Wiring substrate and electronic device

Abstract

To provide a wiring base body with an excellent transmission characteristic of a high frequency signal.SOLUTION: In an electronic device, a terminal member 10a of a wiring base body comprises a ground conductor 13a including a base body 11a, a signal conductor 12, and a first ground conductor. The base body contains: a first surface; a first region R1 that is positioned a location near from an outer side in the first surface, and to which an external substrate 2 is mounted; and a second region R2 other than the first region. The signal conductor contains the first region in the first surface, is extended to a first direction X so as to be separated from the outer side and is positioned. The first ground conductor is positioned in an inner part of the base body, is less than 1 / 4 of a wavelength of a high frequency signal transmitted from the signal conductor in a distance from the signal conductor, and includes a first lattice part nipped by a first open at a first position overlapped to at least one part of the first region and the signal conductor in a plan clairvoyance directed to the first surface. The length of the first open in a first direction and a second direction crossed to the first direction is 1 / 8 or larger and 1 / 4 or less of the wavelength. In the first lattice part, a penetration conductor is positioned.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to a wiring substrate and an electronic device. [Background technology]

[0002] Conventionally, there are wiring substrates (e.g., packages) that mount electronic components and electrically connect the electronic components to external wiring. Some such wiring substrates include a main body that houses the electronic components and terminal members that extend from the main body to the outside. The terminal members have signal conductors and ground conductors that are electrically connected to the electronic components. By mounting an external board on this terminal member, the electronic components are electrically connected to the wiring on the external board.

[0003] As a terminal member, there is known a signal line (microstrip line) that has a signal conductor and a ground conductor that faces the signal conductor with an insulator sandwiched therebetween, and that is capable of transmitting a high-frequency signal. In addition, in such a terminal member, there is known a technique for adjusting the impedance of the signal line by providing a mesh-shaped opening in the ground conductor (for example, see Patent Document 1). ). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. 2010 / 103722 Summary of the Invention

[0005] One aspect of the present disclosure is a first substrate having a perimeter; a signal conductor located on the first substrate and extending in a first direction away from the outer edge; a second substrate located below the first substrate; a first ground conductor located between the first substrate and the second substrate; a first through conductor connected to the first ground conductor and located within the second base; The first ground conductor is The signal conductor in plan view One At least two first openings overlapping the portion and positioned side by side in the first direction; and a first lattice portion sandwiched between the two first openings and in which the first through conductor is located.

[0006] Another aspect of the present disclosure is The above wiring substrate; and an electronic component connected to the wiring substrate. [Brief explanation of the drawings]

[0007] [Figure 1] 1 is a perspective view showing an electronic device according to a first embodiment. [Figure 2] FIG. 1 is a plan view of an electronic device and a wiring board; [Figure 3] FIG. 2 is a view showing a first layer of the terminal member. [Figure 4] FIG. 10 is a view showing a second layer of the terminal member. [Figure 5] FIG. 10 is a view showing a third layer of the terminal member. [Figure 6] FIG. 10 is an enlarged view of a third layer of the terminal member. [Figure 7] FIG. 10 is an enlarged view showing another example of the third layer of the terminal member. [Figure 8] FIG. 10 is a view showing a fourth layer of the terminal member. [Figure 9] FIG. 10 is a view showing a fifth layer of the terminal member. [Figure 10] FIG. 10 is a diagram showing the results of a simulation of reflection loss in a wiring substrate. [Figure 11] FIG. 10 is a diagram showing the results of a simulation of insertion loss in a wiring substrate. [Figure 12] FIG. 6 is a diagram showing first to fourth layers of a terminal member according to a second embodiment. [Figure 13] 10A and 10B are diagrams showing terminal members according to modified examples. [Figure 14] 10A and 10B are diagrams showing terminal members according to modified examples. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, embodiments will be described with reference to the drawings. However, for the sake of convenience, the drawings referred to below show only the main components necessary for explaining the embodiments in a simplified form. Therefore, the wiring substrate 100 and electronic device 1 of the present disclosure may include optional components not shown in the drawings. Furthermore, the dimensions of the components in the drawings do not faithfully represent the dimensions and dimensional ratios of the actual components.

[0009] First Embodiment The configuration of an electronic device 1 according to the first embodiment will be described with reference to FIGS. The electronic device 1 includes a wiring board 100 and an electronic component 200. The electronic device 1 also includes a lid 30 that seals the wiring board 100.

[0010] The wiring substrate 100 includes a main body 20 and a terminal member 10 extending to the outside of the main body 20. When the electronic device 1 includes a lid 30, the lid 30 can be said to seal the main body 20. The wiring substrate 100 is an electronic device package that mounts an electronic component 200 inside the main body 20 and electrically connects the electronic component 200 to wiring on an external substrate 2 via the terminal member 10. The wiring substrate 100 of this embodiment mounts, for example, an electronic component 200 for optical communication. In this case, the electronic component 200 can be an electronic component that inputs or outputs a high-frequency signal related to optical communication (e.g., a modulation rate of approximately 96 Gbaud or less and a frequency band of approximately 75 GHz or less), such as a light-emitting element or a light-receiving element. However, this is merely an example, and the mounted electronic component 200 is not limited to the above.

[0011] The main body 20 includes a bottom 21, a frame 22, and a seal ring 23. The bottom 21 is a rectangular plate-like member. Hereinafter, the directions parallel to the rectangular sides of the bottom 21 are referred to as the X and Y directions, and the direction perpendicular to the bottom 21 and extending from the bottom 21 toward the lid 30 is referred to as the Z direction. Furthermore, of the surfaces of any member parallel to the XY plane, the surface facing the +Z direction will be referred to as the "top surface," and the surface facing the -Z direction will be referred to as the "bottom surface." Furthermore, a layer relatively closer to the -Z direction will be referred to as the "lower layer." Furthermore, viewing from the Z direction will be referred to as a "planar view," and viewing from the Z direction through other members will be referred to as a "planar perspective view." The top surface of the bottom portion 21 is provided with a mounting area on which the electronic component 200 is placed, and is also provided with wiring that is electrically connected to the terminals of the electronic component 200 placed in the mounting area.

[0012] Frame body 22 is a frame-shaped member provided at a position surrounding the mounting area for electronic component 200 in a plan view. In this embodiment, frame body 22 extends in the +Z direction from the outer periphery of bottom 21 to form a frame-shaped side wall. Frame body 22 may be formed with through-holes 22a for passing optical fibers or the like therethrough.

[0013] The bottom 21 and the frame 22 may be configured, for example, by stacking a plurality of insulating substrates in the Z direction. Examples of insulating substrates that can be used include ceramic sintered bodies such as aluminum oxide sintered bodies, aluminum nitride sintered bodies, silicon carbide sintered bodies, mullite sintered bodies, and glass ceramics. The frame 22 may be a separate member from the bottom 21, or may be formed integrally with the bottom 21.

[0014] Seal ring 23 is located on the upper surface of frame 22. Seal ring 23 can be used as a sealing material when hermetically sealing main body 20 with lid 30 after electronic component 200 is mounted on bottom 21. Seal ring 23 may be formed by brazing a frame-shaped metal plate including a metal plate of an Fe-Ni alloy or an Fe-Ni-Co alloy to a frame-shaped conductor formed from a conductor paste including a high-melting point metal such as tungsten or molybdenum with a brazing material or the like.

[0015] The lid 30 is a plate-like member having substantially the same shape as the bottom 21 in a plan view. The lid 30 may be made of any material as long as it is capable of reducing the intrusion of moisture, fine particles, and other foreign matter into the interior of the electronic device 1. The lid 30 may be made of, for example, the same metal material as the seal ring 23, or the same ceramic material as the bottom 21 and frame 22, processed and molded into a plate shape. Hereinafter, the space formed by the bottom 21, frame 22, and lid 30 will be referred to as a cavity.

[0016] A fitting portion 22b penetrating in the thickness direction (X direction) is provided on the side wall of the frame body 22 on the +X direction side. The terminal member 10 has a shape that fits into this fitting portion 22b, and is located from the inside (-X direction side) to the outside (+X direction side) of the fitting portion 22b, and closes the fitting portion 22b. The terminal member 10 fitted into the fitting portion 22b is fixed to the frame body 22 by, for example, a brazing material. The terminal member 10 may also be part of the laminated structure of the frame body 22.

[0017] The terminal member 10 includes a base 11 including a dielectric, a signal conductor 12, and a ground conductor 13. The portion of the terminal member 10 extending from the main body 20 has a first surface S1 facing the +Z direction, and a portion of the signal conductor 12 and a portion of the ground conductor 13 are exposed on this first surface S1. As shown in FIG. 1 , an external substrate 2 is connected to the first surface S1. This electrically connects the wiring located on the surface of the external substrate 2 facing the -Z direction to the signal conductor 12 and the ground conductor 13 located on the first surface S1 of the terminal member 10. The signal conductor 12 and the ground conductor 13 are electrically connected to the terminals of the electronic component 200 via wiring formed on the bottom portion 21, etc. In this way, the wiring of the external substrate 2 and the terminals of the electronic component 200 are electrically connected via the terminal member 10.

[0018] The configuration of the terminal member 10 will be described in detail below with reference to FIGS. The terminal member 10 has a first layer 10a (FIG. 3), a second layer 10b (FIG. 4), a third layer 10c (FIGS. 5 and 6), a fourth layer 10d (FIG. 8), and a fifth layer 10e (FIG. 9). The first to fifth layers 10a to 10e are stacked in this order in the -Z direction, with the first layer 10a being located furthest in the +Z direction. The terminal member 10 may further have a sixth and a seventh layer on the -Z direction side of the fifth layer 10e.

[0019] 3, the first layer 10a includes a base 11a, a signal conductor 12, a ground conductor 13a, and a through conductor 14a. The base 11a is a flat dielectric body having a first surface S1 (top surface). The base 11a is located near an outer edge of the first surface S1 (the edge extending in the Y direction at the end on the +X direction side) and includes a first region R1 where the external substrate 2 is mounted, and a second region R2 other than the first region R1.

[0020] The first region R1 of the base 11a is a rectangular region that is long in the Y direction in plan view, and is exposed to the outside of the wiring base 100. The external substrate 2 is connected to and mounted in the first region R1. In Fig. 3, the mounting region r1 to which the external substrate 2 is connected in plan view is indicated by a rectangular dashed line.

[0021] Of the second region R2 of the base 11a, a portion adjacent to the first region R1 is a frame body stacking region r2 that overlaps with the frame body 22 in a plan view. The second region R2 extends from the frame body stacking region r2 further to the inside of the frame body 22 (i.e., the inside of the cavity).

[0022] The signal conductor 12 and the ground conductor 13a are formed on the upper surface of the base 11a. The signal conductors 12 are located in the first surface S1, including the first region R1, and extend in a first direction (X direction) away from the outer edge. The signal conductors 12 may extend linearly in the X direction within the first region R1 and within the frame body lamination region r2 of the second region R2. Furthermore, the signal conductors 12 may be curved and routed to a predetermined position at the end on the −X direction side within the region of the second region R2 corresponding to the inside of the cavity. The portion of the signal conductors 12 located in the first region R1 may be a rectangular signal terminal 12T. The signal terminal 12T has a predetermined width in the Y direction to electrically connect with wiring on the external substrate 2. The portion of the signal conductors 12 located in the frame body lamination region r2 may have a smaller width in the Y direction than the signal terminals 12T. The terminal member 10 of this embodiment has 16 signal conductors 12. The number of signal conductors 12 can be changed as needed depending on the number of terminals of the electronic component 200 to be mounted.

[0023] The ground conductor 13a is located in the first surface S1 and includes the first region R1, extending in a first direction (X direction) away from the outer edge. The ground conductor 13a may extend linearly in the X direction within the first region R1 and within the frame body stacking region r2 of the second region R2. Furthermore, the ground conductor 13a may be curved and routed to a predetermined position at the end on the -X direction side within the region of the second region R2 that corresponds to the inside of the cavity. The portion of the signal conductor 12 in the first region R1 may serve as a ground terminal 13T to which wiring on the external substrate 2 is connected.

[0024] The terminal member 10 of this embodiment has nine ground conductors 13a, each of which is at ground potential. Two of the ground conductors 13a are located on either side of the sixteen signal conductors 12, i.e., at both ends of the first layer 10a in the Y direction. The remaining seven ground conductors 13a are located such that two signal conductors 12 are sandwiched between adjacent ground conductors 13a. That is, the ground conductors 13a, signal conductors 12, signal conductors 12, and ground conductors 13a are arranged repeatedly in the Y direction. The number of ground conductors 13 can be changed as needed depending on the number of terminals of the electronic component 200 to be mounted, etc.

[0025] A groove 15 may be formed in the substrate 11a between two adjacent signal terminals 12T without a ground terminal 13T in between. The area where the groove 15 is formed is filled with air, lowering the dielectric constant, and thus weakening the electric field coupling between the two signal terminals 12T compared to when no groove 15 is provided. The groove 15 may be formed up to the edge of the substrate 11a, or may be formed only between the signal terminals 12T. This reduces the adverse effects of electromagnetic interference, such as crosstalk noise, between the signal terminals 12T. A wiring substrate 100 having such a configuration has excellent high-frequency signal transmission characteristics.

[0026] Each ground conductor 13a may be connected to a plurality of through conductors 14a that penetrate the base 11a in the Z direction. In FIG. 3, the positions of the through conductors 14 are indicated by circular dots. The through conductors 14 are formed at regular intervals along the outline of the ground conductor 13a in a region that overlaps with the ground conductor 13a in a planar perspective view. Furthermore, in the frame body laminated region r2, a through conductor 14 is formed between two adjacent signal conductors 12 without a ground conductor 13a in between. The through conductors 14a may be, for example, cylindrical, but are not limited to this shape. The same applies to the through conductors 14b to 14e described below.

[0027] As shown in Figure 4, the second layer 10b has a flat base 11b containing a dielectric, a ground conductor 13b, and a through conductor 14b. The base 11b has a first region R1 and a second region R2. The second layer 10b overlaps the first layer 10a so that the positions of the first region R1 of the base 11b and the base 11a coincide in a planar perspective. In Figure 4, the portions that overlap with the mounting region r1 and the frame stacking region r2 in a planar perspective are indicated by dashed lines (the same applies to Figures 5, 8, and 9).

[0028] The ground conductor 13b is formed on the upper surface of the base 11b. The ground conductor 13b has a portion that overlaps with the ground conductor 13a on the first layer 10a in a planar perspective view, and also has a portion that connects the ends of the ground conductor 13b on the -X direction side in a continuous manner. From another perspective, the ground conductor 13b has a shape obtained by removing, from a planar conductor, a portion that overlaps with the formation area of ​​the signal conductor 12 on the first layer 10a and its neighboring area in a planar perspective view. The upper surface of the ground conductor 13b is connected to the through conductor 14a on the first layer 10a. Therefore, the ground conductor 13b is electrically connected to the ground conductor 13a on the first layer 10a via the through conductor 14a and is at ground potential. In addition, the ground conductor 13b is connected to a plurality of through conductors 14b that penetrate the base 11b in the Z direction.

[0029] The second layer 10b is provided mainly for adjusting the thickness between the first layer 10a and the third layer 10c or for adjusting the impedance of the terminal member 10. Therefore, if thickness adjustment or impedance adjustment is not required, it can be omitted.

[0030] As shown in Figure 5, the third layer 10c includes a flat substrate 11c including a dielectric, a ground conductor 13c (first ground conductor), and a through conductor 14c. The substrate 11c includes a first region R1 and a second region R2. The third layer 10c overlaps the second layer 10b so that the positions of the first region R1 of the substrate 11c and the substrate 11b coincide in a planar perspective view. The shape of the substrate 11c is substantially the same as the shape of the substrate 11b.

[0031] The ground conductor 13c is formed on the upper surface of the base 11c. When the wavelength of the high-frequency signal transmitted through the signal conductor 12 is λ, the ground conductor 13c is positioned at a distance of less than λ / 4 from the signal conductor 12 in the direction perpendicular to the first surface S1 (Z direction). The ground conductor 13c has a portion that overlaps with the ground conductor 13b of the second layer 10b in a planar perspective view. The ground conductor 13c also has a plurality of first openings 131A formed in the first region R1. The ground conductor 13c also has a plurality of second openings 132A formed in the second region R2 within a predetermined distance in the −X direction from the boundary with the first region R1. Specifically, the second openings 132A are formed in a portion that overlaps with the frame body lamination region r2 in a planar perspective view. Furthermore, the second openings 132A are also formed on the +Y direction side of the Y direction center of the third layer 10c, on the −X direction side of the frame body lamination region r2, i.e., inside the cavity.

[0032] The first openings 131A and the second openings 132A are arranged in a matrix so as to be adjacent to each other in the X and Y directions. In other words, the ground conductor 13c has mesh-shaped first openings 131A and second openings 132A. The ground conductor 13c has a first lattice portion 131 sandwiched between adjacent first openings 131A and a second lattice portion 132 sandwiched between adjacent second openings 132A. The first lattice portion 131 and the second lattice portion 132 are linear conductors extending in the X and Y directions. The ground conductor 13c also has a linear lattice portion extending in the Y direction at the boundary between the first region R1 and the second region R2, sandwiched between adjacent first openings 131A and second openings 132A.

[0033] Hereinafter, the first apertures 131A and the second apertures 132A arranged in a row in the X direction will be referred to as an "aperture row." The ground conductor 13c has 16 aperture rows corresponding to the 16 signal conductors 12. Each aperture row overlaps one signal conductor 12 in a planar perspective. Specifically, the center of the aperture row in the Y direction overlaps the signal conductor 12. Therefore, the first lattice portions 131 extending in the Y direction and sandwiched between adjacent first apertures 131A in the aperture row in the X direction are orthogonal to the signal conductors 12 in a planar perspective. Furthermore, the second lattice portions 132 extending in the Y direction and sandwiched between adjacent second apertures 132A in the aperture row in the X direction are orthogonal to the signal conductors 12 in a planar perspective. Thus, the ground conductor 13c has the first lattice portions 131 in the first region R1 in a position (first position) overlapping at least a portion of the signal conductor 12 in a planar perspective. The ground conductor 13c is connected to the first lattice portion 131 in the X direction and has a second lattice portion 132 in the second region R2 in a planar perspective view at a position (second position) overlapping at least a part of the signal conductor 12.

[0034] The top surface of the ground conductor 13c is connected to the through conductor 14b on the second layer 10b. Therefore, the ground conductor 13c is electrically connected to the ground conductor 13b on the second layer 10b via the through conductor 14b and is at ground potential. In addition, the ground conductor 13c is connected to a plurality of through conductors 14c that penetrate the base 11c in the Z direction.

[0035] Here, the shapes of the first opening 131A and the second opening 132A in the third layer 10c and the arrangement of the through conductors 14c will be described in detail with reference to FIG. 6, first opening 131A and second opening 132A are rectangular with sides in the X direction (first direction) and the Y direction (second direction). Here, the rectangular shape is not limited to a shape (rectangle) in which the apex angles of the four corners are strictly right angles. In other words, the second direction is a direction intersecting with the first direction. For example, a rectangular shape includes a polygonal shape in which some corners of a rectangle have been rounded off. A rounded corner shape refers to a shape in which two corners of the four sides of a rectangle are connected by a side that is not parallel to either of the two sides. Furthermore, the rectangular shape may include a shape in which the sides of the rectangle are connected by curves. Thus, in the present disclosure, the rectangular shape also includes an opening shape that is rectangular in design but has curved corners that are actually formed through a manufacturing process due to process constraints. The rectangular shape may also include a shape in which a protrusion P that overlaps the through conductor 14c in plan view protrudes from some of the sides.

[0036] The lengths of first opening 131A and second opening 132A in the X and Y directions are not less than λ / 8 and not more than λ / 4. The area of ​​each first opening 131A is larger than the area of ​​each second opening 132A. Specifically, first opening 131A and second opening 132A have the same width in the Y direction, and the width of first opening 131A in the X direction is larger than the width of second opening 132A in the X direction.

[0037] Furthermore, through conductors 14c are located in the first lattice portion 131 and the second lattice portion 132. That is, the through conductors 14c are formed and connected at positions overlapping the first lattice portion 131 and the second lattice portion 132 in a plan view. Specifically, the through conductors 14c are located so as to overlap a portion of the first lattice portion 131 extending in the X direction. The through conductors 14c are also located so as to overlap a lattice portion extending in the Y direction at the boundary between the first region R1 and the second region R2. The through conductors 14c are also located at intersections of the second lattice portion 132. The through conductors 14c are also located around the first opening 131A and the second opening 132A. The distance between each through conductor 14c and an adjacent through conductor 14c is less than λ / 4. That is, when focusing on one through conductor 14c, at least one other through conductor 14c is located within a range of λ / 4 from the through conductor 14c in the XY plane.

[0038] Furthermore, the through conductors 14b of the second layer 10b are located at positions that overlap with some of the through conductors 14c in a planar perspective. In the examples of FIGS. 4 and 5, the through conductors 14b and 14c located in the second region R2 are formed at positions that overlap in a planar perspective. In particular, the through conductors 14b and 14c are located at positions that overlap with the intersections of the second lattice portion 132 in a planar perspective, thereby increasing the arrangement density of the through conductors 14b and 14c in the formation region of the mesh-shaped second opening 132A. In other words, the through conductors 14b and 14c are located on a straight line in the Z direction, sandwiching the intersections of the second lattice portion 132.

[0039] 6, the plurality of through conductors 14c are positioned at equal intervals in the X direction across the first region R1 and the second region R2, but this is not limited to this. For example, as shown in FIG. 7, the arrangement interval of the through conductors 14c in the first region R1 may be smaller than the arrangement interval of the through conductors 14c in the second region R2. In other words, the arrangement density of the through conductors 14c in the first region R1 may be higher than the arrangement density of the through conductors 14c in the second region R2. Furthermore, as shown in FIG. 7, the through conductors 14c may be positioned at the intersections of the first lattice portion 131.

[0040] 8, the fourth layer 10d includes a flat substrate 11d including a dielectric, a ground conductor 13d (second ground conductor), and a through conductor 14d. The substrate 11d includes a first region R1 and a second region R2. The fourth layer 10d overlaps the third layer 10c so that the positions of the first regions R1 of the substrates 11d and 11c coincide in a planar perspective view. The shape of the substrate 11d near its end in the +X direction is substantially the same as the shape of the substrate 11c.

[0041] The ground conductor 13d is formed on the upper surface of the base 11d. The ground conductor 13d is disposed at a position that is less than λ / 4 away from the signal conductor 12 in the Z direction. Because the ground conductor 13d is farther away from the first surface S1 than the ground conductor 13c on the third layer 10c, the distance between the first surface S1 and the ground conductor 13d is greater than the distance between the first surface S1 and the ground conductor 13c.

[0042] Furthermore, the ground conductor 13d has a plurality of mesh-shaped third openings 133A formed in the first region R1. The shape and area of ​​each third opening 133A are identical to the shape and area of ​​the first openings 131A in the third layer 10c. Therefore, the third openings 133A are rectangular with sides in the X and Y directions, and their lengths in the X and Y directions are greater than or equal to λ / 8 and less than or equal to λ / 4. Each third opening 133A overlaps with a first opening 131A in plan view. The ground conductor 13d has third lattice portions 133 sandwiched between adjacent third openings 133A. The third lattice portions 133 are linear conductors extending in the X and Y directions. Similar to the opening row consisting of the first openings 131A, an opening row consisting of the third openings 133A arranged in a line in the X direction overlaps with one signal conductor 12 in plan view. Moreover, the third lattice portion 133 extending in the Y direction is perpendicular to the signal conductor 12 in a planar perspective view. In this way, the ground conductor 13d has the third lattice portion 133 in the first region R1 in a position (third position) overlapping at least a part of the signal conductor 12 in a planar perspective view.

[0043] For impedance adjustment, an additional opening may be formed in ground conductor 13d at a position overlapping second opening 132A in third layer 10c. Also, the area of ​​third opening 133A may be smaller than the area of ​​first opening 131A, as long as the lengths of third opening 133A in the X and Y directions are within a range of λ / 8 to λ / 4.

[0044] The top surface of the ground conductor 13d is connected to the through conductor 14c on the third layer 10c. Therefore, the ground conductor 13d is electrically connected to the ground conductor 13c on the third layer 10c via the through conductor 14c and is at ground potential. In addition, the ground conductor 13d is connected to a plurality of through conductors 14d that penetrate the base 11d in the Z direction.

[0045] As shown in Figure 9, the fifth layer 10e includes a flat substrate 11e including a dielectric, a ground conductor 13e, and a through conductor 14e. The substrate 11e includes a first region R1 and a second region R2. The fifth layer 10e overlaps the fourth layer 10d so that the positions of the first regions R1 of the substrates 11e and 11d coincide in a planar perspective view. The shape of the substrate 11e is substantially the same as the shape of the substrate 11d.

[0046] The top surface of the ground conductor 13e is connected to the through conductor 14d on the fourth layer 10d. Therefore, the ground conductor 13e is electrically connected to the ground conductor 13d on the fourth layer 10d via the through conductor 14d and is at ground potential. The ground conductor 13e is a solid conductor formed in an area including a position overlapping with the third opening 133A on the fourth layer 10d in a plan view. The ground conductor 13e is positioned across the mounting area r1 and a portion of the frame stacking area r2.

[0047] Furthermore, the ground conductor 13e is connected to a plurality of through conductors 14e that penetrate the base 11e in the Z direction. The through conductors 14e are connected to a ground conductor in the sixth layer below the through conductors 14e. The ground conductor in the sixth layer may be connected to a ground conductor in the seventh layer below by a through conductor that penetrates the base of the sixth layer. In this way, by electrically connecting the ground conductors in multiple layers via the through conductors, the ground potential can be stabilized. Note that if the terminal member 10 does not have layers below the sixth layer, the through conductors 14e can be omitted.

[0048] As described above, the base 11 of the terminal member 10 has bases 11a to 11e provided on the first layer 10a to the fifth layer 10e. The ground conductor 13 of the terminal member 10 has ground conductors 13a to 13e provided on the first layer 10a to the fifth layer 10e. Of these, the ground conductors 13b to 13e are located inside the base 11. In the terminal member 10, a microstrip line is formed by the signal conductor 12 on the first layer 10a and the ground conductors 13b to 13e located in layers below it.

[0049] The terminal member 10 can be manufactured, for example, by the following method. The bases 11a to 11e can be made of ceramic sintered bodies such as aluminum oxide sintered bodies, aluminum nitride sintered bodies, silicon carbide sintered bodies, mullite sintered bodies, or glass ceramics. When an aluminum oxide sintered body is used as the bases 11a to 11e, the base 11 of the terminal member 10 can be manufactured as follows. First, a raw material powder containing aluminum oxide powder and a sintering aid powder such as silicon oxide powder as its main components is mixed with an organic solvent and a binder to form a slurry. Next, this slurry is formed into a sheet using a forming method such as a doctor blade method or a lip coater method to produce ceramic green sheets (hereinafter also referred to as green sheets) that will become the bases 11a to 11e. Next, multiple green sheets are stacked to produce a laminate. The laminate is then fired at a temperature of approximately 1300°C to 1600°C to produce the base 11.

[0050] The signal conductor 12 on the substrate 11a and the ground conductors 13a-13e on the substrates 11a-11e contain, as their conductor components, metal materials such as tungsten, molybdenum, manganese, or copper, or alloys of these metal materials. When using a tungsten metallization layer for the signal conductor 12 and the ground conductors 13a-13e, the signal conductor 12 and the ground conductors 13a-13e can be formed by printing a metal paste made by mixing tungsten powder with an organic solvent and an organic binder at predetermined positions on a green sheet using a screen printing method or the like, followed by firing. The through conductors 14a-14e can be formed by forming through holes at predetermined positions on the green sheet prior to printing the metal paste, filling the through holes with the same metal paste as above, and firing the green sheet together with the green sheet. On the surfaces of the conductor layers exposed to the outside, such as the signal conductor 12 and the ground conductor 13a, a nickel film approximately 1-10 μm thick and a gold film approximately 0.1-3 μm thick can be sequentially formed to protect the surface and improve the bondability with brazing filler metal or solder.

[0051] According to the wiring substrate 100 of this embodiment, the terminal member 10 has the above-described configuration, so that the impedance of the terminal member 10 can be adjusted to an appropriate value. This will be described below.

[0052] Generally, in a microstrip line, if the ground conductor below the signal conductor is a solid conductor layer, the resonance frequency shifts to the higher frequency side, improving the transmission characteristics of high-frequency signals. On the other hand, the closer the signal conductor and ground conductor are to each other, the lower the impedance becomes, making impedance matching more difficult.

[0053] In contrast, in the wiring board 100 of this embodiment, a mesh-shaped first opening 131A is formed in the ground conductor 13c below the signal conductor 12 in the mounting region r1 (first region R1). This reduces the decrease in impedance while maintaining the resonant frequency, and allows the impedance to be adjusted to a desired value. Such a wiring board 100 has excellent transmission characteristics for high-frequency signals.

[0054] Furthermore, a mesh-like second opening 132A is formed closer to the cavity than the mounting area r1, i.e., in the frame stacking area r2 and inside the cavity. This allows the frequency of the resonance occurring around the mounting area r1 to be shifted to the higher frequency side, so that the wiring board 100 having this configuration has excellent high-frequency signal transmission characteristics. Furthermore, the decrease in impedance can be further reduced. Generally, the resonant frequency of a microstrip line is largely determined by the cross-sectional shape of the wiring in a plane perpendicular to the signal propagation direction. Therefore, when adjusting the resonant frequency, the shapes of the signal conductor and ground conductor within the mounting area r1 are typically adjusted. However, in reality, the electromagnetic field generated in the mounting area r1 also extends toward the cavity, and the shape of the conductor extending parallel to the signal propagation direction, i.e., the shape of the conductor extending from the mounting area r1 to the inside of the cavity, also affects the resonant frequency. Therefore, a wiring substrate 100 in which a mesh-shaped second opening 132A is also formed in the ground conductor 13 on the cavity side of the mounting area r1, exhibits excellent high-frequency signal transmission characteristics.

[0055] In addition to the first opening 131A on the third layer 10c, a mesh-shaped third opening 133A is also formed in the mounting area r1 on the fourth layer 10d. In other words, mesh-shaped openings are formed across two layers. This further reduces impedance degradation. As described above, the signal conductor 12 forms the signal terminal 12T in the mounting area r1. The line width (width in the Y direction in FIG. 3 ) of this signal terminal 12T has a lower limit determined by design requirements for proper mounting of the external substrate 2. This may result in impedance being lower than desired. In response to this, providing mesh-shaped openings across two layers below the signal terminal 12T reduces impedance degradation and adjusts it to a desired value. Furthermore, making the area of ​​the first opening 131A larger than the area of ​​the second opening 132A also reduces impedance degradation. On the other hand, in the cavity side of the mounting region r1, for example, in the frame body lamination region r2, there are no restrictions on the line width of the signal conductor 12, so the reduction in impedance can be reduced by narrowing the signal conductor 12. Therefore, in the third layer 10c, the area of ​​the second opening 132A may be smaller than the area of ​​the first opening 131A. Furthermore, in the fourth layer 10d, no openings are formed within the second region R2, which includes the frame body lamination region r2. However, this configuration is not limited, and openings may be formed in the second region R2 of the fourth layer 10d as needed to further adjust the impedance.

[0056] Furthermore, by setting the lengths of the first opening 131A, the second opening 132A, and the third opening 133A in the X and Y directions to be greater than or equal to λ / 8 and less than or equal to λ / 4, it is possible to make it difficult for electromagnetic waves generated in response to the transmission of high-frequency signals to pass through. This reduces the radiation of the electromagnetic waves to the outside. Furthermore, by reducing the length of the opening to λ / 4 or less, it is possible to reduce the shift of the resonant frequency to lower frequencies. A wiring substrate 100 having such a configuration has excellent high-frequency signal transmission characteristics.

[0057] Furthermore, by making the area of ​​first opening 131A larger than the area of ​​second opening 132A, the impedance can be adjusted taking into consideration the effective relative dielectric constant of the portion where each opening is formed. This will be described below. The smaller the mesh-like opening, the more the resonant frequency can be shifted toward higher frequencies. On the other hand, the smaller the mesh-like opening, the lower the impedance. Therefore, there is a demand for as large an opening as possible while maintaining a high resonant frequency by setting the opening length to λ / 4 or less. Here, the mounting region r1, which is in contact with air, has a lower effective dielectric constant than the frame-body stacking region r2, which is in contact with the ceramic frame 22, resulting in a larger wavelength λ for electromagnetic waves of the same frequency. Therefore, the first opening 131A formed in the mounting region r1 can be larger than the second lattice portion 132 formed in the frame-body stacking region r2 while still satisfying the condition of "an opening length of λ / 4 or less." This reduces the decrease in impedance without shifting the resonant frequency toward lower frequencies. A wiring substrate 100 with this configuration exhibits excellent high-frequency signal transmission characteristics.

[0058] Furthermore, by arranging the ground conductor 13c, in which the first opening 131A and the second opening 132A are formed, and the ground conductor 13d, in which the third opening 133A is formed, at a position that is less than λ / 4 away from the signal conductor 12, mesh-like openings can be formed within the range through which electromagnetic waves propagate. This reduces the decrease in impedance, and the wiring substrate 100 having such a configuration has excellent transmission characteristics for high-frequency signals.

[0059] Furthermore, ground conductor 13e is located below ground conductor 13d in which third opening 133A is formed, and ground conductor 13e is a solid conductor formed in an area including a position overlapping with third opening 133A in plan view, thereby reducing radiation of electromagnetic waves that have passed through first opening 131A and third opening 133A to the outside of electronic device 1.

[0060] Furthermore, since the ground conductors 13c and 13d, each having a mesh-like opening, are electrically connected by the through conductor 14c, the ground potential can be stabilized (strengthened), thereby improving the transmission characteristics of high-frequency signals. Furthermore, since the ground conductors 13c and 13d are electrically connected to the ground conductors 13a, 13b, and 13e (and the ground conductors on the lower sixth and seventh layers) by other through conductors, the ground potential can be further stabilized.

[0061] Furthermore, by forming the plurality of through conductors 14c (and the through conductors 14b connected thereto) at a distance of less than λ / 4, leakage of electromagnetic waves generated by the transmission of high-frequency signals toward the cavity can be reduced. In particular, by increasing the arrangement density of the through conductors 14c in the first region R1 (mounting region r1), where the resonant frequency is likely to fluctuate due to bonding to an external substrate, compared to the arrangement density of the through conductors 14c in the second region R2, leakage of electromagnetic waves can be reduced. Furthermore, by using a configuration in which the through conductors 14c are located at the intersections of the first lattice portion 131 and a configuration in which the through conductors 14c are located at the intersections of the second lattice portion 132, the through conductors 14c can be arranged at a higher density. From the perspective of reducing leakage of electromagnetic waves, a high arrangement density of the through conductors 14c is desirable. Furthermore, by setting the distance between the through conductors to be less than λ / 4, the electrical connection strength between the ground conductors via the through conductors can be increased, thereby stabilizing the ground potential.

[0062] Next, with reference to FIGS. 10 and 11, the results of simulations of the return loss and insertion loss of the wiring substrate 100 of this embodiment will be described. 10 and 11, the simulation results of an example in which the mesh-like first opening 131A, second opening 132A, and third opening 133A of the present embodiment are provided are shown by solid lines, and the simulation results of a comparative example in which no mesh-like openings are provided in the ground conductor 13 of the terminal member 10 are shown by dashed lines.

[0063] As shown in FIG. 10, in the high frequency band of 55 GHz to 85 GHz, the reflection loss (the closer to 0, the greater the reflection relative to the incident light) of the example was lower than the reflection loss of the comparative example.

[0064] Furthermore, as shown in FIG. 11, in the high frequency band of 55 GHz or higher, the insertion loss (the greater the absolute value of the loss, the greater the loss) of the example was lower than that of the comparative example.

[0065] As described above, the wiring substrate 100 of this embodiment includes the substrate 11, the signal conductor 12, and the ground conductor 13 including the ground conductor 13c as a first ground conductor. The substrate 11 has a first surface S1, a first region R1 located near the outer edge of the first surface S1 and in which the external substrate 2 is mounted, and a second region R2 outside the first region R1. The signal conductor 12 is located on the first surface S1, including the first region R1, and extends in the X direction away from the outer edge. The ground conductor 13c is located inside the substrate 11, and is positioned at a distance from the signal conductor 12 in a direction perpendicular to the first surface S1 that is less than ¼ of the wavelength λ of the high-frequency signal transmitted through the signal conductor 12. The ground conductor 13c has a first lattice portion 131 sandwiched between first openings 131A at a first position that overlaps with at least a portion of the signal conductor 12 in the first region R1 in a planar perspective view toward the first surface S1. The first opening 131A has a length in the X direction and the Y direction of not less than λ / 8 and not more than λ / 4, and the first lattice portion 131 has the through conductor 14c positioned therein. By forming the mesh-shaped first openings 131A of the above size in the ground conductor 13c, it is possible to adjust the impedance to a desired value while maintaining the resonant frequency. Furthermore, by electrically connecting the ground conductor 13c to other ground conductors via the through conductors 14c, it is possible to stabilize (strengthen) the ground potential. This improves the transmission characteristics of high-frequency signals.

[0066] Furthermore, by forming first opening 131A in a rectangular shape having sides in the X direction and Y direction, first opening 131A can be made to have a desired area with a simple design.

[0067] Furthermore, by configuring the through conductors 14c to be located at the intersections of the first lattice portions 131, the through conductors 14c can be arranged at a higher density.

[0068] The ground conductor 13c also includes a second lattice portion 132, which is connected to the first lattice portion 131 in the X direction and sandwiched between second openings 132A at a second position overlapping the second region R2 in a planar perspective. The length of the second opening 132A in the X and Y directions is greater than or equal to λ / 8 and less than λ / 4, and the area of ​​the second opening 132A is smaller than the area of ​​the first opening 131A. This shifts the frequency of resonance occurring around the mounting region r1 to the higher frequency side, improving the transmission characteristics of high-frequency signals. Furthermore, the reduction in impedance can be further reduced. By making the area of ​​the second opening 132A smaller than the area of ​​the first opening 131A, the impedance can be adjusted taking into account the effective relative dielectric constant of the portion where each opening is formed.

[0069] Furthermore, by forming second opening 132A in a rectangular shape having sides in the X and Y directions, second opening 132A can be made to have a desired area with a simple design.

[0070] Furthermore, by configuring the through conductors 14c to be located at the intersections of the second lattice portions 132, the through conductors 14c can be arranged at a higher density.

[0071] The ground conductor 13 is located within the base 11 and at a distance of less than λ / 4 from the signal conductor 12 in a direction perpendicular to the first surface S1. The second ground conductor includes a ground conductor 13d having a third lattice portion 133 sandwiched between third openings 133A at a third position in the first region R1 overlapping at least a portion of the signal conductor 12 in a planar perspective view. The third opening 133A has a length of λ / 8 or more and λ / 4 or less in the X and Y directions. The ground conductor 13d is farther from the first surface S1 than the ground conductor 13c in the direction perpendicular to the first surface S1 and is connected to the ground conductor 13c by a through conductor 14c. This allows mesh-like openings to be formed across two layers, further reducing impedance degradation. The electrical connection strength between the ground conductors can be increased, stabilizing the ground potential.

[0072] Furthermore, by forming third opening 133A in a rectangular shape having sides in the X direction and Y direction, third opening 133A can be made to have a desired area with a simple design.

[0073] Moreover, third opening 133A overlaps with first opening 131A in plan view, so that mesh-like openings can be formed across two layers, thereby reducing the drop in impedance.

[0074] Furthermore, by making the area of ​​the third opening 133A smaller than the area of ​​the first opening 131A, it is possible to adjust the impedance to a desired range while increasing the degree of freedom in design for adjusting the resonant frequency, etc. Such adjustment is possible because the fourth layer 10d on which the third opening 133A is formed is farther from the signal conductor 12 than the third layer 10c on which the first opening 131A is formed.

[0075] The wiring substrate 100 also has a plurality of through conductors 14c, and the distance between adjacent through conductors 14c is less than λ / 4. This reduces leakage of electromagnetic waves toward the cavity caused by the transmission of high-frequency signals. Furthermore, the electrical connection strength between the ground conductors via the through conductors is increased, stabilizing the ground potential.

[0076] Furthermore, the electronic device 1 according to this embodiment includes the wiring board 100 and the electronic component 200 connected to the wiring board 100, and therefore has excellent high-frequency signal transmission characteristics.

[0077] <Second embodiment> Next, a second embodiment will be described. The second embodiment differs from the first embodiment in the structure of the terminal member 10. The differences from the first embodiment will be described below. The electronic device 1 and wiring substrate 100 of the second embodiment can be used for optical communication applications in higher frequency bands (for example, modulation rates of about 128 Gbaud or less, and frequency bands of about 95 GHz or less).

[0078] The configuration of a terminal member 10 according to the second embodiment will be described with reference to FIG. The terminal member 10 of the second embodiment is an example of a four-layer structure made up of a first layer 10a, a second layer 10b, a third layer 10c, and a fourth layer 10d.

[0079] The first layer 10a includes a base 11a, eight signal conductors 12, five ground conductors 13a, and a through conductor 14a. In the second embodiment, the base 11a also includes a first region R1 on which an external substrate 2 is mounted, and a second region R2 including a frame lamination region r2.

[0080] The second layer 10b has a base 11b, a ground conductor 13b, and a through conductor 14b. In the second embodiment, the ground conductor 13b corresponds to the "first ground conductor." The ground conductor 13b has a first opening 131A formed in the first region R1. That is, the ground conductor 13b has a first lattice portion 131 sandwiched between the first openings 131A. Note that, in the example of FIG. 12, the ground conductor 13b does not have a second opening 132A, but may have a second opening 132A if necessary for impedance adjustment.

[0081] The third layer 10c includes a base 11c and a ground conductor 13c. In the second embodiment, the ground conductor 13c corresponds to the "second ground conductor." The ground conductor 13c includes a third opening 133A that overlaps with the first opening 131A in a planar perspective view. That is, the ground conductor 13c includes a third lattice portion 133 sandwiched between the third openings 133A. The third layer 10c does not include a through conductor.

[0082] The fourth layer 10d is made of a dielectric base 11d and does not have any conductors such as a ground conductor or a through conductor.

[0083] As described above, in the second embodiment, the first opening 131A or the third opening 133A does not overlap with the ground conductor 13 in a planar perspective. In other words, no solid conductor is provided at a position that overlaps with the first opening 131A or the third opening 133A in a planar perspective. This can further reduce the decrease in impedance. In addition, the resonant frequency can be shifted further to the higher frequency side, thereby improving the transmission characteristics of high-frequency signals. Furthermore, as the resonant frequency increases, cavity resonance, in which standing waves are generated within the cavity, is likely to occur. However, by not providing (shielding) a solid conductor on the bottom layer, this cavity resonance can be reduced. This reduces the deterioration of the transmission characteristics of high-frequency signals due to the influence of cavity resonance, and can shift the resonant frequency further to the higher frequency side.

[0084] <Modification> A terminal member 10 according to a modification of the first and second embodiments will be described with reference to FIG. FIG. 13 is an enlarged view of a portion of the terminal member 10, showing a first layer 10a and a second layer 10b overlapping the lower surface of the first layer 10a. A plurality of signal conductors 12 are formed on the upper surface of a base 11a of the first layer 10a. A ground conductor 13b is formed on the upper surface of a base 11b of the second layer 10b. A groove 15 is provided between two adjacent signal conductors 12 in the base 11a, penetrating the base 11a in the Z direction. In other words, the base 11 of the terminal member 10 has a groove 15 penetrating from the first surface S1 to the layer where the ground conductor 13b, serving as the first ground conductor, is formed. In FIG. 13, the groove 15 is an oval shape that is elongated in the extension direction (X direction) of the signal conductor 12, but the shape is not limited to this and may be rectangular, for example. The groove 15 may also be a notch extending to the end of the base 11a. A portion of the ground conductor 13b overlaps with the signal conductor 12 in a planar perspective. A plurality of mesh-shaped first openings 131A are formed in the ground conductor 13b. A portion of the first openings 131A overlaps with the signal conductor 12 in a planar perspective. A portion of the first openings 131A also overlaps with the groove 15 in a planar perspective. In other words, a portion of the first openings 131A is exposed from the groove 15 when viewed from the Z direction (i.e., when viewed from the planar perspective toward the first surface S1). A portion of the ground conductor 13b of the second layer 10b is exposed from the groove 15 when viewed from the Z direction. By providing the grooves 15, the relative permittivity of the areas where the grooves 15 are formed can be reduced, thereby reducing the impedance drop of the signal conductor 12. Furthermore, by providing the mesh-shaped first openings 131A in the ground conductor 13b, the impedance drop of the signal conductor 12 can also be reduced. Therefore, according to the configuration shown in FIG. 13, the impedance drop in a configuration in which the signal conductor 12 and the ground conductor 13b are brought closer to each other in order to broaden the bandwidth of the transmission line can be reduced, and the impedance can be adjusted to a desired value. This makes it possible to achieve good transmission characteristics and a broader bandwidth for high-frequency signals.

[0085] 14, the groove 15 may be T-shaped. Specifically, the groove 15 is preferably arranged on an extension of the signal conductor 12 in the signal transmission direction. Specifically, the groove 15 preferably has a portion extending in the X direction (signal transmission direction) between two adjacent signal conductors 12, a portion extending in the +Y direction from the +X-direction end of the portion extending in the X direction, and a portion extending in the −Y direction from the end. The portions of the groove 15 extending in the +Y direction and the −Y direction preferably extend to positions overlapping with the extended portions of the signal conductor 12 when the signal conductor 12 is assumed to be extended in the +X direction. This configuration can reduce a decrease in impedance of the signal conductor 12 near the connection with the external board when the signal conductor 12 is connected to an external board such as an FPC. This can improve the high-frequency characteristics of the signal conductor 12, particularly the high-frequency characteristics in the common mode.

[0086] The above embodiment is merely an example, and various modifications are possible. For example, in the above embodiment, first opening 131A, second opening 132A, and third opening 133A are rectangular with sides in the X direction and Y direction, but this is not limiting. For example, first opening 131A, second opening 132A and third opening 133A may have a shape having sides in a first direction and a second direction that are not orthogonal to each other, such as a parallelogram or a rhombus. Furthermore, first opening 131A, second opening 132A and third opening 133A may have a polygonal shape other than a rectangular shape, a circular shape, an elliptical shape or the like. Alternatively, any one or two of first opening 131A, second opening 132A and third opening 133A may be rectangular, and the remaining may be non-rectangular as exemplified above.

[0087] In addition, in the above embodiment, an example was given in which mesh-like openings were provided across two layers, but this is not limited to this, and the number of layers in which mesh-like openings are formed may be one layer or three or more layers.

[0088] In addition, the specific details of the configuration, structure, positional relationship, shape, etc. shown in the above embodiment can be appropriately changed without departing from the spirit of the present disclosure. Furthermore, the configuration, structure, positional relationship, and shape shown in the above embodiment can be appropriately combined without departing from the spirit of the present disclosure. [Industrial Applicability]

[0089] The present disclosure can be used in wiring substrates and electronic devices. [Explanation of symbols]

[0090] 1 Electronic equipment 2 External Board 10 Terminal member 11, 11a~11e Base 12 Signal Conductor 12T signal terminal 13, 13a to 13e Grounding conductor 13T ground terminal 14a~14e Through conductor 15 groove 20 Main Unit 21 Bottom 22 Frame 22a Through hole 22b Fitting part 23 Seal ring 30 Lid 100 Wiring base 200 Electronic Components R1 1st area R2 2nd area r1 Implementation area r2 Frame stacking area

Claims

1. a first substrate having a perimeter; a signal conductor located on the first substrate and extending in a first direction away from the outer edge; a second substrate located below the first substrate; a first ground conductor located between the first substrate and the second substrate; a first through conductor connected to the first ground conductor and located within the second base; The first ground conductor is at least two first openings overlapping a portion of the signal conductor in a plan view and positioned side by side in the first direction; a first lattice portion sandwiched between the two first openings and in which the first through conductors are located.

2. When a direction intersecting the first direction is defined as a second direction, 2. The wiring substrate according to claim 1, wherein the first opening is rectangular having sides in the first direction and in the second direction.

3. a second through conductor connected to the first ground conductor and passing through a portion of the second base; the first ground conductor has at least four of the first openings and a plurality of the first lattice portions sandwiched between the first openings, 3. The wiring substrate according to claim 1, wherein the second through conductors are located at intersections where a plurality of the first lattice portions intersect.

4. A wiring substrate according to any one of claims 1 to 3, wherein the area of ​​the first opening farther from the outer edge of the two first openings is smaller than the area of ​​the other of the two first openings.

5. a third substrate located below the second substrate; a second ground conductor located between the second substrate and the third substrate; The second ground conductor is at least two second openings overlapping at least a portion of the signal conductor in a plan view and positioned side by side in the first direction; the first through conductor is connected to the first ground conductor; The wiring substrate according to any one of claims 1 to 4.

6. a first substrate having a perimeter; a first signal conductor located on the first substrate and extending in a first direction away from the outer edge; a second signal conductor located on the first substrate and spaced apart from the first signal conductor in a second direction intersecting the first direction; a second substrate located below the first substrate; a first ground conductor located between the first substrate and the second substrate; a first through conductor connected to the first ground conductor and located within the second base; the first ground conductor has at least two first openings and a first lattice portion sandwiched between the two first openings, one of the two first openings overlaps a portion of the first signal conductor in a planar perspective view; the other of the two first openings overlaps a portion of the second signal conductor in a planar perspective view; A wiring substrate, wherein the first through conductor is located between the first signal conductor and the second signal conductor, and is located at a location in the first lattice portion where the distance in the second direction between the two first openings is large.

7. 7. The wiring substrate according to claim 6, wherein the first opening is rectangular having sides in the first direction and the second direction.

8. a second through conductor connected to the first ground conductor and located within the second base; the first ground conductor has at least four of the first openings and a plurality of the first lattice portions sandwiched between the first openings, 8. The wiring substrate according to claim 6, wherein the second through conductors are located at intersections where a plurality of the first lattice portions intersect.

9. 9. The wiring board according to claim 6, wherein the first through conductor is located between the first signal conductor and the second signal conductor in a planar perspective view.

10. the first ground conductor has a second opening that overlaps with at least a part of the first signal conductor or at least a part of the second signal conductor in a planar perspective view, at a location farther from the outer side in the first direction than the first opening; 10. The wiring substrate according to claim 6, wherein the area of ​​the second opening is smaller than the area of ​​the first opening.

11. a third through conductor connected to the first ground conductor and located within the second base; the first ground conductor has a plurality of the second openings and a second lattice portion sandwiched between the plurality of second openings, The wiring substrate according to claim 10 , wherein the third through conductors are located at intersections of the second lattice portions.

12. a third substrate located below the second substrate; a second ground conductor located between the second substrate and the third substrate; the second ground conductor has at least two third openings and is connected to the first ground conductor by the first through conductor; one of the two third openings overlaps at least a portion of the first signal conductor in a plan view; the other of the two third openings overlaps with at least a portion of the second signal conductor in a planar perspective view. The wiring substrate according to any one of claims 6 to 11.

13. The wiring substrate according to claim 12 , wherein the third opening has a rectangular shape having sides in the first direction and sides in the second direction.

14. 14. The wiring board according to claim 12, wherein the third opening overlaps with the first opening in the planar perspective view.

15. 15. The wiring substrate according to claim 12, wherein the area of ​​the third opening is smaller than the area of ​​the first opening.

16. a plurality of said signal conductors; the first substrate has a groove penetrating the first substrate between adjacent signal conductors; 6. The wiring substrate according to claim 1, wherein a portion of the first opening is exposed from the groove in the planar perspective view.

17. the first substrate has a groove penetrating the first substrate between the first signal conductor and the second signal conductor; 10. The wiring substrate according to claim 6, wherein a portion of the first opening is exposed from the groove in the planar perspective view.

18. 18. The wiring substrate according to claim 1, wherein the first opening has at least one of a circular shape and an elliptical shape.

19. 12. The wiring substrate according to claim 10, wherein the second opening has at least one of a circular shape and an elliptical shape.

20. The wiring substrate according to any one of claims 12 to 15, wherein the third opening has at least one of a circular shape and an elliptical shape.

21. A wiring substrate according to any one of claims 1 to 20; and an electronic component connected to the wiring substrate.

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