Power Conversion Device

Abstract

To obtain a power conversion device with a smaller size and a lower cost, while securing vibration resistance.SOLUTION: A power conversion device comprises: a plurality of rectangular parallelepiped power modules that each have a semiconductor chip, are arranged side by side, and each have a first face, a second face on the side opposite to the first face, and four faces surrounding the first face and the second face; a base plate that is arranged at a distance from the second faces of the plurality of power modules, and is electrically connected to a module terminal of each of the plurality of power modules; and a base plate holding member that is arranged in an interval between the base plate and the plurality of power modules, holds the base plate, and is made of a resin member having insulation quality. The plurality of power modules are arranged in a direction parallel with third faces. The module terminal protrudes from at least one face of the second face of the power module, the third face of the power module, and a fourth face on the side opposite to the third face, and then extends in a direction of the base plate. A portion of the module terminal extending in the direction of the base plate penetrates a through hole of the base plate holding member.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present application relates to a power conversion device. [Background technology]

[0002] Electrically-powered vehicles such as hybrid vehicles (HVs), plug-in hybrid vehicles (PHVs, PHEVs), electric vehicles (EVs), and fuel cell vehicles (FCVs) are equipped with power conversion devices, which are components for electrification. Examples of power conversion devices include inverters that convert direct current (DC) power from a battery into alternating current (AC) power for a motor and supply the AC power to the drive motor, and converters that boost the battery voltage. In recent years, there has been a demand for lower costs for power conversion devices.

[0003] Furthermore, in HVs, PHVs, and PHEVs, in addition to the engine, a power conversion device is installed in the engine compartment. This has led to a trend toward a compact power conversion device. EVs also tend to have a drive motor and inverter installed in the rear, which has led to a trend toward a compact power conversion device in order to ensure trunk space and passenger space.

[0004] Furthermore, in recent years, in order to shorten the connection harnesses of each power conversion device, the number of housings for each power conversion device has been reduced, and in order to reduce costs and size, there has been an increasing trend to rigidly connect power conversion devices such as inverters directly to housings for motors, engines, transmissions, etc. Therefore, the internal components of power conversion devices are required to withstand strict vibration specifications. A general power conversion device structure that can withstand strict vibration specifications has been disclosed (see, for example, Patent Document 1). In the structure disclosed in Patent Document 1, a substrate is directly fixed to a base member, which is a heat dissipation member, by a support member. This ensures vibration resistance of the substrate and the components mounted on the substrate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 6369355 Summary of the Invention [Problem to be solved by the invention]

[0006] Various layouts are possible for power conversion devices, such as inverters, for electric vehicles. One layout involves arranging UVW-phase power modules on a cooler, with a circuit board installed vertically above the power modules, and terminals for controlling the power modules extending from the power modules to the circuit board. To minimize the mounting area of ​​the power modules on the cooler, it is difficult to provide a sufficient gap between two adjacent power modules. Because the boss fixing portions for fixing the circuit boards described in Patent Document 1 cannot be provided on the cooler, there is a problem in that the circuit boards and the components mounted on the circuit boards are difficult to withstand vibration specifications.

[0007] In the above-mentioned Patent Document 1, the substrate is fixed to a base member, so the substrate and the components mounted on the substrate can withstand strict vibration specifications. However, because the substrate is directly fixed to the base member, space is required to fix the substrate to the part of the base member facing the substrate, which increases the size of the base member, making it difficult to reduce the size and cost of the power conversion device.

[0008] Therefore, an object of the present application is to provide a power conversion device that is small in size and low in cost while ensuring vibration resistance. [Means for solving the problem]

[0009] The power conversion device disclosed in the present application includes: a plurality of rectangular parallelepiped power modules each having a semiconductor chip and arranged side by side; the power modules each having a first surface, a second surface opposite the first surface, and four surfaces surrounding the first and second surfaces, namely, a third surface, a fourth surface, a fifth surface, and a sixth surface; a substrate arranged at intervals on the second surface of the plurality of power modules and electrically connected to module terminals of each of the plurality of power modules; and a substrate holding member arranged at intervals between the substrate and the plurality of power modules and made of an insulating resin member, the plurality of power modules being arranged in a direction parallel to the third surface; the module terminals protruding from at least one of the second surface of the power module, the third surface of the power module, and the fourth surface opposite the third surface, and then extending toward the substrate; and the portions of the module terminals extending toward the substrate passing through through holes in the substrate holding member. The substrate holding member has a connection terminal mechanically connected to the substrate, and the connection terminal has an embedded portion embedded in the substrate holding member and an extension portion extending toward the substrate and connected to the substrate, and the substrate is held by the substrate holding member by the connection terminal. This is what is being done. [Effects of the Invention]

[0010] The power conversion device disclosed herein includes a plurality of rectangular parallelepiped power modules, each having a semiconductor chip and arranged side by side, the power modules having a first surface, a second surface opposite the first surface, and four surfaces surrounding the first and second surfaces; a substrate arranged at intervals on the second surface of the power modules and electrically connected to module terminals of each of the power modules; and a substrate holding member arranged in the spaces between the substrate and the power modules and made of an insulating resin material to hold the substrate, the power modules being arranged in a direction parallel to a third surface, the module terminals protruding from at least one of the second surface, the third surface, and a fourth surface opposite the third surface and then extending toward the substrate, the portions of the module terminals extending toward the substrate passing through through holes in the substrate holding member, and the substrate being held by the substrate holding member arranged in the spaces between the substrate and the power modules, thereby ensuring vibration resistance of the substrate and components mounted on the substrate. Since there is no need to provide gaps between the power modules to hold the substrate, the power conversion device can be made smaller and less expensive. Since the module terminals pass through the through holes of the board holding member and are connected to the board, the module terminals can be shortened, which allows the power conversion device to be made smaller and less expensive. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is an exploded perspective view showing an outline of a power conversion device according to a first embodiment. [Figure 2] 1 is a perspective view showing an outline of a power conversion device according to a first embodiment. [Figure 3] 3 is a cross-sectional view of the power converter taken along the line AA in FIG. 2. [Figure 4] 3 is a cross-sectional view of the power converter taken along the line BB in FIG. 2. [Figure 5] 1 is a perspective view showing a power module of a power conversion device according to a first embodiment. [Figure 6] 1 is a perspective view showing a drive circuit board for a power converter according to a first embodiment. [Figure 7] 2 is a perspective view showing a control circuit board of the power converter according to the first embodiment. FIG. [Figure 8] 1 is a diagram illustrating an example of an installation state of a power conversion device according to a first embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, a power conversion device according to an embodiment of the present invention will be described with reference to the drawings. In the drawings, the same or equivalent members and parts are denoted by the same reference numerals.

[0013] Embodiment 1 FIG. 1 is an exploded perspective view showing a schematic of a power conversion device 1 according to a first embodiment. FIG. 2 is a perspective view showing a schematic of the power conversion device 1. FIG. 3 is a cross-sectional view of the power conversion device 1 taken along the line AA in FIG. 2. FIG. 4 is a cross-sectional view of the power conversion device 1 taken along the line BB in FIG. 2. FIG. 5 is a perspective view showing a power module 2 of the power conversion device 1. FIG. 6 is a perspective view showing a drive circuit board 3b of the power conversion device 1. FIG. 7 is a perspective view showing a control circuit board 3a of the power conversion device 1. FIG. 8 is a diagram showing an example of an installation state of the power conversion device 1. The power conversion device 1 is a device that converts an input current from DC to AC, AC to DC, or an input voltage to a different voltage. In this embodiment, the power conversion device 1 will be described as an inverter that converts DC power using the power module 2 to output three-phase AC. The configuration of the power conversion device 1 is not limited to this.

[0014] <Power conversion device 1> As shown in FIG. 1, the power conversion device 1 includes a plurality of power modules 2, a substrate 3, and a substrate holding member 4. The power modules 2 have semiconductor chips 10 (not shown in FIG. 1) and are arranged side by side. As shown in FIG. 5, each of the power modules 2 is a rectangular parallelepiped having a first surface 2a, a second surface 2b opposite the first surface 2a, and four surfaces surrounding the first surface 2a and the second surface 2b: a third surface 2c, a fourth surface 2d, a fifth surface 2e, and a sixth surface 2f. As shown in FIG. 1, the substrate 3 is arranged on the second surfaces 2b of the plurality of power modules 2 at intervals and electrically connected to module terminals 2g of each of the plurality of power modules 2. The substrate holding member 4 is arranged in the space between the substrate 3 and the plurality of power modules 2 and holds the substrate 3. The substrate holding member 4 is made of an insulating resin material.

[0015] The number of substrates 3 is not limited to one, and in this embodiment, the power conversion device 1 has two substrates 3. The two substrates 3 are a control circuit substrate 3a and a drive circuit substrate 3b. The multiple power modules 2 are arranged in a direction parallel to the third surface 2c. In the figure, the direction parallel to the third surface 2c is defined as the X direction. The module terminals 2g protrude from at least one of the second surface 2b, the third surface 2c, and the fourth surface 2d opposite the third surface 2c of the power module 2, and then extend toward the substrate 3. As shown in FIG. 4, the portions of the module terminals 2g extending toward the substrate 3 penetrate through through holes 4a formed in the substrate holding member 4. In this embodiment, one module terminal 2g is provided on each of the third surface 2c and the fourth surface 2d of the power module 2, and is connected to the drive circuit substrate 3b. The arrangement surface of the power module 2 on which the module terminals 2g are arranged, the number of module terminals 2g, and the substrate 3 to which the module terminals 2g are connected are not limited to those described above. In this embodiment, the substrate 3 is held by connection terminals 4c provided on the substrate holding member 4. Details of the connection terminals 4c that hold the substrate 3 will be described later.

[0016] With this configuration, the substrate 3 is held by the substrate holding member 4 arranged in the gap between the substrate 3 and the multiple power modules 2, thereby ensuring vibration resistance of the substrate 3 and the components mounted on the substrate 3. Since there is no need to hold the substrate 3 with gaps between the power modules 2 arranged side by side, the power conversion device 1 can be made smaller and less expensive. Since the module terminals 2g pass through the through holes 4a of the substrate holding member 4 and are connected to the substrate 3, the module terminals 2g can be shortened, thereby making it possible to make the power conversion device 1 smaller and less expensive. Furthermore, since the module terminals 2g are shortened, the distance between the power modules 2 and the drive circuit can be shortened, thereby improving the controllability of the power modules 2.

[0017] The module terminals 2g are connected to the drive circuit board 3b via through holes 3g provided in the drive circuit board 3b. In this embodiment, the through holes 4a are funnel-shaped, with the opening on the side of the multiple power modules 2 being larger than the opening on the side of the drive circuit board 3b. This configuration eliminates the need for additional guide components for guiding the module terminals 2g into the through holes 3g, which are required when connecting the module terminals 2g and the through holes 3g, thereby shortening the distance between the power modules 2 and the drive circuit board 3b. Since the distance between the power modules 2 and the drive circuit board 3b is shortened, the distance between the power modules 2 and the drive circuit is shortened, thereby improving the controllability of the power modules 2. Furthermore, since the height of the power conversion device 1 is reduced, the power conversion device 1 can be made more compact.

[0018] <9 coolers, 6 housings, 5 film capacitors> As shown in FIG. 1, the power conversion device 1 further includes a cooler 9, a housing 6, and a film capacitor 5. The cooler 9 has a cooling surface 9a to which the first surfaces 2a of the multiple power modules 2 are thermally connected. As shown in FIG. 3, the cooler 9 has a flow path portion 9b through which a refrigerant flows. The cooling surface 9a is formed on a lid portion 9c that covers the flow path portion 9b. The refrigerant is, for example, water or ethylene glycol liquid. As shown in FIG. 1, the housing 6 has the cooler 9 and an arrangement surface 6a on the same side as the cooling surface 9a. In this embodiment, the cooling surface 9a and the arrangement surface 6a are provided on the same plane. The housing 6 is made of a metal such as aluminum by die-casting. The lid portion 9c is, for example, a forged aluminum alloy. The film capacitor 5 is electrically connected to the multiple power modules 2 via a bus bar 7. The film capacitor 5 is adjacent to the multiple power modules 2 and thermally connected to the arrangement surface 6a of the housing 6. The plurality of power modules 2 and the film capacitor 5 are cooled by a cooler 9. The bus bar 7 is connected to the power terminals 2h of the power modules 2 by, for example, welding.

[0019] The arrangement surface 6a has boss fixing portions 6b to which fixing bosses 4b of the substrate holding member 4 are fixed. The boss fixing portions 6b are provided on the arrangement surface 6a excluding the cooling surface 9a and the projected portions of the arrangement surface 6a where the film capacitors 5 and the bus bars 7 are projected onto the arrangement surface 6a. The fixing bosses 4b and the boss fixing portions 6b are fixed by, for example, screw fastening. With this configuration, the substrate holding member 4 holding the substrate 3 is fixed to the arrangement surface 6a excluding the cooling surface 9a and the projected portions of the arrangement surface 6a where the film capacitors 5 and the bus bars 7 are projected onto the arrangement surface 6a. Therefore, it is not necessary to provide boss fixing portions 6b between the power modules 2 arranged side by side, on the cooling surface 9a on which the flow path portions 9b are provided, or between the power modules 2 and the film capacitors 5. Since it is not necessary to provide boss fixing portions 6b between the power modules 2 arranged side by side, on the cooling surface 9a, or between the power modules 2 and the film capacitors 5, it is possible to reduce the size and cost of the power conversion device 1. Since the board 3 is held by the board holding member 4, the vibration resistance of the board 3 and the components mounted on the board 3 can be ensured.

[0020] Furthermore, since the substrate 3 is installed at a position that does not overlap with the film capacitors 5, which are tall components, when viewed in a direction perpendicular to the second surfaces 2b of the multiple power modules 2, there is no wasted space, and the height of the power conversion device 1 can be reduced. Note that the fixing location of the substrate holding member 4 is not limited to the placement surface 6a of the housing 6. For example, if the power module 2 is configured such that the semiconductor chip 10 is housed in a case and the inside of the case is filled with gel, a boss fixing portion may be provided inside the case, on the side of the substrate holding member 4.

[0021] <Power Module 2> The power module 2 will now be described. In FIG. 5, one semiconductor chip 10 is indicated by a broken line. The number of semiconductor chips 10 included in one power module 2 is not limited to one, and the power module 2 may include multiple semiconductor chips 10. The power module 2 converts DC power to output three-phase AC power. In this embodiment, as shown in FIG. 1, the power conversion device 1 includes three power modules 2 corresponding to the respective phases. The number of power modules 2 included in the power conversion device 1 is not limited to this. The number of power modules 2 may be two, or may be four or more. The first surface 2a of the power module 2 is thermally connected to the cooling surface 9a via a bonding member (not shown). The bonding member is, for example, solder.

[0022] The multiple power modules 2 are arranged in the same direction in the X direction, which is parallel to the third surface 2c. With this configuration, the multiple power modules 2 are aligned in the same direction, which makes it possible to reduce the size of the power conversion device 1. When more power modules 2 are provided, the power modules 2 may be aligned in two rows.

[0023] The module terminal 2g and the power terminal 2h are made of, for example, copper, which has low electrical resistivity and excellent conductivity. The module terminal 2g is a terminal related to driving the power module 2. The power terminal 2h is a terminal related to input / output of the power module 2. For example, one power terminal 2h is connected to a DC power source, and the other power terminal 2h is connected to a motor, which is a load. In this embodiment, one power terminal 2h is connected to a film capacitor 5 via a bus bar 7, and is connected to a DC power source (not shown) via the film capacitor 5. The film capacitor 5 smoothes the power input to the power module 2.

[0024] The power module 2 is formed by transfer molding. Therefore, the semiconductor chip 10 is covered with a mold resin. This configuration makes it easy to protect the semiconductor chip 10 from the outside. Furthermore, it is difficult to hold the substrate 3 in a power module 2 formed by transfer molding. However, in the present application, a substrate holding member 4 that holds the substrate 3 is provided, so that the vibration resistance of the substrate 3 can be improved even without holding the substrate 3 in the power module 2. Note that the power module 2 is not limited to a configuration formed by transfer molding, and may have a configuration in which the semiconductor chip 10 is housed in a case and the inside of the case is filled with gel. Even a configuration in which the semiconductor chip 10 is sealed with gel can improve the vibration resistance of the substrate 3.

[0025] <Substrate holding member 4> The structure of the substrate holding member 4 for holding the substrate 3 will be described with reference to FIG. 4 . The substrate holding member 4 has connection terminals 4c mechanically connected to the substrate 3. The connection terminals 4c have embedded portions 4c1 embedded in the substrate holding member 4 and extended portions 4c2 extending toward and connected to the substrate 3. The substrate 3 is held by the substrate holding member 4 via the connection terminals 4c. The connection terminals 4c are made of, for example, metal. In this embodiment, both the control circuit substrate 3a and the drive circuit substrate 3b are connected to multiple connection terminals 4c and held by the substrate holding member 4. In this embodiment, the connection terminals 4c are U-shaped, with the bottom of the U being the embedded portion 4c1 and extended portions 4c2 formed at one end and the other end of the connection terminal 4c. When viewed in a direction perpendicular to the second surfaces 2b of the multiple power modules 2, the control circuit substrate 3a is connected to one end of the connection terminal 4c at a portion where the control circuit substrate 3a overlaps the substrate holding member 4. When viewed in a direction perpendicular to the second surfaces 2b of the power modules 2, the drive circuit board 3b is connected to the other end of the connection terminal 4c at a portion where the drive circuit board 3b overlaps the board holding member 4. The board 3 and the connection terminal 4c are connected by, for example, soldering. The connection terminal 4c is provided on the board holding member 4 when, for example, the board holding member 4 is molded from resin.

[0026] With this configuration, the connection terminals 4c can be used as structural members for fixing the substrate 3 to the substrate holding member 4 without using fastening members such as bolts. When the substrate 3 is fixed with the connection terminals 4c, the substrate 3 can be fixed in a smaller area than when using bolts, which allows the power conversion device 1 to be made more compact. Furthermore, when the substrate 3 is fixed with the connection terminals 4c, the substrate 3 can be fixed in a shorter time in terms of manufacturing, which allows for a reduction in the number of assembly steps during manufacturing and assembly and the investment amount for assembly facilities, thereby improving the productivity of the power conversion device 1.

[0027] The effects of the above-described configuration will be further explained. To improve the vibration resistance of the substrate 3, it is desirable to ensure the rigidity of the substrate 3. To ensure the rigidity of the substrate alone, it is necessary to increase the second moment of area shown in formula (1). Specifically, it is necessary to increase the second moment of area of ​​the substrate 3 around the X direction, which is the longitudinal direction of the substrate 3. The formula for calculating the second moment of area I of the rectangular cross section of the substrate 3 is shown in formula (1). I=b×h 3 / 12 ···(1) In equation (1), the width of the rectangle is b and the height is h. In a structure with a rectangular cross section, the second moment of area can be increased by increasing the width b and height h. One method for increasing the second moment of area is to increase the thickness of substrate 3, but if the thickness of substrate 3 is made to be a thickness that is not commonly available, this will increase the cost of substrate 3.

[0028] Furthermore, in order to ensure the rigidity of the substrate 3, it is necessary to suppress the deflection of the substrate 3. The formula for calculating the deflection δ at the center of the substrate 3 is shown in equation (2). δ=w×l 4 / (384×E×I) (2) In equation (2), w represents the uniformly distributed load (the weight of the substrate 3), l represents the length of the beam (the length of the longitudinal portion of the substrate 3), E represents the Young's modulus, and I represents the second moment of area.

[0029] Since the beam length l depends on the size of the electrical components and the size of the circuit mounted on the substrate 3, it is difficult to reduce the beam length l. As mentioned above, it is difficult to increase the area second moment I. Therefore, the beam length l and area second moment I in formula (2) are limited in the configuration of the present application.

[0030] In addition to increasing the thickness of the substrate 3, a possible method is to increase the moment of inertia by fixing the substrate 3 to the substrate holding member 4 with bolts at many points, and treating the substrate 3 and the substrate holding member 4 as a single rigid member. However, increasing the number of fixing points with bolts leads to an increase in the size of the power conversion device 1, an increase in the number of assembly steps during manufacturing and assembly, and an increase in the investment amount for assembly facilities.

[0031] In the configuration of the present application, connection terminals 4c are provided on a board holding member 4 molded from resin, and the board 3 is fixed by the connection terminals 4c, so that the connection terminals 4c, which are structural members, can suppress flexing of the board 3. In this embodiment, the board holding member 4 has multiple connection terminals 4c, and the multiple connection terminals 4c are arranged in the longitudinal direction of the board 3, which can further suppress flexing of the board 3. Since flexing of the board 3 is suppressed, the vibration resistance of the board 3 and the components mounted on the board 3 can be improved.

[0032] In this embodiment, the connection terminal 4c is a wiring for an electric circuit. The connection terminal 4c is made of, for example, copper, which has excellent electrical conductivity. The connection terminal 4c and the substrate 3 are connected by, for example, soldering, and the connection terminal 4c is used as wiring for the electric circuit of the power conversion device 1. Because the connection terminal 4c can be used as wiring for the electric circuit, the wiring pattern on the substrate 3 can be reduced, and the power conversion device 1 can be made smaller.

[0033] In this embodiment, the power converter 1 has multiple substrates 3, and the connection terminals 4c are mechanically connected to the multiple substrates 3, with the connection terminals 4c serving as electrical circuit wiring. When the power converter 1 is an inverter, the substrates used in the inverter are broadly divided into two functional sections: a control circuit section and a drive circuit section. If separate substrates for the control circuit and the drive circuit are prepared and connected with connectors and harnesses, the costs of the connectors and harnesses will be added. To reduce the costs of the connectors and harnesses, the control circuit section and the drive circuit section can be mounted on a single substrate rather than separate substrates for the control circuit and the drive circuit. Mounting the control circuit section and the drive circuit section on a single substrate increases the size of the substrate. Therefore, the substrate must be placed above taller electrical components (e.g., film capacitor 5) to prevent interference between the substrate and the taller components. In this case, wasted space is created between the substrate and the shorter components (e.g., power module 2).

[0034] In this embodiment, the power converter 1 includes a control circuit board 3a and a drive circuit board 3b as the multiple boards 3. The number of the multiple boards 3 is not limited to two. The control circuit board 3a and the drive circuit board 3b are mechanically and electrically connected by connection terminals 4c provided on the board holding member 4. This allows the control circuit board 3a and the drive circuit board 3b to be placed in an area of ​​low-height electrical components surrounding the high-height electrical components, rather than being placed on top of the high-height electrical components. Because the control circuit board 3a and the drive circuit board 3b are placed around the high-height electrical components, unnecessary space around the high-height electrical components can be eliminated, thereby enabling the power converter 1 to be made smaller. Furthermore, because connectors and harnesses for connecting the two boards are not required, the power converter 1 can be made smaller and less expensive.

[0035] In this embodiment, the multiple substrates 3 are arranged so that at least a portion of them overlap when viewed in a direction perpendicular to the second surfaces 2b of the multiple power modules 2. As shown in FIG. 1, the power conversion device 1 has a control circuit substrate 3a and a drive circuit substrate 3b as the multiple substrates 3. The control circuit substrate 3a and the drive circuit substrate 3b overlap except for the portion of the control circuit substrate 3a that is connected to the connection terminal 4c. The overlapping area of ​​the control circuit substrate 3a and the drive circuit substrate 3b is not limited to this.

[0036] With this configuration, the area occupied by the substrate 3 in the power converter 1 can be reduced when viewed in a direction perpendicular to the second surfaces 2b of the multiple power modules 2, thereby enabling the size of the power converter 1 to be reduced. Note that although the present application has shown an example in which the power converter 1 includes multiple substrates 3, the number of substrates 3 may be one as long as an increase in size of the power converter 1 is suppressed. Also, although the present application has shown an example in which the power converter 1 includes multiple substrates 3 and the multiple substrates 3 are arranged in an overlapping manner, the multiple substrates 3 may be arranged side by side without overlapping when viewed in a direction perpendicular to the second surfaces 2b of the multiple power modules 2 as long as an increase in size of the power converter 1 is suppressed.

[0037] In this embodiment, an additional board holding member 11 is provided between the overlapping boards 3, and the additional board holding member 11 holds at least one board 3. When the power conversion device 1 has multiple boards 3, the power conversion device 1 may have an additional board holding member 11 between the overlapping control circuit board 3a and drive circuit board 3b, as shown in FIG. 1. The additional board holding member 11 is made of an insulating resin material. The additional board holding member 11 has a board fixing portion 11a, and the fixing portion 3h of the control circuit board 3a is fixed to the board fixing portion 11a. In this embodiment, the board holding member 4 has a board fixing portion 4e, and the fixing portion 3h of the drive circuit board 3b is fixed to the board fixing portion 4e. These parts may be fixed together, for example, by screw fastening.

[0038] With this configuration, an insulating additional board holding member 11 is provided between the control circuit board 3a and the drive circuit board 3b, thereby improving the insulation between the control circuit board 3a and the drive circuit board 3b. The control circuit board 3a is held by the board fixing portion 11a of the additional board holding member 11 in addition to the connection terminals 4c, further improving the vibration resistance of the control circuit board 3a and the components mounted on the control circuit board 3a. In this embodiment, the additional board holding member 11 has a fixing boss 11c, which is fixed to the boss fixing portion 6b together with the fixing boss 4b via the fixing auxiliary portion 3i of the drive circuit board 3b. The fixing method is, for example, screw fastening.

[0039] In this embodiment, the power conversion device 1 has an AC bus bar 8a and includes AC terminals 8 electrically connected to the plurality of power modules 2 via the AC bus bar 8a. The AC terminals 8 are arranged on the arrangement surface 6a opposite to the side where the film capacitors 5 of the plurality of power modules 2 are arranged. The AC bus bar 8a is connected to the power terminals 2h of the power modules 2, for example, by welding. The end of the AC bus bar 8a opposite to the side where the power terminals 2h are arranged is connected to, for example, a motor (not shown). As shown in FIG. 4, a board holding member 4 is provided at least partially between the drive circuit board 3b, which is the board 3, and the bus bar 7 and AC bus bar 8a. The bus bar 7 and AC bus bar 8a are high-voltage members.

[0040] With this configuration, insulating board holding member 4 is provided between drive circuit board 3b and the portions of busbars 7 and AC busbars 8a, which are subject to high voltage, so that insulation between busbars 7 and AC busbars 8a and drive circuit board 3b can be ensured by board holding member 4. Since insulation between busbars 7 and AC busbars 8a and drive circuit board 3b is ensured, the distance between busbars 7 and AC busbars 8a and drive circuit board 3b can be shortened. Since the distance between busbars 7 and AC busbars 8a and drive circuit board 3b can be shortened, power conversion device 1 can be made more compact.

[0041] At least one of a transformer, an aluminum electrolytic capacitor, and a backup transformer, which are mounted components electrically connected to the power module 2, is provided on the substrate 3. In this embodiment, as shown in FIG. 6, a transformer 3c and an aluminum electrolytic capacitor 3d are provided on the drive circuit substrate 3b. As shown in FIG. 7, a backup transformer 3e is provided on the control circuit substrate 3a. The transformer 3c and the aluminum electrolytic capacitor 3d are provided on the side of the drive circuit substrate 3b opposite to the side where the power module 2 is located, and the backup transformer 3e is provided on the side where the power module 2 is located on the control circuit substrate 3a.

[0042] The portion of the mounted components facing the board holding member is bonded to the board holding member via adhesive 3f. In this embodiment, as shown in Fig. 3, the portion of the transformer 3c and the aluminum electrolytic capacitor 3d facing the additional board holding member 11 is bonded to the additional board holding member 11 via adhesive 3f. As shown in Fig. 4, the portion of the backup transformer 3e facing the additional board holding member 11 is bonded to the additional board holding member 11 via adhesive 3f.

[0043] With this configuration, the transformer 3c, aluminum electrolytic capacitor 3d, and backup transformer 3e are fixed to the additional board holding member 11, which is a board holding member, thereby further ensuring the vibration resistance of the board 3 and the electrical components mounted on the board 3. Because the vibration resistance of the board 3 and the electrical components mounted on the board 3 is further ensured, the power conversion device 1 disclosed in the present application can be used in a power conversion device that is rigidly connected to an automotive motor, which has strict vibration resistance requirements. A rigid connection means that two members are mechanically connected without any vibration absorbing material, and is a connection that does not flex at the part where the two members are connected.

[0044] In this embodiment, as shown in Fig. 3, a recess 11b is provided in the portion of the additional substrate holding member 11 facing the transformer 3c and the aluminum electrolytic capacitor 3d, and the transformer 3c and the aluminum electrolytic capacitor 3d are bonded to the bottom of the recess 11b with adhesive 3f. As shown in Fig. 4, a recess 11b is provided in the portion of the additional substrate holding member 11 facing the backup transformer 3e, and the backup transformer 3e is bonded to the bottom of the recess 11b with adhesive 3f. With this configuration, the distance between the control circuit board 3a and the drive circuit board 3b can be shortened, thereby making it possible to reduce the size of the power conversion device 1.

[0045] As shown in FIG. 4 , the substrate holding member 4 has a metal plate 4d inside. The plate 4d is provided on the substrate holding member 4, for example, when the substrate holding member 4 is molded from resin. The fixing boss 4b of the substrate holding member 4 and the housing 6 are made of metal, and the plate 4d, the fixing boss 4b, and the ground of the drive circuit board 3b, which is the substrate 3, are electrically connected. The potential of the housing 6 is the ground, and the plate 4d, the fixing boss 4b, and the ground of the drive circuit board 3b are the same as the potential of the housing 6. The plate 4d, the fixing boss 4b, and the ground of the substrate 3 are electrically connected using, for example, a connection terminal 4c. The plate 4d and the fixing boss 4b may be connected to each other by providing a connection wire 4f when the substrate holding member 4 is molded from resin.

[0046] This configuration allows for easy provision of the necessary ground pattern for the transformer 3c connected to the drive circuit of the drive circuit board 3b. Furthermore, because the plate 4d is provided between the semiconductor chip 10 of the power module 2 and the drive circuit board 3b and connected to ground, the plate 4d can function as a noise shield that blocks noise generated during switching of the semiconductor chip 10. Because the plate 4d functions as a noise shield, there is no need to add a new noise shield, thereby improving the productivity of the power conversion device 1. Furthermore, because the plate 4d has a higher Young's modulus than the resin material of the board holding member 4, the rigidity of the board holding member 4 can be improved. Furthermore, the improved rigidity of the board holding member 4 can improve the vibration resistance of the board 3 fixed to the board holding member 4 and the electrical components mounted on the board 3.

[0047] <Installation example of power conversion device 1> The power conversion device 1 is a device mounted on, for example, a vehicle 12. The vehicle 12 has a vibration source 13 such as an engine, a transmission, a motor, or an e-axle. As shown in FIG. 8 , the housing 6 is rigidly connected to at least one of the vibration sources 13 of the vehicle 12, i.e., the engine, the transmission, the motor, and the e-axle. In FIG. 8 , the housing 6 is indicated by a dashed line. With the power conversion device 1 configured as described above, the vibration resistance of the power conversion device 1 can be ensured even when the housing 6 of the power conversion device 1 is rigidly connected to the vibration source 13 of the vehicle 12, which has strict vibration resistance requirements. Note that the power module 2 can ensure the vibration resistance of the power conversion device 1 when the housing 6 of the power conversion device 1 is rigidly connected to the vibration source 13 of the vehicle 12, which has strict vibration resistance requirements, whether the power module 2 is transfer molded or sealed with gel.

[0048] As described above, the power converter 1 according to the first embodiment includes a plurality of rectangular parallelepiped power modules 2 each having a semiconductor chip 10 and arranged side by side, the plurality of power modules 2 each having a first surface 2a, a second surface 2b opposite to the first surface 2a, and four surfaces surrounding the first surface 2a and the second surface 2b; a substrate 3 arranged at intervals on the second surfaces 2b of the plurality of power modules 2 and electrically connected to module terminals 2g of each of the plurality of power modules 2; and a substrate 3 made of an insulating resin member arranged at intervals between the substrate 3 and the plurality of power modules 2, holding the substrate 3. The power converter 1 includes a plate holding member 4, and the multiple power modules 2 are arranged in a direction parallel to the third surface 2c. The module terminals 2g protrude from at least one of the second surface 2b, the third surface 2c, and the fourth surface 2d opposite the third surface 2c and then extend toward the substrate 3. The portions of the module terminals 2g extending toward the substrate 3 penetrate through through holes 4a in the substrate holding member 4. This allows the substrate 3 to be held by the substrate holding member 4 arranged at the interval between the substrate 3 and the multiple power modules 2, thereby ensuring vibration resistance of the substrate 3 and the components mounted on the substrate 3. Since it is not necessary to hold the substrate 3 with gaps between the power modules 2 arranged side by side, the power converter 1 can be made smaller and less expensive. Since the module terminals 2g penetrate through the through holes 4a in the substrate holding member 4 and are connected to the substrate 3, the module terminals 2g can be shortened, thereby making it possible to make the power converter 1 smaller and less expensive.

[0049] When the mounting surface 6a has boss fixing portions 6b to which fixing bosses 4b of the substrate holding member 4 are fixed, and the boss fixing portions 6b are provided on the mounting surface 6a excluding the cooling surface 9a and the projected portion of the mounting surface 6a where the film capacitors 5 and the bus bars 7 are projected onto the mounting surface 6a, the substrate holding member 4 holding the substrate 3 is fixed to the portion of the mounting surface 6a excluding the cooling surface 9a and the projected portion of the mounting surface 6a where the film capacitors 5 and the bus bars 7 are projected onto the mounting surface 6a, there is no need to provide boss fixing portions 6b between the power modules 2 arranged side by side, on the cooling surface 9a on which the flow path portions 9b are provided, or between the power modules 2 and the film capacitors 5. Since there is no need to provide boss fixing portions 6b between the power modules 2 arranged side by side, on the cooling surface 9a, or between the power modules 2 and the film capacitors 5, the power converter 1 can be made smaller and less expensive. Because the substrate 3 is held by the substrate holding member 4, the vibration resistance of the substrate 3 and the components mounted on the substrate 3 can be ensured.

[0050] When the through-holes 4a are funnel-shaped, with the opening on the side of the multiple power modules 2 being larger than the opening on the side of the drive circuit board 3b, an additional guide component for guiding the module terminals 2g into the through-holes 3g is not required, and the distance between the power modules 2 and the drive circuit board 3b can be shortened. Since the distance between the power modules 2 and the drive circuit board 3b is shortened, the distance between the power modules 2 and the drive circuit can be shortened, and the controllability of the power modules 2 can be improved. Furthermore, since the height of the power conversion device 1 is reduced, the power conversion device 1 can be made more compact.

[0051] When the substrate 3 is held on the substrate holding member 4 by the connection terminals 4c, the connection terminals 4c can be used as structural members for fixing the substrate 3 to the substrate holding member 4 without using fastening members such as bolts. When the substrate 3 is fixed by the connection terminals 4c, the substrate 3 can be fixed in a smaller area than when using bolts, which allows the power conversion device 1 to be made more compact. Furthermore, when the substrate 3 is fixed by the connection terminals 4c, the substrate 3 can be fixed in a shorter time in terms of manufacturing, which allows the assembly man-hours during manufacturing and assembly and the investment amount for assembly equipment to be reduced, thereby improving the productivity of the power conversion device 1.

[0052] If the connection terminals 4c are used as wiring for an electric circuit, the connection terminals 4c can be used as wiring for the electric circuit, and therefore the wiring pattern on the substrate 3 can be reduced, allowing the power converter 1 to be made smaller.

[0053] When the power conversion device 1 has multiple boards 3, the connection terminals 4c are mechanically connected to the multiple boards 3, and the connection terminals 4c are wiring for an electric circuit, the boards 3 can be placed around the tall electrical components in an area where there are shorter electrical components, rather than placing the boards on top of the tall electrical components. Because the multiple boards 3 are placed around the tall electrical components, it is possible to eliminate wasted space around the tall electrical components, thereby reducing the size of the power conversion device 1. Furthermore, because there is no need for board-connecting connectors and harnesses to connect the multiple boards 3, the power conversion device 1 can be made smaller and less expensive.

[0054] When the plurality of substrates 3 are arranged so that at least a portion of them overlap when viewed in a direction perpendicular to the second surfaces 2b of the plurality of power modules 2, the area occupied by the substrates 3 in the power conversion device 1 can be reduced when viewed in a direction perpendicular to the second surfaces 2b of the plurality of power modules 2, thereby making it possible to miniaturize the power conversion device 1.

[0055] When an additional board holding member 11 is provided between the overlapping multiple boards 3 and the additional board holding member 11 holds at least one board 3, it is possible to improve the insulation between the overlapping multiple boards 3. Since the at least one board 3 is held by the additional board holding member 11 in addition to the connection terminal 4c of the board holding member 4, it is possible to further improve the vibration resistance of the at least one board 3 and the components mounted on the board 3.

[0056] When the board holding member 4 is provided at least partially between the drive circuit board 3b and the busbars 7 and AC busbars 8a, the insulating board holding member 4 is provided between the drive circuit board 3b and the high-voltage portions of the busbars 7 and AC busbars 8a, so that insulation between the busbars 7 and AC busbars 8a and the drive circuit board 3b can be ensured by the board holding member 4. Since insulation between the busbars 7 and AC busbars 8a and the drive circuit board 3b is ensured, the distance between the busbars 7 and AC busbars 8a and the drive circuit board 3b can be shortened. Since the distance between the busbars 7 and AC busbars 8a and the drive circuit board 3b can be shortened, the power conversion device 1 can be made smaller.

[0057] When the portion of the mounted components facing the board holding member and the board holding member are bonded via adhesive 3f, the mounted components are fixed to the board holding member, which further ensures vibration resistance of the board 3 and the mounted components mounted on the board 3. Since the vibration resistance of the board 3 and the mounted components mounted on the board 3 is further ensured, the power conversion device 1 disclosed in the present application can be used in a power conversion device that is rigidly connected to an automobile motor and has strict vibration resistance requirements.

[0058] If the fixed boss 4b of the board holding member 4 and the housing 6 are made of metal and the plate 4d, the fixed boss 4b, and the ground of the board 3 are electrically connected, the plate 4d, the fixed boss 4b, and the ground of the board 3 are at the same potential as the ground of the housing 6, making it easy to provide the necessary ground pattern for the transformer 3c connected to the drive circuit of the board 3. Furthermore, since the plate 4d is provided between the semiconductor chip 10 of the power module 2 and the board 3 and connected to the ground, the plate 4d can function as a noise shield that blocks noise generated when the semiconductor chip 10 is switched on. Since the plate 4d functions as a noise shield, there is no need to add a new noise shield, thereby improving the productivity of the power conversion device 1. Furthermore, since the plate 4d has a higher Young's modulus than the resin material of the board holding member 4, the rigidity of the board holding member 4 can be improved. Furthermore, the improved rigidity of the board holding member 4 can improve the vibration resistance of the board 3 fixed to the board holding member 4 and the electrical components mounted on the board 3.

[0059] When the housing 6 is rigidly connected to at least one of the vibration sources 13 in the vehicle 12, namely the engine, transmission, motor, and e-axle, the vibration resistance of the power conversion device 1 can be ensured even if the housing 6 of the power conversion device 1 is rigidly connected to the vibration source 13 of the vehicle 12, which has strict vibration resistance requirements.

[0060] Furthermore, although the present application describes various exemplary embodiments and examples, the various features, aspects, and functions described in one or more embodiments are not limited to application to a particular embodiment, but may be applied to the embodiments alone or in various combinations. Therefore, countless variations not illustrated are conceivable within the scope of the technology disclosed in the present specification, including, for example, cases where at least one component is modified, added, or omitted, and cases where at least one component is extracted and combined with components of another embodiment.

[0061] Various aspects of the present disclosure are summarized below as appendices. (Appendix 1) a plurality of rectangular parallelepiped power modules each having a semiconductor chip and arranged side by side, each having a first surface, a second surface opposite to the first surface, and four surfaces surrounding the first surface and the second surface, that is, a third surface, a fourth surface, a fifth surface, and a sixth surface; a substrate disposed at intervals on the second surface of the plurality of power modules and electrically connected to module terminals of each of the plurality of power modules; a substrate holding member that is disposed in the space between the substrate and the plurality of power modules, holds the substrate, and is made of an insulating resin member, the plurality of power modules are arranged in a direction parallel to the third surface, the module terminals protrude from at least one of the second surface of the power module, the third surface of the power module, and the fourth surface opposite to the third surface, and then extend toward the substrate; A power conversion device in which the portion of the module terminal extending toward the board passes through a through hole formed in the board holding member. (Appendix 2) a cooler having a cooling surface thermally connected to the first surfaces of the plurality of power modules; a housing having the cooler and an arrangement surface on the same side as the cooling surface; a film capacitor electrically connected to the plurality of power modules via a bus bar, adjacent to the plurality of power modules, and thermally connected to the placement surface of the housing, the placement surface has a boss fixing portion to which a fixing boss of the board holding member is fixed, The power conversion device according to claim 1, wherein the boss fixing portion is provided on a portion of the arrangement surface excluding the cooling surface and a projected portion of the arrangement surface where the film capacitor and the bus bar are projected onto the arrangement surface. (Appendix 3) 3. The power conversion device according to claim 1, wherein the through-hole has a funnel shape with an opening on the side of the plurality of power modules being larger than an opening on the side of the substrate. (Appendix 4) the substrate holding member has a connection terminal mechanically connected to the substrate, the connection terminal has an embedded portion embedded in the board holding member and an extending portion extending toward the board and connected to the board, 4. The power conversion device according to claim 1, wherein the substrate is held by the substrate holding member by the connection terminal. (Appendix 5) 5. The power conversion device according to claim 4, wherein the connection terminal is a wiring for an electric circuit. (Appendix 6) a plurality of the substrates; the connection terminals are mechanically connected to the plurality of substrates; 5. The power conversion device according to claim 4, wherein the connection terminal is a wiring for an electric circuit. (Appendix 7) 7. The power conversion device according to claim 6, wherein the plurality of substrates are arranged to overlap at least partially when viewed in a direction perpendicular to the second surfaces of the plurality of power modules. (Appendix 8) additional substrate holding members are provided between the overlapping substrates; 8. The power conversion device of claim 7, wherein the additional substrate holding member holds at least one of the substrates. (Appendix 9) an AC terminal having an AC bus bar and electrically connected to the plurality of power modules via the AC bus bar; The power conversion device according to any one of appendixes 2 to 8, wherein the substrate holding member is provided at least partially between the substrate and the bus bar and the AC bus bar. (Appendix 10) At least one of a transformer, an aluminum electrolytic capacitor, and a backup transformer is mounted on the board and is electrically connected to the power module, 10. The power conversion device according to any one of claims 1 to 9, wherein a portion of the mounted components facing the board holding member and the board holding member are bonded via an adhesive. (Appendix 11) the substrate holding member has a metal plate therein, the fixing boss of the substrate holding member and the housing are made of metal, 11. The power conversion device according to any one of appendixes 2 to 10, wherein the plate, the fixing boss, and the ground of the substrate are electrically connected to each other. (Appendix 12) The power conversion device according to any one of appendices 2, 9, and 11, wherein the housing is rigidly connected to at least one of an engine, a transmission, a motor, and an e-axle, which are vibration sources in a vehicle. [Explanation of symbols]

[0062] REFERENCE SIGNS LIST 1 power conversion device, 2 power module, 2a first surface, 2b second surface, 2c third surface, 2d fourth surface, 2e fifth surface, 2f sixth surface, 2g module terminal, 2h power terminal, 3 board, 3a control circuit board, 3b drive circuit board, 3c transformer, 3d aluminum electrolytic capacitor, 3e backup transformer, 3f adhesive, 3g through hole, 3h fixing portion, 3i fixing auxiliary portion, 4 board holding member, 4a through hole, 4b fixing boss, 4c connection terminal, 4c1 buried portion, 4c2 extension portion, 4d plate, 4e board fixing portion, 4f connection wiring, 5 film capacitor, 6 housing, 6a placement surface, 6b boss fixing portion, 7 bus bar, 8 AC terminal, 8a AC bus bar, 9 cooler, 9a cooling surface, 9b flow path portion, 9c lid portion, 10 semiconductor chip, 11 Additional board holding member, 11a board fixing portion, 11b recess, 11c fixing boss, 12 vehicle, 13 vibration source

Claims

1. a plurality of rectangular parallelepiped power modules each having a semiconductor chip and arranged side by side, each having a first surface, a second surface opposite to the first surface, and four surfaces surrounding the first surface and the second surface, that is, a third surface, a fourth surface, a fifth surface, and a sixth surface; a substrate disposed at intervals on the second surface of the plurality of power modules and electrically connected to module terminals of each of the plurality of power modules; a substrate holding member that is disposed in the space between the substrate and the plurality of power modules, holds the substrate, and is made of an insulating resin member, the plurality of power modules are arranged in a direction parallel to the third surface, the module terminals protrude from at least one of the second surface of the power module, the third surface of the power module, and the fourth surface opposite to the third surface, and then extend toward the substrate; a portion of the module terminal extending toward the board passes through a through-hole formed in the board holding member; the substrate holding member has a connection terminal mechanically connected to the substrate, the connection terminal has an embedded portion embedded in the board holding member and an extending portion extending toward the board and connected to the board, The power conversion device, wherein the board is held by the board holding member by the connection terminal.

2. a cooler having a cooling surface thermally connected to the first surfaces of the plurality of power modules; a housing having the cooler and an arrangement surface on the same side as the cooling surface; a film capacitor electrically connected to the plurality of power modules via a bus bar, adjacent to the plurality of power modules, and thermally connected to the placement surface of the housing, the placement surface has a boss fixing portion to which a fixing boss of the board holding member is fixed, The power conversion device according to claim 1 , wherein the boss fixing portion is provided on a portion of the arrangement surface excluding the cooling surface and a projected portion of the arrangement surface where the film capacitor and the bus bar are projected onto the arrangement surface.

3. The power conversion device according to claim 1 or 2, wherein the through-hole has a funnel shape with an opening on the side of the plurality of power modules being larger than an opening on the side of the substrate.

4. The power conversion device according to claim 1 , wherein the connection terminals are wires for an electric circuit.

5. a plurality of the substrates; the connection terminals are mechanically connected to the plurality of substrates; The power conversion device according to claim 1 , wherein the connection terminals are wires for an electric circuit.

6. The power conversion device according to claim 5 , wherein the plurality of substrates are arranged to overlap at least partially when viewed in a direction perpendicular to the second surfaces of the plurality of power modules.

7. additional substrate holding members are provided between the overlapping substrates; The power conversion apparatus according to claim 6 , wherein the additional substrate holding member holds at least one of the substrates.

8. an AC terminal having an AC bus bar and electrically connected to the plurality of power modules via the AC bus bar; The power conversion device according to claim 2 , wherein the substrate holding member is provided at least partially between the substrate and the bus bar and the AC bus bar.

9. A plurality of rectangular parallelepiped power modules each having a semiconductor chip arranged side by side, each having a first surface, a second surface opposite the first surface, and four surfaces surrounding the first surface and the second surface, that is, a third surface, a fourth surface, a fifth surface, and a sixth surface; a substrate disposed at intervals on the second surface of the plurality of power modules and electrically connected to module terminals of each of the plurality of power modules; a substrate holding member that is disposed in the space between the substrate and the plurality of power modules, holds the substrate, and is made of an insulating resin member, the plurality of power modules are arranged in a direction parallel to the third surface, the module terminals protrude from at least one of the second surface of the power module, the third surface of the power module, and the fourth surface opposite to the third surface, and then extend toward the substrate; a portion of the module terminal extending toward the board passes through a through-hole formed in the board holding member; At least one of a transformer, an aluminum electrolytic capacitor, and a backup transformer is mounted on the board and is electrically connected to the power module, A power conversion device in which a portion of the mounted components facing the board holding member and the board holding member are bonded to each other via an adhesive.

10. A plurality of rectangular parallelepiped power modules each having a semiconductor chip arranged side by side, each having a first surface, a second surface opposite the first surface, and four surfaces surrounding the first surface and the second surface, that is, a third surface, a fourth surface, a fifth surface, and a sixth surface; a substrate disposed at intervals on the second surface of the plurality of power modules and electrically connected to module terminals of each of the plurality of power modules; a substrate holding member that is disposed in the space between the substrate and the plurality of power modules, holds the substrate, and is made of an insulating resin member, the plurality of power modules are arranged in a direction parallel to the third surface, the module terminals protrude from at least one of the second surface of the power module, the third surface of the power module, and the fourth surface opposite to the third surface, and then extend toward the substrate; a portion of the module terminal extending toward the board passes through a through-hole formed in the board holding member; a cooler having a cooling surface thermally connected to the first surfaces of the plurality of power modules; a housing having the cooler and an arrangement surface on the same side as the cooling surface; a film capacitor electrically connected to the plurality of power modules via a bus bar, adjacent to the plurality of power modules, and thermally connected to the placement surface of the housing, the placement surface has a boss fixing portion to which a fixing boss of the board holding member is fixed, the boss fixing portion is provided on a portion of the arrangement surface excluding a projected portion of the arrangement surface obtained by projecting the cooling surface, the film capacitor, and the bus bar onto the arrangement surface, the substrate holding member has a metal plate therein, the fixing boss of the substrate holding member and the housing are made of metal, The plate, the fixing boss, and the ground of the substrate are electrically connected to each other.

11. The power conversion device according to any one of claims 2, 8 and 10, wherein the housing is rigidly connected to at least one of the engine, transmission, motor and e-axle, which are vibration generating sources in a vehicle.

Images