Conformal coating process for multi-row surface mount components in lidless BGA packages and products manufactured thereby

Abstract

A process for conformally coating passive surface mount components soldered to a printed circuit board in a lidless flip-chip ball grid array package includes attaching a stiffener ring to the substrate before forming a conformal coating on the passive surface mount components. The stiffener ring is attached to the substrate such that a plurality of passive surface mount components and an integrated circuit die are housed within an opening formed by the stiffener ring. After attaching the stiffener ring to the substrate, a conformal coating is formed on the passive surface mount components. The conformal coating extends over, around, and under each of the passive surface mount components. Products manufactured according to this process are also disclosed.

Description

[Background technology]

[0001] Electronic devices containing integrated circuits are used in computing devices such as, but not limited to, laptops, desktops, tablets, smartphones, game consoles, televisions, set-top boxes, wearables, internet servers, printers, and other devices. The electronic devices may include an integrated circuit die and passive surface-mounted components, such as chip capacitors, packaged together on the same printed circuit board. Chip capacitors can be used, for example, to decouple the integrated circuit from voltage fluctuations in the power supply. Integrated circuit dies contain very dense circuitry and can operate at very high frequencies, driving ever-increasing levels of performance. Some integrated circuit dies contain multiple processor cores and / or very large memory arrays on a relatively small die. During operation, such devices can generate over 100 watts of heat. Heat buildup in the die can degrade the performance of the integrated circuit and significantly shorten its lifespan.

[0002] In some electronic devices, integrated circuits are mounted upside down, or in a flip-chip configuration, on a printed circuit board in a package, allowing the bond pads on the integrated circuit die to be soldered directly to the electrical connections on the printed circuit board. In ball grid array (BGA) packages such as these flip-chip packages, the package lid is attached to the printed circuit board to protect the die and provide structural support for the board. Before the lid is attached, a thermally conductive material called a thermal interface material (TIM) is applied to the backside of the die to provide a thermally conductive thermal path between the die and the package lid. A high-surface-area heat sink can be bonded to the package lid to remove heat from the package lid by air convection.

[0003] Other electronic devices do not use a package lid, so the TIM is in direct contact with the heat sink. Removing the lid from the thermal path improves the efficiency of heat removal from the integrated circuit die. In such lidless BGA packages, a stiffener ring around the integrated circuit die and passive surface-mount components is attached to the substrate instead of the lid to provide structural support to the substrate.

[0004] The embodiments will be more readily understood in view of the following description taken in conjunction with the following drawings, in which like numerals represent like elements, and in which: [Brief explanation of the drawings]

[0005] [Figure 1] 1 is a schematic plan view of an electronic device according to an example described in this disclosure. [Figure 2] 2 is a schematic cross-sectional side view of the electronic device of FIG. 1 according to one example described in this disclosure. [Figure 3] 2 is a schematic cross-sectional side view of an enlarged portion of the electronic device of FIG. 1 according to one example described in this disclosure. [Figure 4] 2 is a schematic cross-sectional side view of an enlarged portion of the electronic device of FIG. 1 according to another example described in the present disclosure. [Figure 5] 2 is a schematic cross-sectional side view of an enlarged portion of the electronic device of FIG. 1 according to another example described in the present disclosure. [Figure 6] 1 is a flowchart illustrating a process for conformally coating a plurality of passive surface mount components according to one example presented in the present disclosure. [Figure 7] 10 is a flowchart illustrating another process for conformally coating a plurality of passive surface mount components according to an example presented in the present disclosure. [Figure 8] 10 is a flowchart illustrating another process for conformally coating a plurality of passive surface mount components according to an example presented in the present disclosure. [Figure 9] 10 is a flowchart illustrating another process for conformally coating a plurality of passive surface mount components according to an example presented in the present disclosure. [Figure 10] 10 is a flowchart illustrating another process for conformally coating a plurality of passive surface mount components according to an example presented in the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0006] Briefly, an electronic device including an integrated circuit die and multiple passive surface-mount components soldered to a printed circuit board in a BGA package requires a conformal coating on the passive surface-mount components. The passive surface-mount components may include chip capacitors and / or chip resistors. During subsequent processing at high temperatures, such as when soldering the electronic device to a circuit board, portions of the thermally conductive material (TIM) used to form a thermally conductive layer between the integrated circuit die and the heat sink may melt and flow off the integrated circuit die and contact the passive surface-mount components. Because the TIM is electrically conductive, such contact could short out the terminals of the passive surface-mount components, rendering the electronic device inoperable. The conformal coating electrically insulates the terminals of the passive surface-mount components from the TIM and from other conductive materials that may contaminate the terminals of the passive surface-mount components.

[0007] In a BGA package, passive surface-mount components are typically arranged in a row around the periphery of the integrated circuit die. A conformal coating is formed on the passive surface-mount components, and a lid (or a stiffener ring in the case of a lidless BGA package) is attached to the package substrate. This works well when there is only one row of passive surface-mount components on either side of the integrated circuit die. However, as integrated circuit dies become denser and more complex, multiple adjacent rows of passive surface-mount components are required on at least one side of the integrated circuit die. Conformal coatings formed over larger areas, such as those required for multiple adjacent rows of passive surface-mount components, have been found to be prone to coating defects, such as coating voids, coating cracks, delamination of coating layers, and delamination from the substrate and passive surface-mount components. The process described herein provides conformal coatings for multi-row passive surface-mount components, such as chip capacitors in a lidless BGA package, with significantly fewer, if any, coating voids, cracks, or coating layer delamination.

[0008] In some embodiments, a process for conformally coating passive surface mount components soldered to a printed circuit board of a lidless flip-chip ball grid array package includes applying a stiffener ring to the substrate before applying a conformal coating to the passive surface mount components. The stiffener ring is attached to the substrate such that a plurality of passive surface mount components and an integrated circuit die are accommodated within an opening formed by the stiffener ring. After applying the stiffener ring to the substrate, a conformal coating is applied to the passive surface mount components. The conformal coating extends over, around, and under each of the passive surface mount components. In some embodiments, at least some of the passive surface mount components are arranged in multiple adjacent rows. In some embodiments, the multiple passive surface mount components include a plurality of chip capacitors. In some embodiments, applying the stiffener ring to the substrate includes adhering the stiffener ring to the substrate with an adhesive and then curing the adhesive. In some embodiments, forming the conformal coating includes forming an undercoating layer on the plurality of passive surface mount components and then forming a top coating layer over each of the passive surface mount components and the undercoating layer. The undercoating layer extends around each of the passive surface mount components and under each of the passive surface mount components between each of the passive surface mount components and the substrate. In some embodiments, both the undercoating layer and the top coating layer are cured. In some embodiments, the undercoating layer is cured before the top coating layer is formed.

[0009] In some embodiments, the substrate and passive surface mount components are treated with a plasma before forming the conformal coating. In some embodiments, the undercoating layer is treated with a plasma before forming the top coating layer. The plasma used to treat the substrate and passive surface mount components before forming the conformal coating and the plasma used to treat the undercoating layer before forming the top coating layer are formed from gases including helium, argon, oxygen, or any combination of helium, argon, and oxygen.

[0010] In some embodiments, a first adhesive layer is formed on the substrate and the passive surface mount component prior to forming the conformal coating on the passive surface mount component, and in some embodiments, a second adhesive layer is formed on the undercoating layer and the passive surface mount component prior to forming the topcoating layer.

[0011] In some embodiments, an electronic device packaged in a lidless flip-chip ball grid array package includes a printed circuit board, an integrated circuit die soldered to the substrate, a plurality of passive surface mount components soldered to the substrate, a stiffener ring attached to the substrate, and a conformal coating disposed on the plurality of passive surface mount components. The substrate includes a ball grid array. The plurality of passive surface mount components and the integrated circuit die are housed within an opening formed by the stiffener ring. At least some of the plurality of passive surface mount components are arranged in a plurality of adjacent rows. The device is manufactured by attaching the stiffener ring to the substrate and then forming a conformal coating on the plurality of passive surface mount components. The conformal coating extends over, around, and under each of the passive surface mount components. In some embodiments, the plurality of passive surface mount components includes a plurality of chip capacitors. In some embodiments, the plurality of passive surface mount components consists of a plurality of chip capacitors.

[0012] In some embodiments, forming the conformal coating includes forming an undercoating layer on the plurality of passive surface mount components, the undercoating layer extending around each passive surface mount component and underneath each passive surface mount component between each passive surface mount component and the substrate, and forming a top coating layer disposed over each of the passive surface mount components and on the undercoating layer extending around each of the passive surface mount components.

[0013] In some embodiments, the device is fabricated by forming a first adhesive layer on the substrate and the plurality of passive surface mount components before forming a conformal coating on the plurality of passive surface mount components. In some embodiments, the device is fabricated by forming a second adhesive layer on the undercoating layer and the plurality of surface mount components before forming a top coating layer. In some embodiments, the device is fabricated by treating the substrate and the plurality of passive surface mount components with a first plasma before forming the undercoating layer, the first plasma being formed from a gas including helium, argon, oxygen, or any combination thereof. In some embodiments, the device is fabricated by treating the undercoating layer and the top of the passive surface mount components with a second plasma, the second plasma being formed from a gas including helium, argon, oxygen, or any combination thereof.

[0014] In some embodiments, a process for conformally coating a plurality of passive surface-mount components soldered to a printed circuit board of a lidless flip-chip ball grid array package including an integrated circuit die soldered to the substrate and a stiffener ring attached to the substrate includes forming a first adhesive layer on the substrate and the plurality of passive surface-mount components. Next, an undercoating layer is formed on the first adhesive layer, the undercoating layer extending around each of the passive surface-mount components, under each of the passive surface-mount components, and between each of the passive surface-mount components and the substrate. Then, a second adhesive layer is formed on the undercoating layer and each of the passive surface-mount components. Next, a top coating layer is formed on the second adhesive layer. In some embodiments, at least some of the passive surface-mount components are arranged in multiple adjacent rows. In some embodiments, the plurality of passive surface-mount components includes a plurality of chip capacitors. In some embodiments, the plurality of passive surface-mount components consists of a plurality of chip capacitors. In some embodiments, the undercoating layer is cured before the top coating layer is formed. In some embodiments, the process includes treating the substrate and the passive surface mount component with a first plasma before forming the first adhesive layer. In some embodiments, the first plasma is formed from a gas including helium, argon, oxygen, or any combination of helium, argon, and oxygen. In some embodiments, the process includes treating the undercoating layer with a second plasma before forming the second adhesive layer. In some embodiments, the second plasma is formed from a gas including helium, argon, oxygen, or any combination of helium, argon, and oxygen.

[0015] In some embodiments, an electronic device includes a printed circuit board including a ball grid array, an integrated circuit die soldered to the substrate, a plurality of passive surface-mount components soldered to the substrate, a stiffener ring attached to the substrate, and a conformal coating disposed on the passive surface-mount components. The passive surface-mount components are arranged in a plurality of adjacent rows. The passive surface-mount components and the integrated circuit die are housed within an opening formed by the stiffener ring. The conformal coating includes a first adhesive layer, an undercoating layer, a second adhesive layer, and a top coating layer. The first adhesive layer is disposed on the substrate and each of the passive surface-mount components. The undercoating layer is disposed on the first adhesive layer and extends around and beneath each of the passive surface-mount components, between each of the passive surface-mount components and the substrate. The second adhesive layer is disposed on the undercoating layer and each of the passive surface-mount components. The top coating layer is disposed on the second adhesive layer. In some embodiments, the plurality of passive surface-mount components include a plurality of chip capacitors. In some embodiments, the plurality of passive surface mount components comprises a plurality of chip capacitors.In some embodiments, the integrated circuit die includes a plurality of central processing unit cores.

[0016] In some embodiments, the first adhesive layer and the second adhesive layer comprise phosphonate-based self-assembled monolayers. In some embodiments, the undercoating layer comprises at least one polymer formed from a resin selected from the group consisting of epoxy phenolic resins and epoxy amine resins. In some embodiments, the topcoating layer comprises at least one polymer selected from the group consisting of silicone elastomers, acrylated urethanes, and polymers from modified epoxy phenolic resins or modified amine resins.

[0017] In some embodiments, a process for conformal coating passive surface mount components soldered to a printed circuit board of a lidless flip-chip ball grid array package includes attaching a stiffener ring to the substrate before forming a conformal coating on the passive surface mount components. The stiffener ring is attached to the substrate such that a plurality of passive surface mount components and an integrated circuit die are housed within an opening formed by the stiffener ring. After attaching the stiffener ring to the substrate, a conformal coating is formed on the passive surface mount components. The conformal coating extends over, around, and under each of the passive surface mount components. Forming the conformal coating includes forming an undercoating layer on the plurality of passive surface mount components, curing the undercoating layer, forming a first top coating layer over the undercoating layer, curing the first top coating layer, forming a second top coating layer over each of the passive surface mount components and over the cured first undercoating layer, and curing the second top coating layer. The undercoating layer extends around each of the passive surface mount components and underneath each of the passive surface mount components between each of the passive surface mount components and the substrate. In some embodiments, the plurality of passive surface mount components includes a plurality of chip capacitors. In some embodiments, the plurality of passive surface mount components is made up of a plurality of chip capacitors.

[0018] In some embodiments, curing the first top coating layer comprises baking the first top coating layer at a temperature of 95° C. to 105° C. for 50 to 70 minutes and baking the first top coating layer at a temperature of 145° C. to 155° C. for 110 to 130 minutes. In some embodiments, curing the second top coating layer comprises baking the second top coating layer at a temperature of 95° C. to 105° C. for 50 to 70 minutes and baking the second top coating layer at a temperature of 145° C. to 155° C. for 110 to 130 minutes.

[0019] In some embodiments, the substrate and passive surface mount components are treated with a plasma before forming the conformal coating. In some embodiments, the undercoating layer is treated with a plasma before forming the first top coating layer. The plasma used to treat the substrate and passive surface mount components before forming the conformal coating and the plasma used to treat the undercoating layer before forming the first top coating layer are formed from a gas containing helium, argon, oxygen, or any combination of helium, argon, and oxygen.

[0020] In some embodiments, a first adhesive layer is formed on the substrate and the passive surface mount component prior to forming the conformal coating on the passive surface mount component, and in some embodiments, a second adhesive layer is formed on the undercoating layer and the passive surface mount component prior to forming the first topcoating layer.

[0021] In some embodiments, an electronic device packaged in a lidless flip-chip ball grid array package includes a printed circuit board, an integrated circuit die soldered to the substrate, a plurality of passive surface mount components soldered to the substrate, a stiffener ring attached to the substrate, and a conformal coating disposed over the plurality of passive surface mount components. The substrate includes a ball grid array. The plurality of passive surface mount components and the integrated circuit die are housed within an opening formed by the stiffener ring. At least some of the plurality of passive surface mount components are arranged in a plurality of adjacent rows. The device is manufactured by attaching the stiffener ring to the substrate and forming a conformal coating on the plurality of passive surface mount components after attaching the stiffener ring to the substrate. The conformal coating extends over, around, and under each of the passive surface mount components. Forming the conformal coating includes forming an undercoating layer on the plurality of passive surface mount components, curing the undercoating layer, forming a first top coating layer on the undercoating layer, curing the first top coating layer, forming a second top coating layer on each of the passive surface mount components and on the cured first undercoating layer, and curing the second top coating layer. The undercoating layer extends around each of the passive surface mount components and beneath each of the passive surface mount components between each of the passive surface mount components and the substrate. In some embodiments, the plurality of passive surface mount components includes a plurality of chip capacitors. In some embodiments, the plurality of passive surface mount components is comprised of a plurality of chip capacitors.

[0022] In some embodiments, curing the first top coating layer comprises baking the first top coating layer at a temperature of 95° C. to 105° C. for 50 to 70 minutes and baking the first top coating layer at a temperature of 145° C. to 155° C. for 110 to 130 minutes. In some embodiments, curing the second top coating layer comprises baking the second top coating layer at a temperature of 95° C. to 105° C. for 50 to 70 minutes and baking the second top coating layer at a temperature of 145° C. to 155° C. for 110 to 130 minutes.

[0023] In some embodiments, a first adhesive layer is formed on the substrate and the passive surface mount component prior to forming the conformal coating on the passive surface mount component, and in some embodiments, a second adhesive layer is formed on the undercoating layer and the passive surface mount component prior to forming the first topcoating layer.

[0024] In some embodiments, the substrate and passive surface mount components are treated with a plasma before forming the conformal coating. In some embodiments, the undercoating layer is treated with a plasma before forming the first top coating layer. The plasma used to treat the substrate and passive surface mount components before forming the conformal coating and the plasma used to treat the undercoating layer before forming the first top coating layer are formed from a gas including helium, argon, oxygen, or any combination of helium, argon, and oxygen.

[0025] FIG. 1 is a schematic plan view of an example electronic device 10 including a printed circuit board 12, an integrated circuit die 14, a plurality of chip capacitors 16, a stiffening ring 18, and a conformal coating 20. The integrated circuit die 14 may be, for example, a central processing unit, a graphics processing unit, or a combined accelerated processing unit. In some embodiments, the integrated circuit die 14 includes multiple processing cores. In some embodiments, the stiffening ring 18 is a rigid square hoop that defines an opening 22. In some other embodiments, the stiffening ring 18 may be a hoop having a shape other than a square, such as a circle or a rectangle. The conformal coating 20 is described in more detail below with reference to FIGS. 3, 4, and 5. As shown in FIG. 1, some of the chip capacitors 16 are arranged in multiple rows, such as a first row R1 and a second row R2. Other chip capacitors 16 are arranged in a third row R3. The first row R1 and the second row R2 are adjacent rows. The third row R3 does not have an adjacent row of chip capacitors 16. As shown in FIG. 1, the continuous area covered by the conformal coating 20 of the chip capacitors 16 arranged in multiple rows, for example, the areas of the first row R1 and the second row R2, is larger than the continuous area covered by the conformal coating 20 of the chip capacitors 16 arranged in the third row R3.

[0026] Referring also to FIG. 2 , the electrical device 10 further includes a ball grid array 24 including a plurality of solder balls 26 disposed on the surface of the substrate 12 opposite the integrated circuit die 14. The ball grid array 24 can be used to electrically and mechanically connect the electrical device 10 to a larger printed circuit board (not shown) as a component of any of a number of computing devices, including, but not limited to, laptops, desktops, tablets, smartphones, game consoles, televisions, set-top boxes, wearables, internet servers, printers, etc. The printed circuit board 12 is a laminate substrate including a plurality of interconnects 28. The integrated circuit die 14 is electrically coupled to the plurality of interconnects 28 and mechanically attached to the substrate 12 by a plurality of solder joints 30. A die underfill 32 is disposed around the integrated circuit die 14 and the solder joints 20, filling the space between the integrated circuit die 14 and the substrate 12. The die underfill 32 is a non-conductive polymer. The die underfill 32 prevents melted TIM (not shown) or other conductive contaminants from shorting out any of the solder joints 30. Chip capacitor 16 is electrically coupled to a plurality of interconnects 28 and mechanically attached to substrate 12 by a plurality of solder joints 34. Specifically, solder joints 34 electrically connect terminals (not shown) of chip capacitor 16 to the plurality of interconnects 28. Interconnects 28 electrically interconnect integrated circuit die 14, chip capacitor 16, and solder balls 26 of ball grid array 24. As shown in both Figures 1 and 2, integrated circuit die 14 and the plurality of chip capacitors 16 are housed within opening 22 formed by stiffening ring 18.

[0027] Referring also to FIG. 3 , the conformal coating 20 includes an undercoating layer 36 and a top coating layer 38. The undercoating layer 36 extends around each of the chip capacitors 16 and underneath each of the chip capacitors 16 between the chip capacitors 16 and the substrate 12. Although not shown in FIG. 3 , the undercoating layer 36 may further extend to the top of each of the chip capacitors 16 due to capillary action, which forms the undercoating layer 36 between the chip capacitors 16 and the substrate 12. The top coating layer 38 is disposed over each of the chip capacitors 16 and the undercoating 36, and extends around the chip capacitors 16. The conformal coating 20 thus disposed physically and electrically isolates the chip capacitors 16 from conductive contaminants such as TIM.

[0028] In some embodiments, the undercoating layer 36 is an epoxy-based polymer. The undercoating layer 36 is formed from an underfill resin, such as an epoxy phenolic resin, such as U8439-105, or an epoxy amine resin, such as U8410-119A, available from Namics Corporation of Japan. Other suitable underfill resins include U8443-14, U8410-73C, U8410-314A, U8439-1, and U8410-207, available from Namics Corporation; UF-5016-MP03, available from KCC Corporation of Seoul, South Korea; and CRP-4152R5, available from Sumitomo Bakelite Co., Ltd. of Manchester, Connecticut.

[0029] In some embodiments, top coating layer 38 is formed from a coating resin such as Dowsil™ EA 6900 or Dowsil™ SE 4450, available from Dow Chemical Corporation of Midland, Michigan, to form a silicone elastomer, or Dymax® 9482, available from Dymax Corporation of Torrington, Connecticut, to form an acrylated urethane. Other suitable coating resins include Loctite Resinol 90C, Loctite 3515, and Loctite FP4470, available from Henkel Corporation of Rocky Hill, Connecticut, DAPCO™ 3003, available from Solvay USA of Chicago, Illinois, EW-3011, available from 3M of St. Paul, Minnesota, or modified epoxy phenolic or modified amine resins available from Namics, Inc.

[0030] Referring also to FIG. 4 , in some embodiments, the conformal coating 20 further includes a first adhesive layer 40 and a second adhesive layer 42. The first adhesive layer 40 is disposed over the substrate 12 and each chip capacitor 16. In the example of FIG. 4 , an undercoating layer 36 is disposed over the first adhesive layer 40 and extends around each chip capacitor 16 and beneath each chip capacitor 16 between the chip capacitor 16 and the substrate 12. A second adhesive layer 42 is disposed over the undercoating layer 36 and each chip capacitor 16. A top coating layer 38 is disposed over the second adhesive layer 42. As in the example of FIG. 3 , the conformal coating 20 physically and electrically isolates the chip capacitors 16 from conductive contaminants such as TIM.

[0031] In some embodiments, first adhesive layer 40 and second adhesive layer 42 are phosphonate-based self-assembled monolayers, such as adhesion primers available from Aculon Inc. of San Diego, California.

[0032] Referring also to FIG. 5 , in some embodiments, the top coating layer 38 includes a first top coating layer 44 and a second top coating layer 46. The first top coating layer 44 is disposed on the undercoating layer 36. As shown in the example of FIG. 5 , the first top coating layer 44 extends around each of the chip capacitors 16 and flattens the gaps between the chip capacitors 16. The second top coating layer 46 is disposed on the first top coating layer 44 and each of the chip capacitors 16. As in the example of FIG. 3 , the conformal coating 20 physically and electrically isolates the chip capacitors 16 from conductive contaminants such as the TIM.

[0033] In some embodiments, the first top coating layer 44 and the second top coating layer 46 are formed from a coating resin such as those described above for the top coating layer 38. In some embodiments, the first top coating layer 44 and the second top coating layer 46 are formed from the same coating resin. In some other embodiments, the first top coating layer 44 and the second top coating layer 46 are formed from different coating resins. In some embodiments, the first top coating layer 44 is formed from an epoxy-based polymer such as those described above for the undercoating layer 36, and the second top coating layer 46 is formed from a coating resin such as those described above for the top coating layer 38.

[0034] In various embodiments, the thickness of the conformal coating 20, measured from the substrate 12 to the surface of the top coating layer 38 opposite the substrate 12, may be at least 600 microns, 625 microns, 650 microns, or 675 microns, at most 700 microns, 725 microns, or 750 microns, or within a range defined between any two of the above values ​​(e.g., 600 microns to 750 microns, 625 microns to 725 microns, 650 microns to 700 microns, 675 microns to 700 microns, 675 microns to 725 microns, 700 microns to 750 microns, 700 microns to 725 microns, 725 microns to 750 microns). The relative thicknesses of the various layers in Figures 1-5 (e.g., the undercoating layer 36 and first adhesive layer 40 shown in Figure 4) are for ease of illustration and understanding and are not drawn to scale.

[0035] 6 is a flowchart illustrating a process for conformally coating a plurality of chip capacitors 16 according to one example described herein. As shown in block 100, the process begins with an integrated circuit die 14 and a plurality of chip capacitors 16 soldered to a substrate 12, as shown in FIG. 1, for example. A stiffening ring 18 is attached to the substrate 12 in block 102 such that the integrated circuit die 14 and the plurality of chip capacitors 16 are received within openings 22. After block 102, a conformal coating is formed on the plurality of chip capacitors 16 in block 104. The process then continues as shown in block 106 to produce an electrical device 10 with conformally coated chip capacitors 16. By attaching the stiffener ring 18 to the substrate 12 before forming the conformal coating 20 on the chip capacitors 16, it has been found that the conformal coating 20 exhibits far fewer, if any, voids or cracks in the conformal coating 20, or delamination between the undercoating layer 36 and the top coating layer 38, compared to forming the conformal coating 20 on multiple rows of chip capacitors 16 after the stiffener ring 18 is attached to the substrate 12.

[0036] As further shown in FIG. 6 , the process of attaching the stiffener ring 18 to the substrate 12 begins, for example, with the integrated circuit die 14 and the plurality of chip capacitors 16 soldered to the substrate 12, as shown in block 108. The stiffener ring 18 is then adhered to the substrate 12 with an adhesive, such as a silicone adhesive, as shown in block 110. In an embodiment, the adhesive is applied to the substrate 12, after which the stiffener ring 18 is placed on the adhesive. Alternatively or additionally, an adhesive is applied to the stiffener ring 18, after which the stiffener ring 18 with the adhesive is placed on the substrate 12. Once the stiffener ring 18 is adhered to the substrate 12, the adhesive is cured as shown in block 112. The process then continues as shown in block 114 to produce the stiffener ring 18 attached to the substrate 12.

[0037] Without wishing to be bound by any theory, it is believed that attaching the reinforcement ring 18 to the substrate 12 before applying the conformal coating 20 helps stabilize the substrate 12 and reduces mechanical stresses on the conformal coating 20 that could cause cracking and / or delamination of the coating. Attaching the reinforcement ring 18 to the substrate 12 before applying the conformal coating 20 is believed to avoid cross-contamination that would occur if the conformal coating 20 were applied before the reinforcement ring 18 was applied. It is believed that the larger the continuous area covered by the conformal coating 20, the greater the mechanical stress on the conformal coating 20. Therefore, it is believed that this process is most beneficial when multiple chip capacitors 16 are arranged in multiple adjacent rows, resulting in a larger continuous area covered by the conformal coating 20 on the chip capacitors 16 compared to the smaller continuous area covered by the conformal coating 20 for those arranged in a single row ( FIG. 1 ).

[0038] FIG. 7 is a flowchart illustrating a process for conformally coating a plurality of chip capacitors 16 according to one example described herein. Considering FIGS. 1, 2, 3, and 7 together, the process of forming the conformal coating 20 begins, as shown in block 200, with, for example, the integrated circuit die 14 and the plurality of chip capacitors 16 soldered to the substrate 12 and the stiffener ring 18 attached to the substrate 12. The undercoating layer 36 is formed in block 202 by dispensing underfill resin around the plurality of chip capacitors 16, as described above. Capillary action draws a portion of the underfill resin into the space between the plurality of chip capacitors 16 and the substrate 12. The undercoating layer 36 is then cured in block 204. The top coating layer 38 is formed in block 206 by dispensing coating resin over each of the chip capacitors 16 and over the undercoating layer 36, as described above. The top coating layer 38 is then cured in block 208. The process then continues as indicated in block 210 to produce an electrical device 10 with a conformally coated chip capacitor 16 .

[0039] In various embodiments, the undercoating layer 36 may be cured at block 204 using a two-stage heating process. In the first stage of the two-stage heating process, the undercoating layer 36 may be heated to a low temperature of 85°C, 90°C, or 95°C, a high temperature of 100°C, 105°C, or 110°C, or any temperature within a range defined between any two of the above values ​​(e.g., 85°C to 110°C, 90°C to 105°C, 95°C to 100°C, 95°C to 105°C, 90°C to 110°C, 100°C to 105°C, etc.). In the first stage of the two-stage heating process, the undercoating layer 36 can be heated for a short period of time such as 40, 45, 50, 55, or 60 minutes, or for a long period of time such as 65, 70, 75, or 80 minutes, or any range defined between any two of the above values ​​(e.g., 40 to 80 minutes, 45 to 75 minutes, 50 to 70 minutes, 55 to 65 minutes, 55 to 60 minutes, 60 to 65 minutes, 60 to 70 minutes, etc.).

[0040] In the second stage of the two-stage heating process, the undercoating layer 36 may be heated to a lower temperature of 130°C, 135°C, 140°C, 145°C, or 150°C, or to a higher temperature of 155°C, 160°C, 165°C, or 170°C, or to any temperature within a range defined between any two of the above values ​​(e.g., 130°C to 170°C, 135°C to 165°C, 140°C to 160°C, 145°C to 155°C, 150°C to 160°C, 145°C to 150°C, etc.). In the second stage of the two-stage heating process, the undercoating layer 36 can be heated for a short time of 100 minutes, 105 minutes, 110 minutes, 115 minutes, or 120 minutes, or for a long time of 125 minutes, 130 minutes, 135 minutes, or 140 minutes, or any range defined between any two of the above values ​​(e.g., 100 to 140 minutes, 105 to 135 minutes, 110 to 130 minutes, 115 to 125 minutes, 120 to 130 minutes, 120 to 140 minutes, 110 to 120 minutes, etc.).

[0041] In various embodiments, the top coating layer 38 can be cured in block 208 using a two-stage heating process, such as that described above for the undercoating 36 in block 204. In various other embodiments, the top coating layer 38 can be cured using a single-stage heating process, in which the top coating layer 38 can be heated to a low temperature of 150°C, 155°C, or 160°C, a high temperature of 165°C, 170°C, or 175°C, or any temperature within a range defined between any two of the above values ​​(e.g., 150°C to 175°C, 155°C to 170°C, 160°C to 165°C, 160°C to 170°C, 150°C to 160°C, 165°C to 170°C, etc.). In a single-stage heating process, the top coating layer 38 can be heated for a short time of 160 minutes, 165 minutes, 170 minutes, 175 minutes, or 180 minutes, or for a long time of 185 minutes, 190 minutes, 195 minutes, or 200 minutes, or any range defined between any two of the above values ​​(e.g., 160 to 200 minutes, 165 to 195 minutes, 170 to 190 minutes, 175 to 185 minutes, 175 to 185 minutes, 170 to 180 minutes, 180 to 200 minutes, 180 to 190 minutes, etc.).

[0042] In various other embodiments, the top coating layer 38 may be cured at block 208 using a three-stage heating process. In the first stage of the three-stage heating process, the top coating layer 38 may be heated to a low temperature of 85°C, 90°C, or 95°C, a high temperature of 100°C, 105°C, or 110°C, or any range defined between any two of the above values ​​(e.g., 85°C to 110°C, 90°C to 105°C, 95°C to 100°C, 95°C to 105°C, 90°C to 110°C, 100°C to 105°C, etc.). In the first stage of the three-stage heating process, the top coating layer 38 can be heated for a short time of 30, 35, 40, or 45 minutes, or for a long time of 50, 55, or 60 minutes, or any range defined between any two of the above values ​​(e.g., 30 to 60 minutes, 35 to 55 minutes, 40 to 50 minutes, 40 to 45 minutes, 45 to 50 minutes, 35 to 45 minutes, 45 to 50 minutes, etc.).

[0043] In the second stage of the three-stage heating process, the top coating layer 38 can be heated to a low temperature of 110°C, 115°C, or 120°C, a high temperature of 125°C, 130°C, or 135°C, or any temperature within a range defined between any two of the above values ​​(e.g., 110°C to 135°C, 115°C to 130°C, 120°C to 125°C, 120°C to 130°C, 115°C to 135°C, 125°C to 130°C, etc.). In the second stage of the three-stage heating process, the top coating layer 38 can be heated for a short time of 30, 35, 40, or 45 minutes, or for a long time of 50, 55, or 60 minutes, or any range defined between any two of the above values ​​(e.g., 30 to 60 minutes, 35 to 55 minutes, 40 to 50 minutes, 40 to 45 minutes, 45 to 50 minutes, 35 to 45 minutes, 45 to 50 minutes, etc.).

[0044] In the third stage of the three-stage heating process, the top coating layer 38 may be heated to a low temperature of 130°C, 135°C, 140°C, 145°C, or 150°C, a high temperature of 155°C, 160°C, 165°C, or 170°C, or any temperature within a range defined between any two of the above values ​​(e.g., 130°C to 170°C, 135°C to 165°C, 140°C to 160°C, 145°C to 155°C, 150°C to 160°C, 145°C to 150°C, etc.). In the third stage of the three-stage heating process, the top coating layer 38 can be heated for a short time of 100 minutes, 105 minutes, 110 minutes, 115 minutes, or 120 minutes, or for a long time of 125 minutes, 130 minutes, 135 minutes, or 140 minutes, or any range defined between any two of the above values ​​(e.g., 100 to 140 minutes, 105 to 135 minutes, 110 to 130 minutes, 115 to 125 minutes, 120 to 130 minutes, 120 to 135 minutes, 115 to 120 minutes, etc.).

[0045] In various other embodiments, the top coating layer 38 may be cured at block 208 using a four-stage heating process. In the first stage of the four-stage heating process, the top coating layer 38 may be heated to a low temperature of 85°C, 90°C, or 95°C, a high temperature of 100°C, 105°C, or 110°C, or any range defined between any two of the above values ​​(e.g., 85°C to 110°C, 90°C to 105°C, 95°C to 100°C, 95°C to 105°C, 90°C to 110°C, 100°C to 105°C, etc.). In the first stage of the four-stage heating process, the top coating layer 38 can be heated for a short time of 15, 20, 25, or 30 minutes, or a long time of 35, 40, or 45 minutes, or any range defined between any two of the above values ​​(e.g., 15 to 45 minutes, 20 to 40 minutes, 25 to 35 minutes, 25 to 30 minutes, 30 to 35 minutes, 35 to 45 minutes, 20 to 35 minutes, etc.).

[0046] In the second stage of the four-stage heating process, the top coating layer 38 can be heated to a low temperature of 100°C, 105°C, or 110°C, or a high temperature of 115°C, 120°C, 125°C, or 130°C, or any range defined between any two of the above values ​​(e.g., 100°C to 130°C, 105°C to 125°C, 110°C to 120°C, 110°C to 115°C, 115°C to 120°C, etc.). In the second stage of the four-stage heating process, the top coating layer 38 can be heated for a short time of 15, 20, 25, or 30 minutes, or for a long time of 35, 40, or 45 minutes, or any range defined between any two of the above values ​​(e.g., 15 to 45 minutes, 20 to 40 minutes, 25 to 35 minutes, 25 to 30 minutes, 30 to 35 minutes, 35 to 45 minutes, 20 to 35 minutes, etc.).

[0047] In the third stage of the four-stage heating process, the top coating layer 38 can be heated to a low temperature of 115°C, 120°C, or 125°C, a high temperature of 130°C, 135°C, 140°C, or 145°C, or any temperature within a range defined between any two of the above values ​​(e.g., 115°C to 145°C, 120°C to 140°C, 125°C to 135°C, 130°C to 135°C, 125°C to 130°C, etc.). In the third stage of the four-stage heating process, the top coating layer 38 can be heated for a short time of 15, 20, 25, or 30 minutes, or for a long time of 35, 40, or 45 minutes, or any range defined between any two of the above values ​​(e.g., 15 to 45 minutes, 20 to 40 minutes, 25 to 35 minutes, 25 to 30 minutes, 30 to 35 minutes, 35 to 45 minutes, 20 to 35 minutes, etc.).

[0048] In the fourth stage of the four-stage heating process, the top coating layer 38 may be heated to a low temperature of 130°C, 135°C, 140°C, 145°C, or 150°C, a high temperature of 155°C, 160°C, 165°C, or 170°C, or any temperature within a range defined between any two of the above values ​​(e.g., 130°C to 170°C, 135°C to 165°C, 140°C to 160°C, 145°C to 155°C, 150°C to 160°C, 145°C to 150°C, etc.). In the fourth stage of the four-stage heating process, the top coating layer 38 can be heated for a short time of 100 minutes, 105 minutes, 110 minutes, 115 minutes, or 120 minutes, or for a long time of 125 minutes, 130 minutes, 135 minutes, or 140 minutes, or any range defined between any two of the above values ​​(e.g., 100 to 140 minutes, 105 to 135 minutes, 110 to 130 minutes, 115 to 125 minutes, 120 to 130 minutes, 120 to 135 minutes, 115 to 120 minutes, etc.).

[0049] Without wishing to be bound by any theory, it is believed that the more advanced heating stages of the two-, three-, and four-stage heating process applied to the top coating layer 38 in block 208 reduce shrinkage and relieve stress in the curing top coating layer 38, particularly at the corners of the plurality of chip capacitors 16. Relieving stress in the top coating layer 38 at the corners of the plurality of chip capacitors 16 can reduce delamination of the conformal coating 20 from the plurality of chip capacitors 16.

[0050] In various embodiments, the thickness of the conformal coating 20, measured from the substrate 12 to the surface of the top coating layer 38 opposite the substrate 12, may be at least 600 microns, 625 microns, 650 microns, or 675 microns, at most 700 microns, 725 microns, or 750 microns, or within a range defined between any two of the above values ​​(e.g., 600 microns to 750 microns, 625 microns to 725 microns, 650 microns to 700 microns, 675 microns to 700 microns, 675 microns to 725 microns, 700 microns to 750 microns, 700 microns to 725 microns, 725 microns to 750 microns, etc.).

[0051] 8 is a flowchart illustrating a process for conformally coating a plurality of chip capacitors 16 according to another example presented in this disclosure. Considering Figures 1, 2, 3, and 8 together, the process of forming the conformal coating 20 begins, as shown in block 300, with, for example, an integrated circuit die 14 and a plurality of chip capacitors 16 soldered to a substrate 12 and a stiffener ring 18 attached to the substrate 12.

[0052] The substrate 12 and the plurality of chip capacitors 16 are treated with a first plasma at block 302. The first plasma includes helium, argon, oxygen, or any combination of helium, argon, and oxygen. In various embodiments, the first plasma includes a concentration of helium at a level as low as 5%, 10%, 15%, 20%, 25%, 30%, 35%, 45%, or 50% by weight, and at a level as high as 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, or 95% by weight, or within a range defined between any two of the foregoing values ​​(e.g., 5% to 95%). % to 95 wt%, 10 wt% to 90 wt%, 15 wt% to 85 wt%, 20 wt% to 80 wt%, 25 wt% to 75 wt%, 30 wt% to 70 wt%, 35 wt% to 65 wt%, 40 wt% to 60 wt%, 45 wt% to 55 wt%, 50 wt% to 70 wt%, 20 wt% to 30 wt%, 80 wt% to 95 wt%, etc. In some embodiments, the first plasma comprises a weight percent (wt%) of oxygen (e.g., 10 wt% to 95 wt%, 10 wt% to 90 wt%, 15 wt% to 85 wt%, 20 wt% to 80 wt%, 25 wt% to 75 wt%, 30 wt% to 70 wt%, 35 wt% to 65 wt%, 40 wt% to 60 wt%, 45 wt% to 55 wt%, 50 wt% to 70 wt%, 20 wt% to 30 wt%, 80 wt% to 95 wt%, etc.). In some embodiments, the first plasma is comprised of oxygen and / or helium and / or argon.

[0053] The undercoating layer 36 is formed in block 304 by dispensing underfill resin around the plurality of chip capacitors 16, as described above. Capillary action draws some of the underfill resin into the spaces between the plurality of chip capacitors 16 and the substrate 12. The undercoating layer 36 is then cured in block 306, for example, by the process described above with reference to block 204 of FIG.

[0054] The undercoating layer 36 is treated with a second plasma at block 308. The second plasma may include helium, argon, oxygen, or any combination of helium, argon, and oxygen. In various embodiments, the second plasma may include as low as 5%, 10%, 15%, 20%, 25%, 30%, 35%, 45%, or 50% by weight, as high as 55%, 60%, 65%, 70%, 75%, 80%, 85%, 90%, or 95% by weight, or within any range defined between any two of the foregoing values ​​(e.g., 50%). In some embodiments, the second plasma comprises a weight percent (wt%) of oxygen of from about 10 wt% to 95 wt%, 10 wt% to 90 wt%, 15 wt% to 85 wt%, 20 wt% to 80 wt%, 25 wt% to 75 wt%, 30 wt% to 70 wt%, 35 wt% to 65 wt%, 40 wt% to 60 wt%, 45 wt% to 55 wt%, 50 wt% to 70 wt%, 20 wt% to 30 wt%, 80 wt% to 95 wt%, etc. In some embodiments, the second plasma comprises oxygen and / or helium and / or argon.

[0055] The top coating layer 38 is formed, as described above, in block 310 by dispensing a coating resin over each of the chip capacitors 16 and over the undercoating layer 36. The top coating layer 38 is then cured in block 312, for example, by any of the processes described above with reference to block 208 of Figure 7. The process then continues, as shown in block 314, to produce an electrical device 10 with conformally coated chip capacitors 16.

[0056] Without wishing to be bound by any theory, it is believed that the first plasma treatment in block 302 modifies the treated surface by generating radicals at the surface that bond more strongly with the undercoating layer 36 and / or by removing contaminants from the treated surface that would interfere with bonding of the undercoating layer 36. The stronger bond and improved adhesion provided by the first plasma treatment may reduce or substantially eliminate void formation between the undercoating layer 36 and the plurality of chip capacitors 16 and the substrate 12, even in the spaces below the chip capacitors 16 between each of the chip capacitors 16 and the substrate 12. Similarly, it is believed that the second plasma treatment in block 308 modifies the surface of the undercoating layer 36 by generating radicals at the surface of the undercoating layer 36 that bond more strongly with the top coating layer 38 and / or by removing contaminants from the surface of the undercoating layer 36 and the plurality of chip capacitors 16 that would interfere with bonding of the top coating layer 38. The stronger bond and improved adhesion provided by the second plasma treatment can reduce or substantially eliminate the formation of voids between the top coating layer 38 and the undercoating layer 36, and between the top coating layer 38 and the plurality of chip capacitors 16.

[0057] FIG. 9 is a flowchart illustrating a process for conformally coating a plurality of chip capacitors 16 according to another example described herein. Considering FIGS. 1, 2, 4, and 9 together, the process of forming the conformal coating 20 begins, as indicated in block 400, with, for example, an integrated circuit die 14 and a plurality of chip capacitors 16 soldered to a substrate 12 and a stiffener ring 18 attached to the substrate 12. As indicated in block 402, a first adhesion layer 40 is formed on the substrate 12 and the plurality of chip capacitors 16. In one embodiment, the first adhesion layer 40 is formed by applying an adhesion primer to form a phosphonate-based self-assembled monolayer, for example, as described above. In various embodiments, the adhesion primer is applied by spraying, dipping, or wiping the adhesion primer onto the substrate 12 and the plurality of chip capacitors 16.

[0058] The undercoating layer 36 is formed in block 404 by dispensing underfill resin onto the first adhesive layer 40 around the plurality of chip capacitors 16, as described above. Capillary action draws a portion of the underfill resin into the spaces between the plurality of chip capacitors 16 and the substrate 12. The undercoating layer 36 is then cured in block 406, for example, by the process described above with reference to block 204 of FIG.

[0059] As shown in block 408, a second adhesion layer 42 is formed on the undercoating layer 36 and the plurality of chip capacitors 16. In one embodiment, the second adhesion layer 42 is formed by applying an adhesion primer to form a phosphonate-based self-assembled monolayer, for example, as described above. In various embodiments, the adhesion primer is applied by spraying, dipping, or wiping the adhesion primer onto the undercoating layer 36.

[0060] The top coating layer 38 is formed, as described above, in block 410 by dispensing a coating resin over each of the chip capacitors 16 and over the undercoating layer 36. The top coating layer 38 is then cured in block 412, for example, by any of the processes described above with reference to block 208 of Figure 7. The process then continues, as shown in block 414, to produce an electrical device 10 with conformally coated chip capacitors 16.

[0061] Without wishing to be bound by any theory, it is believed that the first adhesive layer 40 after being formed in block 402 bonds strongly to the substrate 12 and the plurality of chip capacitors 16, and further bonds strongly to the undercoating layer 36, bonding the undercoating layer 36 to the substrate 12 and the plurality of chip capacitors 16. The stronger bond provided by the first adhesive layer 40 may reduce or substantially eliminate void formation and delamination between the undercoating layer 36, the plurality of chip capacitors 16, and the substrate 12. Similarly, it is believed that the second adhesive layer 42 formed in block 408 bonds strongly to the undercoating layer 36 and the plurality of chip capacitors 16, as well as the top coating layer 38, bonding the top coating layer 38 to the undercoating layer 36. The stronger bond and improved adhesion provided by the second adhesive layer 42 may reduce or substantially eliminate void formation between the top coating layer 38 and the undercoating layer 36, and between the top coating layer 38 and the plurality of chip capacitors 16.

[0062] FIG. 10 is a flowchart illustrating a process for conformally coating a plurality of chip capacitors 16 according to another example described herein. Considering FIGS. 1, 2, 5, and 10 together, the process of forming the conformal coating 20 begins, as shown in block 500, with, for example, the integrated circuit die 14 and the plurality of chip capacitors 16 soldered to the substrate 12 and the stiffener ring 18 attached to the substrate 12. The undercoating layer 36 is formed in block 502 by dispensing underfill resin onto the first adhesive layer 40 around the plurality of chip capacitors 16 as described above. Capillary action draws a portion of the underfill resin into the spaces between the plurality of chip capacitors 16 and the substrate 12. The undercoating layer 36 is then cured in block 504, for example, by the process described above with reference to block 204 of FIG. 7.

[0063] A first top coating layer 44 of the top coating layer 38 is formed in block 506 by dispensing a coating resin (or an epoxy-based polymer) onto the undercoating layer 36 around the plurality of chip capacitors 16, as described above. The first top coating layer 38 is then cured in block 508, for example, by any of the processes described above with reference to block 208 of FIG. 7 . A second top coating layer 46 of the top coating layer 38 is formed in block 510 by dispensing a coating resin onto each of the chip capacitors 16 and onto the first top coating layer 44, as described above. The second top coating layer 46 is then cured in block 512, for example, by any of the processes described above with reference to block 208 of FIG. 7 . The process then continues, as shown in block 514, to produce an electrical device 10 including conformally coated chip capacitors 16.

[0064] Without wishing to be bound by any theory, it is believed that forming the top coating layer 38 in two parts can reduce stress in the top coating layer 38, particularly at the edges of the plurality of chip capacitors 16. The first top coating layer 44 substantially planarizes the area surrounding the plurality of chip capacitors 16 and does not cover the edges of the plurality of chip capacitors 16 to a significant extent. Therefore, after curing, stresses formed in the first top coating layer 44 at the edges of the plurality of chip capacitors 16 are significantly less than in embodiments in which the entire top coating layer 38 covers the edges of the plurality of chip capacitors 16 at once and cures. The second top coating layer 46 is formed on the substantially planarized surface of the plurality of chip capacitors 16 and the cured first top coating layer 44. Therefore, any exposed edges of the plurality of chip capacitors 16 are significantly reduced in size, which can reduce stresses formed in the second top coating layer 46 at the edges of the plurality of chip capacitors 16.

[0065] Although the examples in Figures 7, 8, 9 and 10 are shown as separate processes for ease of explanation and understanding, it will be understood that the present disclosure includes processes that combine elements of all four processes.

[0066] Although the above examples disclose chip capacitors as passive surface mount components, it will be understood that examples including chip resistors or other passive surface mount components in addition to or instead of chip capacitors are also included in the present disclosure.

[0067] As used herein, the phrase "within any range defined between any two of the above values" literally means that any range can be selected from any two of the values ​​listed before such phrase, regardless of whether the values ​​are at the bottom of the list or at the top of the list. For example, a pair of values ​​can be selected from two low values, two high values, or a low value and a high value.

[0068] The above detailed description and examples set forth therein are presented for purposes of illustration and description only, and not for purposes of limitation. For example, the operations described may be performed in any suitable manner. The operations described herein may be performed in any suitable order, and the order presented is for illustrative purposes only. Accordingly, the present embodiments are contemplated to encompass any and all modifications, variations, or equivalents that fall within the scope of the basic underlying principles disclosed above and claimed herein. Furthermore, while the above description describes hardware in the form of a processor executing code, hardware in the form of a state machine, or dedicated logic capable of producing the same effect, other configurations are contemplated.

Claims

1. 1. A process for conformally coating a plurality of passive surface mount components soldered to a printed circuit board of a lidless flip chip ball grid array package, the package further including an integrated circuit die soldered to the board; attaching a stiffener ring to the substrate, the plurality of passive surface mount components and the integrated circuit die being received within an opening formed by the stiffener ring, at least some of the plurality of passive surface mount components being arranged in a plurality of adjacent rows; forming a conformal coating on the passive surface mount components in a plurality of adjacent rows after attaching the stiffener ring to the substrate, the conformal coating extending over, around, and under each of the passive surface mount components; forming the conformal coating forming an undercoating layer on a plurality of chip capacitors, the undercoating layer extending around each of the plurality of chip capacitors and underneath each of the plurality of chip capacitors between each of the plurality of chip capacitors and the substrate; forming a top coating layer, the top coating layer being disposed on each of the plurality of chip capacitors and on the undercoating layer; process.

2. the plurality of passive surface-mount components includes the plurality of chip capacitors; 2. The process of claim 1.

3. curing the undercoating layer; and curing the top coating layer.

2. The process of claim 1.

4. further comprising treating the substrate and the plurality of chip capacitors with a first plasma before forming the conformal coating.

2. The process of claim 1.

5. further comprising treating the undercoating layer with a second plasma.

5. The process of claim 4.

6. and forming a first adhesive layer on the substrate and the plurality of chip capacitors before forming the conformal coating on the plurality of chip capacitors.

2. The process of claim 1.

7. and forming a second adhesive layer on the undercoating layer and the plurality of chip capacitors before forming the top coating layer. The process of claim 6.

8. 1. An electronic device packaged in a lidless flip-chip ball grid array package, comprising: a printed circuit board including a ball grid array; an integrated circuit die soldered to said substrate; a plurality of passive surface mount components soldered to the substrate, at least some of the plurality of passive surface mount components being arranged in a plurality of adjacent rows; a stiffener ring attached to the substrate, the plurality of passive surface mount components and the integrated circuit die being received within openings formed by the stiffener ring; a conformal coating disposed on the plurality of passive surface mount components, the conformal coating extending over, around, and under each of the plurality of passive surface mount components; The conformal coating comprises: forming an undercoating layer on a plurality of chip capacitors included in the plurality of passive surface mount components, the undercoating layer extending around each of the plurality of chip capacitors and under each of the plurality of chip capacitors between each of the plurality of chip capacitors and the substrate; forming a top coating layer, the top coating layer being disposed on each of the plurality of chip capacitors and on the undercoating layer; Electronic devices.

9. 1. An electronic device comprising: a printed circuit board including a ball grid array; an integrated circuit die soldered to said substrate; a plurality of passive surface mount components soldered to the substrate, at least some of the plurality of passive surface mount components being arranged in a plurality of adjacent rows; a stiffener ring attached to the substrate, the plurality of passive surface mount components and the integrated circuit die being received within openings formed by the stiffener ring; a conformal coating disposed on the plurality of passive surface mount components; The conformal coating comprises: a first adhesive layer disposed on the substrate and each of the plurality of passive surface mount components; an undercoating layer disposed on the first adhesive layer, the undercoating layer extending around each of the plurality of passive surface mount components, under each of the plurality of passive surface mount components, and between each of the plurality of passive surface mount components and the substrate; a second adhesive layer disposed on the undercoating layer and each of the plurality of passive surface mount components; a top coating layer disposed on the second adhesive layer; Electronic devices.

10. the integrated circuit die includes a plurality of central processing unit cores, and the plurality of passive surface mount components includes a plurality of chip capacitors; The electronic device of claim 9.

11. forming the conformal coating forming an undercoating layer on the plurality of passive surface mount components, the undercoating layer extending around and under each of the plurality of passive surface mount components between each of the plurality of passive surface mount components and the substrate; curing the undercoating layer; forming a first top coating layer, the first top coating layer being disposed over the undercoating layer; curing the first top coating layer; forming a second top coating layer, the second top coating layer being disposed over each of the plurality of passive surface mount components and over the cured first top coating layer; and curing the second top coating layer.

2. The process of claim 1.

12. the plurality of passive surface mount components includes a plurality of chip capacitors; 12. The process of claim 11.

13. curing the first top coating layer baking the first top coating layer at a temperature of 95°C to 105°C for 50 to 70 minutes; and baking the first top coating layer at a temperature of 145°C to 155°C for 110 to 130 minutes.

12. The process of claim 11.

14. curing the second top coating layer baking the second top coating layer at a temperature of 95°C to 105°C for 50 to 70 minutes; and baking the second top coating layer at a temperature of 145°C to 155°C for 110 to 130 minutes.

12. The process of claim 11.

15. further comprising treating the substrate and the plurality of passive surface mounted components with a plasma prior to forming the conformal coating.

12. The process of claim 11.

16. further comprising treating the undercoating layer with a second plasma before forming the first topcoating layer.

16. The process of claim 15.

17. forming a first adhesive layer on the substrate and the plurality of passive surface mount components prior to forming the conformal coating on the plurality of passive surface mount components.

12. The process of claim 11.

18. and forming a second adhesive layer on the undercoating layer and the plurality of passive surface mount components before forming the first topcoating layer.

18. The process of claim 17.

19. 1. An electronic device packaged in a lidless flip-chip ball grid array package, comprising: a printed circuit board including a ball grid array; an integrated circuit die soldered to said substrate; a plurality of passive surface mount components soldered to the substrate, at least some of the plurality of passive surface mount components being arranged in a plurality of adjacent rows; a stiffener ring attached to the substrate, the plurality of passive surface mount components and the integrated circuit die being received within openings formed by the stiffener ring; a conformal coating disposed on the plurality of passive surface mount components, the conformal coating extending over, around, and under each of the plurality of passive surface mount components, the conformal coating being comprised of an undercoating layer, a first top coating layer disposed on the undercoating layer, and a second top coating layer disposed on the first top coating layer. Electronic devices.

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