Component mounting device and component mounting system

Abstract

To provide a component mounting device with which it is possible to stably hold components.SOLUTION: A component mounting device according to the present disclosure comprises a mounting head that has a holding member at a lower end for holding components, and that mounts components to a board, and a storage unit that stores information concerning the components. The mounting head permits a first holding member having a first holding face that is in contact with components or a second holding member having a second holding face that is in contact with components to be selectively attached as a holding member, with the area of the first holding face being larger than that of components, and the area of the second holding face being smaller than that of the components, and further includes a determination unit that determines which of the first and second holding members should be used, on the basis of information concerning the components.SELECTED DRAWING: Figure 13

Description

[Technical Field]

[0001] The present disclosure relates to a component mounting apparatus that mounts components on a board. [Background technology]

[0002] As a component mounting apparatus, for example, Patent Document 1 discloses an apparatus for mounting components such as semiconductor elements onto a substrate.

[0003] The component mounting device of Patent Document 1 includes a mounting head having a holding member at the bottom end for holding components. Because the holding member is optically transparent, it is possible to capture an image of the component through the holding member. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6390925 Summary of the Invention [Problem to be solved by the invention]

[0005] However, if the components to be mounted by the mounting head include components that have protruding electrodes or other mounting components, it is difficult to stably hold all the components with the same holding member.

[0006] Therefore, there is still room for improvement in terms of stable component holding.

[0007] The present disclosure aims to solve the above-mentioned problems and to provide a component mounting device that can stably hold components. [Means for solving the problem]

[0008] The component mounting device of the present disclosure comprises a mounting head having a holding member at its lower end for holding a component and for mounting the component on a board, and a memory unit for storing information about the component, wherein the mounting head can selectively attach either a first holding member having a first holding surface that contacts the component or a second holding member having a second holding surface that contacts the component, and when viewed in a plan view from the mounting direction, the area of ​​the first holding surface is larger than the area of ​​the component and the area of ​​the second holding surface is smaller than the area of ​​the component, and the device further comprises a judgment unit that judges whether to use the first holding member or the second holding member based on the information about the component.

[0009] The component mounting system according to the present disclosure includes a component mounting device and a processing device that communicates with the component mounting device via a network. The component mounting device has a mounting head that has a holding member at its lower end that holds the component and that mounts the component on a board, and a first communication unit. The mounting head can selectively attach either a first holding member having a first holding surface that contacts the component or a second holding member having a second holding surface that contacts the component. In a plan view seen from the mounting direction, the area of ​​the first holding surface is larger than the area of ​​the component, and the area of ​​the second holding surface is smaller than the area of ​​the component. The processing device has a memory unit that stores information about the component, a determination unit that determines whether to use the first holding member or the second holding member based on the information about the component, and a second communication unit that transmits information about either the first holding member or the second holding member to be used to the first communication unit via the network. [Effects of the Invention]

[0010] According to the present disclosure, it is possible to provide a component mounting device that can stably hold components. [Brief explanation of the drawings]

[0011] [Figure 1] Schematic diagram of a component mounting device according to a first embodiment of the present disclosure. [Figure 2] Schematic cross-sectional view of the mounted head unit [Figure 3A] Side view of the part [Figure 3B]Part plan view [Figure 4A] Side view of the part [Figure 4B] Part plan view [Figure 5A] Side view of the part [Figure 5B] Part plan view [Figure 6A] Side view of the holding member [Figure 6B] Plan view of the holding member [Figure 7A] Side view of the holding member [Figure 7B] Plan view of the holding member [Figure 8A] Side view of the holding member [Figure 8B] Plan view of the holding member [Figure 9] Schematic plan view of the mounted head unit in Figure 2 [Figure 10] Flowchart showing the operation of the mounting head unit [Figure 11A] A diagram showing the replacement operation of the holding member [Figure 11B] A diagram showing the replacement operation of the holding member [Figure 11C] A diagram showing the replacement operation of the holding member [Figure 11D] A diagram showing the replacement operation of the holding member [Figure 11E] A diagram showing the replacement operation of the holding member [Figure 12] Plan view of a component having protruding electrodes [Figure 13] Schematic cross-sectional view of part of the mounted head unit [Figure 14] Plan view of a component with mounted components [Figure 15] Schematic cross-sectional view of part of the mounted head unit [Figure 16] Schematic cross-sectional view of a mounting head unit in close proximity mounting [Figure 17] 10 is a block diagram of a component mounting system according to a second embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0013] [Embodiment 1] (Overall composition) Fig. 1 is a schematic diagram of a component mounting apparatus 100 according to a first embodiment of the present disclosure. Fig. 2 is a schematic cross-sectional view of a mounting head unit 8. Figs. 3A, 4A, and 5A are side views of a component 2. Figs. 3B, 4B, and 5B are plan views of the component 2.

[0014] As shown in FIG. 1, the component mounting apparatus 100 is an apparatus for mounting components 2 supplied from a wafer 17 onto a substrate 13.

[0015] The component 2 is a die or IC chip that is a rectangular thin plate-like member made of an opaque material such as silicone, gallium nitride, or silicon carbide. As shown in Fig. 2, one surface 2a (the upper surface in Fig. 2) of the component 2 is held by the mounting head unit 8, and the other surface 2b (the lower surface in Fig. 2) of the component 2 is bonded to the substrate 13.

[0016] The substrate 13 is made of, for example, silicone, glass, stainless steel, or a resin substrate, and has a circular or rectangular planar shape.

[0017] Returning to FIG. 1, the component mounting apparatus 100 has a component supply unit 10, a pickup head 7, a mounting head unit 8, a temporary placement unit 9, a stage 12, an X table 20, and a Y table 21.

[0018] The component supply unit 10 is a member for supplying the components 2. For example, the component supply unit 10 supports a wafer 17 supplied from a wafer stocker 18, and the components 2 are supplied from the wafer 17.

[0019] The pickup head 7 picks up the component 2 from the component supply unit 10 and places it on the temporary placement unit 9. The component 2 placed on the temporary placement unit 9 is provisionally recognized, and based on the results of the provisional recognition, the mounting head unit 8 is provisionally aligned. The provisionally aligned mounting head unit 8 picks up the component 2 from the temporary placement unit 9 and mounts it on the substrate 13 supported by the stage 12.

[0020] The pickup head 7 and mounting head unit 8 are held by an X table 20 so as to be movable in the X direction, and are held by a Y table 21 so as to be movable in the Y direction. Therefore, the pickup head 7 and mounting head unit 8 can be moved to any position on the XY plane as long as they do not interfere with each other.

[0021] 2, recognition marks 3a and 3b are formed on the top surface 2a of the component 2 for alignment of the component 2. As shown in FIGS. 3B, 4B, and 5B, the recognition marks 3a and 3b are, for example, small squares and are formed at at least one pair of diagonal corners of the rectangular component 2.

[0022] The mounting head unit 8 captures images of the recognition marks 3 a and 3 b of the component 2 while holding the component 2 so as to mount the component 2 at a predetermined mounting position on the board 13 , and acquires position information of the component 2 .

[0023] Here, a more detailed description will be given of the structure of the mounting head unit 8. As shown in Fig. 2, the mounting head unit 8 according to the first embodiment of the present disclosure includes a mounting head 1, reflective optical systems 61, 62, and 63, an imaging unit 11, a control unit 51, a head lifting mechanism 40, and a head moving mechanism 50.

[0024] The mounting head 1 is a mechanism that sucks and holds the component 2 with a holding member 5 attached to the bottom end, and mounts the component 2 on the board 13. The holding member 5 is, for example, a suction nozzle.

[0025] The mounting head unit 8 is equipped with a plurality of holding members 5 of different sizes, and one selected holding member 5 is attached to the mounting head 1 so as to be interchangeable with other holding members 5. The selected holding member 5 is attached to the mounting head 1 by vacuum suction using a vacuum pump 41. Unused holding members 5 are placed in a stock section 45 (FIG. 1).

[0026] Reflecting optical systems 61, 62, and 63 are arranged inside the mounting head 1. The reflecting optical systems 61, 62, and 63 are reflecting prisms or reflecting mirrors that guide light from the recognition marks 3a and 3b of the component 2 through the mounting head 1 to the imaging unit 11.

[0027] The mounting head 1 has two through holes 69a and 69b that communicate with the holding member 5 below the reflection optical systems 61, 62, and 63.

[0028] The imaging unit 11 is disposed to the side of the mounting head 1, and captures images of the recognition marks 3a and 3b of the component 2 using the imaging sections 11a and 11b. Specifically, the first imaging element 15a of the first imaging section 11a captures an image of the recognition mark 3a along a first imaging optical path 65 that passes from the recognition mark 3a through the holding member 5 and the first through-hole 69a and is reflected by the first reflecting optical system 61. The second imaging element 15b of the second imaging section 11b captures an image of the recognition mark 3b along a second imaging optical path 66 that passes from the recognition mark 3b through the holding member 5 and the second through-hole 69b and is reflected by the second reflecting optical system 62 and the third reflecting optical system 63.

[0029] The two imaging units 11a and 11b are fixed to an imaging stage 11c. The imaging stage 11c may be connected to the mounting head 1 so as to be movable relative to the mounting head 1. In the embodiment, the imaging stage 11c is movable in the lateral direction (for example, the XY direction) so as to adjust the lengths of the imaging optical paths 65 and 66.

[0030] The control unit 51 controls each unit included in the mounting head unit 8. The control unit 51 includes a general-purpose processor such as a CPU or MPU that executes a program to achieve a predetermined function. The control unit 51 is not limited to a unit that achieves a predetermined function through the cooperation of hardware and software, but may also be a hardware circuit designed specifically to achieve a predetermined function. The control unit 51 includes a memory unit 31 and a determination unit 32.

[0031] The storage unit 31 is a recording medium that records various information. The storage unit 31 is realized, for example, by a flash memory, a solid state device (SSD), a hard disk, or other storage device, or by an appropriate combination of these. The storage unit 31 stores, for example, a production program executed by the control unit 51. The production program includes information about the component 2 to be mounted.

[0032] The determination unit 32 determines the holding member 5 to be attached to the mounting head 1 from among the plurality of holding members 5 .

[0033] The head lifting mechanism 40 and the head moving mechanism 50 are mechanisms for moving the mounting head 1 under the control of a control unit 51.

[0034] (Component configuration) 3A to 5B, the configuration of the component 2 held by the mounting head unit 8 will be described in more detail. The component 2 mentioned above is a general term for the different components 52, 102, and 202.

[0035] As shown in FIGS. 3A to 5B, the components 52, 102, and 202 have different structures of their respective top surfaces 52a, 102a, and 202a.

[0036] As shown in FIGS. 3A and 3B, the top surface 52a of the first part 52 is flat.

[0037] During suction and holding, the holding member 5 of the mounting head 1 can come into contact with any position on the top surface 52a of the first component 52. In other words, the entire top surface 52a of the first component 52 is an area (contactable area) S10 that can be used for suction and holding by the holding member 5. Therefore, there is no area of ​​the first component 52 that the holding member 5 cannot come into contact with during suction and holding (contact prohibited area).

[0038] As shown in FIG. 4A, protruding electrodes 103 (bumps) are formed on the top surface 102a of the second component 102. The protruding electrodes 103 protrude upward from the top surface 102a of the second component 102. The protruding electrodes 103 have a height H1 of 0.8 mm or less. As shown in FIG. 4B, the protruding electrodes 103 are arranged along part of the outer periphery of the second component 102.

[0039] The contact-prohibited area S1 of the second component 102 is the outer periphery of the top surface 102a of the second component 102 on which the protruding electrodes 103 are formed. The contact-possible area S11 of the second component 102 is the area of ​​the top surface 102a other than the contact-prohibited area S1. For example, the contact-possible area S11 is the top surface 102a inside the protruding electrodes 103.

[0040] As shown in FIG. 5A, in addition to protruding electrodes 203a (bumps), another component 203b is mounted on the third component 202. The protruding electrodes 203a and the component 203b protrude upward from the top surface 202a of the third component 202. The protruding electrodes 203a and the component 203b have a height H2 of, for example, 0.8 mm or less. As shown in FIG. 5B, the component 203b is provided on the outer periphery of the third component 202, and the protruding electrodes 203a are provided inside the component 203b.

[0041] The contact-prohibited area S2 of the third component 202 is the outer periphery of the top surface 202a of the third component 202 where the protruding electrodes 203a and the components 203b are formed. The contact-possible area S12 of the third component 202 is the area of ​​the top surface 202a other than the contact-prohibited area S2. For example, the contact-possible area S12 is the top surface 202a inside the protruding electrodes 203a and the components 203b.

[0042] (Configuration of holding member) Next, the configurations of the different holding members 5 attached to the mounting head 1 will be described in more detail with reference to Figs. 6A to 8B. The above-mentioned holding member 5 is a general term for holding members 55, 105, and 205. Figs. 6A, 7A, and 8A are side views of the holding members 55, 105, and 205. Figs. 6B, 7B, and 8B are plan views of the holding members 55, 105, and 205.

[0043] 6A to 8B, the holding members 55, 105, 205 have, at their lower ends, holding surfaces 56a, 106a, 206a that hold the component 2. The areas of the holding surfaces 56a, 106a, 206a decrease in order.

[0044] As shown in FIG. 6B, in a plan view seen from the mounting direction (Z direction), the area of ​​holding surface 56a is larger than the area of ​​component 2. More specifically, the entire outer periphery of holding surface 56a is formed outside the outer periphery of component 2, and the width L10 by which holding surface 56a protrudes from the outer periphery of component 2 is constant. Therefore, when component 2 is picked up using first holding member 55, holding surface 56a comes into contact with the entire top surface 2a of component 2. This structure allows for more stable pick-up of component 2.

[0045] 7B and 8B, in a plan view seen from the mounting direction (Z direction), the area of ​​the holding surfaces 106a, 206a is smaller than the area of ​​the component 2. The entire outer periphery of the holding surfaces 106a, 206a is inside the outer periphery of the component 2. Therefore, the holding surfaces 106a, 206a contact inner central regions R11, R12, which are part of the top surface 2a of the component 2. The central region R12 is smaller than the central region R11.

[0046] Here, the area of ​​the component 2 exposed to the holding surface 106a is referred to as the first area R1, and the area of ​​the component 2 exposed to the holding surface 206a is referred to as the second area R2. This structure makes it possible to avoid contact between the holding surface 106a and the first area R1, and between the holding surface 206a and the second area R2.

[0047] Considering the structure of component 2 described above, if component 2 does not have a contact-prohibited area, component 2 can be held using first holding member 55. If component 2 has a contact-prohibited area, component 2 can be held using second holding member 105 or third holding member 205. Whether to use second holding member 105 or third holding member 205 can be determined depending on the size and range of the contact-prohibited area.

[0048] Furthermore, there are cases where components 2 are mounted on board 13 at intervals smaller than the predetermined distance, i.e., close-adjacent mounting is performed. In the case of close-adjacent mounting, second holding member 105 or third holding member 205 is used. Because holding surfaces 106a, 206a are located inside component 2, i.e., inside the mounting position of component 2, interference with components mounted adjacent to the mounting position of component 2 can be avoided. The predetermined distance may be set according to the size of holding member 5 and component 2. The predetermined distance is, for example, 0.05 mm or more and 1 mm or less.

[0049] The determination unit 32 determines which of the holding members 55, 105, and 205 to use based on the production program stored in the storage unit 31.

[0050] The production program stored in the storage unit 31 includes information regarding the type of component 2 to be mounted, the mounting position of the component 2, contact-prohibited areas on the component 2, information regarding components already mounted on the board 13, and the like.

[0051] The information regarding the contact-prohibited area on the component 2 includes the presence or absence, range, size, or height of the structure formed in the contact-prohibited area.

[0052] The information about the components already mounted on the board 13 includes the minimum spacing between the components already mounted.

[0053] The structure of the holding members 55, 105, 205 will now be described in more detail.

[0054] 6A, 7A, and 8A, the holding members 55, 105, and 205 have a two-stage structure and include a first portion 56, 106, and 206, respectively, and a second portion 57, 107, and 207. The first portions 56, 106, and 206 have holding surfaces 56a, 106a, and 206a. The second portions 57, 107, and 207 are connected to the upper ends of the first portions 56, 106, and 206, respectively, and are attached to the mounting head 1 by suction.

[0055] The areas of the first portions 56, 106, and 206 are smaller than the areas of the second portions 57, 107, and 207, respectively. The first portions 56, 106, and 206 have different outer dimensions depending on the areas of the holding surfaces 56a, 106a, and 206a, respectively. The second portions 57, 107, and 207 have the same outer dimensions and thickness. The second portions 57, 107, and 207 may be shared by the holding members 55, 105, and 205.

[0056] As shown in FIGS. 7A and 8A, the first portions 106, 206 have thicknesses T1, T2 that are equal to or greater than the heights H1, H2 of the structure on the component 2, for example, 1 mm or greater.

[0057] The first portions 56, 106, 206 and the second portions 57, 107, 207 are transparent to the wavelengths used by the imaging elements 15a, 15b. Therefore, the imaging optical paths 65, 66 can pass through the holding member 5, and the imaging units 11a, 11b can capture images of the recognition marks 3a, 3b of the component 2 through the holding member 5. In this embodiment, the first portions 56, 106, 206 and the second portions 57, 107, 207 are formed of a material that is transparent to visible light, such as sapphire, quartz, glass, or heat-resistant plastic.

[0058] As shown in FIG. 6A, the imaging optical paths 65, 66 pass through both the first portion 56 and the second portion 57.

[0059] 7A and 8A , the imaging optical paths 65, 66 pass only through the second portions 107, 207, and pass beside the outer peripheries of the first portions 106, 206. There is a gap between the imaging optical paths 65, 66 and the outer peripheries of the first portions 106, 206. This structure makes it possible to suppress scattering of the imaging optical paths 65, 66 compared to when the imaging optical paths 65, 66 pass near the outer peripheries of the first portions 106, 206.

[0060] Due to the difference in refractive index between air and glass, the focal position of imaging unit 11 differs when imaging optical paths 65, 66 pass through first portion 56 and when they pass along the sides of the outer peripheries of first portions 106, 206. Control unit 51 adjusts the position of imaging unit 11 so that the focal position of imaging unit 11 is aligned with recognition marks 3a, 3b.

[0061] 6A, first portion 56 and second portion 57 may be formed by cutting a single plate-like member. This prevents a boundary from being formed between first portion 56 and second portion 57, thereby minimizing the influence on imaging optical paths 65, 66.

[0062] 7A, the first portion 106 and the second portion 107 are formed by bonding two plate-like members together using a bonding technique such as optical contact. This method reduces manufacturing costs and suppresses scattering of the imaging optical paths 65, 66 passing through the main surface 107a of the second portion 107 (the lower surface in FIG. 7A).

[0063] The first and second parts 206 and 207 are manufactured in the same manner as the first and second parts 106 and 107 .

[0064] The holding members 105, 205 may be formed by cutting a single plate-like member, similar to the first holding member 55. In this case, the main surfaces 107a, 207a of the second portions 107, 207 are polished after cutting. With such a structure, scattering of the imaging optical paths 65, 66 passing through the main surfaces 107a, 207a can be suppressed.

[0065] The following describes the suction and holding of the holding member 5 determined by the control unit 51. Fig. 9 is a plan view of the mounting head 1 in Fig. 2 as seen from below.

[0066] 9, a holding member suction path 24 communicating with a vacuum pump 41 is formed at the lower end of the mounting head 1. The mounting head 1 holds the holding member 5 by vacuum suction.

[0067] Furthermore, the holding member 5 has suction holes 58 that are independent of the holding member suction path 24 and communicate with the vacuum pump 41, and grooves 59 that extend radially from the suction holes 58. When the vacuum pump 41 is operated, the suction holes 58 and grooves 59 form the component suction path 25, and the component 2 is held by vacuum suction.

[0068] (Mounting head operation) An example of the operation of the mounting head unit 8 in the above configuration will be described with reference to Figs. 10 to 16. Fig. 10 is a flowchart showing the operation of the mounting head unit 8. Figs. 11A to 11E are views showing replacement of the holding member 5 in the mounting head 1. Fig. 12 is a plan view of the second component 102. Fig. 13 is a schematic cross-sectional view of a portion of the mounting head unit 8 holding the second component 102. Fig. 14 is a plan view of the third component 202. Fig. 15 is a schematic cross-sectional view of a portion of the mounting head unit 8 holding the third component 202. Fig. 16 is a schematic cross-sectional view of the mounting head unit 8 in close adjacent mounting.

[0069] 10, the control unit 51 acquires information about the component 2 (S10). Specifically, the control unit 51 references the production program stored in the storage unit 31 to acquire the presence and extent of a contact-prohibited region S1 of the component 2 to be mounted.

[0070] Next, the determination unit 32 of the control unit 51 selects the holding member 5 to be attached to the mounting head 1 from the holding members 55, 105, and 205 based on the presence or absence and range of the acquired contact prohibition area. Specifically, the determination unit 32 first determines whether or not a contact prohibition area exists (S11).

[0071] If a contact forbidden area exists (Yes in S11), the determination unit 32 determines whether the range of the contact forbidden area is smaller than the first area R1 according to the second holding member 105 (S12). More specifically, the determination unit 32 determines whether the entire contact forbidden area is included in the first area R1.

[0072] If no contact forbidden area exists (No in S11), the determination unit 32 determines to use the first holding member 55 (S13).

[0073] If the range of the contact forbidden area is smaller than the first area R1 (Yes in S12), the determination unit 32 determines to use the second holding member 105 (S14).

[0074] If the range of the contact forbidden area is larger than the first area R1 (No in S12), the determination unit 32 determines to use the third holding member 205 (S15).

[0075] The determination unit 32 may further determine whether the contact forbidden area is smaller than the second area R2. If the contact forbidden area is smaller than the second area R2, the determination unit 32 decides to use the third holding member 205. If the contact forbidden area is larger than the second area R2, the determination unit 32 may notify the user of a warning.

[0076] Next, the control unit 51 determines whether the holding member 5 decided to be used is the same as the attached holding member 5 (S16), and if they are different (No in S16), replaces the holding member 5 (S17).

[0077] Specifically, as shown in Fig. 11A, the mounting head 1 moves above an empty stock section 45. As shown in Fig. 11B, the mounting head 1 descends, releases the vacuum in the holding member suction path 24, and places the attached holding member 5 (for example, the second holding member 105) in the stock section 45. As shown in Figs. 11C and 11D, the mounting head 1 moves above a holding member 5 (for example, the third holding member 205) placed in another stock section 45, and sucks the holding member 5 by the holding member suction path 24. As shown in Fig. 11E, the mounting head 1 rises with the holding member 5 attached.

[0078] Next, the control unit 51 moves the mounting head 1 using the head moving mechanism 50 and the head lifting mechanism 40, and causes the mounting head 1 to hold the component 2 placed on the temporary placement unit 9 (S18). When the mounting head 1 descends, the holding member 5 comes into contact with the component 2, and the holding member 5 holds the component 2 by vacuum suction.

[0079] 12, when the held component 2 is the second component 102, the contact-prohibited area S1 is the outer periphery of the top surface 102a of the second component 102 on which the protruding electrodes 103 are formed. The contact-prohibited area S1 is included in the first area R1. Therefore, the determination unit 32 determines to use the second holding member 105.

[0080] 13, the first portion 106 of the second holding member 105 holds the contactable area S11 inside the contact-prohibited area S1. Furthermore, the thickness T1 of the first portion 106 is greater than the height H1 of the protruding electrodes 103. Therefore, even when the first portion 106 holds the second component 102, the second portion 107 is spaced apart from the protruding electrodes 103. Therefore, by using the second holding member 105, the second component 102 can be stably held while avoiding interference with the protruding electrodes 103.

[0081] 14, when the held component 2 is the third component 202, the contact-prohibited area S2 is the outer periphery of the top surface 202a of the third component 202 on which the protruding electrodes 203a and the component 203b are formed. The contact-prohibited area S2 is larger than the first area R1, but is included in the second area R2. Therefore, the determination unit 32 determines to use the third holding member 205.

[0082] 15, the first portion 206 of the third holding member 205 holds the contactable area S12 inside the contact-prohibited area S2. Furthermore, the thickness T2 of the first portion 206 is greater than the height H2 of the protruding electrode 203a and the component 203b. Therefore, by using the third holding member 205, the third component 202 can be stably held while avoiding interference with the protruding electrode 203a and the component 203b.

[0083] Next, the control unit 51 acquires the component mounting position of the component 2. Specifically, the control unit 51 refers to the production program stored in the storage unit 31 to acquire the component mounting position of the component 2.

[0084] Next, the control unit 51 moves the mounting head 1 holding the component 2 to above the component mounting position on the board 13 (S19).

[0085] Next, the control unit 51 adjusts the position of the imaging unit 11 in accordance with the refractive index of the medium through which the imaging optical paths 65, 66 pass (S20). The focus of the imaging unit 11 shifts from the recognition marks 3a, 3b due to the difference in refractive index between when the first holding member 55 is attached and the imaging optical paths 65, 66 pass through the first part 56 and when the holding members 105, 205 are attached and the imaging optical paths 65, 66 pass through air. The control unit 51 moves the imaging stage 11c of the imaging unit 11 closer to or farther away from the mounting head 1 so that the focus of the imaging unit 11 is on the recognition marks 3a, 3b.

[0086] When the thickness T1 of the first portion 106 of the second holding member 105 and the thickness T2 of the first portion 206 of the third holding member 205 are equal, the focal position of the imaging unit 11 remains constant even when the second holding member 105 and the third holding member are replaced. Therefore, when replacing the second holding member 105 with the third holding member 205, adjustment of the position of the imaging unit 11 can be omitted.

[0087] Next, the control unit 51 causes the imaging unit 11 to capture images of the recognition marks 3a and 3b of the component (S21).

[0088] Next, the control unit 51 performs image processing based on the captured image, and based on the image processing, performs image recognition of the recognition marks 3a and 3b of the component 2 held by the mounting head 1. Based on the image recognition result, the control unit 51 calculates the coordinates of the component 2.

[0089] Next, the control unit 51 corrects the positional deviation of the component 2, i.e., the mounting head 1, based on the coordinate calculation result of the component 2. More specifically, the control unit 51 moves the mounting head 1 in the X, Y, and θ directions using the head moving mechanism 50. In addition to or instead of the mounting head 1, the control unit 51 may also move the stage 12 in the X, Y, and θ directions.

[0090] Next, the control unit 51 causes the head lifting mechanism 40 to lower the mounting head 1 whose position has been corrected, and mounts the component 2 on the board 13 while pressing the component 2 against the board 13 (S22), thereby completing the operation.

[0091] Next, a case where a component 2 is mounted in close proximity will be described with reference to Fig. 16. As shown in Fig. 16, another component 2 is mounted on the board 13.

[0092] The control unit 51 acquires information about the components 2. Specifically, the control unit 51 refers to the production program stored in the storage unit 31 and acquires the minimum value L1 of the mounting interval between the components 2 to be mounted on the board 13.

[0093] Next, the determination unit 32 of the control unit 51 determines whether the acquired minimum mounting interval value L1 is smaller than a predetermined distance L0. The predetermined distance L0 may be defined by a width L10 (FIG. 6B) of the holding surface 56a of the first holding member 55 protruding from the outer periphery of the component 2 in a plan view seen from the mounting direction.

[0094] When the minimum mounting interval L1 is smaller than the predetermined distance L0 (that is, when the components 2 are closely adjacent mounted), the determination unit 32 determines that the second holding member 105 is to be used.

[0095] Since the first portion 106 of the second holding member 105 does not protrude from the outer periphery of the component 2, interference between the second holding member 105 and other components 2 can be avoided during mounting.

[0096] If the minimum mounting interval L1 is greater than the predetermined distance L0, the determination unit 32 determines that the first holding member 55 is to be used.

[0097] By obtaining the minimum value L1 of the mounting interval between components 2 to be mounted on board 13, the same holding member 5 can be used in the mounting operation for one board 13.

[0098] Subsequently, as described above, control unit 51 holds component 2 by vacuum suction with holding member 5 and mounts it on board 13, and then ends the operation.

[0099] The control unit 51 may acquire the minimum mounting interval L1 of the components 2 to be mounted on the board 13, along with the presence or absence and extent of the contact prohibition area S1 of the components 2 to be mounted, and determine the holding member 5 to be used.

[0100] (summary) The features of the present disclosure will be described by summarizing the above description. The component mounting apparatus 100 according to the present disclosure has multiple holding members 5. Each holding member 5 has a different holding surface area 56a, 106a, 206a in a plan view from the mounting direction. With this structure, the region of the upper surface 2a of the component 2 that the holding member 5 contacts varies depending on the type of holding member 5 that holds the component 2. Specifically, the first holding member 55 contacts the entire upper surface 2a of the component 2, the second holding member 105 contacts a central region R11 of the upper surface 2a of the component 2, and the third holding member 205 contacts a more limited central region R12 of the upper surface 2a of the component 2.

[0101] Therefore, the control unit 51 uses different holding members 5 depending on the information about the component 2. If there is no contact prohibition area on the upper surface 2a of the component 2 and the component 2 is not closely adjacently mounted on the board 13, the determination unit 32 decides to use the first holding member 55. By using the first holding member 55, a suction area for the component 2 can be secured, and the component 2 can be stably picked up. This enables the mounting head 1 to move at high speed.

[0102] If a contact-prohibited area exists only on the outer periphery of component 2, or if component 2 is mounted closely adjacent to substrate 13, determination unit 32 determines to use second holding member 105. By using second holding member 105, component 2 can be stably picked up while avoiding the contact-prohibited area. Furthermore, because second holding member 105 does not protrude outside the outer periphery of component 2 in a plan view, interference between second holding member 105 and an object already mounted on substrate 13 can be avoided.

[0103] If a contact-prohibited area also exists inside the area of ​​component 2, determination unit 32 determines to use third holding member 205. By using third holding member 205, component 2 can be stably picked up while avoiding the contact-prohibited area.

[0104] (effect) The component mounting apparatus 100 according to the embodiment can provide the following effects.

[0105] As described above, the component mounting apparatus 100 of the embodiment includes a mounting head 1 having a holding member 5 for holding a component 2 at its lower end and for mounting the component 2 on a board 13, and a storage unit 31 for storing information about the component 2. The mounting head 1 can selectively attach, as the holding member 5, a first holding member 55 having a holding surface 56a (first holding surface) that contacts the component 2, or a second holding member 105 having a holding surface 106a (second holding surface) that contacts the component 2. In a plan view seen from the mounting direction, the area of ​​the holding surface 56a is larger than the area of ​​the component 2, and the area of ​​the holding surface 106a is smaller than the area of ​​the component 2. The component mounting apparatus 100 further includes a determination unit 32 that determines whether to use the first holding member 55 or the second holding member 105 based on the information about the component 2.

[0106] With this configuration, the mounting head 1 can use different holding members 5 depending on the information about the component 2. By using the first holding member 55, a large holding area can be secured and the component 2 can be stably held. By using the second holding member 105, the component 2 can be held only in a limited area of ​​the component 2.

[0107] In the component mounting apparatus 100 of the embodiment, the information about the component 2 includes information about a contact-prohibited area where an object is provided on the upper surface 2a of the component 2. If no contact-prohibited area exists, the determination unit 32 determines that a first holding member 55 should be attached to the mounting head 1. If a contact-prohibited area exists, the determination unit 32 determines that a second holding member 105 should be attached to the mounting head 1.

[0108] With this configuration, by using the second holding member 105, the component 2 can be stably sucked while avoiding the contact-prohibited area.

[0109] In the component mounting apparatus 100 of the embodiment, the information about the components 2 includes information about the mounting interval between components to be mounted on the board 13. If the mounting interval is greater than a predetermined distance L0, the determination unit 32 determines that a first holding member 55 should be attached to the mounting head 1. If the mounting interval is smaller than the predetermined distance L0, the determination unit 32 determines that a second holding member 105 should be attached to the mounting head 1.

[0110] With this configuration, the holding surface 106a of the second holding member 105 does not protrude outside the outer periphery of the component 2, so that interference between the second holding member 105 and an object already mounted on the board 13 can be avoided.

[0111] In the component mounting apparatus 100 of the embodiment, the second holding member 105 has a first portion 106 that constitutes the holding surface 106a, and a second portion 207 that is provided above the first portion 106 and has a larger area than the first portion 106. The information about the component 2 includes information about the height of an object provided on the upper surface 2a of the component 2. The thickness T1 of the first portion 106 of the second holding member 105 is larger than the height H1 of the object.

[0112] This configuration can prevent second portion 107 from hitting an object provided on top surface 2a of component 2. Therefore, damage to the object provided on top surface 2a of component 2 by holding member 5 can be suppressed.

[0113] In the component mounting apparatus 100 of the embodiment, the first holding member 55 has a first portion 56 and a second portion 57 formed integrally, and the second holding member 105 has a first portion 106 and a second portion 107 formed separately.

[0114] With this configuration, when an image of the component 2 is captured through the holding member 5, the manufacturing cost of the holding member 5 can be reduced and the optical transparency of the holding member 5 can be maintained.

[0115] In the component mounting apparatus 100 of the embodiment, the second part 57 of the first holding member 55 and the second part 107 of the second holding member 105 have a common shape.

[0116] With this configuration, different holding members 5 can be attached using a common mechanism in the mounting head 1. This simplifies the structure of the mounting head 1.

[0117] In the component mounting apparatus 100 of the embodiment, a third holding member 205 (which may also be referred to as a second holding member) is provided in addition to the second holding member 105. The areas of the holding surfaces 106a and 206a of the holding members 105 and 205 are different.

[0118] With this configuration, components 2 having different ranges or sizes of contact-prohibited areas can be stably held.

[0119] The component mounting apparatus 100 of the embodiment further includes a stock unit 45 and a control unit 51. The stock unit 45 houses a first holding member 55 or a second holding member 105. The control unit 51 controls the mounting head 1 to exchange one of the first holding member 55 and the second holding member 105 attached to the mounting head 1 for the other housed in the stock unit 45.

[0120] Such a configuration allows automatic replacement of the holding member 5. Therefore, the time required for the mounting operation can be reduced, and the manufacturing cost of the substrate 13 can be reduced.

[0121] In the first embodiment, the wafers 17 are arranged in the component supply unit 10, but the present invention is not limited to this. The component supply unit 10 may be a tray feeder, a stick feeder, a tape feeder, or the like.

[0122] Although the example in which the pickup head 7 picks up the components 2 from the component supply unit 10 has been described, the present invention is not limited to this. The mounting head unit 8 may pick up the components 2 directly from the wafer 17 and mount them on the substrate 13.

[0123] Although the first portion 56, 106, 206 is a single rectangular member in the above example, the present invention is not limited to this. A plurality of first portions 56, 106, 206 may be formed for each second portion 57, 107, 207. This allows the component 2 to be held more stably. Furthermore, depending on the shape of the component 2, the first portion 56, 106, 206 may have a circular or polygonal shape other than a rectangular shape.

[0124] Although the example has been described in which the entire outer periphery of the first portion 106, 206 of the holding member 105, 205 is formed inside the component 102, 202, the present invention is not limited to this. For example, the first portion 106 of the second holding member 105 may be formed inside the second component 102 only in the direction in which the contact prohibition region exists. The first portion 106 of the second holding member 105 may be formed inside the component 2 in only two directions (for example, only on the left and right sides of the paper in FIG. 7B ).

[0125] Although the example in which the holding member 5 is held to the mounting head 1 by vacuum suction has been described, the present invention is not limited to this. For example, the mounting head 1 may have a claw at its bottom end, and the claw may hold the second portion 57, 107, 207 of the holding member 5 to the mounting head 1. With this structure, the holding member 5 can remain attached to the mounting head 1 even when the vacuum pump 41 is turned off. Meanwhile, when the holding member 5 is held to the mounting head 1 by vacuum suction, automatic replacement of the holding member 5 becomes easy. Automatic replacement can shorten the mounting time and reduce the manufacturing cost of the substrate 13.

[0126] Although the controller 51 has been described as replacing the holding member 5 based on the presence or absence and range of the contact-prohibited area acquired, the present invention is not limited to this. For example, the holding member 5 may be replaced depending on the type of component 2 or in conjunction with the replacement of the wafer 17 that supplies the component 2.

[0127] Although the example has been described in which the position of the imaging unit 11 is adjusted with the second holding member 105 attached to the mounting head 1, the present invention is not limited to this. The control unit 51 may adjust the position of the imaging unit 11 before attaching the second holding member 105 to the mounting head 1. For example, an adjustment holding member having a recognition mark corresponding to the second holding member 105 may be attached to the mounting head 1 to adjust the imaging stage 11c, and then the second holding member 105 may be attached to the mounting head 1. Furthermore, the control unit 51 may move the imaging stage 11c to a predetermined position stored in the storage unit 31 depending on the type of holding member 5.

[0128] Although the example in which control unit 51 adjusts the position of imaging unit 11 has been described, the present invention is not limited to this. The thicknesses of first portions 56, 106, and 206 may be designed taking into account the difference in refractive index between them so that the focal positions of imaging elements 15a and 15b are constant. With such a structure, adjustment of the position of imaging unit 11 can be omitted.

[0129] In the above description, the mounting interval is the interval between components in close adjacent mounting, but the present invention is not limited to this. The mounting interval may be the interval between the component 2 and another object. For example, the mounting interval may be the interval between the component 2 and a protruding electrode or recognition mark formed on the substrate 13.

[0130] Although the example in which control unit 51 acquires minimum value L1 of the mounting interval between components 2 on board 13 has been described, the present invention is not limited to this. Each time a component is mounted, control unit 51 may acquire the mounting interval between the component 2 to be mounted and an adjacent component 2, and determine whether the acquired mounting interval is smaller than predetermined distance L0.

[0131] Although the example in which the component mounting apparatus 100 captures the images of the recognition marks 3a and 3b of the component 2 has been described, the present invention is not limited to this. For example, the component mounting apparatus 100 may capture images of recognition marks formed on the board 13 instead of or in addition to the recognition marks 3a and 3b of the component 2.

[0132] [Embodiment 2] A component mounting system 200 according to a second embodiment of the present disclosure will be described. In the second embodiment, the same or equivalent configurations as those in the first embodiment will be denoted by the same reference numerals. Also, in the second embodiment, descriptions that overlap with those in the first embodiment will be omitted.

[0133] FIG. 17 is a block diagram of a component mounting system 200 according to the second embodiment of the present disclosure.

[0134] The second embodiment differs from the first embodiment in that the second embodiment is a component mounting system 200 including a component mounting apparatus 101. More specifically, the component mounting system 200 has a storage unit 131 and a determination unit 132 outside the component mounting apparatus 101. In the second embodiment, the component mounting apparatus 101 is the same as the component mounting apparatus 100 of the first embodiment unless otherwise specified.

[0135] As shown in FIG. 17, the component mounting system 200 includes a component mounting apparatus 101 and a processing apparatus 150.

[0136] The component mounting apparatus 101 includes a mounting head unit 8, a control unit 112, and a first communication unit 110.

[0137] The first communication unit 110 receives, via the network, information about the components transmitted by the second communication unit 151. The first communication unit 110 includes a circuit that performs reception from the second communication unit 151 of the processing device 150 in accordance with a predetermined communication standard (e.g., LAN, Wi-Fi (registered trademark), Bluetooth (registered trademark)).

[0138] The processing device 150 includes a second communication unit 151, a storage unit 131, and a determination unit 132. The processing device 150 is a computer. For example, the processing device 150 is a server or a cloud.

[0139] The second communication unit 151 transmits the information determined by the determination unit 132 based on the information related to the component stored in the storage unit 131 to the first communication unit 110 via the network. The second communication unit 151 includes a circuit that executes transmission to the first communication unit 110 of the component mounting apparatus 101 in accordance with a predetermined communication standard (for example, LAN, Wi-Fi (registered trademark), Bluetooth (registered trademark)).

[0140] (operation) The determination unit 132 of the processing device 150 determines the holding member 5 that will hold the component 2 based on the information about the component 2 stored in the memory unit 131. The second communication unit 151 transmits the information about the holding member 5 to the first communication unit 110. Based on the information about the holding member 5 received by the first communication unit 110, the control unit 112 can replace the holding member 5 attached to the mounting head 1.

[0141] (effect) According to the component mounting system 200 according to the second embodiment, the following effects can be achieved.

[0142] As described above, the component mounting system 200 of this embodiment includes the component mounting apparatus 101 and the processing device 150 that communicates with the component mounting apparatus 101 via a network. The component mounting apparatus 101 includes a mounting head 1 that has a holding member 5 for holding a component 2 at its lower end and mounts the component 2 on a board 13, and a first communication unit 110. The mounting head 1 can selectively attach, as the holding member 5, a first holding member 55 having a holding surface 56a (first holding surface) that contacts the component 2, or a second holding member 105 having a holding surface 106a (second holding surface) that contacts the component 2. In a plan view seen from the mounting direction, the area of ​​the holding surface 56a is larger than the area of ​​the component 2, and the area of ​​the holding surface 106a is smaller than the area of ​​the component 2. The processing device 150 includes a memory unit 131, a determination unit 132, and a second communication unit 151. The memory unit 131 stores information about the component 2. The determination unit 132 determines whether to use the first holding member 55 or the second holding member 105 based on the information about the component 2. The second communication unit 151 transmits information about whether the first holding member 55 or the second holding member 105 is to be used to the first communication unit 110 via the network.

[0143] With this configuration, the external processing device 150 allows the control unit 112 to attach an appropriate holding member 5 to the mounting head 1 in accordance with information about the component 2. Therefore, the mounting head 1 can stably hold the component 2.

[0144] A component mounting device in a first aspect includes a mounting head having a holding member at its lower end for holding a component and for mounting the component on a board, and a memory unit for storing information about the component, wherein the mounting head is capable of selectively attaching either a first holding member having a first holding surface that contacts the component or a second holding member having a second holding surface that contacts the component, wherein, in a plan view seen from the mounting direction, the area of ​​the first holding surface is larger than the area of ​​the component and the area of ​​the second holding surface is smaller than the area of ​​the component, and further includes a judgment unit that judges whether to use the first holding member or the second holding member based on the information about the component.

[0145] As a component mounting device in a second aspect, in the component mounting device in the first aspect, the information about the component includes information about a contact-prohibited area where an object is provided on the upper surface of the component, and if no contact-prohibited area exists, the judgment unit judges to attach a first holding member to the mounting head, and if a contact-prohibited area exists, the judgment unit judges to attach a second holding member to the mounting head.

[0146] As a component mounting device in a third aspect, in the component mounting device in the first or second aspect, the information about the components includes information about the mounting spacing between components mounted on the board, and if the mounting spacing is greater than a predetermined distance, the judgment unit judges to attach a first holding member to the mounting head, and if the mounting spacing is smaller than the predetermined distance, the judgment unit judges to attach a second holding member to the mounting head.

[0147] As a component mounting device in a fourth aspect, in the component mounting device in any of the first to third aspects, the second holding member has a first part that constitutes a second holding surface and a second part that is provided above the first part and has a larger area than the first part, the information about the component includes information about the height of an object provided on the upper surface of the component, and the thickness of the first part of the second holding member is greater than the height of the object.

[0148] As a component mounting device in a fifth aspect, in the component mounting device in the fourth aspect, the first holding member has a first part and a second part formed integrally, and the second holding member has a first part and a second part formed separately.

[0149] As the component mounting apparatus of the sixth aspect, in the component mounting apparatus of the fourth or fifth aspect, the second part of the first holding member and the second part of the second holding member have a common shape.

[0150] As a component mounting apparatus according to a seventh aspect, in the component mounting apparatus according to any one of the first to sixth aspects, a plurality of second holding members are provided, and the areas of the second holding surfaces of the plurality of second holding members are different.

[0151] As a component mounting device in an eighth aspect, in the component mounting device in any of the first to seventh aspects, it further has a stock section that stores the first holding member or the second holding member, and a control section that controls the mounting head so as to exchange one of the first holding member and the second holding member attached to the mounting head with the other stored in the stock section.

[0152] A component mounting system in a ninth aspect includes a component mounting device and a processing device that communicates with the component mounting device via a network. The component mounting device has a mounting head that has a holding member at its lower end that holds the component and mounts the component on a board, and a first communication unit. The mounting head can selectively attach either a first holding member having a first holding surface that contacts the component or a second holding member having a second holding surface that contacts the component. In a planar view seen from the mounting direction, the area of ​​the first holding surface is larger than the area of ​​the component, and the area of ​​the second holding surface is smaller than the area of ​​the component. The processing device has a memory unit that stores information about the component, a judgment unit that judges whether to use either the first holding member or the second holding member based on the information about the component, and a second communication unit that transmits information about either the first holding member or the second holding member to be used to the first communication unit via the network.

[0153] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various changes and modifications will be apparent to those skilled in the art, and such changes and modifications are to be understood as included within the scope of the present invention as defined by the appended claims unless they depart therefrom. [Industrial Applicability]

[0154] The component mounting device of the present disclosure has the effect of mounting components at any specified position on a board, and is particularly useful as a component mounting device used when mounting components such as high-speed, large-capacity memories, application processors, and CPUs. [Explanation of symbols]

[0155] 1 Mounting head 1a Head body 3a Recognition mark 3b Recognition mark 5. Retaining member 8 Mounting head unit 11 Imaging unit 11a First imaging unit 11b Second imaging unit 13 PCB 40 Head lifting mechanism 51 Control section 50 Head movement mechanism 55 first holding member 56 Part 1 56a Holding surface 57 Part 2 61 1st reflection optical system 62 Second reflective optical system 63 Third reflective optical system 65 First imaging optical path 66 Second imaging optical path 105 second holding member 106 Part 1 106a Holding surface 107 Part 2 205 third holding member 206 Part 1 206a Holding surface 207 Part 2

Claims

1. a mounting head having a holding member at a lower end for holding a component and for mounting the component onto a board; a storage unit that stores information about the part, a first holding member having a first holding surface that contacts the component, or a second holding member having a second holding surface that contacts the component, can be selectively attached to the mounting head as the holding member; In a plan view seen from the mounting direction, an area of ​​the first holding surface is larger than an area of ​​the component, and an area of ​​the second holding surface is smaller than an area of ​​the component, The component mounting apparatus further comprises a determination unit that determines whether to use the first holding member or the second holding member based on information related to the component.

2. the information about the component includes information about a contact-prohibited area where an object is provided on an upper surface of the component; When the contact forbidden area does not exist, the determination unit determines that the first holding member is to be attached to the mounting head, The component mounting device according to claim 1 , wherein, when the contact-prohibited area exists, the determining unit determines that the second holding member should be attached to the mounting head.

3. the information about the components includes information about mounting intervals between the components mounted on the board; When the mounting interval is greater than a predetermined distance, the determination unit determines that the first holding member is to be attached to the mounting head; The component mounting device according to claim 1 , wherein the determining unit determines to attach the second holding member to the mounting head when the mounting interval is smaller than a predetermined distance.

4. the second holding member has a first portion that constitutes the second holding surface, and a second portion that is provided above the first portion and has a larger area than the first portion, the information about the component includes information about a height of an object provided on an upper surface of the component; The component mounting device according to claim 1 , wherein the thickness of the first portion of the second holding member is greater than the height of the object.

5. the first holding member is integrally formed with a first portion and a second portion, The component mounting device according to claim 4 , wherein the second holding member has the first portion and the second portion formed separately.

6. The component mounting device according to claim 4 , wherein the second portion of the first holding member and the second portion of the second holding member have a common shape.

7. The second holding member is provided in plurality, The component mounting device according to claim 1 , wherein the second holding surfaces of the plurality of second holding members have different areas.

8. a stock portion that accommodates the first holding member or the second holding member; 2. The component mounting device according to claim 1, further comprising: a control unit that controls the mounting head so as to exchange one of the first holding member and the second holding member attached to the mounting head with the other held in the stock unit.

9. a component mounting device; a processing device that communicates with the component mounting device via a network; Equipped with The component mounting device a mounting head having a holding member at a lower end for holding a component and for mounting the component on a board; and a first communication unit; a first holding member having a first holding surface that contacts the component, or a second holding member having a second holding surface that contacts the component, can be selectively attached to the mounting head as the holding member; In a plan view seen from the mounting direction, an area of ​​the first holding surface is larger than an area of ​​the component, and an area of ​​the second holding surface is smaller than an area of ​​the component, The processing device includes: a storage unit that stores information about the part; a determination unit that determines whether to use the first holding member or the second holding member based on information about the component; a second communication unit that transmits information about either the first holding member or the second holding member to be used to the first communication unit via the network; A component mounting system having the above structure.

Images