Substrate Processing Equipment

Abstract

To provide a substrate processing apparatus that can easily transfer a substrate while allowing stable attitude change by providing a sufficient clearance to allow the apparatus to rise when transferring the substrate.SOLUTION: When the postures of multiple substrates W are changed, a posture changing unit 41 holds the multiple substrates W with a narrow gap between the upper surfaces of the multiple substrates W. Therefore, the multiple substrates W can be stably held and the postures can be stably changed. When the multiple substrates W are transferred in a horizontal posture, the posture changing unit 41 holds the multiple substrates W with a wide gap US between the upper surfaces of the multiple substrates W. Therefore, a bridge robot can easily transfer each of the multiple substrates W.SELECTED DRAWING: Figure 21

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus for performing predetermined processing on substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks. [Background technology]

[0002] Conventionally, this type of apparatus includes a batch module, a single-wafer module, and a rotation mechanism (see, for example, Patent Document 1). A batch module processes multiple substrates at once. A single-wafer module processes substrates one by one. Generally, a drying process using a single-wafer module has a smaller processing atmosphere space that affects the substrates and higher particle performance than a drying process using a batch module. Therefore, it is easier to improve the drying performance of a single-wafer module than a batch module. Therefore, for example, after performing an etching process and a rinsing process in a batch module, a drying process is performed in a single-wafer module.

[0003] In the batch-type module, multiple substrates are processed in a vertical position. On the other hand, in the single-wafer module, substrates are processed in a horizontal position. Therefore, the vertically oriented substrates that have finished processing in the batch-type module are converted to a horizontal position by a rotation mechanism before being transferred to the single-wafer module. The rotation mechanism is equipped with an inversion chuck with grooves that hold the substrates.

[0004] Specifically, the groove of the reversing chuck has a guide groove on the front side and a locking groove on the back side. The guide groove is configured in a V-shape to guide the periphery of the substrate. The locking groove has a shape that is slightly thicker than the thickness of the substrate so as to prevent the substrate from moving significantly in the thickness direction and lock the edge of the substrate. As a result, when the reversing chuck clamps the substrate, the periphery of the substrate is guided by the guide groove, and the edge of the substrate is gripped by the locking groove. This allows for stable rotation of the substrate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Special Publication No. 2016-502275 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the conventional example having such a configuration has the following problems. In other words, in conventional devices, the distance that the substrate can be raised in the locking groove of the inversion chuck is very short. Therefore, although the position change can be performed stably, there is a problem that it is difficult to control the hand that receives the substrate in a horizontal position.

[0007] The present invention has been made in consideration of the above circumstances, and aims to provide a substrate processing apparatus that can easily transfer substrates while enabling stable posture changes by providing a gap that allows for sufficient lift when transferring substrates. [Means for solving the problem]

[0008] In order to achieve the above object, the present invention has the following configuration. That is, the invention described in claim 1 is a substrate processing apparatus for processing substrates, comprising: a batch processing section that processes multiple substrates in a vertical position at once; a single-wafer processing section that processes a single substrate in a horizontal position; an attitude change section that converts the multiple substrates that have finished processing in the batch processing section from a vertical position to a horizontal position; a first transport section that transports the multiple substrates that have finished processing in the batch processing section to the attitude change section; and a second transport section that transports the multiple substrates that have been set to a horizontal position in the attitude change section to the single-wafer processing section, wherein the attitude change section holds the multiple substrates with a narrow gap above their upper surfaces when changing the attitude of the multiple substrates, and holds the multiple substrates with a wide gap above their upper surfaces when setting the multiple substrates to a horizontal position and transferring them.

[0009] [Actions and Effects] According to the invention described in claim 1, a plurality of substrates processed in a batch processing unit are transported by a first transport unit to a posture conversion unit, where they are converted from a vertical posture to a horizontal posture. The plurality of substrates converted to a horizontal posture are then transferred one by one by a second transport unit, and then processed in a single-wafer processing unit. When converting the postures of the plurality of substrates, the posture conversion unit holds the plurality of substrates with a narrow gap above their upper surfaces. Therefore, the plurality of substrates can be stably held and their postures can be stably changed. When transferring a plurality of substrates in a horizontal posture, the posture conversion unit holds the plurality of substrates with a wide gap above their upper surfaces. Therefore, the second transport unit can easily transfer each of the plurality of substrates.

[0010] In the present invention, the posture conversion unit includes inversion chucks disposed opposite each other in a radial direction of the plurality of substrates and clamping peripheral edges of the plurality of substrates, a drive mechanism for horizontally moving the inversion chucks across at least two locations: a first gap for transferring the plurality of substrates between the first transport unit and the second transport unit; and a second gap that is narrower than the first gap and clamps the plurality of substrates; and a rotation mechanism for rotating the inversion chucks in a surface direction of the plurality of substrates, wherein the inversion chucks have first grooves that allow the plurality of substrates to move in a thickness direction, and grooves formed outward of the plurality of substrates from the first grooves, and the plurality of substrates are and second grooves for clamping the plurality of substrates in a radial direction while restricting movement in a thickness direction, and when the inversion chuck receives the plurality of substrates from the first transport unit, the driving mechanism causes the plurality of substrates to be accommodated in the first grooves at the first intervals, and when the rotation mechanism rotates the plurality of substrates into a horizontal position, the driving mechanism causes the plurality of substrates to be clamped in the second grooves at the second intervals, and when the second transport unit receives the plurality of substrates from the inversion chuck, the driving mechanism causes the plurality of substrates to be supported by abutting the lower surfaces of the plurality of substrates in the first grooves at the first intervals (see claim 1). 1 ).

[0011] When the inverting chuck receives multiple substrates from the first transport unit, the drive mechanism sets the substrates at a first interval and accommodates each of the multiple substrates in the first groove. When the rotation mechanism rotates the multiple substrates into a horizontal position, the drive mechanism sets the substrates at a second interval and clamps each of the multiple substrates in the second groove. Therefore, when the position is changed, movement of the substrates in the thickness direction is restricted. As a result, the multiple substrates can be stably held and their position can be changed stably. When the second transport unit receives multiple substrates from the inverting chuck, the drive mechanism sets the substrates at a first interval and supports the bottom surfaces of the multiple substrates in the first groove. Therefore, movement of the substrates in the thickness direction is permitted when the substrates are transferred. As a result, the second transport unit can easily pick up and transfer each of the multiple substrates. The position change unit can clamp or loosely hold the substrates simply by moving the inverting chuck horizontally with the drive mechanism.

[0012] In the present invention, it is preferable that the second groove has an apex where the end faces of the plurality of substrates are located and a rear inclined surface that widens from the apex toward the center of the plurality of substrates, and the first groove has an opening toward the center of the plurality of substrates and a front inclined surface that widens from the rear inclined surface toward the opening (see claim 2 ).

[0013] The inversion chuck has two grooves: a first groove and a second groove. The second groove holds the edge of the substrate at its top and supports the underside of the substrate with its rear inclined surface. This allows the substrate to be stably clamped. The first groove, which continues from the second groove, abuts and supports the underside of the substrate with its front inclined surface that widens toward the opening. This allows for sufficient clearance on the upper surface of the substrate.

[0014] In the present invention, it is preferable that the rear inclined surface and the front inclined surface have inclined surfaces at positions facing the front and rear surfaces of the plurality of substrates (see claim 3 ).

[0015] In substrate processing equipment, lots consisting of multiple substrates with their surfaces facing each other (so-called face-to-face) may be processed. When processing such lots, multiple substrates with their surfaces facing a predetermined direction may be held by an inversion chuck and inverted, or multiple substrates with their surfaces facing the opposite direction may be held by an inversion chuck and inverted in the opposite direction to the substrates with their surfaces facing the predetermined direction. The bottom surfaces of the substrates then slide along the rear inclined surface and are supported in contact with the front inclined surface. Therefore, regardless of the direction of the multiple substrates with their surfaces facing, they can be reliably moved from the rear inclined surface to the front inclined surface and supported in contact with the front inclined surface.

[0016] In the present invention, it is preferable that the front side inclined surface has a gentler inclination than the rear side inclined surface (see claim 1). 4 ).

[0017] When the inverting chuck is shifted from the second distance to the first distance, the substrate is moved from the rear inclined surface to the front inclined surface. At this time, the impact on the underside of the substrate can be reduced, so that the generation of particles when the distance is shifted from the second distance to the first distance can be suppressed.

[0018] In the present invention, it is preferable that the posture conversion unit further includes an alignment bar that is movable between a restricting position that restricts horizontal movement of the plurality of substrates and an allowing position that allows horizontal movement of the plurality of substrates when the plurality of substrates are held in a horizontal posture by the inversion chuck, and that the alignment bar is moved to the restricting position before the inversion chuck is expanded from the second spacing to the first spacing (see claim 5 ).

[0019] The alignment bar is moved to the regulating position before the inverting chuck is expanded from the second gap to the first gap. Therefore, it is possible to prevent the multiple substrates from shifting horizontally when the inverting chuck moves. As a result, the substrates can be reliably transferred by the second transport unit.

[0020] In the present invention, it is preferable that the alignment bar is provided on the side where the second transport unit receives the plurality of substrates and on the opposite side of the receiving side across the plurality of substrates in a plan view (see claim 1). 6 ).

[0021] The horizontal position of the substrate on the side where the second transport unit moves forward and backward can be regulated. Therefore, the front and rear positions of the substrate can be regulated as viewed from the second transport unit. As a result, the substrate can be reliably handed over when being transferred by the second transport unit.

[0022] In the present invention, after the spacing is expanded from the second spacing to the first spacing, when the second transfer unit receives the plurality of substrates from the inversion chuck, it is preferable that the alignment bar on the receiving side of the alignment bars is moved to the allowable position (claim 7 ).

[0023] The substrate is transferred by the second transport unit after the alignment bar on the receiving side is moved to the allowable position, which allows the second transport unit to transfer the substrate smoothly.

[0024] In the present invention, it is preferable that the alignment bar has a plurality of grooves formed therein corresponding to the positions of the end faces of the plurality of substrates (see claim 8 ).

[0025] When the inverting chuck is moved from the second gap to the first gap, the substrates move downward from the rear inclined surface to the front inclined surface, and large horizontal movements are restricted at that time, and the generation of particles due to the edge surfaces of the substrates rubbing against each other can be suppressed.

[0026] In the present invention, it is preferable that the apparatus further includes a lifting mechanism for lifting and lowering the inverting chuck, and that when the second transport unit receives the plurality of substrates from the inverting chuck, the lifting mechanism lowers the inverting chuck (see claim 1). 9 ).

[0027] The substrate can be transferred to the second transfer unit by lowering the inversion chuck using the lifting mechanism without raising or lowering the second transfer unit, thereby simplifying the configuration of the second transfer unit.

[0028] In the present invention, when the first transport unit transfers the plurality of substrates to the inverting chucks, the lifting mechanism preferably lowers the inverting chucks, which are spaced apart at the first interval, from a receiving height near the upper edges of the plurality of substrates transported by the first transport unit to a clamping height near the side edges of the plurality of substrates (see claim 10 ).

[0029] When the lifting mechanism lowers the inverting chuck, which is set at the first interval, from the receiving height to the clamping height, multiple substrates can be transferred to the inverting chuck. Therefore, multiple substrates can be transferred with simple control. [Effects of the Invention]

[0030] In the substrate processing apparatus according to the present invention, a plurality of substrates processed in a batch processing unit are transported by a first transport unit to a position changing unit, where they are converted from a vertical position to a horizontal position. The substrates converted to a horizontal position are then transferred one by one by a second transport unit, and then processed in a single-wafer processing unit. When converting the position of the plurality of substrates, the position changing unit holds the plurality of substrates with a narrow gap above their upper surfaces. This allows the plurality of substrates to be stably held and their position to be stably changed. When transferring a plurality of substrates in a horizontal position, the position changing unit holds the plurality of substrates with a wide gap above their upper surfaces. This allows the second transport unit to easily transfer each of the plurality of substrates. [Brief explanation of the drawings]

[0031] [Figure 1] 1 is a plan view showing an overall configuration of a substrate processing apparatus according to an embodiment; [Figure 2] FIG. 2 is a cross-sectional view taken along the line AA in FIG. [Figure 3] FIG. 10 is a plan view showing the configuration of a 25-plate chuck and a reversing chuck. [Figure 4] FIG. 10 is a front view showing a state in which the reversal chuck is at a first interval. [Figure 5] FIG. 10 is a front view showing a state in which the reversal chuck is at a second interval. [Figure 6] FIG. 10 is a cross-sectional view of the inversion chuck in a state where the inversion chuck is spaced at a first distance. [Figure 7] FIG. 10 is a cross-sectional view of the inversion chuck in a state where the inversion chuck is spaced at a second interval. [Figure 8] FIG. 10 is a front view showing the configuration of the attitude changing unit, showing a state in which the substrate is held in a vertical attitude. [Figure 9] FIG. 10 is a front view showing the configuration of the attitude changing unit, showing a state in which the substrate is held in a horizontal attitude. [Figure 10] FIG. [Figure 11] 10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 12] 10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 13] 10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 14] 10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 15] 10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 16] 10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 17] 10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 18] 10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 19]10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 20] 10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 21] 10A and 10B are vertical cross-sectional views showing the operation of the inverting chuck. [Figure 22] 10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 23] 10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 24] 10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 25] 10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 26] 10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 27] 10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 28] 10A and 10B are diagrams illustrating the attitude changing operation of the substrate. [Figure 29] 10A and 10B show a modified example of the reversing chuck and a state during transfer. [Figure 30] 10A and 10B are diagrams showing a modified example of the inversion chuck, illustrating a state when changing the posture. DETAILED DESCRIPTION OF THE INVENTION

[0032] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0033] Fig. 1 is a plan view showing the overall configuration of a substrate processing apparatus according to an embodiment, and Fig. 2 is a cross-sectional view taken along the line AA in Fig. 1.

[0034] <1. Overall structure>

[0035] The substrate processing apparatus 1 processes substrates W. For example, the substrate processing apparatus 1 performs chemical processing, cleaning processing, drying processing, etc. on the substrates W. The substrate processing apparatus 1 employs a processing method (a so-called hybrid method) that combines the batch and single-wafer processing methods. The batch method processes multiple substrates W in a vertical position all at once. The single-wafer method processes a single substrate W in a horizontal position.

[0036] The substrate processing apparatus 1 includes a batch processing apparatus 3 and a single wafer processing apparatus 5. In this embodiment, the single wafer processing apparatus 5 is disposed adjacent to the batch processing apparatus 3. The batch processing apparatus 3 and the single wafer processing apparatus 5 are disposed at a distance from each other. The batch processing apparatus 3 and the single wafer processing apparatus 5 are connected by a bridge section 7.

[0037] <2. Batch processing equipment>

[0038] The batch processing apparatus 3 collectively processes a plurality of substrates W. The batch processing apparatus 3 includes a carry-in block 9, a stocker block 11, a transfer block 13, a posture changing block 15, and a processing block 17.

[0039] For convenience, in this specification, the direction in which the loading block 9, stocker block 11, transfer block 13, and processing block 17 are aligned is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, the direction from the stocker block 11 toward the loading block 9 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For reference, in each figure, front, back, right, left, top, and bottom are indicated as appropriate.

[0040] <3. Carry-in block>

[0041] The carry-in block 9 includes a loading section 19. The loading section 19 is arranged in the front X of the batch processing apparatus 3. The carrier C stores a plurality of (e.g., 25) substrates W in a horizontal position, stacked at regular intervals in the vertical direction Z. The carrier C has a plurality of grooves (not shown) formed therein, separating the surfaces of the substrates W and accommodating each substrate W. An example of the carrier C is a front-opening unify pod (FOUP). A FOUP is a sealed container. The carrier C may be an open container and may be of any type. The loading section 19 includes, for example, two mounting tables 21 on which the carriers C are placed. The two mounting tables 21 are arranged, for example, along the width direction Y. The loading section 19 is also called a load port.

[0042] <4. Stocker Block>

[0043] The stocker block 11 is disposed adjacent to the rear X of the carry-in block 9. The stocker block 11 includes a transporting and storing unit ACB. The transporting and storing unit ACB includes a transport mechanism 23 and shelves 25.

[0044] The transport mechanism 23 transports the carriers C. The transport storage unit ACB has a plurality of shelves 25. Some of the shelves 25 are simply where the carriers C are placed temporarily, and others are where the carriers C are placed for transfer to and from the first transport mechanism HTR. The transport storage unit ACB takes in the carriers C storing unprocessed substrates W from the input unit 19 and places them on the shelves 25. The transport storage unit ACB transports and places the carriers C on the delivery shelf 25 in accordance with a schedule that defines the processing order. The transport storage unit ACB transports and places the emptied carriers C that have been placed on the delivery shelf 25 on the shelf 25. The transport storage unit ACB unloads the empty carriers C placed on the shelf 25 onto the delivery table 21 in accordance with the availability of the table 21. The empty carriers C are transported to the single-wafer processing unit 5. In the empty carrier C transported to the single wafer processing section 5, for example, a substrate W that was stored in this carrier C before processing and has now been processed is stored in the single wafer processing section 5.

[0045] <5. Transfer block>

[0046] The transfer block 13 is disposed adjacent to the rear X of the stocker block 11. The transfer block 13 includes a transfer mechanism CTC. The transfer mechanism CTC includes a first transport mechanism HTR, a conversion mechanism HVC, a pusher PH, and a second transport mechanism WTR.

[0047] A first transport mechanism HTR is disposed on the right side Y of the rear X of the transport storage unit ACB. The first transport mechanism HTR transports multiple substrates W in a batch. In other words, the first transport mechanism HTR is equipped with multiple hands (not shown). Each hand supports one substrate W. The first transport mechanism HTR can also transport only one substrate W. The first transport mechanism HTR picks up multiple substrates W (e.g., 25 substrates) in a batch from a carrier C placed on a delivery shelf 25 in the transport storage unit ACB, and transports them in a horizontal position to the conversion mechanism HVC. At this time, the conversion mechanism HVC converts the position of the substrates W from a horizontal position to a vertical position.

[0048] To the left Y of the first transport mechanism HTR, a conversion mechanism HVC and a pusher PH are arranged in this order. The conversion mechanism HVC delivers multiple substrates W to the pusher PH. After receiving the multiple substrates W from the conversion mechanism HVC, the pusher PH moves in the width direction Y to the second transport mechanism WTR. At this time, the conversion mechanism HVC and the pusher PH assemble or disassemble a batch lot. The pusher PH delivers multiple substrates W to the second transport mechanism WTR.

[0049] The transfer mechanism CTC combines, for example, multiple substrates W constituting one lot removed from one carrier C with multiple substrates W constituting another lot removed from another carrier C into one batch lot. This is the assembly of the batch lot. A batch lot consists of twice the number of substrates W as one lot. In a batch lot, each substrate W from one lot is arranged adjacent to each substrate W from another lot. In other words, each substrate W from one lot is arranged odd-numbered, and each substrate W from the other lot is arranged even-numbered. Typically, the spacing between multiple substrates W removed from a carrier C is the same as that of the carrier C. This is called full pitch. In a batch lot, for example, the spacing between multiple substrates W is half the full pitch. This is called half pitch. As described above, a batch lot is combined with another lot. There are two types of combination methods: front-to-face (also called face-to-face) and back-to-back (also called back-to-face). The way the lots are combined is determined by the operation of the pusher PH. In the following description, a plurality of substrates W will be referred to as a lot, but when a description specific to a batch lot is required, a plurality of substrates W will be referred to as a batch lot.

[0050] The second transport mechanism WTR is disposed to the left Y of the transfer mechanism CTC. The second transport mechanism WTR is configured to be movable between the transfer block 13 and the processing block 17. The second transport mechanism WTR is configured to be movable in the front-rear direction X. The second transport mechanism WTR is equipped with a pair of hands 27 that transports a lot. The pair of hands 27 has, for example, a rotation axis facing the width direction Y. The pair of hands 27 swings around this rotation axis. The pair of hands 27 clamps the side end surfaces of the substrates W that constitute a lot, located in the front-rear direction X. The second transport mechanism WTR transfers the substrates W that constitute a lot between itself and the transfer mechanism CTC. The second transport mechanism WTR transfers the unprocessed substrates W that constitute a lot to the processing block 17. The second transport mechanism WTR transfers the substrates W that have been processed in the processing block 17 between itself and the attitude conversion block 15.

[0051] Here, the processing block 17 will be explained before the posture transformation block 15.

[0052] <6. Processing Block>

[0053] The processing block 17 includes, for example, a batch processing unit BPU. For example, the batch processing unit BPU includes six processing units. Specifically, the batch processing unit BPU includes a first batch processing unit BPU1, a second batch processing unit BPU2, a third batch processing unit BPU3, a fourth batch processing unit BPU4, a fifth batch processing unit BPU5, and a sixth batch processing unit BPU6. The number of batch processing units BPU is not limited to six. In other words, the number of batch processing units BPU may be less than six, or may be seven or more.

[0054] The first batch processing unit BPU1 to the sixth batch processing unit BPU6 are arranged in a row in the front-rear direction X. Each of the first batch processing unit BPU1 to the sixth batch processing unit BPU6 includes a processing bath BB and a lifter LF. The processing bath BB stores a processing liquid. The processing liquid is pure water or a chemical liquid. The chemical liquid is, for example, an organic solvent or an etching liquid. The organic solvent is, for example, IPA (isopropyl alcohol). The etching liquid is, for example, a phosphoric acid solution.

[0055] The lifter LF moves up and down between a processing position inside the processing bath BB and a transfer position above the liquid level in the processing bath BB. The lifter LF transfers a plurality of substrates W to and from the second transport mechanism WTR at the transfer position. The first batch processing unit BPU1 to the sixth batch processing unit BPU6 are associated with each other in pairs, for example. Specifically, the first batch processing unit BPU1 and the second batch processing unit BPU2 form one pair, the third batch processing unit BPU3 and the fourth batch processing unit BPU4 form one pair, and the fifth batch processing unit BPU5 and the second batch processing unit BPU6 form one pair. Each pair is assigned the role of, for example, chemical processing and cleaning processing. The first batch processing unit BPU1 to the sixth batch processing unit BPU6 can process, for example, up to 50 substrates W at a time. In other words, the first batch processing unit BPU1 to the sixth batch processing unit BPU6 can simultaneously process, for example, a maximum of one batch lot.

[0056] Each processing tank BB is supplied with processing liquid from below. The processing liquid is discharged over the upper edge of each processing tank BB. Each processing tank BB immerses multiple substrates W placed on a lifter LF in the processing liquid. Each lifter LF abuts and holds the lower edge of the substrate W. Each lifter LF transfers multiple substrates W between it and the second transport mechanism WTR.

[0057] <7. Posture change block>

[0058] 2, the posture changing block 15 includes a 25-piece chuck TFC, a standby tank 31, and a posture changing tank 33. In the drawings referring to the standby tank 31 and the posture changing tank 33, the liquid surface is not shown so that each component can be easily seen.

[0059] The standby tank 31 includes a processing tank BB0 and a lifter LF0. The processing tank BB0 has the same configuration as the processing tank BB included in the first batch processing unit BPU1 to the sixth batch processing unit BPU6 described above. The lifter LF0 moves up and down between a standby position inside the processing tank BB0 and a transfer position above the liquid level in the processing tank BB0. The standby tank BB0 stores a processing liquid. The processing liquid is, for example, pure water. At the standby position, the substrate W placed on the lifter LF0 is entirely submerged in the processing liquid.

[0060] Here, reference is made to Fig. 3. Fig. 3 is a plan view showing the configuration of the 25-plate chuck and the reversing chuck.

[0061] The 25-substrate chuck TFC moves horizontally as a whole only in the width direction Y. The 25-substrate chuck TFC does not move up and down in the vertical direction Z. The 25-substrate chuck TFC does not move horizontally in the front-to-rear direction X. However, the 25-substrate chuck TFC opens and closes the hand 35 between the holding position PC and the passing position PT. At the holding position PC, the 25-substrate chuck TFC holds multiple substrates W. At the passing position PT, the 25-substrate chuck TFC does not hold multiple substrates W. In other words, the passing position PT allows the lifter LF0 holding multiple substrates W to move between the transfer position and the standby position. The 25-substrate chuck TFC moves, for example, to three positions in the width direction Y: a first transfer position P1, a second transfer position P2, and a third transfer position P3.

[0062] The 25-substrate chuck TFC has locking portions 37. The locking portions 37 are provided inside the hand 35. The locking portions 37 are formed in the width direction Y at intervals of the full pitch described above. The first transfer position P1 and the second transfer position P2 differ in position in the width direction Y by a distance corresponding to the half pitch. The third transfer position P3 is a position where multiple substrates W are transferred to the posture change tank 33. The 25-substrate chuck TFC receives only one lot from the lifter LF0 at the first transfer position P1. Specifically, of the two lots that make up the batch, it receives only the multiple odd-numbered substrates W that make up the first lot. The 25-substrate chuck TFC receives only the other lot from the lifter LF0 at the second transfer position P2. Specifically, of the two lots that make up the batch, it receives only the multiple even-numbered substrates W that make up the next lot.

[0063] Here, in addition to Fig. 2 and Fig. 3, Fig. 4 to Fig. 7 will be referred to. Fig. 4 is a front view in a state where the inversion chuck is set to a first spacing. Fig. 5 is a front view in a state where the inversion chuck is set to a second spacing. Fig. 6 is a cross-sectional view in a state where the inversion chuck is set to the first spacing. Fig. 7 is a cross-sectional view in a state where the inversion chuck is set to the second spacing.

[0064] As shown in FIG. 2, the posture changing tank 33 includes a dipping tank DB and a posture changing unit 41.

[0065] First, the main parts will be described. The posture changing tank 33 uses the inversion chucks 43 to change the postures of multiple substrates W collectively in the immersion tank DB. Specifically, the inversion chucks 43 change the postures of multiple substrates W from a vertical posture to a horizontal posture. The inversion chucks 43 change the postures of, for example, half of the substrates W that make up a batch lot. The inversion chucks 43 change the postures of, for example, 25 substrates W. The inversion chucks 43 are arranged opposite each other in the radial direction of the substrates W and clamp the peripheral edges of the substrates W. The immersion tank DB stores a processing liquid. The processing liquid is, for example, pure water.

[0066] 4 and 5, the inversion chuck 43 includes a pair of chuck members 45. When receiving or holding a vertically oriented substrate W, the length of the chuck members 45 in the vertical direction Z is shorter than the radius of the substrate W. As shown in Fig. 3, when receiving or holding a vertically oriented substrate W, the length of the chuck members 45 in the width direction Y is slightly longer than the length of the substrates W in the alignment direction in the lot.

[0067] 4 to 6, each chuck member 45 has a groove 47 on the opposing surface. As shown in Fig. 4 and Fig. 5, the groove 47 has an arc-like shape when viewed from the width direction Y in a vertical position for receiving and holding the substrate W in a vertical position. The arc-like shape of the groove 47 follows the outer edge of the substrate W.

[0068] 6, the groove portion 47 has a first groove SL1 and a second groove SL2. The first groove SL1 allows the plurality of substrates W to move in the thickness direction. The second groove SL2 is formed outward from the first groove SL1 in the radial direction of the plurality of substrates W, and clamps the plurality of substrates W in the radial direction while restricting movement of the plurality of substrates W in the thickness direction.

[0069] The second groove SL2 has a top 49 where the edge faces of the substrates W are located, and a rear inclined surface 51 that widens from the top 49 toward the center of the substrates W. The top 49 is formed where the two rear inclined surfaces 51 are narrowest. The top 49 is large enough to accommodate the edge faces of the substrates W. The rear inclined surface 51 is formed in a position facing the front and back surfaces of the substrates W.

[0070] The first groove SL1 has an opening 53 at the center of the plurality of substrates W. The first groove SL1 has a front inclined surface 55 that widens from a rear inclined surface 51 toward the opening 53. The front inclined surface 55 is formed at a position facing the front and back surfaces of the substrates W. The dimension of the opening 53 in the width direction Y is, for example, several times larger than the thickness of the substrates W.

[0071] The front-side inclined surface 55 is formed to have a gentler slope than the rear-side inclined surface 51. In other words, the rear-side inclined surface 51 is formed to have a steeper slope toward the apex 49 than the front-side inclined surface 55.

[0072] The pair of chuck members 45 move in the front-rear direction X over a first distance WD1 and a second distance WD2. The pair of chuck members 45 can change the distance between the opposing grooves 47. The first distance WD1 is a distance for transferring substrates between the 25-plate chuck TFC and the bridging portion 7. The second distance WD2 is narrower in the front-rear direction X than the first distance WD1 and is a distance for clamping multiple substrates W.

[0073] Here, the attitude changing unit 41 will be described with reference to Figs. 8 to 10. Fig. 8 is a front view showing the configuration of the attitude changing unit, with the substrate held in a vertical position. Fig. 9 is a front view showing the configuration of the attitude changing unit, with the substrate held in a horizontal position. Fig. 10 is a plan view of the attitude changing unit.

[0074] The attitude changing unit 41 includes a lifting mechanism 61, a driving mechanism 63, a rotation mechanism 65, and an alignment mechanism 67. The lifting mechanism 61 lifts and lowers the inverting chuck 43. The driving mechanism 63 opens and closes the inverting chuck 43. The rotation mechanism 65 rotates the inverting chuck 43.

[0075] The lifting mechanism 61 is disposed outside the immersion tank DB. The lifting mechanism 61 includes, for example, an actuator 61a and a support 61b. The actuator 61a drives the support 61b to move up and down. The actuator 61a raises and lowers the inverting chuck 43 together with the support 61b. The lifting mechanism 61 uses the actuator 61a to raise and lower the inverting chuck 43 among a receiving height HP1, a clamping height HP2, a locking height HP3, and an immersion height HP4. The receiving height HP1 is a height at which the inverting chuck 43 receives the substrate W in a vertical position. The clamping height HP2 is a height at which the inverting chuck 43 clamps the substrate W in a vertical position. The locking height HP3 is a height at which the substrate W clamped by the inverting chuck 43 is locked. The immersion height HP4 is a height at which the substrate W in a vertical position held by the inversion chuck 43 is immersed in the processing liquid in the immersion tank DB.

[0076] The drive mechanism 63 is disposed across the edge of the immersion tank DB. The drive mechanism 63 includes, for example, an actuator 63a and a connecting member 63b. The actuator 63a is disposed on the upper surface of the support 61b. The drive direction of the actuator 63a is oriented in the front-rear direction X. The actuator 63a drives the connecting member 63b in the front-rear direction X. The connecting member 63b is connected to a rotation mechanism 65, which will be described later. The drive mechanism 63 moves the reversing chuck 43 together with the rotation mechanism 65 in the front-rear direction X. The drive mechanism 63 moves the chuck members 45 of the reversing chuck 43 in opposite directions. The drive mechanism 63 adjusts the distance between the chuck members 45 in the front-rear direction X to a first distance WD1 and a second distance WD2.

[0077] The rotation mechanism 65 is disposed inside the immersion tank DB in a plan view. The rotation mechanism 65 includes, for example, a suspension arm 65a and a motor 65b. The suspension arm 65a extends in the front-rear direction X from the upper surface of the support 61b and extends downward in the vertical direction Z along the inner wall of the immersion tank DB. The suspension arm 65a is moved in the front-rear direction X by the drive mechanism 63. A lower portion of the suspension arm 65a is immersed in the processing liquid stored in the immersion tank DB. The motor 65b has a rotation shaft connected to the reversing chuck 43. The motor 65b rotates the reversing chuck 43 around the axis AX1. The rotation mechanism 65 can rotate the reversing chuck 43 in either the counterclockwise or clockwise direction around the axis AX1 by the motor 65b.

[0078] The alignment mechanism 67 includes, for example, four actuators 67a, four arms 67b, and four alignment bars 67c. The actuators 67a are built into the arm 65a. The rotation axis of the actuators 67a is directed upward in the vertical direction Z. The arms 67b are arranged in a horizontal plane in the front-rear direction X and the width direction Y. The base ends of the arms 67b are connected to the rotation axis of the actuator 67a. The top ends of the alignment bars 67c are connected to the tip ends of the arms 67b. The base ends of the arms 67b are rotated around the axis AX2 by the actuator 67a. As shown in FIG. 10, the alignment bars 67c are arranged on the 25-plate chuck TFC side and the bridging section 7 side.

[0079] The alignment bar 67c extends in the vertical direction Z. As shown in FIG. 9 , the alignment bar 67c has a length that extends along all sides of the substrates W held by the inverting chuck 43 when the inverting chuck 43 is in its elongated state in the vertical direction Z. The alignment bar 67c preferably has grooves 67d formed in positions facing the edge faces of the substrates W. Each alignment bar 67c is independently operated by a corresponding actuator 67a. The alignment bar 67c is driven between a restricting position AP1 and an allowable position AP2. The restricting position AP1 restricts movement of the substrates W in a horizontal position within a horizontal plane including the front-rear direction X and the width direction Y. The allowable position AP2 allows movement of the substrates W in a horizontal position within a horizontal plane including the front-rear direction X and the width direction Y.

[0080] Now, let us return to Figures 1 and 2.

[0081] <8. Bridging Section>

[0082] The bridge unit 7 connects the batch processing apparatus 3 and the single wafer processing apparatus 5. The bridge unit 7 is in communication only with the batch processing apparatus 3 and the single wafer processing apparatus 5. The bridge unit 7 is equipped with a bridge robot BR. The bridge robot BR is configured to be movable only in the width direction Y. The bridge robot BR does not move up and down in the vertical direction Z. The bridge robot BR is equipped with a hand 71. The hand 71 is configured to be rotatable within a horizontal plane including the front-to-rear direction X and the width direction Y. The hand 71 is configured to be extendable and retractable in the horizontal direction. The bridge robot BR moves the hand 71 forward and backward to receive a single horizontally oriented substrate from the orientation conversion block 15. The bridge robot BR delivers the single horizontally oriented substrate to the single wafer processing apparatus 5.

[0083] <9. Single-Wafer Processing Equipment>

[0084] The single wafer processing apparatus 5 includes an unloading block 81, an indexer block 83, and a processing block 85.

[0085] <10. Carry-out block>

[0086] The unloading block 81 includes an unloading section 87. The unloading section 87 is arranged in the front X of the single wafer processing apparatus 5. A carrier C is placed on the unloading section 87. The unloading block 81 includes, for example, four unloading sections 87. The four unloading sections 87 are arranged along the width direction Y. The unloading sections 87 are also called load ports.

[0087] <11. Indexer Block>

[0088] The indexer block 83 is equipped with an indexer robot IR. The indexer robot IR is equipped with, for example, an articulated arm 89 and a hand 91. The indexer robot IR does not move in the width direction Y or the front-rear direction X. The indexer robot IR bends the articulated arm 89 to move the hand 91. The indexer robot IR raises and lowers the hand 91 in the vertical direction Z. The indexer robot IR can access each of the cassettes C placed on the four unloading units 87. The indexer robot IR transports one substrate W with the hand 91. The indexer robot IR transports one substrate W from the processing block 85 to the unloading unit 87.

[0089] <12. Processing Block>

[0090] The processing block 85 includes four towers TW1 to TW4 and a center robot CR.

[0091] The tower TW1 is disposed behind the indexer block 83 in the X direction. The tower TW1 is disposed adjacent to the indexer block 83. The tower TW1 includes processing chambers-MPCs stacked in the vertical direction Z. The tower TW1 includes, for example, three processing chambers-MPCs. The processing chambers-MPCs process substrates W one by one. The processing chambers-MPCs in the vertical direction Z perform, for example, a drying process on the substrates W.

[0092] Tower TW2 is disposed behind tower TW1 at X. Tower TW2 is disposed adjacent to tower TW1. Tower TW2 has the same configuration as tower TW1. That is, tower TW2 has three processing chambers-MPC stacked in the vertical direction Z.

[0093] Tower TW3 is disposed to the left Y of tower TW2. Tower TW3 is disposed to the left Y of tower TW2, with the center robot CR in between. Tower TW3 has the same configuration as towers TW1 and TW2. In other words, tower TW3 has three processing chambers MPC stacked in the vertical direction Z.

[0094] Tower TW4 differs in part in configuration from towers TW1 to TW4. That is, tower TW4 is provided with processing chambers-MPC at the bottom and top in the vertical direction Z. Tower TW4 is provided with a transfer section 93 in the center in the vertical direction Z. A single substrate W is placed on the transfer section 93. The transfer section 93 is provided with lifting pins 93a. The lifting pins 93a are raised and lowered when receiving a substrate W from the bridge robot BR. A single substrate W is placed on the transfer section 93 from the bridge robot BR. The placed substrate W is received by the center robot CR at the transfer section 93.

[0095] The center robot CR is configured to be movable in the front-rear direction X. The center robot CR is equipped with a hand 95. The hand 95 moves up and down in the vertical direction Z. The hand 95 is configured to be rotatable within a plane including the front-rear direction X and the width direction Y. The hand 95 is moved so as to be able to access the processing chambers-MPC and the delivery part 93 of the towers TW1 to TW4. In other words, the center robot CR can freely move the hand 95 in the vertical direction Z, the front-rear direction X, and the width direction Y. The center robot CR delivers the processed substrate W to the indexer robot 83.

[0096] <13. Operation explanation>

[0097] An example of processing performed by the substrate processing apparatus 1 will be described with reference to FIGS.

[0098] First, the overall flow of processing will be roughly described.

[0099] <14. Batch Processing>

[0100] A carrier C containing a plurality of unprocessed substrates W is placed in the loading section 19. The transport mechanism 23 loads the carrier C into the stocker block 11. Two sets of substrates W are assembled into a batch lot by the first transport mechanism HTR and the transfer mechanism CTC. The substrates W constituting the batch lot are transported by the second transport mechanism WTR to the processing block 17. In the processing block 17, for example, a phosphoric acid etching process is performed in the second batch processing unit BPU2. The substrates W constituting the batch lot are then subjected to a pure water cleaning process in the first batch processing unit BPU1. Next, the substrates W constituting the batch lot are transported by the second transport mechanism WTR to the orientation conversion block 15. In the orientation conversion block 15, only one of the batch lots is transported to the orientation conversion bath 33. In the orientation conversion bath 33, the substrates W in only one of the batch lots are converted from a vertical orientation to a horizontal orientation in the liquid. Thereafter, the substrates W constituting one of the batch lots are transported one by one in sequence to the single-wafer processing apparatus 5. Thereafter, the other lot of the batch lot is similarly subjected to posture change and then transported to the single-wafer processing apparatus 5.

[0101] <15. Single-Wafer Processing>

[0102] The substrate W, which has been converted to a horizontal position, is transported to the single-wafer processing apparatus 5 by the bridge robot BR. Specifically, the substrate W is placed on the transfer section 93. The substrate W placed on the transfer section 93 is received by the center robot CR. The center robot CR loads the substrate W, for example, into a processing chamber MPC of the tower TW1. In the processing chamber MPC, for example, a drying process is performed on the substrate W. Specifically, for example, pure water is supplied to the substrate W while the substrate W is being rotated. Then, IPA is supplied to the substrate W to replace the pure water in the substrate W with IPA. The substrate W is then rotated at high speed to dry it. Furthermore, if necessary, a drying process using carbon dioxide as a supercritical fluid is preferably performed in another processing chamber MPC. The substrate W is subjected to a finish drying process by the drying process using the supercritical fluid. This completely dries the substrate W while preventing the collapse of the pattern formed on the substrate W.

[0103] The substrate W for which the drying process has been completed is carried out to the unloading section 87 by the center robot CR and the indexer robot IR. The indexer robot IR stores the substrate W in a carrier C placed in the unloading section 87. Subsequent substrates W that constitute the same lot to be processed are stored in the same carrier C.

[0104] <16. Posture conversion processing>

[0105] The above is a rough outline of the processing flow by the substrate processing apparatus 1, and next, the details of the attitude change will be explained. Here, reference will be made to Figures 11 to 28. Figures 11 to 20 and Figures 22 to 28 are diagrams used to explain the attitude change operation of the substrate. Figure 21 is a vertical cross-sectional view showing the operation of the inverting chuck.

[0106] Please refer to Figure 11. After batch processing, the plurality of substrates W constituting the batch lot are transferred by the second transport mechanism WTR to the lifter LF0 in the standby tank 31. The lifter LF0 moves the plurality of substrates W constituting the batch lot to a standby position inside the standby tank 31. Since the plurality of substrates W constituting the batch lot wait in this state, drying can be prevented. In other words, patterns formed on the substrates W after batch processing can be prevented from collapsing. The alignment bar 67c is positioned at the permissible position.

[0107] Please refer to Figure 12. The 25-substrate chuck TFC is positioned at the first transfer position P1. The 25-substrate chuck TFC releases the hand 35. That is, the 25-substrate chuck TFC has the hand 35 at the passing position PT (see FIG. 3). The lifter LF0 is raised to the transfer position above the liquid level in the standby tank BB0. At this time, since the hand 35 of the 25-substrate chuck TFC is at the passing position PT, the multiple substrates W can pass between the 25-substrate chucks TFC and rise. At the same time, the posture changing unit 41 in the posture changing tank 33 raises the inverted chuck 43 to the receiving height HP1.

[0108] Please refer to Figure 13. The 25-substrate chuck TFC closes the hand 35. That is, the hand 35 of the 25-substrate chuck TFC is set to the holding position PC (see FIG. 3). In this state, the lifter LF0 is lowered to the standby position. As a result, of the multiple substrates W of the batch lot placed on the lifter LF0, only the multiple odd-numbered substrates W constituting one lot are placed on the 25-substrate chuck TFC. Of the multiple substrates W of the batch lot placed on the lifter LF0, the multiple even-numbered substrates W constituting another lot are lowered together with the lifter LF0 into the standby tank BB0. As a result, the hand 35 of the 25-substrate chuck TFC is set to the second transfer position PT2, and the even-numbered substrates W can be held in a standby state prevented from drying until they are moved to the posture conversion tank 33. Therefore, pattern collapse due to drying of the multiple substrates W constituting the other lot can also be prevented.

[0109] Please refer to Figure 14. The 25-substrate chuck TFC advances the hand 35 to the right Y up to the third transfer position P3. At this time, the reversing chuck 43 is positioned at the receiving height HP1, so that no interference with the substrate W occurs.

[0110] Please refer to Figure 15. The inverting chuck 43 is spaced at a first distance WD1 (see FIG. 4). In this state, the inverting chuck 43 is lowered toward the substrates W placed on the 25-substrate chuck TFC. Specifically, the inverting chuck 43 is lowered to a clamping height HP2. At this time, the inverting chuck 43 and the substrates W are in the state shown in FIGS. 4 and 6. In other words, the edges of the substrates W are merely positioned near the first grooves SL1 of the inverting chuck 43 and are not in contact with the inverting chuck 43. In other words, the substrates W are accommodated in the inverting chuck 43 without contacting it.

[0111] Please refer to Figure 16. The inverting chuck 43 is set to a second width WD2 (see FIG. 5). This allows the inverting chuck 43 to clamp the substrate W accommodated therein without contact. As a result, as shown in FIG. 7, the edge of the substrate W is clamped in the second grooves SL2 of the inverting chuck 43. In other words, the edge of the substrate W is abutted and supported by the tops 49 of the second grooves SL21. Furthermore, the inverting chuck 43 is raised to a locking height HP3. As a result, the lower edge of the edge of the substrate W clamped by the inverting chuck 43, which is located below the sides, abuts and is locked against the second grooves SL2. Although not shown, with the inverting chuck 43 temporarily raised to the receiving height HP1, the 25-substrate chuck TFC is moved to a second transfer position P2. This prepares the 25-substrate chuck TFC to receive the substrates W that make up another lot placed on the lifter LF0.

[0112] Please refer to Figure 17. The inversion chuck 43 is lowered to an immersion height HP4. As a result, the multiple substrates W held by the inversion chuck 43 are immersed in the processing liquid in the immersion tank DB. The multiple substrates W are entirely submerged in the processing liquid in the immersion tank DB. In the attitude changing block 15, the multiple substrates W that make up one lot are exposed from the liquid only for a short period of time, from when they are raised from the standby tank BB0 until they are immersed in the immersion tank DB.

[0113] Please refer to Figures 18 and 19. The inversion chuck 43 is rotated by 90°. Specifically, in this example, it is rotated clockwise by 90°. The direction of rotation can be determined depending on the direction in which the processing surface (front surface) of the substrate W is positioned. In other words, the direction of rotation can be determined so that the processing surface of the substrate W faces upward. As a result, the multiple substrates W are converted into a horizontal position.

[0114] Please refer to Figure 20. The alignment bar 67c is moved to the regulating position by the alignment mechanism 67. As a result, the positions of the outer peripheries of the multiple substrates W are regulated by the alignment bar 67c, as shown in the partially enlarged view indicated by the two-dot chain line arrow in Figure 20. Specifically, movement within a horizontal plane including the front-rear direction X and the width direction Y is regulated.

[0115] Please refer to Figure 21. The inverting chuck 43 is expanded to the first width WD1. As a result, the position of the edge of the substrate W moves from the second groove SL2 to the first groove SL1. Therefore, the distance US between the upper surface (processing surface (front surface)) of the substrate W and the upper surface of the groove portion 47 becomes wider. At this time, the substrate W moves while its lower surface slides from the rear inclined surface 51 of the second groove SL2 to the front inclined surface 55 of the first groove SL1. The front inclined surface 55 of the first groove SL1 has a gentler slope than the rear inclined surface 51 of the second groove SL2. This reduces the impact on the lower surface of the substrate W. This reduces the generation of particles when the inverting chuck 43 is set to the first width WD1. Furthermore, friction pulls the substrate W in the movement direction of the inverting chuck 43. At this time, the alignment bar 67c is in the restricting position, preventing the horizontal position of the substrate W from shifting. Therefore, it is possible to prevent transport errors by the bridge robot BR, which will be described later, and to transfer the substrate W reliably.

[0116] Furthermore, the alignment bar 67c has a groove 67d formed at a position corresponding to the edge surface of the substrate W. Therefore, when the substrate W moves downward, it is possible to prevent the edge surface of the substrate W from rubbing against the alignment bar 67c and generating particles.

[0117] Please refer to Figure 22. The inverting chuck 43 is raised. Specifically, the inverting chuck 43 is raised so that only the substrate W clamped in the uppermost groove 47 of the inverting chuck 43 is exposed from the liquid in the immersion tank DB. The height of the inverting chuck 43 is set to a height that allows the hand 71 of the bridge robot BR to enter a position slightly below the underside of the substrate W exposed from the liquid.

[0118] Please refer to Figure 23. The hand 71 of the bridge robot BR is advanced into the posture changing section 41. The hand 71 advances to a position slightly below and spaced apart from the lower surface of the substrate W.

[0119] Please refer to Figure 24. The inverting chuck 43 is moved downward by a distance that is less than the sum of the above-mentioned gap US and the gap between the inserted hand 71 and the lower surface of the substrate W. The substrate W is transferred to the hand 71 by the movement of the inverting chuck 43.

[0120] Please refer to Figure 25. Before the bridge robot BR moves the hand 71 to the right Y, the alignment bar 67c located to the right Y is moved to the permissible position AP2.

[0121] Please refer to Figure 26. The bridge robot BR moves the hand 71 to the right Y and removes the uppermost substrate W from the inversion chuck 43. Since the alignment bar 67c located to the right Y has been moved to the allowable position AP2, the substrate W can be transferred smoothly.

[0122] Please refer to Figure 27. After the top substrate W is extracted from the inverting chuck 43, the two alignment bars 67c on the right Y are moved to the regulating position, thereby preventing the horizontal position of the substrate W from shifting due to disturbances such as vibrations of the apparatus, which can adversely affect the next transport.

[0123] Please refer to Figure 28. The bridge robot BR rotates the hand 71 to position the substrate W to the right Y. Specifically, the hand 71 rotates to move the substrate W toward the delivery section 93. Then, one substrate W is delivered to the delivery section 93.

[0124] By the operation of the posture changing block 15 described above, one substrate W is transported from the batch processing apparatus 3 to the single wafer processing apparatus 5 in a horizontal posture.

[0125] The correspondence between the present invention and the above-described embodiments is as follows:

[0126] The batch processing apparatus 3 corresponds to the "batch processing section" in the present invention. The single wafer processing apparatus 5 corresponds to the "single wafer processing section" in the present invention. The 25 wafer chuck TFC corresponds to the "first transfer section" in the present invention. The bridge robot BR corresponds to the "second transfer section" in the present invention.

[0127] According to this embodiment, multiple substrates W processed in the batch processing apparatus 3 are transported by the 25-substrate chuck TFC to the position changing unit 41, where they are changed from a vertical position to a horizontal position. The multiple substrates W changed to the horizontal position are transferred one by one by the bridge robot BR and then processed in the single-wafer processing apparatus 5. When changing the position of the multiple substrates W, the position changing unit 41 holds the multiple substrates W with a narrow gap above their upper surfaces. Therefore, the multiple substrates W can be stably held and their position can be changed stably. When transferring multiple substrates W in a horizontal position, the position changing unit 41 holds the multiple substrates W with a wide gap above their processing surfaces. Therefore, the bridge robot BR can easily transfer each of the multiple substrates W.

[0128] Furthermore, when the inverting chuck 43 receives multiple substrates W from the 25-substrate chuck TFC, the drive mechanism 61 sets the first distance WD1 and accommodates each of the multiple substrates in the first groove SL1. When the rotation mechanism 65 rotates the multiple substrates W into a horizontal position, the drive mechanism 63 sets the second distance WD2 and clamps each of the multiple substrates W in the second groove SL2. Therefore, when changing the position, movement of the substrates W in the thickness direction is restricted. As a result, the multiple substrates W can be stably held and their position can be stably changed. When the bridge robot BR receives multiple substrates W from the inverting chuck 43, the drive mechanism 63 sets the first distance WD1 and supports the lower surfaces of the multiple substrates W in contact with the first groove SL1. Therefore, when transferring the substrates W, movement of the substrates W in the thickness direction is permitted. As a result, the bridge robot BR can easily pick up and transfer each of the multiple substrates W. The attitude changing unit 41 can clamp or loosely hold the substrate W simply by moving the inversion chuck 43 in the horizontal direction using the drive mechanism 63.

[0129] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0130] (1) In the above-described embodiment, the inverting chuck 43 has the first groove SL1 and the second groove SL2 at the front and rear in the radial direction of the substrate W. However, the present invention is not limited to this configuration. For example, an inverting chuck 43A as shown in FIGS. 29 and 30 may be used.

[0131] Fig. 29 shows a modified example of the inverting chuck, illustrating a state during transfer. Fig. 30 shows a modified example of the inverting chuck, illustrating a state during posture change.

[0132] The inversion chuck 43A includes a pair of chuck members 45A. The chuck member 45A includes, for example, one first groove piece 97 and two second groove pieces 99. The first groove piece 97 includes a first groove SL1. The second groove piece 99 includes a second groove SL2. The second groove pieces 99 are arranged on the vertical direction Z of the first groove pieces 97. The second groove pieces 99 are provided on the chuck member 45A so as to be movable forward and backward in the front-rear direction X toward the center of the substrate W.

[0133] When the inverting chuck 43A configured in this manner receives a substrate W, the second groove piece 99 is moved away from the substrate W (FIG. 29). When changing the orientation of the substrate W, the second groove piece 99 is moved closer to the center of the substrate W (FIG. 30). Such an inverting chuck 43A may be employed. With this configuration, while the inverting chuck 43 described above has a two-stage incline on the rear side, the first groove piece 97 and the second groove piece 99 only have grooves SL1, SL2 with a single stage incline. This has the advantage of making it easier to process the chuck member 45A. Furthermore, when handling substrates W of different thickness standards, only the second groove piece 99 needs to be replaced, allowing for flexible adaptation to different substrate W standards.

[0134] (2) In the above-described embodiment, the inverting chucks 43, 43A have inclined surfaces on both sides of the substrate W. However, when a batch lot is back-to-face, it is sufficient to provide an inclined surface only in the direction corresponding to the bottom surface of the substrate W.

[0135] (3) In the above-described embodiment, the attitude changer 41 changes the attitude of multiple substrates W while they are immersed in the immersion tank DB. However, the present invention is not limited to this configuration. That is, the attitude changer 41 may change the attitude in a gas. In this case, examples of the gas include air and inert gas.

[0136] (4) In the above-described embodiment, the alignment bar 67c has the groove 67d, but this configuration is not essential to the present invention. Also, the attitude conversion unit 41 does not necessarily have to have the alignment bar 67c.

[0137] (5) In the above-described embodiment, the receiving-side alignment bar 67c is moved to the permissible position after the hand 71 of the bridge robot BR enters the inverting chuck 43. However, the present invention is not limited to this timing for moving the alignment bar 67c to the permissible position. In other words, the alignment bar 67c may be moved to the permissible position when the hand 71 enters the inverting chuck 43. This prevents the hand 71 from interfering with the alignment bar 67c even if the positional accuracy in the forward / backward direction X when the hand 71 enters the inverting chuck 43 is somewhat reduced. As a result, the control load can be reduced.

[0138] (6) In the above-described embodiment, when multiple substrates W are received by the inverting chuck 43, the inverting chuck 43 is lowered from the receiving height HP1 to the clamping height HP2. However, the present invention is not limited to this clamping method. For example, the multiple substrates W may be received with the chuck members 45 of the inverting chuck 43 spread apart, and then the distance between the chuck members 45 may be narrowed to clamp the multiple substrates W.

[0139] (7) In the above-described embodiment, the inverting chuck 43 is lowered when the bridge robot BR receives the substrate W. However, the present invention is not limited to this configuration. That is, the inverting chuck 43 may not be lowered, and the hand 71 of the bridge robot BR may be raised to receive the substrate W. This simplifies the control of the posture conversion unit 41.

[0140] (8) In the above-described embodiment, the substrate processing apparatus 1 is configured such that the batch processing apparatus 3 and the single wafer processing apparatus 5 are connected by the bridge section 7. However, the present invention can also be applied to a single substrate processing apparatus 1 that includes the batch processing apparatus 3 and the single wafer processing apparatus 5 in the same housing. [Explanation of symbols]

[0141] 1... Substrate processing equipment W: Substrate 3... Batch processing equipment 5... Single wafer processing equipment 7 … Bridging Section 7 9... Loading block 11... Stocker block 13...Transfer block 15... Posture change block 17 ... Processing block 19 … Input section C...Career BPU: Batch processing unit BB: Treatment tank LF... Lifter TFC... 25-piece zipper 31 … Standby tank 33... Posture change tank BB0: Treatment tank LF0 ... Lifter DB … Immersion tank 41 ... Posture conversion unit 43... Reversing chuck WD1...first interval WD2: Second interval 45 ... Chuck member 47 ... Groove SL1 ... First groove SL2: Second groove 49 … Top 51 … Back slope 53…Aperture 55 ... Front slope 61 ... Lifting mechanism 63 ... Drive mechanism 65... Rotation mechanism 67...Alignment mechanism 67c ... Alignment bar 67d … Groove HP1 … Acceptance height HP2: Clamping height BR... Bridge Robot 81 ... Unloading block 83 ... Indexer block 85 ... Processing block 87 ... Unloading section IR... Indexer robot TW1~TW4 ... Tower CR... Center robot 93 … Delivery department US … Interval

Claims

1. In a substrate processing apparatus for processing a substrate, a batch processing unit that processes a plurality of substrates in a vertical position at once; a single-substrate processing unit that processes a single substrate in a horizontal position; a posture changing unit that changes the posture of the plurality of substrates that have been processed in the batch processing unit from a vertical posture to a horizontal posture; a first transfer unit that transfers the plurality of substrates that have been processed in the batch processing unit to the attitude changing unit; a second transport unit that transports the plurality of substrates that have been placed in a horizontal position by the position conversion unit to the single-wafer processing unit; Equipped with The posture conversion unit is When changing the posture of the plurality of substrates, the plurality of substrates are held with a narrow gap above their upper surfaces, and when transferring the plurality of substrates after setting them in a horizontal posture, the plurality of substrates are held with a wide gap above their upper surfaces; The posture conversion unit is inversion chucks arranged to face each other in a radial direction of the plurality of substrates and to clamp peripheral portions of the plurality of substrates; a drive mechanism that moves the inversion chuck in a horizontal direction across at least two locations: a first gap in which the plurality of substrates are transferred between the first transport unit and the second transport unit; and a second gap that is narrower than the first gap and in which the plurality of substrates are sandwiched; a rotation mechanism that rotates the inversion chuck in a surface direction of the plurality of substrates; Equipped with the inversion chuck includes a first groove that allows the plurality of substrates to move in a thickness direction, and a second groove that is formed outward of the plurality of substrates from the first groove and clamps the plurality of substrates in a radial direction while restricting movement of the plurality of substrates in the thickness direction, When the inversion chuck receives the plurality of substrates from the first transport unit, the driving mechanism sets the first interval so that each of the plurality of substrates is accommodated in the first groove; When the rotation mechanism rotates the plurality of substrates into a horizontal position, the drive mechanism causes the plurality of substrates to be sandwiched between the second grooves at the second intervals; A substrate processing apparatus characterized in that, when the second transport unit receives the plurality of substrates from the inversion chuck, the drive mechanism sets the substrates at the first interval and abuts and supports the lower surfaces of the plurality of substrates in the first grooves.

2. 2. The substrate processing apparatus according to claim 1, The second groove is a top portion where end faces of the plurality of substrates are located; a rear inclined surface that widens from the top toward the center of the plurality of substrates; Equipped with The first groove is a substrate processing apparatus having an opening on a center side of the plurality of substrates, and a front side inclined surface that widens from the rear side inclined surface toward the opening;

3. 3. The substrate processing apparatus according to claim 2, The substrate processing apparatus, wherein the rear inclined surface and the front inclined surface have inclined surfaces at positions facing the front and rear surfaces of the plurality of substrates.

4. 3. The substrate processing apparatus according to claim 2, The substrate processing apparatus is characterized in that the front inclined surface has a gentler inclination than the rear inclined surface.

5. 5. The substrate processing apparatus according to claim 1, the posture conversion unit further includes an alignment bar that is movable between a restricting position that restricts horizontal movement of the plurality of substrates and an allowing position that allows horizontal movement of the plurality of substrates when the plurality of substrates are held in a horizontal posture by the inversion chuck; a first gap between the first and second alignment bars and a second gap between the first and second alignment bars; a second gap between the first and second alignment bars and a second gap between the first and second alignment bars;

6. 6. The substrate processing apparatus according to claim 5, A substrate processing apparatus characterized in that, in a planar view, the alignment bar is provided on the side where the second transport unit receives the multiple substrates and on the opposite side of the receiving side across the multiple substrates.

7. 7. The substrate processing apparatus according to claim 6, A substrate processing apparatus characterized in that, after the second gap is expanded to the first gap, when the second transport unit receives the plurality of substrates from the inversion chuck, the alignment bar on the receiving side of the alignment bars is moved to the allowable position.

8. 6. The substrate processing apparatus according to claim 5, The substrate processing apparatus is characterized in that the alignment bar has a plurality of grooves formed therein corresponding to the positions of the edge faces of the plurality of substrates.

9. 5. The substrate processing apparatus according to claim 1, Further provided is a lifting mechanism for lifting and lowering the inversion chuck, The substrate processing apparatus, wherein when the second transport unit receives the plurality of substrates from the inverting chuck, the inverting chuck is lowered by the lifting mechanism.

10. 10. The substrate processing apparatus according to claim 9, The substrate processing apparatus is characterized in that, when the first transport unit transfers the plurality of substrates to the inversion chuck, the lifting mechanism lowers the inversion chuck, which is spaced at the first interval, from an acceptance height near the upper edges of the plurality of substrates transported by the first transport unit to a clamping height near the side edges of the plurality of substrates.

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