Multi-pattern tooling plate

Abstract

A heated chuck plate and an apparatus using the same, wherein the heated chuck or tooling plate comprises a body including an exterior surface and configured to secure an electronics assembly near the exterior surface, and an air channel network configured to selectively direct heated air to a plurality of predetermined locations on the electronics assembly, the air channel network comprising a first heating path configured to direct the heated air through the exterior surface to a first location of the plurality of predetermined locations, and a second heating path configured to direct the heated air through the exterior surface to a second location of the plurality of predetermined locations.

Description

[Technical Field]

[0001] Background to the disclosure 1. Field of Disclosure The present disclosure relates to a heated chuck plate for a solder dispenser. [Background technology]

[0002] 2. Description of Related Technology Several types of dispensing systems exist that are used to dispense precise amounts of liquid or paste for a variety of applications. One such application is the assembly of integrated circuit chips and other electronic components onto circuit boards. In this application, an automated dispensing system is used to dispense dots of liquid epoxy resin, or solder paste, or some other related material onto the circuit board. Automated dispensing systems are also used to dispense lines of underfill material and encapsulant that may be used to mechanically secure components to the circuit board. An exemplary dispensing system mentioned above is manufactured and distributed by ITW EAE, Inc., of Glenview, Illinois, under the trademark CAMALOT™.

[0003] In typical dispensing systems, a heated chuck is used to hold the electronic board in place as it is heated. One problem associated with heated chucks is that they have a surface with holes designed to direct hot air in one specific heating pattern over the electronic board, requiring the chuck to be replaced for each different board requiring a different heating pattern. One solution is to apply infrared heating to the entire board, thereby covering all possible heating patterns. However, this method is inefficient and unnecessarily heats areas of the board that do not currently require heating, thereby potentially altering or even damaging previous soldering or other operations performed on the board.

[0004] Another problem is that the chucks get so hot that swapping them out for different heating patterns during production requires either handling very hot equipment, which is potentially dangerous to the people working there, or waiting a period for the top plate to cool before swapping, adding costly downtime between dispense cycles. Summary of the Invention

[0005] What is needed is a heated chuck plate that can be easily modified to switch between different heating patterns, is safe to use, and does not add significant time to manufacturing processes that use dispensing systems.

[0006] Disclosure Overview One example feature is a heated chuck plate that is reconfigurable for two or more heating patterns, is safe to use, and does not add significant time to the process of manufacturing electronic assemblies in a dispensing system.

[0007] According to at least one embodiment, an apparatus for depositing assembly material onto an electronic substrate is provided, the apparatus comprising: a frame; an assembly applicator coupled to the frame and configured to apply the assembly material onto the electronic substrate; and a support assembly coupled to the frame and configured to support the electronic substrate, the support assembly comprising a heated chuck plate, the heated chuck plate comprising a body including an exterior surface and configured to secure the electronic substrate near the exterior surface; and an air channel network configured to selectively direct heated air to a plurality of predetermined locations on the electronic substrate, the air channel network comprising a first heating path configured to direct the heated air through the exterior surface to a first location of the plurality of predetermined locations and a second heating path configured to direct the heated air through the exterior surface to a second location of the plurality of predetermined locations.

[0008] In one example, the air channel network includes a plurality of holes in the exterior surface of the body of the heated chuck plate, the first heating path includes a first set of the plurality of holes, and the second heating path includes a second set of the plurality of holes.

[0009] In another example, the first set of holes includes a first group of holes positioned to direct heated air toward a first one of the plurality of predetermined locations on the electronic board, and the second set of holes includes a second group of holes positioned to direct heated air toward a second one of the plurality of predetermined locations on the electronic board.

[0010] In one example, the first set of holes includes a third group of holes positioned to direct heated air toward a third location of the plurality of predetermined locations on the electronic board, and the second set of holes includes a fourth group of holes positioned to direct heated air toward a fourth location of the plurality of predetermined locations on the electronic board.

[0011] In another example, the first set of holes includes a fifth group of holes positioned to direct heated air toward a fifth location of the plurality of predetermined locations on the electronic board, and the second set of holes includes a sixth group of holes positioned to direct heated air toward a sixth location of the plurality of predetermined locations on the electronic board.

[0012] In one example, the air channel network further includes at least one port configured to selectively allow heated air to enter one of the first heating path and the second heating path.

[0013] In another example, the at least one port includes a first port configured to selectively allow heated air to enter the first heating path and a second port configured to selectively allow heated air to enter the second heating path.

[0014] In one example, the first port is configured to receive a first set screw that, when tightened, prevents heated air from traveling through the first heating path and, when loosened, allows heated air to travel through the first heating path; and the second port is configured to receive a second set screw that, when tightened, prevents heated air from traveling through the second heating path and, when loosened, allows heated air to travel through the second heating path.

[0015] In another example, the air channel network further includes a third heating path configured to receive heated air regardless of the position of the first set screw in the first port and regardless of the position of the second set screw in the second port.

[0016] In one example, the apparatus further comprises a plurality of retention members configured to releasably secure the electronic substrate to the heated chuck plate.

[0017] In another example, the apparatus further comprises a first mask including at least one hole positioned to direct heated air from the first heating path toward at least one of a plurality of predetermined locations on the electronic substrate.

[0018] In one example, the first mask is configured to block heated air from directly impinging on the electronic substrate except for at least one hole.

[0019] In another example, the at least one hole includes a first hole positioned in the first mask to direct heated air from the first heating path to a first location of a plurality of predetermined locations on the electronic board, and a second hole positioned in the first mask to direct heated air from the second heating path to a second location of the one or more predetermined locations on the electronic board.

[0020] In one example, the first mask includes a gripping portion for removing the first mask from the exterior surface, the gripping portion extending above an edge of the exterior surface.

[0021] In another example, the apparatus further comprises a second mask including at least one hole positioned to direct heated air from the second heating path toward at least one of a plurality of predetermined locations on the electronic substrate.

[0022] In one example, the first mask is constructed from a material including one of metal, rubber, silicone, or mylar.

[0023] In another example, the apparatus further comprises a valve configured to selectively direct the heated air to one of the first heating path and the second heating path.

[0024] In one example, the valve is electronically controlled by an external controller, pneumatically controlled by an external controller, or mechanically controlled by one of a set screw, knob, and switch.

[0025] According to at least one embodiment, there is provided a heated chuck plate comprising: a body including an exterior surface and configured to secure an electronics assembly near the exterior surface; and an air channel network configured to selectively direct heated air to a plurality of predetermined locations on the electronics assembly, the air channel network comprising a first heating path configured to direct the heated air through the exterior surface to a first location of the plurality of predetermined locations; and a second heating path configured to direct the heated air through the exterior surface to a second location of the plurality of predetermined locations.

[0026] In one example, the air channel network includes a plurality of holes in the exterior surface of the body of the heated chuck plate, the first heating path includes a first set of the plurality of holes, and the second heating path includes a second set of the plurality of holes.

[0027] In another example, the first set of holes includes a first group of holes positioned to direct heated air toward a first one of the plurality of predetermined locations on the electronic device assembly, and the second set of holes includes a second group of holes positioned to direct heated air toward a second one of the plurality of predetermined locations on the electronic device assembly.

[0028] In one example, the first set of holes includes a third group of holes positioned to direct heated air toward a third location of the plurality of predetermined locations on the electronic device assembly, and the second set of holes includes a fourth group of holes positioned to direct heated air toward a fourth location of the plurality of predetermined locations on the electronic device assembly.

[0029] In another example, the first set of holes includes a fifth group of holes positioned to direct heated air toward a fifth location of the plurality of predetermined locations on the electronic device assembly, and the second set of holes includes a sixth group of holes positioned to direct heated air toward a sixth location of the plurality of predetermined locations on the electronic device assembly.

[0030] In one example, the air channel network further includes at least one port configured to selectively allow heated air to enter one of the first heating path and the second heating path.

[0031] In another example, the at least one port includes a first port configured to selectively allow heated air to enter the first heating path and a second port configured to selectively allow heated air to enter the second heating path.

[0032] In one example, the first port is configured to receive a first set screw that, when tightened, prevents heated air from traveling through the first heating path and, when loosened, allows heated air to travel through the first heating path; and the second port is configured to receive a second set screw that, when tightened, prevents heated air from traveling through the second heating path and, when loosened, allows heated air to travel through the second heating path.

[0033] In another example, the air channel network further includes a third heating path configured to receive heated air regardless of the position of the first set screw in the first port and regardless of the position of the second set screw in the second port.

[0034] In one example, the heated chuck plate further comprises a valve configured to selectively direct heated air to one of the first heating path and the second heating path.

[0035] In another example, the valve is electronically controlled by an external controller, pneumatically controlled by an external controller, or mechanically controlled by one of a set screw, a knob, and a switch.

[0036] BRIEF DESCRIPTION OF THE DRAWINGS Various aspects of at least one embodiment are discussed below with reference to the accompanying drawings, which are not intended to be drawn to scale. The drawings are included to provide illustration and a further understanding of the various aspects and embodiments, and are incorporated into and constitute a part of this specification, but are not intended as a definition of the limitations of any particular embodiment. The drawings, together with the remainder of the specification, serve to explain the principles and operation of the described and claimed aspects and embodiments. In the drawings, each identical or nearly identical component shown in various figures is represented by a like reference numeral. For clarity, not every component is labeled in every figure. [Brief explanation of the drawings]

[0037] [Figure 1] FIG. 1 is a block diagram of a dispensing system and an external air source according to aspects described herein. [Figure 2] 1 is a schematic diagram of a dispensing system according to aspects described herein. [Figure 3] FIG. 1 is an exploded perspective view of a chuck with a heated chuck plate according to aspects described herein. [Figure 4A] FIG. 1B is a top view of an air channel network within a heated chuck plate according to aspects described herein. [Figure 4B] FIG. 1B is a top view of an air channel network within a heated chuck plate according to aspects described herein. [Figure 5A] FIG. 1B is a top view of an air channel network within a heated chuck plate according to aspects described herein. [Figure 5B] FIG. 1B is a top view of an air channel network within a heated chuck plate according to aspects described herein. [Figure 6] FIG. 1 is a plan view of a mask for a heated chuck plate according to aspects described herein. [Figure 7] FIG. 1 is a plan view of a mask for a heated chuck plate according to aspects described herein. [Figure 8]FIG. 1 is a perspective view of a dispensing system with packaging removed to disclose a preheat station, a dispensing station, and a postheat station. DETAILED DESCRIPTION OF THE INVENTION

[0038] Detailed Description of Disclosure By way of example only and not limitation, the present disclosure will now be described in detail with reference to the accompanying drawings. The present disclosure is not limited in its application to the details of construction and the arrangement of components set forth in the following description or illustrated in the drawings. The principles described in this disclosure can be used in other embodiments and can be practiced or carried out in various ways. Furthermore, the phraseology and terminology used in this disclosure are for descriptive purposes and should not be considered limiting. Any reference to system and method examples, embodiments, components, elements, or operations referred to in the singular in this disclosure can also encompass embodiments that include the plural, and any reference to any embodiment, component, element, or operation in this disclosure as the plural can also encompass embodiments that include only the singular. References in the singular or plural are not intended to limit the systems or methods, their components, operations, or elements disclosed in this disclosure. The use of the terms "including," "comprising," "having," "containing," "with," and variations thereof in this disclosure is meant to encompass the items listed thereafter, as well as equivalents thereof and additional items. References to "or / or" may be construed as inclusive such that any term described with "or / or" may refer to any of one, more than one, and all of the described terms. Additionally, in the event of inconsistencies in the usage of terms between this application document and documents incorporated by reference, the usage of the term in the documents incorporated by reference is supplementary to the usage in this application document, and in the event of an inconsistency, the usage of the term in this application document will control.

[0039] The present disclosure relates to a heated chuck plate for a dispensing system, and more particularly to a reconfigurable heated chuck plate that is part of a heated chuck for a dispensing system. A chuck is a special type of clamp used to hold radially symmetric objects. For example, in printed circuit board manufacturing, chucks are used to hold electronic boards in place while they are heated before solder or other materials are applied.

[0040] During the manufacture of electronic assemblies and electronic substrates, such as printed circuit boards, it is often necessary to apply heat, sometimes in excess of 150°C, to locations on the substrate before solder paste or other materials are dispensed onto the areas. Heating operations may occur before, during, and after each dispense cycle. For example, some locations may need to be heated before underfill is dispensed. "Non-contact" convection heating is used to direct heated air at the substrate, which is typically concentrated in the areas most needed. Estimated heating can also be used, but results in heating all areas of the substrate, which is unnecessary and potentially damaging.

[0041] Certain manufacturing processes and applications must be able to accommodate electronic boards with different arrangements / layouts of components (e.g., surface-mount electrical components, through-hole electrical components, capacitors, resistors, chip packages, BGA chips, etc.). Furthermore, different electronic boards, or even the same electronic board, may require heating in different locations or zones at different times. All this variability reduces the efficiency of the dispense cycle because a different chuck plate (also called a tooling plate or top plate) must be designed and built for each board and heating pattern. It also reduces efficiency because the chuck plate can become too hot to safely handle and therefore must be replaced while hot or allowed to cool. For rapid production changeovers, neither repeated redesigns nor downtime for cooling are desirable.

[0042] Embodiments of the present disclosure include a heated chuck plate for a dispensing system that is reconfigurable for two or more heating patterns, is safe to use, and does not add significant time to the process of manufacturing electronic boards in the dispensing system. While a dispensing system is described, the concepts described in this disclosure can be applied to other types of printed circuit board fabrication equipment, such as stencil printers. Furthermore, while described in this disclosure as being included in a dispensing system, it is contemplated that the embodiments are applicable to devices that do not dispense solder paste or other similar materials. For example, the reconfigurable chuck plate described in this disclosure may be used in a device that only requires heating a component within the chuck as part of another process.

[0043] By implementing the principles of the present disclosure, a deposition system can easily switch between dispense cycles for different heating patterns on electronic substrates held within a heated chuck without posing safety risks to operators and without adding significant time to the process of manufacturing electronic assembly in the dispense system.

[0044] 1 shows a configuration of a dispensing system 1 that includes a heated chuck plate 3. The heated chuck plate 3 includes an air channel network 9 that directs heated air from an external air source 7 through holes in the exterior surface of the heated chuck plate 3 onto one or more predetermined locations on an electronics board 12. The electronics board 12, in one particular example, is a printed circuit board.

[0045] One or more ports 11 are provided in the heated chuck plate 3 to allow or prevent heated air from reaching one or more locations on the substrate 12. The ports 11, in certain instances, are configured to receive set screws that can be loosened or tightened by an operator using an appropriate tool, such as a hex wrench, screwdriver, or the like. By adding small, specific contact points engageable by an operator using a tool to obtain a safe standoff distance between the heated chuck plate 3 and the operator's body, the operator can safely and easily modify the air channel network 9 to route heated air through one or more corresponding locations (including holes) on the surface of the chuck plate 3 to one or more heating paths toward one or more locations on the electronic substrate 12.

[0046] For illustrative purposes, embodiments of the present disclosure will now be described with reference to a dispensing system generally designated 10 according to one embodiment of the present disclosure. Referring to FIG. 2 , dispensing system 10 is used to dispense a viscous material (e.g., adhesive, encapsulant, epoxy, solder paste, underfill material, etc.) or a semi-viscous material (e.g., solder flux, etc.) onto an electronic substrate 12. Electronic substrate 12, in certain examples, is a printed circuit board (“PCB”) or a semiconductor wafer. Dispensing system 10 may alternatively be used for applying automotive gasket material, or in certain medical fields, or in other applications, such as applying conductive ink. It should be understood that references to viscous or semi-viscous materials, as used in this disclosure, are intended to be exemplary and non-limiting. Dispensing system 10 includes one or more dispensing units, e.g., a first dispensing unit and a second dispensing unit generally designated 14 and 16, respectively, and a controller 18 that controls operation of the dispensing system. It should be understood that the dispensing units may also be referred to as dispensing pumps and / or dispensing heads in this disclosure. Although two dispensing units are shown, it should be understood that one dispensing unit or more than two dispensing units may be utilized.

[0047] The dispensing system 10 may also include a frame 20 having a base or support 22 that supports the electronics board 12, a dispensing unit gantry 24 movably coupled to the frame 20 for supporting and moving the dispensing units 14, 16, and a weight measuring device or scale 26 that weighs the dispensed amount of viscous material and provides weight data to the controller 18, e.g., as part of a calibration procedure.

[0048] In certain examples, the support 22 is part of a support assembly that includes a heated chuck plate 3. In some examples, the dispensing units 14, 16 are part of an assembly applicator coupled to the frame 20, the assembly applicator configured to apply assembly material to or on the electronic substrate 12.

[0049] Other transport mechanisms, such as a conveyor system (not shown) or walking beam, may be used in dispensing system 10 to control the loading and unloading of electronic boards onto and from the dispensing system. Gantry 24 can be moved using a motor under the control of controller 18 to position dispensing units 14, 16 at predetermined locations above the electronic boards. Dispensing system 10 can include a display unit 28 connected to controller 18 to display various information to an operator. An optional second controller may also be provided to control the dispensing units. Each dispensing unit 14, 16 can also be configured to use a Z-axis sensor to detect the height at which the dispensing unit is positioned above electronic board 12 or above features mounted on the electronic board. The Z-axis sensor is coupled to controller 18 and relays information obtained by the sensor to the controller.

[0050] Before performing a dispense operation, as described above, the electronic board, e.g., a printed circuit board, must be aligned or otherwise positioned relative to the dispense unit of the dispense system. The dispense system further includes a vision system 30. In one embodiment, the vision system 30 is coupled to a vision system gantry 32, which is movably coupled to the frame 20 for supporting and moving the vision system. In another embodiment, the vision system 30 may be mounted on the dispense unit gantry 24. As described above, the vision system 30 is utilized to verify the location of landmarks or components, known as fiducials, on the electronic board. Once located, the controller can be programmed to manipulate the movement of one or more of the dispense units 14, 16 to dispense material onto the electronic board. In certain embodiments, the dispense units 14, 16 dispense material onto the electronic board once the electronic board is secured on the heated chuck plate 3 or any other heated chuck plate described herein.

[0051] In one embodiment, the dispensing operations are controlled by a controller 18, which may include a computer system configured to control the material dispensing units. In another embodiment, the controller 18 may be operated by an operator. The controller 18 is configured to manipulate the movement of the vision system gantry 32 to move the vision system to acquire one or more images of the electronic board 12. The controller 18 is further configured to manipulate the movement of the dispense unit gantry 24 to move the dispense units 14, 16 to perform the dispense operations.

[0052] FIG. 3 shows an exploded view of a chuck, generally designated 38, including a heated chuck plate having a body generally designated 40, a first retention member 54, and a second retention member 56. The retention members 54, 56, along with the body of the chuck 38, are arranged to move toward and away from an electronic substrate (e.g., substrate 12) to secure the electronic substrate in place and position the substrate on or above the heated chuck plate's upper exterior surface 42. The retention members 54, 56 collectively hold the electronic substrate in place on or above the exterior surface 42, with the retention members engaging opposing edges of the electronic substrate. When we say that the electronic substrate is "on" the exterior surface 42, we mean that the substrate and surface 42 are in direct physical contact. When we say that the electronic substrate is "near" or "above" the exterior surface, we mean that the substrate and surface 42 are in close proximity such that a majority of the air exiting holes 44 impinges on a corresponding location or locations on the substrate. In one example, the distance between surface 42 and the substrate is between a few millimeters and 25 mm, due to clearance of components below the substrate.

[0053] First and second retaining members 54 and 56 are secured to heated chuck plate 42 by a plurality of screws, each indicated at 55. To heat a printed circuit board, in one example, the printed circuit board (PCB) is held in place between the upper clamp of the conveyor rail and the conveyor belt. Simultaneously, retaining members 54, 56 and body 40 of chuck 38 move upward toward the PCB, which is then clamped between the upper clamp(s) of the conveyor rail and first and second retaining members 54, 56. After clamping, an air gap remains between exterior surface 42 and the PCB.

[0054] The outer surface 42 of the heated chuck plate includes several regions having a plurality of holes, each region designated 44, and the regions are positioned in place so that an air channel network 62 within the heated chuck plate directs hot air through the holes 44 and onto an electronic substrate clamped in place.

[0055] 4A and 4B , to modify the heating pattern provided by the regions or sets of holes 44 in the exterior surface 42, a first port 46 and a second port 48 are formed in the exterior surface 42 to connect with the air channel network 62. The ports 46, 48 may be threaded to receive a first set screw 50 and a second set screw 52, ​​respectively. In certain examples, loosening the first set screw 50 allows hot air passing through the air channel network 62 (described in more detail below) to be routed into a first heating path 70 (described in more detail below) to one set of holes 44, and loosening the second set screw 52 allows hot air passing through the air channel network 62 to be routed into a second heating path 72 (described in more detail below) to another set of holes 44. Conversely, in certain examples, tightening the first set screw 50 prevents hot air passing through the air channel network from being directed to one set of holes 44 in the first heating passage, and tightening the second set screw 52 prevents hot air passing through the air channel network from being directed to one set of holes 44 in the second heating passage 72. Loosening or tightening one of the set screws 50, 52 does not require loosening or tightening the other set screw. In certain examples, the air channel network includes a third heating passage 74 (described in more detail below) that leads to a third set of holes 44 that receives heated air, regardless of the position of the set screws 50, 52 in their respective ports 46, 48.

[0056] FIG. 4A illustrates an air channel network 62 within the body 40 of the heated chuck plate. The air channel network 62 includes a first heating path 70, a second heating path 72, and a third heating path 74. When the air channel network 62 receives heated air, the air is routed through one or more of the first heating path 70, the second heating path 72, and the third heating path 74. As shown in FIG. 4A , in the illustrated embodiment, heated air passing through the air channel network 62 always enters the third heating path 74 (and thereby the set of holes 86 included in the third heating path) because the third heating path 74 is not blocked by the set screws 50, 52. However, it is understood that embodiments include heated chuck plates having fewer or more than three heating paths, as well as air channel networks that do not include any heating paths that always pass heated air through holes in the exterior surface of the heated chuck plate.

[0057] The air channel network 62 directs heated air to a set of holes corresponding to multiple locations on the electronic substrate clamped within the heated chuck 38. The first heating path 70 includes a first set of holes, which includes a first group of holes 64, a second group of holes 66, and a third group of holes 68. The first group of holes 64 corresponds to (i.e., directs air to) a first location on the electronic substrate clamped within the heated chuck 38. The second group of holes 66 corresponds to a second location on the electronic substrate. Similarly, the third group of holes 68 corresponds to a third location on the electronic substrate clamped within the heated chuck 38. Tightening the first set screw 50 prevents the heated air from reaching any of the first group of holes 64, the second group of holes 66, and the third group of holes 68. By loosening the first set screw 50, heated air is directed to each of the first group of holes 64, the second group of holes 66, and the third group of holes 68, as shown in Figure 4A. It is understood that a "set" may include only one group, and a "group" may include only one hole.

[0058] A second set of holes is included in second heating path 70, and the second set includes fourth group of holes 76, fifth group of holes 78, sixth group of holes 80, and seventh group of holes 82. As described above, each group corresponds to a different location on the electronic substrate clamped within heated chuck 38. By tightening second set screw 52, ​​heated air is prevented from reaching any of fourth group of holes 76, fifth group of holes 78, sixth group of holes 80, and seventh group of holes 82. By loosening second set screw 52, ​​heated air is directed to each of fourth group of holes 76, fifth group of holes 78, sixth group of holes 80, and seventh group of holes 82, as shown in FIG. 4B . It should be understood that any reasonable number of heating paths (i.e., the number that can be practically manufactured and / or fit within the heated chuck plate) as well as any reasonable number of hole groups can be included within a given heating path.

[0059] 5A and 5B show a heating chuck plate, generally designated 88, that differs from heating chuck plate 40 at least in the manner in which heated air is selectively directed to first heating path 70 and second heating path 72. Instead of ports 46, 48 and set screws 50, 52 used in heating chuck plate 40, heating chuck plate 80 includes a valve 90. In a first configuration of valve 90, as shown in FIG. 5A, heated air is prevented from reaching second heating path 72. In a second configuration of valve 90, as shown in FIG. 5B, heated air is prevented from reaching first heating path 70. In certain examples, valve 90 is electronically controlled by an external controller, such as controller 18, such that valve 90 includes a motor that receives a control signal to switch between the first and second configurations. In another example, the valve 90 is pneumatically controlled by an external controller to assume a first configuration in response to a first pressure applied to the valve 90 and a second configuration in response to a second pressure different from the first pressure. In another example, the valve is mechanically controlled such that one or more set screws, knobs, switches, or other mechanical actuators cause the valve to be in one of two configurations.

[0060] 6 and 7, as an alternative to, or in addition to, port 11 (FIG. 1) and valve 90 (FIGS. 5A and 5B), a first mask 87 is provided as shown in FIG. 6, and a second mask 92 is provided as shown in FIG. 7. First mask 87 and second mask 92 are constructed from materials including one of metal, rubber, silicone, or Mylar. It is understood that masks 87, 92 described in the present disclosure are not limited to these materials and may be made from any reasonable material capable of withstanding temperatures of approximately 150° C. or temperatures typically reached in solder dispensing applications.

[0061] First mask 87 includes first hole 94, second hole 96, and third hole 98, which correspond to first group of holes 64, second group of holes 66, and third group of holes 68, respectively. It is understood that instead of a single, standalone hole such as hole 94, masks 87, 92 can include groups of holes for each location on the electronic substrate. The holes in first mask 87 may have a one-to-one correspondence with the groups of holes in Figures 4A-5B, or they may differ.

[0062] The second mask 92 includes a fourth hole 106, a fifth hole 108, a sixth hole 110, and a seventh hole 112, which correspond to the fourth group of holes 76, the fifth group of holes 78, the sixth group of holes 80, and the seventh group of holes 82, respectively. The holes in the second mask 92 may have a one-to-one correspondence with the hole groups in Figures 4A-5B, or they may differ.

[0063] A first mask 87 is placed on the exterior surface 42 to restrict the heated air from reaching the electronic substrate via the first heating path 70. A second mask 92 is placed on the exterior surface 42 to restrict the heated air from reaching the electronic substrate via the second heating path 72.

[0064] To easily grip the masks 87, 92 and avoid getting too close to the heated chuck plate 42, a gripping portion 89 is included on the first mask 87 and a gripping portion 93 is included on the second mask 92. The gripping portions 89, 93 of the masks 87, 92 extend above the edges of the exterior surface 42, making it an easy gesture for an operator's fingers to grip the masks 87, 92. The gripping portions 89, 93 of the masks 87, 92 may overhang any suitable edge of the surface 42.

[0065] According to certain embodiments, the first mask 87 and / or the second mask 92 are used with a heating chuck plate that does not have ports or set screws. In such embodiments, an air channel network provides heated air to each set of hole groups, and the specific sets that need to be blocked are therefore blocked using the appropriate mask. For example, the heating chuck plate is identical to the heating chuck plate 40, but the ports 46, 48 and set screws 50, 52 are absent, thereby connecting all heating paths 70, 72, 74 without obstruction. To select the first heating path 70, the operator places the second mask 92 on the exterior surface 42. Next, to select the second heating path 72 and prevent the first heating path 70 from heating the electronic substrate, the operator grasps the gripper 89 with his or her fingers and replaces the second mask 92 with the first mask 87.

[0066] The total thickness of the first mask 87 and the second mask 92 is approximately 3 mm. In some examples, "approximately 3 mm" is equal to 3 mm ± 1 mm. It is understood that the thickness of the masks 87, 92 may vary depending on different design parameters, such as the temperature of the heated air, the duration for which the electronic substrate is heated, and the particular material(s) chosen to construct the masks 87, 92.

[0067] It will be appreciated that in applications where infrared heat is used to heat the entire surface of an electronic board, masks 87, 92 may be configured to block the infrared heat from reaching locations on the board in a manner similar to the blocking of heated air described above.

[0068] Referring to FIG. 8 , a dispensing system is generally designated 200. As shown, dispensing system 200 includes a dispensing station generally designated 202, a pre-heating station generally designated 204 located upstream and before the dispensing station, and a post-heating station generally designated 206 located downstream and after the dispensing station. Pre-heating station 204 defines a pre-heating zone, dispensing station 202 defines a dispensing zone, and post-heating station 206 defines a post-heating zone of dispensing system 200. A conveyor 208 is provided to move electronic substrates, such as substrate 12, from pre-heating station 204 to dispensing station 202 and then to post-heating station 206 (from left to right in FIG. 8 ). As shown, conveyor 208 includes two lanes 208A, 208B to allow substrates to enter the dispensing station more efficiently and at higher speeds.

[0069] Pre-heat station 204 is configured to heat the electronic substrate to a temperature acceptable for dispensing at the dispensing station. Pre-heat station 204 can be configured to increase the temperature of the electronic substrate by a range of 20°C to 200°C. Post-heat station 206 is configured to reduce the temperature of the electronic substrate before it is sent downstream from dispensing system 200 along another processing station. Similar to pre-heat station 204, the post-heat station can be configured to reduce the temperature of the electronic substrate by a range of 20°C to 200°C.

[0070] In certain embodiments, one or more of pre-heat station 204, dispense station 202, and post-heat station 206 are configured to use the heated chuck plates 40, 88 described above.

[0071] In one embodiment, pre-heating station 204 and post-heating station 206 can be part of dispensing system 200 that includes dispensing station 202. In another embodiment, dispensing system 200 can be configured to include only dispensing station 202, and pre-heating station 204 and / or post-heating station 206 can be separate units assembled with the dispensing system, with conveyor 208 extending through all three stations.

[0072] For each process zone, the operator selects the target temperature and tolerance range that the product must reach to be considered "ready." "Ready" can mean that the product can move to the next conveyor zone, or, if in a dispense zone, "ready" for the dispense process to begin. Another objective is to keep the substrate in a "ready" state, so when at a given temperature, the machine automatically adjusts heat settings to keep the product within the desired tolerance range.

[0073] Embodiments of the present disclosure include various heated chuck plates, as well as systems and devices comprising the same. While the illustrated and described embodiments include specific examples of heated chuck plates having specific numbers and arrangements of heating channels, holes, etc., the scope of the disclosed subject matter is not limited to such arrangements. For example, as noted above, the heated chuck plates disclosed in the present disclosure can be applied to other types of equipment, such as stencil printers. Thus, reference to an "apparatus" configured to deposit assembly material on an electronic substrate is intended to include dispensers and stencil printers.

[0074] Having thus described several aspects of at least one embodiment of this disclosure, it should be understood that various alterations, modifications, and improvements will readily occur to those skilled in the art. Such alterations, modifications, and improvements are intended to be part of this disclosure and are intended to be within the spirit and scope of this disclosure. Accordingly, the foregoing description and drawings are by way of example only. [Configuration 1] 1. An apparatus for depositing assembly materials onto an electronic substrate, comprising: The frame and an assembly applicator coupled to the frame and configured to apply assembly material onto the electronic substrate; a support assembly coupled to the frame and configured to support the electronic substrate, the support assembly including a heated chuck plate, the heated chuck plate comprising: a body including an exterior surface and configured to secure the electronic substrate proximate the exterior surface; an air channel network configured to selectively direct heated air to a plurality of predetermined locations on the electronic substrate; the air channel network comprising: a first heating path configured to direct the heated air through the exterior surface to a first location of the plurality of predetermined locations; a second heating path configured to direct the heated air through the exterior surface to a second location of the plurality of predetermined locations; a support assembly including: An apparatus comprising: [Configuration 2] the air channel network includes a plurality of holes in the exterior surface of the body of the heated chuck plate; the first heating path includes a first set of the plurality of holes; the second heating path includes a second set of the plurality of holes; 10. The apparatus of claim 1. [Configuration 3] the first set of holes includes a first group of the holes positioned to direct the heated air toward the first location of the plurality of predetermined locations on the electronic board; the second set of holes includes a second group of the holes positioned to direct the heated air toward the second one of the predetermined locations on the electronic board. 3. The apparatus of claim 2. [Configuration 4] 2. The apparatus of claim 1, wherein the air channel network further includes at least one port configured to selectively allow the heated air to enter one of the first heating path and the second heating path. [Configuration 5] 5. The apparatus of configuration 4, wherein the at least one port includes a first port configured to selectively allow the heated air to enter the first heating path and a second port configured to selectively allow the heated air to enter the second heating path. [Configuration 6] the first port is configured to receive a first set screw that, when tightened, prevents the heated air from traveling through the first heating path and, when loosened, allows the heated air to travel through the first heating path; The second port is configured to receive a second set screw that, when tightened, prevents the heated air from traveling through the second heating path and, when loosened, allows the heated air to travel through the second heating path. 6. The apparatus of claim 5. [Configuration 7] 7. The apparatus of configuration 6, wherein the air channel network further includes a third heating path configured to receive the heated air regardless of the position of the first set screw in the first port and regardless of the position of the second set screw in the second port. [Configuration 8] 2. The apparatus of configuration 1, further comprising a first mask, the first mask including at least one hole positioned within the first mask to direct the heated air from the first heating path toward at least one of the plurality of predetermined locations on the electronic substrate. [Configuration 9] 9. The apparatus of claim 8, wherein the first mask is configured to block the heated air from directly impinging on the electronic substrate except for the at least one hole. [Configuration 10] The at least one hole is a first hole positioned in the first mask to direct the heated air from the first heating path to the first location of a plurality of predetermined locations on the electronic substrate; a second hole positioned in the first mask to direct the heated air from the second heating path to the second one of the one or more predetermined locations on the electronic substrate; 9. The apparatus of claim 8, comprising: [Configuration 11] 9. The apparatus of configuration 8, wherein the first mask includes a gripping portion for removing the first mask from the exterior surface, the gripping portion extending beyond an edge of the exterior surface. [Configuration 12] 9. The apparatus of configuration 8, further comprising a second mask, the second mask including at least one hole positioned within the second mask to direct the heated air from the second heating path toward at least one of the plurality of predetermined locations on the electronic substrate. [Configuration 13] A heated chuck plate, a body including an exterior surface and configured to secure an electronics assembly adjacent the exterior surface; an air channel network configured to selectively direct heated air to a plurality of predetermined locations on the electronics assembly; the air channel network comprising: a first heating path configured to direct the heated air through the exterior surface to a first location of the plurality of predetermined locations; a second heating path configured to direct the heated air through the exterior surface to a second location of the plurality of predetermined locations; A heated chuck plate. [Configuration 14] the air channel network includes a plurality of holes in the exterior surface of the body of the heated chuck plate; the first heating path includes a first set of the plurality of holes; the second heating path includes a second set of the plurality of holes; 14. The heated chuck plate of claim 13. [Configuration 15] the first set of holes includes a first group of the holes positioned to direct the heated air toward the first location of the plurality of predetermined locations on the electronics assembly; the second set of holes includes a second group of the holes positioned to direct the heated air toward the second one of the predetermined locations on the electronics assembly. 15. The heated chuck plate of claim 14. [Configuration 16] 14. The heating chuck plate of claim 13, wherein the air channel network further includes at least one port configured to selectively allow the heated air to enter one of the first heating path and the second heating path. [Configuration 17] 17. The heated chuck plate of claim 16, wherein the at least one port includes a first port configured to selectively allow the heated air to enter the first heating path and a second port configured to selectively allow the heated air to enter the second heating path. [Configuration 18] the first port is configured to receive a first set screw that, when tightened, prevents the heated air from traveling through the first heating path and, when loosened, allows the heated air to travel through the first heating path; The second port is configured to receive a second set screw that, when tightened, prevents the heated air from traveling through the second heating path and, when loosened, allows the heated air to travel through the second heating path. 18. The heated chuck plate of claim 17. [Configuration 19] 19. The heating chuck plate of claim 18, wherein the air channel network further includes a third heating path configured to receive the heated air regardless of the position of the first set screw in the first port and regardless of the position of the second set screw in the second port. [Configuration 20] 14. The heated chuck plate of claim 13, further comprising a valve configured to selectively direct the heated air to one of the first heating path and the second heating path.

Claims

1. 1. An apparatus for depositing assembly materials onto an electronic substrate, comprising: The frame and an assembly applicator coupled to the frame and configured to apply assembly material onto the electronic substrate; a support assembly coupled to the frame and configured to support the electronic substrate, the support assembly including a heated chuck plate, the heated chuck plate comprising: a body including an exterior surface and configured to secure the electronic substrate proximate the exterior surface; an air channel network configured to selectively direct heated air to a plurality of predetermined locations on the electronic substrate; the air channel network comprising: a first heating path configured to direct the heated air through the exterior surface to a first location of the plurality of predetermined locations; a second heating path configured to direct the heated air through the exterior surface to a second location of the plurality of predetermined locations; a support assembly including: a first mask including at least one hole positioned within the first mask to direct the heated air from the first heating path toward the first location; An apparatus comprising:

2. the air channel network includes a plurality of holes in the exterior surface of the body of the heated chuck plate; the first heating path includes a first set of the plurality of holes; the second heating path includes a second set of the plurality of holes; 10. The apparatus of claim 1.

3. the first set of holes includes a first group of the holes positioned to direct the heated air toward the first location of the plurality of predetermined locations on the electronic board; the second set of holes includes a second group of the holes positioned to direct the heated air toward the second of the predetermined locations on the electronic board.

3. The apparatus of claim 2.

4. 10. The apparatus of claim 1, wherein the air channel network further comprises at least one port configured to selectively allow the heated air to enter one of the first heating path and the second heating path.

5. 5. The apparatus of claim 4, wherein the at least one port includes a first port configured to selectively allow the heated air to enter the first heating path and a second port configured to selectively allow the heated air to enter the second heating path.

6. the first port is configured to receive a first set screw that, when tightened, prevents the heated air from traveling through the first heating path and, when loosened, allows the heated air to travel through the first heating path; the second port is configured to receive a second set screw that, when tightened, prevents the heated air from traveling through the second heating path and, when loosened, allows the heated air to travel through the second heating path; 6. The apparatus of claim 5.

7. 7. The apparatus of claim 6, wherein the air channel network further comprises a third heating path configured to receive the heated air regardless of a position of the first set screw in the first port and regardless of a position of the second set screw in the second port.

8. The apparatus of claim 1 , wherein the first mask is configured to block the heated air from directly impinging on the electronic substrate except for the at least one hole.

9. The at least one hole is a first hole positioned in the first mask to direct the heated air from the first heating path toward a first portion contained in the first location; a second hole positioned in the first mask to direct the heated air from the first heating path toward a second portion included in the first location; The apparatus of claim 1 , comprising:

10. The device of claim 1 , wherein the first mask includes a gripping portion for removing the first mask from the exterior surface, the gripping portion extending beyond an edge of the exterior surface.

11. 10. The apparatus of claim 1, further comprising a second mask, the second mask including at least one hole positioned therein to direct the heated air from the second heating path toward the second location.

12. A heated chuck plate, a body including an exterior surface and configured to secure an electronics assembly adjacent the exterior surface; an air channel network configured to selectively direct heated air to a plurality of predetermined locations on the electronics assembly; the air channel network comprising: a first heating path configured to direct the heated air through the exterior surface to a first location of the plurality of predetermined locations; a second heating path configured to direct the heated air through the exterior surface to a second location of the plurality of predetermined locations; a first mask including at least one hole positioned within the first mask to direct the heated air from the first heating path toward the first location; A heated chuck plate.

13. the air channel network includes a plurality of holes in the exterior surface of the body of the heated chuck plate; the first heating path includes a first set of the plurality of holes; the second heating path includes a second set of the plurality of holes; The heated chuck plate of claim 12.

14. the first set of holes includes a first group of the holes positioned to direct the heated air toward the first location of the plurality of predetermined locations on the electronics assembly; the second set of holes includes a second group of the holes positioned to direct the heated air toward the second location of the plurality of predetermined locations on the electronic equipment assembly. The heated chuck plate of claim 13.

15. 13. The heated chuck plate of claim 12, wherein the air channel network further comprises at least one port configured to selectively allow the heated air to enter one of the first heating path and the second heating path.

16. 16. The heated chuck plate of claim 15, wherein the at least one port comprises a first port configured to selectively allow the heated air to enter the first heating path and a second port configured to selectively allow the heated air to enter the second heating path.

17. the first port is configured to receive a first set screw that, when tightened, prevents the heated air from traveling through the first heating path and, when loosened, allows the heated air to travel through the first heating path; the second port is configured to receive a second set screw that, when tightened, prevents the heated air from traveling through the second heating path and, when loosened, allows the heated air to travel through the second heating path; 17. The heated chuck plate of claim 16.

18. 18. The heated chuck plate of claim 17, wherein the air channel network further comprises a third heating path configured to receive the heated air regardless of a position of the first set screw in the first port and regardless of a position of the second set screw in the second port.

19. The heated chuck plate of claim 12 , further comprising a valve configured to selectively direct the heated air to one of the first heating path and the second heating path.

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