Substrate processing apparatus and substrate processing method

Abstract

This substrate treatment device is for treating a superimposed substrate formed by laminating a first substrate, an interface layer which includes at least a laser absorption layer, and a second substrate. In the superimposed substrate, an outer circumferential region which includes an unjoined region of the first substrate and the second substrate and an inner circumferential region which is disposed in a joined region of the first substrate and the second substrate inside the outer circumferential region in the radial direction are set. A control unit executes: control for rotating the superimposed substrate, applying a laser beam to the superimposed substrate while moving the laser beam in the radial direction, and causing detachment at the interface between the first substrate and the laser absorption layer or at the interface between the interface layer and the laser absorption layer; and control for applying, in at least the outer circumferential region, the laser beam while moving the laser beam from inside to outside in the radial direction.

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] Patent Document 1 discloses a method for transferring a semiconductor element formed on a surface of a semiconductor substrate, the semiconductor element being transferred to a destination substrate. The method described in Patent Document 1 includes a step of irradiating the back surface of the semiconductor substrate with light to locally heat the exfoliation oxide film, and a step of causing exfoliation in the exfoliation oxide film and / or at the interface between the exfoliation oxide film and the semiconductor substrate, thereby transferring the semiconductor element to the destination substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2007-220749 Summary of the Invention [Problem to be solved by the invention]

[0004] The technique according to the present disclosure appropriately separates the laser absorption layer from the first substrate in a laminated substrate in which the laser absorption layer is formed at the interface between the first substrate and the second substrate. [Means for solving the problem]

[0005] One aspect of the present disclosure is a substrate processing apparatus for processing a laminated substrate formed by stacking a first substrate, an interface layer including at least a laser absorption layer, and a second substrate, the substrate processing apparatus comprising: a substrate holding unit for holding the laminated substrate; a laser irradiation unit for irradiating the laminated substrate held by the substrate holding unit with laser light; a movement mechanism for relatively moving the substrate holding unit and the laser irradiation unit in a horizontal direction; a rotation mechanism for rotating the substrate holding unit; and a control unit, wherein the laminated substrate is provided with an outer circumferential region including an unbonded region of the first substrate and the second substrate; and an inner circumferential region that is radially inward of the outer circumferential region and is disposed in a bonded region of the first substrate and the second substrate; In the inner circumferential region, a first inner circumferential region on the radially outer side and a second inner circumferential region on the radially inner side are defined, the control unit controls rotation of the laminated substrate and irradiation of the laminated substrate with the laser light while moving the laser light in a radial direction to cause delamination at an interface between the first substrate and the laser absorption layer or an interface between the interface layer and the laser absorption layer; and controls irradiation of the laser light while moving the laser light from the inside to the outside in the radial direction in at least the outer circumferential region. a control for irradiating the laser light in a pulsed manner in the first inner peripheral region by varying the rotation speed of the laminated substrate in accordance with the movement of the laser light while keeping the frequency of the laser light constant; and a control for irradiating the laser light in a pulsed manner in the second inner peripheral region by varying the frequency of the laser light in accordance with the movement of the laser light while keeping the rotation speed of the laminated substrate constant. Execute. [Effects of the Invention]

[0006] According to the present disclosure, in a laminated substrate in which a laser absorption layer is formed at the interface between a first substrate and a second substrate, the first substrate and the laser absorption layer can be appropriately separated. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 2 is a side view showing a configuration example of an overlapping wafer according to an embodiment. [Figure 2] FIG. 1 is a plan view showing an outline of the configuration of a wafer processing system. [Figure 3] FIG. 1 is a plan view showing an outline of the configuration of a laser irradiation device. [Figure 4] FIG. 1 is a side view showing an outline of the configuration of a laser irradiation device. [Figure 5] FIG. 10 is a side view showing the operation of the separation device. [Figure 6] FIG. 10 is an explanatory diagram showing the state of the overlapped wafer irradiated with laser light. [Figure 7] FIG. 2 is a flow chart showing the main steps of wafer processing in the wafer processing system. [Figure 8] 10 is an explanatory diagram showing the diffusion of heat generated in the overlapping wafer. FIG. [Figure 9] FIG. 10 is an explanatory diagram showing the state of the overlapped wafer irradiated with laser light. [Figure 10] FIG. 10 is an explanatory view showing how the first wafer and the laser absorption layer are peeled off. [Figure 11] FIG. 10 is an explanatory view showing how the first wafer and the laser absorption layer are peeled off. [Figure 12] FIG. 2 is a flow chart showing the main steps of wafer processing in the wafer processing system. [Figure 13] FIG. 2 is an explanatory diagram showing regions of an overlapping wafer, the rotation speed of a chuck in each region, and the frequency of a laser beam in each region. [Figure 14] FIG. 2 is a side view showing the outer circumferential region and the first inner circumferential region. [Figure 15] 10 is an explanatory diagram showing the state of the overlapped wafer in which the outer peripheral region is irradiated with laser light. FIG. [Figure 16] 10 is an explanatory diagram showing the state of the overlapped wafer in which the outer peripheral region is irradiated with laser light. FIG. [Figure 17] 10 is an explanatory diagram showing the state of the overlapped wafer in which the outer peripheral region is irradiated with laser light. FIG. [Figure 18] 10 is an explanatory diagram showing the state of an overlapped wafer in which the second inner peripheral region and the first inner peripheral region are irradiated with laser light. FIG. [Figure 19] 10 is an explanatory diagram showing the state of the overlapped wafer in which the first inner peripheral region is irradiated with laser light. FIG. [Figure 20] FIG. 10 is an explanatory diagram showing the state of a superposed wafer in which a central region is irradiated with laser light. [Figure 21] 10A and 10B are explanatory views showing the state of overlapping wafers irradiated with laser light in another embodiment. [Figure 22] 10A and 10B are explanatory views showing the state of overlapping wafers irradiated with laser light in another embodiment. [Figure 23]10A and 10B are explanatory views showing the state of overlapping wafers irradiated with laser light in another embodiment. [Figure 24] 10 is an explanatory diagram showing how the peeling-promoting layer and the laser absorbing layer are peeled off. FIG. [Figure 25] FIG. 10 is a flowchart showing main steps of wafer processing according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0008] In a semiconductor device manufacturing process, a device layer formed on the surface of a first semiconductor substrate (hereinafter referred to as "wafer") is transferred to a second wafer in an overlapped wafer formed by bonding two wafers together. The transfer of the device layer to the second wafer is performed by irradiating a laser light onto a laser absorption layer formed between the first wafer and the device layer, thereby peeling the first wafer from the laser absorption layer. Specifically, for example, while rotating the overlapped wafer, the laser light is irradiated onto the laser absorption layer in pulses while moving from the outer side to the inner side in the radial direction.

[0009] Here, the peripheral edge of the overlapped wafer has a chamfered portion (bevel portion), and this peripheral edge is not bonded. That is, the outer peripheral region of the overlapped wafer includes an unbonded region, and the bonding strength at the interface between the first wafer (including the device layer) and the second wafer is low at the boundary between the unbonded region and the bonded region. In such a case, when the outer peripheral region is irradiated with laser light, peeling occurs at the interface between the first wafer and the second wafer, where the bonding strength is low.

[0010] In this state, if the laser beam is irradiated in the outer peripheral region while moving radially inward, delamination tends to progress from the interface between the delaminated first wafer and the second wafer in the bonded region adjacent to the inner radial direction of the unbonded region. In other words, delamination does not occur at the desired interface between the first wafer and the laser absorption layer in the bonded region of the outer peripheral region. This may result in failure to transfer the device layer of the first wafer to the second wafer.

[0011] The technology disclosed herein appropriately separates a first substrate and a laser absorption layer in a laminated substrate in which the laser absorption layer is formed at the interface between the first substrate and the second substrate. Hereinafter, a wafer processing system equipped with a laser irradiation device as a substrate processing apparatus according to this embodiment, and a wafer processing method as a substrate processing method will be described with reference to the drawings. Note that in this specification and the drawings, elements having substantially the same functional configuration are designated by the same reference numerals, and redundant description will be omitted.

[0012] In a wafer processing system 1 according to this embodiment, which will be described later, processing is performed on a laminated wafer T, which is a laminated substrate formed by bonding a first wafer W and a second wafer S, as shown in Fig. 1. Hereinafter, the surface of the first wafer W that is bonded to the second wafer S will be referred to as the front surface Wa, and the surface opposite the front surface Wa will be referred to as the back surface Wb. Similarly, the surface of the second wafer S that is bonded to the first wafer W will be referred to as the front surface Sa, and the surface opposite the front surface Sa will be referred to as the back surface Sb.

[0013] The first wafer W as the first substrate is a semiconductor wafer such as a silicon substrate. In one embodiment, the first wafer W has a substantially circular disk shape. A laminated film formed by stacking multiple films is formed on the surface Wa of the first wafer W. The laminated film includes, in order from the surface Wa side, a laser absorption layer P, a device layer Dw, and a surface film Fw. The device layer Dw includes multiple devices. Examples of the surface film Fw include an oxide film (THOX film, SiO2 film, TEOS film), a SiC film, a SiCN film, or an adhesive. The first wafer W is bonded to the second wafer S via this surface film Fw. Note that the device layer Dw and the surface film Fw may not be formed on the surface Wa. In this case, the laser absorption layer P is formed on the second wafer S side, and the device layer Ds on the second wafer S side, which will be described later, is transferred to the first wafer W side.

[0014] The laser absorbing layer P absorbs the laser light irradiated from the laser irradiation unit 110, as will be described later. The laser absorbing layer P may be made of, for example, an oxide film (SiO2 film, TEOS film), but is not particularly limited as long as it absorbs the laser light. The laser absorbing layer P is formed, for example, by a CVD (Chemical Vapor Deposition) process outside the wafer processing system 1, which will be described later. The composition of the oxide film (SiO2 film, TEOS film) serving as the laser absorbing layer P can be changed as desired depending on the type and mixture ratio of the processing gas used in the CVD process.

[0015] The second wafer S serving as the second substrate is a semiconductor wafer such as a silicon substrate. A laminated film is formed on the surface Sa of the second wafer S. The laminated film has a device layer Ds and a surface film Fs, in this order, from the surface Sa side. The device layer Ds and the surface film Fs are the same as the device layer Dw and the surface film Fw of the first wafer W, respectively. The surface film Fw of the first wafer W and the surface film Fs of the second wafer S are bonded together. Note that the device layer Ds and the surface film Fs may not be formed on the surface Sa.

[0016] In the technology of the present disclosure, the laminated films formed at the interface between the first wafer W and the second wafer S, specifically the laser absorption layer P, the device layers Dw, Ds, and the surface films Fw, Fs, may be collectively referred to as the "interface layer." In the technology of the present disclosure, the interface layer includes at least the laser absorption layer P. The type of laminated film formed at the interface between the first wafer W and the second wafer S is not limited to the example shown in Fig. 1. For example, the laminated film may include a "peeling-promoting film" (described later) for properly peeling the first wafer W from the laser absorption layer P. In this case, the above-mentioned interface layer includes the peeling-promoting film.

[0017] 2, the wafer processing system 1 has a configuration in which a load / unload block 10, a transfer block 20, and a processing block 30 are integrally connected. The load / unload block 10 and the processing block 30 are provided around the transfer block 20. Specifically, the load / unload block 10 is disposed on the negative Y-axis side of the transfer block 20. A laser irradiation device 31 (described later) and a separation device 32 (described later) of the processing block 30 are disposed on the negative X-axis side of the transfer block 20, and a first cleaning device 33 (described later) and a second cleaning device 34 (described later) are disposed on the positive X-axis side of the transfer block 20.

[0018] The carry-in / out block 10 carries in and out cassettes Ct, Cw, and Cs, each capable of accommodating a plurality of overlapping wafers T, a plurality of first wafers W, and a plurality of second wafers S, for example, between the outside and the block. A cassette mounting table 11 is provided in the carry-in / out block 10. In the illustrated example, the cassette mounting table 11 is capable of mounting a plurality of cassettes, for example, three cassettes Ct, Cw, and Cs, in a line in the X-axis direction. The number of cassettes Ct, Cw, and Cs mounted on the cassette mounting table 11 is not limited to that in this embodiment and can be determined arbitrarily.

[0019] The transfer block 20 is provided with a wafer transfer device 22 that is movable on a transfer path 21 extending in the X-axis direction. The wafer transfer device 22 has, for example, two transfer arms 23, 23 that hold and transfer the overlapped wafer T, the first wafer W, or the second wafer S. Each transfer arm 23 is configured to be movable horizontally, vertically, around a horizontal axis, and around a vertical axis. Note that the configuration of the transfer arm 23 is not limited to this embodiment and may have any configuration. The wafer transfer device 22 is configured to transfer the overlapped wafer T, the first wafer W, or the second wafer S to the cassettes Ct, Cw, and Cs on the cassette mounting table 11, the laser irradiation device 31, the separation device 32, the first cleaning device 33, and the second cleaning device 34.

[0020] The processing block 30 has a laser irradiation device 31, a separation device 32, a first cleaning device 33, and a second cleaning device 34. In one example, the laser irradiation device 31 and the separation device 32 are stacked on the negative side of the X-axis of the transport block 20. The first cleaning device 33 and the second cleaning device 34 are stacked on the positive side of the X-axis of the transport block 20. However, the number and arrangement of the laser irradiation device 31, the separation device 32, the first cleaning device 33, and the second cleaning device 34 are not limited to this.

[0021] The laser irradiation device 31 irradiates the inside of the overlapped wafer T, more specifically, the laser absorption layer P formed on the surface Wa of the first wafer W with laser light to reduce the bonding strength at the interface between the first wafer W and the laser absorption layer P.

[0022] 3, a delivery position A1 and a processing position A2 are set inside the laser irradiation device 31. The delivery position A1 is a position where the overlapped wafer T can be delivered from the transfer arm 23 to a chuck 100 (described later) and where an image of the overlapped wafer T (laser absorbing layer P) can be captured by a camera 120 (described later). The processing position A2 is a position where the overlapped wafer T (laser absorbing layer P) can be irradiated with laser light from a laser irradiation unit 110 (described later).

[0023] 3 and 4, the laser irradiation device 31 has a chuck 100 as a substrate holder that holds the overlapped wafer T on its upper surface. The chuck 100 has a holding surface for the overlapped wafer T on its upper surface, and adsorbs and holds the entire back surface Sb of the second wafer S or a radially inner portion of the back surface Sb. The chuck 100 is, for example, an electrostatic chuck (ESC) or a vacuum chuck. The chuck 100 is provided with lifting pins (not shown) for supporting and elevating the overlapped wafer T from below. The lifting pins are inserted into through holes (not shown) formed through the chuck 100 and are configured to be able to move up and down.

[0024] The chuck 100 is supported by a slider table 102 via an air bearing 101. A rotation mechanism 103 is provided on the underside of the slider table 102. The rotation mechanism 103 has a built-in motor, for example, as a drive source. The chuck 100 is configured to be rotatable around the θ-axis (vertical axis) via the air bearing 101 by the rotation mechanism 103. The slider table 102 is configured to be movable between the transfer position A1 and the processing position A2 by a movement mechanism 104 provided on the underside of the slider table 102 along rails 106 that are provided on a base 105 and extend in the Y-axis direction. The drive source of the movement mechanism 104 is not particularly limited, but a linear motor, for example, is used.

[0025] A laser irradiation unit 110 is provided above the chuck 100 at the processing position A2. The laser irradiation unit 110 has a laser head 111, an optical system 112, and a lens 113. The laser irradiation unit 110 can scan a laser beam. In the following description, scanning a laser beam means moving the laser beam irradiated from the lens 113 of the laser irradiation unit 110 relative to the laser absorption layer P.

[0026] The laser head 111 has a laser oscillator (not shown) that oscillates a laser beam in pulses. This laser beam is a so-called pulsed laser. In this embodiment, the laser beam is a CO2 laser beam, and the wavelength of the CO2 laser beam is, for example, 8.9 μm to 11 μm. The laser head 111 may also have other devices besides the laser oscillator, such as an amplifier.

[0027] The optical system 112 has an optical element (not shown) that controls the intensity and position of the laser light, an attenuator (not shown) that attenuates the laser light to adjust the output, and a laser scanning unit (not shown) that scans the laser light. The laser scanning unit may be, for example, a rotary wedge scanner or a galvano scanner. The optical system 112 may also be configured to be able to control the branching of the laser light.

[0028] The lens 113 irradiates the overlapped wafer T held by the chuck 100 with laser light. The laser light emitted from the laser irradiation unit 110 passes through the first wafer W and is irradiated onto the laser absorption layer P. The lens 113 may be configured to be movable in the horizontal direction by a movement mechanism (not shown), or may be configured to be movable up and down in the vertical direction by a lifting mechanism (not shown).

[0029] Moreover, a camera 120 is provided above the chuck 100 at the delivery position A1. The camera 120 has one or more cameras selected from a macro camera, a micro camera, etc. The camera 120 may be configured to be movable in the horizontal direction by a movement mechanism (not shown), or may be configured to be movable up and down in the vertical direction by a lifting mechanism (not shown).

[0030] The camera 120 captures an image of the laminated wafer T held on the chuck 100. The camera 120 includes, for example, a coaxial lens, irradiates infrared light (IR), and receives reflected light from an object. Image data captured by the camera 120 is output to the control device 40, which will be described later.

[0031] As will be described later, the wafer processing system 1 includes a control device 40, which is provided in the laser irradiation device 31 and also functions as a control unit that controls the laser irradiation device 31.

[0032] The separation device 32 as a separation section separates the first wafer W from the second wafer S (overlapped wafer T) using the interface between the first wafer W and the laser absorption layer P as the separation portion, where the bonding strength has been reduced by the laser irradiation device 31, as a base point.

[0033] 5, the separation device 32 has an adsorption chuck 200 that adsorbs and holds the back surface Sb of the second wafer S from below, and an adsorption pad 210 that adsorbs and holds the back surface Wb of the first wafer W from above. In the separation device 32, the adsorption chuck 200 adsorbs and holds the second wafer S, and the adsorption pad 210 adsorbs and holds the first wafer W, as shown in FIG. 5, the adsorption pad 210 is raised to peel off the first wafer W from the laser absorption layer P.

[0034] The configuration of the separating device 32 is not limited to this, and any configuration may be used as long as the first wafer W can be separated from the second wafer S.

[0035] The first cleaning device 33 cleans the front surface Sa side of the second wafer S separated by peeling in the separation device 32. For example, a brush is brought into contact with the laser absorbing layer P on the front surface Sa side of the second wafer S to clean the laser absorbing layer P. Note that a pressurized cleaning liquid may be used to clean the second wafer S. The first cleaning device 33 may also be configured to clean the back surface Sb of the second wafer S as well as the front surface Sa side.

[0036] The second cleaning device 34 cleans the front surface Wa of the first wafer W separated by peeling in the separation device 32. For example, a brush is brought into contact with the front surface Wa of the first wafer W to clean the front surface Wa. A pressurized cleaning liquid may be used to clean the first wafer W. The second cleaning device 34 may also be configured to clean the back surface Wb of the first wafer W as well as the front surface Wa.

[0037] In this embodiment, as described above, the first cleaning apparatus 33 for cleaning the second wafer S and the second cleaning apparatus 34 for cleaning the first wafer W are disposed independently, but the cleaning of the first wafer W and the cleaning of the second wafer S may be performed using the same cleaning apparatus. In this case, the cleaning of the first wafer W and the second wafer S may be performed simultaneously or independently.

[0038] Furthermore, in this embodiment, the first wafer W is separated from the second wafer S using the separation device 32, but such separation may also be performed inside the laser irradiation device 31. For example, a liftable transfer pad (not shown) is provided at the transfer position A1 of the laser irradiation device 31. Then, while the chuck 100 is holding the second wafer S by suction, the transfer pad holds the first wafer W by suction, and the transfer pad is then raised, thereby separating the first wafer W from the second wafer S.

[0039] The wafer processing system 1 described above is provided with a control device 40 as a control unit. The control device 40 is, for example, a computer, and has a program storage unit (not shown). The program storage unit stores a program for controlling the processing of the overlapped wafer T in the wafer processing system 1. The program storage unit also stores a program for controlling the operation of drive systems such as the various processing devices and transport devices described above to realize wafer processing, which will be described later, in the wafer processing system 1. The program may be recorded on a computer-readable storage medium H and installed from the storage medium H into the control device 40. The storage medium H may be temporary or non-temporary.

[0040] Next, a description will be given of wafer processing performed using the wafer processing system 1 configured as described above. In this embodiment, a first wafer W and a second wafer S are bonded together in a bonding device (not shown) external to the wafer processing system 1 to form an overlapped wafer T in advance.

[0041] First, a cassette Ct containing a plurality of overlapping wafers T is placed on the cassette placement table 11 of the carry-in / out block 10.

[0042] Next, the overlapped wafer T is removed from the cassette Ct by the wafer transfer device 22 and transferred to the laser irradiation device 31. In the laser irradiation device 31, the overlapped wafer T is transferred from the transfer arm 23 to the chuck 100 arranged at the transfer position A1, and the back surface Sb of the second wafer S is attracted and held by the chuck 100. Next, the moving mechanism 104 moves the chuck 100 to the processing position A2.

[0043] Next, as shown in Fig. 6, the laser irradiation unit 110 focuses on the laser absorbing layer P, more specifically, on the interface between the first wafer W and the laser absorbing layer P, and irradiates the interface with pulsed laser light L (CO2 laser light). At this time, the laser light L passes through the first wafer W from the back surface Wb side of the first wafer W and is absorbed in the laser absorbing layer P. Then, this laser light L reduces the bonding strength between the first wafer W and the laser absorbing layer P. Note that in the embodiments, "reduced bonding strength" refers to a state in which the bonding strength is reduced at least compared to before the irradiation of the laser light L, and includes peeling between the first wafer W and the laser absorbing layer P. The mechanism by which the bonding strength between the first wafer W and the laser absorption layer P decreases due to irradiation with the laser light L will be described in detail later.

[0044] When irradiating the laser absorbing layer P with the laser light L at the processing position A2, first, an image of the overlapped wafer T (first wafer W) is taken by the camera 120. Image data taken by the camera 120 is output to the control device 40. The control device 40 determines the irradiation start position of the laser absorbing layer P with the laser light L based on the image data.

[0045] Subsequently, at the processing position A2, the laser irradiation unit 110 irradiates the entire surface of the laser absorbing layer P in plan view with laser light L at desired intervals, thereby reducing the bonding strength over the entire surface of the interface between the first wafer W and the laser absorbing layer P. The method of irradiating the laser absorbing layer P with laser light L will be described in detail later.

[0046] After the entire surface of the laser absorbing layer P is irradiated with the laser light L and the bonding strength between the first wafer W and the entire surface of the laser absorbing layer P is reduced, the moving mechanism 104 moves the chuck 100 (superimposed wafer T) to the delivery position A1.

[0047] Next, the laminated wafer T on the chuck 100 is transferred to the transfer arm 23 of the wafer transfer device 22 and transferred to the separation device 32. In the separation device 32, as shown in FIG. 5(a), the suction chuck 200 suction-holds the back surface Sb of the second wafer S, and the suction pad 210 suction-holds the back surface Wb of the first wafer W. Thereafter, as shown in FIG. 5(b), while the suction pad 210 suction-holds the first wafer W, the suction pad 210 is raised to peel the first wafer W from the laser absorbing layer P. At this time, since the bonding strength at the interface between the first wafer W and the laser absorbing layer P has been reduced by the irradiation of the laser light L as described above, the first wafer W can be separated from the laser absorbing layer P without applying a large load.

[0048] The separated first wafer W is transferred from the suction pad 210 to the transfer arm 23 of the wafer transfer device 22 and transferred to the second cleaning device 34. At this time, the first wafer W transferred from the separation device 32 may be reversed, for example, by the operation of an inverting device (not shown) or the suction pad 210, so that the front surface Wa faces upward, and then transferred to the second cleaning device 34.

[0049] In the second cleaning device 34, the front surface Wa of the first wafer W, which is the surface separated by the separation device 32, is cleaned. Note that in the second cleaning device 34, the back surface Wb may also be cleaned in addition to the front surface Wa. Alternatively, separate cleaning units may be provided for cleaning the front surface Wa and the back surface Wb, respectively. Thereafter, the first wafer W that has been cleaned by the second cleaning device 34 is transferred by the wafer transfer device 22 to the cassette Cw on the cassette mounting table 11.

[0050] On the other hand, the second wafer S held by the suction chuck 200 is transferred to the transfer arm 23 and transferred to the first cleaning device 33. In the first cleaning device 33, the front surface Sa side of the second wafer S, which is the surface separated by the separation device 32, specifically the front surface of the laser absorbing layer P, is cleaned. Note that in the first cleaning device 33, the back surface Sb of the second wafer S may also be cleaned together with the front surface of the laser absorbing layer P. Furthermore, separate cleaning units may be provided for cleaning the front surface of the laser absorbing layer P and the back surface Sb of the second wafer S, respectively. Thereafter, the second wafer S cleaned by the first cleaning device 33 is transferred to the cassette Cs of the cassette mounting table 11 by the wafer transfer device 22.

[0051] Thus, a series of wafer processing steps in the wafer processing system 1 is completed.

[0052] Next, the mechanism of the reduction in the bonding strength between the first wafer W and the laser absorption layer P caused by the irradiation of the laser light L at the processing position A2 of the laser irradiation device 31 will be described in detail.

[0053] As described above, at the processing position A2 of the laser irradiation device 31, the overlapped wafer T held by the chuck 100 is irradiated with the laser light L from the back surface Wb side of the first wafer W (step St11 in FIG. 7). The laser light L output from the lens 113 of the laser irradiation unit 110 passes through silicon (first wafer W) and is absorbed by the laser absorption layer P (step St12 in FIG. 7), as shown in FIG.

[0054] The laser light L absorbed by the laser absorbing layer P is converted into heat according to its energy distribution (step St13 in FIG. 7). In other words, the absorption of the laser light L increases the temperature of the laser absorbing layer P. The temperature of the laser absorbing layer P is highest in the region directly under the irradiation of the laser light L. 8, most of the heat (Ht in the figure) generated in the laser absorbing layer P due to absorption of the laser light L is diffused toward the first wafer W side (step St14 in FIG. 7). In other words, the temperature of the interface between the laser absorbing layer P and the first wafer W (silicon) increases due to the thermal diffusion from the laser absorbing layer P.

[0055] When the heat generated in the laser absorption layer P diffuses toward the first wafer W side, the influence of this heat, i.e., an increase in the interface temperature between the laser absorption layer P and the first wafer W, causes the first wafer W to locally expand (plastically deform into a downward convex shape toward the laser absorption layer P side) in the area irradiated with the laser light L in accordance with the temperature distribution as shown in FIG. 9 (step St15 in FIG. 7). Hereinafter, the region affected by the heat generated by irradiation with the laser light L may be referred to as the “irradiation region R” of the laser light L. In other words, the first wafer W expands locally in the irradiated region R of the laser light L.

[0056] Here, when the first wafer W expands, the laser absorbing layer P is pressed from above (the first wafer W side) in accordance with the expansion of the first wafer W, and as a result, a compressive stress σ1 is generated in the laser absorbing layer P at the irradiation position of the laser light L, as shown in Fig. 9. The generated compressive stress σ1 acts in a direction that peels the first wafer W and the laser absorbing layer P (the downward direction in the figure, toward the laser absorbing layer P side), as shown in Fig. 9, to generate a peeling stress σ2. In other words, in the irradiation region R of the laser light L, the silicon (first wafer W) expands in the region directly below the irradiation of the laser light L (the center of the irradiation region R), generating a compressive stress σ1, and at the same time, a peeling stress σ2, which is a stress in the peeling direction caused by the compressive stress σ1, is generated at the end Re (see FIG. 9) of the irradiation region R. This peeling stress σ2 is a tensile stress generated at the end Re of the irradiation region R.

[0057] The generated compressive stress σ1 and peeling stress σ2 are accumulated inside the laser absorption layer P. At this time, at the end Re of the irradiation region R, the peeling stresses σ2 generated in the multiple irradiation regions R act synergistically (overlappingly).

[0058] Then, when the total accumulated amount (synergistic amount) of peeling stress σ2 at the end Re of the irradiation region R exceeds the adhesion force Σ between the first wafer W and the laser absorbing layer P per unit area at the end Re (n×σ2>Σ (where n is a natural number and is the number of irradiations of the laser light L)), peeling occurs at the interface between the first wafer W and the laser absorbing layer P at the end Re of the irradiation region R as shown in FIG. 10, and as a result, the bonding strength between the laser absorbing layer P and the first wafer W decreases (step St16 in FIG. 7).

[0059] The stress σ (compressive stress σ1 and peeling stress σ2) accumulated inside the laser absorption layer P is released by the peeling of the first wafer W and the laser absorption layer P.

[0060] Then, at the processing position A2 of the laser irradiation device 31, as shown in FIG. 11, peeling occurs over the entire surface of the interface between the first wafer W and the laser absorption layer P in plan view, in other words, the peeling that occurs at the end Re of the irradiation region R is connected over the entire surface of the interface between the first wafer W and the laser absorption layer P, thereby reducing the bonding strength over the entire surface of the first wafer W and the laser absorption layer P, and thereby the first wafer W and the laser absorption layer P can be properly separated in the separation device 32 (step St17 in FIG. 7). In the overlapped wafer T after irradiation with the laser beam L at the processing position A2, ideally, peeling from the laser absorbing layer P occurs over the entire surface of the first wafer W. In other words, after peeling occurs at the edge Re of the irradiation region R, the first wafer W and the laser absorbing layer P are also peeled off in the center of the irradiation region R, including the region immediately below the irradiation, due to the peel stress σ2. However, as shown in FIG. 10 , in the center of the irradiation region R (the region immediately below the irradiation of the laser beam L), the first wafer W and the laser absorbing layer P may remain connected (not peeled off) even after peeling occurs at the edge Re of the irradiation region R. For this reason, in the wafer processing system 1 according to the technique of the present disclosure, in order to reliably separate the first wafer W from the overlapped wafer T (laser absorbing layer P) in the overlapped wafer T after irradiation with the laser beam L, it is preferable to provide a separation device 32 and to perform a step of separating the first wafer W from the overlapped wafer T in the separation device 32.

[0061] Here, when the separation of the first wafer W from the overlapped wafer T is performed in this manner using the separation device 32, if the overlapped wafer T is transported to the separation device 32 in the ideal state described above, i.e., in a state where peeling from the laser absorption layer P has occurred over the entire surface of the first wafer W, there is a risk that the first wafer W will fall off the second wafer S due to inertial forces and the like associated with this transport. Furthermore, if peeling from the laser absorbing layer P occurs over the entire surface of the first wafer W in this manner, even if there is no need to transport the polymerized wafer T after irradiation with the laser light L to the separation device 32, there is a risk that the first wafer W will fly off from the second wafer S due to centrifugal force or the like caused by the rotation of the chuck 100 while the laser light L is being irradiated onto the laser absorbing layer P at the processing position A2.

[0062] In view of this, in order to prevent the first wafer W from scattering or falling during irradiation of the laser light L onto the laser absorption layer P and during transport of the laminated wafer T, it is preferable to control the irradiation conditions (irradiation position, output, etc.) of the laser light L at the processing position A2 so that at least a part of the interface between the first wafer W and the laser absorption layer P remains connected (not peeled off). This allows the first wafer W to be completely separated from the laser absorption layer P during irradiation with the laser light L or during transport to the separating device 32, and prevents the first wafer W from scattering or falling off the second wafer S.

[0063] The reduction in the bonding strength between the first wafer W and the laser absorbing layer P at the processing position A2 of the laser irradiation device 31 is performed as described above. That is, in this embodiment, the laser irradiation device 31 expands the first wafer W by heat generated by irradiation with the laser light L, and generates a compressive stress σ1 in the laser absorbing layer P, thereby generating a peel stress σ2 in the peel direction at the interface between the first wafer W and the laser absorbing layer P, which causes peeling at the interface between the first wafer W and the laser absorbing layer P and reduces the bonding strength.

[0064] In the above embodiment, as shown in FIG. 9, the laser absorbing layer P is irradiated with the laser light L multiple times, and when the total accumulated amount of the resulting peeling stress σ2 exceeds the adhesion force Σ between the first wafer W and the laser absorbing layer P, peeling occurs at the end Re of the irradiated region R. However, the number of times of irradiation with the laser light L until such peeling occurs is not limited to multiple times. For example, if the peel stress σ2 generated by a single irradiation (one time) of laser light L exceeds the adhesion force Σ of the end Re, the irradiation of the single laser light L may cause peeling at the interface between the first wafer W and the laser absorption layer P at the end Re of the irradiation region R.

[0065] Next, a method for irradiating the laser absorption layer P with the laser light L at the processing position A2 of the laser irradiation device 31 will be described in detail.

[0066] First, as shown in FIG. 13, the regions of the overlapped wafer T (laser absorption layer P) in a planar view are set as an outer peripheral region Z0, a first inner peripheral region Z1, a second inner peripheral region Z2, and a central region Z3 (step St20 in FIG. 12). Specifically, for example, an operator sets the outer peripheral region Z0, the first inner peripheral region Z1, the second inner peripheral region Z2, and the central region Z3, and these outer peripheral region Z0, the first inner peripheral region Z1, the second inner peripheral region Z2, and the central region Z3 are stored in the control device 40. The outer peripheral region Z0, the first inner peripheral region Z1, the second inner peripheral region Z2, and the central region Z3 are arranged in this order from the outside to the inside in the radial direction. Furthermore, the outer peripheral region Z0, the first inner peripheral region Z1, and the second inner peripheral region Z2 are arranged in a concentric ring shape with the overlapped wafer T, and the central region Z3 is arranged in a concentric circle shape with the overlapped wafer T.

[0067] 13 and 14, the outer peripheral region Z0 is a peripheral region of the overlapped wafer T, and includes an unbonded region Q where the first wafer W (surface film Fw) and the second wafer S (surface film Fs) are not bonded, and a bonded region B radially inward of the unbonded region Q. The unbonded region Q includes a chamfered portion (bevel portion) where the peripheral edge is chamfered. The unbonded region Q also includes a region where the first wafer W and the second wafer S are not bonded due to, for example, misalignment of the bonding position or other factors.

[0068] The first inner peripheral region Z1, the second inner peripheral region Z2, and the central region Z3 are regions disposed in the bonding region B of the first wafer W and the second wafer S, respectively.

[0069] In this embodiment, the overlapped wafer T is rotated and the laser light L is moved in the radial direction while the laser light L is irradiated in pulses. At this time, in order to uniformly peel the first wafer W and the laser absorption layer P across the wafer surface, it is preferable to keep the interval at which the laser light L is irradiated, i.e., the pulse interval, constant. To keep the irradiation interval of the laser light L constant, for example, the rotation speed of the overlapped wafer T is increased as the laser light L moves from the outer side to the inner side in the radial direction. Furthermore, when the rotation speed of the overlapped wafer T reaches its upper limit, the frequency of the laser light L when irradiating the laser light L in pulses is decreased, for example, as the laser light L moves from the outer side to the inner side in the radial direction. When the rotation speed of the overlapped wafer T reaches its upper limit and the frequency of the laser light reaches its lower limit, for example, the irradiation interval of the laser light decreases as the laser light L moves from the outer side to the inner side in the radial direction, and the laser light L may overlap in the central region of the overlapped wafer T.

[0070] Therefore, in this embodiment, the overlapped wafer T is rotated while being irradiated with the laser light L in the outer peripheral region Z0, the first inner peripheral region Z1, and the second inner peripheral region Z2. Meanwhile, the laser light L is scanned in the central region Z3 while the rotation of the overlapped wafer T is stopped.

[0071] In the outer peripheral region Z0 and the first inner peripheral region Z1, the laser light L is irradiated in pulses by varying the rotation speed of the overlapped wafer T in accordance with the radial movement of the laser light L while keeping the frequency of the laser light L constant. Specifically, the rotation speed of the overlapped wafer T is increased when the laser light L moves from the outer side to the inner side in the radial direction, and the rotation speed of the overlapped wafer T is decreased when the laser light L moves from the inner side to the outer side in the radial direction.

[0072] In the second inner peripheral region Z2, the rotation speed of the overlapped wafer T is kept constant, and the frequency of the laser light L is varied in accordance with the radial movement of the laser light L to irradiate the laser light L in pulses. Specifically, the frequency of the laser light L is decreased when the laser light L moves from the outer side to the inner side in the radial direction, and the frequency of the laser light L is increased when the laser light L moves from the inner side to the outer side in the radial direction.

[0073] The boundary position between the first inner peripheral region Z1 and the second inner peripheral region Z2 is set at a position where the rotation speed of the overlapped wafer T reaches an upper limit, and the boundary position between the second inner peripheral region Z2 and the central region Z3 is set at a position where the frequency of the laser light L reaches a lower limit.

[0074] Next, the laser absorption layer P is irradiated with laser light L. At this time, the processing conditions of the laser processing are changed for each of the regions Z0 to Z3. In this embodiment, irradiation of the outer circumferential region Z0 with laser light L (step St21 in FIG. 12), irradiation of the second inner circumferential region Z2 with laser light L (step St22 in FIG. 12), irradiation of the first inner circumferential region Z1 with laser light L (step St23 in FIG. 12), and irradiation of the central region Z3 with laser light L (step St24 in FIG. 12) are performed in this order.

[0075] In step St21, in the outer peripheral region Z0, as shown in FIG. 15, the rotation mechanism 103 rotates the chuck 100 (the overlapped wafer T held by the chuck 100) counterclockwise, and the movement mechanism 104 moves the chuck 100 in the positive direction of the Y axis, while irradiating the laser light L in pulses. At this time, the laser light L is fixed without scanning. As a result, in the outer peripheral region Z0, the laser light L is irradiated in a spiral pattern from the inside to the outside in the radial direction. Furthermore, due to the peeling mechanism of the first wafer W and the laser absorption layer P caused by the irradiation of the laser light L described above, peeling occurs at the interface between the first wafer W and the laser absorption layer P in the outer peripheral region Z0, as shown in FIG. 16.

[0076] Since the outer peripheral region Z0 includes the unbonded region Q, the bonding strength between the first wafer W and the second wafer S, i.e., the bonding strength between the surface film Fw and the surface film Fs, is low at the boundary between the unbonded region Q and the bonding region B. In this case, when the outer peripheral region Z0 is irradiated with laser light L, as shown in FIG. 17, peeling does not occur between the first wafer W and the laser absorbing layer P in the outer peripheral region Z0 unless the peel stress σ2 exceeds the adhesion force Σ between the first wafer W and the laser absorbing layer P. The convex shape of the interface between the first wafer W and the laser absorbing layer P is transmitted to the surface film Fw, and stress acts on the interface between the surface film Fw and the surface film Fs. This stress may cause peeling at the interface between the surface film Fw and the surface film Fs, where the bonding strength is low, at the boundary between the unbonded region Q and the bonding region B. In this state, when the laser beam L is irradiated by moving from the radially outer side to the radially inner side in the outer peripheral region Z0, peeling tends to progress from the interface between the peeled surface film Fw and the surface film Fs as the leading edge in the bonding region B adjacent to the radially inner side of the unbonded region Q. That is, in the bonding region B of the outer peripheral region Z0, peeling may not occur at the desired interface between the first wafer W and the laser absorption layer P.

[0077] Therefore, in this embodiment, the laser light L is irradiated from the radially inner side to the radially outer side in the outer peripheral region Z0. As a result, as shown in FIG. 16, a peel E1 occurs at the interface between the first wafer W and the laser absorption layer P in the bonding region B. At this time, stress σ is generated in each irradiation region R so that the peel E1 occurs from the center to the edge Re. To generate such a large stress σ, for example, the frequency of the laser light L may be increased (the pitch of the laser light L may be shortened) or the irradiation intensity of the laser light L may be increased. Furthermore, at the boundary between the bonding region B and the unbonded region Q, the bonding strength at the interface between the surface film Fw and the surface film Fs is low, so a peel E2 occurs extending from the interface between the first wafer W and the laser absorption layer P toward the interface between the surface film Fw and the surface film Fs. Even if peel E2 occurs, there is no impact on the device layer Dw radially outside of the peel E2 because it is not a commercial device.

[0078] Next, in step St22, in the second inner peripheral region Z2, as shown in FIG. 18, the chuck 100 is rotated counterclockwise by the rotation mechanism 103 and moved in the positive direction of the Y axis by the movement mechanism 104, while the laser light L is irradiated in pulses. At this time, the laser light L is fixed without scanning. As a result, in the second inner peripheral region Z2, the laser light L is irradiated in a spiral pattern from the inside to the outside in the radial direction. Furthermore, in the second inner peripheral region Z2, peeling occurs at the interface between the first wafer W and the laser absorption layer P, as shown in FIG.

[0079] Next, in step St23, the first inner peripheral region Z1 is also irradiated with the laser light L continuously in step St22, as shown in Fig. 18. That is, the laser light L is irradiated in pulses while the chuck 100 is rotated counterclockwise by the rotation mechanism 103 and moved in the positive direction of the Y axis by the movement mechanism 104. At this time, the laser light L is fixed without scanning.

[0080] Then, in step St23, the laser light L is irradiated in a spiral shape from the radially inner side to the radially outer side in the first inner circumferential region Z1. The spiral shape of the laser light L in the first inner circumferential region Z1 is continuous with the spiral shape of the laser light L in the second inner circumferential region Z2 and the spiral shape of the laser light L in the outer circumferential region Z0. That is, in the outer circumferential region Z0, the first inner circumferential region Z1, and the second inner circumferential region Z2, the rotation direction of the chuck 100 is the same counterclockwise, and the irradiation direction (movement direction) of the laser light L is the same from the radially inner side to the radially outer side, so the spiral shape of the laser light L is continuous.

[0081] 19, in step St23, peeling occurs at the interface between the first wafer W and the laser absorption layer P in the first inner peripheral region Z1. This peeling at the interface between the first wafer W and the laser absorption layer P in the first inner peripheral region Z1 continues to peeling at the interface between the first wafer W and the laser absorption layer P in the second inner peripheral region Z2 and to peeling at the interface in the outer peripheral region Z0.

[0082] In the second inner peripheral region Z2 in step St22 and the first inner peripheral region Z1 in step St23, the first wafer W and the laser absorption layer P are separated or bonded weakly at the edge Re in each irradiation region R, and the first wafer W and the laser absorption layer P are connected at the center. That is, compared to the outer peripheral region Z0, the stress σ accumulated inside the laser absorption layer P is smaller in the second inner peripheral region Z2 and the first inner peripheral region Z1. To generate such a small stress σ, for example, the frequency of the laser light L may be reduced (the pitch of the laser light L may be increased) or the irradiation intensity of the laser light L may be reduced. Increasing the pitch of the laser light L shortens the time required for laser processing, thereby improving throughput. In addition, reducing the irradiation intensity of the laser light L allows for more efficient laser processing.

[0083] Here, if a large stress σ is generated in the second inner peripheral region Z2 and the first inner peripheral region Z1 such that the interface between the first wafer W and the laser absorption layer P completely peels off, and this stress σ accumulates, there is a risk of cracking the first wafer W. Therefore, as described above, in the second inner peripheral region Z2 and the first inner peripheral region Z1, peeling occurs with at least a portion of the interface between the first wafer W and the laser absorption layer P remaining connected, thereby suppressing cracking of the first wafer W.

[0084] 19, when peeling E3 at the interface between the first wafer W and the laser absorption layer P in the first inner peripheral region Z1 connects to peeling E1 in the outer peripheral region Z0, the entire interface between the first wafer W and the laser absorption layer P is peeled off in the first inner peripheral region Z1 and the second inner peripheral region Z2. Note that the above-mentioned "weak bonding strength between the first wafer W and the laser absorption layer P at the edge Re" refers to a bonding strength that is strong enough to cause peeling at the edge Re when peeling E3 at the interface between the first wafer W and the laser absorption layer P in the first inner peripheral region Z1 connects to peeling E1 in the outer peripheral region Z0.

[0085] Next, in step St24, the rotation of the chuck 100 is stopped in the central region Z3. Then, pulsed laser light L is irradiated from the laser irradiation unit 110. The central region Z3 is scanned with the laser light L. At this time, as shown in FIG. 20, scanning irradiation of the laser light L in the X-axis direction and movement of the chuck 100 (superimposed wafer T) in the Y-axis direction are alternately repeated. Alternatively, scanning irradiation of the laser light L in the X-axis direction and movement of the chuck 100 in the negative Y-axis direction may be synchronized. Note that, to improve the throughput of wafer processing, the laser light L may be branched by the optical system 112, and multiple points on the laser absorbing layer P may be irradiated with the laser light L simultaneously. Furthermore, due to the peeling mechanism between the first wafer W and the laser absorbing layer P caused by the irradiation of the laser light L, peeling occurs at the interface between the first wafer W and the laser absorbing layer P in the central region Z3.

[0086] According to this embodiment, by performing steps St20 to St24, it is possible to cause delamination at the interface between the first wafer W and the laser absorption layer P. As a result, the first wafer W and the laser absorption layer P are separated, and the device layer Dw of the first wafer W can be transferred to the second wafer S.

[0087] Furthermore, in step St21, in the outer peripheral region Z0, the laser light L is irradiated by moving from the inside to the outside in the radial direction, so that it is possible to cause delamination at the interface between the first wafer W and the laser absorbing layer P. This can reduce the bonding strength at the interface between the first wafer W and the laser absorbing layer P, and the first wafer W and the laser absorbing layer P can be delaminated.

[0088] Furthermore, in the second inner peripheral region Z2 of step St22 and the first inner peripheral region Z1 of step St23, the laser light L is continuously irradiated from the radial inside to the outside, so that the peeling at the interface between the first wafer W and the laser absorption layer P can be properly continued.

[0089] As described above, in order to appropriately transport the overlapped wafer T after irradiation with the laser light L in the laser irradiation device 31, it is preferable that at least a part of the interface between the first wafer W and the laser absorption layer P remains connected. Therefore, it is preferable to maintain at least a part of the interface between the first wafer W and the laser absorption layer P connected in at least one of the first inner circumferential region Z1, the second inner circumferential region Z2, and the central region Z3.

[0090] In order to obtain the effects of the above embodiment, that is, to delaminate the interface between the first wafer W and the laser absorption layer P at least in the outer peripheral region Z0, the laser light L may be irradiated from the inside to the outside in the radial direction in the outer peripheral region Z0. Other processing conditions are not limited to those in the above embodiment.

[0091] Specifically, the processing conditions for the laser processing can be changed arbitrarily for each of the regions Z0 to Z3. The processing conditions include, for example, the rotation speed of the chuck 100, the frequency of the laser light L, the rotation direction of the chuck 100, and the processing order of the regions Z0 to Z3 (the order of irradiation with the laser light L).

[0092] For example, as shown in FIG. 21, the second inner circumferential region Z2 may be irradiated with laser light L, the first inner circumferential region Z1 may be irradiated with laser light L, the outer circumferential region Z0 may be irradiated with laser light L, and the central region Z3 may be irradiated with laser light L in this order.

[0093] In such a case, as shown in FIG. 21(a), in the second inner peripheral region Z2 and the first inner peripheral region Z1, as in steps St22 and St23, the chuck 100 is rotated counterclockwise by the rotation mechanism 103 and the chuck 100 is moved in the positive direction of the Y axis by the movement mechanism 104, while the laser light L is irradiated in pulses.

[0094] In the second inner peripheral region Z2 and the first inner peripheral region Z1, in each irradiation region R, the first wafer W and the laser absorption layer P are separated or the bonding strength is weak at the edge Re, and the first wafer W and the laser absorption layer P are connected at the center. That is, in the second inner peripheral region Z2 and the first inner peripheral region Z1, the stress σ accumulated inside the laser absorption layer P is reduced. If a large stress σ is generated and accumulated as described above, the first wafer W may crack. In this regard, by reducing the stress σ as in this embodiment, cracking of the first wafer W can be suppressed. Note that the above-mentioned "weak bonding strength between the first wafer W and the laser absorption layer P at the edge Re" refers to a bonding strength that causes the edge Re to peel when the peel E3 at the interface between the first wafer W and the laser absorption layer P in the first inner peripheral region Z1 connects to the peel E1 in the outer peripheral region Z0.

[0095] 21(b), in the outer peripheral region Z0, as in step St21, the chuck 100 is rotated counterclockwise by the rotation mechanism 103 and the chuck 100 is moved in the positive direction of the Y axis by the movement mechanism 104, while the laser light L is irradiated in pulses. In the outer peripheral region Z0, a large stress σ is generated in each irradiation region R so that peeling E1 occurs from the center to the end portions Re.

[0096] Next, in the central region Z3, similarly to step St24, the laser light L is scanned while the rotation of the chuck 100 is stopped. Then, in the central region Z3, peeling occurs at the interface between the first wafer W and the laser absorption layer P.

[0097] In this embodiment, the same effect as in the above embodiment can be obtained. That is, peeling can be caused at the interface between the first wafer W and the laser absorption layer P.

[0098] 22, the laser beam L may be irradiated to the first inner circumferential region Z1 and the second inner circumferential region Z2 while moving from the outer side to the inner side in the radial direction. In this case, the laser beam L is irradiated to the outer circumferential region Z0, the laser beam L is irradiated to the first inner circumferential region Z1, the laser beam L is irradiated to the second inner circumferential region Z2, and the laser beam L is irradiated to the central region Z3 in this order.

[0099] 22(a), in the outer peripheral region Z0, as in step St21, the chuck 100 is rotated counterclockwise by the rotation mechanism 103 and the chuck 100 is moved in the positive direction of the Y axis by the movement mechanism 104 while the laser light L is irradiated in pulses. As a result, the laser light L is irradiated spirally from the inside to the outside in the radial direction in the outer peripheral region Z0. In the outer peripheral region Z0, a large stress σ is generated in each irradiation region R so that peeling E1 occurs from the center to the end Re.

[0100] 22(b), in the first inner circumferential region Z1, the chuck 100 is rotated clockwise by the rotation mechanism 103 and moved in the negative direction of the Y axis by the movement mechanism 104, while irradiating the first inner circumferential region Z1 with pulsed laser light L. As a result, in the first inner circumferential region Z1, the laser light L is irradiated spirally from the outer side toward the inner side in the radial direction.

[0101] In this case, the rotation direction of the chuck 100 is opposite in the adjacent outer peripheral region Z0 and the first inner peripheral region Z1, and the irradiation direction of the laser light L is also opposite. In this way, the spiral shape of the laser light L can be made continuous in the outer peripheral region Z0 and the first inner peripheral region Z1. In other words, when the irradiation direction of the laser light L differs in adjacent regions, the spiral shape of the laser light L can be made continuous by reversing the rotation direction of the chuck 100 in the adjacent regions.

[0102] Next, in the second inner circumferential region Z2 as well, the chuck 100 is rotated clockwise by the rotation mechanism 103 and moved in the negative direction of the Y axis by the movement mechanism 104, while the laser light L is irradiated in a pulsed manner. As a result, the laser light L is irradiated in a spiral from the outer side to the inner side in the radial direction in the second inner circumferential region Z2.

[0103] Note that the magnitude of the stress σ accumulated inside the laser absorption layer P is not limited in the first inner peripheral region Z1 and the second inner peripheral region Z2. When the first inner peripheral region Z1 is irradiated with laser light L, delamination at the interface between the first wafer W and the laser absorption layer P due to the laser light L leads to delamination E1 in the outer peripheral region Z0. Therefore, in the first inner peripheral region Z1, delamination occurs appropriately at the interface between the first wafer W and the laser absorption layer P. Then, this delamination is transmitted to the second inner peripheral region Z2, and delamination also occurs appropriately at the interface between the first wafer W and the laser absorption layer P in the second inner peripheral region Z2.

[0104] Next, in the central region Z3, similarly to step St24, the laser light L is scanned while the rotation of the chuck 100 is stopped. Then, in the central region Z3, peeling occurs at the interface between the first wafer W and the laser absorption layer P.

[0105] In this embodiment, the same effect as in the above embodiment can be obtained. That is, peeling can be caused at the interface between the first wafer W and the laser absorption layer P.

[0106] In the above embodiment, in step St20, two inner peripheral regions are set, a first inner peripheral region Z1 and a second inner peripheral region Z2. However, there may be only one inner peripheral region. In this inner peripheral region, the frequency of the laser light L may be kept constant, while the rotation speed of the overlapped wafer T may be varied in accordance with the radial movement of the laser light L, to irradiate the laser light L in pulses. Alternatively, the rotation speed of the overlapped wafer T may be kept constant, while the frequency of the laser light L may be varied in accordance with the radial movement of the laser light L, to irradiate the laser light L in pulses. In either case, the processing conditions are controlled so that the irradiation interval of the laser light L in the inner peripheral region is constant.

[0107] In the above embodiment, the chuck 100 is moved horizontally when performing the laser processing, but the lens 113 of the laser irradiation unit 110 may be moved horizontally, or both the chuck 100 and the lens 113 may be moved horizontally. By moving the chuck 100 and the lens 113 relatively in the horizontal direction, the laser processing using the laser light L can be performed.

[0108] In the above embodiment, in step St24, the laser light L is scanned and irradiated onto the central region Z3 while the rotation of the chuck 100 is stopped, but the laser light L may be scanned and irradiated from the laser irradiation unit 110 while the chuck 100 is rotating, as shown in Fig. 23. In this case, the rotation speed of the chuck 100 in the central region Z3 may be lower than that in the outer peripheral region Z0, the first inner peripheral region Z1, and the second inner peripheral region Z2.

[0109] In the above-described embodiments, the laser beam L is irradiated in a spiral pattern in the outer peripheral region Z0, the first inner peripheral region Z1, and the second inner peripheral region Z2, but it may be irradiated in a concentric ring pattern. Also, in the embodiment shown in FIG. 23, the laser beam L is irradiated in a spiral pattern in the central region Z3, but it may be irradiated in a concentric ring pattern.

[0110] In the above-described embodiments, as shown in Figures 8 to 11, delamination occurs at the interface between the first wafer W and the laser absorbing layer P. However, as described above, a delamination-promoting film may be formed on the surface Wa of the first wafer W to properly delaminate the first wafer W and the laser absorbing layer P, and in this case, delamination may occur at the interface between the delamination-promoting film and the laser absorbing layer P.

[0111] 24(a), a peeling-promoting film Pe, a laser absorbing layer P, a device layer Dw, and a surface film Fw may be formed as laminated films in this order on the surface Wa of the first wafer W. The peeling-promoting film Pe is formed to facilitate peeling of the first wafer W from the second wafer S, and is made of a material that has lower adhesion to the first wafer W (silicon) than to the laser absorbing layer P and is transparent to the laser light L, such as silicon nitride (SiN).

[0112] When separating the first wafer W from the second wafer S, first, the laser absorption layer P is irradiated with laser light L (step St31 in FIG. 25). The laser light L passes through the first wafer W and the peeling-promoting film Pe and is absorbed by the laser absorption layer P (step St32 in FIG. 25).

[0113] The laser light L absorbed by the laser absorbing layer P is converted into heat in accordance with its energy distribution (step St33 in FIG. 25), which increases the temperature of the laser absorbing layer P. Most of the heat generated in the laser absorbing layer P by absorbing the laser light L diffuses to the peeling-promoting film Pe on the first wafer W side (step St34 in FIG. 25), and this thermal diffusion increases the temperature of the interface between the laser absorbing layer P and the peeling-promoting film Pe.

[0114] When the heat generated in the laser absorbing layer P diffuses toward the first wafer W, the effect of this heat, i.e., an increase in the interface temperature between the laser absorbing layer P and the peeling-promoting film Pe, causes the peeling-promoting film Pe to expand locally in accordance with the temperature distribution, as shown in Fig. 24(b) (step St35 in Fig. 25). At this time, the thermal effect of the interface between the laser absorbing layer P and the peeling-promoting film Pe may affect the first wafer W, and the first wafer W may also expand locally in accordance with the temperature distribution, as shown in Fig. 24(b).

[0115] Thereafter, when the peeling-promoting film Pe (and the first wafer W) expands locally, stress caused by this expansion causes peeling at the interface between the laser absorbing layer P and the peeling-promoting film Pe, which has low adhesion, as shown in Fig. 24(c), resulting in a decrease in the bonding strength between the laser absorbing layer P and the peeling-promoting film Pe (step St36 in Fig. 25). Then, by continuing the peeling over the entire surface of the interface between the peeling-promoting film Pe and the laser absorbing layer P, the bonding strength over the entire surface of the peeling-promoting film Pe and the laser absorbing layer P is decreased, and as a result, the peeling-promoting film Pe and the laser absorbing layer P (the first wafer W and the second wafer S) can be properly separated in the separation device 32 (step St37 in Fig. 25).

[0116] In this way, by forming a peeling-promoting film Pe on the surface Wa of the first wafer W, which has lower adhesion to the first wafer W (silicon) than to the laser absorption layer P, and expanding the peeling-promoting film Pe instead of or together with the first wafer W, the transfer of the device layer Dw formed on the surface Wa of the first wafer W can be performed appropriately.

[0117] In the example shown in FIG. 24, the peel-promoting film Pe is formed at the interface between the first wafer W and the laser absorbing layer P. However, for example, the peel-promoting film Pe may be formed at the interface between the laser absorbing layer P and the device layer Dw, and peeling may occur at the interface between the laser absorbing layer P and the peel-promoting film Pe, so that the peel-promoting film Pe remains on the second wafer S side to which the device layer Dw is transferred.

[0118] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The above-described embodiments may be omitted, substituted, or modified in various ways without departing from the scope and spirit of the appended claims. For example, the components of the above-described embodiments may be arbitrarily combined. Such an arbitrary combination naturally provides the functions and effects of each of the components involved in the combination, and also provides other functions and effects that are apparent to those skilled in the art from the description of this specification.

[0119] Furthermore, the effects described herein are merely descriptive or exemplary and are not limiting. In other words, the technology according to the present disclosure may achieve other effects that are apparent to those skilled in the art from the description of this specification, in addition to or in place of the above-described effects. [Explanation of symbols]

[0120] 31 Laser irradiation device 40 Control device 100 Chuck 103 Rotation mechanism 104 Moving mechanism 110 Laser irradiation unit L laser light P laser absorption layer S Second wafer T Polymerized Wafer W First wafer

Claims

1. A substrate processing apparatus for processing a laminated substrate formed by stacking a first substrate, an interface layer including at least a laser absorption layer, and a second substrate, comprising: a substrate holder for holding the laminated substrate; a laser irradiation unit that irradiates the laminated substrate held by the substrate holding unit with laser light; a moving mechanism that moves the substrate holding unit and the laser irradiation unit relatively in a horizontal direction; a rotation mechanism that rotates the substrate holder; a control unit, In the laminated substrate, an outer circumferential region including an unbonded region of the first substrate and the second substrate, and an inner circumferential region radially inside the outer circumferential region and disposed in a bonded region of the first substrate and the second substrate are set, In the inner circumferential region, a first inner circumferential region on a radially outer side and a second inner circumferential region on a radially inner side are defined, The control unit rotating the laminated substrate and irradiating the laminated substrate with the laser light while moving the laser light in a radial direction, thereby causing delamination at an interface between the first substrate and the laser absorption layer, or at an interface between the interface layer and the laser absorption layer; Control of irradiating the laser light while moving it from the inside to the outside in the radial direction in at least the outer circumferential region; a control for irradiating the first inner peripheral region with the laser light in a pulsed manner by varying a rotation speed of the laminated substrate in accordance with a movement of the laser light while keeping a frequency of the laser light constant; and controlling the laser beam to be irradiated in pulses in the second inner peripheral region by varying the frequency of the laser beam in accordance with the movement of the laser beam while keeping the rotation speed of the laminated substrate constant.

2. The substrate processing apparatus according to claim 1 , wherein the control unit performs control to irradiate the inner peripheral region with the laser light while moving the laser light from the inside to the outside in the radial direction.

3. A substrate processing apparatus for processing a laminated substrate formed by stacking a first substrate, an interface layer including at least a laser absorption layer, and a second substrate, comprising: a substrate holder for holding the laminated substrate; a laser irradiation unit that irradiates the laminated substrate held by the substrate holding unit with laser light; a moving mechanism that moves the substrate holding unit and the laser irradiation unit relatively in a horizontal direction; a rotation mechanism that rotates the substrate holder; a control unit, In the laminated substrate, an outer circumferential region including an unbonded region of the first substrate and the second substrate, and an inner circumferential region radially inside the outer circumferential region and disposed in a bonded region of the first substrate and the second substrate are set, The control unit rotating the laminated substrate and irradiating the laminated substrate with the laser light while moving the laser light in a radial direction, thereby causing delamination at an interface between the first substrate and the laser absorption layer, or at an interface between the interface layer and the laser absorption layer; Control of irradiating the laser light while moving it from the inside to the outside in the radial direction in at least the outer circumferential region; Control of irradiating the inner peripheral region with the laser light while moving the laser light from the inside to the outside in the radial direction; and controlling the irradiation of the laser light so that stress generated in the outer circumferential region by the laser light is greater than stress generated in the inner circumferential region by the laser light.

4. The substrate processing apparatus according to claim 1 , wherein the control unit performs control to irradiate the inner peripheral region with the laser light while moving the laser light from an outer side to an inner side in the radial direction.

5. A substrate processing apparatus for processing a laminated substrate formed by stacking a first substrate, an interface layer including at least a laser absorption layer, and a second substrate, comprising: a substrate holder for holding the laminated substrate; a laser irradiation unit that irradiates the laminated substrate held by the substrate holding unit with laser light; a moving mechanism that moves the substrate holding unit and the laser irradiation unit relatively in a horizontal direction; a rotation mechanism that rotates the substrate holder; a control unit, In the laminated substrate, an outer circumferential region including an unbonded region of the first substrate and the second substrate, and an inner circumferential region radially inside the outer circumferential region and disposed in a bonded region of the first substrate and the second substrate are set, The control unit rotating the laminated substrate and irradiating the laminated substrate with the laser light while moving the laser light in a radial direction, thereby causing delamination at an interface between the first substrate and the laser absorption layer, or at an interface between the interface layer and the laser absorption layer; Control of irradiating the laser light while moving it from the inside to the outside in the radial direction in at least the outer circumferential region; and when the moving directions of the laser light in adjacent regions are different, the rotation directions of the laminated substrate in the adjacent regions are reversed.

6. The substrate processing apparatus according to claim 1 , wherein the control unit executes control to irradiate the inner peripheral region with the laser light after irradiating the outer peripheral region with the laser light.

7. A substrate processing apparatus for processing a laminated substrate formed by stacking a first substrate, an interface layer including at least a laser absorption layer, and a second substrate, comprising: a substrate holder for holding the laminated substrate; a laser irradiation unit that irradiates the laminated substrate held by the substrate holding unit with laser light; a moving mechanism that moves the substrate holding unit and the laser irradiation unit relatively in a horizontal direction; a rotation mechanism that rotates the substrate holder; a control unit, In the laminated substrate, an outer circumferential region including an unbonded region of the first substrate and the second substrate, and an inner circumferential region radially inside the outer circumferential region and disposed in a bonded region of the first substrate and the second substrate are set, The control unit rotating the laminated substrate and irradiating the laminated substrate with the laser light while moving the laser light in a radial direction, thereby causing delamination at an interface between the first substrate and the laser absorption layer, or at an interface between the interface layer and the laser absorption layer; Control of irradiating the laser light while moving it from the inside to the outside in the radial direction in at least the outer circumferential region; and performing control to irradiate the inner peripheral region with the laser light, and then irradiate the outer peripheral region with the laser light.

8. A substrate processing apparatus for processing a laminated substrate formed by stacking a first substrate, an interface layer including at least a laser absorption layer, and a second substrate, comprising: a substrate holder for holding the laminated substrate; a laser irradiation unit that irradiates the laminated substrate held by the substrate holding unit with laser light; a moving mechanism that moves the substrate holding unit and the laser irradiation unit relatively in a horizontal direction; a rotation mechanism that rotates the substrate holder; a control unit, In the laminated substrate, an outer circumferential region including an unbonded region of the first substrate and the second substrate, an inner circumferential region radially inward of the outer circumferential region and disposed in a bonded region of the first substrate and the second substrate, and a central region radially inward of the inner circumferential region and disposed in a bonded region of the first substrate and the second substrate are set, The control unit rotating the laminated substrate and irradiating the laminated substrate with the laser light while moving the laser light in a radial direction, thereby causing delamination at an interface between the first substrate and the laser absorption layer, or at an interface between the interface layer and the laser absorption layer; Control of irradiating the laser light while moving it from the inside to the outside in the radial direction in at least the outer circumferential region; and performing control to irradiate the central region with the laser light while scanning the central region while stopping rotation of the laminated substrate.

9. the interface layer comprises a release-promoting film; 9. The substrate processing apparatus according to claim 1, wherein the interfacial layer and the laser absorbing layer are separated from each other at an interface between the separation-promoting film and the laser absorbing layer.

10. A substrate processing method for processing a laminated substrate formed by stacking a first substrate, an interface layer including at least a laser absorption layer, and a second substrate, comprising: In the laminated substrate, an outer circumferential region including an unbonded region of the first substrate and the second substrate and an inner circumferential region disposed radially inside the outer circumferential region and in a bonded region of the first substrate and the second substrate are set; In the inner circumferential region, a first inner circumferential region is defined on a radially outer side, and a second inner circumferential region is defined on a radially inner side; holding the laminated substrate with a substrate holder; rotating the laminated substrate held by the substrate holding unit, and irradiating the laminated substrate with a laser beam from a laser irradiation unit while moving the laser beam in a radial direction, thereby causing peeling at an interface between the first substrate and the laser absorption layer, or an interface between the interface layer and the laser absorption layer; irradiating the laser light while moving the laser light from the inside to the outside in the radial direction at least in the outer circumferential region; irradiating the first inner peripheral region with the laser light in a pulsed manner by varying a rotation speed of the laminated substrate in accordance with the movement of the laser light while keeping the frequency of the laser light constant; irradiating the second inner peripheral region with pulsed laser light by varying a frequency of the laser light in accordance with movement of the laser light while keeping a constant rotation speed of the laminated substrate.

11. The substrate processing method according to claim 10 , wherein the laser light is irradiated onto the inner peripheral region while moving from the inside to the outside in the radial direction.

12. A substrate processing method for processing a laminated substrate formed by stacking a first substrate, an interface layer including at least a laser absorption layer, and a second substrate, comprising: In the laminated substrate, an outer circumferential region including an unbonded region of the first substrate and the second substrate and an inner circumferential region disposed radially inside the outer circumferential region and in a bonded region of the first substrate and the second substrate are set; holding the laminated substrate with a substrate holder; rotating the laminated substrate held by the substrate holding unit, and irradiating the laminated substrate with a laser beam from a laser irradiation unit while moving the laser beam in a radial direction, thereby causing peeling at an interface between the first substrate and the laser absorption layer, or an interface between the interface layer and the laser absorption layer; irradiating the laser light while moving the laser light from the inside to the outside in the radial direction at least in the outer circumferential region; irradiating the inner peripheral region with the laser light while moving the laser light from the inside to the outside in a radial direction; irradiating the substrate with laser light such that stress generated in the outer circumferential region by the laser light is greater than stress generated in the inner circumferential region by the laser light.

13. The substrate processing method according to claim 10 , wherein the laser light is irradiated onto the inner peripheral region while moving from an outer side to an inner side in the radial direction.

14. A substrate processing method for processing a laminated substrate formed by stacking a first substrate, an interface layer including at least a laser absorption layer, and a second substrate, comprising: In the laminated substrate, an outer circumferential region including an unbonded region of the first substrate and the second substrate and an inner circumferential region disposed radially inside the outer circumferential region and in a bonded region of the first substrate and the second substrate are set; holding the laminated substrate with a substrate holder; rotating the laminated substrate held by the substrate holding unit, and irradiating the laminated substrate with a laser beam from a laser irradiation unit while moving the laser beam in a radial direction, thereby causing peeling at an interface between the first substrate and the laser absorption layer, or an interface between the interface layer and the laser absorption layer; irradiating the laser light while moving the laser light from the inside to the outside in the radial direction at least in the outer circumferential region; When the moving directions of the laser light in adjacent regions are different, reversing the rotation directions of the laminated substrate in the adjacent regions.

15. The substrate processing method according to claim 10 , wherein the laser light is irradiated onto the outer peripheral region and then onto the inner peripheral region.

16. A substrate processing method for processing a laminated substrate formed by stacking a first substrate, an interface layer including at least a laser absorption layer, and a second substrate, comprising: In the laminated substrate, an outer circumferential region including an unbonded region of the first substrate and the second substrate and an inner circumferential region disposed radially inside the outer circumferential region and in a bonded region of the first substrate and the second substrate are set; holding the laminated substrate with a substrate holder; rotating the laminated substrate held by the substrate holding unit, and irradiating the laminated substrate with a laser beam from a laser irradiation unit while moving the laser beam in a radial direction, thereby causing peeling at an interface between the first substrate and the laser absorption layer, or an interface between the interface layer and the laser absorption layer; irradiating the laser light while moving the laser light from the inside to the outside in the radial direction at least in the outer circumferential region; irradiating the inner peripheral region with the laser light, and then irradiating the outer peripheral region with the laser light.

17. A substrate processing method for processing a laminated substrate formed by stacking a first substrate, an interface layer including at least a laser absorption layer, and a second substrate, comprising: In the laminated substrate, an outer circumferential region including an unbonded region of the first substrate and the second substrate, an inner circumferential region located radially inside the outer circumferential region and in a bonded region of the first substrate and the second substrate, and a central region located radially inside the inner circumferential region and in a bonded region of the first substrate and the second substrate are set; holding the laminated substrate with a substrate holder; rotating the laminated substrate held by the substrate holding unit, and irradiating the laminated substrate with a laser beam from a laser irradiation unit while moving the laser beam in a radial direction, thereby causing peeling at an interface between the first substrate and the laser absorption layer, or an interface between the interface layer and the laser absorption layer; irradiating the laser light while moving the laser light from the inside to the outside in the radial direction at least in the outer circumferential region; irradiating the central region with the laser light while scanning the central region with the laser light being stopped while the rotation of the laminated substrate is stopped.

18. the interface layer comprises a release-promoting film; 18. The substrate processing method according to claim 10, wherein the interfacial peeling between the interface layer and the laser absorption layer occurs at the interface between the peel-promoting film and the laser absorption layer.

Images