Electronic Components

Abstract

To provide an electronic component capable of reducing acoustic noise in an audible frequency range of less than 20 kHz and high-frequency vibration of 20 kHz or more.SOLUTION: In an electronic component according to the present invention, at least one or more first and second laminated capacitors are alternately laminated such that external electrodes are connected to each other in the first direction perpendicular to one surface of the first laminated capacitor, and in the first laminated capacitor, a plurality of internal electrodes are laminated in the first direction, and in the second laminated capacitor, a plurality of internal electrodes are laminated in the second direction perpendicular to the first direction.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to electronic components. [Background technology]

[0002] As one type of electronic component, a multilayer capacitor is small yet capable of achieving high capacitance, and is therefore used in a variety of electronic devices.

[0003] Recently, environmentally friendly vehicles and electric vehicles have been attracting attention, and the number of power drive systems in vehicles is increasing, which has led to an increase in demand for stacked capacitors required for vehicles.

[0004] Automotive components require high levels of thermal and electrical reliability, and the performance requirements for stacked capacitors are gradually becoming more sophisticated. In particular, as component packaging density increases, there is a demand for multiple chip stack capacitors that can improve packaging density in a limited space and achieve high capacitance, as well as capacitors that are highly resistant to vibration and deformation.

[0005] A multilayer capacitor is made of a dielectric material that has piezoelectric properties and can deform in response to an applied voltage.

[0006] When the cycle of the applied voltage is in the audible frequency range, the displacement becomes vibration and is transmitted to the board through the solder, causing the board to vibrate and become audible as sound. This sound is called acoustic noise.

[0007] Apart from the acoustic noise that can be perceived by the human ear, when piezoelectric vibrations of multilayer capacitors occur in the high frequency range of 20 kHz or higher, they can cause malfunctions in various sensors used in IT and industrial / electrical equipment.

[0008] Recently, as the number of multilayer capacitors used in automobiles has increased, there has been an increasing demand for reducing vibration noise generated by the multilayer capacitors. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] Korean Patent No. 10-1031111 [Patent Document 2] Japanese Patent Application Laid-Open No. 2012-43947 Summary of the Invention [Problem to be solved by the invention]

[0010] An object of the present invention is to provide an electronic component that can reduce acoustic noise in the audible frequency range below 20 kHz and high-frequency vibrations of 20 kHz or higher. [Means for solving the problem]

[0011] One aspect of the present invention provides an electronic component in which at least one first multilayer capacitor and at least one second multilayer capacitor are alternately stacked such that external electrodes are connected to each other in a first direction perpendicular to one surface of the first multilayer capacitor, the first multilayer capacitor having a plurality of internal electrodes stacked in the first direction, and the second multilayer capacitor having a plurality of internal electrodes stacked in a second direction perpendicular to the first direction.

[0012] In an embodiment of the present invention, a first stacked capacitor may be located at the bottom in the first direction.

[0013] In an embodiment of the present invention, a second stacked capacitor may be located at the bottom in the first direction.

[0014] In an embodiment of the present invention, the electronic component may further include a conductive adhesive layer disposed between the external electrodes of the first multilayer capacitor and the external electrodes of the second multilayer capacitor.

[0015] In one embodiment of the present invention, the first multilayer capacitor may include a first body and first and second external electrodes respectively formed on both ends of the first body in a third direction perpendicular to the second direction, and the first body may include a plurality of first dielectric layers and first and second internal electrodes alternately arranged in the first direction with the first dielectric layers sandwiched therebetween. The second multilayer capacitor may include a second body and third and fourth external electrodes respectively formed on both ends of the second body in the third direction, and the second body may include a plurality of second dielectric layers and third and fourth internal electrodes alternately arranged in the second direction with the second dielectric layers sandwiched therebetween.

[0016] In one embodiment of the present invention, the first and second external electrodes may each include first and second heads formed on both end surfaces of the first body in the third direction, respectively, and first and second band portions extending from the first and second heads to portions of the upper and lower surfaces and both side surfaces of the first body, respectively; and the third and fourth external electrodes may each include third and fourth heads formed on both end surfaces of the second body in the third direction, respectively, and third and fourth band portions extending from the third and fourth heads to portions of the upper and lower surfaces and both side surfaces of the second body, respectively.

[0017] In an embodiment of the present invention, the device may further include a metal frame connected to the external electrode and separating the first or second stacked capacitor from a mounting surface.

[0018] In one embodiment of the present invention, the electronic component may include a first metal frame including a first vertical portion joined to the first and third heads and a first mounting portion extending in a third direction from a lower end of the first vertical portion, and a second metal frame including a second vertical portion joined to the second and fourth heads and a second mounting portion extending in the third direction from a lower end of the second vertical portion.

[0019] Another aspect of the present invention provides an electronic component in which first and second multilayer capacitors are stacked side by side in a first direction perpendicular to one surface of the first multilayer capacitor, the first multilayer capacitor has a plurality of first and second internal electrodes alternately stacked in the first direction, and first and second external electrodes respectively arranged to be connected to the first and second internal electrodes at both ends, and the second multilayer capacitor has a plurality of third and fourth internal electrodes alternately stacked in a second direction perpendicular to the first direction, and third and fourth external electrodes respectively arranged to be connected to the third and fourth internal electrodes at both ends, and the first external electrode and the third external electrode are connected to each other, and the second external electrode and the fourth external electrode are connected to each other.

[0020] In one embodiment of the present invention, the electronic component may have a first stacked capacitor positioned adjacent to the mounting surface.

[0021] In one embodiment of the present invention, the electronic component may have a second stacked capacitor positioned adjacent to the mounting surface. [Effects of the Invention]

[0022] According to one embodiment of the present invention, in an electronic component including a plurality of stacked capacitors arranged adjacent to one another, horizontally stacked capacitors and vertically stacked capacitors are alternately stacked, thereby reducing acoustic noise in the audible frequency range below 20 kHz and high-frequency vibrations of 20 kHz or higher in the electronic component. [Brief explanation of the drawings]

[0023] [Figure 1] 1 is a perspective view schematically illustrating a first stacked capacitor having a horizontal stack structure according to an embodiment of the present invention; [Figure 2] 2(a) and 2(b) are plan views respectively showing first and second internal electrodes applied to the first multilayer capacitor of FIG. 1. [Figure 3] FIG. 2 is a cross-sectional view taken along line II' in FIG. [Figure 4] 10 is a perspective view schematically illustrating a second stacked capacitor having a vertical stack structure according to an embodiment of the present invention; FIG. [Figure 5] 5(a) and 5(b) are plan views showing third and fourth internal electrodes, respectively, applied to the second multilayer capacitor of FIG. 4. [Figure 6] FIG. 5 is a cross-sectional view taken along line II-II' in FIG. [Figure 7] 1 is a perspective view showing a schematic structure of an electronic component according to an embodiment of the present invention; [Figure 8] FIG. 8 is a cross-sectional view taken along line III-III' in FIG. 7. [Figure 9] FIG. 10 is a cross-sectional view showing a schematic structure of an electronic component according to another embodiment of the present invention. [Figure 10] FIG. 10 is a perspective view showing a schematic structure of an electronic component according to another embodiment of the present invention. [Figure 11] FIG. 11 is a cross-sectional view taken along line IV-IV′ in FIG. [Figure 12] FIG. 10 is a cross-sectional view showing a schematic structure of an electronic component according to yet another embodiment of the present invention. [Figure 13] This shows the results of measurements of how vibration noise changes along the stacking direction when two multilayer capacitors are stacked in the Z direction. [Figure 14] This shows the changes in vibration noise along the stacking direction when two stacked capacitors are stacked in the Z direction and a metal frame is attached. DETAILED DESCRIPTION OF THE INVENTION

[0024] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, the embodiments of the present invention may be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those having average knowledge in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements. Furthermore, the same reference numerals are used throughout the drawings for parts having similar functions and actions.

[0025] Furthermore, throughout the specification, "comprising" an element means that it may further include other elements, rather than excluding other elements, unless specifically stated to the contrary.

[0026] To clearly explain the embodiments of the present invention, directions are defined such that X, Y, and Z shown in the drawings respectively indicate the length direction, width direction, and thickness direction of the first or second stacked capacitor.

[0027] Here, the Z direction can be described as a first direction, the Y direction as a second direction, and the X direction as a third direction.

[0028] FIG. 1 is a perspective view schematically showing a first multilayer capacitor having a horizontally stacked structure applied to an embodiment of the present invention, FIGS. 2(a) and 2(b) are plan views respectively showing first and second internal electrodes applied to the first multilayer capacitor of FIG. 1, and FIG. 3 is a cross-sectional view taken along line II' of FIG.

[0029] First, the structure of the first multilayer capacitor applied to the electronic component of this embodiment will be described with reference to FIGS.

[0030] 1 to 3, the first multilayer capacitor 100 of this embodiment includes a first body 110, and first and second external electrodes 131 and 132 formed on both ends of the first body 110 in the X direction, respectively.

[0031] The first body 110 is formed by stacking a plurality of first dielectric layers 111 in the Z direction and firing them, and the boundaries between adjacent first dielectric layers 111 of the first body 110 can be so integrated that they are difficult to see without using a scanning electron microscope (SEM).

[0032] The first body 110 also includes a plurality of first dielectric layers 111 and first and second internal electrodes 121 and 122 having different polarities and alternately arranged in the Z direction with the first dielectric layers 111 sandwiched therebetween.

[0033] The first body 110 may include an active region that contributes to forming the capacitance of the capacitor, and cover regions 112 and 113 that are provided above and below the active region in the Z direction as margins.

[0034] The first body 110 is not particularly limited in shape, but may be hexahedral, and may include first and second surfaces 1 and 2 facing each other in the Z direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in the X direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2, connected to the third and fourth surfaces 3 and 4, and facing each other.

[0035] The first dielectric layer 111 may include ceramic powder, for example, BaTiO3-based ceramic powder.

[0036] The BaTiO3 ceramic powder is a powder in which Ca or Zr is partially dissolved in BaTiO3 (Ba 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Cax )(Ti 1-y Zr y )O3, or Ba(Ti 1-y Zr y )O3, but are not limited to this.

[0037] In addition to the ceramic powder, the first dielectric layer 111 may further contain a ceramic additive, an organic solvent, a plasticizer, a binder, a dispersant, and the like.

[0038] The ceramic additives may include, for example, transition metal oxides or transition metal carbides, rare earth elements, magnesium (Mg), or aluminum (Al).

[0039] The first multilayer capacitor 100 of this embodiment has a horizontally stacked structure, and the first and second internal electrodes 121 and 122 are electrodes to which different polarities are applied and are formed on the first dielectric layer 111 and stacked in the Z direction. They can be alternately arranged facing each other along the Z direction inside the first body 110 with one first dielectric layer 111 sandwiched therebetween.

[0040] At this time, the first and second internal electrodes 121 and 122 may be electrically insulated from each other by the first dielectric layer 111 disposed therebetween.

[0041] One ends of the first and second internal electrodes 121 and 122 may be exposed through the third and fourth surfaces 3 and 4 of the first body 110, respectively.

[0042] In this manner, the ends of the first and second internal electrodes 121, 122 alternately exposed through the third and fourth surfaces 3, 4 of the first body 110 can be electrically connected to the first and second external electrodes 131, 132, respectively, disposed at both ends of the first body 110 in the X direction, as described below.

[0043] With the above configuration, when a predetermined voltage is applied to the first and second external electrodes 131 and 132, charges are accumulated between the first and second internal electrodes 121 and 122.

[0044] At this time, the capacitance of the first multilayer capacitor 100 is proportional to the overlapping area of ​​the first and second internal electrodes 121 and 122 that overlap each other along the Z direction in the active region.

[0045] Furthermore, the material for forming the first and second internal electrodes 121, 122 is not particularly limited, and may be formed using a conductive paste made of one or more of precious metal materials such as platinum (Pt), palladium (Pd), and palladium-silver (Pd-Ag) alloy, nickel (Ni), and copper (Cu).

[0046] In this case, the conductive paste may be printed by a screen printing method or a gravure printing method, but the present invention is not limited thereto.

[0047] The first and second external electrodes 131 and 132 are supplied with voltages of different polarities, are arranged at both ends of the first body 110 in the X direction, and can be electrically connected to the exposed ends of the first and second internal electrodes 121 and 122, respectively.

[0048] The first external electrode 131 may include a first head portion 131a and a first band portion 131b.

[0049] The first head 131a is arranged on the third surface 3 of the first body 110 and contacts the end of the first internal electrode 121 exposed to the outside through the third surface 3 of the first body 110, thereby electrically connecting the first internal electrode 121 and the first external electrode 131 to each other.

[0050] The first band portion 131b is a portion that extends from the first head portion 131a to parts of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the first main body 110 in order to improve the fixing strength.

[0051] The second external electrode 132 may include a second head portion 132a and a second band portion 132b.

[0052] The second head 132a is disposed on the fourth surface 4 of the first body 110 and contacts the end of the second internal electrode 122 exposed to the outside through the fourth surface 4 of the first body 110, thereby electrically connecting the second internal electrode 122 and the second external electrode 132 to each other.

[0053] The second band portion 132b is a portion that extends from the second head portion 132a to parts of the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the first main body 110 in order to improve the fixing strength.

[0054] Meanwhile, the first and second external electrodes 131 and 132 may further include a plating layer.

[0055] The plating layers may include first and second nickel (Ni) plating layers covering the surfaces of the first and second external electrodes 131 and 132, respectively, and first and second tin (Sn) plating layers covering the first and second nickel plating layers, respectively.

[0056] FIG. 4 is a perspective view schematically showing a second stacked capacitor having a vertical stack structure applied to an embodiment of the present invention, FIGS. 5(a) and 5(b) are plan views respectively showing third and fourth internal electrodes applied to the second stacked capacitor of FIG. 4, and FIG. 6 is a cross-sectional view taken along line II-II' of FIG.

[0057] Here, to avoid redundancy, detailed descriptions of parts similar to the structure of the first stacked capacitor described above, such as the structure in which the third and fourth external electrodes 231 and 232 are formed, will be omitted, and detailed descriptions will be provided based on the illustration of the third and fourth internal electrodes 221 and 222 having a structure different from that of the above-described embodiment.

[0058] 4 to 6, in the second stacked capacitor 200 having a vertical stack structure of this embodiment, the second body 210 includes a plurality of second dielectric layers 211 and third and fourth internal electrodes 221, 222 having different polarities and alternately arranged in the Y direction with the second dielectric layers 211 sandwiched therebetween.

[0059] The second body 210 is not particularly limited in shape, but may be hexahedral, and may include 1-1 and 2-1 surfaces 11, 12 facing each other in the Z direction, 3-1 and 4-1 surfaces 13, 14 connected to the 1-1 and 2-1 surfaces 11, 12 and facing each other in the X direction, and 5-1 and 6-1 surfaces 15, 16 connected to the 1-1 and 2-1 surfaces 11, 12, connected to the 3-1 and 4-1 surfaces 13, 14, and facing each other. Here, the 1-1 surface 11 may serve as a mounting surface.

[0060] The third and fourth internal electrodes 221, 222 may be formed on the second dielectric layer 211 and stacked in the Y direction as electrodes to which different polarities are applied, and may be alternately arranged to face each other along the Y direction inside the second body 210 with one second dielectric layer 211 sandwiched therebetween.

[0061] The third external electrode 231 may include a third head portion 231a connected to the third internal electrode 221 and a third band portion 231b extending from the third head portion 231a to portions of the 2-1, 5-1, and 6-1 surfaces 12, 15, and 16 of the second body 210.

[0062] The fourth external electrode 232 may include a fourth head portion 232a connected to the fourth internal electrode 222 and a fourth band portion 232b extending from the fourth head portion 232a to portions of the 2-1, 5-1, and 6-1 surfaces 12, 15, and 16 of the second body 210.

[0063] In the electronic component of the present invention, at least one first multilayer capacitor 100 and at least one second multilayer capacitor 200 are alternately stacked in a direction perpendicular to one surface of the first multilayer capacitor 100 .

[0064] Here, one surface of the first multilayer capacitor 100, 200 may be, for example, a first surface 1 of the first multilayer capacitor 100, which faces the board when the electronic component of this embodiment is mounted on the board.

[0065] In this case, the first multilayer capacitor 100 may have the first and second internal electrodes 121 and 122 stacked in the Z direction as a first direction perpendicular to one surface, and the second multilayer capacitor 200 may have the third and fourth internal electrodes 221 and 222 stacked in the Y direction as a second direction perpendicular to the first direction.

[0066] FIG. 7 is a perspective view showing a schematic structure of an electronic component according to an embodiment of the present invention, and FIG. 8 is a cross-sectional view taken along line III-III' in FIG.

[0067] 7 and 8, the electronic component of the present embodiment may include one first stacked capacitor 100 and one second stacked capacitor 200.

[0068] In this case, the first stacked capacitor 100 and the second stacked capacitor 200 may be arranged in a line along the Z direction.

[0069] In this embodiment, the second stacked capacitor 200 may be disposed below in the Z direction in the drawing, and the first stacked capacitor 100 may be disposed on top of the second stacked capacitor 200 in parallel in the Z direction.

[0070] In this case, a first conductive adhesive layer 161 may be disposed between the first band portion 131b on the lower side of the first external electrode 131 of the first multilayer capacitor 100 and the third band portion 231b on the upper side of the third external electrode 231 of the second multilayer capacitor 200.

[0071] In addition, a second conductive adhesive layer 162 may be disposed between the second band portion 132b on the lower side of the second external electrode 132 of the first multilayer capacitor 100 and the fourth band portion 232b on the upper side of the fourth external electrode 232 of the second multilayer capacitor 200.

[0072] The first and second conductive adhesive layers 161 and 162 electrically connect the first stacked capacitor 100 and the second stacked capacitor 200 to each other and bind them together so that they are not separated from each other.

[0073] Generally, when an electric field is applied to a multilayer capacitor, the dielectric expands in the direction in which the electric field is applied, and at the same time contracts in the direction perpendicular to the electric field due to the Poisson effect.

[0074] At this time, the mounting portion of the substrate that is in contact with the multilayer capacitor is pulled toward the center of the multilayer capacitor and twisted in a direction perpendicular to the substrate surface. When the electric field is removed, the substrate returns to its original state.

[0075] When the above process is repeated depending on the amplitude of the AC voltage, the substrate vibrates, and when the amplitude and frequency of the vibrations reach the range of human hearing, it is recognized as vibration noise.

[0076] In a conventional electronic component having a stack structure, the stacking directions of the internal electrodes of the upper and lower multilayer capacitors are all the same, and the directions of change of the lower and upper multilayer capacitors are also all the same.

[0077] Therefore, in the Z direction, both of them expand vertically, causing the vibrations of the lower and upper stacked capacitors to collide with each other, and in the X and Y directions, both of them contract inward, pulling the substrate with twice the force, resulting in doubling the vibration of the substrate due to the deformation of the stacked capacitors.

[0078] Meanwhile, the electronic component of the present embodiment is configured by joining a plurality of first and second multilayer capacitors in a stack structure in the Z direction, and is characterized in that the stacking direction of the internal electrodes of the first multilayer capacitor and the stacking direction of the internal electrodes of the second multilayer capacitor are perpendicular to each other.

[0079] As a result, the second stacked capacitor located on the lower side generates vibrations that contract inward in the Z direction, and the first stacked capacitor located on the upper side generates vibrations that expand outward in the Z direction.

[0080] Therefore, vibrations occurring in the Z direction in the first and second stacked capacitors do not collide with each other, and when one stacked capacitor contracts in the X and Y directions, the opposite stacked capacitor expands in the opposite direction, thereby reducing the force applied to the substrate.

[0081] The electronic components of this embodiment can be modified into various arrangement structures.

[0082] For example, as shown in FIG. 9, a first multilayer capacitor 100 may be disposed on the lower side in the Z direction, and a second multilayer capacitor 200 may be disposed on the first multilayer capacitor 100 in parallel.

[0083] In this case, unlike the previous embodiment, there is no collision of vibrations occurring in the Z direction between the two stacked capacitors, and one stacked capacitor contracts in the XY directions, while the other stacked capacitor expands, thereby reducing the force applied to the substrate.

[0084] Figure 13 shows the results of measuring how the vibration noise changes along the stacking direction after two multilayer capacitors are stacked in the Z direction and then mounted on a board. Five samples of each are measured, and the average value is calculated.

[0085] Here, the first and second multilayer capacitors have a length and width of 3.2 mm and 2.5 mm, respectively, and each has a total of 266 laminated internal electrodes.

[0086] #1 and #2 are comparative examples, #1 is the case where both the top and bottom are first stacked capacitors, #2 is the case where both the top and bottom are second stacked capacitors, #3 is the case where an electronic component has the structure of Figure 9, and #4 is the case where an electronic component has the structure of Figure 7.

[0087] Referring to FIG. 13, in the case of #1, the acoustic noise was the highest at 36.7 dB, and in the case of #2, it was lower than #1 but still high at 35.8 dB.

[0088] On the other hand, in the case of #3 and #4 according to the present invention, the acoustic noise was 32.4 dB and 30.2 dB, respectively, which indicates that the acoustic noise was reduced compared to #1 and #2.

[0089] In particular, in this structure without a metal frame, the vibration of the stacked capacitor is transmitted more directly to the board, and the smallest acoustic noise was measured in #4, where the second stacked capacitor with a vertical stacked structure is located on the mounting surface side.

[0090] FIG. 10 is a perspective view showing a schematic structure of an electronic component according to another embodiment of the present invention, and FIG. 11 is a cross-sectional view taken along line IV-IV' in FIG.

[0091] 10 and 11, the electronic component of this embodiment may include a metal frame connected to the external electrodes. The metal frame may include first and second metal frames 140 and 150.

[0092] The first metal frame 140 may include a first vertical portion 141 joined to the first and third head portions 131a and 231a, and a first mounting portion 142 extending in the X direction from a lower portion of the first vertical portion 141.

[0093] The second metal frame 150 may include a second vertical portion 151 joined to the second and fourth head portions 132a and 232a, and a second mounting portion 152 extending in the X direction from a lower portion of the second vertical portion 151.

[0094] In this case, the first conductive adhesive layer 161 ′ may be further disposed between the first head portion 131 a and the first vertical portion 141 and between the third head portion 231 a and the first vertical portion 141 .

[0095] In addition, the second conductive adhesive layer 162' may be further disposed between the second head portion 132a and the second vertical portion 151, and between the fourth head portion 232a and the second vertical portion 151.

[0096] In this embodiment, the second stacked capacitor 200 may be disposed below in the Z direction in the drawing, and the first stacked capacitor 100 may be disposed on top of the second stacked capacitor 200 in parallel.

[0097] The electronic components of this embodiment can be modified into various arrangement structures.

[0098] For example, as shown in FIG. 12, the first multilayer capacitor 100 may be disposed below in the Z direction, and the second multilayer capacitor 200 may be disposed on top of the first multilayer capacitor 100 in parallel.

[0099] In this embodiment, when metal frames are bonded to both end faces of the first and second stacked capacitors and mounted on a substrate, a gap is secured between the stacked capacitor located in the lower layer and the substrate, which prevents stress from the substrate from being directly transmitted to the stacked capacitor and, conversely, prevents vibrations of the stacked capacitor from being transmitted to the substrate, thereby further reducing acoustic noise.

[0100] Figure 14 shows how the vibration noise changes along the stacking direction when two multilayer capacitors are stacked in the Z direction, attached to a metal frame, and mounted on a circuit board. Five samples are measured for each, and the average value is calculated.

[0101] The first and second multilayer capacitors each have a length and width of 3.2 mm and 2.5 mm, respectively, and the total number of laminated layers of the internal electrodes is 266. The distance between the mounting portion of the metal frame and the lower multilayer capacitor is 800 μm.

[0102] #5 and #6 are comparative examples, #5 is the case where both the top and bottom are the first stacked type capacitor, #6 is the case where both the top and bottom are the second stacked type capacitor, #7 is the case where the electronic component of FIG. 12 is used, and #8 is the case where the electronic component of FIG. 10 is used.

[0103] Referring to FIG. 14, it can be seen that the effect of the metal frame is to further reduce acoustic noise compared to #1-4.

[0104] Of these, #5 had the highest acoustic noise at 30.1dB, and #6 was also lower than #5 but still high at 29.8dB.

[0105] On the other hand, in the case of #7 and #8 according to the present invention, the acoustic noise was reduced by 28.1 dB and 28.2 dB, respectively, compared to #5 and #6, and it can be confirmed that this is a significant reduction.

[0106] In particular, in the structure having such a metal frame, the smallest acoustic noise was measured in #3 where the first multilayer capacitor with a horizontally stacked structure was located on the mounting surface side.

[0107] The present invention is not limited by the above-described embodiments and accompanying drawings, but by the appended claims.

[0108] Therefore, various substitutions, modifications and alterations can be made by a person having ordinary skill in the art within the scope of the technical idea of ​​the present invention described in the claims, and these also fall within the scope of the present invention. [Explanation of symbols]

[0109] 100 First stacked capacitor 110 First Body 111 First dielectric layer 121, 122 First and second internal electrodes 131, 132 First and second external electrodes 131a, 132a First and second heads 131b, 132b First and second band portions 200 Second stacked capacitor 210 Second Body 211 Second dielectric layer 221, 222 Third and fourth internal electrodes 231, 232 third and fourth external electrodes 231a, 232a 3rd and 4th heads 231b, 232b 3rd and 4th band parts

Claims

1. At least one first stacked capacitor and at least one second stacked capacitor are alternately stacked in a first direction perpendicular to one surface of the first stacked capacitor such that external electrodes are connected to each other; The first multilayer capacitor has a plurality of internal electrodes stacked in a first direction, the second multilayer capacitor has a plurality of internal electrodes stacked in a second direction perpendicular to the first direction, a conductive adhesive layer disposed between an external electrode of the first multilayer capacitor and an external electrode of the second multilayer capacitor; a metal frame connected to the external electrode and separating the first stacked capacitor or the second stacked capacitor from a mounting surface, the metal frame includes a mounting portion disposed on the mounting surface and a vertical portion extending perpendicularly from the mounting portion, the metal frame is joined to the external electrode only at the vertical portion, an electronic component, wherein the entire head of the external electrode of one of the first and second stacked capacitors is joined to the vertical portion of the metal frame, and only a portion of the head of the external electrode of the other capacitor is joined to the vertical portion of the metal frame.

2. The electronic component according to claim 1 , wherein the first stacked capacitor is located at the bottom in the first direction.

3. 3. The electronic component according to claim 1, wherein the second multilayer capacitor is located at the bottom in the first direction.

4. the first stacked capacitor includes a first body and a first external electrode and a second external electrode formed on both ends of the first body in a third direction perpendicular to the second direction, the first body includes a plurality of first dielectric layers and first and second internal electrodes alternately arranged in a first direction with the first dielectric layers interposed therebetween, the second stacked capacitor includes a second body and a third external electrode and a fourth external electrode formed on both ends of the second body in the third direction, respectively; 4. The electronic component according to claim 1, wherein the second body includes a plurality of second dielectric layers and third and fourth internal electrodes arranged alternately in the second direction with the second dielectric layers sandwiched therebetween.

5. the first external electrode and the second external electrode each include a first head portion and a second head portion formed on both end surfaces of the first body in the third direction, respectively, and a first band portion and a second band portion extending from the first head portion and the second head portion to a portion of an upper and lower surface and a portion of both side surfaces of the first body, respectively; 5. The electronic component of claim 4, wherein the third external electrode and the fourth external electrode each include a third head and a fourth head formed on both end surfaces of the second body in the third direction, respectively, and a third band portion and a fourth band portion extending from the third head and the fourth head to a portion of the upper and lower surfaces and a portion of both side surfaces of the second body, respectively.

6. a first metal frame including a first vertical portion joined to the first head and the third head, and a first mounting portion extending from a lower end of the first vertical portion in a third direction; 6. The electronic component according to claim 5, further comprising: a second metal frame including a second vertical portion joined to the second head and the fourth head; and a second mounting portion extending in a third direction from a lower end of the second vertical portion.

7. The first and second stacked capacitors are stacked side by side in a first direction perpendicular to one surface of the first stacked capacitor; The first multilayer capacitor has a plurality of first internal electrodes and a plurality of second internal electrodes alternately stacked in a first direction, and first external electrodes and second external electrodes disposed at both ends thereof so as to be connected to the first internal electrodes and the second internal electrodes, respectively; the second multilayer capacitor has a plurality of third internal electrodes and a plurality of fourth internal electrodes alternately stacked in a second direction perpendicular to the first direction, and third external electrodes and fourth external electrodes disposed at both ends thereof so as to be connected to the third internal electrodes and the fourth internal electrodes, respectively; the first external electrode and the third external electrode are connected to each other, and the second external electrode and the fourth external electrode are connected to each other; a conductive adhesive layer disposed between an external electrode of the first multilayer capacitor and an external electrode of the second multilayer capacitor; a metal frame connected to the external electrode and separating the first stacked capacitor or the second stacked capacitor from a mounting surface, the metal frame includes a mounting portion disposed on the mounting surface and a vertical portion extending perpendicularly from the mounting portion, the metal frame is joined to the external electrode only at the vertical portion, an electronic component, wherein the entire head of the external electrode of one of the first and second stacked capacitors is joined to the vertical portion of the metal frame, and only a portion of the head of the external electrode of the other capacitor is joined to the vertical portion of the metal frame.

8. 8. The electronic component according to claim 7, wherein the first stacked capacitor is located adjacent to the mounting surface.

9. 8. The electronic component according to claim 7, wherein the second stacked capacitor is located adjacent to the mounting surface.

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