Component crimping device and component crimping method

Abstract

To provide a component crimping device and the like, capable of suppressing decrease in mounting accuracy.SOLUTION: A component crimping device 100 includes: a stage 110; a stage movement mechanism 120 moving the stage 110; a backup part 130 which includes an end support surface 131 and a suction mechanism 132 for generating adsorption force on the end support surface 131, and which supports, on the end support surface 131, an end of the substrate placed on the stage 110; a crimping head 150 crimping a held component to an electrode part of the end supported by the backup part 130; a component support part 141 supporting the component; a pressing part 142 provided to the component support part 141; a component support part movement mechanism 143 moving the component support part 141 so that the crimping head 150 holds the component supported by the component support part 141; and a control part 161 which controls the component support part movement mechanism 143 to press the end to the end support surface 131 and then crimps, with the crimping head 150, the component to the electrode part of the end.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a component bonding apparatus and a component bonding method for thermocompression bonding a component to a substrate. [Background technology]

[0002] Conventionally, there is a component bonding device that bonds components such as drive circuits to a substrate (see, for example, Patent Document 1). The component bonding device disclosed in Patent Document 1 presses the substrate against the stage by blowing air onto the substrate placed on the stage, and then discharges air from the underside of the substrate to adsorb the substrate to the stage, and then bonds components to the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2006-086214 Summary of the Invention [Problem to be solved by the invention]

[0004] Some substrates are deformed, such as by warping, at the position where the component is to be pressure-bonded. For example, as disclosed in Patent Document 1, simply blowing air onto the substrate with deformed substrates may not be enough to properly press the substrate against the stage, and even if air is expelled from the bottom side of the substrate, the substrate may not be able to be adsorbed to the stage. In such a state, components may not be able to be pressure-bonded to the substrate, or even if components are pressure-bonded to the substrate, they may be pressure-bonded in an inappropriate position on the substrate, resulting in reduced mounting accuracy.

[0005] The present invention provides a component crimping device and the like that can suppress a decrease in mounting accuracy. [Means for solving the problem]

[0006] A component crimping device according to one aspect of the present invention comprises: a stage on which a substrate is placed, the substrate having an electrode portion at an end thereof to which a component is crimped; a stage movement mechanism for moving the stage; an end support surface; and an adsorption mechanism for generating an adsorption force on the end support surface, the component transfer unit including: a backup unit that supports the end of the substrate placed on the stage on the end support surface; a crimping head that holds the component and crimps the held component onto the electrode portion of the end supported by the backup unit; a component support unit that supports the component; a pressing unit provided on the component support unit; and a component support unit movement mechanism that moves the component support unit to hold the component supported by the component support unit on the crimping head; and a control unit that controls the component support unit movement mechanism to press the end against the end support surface by the pressing unit.

[0007] and a component transfer unit having a component support unit supporting the component, a pressing unit provided on the component support unit, and a component support unit moving mechanism for moving the component support unit to hold the component supported by the component support unit on the crimping head. The component support unit moving mechanism controls the component support unit movement mechanism to press the component against the end support surface.

[0008] These comprehensive or specific aspects may be realized as a system, a method, an integrated circuit, a computer program, or a non-transitory recording medium such as a computer-readable CD-ROM, or may be realized as any combination of a system, a method, an integrated circuit, a computer program, and a recording medium. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a component crimping device and the like that can suppress a decrease in mounting accuracy. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a side view showing a component crimping device according to an embodiment. [Figure 2] FIG. 2 is a block diagram showing the configuration of the component crimping device according to the embodiment. [Figure 3] FIG. 3 is an enlarged top view showing an end support surface of the backup unit and an end of the substrate according to the embodiment. [Figure 4] FIG. 4 is an enlarged side view of the component transfer unit according to the embodiment. [Figure 5] FIG. 5 is a flowchart illustrating a processing procedure of the component crimping device according to the embodiment. [Figure 6] FIG. 6 is a side view illustrating a processing procedure of the component crimping device according to the embodiment. [Figure 7] FIG. 7 is a side view for explaining the processing procedure of the component crimping device according to the embodiment. [Figure 8] FIG. 8 is a side view for explaining the processing procedure of the component crimping device according to the embodiment. [Figure 9] FIG. 9 is a side view for explaining the processing procedure of the component crimping device according to the embodiment. [Figure 10] FIG. 10 is a side view for explaining the processing procedure of the component crimping device according to the embodiment. [Figure 11] FIG. 11 is a side view for explaining the processing procedure of the component crimping device according to the embodiment. [Figure 12] FIG. 12 is a side view for explaining the processing procedure of the component crimping device according to the embodiment. [Figure 13] FIG. 13 is a side view for explaining the processing procedure of the component crimping device according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that each of the embodiments described below represents a specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component arrangements and connection forms, steps, and step sequences shown in the following embodiments are merely examples and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not recited in the independent claims of the present invention will be described as optional components.

[0012] Furthermore, each figure is a schematic diagram and is not necessarily an exact illustration. Therefore, for example, the scales of the figures do not necessarily match. Furthermore, in each figure, substantially the same components are given the same reference numerals, and redundant explanations are omitted or simplified.

[0013] In this specification and drawings, the X-axis, Y-axis, and Z-axis represent the three axes of a three-dimensional Cartesian coordinate system. The X-axis and Y-axis are perpendicular to each other and perpendicular to the Z-axis. In the following embodiments, the positive direction of the Z-axis may be referred to as the upward direction, and the negative direction of the Z-axis may be referred to as the downward direction.

[0014] (Embodiment) [composition] First, the configuration of the component crimping device according to the embodiment will be described.

[0015] Fig. 1 is a side view showing a component crimping apparatus 100 according to an embodiment. Fig. 2 is a block diagram showing the functional configuration of the component crimping apparatus 100 according to an embodiment. Note that Fig. 1 does not show some of the components of the component crimping apparatus 100, such as a suction mechanism 132.

[0016] The component pressure bonding apparatus 100 is an apparatus that places (more specifically, pre-bonds) a component 200 on a substrate 300. The component pressure bonding apparatus 100 is part of a component mounting system for producing, for example, display panels. In the component mounting system, for example, an anisotropic conductive member such as an ACF (Anisotropic Conductive Film) is attached to an electrode portion provided on the substrate 300, and the substrate 300 and the component 200 are thermocompression-bonded via the anisotropic conductive member. The mounting system includes, for example, the component pressure bonding apparatus 100, an attachment device that attaches the ACF to the substrate 300, and a final bonding device that thermocompression-bonds (final bonding) the component 200 placed (pre-bonded) on the substrate via the ACF. For example, the component pressure bonding apparatus is a pre-compression bonding device included in the mounting system. The component pressure-bonding apparatus 100 temporarily bonds the component 200 to a substrate 300 that has been carried out from an upstream device (e.g., a bonding device) to a stage 110 by, for example, a substrate transport device (not shown). The substrate 300 to which the component 200 has been temporarily pressure-bonded is then transported by, for example, the substrate transport device to a downstream device (e.g., a full-pressure bonding device).

[0017] An example of the substrate 300 is a flexible substrate made of resin, etc. The substrate 300 may also be a display panel using a glass substrate, etc.

[0018] Examples of the component 200 include flexible components such as TCP (Tape Carrier Package) and FPC (Flexible Printed Circuits), or IC (Integrated Circuit) chips.

[0019] The component crimping apparatus 100 includes a stage 110 , a stage moving mechanism 120 , a backup unit 130 , a component transfer unit 140 , a crimping head 150 , a lifting mechanism 151 , and a computer 160 .

[0020] Each of the devices included in the component crimping apparatus 100, such as the stage movement mechanism 120, the backup unit 130 (more specifically, the suction mechanism 132), the component transfer unit 140 (more specifically, the component support unit 141 and the component support unit movement mechanism 143), the crimping head 150, and the lifting mechanism 151, is connected to a computer 160 via a control line (not shown) or wirelessly so as to be able to communicate with the computer 160. Each of these devices is controlled by the computer 160 to perform a predetermined task for each device.

[0021] The stage 110 is a movable stage on which the substrate 300 is placed. Specifically, the substrate 300 is placed on the stage 110. The substrate 300 has an electrode portion 310 (see FIG. 3 ) at an end portion 320 to which the component 200 is pressure-bonded. For example, the substrate 300, which is transported by the above-described substrate transport device, is placed on the stage 110. More specifically, the stage 110 has a holding surface 111 that holds the substrate 300 with the end portion 320 of the component 200 to be pressure-bonded protruding from the stage 110. That is, the substrate 300 is placed on the stage 110 with the end portion 320, which is the outer edge of the substrate 300, protruding from the stage 110 (more specifically, with the end portion 320 not overlapping the stage 110 in a top view). The end portion 320 is supported by the backup portion 130 when the component 200 is pressure-bonded to the substrate 300.

[0022] The stage 110 may be provided with a suction mechanism that suctions the substrate 300 onto the holding surface 111 .

[0023] An opening (for example, a through-hole) may be formed in the holding surface 111, and the stage 110 may hold the substrate 300 by suction on the holding surface 111. For example, a suction device may be connected to the opening, which sucks air through the opening to suck the substrate 300 onto the holding surface 111, and the suction device may suck the air, thereby suctioning and holding the substrate 300 on the holding surface 111. The suction mechanism may have, for example, a vacuum pump that sucks air, a vacuum pipe that connects the vacuum pump and the opening, and a valve for controlling suction.

[0024] Alternatively, the stage 110 may not have the above-mentioned opening or the like in the holding surface 111 , and the substrate 300 may be simply placed on the holding surface 111 to hold the substrate 300 on the holding surface 111 .

[0025] The stage 110 is, for example, a three-axis stage that is movable in the X-axis, Y-axis, and Z-axis directions, and is provided so as to be movable by a stage movement mechanism 120 .

[0026] The stage moving mechanism 120 is a mechanism that moves the stage 110. The stage moving mechanism 120 is configured, for example, to be able to move the stage 110 arbitrarily on the XY plane and to be able to move it up and down in the Z-axis direction.

[0027] The stage moving mechanism 120 moves the stage 110 on which the substrate 300 is placed, thereby moving the end 320 above (more specifically, directly above) the backup unit .

[0028] Backup unit 130 is a so-called backup stage that supports edge 320 of substrate 300 placed on stage 110 with edge support surface 131. Specifically, when crimping head 150 crimps component 200 onto substrate 300, backup unit 130 supports the portion of substrate 300 to which component 200 is crimped, i.e., the portion of edge 320 of substrate 300 that protrudes from stage 110, from the back side (bottom side) of substrate 300.

[0029] The backup section 130 includes an end support surface 131 and a suction mechanism 132 .

[0030] The end support surface 131 is provided on the backup part 130 and is a support surface that supports the end 320 from below the substrate 300.

[0031] 3 is an enlarged top view showing the end support surface 131 provided on the backup unit 130 according to the embodiment and the end 320 of the substrate 300. Note that in FIG. 3, the end 320 of the substrate 300 is shown shifted in the Y-axis direction from the position when the end 320 is supported by the end support surface 131.

[0032] The end support surface 131 is a support surface provided on the backup part 130 for supporting the substrate 300, and supports the end 320 of the substrate 300 from below while sucking the end 320.

[0033] The end support surface 131 is provided with a plurality of suction holes 133. The plurality of suction holes 133 are connected to suction mechanisms 132 that suck air through the plurality of suction holes 133, thereby suctioning the substrate 300 onto the end support surface 131.

[0034] There is no particular limitation on the number of suction holes 133. The number of suction holes 133 may be one, or two or more.

[0035] Further, the end support surface 131 may be provided with a notch 134 .

[0036] The cutout portion 134 is a cutout that overlaps with a part of the end portion 320 in a top view when the end portion 320 of the substrate 300 is supported by the end support surface 131. The cutout portion 134 is provided so that the component 200 held by the crimping head 150 can be recognized by a camera arranged below the cutout portion 134.

[0037] It should be noted that the cutout portion 134 does not have to be provided on the end support surface 131. In this case, the camera may be placed at any position.

[0038] The suction mechanism 132 is a mechanism that generates a suction force on the end support surface 131. Specifically, the suction mechanism 132 generates a suction force on the end support surface 131 so that the end 320 of the substrate 300 can be sucked onto the end support surface 131 of the backup part 130.

[0039] The suction mechanism 132 is realized by, for example, suction holes 133, a vacuum pump that sucks air, vacuum piping that connects the vacuum pump to the suction holes 133, and a valve for controlling suction. The control unit 161 controls the valve to switch whether or not the suction mechanism 132 generates a suction force on the end support surface 131, that is, whether or not the suction mechanism 132 suctions the end 320 of the substrate 300.

[0040] The valve provided in the suction mechanism 132 may be, for example, a solenoid valve for switching on and off the suction of air, or a pressure adjustment valve (a so-called pressure regulator) for switching the suction force (adsorption force).

[0041] The component transfer unit 140 is a mechanism for supplying the components 200 to the pressure bonding head 150 to be pressure bonded to the substrate 300 by the pressure bonding head 150 .

[0042] The component transfer unit 140 includes a component support unit 141 , a pressing unit 142 , and a component support unit moving mechanism 143 .

[0043] The component support unit 141 is a mechanism that picks up and supports components placed on a tray or the like.

[0044] 4 is an enlarged side view of the component transfer unit 140 according to the embodiment. In FIG. 4, the component support unit moving mechanism 143 is shown in functional blocks.

[0045] The component support unit 141 includes a nozzle unit 141a, a rotation mechanism 141b, and a support body 141c.

[0046] The nozzle portion 141a is a nozzle that picks up and supports the component 200. The nozzle portion 141a is connected to, for example, a vacuum pump (not shown) via a vacuum pipe, and supports the component 200 by suction. The nozzle portion 141a is supported on a support 141c so as to be rotatable by a rotation mechanism 141b.

[0047] The rotation mechanism 141b is a mechanism such as a motor for switching the portion of the nozzle portion 141a that supports the component 200 (also referred to as the component support surface) between an upper and lower position. A tray on which the components are arranged is disposed, for example, below the component support portion 141. For example, the component support surface of the nozzle portion 141a faces downward when picking up a component arranged on the tray. Furthermore, for example, when the nozzle portion 141a picks up the component 200, the component support surface of the nozzle portion 141a faces upward so that the component can be delivered to the crimping head 150.

[0048] The support 141c is a main body that supports the nozzle portion 141a and the rotation mechanism 141b. A pressing portion 142 is attached to the support 141c.

[0049] The pressing portion 142 is provided on the component support portion 141 and is a mechanism for pressing the end portion 320 of the substrate 300 against the end portion support surface 131 .

[0050] The pressing portion 142 includes a main body portion 142a and a pad portion 142b.

[0051] The main body 142a is a mechanism that is connected to (attached to) the component support 141 (more specifically, the support 141c). Furthermore, the pad portion 142b is attached to the main body 142a.

[0052] The pad portion 142b is an elastic body such as rubber that protrudes downward from the main body portion 142a. When the pressing portion 142 presses the end portion 320 of the substrate 300, the lower surface of the pad portion 142b comes into contact with the upper surface of the end portion 320 of the substrate 300.

[0053] The pressing portion 142 may be provided, for example, on the side of the component support portion 141 (more specifically, on the backup portion 130 side of the component support portion 141).

[0054] The position where the pressing portion 142 is provided is not particularly limited. For example, the pressing portion 142 may be provided below the component support portion 141.

[0055] Furthermore, the number of pressing portions 142 is not particularly limited. The number of pressing portions 142 may be one or more, or may be two or more. In this embodiment, component support portion 141 includes two pressing portions. Two pressing portions 142 are arranged side by side in the X-axis direction. Two pressing positions 400 shown in FIG. 3 are pressed by two pressing portions 142.

[0056] 3, the position pressed by pressing unit 142 is, for example, an end portion of substrate 300, a position where electrode unit 310 is not provided. Pressing unit 142 is moved in the same manner as component support unit 141 when component support unit 141 is moved by component support unit moving mechanism 143.

[0057] The lower end of the pressing unit 142 (more specifically, the lower surface of the pad unit 142b) may be located below a component support surface (more specifically, the surface of the nozzle unit 141a that sucks the component 200) that is provided on the component support unit 141 and that supports the component 200. For example, when the nozzle unit 141a delivers the component 200 to the crimping head 150, the pressing unit 142 may be arranged so that the lower surface of the pad unit 142b is located below the component support surface. On the other hand, when the nozzle unit 141a receives the component 200, the pressing unit 142 may be arranged so that the lower surface of the pad unit 142b is located above the component support surface. This prevents the pressing portion 141 from getting in the way when the nozzle portion 141a receives the component 200 located below the component support portion 141, and also prevents the nozzle portion 141a from getting in the way when the pressing portion 142 presses the substrate 300 against the end support surface 141.

[0058] Component support unit moving mechanism 143 is a mechanism that moves component support unit 141 and pressing unit 142. Component support unit moving mechanism 143 is configured, for example, to be able to move component support unit 141 and pressing unit 142 arbitrarily on the XY plane and to be able to move them up and down in the Z-axis direction.

[0059] For example, under the control of the control unit 161, the component support unit moving mechanism 143 moves the nozzle unit 141a to a position where the component 200 can be picked up from the tray. Also, for example, under the control of the control unit 161, the component support unit moving mechanism 143 causes the pressing unit 142 to press the edge 320 of the substrate 300. Also, for example, under the control of the control unit 161, the component support unit moving mechanism 143 moves the component support unit 141 so that the component 200 supported by the component support unit 141 is held by the crimping head 150.

[0060] The crimping head 150 is a head that holds the component 200 and crimps (temporarily crimps) the held component 200 to the electrode portion 310 of the end portion 320 of the substrate 300 supported by the backup portion 130. The crimping head 150 is provided so as to be movable (specifically, movable up and down) by, for example, an elevating mechanism 151.

[0061] The crimping head 150 may be provided with a heater such as an electric heating wire or a Peltier element for heating the crimping head 150, for example.

[0062] The lifting mechanism 151 is a mechanism that moves the crimping head 150 up and down (in this embodiment, reciprocating movement in the Z-axis direction). The lifting mechanism 151 is realized by a linear guide and a linear motor for moving the crimping head 150. The control unit 161 controls, for example, a heater provided in the crimping head 150 and the lifting mechanism 151, thereby heating the crimping head 150 and causing the crimping head 150 to crimp the component 200 onto the substrate 300.

[0063] Computer 160 is a control device that controls each device included in component crimping apparatus 100. Computer 160 is, for example, a personal computer, and is realized by a communication interface for communicating with each device included in component crimping apparatus 100, a non-volatile memory in which a program is stored, a volatile memory that is a temporary storage area for executing the program, an input / output port for transmitting and receiving signals, a processor that executes the program, and the like.

[0064] The computer 160 includes a control unit 161 and a storage unit 162 .

[0065] The control unit 161 is a processing unit that controls the operation of each device included in the component crimping device 100, such as the stage moving mechanism 120, the suction mechanism 132, the component support unit 141, the component support unit moving mechanism 143, the crimping head 150, and the lifting mechanism 151, as well as the timing of the operation.

[0066] For example, the control unit 161 controls the component support unit moving mechanism 143 to cause the pressing unit 142 to press the end unit 320 against the end unit support surface 131 .

[0067] Furthermore, for example, the control unit 161 performs a first control of controlling the stage moving mechanism 120 to move the stage 110 so that the edge 320 of the substrate 300 placed on the stage 110 is positioned above the edge support surface 131. Thereafter, the control unit 161 further performs a second control of controlling the component support unit moving mechanism 143 and the suction mechanism 132 to cause the pressing unit 142 to press the edge 320 of the substrate 300 from above the edge 320 of the substrate 300 toward the edge support surface 131, and to support the edge 320 of the substrate 300 on the edge support surface 131 on which the suction mechanism 132 generates a suction force.

[0068] For example, the control unit 161 performs the second control so that the pressing unit 142 presses an area other than the electrode unit 310 (for example, the pressing position 400 shown in FIG. 3).

[0069] The position of the substrate 300 pressed by the pressing unit 142 may be the end portion 320. For example, the position of the substrate 300 pressed by the pressing unit 142 may be on the outer side of the substrate 300 with respect to the electrode unit 310 when viewed from above. Alternatively, the position of the substrate 300 pressed by the pressing unit 142 may be on the inner side of the substrate 300 with respect to the electrode unit 310 when viewed from above.

[0070] Furthermore, for example, the control unit 161 controls the component support unit moving mechanism 143 to perform a third control in which the component 200 supported by the component support unit 141 is held by the crimping head 150. For example, the control unit 161 performs the first control after performing the third control.

[0071] Note that the control unit 161 may perform the second control and then the first control. That is, the control unit 161 may perform the first control, the second control, and the third control in this order, or may perform the third control, the first control, and the second control in this order.

[0072] Control unit 161 is realized by, for example, a communication interface for communicating with each device included in component crimping apparatus 100, a processor, and a memory in which a control program executed by the processor is stored.

[0073] Storage unit 162 is a storage device that stores various data necessary for the component pressure bonding process, such as the size of substrate 300, the type of component 200 to be mounted on substrate 300, the mounting position, the mounting direction, the operation of each device, and the timing of the operation. Storage unit 162 is realized by, for example, an HDD (Hard Disk Drive) or a flash memory.

[0074] [Processing Procedure] Next, a processing procedure of the component crimping apparatus 100 according to the embodiment will be described. Fig. 5 is a flowchart for explaining the processing procedure of the component crimping apparatus 100 according to the embodiment. Figs. 6 to 13 are schematic side views for explaining the processing procedure of the component crimping apparatus 100 according to the embodiment.

[0075] 6 to 13, some of the components of component bonding apparatus 100, such as stage moving mechanism 120, suction mechanism 132, component support moving mechanism 143, and lifting mechanism 151, are not shown.

[0076] First, the stage 110 holds the substrate 300 (S101). For example, the control unit 161 controls a substrate transport device (not shown) to transport the substrate 300, which is placed in an apparatus located upstream of the component pressure bonding apparatus 100, to the stage 110, thereby causing the stage 110 to hold the substrate 300.

[0077] Next, the control unit 161 controls the component support unit 141 and the component support unit moving mechanism 143 to cause the component support unit 141 to support the component 200 (S102). For example, the control unit 161 controls the component support unit 141 and the component support unit moving mechanism 143 to cause the component support unit 141 to pick up a component placed on a tray, thereby causing the component support unit 141 to support the component 200. As a result, the component 200 is supported by the component support unit 141, as shown in FIG. 6 .

[0078] Next, the control unit 161 controls the component support unit 141, the component support unit moving mechanism 143, the crimping head 150, and the lifting mechanism 151 to cause the crimping head 150 to hold the component 200 supported by the component support unit 141 (S103). For example, the control unit 161 controls the component support unit moving mechanism 143 to move the component support unit 141 in the negative Y-axis direction from the position shown in FIG. 6 to a position directly below the crimping head 150 as shown in FIG. 7. In this positional relationship, the control unit 161 controls the lifting mechanism 151 to lower the crimping head 150 from the position shown in FIG. 7, so that the lower end of the crimping head 150 comes into contact with the component 200 supported by the component support unit 141 as shown in FIG. 8. Next, the control unit 161 controls the component support unit 141 and the crimping head 150 to hold the component 200 on the crimping head 150, and then lifts the crimping head 150 as shown in FIG. 9. Furthermore, the control unit 161 controls the component support unit moving mechanism 143 to move the component support unit 141 in the positive direction of the Y axis as shown in Fig. 10. In this way, for example, the control unit 161 performs the third control.

[0079] Next, the control unit 161 controls the stage moving mechanism 120 to move the stage 110 so that the end 320 of the substrate 300 placed on the stage 110 is positioned above the end support surface 131 (S104). For example, the control unit 161 controls the stage moving mechanism 120 to move the end 320 of the substrate 300 to above the end support surface 131. Next, as shown in FIG. 10 , the control unit 161 controls the stage moving mechanism 120 to move the stage 110 downward so that the lower surface of the end 320 of the substrate 300 comes into contact with the end support surface 131. Note that the end 320 of the substrate 300 may be deformed, for example, by being warped upward. Therefore, for example, the control unit 161 moves the stage 110 so that the end support surface 131 and the holding surface 111 are flush with each other. In this manner, for example, the control unit 161 performs the first control.

[0080] Next, the control unit 161 controls the component support unit moving mechanism 143 to cause the pressing unit 142 to press the end 320 of the substrate 300 against the end support surface 131 (S105). For example, the control unit 161 controls the component support unit moving mechanism 143 to move the pressing unit 142 above the end 320 of the substrate 300. Next, the control unit 161 controls the component support unit moving mechanism 143 to lower the pressing unit 142, so that the lower surface of the pressing unit 142 presses the upper surface of the end 320 of the substrate 300 downward, as shown in FIG. 11 . Furthermore, the control unit 161 controls the suction mechanism 132 to cause the end 320 of the substrate 300 to be supported on the end support surface 131, on which the suction mechanism 132 generates a suction force. Furthermore, the control unit 161 controls the component support unit moving mechanism 143 to move the component support unit 141 in the positive direction of the Y axis, as shown in FIG. 12 . In this way, for example, the control unit 161 performs the second control.

[0081] Next, the control unit 161 controls the pressure-bonding head 150 and the lifting mechanism 151 to cause the pressure-bonding head 150 to pressure-bond the component 200 onto the substrate 300, as shown in FIG. 13 (S106).

[0082] In step S104, the control unit 161 may move the stage 110 so that the lower surface of the edge 320 of the substrate 300 contacts the edge support surface 131, even if the substrate 300 is warped. That is, the control unit 161 may move the stage 110 so that the holding surface 111 is positioned lower than the edge support surface 131. Thereafter, the pressing unit 142 may press the edge 320 of the substrate 300, and the suction mechanism 132 may generate an adsorption force on the edge support surface 131, thereby supporting the edge 320 of the substrate 300 on the edge support surface 131. That is, the control unit 161 may execute step S105. Thereafter, the control unit 161 may move (raise) the stage 110 so that the edge support surface 131 and the holding surface 111 are flush with each other.

[0083] As a result, even if the substrate 300 is warped, the end 320 can be easily brought close to the end support surface 131 of the backup part 130, and the end 320 can be easily adsorbed by the adsorption mechanism 132. Furthermore, even if the substrate 300 is warped, the substrate 300 can be returned to an appropriate shape (for example, a flat plate shape) and the crimping head 150 can crimp the component 200 onto the substrate 300.

[0084] [Effects, etc.] As described above, component crimping apparatus 100 according to the embodiment includes stage 110 on which substrate 300 is placed, which has electrode section 310 at edge 320 to which component 200 is crimped, stage movement mechanism 120 for moving stage 110, edge support surface 131, and suction mechanism 132 for generating a suction force on edge support surface 131. Backup section 130 supports edge 320 of substrate 300 placed on stage 110 with edge support surface 131, and backup section 130 holds component 200 and supports the held component 200. a component transfer unit 140 having a crimping head 150 that crimps onto the electrode portion 310 of the end portion 320 supported by the portion 130, a component support portion 141 that supports the component 200, a pressing portion 142 provided on the component support portion 141, and a component support portion moving mechanism 143 that moves the component support portion 141 to hold the component 200 supported by the component support portion 141 on the crimping head 150, and a control unit 161 that controls the component support portion moving mechanism 143 to press the end portion 320 against the end support surface 131 with the pressing portion 142.

[0085] According to this, the pressing portion 142 presses the end portion 320 of the substrate 300 against the end portion support surface 131, and the suction force generated on the end portion support surface 131 makes it easier for the end portion 320 of the substrate 300 to be supported by the end portion support surface 131. Therefore, a decrease in the mounting accuracy of the component 200 on the substrate 300 can be suppressed.

[0086] Furthermore, for example, the control unit 161 performs a first control by controlling the stage moving mechanism 120 to move the stage 110 so that the end 320 of the substrate 300 placed on the stage 110 is positioned above the end support surface 131, and then performs a second control by controlling the component support unit moving mechanism 143 and the suction mechanism 132 to cause the pressing unit 142 to press the end 320 from above the end 320 toward the end support surface 131, and to support the end 320 on the end support surface 131 on which the suction mechanism 132 has generated an adsorption force.

[0087] Furthermore, for example, the control unit 161 controls the component support unit moving mechanism 143 to perform a third control in which the component 200 supported by the component support unit 141 is held by the crimping head 150, and then performs the first control.

[0088] According to this, for example, in a case where the component crimping device 100 is equipped with a camera that photographs the component 200 from below through the cutout portion 134, the component 200 held by the crimping head 150 can be photographed by the camera without the substrate 300 obstructing the photograph of the component 200.

[0089] Alternatively, for example, the control unit 161 performs the second control, and then controls the component support unit moving mechanism 143 to perform the third control, which causes the component 200 supported by the component support unit 141 to be held by the crimping head 150.

[0090] According to this, by positioning a camera that photographs the component 200 held by the crimping head 150, for example, diagonally below the crimping head 150, the component 200 held by the crimping head 150 can be photographed by the camera without providing a cutout portion 134.

[0091] Furthermore, for example, the control unit 161 performs the second control so that the pressing unit 142 presses an area other than the electrode unit 310.

[0092] This makes it possible to prevent damage to the electrode section 310 and / or deformation of the ACF attached to the electrode section 310 due to pressure on the electrode section 310.

[0093] Moreover, for example, the pressing portion 142 includes a main body portion 142a connected to the component support portion 141, and a pad portion 142b provided on the main body portion 142a so as to protrude downward.

[0094] This allows the pad portion 142b to press the substrate 300 against the end support surface 131 of the backup portion .

[0095] The component crimping method according to this embodiment includes a stage 110 on which a substrate 300 is placed, the substrate 300 having an electrode portion 310 at an end 320 to which a component 200 is crimped, a stage moving mechanism 120 for moving the stage 110, an end support surface 131, and a suction mechanism 132 for generating a suction force on the end support surface 131. The stage moving mechanism 120 supports the end 320 of the substrate 300 placed on the stage 110 with the end support surface 131, and a backup unit 130 for holding the component 200 and attaching the held component 200 to the electrode portion 310 at the end 320 supported by the backup unit 130. a component transfer unit 140 having a crimping head 150 for crimping a component 200 onto a crimping head 150; a component support unit 141 for supporting the component 200; a pressing unit 142 provided on the component support unit 141; and a component support unit moving mechanism 143 for moving the component support unit 141 to hold the component 200 supported by the component support unit 141 on the crimping head 150, wherein the component support unit moving mechanism 143 is controlled to press the end 320 against the end support surface 131 by the pressing unit 142.

[0096] This provides the same effects as those of the component crimping device 100.

[0097] (Other embodiments) Although the component crimping device according to the present embodiment has been described above based on the above embodiment, the present invention is not limited to the above embodiment.

[0098] For example, in the above embodiment, the method of adsorbing the substrate 300 on the end support surface 131 was described as vacuum adsorption using a vacuum pump by the adsorption mechanism 132, but the adsorption mechanism 132 may adsorb the substrate 300 on the end support surface 131 using any configuration.

[0099] Furthermore, computer 160 may be a computer dedicated to controlling each device included in component crimping apparatus 100, or may be a computer that also controls each device included in a mounting system that includes component crimping apparatus 100.

[0100] Also, for example, in the above embodiment, all or some of the components of computer 160 may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or processor reading and executing a software program recorded on a recording medium such as a HDD or semiconductor memory.

[0101] Furthermore, the components of computer 160 may be configured as one or more electronic circuits, each of which may be a general-purpose circuit or a special-purpose circuit.

[0102] The one or more electronic circuits may include, for example, a semiconductor device, an IC, or an LSI (Large Scale Integration). The IC or LSI may be integrated on a single chip or on multiple chips. Although we refer to them as ICs or LSIs here, they may be called system LSIs, VLSIs (Very Large Scale Integration), or ULSIs (Ultra Large Scale Integration) depending on the degree of integration. Also, a field programmable gate array (FPGA), which is programmed after the LSI is manufactured, can be used for the same purpose.

[0103] In addition, the present invention also includes forms obtained by applying various modifications to each embodiment that a person skilled in the art would think of, and forms realized by arbitrarily combining the components and functions of each embodiment within the scope of the present invention. [Industrial Applicability]

[0104] The component crimping device according to the present invention can be used as a crimping device for crimping components onto a substrate. [Explanation of symbols]

[0105] 100 Component crimping device 110 Stages 111 Holding surface 120 Stage movement mechanism 130 Backup Department 131 End support surface 132 Adsorption mechanism 133 Adsorption hole 134 Notch 140 Parts transfer section 141 Parts support section 141a Nozzle part 141b Rotation mechanism 141c Support 142 Pressing part 142a Main body 142b Pad section 143 Part support moving mechanism 150 crimping head 151 Lifting mechanism 160 Computers 161 Control Unit 162 Storage section 200 parts 300 boards 310 Electrode section 320 End 400 Pressing position

Claims

1. a stage on which a substrate having an electrode portion at an end thereof to which a component is crimped is placed; a stage moving mechanism that moves the stage; a backup unit having an edge support surface and a suction mechanism for generating a suction force on the edge support surface, the backup unit supporting the edge of the substrate placed on the stage with the edge support surface; a crimping head that holds the component and crimps the held component onto the electrode portion of the end supported by the backup portion; a component transfer unit including a component support unit that supports the component, a pressing unit provided on the component support unit, and a component support unit moving mechanism that moves the component support unit so that the component supported by the component support unit is held by the crimping head; a control unit that controls the component support unit moving mechanism to press the end unit against the end unit support surface by the pressing unit, Component crimping device.

2. The control unit performing a first control of controlling the stage moving mechanism to move the stage so that the edge of the substrate placed on the stage is positioned above the edge support surface; a second control is performed in which the component support unit moving mechanism and the suction mechanism are controlled so that the pressing unit presses the end portion from above the end portion toward the end portion support surface, and the end portion is supported on the end portion support surface on which an adsorption force is generated by the adsorption mechanism; The component crimping device according to claim 1 .

3. the control unit performs third control to cause the component supported by the component support unit to be held by the crimping head by controlling the component support unit moving mechanism, and then performs the first control. The component crimping device according to claim 2 .

4. the control unit performs the second control, and then performs a third control to control the component support unit moving mechanism to hold the component supported by the component support unit on the crimping head. The component crimping device according to claim 2 .

5. the control unit performs the second control so that the pressing unit presses an area other than the electrode unit. The component crimping device according to claim 2 .

6. The pressing portion includes a main body portion connected to the component support portion, and a pad portion provided on the main body portion so as to protrude downward. The component crimping device according to any one of claims 1 to 5.

7. a stage on which a substrate having an electrode portion at an end thereof to which a component is crimped is placed; a stage moving mechanism that moves the stage; a backup unit having an edge support surface and a suction mechanism for generating a suction force on the edge support surface, the backup unit supporting the edge of the substrate placed on the stage with the edge support surface; a crimping head that holds the component and crimps the held component onto the electrode portion of the end supported by the backup portion; a component transfer unit including a component support unit that supports the component, a pressing unit provided on the component support unit, and a component support unit moving mechanism that moves the component support unit so that the component supported by the component support unit is held by the crimping head, By controlling the component support portion moving mechanism, the pressing portion presses the end portion against the end portion support surface. Part crimping method.

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