Laminate

Abstract

Provided is a laminate in which a surface protection film or a reinforcing film is laminated on a carrier sheet, which can exhibit high alignment accuracy and high inspectability when continuously attached to a member by roll-to-roll. The laminate of the present invention is a laminate of five or more layers having a resin film (1), a pressure-sensitive adhesive layer (1), a resin film (2), a pressure-sensitive adhesive layer (2), and a resin film (3) in this order, and is formed by directly laminating a three or more layer laminate (A) having the resin film (1), the pressure-sensitive adhesive layer (1), and the resin film (2) in this order, but not having the pressure-sensitive adhesive layer (2) and the resin film (3), and a two or more layer laminate (B) having the pressure-sensitive adhesive layer (2) and the resin film (3) in this order, but not having the resin film (1), the pressure-sensitive adhesive layer (1), and the resin film (2), and the transmittance of the laminate is 5% to 70%.

Description

[Technical Field]

[0001] The present invention relates to a laminate. Preferably, the present invention relates to a laminate that can be suitably used in the manufacturing process of optical components and electronic components. [Background technology]

[0002] In the manufacturing process of optical and electronic components, a surface protection film (SPV) is sometimes applied to prevent the surface of the component from being scratched during processing, assembly, inspection, transportation, etc., and a reinforcing film (RF) is sometimes applied to reinforce thin and fragile components (for example, Patent Document 1).

[0003] To increase the efficiency of the above-mentioned application process, a continuous process using the roll-to-roll method is more effective than a process in which the surface protection film or reinforcing film is applied sheet by sheet.

[0004] By forming a laminate in which the substrate surface of a surface protection film or a reinforcing film is attached to the surface of an easy-release adhesive layer of a carrier sheet having a substrate and an easy-release adhesive layer, continuous attachment of the surface protection film or the reinforcing film to a component by roll-to-roll processing becomes possible. In this case, the carrier sheet is peeled off after attachment.

[0005] When the above-described laminate is continuously attached to a component, high alignment accuracy is required. However, if the transparency of the surface protection film, reinforcing film, or carrier sheet is too high, it becomes difficult to detect the processed end of the surface protection film or reinforcing film using a camera or sensor, and it becomes difficult to align the positional relationship between both ends of the carrier sheet and the component, resulting in misalignment in the TD direction. Therefore, reducing the transparency of the surface protection film, reinforcing film, or carrier sheet is considered, but if the transparency is reduced too much, it becomes difficult to perform visual inspection or foreign matter inspection of the surface protection film itself, the reinforcing film itself, or the carrier sheet itself, and there is a high risk of overlooking foreign matter contamination when attaching the surface protection film or reinforcing film to the component. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Laid-Open No. 2016-17109 Summary of the Invention [Problem to be solved by the invention]

[0007] The object of the present invention is to provide a laminate in which a surface protection film or a reinforcing film is laminated onto a carrier sheet, which can exhibit high alignment accuracy and high inspectability when continuously attached to a component by roll-to-roll. [Means for solving the problem]

[0008] The laminate of the present invention is A laminate of five or more layers having a resin film (1), a pressure-sensitive adhesive layer (1), a resin film (2), a pressure-sensitive adhesive layer (2), and a resin film (3) in this order, a three or more layer laminate (A) having the resin film (1), the pressure-sensitive adhesive layer (1), and the resin film (2) in this order, but not having the pressure-sensitive adhesive layer (2) and the resin film (3), and a two or more layer laminate (B) having the pressure-sensitive adhesive layer (2) and the resin film (3) in this order, but not having the resin film (1), the pressure-sensitive adhesive layer (1), and the resin film (2), which are directly laminated together; The laminate has a transmittance of 5% to 70%.

[0009] In one embodiment, one of the outermost layers of the laminate (A) is the resin film (2).

[0010] In one embodiment, one of the outermost layers of the laminate (B) is the pressure-sensitive adhesive layer (2).

[0011] In one embodiment, the laminate (A) has a transmittance of 6% to 70%.

[0012] In one embodiment, the laminate (B) has a transmittance of 6% to 70%. [Effects of the Invention]

[0013] According to the present invention, it is possible to provide a laminate in which a surface protection film or a reinforcing film is laminated onto a carrier sheet, which can exhibit high alignment accuracy and high inspectability when continuously attached to a component by roll-to-roll. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is a schematic cross-sectional view of one embodiment of a laminate of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0015] When the expression "weight" appears in this specification, it may be read as "mass," which is a commonly used SI unit indicating weight.

[0016] In this specification, the term "(meth)acrylic" means "acrylic and / or methacrylic", the term "(meth)acrylate" means "acrylate and / or methacrylate", the term "(meth)allyl" means "allyl and / or methallyl", and the term "(meth)acrolein" means "acrolein and / or methacrolein".

[0017] ≪≪1. Laminate≫≫ The laminate of the present invention is a laminate of five or more layers having a resin film (1), a pressure-sensitive adhesive layer (1), a resin film (2), a pressure-sensitive adhesive layer (2), and a resin film (3) in this order.

[0018] The laminate of the present invention is formed by directly laminating a three or more layer laminate (A) having a resin film (1), a pressure-sensitive adhesive layer (1), and a resin film (2) in this order, but not having a pressure-sensitive adhesive layer (2) or a resin film (3), and a two or more layer laminate (B) having a pressure-sensitive adhesive layer (2) and a resin film (3) in this order, but not having a resin film (1), a pressure-sensitive adhesive layer (1), or a resin film (2).

[0019] The laminate (A) has a resin film (1), a pressure-sensitive adhesive layer (1), and a resin film (2) in this order, and may have any other appropriate layer as long as the effect of the present invention is not impaired, as long as it is a laminate of three or more layers that does not have a pressure-sensitive adhesive layer (2) and a resin film (3).

[0020] The laminate (B) has a pressure-sensitive adhesive layer (2) and a resin film (3) in this order, and may have any other appropriate layer as long as it is a laminate of two or more layers that does not have a resin film (1), a pressure-sensitive adhesive layer (1), and a resin film (2), as long as the effects of the present invention are not impaired.

[0021] Preferably, one of the outermost layers of the laminate (A) is a resin film (2).

[0022] Preferably, one of the outermost layers of the laminate (B) is the pressure-sensitive adhesive layer (2).

[0023] That is, the laminate of the present invention is preferably a laminate of five or more layers, which is composed of a three or more layer laminate (A) having a resin film (1), a pressure-sensitive adhesive layer (1), and a resin film (2) in this order, with the resin film (2) being the outermost layer, and a two or more layer laminate (B) having a pressure-sensitive adhesive layer (2) and a resin film (3) in this order, with the pressure-sensitive adhesive layer (2) being the outermost layer, laminated such that the resin film (2) and the pressure-sensitive adhesive layer (2) are directly laminated together.

[0024] The other layer may be, for example, a transmittance control layer, which can further enhance the effects of the present invention. Any appropriate layer may be used as the transmittance control layer as long as it is a layer that can control the transmittance. Examples of such a transmittance control layer include a black tape layer and a black printed layer.

[0025] Examples of the transmittance control layer include the surface of the resin film (1) opposite to the adhesive layer (1), the surface of the resin film (1) facing the adhesive layer (1), the surface of the adhesive layer (1) facing the resin film (1), the surface of the adhesive layer (1) facing the resin film (2), the surface of the resin film (2) facing the adhesive layer (1), the surface of the resin film (2) facing the adhesive layer (2), the surface of the adhesive layer (2) facing the resin film (2), the surface of the adhesive layer (2) facing the resin film (3), the surface of the resin film (3) facing the adhesive layer (2), and the surface of the resin film (3) opposite to the adhesive layer (2).

[0026] The number of layers in the laminate of the present invention is preferably 5 to 10 layers, more preferably 5 to 8 layers, even more preferably 5 to 7 layers, particularly preferably 5 to 6 layers, and most preferably 5 layers, depending on the number of other layers described above.

[0027] As shown in FIG. 1, one embodiment of the laminate of the present invention is a laminate 100 of the present invention, which is formed by directly laminating a resin film (1) 10, a pressure-sensitive adhesive layer (1) 20, a resin film (2) 30, a pressure-sensitive adhesive layer (2) 40, and a resin film (3) 50 in this order.

[0028] In one embodiment of the laminate of the present invention shown in Fig. 1, the laminate portion of the resin film (1), the pressure-sensitive adhesive layer (1), and the resin film (2) corresponds to the laminate (A), and can serve as a surface protection film or a reinforcing film. In this case, the resin film (1) can serve as a separator.

[0029] In one embodiment of the laminate of the present invention shown in Fig. 1, the laminate portion of the pressure-sensitive adhesive layer (2) and the resin film (3) corresponds to the laminate (B) and can serve as a carrier sheet. The carrier sheet can also be used as a surface protection film.

[0030] The laminate of the present invention has a transmittance of 5% to 70%, preferably 10% to 70%, more preferably 20% to 70%, particularly preferably 30% to 65%, and most preferably 40% to 60%. If the transmittance of the laminate of the present invention is within the above range, the laminate of the present invention can exhibit high alignment accuracy and high inspectability when continuously attached to members by roll-to-roll.

[0031] In the laminate of the present invention, the transmittance of the laminate (A) is preferably 6% to 70%, more preferably 10% to 70%, even more preferably 20% to 70%, particularly preferably 30% to 70%, and most preferably 40% to 60%. When the transmittance of the laminate (A) is within the above range, the laminate of the present invention can exhibit higher alignment accuracy and higher inspectability when continuously attached to members by roll-to-roll.

[0032] In the laminate of the present invention, the transmittance of the laminate (B) is preferably 6% to 70%, more preferably 10% to 70%, even more preferably 20% to 70%, particularly preferably 30% to 70%, and most preferably 40% to 60%. When the transmittance of the laminate (B) is within the above range, the laminate of the present invention can exhibit higher alignment accuracy and higher inspectability when continuously attached to members by roll-to-roll.

[0033] The adhesive strength of the laminate of the present invention, when the pressure-sensitive adhesive layer (2) is peeled from the resin film (2) at a peel angle of 180° and a peel rate of 30 mm / min under an atmosphere of 23°C and 50% RH, is preferably 1 gf / 25 mm or more, more preferably 1 gf / 25 mm to 10 gf / 25 mm, even more preferably 1.2 gf / 25 mm to 8 gf / 25 mm, still more preferably 1.4 gf / 25 mm to 7 gf / 25 mm, particularly preferably 1.6 gf / 25 mm to 5 gf / 25 mm, and most preferably 1.8 gf / 25 mm to 3 gf / 25 mm. If the adhesive strength is within the above range, the laminate of the present invention can suppress lifting of the resin film (2) from the pressure-sensitive adhesive layer (2) when continuously attached to a member by roll-to-roll processing.

[0034] The adhesive strength when peeling the pressure-sensitive adhesive layer (2) from the resin film (2) at a peel angle of 180° and a peel speed of 30 mm / min can be measured, for example, as follows: That is, the separator of a 10 cm x 10 cm laminate (A) is peeled off, and the surface of the pressure-sensitive adhesive layer of the evaluation sample is attached to a 10 cm x 10 cm glass plate (manufactured by Matsunami Glass Industry Co., Ltd., product name: Microslide Glass S) with a hand roller in an atmosphere of a temperature of 23°C and a humidity of 50% RH, and then pressed with a pressure of 0.25 MPa. The previously de-electrified separator-attached surface protection film (which may also be referred to as a carrier sheet) is cut to a width of 25 mm and a length of 150 mm, and the temperature is 23°C. In an atmosphere of 23°C and 50% RH humidity, the adhesive layer (2) is attached to the resin film side of the laminate (A) fixed to glass by rolling a 2.0 kg roller back and forth once, and then pressed with a pressure of 0.25 MPa. After curing for 30 minutes in an atmosphere of 23°C and 50% RH temperature and 50% RH humidity, the adhesive layer (2) is peeled from the resin film (2) using a universal tensile tester (manufactured by Minebea Co., Ltd., product name: TCM-1kNB) at a peel angle of 180 degrees and a peel speed of 30 mm / min, and the adhesive strength can be measured.

[0035] The adhesive strength of the laminate of the present invention, when the pressure-sensitive adhesive layer (2) is peeled from the resin film (2) at a peel angle of 180° and a peel rate of 300 mm / min under an atmosphere of 23°C and 50% RH, is preferably 2 gf / 25 mm or more, more preferably 2 gf / 25 mm to 20 gf / 25 mm, even more preferably 2.5 gf / 25 mm to 10 gf / 25 mm, still more preferably 3 gf / 25 mm to 9 gf / 25 mm, particularly preferably 3 gf / 25 mm to 8 gf / 25 mm, and most preferably 3.5 gf / 25 mm to 7 gf / 25 mm, when the laminate of the present invention is continuously attached to a member by roll-to-roll, can be more effectively prevented from lifting from the pressure-sensitive adhesive layer (2).

[0036] The adhesive strength when peeling the pressure-sensitive adhesive layer (2) from the resin film (2) at a peel angle of 180° and a peel speed of 300 mm / min can be measured, for example, as follows: That is, the separator of a 10 cm x 10 cm laminate (A) is peeled off, and the surface of the pressure-sensitive adhesive layer of the evaluation sample is attached to a 10 cm x 10 cm glass plate (manufactured by Matsunami Glass Industry Co., Ltd., product name: Microslide Glass S) with a hand roller in an atmosphere of a temperature of 23°C and a humidity of 50% RH, and then pressed with a pressure of 0.25 MPa. The previously de-electrified separator-attached surface protection film (which may also be referred to as a carrier sheet) is cut into a width of 25 mm and a length of 150 mm, and the temperature is 23°C. In an atmosphere of 23°C and 50% RH humidity, the adhesive layer (2) is attached to the resin film side of the laminate (A) fixed to glass by rolling a 2.0 kg roller back and forth once, and then pressed with a pressure of 0.25 MPa. After curing for 30 minutes in an atmosphere of 23°C and 50% RH temperature and 50% RH humidity, the adhesive layer (2) is peeled from the resin film (2) using a universal tensile tester (manufactured by Minebea Co., Ltd., product name: TCM-1kNB) at a peel angle of 180 degrees and a peel speed of 300 mm / min, and the adhesive strength can be measured.

[0037] The adhesive strength of the laminate of the present invention, when the pressure-sensitive adhesive layer (2) is peeled from the resin film (2) at a peel angle of 180° and a peel speed of 2400 mm / min under an atmosphere of 23°C and 50% RH, is preferably 5 gf / 25 mm or more, more preferably 5 gf / 25 mm to 100 gf / 25 mm, more preferably 7 gf / 25 mm to 60 gf / 25 mm, even more preferably 8 gf / 25 mm to 40 gf / 25 mm, particularly preferably 9 gf / 25 mm to 30 gf / 25 mm, and most preferably 10 gf / 25 mm to 25 gf / 25 mm. When the adhesive strength is within the above range, the laminate of the present invention can further suppress the peeling of the resin film (2) from the pressure-sensitive adhesive layer (2) when continuously attached to a member by roll-to-roll. A method for measuring the adhesive strength will be described later.

[0038] The adhesive strength when peeling the pressure-sensitive adhesive layer (2) from the resin film (2) at a peel angle of 180° and a peel speed of 2400 mm / min can be measured, for example, as follows: That is, the separator of a 10 cm x 10 cm laminate (A) is peeled off, and the surface of the pressure-sensitive adhesive layer of the evaluation sample is attached to a 10 cm x 10 cm glass plate (manufactured by Matsunami Glass Industry Co., Ltd., product name: Microslide Glass S) with a hand roller in an atmosphere of a temperature of 23°C and a humidity of 50% RH, and then pressed with a pressure of 0.25 MPa. The previously de-electrified separator-attached surface protection film (which may also be referred to as a carrier sheet) is cut into a width of 25 mm and a length of 150 mm, and then heated at a temperature of 23°C. In an atmosphere of 3°C and 50% RH humidity, the adhesive layer (2) is attached to the resin film side of the laminate (A) fixed to glass using a 2.0 kg roller, rolling it back and forth once, and then pressed with a pressure of 0.25 MPa. After curing for 30 minutes in an atmosphere of 23°C and 50% RH temperature, the adhesive layer (2) is peeled from the resin film (2) using a universal tensile tester (manufactured by Minebea Co., Ltd., product name: TCM-1kNB) at a peel angle of 180 degrees and a peel speed of 2400 mm / min, and the adhesive strength can be measured.

[0039] In the laminate of the present invention, the adhesive strength (1) of the pressure-sensitive adhesive layer (1) when the pressure-sensitive adhesive layer (1) is peeled from glass at a peel angle of 180° and a peel speed of 300 mm / min in an atmosphere having a temperature of 23°C and a humidity of 50% RH, and the adhesive strength (2) of the pressure-sensitive adhesive layer (2) when the pressure-sensitive adhesive layer (2) is peeled from glass at a peel angle of 180° and a peel speed of 300 mm / min in an atmosphere having a temperature of 23°C and a humidity of 50% RH, preferably satisfy the relationship adhesive strength (1) > adhesive strength (2). When adhesive strength (1) > adhesive strength (2), the effects of the present invention can be more effectively exhibited.

[0040] The adhesive strength (1) can be measured, for example, as follows: A laminate (A) consisting of resin film (1) / pressure-sensitive adhesive layer (1) / resin film (2) is cut to a width of 25 mm and a length of 150 mm to prepare an evaluation sample, and the resin film (1) is peeled off from the prepared evaluation sample in an atmosphere of 23°C temperature and 50%RH humidity, and the sample is attached to a glass plate (manufactured by Matsunami Glass Industrial Co., Ltd., product name: Microslide Glass S) with a 2.0 kg roller once back and forth, and aged for 30 minutes in an atmosphere of 23°C temperature and 50%RH humidity, and then peeled off using a universal tensile tester at a peel angle of 180° and a peel speed of 300 mm / min to measure the adhesive strength (1).

[0041] The adhesive strength (2) can be measured, for example, as follows: A separator-attached laminate (B) consisting of separator / adhesive layer (2) / resin film (3) is cut to a width of 25 mm and a length of 150 mm to prepare an evaluation sample, and an adherend is prepared separately in the same manner as in the measurement of adhesive strength (1) by peeling the resin film (1) from the laminate (A) and attaching it to a glass plate, and the separator is peeled from the evaluation sample in an atmosphere of 23°C temperature and 50%RH humidity, and the sample is attached to the adherend with a 2.0 kg roller, rolling it back and forth once, and then aging for 30 minutes in an atmosphere of 23°C temperature and 50%RH humidity, and then peeled using a universal tensile tester at a peel angle of 180° and a peel speed of 300 mm / min, and the adhesive strength (2) can be measured.

[0042] <1-1. Resin film (1)> The thickness of the resin film (1) is preferably 1 μm to 300 μm, more preferably 10 μm to 200 μm, even more preferably 30 μm to 150 μm, particularly preferably 40 μm to 100 μm, and most preferably 50 μm to 80 μm, in order to further exhibit the effects of the present invention.

[0043] The resin film (1) includes a resin substrate film (1a).

[0044] Examples of the resin substrate film (1a) include plastic films made of polyester-based resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); plastic films made of olefin-based resins containing α-olefins as monomer components, such as polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), ethylene-propylene copolymer, and ethylene-vinyl acetate copolymer (EVA); plastic films made of polyvinyl chloride (PVC); plastic films made of vinyl acetate-based resins; plastic films made of polycarbonate (PC); and polyphenylene sulfide (PPS). plastic films made of amide-based resins such as polyamide (nylon) and wholly aromatic polyamide (aramid); plastic films made of polyimide-based resins; plastic films made of polyether ether ketone (PEEK); plastic films made of olefin-based resins such as polyethylene (PE) and polypropylene (PP); plastic films made of fluorine-based resins such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, and chlorofluoroethylene-vinylidene fluoride copolymer; and the like.

[0045] The resin substrate film (1a) may be one layer or two or more layers. The resin substrate film (1a) may be a stretched film.

[0046] The resin substrate film (1a) may be subjected to a surface treatment, such as corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage shock exposure, ionizing radiation treatment, and coating with a primer.

[0047] The resin substrate film (1a) may contain any appropriate additives within the range that does not impair the effects of the present invention.

[0048] The additives include, for example, transmittance control agents, etc. Examples of such transmittance control agents include color pigments and color dyes, and preferably black pigments and black dyes.

[0049] When the resin substrate film (1a) contains a transmittance control agent, the content thereof is preferably 0.01 to 5% by weight, more preferably 0.1 to 3% by weight, and even more preferably 0.5 to 1% by weight, in order to further exhibit the effects of the present invention.

[0050] The resin film (1) may have a release layer (1b) to improve peelability from the pressure-sensitive adhesive layer (1). When the resin film (1) has the release layer (1b), the release layer (1b) side is directly laminated on the pressure-sensitive adhesive layer (1).

[0051] Any suitable material can be used to form the release layer (1b) as long as it does not impair the effects of the present invention. Examples of such materials include silicone-based release agents, fluorine-based release agents, long-chain alkyl-based release agents, and fatty acid amide-based release agents. Among these, silicone-based release agents are preferred. The release layer (1b) can be formed as a coating layer.

[0052] The thickness of the release layer (1b) can be any appropriate thickness depending on the purpose, as long as it does not impair the effects of the present invention. Such a thickness is preferably 10 nm to 2000 nm, more preferably 10 nm to 1500 nm, even more preferably 10 nm to 1000 nm, and particularly preferably 10 nm to 500 nm.

[0053] The release layer (1b) may be a single layer or may be two or more layers.

[0054] Examples of silicone-based release layers include addition reaction type silicone resins. Specific examples of addition reaction type silicone resins include KS-774, KS-775, KS-778, KS-779H, KS-847H, and KS-847T manufactured by Shin-Etsu Chemical Co., Ltd.; TPR-6700, TPR-6710, and TPR-6721 manufactured by Toshiba Silicones; and SD7220 and SD7226 manufactured by Toray Dow Corning. The coating amount (after drying) of the silicone-based release layer is preferably 0.01 g / m. 2 ~2g / m 2 and more preferably 0.01 g / m 2 ~1g / m 2 and more preferably 0.01 g / m 2 ~0.5g / m 2 is.

[0055] The release layer (1b) can be formed, for example, by applying the above-mentioned forming material onto any appropriate layer by a conventionally known coating method such as reverse gravure coating, bar coating, or die coating, and then curing the applied material by heat treatment, usually at about 120 to 200° C. If necessary, the heat treatment may be combined with irradiation with active energy rays such as ultraviolet light.

[0056] The resin film (1) may have an antistatic layer (1c).

[0057] The thickness of the antistatic layer (1c) may be any appropriate thickness within the range that does not impair the effects of the present invention, and is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, even more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

[0058] The antistatic layer (1c) may be a single layer or may be two or more layers.

[0059] Any suitable antistatic layer (1c) can be used as long as it can provide an antistatic effect and does not impair the effects of the present invention. Such an antistatic layer is preferably an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on a suitable substrate layer. Specifically, for example, it is an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on a resin substrate film (1a). Specific coating methods include roll coating, bar coating, and gravure coating.

[0060] Any suitable conductive polymer may be used as the conductive polymer as long as it does not impair the effects of the present invention. Examples of such conductive polymers include conductive polymers in which a π-conjugated conductive polymer is doped with a polyanion. Examples of π-conjugated conductive polymers include chain-like conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. Examples of polyanions include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallyl sulfonic acid, polyacrylate ethyl sulfonic acid, and polymethacrylic carboxylic acid. Only one type of conductive polymer may be used, or two or more types may be used.

[0061] One embodiment of the resin film (1) comprises a resin substrate film (1a), an antistatic layer (1c), and a release layer (1b) in this order. Typically, this embodiment comprises a resin substrate film (1a), an antistatic layer (1c), and a release layer (1b).

[0062] Another embodiment of the resin film (1) comprises, in this order, an antistatic layer (1c), a resin substrate film (1a), an antistatic layer (1c), and a release layer (1b). Typically, this embodiment comprises an antistatic layer (1c), a resin substrate film (1a), an antistatic layer (1c), and a release layer (1b).

[0063] 1-2. Adhesive layer (1) Any appropriate pressure-sensitive adhesive layer can be adopted as the pressure-sensitive adhesive layer (1) as long as it does not impair the effects of the present invention. The pressure-sensitive adhesive layer (1) may be a single layer or may be two or more layers.

[0064] The thickness of the pressure-sensitive adhesive layer (1) is preferably 0.5 μm to 150 μm, more preferably 1 μm to 100 μm, even more preferably 3 μm to 80 μm, particularly preferably 5 μm to 50 μm, and most preferably 5 μm to 30 μm, in order to further exhibit the effects of the present invention.

[0065] The pressure-sensitive adhesive layer (1) is preferably composed of at least one type selected from the group consisting of acrylic pressure-sensitive adhesives, urethane pressure-sensitive adhesives, rubber pressure-sensitive adhesives, and silicone pressure-sensitive adhesives.

[0066] The pressure-sensitive adhesive layer (1) can be formed by any appropriate method. Examples of such methods include a method in which a pressure-sensitive adhesive composition (at least one selected from the group consisting of an acrylic pressure-sensitive adhesive composition, a urethane pressure-sensitive adhesive composition, a rubber pressure-sensitive adhesive composition, and a silicone pressure-sensitive adhesive composition) is applied to any appropriate substrate (e.g., a resin film (2)), heated and dried as necessary, and cured as necessary to form a pressure-sensitive adhesive layer on the substrate. Examples of such application methods include methods using a gravure roll coater, reverse roll coater, kiss roll coater, dip roll coater, bar coater, knife coater, air knife coater, spray coater, comma coater, direct coater, roll brush coater, etc.

[0067] The pressure-sensitive adhesive layer (1) may contain a conductive component, which may be one type only or two or more types.

[0068] The pressure-sensitive adhesive layer (1) may contain any appropriate additives as long as the effects of the present invention are not impaired.

[0069] The additives include, for example, transmittance control agents, etc. Examples of such transmittance control agents include color pigments and color dyes, and preferably black pigments and black dyes.

[0070] When the pressure-sensitive adhesive layer (1) contains a transmittance control agent, the content of the transmittance control agent is typically preferably 0.01 to 5% by weight, more preferably 0.1 to 3% by weight, and even more preferably 0.5 to 1% by weight, relative to the polymer component contained in the pressure-sensitive adhesive composition (at least one selected from the group consisting of an acrylic pressure-sensitive adhesive composition, a urethane pressure-sensitive adhesive composition, a rubber pressure-sensitive adhesive composition, and a silicone pressure-sensitive adhesive composition) forming the pressure-sensitive adhesive layer (1), in order to further exhibit the effects of the present invention. Note that the "polymer component" referred to here refers to an acrylic polymer in the case of an acrylic pressure-sensitive adhesive composition, at least one selected from the group consisting of a urethane prepolymer and a polyol in the case of a urethane pressure-sensitive adhesive composition, a rubber polymer in the case of a rubber pressure-sensitive adhesive composition, and a silicone polymer in the case of a silicone pressure-sensitive adhesive composition.

[0071] <1-2-1. Acrylic adhesive> The acrylic pressure-sensitive adhesive is formed from an acrylic pressure-sensitive adhesive composition.

[0072] The acrylic pressure-sensitive adhesive composition preferably contains an acrylic polymer and a crosslinking agent, in that the effects of the present invention can be more effectively exhibited.

[0073] The acrylic polymer is what can be called a base polymer in the field of acrylic pressure-sensitive adhesives. The acrylic polymer may be of only one type, or may be of two or more types.

[0074] The content of the acrylic polymer in the acrylic pressure-sensitive adhesive composition is preferably 60% by weight to 99.9% by weight, more preferably 65% ​​by weight to 99.9% by weight, even more preferably 70% by weight to 99.9% by weight, particularly preferably 75% by weight to 99.9% by weight, and most preferably 80% by weight to 99.9% by weight, calculated as solid content.

[0075] As the acrylic polymer, any appropriate acrylic polymer can be used as long as it does not impair the effects of the present invention.

[0076] The weight average molecular weight of the acrylic polymer is preferably 300,000 to 2,500,000, more preferably 350,000 to 2,000,000, even more preferably 400,000 to 1,800,000, and particularly preferably 500,000 to 1,500,000, in order to further exhibit the effects of the present invention.

[0077] The acrylic polymer is preferably an acrylic polymer formed by polymerization from a composition (A) containing: (component a) a (meth)acrylic acid alkyl ester in which the alkyl group in the alkyl ester moiety has 4 to 12 carbon atoms; and (component b) at least one selected from the group consisting of a (meth)acrylic acid ester having an OH group and (meth)acrylic acid, in order to more effectively exhibit the effects of the present invention.

[0078] The acrylic polymer is preferably an acrylic polymer formed by polymerization from a composition (A) containing, as (component a), a (meth)acrylic acid alkyl ester in which the alkyl group in the alkyl ester moiety has 4 to 12 carbon atoms, and as (component b), (meth)acrylic acid without containing a (meth)acrylic acid ester having an OH group, in order to further exhibit the effects of the present invention. More preferably, the acrylic polymer is an acrylic polymer formed by polymerization from a composition (A) containing, as (component a), a (meth)acrylic acid alkyl ester in which the alkyl group in the alkyl ester moiety has 4 to 8 carbon atoms, and as (component b), acrylic acid without containing a (meth)acrylic acid ester having an OH group.

[0079] The (a) component and the (b) component may each independently be one type or two or more types.

[0080] Examples of (meth)acrylic acid alkyl esters (component a) in which the alkyl group in the alkyl ester moiety has 4 to 12 carbon atoms include n-butyl (meth)acrylate, isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, and dodecyl (meth)acrylate. Among these, n-butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate are preferred, and n-butyl acrylate and 2-ethylhexyl acrylate are more preferred, in terms of further exhibiting the effects of the present invention.

[0081] Examples of the at least one (component b) selected from the group consisting of (meth)acrylic acid esters having an OH group and (meth)acrylic acid include (meth)acrylic acid esters having an OH group such as hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, and hydroxybutyl (meth)acrylate. Among these, hydroxyethyl (meth)acrylate and (meth)acrylic acid are preferred, and hydroxyethyl acrylate and acrylic acid are more preferred, in terms of being able to further exhibit the effects of the present invention.

[0082] The composition (A) may contain a copolymerizable monomer other than the components (a) and (b). The copolymerizable monomer may be one type only, or two or more types.Examples of such copolymerizable monomers include carboxyl group-containing monomers (excluding (meth)acrylic acid) such as itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid, and acid anhydrides thereof (e.g., acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride); (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-methylol(meth)acrylamide, N-methoxymethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide, N-hydroxyethyl(meth)acrylamide, N-methylol ... Amide group-containing monomers such as acrylamide; amino group-containing monomers such as aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, and t-butylaminoethyl (meth)acrylate; epoxy group-containing monomers such as glycidyl (meth)acrylate and methylglycidyl (meth)acrylate; cyano group-containing monomers such as acrylonitrile and methacrylonitrile; N-vinyl-2-pyrrolidone, (meth)acryloylmorpholine, N-vinylpiperidone, N-vinylpiperazine, N-vinylpyrrole, and N-vinylisopropyl heterocyclic ring-containing vinyl monomers such as midazole, vinylpyridine, vinylpyrimidine, and vinyloxazole; sulfonic acid group-containing monomers such as sodium vinyl sulfonate; phosphate group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; imide group-containing monomers such as cyclohexylmaleimide and isopropylmaleimide; isocyanate group-containing monomers such as 2-methacryloyloxyethyl isocyanate; (meth)acrylic acid esters having alicyclic hydrocarbon groups such as cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, and isobornyl (meth)acrylate; (meth)acrylic acid esters having aromatic hydrocarbon groups such as phenyl (meth)acrylate, phenoxyethyl (meth)acrylate, and benzyl (meth)acrylate; vinyl esters such as vinyl acetate and vinyl propionate; aromatic vinyl compounds such as styrene and vinyltoluene; olefins and dienes such as ethylene, butadiene, isoprene, and isobutylene; vinyl ethers such as vinyl alkyl ethers; and vinyl chloride.

[0083] As the copolymerizable monomer, a polyfunctional monomer may also be used. A polyfunctional monomer refers to a monomer having two or more ethylenically unsaturated groups in one molecule. As the ethylenically unsaturated group, any appropriate ethylenically unsaturated group may be used as long as it does not impair the effects of the present invention. Examples of such ethylenically unsaturated groups include radically polymerizable functional groups such as a vinyl group, a propenyl group, an isopropenyl group, a vinyl ether group (vinyloxy group), and an allyl ether group (allyloxy group). Examples of polyfunctional monomers include hexanediol di(meth)acrylate, butanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, allyl (meth)acrylate, vinyl (meth)acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, urethane acrylate, etc. Such polyfunctional monomers may be used alone or in combination of two or more.

[0084] As the copolymerizable monomer, (meth)acrylic acid alkoxyalkyl esters can also be used. Examples of (meth)acrylic acid alkoxyalkyl esters include 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, methoxytriethylene glycol (meth)acrylate, 3-methoxypropyl (meth)acrylate, 3-ethoxypropyl (meth)acrylate, 4-methoxybutyl (meth)acrylate, and 4-ethoxybutyl (meth)acrylate. The (meth)acrylic acid alkoxyalkyl esters may be of one type or two or more types.

[0085] The content of the (meth)acrylic acid alkyl ester (component a) in which the alkyl group in the alkyl ester moiety has 4 to 12 carbon atoms is preferably 30% by weight or more, more preferably 35% by weight to 99% by weight, even more preferably 40% by weight to 98% by weight, and particularly preferably 50% by weight to 95% by weight, relative to the total amount (100% by weight) of the monomer components constituting the acrylic polymer, in order to further exhibit the effects of the present invention.

[0086] The content of at least one selected from the group consisting of (meth)acrylic acid esters having an OH group and (meth)acrylic acid (component b) is preferably 1% by weight or more, more preferably 1 to 30% by weight, even more preferably 2 to 20% by weight, and particularly preferably 3 to 10% by weight, relative to the total amount (100% by weight) of the monomer components constituting the acrylic polymer, in order to further exhibit the effects of the present invention.

[0087] Composition (A) may contain any appropriate other components as long as the effects of the present invention are not impaired. Examples of such other components include a polymerization initiator, a chain transfer agent, and a solvent. The content of these other components may be any appropriate content as long as the effects of the present invention are not impaired.

[0088] The polymerization initiator may be a thermal polymerization initiator, a photopolymerization initiator (photoinitiator), etc., depending on the type of polymerization reaction. Only one type of polymerization initiator may be used, or two or more types may be used.

[0089] Thermal polymerization initiators are preferably used when obtaining acrylic polymers by solution polymerization. Examples of such thermal polymerization initiators include azo polymerization initiators, peroxide polymerization initiators (e.g., dibenzoyl peroxide, tert-butyl permaleate, etc.), and redox polymerization initiators. Among these thermal polymerization initiators, the azo polymerization initiators disclosed in JP 2002-69411 A are particularly preferred. Such azo polymerization initiators are preferred because their decomposition products are less likely to remain in the acrylic polymer as a source of outgassing. Examples of azo polymerization initiators include 2,2'-azobisisobutyronitrile (hereinafter sometimes referred to as AIBN), 2,2'-azobis-2-methylbutyronitrile (hereinafter sometimes referred to as AMBN), 2,2'-azobis(2-methylpropionate) dimethyl, and 4,4'-azobis-4-cyanovaleric acid.

[0090] The photopolymerization initiator can be preferably used when obtaining an acrylic polymer by active energy ray polymerization. Examples of the photopolymerization initiator include a benzoin ether-based photopolymerization initiator, an acetophenone-based photopolymerization initiator, an α-ketol-based photopolymerization initiator, an aromatic sulfonyl chloride-based photopolymerization initiator, a photoactive oxime-based photopolymerization initiator, a benzoin-based photopolymerization initiator, a benzyl-based photopolymerization initiator, a benzophenone-based photopolymerization initiator, a ketal-based photopolymerization initiator, and a thioxanthone-based photopolymerization initiator.

[0091] Examples of benzoin ether-based photopolymerization initiators include benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2,2-dimethoxy-1,2-diphenylethan-1-one, and anisole methyl ether. Examples of acetophenone-based photopolymerization initiators include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexyl phenyl ketone, 4-phenoxydichloroacetophenone, and 4-(t-butyl)dichloroacetophenone. Examples of α-ketol-based photopolymerization initiators include 2-methyl-2-hydroxypropiophenone and 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropan-1-one. Examples of aromatic sulfonyl chloride-based photopolymerization initiators include 2-naphthalenesulfonyl chloride. Examples of photoactive oxime-based photopolymerization initiators include 1-phenyl-1,1-propanedione-2-(o-ethoxycarbonyl)-oxime. Examples of benzoin-based photopolymerization initiators include benzoin. Examples of benzyl-based photopolymerization initiators include benzil. Examples of benzophenone-based photopolymerization initiators include benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, and α-hydroxycyclohexyl phenyl ketone. Examples of ketal-based photopolymerization initiators include benzil dimethyl ketal. Examples of thioxanthone-based photopolymerization initiators include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, and dodecylthioxanthone.

[0092] The acrylic pressure-sensitive adhesive composition may contain a crosslinking agent. By using a crosslinking agent, the cohesive strength of the acrylic pressure-sensitive adhesive can be improved, and the effects of the present invention can be further exhibited. The crosslinking agent may be one type only, or two or more types.

[0093] Examples of crosslinking agents include polyfunctional isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, as well as urea-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, amine-based crosslinking agents, etc. Among these, at least one selected from the group consisting of polyfunctional isocyanate-based crosslinking agents and epoxy-based crosslinking agents (component c) is preferred in terms of being able to further exhibit the effects of the present invention.

[0094] Examples of polyfunctional isocyanate crosslinking agents include lower aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; alicyclic polyisocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate, isophorone diisocyanate, hydrogenated tolylene diisocyanate, and hydrogenated xylene diisocyanate; and aromatic polyisocyanates such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylene diisocyanate. Examples of polyfunctional isocyanate crosslinking agents include commercially available products such as trimethylolpropane / tolylene diisocyanate adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate L"), trimethylolpropane / hexamethylene diisocyanate adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate HL"), trade name "Coronate HX" (Nippon Polyurethane Industry Co., Ltd.), and trimethylolpropane / xylylene diisocyanate adduct (manufactured by Mitsui Chemicals, Inc., trade name "Takenate 110N").

[0095] Examples of epoxy crosslinking agents (polyfunctional epoxy compounds) include N,N,N',N'-tetraglycidyl-m-xylylenediamine, diglycidylaniline, 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, and methyl ... Examples of epoxy crosslinking agents include diglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipic acid diglycidyl ester, o-phthalic acid diglycidyl ester, triglycidyl-tris(2-hydroxyethyl)isocyanurate, resorcinol diglycidyl ether, and bisphenol-S-diglycidyl ether, as well as epoxy resins having two or more epoxy groups in the molecule. Examples of epoxy crosslinking agents include commercially available products such as "Tetrad C" (manufactured by Mitsubishi Gas Chemical Company, Inc.).

[0096] The content of the crosslinking agent in the acrylic pressure-sensitive adhesive composition may be any appropriate content within the range that does not impair the effects of the present invention. For example, in order to further exhibit the effects of the present invention, such a content is preferably 0.05 to 20 parts by weight, more preferably 0.1 to 18 parts by weight, even more preferably 0.5 to 15 parts by weight, and particularly preferably 0.5 to 10 parts by weight, relative to the solid content (100 parts by weight) of the acrylic polymer.

[0097] The acrylic pressure-sensitive adhesive composition may contain any other appropriate components as long as they do not impair the effects of the present invention. Examples of such other components include polymer components other than acrylic polymers, crosslinking accelerators, crosslinking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), antioxidants, inorganic fillers, organic fillers, metal powders, colorants (pigments, dyes, etc.), foil-like materials, UV absorbers, antioxidants, light stabilizers, chain transfer agents, plasticizers, softeners, surfactants, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, lubricants, solvents, catalysts, etc.

[0098] <1-2-2. Urethane adhesive> As the urethane-based pressure-sensitive adhesive, any appropriate urethane-based pressure-sensitive adhesive can be used, as long as it does not impair the effects of the present invention, such as known urethane-based pressure-sensitive adhesives described in JP 2017-039859 A. Such a urethane-based pressure-sensitive adhesive can be, for example, a urethane-based pressure-sensitive adhesive formed from a urethane-based pressure-sensitive adhesive composition, the urethane-based pressure-sensitive adhesive composition containing at least one selected from the group consisting of urethane prepolymers and polyols, and a crosslinking agent. The urethane-based pressure-sensitive adhesive may be of only one type, or may be of two or more types. The urethane-based pressure-sensitive adhesive can contain any appropriate component, as long as it does not impair the effects of the present invention.

[0099] <1-2-3. Rubber-based adhesives> The rubber-based pressure-sensitive adhesive is typically formed from a rubber-based pressure-sensitive adhesive composition. The rubber-based pressure-sensitive adhesive composition typically contains a rubber-based polymer. As the rubber-based pressure-sensitive adhesive, any appropriate rubber-based pressure-sensitive adhesive may be used, for example, known rubber-based pressure-sensitive adhesives described in JP 2015-074771 A, etc., as long as the effects of the present invention are not impaired. These may be used alone or in combination of two or more types. The rubber-based pressure-sensitive adhesive may contain any appropriate component as long as the effects of the present invention are not impaired.

[0100] <1-2-4. Silicone adhesive> The silicone-based pressure-sensitive adhesive is typically formed from a silicone-based pressure-sensitive adhesive composition. The silicone-based pressure-sensitive adhesive composition typically contains a silicone-based polymer. As the silicone-based pressure-sensitive adhesive, any appropriate silicone-based pressure-sensitive adhesive may be used, for example, known silicone-based pressure-sensitive adhesives described in JP 2014-047280 A, etc., as long as the effects of the present invention are not impaired. These may be used alone or in combination of two or more types. The silicone-based pressure-sensitive adhesive may contain any appropriate component as long as the effects of the present invention are not impaired.

[0101] <1-2-5. Conductive Components> The pressure-sensitive adhesive layer (1) may contain a conductive component. Typically, the pressure-sensitive adhesive composition (at least one selected from the group consisting of an acrylic pressure-sensitive adhesive composition, a urethane pressure-sensitive adhesive composition, a rubber pressure-sensitive adhesive composition, and a silicone pressure-sensitive adhesive composition) that is the material of the pressure-sensitive adhesive layer (1) may contain a conductive component.

[0102] Any appropriate conductive component may be used as the conductive component as long as it does not impair the effects of the present invention. Such a conductive component is preferably at least one compound selected from an ionic liquid, an ion-conductive polymer, an ion-conductive filler, and an electrically conductive polymer.

[0103] When the pressure-sensitive adhesive composition contains a conductive component, the ratio of the base polymer (e.g., acrylic polymer, polyol, urethane prepolymer, rubber polymer, silicone polymer) to the conductive component is preferably 0.01 to 10 parts by weight, more preferably 0.05 to 9.0 parts by weight, even more preferably 0.075 to 8.0 parts by weight, and particularly preferably 0.1 to 7.0 parts by weight, per 100 parts by weight of the base polymer.

[0104] Any appropriate ionic liquid can be used as the ionic liquid as long as it does not impair the effects of the present invention. Here, the ionic liquid refers to a molten salt (ionic compound) that is liquid at 25° C. Only one type of ionic liquid may be used, or two or more types may be used.

[0105] Such an ionic liquid is preferably an ionic liquid composed of a fluoroorganic anion and an onium cation.

[0106] Any appropriate onium cation can be used as the onium cation that can constitute the ionic liquid, as long as it does not impair the effects of the present invention. Such onium cation is preferably at least one selected from the group consisting of nitrogen-containing onium cations, sulfur-containing onium cations, and phosphorus-containing onium cations.

[0107] The onium cation that can constitute the ionic liquid is preferably at least one selected from the cations having structures represented by general formulas (1) to (5), in that it can further exert the effects of the present invention. [ka]

[0108] In general formula (1), Ra represents a hydrocarbon group having 4 to 20 carbon atoms, which may contain a heteroatom, and Rb and Rc are the same or different and represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms, which may contain a heteroatom, provided that when the nitrogen atom contains a double bond, Rc does not exist.

[0109] In general formula (2), Rd represents a hydrocarbon group having 2 to 20 carbon atoms, which may contain a heteroatom, and Re, Rf, and Rg may be the same or different and represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms, which may contain a heteroatom.

[0110] In general formula (3), Rh represents a hydrocarbon group having 2 to 20 carbon atoms, which may contain a heteroatom, and Ri, Rj, and Rk may be the same or different and represent hydrogen or a hydrocarbon group having 1 to 16 carbon atoms, which may contain a heteroatom.

[0111] In general formula (4), Z represents a nitrogen atom, a sulfur atom, or a phosphorus atom, and R, Rm, Rn, and Ro are the same or different and represent a hydrocarbon group having 1 to 20 carbon atoms, which may contain a heteroatom, provided that when Z is a sulfur atom, Ro does not exist.

[0112] In the general formula (5), X represents a Li atom, a Na atom, or a K atom.

[0113] Examples of the cation represented by general formula (1) include a pyridinium cation, a pyrrolidinium cation, a piperidinium cation, a cation having a pyrroline skeleton, and a cation having a pyrrole skeleton.

[0114] Specific examples of the cation represented by general formula (1) include pyridinium cations such as 1-ethylpyridinium cation, 1-butylpyridinium cation, 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-hexyl-3-methylpyridinium cation, 1-butyl-4-methylpyridinium cation, and 1-octyl-4-methylpyridinium cation; 1-ethyl-1-methylpyrrolidinium cation, 1-methyl-1-pyridinium cation, and -propylpyrrolidinium cation, 1-methyl-1-butylpyrrolidinium cation, 1-methyl-1-pentylpyrrolidinium cation, 1-methyl-1-hexylpyrrolidinium cation, 1-methyl-1-heptylpyrrolidinium cation, 1-ethyl-1-propylpyrrolidinium cation, 1-ethyl-1-butylpyrrolidinium cation, 1-ethyl-1-pentylpyrrolidinium cation, 1-ethyl-1-hexylpyrrolidinium cation, 1-ethyl-1-heptylpyrrolidinium cation, etc. pyrrolidinium cation; 1-methyl-1-ethylpiperidinium cation, 1-methyl-1-propylpiperidinium cation, 1-methyl-1-butylpiperidinium cation, 1-methyl-1-pentylpiperidinium cation, 1-methyl-1-hexylpiperidinium cation, 1-methyl-1-heptylpiperidinium cation, 1-ethyl-1-propylpiperidinium cation, 1-ethyl-1-butylpiperidinium cation, 1-ethyl-1-pentylpiperidinium cation, 1-ethyl piperidinium cations such as 1-hexylpiperidinium cation, 1-ethyl-1-heptylpiperidinium cation, and 1-propyl-1-butylpiperidinium cation; and more preferably, 1-hexylpyridinium cation, 1-ethyl-3-methylpyridinium cation, 1-butyl-3-methylpyridinium cation, 1-octyl-4-methylpyridinium cation, 1-methyl-1-propylpyrrolidinium cation, and 1-methyl-1-propylpiperidinium cation.

[0115] Examples of the cation represented by general formula (2) include an imidazolium cation, a tetrahydropyrimidinium cation, and a dihydropyrimidinium cation.

[0116] Specific examples of the cation represented by general formula (2) include imidazolium cations such as 1,3-dimethylimidazolium cation, 1,3-diethylimidazolium cation, 1-ethyl-3-methylimidazolium cation, 1-butyl-3-methylimidazolium cation, 1-hexyl-3-methylimidazolium cation, 1-octyl-3-methylimidazolium cation, 1-decyl-3-methylimidazolium cation, 1-dodecyl-3-methylimidazolium cation, and 1-tetradecyl-3-methylimidazolium cation, and more preferably 1-ethyl-3-methylimidazolium cation and 1-hexyl-3-methylimidazolium cation.

[0117] Examples of the cation represented by general formula (3) include a pyrazolium cation and a pyrazolinium cation.

[0118] Specific examples of the cation represented by general formula (3) include pyrazolium cations such as a 1-methylpyrazolium cation, a 3-methylpyrazolium cation, a 1-ethyl-2-methylpyrazolinium cation, a 1-ethyl-2,3,5-trimethylpyrazolium cation, a 1-propyl-2,3,5-trimethylpyrazolium cation, and a 1-butyl-2,3,5-trimethylpyrazolium cation; and pyrazolinium cations such as a 1-ethyl-2,3,5-trimethylpyrazolinium cation, a 1-propyl-2,3,5-trimethylpyrazolinium cation, and a 1-butyl-2,3,5-trimethylpyrazolinium cation.

[0119] Examples of the cation represented by general formula (4) include tetraalkylammonium cations, trialkylsulfonium cations, tetraalkylphosphonium cations, and cations in which a portion of the alkyl groups is substituted with an alkenyl group, an alkoxyl group, or even an epoxy group.

[0120] Specific examples of the cation represented by general formula (4) include asymmetric tetraalkylammonium cations, trialkylsulfonium cations, and tetraalkylphosphonium cations such as triethylmethylammonium cation, tributylethylammonium cation, trimethyldecylammonium cation, diethylmethylsulfonium cation, dibutylethylsulfonium cation, dimethyldecylsulfonium cation, triethylmethylphosphonium cation, tributylethylphosphonium cation, and trimethyldecylphosphonium cation; N,N-diethyl-N-methyl-N-(2-methoxyethyl)ammonium cation, glycidyltrimethylammonium cation, diallyldimethylammonium cation, N,N-dimethyl-N-ethyl-N-propylammonium cation, N,N-dimethyl-N-ethyl-N-butylammonium cation, N,N-dimethyl-N-ethyl-N-pentylammonium cation, N,N-dimethyl-N-ethyl-N-hexylammonium cation; N-dimethyl-N-ethyl-N-heptylammonium cation, N,N-dimethyl-N-ethyl-N-nonylammonium cation, N,N-dimethyl-N,N-dipropylammonium cation, N,N-diethyl-N-propyl-N-butylammonium cation, N,N-dimethyl-N-propyl-N-pentylammonium cation, N,N-dimethyl-N-propyl-N-hexylammonium cation, N,N-dimethyl-N-propyl-N-heptylammonium cation, N,N-dimethyl-N- Butyl-N-hexylammonium cation, N,N-diethyl-N-butyl-N-heptylammonium cation, N,N-dimethyl-N-pentyl-N-hexylammonium cation, N,N-dimethyl-N,N-dihexylammonium cation, trimethylheptylammonium cation, N,N-diethyl-N-methyl-N-propylammonium cation, N,N-diethyl-N-methyl-N-pentylammonium cation, N,N-diethyl-N-methyl-N-heptylammonium cation, N,Examples of the cation include N-diethyl-N-propyl-N-pentylammonium cation, triethylpropylammonium cation, triethylpentylammonium cation, triethylheptylammonium cation, N,N-dipropyl-N-methyl-N-ethylammonium cation, N,N-dipropyl-N-methyl-N-pentylammonium cation, N,N-dipropyl-N-butyl-N-hexylammonium cation, N,N-dipropyl-N,N-dihexylammonium cation, N,N-dibutyl-N-methyl-N-pentylammonium cation, N,N-dibutyl-N-methyl-N-hexylammonium cation, trioctylmethylammonium cation, and N-methyl-N-ethyl-N-propyl-N-pentylammonium cation, with trimethylpropylammonium cation being more preferred.

[0121] As the fluoroorganic anion that can constitute the ionic liquid, any appropriate fluoroorganic anion can be used as long as it does not impair the effects of the present invention. Such a fluoroorganic anion may be completely fluorinated (perfluorinated) or partially fluorinated.

[0122] Examples of such fluoroorganic anions include perfluoroalkylsulfonates, bis(fluorosulfonyl)imides, and bis(perfluoroalkanesulfonyl)imides, and more specifically, examples include trifluoromethanesulfonate, pentafluoroethanesulfonate, heptafluoropropanesulfonate, nonafluorobutanesulfonate, bis(fluorosulfonyl)imides, and bis(trifluoromethanesulfonyl)imides.

[0123] Specific examples of the ionic liquid may be appropriately selected from the combinations of the above-mentioned cation components and the above-mentioned anion components. Specific examples of such ionic liquids include, for example, 1-hexylpyridinium bis(fluorosulfonyl)imide, 1-ethyl-3-methylpyridinium trifluoromethanesulfonate, 1-ethyl-3-methylpyridinium pentafluoroethanesulfonate, 1-ethyl-3-methylpyridinium heptafluoropropanesulfonate, 1-ethyl-3-methylpyridinium nonafluorobutanesulfonate, 1-butyl-3-methylpyridinium trifluoromethanesulfonate, 1-butyl-3-methylpyridinium bis(trifluoromethanesulfonyl)imide, 1-octyl-4-methylpyridinium bis(fluorosulfonyl)imide, 1-methyl-1-propylpyrrolidinium bis(trifluoromethanesulfonyl)imide, 1-methyl-1-propylpyrrolidinium bis( bis(fluorosulfonyl)imide, 1-methyl-1-propylpiperidinium bis(fluorosulfonyl)imide, 1-methyl-1-propylpiperidinium bis(fluorosulfonyl)imide, 1-ethyl-3-methylimidazolium trifluoromethanesulfonate, 1-ethyl-3-methylimidazolium heptafluoropropanesulfonate, 1-ethyl-3-methylimidazolium bis(trifluoromethanesulfonyl)imide, 1-ethyl-3-methylimidazolium bis(fluorosulfonyl)imide, 1-hexyl-3-methylimidazolium bis(fluorosulfonyl)imide, trimethylpropylammonium bis(trifluoromethanesulfonyl)imide, lithium bis(trifluoromethanesulfonyl)imide, and lithium bis(fluorosulfonyl)imide.

[0124] Commercially available ionic liquids may be used, but they can also be synthesized as follows. The method for synthesizing an ionic liquid is not particularly limited as long as the desired ionic liquid can be obtained. Generally, methods such as the halide method, hydroxide method, acid ester method, complex formation method, and neutralization method are used, as described in the literature "Ionic Liquids - The Frontline and Future of Development" (published by CMC Publishing Co., Ltd.).

[0125] The synthesis methods for nitrogen-containing onium salts are described below using the halide method, hydroxide method, acid ester method, complex formation method, and neutralization method as examples. However, other ionic liquids, such as sulfur-containing onium salts and phosphorus-containing onium salts, can also be obtained by similar methods.

[0126] The halide method is a method carried out by the reactions shown in reaction formulas (1) to (3). First, a tertiary amine is reacted with an alkyl halide to obtain a halide (reaction formula (1), where chlorine, bromine, or iodine are used as the halogen).

[0127] The anion structure of the ionic liquid (A - The desired ionic liquid (R4NA) is obtained by reacting the ionic liquid with an acid (HA) or salt (MA, where M is a cation that forms a salt with the desired anion, such as ammonium, lithium, sodium, or potassium).

[0128] [ka]

[0129] The hydroxide method is a method carried out by the reactions shown in reaction formulas (4) to (8). First, a halide (R4NX) is electrolyzed using an ion exchange membrane (reaction formula (4)), an OH-type ion exchange resin (reaction formula (5)), or reacted with silver oxide (Ag2O) (reaction formula (6)) to obtain a hydroxide (R4NOH) (chlorine, bromine, or iodine is used as the halogen).

[0130] The target ionic liquid (R4NA) can be obtained by using the obtained hydroxide in the same manner as in the halogenation method described above, using the reactions of reaction formulas (7) and (8).

[0131] [ka]

[0132] The acid ester method is a method carried out by the reactions shown in reaction formulas (9) to (11). First, a tertiary amine (RN) is reacted with an acid ester to obtain an acid ester (reaction formula (9)). Examples of acid esters that can be used include esters of inorganic acids such as sulfuric acid, sulfurous acid, phosphoric acid, phosphorous acid, and carbonic acid, and esters of organic acids such as methanesulfonic acid, methylphosphonic acid, and formic acid).

[0133] The desired ionic liquid (R4NA) can be obtained by subjecting the resulting acid ester to the same reactions as in the halogenation method described above, as shown in Reaction Schemes (10) and (11). Alternatively, ionic liquids can be obtained directly by using methyl trifluoromethanesulfonate, methyl trifluoroacetate, or the like as the acid ester.

[0134] [ka]

[0135] The neutralization method is carried out by the reaction shown in reaction formula (12). It can be obtained by reacting a tertiary amine with an organic acid such as CF3COOH, CF3SO3H, (CF3SO2)2NH, (CF3SO2)3CH, or (C2F5SO2)2NH.

[0136] [ka]

[0137] R in the above reaction formulas (1) to (12) represents hydrogen or a hydrocarbon group having 1 to 20 carbon atoms, which may contain a heteroatom.

[0138] Any appropriate ion-conductive polymer can be used as the ion-conductive polymer as long as it does not impair the effects of the present invention. Examples of such ion-conductive polymers include ion-conductive polymers obtained by polymerizing or copolymerizing a monomer having a quaternary ammonium salt group; conductive polymers such as polythiophene, polyaniline, polypyrrole, polyethyleneimine, and allylamine-based polymers; and the like. The ion-conductive polymer may be of one type or two or more types.

[0139] Any suitable ion-conductive filler can be used as the ion-conductive filler as long as it does not impair the effects of the present invention. Examples of such ion-conductive fillers include tin oxide, antimony oxide, indium oxide, cadmium oxide, titanium oxide, zinc oxide, indium, tin, antimony, gold, silver, copper, aluminum, nickel, chromium, titanium, iron, cobalt, copper iodide, ITO (indium oxide / tin oxide), and ATO (antimony oxide / tin oxide). Only one type of ion-conductive filler may be used, or two or more types may be used.

[0140] Any suitable electrically conductive polymer may be used as the electrically conductive polymer as long as it does not impair the effects of the present invention, such as (3,4-ethylenedioxythiophene)-poly(styrenesulfonic acid).

[0141] <1-2-6. Other ingredients> The adhesive composition (at least one selected from the group consisting of acrylic adhesive compositions, urethane adhesive compositions, rubber adhesive compositions, and silicone adhesive compositions) used as the material for the adhesive layer (1) may contain any appropriate other components within the scope of the present invention. Examples of such other components include other polymer components, crosslinking accelerators, crosslinking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), antioxidants, inorganic fillers, organic fillers, metal powders, colorants (pigments, dyes, etc.), foils, UV absorbers, antioxidants, light stabilizers, chain transfer agents, plasticizers, softeners, surfactants, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, lubricants, solvents, and catalysts.

[0142] <1-3. Resin film (2)> The thickness of the resin film (2) may be any appropriate thickness depending on the purpose, as long as it does not impair the effects of the present invention. In order to further exhibit the effects of the present invention, the thickness is preferably 25 μm to 500 μm, more preferably 25 μm to 400 μm, even more preferably 25 μm to 300 μm, particularly preferably 25 μm to 200 μm, and most preferably 25 μm to 150 μm.

[0143] The resin film (2) includes a resin substrate film (2a).

[0144] Examples of the resin substrate film (2a) include plastic films made of polyester-based resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); plastic films made of olefin-based resins containing α-olefins as monomer components, such as polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), ethylene-propylene copolymer, and ethylene-vinyl acetate copolymer (EVA); plastic films made of polyvinyl chloride (PVC); plastic films made of vinyl acetate-based resins; plastic films made of polycarbonate (PC); and polyphenylene sulfide (PPS). plastic films made of amide-based resins such as polyamide (nylon) and wholly aromatic polyamide (aramid); plastic films made of polyimide-based resins; plastic films made of polyether ether ketone (PEEK); plastic films made of olefin-based resins such as polyethylene (PE) and polypropylene (PP); plastic films made of fluorine-based resins such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, and chlorofluoroethylene-vinylidene fluoride copolymer; and the like.

[0145] The resin substrate film (2a) may be one layer or two or more layers. The resin substrate film (2a) may be stretched.

[0146] The resin substrate film (2a) may be subjected to a surface treatment, such as corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage shock exposure, ionizing radiation treatment, and coating with a primer.

[0147] The resin substrate film (2a) may contain any suitable additive depending on the purpose, as long as the effect of the present invention is not impaired.

[0148] The additives include, for example, transmittance control agents, etc. Examples of such transmittance control agents include color pigments and color dyes, and preferably black pigments and black dyes.

[0149] When the resin substrate film (2a) contains a transmittance control agent, the content is preferably 0.01 to 5% by weight, more preferably 0.1 to 3% by weight, and even more preferably 0.5 to 1% by weight, in order to further exhibit the effects of the present invention.

[0150] The resin film (2) may have a conductive layer (2b), which may be disposed between the pressure-sensitive adhesive layer (1) and the resin substrate film (2a).

[0151] The conductive layer (2b) may be a single layer or may be two or more layers.

[0152] The conductive layer (2b) can be provided by forming it on any suitable substrate, and such a substrate is preferably a resin substrate film (2a).

[0153] The conductive layer (2b) is formed by forming a conductive film on any suitable substrate (preferably a resin substrate film (2a)) by any suitable thin film formation method, such as vacuum deposition, sputtering, ion plating, spray pyrolysis, chemical plating, electroplating, or a combination thereof. Among these thin film formation methods, vacuum deposition and sputtering are preferred in terms of the rate of conductive film formation, the ability to form large-area films, productivity, etc.

[0154] Materials for forming the conductive film include, for example, metal-based materials such as gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, and alloys thereof; metal oxide-based materials such as indium oxide, tin oxide, titanium oxide, cadmium oxide, and mixtures thereof; and other metal compounds such as copper iodide.

[0155] The thickness of the conductive layer (2b) may be any appropriate thickness depending on the purpose, as long as it does not impair the effects of the present invention. For example, when the conductive layer (2b) is made of a metal material, the thickness is preferably 30 Å to 600 Å, and when the conductive layer (2b) is made of a metal oxide material, the thickness is preferably 80 Å to 5000 Å.

[0156] The surface resistance of the conductive layer (2b) is preferably 1.0×10 10 Ω / □ or less, and more preferably 1.0×10 9 Ω / □ or less, and more preferably 1.0×10 8 Ω / □ or less, and particularly preferably 1.0×10 7 It is Ω / □ or less.

[0157] When forming the conductive film on any suitable substrate (preferably a resin substrate film (2a)), the surface of the substrate (preferably a resin substrate film (2a)) may be subjected to any suitable pretreatment such as corona discharge treatment, ultraviolet irradiation treatment, plasma treatment, sputter etching treatment, undercoat treatment, etc., to enhance the adhesion between the conductive film and the substrate (preferably a resin substrate film (2a)).

[0158] The resin film (2) may have an antistatic layer (2c), which may be disposed between the pressure-sensitive adhesive layer (1) and the resin substrate film (2a) and / or between the resin substrate film (2a) and the pressure-sensitive adhesive layer (2).

[0159] The antistatic layer (2c) may be a single layer or may be two or more layers.

[0160] The thickness of the antistatic layer (2c) may be any appropriate thickness depending on the purpose, as long as it does not impair the effects of the present invention. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, even more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

[0161] The surface resistance of the antistatic layer (2c) is preferably 1.0×10 10 Ω / □ or less, and more preferably 8.0×10 9 Ω / □ or less, and more preferably 5.0×10 9 Ω / □ or less, and particularly preferably 1.0×10 9 It is Ω / □ or less.

[0162] Any suitable antistatic layer (2c) can be used as long as it can provide an antistatic effect and does not impair the effects of the present invention. Such an antistatic layer is preferably an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on any suitable substrate layer. Specifically, for example, an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on a resin substrate film (2a). After coating, the layer is dried as needed, and cured as needed (heat treatment, ultraviolet treatment, etc.). Specific coating methods include roll coating, bar coating, and gravure coating.

[0163] Any suitable conductive coating liquid containing a conductive polymer may be used as long as it does not impair the effects of the present invention. Such a conductive coating liquid preferably contains a conductive polymer, a binder, a crosslinking agent, and a solvent. Since the solvent is substantially eliminated by volatilization or evaporation due to heating or the like during the process of forming the antistatic layer (2c), the antistatic layer (2c) preferably contains a conductive polymer, a binder, and a crosslinking agent.

[0164] Examples of the solvent include organic solvents, water, and mixed solvents thereof. Examples of the organic solvent include esters such as ethyl acetate; ketones such as methyl ethyl ketone, acetone, and cyclohexanone; cyclic ethers such as tetrahydrofuran (THF) and dioxane; aliphatic or alicyclic hydrocarbons such as n-hexane and cyclohexane; aromatic hydrocarbons such as toluene and xylene; aliphatic or alicyclic alcohols such as methanol, ethanol, n-propanol, isopropanol, and cyclohexanol; glycol ethers such as alkylene glycol monoalkyl ethers (e.g., ethylene glycol monomethyl ether and ethylene glycol monoethyl ether) and dialkylene glycol monoalkyl ethers. The solvent is preferably water or a mixed solvent containing water as the main component (e.g., a mixed solvent of water and ethanol).

[0165] The content of the conductive polymer in the antistatic layer (2c) is preferably 3 to 80% by weight, more preferably 5 to 60% by weight.

[0166] Any suitable conductive polymer may be used as the conductive polymer as long as it does not impair the effects of the present invention. Examples of such conductive polymers include conductive polymers in which a π-conjugated conductive polymer is doped with a polyanion. Examples of π-conjugated conductive polymers include chain-like conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. Examples of polyanions include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallyl sulfonic acid, polyacrylic acid ethyl sulfonic acid, and polymethacrylic carboxylic acid.

[0167] The conductive polymer may be of only one type, or of two or more types.

[0168] The content of the binder in the antistatic layer (2c) is preferably 50% to 95% by weight, more preferably 60% to 90% by weight.

[0169] Any appropriate binder may be used as the binder contained in the conductive coating liquid as long as it does not impair the effects of the present invention. The binder may be one type only or two or more types. Such a binder is preferably a resin, more preferably a polyester resin. The proportion of the polyester resin in the binder is preferably 90% by weight to 100% by weight, more preferably 98% by weight to 100% by weight.

[0170] The polyester resin preferably contains polyester as the main component (preferably more than 50% by weight, more preferably 75% by weight or more, even more preferably 90% by weight or more, and particularly preferably a component that accounts for substantially 100% by weight).

[0171] As the polyester, any appropriate polyester can be used as long as it does not impair the effects of the present invention. Preferably, such polyester has a structure obtained by condensing one or more compounds (polycarboxylic acid components) selected from polycarboxylic acids (e.g., dicarboxylic acid compounds) having two or more carboxyl groups in one molecule and derivatives thereof (e.g., anhydrides, esters, halides, etc. of polycarboxylic acids) with one or more compounds (polyhydric alcohol components) selected from polyhydric alcohols (e.g., diols) having two or more hydroxyl groups in one molecule.

[0172] Any suitable polycarboxylic acid can be used as the polycarboxylic acid component as long as it does not impair the effects of the present invention. Examples of such polycarboxylic acid components include oxalic acid, malonic acid, difluoromalonic acid, alkylmalonic acid, succinic acid, tetrafluorosuccinic acid, alkylsuccinic acid, (±)-malic acid, meso-tartaric acid, itaconic acid, maleic acid, methylmaleic acid, fumaric acid, methylfumaric acid, acetylenedicarboxylic acid, glutaric acid, hexafluoroglutaric acid, methylglutaric acid, glutaconic acid, adipic acid, dithioadipic acid, methyladipic acid, dimethyladipic acid, tetramethyladipic acid, methyleneadipic acid, muconic acid, galactaric acid, pimelic acid, and suberic acid. aliphatic dicarboxylic acids such as perfluorosuberic acid, 3,3,6,6-tetramethylsuberic acid, azelaic acid, sebacic acid, perfluorosebacic acid, brassylic acid, dodecyldicarboxylic acid, tridecyldicarboxylic acid, and tetradecyldicarboxylic acid; alicyclic dicarboxylic acids such as cycloalkyldicarboxylic acids (e.g., 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid), 1,4-(2-norbornene)dicarboxylic acid, 5-norbornene-2,3-dicarboxylic acid (himic acid), adamantanedicarboxylic acid, and spiroheptanedicarboxylic acid;Phthalic acid, isophthalic acid, dithioisophthalic acid, methylisophthalic acid, dimethylisophthalic acid, chloroisophthalic acid, dichloroisophthalic acid, terephthalic acid, methyl terephthalic acid, dimethyl terephthalic acid, chloroterephthalic acid, bromoterephthalic acid, naphthalenedicarboxylic acid, oxofluorenedicarboxylic acid, anthracene dicarboxylic acid, biphenyl dicarboxylic acid, biphenylenedicarboxylic acid, dimethylbiphenylenedicarboxylic acid, 4,4"-p-terephenylenedicarboxylic acid, 4,4"-p-quarelphenyldicarboxylic acid, bibenzyl dicarboxylic acid, azobenzenedicarboxylic acid, homophthalic acid, phenylene diacetic acid, phenyl Examples of suitable polycarboxylic acids include aromatic dicarboxylic acids such as dipropionic acid, naphthalenedicarboxylic acid, naphthalenedipropionic acid, biphenyldiacetic acid, biphenyldipropionic acid, 3,3'-[4,4'-(methylenedi-p-biphenylene)dipropionic acid, 4,4'-bibenzyldiacetic acid, 3,3'(4,4'-bibenzyl)dipropionic acid, and oxydi-p-phenylenediacetic acid; acid anhydrides of any of the above polycarboxylic acids; esters of any of the above polycarboxylic acids (e.g., alkyl esters, monoesters, diesters, etc.); and acid halides corresponding to any of the above polycarboxylic acids (e.g., dicarboxylic acid chlorides).

[0173] Preferred examples of the polycarboxylic acid component include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, and naphthalenedicarboxylic acid, and their acid anhydrides; aliphatic dicarboxylic acids such as adipic acid, sebacic acid, azelaic acid, succinic acid, fumaric acid, maleic acid, himic acid, and 1,4-cyclohexanedicarboxylic acid, and their acid anhydrides; and lower alkyl esters of these dicarboxylic acids (for example, esters with monoalcohols having 1 to 3 carbon atoms).

[0174] As the polyhydric alcohol component, any suitable polyhydric alcohol can be used as long as it does not impair the effects of the present invention. Examples of such polyhydric alcohol components include diols such as ethylene glycol, propylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, 1,6-hexanediol, 3-methylpentanediol, diethylene glycol, 1,4-cyclohexanedimethanol, 3-methyl-1,5-pentanediol, 2-methyl-1,3-propanediol, 2,2-diethyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, xylylene glycol, hydrogenated bisphenol A, and bisphenol A; alkylene oxide adducts of these diols (e.g., ethylene oxide adducts, propylene oxide adducts, etc.); and the like.

[0175] The molecular weight of the polyester resin is preferably 5×10 as a weight average molecular weight (Mw) converted into standard polystyrene as measured by gel permeation chromatography (GPC). 3 ~1.5×10 5 and more preferably 1×10 4 ~6×10 4 is.

[0176] The glass transition temperature (Tg) of the polyester resin is preferably 0 to 120°C, and more preferably 10 to 80°C.

[0177] As the polyester resin, for example, a commercially available product such as "Vylonal" manufactured by Toyobo Co., Ltd. can be used.

[0178] The conductive coating liquid may further contain, as a binder, a resin other than polyester resin (for example, at least one resin selected from acrylic resin, acrylic urethane resin, acrylic styrene resin, acrylic silicone resin, silicone resin, polysilazane resin, polyurethane resin, fluororesin, and polyolefin resin) within a range that does not impair the effects of the present invention.

[0179] Any appropriate crosslinking agent may be used as the crosslinking agent contained in the conductive coating liquid as long as it does not impair the effects of the present invention. The crosslinking agent may be one type or two or more types. Examples of such crosslinking agents include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, and peroxide-based crosslinking agents, as well as urea-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, and amine-based crosslinking agents. Among these, melamine-based crosslinking agents are preferred.

[0180] The content of the crosslinking agent in the antistatic layer (2c) is preferably 1 to 30% by weight, more preferably 2 to 20% by weight.

[0181] The antistatic layer (2c) may contain any other appropriate components as long as the effects of the present invention are not impaired.

[0182] <1-4. Adhesive layer (2)> Any appropriate adhesive layer can be adopted as the adhesive layer (2) as long as it does not impair the effects of the present invention. The adhesive layer (2) may be a single layer or may be two or more layers.

[0183] The thickness of the pressure-sensitive adhesive layer (2) is preferably 0.5 μm to 150 μm, more preferably 1 μm to 100 μm, even more preferably 2 μm to 80 μm, particularly preferably 3 μm to 50 μm, and most preferably 5 μm to 30 μm, in order to further exhibit the effects of the present invention.

[0184] The pressure-sensitive adhesive layer (2) can be formed by any appropriate method. Examples of such methods include a method in which a pressure-sensitive adhesive composition that forms the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer (2) is applied to any appropriate substrate (e.g., a resin film (3)), heated and dried as necessary, and cured as necessary to form a pressure-sensitive adhesive layer on the substrate. Examples of such application methods include methods using a gravure roll coater, reverse roll coater, kiss roll coater, dip roll coater, bar coater, knife coater, air knife coater, spray coater, comma coater, direct coater, roll brush coater, etc.

[0185] The pressure-sensitive adhesive layer (2) may contain any appropriate additives as long as the effects of the present invention are not impaired.

[0186] The additives include, for example, transmittance control agents, etc. Examples of such transmittance control agents include color pigments and color dyes, and preferably black pigments and black dyes.

[0187] When the pressure-sensitive adhesive layer (2) contains a transmittance control agent, the content ratio of the transmittance control agent is preferably 0.01 to 5% by weight, more preferably 0.1 to 3% by weight, and even more preferably 0.5 to 1% by weight, relative to the polymer component contained in the pressure-sensitive adhesive composition (typically, an acrylic pressure-sensitive adhesive composition) forming the pressure-sensitive adhesive layer (2), in order to further exhibit the effects of the present invention. Note that the "polymer component" referred to here refers to an acrylic polymer in the case of an acrylic pressure-sensitive adhesive composition.

[0188] <1-4-1. Acrylic adhesive> The adhesive layer (2) is preferably made of an acrylic adhesive.

[0189] The acrylic pressure-sensitive adhesive is formed from an acrylic pressure-sensitive adhesive composition.

[0190] The acrylic pressure-sensitive adhesive composition preferably contains an acrylic polymer and a crosslinking agent, in that the effects of the present invention can be more effectively exhibited.

[0191] The acrylic polymer is what can be called a base polymer in the field of acrylic pressure-sensitive adhesives. The acrylic polymer may be of only one type, or may be of two or more types.

[0192] The content of the acrylic polymer in the acrylic pressure-sensitive adhesive composition is preferably 60% by weight to 99.9% by weight, more preferably 65% ​​by weight to 99.9% by weight, even more preferably 70% by weight to 99.9% by weight, particularly preferably 75% by weight to 99.9% by weight, and most preferably 80% by weight to 99.9% by weight, calculated as solid content.

[0193] As the acrylic polymer, any appropriate acrylic polymer can be used as long as it does not impair the effects of the present invention.

[0194] The weight average molecular weight of the acrylic polymer is preferably 300,000 to 2,500,000, more preferably 350,000 to 2,000,000, even more preferably 400,000 to 1,800,000, and particularly preferably 500,000 to 1,500,000, in order to further exhibit the effects of the present invention.

[0195] The acrylic polymer is preferably an acrylic polymer formed by polymerization from a composition (B) containing (component a) a (meth)acrylic acid alkyl ester in which the alkyl group in the alkyl ester moiety has 4 to 12 carbon atoms, and (component b) at least one selected from the group consisting of a (meth)acrylic acid ester having an OH group and (meth)acrylic acid, in order to more effectively exhibit the effects of the present invention. (Component a) and (component b) may each independently be a single type or two or more types.

[0196] Examples of (meth)acrylic acid alkyl esters (component a) in which the alkyl group in the alkyl ester moiety has 4 to 12 carbon atoms include n-butyl (meth)acrylate, isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, isooctyl (meth)acrylate, nonyl (meth)acrylate, isononyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, and dodecyl (meth)acrylate. Among these, n-butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate are preferred, and n-butyl acrylate and 2-ethylhexyl acrylate are more preferred, in terms of further exhibiting the effects of the present invention.

[0197] Examples of the at least one (component b) selected from the group consisting of (meth)acrylic acid esters having an OH group and (meth)acrylic acid include (meth)acrylic acid esters having an OH group such as hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, and hydroxybutyl (meth)acrylate. Among these, hydroxyethyl (meth)acrylate and (meth)acrylic acid are preferred, and hydroxyethyl acrylate and acrylic acid are more preferred, in terms of being able to further exhibit the effects of the present invention.

[0198] The composition (B) may contain a copolymerizable monomer other than the components (a) and (b). The copolymerizable monomer may be one type only, or two or more types.Examples of such copolymerizable monomers include carboxyl group-containing monomers (excluding (meth)acrylic acid) such as itaconic acid, maleic acid, fumaric acid, crotonic acid, isocrotonic acid, and acid anhydrides thereof (e.g., acid anhydride group-containing monomers such as maleic anhydride and itaconic anhydride); (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-methylol(meth)acrylamide, N-methoxymethyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide, N-hydroxyethyl(meth)acrylamide, N-methylol ... Amide group-containing monomers such as acrylamide; amino group-containing monomers such as aminoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, and t-butylaminoethyl (meth)acrylate; epoxy group-containing monomers such as glycidyl (meth)acrylate and methylglycidyl (meth)acrylate; cyano group-containing monomers such as acrylonitrile and methacrylonitrile; N-vinyl-2-pyrrolidone, (meth)acryloylmorpholine, N-vinylpiperidone, N-vinylpiperazine, N-vinylpyrrole, and N-vinylisopropyl heterocyclic ring-containing vinyl monomers such as midazole, vinylpyridine, vinylpyrimidine, and vinyloxazole; sulfonic acid group-containing monomers such as sodium vinyl sulfonate; phosphate group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; imide group-containing monomers such as cyclohexylmaleimide and isopropylmaleimide; isocyanate group-containing monomers such as 2-methacryloyloxyethyl isocyanate; (meth)acrylic acid esters having alicyclic hydrocarbon groups such as cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, and isobornyl (meth)acrylate; (meth)acrylic acid esters having aromatic hydrocarbon groups such as phenyl (meth)acrylate, phenoxyethyl (meth)acrylate, and benzyl (meth)acrylate; vinyl esters such as vinyl acetate and vinyl propionate; aromatic vinyl compounds such as styrene and vinyltoluene; olefins and dienes such as ethylene, butadiene, isoprene, and isobutylene; vinyl ethers such as vinyl alkyl ethers; and vinyl chloride.

[0199] As the copolymerizable monomer, a polyfunctional monomer may also be used. A polyfunctional monomer refers to a monomer having two or more ethylenically unsaturated groups in one molecule. As the ethylenically unsaturated group, any appropriate ethylenically unsaturated group may be used as long as it does not impair the effects of the present invention. Examples of such ethylenically unsaturated groups include radically polymerizable functional groups such as a vinyl group, a propenyl group, an isopropenyl group, a vinyl ether group (vinyloxy group), and an allyl ether group (allyloxy group). Examples of polyfunctional monomers include hexanediol di(meth)acrylate, butanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, trimethylolpropane tri(meth)acrylate, tetramethylolmethane tri(meth)acrylate, allyl (meth)acrylate, vinyl (meth)acrylate, divinylbenzene, epoxy acrylate, polyester acrylate, urethane acrylate, etc. Such polyfunctional monomers may be used alone or in combination of two or more.

[0200] As the copolymerizable monomer, (meth)acrylic acid alkoxyalkyl esters can also be used. Examples of (meth)acrylic acid alkoxyalkyl esters include 2-methoxyethyl (meth)acrylate, 2-ethoxyethyl (meth)acrylate, methoxytriethylene glycol (meth)acrylate, 3-methoxypropyl (meth)acrylate, 3-ethoxypropyl (meth)acrylate, 4-methoxybutyl (meth)acrylate, and 4-ethoxybutyl (meth)acrylate. The (meth)acrylic acid alkoxyalkyl esters may be of one type or two or more types.

[0201] The content of the (meth)acrylic acid alkyl ester (component a) in which the alkyl group in the alkyl ester moiety has 4 to 12 carbon atoms is preferably 30% by weight or more, more preferably 35% by weight to 99% by weight, even more preferably 40% by weight to 98% by weight, and particularly preferably 50% by weight to 95% by weight, relative to the total amount (100% by weight) of the monomer components constituting the acrylic polymer, in order to further exhibit the effects of the present invention.

[0202] The content of at least one selected from the group consisting of (meth)acrylic acid esters having an OH group and (meth)acrylic acid (component b) is preferably 1% by weight or more, more preferably 1 to 30% by weight, even more preferably 2 to 20% by weight, and particularly preferably 3 to 10% by weight, relative to the total amount (100% by weight) of the monomer components constituting the acrylic polymer, in order to further exhibit the effects of the present invention.

[0203] Composition (B) may contain any appropriate other components as long as the effects of the present invention are not impaired. Examples of such other components include a polymerization initiator, a chain transfer agent, and a solvent. The content of these other components may be any appropriate content as long as the effects of the present invention are not impaired.

[0204] The polymerization initiator may be a thermal polymerization initiator, a photopolymerization initiator (photoinitiator), etc., depending on the type of polymerization reaction. Only one type of polymerization initiator may be used, or two or more types may be used.

[0205] Thermal polymerization initiators are preferably used when obtaining acrylic polymers by solution polymerization. Examples of such thermal polymerization initiators include azo polymerization initiators, peroxide polymerization initiators (e.g., dibenzoyl peroxide, tert-butyl permaleate, etc.), and redox polymerization initiators. Among these thermal polymerization initiators, the azo polymerization initiators disclosed in JP 2002-69411 A are particularly preferred. Such azo polymerization initiators are preferred because their decomposition products are less likely to remain in the acrylic polymer as a source of outgassing. Examples of azo polymerization initiators include 2,2'-azobisisobutyronitrile (hereinafter sometimes referred to as AIBN), 2,2'-azobis-2-methylbutyronitrile (hereinafter sometimes referred to as AMBN), 2,2'-azobis(2-methylpropionate) dimethyl, and 4,4'-azobis-4-cyanovaleric acid.

[0206] The photopolymerization initiator can be preferably used when obtaining an acrylic polymer by active energy ray polymerization. Examples of the photopolymerization initiator include a benzoin ether-based photopolymerization initiator, an acetophenone-based photopolymerization initiator, an α-ketol-based photopolymerization initiator, an aromatic sulfonyl chloride-based photopolymerization initiator, a photoactive oxime-based photopolymerization initiator, a benzoin-based photopolymerization initiator, a benzyl-based photopolymerization initiator, a benzophenone-based photopolymerization initiator, a ketal-based photopolymerization initiator, and a thioxanthone-based photopolymerization initiator.

[0207] Examples of benzoin ether-based photopolymerization initiators include benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isopropyl ether, benzoin isobutyl ether, 2,2-dimethoxy-1,2-diphenylethan-1-one, and anisole methyl ether. Examples of acetophenone-based photopolymerization initiators include 2,2-diethoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 1-hydroxycyclohexyl phenyl ketone, 4-phenoxydichloroacetophenone, and 4-(t-butyl)dichloroacetophenone. Examples of α-ketol-based photopolymerization initiators include 2-methyl-2-hydroxypropiophenone and 1-[4-(2-hydroxyethyl)phenyl]-2-methylpropan-1-one. Examples of aromatic sulfonyl chloride-based photopolymerization initiators include 2-naphthalenesulfonyl chloride. Examples of photoactive oxime-based photopolymerization initiators include 1-phenyl-1,1-propanedione-2-(o-ethoxycarbonyl)-oxime. Examples of benzoin-based photopolymerization initiators include benzoin. Examples of benzyl-based photopolymerization initiators include benzil. Examples of benzophenone-based photopolymerization initiators include benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4-methoxybenzophenone, polyvinylbenzophenone, and α-hydroxycyclohexyl phenyl ketone. Examples of ketal-based photopolymerization initiators include benzil dimethyl ketal. Examples of thioxanthone-based photopolymerization initiators include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-diisopropylthioxanthone, and dodecylthioxanthone.

[0208] The acrylic pressure-sensitive adhesive composition may contain a crosslinking agent. By using a crosslinking agent, the cohesive strength of the acrylic pressure-sensitive adhesive can be improved, and the effects of the present invention can be further exhibited. The crosslinking agent may be one type only, or two or more types.

[0209] Examples of crosslinking agents include polyfunctional isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, as well as urea-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, amine-based crosslinking agents, etc. Among these, at least one selected from the group consisting of polyfunctional isocyanate-based crosslinking agents and epoxy-based crosslinking agents (component c) is preferred in terms of being able to further exhibit the effects of the present invention.

[0210] Examples of polyfunctional isocyanate crosslinking agents include lower aliphatic polyisocyanates such as 1,2-ethylene diisocyanate, 1,4-butylene diisocyanate, and 1,6-hexamethylene diisocyanate; alicyclic polyisocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate, isophorone diisocyanate, hydrogenated tolylene diisocyanate, and hydrogenated xylene diisocyanate; and aromatic polyisocyanates such as 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylene diisocyanate. Examples of polyfunctional isocyanate crosslinking agents include commercially available products such as trimethylolpropane / tolylene diisocyanate adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate L"), trimethylolpropane / hexamethylene diisocyanate adduct (manufactured by Nippon Polyurethane Industry Co., Ltd., trade name "Coronate HL"), trade name "Coronate HX" (Nippon Polyurethane Industry Co., Ltd.), and trimethylolpropane / xylylene diisocyanate adduct (manufactured by Mitsui Chemicals, Inc., trade name "Takenate 110N").

[0211] Examples of epoxy crosslinking agents (polyfunctional epoxy compounds) include N,N,N',N'-tetraglycidyl-m-xylylenediamine, diglycidylaniline, 1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, 1,6-hexanediol diglycidyl ether, neopentyl glycol diglycidyl ether, ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, sorbitol polyglycidyl ether, and methyl ... Examples of epoxy crosslinking agents include diglycidyl ether, glycerol polyglycidyl ether, pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether, sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipic acid diglycidyl ester, o-phthalic acid diglycidyl ester, triglycidyl-tris(2-hydroxyethyl)isocyanurate, resorcinol diglycidyl ether, and bisphenol-S-diglycidyl ether, as well as epoxy resins having two or more epoxy groups in the molecule. Examples of epoxy crosslinking agents include commercially available products such as "Tetrad C" (manufactured by Mitsubishi Gas Chemical Company, Inc.).

[0212] The content of the crosslinking agent in the acrylic pressure-sensitive adhesive composition may be any appropriate content within the range that does not impair the effects of the present invention. For example, in order to further exhibit the effects of the present invention, such a content is preferably 0.05 to 20 parts by weight, more preferably 0.1 to 18 parts by weight, even more preferably 0.5 to 15 parts by weight, and particularly preferably 0.5 to 10 parts by weight, relative to the solid content (100 parts by weight) of the acrylic polymer.

[0213] The acrylic pressure-sensitive adhesive composition may contain any other appropriate components as long as they do not impair the effects of the present invention. Examples of such other components include polymer components other than acrylic polymers, crosslinking accelerators, crosslinking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), antioxidants, inorganic fillers, organic fillers, metal powders, colorants (pigments, dyes, etc.), foil-like materials, UV absorbers, antioxidants, light stabilizers, chain transfer agents, plasticizers, softeners, surfactants, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, lubricants, solvents, catalysts, etc.

[0214] <1-4-2. Conductive Components> The pressure-sensitive adhesive layer (2) may contain a conductive component. Regarding the conductive component, the explanation in the section <1-2-5. Conductive component> can be directly applied.

[0215] <1-4-3. Other ingredients> The adhesive composition (preferably an acrylic adhesive composition) used as the material for the adhesive layer (2) may contain any appropriate other components within the scope of not impairing the effects of the present invention. Examples of such other components include other polymer components, crosslinking accelerators, crosslinking catalysts, silane coupling agents, tackifying resins (rosin derivatives, polyterpene resins, petroleum resins, oil-soluble phenols, etc.), antioxidants, inorganic fillers, organic fillers, metal powders, colorants (pigments, dyes, etc.), foil-like materials, UV absorbers, antioxidants, light stabilizers, chain transfer agents, plasticizers, softeners, surfactants, antistatic agents, conductive agents, stabilizers, surface lubricants, leveling agents, corrosion inhibitors, heat stabilizers, polymerization inhibitors, lubricants, solvents, and catalysts.

[0216] <1-5. Resin film (3)> The thickness of the resin film (3) is preferably 4 μm to 450 μm, more preferably 8 μm to 350 μm, even more preferably 12 μm to 250 μm, particularly preferably 16 μm to 150 μm, and most preferably 20 μm to 100 μm, in order to further exhibit the effects of the present invention.

[0217] The resin film (3) includes a resin substrate film (3a).

[0218] Examples of the resin substrate film (3a) include plastic films made of polyester-based resins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT); plastic films made of olefin-based resins containing α-olefins as monomer components, such as polyethylene (PE), polypropylene (PP), polymethylpentene (PMP), ethylene-propylene copolymer, and ethylene-vinyl acetate copolymer (EVA); plastic films made of polyvinyl chloride (PVC); plastic films made of vinyl acetate-based resins; plastic films made of polycarbonate (PC); and polyphenylene sulfide (PPS). plastic films made of amide-based resins such as polyamide (nylon) and wholly aromatic polyamide (aramid); plastic films made of polyimide-based resins; plastic films made of polyether ether ketone (PEEK); plastic films made of olefin-based resins such as polyethylene (PE) and polypropylene (PP); plastic films made of fluorine-based resins such as polytetrafluoroethylene, polychlorotrifluoroethylene, polyvinyl fluoride, polyvinylidene fluoride, tetrafluoroethylene-hexafluoropropylene copolymer, and chlorofluoroethylene-vinylidene fluoride copolymer; and the like.

[0219] The resin substrate film (3a) may be a single layer or may be two or more layers. The resin substrate film (3a) may be a stretched film.

[0220] The resin substrate film (3a) may be subjected to a surface treatment, such as corona treatment, plasma treatment, chromic acid treatment, ozone exposure, flame exposure, high-voltage shock exposure, ionizing radiation treatment, and coating with a primer.

[0221] The surface of the resin film (3a) on which the adhesive layer (2) is not applied may be subjected to a release treatment by adding, for example, fatty acid amide, polyethyleneimine, long-chain alkyl additives, or the like to the resin film (3a) in order to form a roll that can be easily unwound, or a coating layer made of any suitable release agent such as a silicone-based, long-chain alkyl-based, or fluorine-based release agent may be provided.

[0222] The resin film (3a) may contain any suitable additive depending on the purpose, as long as the effect of the present invention is not impaired.

[0223] The additives include, for example, transmittance control agents, etc. Examples of such transmittance control agents include color pigments and color dyes, and preferably black pigments and black dyes.

[0224] When the resin substrate film (3a) contains a transmittance control agent, the content is preferably 0.01 to 5% by weight, more preferably 0.1 to 3% by weight, and even more preferably 0.5 to 1% by weight, in order to further exhibit the effects of the present invention.

[0225] The resin film (3) may have a conductive layer (3b), which may be disposed between the pressure-sensitive adhesive layer (2) and the resin substrate film (3a).

[0226] The conductive layer (3b) may be a single layer or may be two or more layers.

[0227] The conductive layer (3b) can be provided by forming it on any suitable substrate, and such a substrate is preferably a resin substrate film (3a).

[0228] The conductive layer (3b) is formed by forming a conductive film on any suitable substrate (preferably a resin substrate film (3a)) by any suitable thin film formation method, such as vacuum deposition, sputtering, ion plating, spray pyrolysis, chemical plating, electroplating, or a combination thereof. Among these thin film formation methods, vacuum deposition and sputtering are preferred in terms of the rate of conductive film formation, the ability to form large-area films, productivity, etc.

[0229] Materials for forming the conductive film include, for example, metal-based materials such as gold, silver, platinum, palladium, copper, aluminum, nickel, chromium, titanium, iron, cobalt, tin, and alloys thereof; metal oxide-based materials such as indium oxide, tin oxide, titanium oxide, cadmium oxide, and mixtures thereof; and other metal compounds such as copper iodide.

[0230] The thickness of the conductive layer (3b) may be any appropriate thickness depending on the purpose, as long as it does not impair the effects of the present invention. For example, when the conductive layer (3b) is made of a metal material, the thickness is preferably 30 Å to 600 Å, and when the conductive layer (3b) is made of a metal oxide material, the thickness is preferably 80 Å to 5000 Å.

[0231] The surface resistance of the conductive layer (3b) is preferably 1.0×10 10 Ω / □ or less, and more preferably 1.0×10 9 Ω / □ or less, and more preferably 1.0×10 8 Ω / □ or less, and particularly preferably 1.0×10 7 It is Ω / □ or less.

[0232] When forming the conductive film on any suitable substrate (preferably a resin substrate film (3a)), the surface of the substrate (preferably a resin substrate film (3a)) may be subjected to any suitable pretreatment such as corona discharge treatment, ultraviolet irradiation treatment, plasma treatment, sputter etching treatment, undercoat treatment, etc., to enhance the adhesion between the conductive film and the substrate (preferably a resin substrate film (3a)).

[0233] The resin film (3) may have an antistatic layer (3c), which may be disposed between the pressure-sensitive adhesive layer (2) and the resin substrate film (3a) and / or on the opposite side of the resin substrate film (3a) to the pressure-sensitive adhesive layer (2).

[0234] The antistatic layer (3c) may be a single layer or may be two or more layers.

[0235] The thickness of the antistatic layer (3c) may be any appropriate thickness depending on the purpose, as long as it does not impair the effects of the present invention. Such a thickness is preferably 1 nm to 1000 nm, more preferably 5 nm to 900 nm, even more preferably 7.5 nm to 800 nm, and particularly preferably 10 nm to 700 nm.

[0236] The surface resistance of the antistatic layer (3c) is preferably 1.0×10 10 Ω / □ or less, and more preferably 8.0×10 9 Ω / □ or less, and more preferably 5.0×10 9 Ω / □ or less, and particularly preferably 1.0×10 9 It is Ω / □ or less.

[0237] Any suitable antistatic layer (3c) can be used as long as it can provide an antistatic effect and does not impair the effects of the present invention. Such an antistatic layer is preferably an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on any suitable substrate layer. Specifically, for example, it is an antistatic layer formed by coating a conductive coating liquid containing a conductive polymer on a resin substrate film (3a). After coating, the coating is dried as needed, and cured as needed (heat treatment, ultraviolet treatment, etc.). Specific coating methods include roll coating, bar coating, and gravure coating.

[0238] Any suitable conductive coating liquid containing a conductive polymer may be used as long as it does not impair the effects of the present invention. Such a conductive coating liquid preferably contains a conductive polymer, a binder, a crosslinking agent, and a solvent. Since the solvent is substantially eliminated by volatilization or evaporation due to heating or the like during the process of forming the antistatic layer (3c), the antistatic layer (3c) preferably contains a conductive polymer, a binder, and a crosslinking agent.

[0239] Examples of the solvent include organic solvents, water, and mixed solvents thereof. Examples of the organic solvent include esters such as ethyl acetate; ketones such as methyl ethyl ketone, acetone, and cyclohexanone; cyclic ethers such as tetrahydrofuran (THF) and dioxane; aliphatic or alicyclic hydrocarbons such as n-hexane and cyclohexane; aromatic hydrocarbons such as toluene and xylene; aliphatic or alicyclic alcohols such as methanol, ethanol, n-propanol, isopropanol, and cyclohexanol; glycol ethers such as alkylene glycol monoalkyl ethers (e.g., ethylene glycol monomethyl ether and ethylene glycol monoethyl ether) and dialkylene glycol monoalkyl ethers. The solvent is preferably water or a mixed solvent containing water as the main component (e.g., a mixed solvent of water and ethanol).

[0240] The content of the conductive polymer in the antistatic layer (3c) is preferably 3 to 80% by weight, more preferably 5 to 60% by weight.

[0241] Any suitable conductive polymer may be used as the conductive polymer as long as it does not impair the effects of the present invention. Examples of such conductive polymers include conductive polymers in which a π-conjugated conductive polymer is doped with a polyanion. Examples of π-conjugated conductive polymers include chain-like conductive polymers such as polythiophene, polypyrrole, polyaniline, and polyacetylene. Examples of polyanions include polystyrene sulfonic acid, polyisoprene sulfonic acid, polyvinyl sulfonic acid, polyallyl sulfonic acid, polyacrylic acid ethyl sulfonic acid, and polymethacrylic carboxylic acid.

[0242] The conductive polymer may be of only one type, or of two or more types.

[0243] The content of the binder in the antistatic layer (3c) is preferably 50% to 95% by weight, and more preferably 60% to 90% by weight.

[0244] Any appropriate binder may be used as the binder contained in the conductive coating liquid as long as it does not impair the effects of the present invention. The binder may be one type only or two or more types. Such a binder is preferably a resin, more preferably a polyester resin. The proportion of the polyester resin in the binder is preferably 90% by weight to 100% by weight, more preferably 98% by weight to 100% by weight.

[0245] The polyester resin preferably contains polyester as the main component (preferably more than 50% by weight, more preferably 75% by weight or more, even more preferably 90% by weight or more, and particularly preferably a component that accounts for substantially 100% by weight).

[0246] As the polyester, any appropriate polyester can be used as long as it does not impair the effects of the present invention. Preferably, such polyester has a structure obtained by condensing one or more compounds (polycarboxylic acid components) selected from polycarboxylic acids (e.g., dicarboxylic acid compounds) having two or more carboxyl groups in one molecule and derivatives thereof (e.g., anhydrides, esters, halides, etc. of polycarboxylic acids) with one or more compounds (polyhydric alcohol components) selected from polyhydric alcohols (e.g., diols) having two or more hydroxyl groups in one molecule.

[0247] Any suitable polycarboxylic acid can be used as the polycarboxylic acid component as long as it does not impair the effects of the present invention. Examples of such polycarboxylic acid components include oxalic acid, malonic acid, difluoromalonic acid, alkylmalonic acid, succinic acid, tetrafluorosuccinic acid, alkylsuccinic acid, (±)-malic acid, meso-tartaric acid, itaconic acid, maleic acid, methylmaleic acid, fumaric acid, methylfumaric acid, acetylenedicarboxylic acid, glutaric acid, hexafluoroglutaric acid, methylglutaric acid, glutaconic acid, adipic acid, dithioadipic acid, methyladipic acid, dimethyladipic acid, tetramethyladipic acid, methyleneadipic acid, muconic acid, galactaric acid, pimelic acid, and suberic acid. aliphatic dicarboxylic acids such as perfluorosuberic acid, 3,3,6,6-tetramethylsuberic acid, azelaic acid, sebacic acid, perfluorosebacic acid, brassylic acid, dodecyldicarboxylic acid, tridecyldicarboxylic acid, and tetradecyldicarboxylic acid; alicyclic dicarboxylic acids such as cycloalkyldicarboxylic acids (e.g., 1,4-cyclohexanedicarboxylic acid, 1,2-cyclohexanedicarboxylic acid), 1,4-(2-norbornene)dicarboxylic acid, 5-norbornene-2,3-dicarboxylic acid (himic acid), adamantanedicarboxylic acid, and spiroheptanedicarboxylic acid;Phthalic acid, isophthalic acid, dithioisophthalic acid, methylisophthalic acid, dimethylisophthalic acid, chloroisophthalic acid, dichloroisophthalic acid, terephthalic acid, methyl terephthalic acid, dimethyl terephthalic acid, chloroterephthalic acid, bromoterephthalic acid, naphthalenedicarboxylic acid, oxofluorenedicarboxylic acid, anthracene dicarboxylic acid, biphenyl dicarboxylic acid, biphenylenedicarboxylic acid, dimethylbiphenylenedicarboxylic acid, 4,4"-p-terephenylenedicarboxylic acid, 4,4"-p-quarelphenyldicarboxylic acid, bibenzyl dicarboxylic acid, azobenzenedicarboxylic acid, homophthalic acid, phenylene diacetic acid, phenyl Examples of suitable polycarboxylic acids include aromatic dicarboxylic acids such as dipropionic acid, naphthalenedicarboxylic acid, naphthalenedipropionic acid, biphenyldiacetic acid, biphenyldipropionic acid, 3,3'-[4,4'-(methylenedi-p-biphenylene)dipropionic acid, 4,4'-bibenzyldiacetic acid, 3,3'(4,4'-bibenzyl)dipropionic acid, and oxydi-p-phenylenediacetic acid; acid anhydrides of any of the above polycarboxylic acids; esters of any of the above polycarboxylic acids (e.g., alkyl esters, monoesters, diesters, etc.); and acid halides corresponding to any of the above polycarboxylic acids (e.g., dicarboxylic acid chlorides).

[0248] Preferred examples of the polycarboxylic acid component include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, and naphthalenedicarboxylic acid, and their acid anhydrides; aliphatic dicarboxylic acids such as adipic acid, sebacic acid, azelaic acid, succinic acid, fumaric acid, maleic acid, himic acid, and 1,4-cyclohexanedicarboxylic acid, and their acid anhydrides; and lower alkyl esters of these dicarboxylic acids (for example, esters with monoalcohols having 1 to 3 carbon atoms).

[0249] As the polyhydric alcohol component, any suitable polyhydric alcohol can be used as long as it does not impair the effects of the present invention. Examples of such polyhydric alcohol components include diols such as ethylene glycol, propylene glycol, 1,2-propanediol, 1,3-propanediol, 1,3-butanediol, 1,4-butanediol, neopentyl glycol, 1,5-pentanediol, 1,6-hexanediol, 3-methylpentanediol, diethylene glycol, 1,4-cyclohexanedimethanol, 3-methyl-1,5-pentanediol, 2-methyl-1,3-propanediol, 2,2-diethyl-1,3-propanediol, 2-butyl-2-ethyl-1,3-propanediol, xylylene glycol, hydrogenated bisphenol A, and bisphenol A; alkylene oxide adducts of these diols (e.g., ethylene oxide adducts, propylene oxide adducts, etc.); and the like.

[0250] The molecular weight of the polyester resin is preferably 5×10 as a weight average molecular weight (Mw) converted into standard polystyrene as measured by gel permeation chromatography (GPC). 3 ~1.5×10 5 and more preferably 1×10 4 ~6×10 4 is.

[0251] The glass transition temperature (Tg) of the polyester resin is preferably 0 to 120°C, and more preferably 10 to 80°C.

[0252] As the polyester resin, for example, a commercially available product such as "Vylonal" manufactured by Toyobo Co., Ltd. can be used.

[0253] The conductive coating liquid may further contain, as a binder, a resin other than polyester resin (for example, at least one resin selected from acrylic resin, acrylic urethane resin, acrylic styrene resin, acrylic silicone resin, silicone resin, polysilazane resin, polyurethane resin, fluororesin, and polyolefin resin) within a range that does not impair the effects of the present invention.

[0254] Any appropriate crosslinking agent may be used as the crosslinking agent contained in the conductive coating liquid as long as it does not impair the effects of the present invention. The crosslinking agent may be one type or two or more types. Examples of such crosslinking agents include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, melamine-based crosslinking agents, and peroxide-based crosslinking agents, as well as urea-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, and amine-based crosslinking agents. Among these, melamine-based crosslinking agents are preferred.

[0255] The content of the crosslinking agent in the antistatic layer (3c) is preferably 1 to 30% by weight, more preferably 2 to 20% by weight.

[0256] The antistatic layer (3c) may contain any other appropriate components as long as the effects of the present invention are not impaired.

[0257] 2. Manufacturing method of laminate The laminate of the present invention can be produced by any appropriate method as long as the effects of the present invention are not impaired.

[0258] As a representative example of the method for producing the laminate of the present invention, a laminate of the present invention having a resin film (1), a pressure-sensitive adhesive layer (1), a resin film (2), a pressure-sensitive adhesive layer (2), and a resin film (3) in this order will be described.

[0259] In one embodiment of the method for producing a laminate of the present invention, a laminate (A) consisting of a resin film (1), a pressure-sensitive adhesive layer (1), and a resin film (2) in this order, and a laminate (B) consisting of a pressure-sensitive adhesive layer (2) and a resin film (3) in this order, are produced, and then the surface of the resin film (2) of the laminate (A) and the surface of the pressure-sensitive adhesive layer (2) of the laminate (B) are bonded together.

[0260] The laminate (A) can be produced, for example, by applying a pressure-sensitive adhesive composition (at least one selected from the group consisting of an acrylic pressure-sensitive adhesive composition, a urethane pressure-sensitive adhesive composition, a rubber pressure-sensitive adhesive composition, and a silicone pressure-sensitive adhesive composition) that forms the pressure-sensitive adhesive that constitutes the pressure-sensitive adhesive layer (1) onto a resin film (2), optionally heating and drying the composition, and optionally curing the composition to form the pressure-sensitive adhesive layer (1) on the resin film (2), and then attaching the resin film (1) (or the release layer (1b), if present) to the surface of the pressure-sensitive adhesive layer (1) opposite to the resin film (2).

[0261] The laminate (II) is prepared, for example, by applying a pressure-sensitive adhesive composition (preferably an acrylic pressure-sensitive adhesive composition) that forms the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer (2) onto a resin film (3), optionally heating and drying the composition, and optionally curing the composition, to form the pressure-sensitive adhesive layer (2) on the resin film (3). Note that, until the laminate (A) and the laminate (B) are attached to each other, any appropriate separator (for example, a film similar to the resin film (1)) may be attached to the resin film (3) to protect the exposed surface of the pressure-sensitive adhesive layer (2). [Example]

[0262] The present invention will be specifically described below using examples, but the present invention is not limited to these examples. The test and evaluation methods used in the examples are as follows. The term "parts" means "parts by weight" unless otherwise specified, and the term "%" means "% by weight" unless otherwise specified.

[0263] <Measurement of weight average molecular weight> The weight-average molecular weight was measured by gel permeation chromatography (GPC). Specifically, the measurement was performed using a GPC measuring device (trade name: HLC-8120GPC, manufactured by Tosoh Corporation) under the following conditions, and the weight-average molecular weight was calculated in terms of standard polystyrene. (Molecular weight measurement conditions) Sample concentration: 0.2 wt% (tetrahydrofuran solution) Sample injection volume: 10 μL Column: Product name "TSKguardcolumn SuperHZ-H (1 tube) + TSKgel SuperHZM-H (2 tubes)" (manufactured by Tosoh Corporation) Reference column: Product name "TSKgel SuperH-RC (1 column)" (Tosoh Corporation) Eluent: tetrahydrofuran (THF) ·Flow rate: 0.6mL / min Detector: Differential refractometer (RI) Column temperature (measurement temperature): 40℃

[0264] <Transmittance measurement> Using Murakami Color Research Laboratory's HM-150N, transmittance (total light transmittance) was measured under the conditions of JIS-K-7361. At this time, the entire laminate was placed so that the resin film (3) faced the light source. Laminate (A) was placed so that the resin film (2) faced the light source. Laminate (B) was placed so that the resin film (3) faced the light source.

[0265] <Focus evaluation> Measurements were taken using a Kyowa Interface Science drop meter DM700 and analysis software FAMAS. A laminate sample (50 mm x 50 mm) was placed upright on the stage, 100 mm from the CCD camera and 150 mm from the light source, and the light source was shone from behind, and the image was taken with the CCD camera. The resin film (1) was placed facing the camera, and the edge of the laminate sample was not included in the image (because it is easier to focus when the edge is included). While checking the image with the interface measurement and analysis system software FAMAS, the force handle was turned to determine whether or not the image was in focus. 〇: Focusing successful ×: Unable to focus

[0266] <Evaluation of foreign matter inspection> The laminate to be measured was inspected for foreign matter of 100 μm to 1 mm in size. Specifically, in a dark room, the laminate was held up to a fluorescent lamp (three wavelengths) and the presence or absence of foreign matter of 100 μm to 1 mm in size was visually inspected using transmitted light. A score of ◯ was given when the presence or absence of foreign matter in the laminate could be clearly detected using bright transmitted light, a score of △ was given when the presence or absence of foreign matter in the laminate could be detected even though the transmitted light was dark, and an X was given when no foreign matter could be detected.

[0267] [Production Example 1] Production of adhesive composition (1A) A reaction vessel equipped with a thermometer, stirrer, reflux condenser, and nitrogen gas inlet tube was charged with 63 parts by weight of 2-ethylhexyl acrylate (2EHA), 15 parts by weight of N-vinylpyrrolidone (NVP), 9 parts by weight of methyl methacrylate (MMA), and 13 parts by weight of hydroxyethyl acrylate (HEA) as monomers, 0.2 parts by weight of azobisisobutyronitrile as a polymerization initiator, and 233 parts by weight of ethyl acetate as a solvent. Nitrogen gas was introduced and the mixture was purged with nitrogen for approximately 1 hour while stirring. The mixture was then heated to 60°C and reacted for 7 hours to obtain a solution of acrylic polymer A with a weight-average molecular weight (Mw) of 1.2 million. To the obtained solution of acrylic polymer A, 1 part by weight of Takenate D110N (Mitsui Chemicals) was added per 100 parts by weight of acrylic polymer A, and the mixture was mixed uniformly to produce a pressure-sensitive adhesive composition (1A).

[0268] [Production Example 2] Production of adhesive composition (2A) A pressure-sensitive adhesive composition (2A) was produced in the same manner as in Production Example 1, except that 0.1 parts by weight of black pigment (carbon black, manufactured by Alfa Aesar) was further added per 100 parts by weight of acrylic polymer A to the solution of acrylic polymer A obtained in Production Example 1.

[0269] [Production Example 3] Production of adhesive composition (3A) A pressure-sensitive adhesive composition (3A) was produced in the same manner as in Production Example 1, except that 0.3 parts by weight of black pigment (carbon black, manufactured by Alfa Aesar) was further added per 100 parts by weight of acrylic polymer A to the solution of acrylic polymer A obtained in Production Example 1.

[0270] [Production Example 4] Production of adhesive composition (4A) A pressure-sensitive adhesive composition (4A) was produced in the same manner as in Production Example 1, except that 0.5 parts by weight of black pigment (carbon black, manufactured by Alfa Aesar) was further added per 100 parts by weight of acrylic polymer A to the solution of acrylic polymer A obtained in Production Example 1.

[0271] [Production Example 5] Production of adhesive composition (5A) A pressure-sensitive adhesive composition (5A) was produced in the same manner as in Production Example 1, except that 1.0 part by weight of black pigment (carbon black, manufactured by Alfa Aesar) was further added per 100 parts by weight of acrylic polymer A to the solution of acrylic polymer A obtained in Production Example 1.

[0272] [Production Example 6] Production of adhesive composition (6A) A pressure-sensitive adhesive composition (6A) was produced in the same manner as in Production Example 1, except that 3.0 parts by weight of black pigment (carbon black, manufactured by Alfa Aesar) was further added per 100 parts by weight of acrylic polymer A to the solution of acrylic polymer A obtained in Production Example 1.

[0273] [Production Example 7] Production of adhesive composition (7A) A pressure-sensitive adhesive composition (7A) was produced in the same manner as in Production Example 1, except that 0.1 parts by weight of a black dye (Solvent Black 29, manufactured by BASF) was further added to 100 parts by weight of the acrylic polymer A solution obtained in Production Example 1.

[0274] [Production Example 8] Production of adhesive composition (8A) A pressure-sensitive adhesive composition (8A) was produced in the same manner as in Production Example 1, except that 0.3 parts by weight of a black dye (Solvent Black 29, manufactured by BASF) was further added to 100 parts by weight of the acrylic polymer A solution obtained in Production Example 1.

[0275] [Production Example 9] Production of adhesive composition (9A) A pressure-sensitive adhesive composition (9A) was produced in the same manner as in Production Example 1, except that 0.5 parts by weight of a black dye (Solvent Black 29, manufactured by BASF) was further added to 100 parts by weight of the acrylic polymer A solution obtained in Production Example 1.

[0276] [Production Example 10] Production of adhesive composition (10A) A pressure-sensitive adhesive composition (10A) was produced in the same manner as in Production Example 1, except that 1.0 parts by weight of black dye (Solvent Black 29, manufactured by BASF) was further added per 100 parts by weight of acrylic polymer A to the solution of acrylic polymer A obtained in Production Example 1.

[0277] [Production Example 11] Production of adhesive composition (11A) A pressure-sensitive adhesive composition (11A) was produced in the same manner as in Production Example 1, except that 3.0 parts by weight of a black dye (Solvent Black 29, manufactured by BASF) was further added per 100 parts by weight of the acrylic polymer A solution obtained in Production Example 1.

[0278] [Production Example 12] Production of adhesive composition (1B) A reaction vessel equipped with a thermometer, stirrer, reflux condenser, and nitrogen gas inlet tube was charged with 95 parts by weight of 2-ethylhexyl acrylate (2EHA) and 5 parts by weight of hydroxyethyl acrylate (HEA) as monomers, 0.2 parts by weight of azobisisobutyronitrile as a polymerization initiator, and 233 parts by weight of ethyl acetate as a solvent. Nitrogen gas was introduced and the mixture was purged with nitrogen for approximately 1 hour while stirring. The mixture was then heated to 60°C and reacted for 7 hours, yielding a solution of acrylic polymer B with a weight-average molecular weight (Mw) of 440,000. To the resulting solution of acrylic polymer B, 4 parts by weight of Coronate HX (manufactured by Nippon Polyurethane) was added per 100 parts by weight of acrylic polymer B, and the mixture was mixed uniformly to produce a pressure-sensitive adhesive composition (1B).

[0279] [Production Example 13] Production of adhesive composition (2B) A pressure-sensitive adhesive composition (2B) was produced in the same manner as in Production Example 12, except that 0.1 parts by weight of black pigment (carbon black, manufactured by Alfa Aesar) was further added per 100 parts by weight of acrylic polymer B to the solution of acrylic polymer B obtained in Production Example 12.

[0280] [Production Example 14] Production of adhesive composition (3B) A pressure-sensitive adhesive composition (3B) was produced in the same manner as in Production Example 12, except that 0.3 parts by weight of black pigment (carbon black, manufactured by Alfa Aesar) was further added per 100 parts by weight of acrylic polymer B to the solution of acrylic polymer B obtained in Production Example 12.

[0281] [Production Example 15] Production of adhesive composition (4B) A pressure-sensitive adhesive composition (4B) was produced in the same manner as in Production Example 12, except that 0.5 parts by weight of black pigment (carbon black, manufactured by Alfa Aesar) was further added per 100 parts by weight of acrylic polymer B to the solution of acrylic polymer B obtained in Production Example 12.

[0282] [Production Example 16] Production of adhesive composition (5B) A pressure-sensitive adhesive composition (5B) was produced in the same manner as in Production Example 12, except that 1.0 part by weight of black pigment (carbon black, manufactured by Alfa Aesar) was further added per 100 parts by weight of acrylic polymer B to the solution of acrylic polymer B obtained in Production Example 12.

[0283] [Production Example 17] Production of adhesive composition (6B) A pressure-sensitive adhesive composition (6B) was produced in the same manner as in Production Example 12, except that 3.0 parts by weight of black pigment (carbon black, manufactured by Alfa Aesar) was further added per 100 parts by weight of acrylic polymer B to the solution of acrylic polymer B obtained in Production Example 12.

[0284] [Production Example 18] Production of adhesive composition (7B) A pressure-sensitive adhesive composition (7B) was produced in the same manner as in Production Example 12, except that 0.1 parts by weight of black dye (Solvent Black 29, manufactured by BASF) was further added per 100 parts by weight of acrylic polymer B to the solution of acrylic polymer B obtained in Production Example 12.

[0285] [Production Example 19] Production of adhesive composition (8B) A pressure-sensitive adhesive composition (8B) was produced in the same manner as in Production Example 12, except that 0.3 parts by weight of black dye (Solvent Black 29, manufactured by BASF) was further added per 100 parts by weight of acrylic polymer B to the solution of acrylic polymer B obtained in Production Example 12.

[0286] [Production Example 20] Production of adhesive composition (9B) A pressure-sensitive adhesive composition (9B) was produced in the same manner as in Production Example 12, except that 0.5 parts by weight of black dye (Solvent Black 29, manufactured by BASF) was further added per 100 parts by weight of acrylic polymer B to the solution of acrylic polymer B obtained in Production Example 12.

[0287] [Production Example 21] Production of adhesive composition (10B) A pressure-sensitive adhesive composition (10B) was produced in the same manner as in Production Example 12, except that 1.0 parts by weight of black dye (Solvent Black 29, manufactured by BASF) was further added per 100 parts by weight of acrylic polymer B to the solution of acrylic polymer B obtained in Production Example 12.

[0288] [Production Example 22] Production of adhesive composition (11B) A pressure-sensitive adhesive composition (11B) was produced in the same manner as in Production Example 12, except that 3.0 parts by weight of black dye (Solvent Black 29, manufactured by BASF) was further added per 100 parts by weight of acrylic polymer B to the solution of acrylic polymer B obtained in Production Example 12.

[0289] [Production Example 23] Production of laminate (A1) The pressure-sensitive adhesive composition (1A) obtained in Production Example 1 was applied to a polyester resin substrate "Lumirror S10" (thickness 75 μm, manufactured by Toray Industries, Inc.) using a fountain roll so that the thickness after drying would be 25 μm, and the coating was cured and dried under conditions of a drying temperature of 130°C and a drying time of 2 minutes. In this way, a pressure-sensitive adhesive layer was produced on the substrate. Next, the silicone-treated surface of a substrate made of polyester resin "Lumirror S10" (thickness 25 μm, manufactured by Toray Industries, Inc.) with one side silicone-treated was laminated to the surface of the pressure-sensitive adhesive layer, to obtain a laminate (A1) consisting of resin film (with silicone-treated surface) / pressure-sensitive adhesive layer / resin film.

[0290] [Production Example 24] Production of laminate (A2) The same procedure as in Production Example 23 was carried out, except that the adhesive composition (2A) obtained in Production Example 2 was used instead of the adhesive composition (1A), to obtain a laminate (A2) having a structure of resin film (with silicone-treated surface) / adhesive layer / resin film.

[0291] [Production Example 25] Production of laminate (A3) The same procedure was carried out as in Production Example 23, except that the adhesive composition (3A) obtained in Production Example 3 was used instead of the adhesive composition (1A), to obtain a laminate (A3) having a structure of resin film (with silicone-treated surface) / adhesive layer / resin film.

[0292] [Production Example 26] Production of laminate (A4) The same procedure was carried out as in Production Example 23, except that the adhesive composition (4A) obtained in Production Example 4 was used instead of the adhesive composition (1A), to obtain a laminate (A4) having a structure of resin film (with silicone-treated surface) / adhesive layer / resin film.

[0293] [Production Example 27] Production of laminate (A5) The same procedure as in Production Example 23 was carried out, except that the adhesive composition (5A) obtained in Production Example 5 was used instead of the adhesive composition (1A), to obtain a laminate (A5) having a structure of resin film (with silicone-treated surface) / adhesive layer / resin film.

[0294] [Production Example 28] Production of laminate (A6) The same procedure as in Production Example 23 was carried out, except that the adhesive composition (6A) obtained in Production Example 6 was used instead of the adhesive composition (1A), to obtain a laminate (A6) having a structure of resin film (with silicone-treated surface) / adhesive layer / resin film.

[0295] [Production Example 29] Production of laminate (A7) The same procedure as in Production Example 23 was carried out, except that the adhesive composition (7A) obtained in Production Example 7 was used instead of the adhesive composition (1A), to obtain a laminate (A7) having a structure of resin film (with silicone-treated surface) / adhesive layer / resin film.

[0296] [Production Example 30] Production of laminate (A8) The same procedure as in Production Example 23 was carried out, except that the adhesive composition (8A) obtained in Production Example 8 was used instead of the adhesive composition (1A), to obtain a laminate (A8) having a structure of resin film (with silicone-treated surface) / adhesive layer / resin film.

[0297] [Production Example 31] Production of laminate (A9) The same procedure as in Production Example 23 was carried out, except that the adhesive composition (9A) obtained in Production Example 9 was used instead of the adhesive composition (1A), to obtain a laminate (A9) having a structure of resin film (with silicone-treated surface) / adhesive layer / resin film.

[0298] [Production Example 32] Production of laminate (A10) The same procedure was carried out as in Production Example 23, except that the adhesive composition (10A) obtained in Production Example 10 was used instead of the adhesive composition (1A), to obtain a laminate (A10) having a structure of resin film (with silicone-treated surface) / adhesive layer / resin film.

[0299] [Production Example 33] Production of laminate (A11) The same procedure was carried out as in Production Example 23, except that the adhesive composition (11A) obtained in Production Example 11 was used instead of the adhesive composition (1A), to obtain a laminate (A11) having a structure of resin film (with silicone-treated surface) / adhesive layer / resin film.

[0300] [Production Example 34] Production of laminate (B1) The pressure-sensitive adhesive composition (1B) obtained in Production Example 12 was applied to a polyester resin substrate "Lumirror S10" (thickness 50 μm, manufactured by Toray Industries, Inc.) using a fountain roll so that the thickness after drying would be 25 μm, and the coating was cured and dried under conditions of a drying temperature of 130°C and a drying time of 2 minutes. In this way, a pressure-sensitive adhesive layer was produced on the substrate. Next, the silicone-treated side of a substrate made of polyester resin "Lumirror S10" (thickness 25 μm, manufactured by Toray Industries, Inc.) with one side silicone-treated as a separator was laminated to the surface of the pressure-sensitive adhesive layer, to obtain a laminate (B1) having a separator / pressure-sensitive adhesive layer / resin film configuration.

[0301] [Production Example 35] Production of laminate (B2) The same procedure as in Production Example 34 was carried out, except that the adhesive composition (2B) obtained in Production Example 13 was used instead of the adhesive composition (1B), to obtain a laminate (B2) having a separator / adhesive layer / resin film configuration.

[0302] [Production Example 36] Production of laminate (B3) The same procedure as in Production Example 34 was carried out, except that the adhesive composition (3B) obtained in Production Example 14 was used instead of the adhesive composition (1B), to obtain a laminate (B3) having a separator / adhesive layer / resin film configuration.

[0303] [Production Example 37] Production of laminate (B4) The same procedure as in Production Example 34 was carried out, except that the adhesive composition (4B) obtained in Production Example 15 was used instead of the adhesive composition (1B), to obtain a laminate (B4) having a separator / adhesive layer / resin film configuration.

[0304] [Production Example 38] Production of laminate (B5) The same procedure as in Production Example 34 was carried out, except that the adhesive composition (5B) obtained in Production Example 16 was used instead of the adhesive composition (1B), to obtain a laminate (B5) having a separator / adhesive layer / resin film configuration.

[0305] [Production Example 39] Production of laminate (B6) The same procedure as in Production Example 34 was carried out, except that the adhesive composition (6B) obtained in Production Example 17 was used instead of the adhesive composition (1B), to obtain a laminate (B6) having a separator / adhesive layer / resin film configuration.

[0306] [Production Example 40] Production of laminate (B7) The same procedure as in Production Example 34 was carried out, except that the adhesive composition (7B) obtained in Production Example 18 was used instead of the adhesive composition (1B), to obtain a laminate (B7) having a separator / adhesive layer / resin film configuration.

[0307] [Production Example 41] Production of laminate (B8) The same procedure as in Production Example 34 was carried out, except that the adhesive composition (8B) obtained in Production Example 19 was used instead of the adhesive composition (1B), to obtain a laminate (B8) having a separator / adhesive layer / resin film configuration.

[0308] [Production Example 42] Production of laminate (B9) The same procedure as in Production Example 34 was carried out, except that the adhesive composition (9B) obtained in Production Example 20 was used instead of the adhesive composition (1B), to obtain a laminate (B9) having a separator / adhesive layer / resin film configuration.

[0309] [Production Example 43] Production of laminate (B10) The same procedure as in Production Example 34 was carried out, except that the adhesive composition (10B) obtained in Production Example 21 was used instead of the adhesive composition (1B), to obtain a laminate (B10) having a separator / adhesive layer / resin film configuration.

[0310] [Production Example 44] Production of laminate (B11) The same procedure as in Production Example 34 was carried out, except that the adhesive composition (11B) obtained in Production Example 22 was used instead of the adhesive composition (1B), to obtain a laminate (B11) having a separator / adhesive layer / resin film configuration.

[0311] Example 1 The separator was peeled off from the laminate (B1) obtained in Production Example 34, and the resin film (non-silicone-treated resin film) side of the laminate (A3) obtained in Production Example 25 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (1). The results are shown in Table 1.

[0312] Example 2 The separator was peeled off from the laminate (B1) obtained in Production Example 34, and the resin film (non-silicone-treated resin film) side of the laminate (A4) obtained in Production Example 26 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (2). The results are shown in Table 1.

[0313] Example 3 The separator was peeled off from the laminate (B1) obtained in Production Example 34, and the resin film (non-silicone-treated resin film) side of the laminate (A5) obtained in Production Example 27 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (3). The results are shown in Table 1.

[0314] Example 4 The separator was peeled off from the laminate (B1) obtained in Production Example 34, and the resin film (non-silicone-treated resin film) side of the laminate (A8) obtained in Production Example 30 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (4). The results are shown in Table 1.

[0315] Example 5 The separator was peeled off from the laminate (B1) obtained in Production Example 34, and the resin film (non-silicone-treated resin film) side of the laminate (A9) obtained in Production Example 31 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (5). The results are shown in Table 1.

[0316] Example 6 The separator was peeled off from the laminate (B1) obtained in Production Example 34, and the resin film (non-silicone-treated resin film) side of the laminate (A10) obtained in Production Example 32 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (6). The results are shown in Table 1.

[0317] Example 7 The separator was peeled off from the laminate (B1) obtained in Production Example 34, and the resin film (non-silicone-treated resin film) side of the laminate (A11) obtained in Production Example 33 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (7). The results are shown in Table 1.

[0318] Example 8 The separator was peeled off from the laminate (B3) obtained in Production Example 36, and the resin film (non-silicone-treated resin film) side of the laminate (A1) obtained in Production Example 23 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (8). The results are shown in Table 1.

[0319] Example 9 The separator was peeled off from the laminate (B4) obtained in Production Example 37, and the resin film (non-silicone-treated resin film) side of the laminate (A1) obtained in Production Example 23 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (9). The results are shown in Table 1.

[0320] Example 10 The separator was peeled off from the laminate (B5) obtained in Production Example 38, and the resin film (non-silicone-treated resin film) side of the laminate (A1) obtained in Production Example 23 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (10). The results are shown in Table 1.

[0321] Example 11 The separator was peeled off from the laminate (B8) obtained in Production Example 41, and the resin film (non-silicone-treated resin film) side of the laminate (A1) obtained in Production Example 23 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (11). The results are shown in Table 1.

[0322] Example 12 The separator was peeled off from the laminate (B9) obtained in Production Example 42, and the resin film (non-silicone-treated resin film) side of the laminate (A1) obtained in Production Example 23 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (12). The results are shown in Table 1.

[0323] Example 13 The separator was peeled off from the laminate (B10) obtained in Production Example 43, and the resin film (non-silicone-treated resin film) side of the laminate (A1) obtained in Production Example 23 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (13). The results are shown in Table 1.

[0324] Example 14 The separator was peeled off from the laminate (B11) obtained in Production Example 44, and the resin film (non-silicone-treated resin film) side of the laminate (A1) obtained in Production Example 23 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (14). The results are shown in Table 1.

[0325] Comparative Example 1 The separator was peeled off from the laminate (B1) obtained in Production Example 34, and the resin film (non-silicone-treated resin film) side of the laminate (A1) obtained in Production Example 23 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (C1). The results are shown in Table 1.

[0326] Comparative Example 2 The separator was peeled off from the laminate (B1) obtained in Production Example 34, and the resin film (non-silicone-treated resin film) side of the laminate (A2) obtained in Production Example 24 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (C2). The results are shown in Table 1.

[0327] Comparative Example 3 The separator was peeled off from the laminate (B1) obtained in Production Example 34, and the resin film (non-silicone-treated resin film) side of the laminate (A6) obtained in Production Example 28 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (C3). The results are shown in Table 1.

[0328] Comparative Example 4 The separator was peeled off from the laminate (B1) obtained in Production Example 34, and the resin film (non-silicone-treated resin film) side of the laminate (A7) obtained in Production Example 29 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (C4). The results are shown in Table 1.

[0329] Comparative Example 5 The separator was peeled off from the laminate (B2) obtained in Production Example 35, and the resin film (non-silicone-treated resin film) side of the laminate (A1) obtained in Production Example 23 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (C5). The results are shown in Table 1.

[0330] Comparative Example 6 The separator was peeled off from the laminate (B6) obtained in Production Example 39, and the resin film (non-silicone-treated resin film) side of the laminate (A1) obtained in Production Example 23 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (C6). The results are shown in Table 1.

[0331] Comparative Example 7 The separator was peeled off from the laminate (B7) obtained in Production Example 40, and the resin film (non-silicone-treated resin film) side of the laminate (A1) obtained in Production Example 23 was attached to the exposed pressure-sensitive adhesive layer to obtain a laminate (C7). The results are shown in Table 1.

[0332] [Table 1] [Industrial Applicability]

[0333] The laminate of the present invention can be suitably used in the manufacturing process of optical components and electronic components. [Explanation of symbols]

[0334] Resin film (1) 10 Adhesive layer (1) 20 Resin film (2) 30 Adhesive layer (2) 40 Resin film (3) 50 Laminate 100

Claims

1. A laminate of five or more layers having a resin film (1), a pressure-sensitive adhesive layer (1), a resin film (2), a pressure-sensitive adhesive layer (2), and a resin film (3) in this order, a laminate (A) of three or more layers having the resin film (1), the pressure-sensitive adhesive layer (1), and the resin film (2) in this order, but not having the pressure-sensitive adhesive layer (2) and the resin film (3); and a laminate (B) of two or more layers having the pressure-sensitive adhesive layer (2) and the resin film (3) in this order, but not having the resin film (1), the pressure-sensitive adhesive layer (1), and the resin film (2), which are directly laminated together; the resin film (2) is a resin substrate film (2a), the resin substrate film (2a) is a plastic film made of a polyester resin, a plastic film made of a polyimide resin, or a plastic film made of polyether ether ketone, the pressure-sensitive adhesive layer (1) or the pressure-sensitive adhesive layer (2) contains a transmittance control agent, When the pressure-sensitive adhesive layer (1) contains the transmittance control agent, the content ratio thereof is 0.01 wt % to 5 wt % based on the polymer component contained in the pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer (1), when the pressure-sensitive adhesive layer (2) contains the transmittance control agent, the content ratio thereof is 0.01 wt % to 5 wt % relative to the polymer component contained in the pressure-sensitive adhesive composition forming the pressure-sensitive adhesive layer (2); the laminate has a total light transmittance of 5% to 70% as measured under the conditions of JIS-K-7361; Laminate.

2. The laminate according to claim 1, wherein one outermost layer of the laminate (A) is the resin film (2).

3. The laminate according to claim 1 or 2, wherein one outermost layer of the laminate (B) is the pressure-sensitive adhesive layer (2).

4. 4. The laminate according to claim 1, wherein the laminate (A) has a total light transmittance measured under the conditions of JIS-K-7361 of 6% to 70%.

5. 5. The laminate according to claim 1, wherein the laminate (B) has a total light transmittance measured under the conditions of JIS-K-7361 of 6% to 70%.

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