuring device as temperature detection means having a signal line 220 inserted therein.

[0015] Figure 3 is an explanatory diagram of the procedure for attaching and fixing a temperature measuring device. Figure 3(a) is a perspective view showing the state in which the temperature measuring device 221 (see Figure 3(b)) is inserted, Figure 3(b) is an explanatory diagram of the state in which the through hole 200 of this embodiment is filled with resin 210 and fixed, and Figure 3(c) is an explanatory diagram of a comparative example.

[0016] In the comparative example shown in FIG. 3( c), an ultraviolet-curable resin is used as the adhesive resin. The resin filled in the through-hole 200 is irradiated with ultraviolet light from the surface side, i.e., from above in the figure, to harden the entire resin. It has been discovered that the mounting and fixing structure of this comparative example may degrade the liquid ejection performance of the liquid ejection head 1 as follows. This fixing structure uses an adhesive to directly attach the temperature measuring device 221 to the pressure chamber actuator substrate 70, which is the core component. This stress is applied to the core component due to the cure shrinkage of the adhesive during the mounting and fixing process, and the difference in linear expansion with the surrounding components due to the temperature rise during transportation and storage of the liquid ejection head 1 in a high-temperature environment. This stress changes the rigidity of the diaphragm of the diaphragm member 30 of the pressure chamber actuator substrate 70, thereby changing the ejection characteristics. As a result, there is a risk of degrading the liquid ejection performance of the liquid ejection head 1.

[0017] 3(b), in the liquid ejection head 1 of this embodiment, adhesive resin 210 filled into through-hole 200, which serves as a hole into which a temperature detection means is inserted and attached via resin, has an uncured portion 211 that is in contact with pressure chamber actuator substrate 70, and another portion 212 that is in a cured state. As a result, because the adhesive (resin) on the contact surface with pressure chamber actuator substrate 70 is not hardened, stress caused by the hardening contraction of the adhesive and expansion and contraction of parts due to thermal stress during transportation is not transmitted to the pressure chamber. This makes it possible to avoid the impact of hardened adhesive on ejection characteristics.

[0018] By using a UV-curable resin with poor UV transparency, UV rays can only reach a certain depth, and the resin only hardens to that depth. UV-curable resin hardens from the surface exposed to UV rays, and UV transmittance also decreases, so by adjusting the UV irradiation time, it is possible to achieve a hardened state to a certain depth. As a result, the hardened resin on the surface seals the unhardened resin on the pressure chamber actuator substrate 70, and the resin maintains its unhardened, fluid state even when used as a liquid ejection head 1 in a device that ejects liquid. Even if the resin requires UV rays as well as moisture and oxygen in the air to harden, hardening on the surface side allows it to perform its sealing function against moisture and other elements.

[0019] 3(b), the resin 210 has a fluid portion 211 that is in contact with the pressure chamber actuator substrate 70, and another portion 212 that is not fluid. The resin 210 can also be said to have a first hardness portion 211 that is in contact with the pressure chamber actuator substrate 70, and another portion 212 that has a second hardness that is higher than the first hardness. This is because cured resin has a higher hardness than uncured resin.

[0020] Fig. 4 is an explanatory diagram of a mounting and fixing structure according to a modified example. In the example of Fig. 4, the hardness of the resin 210 gradually increases from the portion in contact with the surface of the pressure chamber actuator substrate 70 toward the opposite side. The change in hardness is represented by a change in density.

[0021] 5A and 5B are explanatory diagrams of an attachment / fixing structure according to another modified example. FIG. 5A is an explanatory diagram of a longitudinal section, and FIG. 5B is an explanatory diagram of a plan view. In this example, the contacting portion 211, which is uncured, fluid, or has a first hardness, includes the periphery of the temperature measuring device 221 (the hatched area inside the dashed line 211b in the figure). The contacting portion 211 also includes an edge portion (the hatched area outside the dashed line 211a in the figure) formed by the surface of the pressure chamber actuator substrate 70 and the inner circumferential surface of the through-hole 200 that contacts that surface.

[0022] It was found that when the adhesive in the above areas (211a, 211b) hardens, a strong stress is applied to the pressure chamber actuator substrate 70, which affects the ejection characteristics. If the target areas are unhardened, the impact on the ejection characteristics is small.

[0023] FIG. 6 is an explanatory diagram of the distance between the temperature measuring device 221 and the surface of the pressure chamber actuator substrate 70 in each of the above examples. The range of distance G is shown using the example of FIG. 3. This range is preferably set within a range of 0 to 2 mm. If it is within the range of 0 to 2 mm, the ink temperature (temperature of the pressure chamber actuator substrate 70) can be measured normally. If the temperature measuring device is not pressed into the pressure chamber actuator substrate side within the range of 0 to 2 mm, no stress is applied to the pressure chamber actuator substrate 70, and there is no impact on the ejection performance.

[0024] 7 is an explanatory diagram of a modified shape of the inner circumferential surface 200a of the through-hole 200 in each of the above examples. This is an explanatory diagram using the example of FIG. 3. The inner circumferential surface 200a of the through-hole 200 has a tapered shape in which the opening cross-sectional area increases the further away from the pressure chamber actuator substrate 70. Because the bonding area is narrower, the stress applied to the pressure chamber actuator substrate 70 is smaller, and the impact on the ejection performance is also small. Therefore, more effective results can be achieved.

[0025] It is preferable that the surface portion of the pressure chamber actuator substrate facing the frame member, and more preferably, most of the laminated substrate portions, are made of silicon substrates. Silicon substrates have a small amount of deformation, and stress caused by adhesive hardening is less likely to be transmitted to the actuator portion, thereby achieving greater effectiveness.

[0026] Next, an example of a head module including the liquid ejection head 1 of this embodiment will be described with reference to FIGS. FIG. 8 is an exploded perspective view illustrating the head module of this embodiment. FIG. 9 is an exploded perspective explanatory view of the head module of this embodiment as seen from the nozzle surface side.

[0027] The head module 100 includes a liquid ejection head (hereinafter simply referred to as "head") 1 that ejects liquid, a base member 103 that holds the multiple liquid ejection heads 1, and a cover member 113 that serves as nozzle covers 15 for the multiple liquid ejection heads 1. The head module 100 also includes a heat dissipation member 104, a manifold 105 that forms a flow path that supplies liquid to the multiple liquid ejection heads 1, a printed circuit board (PCB) 106 that connects to the flexible wiring member 101, and a module case 107.

[0028] Next, an example of a liquid ejection device according to the present invention will be described with reference to FIGS. FIG. 10 is a schematic explanatory diagram of a printing apparatus, which is an inkjet recording apparatus serving as a device for ejecting liquid in this embodiment. FIG. 11 is an explanatory plan view of an example of a head unit of the printing device of this embodiment.

[0029] The printing device 500, which is a device for ejecting this liquid, includes an input means 501 for inputting a continuous body 510, a guide and conveyance means 503 for guiding and conveying the continuous body 510 inputted from the input means 501 to a printing means 505, a printing means 505 for ejecting a liquid onto the continuous body 510 to perform printing to form an image, a drying means 507 for drying the continuous body 510, and an output means 509 for outputting the continuous body 510.

[0030] The continuous web 510 is sent out from a main winding roller 511 of the carry-in means 501, guided and conveyed by the rollers of the carry-in means 501, the guide and conveying means 503, the drying means 507, and the conveying means 509, and wound up by a winding roller 591 of the conveying means 509. In the printing means 505, the continuous web 510 is conveyed on a conveying guide member 559 opposite the head unit 550, and an image is printed by liquid ejected from the head unit 550.

[0031] In the printing device 500 of this embodiment, the head unit 550 includes the two head modules 100A and 100B according to this embodiment described above, mounted on a common base member 552.

[0032] When the direction in which the liquid ejection heads 1 of the head modules 100A and 100B are lined up in a direction perpendicular to the transport direction is defined as the head arrangement direction, the head arrays 1A1 and 1A2 of the head module 100A eject liquid of the same color. Similarly, the head arrays 1B1 and 1B2 of the head module 100A are paired, the head arrays 1C1 and 1C2 of the head module 100B are paired, and the head arrays 1D1 and 1D2 are paired, and each ejects liquid of the required color.

[0033] Next, another example of a printing apparatus as a liquid ejecting apparatus according to the present invention will be described with reference to FIGS. FIG. 12 is an explanatory plan view of the main parts of the printing apparatus of this embodiment. FIG. 13 is an explanatory side view of the main part of the printing apparatus of this example.

[0034] The printing apparatus 500 of this example is a serial type apparatus, and a carriage 403 is moved back and forth in the main scanning direction by a main scanning movement mechanism 493. The main scanning movement mechanism 493 includes a guide member 401, a main scanning motor 405, a timing belt 408, etc. The guide member 401 is hung between left and right side plates 491A and 491B to movably hold the carriage 403. The main scanning motor 405 then moves the carriage 403 back and forth in the main scanning direction via a timing belt 408 hung between a drive pulley 406 and a driven pulley 407.

[0035] This carriage 403 is equipped with a liquid ejection unit 440 that integrates a liquid ejection head 1 according to the present invention and a head tank 441. The liquid ejection head 1 of the liquid ejection unit 440 ejects liquid of each color, for example, yellow (Y), cyan (C), magenta (M), and black (K). The liquid ejection head 1 is mounted with a nozzle row consisting of multiple nozzles arranged in a sub-scanning direction perpendicular to the main scanning direction, and the ejection direction facing downward. The liquid ejection head 1 is connected to a liquid circulation device, which circulates and supplies liquid of the required color.

[0036] The printing apparatus 500 is equipped with a transport mechanism 495 for transporting paper 410. The transport mechanism 495 includes a transport belt 412, which is a transport means, and a sub-scanning motor 416 for driving the transport belt 412. The transport belt 412 attracts the paper 410 and transports it at a position facing the liquid ejection head 1. The transport belt 412 is an endless belt that is stretched between a transport roller 413 and a tension roller 414. The attraction can be achieved by electrostatic attraction or air suction. The transport belt 412 moves in a circular motion in the sub-scanning direction as the transport roller 413 is rotationally driven by the sub-scanning motor 416 via a timing belt 417 and a timing pulley 418.

[0037] Furthermore, a maintenance and recovery mechanism 420 that maintains and recovers the liquid ejection head 1 is disposed on one side of the carriage 403 in the main scanning direction, beside the conveyor belt 412. The maintenance and recovery mechanism 420 is composed of, for example, a cap member 421 that caps the nozzle surface of the liquid ejection head 1, a wiper member 422 that wipes the nozzle surface, and the like. The main scanning movement mechanism 493, the maintenance and recovery mechanism 420, and the conveyor mechanism 495 are attached to a housing that includes side plates 491A and 491B and a back plate 491C.

[0038] In the printing device 500 configured in this manner, the paper 410 is fed onto the conveyor belt 412 and adsorbed thereon, and the paper 410 is conveyed in the sub-scanning direction by the circular movement of the conveyor belt 412. Then, by driving the liquid ejection head 1 in accordance with an image signal while moving the carriage 403 in the main scanning direction, liquid is ejected onto the stationary paper 410 to form an image.

[0039] Next, another example of the liquid discharge unit according to the present invention will be described with reference to FIG. FIG. 14 is a plan view illustrating the main parts of the liquid discharge unit of this embodiment.

[0040] This liquid ejection unit 440 is composed of the components that make up the device for ejecting the liquid, including a housing portion consisting of side plates 491A, 491B and a back plate 491C, a main scanning movement mechanism 493, a carriage 403, and a liquid ejection head 1.

[0041] It is also possible to configure a liquid discharge unit in which the above-described maintenance and recovery mechanism 420 is further attached to, for example, the side plate 491B of this liquid discharge unit 440.

[0042] Next, still another example of the liquid discharge unit according to the present invention will be described with reference to FIG. FIG. 15 is an explanatory front view of the liquid discharge unit of this example.

[0043] This liquid discharge unit 440 is composed of a liquid discharge head 1 to which a flow path part 444 is attached, and a tube 456 connected to the flow path part 444 .

[0044] The flow path part 444 is disposed inside the cover 442. A head tank 441 may be included instead of the flow path part 444. A connector 443 for electrically connecting with the liquid ejection head 1 is provided on the upper part of the flow path part 444.

[0045] In the present application, the liquid to be ejected may have a viscosity and surface tension that allows it to be ejected from the head, and is not particularly limited, but preferably has a viscosity of 30 mPa·s or less at room temperature and normal pressure, or upon heating or cooling. More specifically, the liquid may be a solution, suspension, emulsion, or the like containing a solvent such as water or an organic solvent, a colorant such as a dye or pigment, a polymerizable compound, a resin, a surfactant, or the like, a biocompatible material such as DNA, amino acids, proteins, or calcium, or an edible material such as a natural colorant, and the like. These liquids can be used, for example, as inkjet inks, surface treatment liquids, liquids for forming components of electronic devices or light-emitting elements, or electronic circuit resist patterns, and material liquids for 3D modeling.

[0046] Energy sources for ejecting liquid include piezoelectric actuators (laminated piezoelectric elements and thin-film piezoelectric elements), thermal actuators that use electrothermal conversion elements such as heating resistors, and electrostatic actuators consisting of a vibration plate and an opposing electrode.

[0047] A "liquid ejection unit" is a liquid ejection head integrated with functional parts and mechanisms, and includes a collection of parts related to ejecting liquid. For example, a "liquid ejection unit" includes a liquid ejection head combined with at least one of the following components: a head tank, a carriage, a supply mechanism, a maintenance and recovery mechanism, a main scanning movement mechanism, and a liquid circulation device.

[0048] Here, "integrated" includes, for example, a liquid ejection head and a functional part or mechanism that are fixed to each other by fastening, bonding, engaging, etc., or one that is held movably relative to the other. The liquid ejection head, functional part, or mechanism may also be configured to be detachable from each other.

[0049] For example, some liquid ejection units have a liquid ejection head and a head tank integrated together, while others have a liquid ejection head and a head tank integrated together by being connected to each other by a tube, etc. Here, a unit including a filter can be added between the head tank and the liquid ejection head of these liquid ejection units.

[0050] Furthermore, there is a liquid ejection unit in which the liquid ejection head and the carriage are integrated.

[0051] In some liquid ejection units, the liquid ejection head is movably held by a guide member that constitutes part of the scanning movement mechanism, and the liquid ejection head and the scanning movement mechanism are integrated together. In other liquid ejection units, the liquid ejection head, the carriage, and the main scanning movement mechanism are integrated together.

[0052] Furthermore, there is a liquid ejection unit in which a cap member, which is part of the maintenance and recovery mechanism, is fixed to a carriage on which a liquid ejection head is attached, thereby integrating the liquid ejection head, carriage, and maintenance and recovery mechanism.

[0053] In some liquid ejection units, a tube is connected to a liquid ejection head equipped with a head tank or flow path components, integrating the liquid ejection head with a supply mechanism. Liquid is supplied from a liquid storage source to the liquid ejection head via this tube.

[0054] The main scanning movement mechanism includes the guide member alone, and the supply mechanism includes the tube alone and the loading unit alone.

[0055] Here, the "liquid ejection unit" is described in combination with a liquid ejection head, but the "liquid ejection unit" also includes a head module or head unit that includes the liquid ejection head described above, and that integrates the functional components and mechanisms described above.

[0056] "Liquid ejection devices" include devices that are equipped with a liquid ejection head, a liquid ejection unit, a head module, a head unit, etc., and that eject liquid by driving the liquid ejection head. Liquid ejection devices include not only devices that can eject liquid onto objects to which the liquid can adhere, but also devices that eject liquid into air or liquid.

[0057] This "liquid ejecting device" can also include means for feeding, transporting, and discharging items onto which liquid can be attached, as well as pre-processing devices and post-processing devices.

[0058] For example, examples of "liquid ejecting devices" include image forming devices that eject ink to form images on paper, and three-dimensional modeling devices (three-dimensional modeling devices) that eject modeling liquid onto a powder layer formed from layers of powder in order to create a three-dimensional object (a three-dimensional model).

[0059] Furthermore, the term "liquid ejection device" is not limited to devices that use ejected liquid to visualize meaningful images such as letters and figures. For example, it also includes devices that form patterns that have no meaning in themselves, and devices that create three-dimensional images.

[0060] The above-mentioned "object onto which a liquid can adhere" means an object onto which a liquid can adhere at least temporarily, an object onto which the liquid can adhere and stick, an object onto which the liquid can penetrate, etc. Specific examples include media such as paper, recording paper, film, and cloth, electronic circuit boards, electronic components such as piezoelectric elements, powder layers, organ models, and test cells, and unless otherwise specified, includes all objects onto which a liquid can adhere.

[0061] The material of the "substance to which a liquid can adhere" may be any material to which a liquid can adhere, even temporarily, such as paper, thread, fiber, fabric, leather, metal, plastic, glass, wood, or ceramics.

[0062] Furthermore, the "liquid ejection device" may be a device in which a liquid ejection head and an object onto which liquid can be attached move relatively, but is not limited to this. Specific examples include a serial type device in which a liquid ejection head moves, and a line type device in which a liquid ejection head does not move.

[0063] Other examples of "liquid ejecting devices" include a treatment liquid application device that ejects a treatment liquid onto paper to apply the treatment liquid to the surface of the paper for purposes such as modifying the surface of the paper, and an injection granulation device that ejects a composition liquid in which raw materials are dispersed through a nozzle to granulate fine particles of the raw materials.

[0064] In the present application, the terms image formation, recording, printing, copying, printing, modeling, etc. are all synonymous. [Explanation of symbols]

[0065] 1: Liquid ejection head 1A1: Head row 1A2: Head row 1B1: Head row 1B2: Head row 1C1: Head row 1C2: Head row 1D1: Head row 1D2: Head row 10: Nozzle plate 15: Nozzle cover 20: Individual flow path member 30: Diaphragm member 50: Common flow path member 60: Damper member 70: Pressure chamber actuator substrate 80: Frame member 81: Supply port 82: Collection port 100: Head module 100A: Head module 100B: Head module 101: Flexible wiring material 102: Drive circuit 103: Base member 104: Heat dissipation material 105: Manifold 107: Module case 113: Cover member 200:Through hole 200a: Inner surface 210: Adhesive resin 211 :part 212 :part 220: Signal line 221: Temperature measuring device 401: Guide member 403: Carriage 405: Main scanning motor 406: Drive pulley 407: Driven pulley 408: Timing belt 410: Paper 412: Conveyor belt 413: Transport roller 414: Tension roller 416: Sub-scanning motor 417: Timing belt 418: Timing pulley 420: Maintenance and recovery mechanism 421: Cap member 422: Wiper member 440: Liquid dispensing unit 441: Head Tank 442: Cover 443: Connector 444: Flow path parts 456: Tube 491A: Side panel 491B: Side plate 491C: Back plate 493: Main scanning movement mechanism 495:Transport mechanism 500:Printing device 501: Means of transport 503: Guide and conveying means 505:Printing means 507 :Drying means 509:Export means 510: Continuum 511: Main winding roller 550: Head unit 552: Common base member 559: Transport guide member 591: Winding roller G: distance [Prior art documents] [Patent documents]

[0066] [Patent Document 1] Patent Publication No. 2021-84372

Claims

1. a pressure chamber actuator substrate including a pressure chamber connected to a nozzle for ejecting liquid and a pressure generating means for pressurizing the liquid in the pressure chamber; a frame member that holds the pressure chamber actuator substrate; a temperature detection means for detecting the temperature of the pressure chamber actuator substrate, the frame member has a hole into which the temperature detection means is inserted and attached via resin, The liquid ejection head is characterized in that, when the liquid ejection head is in use, the resin has a portion that is in an uncured state and is in contact with the pressure chamber actuator substrate, and the other portion that is in a cured state.

2. a pressure chamber actuator substrate including a pressure chamber connected to a nozzle for ejecting liquid and a pressure generating means for pressurizing the liquid in the pressure chamber; a frame member that holds the pressure chamber actuator substrate; a temperature detection means for detecting the temperature of the pressure chamber actuator substrate, the frame member has a hole into which the temperature detection means is inserted and attached via resin, A liquid ejection head characterized in that, when the liquid ejection head is in use, the resin has a fluid portion that is in contact with the pressure chamber actuator substrate and other portions that do not have fluidity.

3. a pressure chamber actuator substrate including a pressure chamber connected to a nozzle for ejecting liquid and a pressure generating means for pressurizing the liquid in the pressure chamber; a frame member that holds the pressure chamber actuator substrate; a temperature detection means for detecting the temperature of the pressure chamber actuator substrate, the frame member has a hole into which the temperature detection means is inserted and attached via resin, A liquid ejection head characterized in that, when the liquid ejection head is in use, the resin has a portion that is in contact with the pressure chamber actuator substrate and has a first hardness, and another portion that has a second hardness that is higher than the first hardness.

4. 4. The liquid ejection head according to claim 1, the temperature detection means includes a temperature measuring device and a signal line extending from the temperature measuring device; A liquid ejection head characterized in that the contacting portion in the uncured state, having fluidity, or having the first hardness includes the periphery of the temperature measuring device and also includes an edge portion formed by the surface of the pressure chamber actuator substrate and the inner surface of the hole that contacts that surface.

5. 5. The liquid ejection head according to claim 1, A liquid ejection head characterized in that the distance between the tip of the temperature detection means on the surface side of the pressure chamber actuator substrate and the surface of the pressure chamber actuator substrate is within a range of 0 to 2 mm.

6. 4. The liquid ejection head according to claim 1, The liquid ejection head is characterized in that the inner peripheral surface of the hole has a tapered shape in which the cross-sectional area of ​​the opening increases as the hole becomes farther away from the pressure chamber actuator substrate.

7. 7. The liquid ejection head according to claim 1, The liquid ejection head according to claim 1, wherein a surface portion of the pressure chamber actuator substrate on the side of the frame member is made of a silicon substrate.

8. A liquid ejection unit comprising the liquid ejection head according to claim 1 .

9. 9. A liquid ejection device comprising: a liquid ejection head according to claim 1; or a liquid ejection unit according to claim 8.

Images