Methods and materials for improving barrier performance and reducing via resistance

Abstract

Embodiments of the present disclosure relate to methods and materials for forming barrier layers with improved barrier performance and / or reduced via resistance. Some embodiments of the present disclosure provide methods for passivating metal surfaces by exposing the metal surface to a metal complex containing an organic ligand having at least three carbon atoms and a double or triple bond eta-bonded to a central metal atom. Some embodiments provide barrier layers in vias that enable at least a 25% reduction in resistance, resulting in a thinner barrier layer with comparable barrier properties.

Description

[Technical Field]

[0001] FIELD OF THE DISCLOSURE Embodiments of the present disclosure generally relate to methods and materials useful for forming via interconnects. In particular, embodiments of the present disclosure provide via interconnects with improved diffusion barrier and / or reduced resistance. [Background technology]

[0002]

[0003] Some methods for producing electronic devices rely on interconnecting metal layers through interconnects in dielectric materials. These interconnects are often formed through small vias. As technology nodes become smaller and smaller, vias are required to have smaller diameters to facilitate high device density on a substrate.

[0003] An interconnect typically consists of a via with a metal bottom and dielectric sidewalls. The via is covered with a barrier layer to prevent metal diffusion into the dielectric, and a metal fill material is deposited within the via to electrically connect the metal material at the bottom of the via to the top surface of the via.

[0004] The resistance of the electrical path through a via is directly related to the thickness of the barrier layer. For example, a thinner barrier layer can increase the volume of metal in the via, thereby reducing the via resistance. Furthermore, because the barrier layer covers the metal bottom, a thicker barrier layer between the metal bottom and the metal fill increases the resistance.

[0005] Tantalum nitride (TaN) is a material of particular interest as a barrier layer for via interconnects. Atomic layer deposition (ALD) of TaN generally provides films with better barrier performance (for equivalent thickness) at higher deposition temperatures. However, at higher deposition temperatures, the selectivity of ALD TaN increasingly favors deposition on the metal bottom of the via rather than the dielectric sidewalls. This selectivity effect results in a thicker film at the bottom, increasing resistance.

[0006] Therefore, methods and materials are needed to improve barrier performance, reduce barrier film thickness on the bottom surface, and lower via resistance. Summary of the Invention

[0007] One or more embodiments of the present disclosure relate to a method for passivating a metal surface, the method comprising exposing the metal surface to a metal complex to form a passivated metal surface, the metal complex comprising a metal atom and an organic ligand having at least three carbon atoms and a double or triple bond ether-bonded to the metal atom.

[0008] An additional embodiment of the present disclosure relates to a method for depositing a barrier layer, comprising exposing a substrate surface, including a metal surface and a dielectric surface, to a first metal complex to form a treated substrate surface. The treated substrate surface comprises a treated metal surface and a treated dielectric surface. The first metal complex comprises a first metal atom and an organic ligand having at least three carbon atoms and a double or triple bond eta-bonded to the first metal atom. The treated substrate surface is sequentially exposed to a second metal precursor and a reactant to form a barrier layer on the treated substrate surface.

[0009] An additional embodiment of the present disclosure relates to a method for forming a via barrier layer. The method includes immersing a substrate surface with a first metal complex. A via is formed in the substrate surface. The via has sidewalls and a bottom surface. The sidewalls are dielectric surfaces and the bottom surface is a metal surface. The first metal complex adsorbs onto the metal surface to form a treated metal surface. The first metal complex includes a first metal atom and an organic ligand having at least three carbon atoms and a double or triple bond eta-bonded to the first metal atom. The substrate surface is sequentially exposed to a second metal precursor and a reactant to form the barrier layer. A metal layer is deposited on the barrier layer to at least partially fill the via.

[0010] In order that the above-recited features of the present disclosure may be understood in detail, a more particular description of the present disclosure briefly summarized above can be had by reference to embodiments, some of which are illustrated in the accompanying drawings. It should be noted, however, that the accompanying drawings illustrate only typical embodiments of the present disclosure and therefore should not be considered as limiting the scope of the present disclosure, since the present disclosure may admit of other equally effective embodiments. [Brief explanation of the drawings]

[0011] [Figure 1] 1A-1C are cross-sectional views of an exemplary substrate during processing in accordance with one or more embodiments of the present disclosure. [Figure 2] 1A-1C are cross-sectional views of an exemplary substrate during processing in accordance with one or more embodiments of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0012] Before describing several example embodiments of the present disclosure, it is to be understood that the present disclosure is not limited to the details of structure or process steps set forth in the following description. The present disclosure is capable of other embodiments and of being practiced or carried out in various ways.

[0013] The term "substrate," as used herein and in the appended claims, refers to a surface or portion of a surface upon which a process acts. Those skilled in the art will also understand that a reference to a substrate can also refer to only a portion of a substrate, unless the context clearly dictates otherwise. Additionally, a reference to depositing on a substrate can refer to both a bare substrate and a substrate upon which one or more films or features have been deposited or formed.

[0014] As used herein, "substrate" refers to any substrate or material surface formed on a substrate on which a film treatment is performed during a manufacturing process. For example, substrate surfaces on which treatment can be performed include silicon, silicon oxide, strained silicon (developed by IBM), silicon-on-insulator (SOI), carbon-doped silicon oxide, amorphous silicon, doped silicon, germanium, gallium arsenide, glass, sapphire, and any other materials such as metals, metal nitrides, alloys, and other conductive materials, depending on the application. Substrates include, but are not limited to, semiconductor wafers. Substrates may be subjected to pretreatment processes to polish, etch, reduce, oxidize, hydroxylate, anneal, UV cure, electron beam cure, and / or bake the substrate surface. In addition to performing film treatments directly on the surface of the substrate itself, in this disclosure, any of the disclosed film treatment steps may also be performed on an underlying layer formed on the substrate, as disclosed in more detail below, and the term "substrate surface" is intended to include such underlying layers as the context indicates. Thus, for example, when a film / layer or partial film / layer is deposited on a substrate surface, the exposed surface of the newly deposited film / layer becomes the substrate surface.

[0015] One or more embodiments of the present disclosure relate to methods for passivating metal surfaces, some of which advantageously reduce the thickness of films deposited on the passivated metal surface by at least 20%.

[0016] Referring to FIG. 1 , an exemplary method 100 for processing a substrate 200 according to one or more embodiments of the present disclosure is shown. The substrate 200 includes a metallic material 210 having a metallic surface 215. In some embodiments, the metallic surface includes one or more of copper, cobalt, tungsten, molybdenum, or ruthenium. In some embodiments, the metallic surface consists essentially of copper. In some embodiments, the metallic surface consists essentially of ruthenium. In some embodiments, the metallic surface consists essentially of molybdenum. As used in this context, a surface "consisting essentially of" a described material includes, on an atomic number basis, 95% or more, 98% or more, 99% or more, or 99.5% or more of the described material.

[0017] At 110, the metal surface 215 is exposed to a metal complex to form a stabilized metal surface 225. The metal complex includes a metal atom and an organic ligand having at least three carbon atoms and a double or triple bond that is eta-bonded to the metal atom.

[0018] In some embodiments, exposing the metal surface 215 to the metal complex comprises immersing the substrate 200 including the metal surface 215 in the metal complex. In some embodiments, the substrate 200 is immersed for a time ranging from 1 second to 20 seconds, from 2 seconds to 15 seconds, from 3 seconds to 10 seconds, or from 2 seconds to 5 seconds.

[0019] In some embodiments, the metal complex comprises a compound having the general formula M(NR2)3L. See structure (I). [ka] (I) where M is a metal, each R is independently selected from the group consisting of H and C1-C5 alkyl, and L is an organic ligand having at least three carbon atoms and a double or triple bond that is eta (η) bonded to the metal atom. When used in this manner, an eta (η) bond refers to a ligand that is coordinately bonded to the metal atom by at least two adjacent atoms.

[0020] In some embodiments, the metal atoms (M) comprise, consist essentially of, or consist of tantalum. In some embodiments, the term "consist essentially of" means that, on an atomic basis, about 95%, 98%, 99%, or 99.5% or more of the metal atoms are the recited nuclide.

[0021] In some embodiments, the organic ligand has an η structure where two adjacent atoms are coordinated to the metal atom. 2 The organic ligand coordinates to the metal atom via a bond. In some embodiments, the organic ligand comprises 3 to 18 carbon atoms. In some embodiments, the organic ligand comprises 3 or more carbon atoms with double bonds. In some embodiments, the organic ligand comprises 3 or more carbon atoms with triple bonds.

[0022] In some embodiments, the organic ligand contains at least one non-terminal double and / or triple bond. As used in this context, a terminal bond refers to any bond involving an atom that forms the end of a chain of atoms, excluding a hydrogen atom. For example, 2-butene, which has a double bond between the second and third carbon atoms, has a non-terminal double bond. In contrast, butene, which has a double bond between the first and second carbon atoms, has a terminal double bond.

[0023] In some embodiments, the organic ligand has a lower binding energy than each of the -NR groups. In some embodiments, the organic ligand comprises an alkene. In some embodiments, the organic ligand comprises an alkyne. In some embodiments, the organic ligand comprises one or more of butene, butyne, pentene, pentyne, hexane, hexyne, heptane, heptyne, octene, octyne, nonene, nonyne, decene, or decene and their structural isomers (e.g., 2-butene, 3-hexyne). In some embodiments, the organic ligand comprises a cycloalkene. In some embodiments, the organic ligand comprises one or more of cyclopentene, cyclopentadiene, cyclohexene, 1,3-cyclohexadiene, 1,4-cyclohexadiene, benzene, and alkyl-substituted derivatives thereof (e.g., methylcyclopentadiene).

[0024] The organic ligands bind to the metal surface 215 to form a stabilized metal surface 225 and inhibit deposition thereon. In some embodiments, at 120, a film 230 is deposited on the stabilized metal surface 225. As shown in FIG. 1 , the film 230 deposited on the stabilized metal surface 225 has a thickness T1. In contrast, when the film 230 is deposited on the unstabilized metal surface 215, as shown at 150, the film 230 has a thickness T2.

[0025] T1 is thinner than T2. ​​In some embodiments, T1 is at least 5% thinner than T2, at least 10% thinner than T2, at least 20% thinner than T2, at least 25% thinner than T2, at least 30% thinner than T2, or at least 50% thinner than T2.

[0026] 2, a method 300 for depositing a barrier layer 430 on a treated substrate surface is shown. The method 300 begins with a substrate 400 that includes a substrate surface. The substrate 400 includes a metallic material 410 having a metallic surface 415 and a dielectric material 420 having a dielectric surface 425. Those skilled in the art will understand that the substrate surface includes the metallic surface 415 and the dielectric surface 425. The metallic material 410 can be selected from the same materials identified above for the metallic material 210.

[0027] In some embodiments, a substrate surface has a via 450 formed therein, as shown in Figure 2. The via 450 has sidewalls 452, 454 and a bottom 456. As shown in Figure 2, the sidewalls 452, 454 are dielectric surfaces 425, and the bottom 456 is a metal surface 415. This configuration of materials / surfaces and portions of the via 450 is merely exemplary and is not intended to limit the scope of the present disclosure.

[0028] At 310, substrate 400 is exposed to a first metal complex to form a treated substrate surface. Those skilled in the art will appreciate that the treated substrate surface includes treated metal surface 417 and treated dielectric surface 427. The first metal complex and the exposure of the substrate thereto are described above with respect to method 100.

[0029] Without being bound by theory, it is believed that the first metal complex has a greater binding affinity for the metal surface 415. Therefore, it is envisioned that the first metal complex will interact with both the metal surface 415 and the dielectric surface 425, but the density of the first metal complex is expected to be higher on the metal surface 415 than on the dielectric surface 425 after the substrate 400 is exposed to the first metal complex. Thus, although the first metal complex (denoted as X) is shown only on the metal surface 415 to form the treated metal surface 417 in FIG. 2 , one skilled in the art will understand that at least a portion of the first metal complex will also be present on the dielectric surface 425 to form the treated dielectric surface 427.

[0030] Stated another way, in some embodiments, the first metal complex selectively adsorbs to the metal surface 415 over the dielectric surface 425. In some embodiments, the amount of first metal complex per unit area on the metal surface 415 is at least 2 times, at least 5 times, at least 10 times, at least 25 times, or at least 50 times greater than the amount of first metal complex per unit area on the dielectric surface 425.

[0031] In some embodiments, the treated substrate surface is purged with an inert gas after exposure to the first metal complex. Without being bound by theory, as discussed above, it is believed that the binding of the first metal complex to the metal surface 415 is stronger than the binding of the first metal complex to the dielectric surface 425. Therefore, it is believed that the inert gas purge is useful for removing the first metal complex from the dielectric surface 425 while having little or no effect on the first metal complex on the metal surface 415.

[0032] At 320, the treated substrate surface is sequentially exposed to a second metal precursor and a reactant to form a barrier layer 430 on the treated substrate surface. In some embodiments, the formation of the barrier layer is performed by atomic layer deposition (ALD).

[0033] As noted above, the presence of the first metal complex on the metal surface inhibits deposition on the metal surface. Thus, in some embodiments, the second metal precursor selectively adsorbs to the treated dielectric surface 427 over the treated metal surface 417.

[0034] Barrier layer 430 is selectively formed on treated dielectric surface 427 over treated metal surface 417. Barrier layer 430 has a thickness T3 on treated metal surface 417 and a thickness T4 on treated dielectric surface 427. In some embodiments, T3 is at least 5%, at least 10%, at least 15%, at least 20%, at least 25%, at least 30%, at least 40%, or at least 50% thinner than T4. Without being bound by theory, it is believed that the reduced thickness on the metal surface results in a reduced resistance of the fully formed via interconnect. Thus, one or more methods of the present disclosure advantageously provide a via interconnect with reduced resistance.

[0035] In some embodiments, the first metal complex and the second metal precursor comprise the same metal. In some embodiments, the first metal complex and the second metal precursor comprise tantalum. In some embodiments, the first metal complex and the second metal precursor comprise different metals.

[0036] In some embodiments, the barrier layer 430 comprises tantalum. In some embodiments, the barrier layer comprises or consists of tantalum nitride. In some embodiments, the second metal precursor comprises pentakis(dimethylamino)tantalum (PDMAT, Ta(N(CH3)2)5). In some embodiments, the reactant comprises ammonia.

[0037] In some embodiments, the process temperature during deposition of barrier layer 430 is controlled. In some embodiments, the temperature is maintained in the range of 250°C to 350°C, in the range of 275°C to 325°C, in the range of 300°C to 350°C, or in the range of 300°C to 325°C. In some embodiments, the temperature is maintained at about 325°C.

[0038] Without being bound by theory, it is believed that barrier layers, particularly tantalum nitride layers, have excellent barrier properties when deposited at higher temperatures.However, higher deposition temperatures generally result in increased deposition rates on copper surfaces compared to silicon oxide surfaces.One or more methods disclosed herein advantageously allow for the deposition of barrier layers at higher deposition temperatures without losing selectivity between metal surfaces and dielectric surfaces.

[0039] At 330, a metal layer 440 is deposited on the barrier layer 430 to at least partially fill the via 450. In some embodiments, the metal layer 440 comprises or consists essentially of copper. In some embodiments, the metal layer 440 comprises one or more of the materials identified as the metal material 210.

[0040] In some embodiments, metal layer 440 is deposited by physical vapor deposition (PVD). In some embodiments, metal layer 440 overfills via 450. In these embodiments, substrate 400 can be planarized to remove excess metal layer 440 outside via 450.

[0041] As noted above, one or more methods of the present disclosure advantageously provide via interconnects with reduced resistance, in some embodiments, the resistance of the via is at least 10%, at least 20%, at least 30%, at least 40%, or at least 50% less than the resistance of a similar via having a barrier layer formed without immersing the substrate surface with the first metal complex.

[0042] Throughout this specification, references to "one embodiment," "some embodiments," "one or more embodiments," or "one embodiment" mean that a particular feature, structure, material, or characteristic described in connection with an embodiment is included in at least one embodiment of the present disclosure. Thus, the appearances of phrases such as "one or more embodiments," "some embodiments," "in one embodiment," or "in one embodiment" in various places throughout this specification do not necessarily refer to the same embodiment of the present disclosure. Moreover, particular features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments.

[0043] Although the present disclosure herein has been described with reference to particular embodiments, those skilled in the art will recognize that the described embodiments are merely illustrative of the principles and applications of the present disclosure. It will be apparent to those skilled in the art that various modifications and variations can be made in the disclosed method and apparatus without departing from the spirit and scope of the present disclosure. Accordingly, the present disclosure may include modifications and variations that come within the scope of the appended claims and their equivalents.

Claims

1. 1. A method for passivating a metal surface, comprising exposing the metal surface to a metal complex to form a passivated metal surface, the metal complex comprising a metal atom and an organic ligand having at least three carbon atoms and a double or triple bond eta-bonded to the metal atom.

2. the metal surface comprises copper, cobalt, tungsten, molybdenum, or ruthenium; The method of claim 1.

3. The method of claim 1 , wherein the metal atoms consist essentially of tantalum.

4. The method of claim 1 , wherein the organic ligand comprises an alkyne.

5. The method of claim 1 , wherein the organic ligand comprises a cycloalkene.

6. The metal complex has the general formula M(NR 2 ) 3 10. The method of claim 1, having L, wherein M is a metal, each R is independently selected from the group consisting of H and C1-C5 alkyl, and L is an organic ligand.

7. The M-L bond is M-NR 2 The method of claim 6 , wherein the bond has a lower bond energy than each of the bonds.

8. 10. The method of claim 1, wherein the film deposited on the stabilized metal surface has a thickness that is at least 20% less than the thickness of a film deposited on the unstabilized metal surface.

9. 1. A method of depositing a barrier layer, comprising: exposing a substrate surface, including a metal surface and a dielectric surface, to a first metal complex to form a treated substrate surface, wherein the treated substrate surface comprises a treated metal surface and a treated dielectric surface, and the first metal complex comprises a first metal atom and an organic ligand having at least three carbon atoms and a double or triple bond eta-bonded to the first metal atom; sequentially exposing the treated substrate surface to a second metal precursor and a reactant to form a barrier layer on the treated substrate surface; A method comprising:

10. The method of claim 9 , wherein the metal surface comprises copper, cobalt, tungsten, or ruthenium.

11. 10. The method of claim 9, wherein the first metal complex selectively adsorbs to the metal surface over the dielectric surface.

12. 10. The method of claim 9, wherein the second metal precursor selectively adsorbs onto the treated dielectric surface over the treated metal surface.

13. 10. The method of claim 9, wherein the first metal complex and the second metal precursor comprise the same metal.

14. The method of claim 13 , wherein the first metal complex and the second metal precursor comprise tantalum.

15. The first metal complex is represented by the general formula M(NR 2 ) 3 10. The method of claim 9, comprising a compound having L, wherein M is the first metal, each R is independently selected from the group consisting of H and C1-C5 alkyl, and L is an organic ligand.

16. The second metal precursor is pentakis(dimethylamino)tantalum (PDMAT, Ta(N(CH 3 ) 2 ) 5 10. The method of claim 9, wherein the reactant comprises ammonia.

17. 17. The method of claim 16, wherein the treated substrate surface is maintained at a temperature in the range of 275°C to 325°C during formation of the barrier layer.

18. 10. The method of claim 9, further comprising an inert gas purge of the substrate surface between exposing the substrate surface to the first metal complex and sequentially exposing the treated substrate surface to the second metal precursor and the reactant.

19. 1. A method of forming a via barrier layer, comprising: immersing a substrate surface with a first metal complex, the substrate surface having a via formed therein, the via having a sidewall and a bottom surface, the sidewall being a dielectric surface and the bottom surface being a metal surface, the first metal complex adsorbing onto the metal surface to form a treated metal surface, the first metal complex comprising a first metal atom and an organic ligand having at least three carbon atoms and a double or triple bond eta-bonded to the first metal atom; sequentially exposing the substrate surface to a second metal precursor and a reactant to form a barrier layer; depositing a metal layer over the barrier layer to at least partially fill the via; A method comprising:

20. 20. The method of claim 19, wherein the via resistance is at least 40% less than the resistance of a similar via having a barrier layer formed without immersing the substrate surface with the first metal complex.

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