Processing device and manufacturing method of processed product

Abstract

To provide a processing apparatus and a method for manufacturing a processed product, which simplifies a configuration and prevents scattering of working liquid while reducing footprint.SOLUTION: A processing apparatus includes processing tables 2A and 2B that hold a sealed substrate W, a first holding mechanism 3 that holds the sealed substrate to transport the sealed substrate to the processing tables, a processing mechanism, a transfer table onto which a plurality of products are transferred, a second holding mechanism that transports the plurality of products to the transfer table, a transfer movement mechanism having a common transfer shaft 71 for moving the first holding mechanism and the second holding mechanism, a processing movement mechanism for moving the processing mechanism, a working liquid supply mechanism for jetting work liquid, and a working liquid scattering prevention mechanism for preventing scattering of the working liquid.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a processing device and a method for manufacturing a processed product. [Background technology]

[0002] Conventionally, as shown in Patent Document 1, a cutting system has been considered in which a strip picker moves in the X-axis direction to transfer a semiconductor strip from an on-load device to a chuck table of a cutting device, the chuck table picks up the semiconductor strip and moves to the rear of the system in the Y-axis direction, and then the semiconductor strip is cut into semiconductor packages by a spindle. Also, the chuck table is configured to be moved in the Y-axis direction using a ball screw (ball screw mechanism).

[0003] However, in the above-mentioned cutting system, because cutting is performed by moving the chuck table using a ball screw, a bellows member is required to protect the ball screw from processing water and processing debris, and multiple plate members are required to be mounted on the bellows member to further protect the bellows member, resulting in a complex device configuration.

[0004] Furthermore, in the above cutting system, the semiconductor strip is not only transported in the X-axis direction, but also transported to the rear of the system in the Y-axis direction to be cut, resulting in a large footprint of the device.

[0005] On the other hand, as shown in Patent Document 2, a processing device has been devised in which a cutting means is processed and fed in the X-axis direction by a processing feed means, and a positionally fixed chuck table is notched and fed in the Z-axis direction by a cutting feed means, thereby performing cutting processing on a workpiece held on a chuck table. In this processing device, waterproofing means with a horizontally arranged bellows structure around the chuck table is not required to protect against cutting water that accompanies the processing feed.

[0006] However, although this processing device eliminates the need for a waterproofing means such as a horizontally arranged bellows structure around the chuck table, cutting water may splash onto surrounding components during cutting, causing problems. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Special Publication No. 2007-536727 [Patent Document 2] Japanese Patent Application Laid-Open No. 2008-140981 Summary of the Invention [Problem to be solved by the invention]

[0008] The present invention has been made to solve the above problems, and its main objective is to simplify the device configuration, reduce the footprint, and prevent the machining fluid from splashing. [Means for solving the problem]

[0009] That is, the processing apparatus of the present invention is characterized by comprising a processing table for holding a processing object, a first holding mechanism for holding the processing object in order to transport it to the processing table, a processing mechanism for processing the processing object held on the processing table, a transfer table to which the processing object is transferred after processing, a second holding mechanism for holding the processing object after processing in order to transport it from the processing table to the transfer table, a transport moving mechanism that extends along the arrangement direction of the processing table and the transfer table and has a common transfer axis for moving the first holding mechanism and the second holding mechanism, a processing moving mechanism that moves the processing mechanism in a first direction along the transfer axis in a horizontal plane and a second direction perpendicular to the first direction, a processing liquid supply mechanism that moves together with the processing mechanism by the processing moving mechanism and injects processing liquid onto the processing mechanism from the front side in the processing feed direction, and a processing liquid splash prevention mechanism that is provided on the rear side of the processing mechanism in the processing feed direction, covers the upper part from a position below the top surface of the processing table, and prevents the processing liquid from splashing. [Effects of the Invention]

[0010] According to the present invention configured in this manner, it is possible to simplify the device configuration, reduce the footprint, and prevent the machining fluid from splashing. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a diagram schematically illustrating a configuration of a cutting device according to an embodiment of the present invention. [Figure 2] FIG. 2 is a perspective view schematically showing a cutting table and its peripheral structure in the embodiment. [Figure 3] 3 is a view (plan view) seen from the Z direction, which schematically shows the configuration of the cutting table and its peripheral structure in this embodiment. FIG. [Figure 4] 4 is a view (front view) seen from the Y direction, schematically showing the configuration of the cutting table and its peripheral structure in this embodiment. FIG. [Figure 5]10 is a diagram (front view) seen from the Y direction, schematically showing the configuration of the first holding mechanism and the transport moving mechanism of the embodiment. FIG. [Figure 6] 10 is a diagram (side view) seen from the X direction, schematically showing the configuration of the first holding mechanism and the transport moving mechanism of the embodiment. FIG. [Figure 7] FIG. 2 is a cross-sectional view schematically showing the configuration of the rack and pinion mechanism of the embodiment. [Figure 8] 10 is a diagram (front view) seen from the Y direction, schematically showing the configuration of the second holding mechanism and the transport moving mechanism of the embodiment. FIG. [Figure 9] 4 is a cross-sectional view seen from the X direction, schematically showing the configuration of a moving mechanism for processing and a cover member of the embodiment. FIG. [Figure 10] 4 is a cross-sectional view seen from the Y direction, schematically showing the configuration of a moving mechanism for machining, a cover member, and a cutting water splash prevention mechanism of the embodiment. FIG. [Figure 11] 4 is a cross-sectional view seen from the Y direction, schematically showing the configuration of a moving mechanism for machining, a cover member, and a cutting water splash prevention mechanism of the embodiment. FIG. [Figure 12] 5A and 5B are schematic diagrams showing a shutter member in the cutting water splash prevention mechanism of the embodiment in (a) a raised position and (b) a lowered position. [Figure 13] 10A and 10B are schematic diagrams illustrating the operation of the cutting water splash prevention mechanism of the embodiment. [Figure 14] 10A and 10B are schematic diagrams illustrating the operation of the cutting water splash prevention mechanism of the embodiment. [Figure 15] 5A to 5C are schematic diagrams illustrating the operation of the cutting device of the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] The present invention will now be described in more detail with reference to examples, although the present invention is not limited to the following description.

[0013] As described above, the processing apparatus of the present invention is characterized by comprising a processing table for holding a processing object, a first holding mechanism for holding the processing object in order to transport it to the processing table, a processing mechanism for processing the processing object held on the processing table, a transfer table to which the processing object is transferred after processing, a second holding mechanism for holding the processing object after processing in order to transport it from the processing table to the transfer table, a transport moving mechanism that extends along the arrangement direction of the processing table and the transfer table and has a common transfer axis for moving the first holding mechanism and the second holding mechanism, a processing moving mechanism that moves the processing mechanism in a first direction along the transfer axis in a horizontal plane and a second direction perpendicular to the first direction, a processing liquid supply mechanism that moves together with the processing mechanism by the processing moving mechanism and injects processing liquid onto the processing mechanism from the front side in the processing feed direction, and a processing liquid splash prevention mechanism that is provided on the rear side of the processing mechanism in the processing feed direction, covers the upper part from a position below the top surface of the processing table, and prevents the processing liquid from splashing. This machining apparatus is configured to move the first and second holding mechanisms using a common transfer shaft extending along the arrangement direction of the machining table and the transfer table, and the machining movement mechanism moves the machining mechanisms in a first direction along the transfer shaft and a second direction perpendicular to the first direction on a horizontal plane. This allows machining of the workpiece without moving the machining table in the first and second directions. Therefore, the machining table is not moved by a ball screw mechanism, eliminating the need for a bellows member for protecting the ball screw mechanism and a cover member for protecting the bellows member. As a result, the configuration of the machining apparatus can be simplified. Furthermore, because the machining table does not move in the first and second directions on a horizontal plane, the movement space of the machining table and the surrounding wasted space can be reduced, thereby reducing the footprint of the machining apparatus. In particular, in the present invention, in a configuration in which machining fluid is sprayed onto the machining mechanism from the front side in the machining feed direction, a machining fluid splash prevention mechanism is provided on the rear side of the machining mechanism in the machining feed direction, covering the area above from a position below the top surface of the machining table, thereby preventing the machining fluid from splashing.

[0014] In order to prevent the splashing of processing fluid while following the movement of the processing mechanism by the processing movement mechanism, it is desirable that the processing fluid splash prevention mechanism have a bellows member that expands and contracts in accordance with the movement of the processing mechanism and covers the upper and sides perpendicular to the processing feed direction, and a shutter member to which the rear end of the bellows member in the processing feed direction is connected and covers the rear in the processing feed direction. If the shutter member moves while the processing mechanism is processing the workpiece, it may not be possible to reliably prevent the processing liquid from splashing. To solve this problem, it is desirable that the processing device have a fixing part that fixes the shutter member while the processing mechanism is processing the workpiece.

[0015] In order to increase the processing capacity of a single processing apparatus for processing objects, it is desirable that the processing apparatus of the present invention be provided with a plurality of the processing tables. Here, it is desirable that the fixing portion is provided corresponding to each of the plurality of processing tables. With this configuration, the bellows member can be made to have a length corresponding to one processing table, and the dimensions of the bellows member in its contracted state can be reduced. Furthermore, a shutter member can be fixed according to each processing table, and one processing table can be covered by the bellows member, which can increase processing capacity by allowing workpieces to be loaded onto a processing table that is not being processed and processed workpieces to be unloaded from the processing table.

[0016] In order to move the shutter member to a plurality of fixed portions corresponding to a plurality of processing tables, it is desirable that the processing movement mechanism moves the shutter member to each of the plurality of fixed portions. With this configuration, there is no need to provide a separate moving mechanism for moving the shutter member, and the configuration for moving the shutter member can be simplified.

[0017] Since the lower end of the shutter member is located at a position lower than the upper surface of the processing table, it is necessary to move the shutter member without interfering with the processing table. Therefore, it is desirable that the shutter member be movable between an elevated position where its lower end is located above the upper surface of the processing table and a lowered position where its lower end is located below the upper surface of the processing table, and be fixed by the fixing portion in the lowered position.

[0018] The machining movement mechanism is a so-called gantry mechanism. Specifically, the machining movement mechanism includes an X-direction movement unit that linearly moves the machining mechanism in the X-direction, which is the first direction, and a Y-direction movement unit that linearly moves the machining mechanism in the Y-direction, which is the second direction, and the X-direction movement unit preferably includes a pair of X-direction guide rails that are provided along the X-direction across the machining table, and a support that moves along the pair of X-direction guide rails and supports the machining mechanism via the Y-direction movement unit. In this configuration, a common transfer shaft is disposed above the support so as to cross the support, and the common transfer shaft and the support are in a mutually intersecting positional relationship. In this way, since a pair of X-direction guide rails are provided along the X direction with the machining table in between, the pitch (spacing) of the pair of X-direction guide rails can be increased. As a result, the effect of vertical positional deviation between the X-direction guide rails on machining can be reduced. In other words, deviation in the orthogonality between the machining mechanism (e.g., a rotary tool such as a blade) and the machining table can be reduced, improving machining accuracy. Also, X-direction guide rails with lower specifications than conventional ones can be used.

[0019] In the above-described moving machining mechanism, it is desirable that the direction facing one side along the X direction is the machining feed direction, that the machining mechanism and the machining-liquid supply mechanism are provided on one side of the support along the X direction, and that the machining-liquid scattering prevention mechanism is provided on the other side of the support along the X direction. With this configuration, it is possible to prevent the machining liquid that has passed under the support from scattering on the other side of the support along the X direction.

[0020] In order to prevent the machining fluid from splashing on one side of the support in the X direction, it is desirable that a cover member that houses the machining mechanism and the machining fluid supply mechanism be provided on one side of the support in the X direction.

[0021] Another aspect of the present invention is a method for manufacturing a processed product using the above processing device.

[0022] <One embodiment of the present invention> An embodiment of a processing apparatus according to the present invention will be described below with reference to the drawings. Note that, for ease of understanding, all of the drawings shown below are drawn in a schematic manner with appropriate omissions or exaggerations. Identical components are designated by the same reference numerals, and their description will be omitted where appropriate.

[0023] <Overall configuration of the processing equipment> The processing apparatus 100 of this embodiment is a cutting apparatus that separates a sealed substrate W, which is an object to be processed, into a plurality of products P by cutting the sealed substrate W.

[0024] Here, the encapsulated substrate W is a substrate to which electronic elements such as semiconductor chips, resistor elements, and capacitor elements are connected, and which is molded with resin so as to encapsulate at least the electronic elements. Examples of substrates that constitute the encapsulated substrate W include lead frames and printed wiring boards, as well as semiconductor substrates (including semiconductor wafers such as silicon wafers), metal substrates, ceramic substrates, glass substrates, and resin substrates. Furthermore, the substrates that constitute the encapsulated substrate W may or may not be wired.

[0025] In addition, one surface of the sealed substrate W and the product P in this embodiment is a mounting surface on which mounting will be performed later. In the description of this embodiment, the surface on which mounting will be performed later is referred to as the "mounting surface," and the surface opposite thereto is referred to as the "opposite surface."

[0026] Specifically, as shown in FIG. 1, the cutting device 100 includes two cutting tables (processing tables) 2A and 2B that hold the sealed substrate W, a first holding mechanism 3 that holds the sealed substrate W in order to transport the sealed substrate W to the cutting tables 2A and 2B, a cutting mechanism (processing mechanism) 4 that cuts the sealed substrate W held on the cutting tables 2A and 2B, a transfer table 5 to which multiple products P are transferred, a second holding mechanism 6 that holds the multiple products P in order to transport the multiple products P from the cutting tables 2A and 2B to the transfer table 5, a transport moving mechanism 7 having a common transfer axis 71 for moving the first holding mechanism 3 and the second holding mechanism 6, and a cutting moving mechanism (processing moving mechanism) 8 that moves the cutting mechanism 4 relative to the sealed substrate W held on the cutting tables 2A and 2B. The first holding mechanism 3 and the transport moving mechanism 7 constitute a transport mechanism (loader) that transports the sealed substrate W, and the second holding mechanism 6 and the transport moving mechanism 7 constitute a transport mechanism (unloader) that transports multiple products P.

[0027] In the following description, directions perpendicular to each other in a plane (horizontal plane) along the upper surfaces of the cutting tables 2A, 2B are referred to as the X direction, which is a first direction, and the Y direction, which is a second direction, respectively, and the vertical direction perpendicular to the X direction and the Y direction is referred to as the Z direction. Specifically, the left-right direction in FIG. 1 is referred to as the X direction, and the up-down direction is referred to as the Y direction. As will be described later, the X direction is the movement direction of the support 812, and is also the direction perpendicular to the longitudinal direction (extension direction of the beam) of the beam part spanning the pair of legs of the gate-shaped support 812 (see FIGS. 2 and 3).

[0028] <Cutting tables 2A and 2B> The two cutting tables 2A, 2B are fixed in the X, Y, and Z directions. The cutting table 2A can be rotated in the θ direction by a rotation mechanism 9A provided below the cutting table 2A. The cutting table 2B can be rotated in the θ direction by a rotation mechanism 9B provided below the cutting table 2B.

[0029] These two cutting tables 2A, 2B are provided on a horizontal plane along the X direction. Specifically, the two cutting tables 2A, 2B are arranged so that their upper surfaces are located on the same horizontal plane (at the same height in the Z direction) (see FIG. 4), and so that the centers of their upper surfaces (specifically, the centers of rotation by the rotation mechanisms 9A, 9B) are located on the same straight line extending in the X direction (see FIGS. 2 and 3).

[0030] The two cutting tables 2A and 2B are used to suction and hold the sealed substrate W, and as shown in Fig. 1, two vacuum pumps 10A and 10B for suction and holding are arranged corresponding to the two cutting tables 2A and 2B. Each of the vacuum pumps 10A and 10B is, for example, a water-sealed vacuum pump.

[0031] Here, because the cutting tables 2A, 2B are fixed in the X, Y, and Z directions, the piping (not shown) connecting the vacuum pumps 10A, 10B to the cutting tables 2A, 2B can be shortened, reducing pressure loss in the piping and preventing a decrease in suction force. As a result, even extremely small packages, for example, 1 mm square or less, can be reliably suctioned to the cutting tables 2A, 2B. In addition, because a decrease in suction force due to pressure loss in the piping can be prevented, the capacity of the vacuum pumps 10A, 10B can be reduced, leading to size reduction and cost reduction.

[0032] <First holding mechanism 3> 1, the first holding mechanism 3 holds the sealed substrate W in order to transport the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B. As shown in FIGS. 5 and 6, the first holding mechanism 3 has a suction head 31 provided with a plurality of suction portions 311 for suction-holding the sealed substrate W, and a vacuum pump (not shown) connected to the suction portions 311 of the suction head 31. The suction head 31 is moved to a desired position by a transport moving mechanism 7, which will be described later, or the like, thereby transporting the sealed substrate W from the substrate supply mechanism 11 to the cutting tables 2A and 2B.

[0033] 1, the substrate supply mechanism 11 has a substrate accommodation unit 111 in which a plurality of sealed substrates W are accommodated from outside, and a substrate supply unit 112 that moves the sealed substrate W accommodated in the substrate accommodation unit 111 to a holding position RP where the sealed substrate W is held by suction by the first holding mechanism 3. This holding position RP is set so as to be aligned with the two cutting tables 2A, 2B in the X direction. The substrate supply mechanism 11 may also have a heating unit 113 that heats the sealed substrate W to be suctioned by the first holding mechanism 3 to make it flexible and facilitate suction.

[0034] <Cutting mechanism 4> As shown in FIGS. 1, 2, and 3, the cutting mechanism 4, which is a processing mechanism, has two rotary tools 40 each consisting of blades 41A and 41B and two spindles 42A and 42B. The two spindles 42A and 42B are arranged so that their rotation axes are aligned along the Y direction, and the blades 41A and 41B attached thereto are disposed so as to face each other (see FIG. 3). The blade 41A of the spindle 42A and the blade 41B of the spindle 42B rotate in a plane including the X and Z directions to cut the sealed substrate W held on each cutting table 2A and 2B. As shown in FIG. 4, the cutting device 100 of this embodiment is provided with a cutting water supply mechanism (working fluid supply mechanism) 12 that sprays cutting water, which is a working fluid, to suppress frictional heat generated by the blades 41A and 41B. The cutting water supply mechanism 12 will be described later.

[0035] <Transfer Table 5> 1, the transfer table 5 in this embodiment is a table onto which multiple products P inspected by the inspection unit 13 (described later) are transferred. This transfer table 5 is a so-called index table on which multiple products P are temporarily placed before being sorted into various trays 21. The transfer table 5 is arranged in a row along the X direction on a horizontal plane together with the two cutting tables 2A and 2B. The multiple products P placed on the transfer table 5 are sorted into various trays 21 by a sorting mechanism 20 according to the inspection results (good product, defective product, etc.) by the inspection unit 13.

[0036] The various trays 21 are transported to desired positions by a tray transport mechanism 22 that moves along a transfer shaft 71, and the products P to be sorted by the sorting mechanism 20 are placed on the trays 21. After sorting, the various trays 21 are stored in the tray storage section 23 by the tray transport mechanism 22.

[0037] <Inspection Department 13> As shown in FIG. 1, the inspection unit 13 is provided between the cutting tables 2A, 2B and the transfer table 5, and inspects a plurality of products P held by the second holding mechanism 6. The inspection unit 13 of this embodiment has a first inspection unit 131 that inspects the opposite side of the product P, and a second inspection unit 132 that inspects the mounting surface of the product P. The first inspection unit 131 is an imaging camera having an optical system for inspecting the opposite side, and the second inspection unit 132 is an imaging camera having an optical system for inspecting the mounting surface. The first inspection unit 131 and the second inspection unit 132 may be a common unit.

[0038] Also, in order to enable the inspection unit 13 to inspect both sides of the multiple products P, an inversion mechanism 14 is provided that inverts the multiple products P (see FIG. 1). This inversion mechanism 14 has a holding table 141 that holds the multiple products P, and an inversion unit 142 such as a motor that inverts the holding table 141 so that the front and back are reversed.

[0039] When the second holding mechanism 6 holds the multiple products P from the processing tables 2A, 2B, the opposite sides of the products P face downward. In this state, while the multiple products P are being transported from the processing tables 2A, 2B to the inversion mechanism 14, the first inspection unit 131 inspects the opposite sides of the products P. Then, the multiple products P held by the second holding mechanism 6 are inverted by the inversion mechanism 14, which then moves to the position of the transfer table 5. During this movement, the second inspection unit 132 inspects the mounting surfaces of the products P facing downward. Then, the products P are delivered to the transfer table 5.

[0040] <Second holding mechanism 6> 1, the second holding mechanism 6 holds the plurality of products P in order to transport the plurality of products P from the cutting tables 2A, 2B to the reversing mechanism 14. As shown in FIG. 8, the second holding mechanism 6 has a suction head 61 provided with a plurality of suction portions 611 for suction-holding the plurality of products P, and a vacuum pump (not shown) connected to the suction portions 611 of the suction head 61. The suction head 61 is moved to a desired position by a transfer moving mechanism 7 (described later) or the like, thereby transporting the plurality of products P from the cutting tables 2A, 2B to the holding table 141.

[0041] <Transportation moving mechanism 7> As shown in FIG. 1, the transport moving mechanism 7 moves the first holding mechanism 3 at least between the substrate supply mechanism 11 and the cutting tables 2A, 2B, and moves the second holding mechanism 6 at least between the cutting tables 2A, 2B and the holding table 141.

[0042] As shown in FIG. 1, the transport moving mechanism 7 extends in a straight line along the arrangement direction (X direction) of the two cutting tables 2A, 2B and the transfer table 5, and has a common transfer axis 71 for moving the first holding mechanism 3 and the second holding mechanism 6.

[0043] The transfer shaft 71 is provided within a range that allows the first holding mechanism 3 to move above the substrate supply unit 112 of the substrate supply mechanism 11 and allows the second holding mechanism 6 to move above the transfer table 5 (see FIG. 1). The first holding mechanism 3, the second holding mechanism 6, the cutting tables 2A and 2B, and the transfer table 5 are provided on the same side (near side) of the transfer shaft 71 in a plan view. In addition, the inspection unit 13, the reversing mechanism 14, the various trays 21, the tray transport mechanism 22, the tray storage unit 23, the first cleaning mechanism 18 and the second cleaning mechanism 19 (described later), and the collection container 172 are also provided on the same side (near side) of the transfer shaft 71.

[0044] Furthermore, as shown in Figures 5, 6 and 8, the transport movement mechanism 7 has a main movement mechanism 72 that moves the first holding mechanism 3 and the second holding mechanism 6 in the X direction along the transfer shaft 71, an elevation movement mechanism 73 that moves the first holding mechanism 3 and the second holding mechanism 6 up and down in the Z direction relative to the transfer shaft 71, and a horizontal movement mechanism 74 that moves the first holding mechanism 3 and the second holding mechanism 6 horizontally in the Y direction relative to the transfer shaft 71.

[0045] As shown in Figures 5 to 8, the main moving mechanism 72 is provided on the transfer shaft 71 and has a common guide rail 721 that guides the first holding mechanism 3 and the second holding mechanism 6, and a rack and pinion mechanism 722 that moves the first holding mechanism 3 and the second holding mechanism 6 along the guide rail 721.

[0046] The guide rail 721 extends in a straight line in the X direction along the transfer shaft 71, and, like the transfer shaft 71, is provided within a range that allows the first holding mechanism 3 to move above the substrate supply unit 112 of the substrate supply mechanism 11 and the second holding mechanism 6 to move above the transfer table 5. A slide member 723 is slidably provided on this guide rail 721, and on which the first holding mechanism 3 and the second holding mechanism 6 are provided via a lifting / lowering mechanism 73 and a horizontal movement mechanism 74. Here, the guide rail 721 is common to the first holding mechanism 3 and the second holding mechanism 6, but the lifting / lowering mechanism 73, the horizontal movement mechanism 74, and the slide member 723 are provided individually for each of the first holding mechanism 3 and the second holding mechanism 6.

[0047] The rack-and-pinion mechanism 722 has a cam rack 722a common to the first holding mechanism 3 and the second holding mechanism 6, and a pinion gear 722b provided in each of the first holding mechanism 3 and the second holding mechanism 6 and rotated by an actuator (not shown). The cam rack 722a is provided on the common transfer shaft 71, and can be adjusted to various lengths by connecting multiple cam rack elements. The pinion gear 722b is provided on the slide member 723 and is a so-called roller pinion. As shown in FIG. 7, the pinion gear 722b has a pair of roller bodies 722b1 that rotate with the rotation shaft of the motor, and multiple roller pins 722b2 that are provided circumferentially at equal intervals between the pair of roller bodies 722b1 and are rotatable relative to the roller bodies 722b1. The rack and pinion mechanism 722 of this embodiment uses the above-mentioned roller pinion, so that two or more roller pins 722b2 come into contact with the cam rack 722a, no backlash occurs in the forward or reverse direction, and the positioning accuracy is improved when the first holding mechanism 3 and the second holding mechanism 6 are moved in the X direction.

[0048] As shown in FIGS. 5 and 8, the lifting and moving mechanism 73 is provided corresponding to each of the first holding mechanism 3 and the second holding mechanism 6. As shown in FIGS. 5 and 6, the lifting and moving mechanism 73 of the first holding mechanism 3 is provided between the transfer shaft 71 (specifically, the main moving mechanism 72) and the first holding mechanism 3, and includes a Z-direction guide rail 73a provided along the Z direction and an actuator unit 73b that moves the first holding mechanism 3 along the Z-direction guide rail 73a. The actuator unit 73b may be, for example, a ball screw mechanism, an air cylinder, or a linear motor. The configuration of the lifting and moving mechanism 73 of the second holding mechanism 6 is similar to that of the lifting and moving mechanism 73 of the first holding mechanism 3, as shown in FIG. 8.

[0049] 5 and 8, horizontal movement mechanisms 74 are provided corresponding to the first holding mechanism 3 and the second holding mechanism 6, respectively. As shown in FIGS. 5 and 6, the horizontal movement mechanism 74 of the first holding mechanism 3 is provided between the transfer shaft 71 (specifically, the elevation movement mechanism 73) and the first holding mechanism 3, and includes a Y-direction guide rail 74a provided along the Y direction, an elastic body 74b that applies a force to one side of the Y-direction guide rail 74a to the first holding mechanism 3, and a cam mechanism 74c that moves the first holding mechanism 3 to the other side of the Y-direction guide rail 74a. Here, the cam mechanism 74c uses an eccentric cam, and the amount of movement of the first holding mechanism 3 in the Y direction can be adjusted by rotating the eccentric cam with an actuator such as a motor.

[0050] 8, the horizontal movement mechanism 74 of the second holding mechanism 6 is configured similarly to the lifting movement mechanism 73 of the first holding mechanism 3. The second holding mechanism 6 may not be provided with the horizontal movement mechanism 74, or neither the first holding mechanism 3 nor the second holding mechanism 6 may be provided with the horizontal movement mechanism 74. Furthermore, like the lifting movement mechanism 73, the horizontal movement mechanism 74 may not use the cam mechanism 74c, but may instead use, for example, a ball screw mechanism, an air cylinder, or a linear motor.

[0051] <Cutting movement mechanism 8 (processing movement mechanism)> The cutting movement mechanism 8 linearly moves each of the two spindles 42A, 42B in the X, Y, and Z directions.

[0052] Specifically, as shown in Figures 2 to 4 and 9 to 11, the cutting movement mechanism 8 includes an X-direction movement unit 81 that moves the spindles 32A and 32B linearly in the X direction, a Y-direction movement unit 82 that moves the spindles 32A and 32B linearly in the Y direction, and a Z-direction movement unit 83 that moves the spindles 32A and 32B linearly in the Z direction. In this embodiment, the processing feed direction SD of the cutting mechanism 4 by the cutting movement mechanism 8 is a direction facing one side along the X direction (a direction facing from the other side to one side along the X direction (see Figure 3, etc.).

[0053] The X-direction moving unit 81 is common to the two cutting tables 2A, 2B, and as shown in particular in FIGS. 2 and 3 , has a pair of X-direction guide rails 811 arranged along the X direction with the two cutting tables 2A, 2B sandwiched between them, and a support 812 that moves along the pair of X-direction guide rails 811 and supports the spindles 32A, 32B via the Y-direction moving unit 82 and the Z-direction moving unit 83. The pair of X-direction guide rails 811 are provided on the sides of the two cutting tables 2A, 2B arranged along the X direction. The support 812 is, for example, gate-shaped and has a shape that extends in the Y direction. Specifically, the support 812 has a pair of legs extending upward from the pair of X-direction guide rails 811 and a beam portion spanning the pair of legs, with the beam portion extending in the Y direction. In this support body 812, the spindles 32A and 32B of the cutting mechanism 4 are provided on one side along the X direction (the side facing the processing feed direction SD).

[0054] The support 812 is moved back and forth linearly along the X direction on a pair of X-direction guide rails 811 by, for example, a ball screw mechanism 813 extending in the X direction. The ball screw mechanism 813 is driven by a drive source (not shown) such as a servo motor. Alternatively, the support 812 may be configured to move back and forth by another direct acting mechanism such as a linear motor.

[0055] As shown in FIG. 3 , the Y-direction moving unit 82 has a Y-direction guide rail 821 provided on the support 812 along the Y direction, and a Y-direction slider 822 that moves along the Y-direction guide rail 821. The Y-direction moving unit 82 is provided on one side of the support 812 along the X direction (the side facing the processing feed direction SD). The Y-direction slider 822 is driven by, for example, a linear motor 823, and moves linearly back and forth on the Y-direction guide rail 821. In this embodiment, two Y-direction sliders 822 are provided corresponding to the two spindles 32A, 32B. This allows the two spindles 32A, 32B to move in the Y direction independently of each other. Alternatively, the Y-direction slider 822 may be configured to move back and forth using another linear motion mechanism that uses a ball screw mechanism.

[0056] 9 to 11, the Z-direction moving unit 83 has a Z-direction guide rail 831 provided on each Y-direction slider 822 along the Z direction, and a Z-direction slider 832 that moves along the Z-direction guide rail 831 and supports the spindles 32A and 32B. That is, a Z-direction moving unit 83 is provided corresponding to each spindle 32A and 32B. The Z-direction slider 832 is driven by, for example, an eccentric cam mechanism (not shown), and moves back and forth linearly on the Z-direction guide rail 831. Alternatively, the Z-direction slider 832 may be configured to move back and forth by another linear motion mechanism such as a ball screw mechanism.

[0057] 1 and 4, the positional relationship between the moving cutting mechanism 8 and the transfer shaft 71 is such that the transfer shaft 71 is disposed above the moving cutting mechanism 8 and crosses the moving cutting mechanism 8. Specifically, the transfer shaft 71 is disposed above the support 812 and crosses the support 812, and the transfer shaft 71 and the support 812 are in a mutually intersecting positional relationship.

[0058] <Cover member 15> 3, 4, and 9 to 11, the support body 812 in the above-described cutting movement mechanism 8 is provided with a cover member 15 that houses the two spindles 32A, 32B. Note that the cover member 15 is omitted in FIG. 2. This cover member 15 is provided on one side of the support body 812 along the X direction (the side facing the processing feed direction SD), and houses not only the two spindles 32A, 32B of the cutting mechanism 4 but also the jet nozzle 121 of the cutting water supply mechanism 12 so that cutting water jetted from the jet nozzle 121 does not splash around.

[0059] Specifically, as shown in FIGS. 9 to 11, the cover member 15 has an opening 15a on its underside to expose the blades 41A and 41B. An opening 15b is formed on its top surface so as not to interfere with the movement of the spindles 42A and 42B or the cutting movement mechanism 8. The opening 15b on the top surface is closed by a bellows member 16, which expands and contracts as the spindles 42A and 42B move. The cover member 15 and the bellows member 16 cover both sides of the spindles 42A and 42B in the X direction, both sides of the spindles 42A and 42B in the Y direction, and the upper side of the spindles 42A and 42B on one side of the support 812 in the X direction (the side facing the processing feed direction SD), thereby limiting the area into which cutting water sprayed from the spray nozzle 121 splashes. A window 151 is formed in the side wall of the cover member 15 on the front side (opposite the support 812) to allow the interior of the cover member 15 to be viewed (see FIGS. 10 and 11). Furthermore, by exhausting the inside of this cover member 15 with an exhaust mechanism (not shown), the droplets (mist) can be effectively discharged to the outside.

[0060] <Processing waste storage section 17> 1, the cutting device 100 of this embodiment further includes a processing waste storage unit 17 for storing processing waste S such as scraps generated by cutting the sealed substrate W.

[0061] 2 to 4, the processing debris storage section 17 is provided below the cutting tables 2A, 2B, and has a guide chute 171 having an upper opening 171X that surrounds the cutting tables 2A, 2B in a plan view, and a collection container 172 that collects processing debris S guided by the guide chute 171. By providing the processing debris storage section 17 below the cutting tables 2A, 2B, the collection rate of processing debris S can be improved.

[0062] The guide chute 171 guides the machining chips S that have scattered or fallen from the cutting tables 2A, 2B to the collection container 172. In this embodiment, the upper opening 171X of the guide chute 171 is configured to surround the cutting tables 2A, 2B (see FIG. 3), making it less likely that the machining chips S will be missed, and the collection rate of the machining chips S can be further improved. In addition, the guide chute 171 is provided to surround the rotation mechanisms 9A, 9B provided below the cutting tables 2A, 2B (see FIG. 4), and is configured to protect the rotation mechanisms 9A, 9B from the machining chips S and cutting water.

[0063] In this embodiment, the processing waste storage section 17 is common to the two cutting tables 2A and 2B, but it may be provided for each of the cutting tables 2A and 2B.

[0064] The collection containers 172 collect the processing debris S that has passed through the guide chute 171 due to its own weight, and in this embodiment, as shown in FIG. 4 etc., one is provided corresponding to each of the two cutting tables 2A, 2B. The two collection containers 172 are arranged on the front side of the transfer shaft and are configured so that they can be independently removed from the front side of the cutting device 100. This configuration improves the ease of maintenance, such as disposal of the processing debris S. Note that one collection container 172 may be provided under all of the cutting tables, or three or more may be provided, taking into consideration the size of the sealed substrate W, the size and amount of the processing debris S, workability, etc.

[0065] 4 and other figures, the machining chip storage section 17 has a separation section 173 that separates the cutting water from the machining chips. One possible configuration for this separation section 173 is to provide a filter such as a porous plate that allows the cutting water to pass through on the bottom surface of the collection container 172. This separation section 173 makes it possible to collect the machining chips S without the cutting water accumulating in the collection container 172.

[0066] <First cleaning mechanism 18> 1 and 5, the cutting device 100 of the present invention further includes a first cleaning mechanism 18 that cleans the upper surfaces (mounting surfaces) of the multiple products P held on the cutting tables 2A and 2B. This first cleaning mechanism 18 cleans the upper surfaces of the products P using injection nozzles 18a (see FIG. 5) that inject cleaning liquid and / or compressed air onto the upper surfaces of the multiple products P held on the cutting tables 2A and 2B.

[0067] 5, the first cleaning mechanism 18 is configured to be movable along the transfer shaft 71 together with the first holding mechanism 3. Here, the first cleaning mechanism 18 is provided on a slide member 723 that slides on a guide rail 721 provided on the transfer shaft 71. Here, an elevation movement mechanism 181 for moving the first cleaning mechanism 18 up and down in the Z direction is provided between the first cleaning mechanism 18 and the slide member 723. This elevation movement mechanism 181 may be, for example, one that uses a rack and pinion mechanism, one that uses a ball screw mechanism, or one that uses an air cylinder.

[0068] <Second cleaning mechanism 19> 1, the cutting device 100 of the present invention further includes a second cleaning mechanism 19 that cleans the undersides (opposite sides) of the multiple products P held by the second holding mechanism 6. This second cleaning mechanism 19 is provided between the cutting table 2B and the inspection unit 13, and cleans the undersides of the multiple products P held by the second holding mechanism 6 by spraying cleaning liquid and / or compressed air onto the undersides of the multiple products P. In other words, the second cleaning mechanism 19 cleans the undersides of the products P while the second holding mechanism 6 is moving along the transfer shaft 71.

[0069] <Machining fluid supply mechanism 12 (cutting water supply mechanism) and machining fluid splash prevention mechanism 24 (cutting water splash prevention mechanism)> In this embodiment, as described above, the processing feed direction SD of the cutting mechanism 4 is configured to be a direction facing in one direction along the X direction (the direction of movement from top to bottom on the paper in FIG. 3, and the direction of movement from right to left on the paper in FIG. 4).

[0070] As shown in Figures 3, 4, 10 and 11, the cutting device 100 of this embodiment is equipped with a cutting water supply mechanism 12 that moves together with the cutting mechanism 4 by the cutting moving mechanism 8, and a cutting water splash prevention mechanism 24 that prevents cutting water from splashing.

[0071] Here, the cutting mechanism 4 and cutting water supply mechanism 12 are provided on one side of the support body 812 along the X direction (the side facing the processing feed direction SD), and a cutting water splash prevention mechanism 24 is provided on the other side of the support body 812 along the X direction (the side opposite to the processing feed direction SD).

[0072] 10 and 11, the cutting water supply mechanism 12 has a spray nozzle 121 that sprays cutting water onto the blades 41A, 41B of the cutting mechanism 4 from the front side in the processing feed direction SD, and this spray nozzle 121 is supported, for example, by the Z-direction moving part 83. Specifically, the spray nozzle 121 sprays cutting water toward the blades 41A, 41B of the cutting mechanism 4 from the side opposite to the support body 812.

[0073] The cutting water splash prevention mechanism 24 is provided on the rear side of the cutting mechanism 4 in the processing feed direction SD, and has a configuration that covers from a position below the upper surfaces of the cutting tables 2A, 2B upward.

[0074] Specifically, the cutting water splash prevention mechanism 24 has a bellows member 241 that expands and contracts as the cutting mechanism 4 moves, and a shutter member 242 to which the rear end of the bellows member 241 in the processing feed direction SD is connected, as shown in Figures 3, 4, 10 and 11.

[0075] The bellows member 241 covers the upper and side surfaces perpendicular to the machining feed direction SD. Specifically, the bellows member 241 has a pair of side wall portions that cover the side surfaces and an upper wall portion that is continuous with the upper ends of the pair of side wall portions and covers the upper surface. The front end of the bellows member 241 in the machining feed direction SD is connected to the side surface of the support body 812 (the surface opposite to the machining feed direction SD). The shutter member 242 covers the rear side in the machining feed direction SD. The bellows member 241 and the shutter member 242 confine cutting water that passes below the support body 812 (specifically, below the beam portion of the support body 812) and splashes toward the opposite side of the machining feed direction SD relative to the support body 812 within the space surrounded by the bellows member 241 and the shutter member 242. The inside of the guide chute 171 of the machining chip storage unit 17 is evacuated by an exhaust mechanism (not shown), thereby effectively discharging droplets (mist) to the outside.

[0076] 3, 4, 10, and 11, the cutting water splash prevention mechanism 24 has fixing portions 243A and 243B that fix the shutter member 242 to the cutting tables 2A and 2B when the sealed substrate W is cut by the cutting mechanism 4. In this embodiment, since there are two cutting tables 2A and 2B, fixing portions 243A and 243B are provided corresponding to the two cutting tables 2A and 2B, respectively. Specifically, each fixing portion 243A and 243B is provided on the rear side of each cutting table 2A and 2B in the processing feed direction SD. Furthermore, two fixing portions 243A and 243B are provided along the Y direction to fix both ends of the shutter member 242 in the Y direction (see FIG. 3).

[0077] The shutter member 242 is moved by the X-direction moving part 81 of the cutting movement mechanism 8 to the fixing parts 243A and 243B provided corresponding to the two cutting tables 2A and 2B, respectively.

[0078] Here, the lower end of the shutter member 242 is located at a position lower than the upper surfaces of the cutting tables 2A and 2B when the sealed substrate W is cut by the cutting mechanism 4. For this reason, as shown in Figures 10, 11 and 12, the shutter member 242 of this embodiment is configured to be movable between a raised position U (see Figures 10 and 12(a)) where its lower end is located above the upper surfaces of the cutting tables 2A and 2B, and a lowered position D (see Figures 11 and 12(b)) where its lower end is located below the upper surfaces of the cutting tables 2A and 2B. Note that the lower ends of the pair of side wall portions of the bellows member 241 may be arranged to be located at a position lower than the upper surfaces of the cutting tables 2A and 2B.

[0079] 11 and 12(b), the shutter member 242 is fixed by the fixing portions 243A and 243B at the lowered position D. Specifically, the shutter member 242 is fixed at the lowered position D by fitting the first protrusion 242a provided on the side surface of the shutter member 242 into the recesses of the fixing portions 243A and 243B.

[0080] In addition, the shutter member 242 is connected to the rear end of the bellows member 241 so that it can move up and down, and the shutter member 242 moves up and down by an elevation movement mechanism 244 provided on the support body 812, as shown in Figures 3, 4, and 10 to 12.

[0081] 10 to 12, the lifting movement mechanism 244 has a shutter holding portion 244a that holds the shutter member 242, a guide rail 244b that guides the shutter holding portion 244a in the up and down direction (Z direction) relative to the support body 812, and a drive portion 244c such as an air cylinder that moves the shutter holding portion 244a along the guide rail 244b. In this embodiment, the shutter holding portion 244a has a recess that fits into a second protrusion 242b provided on the side surface of the shutter member 242.

[0082] By raising the shutter holding portion 244a by the driving portion 244c, the recess of the shutter holding portion 244a fits into the second protrusion 242b, the shutter holding portion 244a lifts the shutter member 242, and the shutter member 242 moves to the raised position U (see FIGS. 10 and 12(a)). Note that the raised position U is a state in which the shutter holding portion 244a holds the shutter member 242, and the fixation of the shutter member 242 by the fixing portions 243A and 243B is released.

[0083] <Operation of the cutting water splash prevention mechanism 24 during cutting> Next, the operation of the cutting water splash prevention mechanism 24 will be described with reference to FIGS. 10 to 14, assuming that the sealed substrate W is cut by the cutting table 2A on the left side of FIG.

[0084] First, the shutter holding portion 244a of the lifting movement mechanism 244 is raised, and the shutter holding portion 244a is engaged with the second protrusion 242b of the shutter member 242, and the shutter member 242 is raised to the raised position U (see FIGS. 10, 12(a), and 13(a)). Furthermore, the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2A by the transport moving mechanism 7, and the sealed substrate W is placed on the cutting table 2A (see FIG. 13(a)). In this state, the support 812 of the cutting movement mechanism 8 is moved to one side along the X direction, and the shutter member 242 is moved to above the fixing portion 243A corresponding to the left cutting table 2A. In this position, when the shutter holding portion 244a of the elevation movement mechanism 244 is lowered, the shutter member 242 is lowered to the lowered position D and is fitted into and fixed to the fixing portion 243A (see FIGS. 12(b) and 13(b)). Note that when the shutter member 242 is in the lowered position D, the holding of the shutter member 242 by the shutter holding portion 242a is released.

[0085] After the shutter member 242 is fixed by the fixing part 243A, cutting water is sprayed from the spray nozzle 121 of the cutting water supply mechanism 12, and the cutting mechanism 4 is moved in the processing feed direction SD by the cutting movement mechanism 8 to cut the sealed substrate W (see FIGS. 11 and 13(c)). During this cutting operation, as the cutting mechanism 4 and the support body 812 move, the bellows member 241 expands and contracts with the rear end of the bellows member 241 fixed to the shutter member 242. As a result, cutting water that passes under the support body 812 and splashes is blocked by the bellows member 241 and the shutter member 242, preventing the cutting water from splashing onto the cutting table 2B on the right side, etc.

[0086] When cutting of the sealed substrate W is completed, the support 812 of the moving mechanism for cutting 8 is moved to the vicinity of the fixed portion 243A and to a position where the shutter holding portion 244a can fit into the second protrusion 242b of the shutter member 242. In this state, the shutter holding portion 244a of the lifting and lowering mechanism 244 is raised to fit the shutter holding portion 244a into the second protrusion 242b, and the shutter member 242 is moved to the raised position U (see FIGS. 12(a) and 14(d)). This releases the fixation of the shutter member 242 by the fixed portion 243A. Then, the support 812 of the moving mechanism for cutting 8 is moved to a position where it does not interfere with the transport of the multiple products P. In this state, the transport moving mechanism 7 moves the second holding mechanism 6 to the post-cutting cutting table 2A, and the second holding mechanism 6 suction-holds the multiple products P, which are then transported from the cutting table 2A (see Figure 14(e)).

[0087] Thereafter, when cutting the sealed substrate W on the right cutting table 2B, after placing the sealed substrate W on the cutting table 2B (see FIG. 14(f)), the support 812 of the moving mechanism for cutting 8 is moved to the other side along the X direction, and the shutter member 242 is moved to above the fixing part 243B corresponding to the right cutting table 2B. The subsequent operations are the same as those described above.

[0088] <Example of cutting device operation> Next, an example of the operation of the cutting device 100 will be described. Fig. 15 shows the movement path of the first holding mechanism 3 and the movement path of the second holding mechanism 6 in the operation of the cutting device 10. In this embodiment, all operations and controls of the cutting device 100, such as transporting the sealed substrate W, cutting the sealed substrate W, operating the cutting water splash prevention mechanism 24, and inspecting the product P, are performed by the control unit CTL (see Fig. 1).

[0089] The substrate supply unit 112 of the substrate supply mechanism 11 moves the sealed substrate W accommodated in the substrate accommodation unit 111 toward the holding position RP where the sealed substrate W is held by the first holding mechanism 3.

[0090] Next, the transfer movement mechanism 7 moves the first holding mechanism 3 to the holding position RP, and the first holding mechanism 3 sucks and holds the sealed substrate W. Thereafter, the transfer movement mechanism 7 moves the first holding mechanism 3 holding the sealed substrate W to the cutting tables 2A and 2B, and the first holding mechanism 3 releases the sucking and holds, and places the sealed substrate W on the cutting tables 2A and 2B. At this time, the main movement mechanism 72 adjusts the position of the sealed substrate W in the X direction, and the horizontal movement mechanism 74 adjusts the position of the sealed substrate W in the Y direction. Then, the cutting tables 2A and 2B suck and hold the sealed substrate W.

[0091] Here, when the first holding mechanism 3 holding the sealed substrate W is moved to the cutting table 2B, the lifting movement mechanism 73 raises the first holding mechanism 3 to a position where it does not physically interfere with the cutting movement mechanism 8 (support 812). Note that when moving the first holding mechanism 3 holding the sealed substrate W to the cutting table 2B, if the support 812 is retracted from the cutting table 2B to the transfer table 5 side, there is no need to lift and lower the first holding mechanism 3 as described above.

[0092] In this state, the cutting movement mechanism 8 sequentially moves the two spindles 42A, 42B in the X direction and the Y direction, and the cutting tables 2A, 2B rotate, thereby cutting the sealed substrate W into individual pieces in a lattice pattern. When cutting the sealed substrate W into a lattice pattern, the cutting water splash prevention mechanism 24 performs the operation described above in <Operation of the cutting water splash prevention mechanism 24 associated with cutting>.

[0093] After cutting, the transport moving mechanism 7 moves the first cleaning mechanism 18 to clean the upper surfaces (mounting surfaces) of the multiple products P held on the cutting tables 2A and 2B. After this cleaning, the transport moving mechanism 7 retreats the first holding mechanism 3 and the first cleaning mechanism 18 to predetermined positions.

[0094] Next, the transport movement mechanism 7 moves the second holding mechanism 6 to the post-cutting cutting tables 2A, 2B, and the second holding mechanism 6 suction-holds the multiple products P. Thereafter, the transport movement mechanism 7 moves the second holding mechanism 6 holding the multiple products P to the second cleaning mechanism 19. As a result, the second cleaning mechanism 19 cleans the underside (opposite side) of the multiple products P held by the second holding mechanism 6.

[0095] After cleaning, the multiple products P held by the second holding mechanism 6 are inspected on both sides by the inspection unit 13 and the reversing mechanism 14. Thereafter, the transport movement mechanism 7 moves the second holding mechanism 6 to the transfer table 5, and the second holding mechanism 6 releases the suction hold and places the multiple products P on the transfer table 5. The multiple products P placed on the transfer table 5 are sorted by the sorting mechanism 20 into various trays 21 according to the inspection results (good products, defective products, etc.) by the inspection unit 13.

[0096] In double-sided inspection, for example, first, one side of the product P is inspected while it is held by suction using the second holding mechanism 6. Next, the product P is transferred from the second holding mechanism 6 to the holding table 141 of the inversion mechanism 14, and the other side of the product P is inspected while it is held by suction using the inverted holding table 141, thereby enabling double-sided inspection. The product P can then be transported from the inversion table 14 to the transfer table 5 by transferring it from the holding table 141 to the second holding mechanism 6. Alternatively, the holding table 141 may be configured to be movable in the X direction, and at least one of the holding table 141 and the transfer table 5 may be configured to be movable in the Z direction, and the product P may be transported and transferred to the transfer table 5 by moving the holding table 141 above the transfer table 5.

[0097] <Effects of this embodiment> According to the cutting device 100 of this embodiment, the first holding mechanism 3 and the second holding mechanism 6 are moved by a common transfer shaft 71 extending along the arrangement direction of the cutting tables 2A, 2B and the transfer table 5. The cutting mechanism 4 is moved in the X direction along the transfer shaft 71 in a horizontal plane and in the Y direction perpendicular to the X direction by the cutting movement mechanism 8. This allows the sealed substrate W to be processed without moving the cutting tables 2A, 2B in the X direction and the Y direction. Therefore, the cutting tables 2A, 2B are not moved by a ball screw mechanism, and a bellows member for protecting the ball screw mechanism and a cover member for protecting the bellows member are not required. As a result, the configuration of the cutting device 100 can be simplified. Furthermore, the cutting tables 2A, 2B can be configured not to move in the X direction and the Y direction, allowing the footprint of the cutting device 100 to be reduced.

[0098] Furthermore, in this embodiment, in a configuration in which cutting water is sprayed onto the cutting mechanism 4 from the front side in the processing feed direction SD, the cutting fluid splash prevention mechanism 24 is provided on the rear side of the cutting mechanism 4 in the processing feed direction SD, covering the upper side from a position below the upper surfaces of the cutting tables 2A, 2B, so that splashing of cutting water can be prevented. Particularly in this embodiment, in a configuration in which the cutting mechanism 4 and the cutting water supply mechanism 12 are provided on one side in the X direction of the support body 812, the cutting water splash prevention mechanism 24 is provided on the other side in the X direction of the support body 812, so that cutting water that has passed under the support body 812 can be prevented from splashing on the other side in the X direction of the support body 812.

[0099] Furthermore, in this embodiment, cutting water splash prevention mechanism 24 is configured using bellows member 241, and therefore can prevent splashing of cutting water while following the movement of cutting mechanism 4 by cutting movement mechanism 8. Here, shutter member 242 is connected to the rear end of bellows member 241 in the processing feed direction SD, and shutter member 242 is fixed by fixing portions 243A and 243B, so that the space surrounded by bellows member 241 and shutter member 242 can be fixed when processing sealed substrate W, and splashing of cutting water can be reliably prevented.

[0100] Furthermore, since two or more cutting tables 2A, 2B are provided along the X direction and the supports 812 supporting the spindles 42A, 42B are configured to move along the X direction, while a sealed substrate W is being processed on one cutting table 2A, another process such as transportation can be performed on the other cutting table 2B. In this embodiment, fixing portions 243A, 243B for fixing the shutter members are provided for each cutting table 2A, 2B, so the bellows member 241 can be set to a length corresponding to one cutting table 2A, 2B, and the dimensions of the bellows member 241 in its contracted state can be reduced. Furthermore, since the shutter members 242 are fixed according to each cutting table 2A, 2B and one cutting table 2A, 2B is covered with the bellows member 241, processing capacity can be improved, such as by allowing an unprocessed sealed substrate W to be loaded onto the cutting tables 2A, 2B and multiple products P to be unloaded.

[0101] In this embodiment, the pair of X-direction guide rails 811 provided in the X direction are arranged on either side of the cutting tables 2A, 2B, so the pitch between the pair of X-direction guide rails 811 can be increased. As a result, the effect on processing of misalignment in the Z direction between the X-direction guide rails 811 can be reduced. Furthermore, the increased pitch between the pair of guide rails 811 improves the linearity of the X-direction moving unit 81, which in turn reduces the wobble of the cutting edges of the blades 41A, 41B, reducing cutting resistance during cutting and improving processing accuracy. Also, it is possible to use Y-direction guide rails 811 with lower specifications than conventional guide rails.

[0102] In this embodiment, since the two or more cutting tables 2A, 2B do not move in the Y direction during cutting, it is possible to adjust the X-direction parallelism of the movement mechanism 8 (X-direction movement unit 81) for the two or more cutting tables 2A, 2B all at once. That is, when two cutting tables are provided in a conventional device in which the cutting table moves during cutting, it was necessary to adjust the X-direction parallelism of the two cutting tables and then adjust this adjusted X-direction parallelism and the X-direction parallelism of the blades (specifically, two adjustments were required), but in this embodiment, since the two cutting tables 2A, 2B do not move in the X direction during cutting, it is only necessary to adjust the X-direction parallelism of the blades 41A, 41B (specifically, one adjustment is sufficient).

[0103] <Other Modified Embodiments> The present invention is not limited to the above-described embodiment.

[0104] For example, in the above embodiment, a cutting device with a twin cut table system and a twin spindle configuration has been described, but the present invention is not limited to this and may be a cutting device with a single cut table system and a single spindle configuration, or a cutting device with a single cut table system and a twin spindle configuration. Also, a configuration having three or more cutting tables is also possible. Even in this case, the configuration will have three or more fixing units corresponding to the three or more cutting tables.

[0105] Furthermore, the transfer table 5 in the above embodiment is an index table on which the documents are temporarily placed before being sorted onto the various trays 21, but the transfer table 5 may also be the holding table 141 of the reversing mechanism .

[0106] Furthermore, in the above embodiment, the configuration is such that the products are sorted from the transfer table 5 onto the tray 21 (also called "tray storage"), but it may also be such that multiple products P are stored by being attached to an adhesive member having an adhesive surface (also called "ring storage"), or multiple products P are dropped into a storage box and stored in a loose state (also called "bulk storage"), or multiple products P are stored by being inserted into one opening end of a cylindrical container (also called "tube storage").

[0107] Furthermore, in the configuration of the above embodiment, the grooves may be formed without cutting the sealed substrate on the cutting tables 2A and 2B. In this case, for example, the sealed substrate W that has been grooved on the cutting tables 2A and 2B may be returned to the substrate supply unit 112 by the first holding mechanism 3 and the transport moving mechanism 7. Also, the sealed substrate W returned to the substrate supply unit 112 may be accommodated in the substrate accommodation unit 111.

[0108] Furthermore, since the cam rack elements that make up the transfer shaft 71 can be configured by connecting multiple elements, for example, the cutting device (processing device) 100 can be configured as a module that can be separated and connected (detached) between the second cleaning mechanism 19 and the inspection unit 13. In this case, for example, a module that performs a type of inspection different from the inspection performed by the inspection unit 13 can be added between the module on the second cleaning mechanism 19 side and the module on the inspection unit 13 side. Note that, in addition to the configuration exemplified here, the cutting device (processing device) 100 may be configured as a module that can be separated and connected (detached) at any point, and the added module may be a module with various functions other than inspection.

[0109] Furthermore, the processing device of the present invention may be one that performs processing other than cutting, and may be one that performs other mechanical processing such as cutting or grinding.

[0110] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0111] 100...Cutting equipment (processing equipment) W···Sealed substrate (object to be processed) P···Product (processed object) SD... Machining feed direction 2A, 2B... Cutting table (processing table) 3...1st holding mechanism 4...Cutting mechanism (processing mechanism) 5. Transfer table 6...Second holding mechanism 7. Transfer mechanism 71 Common transfer shaft 8...Movement mechanism for cutting (movement mechanism for processing) 81...X direction moving part 811: A pair of X-direction guide rails 812...Support 82 Y-direction moving part 12... Cutting water supply mechanism (processing fluid supply mechanism) 15 Cover member 24... Cutting water scattering prevention mechanism (machining fluid scattering prevention mechanism) 241... Bellows member 242 Shutter member 243A, 243B... Fixed part U···Up position D...Descent position

Claims

1. a processing table for holding an object to be processed; a first holding mechanism that holds the workpiece to transport it to the processing table; a processing mechanism that processes the object held on the processing table; a transfer table onto which the processed object is transferred; a second holding mechanism that holds the processed object in order to transport the processed object from the processing table to the transfer table; a transfer mechanism extending along an arrangement direction of the processing table and the transfer table and having a common transfer shaft for moving the first holding mechanism and the second holding mechanism; a processing movement mechanism that moves the processing mechanism in a first direction along the transfer axis and a second direction perpendicular to the first direction on a horizontal plane; a machining fluid supply mechanism that moves together with the machining mechanism by the machining movement mechanism and injects machining fluid onto the machining mechanism from one side in a machining feed direction; a cover member that houses the machining mechanism and the machining liquid supply mechanism; The processing device is provided with a processing fluid splash prevention mechanism that is provided on the other side of the processing mechanism in the processing feed direction, covers the processing table from a position below the top surface, and prevents the processing fluid from splashing.

2. The machining fluid splash prevention mechanism includes: a bellows member that expands and contracts with the movement of the processing mechanism and covers the upper and side surfaces perpendicular to the processing feed direction; 2. The processing device according to claim 1, further comprising a shutter member connected to a rear end of the bellows member in the processing feed direction and covering the rear in the processing feed direction.

3. 3. The processing apparatus according to claim 2, further comprising a fixing portion that fixes the shutter member to the processing table when the processing mechanism processes the object.

4. The processing table is provided in plurality, The processing apparatus according to claim 3 , wherein the fixing portion is provided corresponding to each of the plurality of processing tables.

5. The processing device according to claim 4 , wherein the processing movement mechanism moves the shutter member to each of the plurality of fixed portions.

6. the shutter member is movable between an elevated position where a lower end portion thereof is positioned above an upper surface of the processing table and a lowered position where the lower end portion thereof is positioned below an upper surface of the processing table, The processing device according to claim 3 , wherein the processing device is fixed in the lowered position by the fixing portion.

7. the processing movement mechanism includes an X-direction movement unit that linearly moves the processing mechanism in the X-direction, which is the first direction, and a Y-direction movement unit that linearly moves the processing mechanism in the Y-direction, which is the second direction, 7. The processing device according to claim 1, wherein the X-direction moving unit includes a pair of X-direction guide rails arranged along the X direction with the processing table sandwiched therebetween, and a support body that moves along the pair of X-direction guide rails and supports the processing mechanism via the Y-direction moving unit.

8. a direction facing one side along the X direction is the processing feed direction, the processing mechanism and the processing liquid supply mechanism are provided on one side of the support along the X direction, The machining apparatus according to claim 7 , wherein the machining fluid splash prevention mechanism is provided on the other side of the support along the X direction.

9. A processing apparatus as described in Claim 8, wherein the cover member is provided on one side of the support along the X direction.

10. A method for manufacturing a processed product, comprising the steps of: manufacturing a processed product using the processing device according to any one of claims 1 to 9;

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