Semi-open inverter brick structure for electric drive system, controller system and vehicle

Abstract

The utility model relates to a semi-open type inversion brick structure for an electric drive system, a controller system and a vehicle. The structure comprises a control mainboard, an IGBT module, a heat radiation substrate, a film capacitor, an EMC filtering assembly and a semi-open type housing. One side of the heat dissipation substrate is provided with a heat dissipation water tank, the heat dissipation water tank is connected with a water inlet and a water outlet, the IGBT module is installed in the heat dissipation water tank, the control mainboard is located at the upper end of the IGBT module, the thin film capacitor and the EMC filtering assembly are installed on the side, away from the heat dissipation water tank, of the heat dissipation substrate, and the heat dissipation substrate is installed in the semi-open type shell; a cooling pipeline is arranged in the semi-open type shell, one end of the cooling pipeline is connected with a water inlet pipe, the other end of the cooling pipeline is connected with a water inlet, and the side, away from the heat dissipation water tank, of the heat dissipation substrate is close to the cooling pipeline. Compared with the prior art, the power module has the advantages of being convenient to assemble, good in heat dissipation and cooling effect, high in filtering performance and safety and the like.

Description

Technical Field

[0001] This utility model relates to the field of controller structure, and in particular to a semi-open inverter brick structure for electric drive systems, a controller system, and a vehicle. Background Technology

[0002] With increasing global attention to environmental protection and sustainable development, new energy vehicles, as a significant alternative to traditional gasoline-powered vehicles, have experienced rapid growth in recent years. Among the core technologies of new energy vehicles, the motor controller plays a crucial role, directly impacting the vehicle's power, economy, and reliability. Inverter power bricks, as an innovative form of motor controller, are gradually becoming a focus of industry attention and are highly favored by OEMs due to their advantages such as high power density, high interface compatibility, simple structure, and low cost.

[0003] Currently, the common practice in the industry is to mount the supporting capacitors, power modules, and driver circuit boards onto a heat sink aluminum plate. This means the inverter brick can only function as a standalone power component, unable to accommodate external interfaces such as high-voltage connectors, low-voltage connectors, and water pipe connectors. Vehicle manufacturers still need to develop a housing for the inverter brick, increasing assembly complexity and hindering production speed. Furthermore, the existing structure concentrates power components on the heat sink, relying solely on it for cooling, resulting in poor heat dissipation and impacting component performance. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art, which has separate power components installed on a heat sink, resulting in poor heat dissipation and affecting the performance of the power components. This invention provides a semi-open inverter brick structure, controller system, and vehicle for electric drive systems.

[0005] The objective of this utility model can be achieved through the following technical solutions:

[0006] This solution provides a semi-open inverter brick structure for an electric drive system, including a control motherboard, IGBT module, heat dissipation substrate, thin film capacitor, EMC filter component and semi-open enclosure;

[0007] A heat dissipation water tank is provided on one side of the heat dissipation substrate. The IGBT module is installed in the heat dissipation water tank. The control motherboard is located on top of the IGBT module. The thin film capacitor and EMC filter assembly are installed on the side of the heat dissipation substrate away from the heat dissipation water tank. The heat dissipation substrate is installed in a semi-open housing. A cooling pipe is provided in the semi-open housing. One end of the cooling pipe is connected to a water inlet pipe, and the other end is connected to the water inlet of the heat dissipation water tank. The side of the heat dissipation substrate away from the heat dissipation water tank is close to the cooling pipe.

[0008] Preferably, the EMC filtering assembly includes an adapter copper bus, a filter bracket, a DC bus copper bus, a noise-suppressing magnetic ring, a safety capacitor, a filter board, and a DC current sensor;

[0009] The adapter copper busbar is fixed on the filter bracket and electrically connected to the DC bus copper busbar. The noise suppression magnetic ring is sleeved on the DC bus copper busbar. The safety capacitor is fixed on the filter board. The noise suppression magnetic ring and the safety capacitor are respectively installed on the filter bracket. The DC current sensor is welded and fixed on the adapter copper busbar.

[0010] Preferably, there are multiple noise-suppressing magnetic rings, and the filter bracket is provided with arrayed noise-suppressing magnetic ring mounting slots, in which the noise-suppressing magnetic rings are installed.

[0011] Preferably, an AC current sensor is provided on the heat dissipation substrate, and the output terminal of the IGBT module passes through the AC current sensor.

[0012] Preferably, the heat dissipation substrate has a first water temperature detection hole and a second water temperature detection hole on both sides of the heat dissipation water tank. The first water temperature detection hole is arranged adjacent to the water outlet of the heat dissipation substrate, and the second water temperature detection hole is arranged adjacent to the water inlet.

[0013] Temperature sensors are respectively installed in the first and second water temperature detection holes. The temperature sensors are welded and fixed on the control motherboard. Organic silicone is installed in the first and second water temperature detection holes.

[0014] Preferably, the heat dissipation substrate has an L-shaped structure, and a filter mounting channel is provided on the side of the heat dissipation substrate away from the heat dissipation water tank. The EMC filter component is installed in the filter mounting channel, and the water inlet is arranged adjacent to the filter mounting channel.

[0015] Preferably, the semi-open housing is provided with a high-pressure connector and a low-pressure connector, the low-pressure connector being located on the side of the semi-open housing away from the water inlet pipe, and the high-pressure connector being located at the bottom end of the semi-open housing.

[0016] Preferably, the heat dissipation substrate is further provided with a three-phase output component on the side near the heat dissipation water tank. The three-phase output component is connected to the IGBT module, and a magnetic ring is provided inside the three-phase output component.

[0017] This solution also provides a controller system, including at least one of the above-mentioned semi-open inverter brick structures for electric drive systems.

[0018] This solution also provides a vehicle that includes the aforementioned controller system.

[0019] Compared with the prior art, the present invention has the following advantages:

[0020] (1) In this solution, the power components adopt a multi-layer stacked structure. The control motherboard and IGBT module are installed on the upper side of the heat dissipation substrate, and the film capacitor and EMC filter components are installed on the lower side. The heat dissipation substrate is installed inside a semi-open shell with internal cooling pipes, so that the cooling pipes are connected to the heat dissipation water tank on the heat dissipation substrate. The coolant flows through the cooling pipes in the bottom semi-open shell and the heat dissipation water tank of the middle heat dissipation substrate, thereby achieving three-dimensional heat dissipation of the lower capacitor and the upper IGBT module. Compared with the existing method of only using heat sinks to dissipate heat from the power components, the heat dissipation efficiency is improved.

[0021] (2) This solution provides a high-efficiency EMC filter assembly suitable for inverter bricks. The EMC filter assembly integrates a DC bus copper bus, filter board, safety capacitor, noise suppression magnetic ring, filter bracket, adapter copper bus, and DC current sensor. The multi-stage magnetic ring matching filter board can achieve higher EMC performance. At the same time, the internal DC current sensor can effectively detect the current value at the DC end and avoid damage to power devices by abnormal current.

[0022] (3) The high-performance power module of this solution integrates a DC current sensor, an AC current sensor, and a temperature sensor. The status of the power module can be monitored through dual channels of electrical performance and water temperature control, thereby improving the stability and reliability of the inverter system.

[0023] (4) In this solution, the water inlet pipe, high-voltage connector and low-voltage connector are integrated on the semi-open shell. The inverter module is fixed inside the semi-open shell, forming a semi-open inverter brick structure with a bottom shell, connector and water pipe head. It has the characteristics of high integration, good heat dissipation performance, few parts and low cost of inverter brick, and also has the mechanical and electrical interfaces and part of the shell of traditional inverter, which facilitates the assembly of the whole vehicle.

[0024] (5) The three-phase output component in this solution is equipped with a magnetic ring, which can effectively suppress the generation of motor shaft current, reduce the occurrence of bearing electro-corrosion, and extend the service life of the three-phase output component. Attached Figure Description

[0025] Figure 1 An exploded structural diagram of the semi-open inverter brick structure provided by this utility model;

[0026] Figure 2 A top view of the power module provided by this utility model;

[0027] Figure 3 A bottom view of the power module provided by this utility model;

[0028] Figure 4 A top view of the heat dissipation substrate provided by this utility model;

[0029] Figure 5 A schematic diagram of the back structure of the heat dissipation substrate provided by this utility model;

[0030] Figure 6 An exploded view of the EMC filter component provided by this utility model;

[0031] Figure 7 This is a schematic diagram of the structure of the three-phase output component provided by this utility model;

[0032] In the diagram: 1. IGBT module; 2. Heat sink substrate; 3. Film capacitor; 4. EMC filter assembly; 5. Semi-open housing; 6. Control motherboard; 7. Power module; 8. Temperature sensor; 9. Three-phase output assembly; 21. Cooling water tank; 22. Water inlet; 23. AC current sensor; 24. First water temperature detection hole; 25. Second water temperature detection hole; 26. Water outlet; 27. Filter mounting channel; 41. Filter board; 42. Adapter copper busbar; 43. Filter bracket; 44. DC bus copper busbar; 45. Noise suppression magnetic ring; 46. Safety capacitor; 47. DC current sensor; 51. Water outlet; 52. High voltage connector; 53. Low voltage connector; 91. Magnetic ring. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0035] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0036] In the description of this utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0037] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0038] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0039] Example 1

[0040] like Figures 1 to 5 As shown, this embodiment provides a semi-open inverter brick structure for an electric drive system, including a control motherboard, an IGBT module 1, a heat dissipation substrate 2, a thin film capacitor 3, an EMC filter component 4, and a semi-open housing 5.

[0041] A heat dissipation substrate 2 has a heat dissipation water tank 21 on one side. The IGBT module 1 is installed in the heat dissipation water tank 21. The control motherboard is located on the top of the IGBT module 1. The thin film capacitor 3 and the EMC filter assembly 4 are installed on the side of the heat dissipation substrate 2 away from the heat dissipation water tank 21. The heat dissipation substrate 2 is installed in a semi-open shell 5. A cooling pipe is provided in the semi-open shell 5. One end of the cooling pipe is connected to a water inlet pipe 51, and the other end is connected to the water inlet 22 of the heat dissipation water tank 21. The side of the heat dissipation substrate 2 away from the heat dissipation water tank 21 is close to the cooling pipe.

[0042] The power components employ a multi-layer stacked structure. A control motherboard and IGBT module 1 are mounted on the upper side of the heat dissipation substrate 2, while a thin-film capacitor 3 and EMC filter assembly 4 are mounted on the lower side. The heat dissipation substrate 2 is housed within a semi-open housing 5 containing internal cooling pipes, which are connected to a cooling water tank 21 on the heat dissipation substrate 2. Coolant flows through the cooling pipes in the bottom semi-open housing 5 and the cooling water tank 21 of the middle heat dissipation substrate, achieving three-dimensional heat dissipation for the lower capacitor and upper IGBT module. Compared to existing methods that only use heat sinks to dissipate heat from the power components, this significantly improves heat dissipation efficiency.

[0043] Preferred implementation methods, such as Figure 6 As shown, the EMC filter assembly 4 includes a copper busbar 42, a filter bracket 43, a DC busbar copper busbar 44, a noise-suppressing magnetic ring 45, a safety capacitor 46, and a filter board 41.

[0044] The adapter copper busbar 42 is fixed on the filter bracket 43. The adapter copper busbar 42 is electrically connected to the DC bus copper busbar 44. The noise suppression magnetic ring 45 is sleeved on the DC bus copper busbar 44. The safety capacitor 46 is fixed on the filter board 41. The noise suppression magnetic ring 45 and the safety capacitor 46 are respectively installed on the filter bracket 43.

[0045] Furthermore, the EMC filter assembly 4 also includes a DC current sensor 47, which is soldered and fixed to the adapter copper busbar 42. The DC current sensor inside the EMC filter assembly 4 can effectively detect the current value at the DC end, preventing damage to power devices from abnormal current.

[0046] Furthermore, the noise-suppressing magnetic rings 45 are multiple, and the filter bracket 43 is provided with arrayed noise-suppressing magnetic ring mounting slots, in which the noise-suppressing magnetic rings 45 are installed. This multi-stage magnetic ring matching filter board achieves higher EMC performance.

[0047] In this embodiment, the EMC filtering assembly includes a DC bus copper bus, a filter board, a safety capacitor, a noise-suppressing magnetic ring, a filter bracket, a transition copper bus, and a DC current sensor. The bus copper bus passes through three noise-suppressing magnetic rings and is fixed to the filter bracket with epoxy resin. The safety capacitor is fixed to the bottom of the filter board by soldering. The filter board is fixed directly above the filter bracket and is electrically connected to the DC bus copper bus. A DC current sensor is connected in series on the transition copper bus and is electrically connected to the DC bus copper bus by bolts.

[0048] Among them, such as Figure 2 and Figure 3As shown, the power module 7, consisting of a PCBA driver circuit board (i.e., control motherboard 6), a temperature sensor, a three-phase output component, an IGBT module, a heat-dissipating aluminum substrate, an EMC filter component, and a film capacitor, is fixed in a semi-open housing. The power module 7 is arranged in a stacked configuration, with the heat-dissipating aluminum substrate in the middle layer. The upper layer of the heat-dissipating aluminum substrate houses the IGBT module, the three-phase output component, and the PCBA driver circuit board, while the lower layer houses the film capacitor and the EMC filter component. On the upper layer of the heat-dissipating aluminum substrate, the IGBT module is positioned in the middle, the three-phase output component is located to one side of the IGBT module, and an AC current sensor is positioned between the IGBT module and the three-phase output component. The output terminals of the IGBT module pass through the AC current sensor and are electrically connected to the three-phase output component. On the lower layer of the heat-dissipating aluminum substrate, the film capacitor is located on the left side, and the EMC filter component is located on the right side. A water inlet is located between the film capacitor and the EMC filter component, connecting to the water inlet pipe of the semi-open housing.

[0049] In this embodiment, an AC current sensor 23 is provided on the heat dissipation substrate 2, and the output terminal of the IGBT module 1 passes through the AC current sensor 23. A first water temperature detection hole 24 and a second water temperature detection hole 25 are provided on both sides of the heat dissipation water tank 21 on the heat dissipation substrate 2. The first water temperature detection hole 24 is adjacent to the outlet 26 of the heat dissipation substrate 2, and the second water temperature detection hole 25 is adjacent to the inlet 22. A filter mounting channel 27 is provided on the back of the heat dissipation substrate 2 near the inlet 22 for mounting the EMC filter component 4. Temperature sensors 8 are respectively installed in the first water temperature detection hole 24 and the second water temperature detection hole 25. The temperature sensors 8 are soldered and fixed to the control motherboard, and silicone sealant is provided in the first water temperature detection hole 24 and the second water temperature detection hole 25. The dual-channel monitoring of the power module's status through electrical performance and water temperature control improves the stability and reliability of the inverter system. During operation, coolant enters the heat dissipation substrate from the inlet, passes through the heat dissipation water tank, and flows out from the outlet, thus cooling the IGBT module.

[0050] In this embodiment, as Figure 1 As shown, the semi-open housing 5 is provided with a high-pressure connector 52 and a low-pressure connector 53. The low-pressure connector 53 is located on the side of the semi-open housing 5 away from the water inlet pipe 51, and the high-pressure connector 52 is located at the bottom of the semi-open housing 5.

[0051] Optionally, such as Figure 7 As shown, a three-phase output component 9 is also provided on the side of the heat dissipation substrate 2 near the heat dissipation tank 21. The three-phase output component 9 is connected to the IGBT module 1, and a magnetic ring 91 is provided inside the three-phase output component. The magnetic ring 91 can effectively suppress the generation of motor shaft current and reduce the occurrence of bearing electro-corrosion.

[0052] In conjunction with the above preferred embodiments, such as Figures 1 to 7 As shown, this embodiment also provides specific methods for fixing and installing each component:

[0053] First, install the semi-open housing. Install the inlet pipe to the side of the housing using bolts, then secure the low-pressure connector to the other side of the housing using bolts, and finally secure the high-pressure connector to the bottom area of ​​the housing using bolts.

[0054] Secondly, EMC filtering components. For example... Figure 5 As shown, the safety capacitor is fixed to the filter board by soldering; then, the DC bus copper busbar is passed through three noise-suppressing magnetic rings. The DC bus copper busbar and noise-suppressing magnetic rings are then placed together in the filter bracket and fixed with epoxy potting. Next, silicone is pre-coated onto the shell of the safety capacitor at the bottom of the filter board, and the filter board and safety capacitor are placed on top of the filter bracket, with the safety capacitor falling into the pre-reserved mounting slot on the filter bracket. The filter board is then fixed with bolts. Finally, the DC current sensor is laser-welded to the adapter copper busbar, and the adapter is fixed to the bottom of the filter bracket with bolts. The adapter copper busbar is then electrically connected to the DC bus copper busbar with bolts.

[0055] Next, assemble the power module; first, fix the film capacitor to the bottom of the heat sink substrate with bolts. After placing a sealing ring on the heat sink on the upper surface of the heat sink substrate, lock the IGBT module onto the heat sink substrate. Electrically connect the output terminals of the film capacitor to the input terminals of the IGBT module using laser welding. Next, pass the AC current sensor through the output terminals of the IGBT module, install the three-phase output assembly on the edge of the heat sink substrate, and electrically connect the three-phase output assembly to the IGBT module with bolts. Then, solder the temperature sensor to the PCBA driver circuit board, and pre-apply silicone to the water temperature detection holes on the heat sink substrate. Next, install the PCBA driver circuit board on top of the IGBT module, and electrically connect the PCBA circuit board to the IGBT module using soldering. Finally, install the EMC filter assembly into the filter mounting channel under the aluminum-based heat sink, and electrically connect the output terminals of the EMC filter to the input terminals of the film capacitor.

[0056] Finally, assemble the semi-open inverter brick. Place the power module into the semi-open housing, mechanically connect the power components to the semi-open housing with bolts, and connect the water channels inside the bottom housing to the water inlet of the heat sink plate;

[0057] This embodiment also provides a controller system, including the semi-open inverter brick structure for the electric drive system described above.

[0058] This embodiment also provides a vehicle including the controller system described above.

[0059] The preferred embodiments of this utility model have been described in detail above. It should be understood that those skilled in the art can make numerous modifications and variations based on the concept of this utility model without creative effort. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of this utility model through logical analysis, reasoning, or limited experimentation on the basis of existing technology should be within the scope of protection defined by the claims.

Claims

1. A semi-open inverter brick structure for an electric drive system, characterized in that, It includes an IGBT module (1), a heat dissipation substrate (2), a thin film capacitor (3), an EMC filter assembly (4), a semi-open housing (5), and a control motherboard (6); A heat dissipation water tank (21) is provided on one side of the heat dissipation substrate (2). The heat dissipation water tank (21) is connected to an inlet (22) and an outlet (26). The IGBT module (1) is installed in the heat dissipation water tank (21). The control motherboard (6) is located on the upper end of the IGBT module (1). The thin film capacitor (3) and the EMC filter assembly (4) are installed on the side of the heat dissipation substrate (2) away from the heat dissipation water tank (21). The heat dissipation substrate (2) is installed in a semi-open shell (5). A cooling pipe is provided in the semi-open shell (5). One end of the cooling pipe is connected to an inlet pipe (51), and the other end is connected to an inlet (22). The side of the heat dissipation substrate (2) away from the heat dissipation water tank (21) is close to the cooling pipe.

2. The semi-open inverter brick structure for an electric drive system according to claim 1, characterized in that, The EMC filter assembly (4) includes a copper busbar (42), a filter bracket (43), a DC busbar (44), a noise-suppressing magnetic ring (45), a safety capacitor (46), a filter board (41), and a DC current sensor (47). The adapter copper bus (42) is fixed on the filter bracket (43). The adapter copper bus (42) is electrically connected to the DC bus copper bus (44). The noise suppression magnetic ring (45) is sleeved on the DC bus copper bus (44). The safety capacitor (46) is fixed on the filter plate (41). The noise suppression magnetic ring (45) and the safety capacitor (46) are respectively installed on the filter bracket (43). The DC current sensor (47) is welded and fixed on the adapter copper bus (42).

3. The semi-open inverter brick structure for an electric drive system according to claim 2, characterized in that, The number of noise suppression magnetic rings (45) is multiple, and the filter bracket (43) is provided with an array of noise suppression magnetic ring mounting slots, and the noise suppression magnetic rings (45) are installed in the noise suppression magnetic ring mounting slots.

4. The semi-open inverter brick structure for an electric drive system according to claim 1, characterized in that, An AC current sensor (23) is provided on the heat dissipation substrate (2), and the output terminal of the IGBT module (1) passes through the AC current sensor (23).

5. The semi-open inverter brick structure for an electric drive system according to claim 1, characterized in that, The heat dissipation substrate (2) has a first water temperature detection hole (24) and a second water temperature detection hole (25) on both sides of the heat dissipation water tank (21). The first water temperature detection hole (24) is adjacent to the water outlet (26) of the heat dissipation substrate (2), and the second water temperature detection hole (25) is adjacent to the water inlet (22). Temperature sensors (8) are respectively provided in the first water temperature detection hole (24) and the second water temperature detection hole (25). The temperature sensors (8) are welded and fixed on the control motherboard. Organic silicone is provided in the first water temperature detection hole (24) and the second water temperature detection hole (25).

6. The semi-open inverter brick structure for an electric drive system according to claim 1, characterized in that, The heat dissipation substrate (2) has an L-shaped structure. A filter installation channel (27) is provided on the side of the heat dissipation substrate (2) away from the heat dissipation water tank (21). The EMC filter component (4) is installed in the filter installation channel (27). The water inlet (22) is arranged adjacent to the filter installation channel (27).

7. The semi-open inverter brick structure for an electric drive system according to claim 1, characterized in that, The semi-open housing (5) is provided with a high-voltage connector (52) and a low-voltage connector (53). The low-voltage connector (53) is located on the side of the semi-open housing (5) away from the water inlet pipe (51), and the high-voltage connector (52) is located at the bottom end of the semi-open housing (5).

8. The semi-open inverter brick structure for an electric drive system according to claim 1, characterized in that, The heat dissipation substrate (2) is also provided with a three-phase output component (9) on the side near the heat dissipation tank (21). The three-phase output component (9) is connected to the IGBT module (1). The three-phase output component is provided with a magnetic ring (91) inside.

9. A controller system, characterized in that, It includes at least one semi-open inverter brick structure for an electric drive system as described in any one of claims 1-8.

10. A vehicle, characterized in that, Includes the controller system as described in claim 9.

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