Semiconductor die lifting device

Abstract

To provide a push-up device of a semiconductor die, which magnetically sucks a stage, capable of smoothly moving a movement element.SOLUTION: A push-up device of a semiconductor die, comprises: a stage 10 of a magnetic body; a holder 20 of which a plurality of magnets 25 and 26 is provided onto an upper part, and which magnetically sucks the stage 10 to an upper end surface 22; and an outer side movement element 31 and an inner side movement element 34 that are arranged in a hole 23 provided at a center of the holder 20, are moved to between a first position that is lower than an upper surface 11 while passing through an opening 12 to which a tip end surface is provided to the upper surface 11 of the stage 10 and a second position that is higher than the upper surface 11, and pushes up a semiconductor die 50 by the tip end surface from a lower surface 42 of a dicing sheet 40 when picking up the semiconductor die 50. The plurality of magnets 25 and 26 is attached to an outer peripheral part of the hole 23 so that each magnet pole of the adjacent magnets becomes different.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a structure of a semiconductor die push-up device that pushes up a semiconductor die attached to the surface of a dicing sheet when picking up the semiconductor die. [Background technology]

[0002] Semiconductor dies are manufactured by cutting 6-inch or 8-inch wafers to the specified size. During cutting, a dicing sheet is attached to the bottom surface to prevent the cut semiconductor dies from falling apart, and the wafer is cut from the top surface using a dicing saw or similar. During this process, the dicing sheet attached to the bottom surface is slightly cut but not cut, so that each semiconductor die is held in place. The cut semiconductor dies are then picked up one by one from the dicing sheet and sent to the next process, such as die bonding.

[0003] As a device for picking up a semiconductor die from a dicing sheet, a push-up device is used that pushes up the semiconductor die from the lower surface of the dicing sheet using a plurality of moving elements (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 5717910 specification Summary of the Invention [Problem to be solved by the invention]

[0005] In some cases, such a push-up device has interchangeable moving elements and stages with openings through which the moving elements pass, allowing it to push up semiconductor dies of various sizes. In this case, the stage is attached to the top of a holder that houses the moving elements by magnetic attraction. However, because the moving elements are made of a magnetic material, the attractive force of the magnets can sometimes hinder the vertical movement of the moving elements.

[0006] Therefore, an object of the present disclosure is to enable smooth movement of a moving element in a semiconductor die push-up device that magnetically attracts a stage. [Means for solving the problem]

[0007] The semiconductor die push-up device disclosed herein is a semiconductor die push-up device that pushes up semiconductor dies attached to the surface of a dicing sheet when picking up the semiconductor dies, and is characterized by comprising: a magnetic stage including an adsorption surface that adsorbs the underside of the dicing sheet; a holder having a plurality of magnets attached to the top thereof that magnetically adsorbs the stage to its upper surface; and a plurality of moving elements that are arranged in a hole provided in the center of the holder and whose tip surfaces move through openings provided in the adsorption surface of the stage between a first position lower than the adsorption surface and a second position higher than the adsorption surface, so that when picking up the semiconductor dies, their tip surfaces push up the semiconductor dies from the underside of the dicing sheet, and the plurality of magnets are attached to the outer periphery of the hole so that adjacent magnets have different magnetic poles.

[0008] This prevents the magnetic flux of the magnet from passing through the moving element housed in the hole in the center of the holder, thereby preventing the moving element from being hindered in its vertical movement.

[0009] In the semiconductor die push-up device of the present disclosure, the multiple magnets may be arranged so that the magnetic poles of adjacent magnets alternate in the circumferential direction.

[0010] In the semiconductor die push-up device of the present disclosure, the multiple magnets may be arranged so that the magnetic poles of adjacent magnets are different in the radial direction.

[0011] In the semiconductor die push-up device of the present disclosure, the plurality of moving elements may be moved from the first position to the second position by the moving mechanism, and may return from the second position to the first position by their own weight.

[0012] This allows the moving element to be moved up and down with a simple configuration. [Effects of the Invention]

[0013] The present disclosure enables smooth movement of a moving element in a semiconductor die push-up device that magnetically attracts a stage. [Brief explanation of the drawings]

[0014] [Figure 1] 1 is an exploded perspective view showing a semiconductor die push-up device according to an embodiment; [Figure 2] This is a cross section taken along the line AA shown in FIG. [Figure 3] 2 is a plan view of the holder of the semiconductor die push-up device shown in FIG. 1, seen from above. [Figure 4] 2 is an explanatory view showing the operation of the semiconductor die push-up device shown in FIG. 1, and is a cross-sectional view showing a state in which the tip surface of the moving element is at a first position lower than the suction surface. FIG. [Figure 5] 1. FIG. 4 is a cross-sectional view illustrating the operation of the semiconductor die push-up device shown in FIG. 1, showing a state in which the tip surface of the moving element is at a second position higher than the suction surface. [Figure 6] 10 is a plan view of a holder of a semiconductor die push-up device according to another embodiment, as viewed from above. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0015] The semiconductor die push-up device 100 according to the embodiment will be described below with reference to the drawings. As shown in FIG.

[0016] The stage 10 is a disk-shaped plate member made of a magnetic material. The upper surface 11 serves as an attraction surface that vacuum-attaches the lower surface 42 (see FIGS. 4 and 5) of the dicing sheet 40. An opening 12 is provided in the center of the upper surface 11, through which the protrusions 33 and 36 of the movable body 30 pass. A plurality of vacuum suction grooves 13 are provided outside the opening 12 in the upper surface 11. A vacuum hole (not shown) that penetrates to the lower surface 14 is provided at the bottom of each vacuum suction groove 13.

[0017] The holder 20 is a cylindrical casing with a top lid. A square hole 23 is provided in the center of the top lid of the holder 20. The main bodies 32 and 35 of the movable body 30 are housed within the hole 23 so that they can move up and down. Multiple magnets 25 and 26 are attached to the outer periphery of the hole 23 and aligned in the circumferential direction. The top surfaces of the magnets 25 and 26 are slightly recessed from the upper end surface 22 of the holder 20. The magnets 25 and 26 have different magnetic poles on their top surfaces. For example, the top surface of the magnet 25 has a north pole, and the top surface of the magnet 26 has a south pole. Thus, the magnets 25 and 26 are attached to the outer periphery of the hole 23 so that their different magnetic poles are alternately arranged in the circumferential direction. In other words, adjacent magnets 25 and 26 are attached to the outer periphery of the hole 23 so that their magnetic poles are different. Additionally, multiple vacuum holes 29 are arranged alongside the magnets 25 and 26 on the outer periphery of the hole 23. Each vacuum hole 29 is connected to a vacuum device (not shown) to create a vacuum inside.

[0018] As shown in FIG. 2, the moving body 30 is composed of multiple moving elements, namely, outer moving elements 31 and inner moving elements 34. Both the outer moving elements 31 and the inner moving elements 34 are made of magnetic materials. The outer moving elements 31 are composed of a rectangular annular main body 32 and a rectangular annular protrusion 33 that protrudes upward from the top surface of the main body 32. The inner moving elements 34 are composed of a rectangular annular main body 35 and a rectangular prism-shaped protrusion 36 that protrudes upward from the top surface of the main body 35. The main body 35 and protrusion 36 of the inner moving element 34 are nested inside the rectangular annular main body 32 and protrusion 33 of the outer moving element 31. The outer surface of the main body 32 is guided by the inner surface of the hole 23 of the holder 20 and moves up and down as indicated by arrow 91 in FIG. 2.

[0019] Next, the flow of magnetic flux between magnets 25, 26 attached to holder 20 will be described with reference to FIG. 3. In the following description, it is assumed that the top surface of magnet 25 is a north pole and the top surface of magnet 26 is a south pole. As indicated by arrow 92 in FIG. 3, magnetic flux flows from the top surface of magnet 25, around the outer periphery of holder 20, to the top surface of magnet 26. Although not shown, the bottom surface of magnet 26 is a north pole and the bottom surface of magnet 25 is a south pole, so below each magnet 25, 26, magnetic flux flows from the bottom surface of magnet 26, around the bottom outer periphery of holder 20, to the bottom surface of magnet 25. In this way, the magnetic flux of each magnet 25, 26 flows around the outer periphery of holder 20, and therefore the magnetic flux passing through movable body 30, which is located in the center of holder 20, is smaller than that at the outer periphery.

[0020] When the lower surface 14 of the stage 10 is brought into close contact with the upper end surface 22 of the holder 20, the stage 10 is magnetically attracted to the upper end surface 22 of the holder 20 by the magnetic force of the magnets 25 and 26, and is fixed to the upper end surface 22 of the holder 20. In addition, the vacuum hole provided in the vacuum suction groove 13 of the stage 10 communicates with the vacuum hole 29 provided in the holder 20.

[0021] Next, the process of picking up the semiconductor die 50 using the semiconductor die push-up device 100 of the embodiment will be described with reference to FIGS.

[0022] 4, dicing sheet 40 having semiconductor die 50 attached to surface 41 is placed on top surface 11 of stage 10, and the semiconductor die 50 is aligned with opening 12 of stage 10. At this time, moving body 30 is positioned at a first position where the tip surfaces of protrusions 33 of outer moving elements 31 and protrusions 36 of inner moving elements 34 are lower than top surface 11 of stage 10.

[0023] Next, a vacuum device (not shown) is used to evacuate vacuum hole 29 of holder 20. Because vacuum hole 29 is connected to the vacuum hole of stage 10, when vacuum hole 29 is evacuated, the vacuum hole and vacuum suction groove 13 of stage 10 are also evacuated. As a result, lower surface 42 of dicing sheet 40 is vacuum-sucked to upper surface 11 of stage 10.

[0024] Next, as shown in FIG. 5 , the outer moving element 31 and the inner moving element 34 are moved upward by a moving mechanism (not shown). Then, the tip surfaces of the protrusions 33 of the outer moving element 31 and the protrusions 36 of the inner moving element 34 are caused to protrude above the upper surface 11 of the stage 10, and the tip surfaces are raised to a second position higher than the upper surface 11 of the stage 10. At this time, the inner moving element 34 is moved upward so that the tip surface of the protrusions 36 is higher than the tip surface of the protrusions 33. As a result, as shown in FIG. 5 , the tip surfaces of the protrusions 33 and 36 push up the lower surface 42 of the dicing sheet 40. This creates a gap between the surface 41 of the dicing sheet 40 and the lower surface of the semiconductor die 50, causing the peripheral portion of the semiconductor die 50 to peel off from the surface 41 of the dicing sheet 40. In this state, the semiconductor die 50 is picked up by a collet (not shown).

[0025] When the semiconductor die 50 is picked up, the moving mechanism releases the outer moving elements 31 and the inner moving elements 34 from moving upward. As described above, the magnetic flux of each magnet 25, 26 flows around the outer periphery of the holder 20, so the magnetic flux passing through the moving body 30 located in the center of the holder 20 is smaller than that at the outer periphery. Therefore, the magnetic flux passing between the stage 10, which is a magnetic body, and the outer moving elements 31 and the inner moving elements 34 is small, preventing the outer moving elements 31 and the inner moving elements 34 from being attracted to the stage 10 by magnetic force. Therefore, when the moving mechanism releases the outer moving elements 31 and the inner moving elements 34 from moving upward, the outer moving elements 31 and the inner moving elements 34 move downward under their own weight and return to the first position shown in FIG. 4.

[0026] As described above, the semiconductor die push-up device 100 of the embodiment prevents the magnetic flux of each magnet 25, 26 from passing through the outer moving element 31 and the inner moving element 34 housed in the central hole 23 of the holder 20, thereby preventing obstruction to the vertical movement of the outer moving element 31 and the inner moving element 34. Furthermore, since the outer moving element 31 and the inner moving element 34 move downward by their own weight and return from the second position to the first position, the moving mechanism can be configured simply.

[0027] Furthermore, although the magnets 25, 26 of the holder 20 have been described as being arranged so that their magnetic poles differ in the circumferential direction, this is not a limitation. For example, as shown in FIG. 6, the magnets 25, 26 adjacent in the radial direction may be arranged so that their magnetic poles differ. In FIG. 6, the magnet 25 is arranged on the inner periphery, and the magnet 26 is arranged on the outer periphery of the magnet 25 so that it is aligned with the magnet 26 in the radial direction of the holder 20. In this case, too, the magnetic flux passes through the outer periphery of the hole 23, as indicated by the arrow 93 in FIG. 6. This prevents the magnetic flux from passing through the outer moving element 31 and the inner moving element 34, thereby preventing the upward and downward movement of the outer moving element 31 and the inner moving element 34 from being hindered. [Explanation of symbols]

[0028] 10 stage, 11 upper surface, 12 opening, 13 vacuum suction groove, 14 lower surface, 20 holder, 22 upper end surface, 23 hole, 25, 26 magnet, 29 vacuum hole, 30 moving body, 31 outer moving element, 32, 35 main body, 33, 36 protrusion, 34 inner moving element, 40 dicing sheet, 41 surface, 42 lower surface, 50 semiconductor die, 100 semiconductor die push-up device.

Claims

1. A semiconductor die push-up device that pushes up a semiconductor die attached to a surface of a dicing sheet when picking up the semiconductor die, a magnetic stage including an adsorption surface that adsorbs the lower surface of the dicing sheet; a holder having a plurality of magnets attached to an upper portion thereof, the holder magnetically attracting the stage to an upper end surface; a plurality of moving elements disposed in a hole provided in the center of the holder, the leading end surfaces of which move through openings provided in the suction surface of the stage between a first position lower than the suction surface and a second position higher than the suction surface, so that when picking up the semiconductor die, the leading end surfaces push up the semiconductor die from the lower surface of the dicing sheet; the plurality of magnets are attached to the outer periphery of the hole such that adjacent magnets have different magnetic poles; A semiconductor die push-up device comprising:

2. 2. The semiconductor die push-up device according to claim 1, the plurality of magnets are arranged so that the magnetic poles of adjacent magnets are alternately different in the circumferential direction; A semiconductor die push-up device comprising:

3. 2. The semiconductor die push-up device according to claim 1, the plurality of magnets are arranged so that the magnetic poles of adjacent magnets are different in the radial direction; A semiconductor die push-up device comprising:

4. 2. The semiconductor die push-up device according to claim 1, the plurality of moving elements are moved from the first position to the second position by a moving mechanism, and return from the second position to the first position by their own weight; A semiconductor die push-up device comprising:

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