Resin sealing device and resin sealing method

Abstract

To provide a resin encapsulation device that reduces molding defects.SOLUTION: A resin encapsulation device for resin encapsulating electronic components in workpieces containing base materials and electronic components includes: a cleaning unit in which a frame with a through hole for regulating spreading of a resin is provided, and a side wall of the frame surrounding the through hole is cleaned as the unit lifts and lowers; and a cleaner that sucks a first surface of the frame.SELECTED DRAWING: Figure 3A

Description

[Technical Field]

[0001] The present invention relates to a resin sealing apparatus and a resin sealing method. [Background technology]

[0002] 2. Description of the Related Art As an example of a resin sealing apparatus that melts resin onto a workpiece including a substrate and electronic components to resin-seal the electronic components, a resin sealing apparatus that molds resin onto a functional member together with the workpiece is known.

[0003] Patent Document 1 discloses a resin molding device that uses a molding resin poured into a through-hole in a resin guard to resin-mold a workpiece to process it into a molded product.

[0004] Patent document 2 discloses a resin sealing device and a workpiece cleaning method that prevents the workpiece from being transported into a molding die with particles (granular resin powder, fine powder, etc.) attached to it, thereby preventing a decline in molding quality. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2019-145548 [Patent Document 2] Patent Publication No. 2021-178411 Summary of the Invention [Problem to be solved by the invention]

[0006] However, in the case of the configuration of Patent Document 1, during the process of molding a resin onto a workpiece to produce a molded product, the processing flow proceeds with resin adhering to the side walls of the resin guard as particles, which may result in foreign matter being mixed into the molded product.

[0007] Furthermore, even if the configuration of Patent Document 2 is applied to Patent Document 1, it is not possible to remove particles adhering to the side walls of the resin guard, and if particles are scattered during the resin sealing process, this can cause molding defects such as the adhesion of dirt or the inclusion of foreign matter.

[0008] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a resin sealing technology that reduces molding defects caused by particles adhering to the resin guard. [Means for solving the problem]

[0009] A resin sealing device according to one embodiment of the present invention is a resin sealing device that resin-seals electronic components of a workpiece including a substrate and electronic components, and is provided with a frame body with a through hole for restricting the spread of resin, a cleaning unit that cleans the side wall of the frame body surrounding the through hole by raising and lowering the frame body, and a cleaner that sucks the first surface of the frame body.

[0010] In the above aspect, the cleaning unit may be provided with a brush, and the side wall of the frame may be cleaned as the cleaning unit moves up and down.

[0011] In the above aspect, the longest end of the brush from the axial center may be larger than the diameter of the through hole.

[0012] In the above embodiment, the side walls of the frame may be coated with a non-stick coating.

[0013] In the above aspect, the cleaning unit may be raised and lowered multiple times.

[0014] In the above aspect, a cleaning device may be provided that sucks a second surface of the frame opposite to the first surface, and the cleaning device may be provided on the transport path of the frame.

[0015] In the above aspect, the cleaning unit may be provided with a top plate, and the cleaner may suck the first surface of the frame with the through-hole blocked by the top plate.

[0016] In the above aspect, the frame body is provided with a plurality of through holes, and a plurality of cleaning units are provided corresponding to each of the plurality of through holes, and the periods during which the plurality of cleaning units move up and down may overlap at least partially.

[0017] A resin sealing method according to one embodiment of the present invention is a resin sealing method for resin-sealing electronic components of a workpiece including a substrate and electronic components, and is provided in a resin sealing apparatus equipped with a frame body, a cleaning unit, and a cleaner, the resin sealing method including the steps of: a step in which the cleaning unit cleans the side wall of the frame body surrounding the through hole by raising and lowering the frame body, the frame body having a through hole for restricting the spread of resin; and a step in which the cleaner sucks the first surface of the frame body. [Brief explanation of the drawings]

[0018] [Figure 1] 1 is a plan view schematically illustrating a configuration of a resin sealing apparatus according to an embodiment. [Figure 2] FIG. 2 is a plan view schematically showing a more detailed configuration of a first loader and a second loader. [Figure 3A] 4 is a cross-sectional view schematically showing a state in the middle of cleaning a side wall of a frame in the resin sealing apparatus according to the first embodiment of the present invention. FIG. [Figure 3B] 4 is a cross-sectional view schematically showing the state in the middle of cleaning the upper surface of the frame in the first embodiment of the resin sealing apparatus according to the present invention. FIG. [Figure 4A] FIG. 10 is a cross-sectional view schematically showing a state in the middle of cleaning a side wall of a frame in a resin sealing apparatus according to a second embodiment of the present invention. [Figure 4B] 10 is a cross-sectional view schematically showing a state in the middle of cleaning the upper surface of a frame in a resin sealing apparatus according to a second embodiment of the present invention. FIG. [Figure 5A]FIG. 11 is a cross-sectional view schematically showing a state in the middle of cleaning a side wall of a frame in a resin sealing apparatus according to a third embodiment of the present invention. [Figure 5B] FIG. 11 is a cross-sectional view schematically showing a state in the middle of cleaning the upper surface of the frame in the resin sealing apparatus according to the third embodiment of the present invention. [Figure 6] 10 is a flowchart showing a method for cleaning a frame in a resin sealing apparatus 1 according to an exemplary embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0019] Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings of each embodiment are merely examples, and the dimensions and shapes of each part are schematic, so the technical scope of the present invention should not be interpreted as being limited to the embodiment.

[0020] <Resin sealing equipment> 1 and 2 show the layout when viewed from above. Each drawing is conveniently labeled with directions (front, back, left, right, top, bottom) to clarify the relationship between the drawings and to help understand the positional relationship of each component. The resin sealing device 1 will be described below with reference to FIGS. 1 and 2.

[0021] The resin sealing apparatus 1 is a manufacturing device that melts resin R on a workpiece W including a substrate S and electronic components P to resin-encapsulate the electronic components P and produce a molded product M. The resin sealing apparatus 1 also molds resin R on a functional component H along with the workpiece W. The functional component H is, for example, a plate-shaped component and is exposed on the side opposite to the side on which the substrate S of the molded product M is exposed. The substrate S is, for example, an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, a semiconductor substrate, etc. The electronic component P is, for example, a semiconductor element such as an IC chip, but is not limited thereto, and may also be various active elements, passive elements, MEMS devices, etc. The functional component H is, for example, a heat dissipation component that dissipates heat generated by the electronic component P or a shielding component that blocks electromagnetic waves, but is not limited thereto. The resin R is, for example, a granular thermosetting resin. The shape of the resin R is not limited to the above and may be liquid or tablet.

[0022] The resin sealing apparatus 1 according to this embodiment is a compression type resin sealing apparatus. However, the resin sealing apparatus according to one embodiment of the present invention is not limited to the above, and may be a transfer type resin sealing apparatus.

[0023] 1, the resin sealing apparatus 1 includes a workpiece supply unit 10, a resin supply unit 40, a functional material supply unit 50, resin molding units 20 and 30, a molded product recovery unit 90, a first loader 60, and a second loader 70. The workpiece supply unit 10, the resin supply unit 40, the resin molding units 20 and 30, and the molded product recovery unit 90 are arranged side by side in the left-right direction. The resin supply unit 40 and the functional material supply unit 50 are arranged side by side in the front-rear direction.

[0024] The work supply unit 10 supplies the work W to the first loader hand 61 of the first loader 60. The work supply unit 10 includes a work storage section 11, a work transfer section 13, a work preheating section 15, and a work supply control panel 19. When viewed from above as shown in FIG. 1 , the work supply unit 10 is disposed at the left end of the resin sealing apparatus 1, for example.

[0025] The work storage unit 11 stores a plurality of workpieces W and delivers the workpieces W sequentially. For example, the work storage unit 11 is equipped with a plurality of workpiece magazines and a workpiece elevation. The workpiece magazine set in the work storage unit 11 stores a plurality of workpieces W stacked vertically. The workpiece elevation adjusts the position of the workpiece magazine in order to deliver the workpieces W to the workpiece delivery unit 13.

[0026] The workpiece transfer section 13 transfers the workpiece W received from the workpiece storage section 11 to the workpiece preheating section 15. For example, the workpiece transfer section 13 is provided with a workpiece index that receives and aligns the workpiece W sent out by the workpiece storage section 11, and a workpiece pick and place that transfers the workpiece W aligned by the workpiece index to the workpiece preheating section 15.

[0027] The workpiece preheating section 15 preheats the workpiece W received from the workpiece transfer section 13 and transfers it to the first loader hand 61 of the first loader 60. By preheating the workpiece W before it is transported to the resin molding units 20, 30, deformation of the workpiece W due to a sudden temperature change inside the resin sealing molds 21, 31 is suppressed. For example, the workpiece preheating section 15 is provided with a preheat rail that heats the workpiece W from its end. The workpiece preheating section 15 may also be provided with a hot plate that heats the entire surface of the workpiece W.

[0028] The work supply control panel 19 is a control panel for controlling the operation of the work supply unit 10. When viewed from above as shown in FIG. 1 , the work supply control panel 19 is disposed on the front side of the work supply unit 10. For example, the work supply control panel 19 is provided with a display unit that displays control parameters of the work supply unit 10 and an input unit for inputting the control parameters of the work supply unit 10. Furthermore, for example, the work supply control panel 19 may be provided with a display unit that displays control parameters of the molded product recovery unit 90, resin supply unit 40, functional component supply unit 50, first loader 60, and second loader 70, which will be described later, and an input unit for inputting the control parameters.

[0029] The work supply unit 10 may further include a volume measuring unit that measures the volume of the work W, an appearance inspection unit that inspects the appearance of the work W, and the like.

[0030] The molded product recovery unit 90 recovers the molded products M from the first loader hand 61 of the first loader 60. The molded product recovery unit 90 includes a molded product receiving section 91, a molded product delivery section 93, and a molded product storage section 95. When viewed from above as shown in FIG. 1 , the molded product recovery unit 90 is disposed, for example, at the right end of the resin sealing apparatus 1. The molded product recovery unit 90 is disposed on the opposite side of the resin molding units 20 and 30 from the workpiece supply unit 10 in the left-right direction, but this is not limitative. The molded product recovery unit 90 may also be disposed on the same side of the resin molding units 20 and 30 as the workpiece supply unit 10 in the left-right direction.

[0031] The molded product receiving section 91 delivers the molded product M received from the first loader hand 61 of the first loader 60 to the molded product delivery section 93. For example, the molded product receiving section 91 is provided with a cooling pallet for cooling the molded product M.

[0032] The molded product delivery section 93 delivers the molded products M received from the molded product receiving section 91 to the molded product storage section 95. For example, the molded product delivery section 93 is provided with a molded product index that receives and aligns the molded products M sent out by the molded product receiving section 91, and a molded product pick and place that delivers the molded products M aligned by the molded product index to the molded product storage section 95.

[0033] The molded product storage section 95 receives and stores the molded products M. For example, the molded product storage section 95 is provided with a plurality of molded product magazines and a molded product elevation. The molded product magazine set in the molded product storage section 95 stores a plurality of molded products M stacked vertically. The molded product elevation adjusts the position of the molded product magazine in order to receive the molded products M from the molded product delivery section 93.

[0034] The molded product recovery unit 90 may further include a volume measurement unit that measures the volume of the molded product M, an appearance inspection unit that inspects the appearance of the molded product M, etc. When the resin sealing apparatus according to one embodiment of the present invention is a transfer type resin sealing apparatus, the molded product recovery unit may include a degating unit that separates unnecessary resin called cull or liner from the molded product M, a scrap box for collecting the separated unnecessary resin, etc.

[0035] The resin molding unit 20 molds the resin R onto the workpiece W and the functional component H. The resin molding unit 20 molds the resin R so that at least a portion of the functional component H is exposed. The resin molding unit 20 includes a resin sealing mold 21, a film handler 27, and a resin molding control panel 29. When viewed from above as shown in FIG. 1, the resin molding unit 20 is connected to the right side of the work supply unit 10, for example.

[0036] The resin sealing mold 21 is a pair of openable and closable molds that fill an internal cavity 25 with resin R to form a mold. The resin sealing mold 21 comprises a lower mold 22 and an upper mold 23. The surface of the lower mold 22 facing the upper mold 23 is flat, and the cavity 25 is formed on the surface of the upper mold 23 facing the lower mold 22 (hereinafter referred to as the "molding surface"). In other words, the resin sealing mold 21 is a compression molding mold with a so-called upper cavity movable structure.

[0037] The film handler 27 supplies a film to the resin sealing mold 21. The film is a release film that prevents the resin R from penetrating into the gaps in the upper mold 23 and facilitates the release of the molded product M from the upper mold 23. The film handler 27 includes an unwinding section that supplies unused film F and a winding section that collects used film F. The film handler 27 corresponds to an example of a "film supplying section" according to the present invention. Suitable film materials include polymeric materials with excellent heat resistance, ease of release, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene-ethylene copolymer), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), PET (polyethylene terephthalate), PP (polypropylene), and PVDC (polyvinylidine chloride). The film material is not limited to the above, and may be, for example, fluorine-impregnated glass cloth. The thickness of the film is appropriately selected depending on the physical properties of the material, and is, for example, approximately 50 μm. The shape of the film is not limited to a roll, but may be a strip.

[0038] The resin molding control panel 29 is a control panel for controlling the operation of the resin molding unit 20. When viewed from above as shown in FIG. 1, the resin molding control panel 29 is disposed in front of the resin molding unit 20. For example, the resin molding control panel 29 is provided with a display unit that displays the control parameters of the resin molding unit 20 and an input unit that inputs the control parameters of the resin molding unit 20.

[0039] The resin molding unit 30 includes a resin sealing mold 31, a film handler 37, and a resin molding control panel 39. When viewed from above as shown in Fig. 1, the resin molding unit 30 is connected to, for example, the left side of the molded product recovery unit 90. Note that the configuration of the resin molding unit 30 is the same as the configuration of the resin molding unit 20, so a description of the resin sealing mold 31, the film handler 37, and the resin molding control panel 39 will be omitted.

[0040] At least some of the functions of the resin molding control panels 29, 39 may be integrated into the workpiece supply control panel 19. For example, the control parameters of the resin molding units 20, 30 may be displayed on the display unit of the workpiece supply control panel 19, and the control parameters of the resin molding units 20, 30 may be input into the input unit of the workpiece supply control panel 19. When all of the functions of the control panels of the respective units are integrated into the workpiece supply control panel 19, the resin molding control panels 29, 39 may be omitted.

[0041] The resin supply unit 40 supplies granular resin R to the second loader hand 71 of the second loader 70. When viewed from above as shown in FIG. 1, the resin supply unit 40 is connected to the right side of the resin molding unit 20 and to the left side of the resin molding unit 30. The resin supply unit 40 includes a resin supply section 41.

[0042] The resin supply unit 41 includes, for example, a hopper and a feeder. The hopper corresponds to an example of a resin storage unit that stores the resin R. The feeder corresponds to an example of a resin supply unit that feeds the resin R received from the hopper. If the resin is liquid, the resin supply unit may include a syringe that stores the resin, a piston that pushes out the resin, and a pinch valve that opens and closes the tip of the syringe. If the resin supply unit supplies liquid resin, the resin supply unit may apply the liquid resin onto the workpiece.

[0043] In addition, the resin supply unit 40 may further include a weight measuring section for measuring the weight of the resin R, a resin preheating section for preheating the resin R, a resin guard used as a frame for defining the area in which the resin R is dispersed, a vibration section for dispersing the resin R by vibration, an inspection section for inspecting the degree of dispersion of the resin R, etc.

[0044] The functional component supply unit 50 supplies the functional component H to the second loader hand 71 of the second loader 70. The functional component supply unit 50 includes a functional component storage section 51 and a functional component transfer section 53. In plan view as shown in FIG. 1 , the functional component supply unit 50 is connected to the front side of the resin supply unit 40. In other words, the functional component supply unit 50 is disposed on the front side of the resin sealing apparatus 1. Here, the front side of the resin sealing apparatus 1 is the side on which the workpiece supply control panel 19 and the resin molding control panels 29, 39 are disposed in the front-rear direction. The functional component supply unit 50 is disposed alongside the workpiece supply control panel 19 and the resin molding control panels 29, 39 in the left-right direction. The functional component supply unit 50 is disposed on the opposite side of the resin supply section 41 when viewed from a first guide section 60R described later.

[0045] The functional component storage section 51 stores a plurality of functional components H and sequentially delivers the functional components H. For example, the functional component storage section 51 is equipped with a plurality of functional component magazines and a functional component elevation. The functional component magazine set in the functional component storage section 51 stores a plurality of functional components H stacked vertically. The functional component elevation adjusts the position of the functional component magazine in order to deliver the functional components H to the functional component delivery section 53.

[0046] The functional component delivery section 53 delivers the functional components H received from the functional component storage section 51 to the second loader hand 71 of the second loader 70. For example, the functional component delivery section 53 is provided with a functional component index that receives and aligns the functional components H sent out by the functional component storage section 51, and a functional component pick and place that delivers the functional components H aligned by the functional component index to the second loader hand 71.

[0047] The functional member supply unit 50 may further include a volume measuring section for measuring the volume of the functional member H, an appearance inspection section for inspecting the appearance of the functional member H, a functional member preheating section for preheating the functional member H, and the like.

[0048] The first loader 60 transports the workpiece W from the workpiece supply unit 10 to the resin molding units 20 and 30. The first loader 60 is configured to be movable along a first guide portion 60R. The first guide portion 60R extends in the left-right direction across the workpiece supply unit 10, the resin molding units 20 and 30, the resin supply unit 40, and the molded product recovery unit 90. When viewed from above as shown in FIG. 1, the first guide portion 60R is provided, for example, behind the resin sealing molds 21 and 31 and in front of the resin supply portion 41. In the configuration example shown in FIG. 1, the first loader 60 transports the molded product M from the resin molding units 20 and 30 to the molded product recovery unit 90. However, a molded product recovery loader other than the first loader 60 may be provided to transport the molded product M.

[0049] As shown in FIG. 2, the first loader 60 includes a first loader hand 61, a first base 62, and a first guide rod 63.

[0050] The first loader hand 61 is configured to be able to advance and retreat from the resin sealing mold 21 from the rear.

[0051] As shown in FIG. 2, the first base 62 is connected to the first guide portion 60R so as to be movable in the left-right direction, but movement in the front-rear direction is restricted.

[0052] 2, the first guide rod 63 is connected to the first base 62 and supports the first loader hand 61. The first guide rod 63 is configured to be extendable and retractable in the front-rear direction, and moves the first loader hand 61 in the front-rear direction.

[0053] As an example, after receiving the workpiece W at the workpiece transfer section 13, the first loader hand 61 is transported rightward by the first base 62 and moves to the rear of the resin sealing mold 21. Next, while holding the workpiece W, the first loader hand 61 advances into the resin sealing mold 21 from the rear by extending the first guide rod 63. That is, the first loader hand 61 loads the workpiece W into the resin sealing mold 21. After delivering the workpiece W to the lower mold 22 of the resin sealing mold 21, the first loader hand 61 retracts to the rear of the resin sealing mold 21 by contracting the first guide rod 63. After the molded product M is molded and the resin sealing mold 21 is opened, the first loader hand 61 unloads the molded product M from the resin sealing mold 21 by performing the same operation as when the workpiece W was loaded. The first loader hand 61 is then transported rightward by the first base 62 and delivers the molded product M at the molded product receiving section 91.

[0054] The second loader 70 transports the resin R and the functional component H. The second loader 70 is configured to be movable along a second guide portion 70R. The second guide portion 70R is provided, for example, in the resin supply unit 40 and extends in the front-rear direction. When viewed from above as shown in FIG. 1, the second guide portion 70R intersects, for example, with the first guide portion 60R.

[0055] The second loader 70 simultaneously transports, for example, both the resin R and the functional member H, but is not limited to this. One of the resin R and the functional member H may be transported first, and then the other may be transported.

[0056] 2, the second loader 70 includes a second loader hand 71, a second base 72, and a second guide rod 73. The second loader hand 71 transports the resin R and the functional component H to the resin sealing mold 21.

[0057] The second loader hand 71 is configured to be able to advance and retreat from the right side relative to the resin sealing mold 21. The resin guard 44 provided on the second loader hand 71 is a frame that surrounds the pressing member 75 and functions as the side of a tray for receiving the resin R. The second loader hand 71 may also be provided with side rails, chuck claws, a suction mechanism, etc. that hold the functional member H. The resin guard 44 may be detachable; for example, it may be attached when the resin R is supplied and removed once the resin R has been fused by preheating.

[0058] As shown in FIG. 2, the second base 72 is connected to the second guide portion 70R so as to be movable in the front-rear direction, but movement in the left-right direction is restricted.

[0059] 2, the second guide rod 73 is connected to the second base 72 and supports the second loader hand 71. The second guide rod 73 is configured to be extendable and rotatable from the point where it is connected to the second base 72. As a result, the second guide rod 73 moves the second loader hand 71 in the front-to-back or left-to-right directions, and also rotates the second loader hand 71 around the second base 72.

[0060] As an example, after receiving the resin R at the resin supply unit 41, the second loader hand 71 is transported forward by the second base 72 and moves to position P1 in front of the resin supply unit 41. Next, the second loader hand 71 moves to position P2 behind the functional component delivery unit 53 by pivoting the second guide rod 73. Next, the second loader hand 71 moves to the functional component delivery unit 53 by extending the second guide rod 73. Then, after receiving the functional component H, the second loader hand 71 returns to position P2 by retracting the second guide rod 73. Next, the second loader hand 71 moves to position P3 to the right of the resin sealing mold 21 by pivoting the second guide rod 73. Next, the second loader hand 71, while holding the resin R and the functional component H, enters the resin sealing mold 21 from the right by extending the second guide rod 73. That is, the second loader hand 71 carries the resin R and the functional component H into the resin sealing mold 21. After delivering the resin R and the functional component H to the resin sealing mold 21, the second loader hand 71 retreats to the right of the resin sealing mold 21 due to the contraction of the second guide rod 73.

[0061] It should be noted that the second loader hand 71 receives, for example, the resin R and then the functional component H, and simultaneously carries both of them into the resin sealing mold 21, but this is not limited to this. The second loader hand 71 may receive the functional component H and then the resin R. The second loader hand 71 may also carry one of the resin R and the functional component H into the resin sealing mold 21 and then the other into the resin sealing mold 21.

[0062] In this way, if the second loader hand 71 can move from the resin supply unit 40 to the functional component delivery section 53 by extending and contracting the second guide rod 73, the functional component supply unit 50 can be added without extending the second guide section 70R to the functional component supply unit 50.

[0063] It should be noted that the mechanism for rotating the second guide rod 73 may be omitted from the second loader 70. In this case, for example, the second guide portion 70R may extend in the front-rear direction from the resin supply unit 40 to the functional component supply unit 50, and the second loader hand 71 may move between the resin supply portion 41 and the functional component delivery portion 53 by the second base 72.

[0064] The first loader 60 and the second loader 70 operate in the same manner with respect to the resin sealing mold 31 of the resin molding unit 30 as they do with respect to the resin sealing mold 21 of the resin molding unit 20. Therefore, a description of the operations of the first loader 60 and the second loader 70 with respect to the resin sealing mold 31 will be omitted. However, the operation of the second loader 70 with respect to the resin sealing mold 31 is the left-right reverse of the operation of the second loader 70 with respect to the resin sealing mold 21.

[0065] Note that either the resin molding unit 20 or the resin molding unit 30 may be omitted. That is, only one resin molding unit may be provided, and one resin supply unit may supply resin to one resin molding unit. Also, three or more resin molding units may be provided. In this case, two or more resin supply units may be provided. For example, two resin molding units and a resin supply unit provided between the two resin molding units to supply resin to the two resin molding units may be considered as one unit group, and multiple unit groups may be arranged side by side in the left-right direction.

[0066] The first loader 60 according to this embodiment functions as a work loader that loads the workpiece W into the resin sealing molds 21, 31, and also functions as a molded product unloader that unloads the molded product M from the resin sealing molds 21, 31; however, the function of the first loader 60 may be limited to that of a work loader. That is, the resin sealing apparatus may further include a third loader as a molded product unloader. Such a third loader may share a transport path with the first loader and be configured to be movable along the first guide unit, for example. The resin sealing apparatus may also include a third guide unit for transporting the third loader.

[0067] In this embodiment, the workpiece W and the molded product M are transported between the units by the first loader 60, but this is not limited to this. For example, the workpiece preheating unit and the molded product receiving unit may be configured to be movable left and right along the first guide unit. Specifically, the workpiece preheating unit may transport the workpiece from the workpiece supply unit to the resin molding unit and hand over the workpiece to a loader provided in the resin molding unit. Alternatively, the molded product receiving unit may receive the molded product from the loader in the resin supply unit and transport the molded product from the resin molding unit to the molded product recovery unit. If the resin sealing apparatus has multiple resin molding units, such a loader may be provided in each of the multiple resin molding units.

[0068] First Embodiment 3A and 3B are views showing the resin guard 44 (hereinafter referred to as "frame FB") in the resin sealing apparatus 1 according to the first embodiment during cleaning by the cleaning mechanism CM. FIG. 3A is a cross-sectional view schematically showing the frame side wall during cleaning in the first embodiment of the resin sealing apparatus according to the present invention. FIG. 3B is a cross-sectional view schematically showing the frame upper surface during cleaning in the first embodiment of the resin sealing apparatus according to the present invention. The cleaning mechanism CM in the first embodiment is composed of a first cleaning unit CU1, a second cleaning unit CU2, and a cleaner C.

[0069] In the first embodiment, cleaning of the frame body FB is performed in three steps. In the first step, the brush B provided in the first cleaning unit CU1 abuts against the side wall sw of the frame body FB and moves up and down, thereby scraping off particles adhering to the side wall sw of the frame body FB. In the second step, the second cleaning unit CU2 moves up and down in the same manner as in the first step, scraping off particles adhering to the side wall sw of the frame body FB. In the third step, the particles scraped off in the previous two steps are deposited on the surface formed by the upper surface ts of the frame body FB and the top surface tp of the top plate TP of the first and second cleaning units CU1 and CU2, and the particles are removed by suctioning this surface with the cleaner C.

[0070] The first cleaning unit CU1 is made up of an extensible member EM, a top plate TP, and a brush B. Each of the first components will be described in detail below.

[0071] The expandable member EM is, for example, a cylinder or an actuator configured to be expandable and contractible in the vertical direction.

[0072] The top plate TP is provided so as to close the through-hole th in the frame body FB when the first cleaning unit CU1 is not moving up or down, and is attached, for example, to the tip of the extensible member EM. Note that when the first cleaning unit CU1 is not moving up or down, the top surface tp of the top plate TP may be flush with the upper surface ts of the frame body FB to close the through-hole th.

[0073] The brush B is arranged to abut against the side wall sw of the frame body FB during at least a portion of the lifting operation period when the first cleaning unit CU1 is lifted and lowered. For example, the brush B is attached to the side surface of the extendable member EM. The longest end of the brush B from the axis may be larger than the diameter of the through hole th formed in the frame body FB. With this configuration, the brush B abuts against the side wall sw of the frame body FB during at least a portion of the lifting operation period when the cleaning unit CU1 is lifted and lowered. The side wall sw of the frame body FB may be coated with a non-adhesive material. Applying a non-adhesive coating to the side wall sw of the frame body FB has the advantage of suppressing particle adhesion and making it easier to remove particles during cleaning.

[0074] Detailed description of each component of the second cleaning unit CU2 will be omitted, but the second cleaning unit CU2 may have the same configuration as the first cleaning unit CU1.

[0075] The cleaner C is connected to a dust collector (not shown) that performs, for example, air suction or electrostatic suction, and is provided to suck up particles on at least the upper surface ts of the frame body FB. Scraped particles accumulate on the surface formed by the upper surface ts of the frame body FB and the top surfaces tp of the top plates TP of the first and second cleaning units CU1 and CU2, and are removed by suction from this surface with the cleaner C. At this time, the cleaner C performs suction while moving relative to the frame body FB. A rotating brush (not shown) or the like may be provided at the tip of the cleaner C on the side opposite the moving direction, to brush off particles that cannot be sucked up by the cleaner C.

[0076] Second Embodiment 4A and 4B are views showing the frame FB in the resin sealing apparatus 1 according to the second embodiment during cleaning. FIG. 4A is a cross-sectional view schematically showing the frame side wall in the second embodiment of the resin sealing apparatus according to the present invention during cleaning. FIG. 4B is a cross-sectional view schematically showing the frame top surface in the second embodiment of the resin sealing apparatus according to the present invention during cleaning. The second embodiment differs from the first embodiment in that the first and second cleaning units CU10 and CU20 are composed of a top plate TP and an expandable member EM. Note that the top plate TP may be made of a plastic material with appropriate flexibility, as it rubs against the frame FB.

[0077] In the second embodiment, cleaning of the frame body FB is also performed in three steps. In the first step, the top plate TP provided in the first cleaning unit CU10 abuts against the side wall sw of the frame body FB and moves up and down, thereby scraping off particles adhering to the side wall sw of the frame body FB. In the second step, the second cleaning unit CU20 moves up and down in the same manner as in the first step, scraping off particles adhering to the side wall sw of the frame body FB. In the third step, since the particles scraped off in the previous two steps have accumulated on the surface formed by the upper surface ts of the frame body FB and the top surfaces tp of the top plates TP of the first and second cleaning units CU10 and CU20, the particles are removed by suction from this surface with the cleaner C.

[0078] The first and second cleaning units CU10 and CU20 may be, for example, plungers provided in the lower mold 22 of the resin sealing mold 21. In this way, the plungers provided in the resin sealing apparatus 1 may be used as the first and second cleaning units CU10 and CU20, and a cleaner C may be provided nearby to configure the cleaning mechanism CM.

[0079] As described above, in the first embodiment, the cleaning mechanism CM is provided on the transport path along which the resin R is transported from the resin supply unit 40 to the resin-encapsulated deposit mold 21. In contrast, in the second embodiment, the plunger of the resin-encapsulated deposit mold 21 is used as part of the cleaning mechanism CM, eliminating the need for a separate cleaning unit. In the second embodiment, brushes may be provided on the side surfaces of the extendable members EM of the first and second cleaning units CU10 and CU20. Furthermore, an extendable member (not shown) may be provided on the frame FB, and particles adhering to the side walls sw of the frame FB may be scraped off by raising and lowering the frame FB relative to the first and second cleaning units CU10 and CU20.

[0080] Third Embodiment 5A and 5B are views showing the frame FB in the resin sealing apparatus 1 according to the third embodiment during cleaning by the cleaning mechanism CM. FIG. 5A is a cross-sectional view schematically showing the frame side wall in the resin sealing apparatus according to the third embodiment of the present invention during cleaning. FIG. 5B is a cross-sectional view schematically showing the frame bottom surface in the resin sealing apparatus according to the third embodiment of the present invention during cleaning. The third embodiment differs from the first embodiment in that the first cleaning unit CU100, second cleaning unit CU200, and cleaner C that make up the cleaning mechanism CM are configured upside down.

[0081] In the third embodiment, cleaning of the frame body FB is also performed in three steps. In the first step, the brush B provided on the first cleaning unit CU100 comes into contact with the side wall sw of the frame body FB and moves up and down, thereby scrubbing off particles adhering to the side wall sw of the frame body FB. In the second step, the second cleaning unit CU200 moves up and down as in the first step, scrubbing off particles adhering to the side wall sw of the frame body FB. In the third step, particles that may have been blown up or otherwise adhered to the bottom surface bs of the frame body FB and the bottom surfaces bs formed by the top plates TP of the first and second cleaning units CU100 and CU200 in the previous two steps are removed by suction using the cleaner C. Furthermore, in the first and second steps, if the particles on the side wall sw of the frame body FB are scraped off without flying up or the like as the first and second cleaning units CU100 and CU200 are raised and lowered, the top plate TP or the cleaner C may be omitted from the cleaning mechanism CM.

[0082] Although the configuration of the cleaning mechanism CM in the first, second, and third embodiments has been described above, the configuration of the cleaning mechanism CM is not limited to this. Furthermore, the resin sealing apparatus 1 may be provided with a separate cleaning device (not shown) that sucks the surface of the frame body FB opposite to the surface to be cleaned. Suction by the cleaning device may be performed before cleaning using the cleaning mechanism CM on the transport path of the resin R.

[0083] 6 is a flowchart showing a method for cleaning a frame body in a resin sealing apparatus 1 according to one exemplary embodiment (hereinafter referred to as "this cleaning method"). As shown in FIG. 6, this cleaning method includes a step S10 of moving the first cleaning units CU1, CU10, and CU100 up and down, a step S20 of moving the second cleaning units CU2, CU20, and CU200 up and down, and a step S30 of suctioning the main surface of the frame body FB with a cleaner C. Note that the main surface of the frame body FB in this cleaning method refers to the surface that is suctioned by the cleaner C, i.e., the top surface ts of the frame body FB in the first and second embodiments, and the bottom surface bs of the frame body FB in the third embodiment.

[0084] (Step S10: Raising and lowering operation of the first cleaning unit) In step S10, the first cleaning units CU1, CU10, and CU100 move up and down from a starting state. As the first cleaning units CU1, CU10, and CU100 move up and down, particles are scraped off the side walls sw of the frame body FB corresponding to the first cleaning units CU1, CU10, and CU100. The starting state refers to a state in which the first and second cleaning units CU1, CU10, CU100, CU2, CU20, and CU200 are stopped with their corresponding through-holes th blocked, and the cleaner C is also stopped at a predetermined position.

[0085] (Step S20: Raising and lowering operation of the second cleaning unit) In step S20, the second cleaning units CU2, CU20, and CU200 perform a lifting and lowering operation. As the second cleaning units CU2, CU20, and CU200 move up and down, particles are scraped off from the side wall sw of the frame FB corresponding to the second cleaning units CU2, CU20, and CU200.

[0086] (Step S30: Suction the main surface of the frame with a cleaner) In step S30, the main surface (top surface ts or bottom surface bs) of the frame body FB is suctioned by the cleaner C. The first and second cleaning units CU1, CU10, CU100, CU2, CU20, and CU200 are stopped with their corresponding through-holes th covered. Particles scraped off from the side walls sw of the frame body FB in steps S10 and S20 are deposited on the surface formed by the top surface ts of the frame body FB and the top surfaces tp of the top plates TP of the first and second cleaning units CU1, CU10, CU100, CU2, CU20, and CU200. The cleaner C moves relative to this surface and performs suction, removing the particles.

[0087] Steps S10, S20, and S30 may be repeatedly performed. The number of times steps S10, S20, and S30 are repeated may be set arbitrarily. For example, steps S10, S20, and S30 constitute one cycle, and it is determined whether the number of cycles has reached a preset number of repetitions. Steps S10, S20, and S30 may be repeated until the number of cycles reaches the preset number. The number of repetitions may be set based on the amount of particles remaining on the side wall sw of the frame body FB.

[0088] In steps S10 and S20, the periods during which the first and second cleaning units CU1, CU10, CU100, CU2, CU20, and CU200 are raised and lowered may at least partially overlap. For example, the second cleaning units CU2, CU20, and CU200 may begin to rise while the first cleaning units CU1, CU10, and CU100 are descending. As another example, the first and second cleaning units CU1, CU10, CU100, CU2, CU20, and CU200 may be raised and lowered simultaneously. By raising and lowering the first and second cleaning units CU1, CU10, CU100, CU2, CU20, and CU200 in this manner, the cleaning time in this cleaning method can be shortened.

[0089] In steps S10 and S20, the periods during which the first and second cleaning units CU1, CU10, CU100, CU2, CU20, and CU200 are raised and lowered do not have to overlap. That is, for example, the first cleaning unit CU1, CU10, and CU100 may finish raising and lowering, close the corresponding through-hole th, and stop, and after a predetermined period, the second cleaning unit CU2, CU20, and CU200 may begin to rise. By raising and lowering the first and second cleaning units CU1, CU10, CU100, CU2, CU20, and CU200 in this manner, it is possible to prevent particles scraped off by the raising and lowering operation of one cleaning unit from spilling out of the through-hole th corresponding to the other cleaning unit.

[0090] In steps S20 and S30, the period during which the second cleaning units CU2, CU20, and CU200 are raised and lowered and the period during which the cleaner C is suctioned may at least partially overlap. That is, for example, the cleaner C may start moving while the second cleaning units CU2, CU20, and CU200 are lowering. By raising and lowering the second cleaning units CU2, CU20, and CU200 and performing suction with the cleaner C in this manner, the cleaning time in this cleaning method can be shortened.

[0091] <Another Example of This Embodiment> In the first to third embodiments, an example is described in which the frame body FB has two holes th and two cleaning units are provided corresponding to these holes, but the number of holes is not limited to two and may be one or more. Also, in the first to third embodiments, a cleaning unit is provided for each of the two holes th in the frame body FB, but one cleaning unit may be moved laterally to clean multiple holes th. That is, the cleaning unit may move up and down for one of the multiple holes th in the frame body FB to perform suction with the cleaner C, and then the cleaning unit may move laterally, and the cleaning unit may move up and down for another hole th to perform suction with the cleaner C.

[0092] The above-described embodiments are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangement, materials, conditions, shapes, sizes, etc., are not limited to those illustrated and can be modified as appropriate. Furthermore, configurations shown in different embodiments can be partially substituted or combined with each other. [Explanation of symbols]

[0093] 1...Resin sealing equipment 10...Work supply unit 20, 30...Resin molding unit 40...Resin supply unit 44...Resin guard (frame body FB) 50...Functional component supply unit 60...First loader 70...Second loader 80...Resin heater 90...Molded product recovery unit W…Work P…Electronic parts S...Base material R…Resin H...functional components CM: cleaning mechanism CU1, CU10, CU100...First cleaning unit CU2, CU20, CU200...Second cleaning unit C...Cleaner EM: Elastic member TP…top plate B...Brush tp...top ts…Top surface sw...side wall bs...bottom th...Through hole

Claims

1. A resin sealing apparatus for sealing electronic components in a workpiece including a substrate and electronic components with resin, a mold for compressing the resin supplied from a resin supply unit to resin-seal the electronic component; a frame body provided with a through hole for restricting the spread of the resin supplied from the resin supply unit; a cleaning unit that scrapes off resin adhering to a side wall of the frame surrounding the through hole as the frame moves up and down; a cleaner that sucks the resin scraped off by the lifting and lowering operation from the first surface side of the frame body; Equipped with Resin sealing equipment.

2. 2. The resin sealing device according to claim 1, wherein the cleaning unit is provided with a brush, and the brush deposits the resin adhering to the side wall of the frame on the first surface of the frame as the cleaning unit moves up and down.

3. 3. The resin sealing device according to claim 2, wherein the longest end of the brush from the axial center is larger than the diameter of the through hole.

4. The resin sealing device according to claim 1 , wherein a non-stick coating is applied to a side wall of the frame.

5. The resin sealing apparatus according to claim 1 , wherein the cleaning unit repeats raising and lowering operations multiple times.

6. The resin sealing apparatus according to claim 1 , further comprising a cleaning device that sucks a second surface side of the frame body opposite to the first surface side, the cleaning device being provided on a transport path of the frame body.

7. The resin sealing device according to claim 1 , wherein the cleaning unit is provided with a top plate, and the cleaner sucks the first surface of the frame body with the through-hole closed by the top plate.

8. The frame body is provided with a plurality of the through holes, 8. The resin sealing device according to claim 1, wherein a plurality of the cleaning units are provided corresponding to the plurality of through holes, and the lifting and lowering operation periods of the plurality of the cleaning units overlap at least partially.

9. A resin sealing method for resin-sealing an electronic component in a workpiece including a substrate and the electronic component, the resin sealing method comprising: a resin supply unit, a mold, a frame, a cleaning unit, and a cleaner; a resin sealing step of compressing the resin supplied from the resin supply unit with the mold to seal the electronic component with resin; The frame body is provided with a through hole for restricting the spread of the resin supplied from the resin supply unit, a cleaning step in which the cleaning unit scrapes off resin adhering to a side wall of the frame surrounding the through hole from the side wall by performing an up-and-down movement; a step of sucking the resin scraped off from the side wall from the first surface side of the frame body by the cleaner; The resin sealing method includes the steps of:

Images