Degating device, resin sealing device, and degating method

Abstract

To provide a degate device which can stably remove an unnecessary resin.SOLUTION: A degate device 5 includes: a pair of degate palettes 51L and 51R on which a sealed product W' sealed with a resin is mounted; a pair of degate hands 52L and 52R which are arranged above the pair of degate palettes 51L and 51R, and are vertically movable together with the pair of degate palettes 51L and 51R; and a receiving member 53 which separates an unnecessary resin C from a sealed product W by being pushed against a lower surface of a part of the sealed product W in a space 51C between the pair of degate palettes 51L and 51R, in the state where the sealed product W is sandwiched between the pair of degate palettes 51L and 51R and the pair of degate hands 52L and 52R. The receiving member 53 is configured to be retractable from the space 51C between the pair of degate palettes 51L and 51R so as to open an inlet of a collection path 50 where the unnecessary resin C can fall down.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present invention relates to a degating device, a resin sealing device, and a degating method. [Background technology]

[0002] When lead frames, semiconductor chips, etc. are resin-encapsulated by transfer molding, the portion of the encapsulated part where the thermosetting resin hardens in the cavity becomes the product, while the portion that hardens in the culls, runners, etc. becomes unnecessary resin. The unnecessary resin is removed from the gate, which is the boundary with the cavity, using a degating device (see, for example, Patent Document 1).

[0003] The de-gate device first clamps the hardened part of the cavity between the de-gate pallet and the de-gate hand, and tears off any excess resin that is not clamped. Next, the separated excess resin is picked up by a suction pad, and the de-gate pallet is removed from directly below the suction pad. Finally, the excess resin is dropped from the suction pad and collected in a disposal box. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2012-231030 A. Summary of the Invention [Problem to be solved by the invention]

[0005] However, in conventional methods, the hardened portion of the resin material stuck to the tip of the plunger that pushed the resin material toward the cull, causing cracks and chips in the unwanted resin when it was removed. If the unwanted resin had cracks or other defects, the suction force of the suction pad would be reduced, making it impossible to lift and remove the unwanted resin. This required the operator to stop the device and wait for the mold temperature to drop before manually removing the unwanted resin, which increased the burden on the operator. In particular, soft resin materials such as silicone-based resins are prone to cracks and chips in the unwanted resin, and a solution to this problem was needed.

[0006] Therefore, an object of the present invention is to provide a degating device that can stably remove unnecessary resin, a resin sealing device equipped with the device, a degating method using the device, and the like. [Means for solving the problem]

[0007] A degating device according to one aspect of the present invention includes a pair of degate pallets on which resin-sealed sealed products are placed, a pair of degate hands arranged above the pair of degate pallets and movable up and down together with the pair of degate pallets, and a receiving member that separates unwanted resin from the sealed products by pressing the receiving member against the underside of a portion of the sealed products between the pair of degate pallets while the sealed products are sandwiched between the pair of degate pallets and the pair of degate hands. The receiving member is configured to be retractable from between the pair of degate pallets to open an entrance to a recovery path through which the unwanted resin can fall.

[0008] According to this aspect, the unnecessary resin separated from the sealed product can be dropped from the entrance of the recovery path that is opened by the retraction of the receiving member, so that the unnecessary resin can be stably removed.

[0009] In the above aspect, the receiving member may be configured to be separable into a first member and a second member, and when separating the unnecessary resin from the sealed product, the first member and the second member may approach each other below the unnecessary resin, and after separating the unnecessary resin, the first member and the second member may move away from each other below the unnecessary resin, and a recovery path may be formed between the first member and the second member.

[0010] According to this aspect, the movement of the receiving member to retreat from the recovery path of the falling unnecessary resin can be divided into the movement of the first member and the movement of the second member, thereby reducing the movement distance and movement time.

[0011] In the above aspect, the receiving member may be driven by a cam mechanism that converts vertical movement into horizontal movement, and move horizontally to open the entrance.

[0012] According to this aspect, the receiving member can be moved only by a mechanical mechanism without relying on electrical control.

[0013] In the above aspect, the device may further include a pusher that pushes the unwanted resin downward after the receiving member opens the inlet.

[0014] According to this aspect, the waste resin can be reliably dropped using the pusher, and the waste resin can be stably collected. Note that if a pusher is not used, the waste resin may be temporarily lifted by a suction pad and tilted so that it is smaller than the entrance of the collection path in a plan view, and then dropped into the collection path.

[0015] In the above aspect, a waste box capable of storing unnecessary resin may be disposed immediately below the pusher.

[0016] According to this aspect, the waste resin can be removed by minimizing the collection path from the pusher to the waste box. The waste box can also be positioned away from directly below the pusher. In this case, a sloped surface that allows the waste resin to slide off can be provided on the receiving member or the like.

[0017] In the above aspect, the unwanted resin may be a silicone-based resin formed to be larger than the inlet in the direction in which the pair of degate pallets are arranged, and may be deflected and deformed when pushed by the pusher to pass through the inlet.

[0018] According to this aspect, even if the entrance of the recovery path is smaller than the unwanted resin, the unwanted resin can be deformed and recovered.

[0019] In addition to the above aspect, the resin sealing apparatus may further include a resin supplying device capable of supplying a liquid resin material.

[0020] According to this embodiment, unnecessary resin can be stably removed, and therefore, it is suitable for transfer molding using a soft liquid resin material.

[0021] A de-gating method according to one embodiment of the present invention includes placing a resin-sealed sealed product on a pair of de-gate pallets, restraining the sealed product by clamping it between the pair of de-gate pallets and a pair of de-gate hands, separating the unwanted resin from the sealed product by pressing a portion of the sealed product against the upper surface of a receiving member from between the pair of de-gate pallets, opening an entrance to a recovery path through which the unwanted resin can fall by retracting the receiving member from between the pair of de-gate pallets, and dropping the unwanted resin into the entrance.

[0022] According to this aspect, the unnecessary resin separated from the sealed product can be dropped from the entrance of the recovery path that is opened by the retraction of the receiving member, so that the unnecessary resin can be stably removed.

[0023] In the above aspect, dropping the waste resin into the inlet may include poking the waste resin downward to cause it to bend and deform.

[0024] According to this aspect, the waste resin can be reliably dropped by being bent and deformed, and therefore the waste resin can be stably collected. [Effects of the Invention]

[0025] According to the present invention, it is possible to provide a degating device capable of stably removing unnecessary resin, a resin sealing device equipped with the device, a degating method using the device, and the like. [Brief explanation of the drawings]

[0026] [Figure 1] 1 is a plan view schematically showing the configuration of a resin sealing apparatus including a degating device according to an embodiment of the present invention; [Figure 2] FIG. 1 is a front view showing the degate device of one embodiment of the present invention, showing the state in which the pallet has moved directly below the degate head and the degate head has lowered. [Figure 3] FIG. 3 is a front view showing the degating device in operation following FIG. 2, showing a state in which a receiving member has entered a space sandwiched between a pair of pallets. [Figure 4] 4 is a front view showing the degate device in operation following FIG. 3, showing a state in which a sealed product is sandwiched between the degate pallet and the degate hand and a part of the sealed product is pressed against the receiving member. FIG. [Figure 5] FIG. 5 is a front view showing the degate device in operation following FIG. 4, showing a state in which the receiving member has been retracted from the space sandwiched between the pair of degate pallets. [Figure 6] 6 is a front view showing the degating device in operation following FIG. 5, showing a state in which the pusher has pushed down the unnecessary resin. FIG. [Figure 7] 1 is a flowchart illustrating a degating method using a degating device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0027] A preferred embodiment of the present invention will be described with reference to the accompanying drawings. In each drawing, components with the same reference numerals have the same or similar configurations. Each configuration will be described in detail below with reference to Figs. 1 to 7. Fig. 1 is a plan view schematically showing the configuration of a resin sealing apparatus 1 equipped with a degating device 5 according to one embodiment of the present invention. For convenience in explaining the embodiment, "front," "rear," "left," and "right" are defined as shown in Fig. 1, and "upper" and "lower" are defined with respect to gravity.

[0028] The resin sealing apparatus 1 is a transfer molding machine, and is equipped with a work supply device 2, a resin supply device 3, a press device 4, a degating device 5, a work storage device 6, a conveying device 7, etc. In the illustrated example, the resin sealing apparatus 1 is equipped with two press devices 4. The number of press devices 4 is not limited to the illustrated example, and may be changed as appropriate.

[0029] The workpiece W before being resin-sealed is, for example, a lead frame on which a semiconductor element is mounted, an interposer substrate on which a semiconductor element is mounted, a carrier plate with an adhesive sheet to which a semiconductor element is temporarily attached, etc., and is composed of a support and minute components such as a semiconductor element, a MEMS chip, an electronic device, etc., attached to the support. The workpiece W may be a support on which multiple components are attached, or a support on which different types of components are mixed and attached.

[0030] The transport device 7 includes a loader 71 and an unloader 72 that are movable along a guide rail 70. The work supply device 2 supplies the work W to the loader 71. The loader 71 carries the supplied work W into the die 40 of the press device 4.

[0031] In the illustrated example, the resin supply device 3 is configured to supply a thermosetting liquid resin material to a plurality of pots 43 provided in the mold 40. The configuration of the resin supply device 3 is not limited to the illustrated example, and it may be configured to supply solid resin tablets to the loader 71. The liquid resin material is, for example, a composition of silicone resin or epoxy resin, and exhibits excellent sealing properties when cured by transfer molding or the like.

[0032] The resin supply device 3 includes supply ports 33, the same number of syringes 31 as the pots 43 of the mold 40, and tubes 32 connecting each syringe 31 to the corresponding supply port 33. The syringes 31 are filled with liquid resin material. The supply ports 33 are provided with pinch valves that open and close the tubes 32. When the syringes 31 are compressed and the pinch valves are loosened, the liquid resin material is supplied to the supply ports 33 through the tubes 32.

[0033] The resin supply device 3 can rotate its supply port 33 to supply liquid resin material to either the left or right press device 4. The resin supply device 3 can also move left and right along rails laid on the floor surface, allowing the supply port 33 to enter the mold 40 of the press device 4. The supply port 33 enters the mold 40 and drips the liquid resin material from directly above the corresponding pot 43.

[0034] The press device 4 sandwiches the workpiece W between a lower mold and an upper mold and applies pressure to seal it with resin (molding). The unloader 72 removes the sealed product W', which is the resin-sealed workpiece W, from the mold 40 and transports it to a pallet 51 that can move back and forth. The sealed product W' includes a portion (hereinafter sometimes referred to as a package P) where the thermosetting resin hardens in the cavity to become a product, and a portion (hereinafter sometimes referred to as unnecessary resin C) where the thermosetting resin does not harden into a product due to culls, runners, etc.

[0035] In the illustrated example, two packages P are connected by the same number of waste resin C as the pots 43. The degating device 5 separates the waste resin C from the sealed product W' when the pallet 51 moves directly under the degating head 52 installed between the guide rail 70 and the work storage device 6. The work storage device 6 receives the package P from which the waste resin C has been separated from the pallet 51 and stores it in a magazine.

[0036] Hereinafter, a degating device 5 according to one embodiment of the present invention will be described with reference to Figures 2 to 6. Figure 2 is a front view showing a state in which a pallet 51 has moved directly below a degating head 52 and the degating head has lowered. As shown in Figure 2, the degating device 5 is equipped with at least a pair of degating pallets 51L, 51R, a pair of degating hands 52L, 52R, a receiving member 53, etc. In the illustrated example, it further includes a pusher 54, a disposal box 55, and multiple air blowers 56.

[0037] The pair of degate pallets 51L, 51R are spaced apart from each other and arranged on the upper surface of the pallet 51. The pair of degate hands 52L, 52R are spaced apart from each other and arranged on the lower surface of the degate head 52.

[0038] One degate hand 52L faces one degate pallet 51L from above and is configured to be able to move up and down together with the degate pallet 51L. Similarly, the other degate hand 52R faces the other degate pallet 51R from above and is configured to be able to move up and down together with the degate pallet 51R.

[0039] The pusher 54 is provided between the pair of degate hands 52L, 52R and is located directly above the space 51C sandwiched between the pair of degate pallets 51L, 51R. Each air blower 56 is disposed near the degate hands 52L, 52R and is configured to be able to cool the resin-sealed sealed product W' at a high temperature.

[0040] In the illustrated example, the receiving member 53 is configured to be separable into a first member 53L (e.g., the left half) and a second member 53R (e.g., the right half). The first and second members 53L, 53R are formed symmetrically, and each includes a support plate 531, a cam 532, a spring 533, etc. The support plate 531 extends in the front-rear direction. The cam 532 is fixed to an end of the support plate 531. The spring 533 is fixed to the cam 532.

[0041] Cam 532 constituting first member 53L has an inclined surface that slopes downward and toward the left. Spring 533 constituting first member 53L is a compression spring that urges cam 532 toward the left. Similarly, cam 532 constituting second member 53R has an inclined surface that slopes downward and toward the right, and spring 533 urges cam 532 toward the right.

[0042] 3 is a front view showing a state in which the support plate 531 of the receiving member 53 has entered the space 51C sandwiched between the pair of degate pallets 51L, 51R. As shown in FIG. 3, when the receiving member 53 is raised and the inclined surface of the cam 532 is pressed against the roller 512 attached to the pallet 51, the first and second members 53L, 53R approach each other below the waste resin against the biasing force of the spring 533. In the example shown, the first and second members 53L, 53R approach each other toward directly below the center of the waste resin C. The support plate 531 of the receiving member 53 enters the space 51C sandwiched between the pair of degate pallets 51L, 51R and faces the waste resin C from below.

[0043] 4 is a front view showing a state in which a sealed product W' is sandwiched between a pair of degate pallets 51L, 51R and a pair of degate hands 52L, 52R, and a part of the sealed product W' is pressed against a support plate 531 of a receiving member 53. The sealed product W' can be sandwiched and restrained between the pair of degate pallets 51L, 51R and the pair of degate hands 52L, 52R.

[0044] 5 is a diagram showing the state in which the receiving member 53 has retreated from the space 51C sandwiched between the pair of degate pallets 51L, 51R. The receiving member is driven by a cam mechanism that converts vertical movement into horizontal movement, and moves horizontally to open the entrance. When the receiving member 53 descends, the support plate 531 of the receiving member 53 retreats from the space 51C sandwiched between the pair of degate pallets 51L, 51R, which is the entrance to the recovery path 50.

[0045] Furthermore, the biasing force of the spring 533 moves the first member 53L to the left and the second member 53R to the right, so that the first and second members 53L, 53R move away from each other below the waste resin C, thereby defining a collection path 50 between the left and right support plates 531 through which the waste resin C can fall. The means for moving the first and second members 53L, 53R is not limited to a cam mechanism. For example, the first and second members 53L, 53R may be moved by the driving force of a motor or the like.

[0046] Fig. 6 is a front view showing the state in which the pusher has pushed down the unwanted resin C. As shown in Fig. 6, the pusher 54 can push down the unwanted resin C after the receiving member 53 opens the space 51C sandwiched between the pair of degate pallets 51L, 51R, which is the entrance to the recovery path 50.

[0047] The unnecessary resin C that has fallen into the recovery path 50 is collected in a waste box 55. The waste box 55 can store the unnecessary resin C. The waste box 55 is disposed, for example, directly below the pusher 54. The receiving member 53 may be provided with an inclined surface that allows the unnecessary resin C to slide down, and the waste box 55 may be disposed away from directly below the pusher 54.

[0048] 7 is a flowchart illustrating a degating method using the degating device 5 of one embodiment of the present invention. In this method, first, as shown in FIGS. 1 and 2, the pallet 51 moves to a standby position facing the guide rails 70, and the unloader 72 places the sealed products W' on the pair of degate pallets 51L, 51R (step S1).

[0049] 4, the sealed product W' is sandwiched between a pair of degate pallets 51L, 51R and a pair of degate hands 52L, 52R to restrain it (step S2). The degate hands 52L, 52R are lowered together with the degate pallets 51L, 51R, and the underside of part of the sealed product W' is pressed against the upper end surface of the support plate 531 of the receiving member 53, thereby separating the unnecessary resin C from the sealed product W' by tearing it off (step S3). For example, with the package P of the sealed product W' restrained, the unnecessary resin C is pressed against the receiving member 53 and torn off.

[0050] 5, the receiving member 53 is retracted from the space 51C between the pair of degate pallets 51L and 51R to open the entrance of the recovery path 50 (step S4). Finally, the unnecessary resin C is dropped into a waste box 55 by being pushed downward with a pusher 54 (step S5).

[0051] 5, the unwanted resin C may be formed to be larger than the space 51C sandwiched between the pair of degate pallets 51L, 51R, which is the entrance to the recovery path 50, in the left-right direction when the pair of degate pallets 51L, 51R are arranged. When pushed by the pusher 54, the unwanted resin C, which is made of a silicone-based resin or the like, is bent and deformed to pass through the entrance to the recovery path 50. If the pusher 54 is not used, the unwanted resin C may be temporarily lifted by a suction pad and tilted so that it is smaller than the entrance to the recovery path 50 in a plan view, before being dropped into the recovery path 50.

[0052] According to the degating device 5 of this embodiment configured as described above and the degating method including the degating device 5, the unwanted resin C can be dropped from the entrance of the recovery path 50 that is opened by retracting the receiving member 53, so that the unwanted resin C can be stably removed. Because the unwanted resin can be stably removed even when a soft liquid resin material is used, this method is suitable for the resin sealing device 1 that seals the workpiece W with a liquid resin material.

[0053] The above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangement, materials, conditions, shapes, sizes, etc., are not limited to those illustrated and can be modified as appropriate. Furthermore, configurations shown in different embodiments can be partially substituted or combined with each other. [Explanation of symbols]

[0054] 1...resin sealing device, 2...work supply device, 3...resin supply device, 4...press device, 5...degate device, 6...work storage device, 7...conveyor device, 31...syringe, 32...tube, 33...supply port, 40...mold, 43...pot, 50...recovery path, 51...pallet, 51L, 51R...degate pallet, 51C...space sandwiched between a pair of degate pallets, 52...degate head, 52L, 52R...degate hand, 53...receiving member, 53L...first member, 53R...second member, 54...pusher, 55...disposal box, 56...air blow, 70...guide rail, 71...loader, 72...unloader, 512...roller, 531...support plate, 532...cam, 533...spring, C...unwanted resin, P...package, W...work, W'...sealed product.

Claims

1. a pair of degate pallets on which resin-sealed products are placed; a pair of degate hands arranged above the pair of degate pallets and movable up and down together with the pair of degate pallets; a receiving member that separates unnecessary resin from the sealed product by pressing the receiving member against a bottom surface of a part of the sealed product between the pair of degate pallets and the pair of degate hands while the sealed product is sandwiched between the pair of degate pallets and the pair of degate hands, The receiving member is configured to be retractable from between the pair of degate pallets so as to open an entrance of a recovery path through which the unnecessary resin can fall. Degate device.

2. The receiving member is configured to be separable into a first member and a second member, when the unnecessary resin is separated from the sealed product, the first member and the second member approach each other below the unnecessary resin, After separating the unnecessary resin, the first member and the second member move away from each other below the unnecessary resin, and a space between the first member and the second member becomes the recovery path.

2. The degating device of claim 1.

3. The receiving member is driven by a cam mechanism that converts vertical movement into horizontal movement, and moves horizontally to open the entrance.

3. A degating device according to claim 1 or 2.

4. The apparatus further includes a pusher that pushes the unnecessary resin downward after the receiving member opens the inlet.

3. A degating device according to claim 1 or 2.

5. a waste box capable of storing the unnecessary resin is disposed directly below the pusher; 5. The degating device of claim 4.

6. The unnecessary resin is a silicone-based resin formed to be larger than the inlet in the direction in which the pair of degate pallets are arranged, and is deflected and deformed by being pushed by the pusher to pass through the inlet.

5. The degating device of claim 4.

7. In addition to the degating device according to claim 1 or 2, Further provided with a resin supply device capable of supplying a liquid resin material, Resin sealing equipment.

8. placing the resin-sealed product on a pair of degate pallets; restraining the sealed product by sandwiching it between the pair of degate pallets and the pair of degate hands; separating the unnecessary resin from the sealed product by pressing a part of the sealed product against an upper surface of a receiving member from between the pair of degate pallets; The receiving member is retracted from between the pair of degate pallets to open an entrance of a recovery path through which the unnecessary resin can fall; and dropping the waste resin into the inlet. Degate method.

9. Dropping the waste resin into the inlet includes poking the waste resin downward to cause it to bend and deform.

9. The method of degating according to claim 8.

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