Substrate Processing Equipment

Abstract

To provide a substrate processing device with which it is possible for a horizontal substrate conveyance robot to easily remove one substrate from a plurality of collectively processed substrates.SOLUTION: A substrate processing device 1 comprises: a substrate holding unit 27 that holds a processing substrate group; a second transport mechanism WTR2 that extracts and transports a divided substrate group from the processing substrate group held by the substrate holding unit 27; an underwater attitude conversion unit 24 that collectively converts the attitude of the divided substrate group transported by the second transport mechanism WTR2, from vertical to horizontal; a center robot CR that removes one substrate from the divided substrate group having been converted to the horizontal attitude, and transports the substrate to a single wafer processing unit SWP1; a relative lifting unit that lifts the substrate holding unit 27 and the second transport mechanism WTR2 relatively to each other; and an alignment direction relative movement unit that horizontally moves the substrate holding unit 27 and the second transport mechanism WTR2 relatively to each other in the alignment direction of the processing substrate group. The second transport mechanism WTR2 includes a pair of chucks in which a holding groove and a passage groove are alternately arranged one by one.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus for performing predetermined processing on substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal displays and organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical disks. [Background technology]

[0002] Conventionally, this type of apparatus includes a batch processing unit, a single wafer processing unit, and a rotation mechanism (see, for example, Patent Document 1). The batch processing unit processes multiple substrates at once. The single wafer processing unit processes substrates one by one.

[0003] The batch processing unit processes multiple substrates in a vertical position. On the other hand, the single-wafer processing module processes substrates in a horizontal position. Therefore, the vertically oriented substrates that have finished processing in the batch processing unit are converted to a horizontal position by a rotation mechanism before being transferred to the single-wafer processing module (see Patent Document 1).

[0004] The substrate processing system of Patent Document 2 includes a rinse liquid bath, a single wafer processing unit, a six-axis articulated robot, and a first holder. The first holder can hold multiple substrates arranged in a vertical position with a narrow pitch. The first holder is also movable between baths. The first holder is also capable of raising and lowering, and can immerse multiple substrates in the pure water in the rinse liquid bath. A second holder is provided inside the rinse liquid bath. The second holder has holding grooves and passing grooves arranged with a wide pitch. The holding grooves and passing grooves are arranged alternately.

[0005] The first holder is lowered into the rinse bath. When the first holder is lowered further than the second holder, the second holder receives the substrates arranged at wide intervals from the first holder. In other words, the multiple substrates are held separately by the first holder and the second holder in the pure water in the rinse bath. The articulated robot first lifts the substrates held by the second holder in a vertical position in the pure water in the rinse bath, and transports the substrates to a single-wafer processing unit.

[0006] After the substrate held by the second holder is transported, the first holder is raised to a position slightly lower than the second holder. The articulated robot then lifts the vertically oriented substrate held by the first holder out of the pure water in the rinse liquid tank and transports the substrate to the single wafer processing section.

[0007] The substrate processing apparatus of Patent Document 3 includes a posture changing mechanism (a posture changing unit or a rotation mechanism). [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Special Publication No. 2016-502275 [Patent Document 2] Patent Publication No. 2021-064652 [Patent Document 3] Japanese Patent Application Publication No. 2018-056341 Summary of the Invention [Problem to be solved by the invention]

[0009] However, conventional substrate processing apparatuses have the following problem. A batch processing unit processes multiple substrates at once. The multiple substrates are arranged, for example, at intervals of 5 mm. Therefore, when transporting substrates to a single-substrate processing unit, the horizontally oriented hand of a horizontal substrate transport robot cannot enter the gap between two adjacent substrates arranged at that interval, which may prevent the hand from picking up a single substrate. Therefore, some method is needed to widen the gap.

[0010] In Patent Document 2, multiple substrates are held vertically by a first holder and a second holder in pure water in a rinse liquid bath. This allows the gap between two adjacent substrates to be widened. However, this makes the rinse liquid bath longer (deeper) in the vertical direction. Furthermore, even though the first holder has the ability to move up and down, the operation of removing the substrates in a vertical position from the pure water is required, making the configuration complicated.

[0011] The present invention has been made in consideration of the above circumstances, and aims to provide a substrate processing apparatus that allows a horizontal substrate transport robot to easily remove a single substrate from a batch of multiple substrates that have been processed at once. [Means for solving the problem]

[0012] In order to achieve the above object, the present invention has the following configuration: That is, a substrate processing apparatus according to the present invention is a substrate processing apparatus including a batch processing section for processing a plurality of substrates collectively and a single processing section for processing substrates one by one, and includes a vertical substrate holding section for holding a group of processed substrates made up of the plurality of substrates processed in the batch processing section and aligned in a vertical position at a predetermined interval, a vertical substrate transport robot for extracting a plurality of substrates from the group of processed substrates held by the vertical substrate holding section in two batches and transporting each of the divided substrate groups extracted in two batches, and a transport mechanism for transporting the divided substrates by the vertical substrate transport robot. a horizontal substrate transport robot that picks up one substrate from each of the divided substrate groups that have been converted to a horizontal position by the position conversion unit and transports the substrate to the single substrate processing unit; a relative lifting unit that raises and lowers the vertical substrate holding unit and the vertical substrate transport robot relatively; and an alignment direction relative movement unit that horizontally moves the vertical substrate holding unit and the vertical substrate transport robot relatively in an alignment direction in which the group of substrates to be processed are aligned, a pair of chucks for clamping two sides of the outer edge of each substrate; a plurality of pairs of holding grooves, each of which holds one vertically oriented substrate, provided in the pair of chucks so as to face each other; and a plurality of pairs of passing grooves, each of which passes one vertically oriented substrate, provided in the pair of chucks so as to face each other, wherein the holding grooves and the passing grooves are alternately arranged one by one in the alignment direction of the group of substrates to be processed, and the relative lifting unit performs two relative lifting and lowering movements of the vertical substrate holding unit and the vertical substrate transport robot at a predetermined substrate transfer position, the plate transport robot uses a first relative lifting and lowering movement to remove every other first group of divided substrates aligned in the vertical substrate holding unit while holding them in the holding grooves, and transports the removed first group of divided substrates to the posture conversion unit, while the vertical substrate transport robot uses the first relative lifting and lowering movement to pass the remaining second group of divided substrates through the passing grooves, thereby maintaining the second group of divided substrates held by the vertical substrate holding unit, and the alignment direction relative movement unit includes the vertical substrate holding unit from which the first group of divided substrates has been removed and which holds the second group of divided substrates;The vertical substrate transport robot is moved horizontally relative to the vertical substrate transport robot by the predetermined interval in the alignment direction of the group of processed substrates, and after this horizontal movement, the vertical substrate transport robot receives the second group of divided substrates held by the vertical substrate holding unit by holding them in the holding grooves through a second relative lifting and lowering movement, and transports the received second group of divided substrates to the posture conversion unit.

[0013] According to the substrate processing apparatus of the present invention, the pair of chucks of the vertical substrate transfer robot each have a holding groove and a passing groove arranged alternately. Therefore, the pair of chucks can extract every other substrate from a processing substrate group consisting of multiple substrates held by the vertical substrate holder and transport each of the extracted divided substrate groups to the posture conversion unit. This allows for a wider gap between two adjacent substrates. Furthermore, the posture of the extracted substrate is converted from vertical to horizontal by the posture conversion unit. Therefore, for example, the hand of the horizontal substrate transfer robot can enter between two adjacent substrates, allowing the horizontal substrate transfer robot to easily extract a single substrate.

[0014] Preferably, the substrate processing apparatus further includes an upstream vertical substrate transfer robot capable of transferring the group of substrates to be processed collectively to the vertical substrate holding unit. The upstream vertical substrate transfer robot is capable of transferring the group of substrates to be processed collectively to the vertical substrate holding unit. The vertical substrate transfer robot is also capable of transferring divided substrate groups that are extracted in two batches from the group of substrates to be processed held by the vertical substrate holding unit.

[0015] Furthermore, in the above-mentioned substrate processing apparatus, it is preferable that the vertical substrate transport robot further includes multiple pairs of upper holding grooves, each of which holds one substrate in a vertical position, provided on the pair of chucks at positions above the holding groove and the passing groove and facing each other, and that the multiple pairs of upper holding grooves are arranged in the alignment direction of the processing substrate group at the same intervals as the intervals at which the processing substrate group is aligned.

[0016] As a result, the pair of chucks has two functions. The first function is to hold every other substrate using the holding grooves and passing grooves. The second function is to hold the substrates aligned continuously, rather than every other substrate, using the pair of upper holding grooves. Furthermore, it is not necessary to provide a vertical substrate transport robot having the second function in addition to the vertical substrate transport robot having the first function. This allows for a reduction in the number of transport robots.

[0017] Preferably, the substrate processing apparatus further includes a rinse tank for storing a rinse liquid, the relative lifting unit includes a lifting mechanism for raising and lowering the vertical substrate holder, and the lifting mechanism immerses the processing substrate group or the second divided substrate group in the rinse liquid stored in the rinse tank when the vertical substrate transport robot is not transporting each of the divided substrate groups. Because the substrates are immersed in the rinse liquid stored in the rinse tank, drying of the substrates can be prevented.

[0018] Furthermore, in the substrate processing apparatus described above, the posture changing unit includes an intra-tank carrier having a front opening for passing each of the divided substrate groups and two side walls with a plurality of pairs of substrate holding grooves each formed opposite to each other for storing each of the divided substrate groups that have passed through the front opening, the intra-tank carrier having a back wall opposite to the front opening and a back opening smaller in area than the front opening; a carrier support unit for supporting the intra-tank carrier and a carrier lifter having a carrier elevating mechanism for raising and lowering the carrier support unit; an immersion tank that accommodates the intra-tank carrier and the carrier support unit and stores immersion liquid; and a lifting mechanism for lifting and lowering the intra-tank carrier immersed in the immersion liquid in the immersion tank to collectively change the posture of each of the divided substrate groups from vertical to horizontal. and a pusher rotation mechanism for rotating the vertical substrate transport robot about a vertical axis, a carrier rotation mechanism for rotating the vertical substrate transport robot about a horizontal axis, a pusher for holding from below each of the divided substrate groups held by the vertical substrate transport robot, a pusher lifting mechanism for raising and lowering the pusher, and a pusher rotation mechanism for rotating the pusher about a vertical axis, wherein when the front opening of the intra-tank carrier is facing upward, the pusher can be raised and lowered between a position on the bottom side of the immersion tank and a position above the immersion tank through the back opening and the front opening of the intra-tank carrier, and it is preferable that the intra-tank carrier is configured to receive each of the divided substrate groups from the pusher when the pusher transitions from a state in which it is positioned above the intra-tank carrier to a state in which it is positioned below the intra-tank carrier.

[0019] The orientation change unit stores one of the divided substrate groups in the intra-tank carrier while immersing the intra-tank carrier in the immersion liquid in the immersion tank. The orientation change unit then rotates the intra-tank carrier immersed in the immersion liquid about a horizontal axis to change the orientation of the divided substrate group from vertical to horizontal. Therefore, each substrate remains immersed in the immersion liquid until the horizontal substrate transport robot removes the horizontally oriented substrate from the intra-tank carrier. This prevents the substrates from drying out, thereby suppressing collapse of the substrate patterns.

[0020] Furthermore, it is preferable that the above-mentioned substrate processing apparatus further includes a control unit, wherein the control unit uses the pusher lifting mechanism to raise the pusher above the intra-tank carrier whose front opening faces upward, thereby receiving the first group of divided substrates from the vertical substrate transport robot with the pusher, the control unit uses the pusher rotation mechanism to rotate the pusher holding the first group of divided substrates 180 degrees around a vertical axis, the control unit raises the intra-tank carrier relatively to store the first group of divided substrates rotated 180 degrees into the intra-tank carrier, and the control unit uses the carrier rotation mechanism to rotate the intra-tank carrier immersed in the immersion liquid in the immersion tank around a horizontal axis, thereby converting the orientation of the first group of divided substrates from vertical to horizontal.

[0021] Before the first group of divided substrates is stored in the intra-tank carrier, the first group of divided substrates can be oriented in any direction.

[0022] In the substrate processing apparatus described above, the carrier rotation mechanism preferably includes two shafts configured to sandwich and release the intravessel carrier, and a rotation drive unit that rotates the two shafts about the horizontal axis. The two shafts and the carrier rotation mechanism allow the orientation of each of the divided substrate groups stored in the intravessel carrier to be changed in the liquid. [Effects of the Invention]

[0023] According to the substrate processing apparatus of the present invention, the horizontal substrate transport robot can easily remove one substrate from a batch of multiple substrates that have been processed at once. [Brief explanation of the drawings]

[0024] [Figure 1] 1 is a plan view showing a schematic configuration of a substrate processing apparatus according to an embodiment; [Figure 2] FIG. [Figure 3]10(a) to 10(f) are side views for explaining the position change unit and the pusher mechanism in the transfer block. [Figure 4] (a) is a plan view of the second transport mechanism, and (b) is a side view showing the swinging section, the substrate alignment direction moving section, the inter-tank moving section, and the chuck as viewed in the direction of arrow A in (a). [Figure 5] 4(a) is a longitudinal cross-sectional view of a pair of retaining grooves as seen in the direction of arrow BB in FIG. 4(a), and FIG. 4(b) is a longitudinal cross-sectional view of a pair of passing grooves as seen in the direction of arrow CC in FIG. 4(a). [Figure 6] FIG. 2 is a plan view showing an underwater attitude change unit. [Figure 7] FIG. 2 is a side view showing the underwater attitude change unit. [Figure 8] FIG. 2 is a front view showing the underwater attitude change unit. [Figure 9] 10 is a flowchart illustrating an operation of the substrate processing apparatus. [Figure 10] 10 is a flowchart for explaining the first half of the operation such as changing the attitude in water. [Figure 11] 10 is a flowchart for explaining the latter half of the operation such as changing the attitude in water. [Figure 12] 10(a) to 10(c) are front views for explaining operations such as changing posture in water. [Figure 13] 10(a) to 10(c) are front views for explaining operations such as changing posture in water. [Figure 14] 10(a) to 10(c) are front views for explaining operations such as changing posture in water. [Figure 15] (a) is a front view for explaining operations such as changing posture in water, (b) is a left side view of (a), and (c) to (d) are front views for explaining operations such as changing posture in water. [Figure 16] 10(a) to 10(c) are front views for explaining operations such as changing posture in water, and 10(d) is a left side view of 10(c). [Figure 17](a) is a side view showing one of the chucks and the oscillating part, etc., in the second conveying mechanism relating to the modified example, (b) is a longitudinal cross-sectional view showing the holding groove and the upper holding groove as seen in the direction of the arrow EE in (a), and (c) is a longitudinal cross-sectional view showing the passing groove and the upper holding groove as seen in the direction of the arrow FF in (a). [Figure 18] FIG. 10 is a plan view showing a schematic configuration of a substrate processing apparatus according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0025] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will now be described with reference to the accompanying drawings. Fig. 1 is a plan view of a substrate processing apparatus 1 according to the embodiment.

[0026] <1. Overall structure>

[0027] The substrate processing apparatus 1 includes a carry-in / out block 3, a stocker block 5, a transfer block 7, and a processing block 9.

[0028] The substrate processing apparatus 1 processes substrates W. For example, the substrate processing apparatus 1 performs chemical processing, cleaning processing, drying processing, etc. on the substrates W. The substrate processing apparatus 1 employs a processing method (a so-called hybrid method) that combines the batch and single-wafer processing methods. The batch method is a method in which multiple substrates W are processed collectively in a vertical position. The single-wafer method is a method in which substrates W are processed one by one in a horizontal position.

[0029] For convenience, in this specification, the direction in which the load-unload block 3, stocker block 5, transfer block 7, and processing block 9 are lined up is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, the direction from the stocker block 5 toward the load-unload block 3 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For reference, in each figure, front, back, right, left, top, and bottom are indicated as appropriate.

[0030] <2. Loading / unloading block>

[0031] The carry-in / out block 3 includes an input section 11 and an output section 13. The input section 11 and the output section 13 are arranged in the width direction Y. A plurality of substrates W (for example, 25 substrates) are stored in a single carrier C in a stacked manner in a horizontal position at regular intervals. The carrier C storing unprocessed substrates W is placed in the input section 11. The input section 11 includes, for example, two mounting tables 15 on which the carriers C are placed. The carrier C has a plurality of grooves (not shown) formed therein, separating the surfaces of the substrates W and accommodating each substrate W individually. An example of the carrier C is a front-opening unify pod (FOUP). A FOUP is a sealed container. The carrier C may be an open container, and any type of carrier C may be used.

[0032] The unloading unit 13 is disposed on the opposite side of the loading unit 11 across the center of the width direction Y of the substrate processing apparatus 1. The unloading unit 13 is located to the left Y of the loading unit 11. The unloading unit 13 stores processed substrates W in carriers C and unloads the carriers C. The unloading unit 13, which functions in this manner, is equipped with, for example, two mounting tables 16 for placing carriers C, similar to the loading unit 11. The loading unit 11 and the unloading unit 13 are also called load ports.

[0033] <3. Stocker Block>

[0034] The stocker block 5 is disposed adjacent to the rear X of the carry-in / out block 3. The stocker block 5 includes a transport mechanism (robot) 17 and a plurality of shelves 18.

[0035] The shelves 18 are divided into a shelf 18A for receiving and transferring substrates W, and a shelf 18B for storage. The transport mechanism 17 transports carriers C storing unprocessed substrates W from one of the two input units 11 to the shelves 18 (18A, 18B). The transport mechanism 17 also transports carriers C storing processed substrates W from the shelves 18 (18A, 18B) to one of the two output units 13. The transport mechanism 17 transports carriers C to each shelf 18, including shelf 18A, in accordance with a schedule that defines the processing order. The transport mechanism 17 is equipped with a gripping unit that grips a protrusion on the top surface of the carrier C, or a hand that supports the carrier C while contacting the underside of the carrier C. The transport mechanism 17 is driven by an electric motor.

[0036] <4. Transfer block>

[0037] The transfer block 7 is disposed adjacent to the rear X of the stocker block 5. The transfer block 7 is equipped with a batch transport mechanism (robot) HTR.

[0038] A bulk transport mechanism HTR is arranged on the right side Y of the rear X of the stocker block 5. The bulk transport mechanism HTR transports a plurality of substrates W at a time. The bulk transport mechanism HTR is equipped with a plurality of hands 19A (for example, 25 hands). Each hand 19A holds one substrate W.

[0039] As shown in FIG. 2, the batch transfer mechanism HTR further includes a hand support unit 19B, an advancing / retreating unit 19C, and an elevation rotation unit 19D. For convenience of illustration, FIG. 2 shows the batch transfer mechanism HTR equipped with three hands 19A. The hand support unit 19B supports the multiple hands 19A, allowing the multiple hands 19A to move integrally. The advance / retract unit 19C advances and retreats the multiple hands 19A via the hand support unit 19B. The elevation rotation unit 19D rotates the advancing / retreating unit 19C about the vertical axis AX1, thereby rotating the multiple hands 19A, etc. about the vertical axis AX1. The elevation rotation unit 19D also raises and lowers the multiple hands 19A, etc. by raising and lowering the advancing / retreating unit 19C. The elevation rotation unit 19D is fixed to the floor. That is, the elevation rotation unit 19D does not move horizontally. The advancing / retreating unit 19C and the lifting / rotating unit 19D each include an electric motor.

[0040] The bulk transport mechanism HTR can also transport only one substrate W using one hand (not shown). The bulk transport mechanism HTR takes out a plurality of substrates W (e.g., 25 substrates) in a batch from a carrier C placed on a transfer shelf 18A in the stocker block 5, and transports the plurality of substrates W to the attitude conversion unit 20, which will be described later. The bulk transport mechanism HTR also receives a plurality of processed substrates W (e.g., 25 substrates) in a batch from a processing block 9, which will be described later. The bulk transport mechanism HTR then transports the plurality of processed substrates W in a batch to a carrier C placed on a transfer shelf 18A in the stocker block 5.

[0041] The transfer block 7 further includes a position change unit 20 and a pusher mechanism 21. The batch transport mechanism HTR, the position change unit 20, and the pusher mechanism 21 are arranged in this order in the Y direction. Figures 3(a) to 3(f) are diagrams for explaining the position change unit 20 and the pusher mechanism 21.

[0042] The attitude conversion unit 20 converts the attitude of a plurality of (two or more) substrates W transferred from the batch transfer mechanism HTR from horizontal to vertical. As shown in Fig. 3(a), the attitude conversion unit 20 includes a support base 20A, a pair of horizontal holding units 20B, a pair of vertical holding units 20C, and a rotation drive unit 20D.

[0043] 1 and 3(a), a pair of horizontal holding parts 20B and a pair of vertical holding parts 20C are provided on a support base 20A. When a plurality of (e.g., 25) substrates W are in a horizontal position, the pair of horizontal holding parts 20B contacts the underside of each substrate W and supports the substrates W from below. When the plurality of substrates W are in a vertical position, for example, the pair of vertical holding parts 20C holds the plurality of substrates W.

[0044] The rotation drive unit 20D supports the support table 20A so that it can rotate about the horizontal axis AX2. Furthermore, the rotation drive unit 20D rotates the support table 20A about the horizontal axis AX2, thereby converting the orientation of the multiple substrates W held by the holders 20B and 20C from horizontal to vertical.

[0045] As shown in FIGS. 1 and 3(f), the pusher mechanism 21 includes a pusher 21A, a lifting and rotating unit 21B, a horizontal moving unit 21C, and a rail 21D. The pusher 21A supports the lower portion of each of a plurality of (e.g., 50) substrates W in a vertical position. The lifting and rotating unit 21B is connected to the underside of the pusher 21A. The lifting and rotating unit 21B extends and retracts to raise and lower the pusher 21A in the vertical direction. The lifting and rotating unit 21B also rotates the pusher 21A around a vertical axis AX3. The horizontal moving unit 21C supports the lifting and rotating unit 21B. The horizontal moving unit 21C horizontally moves the pusher 21A and the lifting and rotating unit 21B along the rail 21D. The rail 21D is formed to extend in the Y direction (see FIG. 1). The rotation drive unit 20D, the lift rotation unit 21B, and the horizontal movement unit 21C each include an electric motor.

[0046] The operation of the position changer 20 and the pusher mechanism 21 will now be described. The position changer 20 and the pusher mechanism 21 arrange, face-to-face, for example, 50 substrates W in two carriers C at a predetermined interval (e.g., 5 mm: half pitch). The pusher mechanism 21 transfers these 50 substrates W to the first transport mechanism WTR1 arranged in the fourth row R4 of the processing block 9 at a substrate transfer position (position P of the pusher mechanism 21 shown by the dashed line in Figure 1) determined within the transfer block 7. The 25 substrates W in the first carrier C will be described as substrates W1 of the first substrate group. The 25 substrates W in the second carrier C will be described as substrates W2 of the second substrate group. Note that for convenience of illustration, in Figures 3(a) to 3(f), the first substrate group will have three substrates W1 and the second substrate group will have three substrates W2. Furthermore, when there is no particular distinction between the substrates W1 and W2, the substrates W1 and W2 will be referred to as "substrate W."

[0047] See Figure 3(a). The attitude conversion unit 20 receives the first group of 25 substrates W1 transported by the batch transport mechanism HTR at holders 20B and 20C. At this time, the 25 substrates W1 are in a horizontal position, with their device surfaces facing upward. The orientation of the device surfaces is indicated by arrow AR. The 25 substrates W1 are arranged at a predetermined interval (for example, 10 mm). This 10 mm interval is called the full pitch or normal pitch.

[0048] The half pitch is half the distance of the full pitch. The device surface of the substrate W (W1, W2) is the surface on which the electronic circuit is formed and is called the "front surface." The back surface of the substrate W is the surface on which the electronic circuit is not formed. The surface opposite the device surface is called the back surface.

[0049] See Figure 3(b). The attitude conversion unit 20 rotates the holders 20B and 20C by 90 degrees around the horizontal axis AX2 to convert the attitude of the 25 substrates W1 from horizontal to vertical. See Figure 3(c). The pusher mechanism 21 raises the pusher 21A to a position higher than the holders 20B and 20C of the attitude conversion unit 20. As a result, the pusher 21A receives the 25 substrates W from the holders 20B and 20C. The 25 substrates W1 held by the pusher 21A face leftward Y.

[0050] See FIG. 3(d). The pusher mechanism 21 rotates the 25 substrates W in a vertical orientation by 180 degrees around the vertical axis AX3. As a result, the 25 substrates W1 are inverted and face rightward Y. The inverted 25 substrates W1 then move half a pitch (e.g., 5 mm) to the rightward Y from their pre-rotation positions. The holders 20B and 20C of the orientation conversion unit 20 are then rotated -90 degrees around the horizontal axis AX2 to prepare for receiving the next substrate W2. The orientation conversion unit 20 then receives the second group of 25 substrates W2, transported by the batch transport mechanism HTR, with the holders 20B and 20C. At this time, the 25 substrates W2 are in a horizontal orientation, with their device surfaces facing upward. The orientation conversion unit 20 and the pusher mechanism 21 are operated so as not to interfere with each other.

[0051] See Figure 3(e). The pusher mechanism 21 lowers the pusher 21A holding the 25 substrates W1 of the first substrate group to the retracted position. Thereafter, the attitude changing unit 20 changes the attitude of the 25 substrates W2 from horizontal to vertical. After the attitude change, the 25 substrates W2 face leftward Y. See Figure 3(f). Thereafter, the pusher mechanism 21 raises the pusher 21A holding the 25 substrates W2 of the second substrate group. This causes the pusher mechanism 21 to receive another 25 substrates W2 from the attitude changing unit 20.

[0052] As a result, the pusher 21A holds 50 substrates W (W1, W2) of the first substrate group and the second substrate group. The 50 substrates W are arranged in an alternating sequence of 25 substrates W1 and 25 substrates W2. The 50 substrates W are arranged at a half pitch (e.g., 5 mm intervals). Furthermore, the 25 substrates W1 face in the opposite direction to the 25 substrates W2. Therefore, the 50 substrates W are arranged face-to-face. That is, two adjacent substrates W1 and W2 have their two device surfaces (or two back surfaces) facing each other.

[0053] Thereafter, the pusher mechanism 21 moves the pushers 21A holding the 50 substrates W along the rails 21D to a position below a pair of chucks 23 (described later) of the first transport mechanism WTR1 (substrate transfer position P).

[0054] Returning to FIG. 1, the first transport mechanism WTR1 is disposed in the fourth row R4 of the processing block 9. The first transport mechanism WTR1 moves in the front-rear direction X through the fourth row R4. The front end of the fourth row R4 extends to the substrate transfer position P of the transfer block 7. The first transport mechanism WTR1 is equipped with a pair of chucks 23 that transports a plurality of (e.g., 50) substrates W. Each of the two chucks 23 has, for example, two rotation shafts oriented in the width direction Y. The two chucks 23 are swung around the two rotation shafts. The two chucks 23 clamp both end surfaces of the plurality of vertically oriented substrates W. The first transport mechanism WTR1 receives the plurality of vertically oriented substrates W from the pusher 21A. The first transport mechanism WTR1 delivers the plurality of unprocessed substrates W to each of the batch processing units BPU1 to BPU3 of the processing block 9.

[0055] <5. Processing Block>

[0056] The processing block 9 processes the substrates W. The processing block 9 is divided into a first column R1, a second column R2, a third column R3, and a fourth column R4 in the width direction Y. In detail, the first column R1 and the fourth column R4 are arranged side by side on the left side Y. The second column R2 is arranged in the center in the width direction Y. In other words, the second column R2 is arranged to the right side Y of the first column R1. The third column R3 is arranged to the right side Y of the second column R2. The configuration of each of the columns R1 to R4 will be described below.

[0057] <5-1. 1st column>

[0058] The first row R1 is a batch processing area and is mainly equipped with a batch processing section (hereinafter referred to as a "batch processing section"). Specifically, the first row R1 is equipped with a first batch processing section BPU1, a second batch processing section BPU2, a third batch processing section BPU3, and an underwater posture conversion section 24. Each of the three batch processing sections BPU1 to BPU3 processes a plurality of substrates W (for example, 50 substrates) collectively. The plurality of substrates W processed collectively by each of the batch processing sections BPU1 to BPU3 is called a group of processed substrates.

[0059] The first batch processing unit BPU1 is adjacent to the rear X of the transfer block 7. The second batch processing unit BPU2 is adjacent to the rear X of the first batch processing unit BPU1. The third batch processing unit BPU3 is adjacent to the rear X of the second batch processing unit BPU2. The underwater attitude conversion unit 24 is adjacent to the rear X of the third batch processing unit BPU3.

[0060] The first batch processing unit BPU1 is, for example, a chemical processing unit CHB1. The chemical processing unit CHB1 performs, for example, a phosphoric acid process. The phosphoric acid process uses phosphoric acid as a processing liquid. The phosphoric acid process performs an etching process on multiple substrates W. The etching process chemically removes, for example, a coating deposited on the substrates W. The coating is, for example, a nitride film.

[0061] The chemical liquid processor CHB1 includes a processing tank 26A and a lifter LF1. The processing tank 26A stores a processing liquid. The processing tank 26A supplies the processing liquid, for example, from below to above. The lifter LF1 moves up and down in the vertical direction Z. Specifically, the lifter LF1 moves up and down between a processing position inside the processing tank 26A and a transfer position above the processing tank 26A. The lifter LF1 holds multiple substrates W in a vertical position. At the transfer position, the lifter LF1 transfers the multiple substrates W to and from the first transport mechanism WTR1.

[0062] The second batch processing unit BPU2 is, for example, a chemical processing unit CHB2. The chemical processing unit CHB2 has the same configuration as the chemical processing unit CHB1. That is, the chemical processing unit CHB2 includes a processing tank 26B and a lifter LF2. The chemical processing unit CHB2 performs the same processing as the chemical processing unit CHB1. That is, there are multiple processing units that perform the same chemical processing. This is because the phosphoric acid processing takes a long time compared to other chemical processing or pure water cleaning processing. The phosphoric acid processing takes, for example, about 60 minutes. Therefore, throughput can be improved by performing the processing in parallel using multiple chemical processing units. The lifter LF2 has the same configuration as the lifter LF1.

[0063] The third batch processor BPU3 is, for example, a pure water processor ONB. The pure water processor ONB has a configuration similar to that of the chemical processors CHB1 and CHB2. Specifically, the pure water processor ONB includes a processing tank 26C and a lifter LF3. However, the processing tank 26C is supplied with mainly pure water for the pure water cleaning process using a jet pipe 145 (see FIG. 12(a)) described later. The jet pipe 145 has a configuration similar to that of the jet pipe 73A described later. The processing tank 26C stores pure water. The processing tank 26C cleans the chemical liquid adhering to the plurality of substrates W. In other words, the processing tank 26C of the pure water processor ONB washes away the chemical liquid adhering to the plurality of substrates W. The pure water processor ONB terminates the cleaning process, for example, when the resistivity of the pure water in the processing tank 26C increases to a predetermined value.

[0064] The lifter LF3 is configured similarly to the lifters LF1 and LF2. Specifically, the lifter LF3 includes a substrate holder 27 and a lifting mechanism 28 (see FIGS. 1 and 12(c)). The substrate holder 27 holds a plurality of substrates W (a group of substrates to be processed) aligned in a vertical position at a predetermined interval (half pitch, for example, 5 mm). The lifting mechanism 28 raises and lowers the substrate holder 27. The lifting mechanism 28 includes an electric motor or an air cylinder.

[0065] The pure water supplied by the pure water processing unit ONB corresponds to the rinse liquid of the present invention. The processing tank 26C corresponds to the rinse tank of the present invention. The substrate holding unit 27 of the lifter LF3 corresponds to the vertical substrate holding unit of the present invention. The lifting mechanism 28 of the lifter LF3 corresponds to part or all of the relative lifting unit of the present invention.

[0066] <5-2. 2nd column>

[0067] The second row R2 is a single substrate transport area and is equipped with a center robot CR. The center robot CR is equipped with a hand 29. The hand 29 holds one substrate W in a horizontal position. The center robot CR may, for example, be configured to have another hand 29 in the vertical direction Z. The center robot CR is configured to be movable in the front-to-rear direction X. The center robot CR is configured to be able to move up and down in the vertical direction Z. The center robot CR is configured to be able to rotate within a horizontal plane including the front-to-rear direction X and the width direction Y. The hand 29 is configured to be able to move forward and backward within a horizontal plane including the front-to-rear direction X and the width direction Y.

[0068] The hand 29 receives the substrates W one by one from the underwater posture conversion unit 24. The center robot CR delivers the substrates W one by one to the third row R3. That is, the center robot CR takes out one substrate W from each of the first substrate group (substrate W1) and the second substrate group (substrate W2) that have been converted to a horizontal posture by the underwater posture conversion unit 24, and transports the substrate W1 (W2) to one of two single wafer processing units SWP1, SWP2, which will be described later. Note that if the center robot CR is equipped with two hands 29, it may receive two substrates W at once from the underwater posture conversion unit 24 and deliver the substrates W one by one to two locations, namely, the two single wafer processing units SWP1, SWP2, which will be described later. Note that the center robot CR corresponds to the horizontal substrate transport robot of the present invention.

[0069] <5-3. 3rd column>

[0070] The third row R3 is a single substrate processing region and is primarily equipped with a single-wafer processing section (hereinafter referred to as the "single-wafer processing section"). Specifically, the third row R3 is equipped with a first single-wafer processing section SWP1, a second single-wafer processing section SWP2, a third single-wafer processing section SWP3, and a buffer section 31. Each of the three single-wafer processing sections SWP1 to SWP3 processes one substrate W at a time. The first single-wafer processing section SWP1 is located at the innermost side in the front-rear direction X. In other words, the first single-wafer processing section SWP1 is located on the opposite side of the submersible position change section 24 in the width direction Y, with the second row R2 in between. The second single-wafer processing section SWP2 is adjacent to the front X of the first single-wafer processing section SWP1. The third single-wafer processing section SWP3 is adjacent to the front X of the second single-wafer processing section SWP2. The buffer section 31 is located in front X of the third single-wafer processing section SWP3 and adjacent to the rear X of the batch transport mechanism HTR.

[0071] The first single wafer processing unit SWP1 and the second single wafer processing unit SWP2 each include, for example, a rotation processing unit 33 and a nozzle 35. The rotation processing unit 33 includes a spin chuck that holds the substrate W in a horizontal position, and an electric motor that rotates the substrate W about a vertical axis that passes through the center of the substrate W. The nozzle 35 supplies a processing liquid to the substrate W held in the rotation processing unit 33. The nozzle 35 oscillates between a standby position away from the rotation processing unit 33 and a supply position above the rotation processing unit 33. The processing liquid is, for example, IPA (isopropyl alcohol) or pure water. The first single wafer processing unit SWP1 and the second single wafer processing unit SWP2 may, for example, perform a cleaning process on the substrate W with pure water, and then perform a preliminary drying process with IPA, or form a liquid film of IPA on the upper surface of the substrate W.

[0072] The third single wafer processing unit SWP3 includes, for example, a supercritical fluid chamber 37. The supercritical fluid chamber 37 performs drying processing using, for example, a supercritical fluid. The fluid used here is, for example, carbon dioxide. The supercritical fluid chamber 37 processes the substrate W by bringing the processing liquid to a supercritical state. The supercritical state is achieved by bringing the fluid to its specific critical temperature and critical pressure. Specifically, when the fluid is carbon dioxide, the critical temperature is 31°C and the critical pressure is 7.38 MPa. In the supercritical state, the surface tension of the fluid becomes almost zero. Therefore, the pattern on the substrate W is not affected by the gas-liquid interface. Therefore, pattern collapse on the substrate W is less likely to occur.

[0073] The buffer unit 31 includes, for example, multiple tiers of loading shelves 39. The multiple tiers of loading shelves 39 are preferably stacked in the vertical direction Z. The multiple tiers of loading shelves 39 can load at least one lot's worth of substrates W (e.g., 25 substrates). The batch transport mechanism HTR can remove multiple substrates W (e.g., 25 substrates) at once, which reduces the burden on the batch transport mechanism HTR compared to removing substrates W one by one. The buffer unit 31 can be accessed from multiple different horizontal directions. The center robot CR accesses the buffer unit 31 from the second row R2 side toward the right Y to load substrates W. The batch transport mechanism HTR accesses the buffer unit 31 from the front X to the rear X to receive one lot's worth of substrates W all at once. The batch transport mechanism HTR can also receive substrates W in a number less than one lot. The center robot CR described above moves up and down in the vertical direction Z to transfer substrates W between the multiple loading shelves 39.

[0074] The first single wafer processing section SWP1, the second single wafer processing section SWP2, and the third single wafer processing section SWP3 are preferably each configured such that similar processing sections are stacked in multiple stages in the vertical direction Z. This can improve throughput.

[0075] <5-4. 4th column> The fourth row R4 is a bulk substrate transport area, where the first transport mechanism WTR1 and the second transport mechanism WTR2 are arranged. The configuration of the first transport mechanism WTR1 has been described in detail above, so a detailed description will be omitted here. The second transport mechanism WTR2 will be described below.

[0076] The processing block 9 further includes a second transport mechanism (robot) WTR2. That is, the substrate processing apparatus 1 includes the second transport mechanism WTR2 in addition to the first transport mechanism WTR1. As shown in Fig. 1, the first transport mechanism WTR1 transports, for example, 50 substrates W in a vertical position between the pusher 21A and the three lifters LF1 to LF3. For example, the first transport mechanism WTR1 can transport 50 substrates W (a group of substrates to be processed) all at once to the substrate holder 27 of the lifter LF3.

[0077] In contrast, the second transport mechanism WTR2 transports, for example, 25 substrates W1 (W2) in a vertical position between the lifter LF3 and a pusher 75 (described later). The second transport mechanism WTR2 also extracts, in two batches, a plurality of substrates (for example, 25 substrates) W1 (W2) from the 50 substrates (substrate group to be processed) held by the substrate holder 27 of the lifter LF3. That is, the second transport mechanism WTR2 can selectively extract and transport either 25 odd-numbered substrates W or 25 even-numbered substrates W from the 50 substrates W. The second transport mechanism WTR2 then transports the 25 substrates W1 of the first substrate group and the 25 substrates W2 of the second substrate group extracted in two batches.

[0078] The first transport mechanism WTR1 corresponds to the upstream vertical substrate transport robot of the present invention, and the second transport mechanism WTR2 corresponds to the vertical substrate transport robot of the present invention.

[0079] Fig. 4(a) is a plan view showing a schematic configuration of the second transport mechanism WTR2. Fig. 4(b) is a side view showing one chuck 41 as viewed in the direction of arrow A in Fig. 4(a). Fig. 5(a) is a vertical cross-sectional view showing the holding grooves 43 and 44 of the pair of chucks 41 and 42 as viewed in the direction of arrow B in Fig. 4(a). Fig. 5(b) is a vertical cross-sectional view showing the passing grooves 45 and 46 of the pair of chucks 41 and 42 as viewed in the direction of arrow C in Fig. 4(a).

[0080] The second transport mechanism WTR2 includes a pair of chucks 41, 42. A pair of holding grooves 43, 44 and a pair of passing grooves 45, 46 are formed alternately and continuously at equal intervals in the chucks 41, 42. The pair of chucks 41, 42 is configured to sandwich two sides of the outer edge of each substrate W of a plurality of substrates W (a group of substrates to be processed). The pairs of holding grooves 43, 44 and the pairs of passing grooves 45, 46 are arranged alternately, one by one, in the Y direction in which the plurality of substrates W are aligned. The distance between the pair of holding grooves 43, 44 and the pair of passing grooves 45, 46 is the same as the arrangement pitch (here, a half pitch, for example, 5 mm) of the plurality of substrates W to be batch-processed.

[0081] The number of pairs of holding grooves 43, 44 is, for example, 25 pairs. The number of pairs of passing grooves 45, 46 is, for example, 25 pairs. In this case, 25 holding grooves 43 and 25 passing grooves 45 are provided in the first chuck 41. Also, 25 holding grooves 44 and 25 passing grooves 45 are provided in the second chuck 42. Also, as shown in FIG. 4(b), the holding grooves 43 and the passing grooves 45 are arranged alternately in the first chuck 41.

[0082] The pair of holding grooves 43, 44 are arranged opposite each other. As shown in Fig. 4(a), for example, the pair of holding grooves 43A, 44A are arranged opposite each other. Each of the pair of holding grooves 43, 44 holds one substrate W in a vertical position. As shown in Fig. 5(a), the pair of holding grooves 43, 44 each have two protrusions 47, 48 for holding one substrate W in a vertical position.

[0083] The pair of passing grooves 45, 46 are arranged opposite each other. As shown in FIG. 4(a), for example, the pair of passing grooves 45A, 46A are arranged opposite each other. Each of the pair of passing grooves 45, 46 allows one substrate W in a vertical position to pass through. In other words, each of the pair of passing grooves 45, 46 cannot hold one substrate W in a vertical position. As shown in FIGS. 5(a) and 5(b), the pair of passing grooves 45, 46 do not each have two protrusions 47, 48 like the pair of holding grooves 43, 44.

[0084] 4(a), the second transport mechanism WTR2 includes a swinging unit 51, a substrate alignment direction moving unit 53, and an inter-tank moving unit 55. The swinging unit 51 includes a first horizontal shaft 57 provided at the upper end of the first chuck 41, a second horizontal shaft 58 provided at the upper end of the second chuck 42, and one or more electric motors (not shown). The swinging unit 51 rotates the first chuck 41 about the horizontal axis AX4 of the first horizontal shaft 57, and simultaneously rotates the second chuck 42 about the horizontal axis AX5 of the second horizontal shaft 58. This allows the chucks 41, 42 to clamp and release multiple substrates W from being clamped between them.

[0085] The two chucks 41 and 42 rotate around horizontal axes AX4 and AX5, respectively, in order to clamp a plurality of substrates W. In this regard, the two chucks 41 and 42 may be moved away from or towards each other.

[0086] The substrate alignment direction moving unit 53 horizontally moves the chucks 41, 42 and the swinging unit 51 in the Y direction along at least one of two horizontal shafts 57, 58 extending in the Y direction in which the substrates W are aligned. The substrate alignment direction moving unit 53 includes, for example, an electric motor 53A, a screw shaft (screw shaft) 53B, a slider 53C, and a guide rail 53D. The slider 53C is connected to the swinging unit 51. The screw shaft 53B is threaded through a nut portion 53E of the slider 53C, which engages with the screw shaft 53B. When the screw shaft 53B is rotated around its axis by the electric motor 53A, the slider 53C is moved in the Y direction. This moves the two chucks 41, 42 and the swinging unit 51 in the Y direction.

[0087] Furthermore, the substrate alignment direction moving unit 53 can move the two chucks 41, 42 between a first holding position and a second holding position. The first holding position is a position where, for example, 25 pairs of holding grooves 43, 44 can hold 25 substrates W1 of the first substrate group. The second holding position is a position where 25 pairs of holding grooves 43, 44 can hold 25 substrates W2 of the second substrate group. The first holding position and the second holding position are displaced by a half pitch (for example, 5 mm).

[0088] The inter-tank transfer unit 55 horizontally moves the chucks 41, 42, the swinging unit 51, and the substrate alignment direction transfer unit 53 in the X direction along guide rails 59 extending in the X direction along which the three processing tanks 26A, 26B, and 26C are aligned. This makes it possible to transport, for example, 25 substrates W1 (W2) in a vertical position between the lifter LF3 of the third batch processing unit BPU3 and a pusher 75 (described later) of the submersible position conversion unit 24.

[0089] <6. Underwater posture change unit>

[0090] The underwater attitude change unit 24 will now be described with reference to Figures 6 to 8. Figure 6 is a plan view of the underwater attitude change unit 24. Figure 7 is a side view of the underwater attitude change unit 24. Figure 8 is a front view of the underwater attitude change unit 24.

[0091] The submersible position changer 24 collectively changes the position of each of the first substrate group (substrates W1) and the second substrate group (substrates W2) transported by the second transport mechanism WTR2 from vertical to horizontal. The submersible position changer 24 includes a position changer 71, an immersion tank 73, a lifter LF4, and a pusher 75. The position changer 71 includes an in-tank carrier 76 and a rotation mechanism 79.

[0092] The intra-tank carrier 76 can store, for example, 50 substrates W in a vertical position. In this case, the intra-tank carrier 76 stores the 50 substrates W spaced apart at predetermined intervals in a predetermined alignment direction. The alignment direction of the substrates W is a direction perpendicular to the device surface. The alignment direction is the thickness direction of the substrates W. The intra-tank carrier 76 may also be capable of storing, for example, 25 substrates W.

[0093] The intra-tank carrier 76 includes a front opening 81, a back opening 82, a plurality of (for example, 50) substrate holding grooves 84 each paired together, a back wall 76A (see FIG. 15(b)), two side walls 76B, and an engagement portion 85. This will be described in detail.

[0094] A front opening 81 is formed on the top surface of the intra-tank carrier 76. A back opening 82 is formed on the bottom of the intra-tank carrier 76. The front opening 81 is an opening for passing, for example, a substrate W. The length of the front opening 81 in the front-rear direction X is longer than the diameter of the substrate W. The back opening 82 has a narrower (smaller) opening area than the front opening 81. Therefore, the back opening 82 is configured so that each of the 25 substrates W cannot pass through. The back wall (bottom wall) 76A in which the back opening 82 is formed faces the front opening 81. In other words, the back opening 82 faces the front opening 81.

[0095] 6, multiple pairs (50 pairs) of substrate holding grooves 84 are arranged at a half pitch (e.g., 5 mm intervals) in the Y direction. These substrate holding grooves 84 are capable of holding 50 substrates W arranged at a half pitch. Multiple pairs of substrate holding grooves 84 are provided on two side walls 76B. Each pair of substrate holding grooves 84 is arranged to face each other. In this embodiment, the intra-tank carrier 76 is capable of storing 50 substrates W, but stores 25 substrates W1 (W2) transported by the second transport mechanism WTR2.

[0096] The engagement portions 85 are formed on two outer surfaces of two side walls 76B in the front-rear direction X of the intra-tank carrier 76. The engagement portions 85 are formed on the outer surfaces in a direction perpendicular to the alignment direction of the multiple substrates W.

[0097] The immersion tank 73 accommodates an intra-tank carrier 76 and two support members 95, which will be described later. The immersion tank 73 stores pure water as the immersion liquid. The immersion tank 73 is provided with ejection pipes 73A at both ends of the bottom surface in the front-to-rear direction X. Each ejection pipe 73A is cylindrical. Each ejection pipe 73A has a major axis in the width direction Y. Each ejection pipe 73A is long in the width direction Y. Each ejection pipe 73A supplies pure water toward the center of the immersion tank 73 in the front-to-rear direction X. Each ejection pipe 73A forms an ascending flow of pure water that flows upward from the bottom of the immersion tank 73. The pure water supplied from each ejection pipe 73A to the immersion tank 73 is discharged over the upper edge of the immersion tank 73.

[0098] The rotation mechanism 79 rotates the intra-tank carriers 76 immersed in the pure water in the immersion tank 73 around a horizontal axis to simultaneously change the postures of the first substrate group (substrates W1) and the second substrate group (substrates W2). The rotation mechanism 79 includes an air cylinder 87 and a motor (electric motor) 89. The air cylinder 87 includes an operating shaft 87A and an engaging piece 87B. The operating shaft 87A is driven to move back and forth in the front-rear direction X in response to the on / off of the air cylinder 87. A through hole 74 is formed in the immersion tank 73. The through hole 74 is formed in each of the two side walls of the immersion tank 73 in the front-rear direction X. The operating shaft 87A is attached to the through hole 74 of the immersion tank 73 in a liquid-tight manner. The operating shaft 87A can move back and forth in the front-rear direction X in a liquid-tight manner. The operating shaft 87A can rotate around an axis in the front-rear direction X in a liquid-tight manner. In other words, the operating shaft 87A can move back and forth and rotate relative to the center of the immersion tank 73 while maintaining liquid-tightness.

[0099] The advanced position where the engaging piece 87B of the operating shaft 87A engages with the engaging portion 85 is the coupled position. The retracted position where the engaging piece 87B of the operating shaft 87A is separated from the engaging portion 85 is the released position. The operating shaft 87A shown in Figure 6 has the engaging piece 87B positioned in the released position.

[0100] The engagement piece 87B engages with the engagement portion 85 of the intra-tank carrier 76. The shape (contour) of the outer peripheral surface of the engagement piece 87B is formed so as to engage with the engagement portion 85. For example, the engagement portion 85 and the engagement piece 87B have a polygonal shape when viewed from the front-rear direction X. The dimension of the engagement piece 87B in a vertical cross section is slightly smaller than that of the engagement piece 85. The shape of the inner peripheral surface of the engagement portion 85 and the shape of the outer peripheral surface of the engagement piece 87B are similar. When the engagement piece 87B engages with the engagement portion 85, the intra-tank carrier 76 and the operating shaft 87A are integrated. In other words, when the engagement piece 87B engages with the engagement portion 85, the intra-tank carrier 76 can rotate together with the operating shaft 87A around an axis in the front-rear direction X.

[0101] When the air cylinder 87 is turned on, for example, the operating shaft 87A advances. When the air cylinder 87 is turned off, for example, the operating shaft 87A retracts. When the air cylinder 87 is turned on, it moves to a connected position where the engagement piece 87B engages with the engagement portion 85. When the air cylinder 87 is turned off, it moves to an open position where the engagement piece 87B is separated from the engagement portion 85. At the connected position, the operating shaft 87A is integrated with the in-tank carrier 76. At the open position, the operating shaft 87A is separate from the in-tank carrier 76.

[0102] The motor 89 rotates the air cylinder 87 around an axis in the front-rear direction X. When the air cylinder 87 is turned on and the motor 89 is rotationally driven in a first direction, the motor 89 rotates the intra-tank carrier 76 in the forward direction around the axis in the front-rear direction X. When the air cylinder 87 is turned on and the motor 89 is rotationally driven in a second direction opposite to the first direction, the motor 89 rotates the intra-tank carrier 76 in the reverse direction around the axis in the front-rear direction X. Each of these rotation angles is approximately 90 degrees (absolute value). The rotation angles at this time are rotation angles at which the orientations of the multiple substrates W stored in the intra-tank carrier 76 are converted between a horizontal orientation and a vertical orientation.

[0103] As shown in Figures 6 and 7, the lifter LF4 has a back plate portion 93 and two support portions 95. The back plate portion 93 extends in the vertical direction Z along the inner surface of the immersion tank 73. For example, two support portions 95 are attached to the lower end of the back plate portion 93. The two support portions 95 extend in the width direction Y. The distance between the two support portions 95 in the front-to-rear direction X is wider than the rear opening 82. The lifter LF4 supports the intra-tank carrier 76 so that the longitudinal direction of the intra-tank carrier 76 is horizontal. In other words, the two support portions 95 of the lifter LF4 support the intra-tank carrier 76 with the front opening 81 facing upward.

[0104] A lifting mechanism 97 is disposed near the lifter LF4. The lifting mechanism 97 raises and lowers the two support parts 95 and the like. The lifting mechanism 97 includes a motor (electric motor) 98, a threaded shaft 101, a linear guide 103, and a lifting piece 105. The motor 98 is disposed with its rotation shaft oriented vertically. The threaded shaft 101 is attached to the rotation shaft of the motor 98. The threaded shaft 101 is oriented in the vertical direction Z. The linear guide 103 is disposed parallel to the threaded shaft 101. The linear guide 103 is oriented in the vertical direction Z. The lifting piece 105 is threadedly engaged with the threaded shaft 101. One end of the lifting piece 105 is slidably attached to the linear guide 103. The other end of the lifting piece 105 is attached to a connecting member 107. The connecting member 107 is in an inverted L shape. The connecting member 107 is connected to the upper end of the back plate portion 93 .

[0105] When the motor 98 rotates, the threaded shaft 101 rotates. When the threaded shaft 101 rotates, the lifting pieces 105 move up and down in the vertical direction Z along the linear guides 103 in accordance with the rotation direction of the motor 98. As a result, for example, the lifter LF4 moves the two support parts 95 up and down to a plurality of height positions.

[0106] The underwater attitude change unit 24 corresponds to the attitude change unit of the present invention. The lifter LF4 corresponds to the carrier lifter of the present invention. The support unit 95 corresponds to the carrier support unit of the present invention. The lifting mechanism 97 corresponds to the carrier lifting mechanism of the present invention. The rotation mechanism 79 corresponds to the carrier rotation mechanism of the present invention. The operating shaft 87A and the engagement piece 87B correspond to the shaft of the present invention. The motor 89 corresponds to the rotation drive unit of the present invention.

[0107] 7, for example, the support portion 95 of the lifter LF4 is raised and lowered by the lifting mechanism 97 among a first height position P1, a second height position P2, a third height position P3, and a fourth height position P4. The fourth height position P4 is higher than the first height position P1. The second height position P2 is higher than the fourth height position P4. The third height position P3 is higher than the second height position P2.

[0108] When the support portion 95 of the lifter LF4 is located at the first height position P1, the support portion 95 is located near the bottom surface of the immersion tank 73. When the support portion 95 is located at the first height position P1, the rotation mechanism 79 clamps the intra-tank carrier 76, and the support portion 95 is separated from the bottom surface of the intra-tank carrier 76. When the support portion 95 is located at the first height position P1, the rotation mechanism 79 can vertically rotate the intra-tank carrier 76 in the longitudinal direction within the immersion tank 73.

[0109] When the support portion 95 of the lifter LF4 is located at the second height position P2, the entire intra-tank carrier 76 is located below the liquid level in the immersion tank 73, and the front opening 81 of the intra-tank carrier 76 is located below the liquid level. When the support portion 95 is located at the second height position P2, the rotation mechanism 79 can clamp the intra-tank carrier 76 with the front opening 881 facing upward. When the support portion 95 is located at the second height position P2, the engagement portion 85 of the intra-tank carrier 76 and the engagement piece 87B of the air cylinder 87 are aligned linearly in the horizontal direction, and the engagement portion 85 and the engagement piece 87B face each other in the horizontal direction.

[0110] When the support portion 95 of the lifter LF4 is located at the third height position P3, multiple substrates W can be transferred between the second transport mechanism WTR2 and the pusher 75. When the support portion 95 is located at the third height position P3, for example, the support portion 95 is located above the liquid level in the immersion tank 73. However, it is only necessary that the bottom of the intra-tank carrier 76 is located above the liquid level, so the support portion 95 does not necessarily have to be located above the liquid level.

[0111] When the support parts 95 of the lifter LF4 are located at the fourth height position P4, the intra-tank carrier 76, which holds multiple substrates W in a horizontal position, is located below the water surface in the immersion tank 73. The support parts 95 are displaced in stages from the fourth height position P4 to the third height position P3. By displacing the support parts 95 in stages, only the substrates W to be transported by the center robot CR can be positioned above the liquid surface of the immersion tank 73.

[0112] 8, a through-hole 109 is formed in the bottom of the immersion tank 73. In addition to the pusher 75, the underwater attitude changing unit 24 is equipped with a pusher rotation mechanism 110 and a pusher lifting mechanism 111.

[0113] The pusher rotation mechanism 110 includes, for example, a vertical shaft 113 (including a spline 121), a spline nut 123, an electric motor 125, a pulley 127, and a belt 129. The pusher lifting mechanism 111 includes, for example, the vertical shaft 113 (including a spline 121), a linear actuator 133, a movable member 134, and a lifting member 135. The vertical shaft 113 is shared by the pusher rotation mechanism 110 and the pusher lifting mechanism 111.

[0114] A vertical shaft 113 is inserted through the through hole 109 (see FIG. 8). The vertical shaft 113 is disposed so as to extend in the vertical direction. The upper end of the vertical shaft 113 is connected to the pusher 75. A spline 121 is formed on the lower part of the vertical shaft 113. The spline 121 is inserted into a spline nut 123. The spline 121 is movable up and down along the vertical axis AX7 relative to the spline nut 123. External teeth 121A formed on the outer peripheral surface of the spline 121 mesh with internal teeth formed on the inner peripheral surface of the spline nut 123. The spline 121 (vertical shaft 113) and the spline nut 123 rotate together around the vertical axis AX7.

[0115] A pulley 127 is connected to the rotation output shaft 125A of the electric motor 125. A belt 129 is looped around the pulley 127 and the spline nut 123. This transmits the rotation of the rotation output shaft 125A about the vertical axis AX8 to the spline nut 123. Furthermore, rotation of the spline nut 123 rotates the spline 121 (vertical shaft 113) about the vertical axis AX7. A linear actuator 133 pushes the movable member 134 downward and retracts it upward. A lifting member 135 is connected to the lower end of the movable member 134. Furthermore, the lifting member 135 holds the lower end of the vertical shaft 113 so that the vertical shaft 113 can rotate about the vertical axis AX7. The vertical shaft 113 moves up and down together with the lifting member 135. The linear actuator 133 includes an air cylinder or an electric motor.

[0116] When the electric motor 125 rotates the pulley 127, the pusher 75 rotates around the vertical axis AX7. When the linear actuator 133 raises the lifting member 135, the pusher 75 is raised. When the linear actuator 133 lowers the lifting member 135, the pusher 75 is lowered.

[0117] As shown in FIG. 8, when the front opening 81 of the intravessel carrier 76 faces upward, the pusher 75 can pass through the two openings 81, 82 of the intravessel carrier 76. The pusher 75 can pass between the two supports 95. The pusher 75 can also move up and down between a standby position and a receiving position. The standby position is a position on the bottom side of the immersion tank 73. The receiving position is a position above the immersion tank 73. When the pusher 75 is located at the receiving position, the pusher 75 is above the level of the immersion liquid in the immersion tank 73. The receiving position is a position where 25 substrates W are received from the second transport mechanism WTR2.

[0118] The pusher 75 has a plurality of (e.g., 50) holding grooves that hold from below a plurality of (e.g., 50) substrates W. When the pusher 75 transitions from a state in which it is positioned above the intravessel carrier 76 to a state in which it is positioned below the intravessel carrier 76, the intravessel carrier 76 receives 25 substrates W1 from the pusher 75.

[0119] The substrate processing apparatus 1 includes a control unit 141 (see FIG. 1) and a storage unit (not shown). The control unit 141 controls each component of the substrate processing apparatus 1. The control unit 141 includes one or more processors, such as a central processing unit (CPU). The storage unit includes at least one of a read-only memory (ROM), a random-access memory (RAM), and a hard disk. The storage unit stores computer programs required to control each component of the substrate processing apparatus 1.

[0120] Although the batch transport mechanism HTR can transport 25 substrates W, the number of substrates W that can be transported is not limited to 25. For example, the number of substrates W that can be transported may be 5. Furthermore, although the first transport mechanism WTR1 can transport 50 substrates W, the number of substrates W that can be transported is not limited to 50.

[0121] The second transport mechanism WTR2 can transport 25 substrates W, but the number of substrates W that can be transported is not limited to 25. For example, the number of substrates W that can be transported may be 26. In this case, the pair of chucks 41, 42 has 26 pairs of holding grooves 43, 44.

[0122] <7. Operational Description>

[0123] Next, the operation of the substrate processing apparatus 1 will be described with reference to Figure 1. An external transfer robot (not shown) transfers two carriers C in sequence to the loading section 11. Figure 9 is a flowchart for explaining the operation of the substrate processing apparatus 1. For convenience of illustration, in Figures 12(a) to 16(d), the first substrate group is made up of three substrates W1, and the second substrate group is also made up of three substrates W2.

[0124] [Step S01] Transferring substrates from carriers The transport mechanism 17 in the stocker block 5 transports the first carrier C to the delivery shelf 18A. The bulk transport mechanism HTR in the transfer block 7 takes out 25 horizontally oriented substrates W1 all at once from the first carrier C placed on the shelf 18A and transports them to the posture conversion unit 20. The transport mechanism 17 then transports the empty first carrier C to another shelf 18. The transport mechanism 17 then transports the second carrier C to the delivery shelf 18A. The bulk transport mechanism HTR takes out 25 horizontally oriented substrates W2 all at once from the second carrier C placed on the shelf 18A and transports them to the posture conversion unit 20.

[0125] [Step S02] Transformation to vertical posture Fifty substrates W (W1, W2) on two carriers C are transported in groups of 25 to the attitude changing unit 20. As shown in Figures 3(a) to 3(f), the attitude changing unit 20 and pusher mechanism 21 align the 50 substrates W face-to-face at a half pitch (5 mm) and convert the attitude of the 50 substrates W from horizontal to vertical. The pusher mechanism 21 transports the 50 substrates W in a vertical attitude below the two chucks 23 of the first transport mechanism WTR1, which has been moved to the substrate transfer position P of the transfer block 7.

[0126] [Step S03] Chemical treatment (batch treatment) The first transport mechanism WTR1 receives 50 substrates W in a vertical position from the pusher mechanism 21 and transports the 50 substrates W to one of the two lifters LF1, LF2 of the two batch processing units BPU1, BPU2. For example, the first transport mechanism WTR1 transports the 50 substrates W to the lifter LF1 of the first batch processing unit BPU1. The lifter LF1 receives the 50 substrates W at a position above the processing bath 26A. The lifter LF1 immerses the 50 substrates W in the phosphoric acid in the processing bath 26A. This allows the 50 substrates W to be etched. After the etching process, the lifter LF1 lifts the 50 substrates W out of the phosphoric acid in the processing bath 26A. Note that when the 50 substrates W are transported to the lifter LF2 of the second batch processing unit BPU2, the same process as in the first batch processing unit BPU1 is performed.

[0127] [Step S04] Pure water cleaning process (batch processing) The first transport mechanism WTR1 receives 50 substrates W in a vertical position from the lifter LF1 (or lifter LF2) and transports the 50 substrates W to the lifter LF3 of the third batch processing unit BPU3. The lifter LF3 receives the 50 substrates W (a group of processed substrates) that have been processed in one of the batch processing units BPU1, BPU2 at a position above the processing bath 26C. The lifter LF3 immerses the 50 substrates W in pure water in the processing bath 26C. This allows the 50 substrates W to be cleaned.

[0128] While the substrate W is immersed in the pure water, the pure water may be continuously supplied to the processing tank 26C from the jet pipe 145 (see FIG. 12(a)). Also, the first transport mechanism WTR1 is moved to a position where it does not interfere with the second transport mechanism WTR2.

[0129] [Step S05] Change posture to horizontal posture underwater The underwater posture conversion unit 24 converts the posture of the substrates W that have been subjected to the cleaning process from vertical to horizontal. Here, the following problem occurs. Specifically, when the postures of 50 substrates W spaced at half pitch (5 mm intervals) are converted all at once, one hand 29 of the center robot CR may not be able to properly enter the gap between two of the 50 substrates W. As a result, one hand 29 may not be able to properly remove the substrates W.

[0130] Furthermore, when the substrates W are aligned face-to-face, some of the substrates W converted to a horizontal position have their device surfaces facing upward, while others have their device surfaces facing downward. For example, it is not desirable for the hand 29 of the center robot CR to come into contact with the device surfaces of the substrates W. It is also not desirable for substrates W with device surfaces facing different directions to be transported to each of the single wafer processing units SWP1 to SWP3.

[0131] Therefore, in this embodiment, the distance between two adjacent substrates W is widened and the device surfaces of the 50 substrates W are aligned with one another. This will be specifically described with reference to steps S11 to S25 of the flowcharts in FIGS. 10 and 11.

[0132] [Step S11] Transporting the first substrate group above the underwater attitude change unit The lifting mechanism 28 of the lifter LF3 performs a first relative lifting operation between the substrate holder 27 of the lifter LF3 and the second transport mechanism WTR2 at a predetermined transfer position. Here, the predetermined transfer position is a position determined by the inter-tank moving part 55 and the substrate alignment direction moving part 53 of the second transport mechanism WTR2.

[0133] Furthermore, the second transport mechanism WTR2 uses the first relative lifting and lowering operation to hold and remove every other 25 substrates W1 of the first substrate group (first divided substrate group) from the substrate holding section 27, using the holding grooves 43, 44. The second transport mechanism WTR2 then transports the removed 25 substrates W1 of the first substrate group to the underwater posture changing section 24. Furthermore, the second transport mechanism WTR2 uses the first relative lifting and lowering operation to pass the remaining 25 substrates W2 of the second substrate group (second divided substrate group) through the passing grooves 45, 46, thereby maintaining the 25 substrates W2 of the second substrate group held by the substrate holding sections 27 of the lifter LF2. These operations will now be described in detail.

[0134] The inter-tank moving unit 55 of the second transport mechanism WTR2 moves the two chucks 41, 42 above the lifter LF3 of the third batch processing unit BPU3. The swinging unit 51 separates the two tip ends of the two chucks 41, 42, thereby opening the two chucks 41, 42. The substrate alignment direction moving unit 53 moves the two chucks 41, 42 in the Y direction, thereby moving the two chucks 41, 42 to the first holding position. The first holding position is a position formed by 25 pairs of holding grooves 43, 44 holding the 25 substrates W1 of the first substrate group.

[0135] Thereafter, the lifting mechanism 28 of the lifter LF3 raises the substrate holders 27 holding the 50 substrates W. As a result, the 50 substrates W are lifted up from the pure water in the processing bath 26C.

[0136] See Figure 12(a). Thereafter, the second transport mechanism WTR2 clamps the 50 substrates W held by the substrate holding portions 27 of the lifter LF3 between the two chucks 41 and 42. As a result, as shown by the circled frames in Figure 12(a), the substrate W1 is stored in each of the holding grooves 43 and 44 of the chucks 41 and 42. Furthermore, the substrate W2 is stored in each of the passing grooves 45 and 46. The circled frames in Figure 12(a) show a plan view of how the substrates W1 (W2) are stored in each of the holding grooves 43 and 44 and the passing grooves 45 and 46 of the chucks 41 and 42.

[0137] The 50 substrates W are configured by alternately arranging 25 substrates W1 and 25 substrates W2 one by one. The 50 substrates W are arranged face-to-face at a half pitch. As indicated by the arrow AR in the circle in Figure 12(a), the device surface of each substrate W1 faces to the right Y. The device surface of each substrate W2 faces to the left Y.

[0138] See FIG. 12(b). Thereafter, the lifting mechanism 28 of the lifter LF3 lowers the substrate holder 27. As a result, the substrate W1 stored in each of the holding grooves 43 and 44 of the chucks 41 and 42 is held by the chucks 41 and 42. On the other hand, the substrate W2 stored in each of the passage grooves 45 and 46 of the chucks 41 and 42 is not held by the chucks 41 and 42 and remains on the lifter LF3. In other words, the second transport mechanism WTR2 can extract the 25 substrates W1 of the first substrate group from the 50 substrates W held by the substrate holder 27 of the lifter LF3. The 25 substrates W1 are arranged at a full pitch. This allows the distance between two adjacent substrates W to be increased. The full pitch (first pitch) is twice the half pitch (second pitch).

[0139] The 25 substrates W2 of the second substrate group that were not removed by the second transport mechanism WTR2 and remain on the substrate holders 27 of the lifter LF3 are immersed in the pure water in the processing bath 26C. This prevents the substrates W2 of the second substrate group from drying out. The upper circle in Figure 12(b) is a plan view showing the two chucks 41, 42 of the second transport mechanism WTR2 holding the 25 substrates W1. The lower circle in Figure 12 is a plan view showing the lifter LF3 holding the 25 substrates W2.

[0140] [Step S12] Receiving the first group of substrates by the pusher See Figure 12(c). The 25 substrates W2 held by the lifter LF3 are immersed in pure water in the processing tank 26C. After the second transport mechanism WTR2 removes the 25 substrates W1, the second transport mechanism WTR2 moves above the immersion tank 73 and pusher 75 of the submersible position change unit 24. The pusher lifting mechanism 111 (see Figure 8) then raises the pusher 75 above the intra-tank carrier 76, the front opening 81 of which faces upward. The pusher 75 holds the 25 substrates W1 supported by the second transport mechanism WTR2 from below.

[0141] Thereafter, the two chucks 41, 42 of the second transport mechanism WTR2 release their hold on the 25 substrates W1. Specifically, the swinging unit 51 opens the two chucks 41, 42. This allows the pusher 75 to receive the 25 substrates W1 from the second transport mechanism WTR2. Thereafter, the second transport mechanism WTR2 moves, for example, from a position above the submersible attitude change unit 24.

[0142] [Step S13] Rotate the first substrate group 180 degrees around the vertical axis See Figure 13(a). The pusher rotation mechanism 110 (see Figure 8) rotates the pusher 75 holding the 25 substrates W1 by 180 degrees around the vertical axis AX7. This reverses the orientation of each substrate W1, whose device surface faces in the direction from the back to the front (rightward Y) in Figures 12(b) and 12(c). This causes each substrate W1 to face in the direction from the front to the back (leftward Y). Therefore, the device surface of each substrate W1 in a horizontal orientation that has undergone orientation conversion, which will be described later, can be turned upward.

[0143] [Step S14] Place the first group of substrates into the in-tank carrier 13(b). Then, the lifting mechanism 97 of the lifter LF4 raises the two supports 95 on which the intratank carrier 76 is placed to the third height position P3. As a result, the intratank carrier 76 is removed from the pure water in the immersion tank 73. Furthermore, the pusher 75 changes from being positioned above the intratank carrier 76 to being positioned below the intratank carrier 76. As a result, the intratank carrier 76 receives the 25 substrates W1 from the pusher 75. That is, the 25 substrates W1 of the first substrate group that have been rotated 180 degrees are stored in the intratank carrier 76.

[0144] [Step S15] Immerse the first group of substrates in pure water stored in an immersion tank See Figure 13(c). The pusher lifting mechanism 111 (see Figure 8) lowers the pusher 75 to near the bottom of the immersion tank 73. Furthermore, the lifting mechanism 97 of the lifter LF4 lowers the support part 95 on which the intra-tank carrier 76 is placed to the second height position P2. As a result, the 25 substrates W1 stored in the intra-tank carrier 76 are immersed in the pure water in the immersion tank 73.

[0145] [Step S16] Change the orientation of the first group of substrates from vertical to horizontal See Figure 14(a). The rotation mechanism 79 (see Figure 6) activates the air cylinder 87 to advance the operating shaft 87A toward the intra-tank carrier 76. The rotation mechanism 79 advances the operating shaft 87A to the coupling position. As a result, the engaging piece 87B of the air cylinder 87 engages with the engaging portion 85 of the intra-tank carrier 76. The intra-tank carrier 76 is clamped between the pair of operating shafts 87A with its lower portion supported by the support portion 95 of the lifter LF4. Thereafter, the lifting mechanism 97 lowers the support portion 95 to the first height position P1. As a result, the intra-tank carrier 76 is clamped only by the pair of operating shafts 87A.

[0146] See FIG. 14(b). The motor 89 of the rotation mechanism 79, together with the air cylinder 87, rotates the intra-tank carrier 76 around the axis in the front-rear direction X. That is, the intra-tank carrier 76 is rotated 90 degrees from a state in which the front opening 81 faces upward toward the second row R2 where the center robot CR is located. This causes the intra-tank carrier 76 to change from a horizontal position (horizontally elongated state) to a vertical position (vertically elongated state). Therefore, the position of the 25 substrates W1 is changed from vertical to horizontal. At this time, the 25 substrates W1 in the intra-tank carrier 76 remain immersed in the pure water in the immersion tank 73. Even a portion of the 25 substrates W1 is not exposed from the pure water when the position change is performed.

[0147] See Figure 14(c). The lifting mechanism 97 raises the support portion 95 of the lifter LF4 to the fourth position P4. As a result, the support portion 95 of the lifter LF4 holds the in-tank carrier 76 in the vertical position in the liquid. Furthermore, the air cylinder 87 is contracted, and the operating shaft 87A is moved to the open position. As a result, the in-tank carrier 76 is held only by the support portion 95 of the lifter LF4.

[0148] [Step S17] Removal of substrates in the first substrate group from the in-tank carrier See Figures 15(a) and 15(b). The lifting mechanism 97 raises the support part 95 of the lifter LF4 from the fourth position P4. This raises the intra-tank carrier 76 to a position where only the uppermost substrate W1 is exposed above the liquid surface. This substrate W1 is the target to be transported by the center robot CR. As a result, the uppermost substrate W1 is exposed above the liquid surface of the immersion tank 73 with the pure water stored in the immersion tank 73 on its upper surface. In this state, the center robot CR advances the hand 29 into the intra-tank carrier 76 and transports the uppermost substrate W1 out.

[0149] When the center robot CR moves to the submersible posture conversion unit 24 to transport the next substrate W, the lifting mechanism 97 further raises the intra-tank carrier 76. Specifically, the lifting mechanism 97 raises the support unit 95 etc. so that only the next substrate W1 is exposed above the liquid surface of the immersion tank 73. In this state, the center robot CR unloads the substrate W1. In this way, each time the center robot CR moves, the lifting mechanism 97 gradually raises the intra-tank carrier 76. As a result, all of the substrates W1 are transported by the center robot CR while remaining wet with pure water.

[0150] That is, from the time when the 25 substrates W1 are immersed in the pure water in the immersion tank 73 until the center robot CR removes the substrates W1, the 25 substrates W1 remain in the pure water. Therefore, the submersible posture conversion unit 24 prevents the substrates W1 from drying out. This makes it possible to prevent the patterns formed on the device surfaces of the substrates W from collapsing due to drying. The same applies to the substrates W2 of the second substrate group.

[0151] [Step S18] Prepare to receive the second group of substrates 15(c), after the center robot CR has transported all 25 substrates W in the intra-tank carrier 76, the submersible attitude conversion unit 24 returns the intra-tank carrier 76 from the state in which the front opening 81 is oriented sideways as shown in FIG. 15(a) to the state in which the front opening 81 is oriented upward.

[0152] 14(c), the lifter LF3 holds 25 substrates W2 and immerses the 25 substrates W2 in pure water in the processing bath 26 C. Next, the postures of the remaining 25 substrates W2 (second substrate group) held by the lifter LF3 are changed.

[0153] [Step S19] Transporting the second substrate group above the underwater attitude change unit An overview of the operation of this step will be described below. The substrate alignment direction moving unit 53 horizontally moves the substrate holding unit 27 of the lifter LF3, which holds the 25 substrates W2 of the second substrate group after the 25 substrates W1 of the first substrate group have been extracted, and the second transport mechanism WTR2 relatively by a predetermined interval (e.g., half pitch) in the alignment direction of the 25 substrates W2.

[0154] After this horizontal movement, the lifting mechanism 28 of the lifter LF3 performs a second relative lifting operation between the substrate holding parts 27 of the lifter LF3 and the second transport mechanism WTR2 at a predetermined transfer position. The second transport mechanism WTR2 receives the 25 substrates W2 of the second substrate group held by the substrate holding parts 27 of the lifter LF3 by the second relative lifting operation, by holding them in the holding grooves 43, 44. The second transport mechanism WTR2 then transports the received 25 substrates W2 of the second substrate group to the underwater attitude conversion unit 24. These operations will now be described in detail.

[0155] The inter-tank moving unit 55 of the second transport mechanism WTR2 moves the two chucks 41, 42 above the lifter LF3. The swinging unit 51 opens the two chucks 41, 42. The substrate alignment direction moving unit 53 moves the two chucks 41, 42 in the Y direction by a distance equivalent to the half pitch, thereby moving the two chucks 41, 42 to the second holding position. The second holding position is a position where the 25 pairs of holding grooves 43, 44 can hold the 25 substrates W2 of the second substrate group.

[0156] See Figure 15(c). The lifting mechanism 28 of the lifter LF3 raises the substrate holder 27 holding the 25 substrates W2, thereby lifting them out of the pure water in the processing bath 26C. Thereafter, the swinging mechanism 51 of the second transport mechanism WTR2 closes the two chucks 41, 42, thereby sandwiching the 25 substrates W2 between the two chucks 41, 42. At this time, the 25 substrates W2 are stored in each of the 25 pairs of holding grooves 43, 44 of the two chucks 41, 42. Thereafter, the lifting mechanism 28 of the lifter LF3 lowers the substrate holder 27. As a result, the two chucks 41, 42 of the second transport mechanism WTR2 hold the 25 substrates W2.

[0157] While holding the 25 substrates W2, the inter-tank transfer unit 55 moves the 25 substrates W2 from a position above the lifter LF3 to a position above the pusher 75 of the submersible attitude change unit 24.

[0158] [Step S20] Receiving the second group of substrates by the pusher See Figure 15(d). The pusher lifting mechanism 111 (see Figure 8) raises the pusher 75 above the intra-tank carrier 76, whose front opening 81 faces upward. The pusher 75 also holds, from below, the 25 substrates W2 held by the second transport mechanism WTR2. The swinging unit 51 then opens the two chucks 41, 42. This allows the pusher 75 to receive the 25 substrates W2 from the second transport mechanism WTR2. The second transport mechanism WTR2 then moves, for example, from a position above the submersible attitude change unit 24.

[0159] [Step S21] Place the second group of substrates into the in-tank carrier Thereafter, the lifting mechanism 97 of the lifter LF4 raises the two supports 95 on which the intra-tank carrier 76 is placed to the third height position P3. As a result, the intra-tank carrier 76 is removed from the pure water in the immersion tank 73, and the 25 substrates W2 held by the pusher 75 are stored in the intra-tank carrier 76.

[0160] [Step S22] Immerse the second group of substrates in pure water stored in an immersion tank 16(a), the linear actuator 133 then lowers the pusher 75 to near the bottom of the immersion tank 73. The lifting mechanism 97 also immerses the intra-tank carrier 76 in the pure water in the immersion tank 73.

[0161] [Step S23] Change the orientation of the second group of substrates from vertical to horizontal See FIG. 16(b). The rotation mechanism 79 activates the air cylinder 87 to move the operating shaft 87A to the coupled position. As a result, the two operating shafts 87A clamp the two side walls 76B of the intra-tank carrier 76. The lifting mechanism 97 of the lifter LF4 then lowers the support member 95 to the first height position P1. The motor 89 of the rotation mechanism 79 then rotates the intra-tank carrier 76, together with the air cylinder 87, around the operating shaft 87A. This changes the orientation of the 25 substrates W2 from vertical to horizontal. Even a portion of the 25 substrates W2 is not exposed to the pure water during the orientation change. After the orientation change, the front opening 81 of the intra-tank carrier 76 faces the second row R2 where the center robot CR is located. The device surface of each of the 25 horizontally positioned substrates W2 faces upward.

[0162] The lifting mechanism 97 of the lifter LF4 raises the support part 95 to the fourth position P4. As a result, the support part 95 of the lifter LF4 holds the in-tank carrier 76 in the liquid in a vertical position. Furthermore, the air cylinder 87 is contracted, and the operating shaft 87A is moved to the open position. As a result, the in-tank carrier 76 is held only by the lifter LF4.

[0163] [Step S24] Removal of substrates of the second substrate group from the carrier in the tank See Figures 16(c) and 16(d). The lifting mechanism 97 of the lifter LF4 raises the support part 95 from the fourth position P4. This raises one of the 25 substrates W2 from the liquid surface. The center robot CR removes the substrate W2 that has been raised from the liquid surface from the intra-tank carrier 76. As a result, the substrate W2 is transported by the center robot CR while still wet with pure water. Note that the 25 substrates W2 are arranged at full pitch, making it easy for the hand 29 of the center robot CR to enter.

[0164] [Step S25] Prepare to receive the next group of substrates After the center robot CR has transported all 25 substrates W2 in the intra-tank carrier 76, the submersible posture conversion unit 24 returns the intra-tank carrier 76 from the state in which the front opening 81 is sideways, as shown in FIG. 16(c), to the state in which the front opening 81 is facing upward. This prepares the intra-tank carrier 76 to receive the next group of substrates. Note that the first transport mechanism WTR1 has transported the next 50 substrates W to be processed to the lifter LF3. The 50 substrates W are immersed in pure water stored in the processing tank 26C. This prevents the substrates W from drying out.

[0165] [Step S06] First single wafer processing Returning to the explanation of the flowchart of Fig. 9, the substrate W transported by the center robot CR as described above is processed, for example, as follows.

[0166] The center robot CR transports the substrate W (W1, W2) removed from the intra-tank carrier 76 to one of the single wafer processing units SWP1 and SWP2. For example, the center robot CR transports the substrate W to the first single wafer processing unit SWP1. During transport, the device side of the substrate W faces upward. The rotation unit 33 of the first single wafer processing unit SWP1 holds the transported substrate W and rotates the substrate W around a vertical axis. The first single wafer processing unit SWP1 also supplies deionized water to the device side of the substrate W from the nozzle 35. Thereafter, the first single wafer processing unit SWP1 supplies IPA to the device side of the substrate W from the nozzle 35 to replace the deionized water on the substrate W with IPA. The second single wafer processing unit SWP2 performs the same processing as the first single wafer processing unit SWP1.

[0167] [Step S07] Second Single-Wafer Processing (Drying Processing) Thereafter, the center robot CR receives the substrate W from the rotation processing unit 33 of one of the single wafer processing units SWP1, SWP2, and transports the substrate W into the supercritical fluid chamber 37 of the third single wafer processing unit SWP3. The supercritical fluid chamber 37 performs a drying process on the substrate W using carbon dioxide in a supercritical state. This dries the substrate W, but prevents the pattern formed on the substrate W from collapsing.

[0168] [Step S08] Transferring substrates from the substrate buffer to the carrier The substrates W that have been processed in the supercritical fluid chamber 37 are transported by the center robot CR to the buffer unit 31. The center robot CR places the substrates W on the loading shelf 39 of the buffer unit 31. When one lot (25 substrates) of substrates W1 are placed in the buffer unit 31, the batch transport mechanism HTR removes the 25 substrates W1 from the buffer unit 31 all at once and transports the 25 substrates W1 into an empty first carrier C placed on the shelf 18A. Thereafter, the transport mechanism 17 transports the first carrier C to the dispensing unit 13.

[0169] Furthermore, when one lot of substrates W2 is placed in the buffer section 31, the batch transport mechanism HTR transports 25 substrates W2 into a second carrier C placed on the shelf 18A. Thereafter, the transport mechanism 17 transports the second carrier C to the dispensing section 13. Thereafter, an external transport mechanism (not shown) transports the two carriers C in order to their next destinations.

[0170] According to this embodiment, the pair of chucks 41, 42 of the second transport mechanism WTR2 have holding grooves 43, 44 and passage grooves arranged alternately. Therefore, the pair of chucks 41, 42 can extract every other substrate W1 (W2) from a processing substrate group consisting of 50 substrates W held by the substrate holder 27 of the lifter LF3, and transport each of the extracted divided substrate groups (25 substrates W1 and 25 substrates W2) to the submersible posture conversion unit 24. This allows for a wider spacing between two adjacent substrates W1 (W2). Furthermore, the posture of the extracted substrate W1 (W2) is converted from vertical to horizontal by the submersible posture conversion unit 24. Therefore, for example, the hand 29 of the center robot CR can enter between two adjacent substrates W1 (W2), allowing the center robot CR to easily extract one substrate W1 (W2).

[0171] The substrate processing apparatus 1 further includes a first transport mechanism WTR1 that can transport 50 substrates W (a group of substrates to be processed) in a batch to the substrate holding portion 27 of the lifter LF3. The first transport mechanism WTR1 can transport 50 substrates W in a batch to the substrate holding portion 27. The second transport mechanism WTR2 can transport each of the divided substrate groups (25 substrates W1 and 25 substrates W2) that are extracted in two batches from the 50 substrates W held by the substrate holding portion 27.

[0172] The substrate processing apparatus 1 further includes a processing tank 26C that stores pure water. The lifting mechanism 28 of the lifter LF3 raises and lowers the substrate holder 27. When the second transport mechanism WTR2 is not transporting each of the divided substrate groups (25 substrates W1 and 25 substrates W2), the lifting mechanism 28 immerses the 50 substrates W or the second divided substrate group (25 substrates W2) in the pure water stored in the processing tank 26C. Because the substrates W (W1, W2) are immersed in the pure water stored in the processing tank 26C, drying of the substrates W can be prevented.

[0173] The submersible attitude changing unit 24 also includes an intra-tank carrier 76 having a front opening 81 for passing each of the divided substrate groups, and two side walls 76B with 50 pairs of substrate holding grooves 84 arranged opposite each other to store each of the divided substrate groups that have passed through the front opening 81. The intra-tank carrier 76 has a back wall 76A facing the front opening 81, in which a back opening 82 having an area smaller than that of the front opening 81 is formed. The submersible attitude changing unit 24 also includes a lifter LF4 having a support part 95 for supporting the intra-tank carrier 76 and an elevating mechanism 97 for raising and lowering the support part 95, an immersion tank 73 that houses the intra-tank carrier 76 and the support part 95 and stores pure water, and a rotation mechanism 79 that rotates the intra-tank carrier 76, which is immersed in pure water in the immersion tank 73, about a horizontal axis (operating axis 87A) to collectively change the attitude of each of the divided substrate groups from vertical to horizontal.

[0174] The underwater attitude conversion unit 24 also includes a pusher 75 that holds, from below, each of the divided substrate groups held by the second transport mechanism WTR2, a pusher lifting mechanism 111 that raises and lowers the pusher 75, and a pusher rotation mechanism 110 that rotates the pusher 75 about the vertical axis AX7. When the front opening 81 of the intratank carrier 76 faces upward, the pusher 75 can pass through the back opening 82 and front opening 81 of the intratank carrier 76 to raise and lower between a position on the bottom side of the immersion tank 73 and a position above the immersion tank 73, and the intratank carrier 76 is configured to receive each of the divided substrate groups from the pusher 75 when the pusher 75 transitions from being positioned above the intratank carrier 76 to being positioned below the intratank carrier 76.

[0175] The submersible attitude conversion unit 24 stores one of the divided substrate groups in the intra-tank carrier 76, while immersing the intra-tank carrier 76 in the pure water in the immersion tank 73. The submersible attitude conversion unit 24 then rotates the intra-tank carrier 76 immersed in the pure water about a horizontal axis (operating axis 87A), thereby converting the attitude of the divided substrate group from vertical to horizontal. Therefore, each substrate W1 (W2) remains immersed in pure water until the center robot CR removes the horizontally oriented substrate W1 (W2) from the intra-tank carrier 76. This prevents the substrate W1 (W2) from drying out, thereby preventing the pattern on the substrate W1 (W2) from collapsing.

[0176] The control unit 141 also causes the pusher lifting mechanism 111 to raise the pusher 75 above the intratank carrier 76, whose front opening 81 faces upward, so that the pusher 75 receives the first group of divided substrates (25 substrates W1) from the second transport mechanism WTR2. The control unit 141 causes the pusher rotation mechanism 110 to rotate the pusher 75 holding the first group of divided substrates 180 degrees about the vertical axis AX7. The control unit 141 causes the intratank carrier 76 to relatively raise, so that the first group of divided substrates rotated 180 degrees is stored in the intratank carrier 76. The control unit 141 causes the rotation mechanism 79 to rotate the intratank carrier 76, which is immersed in the pure water in the immersion tank 73, about the horizontal axis, thereby changing the orientation of the first group of divided substrates from vertical to horizontal.

[0177] Before the first group of divided substrates (25 substrates W1) is stored in the intra-tank carrier 76, the orientation of the first group of divided substrates (25 substrates W1) can be set in any direction.

[0178] The rotation mechanism 79 also includes two actuating shafts 87A configured to clamp and release the intravessel carrier 76, and two motors 89 that rotate the two shafts around a horizontal axis that is the central axis of at least one of the two shafts. The two actuating shafts 87A and the two motors 89 can change the positions of the 25 substrates W1 stored in the intravessel carrier 76 in the liquid. Note that in Figure 6, for example, one of the two motors 89 may not be provided. In this case, one motor 89 rotates the intravessel carrier 76 clamped between the two actuating shafts 87A.

[0179] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0180] (1) In the above-described embodiment, the substrate processing apparatus 1 includes a first transport mechanism WTR1 for transporting 50 substrates W aligned at a half pitch and a second transport mechanism WTR2 for transporting 25 substrates W1 (W2) aligned at a full pitch. In this regard, the substrate processing apparatus 1 does not necessarily have to include the first transport mechanism WTR1. In other words, the second transport mechanism WTR2 may be configured to further transport 50 substrates W aligned at a half pitch.

[0181] Fig. 17(a) is a side view showing one chuck 41 and the swinging unit 51 of the second transfer mechanism WTR2 according to the modified example. Fig. 17(b) is a vertical cross-sectional view showing the holding grooves 43, 44 and the upper holding grooves 151, 152 as seen in the direction of the arrow EE in Fig. 17(a). Fig. 17(c) is a vertical cross-sectional view showing the passing grooves 45, 46 and the upper holding grooves 151, 152 as seen in the direction of the arrow FF in Fig. 17(a). Note that in Fig. 17(a), for convenience of illustration, the chuck 41 is shown to have three holding grooves 43, three passing grooves 45, and six upper holding grooves 151.

[0182] The second transport mechanism WTR2 further includes multiple pairs (e.g., 50 pairs) of upper holding grooves 151, 152. The 50 pairs of upper holding grooves 151, 152 are provided above the 25 pairs of holding grooves 44, 45 and the 25 pairs of passing grooves 45, 46. The multiple pairs of upper holding grooves 151, 152 are provided in a pair of chucks 41, 42. The upper holding grooves 151, 152 are arranged opposite each other. Each upper holding groove 151, 152 holds one substrate W in a vertical position. The 50 pairs of upper holding grooves 151, 152 are arranged in the alignment direction of the 50 substrates W (processing substrate group) at intervals equal to the intervals (half pitch) at which the 50 substrates W are aligned.

[0183] 1, the second transport mechanism WTR2 of this modified example transports 50 substrates W between the pusher mechanism 21 and the three lifters FL1 to FL3. Furthermore, the second transport mechanism WTR2 transports 25 substrates W1 (W2) between the lifter LF3 and the pusher 75.

[0184] According to this modification, the pair of chucks 41, 42 have two functions. Specifically, the first function is to hold every other substrate W1 (W2) using the pair of holding grooves 44, 45 and the pair of passing grooves 45, 46. The second function is to hold the substrates W aligned continuously, rather than every other substrate, using the pair of upper holding grooves 151, 152. According to this embodiment, it is not necessary to provide the first transport mechanism WTR1 having the second function in addition to the second transport mechanism WTR2 having the first function. This allows the number of transport mechanisms to be reduced.

[0185] (2) In the above-described embodiment and modified example (1), as shown in FIG. 1, the first row R1 includes two chemical processors CHB1 and CHB2, one pure water processor ONB, and an underwater posture conversion unit 24. In this regard, the first row R1 may further include one or more pure water processors ONB2 (batch processor BPU4). This allows the second pure water processor ONB2 to perform pure water cleaning on the other 50 substrates W while the 25 substrates W2 of the second substrate group are immersed in pure water in the processing tank 26C of the first pure water processor ONB. The first row R1 may include one or more chemical processors.

[0186] (3) In the above-described embodiment and each modified example, when the substrate W is transferred to the center robot CR, the intra-tank carrier 76 and the support part 95 are raised relative to the immersion tank 73. However, the present invention is not limited to such an embodiment. For example, the immersion tank 73 may be lowered relative to the intra-tank carrier 76 and the support part 95.

[0187] (4) In the above-described embodiment and each modified example, the third single wafer processing unit SWP3 includes a supercritical fluid chamber 37 and performs a drying process on the substrate W using a supercritical fluid. However, the third single wafer processing unit SWP3 may include a rotation processing unit 33 and a nozzle 35, similar to each of the single wafer processing units SWP1 and SWP2. That is, each of the single wafer processing units SWP1 to SWP3 includes a rotation processing unit 33 and a nozzle 35. For example, each of the single wafer processing units SWP1 to SWP3 may perform spin drying after processing with pure water and IPA.

[0188] (5) In the above-described embodiment and each modified example, the submersible posture conversion unit 24 raised the substrates W one by one from the liquid surface. However, the present invention is not limited to this configuration. That is, if the center robot CR has two hands 29, the submersible posture conversion unit 24 may raise the substrates W two by two from the liquid surface. In other words, the substrates W may be raised from the liquid surface according to the number of hands 29 of the center robot CR. Furthermore, in order to transport, for example, one substrate W from the intravessel carrier 76, two or more substrates W in the intravessel carrier 76 may be raised from the liquid surface.

[0189] (6) In the above-described embodiment and each modified example, the substrate processing apparatus 1 includes the load-unload block 3 and the stocker block 5. However, the substrate processing apparatus 1 does not have to include the load-unload block 3 and the stocker block 5. In this case, multiple shelves 18A may be provided on the outer wall of the transfer block 7. That is, the multiple shelves 18A may be provided adjacent to the transfer block 7. The batch transport mechanism HTR may then sequentially transport, for example, 25 substrates W1 (W2) from two carriers C placed on each of the two shelves 18A.

[0190] (7) In the above-described embodiment and each modified example, the substrate alignment direction moving unit 53 of the second transport mechanism WTR2 horizontally moves the pair of chucks 41, 42 relative to the substrate holding unit 27 of the lifter LF3 in the alignment direction (width direction Y) in which the 50 substrates W (substrates to be processed) are aligned. As a result, the chucks 41, 42 are moved between the first holding position and the second holding position.

[0191] In this regard, the lifter LF3 of the pure water processing unit ONB may be provided with a moving unit (not shown) instead of the substrate alignment direction moving unit 53 of the second transport mechanism WTR2. In this case, the moving unit of the lifter LF3 may horizontally move the substrate holder 27 relative to the chucks 41, 42 of the second transport mechanism WTR2 in the alignment direction of the 50 substrates W. The substrate alignment direction moving unit 53 of the second transport mechanism WTR2 or the moving unit of the lifter LF3 corresponds to the alignment direction relative moving unit of the present invention.

[0192] (8) In the above-described embodiment and modifications, the lifting mechanism 28 of the lifter LF3 raises and lowers the substrate holding unit 27 relative to the second transport mechanism WTR2 (the pair of chucks 41, 42). In this regard, the second transport mechanism WTR2 may be provided with a lifting mechanism (not shown). In this case, the lifting mechanism of the second transport mechanism WTR2 may raise and lower at least the pair of chucks 41, 42 and the swinging unit 51 relative to the substrate holding unit 27 of the lifter LF3.

[0193] Furthermore, the lifting mechanism 28 of the lifter LF3 may raise and lower the substrate holding part 27, and the lifting mechanism of the second transport mechanism WTR2 may raise and lower at least the pair of chucks 41, 42 and the swinging part 51. In other words, at least one of the lifting mechanism 28 of the lifter LF3 and the lifting mechanism of the second transport mechanism WTR2 corresponds to the relative lifting part of the present invention.

[0194] (9) In the above-described embodiment and each modified example, as shown in FIG. 13(b), the intravessel carrier 76 is raised relative to the pusher 75 in order to store the substrate W1 in the intravessel carrier 76. However, the pusher 75 may be lowered. Alternatively, the pusher 75 may be lowered and the intravessel carrier 76 may be raised.

[0195] (10) In the above-described embodiment and each modified example, each batch processing unit BPU1 to BPU3 collectively processed 50 substrates W arranged at half pitch and in a face-to-face manner. However, each batch processing unit BPU1 to BPU3 may collectively process 50 substrates W arranged at half pitch and in a face-to-back manner. The face-to-back arrangement is an arrangement in which the device surface and back surface of two adjacent substrates W1, W2 face each other. In other words, the 50 substrates W arranged in a face-to-back arrangement face in the same direction.

[0196] In the case of the face-to-back method, step S13 in Fig. 10 (rotating the first substrate group 180 degrees about the vertical axis) does not have to be performed. Alternatively, in step S13 in Fig. 10, the 25 substrates W1 of the first substrate group may be rotated 180 degrees about the vertical axis AX7, and further, between the two steps S20 and S21 in Fig. 11, the 25 substrates W2 of the second substrate group may be rotated 180 degrees about the vertical axis AX7.

[0197] (11) In the above-described embodiment and each modified example, in order to prepare 50 substrates W (a group of substrates to be processed) arranged face-to-face and at half pitch, 25 substrates W1 are rotated 180 degrees around the vertical axis AX3, and 25 substrates W2 are not rotated around the vertical axis AX3, as shown in Figures 3(a) to 3(f). This may be reversed. That is, to prepare 50 substrates W, 25 substrates W1 may not be rotated around the vertical axis AX3, and 25 substrates W2 may be rotated 180 degrees around the vertical axis AX3.

[0198] 13(a) to 16(d), in order to change the attitude of 50 substrates W in two stages, 25 substrates W1 (first divided substrate group) are rotated 180 degrees around the vertical axis AX7, and 25 substrates W2 (second divided substrate group) are not rotated around the vertical axis AX7. This may be reversed. That is, in order to change the attitude of 50 substrates W in two stages, 25 substrates W1 may not be rotated around the vertical axis AX7, and 25 substrates W2 (second divided substrate group) may be rotated 180 degrees around the vertical axis AX7.

[0199] (12) In the above-described embodiment and each of the modified examples, each of the batch processing units BPU1 to BPU3 collectively processed a plurality of substrates W arranged at a half pitch. However, if necessary, each of the batch processing units BPU1 to BPU3 may collectively process a plurality of substrates W arranged at a full pitch.

[0200] (13) In the above-described embodiment and each modified example, the substrate processing apparatus 1 includes one underwater attitude change unit 24 to change the attitude of the substrate W from vertical to horizontal. However, the substrate processing apparatus 1 may include multiple underwater attitude change units 24. [Explanation of symbols]

[0201] 1... Substrate processing equipment WTR1: First transport mechanism 23 ... Chuck 24... Underwater attitude change unit BPU3: Third batch processing unit ONB: Pure water processing unit LF3 ... Lifter 26C... Treatment tank 27 … Board holding part 28... Lifting mechanism CR...Center robot 29...Hand WTR2: Second transport mechanism 41,42 ... Chuck 43(43A),44(44A)...Retaining groove 45(45A),46(46A) … Passing groove 53 ... Substrate alignment direction moving section 71 ... Posture conversion unit 73 … Soaking tank 75 ... Pusher 76 ... In-tank carrier 76A ... Back wall 79... Rotation mechanism 81 … Front opening 82 ... Back opening 87A ... Operating shaft LF4 ... Lifter 95 … Support part 97... Lifting mechanism 110 ... Pusher rotation mechanism 111 ... Pusher lifting mechanism 141 ... control section

Claims

1. A substrate processing apparatus including a batch processing unit that processes a plurality of substrates at once and a single substrate processing unit that processes the substrates one by one, a vertical substrate holder that holds a group of processed substrates made up of the plurality of substrates that have been processed in the batch processing unit and aligned at predetermined intervals in a vertical position; a vertical substrate transport robot capable of extracting a plurality of substrates in two batches from the group of processed substrates held by the vertical substrate holding unit and transporting each of the groups of divided substrates extracted in two batches; a posture changing unit that collectively changes the posture of each of the divided substrate groups transported by the vertical substrate transport robot from vertical to horizontal; a horizontal substrate transfer robot that takes out one substrate from each of the divided substrate groups that have been converted to a horizontal position by the position conversion unit and transports the substrate to the single substrate processing unit; a relative lifting unit that lifts and lowers the vertical substrate holding unit and the vertical substrate transport robot relative to each other; an alignment direction relative movement unit that moves the vertical substrate holding unit and the vertical substrate transport robot horizontally relative to each other in an alignment direction in which the group of substrates to be processed are aligned; Equipped with The vertical substrate transfer robot includes: a pair of chucks that clamp two sides of the outer edge of each substrate in the group of substrates to be processed; a plurality of pairs of holding grooves, each pair of grooves being provided in the pair of chucks so as to face each other, and each pair of grooves being configured to hold one substrate in a vertical position; a plurality of pairs of passage grooves, each of which allows one substrate in a vertical position to pass through, provided in the pair of chucks so as to face each other; the holding grooves and the passing grooves are alternately arranged one by one in the alignment direction of the processing substrate group, the relative lifting unit performs two relative lifting movements of the vertical substrate holding unit and the vertical substrate transport robot at a predetermined substrate transfer position; the vertical substrate transport robot holds and removes every other divided substrate in the first group of divided substrates aligned one by one from the vertical substrate holding unit by the holding grooves through a first relative lifting movement, and transports the removed first divided substrate group to the posture conversion unit; the vertical substrate transport robot causes the remaining second divided substrate group to pass through the passage grooves by the first relative lifting movement, thereby maintaining a state in which the second divided substrate group is held by the vertical substrate holding parts; the alignment direction relative movement unit horizontally moves the vertical substrate holding unit, which holds the second divided substrate group after the first divided substrate group has been extracted, and the vertical substrate transport robot relatively by the predetermined interval in the alignment direction of the processing substrate groups; After this horizontal movement, the vertical substrate transport robot receives the second divided substrate group held by the vertical substrate holding unit by holding it in the holding grooves through a second relative lifting movement, and transports the received second divided substrate group to the posture conversion unit. The substrate processing apparatus is characterized by the above.

2. 2. The substrate processing apparatus according to claim 1, The substrate processing apparatus further comprises an upstream vertical substrate transport robot capable of transporting the group of substrates to be processed collectively to the vertical substrate holding section.

3. 2. The substrate processing apparatus according to claim 1, the vertical substrate transport robot further includes a plurality of pairs of upper holding grooves, each pair of which holds one substrate in a vertical position, and which are provided in the pair of chucks so as to face each other and above the holding groove and the passing groove; The substrate processing apparatus is characterized in that the plurality of pairs of upper holding grooves are arranged in the alignment direction of the processing substrate groups at the same intervals as the intervals at which the processing substrate groups are aligned.

4. 4. The substrate processing apparatus according to claim 1, Further provided is a rinse tank for storing a rinse liquid; the relative lifting unit includes a lifting mechanism that lifts and lowers the vertical substrate holding unit, The substrate processing apparatus is characterized in that the lifting mechanism immerses the processing substrate group or the second divided substrate group in the rinse liquid stored in the rinse tank when the vertical substrate transport robot is not transporting each of the divided substrate groups.

5. 4. The substrate processing apparatus according to claim 1, The posture conversion unit is an intra-tank carrier having a front opening for passing each of the divided substrate groups and having two side walls on which a plurality of pairs of substrate holding grooves are provided facing each other for storing each of the divided substrate groups that have passed through the front opening, the intra-tank carrier having a back wall facing the front opening and having a back opening smaller in area than the front opening; a carrier lifter having a carrier support part for supporting the in-tank carrier and a carrier lifting mechanism for raising and lowering the carrier support part; an immersion tank that accommodates the in-tank carrier and the carrier support portion and stores an immersion liquid; a carrier rotation mechanism that rotates the intra-tank carrier immersed in the immersion liquid in the immersion tank about a horizontal axis in order to collectively change the orientation of each of the divided substrate groups from vertical to horizontal; a pusher that holds, from below, each of the divided substrate groups held by the vertical substrate transfer robot; a pusher lifting mechanism for lifting and lowering the pusher; a pusher rotation mechanism that rotates the pusher around a vertical axis; Equipped with the pusher can move up and down between a bottom position in the immersion tank and an upper position in the immersion tank through the back opening and the front opening of the intra-tank carrier when the front opening of the intra-tank carrier faces upward; A substrate processing apparatus characterized in that the intra-tank carrier is configured to receive each of the divided substrate groups from the pusher when the pusher transitions from a state in which it is positioned above the intra-tank carrier to a state in which it is positioned below the intra-tank carrier.

6. 6. The substrate processing apparatus according to claim 5, Further comprising a control unit, the control unit causes the pusher lifting mechanism to lift the pusher above the intra-tank carrier with the front opening facing upward, thereby receiving the first group of divided substrates from the vertical substrate transfer robot with the pusher; the control unit rotates the pusher holding the first divided substrate group by 180 degrees around a vertical axis using the pusher rotation mechanism; the control unit relatively raises the intra-tank carrier to store the first divided substrate group rotated by 180 degrees in the intra-tank carrier; The control unit is characterized in that the carrier rotation mechanism rotates the in-tank carrier immersed in the immersion liquid in the immersion tank around a horizontal axis, thereby converting the orientation of the first divided substrate group from vertical to horizontal.

7. 6. The substrate processing apparatus according to claim 5, The carrier rotation mechanism includes two shafts configured to clamp the intra-vessel carrier and release the clamping of the intra-vessel carrier; a rotation drive unit that rotates the two shafts around the horizontal axis.

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