Temperature measuring device, manufacturing device for disk device suspension, and manufacturing method for disk device suspension

Abstract

To provide a temperature measuring instrument capable of accurately measuring a temperature using a thermocouple, a device for manufacturing a suspension for a disc device, and a method for manufacturing a suspension for a disc device.SOLUTION: A temperature measuring instrument according to one embodiment comprises: a base having a first surface, a second surface opposite to the first surface, and a first opening part penetrating the first surface and the second surface; a support member having a body part provided on the second surface side and overlapping with the first opening part, and a plurality of extension parts extending from the body part along the second surface and overlapping with the second surface; and a thermocouple inserted into the first opening part and having a measurement unit located in the body part.SELECTED DRAWING: Figure 9

Description

[Technical Field]

[0001] The present invention relates to a temperature measuring device, a manufacturing apparatus for a disk drive suspension, and a manufacturing method for a disk drive suspension. [Background technology]

[0002] Hard disk drives (HDDs) are used in information processing devices such as personal computers. Hard disk drives include a magnetic disk that rotates around a spindle and a carriage that rotates around a pivot shaft. The carriage has an arm that rotates around the pivot shaft in the track width direction of the disk using a positioning motor such as a voice coil motor.

[0003] A disk drive suspension (hereinafter simply referred to as the suspension) is attached to the arm. The suspension includes a load beam and a flexure placed on the load beam. A slider that constitutes a magnetic head is mounted on a gimbal portion formed near the tip of the flexure. The slider is equipped with an element (transducer) for accessing the disk, such as reading or writing data. The load beam, flexure, and slider constitute a head gimbal assembly.

[0004] To accommodate the increasing recording density of disks, it is necessary to further miniaturize the head gimbal assembly and enable the slider to be positioned with greater precision relative to the disk's recording surface.To improve the positioning accuracy of the magnetic head, a suspension equipped with a piezoelectric element that functions as an actuator in addition to a positioning motor (voice coil motor) is known.

[0005] For example, a thermosetting adhesive is used to fix the piezoelectric element. The adhesive is heated and hardened by, for example, irradiation with infrared rays. The irradiated infrared rays affect the performance of the suspension, so the irradiated infrared rays must be strictly controlled. To control the irradiated infrared rays, temperature is measured using a temperature sensor such as a thermocouple. Various proposals have been made in the past regarding temperature measurement using a thermocouple.

[0006] For example, Patent Document 1 discloses an infrared heater including a heating element that generates heat when current is applied and radiates infrared rays, an insulating support that supports the heating element, and a thermocouple that is spaced apart from the heating element and has a first metal wire and a second metal wire that are different in material composition, with a temperature measuring part formed by joining the first metal wire and the second metal wire and positioned in the space between the heating element and the support.

[0007] For example, Patent Document 2 discloses a thermocouple for measuring surface temperature, characterized in that the tip portion having a temperature-sensing tip portion is in the form of a flexible thin plate or thin wire and is bent at a predetermined angle. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Utility Model Registration No. 3194388 [Patent Document 2] Patent No. 5756987 Summary of the Invention [Problem to be solved by the invention]

[0009] Even in light of the infrared heater disclosed in Patent Document 1 and the thermocouple for measuring surface temperature disclosed in Patent Document 2, there is still room for various improvements in temperature measurement using a thermocouple. Therefore, one object of the present invention is to provide a temperature measuring device that can perform temperature measurement using a thermocouple with high accuracy, a manufacturing device for disk drive suspensions, and a manufacturing method for disk drive suspensions. [Means for solving the problem]

[0010] A temperature measuring device according to one embodiment comprises a base having a first surface, a second surface opposite the first surface, and a first opening penetrating the first surface and the second surface, a support member provided on the second surface side and having a main body portion overlapping the first opening, and a plurality of extension portions extending from the main body portion along the second surface and overlapping the second surface, and a thermocouple having a measuring portion inserted into the first opening and located in the main body portion.

[0011] The support member may have a second opening that overlaps the center of the first opening and penetrates the main body, and the measurement unit may be located in the second opening. The extension may have a base connected to the main body and a tip that overlaps the second surface and has a width smaller than a width of the base.

[0012] The support member may further include a frame portion connected to the plurality of extension portions and overlapping the second surface. The support member may further include an adhesive that bonds the base and the support member, the support member may overlap the second surface, and the support member may further include a plurality of third openings penetrating the support member, the adhesive being located in the third openings.

[0013] In one embodiment, a manufacturing apparatus for a disk drive suspension is a manufacturing apparatus for a disk drive suspension having an actuator mounting portion on which a piezoelectric element is mounted, and is equipped with an application device that applies adhesive to the actuator mounting portion, an infrared irradiation device that heats the applied adhesive by irradiating the adhesive with infrared rays, a temperature measuring device that measures the temperature at the position irradiated by the infrared rays, and a control device that adjusts the infrared irradiation conditions based on the temperature measured by the temperature measuring device.

[0014] The disk drive suspension may have a metal base located on the actuator mounting portion, the support member may be made of the same material as the metal base, and the disk drive suspension may have a metal base located on the actuator mounting portion, and the support member may have a thickness equal to the thickness of the metal base.

[0015] In one embodiment, a method for manufacturing a suspension for a disk device is a method for manufacturing a suspension for a disk device having an actuator mounting portion on which a piezoelectric element is mounted, and includes placing a temperature measuring device at an irradiation position of infrared rays to be irradiated onto an adhesive applied to the actuator mounting portion, irradiating the infrared rays onto the temperature measuring device, measuring the temperature at the irradiation position using the temperature measuring device, adjusting the irradiation conditions of the infrared rays based on the temperature measured by the temperature measuring device, applying the adhesive to the actuator mounting portion, and irradiating the infrared rays onto the adhesive applied to the actuator mounting portion. [Effects of the Invention]

[0016] According to the present invention, it is possible to provide a temperature measuring device capable of performing temperature measurement using a thermocouple with high accuracy, a manufacturing apparatus for a disk drive suspension, and a manufacturing method for a disk drive suspension. [Brief explanation of the drawings]

[0017] [Figure 1]FIG. 1 is a schematic perspective view showing an example of a disk device. [Figure 2] FIG. 2 is a schematic cross-sectional view showing a part of the disk device. [Figure 3] FIG. 3 is a schematic perspective view showing an example of a suspension provided in a disk device. [Figure 4] FIG. 4 is a schematic perspective view of a part of the tip end side of the suspension shown in FIG. 3 as seen from the slider side. [Figure 5] FIG. 5 is a schematic cross-sectional view showing the first actuator mounting portion shown in FIG. [Figure 6] FIG. 6 is a diagram showing a schematic configuration of a suspension manufacturing apparatus according to the first embodiment. [Figure 7] FIG. 7 is a flowchart showing an example of a method for manufacturing one of the suspensions shown in FIG. [Figure 8] FIG. 8 is a side view that schematically shows the temperature measuring device and the infrared irradiating device. [Figure 9] FIG. 9 is a schematic plan view showing the temperature measuring device shown in FIG. [Figure 10] FIG. 10 is a schematic cross-sectional view showing a part of the temperature measuring device taken along line XX shown in FIG. [Figure 11] FIG. 11 is a diagram for explaining the relationship between the actuator mounting portion of the workpiece and the infrared radiation irradiation area. [Figure 12] FIG. 12 is a diagram showing the measured temperatures at each output of the infrared irradiation device. [Figure 13] FIG. 13 is a diagram showing the relationship between time and measured temperature. [Figure 14] FIG. 14 is a diagram showing the relationship between time and measured temperature. [Figure 15] FIG. 15 is a diagram showing the relationship between time and measured temperature. [Figure 16] FIG. 16 is a diagram showing the relationship between time and measured temperature. [Figure 17] FIG. 17 is a diagram showing the relationship between time and measured temperature. [Figure 18]FIG. 18 is a schematic plan view showing a temperature measuring device according to the second embodiment. [Figure 19] FIG. 19 is a schematic cross-sectional view showing a part of the temperature measuring device taken along line XIX-XIX shown in FIG. [Figure 20] FIG. 20 is a schematic plan view showing a temperature measuring device according to the third embodiment. [Figure 21] FIG. 21 is a schematic plan view showing a temperature measuring device according to the fourth embodiment. [Figure 22] FIG. 22 is a schematic plan view showing a temperature measuring device according to the fourth embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0018] Hereinafter, each embodiment of the present invention will be described with reference to the drawings. For clarity of the description, the size, shape, etc. of each part in the drawings may be changed from the actual embodiment and shown schematically.

[0019] [First embodiment] 1 is a schematic perspective view showing an example of a disk drive (HDD) 1. The disk drive 1 includes a case 2, a plurality of disks 4 that rotate around a spindle 3, a carriage 6 that can rotate around a pivot shaft 5, and a positioning motor (voice coil motor) 7 for driving the carriage 6. The case 2 is sealed with a lid (not shown).

[0020] 2 is a schematic cross-sectional view showing a part of the disc device 1. As shown in FIGS. 1 and 2, the carriage 6 is provided with a plurality of arms (carriage arms) 8 (for example, three).

[0021] A disk drive suspension (hereinafter simply referred to as suspension 10) is attached to the tip of each of the multiple arms 8. A slider 11 that constitutes a magnetic head is provided at the tip of each suspension 10. When the disk 4 rotates at high speed, air flows in between the disk 4 and the slider 11, forming an air bearing.

[0022] The suspension 10 includes a base plate 21. The base plate 21 has a boss 21a formed thereon, which is inserted into a hole 8a formed in the arm 8. When the carriage 6 is rotated by the positioning motor 7, the suspension 10 moves in the radial direction of the disk 4, and the slider 11 moves to the desired track on the disk 4.

[0023] Fig. 3 is a schematic perspective view showing an example of the suspension 10 provided in the disk device 1. Fig. 4 is a schematic perspective view of a part of the tip end side of the suspension 10 shown in Fig. 3, seen from the slider 11 side.

[0024] The suspension 10 includes the above-mentioned base plate 21, a load beam 22, and a flexure 23. The load beam 22 and the flexure 23 both extend in the longitudinal direction of the suspension 10.

[0025] Hereinafter, the length direction of the suspension 10, base plate 21, load beam 22, and flexure 23 is defined as length direction X. The direction perpendicular to length direction X is defined as width direction Y of the suspension 10, base plate 21, load beam 22, and flexure 23.

[0026] The direction intersecting (for example, perpendicular to) the length direction X and width direction Y is defined as the thickness direction Z of the suspension 10, base plate 21, load beam 22, flexure 23, etc. Furthermore, as shown in FIG. 4, a sway direction S is defined as indicated by an arc-shaped arrow near the tip of the load beam 22.

[0027] As shown in Fig. 3, one end of the load beam 22 overlaps with the base plate 21. The flexure 23 is disposed along the load beam 22. As shown in Figs. 3 and 4, the flexure 23 includes a metal base 24 made of, for example, stainless steel, and a wiring portion 25 formed on the metal base 24. A portion of the wiring portion 25 is connected to the slider 11.

[0028] The thickness of the metal base 24 is smaller than the thickness of the load beam 22. The thickness of the metal base 24 is, for example, 12 to 25 μm, and is 20 μm in one example. The thickness of the load beam 22 is, for example, 30 μm.

[0029] The flexure 23 has a tongue 26 that functions as a gimbal portion near the tip of the load beam 22. A slider 11 that forms a magnetic head is attached to the tongue 26. The tongue 26 is a part of the metal base 24, and is formed by, for example, etching.

[0030] As shown in Figure 4, an element 12 capable of converting magnetic signals to electric signals, such as an MR element, is provided at the tip of the slider 11. These elements 12 are used to access the disk 4 (shown in Figures 1 and 2), such as to write or read data.

[0031] A head gimbal assembly is made up of the slider 11, the load beam 22, the flexure 23, etc. As shown in FIG.

[0032] 4, the suspension 10 further includes a pair of actuator mounting portions 13 and 14 and a pair of piezoelectric elements 15 and 16. The pair of actuator mounting portions 13 and 14 are provided at the tip end of the suspension 10.

[0033] A first actuator mounting portion 13 on which a piezoelectric element 15 is mounted is disposed on one side of the slider 11 in the width direction Y. A second actuator mounting portion 14 on which a piezoelectric element 16 is mounted is disposed on the other side of the slider 11 in the width direction Y.

[0034] The piezoelectric elements 15 and 16 function as actuators. The piezoelectric elements 15 and 16 are made of a piezoelectric material such as lead zirconate titanate (PZT). The piezoelectric elements 15 and 16 deform in response to an applied voltage, thereby rotating the tongue 26 in the sway direction S.

[0035] Fig. 5 is a schematic cross-sectional view showing the first actuator mounting portion 13 shown in Fig. 4. The second actuator mounting portion 14 has substantially the same configuration as the first actuator mounting portion 13. Therefore, the first actuator mounting portion 13 will be described below, and a description of the second actuator mounting portion 14 will be omitted.

[0036] It is composed of an actuator mounting portion 13, a metal base 24 of a flexure 23, etc. One end 15a of the piezoelectric element 15 is fixed to a first actuator support portion 24a of the metal base 24 with an adhesive 31.

[0037] The other end 15b of the piezoelectric element 15 is fixed to the second actuator support portion 24b of the metal base 24 by an adhesive 31. The adhesive 31 is electrically insulating. The adhesive 31 is, for example, a one-component thermosetting epoxy adhesive.

[0038] The first electrode 17 of the piezoelectric element 15 is electrically connected to the first conductor 25a of the actuator mounting portion 13 via the conductive material 32. The second electrode 18 of the piezoelectric element 15 is electrically connected to the second conductor 25b of the actuator mounting portion 13 via the conductive material 32. The conductive material 32 is, for example, a conductive adhesive.

[0039] Next, the manufacturing of the suspension 10 will be described. 6 is a diagram showing a schematic configuration of a manufacturing apparatus 100 for the suspension 10 according to this embodiment. The manufacturing apparatus 100 includes a conveying device 110, a coating device 120, an infrared irradiating device 130, an element supplying device 140, a temperature measuring device 50, and a control device 160.

[0040] The transport device 110 is controlled by the control device 160 and transports the suspension 10 in the middle of manufacture placed on the stage toward the coating device 120, the infrared irradiation device 130, and the element supply device 140. Hereinafter, the suspension 10 in the middle of manufacture may be referred to as a workpiece W.

[0041] The application device 120 is controlled by the control device 160, and applies adhesive to the actuator mounting portions 13, 14 (shown in FIG. 4) of the workpiece W. The application device 120 includes a dispenser 122 having a nozzle 121, and a movement mechanism 123 that moves the dispenser 122 to control the position of the nozzle 121.

[0042] Uncured (liquid) adhesive is discharged from the nozzle 121. By curing this adhesive, the above-mentioned adhesive 31 is formed. The application device 120 may further include an adhesive supply source (not shown).

[0043] The infrared irradiation device 130 is controlled by the control device 160, and irradiates infrared rays onto the adhesive applied to the actuator mounting portions 13, 14 of the workpiece W that has been transported to the infrared irradiation position RP. The applied adhesive is heated by the irradiated infrared rays.

[0044] The infrared irradiating device 130 includes an irradiation head 131 that irradiates infrared rays, and a movement mechanism 132 that controls the position of the irradiation head 131. The irradiation head 131 is provided so that its position can be adjusted by the movement mechanism 132.

[0045] The element supply device 140 is controlled by the control device 160, and places the piezoelectric elements 15 and 16 (shown in FIG. 4) on the adhesive applied to the actuator mounting portions 13 and 14, respectively.

[0046] At this time, the applied adhesive is heated, for example, by the infrared irradiation device 130, and is in a state where its viscosity has increased. In this case, the piezoelectric elements 15, 16 placed on the adhesive are prevented from moving from their predetermined positions due to the surface tension of the adhesive, etc. In some cases, the applied adhesive is heated by the infrared irradiation device 130 only after the piezoelectric elements 15, 16 are placed.

[0047] The temperature measuring device 50 measures the temperature at an irradiation position RP of infrared rays irradiated from the infrared irradiation device 130. In the example shown in Fig. 6, the temperature measuring device 50 is located at the infrared irradiation position RP. The temperature measuring device 50 includes a thermocouple unit 60 including a thermocouple 51, and a measurement module 52 connected to the thermocouple 51.

[0048] The control device 160 controls various elements of the manufacturing apparatus 100, such as the transport device 110, the coating device 120, the infrared irradiation device 130, the element supply device 140, and the temperature measuring device 50. The control device 160 includes a memory that stores computer programs and data for implementing operations related to the control and inspection of these elements, and a processor that executes these programs.

[0049] The control device 160 adjusts the inspection conditions of the infrared irradiation device 130 and the infrared irradiation conditions based on, for example, the temperature measured by the temperature measuring device 50. The manufacturing apparatus 100 may further include a conductive material supply device, a heating device, and the like, which are not shown.

[0050] Next, a description will be given of an example of a manufacturing method for mounting the piezoelectric elements 15, 16 on the actuator mounting portions 13, 14. Fig. 7 is a flowchart showing an example of a manufacturing method for one suspension 10 shown in Fig. 3.

[0051] Here, attention is focused on the manufacturing process using the conveying device 110, the coating device 120, the infrared irradiating device 130, the element supply device 140, and the temperature measuring device 50, and detailed description of other processes is omitted. Temperature measurement using the temperature measuring device 50 is performed, for example, before the infrared irradiating device 130 starts operating. Temperature measurement using the temperature measuring device 50 may also be performed during maintenance or daily inspection of the infrared irradiating device 130.

[0052] 7, first, the thermocouple unit 60 of the temperature measuring device 50 is placed at the infrared irradiation position RP (shown in FIG. 6) of the infrared irradiation device 130 (step S1). The thermocouple unit 60 may be placed by a device (not shown) controlled by the control device 160, or may be placed by an operator.

[0053] Next, infrared rays are irradiated from the infrared irradiator 130 toward the thermocouple unit 60 placed at the irradiation position RP (step S2). Next, the temperature at the irradiation position RP is measured by the temperature measuring device 50 (step S3).

[0054] In this embodiment, when infrared rays are irradiated from the infrared irradiation device 130, the measurement module 52 measures the temperature via the thermocouple 51. The measured temperature is output from the measurement module 52 to the control device 160.

[0055] Next, based on the temperature measured in step S3, the control device 160 determines whether the infrared irradiation conditions of the infrared irradiation device 130 are appropriate (step S4). For example, if the measured temperature is within a predetermined numerical range, the control device 160 determines that the infrared irradiation conditions are appropriate, and if the measured temperature is outside the numerical range, the control device 160 determines that the infrared irradiation conditions are inappropriate.

[0056] Subsequently, if it is determined in step S4 that the infrared irradiation conditions are not appropriate, the control device 160 executes feedback to adjust the control parameters related to the infrared irradiation device 130 so that the infrared irradiation conditions become appropriate (step S5).

[0057] For example, the control parameters include the position of the irradiation head 131, the output of infrared rays, the irradiation time of infrared rays, etc. If it is determined in step S4 that the irradiation conditions of infrared rays are appropriate, the control device 160 does not adjust the control parameters related to the infrared irradiation device 130.

[0058] Next, the workpiece W is transported by the transport device 110 to a coating position directly opposite the nozzle 121 of the coating device 120, and the adhesive is applied to the actuator mounting portions 13, 14 by the coating device 120 (step S6). The workpiece W to be transported has already undergone previous processes including the assembly of the base plate 21 and the load beam 22.

[0059] Next, the workpiece W is transported to the irradiation position RP by the transport device 110, and the infrared irradiation device 130 irradiates the adhesive applied to the actuator mounting portions 13, 14 of the workpiece W with infrared rays (step S7).

[0060] Next, the piezoelectric elements 15 and 16 are placed on the adhesive applied to the actuator mounting portions 13 and 14 by the element supply device 140 (step S8). After that, various processes required to complete the suspension 10 are carried out (step S9).

[0061] By going through the above manufacturing steps, the piezoelectric elements 15, 16 are mounted on the actuator mounting portions 13, 14. After the control parameters of the infrared irradiation device 130 are adjusted in step S5, the processes from step S2 onward may be executed again to determine whether the infrared irradiation conditions are appropriate. Furthermore, the infrared irradiation of the applied adhesive may be performed after the piezoelectric elements 15, 16 are placed.

[0062] Next, the temperature measuring device 50 of this embodiment will be described.

[0063] Fig. 8 is a side view that schematically shows the temperature measuring device 50 and the infrared irradiation device 130. Fig. 9 is a schematic plan view that shows the temperature measuring device 50 shown in Fig. 8. Fig. 10 is a schematic cross-sectional view that shows a part of the temperature measuring device 50 along line XX shown in Fig. 9. In Fig. 8, the thermocouple unit 60 is disposed at the irradiation position RP of the infrared irradiation device 130. The measurement module 52 is omitted from Figs. 9 and 10.

[0064] As described above, the temperature measuring device 50 includes the thermocouple unit 60 and the measurement module 52. As shown in Fig. 8, the thermocouple unit 60 includes a fixed base 61, a base 70, a support member 80, and a thermocouple 51. Hereinafter, as shown in Figs. 8 to 10, a first direction D1, a second direction D2, and a third direction D3 of the temperature measuring device 50 will be defined. These directions are perpendicular to one another.

[0065] The third direction D3 corresponds to the direction in which the fixed base 61, the base 70, and the support member 80 overlap. The direction indicated by the arrow of the third direction D3 may be referred to as the upper side of the thermocouple unit 60, and the opposite direction may be referred to as the lower side of the thermocouple unit 60. Viewing the plane defined by the first direction D1 and the second direction D2 may be referred to as planar view.

[0066] 8, the fixed base 61, the base 70, the support member 80, and the irradiation head 131 are arranged in this order along the third direction D3. The fixed base 61 is made of a metal material such as an aluminum alloy. The fixed base 61 has an opening 63 into which the thermocouple 51 is inserted. The opening 63 penetrates the fixed base 61 along the third direction D3.

[0067] The base 70 is fixed to the fixed base 61. The base 70 is made of, for example, a metal material such as an aluminum alloy. As another example, the base 70 may be made of an engineering plastic such as polyether ether ketone (PEEK) resin.

[0068] The base 70 is formed in a flat plate shape. In the example shown in FIG. 9, the base 70 is rectangular in plan view. For example, the length of the base 70 along the first direction D1, which is the long side, is 10 to 100 mm, and the length of the base 70 along the second direction D2, which is the short side, is 10 to 100 mm. The thickness of the base 70 is thicker than the thickness of the support member 80. Here, the thickness corresponds to the distance along the third direction D3. The thickness of the base 70 is, for example, approximately 1.5 mm to approximately 2.0 mm.

[0069] 10, the base 70 has a first surface 71 facing the fixed base 61, a second surface 72 opposite the first surface 71, and an opening 73 (first opening) penetrating the first surface 71 and the second surface 72. The first surface 71 and the second surface 72 are parallel to a plane defined by the first direction D1 and the second direction D2. The opening 73 has a circular shape centered on an axis CX extending in the third direction D3.

[0070] The opening 73 has an inner surface 74. The inner surface 74 has a uniform diameter in the third direction D3. The shape of the opening 73 may be other shapes, such as a polygonal shape. Hereinafter, as shown in Figures 9 and 10, a direction from the axis CX centered on the axis CX away from the axis CX is defined as a radial direction Dr, and a circumferential direction Dθ centered on the axis CX is defined.

[0071] The support member 80 is provided on the second surface 72 side. The support member 80 is formed in a thin plate shape. The support member 80 is formed, for example, from a metal material. The material from which the support member 80 is formed is preferably the same as the metal material from which the metal base 24 described above is formed.

[0072] More specifically, the support member 80 is formed of, for example, stainless steel. The thickness of the support member 80 is preferably substantially the same as the thickness of the metal base 24. The thickness of the support member 80 is, for example, 30 μm (0.03 mm) or less, and in one example, is 20 μm (0.02 mm).

[0073] Increasing the thickness of the support member 80 reduces the measured temperature, which will be described later. For example, when the thickness of the support member 80 is 30 μm, the measured temperature is about 9% lower than when the thickness of the support member 80 is 20 μm, but it is possible to keep the decrease in measured temperature to less than 10%.

[0074] As shown in Figure 9, the support member 80 has a main body portion 81, a plurality of extension portions 82 extending from the main body portion 81 along the second surface 72, a fixing portion 83 connected to the extension portions 82, and an opening 84 (second opening) that penetrates the main body portion 81.

[0075] The support member 80 is provided such that the main body 81 overlaps the center of the opening 73 in a plan view. The opening 84 has, for example, a circular shape. The opening 84 is positioned coaxially with the opening 73.

[0076] From another perspective, the opening 84 overlaps with the center of the opening 73. The shape of the opening 84 may be other shapes, such as a polygonal shape. The shape of the main body 81 is not limited to the example shown in the drawings.

[0077] The multiple extension portions 82 are provided substantially uniformly in the circumferential direction Dθ around the main body portion 81. The number of extension portions 82 is, for example, three, but may also be two, four or more. The multiple extension portions 82 each have the same shape.

[0078] 9, the extension portion 82 is tapered so that its width decreases with increasing distance from the main body portion 81 in the radial direction Dr. Here, the width corresponds to the distance in a direction perpendicular to the radial direction Dr and the third direction D3. From another perspective, the extension portion 82 has a width that decreases at a constant rate or an arbitrary rate along the radial direction Dr.

[0079] The extension portion 82 has a base portion 85 connected to the main body portion 81 and a tip portion 86 on the opposite side of the base portion 85. The base portion 85 overlaps the opening 73, and the tip portion 86 overlaps the second surface 72. The width W86 (shown in FIG. 9) of the tip portion 86 is smaller (W86) than the width W85 (shown in FIG. 9) of the base portion 85. <W85)。

[0080] The fixed portion 83 is connected to the tip portion 86. The fixed portion 83 has, for example, a substantially rectangular shape, but is not limited to this example. In the example shown in Fig. 9, the width W83 of the fixed portion 83 is larger than the width W86 of the tip portion 86 and larger than the width W85 of the base portion 85 (W83>W86, W83>W85).

[0081] The type of thermocouple 51 can be changed as appropriate depending on the temperature range to be measured. Thermocouple 51 is, for example, a K-type thermocouple. Thermocouple 51 is inserted into openings 63 and 73 along third direction D3. Thermocouple 51 has metal wires 53 and 54 and measuring portion 55 formed by metal wires 53 and 54.

[0082] The measuring unit 55 is a measuring junction (temperature measuring junction, hot junction). The measuring unit 55 is formed by electrically connecting one end of each of the metal wires 53 and 54. The ends of the metal wires 53 and 54 opposite the measuring unit 55 are electrically connected to the measuring module 52.

[0083] The measurement module 52 measures the temperature based on the thermoelectromotive force generated by the thermocouple 51. The measurement module 52 is, for example, a data logger. Compensation wires may be provided between the measurement module 52 and the metal wires 53 and .

[0084] 10, the measuring unit 55 is located in the opening 84 of the main body 81. From another perspective, the measuring unit 55 is covered by the inner surface 87 (shown in FIG. 10) of the opening 84. Note that the measuring unit 55 may be located above the opening 84 or below the opening 84.

[0085] The temperature measuring device 50 further includes adhesives 33 and 34. The adhesives 33 and 34 are, for example, thermosetting adhesives. The adhesives 33 and 34 are made of, for example, the same material as the adhesive 31 described above.

[0086] The adhesive 33 fixes the measuring unit 55 to the opening 84. In the example shown in Fig. 9, the adhesive 33 has a first portion 331 located at the opening 84, a second portion 332 located above the opening 84, and a third portion 333 located below the opening 84. Note that the adhesive 33 does not necessarily have to have the second portion 332 and the third portion 333. In Fig. 9, the adhesive 33 is indicated by dots.

[0087] The adhesive 34 bonds the base 70 and the support member 80. The adhesive 34 is provided between the base 70 and the fixing portion 83. By fixing the fixing portion 83, which has a width greater than the width W86 of the tip portion 86, to the base 70 with the adhesive 34, the support member 80 can be stably fixed to the base 70.

[0088] However, the adhesive 34 may be provided between the base 70 and the tip portion 86. In the example shown in Figure 10, for convenience of explanation, a gap is formed between the base 70 and the support member 80, but this gap is a very small gap, and the base 70 and the support member 80 may be in contact with each other.

[0089] Next, the relationship between the temperature measuring device 50 and the infrared irradiating device 130 will be described.

[0090] 8, the irradiation head 131 of the infrared irradiation device 130 is provided above the thermocouple unit 60. There is a distance H (shown in FIG. 8) between the tip 133 of the irradiation head 131 in the third direction D3 and the upper surface of the support member 80.

[0091] The distance H is substantially equal to the distance from the tip 133 of the irradiation head 131 to the workpiece W in the manufacturing process (step S7) of the suspension 10. The distance H is, for example, about 3.0 mm.

[0092] The distance H is adjusted by the fixed table 61, the base 70, etc. so that it is substantially equal to the distance from the tip 133 of the irradiation head 131 to the workpiece W in step S7. By setting the distance H in this way, it is possible to obtain a measured temperature equivalent to that when the workpiece W is used.

[0093] 9 shows area A, which receives 90% of the irradiation energy of infrared rays irradiated from the irradiation head 131. The thermocouple unit 60 is disposed so that the axis CX coincides with the center of the irradiation head 131 (the center of area A).

[0094] In a plan view, the size of opening 73 is preferably larger than the size of region A. Main body 81 and base 85 of extension 82 overlap region A, but tip 86 of extension 82, fixing portion 83, and second surface 72 of base 70 do not overlap region A.

[0095] The inner diameter ID (shown in FIG. 10) of the opening 73 is, for example, 2.0 mm or more, and in one example, is approximately 3.0 mm. The inner diameter ID of the opening 73 may be larger than 3.0 mm. Since the size of the region A varies depending on the infrared irradiation device 130, the distance H, etc., the size of the opening 73 is appropriately adjusted so that it is larger than the size of the region A.

[0096] Here, we will explain the relationship between the area A and the actuator mounting portions 13, 14. Figure 11 is a diagram for explaining the relationship between the actuator mounting portions 13, 14 of the workpiece W and the infrared irradiation area. The workpiece W has a pair of actuator mounting portions 13, 14.

[0097] When the workpiece W is transported to the irradiation position RP and faces the tip 133 of the irradiation head 131, the actuator mounting parts 13, 14 overlap with the area A of the irradiation area of ​​the infrared irradiation device 130.

[0098] From another perspective, area A is set to include each of actuator mounting portions 13 and 14. By setting area A in this manner, it is possible to simultaneously irradiate the adhesive applied to each of actuator mounting portions 13 and 14 with infrared rays.

[0099] Fig. 12 is a diagram showing the measured temperature at each output of the infrared irradiation device 130. The horizontal axis of Fig. 12 represents the output [%] of the infrared irradiation device 130. The vertical axis of Fig. 12 represents the measured temperature [Deg / C]. Fig. 12 shows the measured temperature C1 when the temperature measuring device 50 is used and the measured temperature C2 when the workpiece W is used.

[0100] 12 shows the case where a base 70 having an inner diameter ID (shown in FIG. 10) of the opening 73 of approximately 3.0 mm was used. The measured temperature when the workpiece W was used was obtained with the measuring portion 55 of the thermocouple 51 fixed near the tongue 26 between the pair of actuator mounting portions 13, 14 of the workpiece W.

[0101] 12, it can be seen that the measured temperature increases as the output of the infrared irradiation device 130 increases. With the temperature measuring device 50 of this embodiment, the measured temperature was equivalent to that when the workpiece W was used.

[0102] When the workpiece W was used, the measured temperature varied when the output of the infrared irradiation device 130 was 90%. On the other hand, when the temperature measuring device 50 was used, there was almost no variation in the measured temperature at each output of the infrared irradiation device 130, and a stable measured temperature could be obtained.

[0103] Figures 13 and 14 are graphs showing the relationship between time and measured temperature. The horizontal axis of Figures 13 and 14 represents time [s], with zero corresponding to the start of measurement. The vertical axis of Figures 13 and 14 represents measured temperature [Deg / C].

[0104] Figure 13 shows the case where a base 70 having an inner diameter ID (shown in Figure 10) of the opening 73 of approximately 3.0 mm is used, and Figure 14 shows the case where a base 70 having an inner diameter ID of the opening 73 of approximately 2.0 mm is used. The elements of the temperature measuring device 50 other than the base 70 are configured in the same way.

[0105] 13 and 14, the infrared irradiation device 130 irradiated infrared light at 100% output for 0.7 seconds (first time), and then irradiated infrared light at 93% output for 0.7 seconds (second time). In Fig. 13 and Fig. 14, the temperature after the first infrared irradiation was measured.

[0106] Each measured temperature peak P1 shown in Fig. 13 is greater than each temperature peak P2 shown in Fig. 14. In the example shown in Fig. 13, each peak P1 is located between 120 degrees and 140 degrees, and in the example shown in Fig. 14, each peak P2 is located between 80 degrees and 100 degrees. That is, by reducing the size of opening 73, the measured temperature was reduced.

[0107] Reducing the size of the opening 73 increases the area where the extension 82 overlaps with the second surface 72 of the base 70. Increasing the area where the extension 82 overlaps with the second surface 72 of the base 70 makes it easier for heat to dissipate from the extension 82 through the base 70. If too much heat is dissipated through the base 70, there is a risk that the measured temperature when using the temperature measuring device 50 will be lower than when infrared rays are irradiated onto the workpiece W.

[0108] Therefore, as described above, it is preferable that the size of the opening 73 is larger than the size of the region A. For example, the area where the extension 82 and the opening 73 overlap is larger than the area where the extension 82 and the second surface 72 of the base 70 overlap. By forming such an opening 73, it is possible to obtain a measured temperature equivalent to that obtained when the workpiece W is irradiated with infrared rays.

[0109] 15 to 17 are diagrams showing the relationship between time and measured temperature. The horizontal axis of Fig. 15 to Fig. 17 represents time [s]. The vertical axis of Fig. 15 to Fig. 17 represents measured temperature [Deg / C]. Fig. 15 to Fig. 17 show a part of the temperature rising portion T1 and the temperature falling portion T2 of the measured temperature.

[0110] 15 and 16 show the measured temperatures when the temperature measuring device 50 was used, and Fig. 17 shows the measured temperatures when the workpiece W was used. Fig. 15 shows the case where the base 70 made of an aluminum alloy was used, and Fig. 16 shows the case where the base 70 made of PEEK was used.

[0111] Although not shown, the peaks of the measured temperatures shown in Figures 15 to 17 are substantially the same. Comparing the temperature rise portions T1 in Figures 15 to 17, it can be seen that the temperature rise portions T1 are the same.

[0112] 15 and 16, it can be seen that the temperature of the base 70 made of an aluminum alloy drops faster than that of the base 70 made of PEEK. From another perspective, the base 70 made of an aluminum alloy dissipates heat more easily than the base 70 made of PEEK.

[0113] When comparing Figures 15 and 16 with Figure 17 in terms of the relationship between time and measured temperature (temperature profile), it was found that by using a base 70 made of PEEK, a temperature profile equivalent to the temperature profile shown in Figure 17 could be obtained.

[0114] The temperature measuring device 50 configured as described above includes a base 70 having an opening 73, a main body portion 81 overlapping the opening 73, a support member 80 having a plurality of extension portions 82, and a thermocouple 51 having a measuring portion 55 inserted into the opening 73 and located in the main body portion 81.

[0115] For example, in order to measure the temperature at the irradiation position RP using the workpiece W, it is necessary to fix the measuring portion 55 of the thermocouple 51 between the pair of actuator mounting portions 13, 14, as described with reference to FIG.

[0116] In this case, the thermocouple 51 is brought into contact with the workpiece W, which may cause deformation of the workpiece W. Furthermore, as described with reference to FIG. 12, the measured temperature when the workpiece W is used is prone to variation, making it difficult to obtain a stable measured temperature.

[0117] In addition, a metal mesh can be used as a substitute for the workpiece W, but because the metal mesh has a large amount of heat dissipation, the measured temperature tends to be lower than when infrared rays are irradiated onto the workpiece W.

[0118] 12, the temperature measuring device 50 of this embodiment can obtain a measured temperature equivalent to that obtained when the workpiece W is used, and can also obtain a stable measured temperature with almost no variation in the measured temperature. Therefore, this embodiment can accurately measure the temperature of the infrared rays irradiated at the irradiation position RP using the thermocouple 51.

[0119] The measuring unit 55 of the thermocouple 51 in this embodiment is located in an opening 84 formed in the main body 81 of the support member 80. By providing the measuring unit 55 on the support member 80 in this way, when the thermocouple unit 60 is placed at the irradiation position RP, the measuring unit 55 can be easily placed in the center of the region A. This makes it possible to appropriately manage the positional relationship between the measuring unit 55 and the irradiation head 131, and to perform temperature measurement using the thermocouple 51 with greater accuracy.

[0120] In this embodiment, the extension portion 82 is formed in a tapered shape with a width that decreases as it moves away from the main body portion 81, so that the area where the extension portion 82 overlaps with the second surface 72 of the base 70 becomes smaller along the radial direction Dr.

[0121] This makes it difficult for heat to be dissipated from the extension 82 via the base 70. As a result, the temperature measuring device 50 of this embodiment can obtain a measured temperature equivalent to that obtained when the workpiece W is used, and therefore it is possible to perform temperature measurement using the thermocouple 51 with greater accuracy.

[0122] The support member 80 of this embodiment is formed from the same material as the material forming the metal base 24. The support member 80 of this embodiment has a thickness equivalent to that of the metal base 24. By forming the support member 80 in this manner, it becomes easier to obtain a measurement temperature equivalent to that when the workpiece W is used.

[0123] The manufacturing apparatus 100 for the suspension 10 according to this embodiment is equipped with a temperature measuring device 50. As described above, the temperature measuring device 50 can obtain a measured temperature equivalent to that obtained when using the workpiece W. By adjusting the control parameters of the infrared irradiating device 130 based on the measured temperature, it is possible to appropriately manage the infrared irradiation conditions of the infrared irradiating device 130.

[0124] If the infrared irradiation device 130 has properly controlled irradiation conditions, it is possible to properly control the state of the applied adhesive and accurately mount the piezoelectric elements 15, 16 at the predetermined positions on the actuator mounting portions 13, 14. As a result, it is possible to provide a suspension 10 with stable quality. In addition to the above, various other advantageous effects can be obtained from this embodiment.

[0125] Next, other embodiments will be described. In the other embodiments described below, the same components as those in the first embodiment described above will be assigned the same reference numerals as those in the first embodiment, and detailed descriptions thereof may be omitted or simplified.

[0126] [Second embodiment] Fig. 18 is a schematic plan view showing a temperature measuring device 50 according to this embodiment. Fig. 19 is a schematic cross-sectional view showing a portion of the temperature measuring device 50 taken along line XIX-XIX shown in Fig. 18. The temperature measuring device 50 according to this embodiment differs from the first embodiment in that the support member 80 has an opening 88 formed in the fixing portion 83.

[0127] The support member 80 has a plurality of openings 88 (third openings) that penetrate the fixing portions 83. In the example shown in FIG. 18 , one opening 88 is provided in each fixing portion 83. The plurality of openings 88 overlap with the second surface 72. The openings 88 are, for example, circular. Note that the shape of the openings 88 may be other shapes, such as a polygonal shape.

[0128] 19, the adhesive 34 has a fourth portion 341 located between the base 70 and the fixing portion 83, a fifth portion 342 located at the opening 88, and a sixth portion 343 located above the opening 88. The adhesive 34 does not necessarily have to have the sixth portion 343. In FIG. 18, the adhesives 33, 34 are indicated by dots.

[0129] The configuration of this embodiment can also achieve the same effects as in the first embodiment. In the temperature measuring device 50 according to this embodiment, the fixing portion 83 of the support member 80 has an opening 88. By forming the opening 88 in the fixing portion 83, when fixing the support member 80 to the base 70, the support member 80 can be overlapped and positioned on the base 70, and uncured adhesive 34 can be injected between the base 70 and the fixing portion 83 through the opening 88 from the direction opposite to the third direction D3.

[0130] This makes it difficult for the support member 80 to shift when fixing the support member 80 to the base 70. Since adhesive can be injected with the support member 80 overlapping the base 70, workability is improved when manufacturing the temperature measuring device 50.

[0131] [Third embodiment] 20 is a schematic plan view showing a temperature measuring device 50 according to this embodiment. The temperature measuring device 50 according to this embodiment differs from the first embodiment in that the support member 80 has a frame portion 89.

[0132] The support member 80 has a frame portion 89 connected to the multiple extension portions 82. The frame portion 89 is located outward in the radial direction Dr from the tip portion 86. The frame portion 89 overlaps the second surface 72. The frame portion 89 is formed in an annular shape in a plan view. The shape of the frame portion 89 is not limited to this example.

[0133] In this embodiment, the adhesive 34 is provided between the base 70 and the frame portion 89. For example, the adhesive is provided over the entire frame portion 89 in the circumferential direction Dθ. The adhesive 34 may be further provided between the base 70 and the tip portion 86.

[0134] In the temperature measuring device 50 according to this embodiment, the support member 80 has a frame portion 89. This makes the support member 80 less likely to deform and enables the support member 80 to be stably fixed to the base 70. The presence or absence of the frame portion 89 makes almost no difference in the temperature measured by the temperature measuring device 50, so the configuration of this embodiment can also achieve the same effects as the first embodiment.

[0135] [Fourth embodiment] 21 and 22 are schematic plan views showing a temperature measuring device 50 according to this embodiment. The temperature measuring device 50 according to this embodiment differs from the third embodiment in that the support member 80 has an opening 88 formed in a frame portion 89. The opening 88 according to this embodiment has the same shape as the opening 88 according to the second embodiment.

[0136] The support member 80 has a plurality of openings 88 penetrating a frame portion 89. The plurality of openings 88 overlap with the second surface 72. The openings 88 have, for example, a circular shape. The plurality of openings 88 are arranged in the frame portion 89 substantially evenly in the circumferential direction Dθ.

[0137] In the example shown in Fig. 21, three openings 88 are formed in the frame portion 89. In the example shown in Fig. 22, six openings 88 are formed in the frame portion 89. The positions of the multiple openings 88 in Figs. 21 and 22 are merely examples, and the present invention is not limited to these examples.

[0138] In this embodiment, the adhesive 34 is provided at equal intervals in the circumferential direction Dθ between the base 70 and the frame portion 89. The configuration of this embodiment is a combination of the configurations of the second embodiment and the fourth embodiment. The configuration of this embodiment also provides the same effects as those of the second and fourth embodiments described above.

[0139] In implementing the invention disclosed in the above embodiments, it goes without saying that the specific configuration of the suspension, as well as the specific aspects of the elements that make up the actuator mounting portion, such as the piezoelectric element and adhesive, can be changed in various ways. Furthermore, the conveying device, coating device, infrared irradiation device, and element supply device can also be implemented in various ways.

[0140] In this embodiment, the measuring portion 55 of the thermocouple 51 is fixed to the opening 84 with the adhesive 33, but the measuring portion 55 may also be fixed to the opening 84 with solder. The extending portion 82 is formed in a tapered shape, but may also be formed to have a constant width along the radial direction Dr. [Explanation of symbols]

[0141] 1...disk device, 10...suspension, 13, 14...actuator mounting portion, 15, 16...piezoelectric element, 50...temperature measuring device, 51...thermocouple, 52...measurement module, 55...measurement portion, 60...thermocouple unit, 61...fixed base, 63...opening, 70...base, 71...first surface, 72...second surface, 73...opening (first opening), 80...support member, 81...main body portion, 82...extension portion, 84...opening (second opening), 85...base portion, 86...tip portion, 88...opening (third opening), 89...frame portion, 100...manufacturing apparatus, 110...transport device, 120...coating device, 130...infrared irradiation device, 140...element supply device, 160...control device, A...area, RP...irradiation position, W...work.

Claims

1. a base having a first surface, a second surface opposite the first surface, and a first opening penetrating the first surface and the second surface; a support member provided on the second surface side and including a main body portion overlapping with the first opening, and a plurality of extension portions extending from the main body portion along the second surface and overlapping with the second surface; a thermocouple inserted into the first opening and having a measurement portion located in the body portion; Temperature measuring device.

2. the support member has a second opening that overlaps the center of the first opening and penetrates the main body portion; The measurement unit is located at the second opening.

2. The temperature measuring device according to claim 1.

3. The extension portion has a base portion connected to the main body portion and a tip portion overlapping the second surface and having a width smaller than a width of the base portion. The temperature measuring device according to claim 1 .

4. the support member is connected to the plurality of extension portions and further includes a frame portion overlapping the second surface. The temperature measuring device according to claim 1 .

5. further comprising an adhesive that bonds the base and the support member; the support member overlaps the second surface and further includes a plurality of third openings extending through the support member; the adhesive is located in the third opening; The temperature measuring device according to claim 1 .

6. A manufacturing apparatus for a disk drive suspension having an actuator mounting portion on which a piezoelectric element is mounted, an application device that applies adhesive to the actuator mounting portion; an infrared irradiation device that heats the adhesive by irradiating the applied adhesive with infrared rays; The temperature measuring device according to claim 1 , which measures a temperature at a position irradiated with the infrared rays; and a control device that adjusts the infrared irradiation conditions based on the temperature measured by the temperature measuring device. Manufacturing equipment for disk drive suspensions.

7. the disk drive suspension has a metal base located on the actuator mounting portion, The material forming the support member is the same as the material forming the metal base.

7. An apparatus for manufacturing a disk drive suspension according to claim 6.

8. the disk drive suspension has a metal base located on the actuator mounting portion, The thickness of the support member is equal to the thickness of the metal base.

7. An apparatus for manufacturing a disk drive suspension according to claim 6.

9. A method for manufacturing a suspension for a disk drive having an actuator mounting portion on which a piezoelectric element is mounted, comprising the steps of: a temperature measuring device according to any one of claims 1 to 5, disposed at a position where infrared rays are irradiated onto the adhesive applied to the actuator mounting portion; irradiating the temperature measuring device with the infrared rays; measuring the temperature at the irradiation position by the temperature measuring device; adjusting the infrared irradiation conditions based on the temperature measured by the temperature measuring device; applying the adhesive to the actuator mounting portion; irradiating the adhesive applied to the actuator mounting portion with the infrared rays; A method for manufacturing a suspension for a disk drive.

Images