Light-emitting device

Abstract

To provide a technology suitable for high output and high density of a light-emitting element in a light-emitting device having a plurality of light-emitting element groups that can be individually driven.SOLUTION: A light-emitting device has a plurality of light-emitting elements and a plurality of drive wirings for driving the plurality of light-emitting elements. The plurality of light-emitting elements are divided into a plurality of groups each of which includes at least two light-emitting elements. A plurality of drive wirings are provided in correspondence with the plurality of groups. The plurality of drive wirings partially overlap each other in a planar view, and electrically separated from each other by insulating layers. Each of the plurality of drive wirings is electrically connected to the light-emitting element on an upper surface of the light-emitting element that belongs to a corresponding group among the plurality of groups.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a light emitting device. [Background technology]

[0002] Light-emitting devices with two-dimensionally arranged vertical cavity surface-emitting laser (VCSEL) elements are being developed as light sources for LiDAR (Light Detection and Ranging), 3D (Dimensional) sensors, etc. For example, in distance measuring devices, studies are being conducted to arrange VCSEL elements with a wide light-emitting diameter at high density (narrow pitch) with the aim of increasing output and miniaturizing the elements to improve distance measurement performance (sensitivity, resolution, extended distance measurement range, etc.).

[0003] There are two driving methods for LiDAR light sources that use VCSEL elements: a flash method in which all VCSEL elements that make up the array are illuminated simultaneously to measure distances over a wide area, and a sequential flash method in which multiple light-emitting regions that make up the array are illuminated in sequence.For example, in the sequential flash method, if the optical power density of some of the multiple light-emitting regions can be made equal to the optical power density of the entire element, it is possible to improve distance measurement performance.

[0004] Patent Document 1 describes a light-emitting device having multiple VCSEL groups that can operate individually. In Patent Document 1, the size of the light-emitting device is reduced by arranging electrodes connected to the VCSEL groups on the short side of the substrate on which the light-emitting section is arranged. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2022-165805 Summary of the Invention [Problem to be solved by the invention]

[0006] In order to individually illuminate each light-emitting region in which multiple light-emitting elements are arranged, individual drive wiring is required to control each light-emitting region. However, the space for laying the drive wiring in the light-emitting region is limited, making it difficult to simultaneously achieve high density of light-emitting elements and an increase in the number of drive wirings. Furthermore, since a high current injection value is required to illuminate a light-emitting region containing multiple light-emitting elements, it is necessary to increase the width of the wiring as much as possible to increase the limiting current density in order to avoid breakage of the drive wiring due to electromigration. From this perspective as well, it has been difficult to simultaneously achieve high density of light-emitting elements and an increase in the number of drive wirings.

[0007] An object of the present invention is to provide a technique suitable for increasing the output and density of light emitting elements in a light emitting device having a group of a plurality of light emitting elements that can be driven individually. [Means for solving the problem]

[0008] According to one disclosure of the present specification, a plurality of light-emitting elements, a plurality of drive wirings for driving the plurality of light-emitting elements, a transparent conductive film provided on an upper surface of each of the plurality of light-emitting elements; the plurality of light-emitting elements are divided into a plurality of groups each including at least two light-emitting elements, the plurality of drive wirings are provided corresponding to the plurality of groups, the plurality of drive wirings at least partially overlap each other in a plan view and are electrically separated from each other by an insulating layer, and each of the plurality of drive wirings is The aforementionedA light-emitting device is provided in which the first drive wiring is electrically connected to the light-emitting elements on the top surface, a first drive wiring of the plurality of groups is electrically connected to the light-emitting elements belonging to a first group of the plurality of groups and is not electrically connected to the light-emitting elements belonging to a second group of the plurality of groups, and a second drive wiring of the plurality of drive wiring is not electrically connected to the light-emitting elements belonging to the first group and is electrically connected to the light-emitting elements belonging to the second group, and the first drive wiring extends over the top surface of the light-emitting elements belonging to the second group. According to another disclosure of the present specification, there is provided a light emitting device comprising a plurality of light emitting elements and a plurality of drive wirings for driving the plurality of light emitting elements, the plurality of light emitting elements being divided into a plurality of groups each including at least two light emitting elements, the plurality of drive wirings being provided corresponding to the plurality of groups, the plurality of drive wirings at least partially overlapping in a plan view and electrically isolated from one another by an insulating layer, each of the plurality of drive wirings being electrically connected to a light emitting element belonging to a corresponding one of the plurality of groups on an upper surface of the light emitting element belonging to the corresponding one of the plurality of groups, a first drive wiring of the plurality of drive wirings being electrically connected to a light emitting element belonging to a first group of the plurality of groups and not electrically connected to a light emitting element belonging to a second group of the plurality of groups, a second drive wiring of the plurality of drive wirings being electrically not connected to a light emitting element belonging to the first group and electrically connected to a light emitting element belonging to the second group, and the first drive wiring extending over the upper surface of the light emitting element belonging to the second group. Each of the plurality of drive wirings is provided continuously over the entire area in which the plurality of light emitting elements are arranged, and has an opening at the portion of the light emission port of each of the plurality of light emitting elements. A light emitting device is provided. [Effects of the Invention]

[0009] According to the present invention, in a light emitting device having a group of a plurality of light emitting elements that can be driven individually, it is possible to achieve higher output and higher density of the light emitting elements. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a plan view schematically illustrating the configuration of a light emitting device according to a first embodiment. [Figure 2] 1 is a cross-sectional view showing a schematic configuration of a light emitting device according to a first embodiment. [Figure 3] 1 is a partial cross-sectional view of a light emitting device according to a first embodiment. [Figure 4] FIG. 4 is a cross-sectional view showing a schematic configuration of a light emitting device according to a modified example of the first embodiment. [Figure 5] FIG. 1 is a plan view (part 1) showing a schematic configuration of a light emitting device according to a modified example of the first embodiment. [Figure 6] FIG. 2 is a second schematic plan view showing the general configuration of a light emitting device according to a modified example of the first embodiment. [Figure 7] FIG. 10 is a cross-sectional view showing a schematic configuration of a light emitting device according to a second embodiment. [Figure 8] FIG. 10 is a plan view schematically illustrating the configuration of a light emitting device according to a third embodiment. [Figure 9] FIG. 10 is a cross-sectional view showing a schematic configuration of a light emitting device according to a third embodiment. [Figure 10] FIG. 10 is a partial cross-sectional view of a light emitting device according to a third embodiment. [Figure 11] FIG. 10 is a partial cross-sectional view (part 1) of a light emitting device according to a modified example of the third embodiment. [Figure 12] FIG. 11 is a partial cross-sectional view (part 2) of a light emitting device according to a modified example of the third embodiment. [Figure 13] FIG. 10 is a plan view schematically illustrating the configuration of a light emitting device according to a fourth embodiment. [Figure 14] FIG. 10 is a cross-sectional view showing a schematic configuration of a light emitting device according to a fourth embodiment. [Figure 15] FIG. 10 is a plan view schematically illustrating the configuration of a light emitting device according to a fifth embodiment. [Figure 16] FIG. 10 is a block diagram showing a schematic configuration of a distance measuring device according to a sixth embodiment. [Figure 17] FIG. 13 is a block diagram showing an example of the configuration of a moving body according to a seventh embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the following embodiments do not limit the invention according to the claims. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate identical or similar components, and redundant explanations are omitted as appropriate. Furthermore, each drawing is merely for the purpose of explaining the structure or configuration, and the dimensions of each illustrated component do not necessarily reflect the actual dimensions.

[0012] In the following embodiments, a light emitting device in which a plurality of vertical cavity surface emitting laser (VCSEL) elements are two-dimensionally arranged will be described as an example of a light emitting device to which the present invention can be applied. However, the present invention can also be applied to a light emitting device in which other light emitting elements such as light emitting diodes (LEDs) are two-dimensionally arranged.

[0013] [First embodiment] A light emitting device according to a first embodiment of the present invention will be described with reference to Figs. 1 to 6. Fig. 1 is a plan view showing a schematic configuration of a light emitting device according to this embodiment. Fig. 2 is a cross-sectional view showing a schematic configuration of a light emitting device according to this embodiment. Fig. 3 is a partial cross-sectional view of a light emitting device according to this embodiment. Fig. 4 is a cross-sectional view showing a schematic configuration of a light emitting device according to a modification of this embodiment. Figs. 5 and 6 are plan views showing a schematic configuration of a light emitting device according to a modification of this embodiment.

[0014] The light emitting device 100 according to this embodiment is a surface-emitting semiconductor light emitting device having a plurality of light emitting elements arranged two-dimensionally. Each of the plurality of light emitting elements is formed by a VCSEL element. FIG. 1 is a plan view of the light emitting device 100 as viewed from the light emitting surface side, FIG. 2(a) is a cross-sectional view taken along line IA-IA' in FIG. 1, and FIG. 2(b) is a cross-sectional view taken along line IB-IB' in FIG. 1. FIG. 3(a) is an enlarged view of region A in FIG. 2(a), FIG. 3(b) is an enlarged view of region B in FIG. 2(a), and FIG. 3(c) is an enlarged view of region C in FIG. 2(a).

[0015] FIG. 1 shows 24 VCSEL elements 10 arranged in a square lattice of 4 rows and 6 columns as an example of a plurality of light-emitting elements. Each of the 24 circular regions shown in FIG. 1 represents a VCSEL element 10. These VCSEL elements 10 form a VCSEL element array. The plurality of VCSEL elements 10 are divided into a group (first group) including a plurality of VCSEL elements 10A and a group (second group) including a plurality of VCSEL elements 10B. Each group includes at least two light-emitting elements. The VCSEL elements 10A and VCSEL elements 10B are arranged alternately in both the row and column directions. From the perspective of increasing the density of the VCSEL elements, it is desirable that the VCSEL elements 10A and 10B constituting the VCSEL element array be arranged at regular intervals throughout the VCSEL element array.

[0016] The number of VCSEL elements 10 constituting the light emitting device 100 is not limited to 24, and the number of rows and columns constituting the VCSEL element array can be increased or decreased as appropriate. Also, although the same number of VCSEL elements 10A and VCSEL elements 10B are arranged in Fig. 1, the number of VCSEL elements 10A and the number of VCSEL elements 10B do not necessarily have to be the same and may be different.

[0017] Provided around the VCSEL element array are pad electrodes 28A, which are electrically connected to drive wiring for driving VCSEL element 10A, and pad electrodes 28B, which are electrically connected to drive wiring for driving VCSEL element 10B. While FIG. 1 shows pad electrodes 28A and 28B provided on two adjacent sides of the rectangular region in which the VCSEL element array is disposed, pad electrodes 28A and 28B may alternatively be provided on opposing sides of the rectangular region in which the VCSEL element array is disposed. Alternatively, pad electrodes 28A and 28B may be provided on one side of the rectangular region in which the VCSEL element array is disposed. Multiple wires can be connected to pad electrodes 28A and 28B, respectively.

[0018] 2, the VCSEL elements 10A and VCSEL elements 10B may be provided on a compound semiconductor epitaxial layer 14 grown on a compound semiconductor substrate 12. The upper portion of the compound semiconductor epitaxial layer 14 is processed into mesa structures 16 that are circular in plan view, and each of these mesa structures 16 constitutes either the VCSEL element 10A or the VCSEL element 10B. The diameter of the mesa structure 16 in plan view may be, for example, about 20 μm, and the arrangement pitch of the VCSEL elements 10 may be, for example, about 25 μm.

[0019] The compound semiconductor epitaxial layer 14 is provided with a lower DBR (Distributed Bragg Reflector) layer, a resonator layer including an active layer, and an upper DBR layer (none of which are shown). The upper DBR layer may be provided with a current confinement layer 18 for confining the path of current injected into the active layer. The inner portion surrounded by the current confinement layer 18 becomes the light-emitting portion of the VCSEL devices 10A, 10B. The diameter of the light-emitting portion in plan view may be, for example, approximately 6 μm.

[0020] 2 and 3, an insulating layer 20, a drive wiring 22A (first drive wiring), an insulating layer 20, a drive wiring 22B (second drive wiring), and an insulating layer 20 are laminated in this order on the sidewalls of the mesa structure 16 and in the regions between the mesa structures 16. The drive wiring 22A and the drive wiring 22B are electrically disconnected from each other over the entire area of ​​the light-emitting device 100 due to the insulating layer 20 therebetween. From another perspective, the drive wirings 22A and 22B at least partially overlap in a planar view and are electrically insulated from each other by the insulating layer 20.

[0021] 3(a), the drive wiring 22A extends up to the top surface of the mesa structure 16 of the VCSEL device 10A and is electrically connected to the VCSEL device 10A at the top surface of the mesa structure 16. The drive wiring 22A also extends near the top surface of the mesa structure 16 of the VCSEL device 10B, but an insulating layer 20 is provided between the drive wiring 22A and the VCSEL device 10B, and the drive wiring 22A and the VCSEL device 10B are not electrically connected to each other.

[0022] 3(b), the drive wiring 22B extends up to the upper surface of the mesa structure 16 of the VCSEL device 10B and is electrically connected to the VCSEL device 10B at the upper surface of the mesa structure 16. The drive wiring 22B also extends near the upper surface of the mesa structure 16 of the VCSEL device 10A, but the insulating layer 20 is disposed between the drive wiring 22B and the VCSEL device 10A, and the drive wiring 22B and the VCSEL device 10B are not electrically connected.

[0023] As described above, the VCSEL elements 10A and 10B are arranged in a square lattice pattern, alternately arranged in both the row and column directions. Therefore, two VCSEL elements 10 adjacent to each other at the shortest distance belong to different groups and are connected to different drive wirings 22.

[0024] Drive wiring 22A is connected to the periphery of the top surface of mesa structure 16 of VCSEL device 10A and has a light exit port 24A in the center of the top surface of mesa structure 16. Similarly, drive wiring 22B is connected to the periphery of the top surface of mesa structure 16 of VCSEL device 10B and has a light exit port 24B in the center of the top surface of mesa structure 16. Note that the annular regions of VCSEL devices 10A and 10B shown in FIG. 1 represent the connections of drive wiring 22A and 22B to the top surface of mesa structure 16, and their inner contours correspond to the shapes of exit ports 24A and 24B in a plan view. From the perspective of efficiently emitting light from exit ports 24A and 24B, the thickness of insulating layer 20 within exit ports 24A and 24B preferably has a relationship of mλ / 2n, where λ is the oscillation wavelength, n is the refractive index of the material constituting insulating layer 20, and m is an arbitrary natural number.

[0025] Each of the drive wiring 22A and the drive wiring 22B is provided continuously over the entire area in which the VCSEL element array is disposed, and has a plurality of openings arranged so as not to block any of the emission ports 24A, 24B. That is, each of the drive wiring 22A and the drive wiring 22B is arranged so as to surround the periphery of all of the mesa structures 16 that make up the VCSEL elements 10A, 10B. One of the drive wiring 22A and the drive wiring 22B is electrically connected to each of the mesa structures 16. A pad electrode 28A connected to the drive wiring 22A and a pad electrode 28B connected to the drive wiring 22B are provided on the periphery of the VCSEL element array.

[0026] By adopting the above configuration, the drive wiring 22A, 22B can be arranged to extend up to the top surface of the mesa structure 16 on which the VCSEL elements 10A, 10B are formed, thereby increasing the cross-sectional area of ​​the drive wiring 22A, 22B. Increasing the cross-sectional area reduces the current density, making it possible to increase the current that can be injected.

[0027] A common electrode 26 is provided on the surface of the compound semiconductor substrate 12 opposite to the surface on which the compound semiconductor epitaxial layer 14 is provided. For example, if the compound semiconductor substrate 12 is an n-type semiconductor, the common electrode 26 functions as a cathode electrode for all of the VCSEL elements 10A and 10B that make up the VCSEL element array. The connection portion of the drive wiring 22A to the mesa structure 16 functions as an anode electrode for the VCSEL element 10A, and the connection portion of the drive wiring 22B to the mesa structure 16 functions as an anode electrode for the VCSEL element 10B. The compound semiconductor substrate 12 may be a p-type semiconductor. In this case, the common electrode 26 functions as an anode electrode for all of the VCSEL elements 10A and 10B that make up the VCSEL element array. The connection portion of the drive wiring 22A to the mesa structure 16 functions as a cathode electrode for the VCSEL element 10A, and the connection portion of the drive wiring 22B to the mesa structure 16 functions as a cathode electrode for the VCSEL element 10B.

[0028] By configuring the light-emitting device 100 in this manner, it is possible to individually control the VCSEL elements 10A and 10B. For example, if current is injected only through the pad electrode 28A, only the VCSEL element 10A of the VCSEL elements 10A and 10B will emit light, whereas if current is injected only through the pad electrode 28B, only the VCSEL element 10B of the VCSEL elements 10A and 10B will emit light. When the VCSEL elements 10A and 10B are driven to emit light separately, the number of VCSEL elements 10 connected to one drive wiring 22 is half that of a conventional VCSEL element array, allowing for a higher current to be injected per VCSEL element 10. As a result, for example, when the light-emitting device 100 is applied to a distance measurement system, the optical output of each VCSEL element 10 will be higher when the total optical output of the entire VCSEL element array reaches the eye-safe limit, thereby extending the distance measurement range.

[0029] Furthermore, if current is injected simultaneously from pad electrodes 28A and 28B, all of the VCSEL elements 10A and 10B constituting the VCSEL element array will emit light. When VCSEL elements 10A and 10B are made to emit light simultaneously, because drive wiring 22A and 22B are separated into two, the number of VCSEL elements 10 connected to each of drive wiring 22A and 22B is half that of a VCSEL element array with a conventional configuration. This makes it possible to increase the amount of current that can be injected per VCSEL element, enabling the realization of a two-dimensional VCSEL array with higher output.

[0030] Next, a method for manufacturing the light emitting device 100 according to this embodiment will be described using a VCSEL element that emits light in the 940 nm band as an example.

[0031] First, an n-type GaAs substrate, for example, is prepared as the compound semiconductor substrate 12. Next, the semiconductor layers constituting the lower DBR layer, resonator layer, selective oxidation layer, and upper DBR layer are epitaxially grown on the compound semiconductor substrate 12 by metal organic chemical vapor deposition or molecular beam epitaxy to form the compound semiconductor epitaxial layer 14. The lower DBR layer can be formed by repeatedly stacking a predetermined number of n-type GaAs layers and n-type AlGaAs layers, for example. The resonator layer can be formed by including an active layer with a multiple quantum well structure, each of which includes multiple InGaAs well layers sandwiched between AlGaAs barrier layers, for example. The selective oxidation layer can be formed by, for example, p-type Al 0.98 The upper DBR layer may be formed by repeatedly stacking a predetermined number of n-type GaAs layers and n-type AlGaAs layers, for example.

[0032] Next, using photolithography and etching techniques, the compound semiconductor epitaxial layer 14 is etched at least until the multiple quantum well structure is broken, forming the mesa structure 16 that constitutes the VCSEL elements 10A and 10B. Next, a heat treatment is performed in a water vapor atmosphere to remove the p-type Al that constitutes the selective oxidation layer. 0.98 The GaAs layer is selectively oxidized from the sidewall of the mesa structure 16 to form a current confinement layer 18 .

[0033] Next, an insulating layer 20 made of, for example, silicon oxide is formed by, for example, CVD so as to cover the entire surface. Next, using photolithography and etching techniques, openings are formed in the insulating layer 20 for connecting the drive wiring 22A to the upper surface of the mesa structure 16 of the VCSEL device 10A. In addition to silicon oxide, the insulating layer 20 may be made of a dielectric film such as silicon nitride, silicon oxynitride, amorphous silicon, or aluminum oxide.

[0034] Next, the drive wiring 22A and the pad electrode 28A are formed using lift-off technology. First, photoresist is formed using photolithography technology in areas where the drive wiring 22A and the pad electrode 28A are not to be disposed. Next, a metal layer that will become the drive wiring 22A and the pad electrode 28A is formed by vacuum deposition so as to cover the entire surface. Next, the unnecessary metal layer on the photoresist is removed together with the photoresist, thereby forming the drive wiring 22A and the pad electrode 28A.

[0035] The metal layers constituting the drive wiring 22A and the pad electrode 28A may be made of, for example, Au (gold) / Ti (titanium), Au / Pt (platinum) / Ti, or Au / Ti / Cu (copper) / Ti / Au / Ti. In particular, when a high limiting current density is desired, it is preferable to use a configuration mainly made of Cu, which has high electromigration resistance. The same applies to the drive wiring 22B and the pad electrode 28B.

[0036] Next, an insulating layer 20 made of, for example, silicon oxide is formed by, for example, CVD so as to cover the entire surface. Next, an opening is formed in the insulating layer 20 using photolithography and etching techniques to connect the drive wiring 22B to the upper surface of the mesa structure 16 of the VCSEL device 10B.

[0037] Next, the drive wiring 22B and the pad electrode 28B are formed using lift-off technology. First, photoresist is formed using photolithography technology in areas where the drive wiring 22B and the pad electrode 28B are not to be disposed. Next, a metal layer that will become the drive wiring 22B and the pad electrode 28B is formed by vacuum deposition so as to cover the entire surface. Next, the unnecessary metal layer on the photoresist is removed together with the photoresist, thereby forming the drive wiring 22B and the pad electrode 28B.

[0038] In this way, it is possible to form the drive wiring 22 and the pad electrode 28 on a uniform surface each time metal deposition and lift-off techniques are performed.

[0039] Next, an insulating layer 20 made of, for example, silicon oxide is formed by, for example, CVD so as to cover the entire surface. Next, photolithography and etching are used to remove the insulating layer 20 on the pad electrodes 28A, 28B to expose the pad electrodes 28A, 28B.

[0040] Next, the compound semiconductor substrate 12 is polished from the surface opposite to the side on which the compound semiconductor epitaxial layer 14 is formed to thin it, and then a metal layer is deposited on the polished surface of the compound semiconductor substrate 12 by, for example, vacuum deposition, to form the common electrode 26.

[0041] In this embodiment, a light emitting device having a VCSEL element array in which the VCSEL elements 10 are arranged in a square lattice pattern has been exemplified, but the arrangement of the VCSEL elements 10A, 10B is not limited to a square lattice arrangement and may be, for example, a hexagonal lattice arrangement or a random arrangement.

[0042] Furthermore, in this embodiment, a light emitting device having a VCSEL element having a mesa structure of a compound semiconductor is exemplified, but the VCSEL element does not necessarily have to have a mesa structure, and may have a planar structure or a structure combining a mesa structure and a planar structure (not shown).

[0043] 4 shows an example of a light-emitting device having a planar-structure VCSEL element. In this planar structure, an insulating layer 20, drive wiring 22A, 22B, and pad electrodes 28A, 28B may be disposed on the flat surface of a compound semiconductor epitaxial layer 14 on which a lower DBR layer, a resonator layer, and an upper DBR layer are provided. By providing an isolation structure such as a proton-implanted region 32 in the compound semiconductor epitaxial layer 14, it is possible to isolate adjacent VCSEL elements 10 and confine current in each VCSEL element 10.

[0044] In addition, although the mesa structure 16 and the outlet 24 have circular shapes in plan view in this embodiment, they do not necessarily have to be circular. The shapes of the mesa structure 16 and the outlet 24 in plan view are not particularly limited, and may be, for example, rectangular as shown in Fig. 5 or other polygonal shapes. Furthermore, although it is preferable that the shapes of the mesa structure 16 and the outlet 24 in plan view are the same, they do not necessarily have to be the same.

[0045] Furthermore, in this embodiment, one pad electrode 28A and one pad electrode 28B are provided for each of the plurality of VCSEL elements 10A and the plurality of VCSEL elements 10B, but a plurality of pad electrodes 28A and a plurality of pad electrodes 28B may be provided, for example, as shown in Fig. 6. By adopting such a configuration, it becomes possible to supply power to each of the plurality of pad electrodes 28A, 28B from the outside via bonding wires or the like, thereby obtaining a light-emitting device that allows more uniform current injection.

[0046] As described above, according to this embodiment, in a light emitting device having a plurality of light emitting element groups that can be driven individually, it is possible to achieve high output and high density of the light emitting elements.

[0047] [Second embodiment] A light emitting device according to a second embodiment of the present invention will be described with reference to Fig. 7. Fig. 7 is a cross-sectional view showing the general configuration of the light emitting device according to this embodiment. Components similar to those in the light emitting device according to the first embodiment are given the same reference numerals, and descriptions thereof will be omitted or simplified.

[0048] If the diameter of the mesa structure 16 of the VCSEL element 10 is increased to further increase the optical power density, the injected carriers may concentrate at the periphery of the light-emitting portion, resulting in a ring-shaped emission with high optical intensity at the periphery of the emission port 24. In this embodiment, a suitable configuration for achieving more uniform light emission throughout the light-emitting portion in a light-emitting device having a VCSEL element with an increased diameter of the light-emitting portion to increase the optical power density will be described. Note that an example of such a VCSEL element is a VCSEL element 10 in which the diameter of the mesa structure 16 in plan view is approximately 38 μm, the arrangement pitch of the VCSEL elements 10 is approximately 40 μm, and the diameter of the light-emitting portion in plan view is approximately 30 μm.

[0049] FIG. 7(a) is a cross-sectional view showing the schematic configuration of a VCSEL element 10B of a light-emitting device according to this embodiment, and FIG. 7(b) is an enlarged cross-sectional view of region E in FIG. 7(a). In the VCSEL element 10B of this embodiment, as shown in FIG. 7, a transparent conductive film 30 having a diameter at least larger than the diameter of the light-emitting portion is provided on the upper surface of the mesa structure 16. The transparent conductive film 30 is electrically connected to the mesa structure 16 on its upper surface. The transparent conductive film 30 is insulated from the drive wiring 22A by an insulating layer 20 and is electrically connected to the drive wiring 22B on its upper surface. By configuring the VCSEL element 10B in this manner, carriers injected from the drive wiring 22A diffuse within the transparent conductive film 30 and spread throughout the entire light-emitting portion surrounded by the current confinement layer 18. As a result, light can be emitted uniformly throughout the entire light-emitting portion.

[0050] The material of the transparent conductive film 30 is not particularly limited as long as it is a conductive material that does not block the light emitted from the light-emitting portion, and for example, oxide semiconductors such as indium tin oxide (ITO), indium oxide, tin oxide, zinc oxide, and indium gallium zinc oxide can be used.

[0051] 7 shows an example in which the configuration of this embodiment is applied to the VCSEL device 10B, but the configuration of this embodiment can also be applied to the VCSEL device 10A. In this case, the drive wiring 22A and the transparent conductive film 30 are electrically connected, and the drive wiring 22B and the transparent conductive film 30 are insulated from each other by the insulating layer 20.

[0052] By adopting the configuration of this embodiment, it is possible to increase the diameter of the light emitting portion and achieve higher output in the light emitting device according to the first embodiment.

[0053] As described above, according to this embodiment, in a light emitting device having a plurality of light emitting element groups that can be driven individually, it is possible to achieve high output and high density of the light emitting elements.

[0054] [Third embodiment] A light emitting device according to a third embodiment of the present invention will be described with reference to Figs. 8 to 12. Fig. 8 is a plan view showing the general configuration of a light emitting device according to this embodiment. Fig. 9 is a cross-sectional view showing the general configuration of a light emitting device according to this embodiment. Fig. 10 is a partial cross-sectional view of a light emitting device according to this embodiment. Figs. 11 and 12 are cross-sectional views showing the general configuration of a light emitting device according to a modified example of this embodiment. Components similar to those of the light emitting device according to the first or second embodiment are given the same reference numerals, and descriptions thereof will be omitted or simplified.

[0055] In the first and second embodiments, a light emitting device having VCSEL elements 10A and VCSEL elements 10B was shown, but the number of groups of independently controllable VCSEL elements 10 is not limited to two, and may be three or more. In this embodiment, as an example, a light emitting device having four independently controllable groups of VCSEL elements 10 will be described.

[0056] The light emitting device 100 according to this embodiment is a surface-emitting semiconductor light emitting device having a plurality of light emitting regions arranged two-dimensionally, similar to the first and second embodiments. Each of the plurality of light emitting regions is formed by a VCSEL element. FIG. 8 is a plan view of the light emitting device 100 according to this embodiment as viewed from the light emitting surface side, FIG. 9(a) is a cross-sectional view taken along line VIIIA-VIIIA' in FIG. 8, and FIG. 9(b) is a cross-sectional view taken along line VIIIB-VIIIB' in FIG. 8. FIG. 10(a) is an enlarged view of region A in FIG. 9(b), FIG. 10(b) is an enlarged view of region B in FIG. 9(b), FIG. 10(c) is an enlarged view of region C in FIG. 9(b), and FIG. 10(d) is an enlarged view of region D in FIG. 9(b).

[0057] FIG. 8 shows 24 VCSEL elements 10 arranged in a square lattice of 4 rows and 6 columns as an example of multiple light-emitting regions. Each of the 24 circular regions shown in FIG. 8 represents a VCSEL element 10. These VCSEL elements 10 form a VCSEL element array. The multiple VCSEL elements 10 include multiple VCSEL elements 10A, multiple VCSEL elements 10B, multiple VCSEL elements 10C, and multiple VCSEL elements 10D. The VCSEL elements 10A and the VCSEL elements 10B are alternately arranged in odd-numbered rows, for example, and the VCSEL elements 10C and the VCSEL elements 10D are alternately arranged in even-numbered rows, for example. By arranging the four VCSEL elements 10A, 10B, 10C, and 10D in this manner in a unit block of 2 rows and 2 columns, the VCSEL elements 10A, 10B, 10C, and 10D can be arranged at equal intervals within the VCSEL element array.

[0058] The number of VCSEL elements 10 constituting the light emitting device 100 is not limited to 24, and the number of rows and columns constituting the VCSEL element array can be increased or decreased as appropriate. Also, although the same number of VCSEL elements 10A, 10B, 10C, and 10D are arranged in Fig. 8, the numbers of VCSEL elements 10A, 10B, 10C, and 10D do not necessarily have to be the same and may be different.

[0059] Pad electrodes 28A, 28B, 28C, and 28D are provided around the VCSEL element array. Pad electrode 28A is electrically connected to drive wiring for driving VCSEL element 10A. Pad electrode 28B is electrically connected to drive wiring for driving VCSEL element 10B. Pad electrode 28C is electrically connected to drive wiring for driving VCSEL element 10C. Pad electrode 28D is electrically connected to drive wiring for driving VCSEL element 10D. Although pad electrodes 28A, 28B, 28C, and 28D are provided on each side of the rectangular region in which the VCSEL element array is arranged in FIG. 8, two or more types of pad electrodes 28 may be provided on one side.

[0060] 9, the VCSEL elements 10A, 10B, 10C, and 10D can be provided on a compound semiconductor epitaxial layer 14 grown on a compound semiconductor substrate 12. The upper part of the compound semiconductor epitaxial layer 14 is processed into a mesa structure 16 that is circular in plan view, and each of these mesa structures 16 constitutes one of the VCSEL elements 10A, 10B, 10C, and 10D.

[0061] 8 and 9, an insulating layer 20, a drive wiring 22A, an insulating layer 20, a drive wiring 22B, an insulating layer 20, a drive wiring 22C, an insulating layer 20, a drive wiring 22D, and an insulating layer 20 are stacked in this order on the sidewalls of the mesa structure 16 and in the regions between the mesa structures 16. The drive wirings 22A, 22B, 22C, and 22D are electrically disconnected from one another throughout the light-emitting device 100 due to the insulating layer 20 between them. From another perspective, the drive wirings 22A, 22B, 22C, and 22D at least partially overlap in a planar view and are electrically insulated from one another by the insulating layer 20.

[0062] 10(a), the drive wiring 22A extends up to the top surface of the mesa structure 16 of the VCSEL device 10A and is electrically connected to the VCSEL device 10A at the top surface of the mesa structure 16. The drive wiring 22A also extends near the top surfaces of the mesa structures 16 of the VCSEL devices 10B, 10C, and 10D, but an insulating layer 20 is disposed between the drive wiring 22A and the VCSEL devices 10B, 10C, and 10D. As a result, the drive wiring 22A is electrically disconnected from the VCSEL devices 10B, 10C, and 10D.

[0063] 10(b), the drive wiring 22B extends up to the top surface of the mesa structure 16 of the VCSEL device 10B and is electrically connected to the VCSEL device 10B at the top surface of the mesa structure 16. The drive wiring 22B also extends near the top surfaces of the mesa structures 16 of the VCSEL devices 10A, 10C, and 10D, but an insulating layer 20 is disposed between the drive wiring 22B and the VCSEL devices 10A, 10C, and 10D. As a result, the drive wiring 22B is electrically disconnected from the VCSEL devices 10A, 10C, and 10D.

[0064] 10(c), the drive wiring 22C extends to the upper surface of the mesa structure 16 of the VCSEL element 10C and is electrically connected to the VCSEL element 10C at the upper surface of the mesa structure 16. The drive wiring 22C also extends to the vicinity of the upper surfaces of the mesa structures 16 of the VCSEL elements 10A, 10B, and 10D, but an insulating layer 20 is disposed between the drive wiring 22C and the VCSEL elements 10A, 10B, and 10D. As a result, the drive wiring 22C is electrically disconnected from the VCSEL elements 10A, 10B, and 10D.

[0065] 10(d), the drive wiring 22D extends to the upper surface of the mesa structure 16 of the VCSEL device 10C and is electrically connected to the VCSEL device 10D at the upper surface of the mesa structure 16. The drive wiring 22D also extends to the vicinity of the upper surfaces of the mesa structures 16 of the VCSEL devices 10A, 10B, and 10C, but an insulating layer 20 is disposed between the drive wiring 22D and the VCSEL devices 10A, 10B, and 10C. As a result, the drive wiring 22D is electrically disconnected from the VCSEL devices 10A, 10B, and 10C.

[0066] Drive wiring 22A is connected to the periphery of the upper surface of mesa structure 16 of VCSEL device 10A, and has a light outlet 24A in the center of the upper surface of mesa structure 16. Similarly, drive wiring 22B is connected to the periphery of the upper surface of mesa structure 16 of VCSEL device 10B, and has a light outlet 24B in the center of the upper surface of mesa structure 16. Drive wiring 22C is connected to the periphery of the upper surface of mesa structure 16 of VCSEL device 10C, and has a light outlet 24C in the center of the upper surface of mesa structure 16. Drive wiring 22D is connected to the periphery of the upper surface of mesa structure 16 of VCSEL device 10D, and has a light outlet 24D in the center of the upper surface of mesa structure 16.

[0067] Each of the drive wirings 22A, 22B, 22C, and 22D is provided continuously across the entire area in which the VCSEL element array is disposed and has multiple openings arranged so as not to block any of the emission ports 24A, 24B, 24C, and 24D. That is, each of the drive wirings 22A, 22B, 22C, and 22D is arranged so as to surround all of the mesa structures 16 constituting the VCSEL elements 10A, 10B, 10C, and 10D. Each of the mesa structures 16 is electrically connected to one of the drive wirings 22A, 22B, 22C, and 22D. A pad electrode 28A connected to the drive wiring 22A, a pad electrode 28B connected to the drive wiring 22B, a pad electrode 28C connected to the drive wiring 22C, and a pad electrode 28D connected to the drive wiring 22D are provided on the periphery of the VCSEL element array.

[0068] By adopting the above configuration, it is possible to arrange the drive wirings 22A, 22B, 22C, and 22D so that they extend up to the top surface of the mesa structure 16 that forms the VCSEL elements 10A, 10B, 10C, and 10D. This makes it possible to increase the cross-sectional area of ​​the drive wirings 22A, 22B, 22C, and 22D, thereby further reducing the current density and enabling a higher current value to be injected.

[0069] 9 and 10, the drive wirings 22A, 22B, 22C, and 22D in each of the VCSEL elements 10A, 10B, 10C, and 10D extend up to the top surface of the mesa structure 16, but it is not necessary for all of them to extend up to the top surface of the mesa structure 16. The drive wirings 22A, 22B, 22C, and 22D can also be configured as shown in, for example, FIGS.

[0070] 11(a) shows a configuration example of a VCSEL element 10C in which, of drive wirings 22A, 22B, 22C, and 22D, drive wirings 22A and 22C extend to the top surface of mesa structure 16, and drive wirings 22B and 22D are arranged so as not to overlap mesa structure 16 in a planar view. In this configuration example, the cross-sectional areas of drive wirings 22A and 22C can be selectively increased, thereby increasing the output power of VCSEL elements 10A and 10C. With this configuration, when the light-emitting device of this embodiment is applied to a distance measurement system, it is possible to switch the VCSEL element 10 that emits light depending on the distance measurement range, for example, using a high-output light-emitting element for a long distance measurement range and a low-output light-emitting element for a short distance measurement range.

[0071] 11(b) shows a configuration example in which, in a VCSEL device 10C, only drive wiring 22C connected to mesa structure 16 is arranged as a wiring that extends to the top surface of mesa structure 16, and the other drive wirings 22A, 22B, and 22D are arranged so as not to extend to the top surface of mesa structure 16. In FIG. 11(b), drive wirings 22B and 22D are arranged so as not to overlap with mesa structure 16 in a plan view, and drive wiring 22A is arranged so as to extend partway up the sidewall of mesa structure 16. Two or more of drive wirings 22A, 22B, and 22D may be arranged so as to extend partway up the sidewall of mesa structure 16.

[0072] Although FIG. 11 shows only an example of the configuration of the VCSEL device 10C, the same configuration as the VCSEL device 10C can also be applied to the VCSEL devices 10A, 10B, and 10D.

[0073] Alternatively, for example, as shown in FIGS. 12(a) to 12(d), in each of the VCSEL elements 10A, 10B, 10C, and 10D, the drive wiring 22 extending to the top surface of the mesa structure 16 may be only the drive wiring 22 electrically connected to the corresponding mesa structure 16.

[0074] As described above, according to this embodiment, in a light emitting device having a plurality of light emitting element groups that can be driven individually, it is possible to achieve high output and high density of the light emitting elements.

[0075] [Fourth embodiment] A light emitting device according to a fourth embodiment of the present invention will be described with reference to Figs. 13 and 14. Fig. 13 is a schematic plan view showing the general configuration of the light emitting device according to this embodiment. Fig. 14 is a schematic cross-sectional view showing the general configuration of the light emitting device according to this embodiment. Components similar to those of the light emitting devices according to the first to third embodiments are given the same reference numerals, and descriptions thereof will be omitted or simplified.

[0076] In the first embodiment, the VCSEL elements 10A and the VCSEL elements 10B are arranged alternately in both the row and column directions. However, light-emitting element blocks arranged in M ​​rows and N columns may be arranged alternately in both the row and column directions. In Figures 13 and 14, a light-emitting element block having VCSEL elements 10A arranged in 2 rows and 2 columns and a light-emitting element block having VCSEL elements 10B arranged in 2 rows and 2 columns are arranged alternately in both the row and column directions. Here, M and N are any natural numbers, and at least one of M and N is 2 or greater. Light emitted from the (M x N) VCSEL elements 10 constituting each light-emitting element block may be collected by one microlens and emitted as a single light-emitting point.

[0077] 13, a light-emitting element block including VCSEL elements 10A and a light-emitting element block including VCSEL elements 10B are arranged in a square lattice pattern as shown in the figure. In this case, the VCSEL elements included in two light-emitting element blocks adjacent to each other at the shortest distance belong to different groups and are connected to different drive wirings 22.

[0078] When three or more types of VCSEL elements 10 are included as in the third embodiment, different types of light-emitting element blocks each including the same type of VCSEL element 10 may be arranged periodically in both the row and column directions.

[0079] By configuring the light emitting device so that multiple VCSEL elements 10 form one light emitting point, the optical output per light emitting point increases. Therefore, when the light emitting device of this embodiment is applied to a distance measurement system, for example, it becomes possible to realize a distance measurement system with a long distance measurement range.

[0080] As described above, according to this embodiment, in a light emitting device having a plurality of light emitting element groups that can be driven individually, it is possible to achieve high output and high density of the light emitting elements.

[0081] [Fifth embodiment] A light emitting device according to a fifth embodiment of the present invention will be described with reference to Fig. 15. Fig. 15 is a plan view showing the general configuration of the light emitting device according to this embodiment. Components similar to those in the light emitting devices according to the first to fourth embodiments are given the same reference numerals, and descriptions thereof will be omitted or simplified.

[0082] In the first embodiment, the VCSEL elements 10A and VCSEL elements 10B are alternately arranged in both the row and column directions, but the VCSEL elements 10A and VCSEL elements 10B may be alternately arranged every M rows or every N columns, where M and N are any natural numbers. FIG. 15 shows an example of a configuration in which the VCSEL elements 10A and VCSEL elements 10B are alternately arranged every other row. Each row is composed of only one of the VCSEL elements 10A and VCSEL elements 10B.

[0083] When three or more types of VCSEL elements 10 are included as in the third embodiment, three or more types of columnar light-emitting element blocks each including the same type of VCSEL elements 10 may be configured to be periodically arranged in the column direction or row direction.

[0084] In the arrangement example of this embodiment as well, the VCSEL elements included in two adjacent light-emitting element blocks that are closest to each other belong to different groups and are connected to different drive wirings 22 .

[0085] As described above, according to this embodiment, in a light emitting device having a plurality of light emitting element groups that can be driven individually, it is possible to achieve high output and high density of the light emitting elements.

[0086] [Sixth embodiment] A distance measuring device according to a sixth embodiment of the present invention will be described with reference to Fig. 16. Fig. 16 is a block diagram showing a schematic configuration of the distance measuring device according to this embodiment.

[0087] The distance measuring device 200 according to this embodiment is a distance measuring device (LiDAR device) in which the light emitting device 100 described in any one of the first to fifth embodiments is applied to a light source unit. The distance measuring device 200 can be configured with a control unit 210, a surface emitting laser array driver 212, a surface emitting laser array 214, an emission side optical system 218, a light receiving side optical system 220, an image sensor 222, and a distance data processing unit 224.

[0088] The surface-emitting laser array 214 is a light-emitting device 100 according to any one of the first to fifth embodiments mounted in a package. The surface-emitting laser array driver 212 is a drive unit that receives a drive signal from the control unit 210, generates a drive current for oscillating the surface-emitting laser array 214, and outputs the drive current to the surface-emitting laser array 214. Note that the surface-emitting laser array 214 and the surface-emitting laser array driver 212 do not necessarily need to be separate components, and the surface-emitting laser array 214 may have the function of the surface-emitting laser array driver 212.

[0089] The light-emitting side optical system 218 is an optical system that emits laser light generated by the surface-emitting laser array 214 toward the range to be measured. The light-receiving side optical system 220 is an optical system that guides laser light reflected by the measurement object 1000 to the image sensor 222. Note that although the light-emitting side optical system 218 and the light-receiving side optical system 220 are represented by a single convex lens-shaped member in Fig. 16, they are not composed of only a single convex lens-shaped member, but are composed of a lens group combining multiple lenses.

[0090] Image sensor 222 is a photoelectric conversion device in which a plurality of pixels, each including a photoelectric conversion unit, are arranged in a two-dimensional array, and is a light-receiving device that outputs an electrical signal in response to incident light. Image sensor 222 may be an imaging device such as a CMOS image sensor or a SPAD image sensor. Distance data processing unit 224 functions as a distance information acquisition unit that generates and outputs information regarding the distance to measurement object 1000 present in the distance measurement range based on a signal from image sensor 222. Note that distance data processing unit 224 only needs to be electrically connected to image sensor 222, and may be disposed in the same package as image sensor 222 or in a package separate from image sensor 222.

[0091] The control unit 210 is configured by an information processing device including a microcomputer and logic circuits, and functions as a central processing device that controls the operation of each unit and performs various calculation processes in the distance measuring device 200.

[0092] Next, the operation of the distance measuring device according to this embodiment will be described with reference to FIG. First, the control unit 210 outputs a drive signal to the surface-emitting laser array driver 212. The surface-emitting laser array driver 212 receives the drive signal from the control unit 210 and injects a current of a predetermined current value into the surface-emitting laser array 214. This causes the surface-emitting laser array 214 to oscillate, and laser light is output from the surface-emitting laser array 214.

[0093] The laser light generated by the surface-emitting laser array 214 is emitted toward the distance measurement range by the light-emitting side optical system 218. Of the laser light irradiated onto the measurement object 1000 in the distance measurement range, the laser light reflected by the measurement object 1000 and incident on the light-receiving side optical system 220 is guided to the image sensor 222 by the light-receiving side optical system 220.

[0094] Each pixel of the image sensor 222 generates an electric signal pulse according to the timing of incidence of the laser light. The electric signal pulse generated by the image sensor 222 is input to the distance data processing unit 224.

[0095] The distance data processing unit 224 generates information about the distance to the measurement object 1000 along the light propagation direction based on the reception timing of the electrical signal pulse output from the image sensor 222. For example, the information about the distance to the measurement object 1000 is generated based on the time difference between the timing at which light is emitted from the surface-emitting laser array 214 and the timing at which the image sensor 222 receives the light. By calculating the distance information based on the electrical signal pulse output from each pixel of the image sensor 222, three-dimensional information about the measurement object 1000 can be acquired.

[0096] The distance measuring device 200 of this embodiment can be applied to, for example, a control device in the automotive field that controls a vehicle to avoid collision with another vehicle, or a control device that controls automatic driving by following another vehicle. The distance measuring device 200 of this embodiment can also be applied to other moving objects (moving devices) such as ships, aircraft, and industrial robots, as well as moving object detection systems. The distance measuring device 200 of this embodiment can be widely applied to devices that use information about objects recognized three-dimensionally, including distance information. These moving objects can be configured to include the distance measuring device of this embodiment and control means that controls the moving object based on the distance information acquired by the distance measuring device.

[0097] Furthermore, the three-dimensional information including depth that can be acquired by the distance measuring device 200 of this embodiment can also be used in an image capturing device, an image processing device, a display device, etc. For example, by using the three-dimensional information acquired by the distance measuring device 200 of this embodiment, it is possible to display a virtual object on an image of the real world without creating a sense of incongruity. Furthermore, by storing the three-dimensional information together with the image information, it is also possible to correct the blurring of the captured image after shooting.

[0098] [Seventh embodiment] A moving body according to the seventh embodiment of the present invention will be described with reference to Fig. 17. Fig. 17 is a block diagram showing an example of the configuration of a moving body according to this embodiment.

[0099] 17(a) shows an example of the configuration of a device mounted on a vehicle as an in-vehicle camera. The device 300 has a distance measurement unit 303 that measures the distance to an object to be measured, and a collision determination unit 304 that determines whether or not there is a possibility of a collision based on the distance measured by the distance measurement unit 303. The distance measurement unit 303 may be configured, for example, by the distance measuring device 200 described in the sixth embodiment. Here, the distance measurement unit 303 is an example of a distance information acquisition means that acquires distance information to the object to be measured. In other words, the distance information is information related to the distance to the object to be measured, etc.

[0100] The device 300 is connected to a vehicle information acquisition device 310 and can acquire vehicle information such as vehicle speed, yaw rate, and steering angle. The device 300 is also connected to a control ECU 320, which is a control device that outputs a control signal to generate a braking force for the vehicle based on the determination result of the collision determination unit 304. The device 300 is also connected to an alarm device 330 that issues an alarm to the driver based on the determination result of the collision determination unit 304. For example, if the collision determination unit 304 determines that a collision is highly likely, the control ECU 320 performs vehicle control to avoid a collision and mitigate damage by applying the brakes, releasing the accelerator, suppressing engine output, etc. The alarm device 330 warns the user by sounding an alarm, displaying alarm information on a screen of a car navigation system, etc., or vibrating a seat belt or steering wheel. These devices of the device 300 function as a mobile object control unit that controls the operation of controlling the vehicle as described above.

[0101] In this embodiment, the device 300 measures the distance around the vehicle, for example, the front or rear. Fig. 17(b) shows the device when measuring the distance in front of the vehicle (distance measurement range 350). The vehicle information acquisition device 310, which serves as a distance measurement control means, sends an instruction to the device 300 or the distance measurement unit 303 to perform a distance measurement operation. This configuration can further improve the accuracy of distance measurement.

[0102] Although the above describes an example of control to prevent collision with other vehicles, the present invention can also be applied to control of automatic driving by following other vehicles, control of automatic driving to prevent deviation from a lane, etc. Furthermore, the present invention is not limited to vehicles such as automobiles, but can be applied to moving objects (moving devices) such as ships, aircraft, artificial satellites, industrial robots, and consumer robots. In addition, the present invention can be applied to a wide range of devices that use object recognition or biometric recognition, such as intelligent transport systems (ITS) and surveillance systems, without being limited to moving objects.

[0103] [Modified embodiment] The present invention is not limited to the above-described embodiment, and various modifications are possible.

[0104] For example, an example in which part of the configuration of any one of the embodiments is added to another embodiment, or an example in which part of the configuration of another embodiment is substituted therefor, is also an embodiment of the present invention.

[0105] For example, in the second to fifth embodiments, the mesa structure 16 and the emission port 24 have a circular shape in plan view, but they do not necessarily have to be circular and may have a rectangular or other polygonal shape, as explained as a modification of the first embodiment. Furthermore, the VCSEL element does not necessarily have to have a mesa structure and may have a planar structure or a structure that combines a mesa structure and a planar structure. Furthermore, in the third to fifth embodiments, a transparent conductive film 30 may be disposed on the top surface of the mesa structure 16, as explained in the second embodiment.

[0106] It should be noted that the above-described embodiments are merely examples of specific embodiments for carrying out the present invention, and the technical scope of the present invention should not be construed as being limited by these embodiments. In other words, the present invention can be carried out in various forms without departing from its technical concept or main features.

[0107] The disclosure of the above embodiment includes the following configurations. (Configuration 1) A plurality of light-emitting elements; a plurality of drive wirings for driving the plurality of light-emitting elements; the plurality of light emitting elements are divided into a plurality of groups, each group including at least two light emitting elements; the plurality of drive wirings are provided corresponding to the plurality of groups, the plurality of drive wirings at least partially overlap each other in a plan view and are electrically isolated from each other by an insulating layer; Each of the plurality of drive wirings is electrically connected to a light emitting element on the upper surface of the light emitting element belonging to a corresponding one of the plurality of groups. A light emitting device characterized by: (Configuration 2) a first drive wiring among the plurality of drive wirings is electrically connected to light-emitting elements belonging to a first group among the plurality of groups, and is not electrically connected to light-emitting elements belonging to a second group among the plurality of groups; A second driving wiring of the plurality of driving wirings is not electrically connected to the light emitting elements belonging to the first group, but is electrically connected to the light emitting elements belonging to the second group. 2. The light-emitting device according to configuration 1. (Configuration 3) The first drive wiring extends over the upper surfaces of the light-emitting elements belonging to the second group. 3. The light-emitting device according to configuration 2. (Configuration 4) All of the plurality of drive wirings, except for the second drive wiring, extend above the upper surfaces of the light-emitting elements belonging to the second group. 3. The light-emitting device according to configuration 2. (Configuration 5) The light-emitting element further includes a transparent conductive film provided on the upper surface of each of the plurality of light-emitting elements. 5. The light emitting device according to any one of configurations 1 to 4. (Configuration 6) Each of the plurality of drive wirings is electrically connected to the light emitting elements belonging to the corresponding group via the transparent conductive film. 6. The light-emitting device according to configuration 5. (Configuration 7) The transparent conductive film contains indium tin oxide. 7. The light-emitting device according to configuration 5 or 6. (Configuration 8) The light emitting device has a mesa structure. 8. The light emitting device according to any one of configurations 1 to 7. (Configuration 9) The light emitting device has a planar structure. 8. The light emitting device according to any one of configurations 1 to 7. (Configuration 10) Each of the plurality of drive wirings is provided continuously over the entire area in which the plurality of light emitting elements are arranged, and has an opening at the portion of the light emission port of each of the plurality of light emitting elements. 10. The light emitting device according to any one of configurations 1 to 9. (Configuration 11) Each of the plurality of drive wirings is arranged so as to surround the periphery of each of the plurality of light-emitting elements. 11. The light emitting device according to any one of configurations 1 to 10. (Configuration 12) The plurality of light-emitting elements are arranged in a square lattice pattern, Each of the two light-emitting elements adjacent to each other at the shortest distance is connected to a separate driving wiring. 12. The light emitting device according to any one of configurations 1 to 11. (Configuration 13) the plurality of light-emitting elements are divided into a plurality of light-emitting element blocks, each including a predetermined number of adjacent light-emitting elements; The light emitting elements included in the same light emitting element block are connected to the same drive wiring, and the light emitting elements included in two adjacent light emitting element blocks at the shortest distance are connected to different drive wirings. 12. The light emitting device according to any one of configurations 1 to 11. (Configuration 14) The plurality of light-emitting element blocks are arranged in a square lattice pattern. 14. The light-emitting device according to configuration 13. (Configuration 15) Each of the plurality of light-emitting element blocks includes the predetermined number of light-emitting elements arranged in a row. 14. The light-emitting device according to configuration 13. (Configuration 16) The driving circuit further includes a plurality of pad electrodes connected to the plurality of driving wirings. 16. The light emitting device according to any one of configurations 1 to 15. (Configuration 17) Two or more of the pad electrodes are provided corresponding to each of the plurality of drive wirings. 17. The light-emitting device according to configuration 16. (Configuration 18) The plurality of pad electrodes are arranged around the area in which the plurality of light emitting elements are arranged. 18. The light-emitting device according to configuration 16 or 17. (Configuration 19) Each of the plurality of light-emitting elements is a VCSEL element. 19. The light emitting device according to any one of configurations 1 to 18. (Configuration 20) The plurality of light emitting elements are arranged at regular intervals. 20. The light emitting device according to any one of configurations 1 to 19. (Configuration 21) a light-emitting device according to any one of configurations 1 to 20; a light receiving device that receives light emitted from the light emitting device and reflected by the object to be measured; a distance information acquisition unit that acquires information about the distance to the object to be measured based on the time difference between the timing at which light is emitted from the light emitting device and the timing at which light is received by the light receiving device; A distance measuring device comprising: (Configuration 22) A mobile object, a distance measuring device according to configuration 21; a control means for controlling the moving object based on information about the distance acquired by the distance measuring device; A moving object characterized by having: [Explanation of symbols]

[0108] 10A, 10B, 10C, 10D...VCSEL element 12...Compound semiconductor substrate 14...Compound semiconductor epitaxial layer 16...Mesa structure 18...Current confinement layer 20...insulating layer 22A, 22B, 22C, 22D...Drive wiring 24...Ejection port 26…Common electrode 28A, 28B, 28C, 28D...Pad electrodes 30...Transparent conductive film 32...Proton injection region 100...Light emitting device 200…Distance measuring device 300…Equipment

Claims

1. A plurality of light-emitting elements; a plurality of drive wirings for driving the plurality of light-emitting elements; a transparent conductive film provided on an upper surface of each of the plurality of light-emitting elements; the plurality of light emitting elements are divided into a plurality of groups, each group including at least two light emitting elements; the plurality of drive wirings are provided corresponding to the plurality of groups, the plurality of drive wirings at least partially overlap each other in a plan view and are electrically isolated from each other by an insulating layer; each of the plurality of drive wirings is electrically connected to a light-emitting element on the upper surface of the light-emitting element belonging to a corresponding one of the plurality of groups; a first driving wiring among the plurality of driving wirings is electrically connected to light-emitting elements belonging to a first group among the plurality of groups, and is not electrically connected to light-emitting elements belonging to a second group among the plurality of groups; a second driving wiring among the plurality of driving wirings is not electrically connected to the light-emitting elements belonging to the first group, and is electrically connected to the light-emitting elements belonging to the second group; The first drive wiring extends over the upper surfaces of the light-emitting elements belonging to the second group. A light emitting device characterized by:

2. Each of the plurality of drive wirings is electrically connected to the light emitting elements belonging to the corresponding group via the transparent conductive film.

2. The light emitting device according to claim 1.

3. The transparent conductive film contains indium tin oxide.

2. The light emitting device according to claim 1.

4. A plurality of light-emitting elements; a plurality of drive wirings for driving the plurality of light-emitting elements; the plurality of light emitting elements are divided into a plurality of groups, each group including at least two light emitting elements; the plurality of drive wirings are provided corresponding to the plurality of groups, the plurality of drive wirings at least partially overlap each other in a plan view and are electrically isolated from each other by an insulating layer; each of the plurality of drive wirings is electrically connected to a light emitting element on an upper surface of the light emitting element belonging to a corresponding one of the plurality of groups; a first driving wiring among the plurality of driving wirings is electrically connected to light-emitting elements belonging to a first group among the plurality of groups, and is not electrically connected to light-emitting elements belonging to a second group among the plurality of groups; a second driving wiring among the plurality of driving wirings is not electrically connected to the light-emitting elements belonging to the first group, and is electrically connected to the light-emitting elements belonging to the second group; the first drive wiring extends over the upper surfaces of the light-emitting elements belonging to the second group; Each of the plurality of drive wirings is provided continuously over the entire area in which the plurality of light emitting elements are arranged, and has an opening at the portion of the light emission port of each of the plurality of light emitting elements. A light emitting device characterized by:

5. The light-emitting element further includes a transparent conductive film provided on the upper surface of each of the plurality of light-emitting elements.

5. The light emitting device according to claim 4.

6. Each of the plurality of drive wirings is electrically connected to the light emitting elements belonging to the corresponding group via the transparent conductive film.

6. The light emitting device according to claim 5.

7. The transparent conductive film contains indium tin oxide.

6. The light emitting device according to claim 5.

8. The light emitting device has a mesa structure.

8. The light emitting device according to claim 1, wherein the light emitting device is a light emitting device.

9. The light emitting device has a planar structure.

8. The light emitting device according to claim 1, wherein the light emitting device is a light emitting device.

10. Each of the plurality of drive wirings is provided continuously over the entire area in which the plurality of light emitting elements are arranged, and has an opening at the portion of the light emission port of each of the plurality of light emitting elements.

4. The light emitting device according to claim 1, wherein the light emitting device is a light emitting device.

11. Each of the plurality of drive wirings is arranged so as to surround the periphery of each of the plurality of light-emitting elements.

8. The light emitting device according to claim 1, wherein the light emitting device is a light emitting device.

12. The plurality of light-emitting elements are arranged in a square lattice pattern, Each of the two light-emitting elements adjacent to each other at the shortest distance is connected to a separate driving wiring.

8. The light emitting device according to claim 1, wherein the light emitting device is a light emitting device.

13. the plurality of light-emitting elements are divided into a plurality of light-emitting element blocks, each including a predetermined number of adjacent light-emitting elements; The light-emitting elements included in the same light-emitting element block are connected to the same drive wiring, and the light-emitting elements included in two adjacent light-emitting element blocks at the shortest distance are connected to different drive wirings.

8. The light emitting device according to claim 1, wherein the light emitting device is a light emitting device.

14. The plurality of light-emitting element blocks are arranged in a square lattice pattern.

14. The light emitting device according to claim 13.

15. Each of the plurality of light-emitting element blocks includes the predetermined number of light-emitting elements arranged in a row.

14. The light emitting device according to claim 13.

16. The driving circuit further includes a plurality of pad electrodes connected to the plurality of driving wirings.

8. The light emitting device according to claim 1, wherein the light emitting device is a light emitting device.

17. Two or more of the pad electrodes are provided corresponding to each of the plurality of drive wirings.

17. The light emitting device according to claim 16.

18. The plurality of pad electrodes are arranged around the area in which the plurality of light emitting elements are arranged.

17. The light emitting device according to claim 16.

19. Each of the plurality of light-emitting elements is a VCSEL element.

8. The light emitting device according to claim 1, wherein the light emitting device is a light emitting device.

20. The plurality of light emitting elements are arranged at regular intervals.

8. The light emitting device according to claim 1, wherein the light emitting device is a light emitting device.

21. A light emitting device according to any one of claims 1 to 7; a light receiving device that receives light emitted from the light emitting device and reflected by the object to be measured; a distance information acquisition unit that acquires information about the distance to the object to be measured based on the time difference between the timing at which light is emitted from the light emitting device and the timing at which light is received by the light receiving device; A distance measuring device comprising:

22. A mobile object, a distance measuring device according to claim 21; a control means for controlling the moving object based on information about the distance acquired by the distance measuring device; A moving object characterized by having:

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