Machine tool and method for cleaning the inside of the machining chamber of the machine tool

Abstract

To provide a machine tool capable of more efficiently cleaning chips. [Solution] The machine tool is equipped with an imaging means for imaging the inside of the machining chamber of the machine tool that processes the workpiece, a determination means for determining the accumulation state of workpiece chips inside the machining chamber based on the image obtained by imaging and first and second determination criteria that are different from each other, and a cleaning means for cleaning the inside of the machining chamber with coolant based on the determined accumulation state.

Description

[Technical Field]

[0001] The present disclosure relates to a machine tool and a method for cleaning the inside of a machining chamber of the machine tool. [Background technology]

[0002] For example, Patent Publication No. 2021-102235 (Patent Document 1) discloses a machine tool that includes an imaging unit, a chip recognition unit that automatically recognizes chips based on images captured by the imaging unit and detects the location where the chips have accumulated, and a coolant discharge unit that, when a detection signal is input from the chip recognition unit, discharges coolant along a predetermined path toward the location where the chips have accumulated. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-102235 Summary of the Invention [Problem to be solved by the invention]

[0004] The machine tool of Patent Document 1 above recognizes the position where chips are piled up, but is not configured to remove the chips taking into consideration the state of accumulation at that position.

[0005] The present disclosure provides a machine tool and a method for cleaning the inside of a machining chamber of a machine tool that can more efficiently remove chips by accurately determining the state of chip accumulation in the machining chamber. [Means for solving the problem]

[0006] According to one aspect of the present disclosure, a machine tool includes an imaging means for imaging the inside of a machining chamber of the machine tool that processes a workpiece, a determination means for determining a first accumulation state of workpiece chips within the machining chamber based on the image obtained by imaging and first and second determination criteria that are different from each other, and a cleaning means for cleaning the inside of the machining chamber with coolant based on the determined first accumulation state.

[0007] According to this configuration, the accumulation state of chips in the machining chamber can be determined more accurately than when a single determination criterion is used, and therefore, according to this configuration, chips can be removed more efficiently.

[0008] Preferably, the first accumulation state is an accumulation state of chips in a first region among the plurality of regions in the machining chamber. The cleaning means cleans the first region with coolant based on the first accumulation state.

[0009] This configuration makes it possible to more accurately determine the state of chip accumulation in the first region, which is a portion of the machining chamber, compared to when a single determination criterion is used, thereby enabling more efficient removal of chips from the portion of the machining chamber.

[0010] Preferably, the first criterion is a criterion for determining whether chips have accumulated over the entire first region, and the second criterion is a criterion for determining whether chips have accumulated locally in the first region.

[0011] With this configuration, the state of chip accumulation in the first region can be determined more accurately than with a configuration that determines only whether chips have accumulated throughout the entire first region or only whether chips have accumulated locally in the first region.

[0012] Preferably, the determining means determines the level of the first accumulation state, and the cleaning means cleans the first area on condition that the first accumulation state is equal to or greater than the first level.

[0013] With this configuration, the first region is not cleaned when the chip accumulation level is below the first level, which reduces power consumption compared to a configuration in which cleaning is performed even when the chip accumulation level is below the first level.

[0014] Preferably, when the first accumulation state is a second level where more chips have accumulated than at the first level, the cleaning means ejects coolant into the first region at a higher pressure or at a higher flow rate than when the first accumulation state is at the first level.

[0015] With this configuration, coolant is discharged at a higher pressure or at a higher flow rate to the area where the accumulation level is the second level than to the area where the accumulation level is the first level, which makes it possible to remove chips in the area where the accumulation level is the second level with a higher degree of accuracy than when coolant is discharged to the area where the accumulation level is the second level at the same pressure as that of the area where the accumulation level is the first level.

[0016] Preferably, the determining means divides the image of the first region of the image into a plurality of element regions, obtains the second accumulation state of the chips in each element region, and determines the level of the first accumulation state by weighting each element region according to the second accumulation state of the chips.

[0017] With this configuration, it is possible to determine whether chips are deposited over the entire first region or locally.

[0018] Preferably, the determining unit further determines a first accumulation state of the workpiece in a second region of the plurality of regions based on the image and the first and second determination criteria, and the cleaning unit cleans the second region with coolant based on the determined first accumulation state in the second region.

[0019] This configuration allows the accumulation state of chips in the first and second regions in the machining chamber to be determined with high accuracy, and therefore allows the chips in the first and second regions in the machining chamber to be removed more efficiently.

[0020] According to another aspect of the present disclosure, a method for cleaning the inside of a machining chamber of a machine tool includes the steps of: capturing an image of the inside of the machining chamber of the machine tool that processes a workpiece; determining the accumulation state of workpiece chips in the machining chamber based on the image obtained by capturing the image and first and second judgment criteria; and cleaning the inside of the machining chamber with coolant based on the determined accumulation state.

[0021] According to this method, the accumulation state of chips in the machining chamber can be determined more accurately than when a single determination criterion is used, and therefore, according to this method, chips can be removed more efficiently. [Effects of the Invention]

[0022] According to the present disclosure, chips can be removed more efficiently. [Brief explanation of the drawings]

[0023] [Figure 1] FIG. 1 is a perspective view showing a machine tool. [Figure 2] FIG. 2 is a top view showing the inside of a machining chamber of a machine tool. [Figure 3] FIG. 2 is a diagram for explaining the configuration of a device for removing chips from a workpiece. [Figure 4] FIG. 2 is a diagram illustrating multiple regions within a processing chamber. [Figure 5] 5 is a diagram for explaining the areas to be cleaned by each nozzle among the multiple areas shown in FIG. 4. FIG. [Figure 6] FIG. 10 is a diagram showing an example of a state in which chips are piled up. [Figure 7] FIG. 7 is a diagram for explaining the level determination of the area in the case of FIG. 6. [Figure 8]It is a diagram showing another example of the chip accumulation state. [Figure 9] It is a diagram for explaining the level determination of the region in the case of FIG. 8. [Figure 10] It is a diagram showing still another example of the chip accumulation state. [Figure 11] It is a diagram for explaining the level determination of the region in the case of FIG. 10. [Figure 12] It is a block diagram for explaining the functional configuration of the machine tool. [Figure 13] It is a flowchart for explaining the flow of processing executed by the machine tool. [Figure 14] It is a flowchart showing the details of the processing in step S2 of FIG. 13. [Figure 15] It is a flowchart showing the details of the processing in step S3 of FIG. 13.

Modes for Carrying Out the Invention

[0024] Hereinafter, each embodiment according to the present invention will be described with reference to the drawings. In the following description, the same parts and components are denoted by the same reference numerals. Their names and functions are also the same. Therefore, detailed descriptions thereof will not be repeated.

[0025] <A: Schematic Configuration of Machine Tool> FIG. 1 is a perspective view showing the machine tool in the present embodiment. FIG. 2 is a top view showing the machining chamber (machining area) of the machine tool in FIG. 1.

[0026] 1 and 2, machine tool 100 is a machining center that machines a workpiece by bringing a rotating tool 90 into contact with the workpiece. More specifically, machine tool 100 is a machining center in which a central axis of rotation 101 of the tool extends horizontally. Specifically, machine tool 100 is a five-axis machining machine with a rotating and tilting table. However, machine tool 100 is not limited to a five-axis machining machine. Machine tool 100 is an NC (Numerical Control) machine tool in which various operations for machining a workpiece are automated by computer numerical control.

[0027] The figure shows a Z axis that is parallel to the horizontal direction and parallel to the rotation center axis 101 of the tool 90, an X axis that is parallel to the horizontal direction and perpendicular to the rotation center axis 101 of the tool 90, and a Y axis that is parallel to the vertical direction.

[0028] The machine tool 100 has a tool spindle 21. The tool spindle 21 is motor-driven and can rotate about a rotation center axis 101 that is parallel to the Z axis. The tool spindle 21 has a built-in clamping mechanism for detachably holding a tool. The tool spindle 21 rotates a tool 90, such as a drill, reamer, or milling cutter, about the rotation center axis 101. The tool spindle 21 can move in the X-axis and Y-axis directions by various feed mechanisms, guide mechanisms, servo motors, etc.

[0029] Machine tool 100 further has a table 41. Table 41 is a device for fixing a workpiece. A pallet 42 is detachably attached to table 41. Table 41 is movable in the Z-axis direction by various feed mechanisms, guide mechanisms, servo motors, etc. Table 41 is rotatable around an A-axis (an axis that rotates around the X-axis), not shown. A mounting portion of table 41 on which pallet 42 is mounted is rotatable around a C-axis, not shown.

[0030] The machine tool 100 further has an automatic pallet changer (APC) 50. The automatic pallet changer 50 changes the pallet 42 between the machining chamber interior 110 and the setup station 120. More specifically, the automatic pallet changer 50 has an APC arm 52. The APC arm 52 switches the pallet 42.

[0031] The machining chamber 110 is a space where the workpiece is machined. The tool spindle 21 and the table 41 are arranged in the machining chamber 110. The machine tool 100 further has an automatic tool changer (not shown). The automatic tool changer changes the tool 90 attached to the tool spindle 21.

[0032] The setup station 120 is a space where workpieces are attached to the pallet 42. The setup station 120 is provided with a pallet placement table (not shown) on which the pallet 42 is placed.

[0033] Machine tool 100 further has an operation panel 81. Operation panel 81 is a general-purpose computer. Operation panel 81 has an upper panel 82 and a lower panel 83. Upper panel 82 includes a touch screen that displays a manual or various application screens, and is operated when using an application. Lower panel 83 includes a touch screen that displays the operating status of machine tool 100 or the machining status of a workpiece, and is operated when operating machine tool 100, and operation units such as buttons or switches that are operated when operating machine tool 100.

[0034] The machine tool 100 further has a cover body 31. The cover body 31 defines a machining chamber interior 110 and also forms the outer appearance of the machine tool 100. The machining chamber 110 is sealed by the cover body 31 so that foreign matter such as chips and coolant resulting from workpiece machining does not leak out from the machining chamber 110.

[0035] The cover body 31 has covers 32, 36, 37, 38, 65, and 66, telescopic covers 34, 62, and 63, a door 35, an ATC shutter 33, a protective cover 61, and a ceiling cover 39. The covers 32 and 38 and the telescopic covers 34 and 63 are erected. The cover 32 and the ATC shutter 33 are arranged opposite each other in the X-axis direction. The ceiling cover 39 is arranged on the ceiling of the processing chamber 110.

[0036] The door 35 is disposed in an opening provided in the cover 32. The door 35 is capable of sliding to open and close the opening provided in the cover 32. The ATC shutter 33 is disposed in an opening provided in the cover 38. The ATC shutter 33 is capable of sliding to open and close the opening provided in the cover 38. The automatic tool changer is disposed on the opposite side of the machining chamber 110 across the ATC shutter 33.

[0037] The telescopic cover is configured to be deformable in accordance with the movement of the tool spindle 21 in the X-axis direction and the Y-axis direction. The tool spindle 21 protrudes from the telescopic cover in the Z-axis direction.

[0038] The covers 65 and 66 are arranged on the cover 38 side. The cover 66 is located above the cover 65. The covers 65 and 66 are continuous. The covers 65 and 66 are inclined downward toward the conveyor 46, which will be described later. The cover 65 extends obliquely downward from the lower end of the cover 66 toward the conveyor 46. The covers 65 and 66 form a stepped slope. The length of the cover 65 in the Z-axis direction is longer than the length of the cover 66 in the Z-axis direction. The cover 65 has a first portion 651 on the tool spindle 21 side and a second portion 652 on the opposite side to the first portion 651. The second portion 652 is a portion below the cover 66.

[0039] The covers 36 and 37 are disposed on the floor of the machining chamber 110. The covers 36 and 37 are spaced apart from each other in the X-axis direction. The cover 36 extends obliquely downward from the lower end of the cover 32 toward the cover 37. The cover 37 extends obliquely downward from the lower end of the cover 38 toward the cover 36. The cover 37 is adjacent to the covers 65 and 66 in the Z-axis direction. The cover 37 is adjacent to the automatic pallet changer 50. The cover 37 is farther from the tool spindle 21 in the Z-axis direction than the covers 65 and 66.

[0040] The machine tool 100 further includes a conveyor 46. The conveyor 46 is provided between the telescopic cover 62 and the cover 65 in the X-axis direction. The conveyor 46 extends in the Z-axis direction. The conveyor 46 carries out, from the machining chamber 110, chips generated during workpiece machining.

[0041] The telescopic covers 62, 63 are configured to be deformable in accordance with the movement of the table 41 in the Z-axis direction. The telescopic cover 62 is disposed on the floor of the machining chamber inner 110. The telescopic cover 62 is disposed between the cover 36 and the conveyor 46 in the X-axis direction. The telescopic cover 62 has a first portion 621 on the tool spindle 21 side and a second portion 622 on the opposite side to the first portion 621.

[0042] The protective cover 61 protects the table 41 from above. The protective cover 61 is located between the first part 621 and the second part 622 in the Z-axis direction.

[0043] FIG. 3 is a diagram for explaining the configuration of a device for removing chips from a workpiece. As shown in FIG. 3, machine tool 100 further includes a camera 210, a cleaning device 300, a controller 500, an oil conditioner 800, and a valve 850.

[0044] The cleaning device 300 uses coolant to clean the inside of the processing chamber 110. The cleaning device 300 includes nozzles 301 to 309, valves 351 to 359, a coolant tank 371, and a pump 372.

[0045] The camera 210 captures images of the inside of the processing chamber 110. The camera 210 periodically transmits image data of the inside of the processing chamber 110 to the controller 500. The camera 210 may be a CCD (Charge Coupled Device) camera or another type of camera. The camera 210 is provided so as to be able to capture images of the inside of the processing chamber 110. The camera 210 is provided inside the processing chamber 110. In this example, the camera 210 is attached to the ceiling cover 39. The camera 210 is not limited to being attached to the ceiling cover 39, and may be attached to, for example, the cover 32 or the cover 38. The number of cameras is not limited to one, and may be multiple.

[0046] Coolant tank 371 is made of a box capable of storing coolant. Coolant tank 371 is placed on the floor of a factory or the like where machine tool 100 is installed. Coolant is stored in coolant tank 371. Pump 372 is installed in coolant tank 371. When pump 372 is driven, pump 372 sends the coolant stored in coolant tank 371 to nozzles 301 to 309 via valves 351 to 359. Pump 372 supplies coolant to oil conditioner 800 via valve 850.

[0047] The controller 500 acquires image data from the camera 210. The controller 500 controls the operation of the pump 372. The controller 500 includes a processor and a memory in which programs and various data are stored. The controller 500 controls the operations of the valves 351 to 359 and 850. The control by the controller 500 will be described in detail later.

[0048] The valves 351 to 359, and 850 are electromagnetic valves. In this example, the valves 351 to 359, and 850 are solenoid valves. The valves 351 to 359, and 850 operate in response to commands from the controller 500. The valves 351 to 359, and 850 are either open or closed in response to commands from the controller 500. The valves 351 to 359, and 850 can establish or block a coolant flow path.

[0049] Nozzle 301 is attached to ceiling cover 39. Nozzle 301 can change the direction in which it discharges (emits) coolant. The direction in which coolant is discharged from nozzle 301 is controlled by controller 500. Nozzle 301 is connected to pump 372 via valve 351. When valve 351 is open, coolant is supplied to nozzle 301 as pump 372 is driven. This causes coolant to be discharged from nozzle 301. Note that when valve 351 is closed, coolant is not supplied to nozzle 301 even if pump 372 is driven. This supply stop also applies to other nozzles 302 to 309, which will be described later.

[0050] Like nozzle 301, nozzle 302 is attached to ceiling cover 39. Like nozzle 301, nozzle 302 is capable of changing the direction in which coolant is discharged. The direction in which coolant is discharged from nozzle 302 is controlled by controller 500. Nozzle 302 is connected to pump 372 via valve 352. When valve 352 is open, coolant is supplied to nozzle 302 as pump 372 is driven. As a result, coolant is discharged from nozzle 302.

[0051] Nozzle 303, like nozzles 301 and 302, is attached to ceiling cover 39. Nozzle 303 has multiple outlets arranged at predetermined intervals in the Z-axis direction. Nozzle 303 is connected to pump 372 via valve 353. When valve 353 is open, coolant is supplied to nozzle 303 as pump 372 is driven. As a result, coolant is ejected from each outlet of nozzle 303.

[0052] Nozzle 304 is attached to ceiling cover 39. The direction in which coolant is discharged from nozzle 304 is fixed. Nozzle 304 is connected to pump 372 via valve 354. When valve 354 is open, coolant is supplied to nozzle 304 as pump 372 is driven. As a result, coolant is discharged from nozzle 304.

[0053] Nozzle 305, like nozzle 304, is attached to ceiling cover 39. Like nozzle 304, nozzle 305 has a fixed coolant discharge direction. Nozzle 305 is connected to pump 372 via valve 355. When valve 355 is open, coolant is supplied to nozzle 305 as pump 372 is driven. As a result, coolant is discharged from nozzle 305.

[0054] The nozzle 306 is provided on the tool spindle 21. The nozzle 306 includes a first discharge portion 306a and a second discharge portion 306b located below the first discharge portion 306a. The first discharge portion 306a is located at a higher position than the tool 90 attached to the tip of the tool spindle 21. The second discharge portion 306b is located at a lower position than the tool 90. The nozzle 306 is connected to a pump 372 via a valve 356. When the valve 356 is open, coolant is supplied to the nozzle 306 as the pump 372 is driven. This causes coolant to be discharged from the first and second discharge portions 306a and 306b of the nozzle 306. More specifically, the first discharge portion 306a discharges coolant toward the tool 90 (diagonally downward). The second discharge portion 306b discharges coolant toward the tool 90 (diagonally upward).

[0055] The nozzle 307 is arranged on the side of the setup station 120 in the processing chamber 110. The nozzle 307 is provided on the side of the cover 37. The nozzle 307 is connected to the pump 372 via the valve 357. When the valve 357 is in the open state, coolant is supplied to the nozzle 307 with the driving of the pump 372. Thereby, the coolant is discharged from the nozzle 307.

[0056] The nozzle 308 is arranged on the side of the cover 32 in the processing chamber 110. The nozzle 308 is installed below the cover 36. The nozzle 308 has a plurality of discharge ports arranged at a predetermined interval in the Z-axis direction. The nozzle 308 is connected to the pump 372 via the valve 358. When the valve 358 is in the open state, coolant is supplied to the nozzle 308 with the driving of the pump 372. Thereby, the coolant is discharged from the nozzle 308. Specifically, the nozzle 308 discharges the coolant toward the second part 622 side of the telescopic cover 62.

[0057] The nozzle 309 is arranged on the side of the door 35 in the processing chamber 110. The nozzle 309 is installed below the cover 36, similar to the nozzle 308. The nozzle 309 is installed closer to the telescopic cover 34 side than the nozzle 308. The nozzle 309 has a plurality of discharge ports arranged at a predetermined interval in the Z-axis direction, similar to the nozzle 308. The nozzle 309 is connected to the pump 372 via the valve 359. When the valve 359 is in the open state, coolant is supplied to the nozzle 309 with the driving of the pump 372. Thereby, the coolant is discharged from the nozzle 309. Specifically, the nozzle 309 discharges the coolant toward the first part 621 side of the telescopic cover 62.

[0058] <B: Relationship between the regions in the processing chamber and the nozzles> FIG. 4 is a diagram showing a plurality of regions in the processing chamber 110. FIG. 5 is a diagram for explaining the regions to be cleaned by each of the nozzles 301 to 309 among the plurality of regions shown in FIG. 4.

[0059] 4 and 2, region R1 is a region of the surface (upper surface) of cover 36. Region R2 is a region of the surface of second portion 622 of telescopic cover 62. Region R3 is a region of the surface (upper surface) of protect cover 61. Region R4 is a region of the surface of first portion 621 of telescopic cover 62.

[0060] Region R5 is the surface area of ​​the APC arm 52. Region R6 is the surface area of ​​the cover 37. Region R7 is the combined surface area of ​​the cover 66 and the surface area of ​​the second portion 652 of the cover 65.

[0061] Region R8 is the region of table 41. Region R8 includes the region on the upper surface side of table 41. When a pallet is placed on table 41, region R8 includes the surface of the pallet .

[0062] Area R9 is the combined area of ​​the surface of the cover 38, the surface of the ATC shutter 33, the surface of the telescopic cover 63, and the surface of the first portion 651 of the cover 65. Area R10 is the area of ​​the surface of the telescopic cover 34. Area R11 is the area of ​​the top surface of the tool spindle 21. Area R12 is the area of ​​the tool 90.

[0063] 3 to 5, as shown in data D1, region R1 is cleaned by the coolant discharged from nozzle 301. Region R2 is cleaned by the coolant discharged from nozzle 308. Region R3 is cleaned by the coolant discharged from nozzle 301 and / or nozzle 302. Region R4 is cleaned by the coolant discharged from nozzle 302 and / or nozzle 309. Region R5 is cleaned by the coolant discharged from nozzle 301 and / or nozzle 302. Region R6 is cleaned by the coolant discharged from nozzle 307.

[0064] Region R7 is cleaned by the coolant discharged from nozzle 303. Region R8 is cleaned by the coolant discharged from nozzles 301 and 302. Region R9 is cleaned by the coolant discharged from nozzle 303. Region R10 is cleaned by the coolant discharged from nozzle 305. Region R11 is cleaned by the coolant discharged from nozzle 304. Region R12 is cleaned by the coolant discharged from nozzle 306.

[0065] Controller 500 holds the data showing the relationship between the nozzles and the regions as shown in FIG. 5.

[0066] <C: Judgment of Chip Deposition State> Controller 500 determines the chip deposition state in each of regions R1 to R12. Specifically, controller 500 determines the chip deposition state of the workpiece in processing chamber 110 for each of regions R1 to R12 based on the image obtained by imaging with camera 210 and two different judgment criteria #1 and #2. Such judgment processing is typically realized by a processor included in controller 500 executing a program stored in a memory.

[0067] Specifically, controller 500 determines the chip deposition level in each of regions R1 to R12. Controller 500 classifies the chip deposition state in each of the plurality of regions R1 to R12 into levels using two judgment criteria #1 and #2. In this example, controller 500 divides the deposition state into three levels.

[0068] Hereinafter, from the lowest deposition level in order, they are referred to as "level 0", "level 1", and "level 2". Level 0 indicates that there is no chip or the amount of chips is small. Level 1 indicates that the amount of chips is normal (medium amount, medium degree). Level 2 indicates that the amount of chips is large.

[0069] For the sake of convenience, the following description will focus on region R2 among the multiple regions R1 to R12. In more detail, three cases will be described as examples.

[0070] (First case) Fig. 6 is a diagram showing an example of the state of chip accumulation. In detail, Fig. 6 shows the state in which chips are accumulated over the entire region R2.

[0071] The controller 500 performs the following process to determine the chip accumulation level in region R2. As described above, the controller 500 acquires image data from the camera 210. The controller 500 divides the image of region R2, which is based on the image data, into a plurality of regions (hereinafter referred to as "element regions Ei"). The controller 500 acquires the chip accumulation state in each element region Ei. In this example, as shown in FIG. 6, region R2 is divided into 72 element regions Ei. In this case, the value of i is a natural number greater than or equal to 1 and less than or equal to 72.

[0072] The controller 500 classifies the deposition state in the element region Ei into three levels, similar to the three levels (levels 0 to 2) described above. The first level (hereinafter also referred to as "level L") is a state in which there are no chips or a small amount of chips. The second level (hereinafter also referred to as "level M") is a state in which there is a medium (moderate) amount of chips. The third level (hereinafter also referred to as "level H") is a state in which there is a large amount of chips.

[0073] In the example of Fig. 6, of the 72 element regions Ei, the number of level L regions, the number of level M regions, and the number of level H regions are 37, 32, and 3, respectively. Note that in Fig. 6, the spacing between the hatched lines narrows in the order of level L, level M, and level H. This also applies to Figs. 8 and 10, which will be described later.

[0074] 7 is a diagram for explaining the level determination of region R2 in this case. Referring to FIG. 7, the controller 500 assigns weights to the number of element regions Ei at each level. In this example, the controller 500 assigns weights of 0 points, 3 points, and 8 points to element regions Ei at level L, element regions Ei at level M, and element regions Ei at level H, respectively.

[0075] 6, there are 37 element areas Ei at level L, but the weighted points for these 37 element areas Ei are 0 points, so the controller 500 does not award any points. There are 32 element areas Ei at level M, so the controller 500 weights these 32 element areas Ei by 3 points, resulting in 96 points (= 3 points × 32). There are three element areas Ei at level H, so the controller 500 weights these three element areas Ei by 8 points, resulting in 24 points (= 8 points × 3).

[0076] The controller 500 calculates the total score of the 72 element regions Ei obtained by the weighting. In this example, the controller 500 calculates the sum of 0 point, 96 point, and 24 point, and obtains a total score of 120 points.

[0077] Next, the controller 500 determines the accumulation level of the region R2 using two criteria #1 and #2. Criterion #1 is a criterion for determining whether chips are accumulated throughout the entire region R2. Criterion #2 is a criterion for determining whether chips are accumulated locally in the region R2.

[0078] Specifically, judgment criterion #1 determines that chips are accumulated throughout the entire region R2 if the score #1 shown in the following formula (1) is equal to or greater than the threshold value of judgment criterion #1 (hereinafter also referred to as the "first threshold value").

[0079] Score #1 = Total score / (Number of element areas Ei in area R2 × Highest weighted score) × 100 … (1) In this example, the total score is 120 points, the number of element areas Ei in area R2 is 72, and the highest weighted score is 8 points, so the controller 500 obtains score #1 as 20.8 (=120 points / (8 points × 72 areas) × 100). Since score #1 is equal to or greater than the first threshold (15 in this example), the controller 500 determines that chips are accumulated throughout area R2.

[0080] Criterion #2 is that if the score #2 shown in the following formula (2) is equal to or greater than the threshold value of criterion #2 (hereinafter also referred to as the "second threshold value"), it is determined that chips have accumulated locally in region R2.

[0081] Score #2 = Score of level H obtained by weighting / (Number of element areas Ei in area R2 × Score of highest weighting) × 100 … (2) In this example, the score for level H obtained by weighting is 24 points, the number of element regions Ei in region R2 is 72, and the highest weighted score is 8 points, so the controller 500 obtains score #2 as 4.2 (= 24 points / (8 points × 72 elements) × 100). Since score #2 is less than the second threshold (10 in this example), the controller 500 determines that chips are not locally accumulated in region R2.

[0082] The controller 500 determines the chip accumulation level in the region R2 using the above-described determination results based on the two determination criteria #1 and #2. The specific determination method is as follows.

[0083] If it is determined that chips have accumulated throughout the entire region R2 and that chips have accumulated locally in the region R2, the controller 500 determines that the accumulation level of the region R2 is level 2.

[0084] If it is determined that chips have accumulated throughout the entire region R2 and that chips have not accumulated locally in the region R2, the controller 500 determines that the accumulation level of the region R2 is level 1. Conversely, if it is determined that chips have not accumulated throughout the entire region R2 and that chips have accumulated locally in the region R2, the controller 500 also determines that the accumulation level of the region R2 is level 1.

[0085] If it is determined that chips have not accumulated over the entire region R2 and that chips have not accumulated locally in region R2, the controller 500 determines the accumulation level of region R2 to be level 0.

[0086] In this case, since it is determined that chips have accumulated throughout the entire region R2 and that chips have not accumulated locally in the region R2, the controller 500 determines that the accumulation level of the region R2 is level 1.

[0087] (Second case) Fig. 8 is a diagram showing another example of the state of chip accumulation. Specifically, Fig. 8 shows a state in which chips are locally accumulated in region R2. Fig. 9 is a diagram for explaining the level determination of region R2 in this case.

[0088] Referring to FIG. 8, of the 72 element regions Ei, the number of level L regions, the number of level M regions, and the number of level H regions were 61, 3, and 8, respectively.

[0089] In the example of Fig. 8, there are 61 element areas Ei at level L, but the weighted points for these 61 element areas Ei are 0 points, so the controller 500 does not award any points. There are three element areas Ei at level M, so the controller 500 weights these three element areas Ei by 3 points, resulting in 9 points (= 3 points x 3). There are eight element areas Ei at level H, so the controller 500 weights these eight element areas Ei by 8 points, resulting in 64 points (= 8 points x 8).

[0090] The controller 500 calculates the total score of the 72 element regions Ei obtained by weighting. In this example, the controller 500 calculates the sum of 0, 9, and 64 points to obtain a total score of 73 points. Next, the controller 500 determines the accumulation level of region R2 using two criteria #1 and #2.

[0091] For judgment criterion #1, the total score is 73 points, the number of element regions Ei in region R2 is 72, and the highest weighted score is 8 points, so the controller 500 obtains score #1 of 12.7 (=73 points / (8 points × 72 elements) × 100) based on the above-mentioned formula (1). Since score #1 is less than the first threshold value (15 in this example), the controller 500 determines that chips are not accumulated throughout region R2.

[0092] Regarding the judgment criterion #2, the score of the level H obtained by weighting is 64 points, the number of element regions Ei in region R2 is 72, and the highest weighted score is 8 points, so the controller 500 obtains score #2 as 11.1 (= 64 points / (8 points × 72 regions) × 100) based on the above-mentioned formula (2). Since score #2 is equal to or greater than the second threshold value (10 in this example), the controller 500 determines that chips are locally accumulated in region R2.

[0093] Thus, in this case, since it is determined that chips are not accumulated throughout the entire region R2 and that chips are accumulated locally in region R2, the controller 500 determines that the accumulation level in region R2 is level 1.

[0094] (Third case) Fig. 10 shows another example of the state of chip accumulation. Specifically, Fig. 10 shows a state in which chips are accumulated locally throughout the entire region R2. Fig. 11 is a diagram for explaining the level determination of region R2 in this case.

[0095] Referring to FIG. 10, of the 72 element regions Ei, the number of level L regions, the number of level M regions, and the number of level H regions were 33, 28, and 11, respectively.

[0096] In the example of Fig. 10, there are 33 element areas Ei at level L, but the weighted points for these 33 element areas Ei are 0 points, so the controller 500 does not award any points. There are 28 element areas Ei at level M, so the controller 500 weights these 28 element areas Ei by 3 points, resulting in 84 points (= 3 points x 28). There are 11 element areas Ei at level H, so the controller 500 weights these 11 element areas Ei by 8 points, resulting in 88 points (= 8 points x 11).

[0097] The controller 500 calculates the total score of the 72 element regions Ei obtained by weighting. In this example, the controller 500 calculates the sum of 0, 84, and 88 points to obtain a total score of 172. Next, the controller 500 determines the accumulation level of region R2 using two criteria #1 and #2.

[0098] For judgment criterion #1, the total score is 172 points, the number of element regions Ei in region R2 is 72, and the highest weighted score is 8 points, so the controller 500 obtains score #1 of 29.9 (=172 points / (8 points × 72 regions) × 100) based on the above-mentioned formula (1). Since score #1 is equal to or greater than the first threshold value (15 in this example), the controller 500 determines that chips are accumulated throughout region R2.

[0099] For judgment criterion #2, the score of level H obtained by weighting is 88 points, the number of element regions Ei in region R2 is 72, and the highest weighted score is 8 points, so the controller 500 obtains score #2 as 15.3 (=88 points / (8 points × 72 regions) × 100). Because score #2 is equal to or greater than the second threshold value (10 in this example), the controller 500 determines that chips are locally accumulated in region R2.

[0100] Thus, in this case, since the chips are deposited over the entire region R2 and are determined to be locally deposited in the region R2, the controller 500 determines that the deposition level of the region R2 is level 2.

[0101] Note that the above three cases are merely examples, and the chip deposition states in the region R2 vary. Also, although the region R2 has been described as an example above, the controller 500 performs the processes described based on the region R2 for each of the other regions R1, R3 to R12. That is, the controller 500 determines the chip deposition level for each of the twelve regions R1 to R12.

[0102] <D: Cleaning> The controller 500 switches the presence or absence of cleaning according to the chip deposition level in each of the regions R1 to R12. Further, when cleaning is to be performed, the controller 500 changes the coolant pressure according to the deposition level. Specifically, it is as follows.

[0103] For the regions determined to be level 0 among the regions R1 to R12, the controller 500 does not discharge coolant from the nozzles corresponding to those regions. For the regions determined to be level 1 or level 2 among the regions R1 to R12, the controller 500 discharges coolant from the nozzles corresponding to those regions.

[0104] The controller 500 may discharge a high-pressure or large-flow coolant to the regions determined to be level 2 rather than the regions determined to be level 1 among the regions R1 to R12. Such control of the coolant discharge pressure is realized by controlling the output of the pump 372 and the switching control of the valves 351 to 359.

[0105] <E: Functional Configuration> Fig. 12 is a block diagram for explaining the functional configuration of machine tool 100. With reference to Fig. 12, as described above, machine tool 100 includes camera 210, controller 500, and cleaning device 300. As described above, cleaning device 300 includes pump 372, a plurality of valves 351-359, and a plurality of nozzles 301-309.

[0106] The controller 500 has an extraction unit 510, a determination unit 520, a pump control unit 530, and a valve control unit 540. The determination unit 520 has a division unit 521, a score calculation unit 522, a first individual determination unit 523, and a second individual determination unit 524. The extraction unit 510, the determination unit 520, the pump control unit 530, and the valve control unit 540 are functional blocks realized by a processor executing a program stored in a memory.

[0107] The extraction unit 510 extracts image portions corresponding to each of the plurality of regions R1 to R12 from the image captured by the camera 210. Specifically, the extraction unit 510 extracts image data (hereinafter referred to as "image data G1 to G12") corresponding to each of the plurality of regions R1 to R12 from the image data acquired from the camera 210. The extraction unit 510 sends the extracted plurality of image data G1 to G12 to the determination unit 520.

[0108] The determination unit 520 determines the accumulation state of chips in each of the regions R1 to R12. Specifically, the determination unit 520 determines the accumulation state of chips from the workpiece in the machining chamber 110 for each of the regions R1 to R12 based on the image captured by the camera 210 and two different determination criteria #1 and #2. Specifically, the determination unit 520 determines the accumulation level of chips in each of the regions R1 to R12.

[0109] The determination unit 520 receives the image data G1 to G12. The determination unit 520 determines the accumulation level of chips in each of the regions R1 to R12 based on the image data G1 to G12. For example, the determination unit 520 determines the accumulation level of chips in each of the regions R1 to R12 based on the image data G1. , territorySimilarly, the determining unit 520 determines the accumulation level of chips in the area R1 based on the image data G2. , territory The chip accumulation level in region R2 is determined.

[0110] For ease of explanation, the processing of determination unit 520 will be described below using image data G2 corresponding to region R2 as an example. Note that the same processing as region R2 is performed for the other regions R1, R3 to R12. Therefore, the processing for the other regions R1, R3 to R12 will not be described repeatedly.

[0111] As shown in Fig. 6 etc., the dividing unit 521 divides the image of region R2 into a plurality of element regions Ei. The dividing unit 521 divides the image of region R2 into 72 element regions Ei, each of which is a square. More specifically, the dividing unit 521 extracts element image data (hereinafter referred to as "element image data GE1 to GE72") corresponding to each of the plurality of element regions E1 to E72 from the image data of region R2. Each of the plurality of element image data GE1 to GE72 includes a plurality of pixel data (pixel values ​​of a plurality of pixels).

[0112] The score calculation unit 522 determines the accumulation level of each element area Ei based on the multiple element image data GE1 to GE72. Specifically, the score calculation unit 522 determines the accumulation level of each element area Ei to be one of level L, level M, and level H. Furthermore, the score calculation unit 522 calculates the number of element areas Ei at level L, the number of element areas Ei at level M, and the number of element areas Ei at level H.

[0113] Next, the score calculation unit 522 performs the weighting process described above. Specifically, the score calculation unit 522 performs weighting by assigning 0 points to the element region Ei of level L, 3 points to the element region Ei of level M, and 8 points to the element region Ei of level H. As a result, for example, in the first case described above, the score calculation unit 522 calculates 0 points, 96 points, and 24 points as shown in FIG. 7. Furthermore, the score calculation unit 522 sums the three calculated scores. In the first case, the score calculation unit 522 adds 0 points, 96 points, and 24 points to obtain 120 points.

[0114] (Based on Criterion #1) The total score of the three scores is sent to the first individual judgment unit 523. In the first case described above, the score calculation unit 522 notifies the first individual judgment unit 523 of 120 points. The first individual judgment unit 523 makes a judgment based on the above-mentioned judgment criterion #1. That is, the first individual judgment unit 523 judges whether or not chips have accumulated throughout the entire region R2.

[0115] Specifically, the first individual judgment unit 523 calculates score #1 based on the above-mentioned formula (1). In the first case described above, the first individual judgment unit 523 multiplies the value "0.208" obtained by dividing 120 points by 576 points, which is the product of 72 points multiplied by 8 points, by 100. As a result, the first individual judgment unit 523 obtains "20.8" as score #1. Furthermore, the first individual judgment unit 523 determines whether the calculated score #1 is equal to or greater than the first threshold value (15 points).

[0116] (Based on Criterion #2) The total score of the element region Ei of level H after weighting is sent to the second individual judgment unit 524. In the first case, the score calculation unit 522 notifies the second individual judgment unit 524 of 24 points. The second individual judgment unit 524 makes a judgment based on the above-mentioned judgment criterion #2. That is, the second individual judgment unit 524 judges whether or not chips are locally accumulated in the region R2.

[0117] Specifically, the second individual judgment unit 524 calculates score #2 based on the above-mentioned formula (2). In the first case described above, the second individual judgment unit 524 multiplies the value "0.042" obtained by dividing 24 points by 576 points, which is the product of 72 points multiplied by 8 points, by 100. As a result, the second individual judgment unit 524 obtains "4.2" as score #1. Furthermore, the second individual judgment unit 524 determines whether the calculated score #2 is equal to or greater than the second threshold (10 points).

[0118] (Overall judgment) The determination unit 520 determines the accumulation level of chips in the region R2 based on the determination result by the first individual determination unit 523 and the determination result by the second individual determination unit 524. Specifically, the determination unit 520 specifies the accumulation level of the region R2 as one of the above-mentioned "Level 0," "Level 1," or "Level 2."

[0119] Specifically, if the first individual judgment unit 523 judges that score #1 is greater than or equal to the first threshold (15 points) and the second individual judgment unit 524 judges that score #2 is greater than or equal to the second threshold (10 points), the judgment unit 520 identifies the accumulation level of area R2 as level 2.

[0120] If score #1 is equal to or greater than the first threshold and score #2 is less than the second threshold, the determination unit 520 determines the accumulation level of region R2 as level 1. Similarly, if score #1 is less than the first threshold and score #2 is greater than or equal to the second threshold, the determination unit 520 determines the accumulation level of region R2 as level 1. If score #1 is less than the first threshold and score #2 is less than the second threshold, the determination unit 520 determines the accumulation level of region R2 as level 0.

[0121] The determining unit 520 determines not only the chip accumulation level in the region R2, but also the chip accumulation levels in the other regions R1, R3 to R12.

[0122] (Cleaning device control) The pump control unit 530 operates the pump 372. In this example, as shown in Fig. 3, coolant is supplied from the pump 372 to the oil conditioner 800 via the valve 850. Therefore, as long as the oil conditioner 800 is operating, the pump 372 is operated by the pump control unit 530 regardless of the level of chip accumulation in the machining chamber 110.

[0123] The pump control unit 530 and the valve control unit 540 receive notification of the accumulation level in each of the regions R1 to R12 from the determination unit 520. First, a case where the accumulation level in each of the multiple regions R1 to R12 is level 0 or level 1 will be described. Note that, in the following, it is assumed that the valves 351 to 359 are in the "closed state" by default.

[0124] In this case, the valve control unit 540 closes the valve connected to the nozzle that cleans the area where the accumulation level is determined to be Level 0. The valve control unit 540 sends a command to transition the valve connected to the nozzle that cleans the area where the accumulation level is determined to be Level 1 from the closed state to the open state.

[0125] As a result, coolant is supplied from the pump 372 to the nozzle connected to the open valve, causing the coolant to be discharged from the nozzle.

[0126] An example is as follows: The chip accumulation level in regions R1 to R6 is assumed to be level 1. The chip accumulation level in regions R7 to R12 is assumed to be level 0. In this case, the valve control unit 540 refers to data D1 (FIG. 5) and causes the valves 351, 352, 357, 358, and 359 to transition from the closed state to the open state. As a result, coolant is discharged from the nozzles 301, 302, 307, 308, and 309. As a result, the coolant cleans the regions R1 to R6 whose accumulation level has been determined to be level 1.

[0127] Next, a case will be described in which the deposition level of one of the multiple regions R1 to R12 is determined to be Level 2. In this case, the pump control unit 530 sends a command to the pump 372 to increase the output at a predetermined timing. Thereafter, the pump control unit 530 sends a command to the pump 372 to return the output to normal at a predetermined timing.

[0128] For example, assume that the chip deposition level in regions R2 and R6 is level 2, and the chip deposition level in the remaining regions R1, R3 to R5, and R7 to R12 is level 1. In this case, the pump control unit 530 changes the output of the pump 372 from the normal state (e.g., output 80%) to the high-output state (e.g., output 95%).

[0129] Next, the valve control unit 540 opens only the valve 358 connected to the nozzle 308 (see FIG. 5) corresponding to the region R2 among the plurality of valves 351 to 359. After a predetermined time has elapsed, the valve control unit 540 closes the valve 358 and opens only the valve 357 connected to the nozzle 307 (see FIG. 5) corresponding to the region R6 among the plurality of valves 351 to 359.

[0130] After a predetermined time has elapsed, the valve 357 is closed, and the pump control unit 530 returns the output of the pump 372 from the high-output state (output 95%) to the normal state (output 80%). Further, the valve control unit 540 opens only the valves 351 to 356 and 359 connected to the nozzles 301 to 306 and 309 (see FIG. 5) corresponding to the remaining regions R1, R3 to R5, and R7 to R12 among the plurality of valves 351 to 359.

[0131] By such processing, a high-pressure coolant can be discharged to the regions with a deposition level of level 2. Therefore, compared with the case of discharging a coolant at normal pressure to the regions of level 2, the chips in the regions of level 2 can be removed with high accuracy. In particular, by shifting the cleaning timings of the plurality of regions of level 2 (regions R2 and R6) from each other, a high-pressure coolant can be discharged to each region of level 2 compared with the case of cleaning the plurality of regions of level 2 simultaneously.

[0132] <F: Control Structure> FIG. 13 is a flowchart for explaining the flow of the process executed by the machine tool 100.

[0133] 13, in step S1, the camera 210 captures an image of the interior of the machining chamber 110. In step S2, the controller 500 determines the accumulation state of workpiece chips in each of the regions R1 to R12 in the machining chamber 110 based on the captured image (more specifically, image data) and two criteria #1 and #2. The cleaning device 300 cleans each of the regions R1 to R12 with coolant according to the accumulation state of chips in each of the regions R1 to R12.

[0134] FIG. 14 is a flowchart showing details of the process of step S2 in FIG. Steps S21 to S27 shown in Fig. 14 are executed for each of regions R1 to R12. The following description will be given taking region R2 as an example. In step S21, the controller 500 determines whether the chip accumulation state in region R2 satisfies criterion #1. If it is determined that criterion #1 is satisfied (YES in step S21), the controller 500 determines in step S22 whether the chip accumulation state in region R2 satisfies criterion #2.

[0135] If it is determined that criterion #2 is met (YES in step S22), the controller 500 determines in step S23 that the chip accumulation level in region R2 is level 2. If it is determined that criterion #2 is not met (NO in step S22), the controller 500 determines in step S24 that the chip accumulation level in region R2 is level 1.

[0136] If it is determined that criterion #1 is not met (NO in step S21), the controller 500 determines in step S25 whether or not the state of chip accumulation in region R2 meets determination criterion #2.

[0137] When it is determined that the reference #2 is satisfied (YES in step S25), the controller 500 determines, in step S26, that the chip accumulation level in the region R2 is level 1. When it is determined that the reference #2 is not satisfied (NO in step S25), the controller 500 determines, in step S27, that the chip accumulation level in the region R2 is level 0. Note that the same processing as described above is also executed for the other regions R1, R3 to R12.

[0138] FIG. 15 is a flowchart showing details of the processing in step S3 of FIG. 13. Each of the steps S31 to S35 shown in FIG. 15 is executed for each of the regions R1 to R12. Hereinafter, the region R2 will be described as an example. In step S31, the controller 500 determines whether the determined level is level 0. When it is determined that the level is level 0 (YES in step S31), the controller 500 ends the process without cleaning the region R2 in step S32. When it is determined that the level is not level 0 (NO in step S31), the controller 500 determines in step S33 whether the determined level is level 1.

[0139] When it is determined that the level is level 1 (YES in step S33), the controller 500 cleans the region R2 (normal cleaning) with the pump output in the normal state in step S34. When it is determined that the level is not level 1 (NO in step S33), the controller 500 cleans the region R2 (high-pressure cleaning) with the pump output in the high-output state in step S35. Note that the same processing as described above is also executed for the other regions R1, R3 to R12.

[0140] <G: Parentheses and Advantages> (1) As described above, the machine tool 100 includes a camera 210 that captures an image of the interior of the machining chamber 110 of the machine tool that processes the workpiece, a judgment unit 520 that judges the accumulation state of workpiece chips in each of the regions R1 to R12 within the machining chamber 110 based on the image obtained by the image capture and two different judgment criteria #1 and #2, and a cleaning device 300 that cleans the interior of the machining chamber 110 with coolant based on the determined accumulation state.

[0141] This configuration allows the accumulation state of chips in the machining chamber to be determined more accurately than when a single determination criterion is used, and therefore machine tool 100 allows chips to be removed more efficiently.

[0142] For the sake of convenience, the following description will focus on and summarize the region R2 among the multiple regions R1 to R12. The same applies to the regions R1, R3 to R12.

[0143] (2) Criterion #1 is a criterion for determining whether chips are accumulated over the entire region R2. Criterion #2 is a criterion for determining whether chips are accumulated locally in region R2.

[0144] According to this configuration, the accumulation state of chips in region R2 is determined based on information on whether chips are accumulated over the entire region R2 or locally. Therefore, the accumulation state of chips in region R2 can be determined more accurately than in a configuration that determines only whether chips are accumulated over the entire region R2 or only whether chips are accumulated locally in region R2.

[0145] (3) The determining unit 520 determines the level of the accumulation state. The cleaning device 300 cleans the area R2 on the condition that the accumulation state of chips in the area R2 is at level 1 or higher.

[0146] According to such a configuration, when the accumulation state of the chips in the region R2 is at level 0, the region R2 is not cleaned. Therefore, compared with a configuration in which the region R2 is cleaned even in the case of level 0, the power consumption can be reduced.

[0147] (4) When the accumulation state in the region R2 is level 2 where more chips are accumulated than at level 1, the cleaning device 300 discharges a coolant at a higher pressure into the region R2 than when the accumulation state in the region R2 is at level 1.

[0148] According to such a configuration, when a large amount of chips are accumulated in the region R2, the chips in the region R2 can be quickly removed compared with the case where the coolant is discharged into the region R2 at the same pressure as when it is at level 1.

[0149] ((5) The determination unit 520 divides the image of the region R2 in the above image into a plurality of element regions Ei, and acquires the accumulation state of the chips in each element region Ei. As shown in FIG. 7 and the like, the determination unit 520 determines the level of the accumulation state of the region R2 by weighting each of the element regions Ei according to the accumulation state of the element region Ei.

[0150] According to such a configuration, the determination unit 520 can determine whether the chips are accumulated throughout the region R2 or locally accumulated.

[0151] <H: Modified Example> ((1) In the above, the case where the processing chamber 110 is divided into a plurality of regions R1 to R12 has been described as an example, but the present invention is not limited thereto. The region of the processing chamber 110 may not be divided into a plurality of regions, and may be configured as one region and cleaned with one or a plurality of nozzle coolants. That is, the accumulation state of the chips of the workpiece in the processing chamber 110 may be determined, and the cleaning device 300 may clean the processing chamber 110 with a coolant based on the determined accumulation state.

[0152] <00(2) In the above, an example configuration including one pump 372 has been described, but the present invention is not limited to this. Machine tool 100 may include multiple pumps. For example, machine tool 100 may be configured so that one pump supplies coolant to one or more of nozzles 301-309, and another pump supplies coolant to the remaining nozzles.

[0153] (3) In the above description, an example has been given in which the controller 500 executes the processes in the order of "acquiring an image," "dividing the entire area of ​​the image into at least areas R1 to R12," and "dividing each of the areas R1 to R12 into element areas Ei." However, the present invention is not limited to this. For example, the controller 500 may execute the processes in the order of "acquiring an image," "dividing the entire area of ​​the image into element areas Ei," and "dividing the entire area into at least areas R1 to R12 by grouping a plurality of element areas Ei."

[0154] (4) In the above description, the first threshold and the second threshold are set to constant values, but the present invention is not limited to this. It is preferable to configure the controller 500 so that the first threshold and the second threshold can be changed by the user. Increasing the first threshold and the second threshold reduces the cleaning frequency, thereby reducing power consumption. Setting the first threshold and the second threshold to a lower value increases the cleaning frequency, thereby keeping the interior of the machine cleaner.

[0155] The embodiments disclosed herein are merely examples and are not limited to the above. The scope of the present invention is defined by the claims, and it is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0156] 21 tool spindle, 31 cover body, 32, 36, 37, 38, 65, 66 cover, 34, 62, 63 telescopic cover, 33 ATC shutter, 35 door, 39 ceiling cover, 41 table, 42 pallet, 46 conveyor, 50 automatic pallet changer, 52 arm, 61 protective cover, 81 operation panel, 82 upper panel, 83 panel, 90 tool, 100 machine tool, 101 rotation center axis, 110 machining chamber, 120 setup station, 210 camera, 300 cleaning device, 301, 302, 303, 304, 305, 306, 307, 308, 309 nozzle, 306a first discharge section 、3 06b Second discharge section, 351, 352, 353, 354, 355, 356, 357, 358, 359, 850 Valve, 371 Coolant tank, 372 Pump, 500 Controller, 510 Extraction section, 520 Judgment section, 521 Division section, 522 Score calculation section, 523 First individual judgment section, 524 Second individual judgment section, 530 Pump control section, 540 Valve control section, 621, 651 First section, 622, 652 Second section, 800 Oil conditioner, Ei Element area, R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, R12 area.

Claims

1. an imaging means for imaging the inside of a machining chamber of a machine tool that processes a workpiece; a determination means for determining a state of accumulation of chips from the workpiece in a first region among a plurality of regions in the machining chamber based on the image obtained by the imaging and first and second determination criteria that are different from each other; a cleaning means for cleaning the first area with coolant based on the determined deposition state, the first determination criterion is a criterion for determining whether the chips are accumulated over the entire first region; The second judgment criterion is a criterion for judging whether the chips are locally accumulated in the first region.

2. the determination means determines the level of the accumulation state based on whether the accumulation state satisfies the first determination criterion and whether the accumulation state satisfies the second determination criterion; The machine tool according to claim 1 , wherein the cleaning means cleans the first area on condition that the accumulation state is equal to or greater than a first level.

3. 3. The machine tool according to claim 2, wherein when the accumulation state is at a second level where more chips have accumulated than at the first level, the cleaning means discharges the coolant into the first area at a higher pressure or a larger flow rate than when the accumulation state is at the first level.

4. The determination means Dividing the image of the first region of the image into a plurality of element regions, and acquiring the amount of chip accumulation in each of the element regions; 3. The machine tool according to claim 2, wherein each of the element regions is weighted according to the amount of accumulation, and a predetermined calculation is performed on the value obtained by the weighting, thereby determining whether the chips have accumulated throughout the entire first region or whether the chips have accumulated locally in the first region.

5. The determination means further determines a deposition state of the workpieces in a second area among the plurality of areas based on the image and the first and second determination criteria, The machine tool according to claim 1 , wherein the cleaning means cleans the second area with coolant based on the determined state of deposition in the second area.

6. A step of imaging the inside of a machining chamber of a machine tool that processes a workpiece; determining a state of accumulation of chips from the workpiece in a predetermined area among a plurality of areas in the machining chamber based on the image obtained by the imaging and first and second criteria; and cleaning the predetermined area with coolant based on the determined deposition state. the first determination criterion is a criterion for determining whether the chips are accumulated over the entire predetermined area, A method for cleaning the inside of a machining chamber of a machine tool, wherein the second judgment criterion is a criterion for judging whether the chips have accumulated locally in the predetermined area.

Images