substrate fixing device

Abstract

To provide a substrate fixing device capable of suppressing discharge even when electrostatic attracting members are thin.SOLUTION: The substrate fixing device has a base plate through which a through-hole is formed, an electrode pin inserted inside the through-hole, and an electrostatic attracting member including an attracting electrode connected to the electrode pin. The base plate has a metal member including a first surface facing the electrostatic attraction member. A recess is formed on the first surface. The recess connects to the through-hole and includes the through-hole in plan view from a direction perpendicular to the first surface.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a substrate clamping device. [Background technology]

[0002] A known substrate fixing device used to fix a substrate such as a wafer has an electrostatic chucking member with a built-in chucking electrode, which has an opening for an electrode pin and a recess formed near the end of the opening on the base plate side. The recess increases the distance between the base plate and the connection portion of the electrode pin with the chucking electrode, thereby suppressing discharge between the connection portion and the base plate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2015-225952 [Patent Document 2] Japanese Patent Application Laid-Open No. 2007-258615 Summary of the Invention [Problem to be solved by the invention]

[0004] If the electrostatic attraction member is thin, it may be difficult to form a recess with sufficient depth, making it difficult to suppress discharge.

[0005] An object of the present disclosure is to provide a substrate fixing device that can suppress discharge even when the electrostatic attraction member is thin. [Means for solving the problem]

[0006] According to one aspect of the present disclosure, there is provided an electrostatic attraction member including: a base plate having a through hole formed therein; an electrode pin inserted into the through hole; and an attraction electrode connected to the electrode pin; a first cylindrical insulating part and a second cylindrical insulating part;the base plate has a metal member having a first surface facing the electrostatic attraction member, and a recess is formed on the first surface, the recess communicating with the through hole and including the through hole in a plan view from a direction perpendicular to the first surface. the base plate has a first insulating film covering the first surface around the recess, the first cylindrical insulating component is disposed in the through hole and the recess without protruding further toward the electrostatic attraction member than the first insulating film, and has a cylindrical first base through which the electrode pin is inserted, and a flange portion that protrudes radially outward from the first base and is sandwiched between a bottom of the recess and the electrostatic attraction member, and the second cylindrical insulating component has a cylindrical second base disposed between the first base and the metal member, and an inner protrusion that protrudes radially inward from an end of the second base opposite to the electrostatic attraction member side and comes into contact with an end of the first base opposite to the electrostatic attraction member side. A substrate clamping device is provided. [Effects of the Invention]

[0007] According to the present disclosure, even if the electrostatic attraction member is thin, discharge can be suppressed. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 2 is a cross-sectional view showing the substrate fixing device according to the first embodiment. [Figure 2] 1A to 1C are cross-sectional views (part 1) illustrating a method for manufacturing the substrate fixing device according to the first embodiment. [Figure 3] 10A and 10B are cross-sectional views (part 2) showing the method for manufacturing the substrate fixing device according to the first embodiment. [Figure 4] 10A and 10B are cross-sectional views (part 3) showing the method for manufacturing the substrate fixing device according to the first embodiment. [Figure 5] FIG. 10 is a cross-sectional view showing a substrate fixing device according to a reference example. [Figure 6] FIG. 10 is a cross-sectional view showing a substrate fixing device according to a second embodiment. [Figure 7] 10A and 10B are cross-sectional views (part 1) showing a method for manufacturing a substrate fixing device according to a second embodiment. [Figure 8] 10 is a cross-sectional view (part 2) showing the method for manufacturing the substrate fixing device according to the second embodiment. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. In this specification and drawings, components having substantially the same functional configurations are designated by the same reference numerals, and redundant description may be omitted.

[0010] (First embodiment) First, a first embodiment will be described. The first embodiment relates to a substrate fixing device.

[0011] [Configuration of the substrate holding device] Fig. 1 is a cross-sectional view showing a substrate fixing device according to the first embodiment. As shown in Fig. 1, the substrate fixing device 1 according to the first embodiment has, as its main components, a base plate 100, an electrostatic attraction member 200, an electrode pin 300, an insulating sleeve 400, and an adhesive layer 500.

[0012] The base plate 100 includes a plate-shaped metal member 110 and an insulating film 120 .

[0013] The thickness of the metal member 110 is, for example, approximately 20 mm to 50 mm. The metal member 110 is formed of, for example, aluminum, an aluminum alloy, titanium, or a titanium alloy. A through hole 111 is formed in the metal member 110, penetrating the metal member 110 in the thickness direction. The shape of the through hole 111 is, for example, approximately circular. The diameter of the through hole 111 is approximately 5 mm to 6 mm. An electrode pin 300 is inserted into the inside of the through hole 111. The metal member 110 has a first surface 110A. An electrostatic attraction member 200 is provided on the first surface 110A. A recess 112, which is like a counterbore and encompasses the through hole 111 in a plan view from a direction perpendicular to the first surface 110A, is formed in the first surface 110A of the metal member 110. The recess 112 is in communication with the through hole 111. The shape of the recess 112 is, for example, approximately circular. The diameter D1 of the recess 112 is about 8 mm to 12 mm. The depth D2 of the recess 112 is about 1.5 mm to 2.5 mm. The central axis of the through hole 111 and the central axis of the recess 112 are substantially aligned.

[0014] The metal member 110 can also be used as an electrode or the like for controlling plasma. By supplying a predetermined high-frequency power to the metal member 110, the energy for causing ions and the like in the generated plasma state to collide with a substrate such as a wafer attracted to the electrostatic attraction member 200 can be controlled, thereby enabling effective etching processing.

[0015] The insulating film 120 is formed on the first surface 110A and the sidewall and bottom surfaces of the recess 112. The insulating film 120 is, for example, an aluminum oxide film. The thickness of the insulating film 120 is approximately 0.2 mm to 0.4 mm. When the metal member 110 is made of aluminum or an aluminum alloy, for example, the insulating film 120 can be formed by anodizing the metal member 110 or by thermally spraying aluminum oxide onto the metal member 110.

[0016] The electrostatic attraction member 200 has a plate-shaped ceramic member 210 and an attraction electrode 220. The attraction electrode 220 is built into the ceramic member 210. The ceramic member 210 has a second surface 210A facing the first surface 110A of the metal member 110. An opening 211 reaching the attraction electrode 220 is formed in the second surface 210A of the ceramic member 210. In a plan view from a direction perpendicular to the first surface 110A, the opening 211 is located inside the through-hole 111, and the attraction electrode 220 overlaps with the through-hole 111. The electrostatic attraction member 200 may further have a heater.

[0017] The electrode pin 300 has a substantially cylindrical shape, is inserted into the through-hole 111, and is joined to the chucking electrode 220 within the opening 211 by a joining material 310. The diameter D3 of the portion of the electrode pin 300 that contacts the chucking electrode 220 is approximately 1.3 mm to 1.7 mm. The joining material 310 is, for example, a solder material or a brazing material. That is, the electrode pin 300 is, for example, soldered or brazed to the chucking electrode 220. The magnitude of the voltage applied from the electrode pin 300 to the chucking electrode 220 is, for example, approximately 3000 V to 6000 V.

[0018] The insulating sleeve 400 includes a cylindrical base 401 and a flange 402. The base 401 is disposed inside the through-hole 111, and the electrode pin 300 is inserted through the base 401. The base 401 covers the side surface of the electrode pin 300. The thickness of the base 401 is approximately the same as the distance between the outer surface of the electrode pin 300 and the inner wall surface of the through-hole 111. The flange 402 is a portion that protrudes radially outward from the end of the base 401 on the electrostatic attraction member 200 side. The flange 402 is located between the bottom surface of the recess 112 and the second surface 210A of the electrostatic attraction member 200, and is sandwiched between the bottom of the recess 112 and the electrostatic attraction member 200. The insulating sleeve 400 is made of an organic insulator such as polyimide or an inorganic insulator such as alumina. The insulating sleeve 400 is an example of a first cylindrical insulating component. The base 401 is an example of a first base.

[0019] The adhesive layer 500 bonds the electrostatic attraction member 200 to the insulating film 120 and the insulating sleeve 400, bonds the insulating film 120 and the metal member 110 to the insulating sleeve 400, and bonds the insulating sleeve 400 to the electrode pin 300. The base 401 of the insulating sleeve 400 is bonded to the metal member 110 by the adhesive layer 500. The adhesive layer 500 is made of an insulating resin such as silicone resin. The adhesive layer 500 may contain a filler such as alumina or aluminum nitride.

[0020] [Manufacturing method of substrate fixing device] Next, we will explain a method for manufacturing the substrate fixing device 1. Figures 2 to 4 are cross-sectional views showing a method for manufacturing the substrate fixing device 1 according to the first embodiment.

[0021] First, as shown in FIG. 2(a), an electrostatic attraction member 200 is prepared, which includes a ceramic member 210 and an attraction electrode 220, and in which an opening 211 is formed in the ceramic member 210.

[0022] Next, as shown in FIG. 2(b), the electrode pin 300 is joined to the chucking electrode 220 in the opening 211 by soldering or brazing.

[0023] 3(a), a base plate 100 is prepared, which includes a metal member 110 having a through-hole 111 and a recess 112 formed therein, and an insulating film 120. When the metal member 110 is made of aluminum or an aluminum alloy, the insulating film 120 can be formed by anodizing the metal member 110 or by thermally spraying aluminum oxide onto the metal member 110.

[0024] Next, as shown in FIG. 3(b), a fluid adhesive 510 is applied to the surface of the insulating film 120 and the surface of the metal member 110 by coating or the like.

[0025] 4(a), the insulating sleeve 400 is inserted into the recess 112 and the through-hole 111 from the first surface 110A side of the metal member 110 so that the flange portion 402 is caught on the bottom of the recess 112. As a result, part of the adhesive 510 provided in the recess 112 moves upward on the first surface 110A. In addition, the base 401 comes into contact with the adhesive 510 on the inner wall surface of the through-hole 111.

[0026] 4(b), the electrode pin 300 is inserted into the insulating sleeve 400 from the first surface 110A side of the metal member 110, while the second surface 210A of the ceramic member 210 is brought into contact with the adhesive 510. Then, the electrostatic attraction member 200 is pressed against the base plate 100 to bond them together. As a result, the adhesive 510 between the base plate 100 and the electrostatic attraction member 200 spreads into the gaps around the ceramic member 210, the insulating sleeve 400, and the electrode pin 300. Next, the adhesive 510 is cured (hardened), and an adhesive layer 500 is formed from the adhesive 510.

[0027] In this way, the substrate fixing device 1 according to the first embodiment can be manufactured.

[0028] Here, the effects of the first embodiment will be described in comparison with a reference example. Fig. 5 is a cross-sectional view showing a substrate fixing device according to a reference example.

[0029] The substrate fixing device 9 according to the reference example differs from the first embodiment mainly in the configuration of the base plate. As shown in FIG. 5, a base plate 900 is provided instead of the base plate 100. The base plate 900 is composed of a metal member 910 made of the same material as the metal member 110. A through hole 911 similar to the through hole 111 is formed in the metal member 910, but no recess is formed therein. Furthermore, the insulating film 120 is not formed. Furthermore, a cylindrical insulating sleeve 930 is provided instead of the insulating sleeve 400. The other configurations are the same as those of the first embodiment.

[0030] Comparing the first embodiment with the reference example, because a recess is formed in the metal member 110 of the base plate 100, the shortest distance L1 between the bonding material 310 and the base plate 100 is longer than the shortest distance L2 between the bonding material 310 and the base plate 900. Here, the shortest distances L1 and L2 are distances in a path that does not include the ceramic member 210, which is likely to hinder discharge. For example, the shortest distance L2 is about 2 mm, while the shortest distance L1 is about 5 mm to 6 mm. Therefore, according to the first embodiment, discharge can be made less likely to occur in view of the shape of the metal member 110.

[0031] Furthermore, in the first embodiment, the base plate 100 has the insulating film 120. Therefore, according to the first embodiment, discharge can be made less likely to occur from the viewpoint of insulation.

[0032] Therefore, according to the first embodiment, discharge can be suppressed regardless of the thickness of the electrostatic attraction member 200. Furthermore, suppression of discharge can extend the life of the substrate fixing device 1.

[0033] (Second embodiment) Next, a second embodiment will be described. The second embodiment differs from the first embodiment mainly in the configuration of the insulating sleeve.

[0034] [Configuration of the substrate holding device] Fig. 6 is a cross-sectional view showing a substrate fixing device according to the second embodiment. As shown in Fig. 6, the substrate fixing device 1 according to the second embodiment has insulating sleeves 600 and 700 instead of the insulating sleeve 400 in the first embodiment.

[0035] The insulating sleeve 600 includes a cylindrical base 601 and a flange 602. The base 601 is disposed inside the through-hole 111, and the electrode pin 300 is inserted through the base 601. The base 601 covers the side surface of the electrode pin 300. The thickness of the base 601 is approximately half the distance between the outer surface of the electrode pin 300 and the inner wall surface of the through-hole 111. The flange 602 is a portion that protrudes radially outward from the end of the base 601 on the electrostatic attraction member 200 side. Similar to the flange 402, the flange 602 is located between the bottom surface of the recess 112 and the second surface 210A of the electrostatic attraction member 200, and is sandwiched between the bottom of the recess 112 and the electrostatic attraction member 200. The insulating sleeve 600 is made of an organic insulator such as polyimide or an inorganic insulator such as alumina. The insulating sleeve 600 is an example of a first cylindrical insulating component. The base 601 is an example of a first base.

[0036] The insulating sleeve 700 includes a cylindrical base portion 701 and an inner protrusion 702. The base portion 701 is disposed inside the through-hole 111 and outside the base portion 601. That is, the base portion 701 is disposed between the base portion 601 and the metal member 110 in the radial direction of the through-hole 111. The base portions 601 and 702 are in contact with each other. The base portion 701 is also in contact with the flange portion 602. The thickness of the base portion 701 is approximately half the distance between the outer surface of the electrode pin 300 and the inner wall surface of the through-hole 111. The inner protrusion 702 is a portion that protrudes radially inward from the end of the base portion 701 opposite the electrostatic attraction member 200 side. The inner protrusion 702 is in contact with the end of the base portion 601 of the insulating sleeve 600 opposite the electrostatic attraction member 200 side. The insulating sleeve 700 is made of an organic insulator such as polyimide or an inorganic insulator such as alumina. The insulating sleeve 700 is an example of a second cylindrical insulating part. The base 701 is an example of a second base.

[0037] The other configurations are the same as those in the first embodiment.

[0038] [Manufacturing method of substrate fixing device] Next, a description will be given of a method for manufacturing the substrate fixing device 2. Figures 7 and 8 are cross-sectional views showing a method for manufacturing the substrate fixing device 2 according to the second embodiment.

[0039] First, similarly to the first embodiment, the electrostatic attraction member 200 is prepared, and the electrode pin 300 is joined to the attraction electrode 220 in the opening 211 by soldering or brazing (see FIG. 2(b)).

[0040] Similarly to the first embodiment, the base plate 100 is prepared (see FIG. 3(a)). Next, as shown in FIG. 7(a), a fluid adhesive 520 is provided on the surface of the insulating film 120 by coating or the like.

[0041] 7(b), the insulating sleeve 600 is inserted into the recess 112 and the through-hole 111 from the first surface 110A side of the metal member 110 so that the flange portion 602 is caught on the bottom of the recess 112. As a result, part of the adhesive 520 provided in the recess 112 moves above the first surface 110A. In addition, a gap exists between the inner wall surface of the through-hole 111 and the base portion 601.

[0042] 8(a), the electrode pin 300 is inserted into the insulating sleeve 600 from the first surface 110A side of the metal member 110, while the second surface 210A of the ceramic member 210 is brought into contact with the adhesive 520. Then, the electrostatic attraction member 200 is pressed against the base plate 100 to be bonded together. As a result, the adhesive 520 between the base plate 100 and the electrostatic attraction member 200 spreads into the gaps around the ceramic member 210, the insulating sleeve 600, and the electrode pin 300. Next, the adhesive 520 is cured (hardened), and an adhesive layer 521 is formed from the adhesive 520.

[0043] 8(b), the insulating sleeve 700 is inserted into the through-hole 111 from the side opposite to the first surface 110A of the metal member 110 so that the end of the base 701 on the side where the inner protrusion 702 is not provided is in contact with the flange portion 602. The inner protrusion 702 may be in contact with the base 601. At this time, a fluid adhesive is provided on the outer surface of the insulating sleeve 700. After the insertion, the adhesive provided on the insulating sleeve 700 is cured (hardened) to form the adhesive layer 500 including the adhesive layer 521.

[0044] The second embodiment can also provide the same effects as the first embodiment. Furthermore, in the second embodiment, the insulating sleeve 700 can be disposed after the base plate 100 and the electrostatic attraction member 200 are bonded together.

[0045] The above describes in detail preferred embodiments, but the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims. [Explanation of symbols]

[0046] 1, 2: Board fixing device 100: Base plate 110: Metal parts 111: Through hole 112: Recess 120: insulating film 200: Electrostatic attraction member 300: Electrode pin 400, 600, 700: Insulating sleeve 500: Adhesive layer

Claims

1. a base plate having a through hole formed therein; an electrode pin inserted into the through hole; an electrostatic attraction member including an attraction electrode to which the electrode pin is connected; a first cylindrical insulating part and a second cylindrical insulating part; and the base plate includes a metal member having a first surface facing the electrostatic attraction member, a recess formed in the first surface, the recess communicating with the through hole and including the through hole in a plan view from a direction perpendicular to the first surface; the base plate has a first insulating film covering the first surface around the recess; The first cylindrical insulating part is the insulating film is disposed in the through hole and the recess without protruding beyond the first insulating film toward the electrostatic attraction member; a cylindrical first base portion through which the electrode pin is inserted; a flange portion that protrudes radially outward from the first base portion and is sandwiched between a bottom of the recess and the electrostatic attraction member; and The second cylindrical insulating part is a cylindrical second base portion disposed between the first base portion and the metal member; an inner protrusion that protrudes radially inward from an end of the second base opposite to the electrostatic attraction member side and that comes into contact with an end of the first base opposite to the electrostatic attraction member side; A substrate fixing device comprising:

2. A base plate having a through hole formed therein; an electrode pin inserted into the through hole; an electrostatic attraction member including an attraction electrode to which the electrode pin is connected; a first cylindrical insulating part; and the base plate includes a metal member having a first surface facing the electrostatic attraction member, a recess formed in the first surface, the recess communicating with the through hole and including the through hole in a plan view from a direction perpendicular to the first surface; the base plate has a first insulating film covering the first surface around the recess; a first insulating film disposed in the through hole and the recess without protruding toward the electrostatic attraction member beyond the first insulating film;

3. The first cylindrical insulating part is a cylindrical first base portion through which the electrode pin is inserted; a flange portion that protrudes radially outward from the first base portion and is sandwiched between a bottom of the recess and the electrostatic attraction member; The substrate fixing device according to claim 2 , further comprising:

4. 4. The substrate fixing device according to claim 1, wherein the first base portion is bonded to the electrode pin.

5. 5. The substrate fixing device according to claim 1, wherein the first base portion is also bonded to the metal member.

6. 4. The substrate fixing device according to claim 3, further comprising a second cylindrical insulating part including a second base portion disposed between the first base portion and the metal member.

7. 7. The substrate fixing device according to claim 1, wherein the second base portion is bonded to the metal member.

8. The diameter of the recess is 8 mm to 12 mm, 8. The substrate fixing device according to claim 1, wherein the depth of the recess is 1.5 mm to 2.5 mm.

9. 9. The substrate fixing device according to claim 1, wherein the base plate has a second insulating film covering the sidewall and bottom surfaces of the recess.

10. 10. The substrate holding device according to claim 9, wherein the second insulating film has a thickness of 0.2 mm to 0.4 mm.

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