Modified polybenzoxazole, modified polybenzoxazole sheet, cleaning sheet, and conveying member with cleaning function
A modified polybenzoxazole sheet with controlled elastic modulus addresses the challenge of foreign matter removal in substrate transport, ensuring stable cleaning performance across varying temperatures and speeds.
Patent Information
- Application Number
- JP2021173016
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-10-22
- Publication Date
- 2026-03-02
- Estimated Expiration
- 2041-10-22
AI Technical Summary
Existing substrate transport methods in sensitive equipment, such as semiconductor manufacturing, fail to effectively remove foreign matter from transport devices without causing contamination, adhesion issues, or damage, due to temperature and speed dependencies of elastic modulus in cleaning sheets.
A modified polybenzoxazole with a benzoxazole ring structure and amide bonds, having a storage modulus of 200 MPa to 2000 MPa and low temperature dependence, is used to form a cleaning sheet with a cleaning layer, ensuring stable performance across a wide temperature range.
The modified polybenzoxazole sheet provides stable cleaning performance unaffected by temperature and speed conditions, preventing contamination and damage, while effectively removing foreign matter from transport devices.
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Abstract
Description
[Technical Field]
[0001] The present invention relates to a modified polybenzoxazole, a modified polybenzoxazole sheet, a cleaning sheet, and a transport member with cleaning function. [Background technology]
[0002] In various substrate processing equipment that is sensitive to foreign matter, such as manufacturing equipment and inspection equipment for semiconductors, flat panel displays, and printed circuit boards, substrates are transported while being in physical contact with a transport device (typically a chuck table, etc.). In this case, if foreign matter adheres to the transport device, it will contaminate subsequent substrates, requiring the equipment to be periodically stopped and cleaned. This results in problems such as a decrease in the operating rate of the processing equipment and the great effort required to clean the equipment.
[0003] To overcome this problem, a method has been proposed in which foreign matter adhering to the transport device is removed by transporting a plate-like member into the substrate processing apparatus (see Patent Document 1). This method eliminates the need to stop the substrate processing apparatus to perform the cleaning process, thereby eliminating the problem of reduced processing apparatus operating rate. However, this method does not adequately remove foreign matter adhering to the transport device.
[0004] Meanwhile, a method has been proposed in which a substrate having an adhesive substance adhered thereto is used as a cleaning member to transport the substrate into a substrate processing apparatus, thereby removing foreign matter adhering to the transport device (see Patent Document 2). This method is superior to the method described in Patent Document 1 in its ability to remove foreign matter. However, the method described in Patent Document 2 can have a problem in that the adhesive substance adheres too strongly to the transport device at the contact point, preventing the two from separating. As a result, problems may arise in which the substrate having the adhesive substance adhered thereto cannot be reliably transported, the transport device may be damaged, or the transport device may be contaminated. On the other hand, if the adhesive force between the adhesive substance and the transport device becomes too weak, the cleaning member's ability to remove foreign matter may decrease, resulting in a problem in which sufficient cleaning effect cannot be achieved.
[0005] As a means for solving the above-mentioned various problems, the present applicant has reported a cleaning sheet having a cleaning layer containing a modified polybenzoxazole having a specific soft segment (Patent Document 3).
[0006] Here, it is preferable that the cleaning sheet has a wide usable temperature range. To ensure a wide usable temperature range, it is preferable that the temperature dependency of the elastic modulus of the cleaning sheet is small. For example, if the cleaning sheet has a low elastic modulus due to a high temperature dependency, it may adhere to the stage when used as a transport member for transporting the cleaning sheet through a substrate processing apparatus. [Prior art documents] [Patent documents]
[0007] [Patent Document 1] Japanese Patent Application Publication No. 11-87458 [Patent Document 2] Japanese Patent Application Publication No. 10-154686 [Patent Document 3] Patent Publication No. 2021-86875 Summary of the Invention [Problem to be solved by the invention]
[0008] The present invention aims to provide a modified polybenzoxazole and a modified polybenzoxazole sheet having a low temperature dependence of elastic modulus that can be suitably used to form a cleaning sheet suitable for use in a transport member transported in a substrate processing apparatus. It also aims to provide a cleaning sheet having a cleaning layer made of such a modified polybenzoxazole sheet and having a low temperature dependence of elastic modulus. It also aims to provide a transport member with a cleaning function that includes such a cleaning sheet and a transport member. [Means for solving the problem]
[0009] The modified polybenzoxazole according to an embodiment of the present invention comprises: A modified polybenzoxazole having a benzoxazole ring structure and two or more amide bonds, The storage modulus at 1 Hz in the temperature range of 0°C to 100°C is 200 MPa to 2000 MPa.
[0010] In one embodiment, the rate of change in storage modulus at 1 Hz within the above range of 0°C to 100°C is 50% or less.
[0011] In one embodiment, the modified polybenzoxazole according to an embodiment of the present invention has a change rate of storage modulus at 25° C. of 50% or less within a range of 0.001 Hz to 1 Hz.
[0012] In one embodiment, the two or more amide bonds are amide bonds derived from polyamines.
[0013] In one embodiment, the polyamine is at least one selected from the group consisting of a diamine compound having a polyether structure, an aliphatic diamine, and an aromatic diamine.
[0014] A modified polybenzoxazole sheet according to an embodiment of the present invention comprises a modified polybenzoxazole according to an embodiment of the present invention.
[0015] A cleaning sheet according to an embodiment of the present invention is a cleaning sheet comprising a cleaning layer, and the cleaning layer is a modified polybenzoxazole sheet according to an embodiment of the present invention.
[0016] In one embodiment, the modified polybenzoxazole sheet according to an embodiment of the present invention includes an adhesive layer.
[0017] In one embodiment, a modified polybenzoxazole sheet according to an embodiment of the present invention includes a support.
[0018] The cleaning function-equipped transport member according to the embodiment of the present invention includes a cleaning sheet according to the embodiment of the present invention and a transport member. [Effects of the Invention]
[0019] According to the present invention, there are provided a modified polybenzoxazole and a modified polybenzoxazole sheet having a low temperature dependence of elastic modulus, which can be suitably used to form a cleaning sheet suitable for use in a transport member transported in a substrate processing apparatus. Also provided is a cleaning sheet having a low temperature dependence of elastic modulus, which includes such a modified polybenzoxazole sheet as a cleaning layer. Furthermore, there is provided a transport member with a cleaning function, which includes such a cleaning sheet and a transport member. [Brief explanation of the drawings]
[0020] [Figure 1] FIG. 1 is a schematic cross-sectional view showing one embodiment of the cleaning sheet of the present invention. [Figure 2] FIG. 2 is a schematic cross-sectional view showing another embodiment of the cleaning sheet of the present invention. [Figure 3]FIG. 3 is a schematic cross-sectional view showing yet another embodiment of the cleaning sheet of the present invention. [Figure 4] FIG. 4 is a schematic cross-sectional view showing one embodiment of the cleaning function-equipped transport member of the present invention. DETAILED DESCRIPTION OF THE INVENTION
[0021] 1. Modified Polybenzoxazole The modified polybenzoxazole according to the embodiment of the present invention can be preferably used to form a cleaning sheet suitable for use in a transport member transported in a substrate processing apparatus, but can also be used for any other suitable purpose as long as the effects of the present invention can be utilized.
[0022] The modified polybenzoxazole according to an embodiment of the present invention has a storage modulus of 200 MPa to 2000 MPa at 1 Hz in the temperature range of 0°C to 100°C. This means that the storage modulus is adjusted within the narrow range of 200 MPa to 2000 MPa over the wide temperature range of 0°C to 100°C. Therefore, the modified polybenzoxazole according to an embodiment of the present invention has a small temperature dependency of the modulus.
[0023] The modified polybenzoxazole according to an embodiment of the present invention has a storage modulus at 1 Hz within a temperature range of 0°C to 100°C of 200 MPa to 2000 MPa, preferably 500 MPa to 1900 MPa, and more preferably 800 MPa to 1800 MPa, as described above. When the storage modulus at 1 Hz within a temperature range of 0°C to 100°C of the modified polybenzoxazole according to an embodiment of the present invention is within the above range, the modified polybenzoxazole according to an embodiment of the present invention has a small temperature dependency of the modulus, and can exhibit stable cleaning performance unaffected by the temperature conditions of the stage to be cleaned (typically, 0°C to 100°C). When the storage modulus at 1 Hz within a temperature range of 0°C to 100°C of the modified polybenzoxazole according to an embodiment of the present invention is less than 200 MPa, when applied to a cleaning sheet, the cleaning sheet exhibits a low modulus, which may result in transfer of the cleaning material to the cleaning target, resulting in back contamination. If the storage modulus of the modified polybenzoxazole according to an embodiment of the present invention exceeds 2000 MPa at 1 Hz within a temperature range of 0°C to 100°C, when the modified polybenzoxazole is applied to a cleaning sheet, the particles to be collected may not be embedded sufficiently, and the cleaning performance may not be fully exhibited. The storage modulus at 1 Hz within a temperature range of 0°C to 100°C is measured by the method described below.
[0024] The modified polybenzoxazole according to an embodiment of the present invention preferably has a storage modulus change rate at 1 Hz within the range of 0°C to 100°C of 50% or less, more preferably 40% or less, and even more preferably 30% or less. If the storage modulus change rate at 1 Hz within the range of 0°C to 100°C of the modified polybenzoxazole according to an embodiment of the present invention is within the above range, the temperature dependence of the modulus of elasticity of the modified polybenzoxazole according to an embodiment of the present invention will be smaller. If the storage modulus change rate at 1 Hz within the range of 0°C to 100°C of the modified polybenzoxazole according to an embodiment of the present invention is too large and outside the above range, the cleaning sheet may exhibit a low modulus of elasticity depending on the temperature conditions of the stage to be cleaned (typically 0°C to 100°C), which may cause the cleaning sheet to stick to the surface to be cleaned or the cleaning sheet to be transferred after peeling, resulting in back contamination. The storage modulus change rate at 1 Hz within the range of 0°C to 100°C is measured by the method described below.
[0025] The modified polybenzoxazole according to an embodiment of the present invention preferably has a storage modulus of 200 MPa to 2000 MPa, more preferably 500 MPa to 1900 MPa, and even more preferably 800 MPa to 1800 MPa at 25°C within a frequency range of 0.001 Hz to 1 Hz. If the storage modulus of the modified polybenzoxazole according to an embodiment of the present invention at 25°C within the above range is within this range, the modified polybenzoxazole according to an embodiment of the present invention exhibits little speed dependency of the elastic modulus and exhibits stable cleaning performance unaffected by the speed conditions of the stage to be cleaned, such as the adsorption speed and adsorption retention time of the cleaning sheet to the stage. If the storage modulus of the modified polybenzoxazole according to an embodiment of the present invention is less than 200 MPa within a frequency range of 0.001 Hz to 1 Hz at 25°C, when used as a cleaning sheet, the cleaning sheet may exhibit a low elastic modulus, resulting in the risk of transfer to the cleaning target, causing back contamination. If the storage modulus of the modified polybenzoxazole according to an embodiment of the present invention at 25°C within a range of 0.001 Hz to 1 Hz exceeds 2000 MPa, when the polybenzoxazole is applied to a cleaning sheet, the particles to be collected may not be embedded properly, and cleaning performance may not be fully exhibited. The storage modulus at 25°C within a range of 0.001 Hz to 1 Hz is measured by the method described below.
[0026] The modified polybenzoxazole according to an embodiment of the present invention preferably has a storage modulus change rate at 25°C within a frequency range of 0.001 Hz to 1 Hz of 50% or less, more preferably 40% or less, and even more preferably 30% or less. If the storage modulus change rate at 25°C within a frequency range of 0.001 Hz to 1 Hz of the modified polybenzoxazole according to an embodiment of the present invention is within the above range, the modified polybenzoxazole according to an embodiment of the present invention can exhibit stable cleaning performance regardless of the speed conditions of the stage to be cleaned, such as the speed at which the cleaning sheet is adsorbed to the stage and the time the adsorption is maintained. If the storage modulus change rate at 25°C within a frequency range of 0.001 Hz to 1 Hz of the modified polybenzoxazole according to an embodiment of the present invention is too large and outside the above range, the cleaning sheet may exhibit a low modulus depending on the speed conditions of the stage to be cleaned, which may cause the cleaning sheet to stick to the surface to be cleaned or the cleaning sheet to be transferred after peeling, resulting in back contamination. The storage modulus change rate at 25°C within a frequency range of 0.001 Hz to 1 Hz is measured by the method described below.
[0027] The modified polybenzoxazole according to an embodiment of the present invention preferably has a Tg of 100°C or higher, more preferably 120°C or higher, and even more preferably 150°C or higher. If the Tg of the modified polybenzoxazole according to an embodiment of the present invention is within the above range, the modified polybenzoxazole according to an embodiment of the present invention can exhibit stable cleaning performance without being affected by the temperature conditions of the stage to be cleaned (typically, 0°C to 100°C). If the Tg of the modified polybenzoxazole according to an embodiment of the present invention is too low, outside the above range, the cleaning sheet may exhibit a low elastic modulus depending on the temperature conditions of the stage to be cleaned (typically, 0°C to 100°C), which may cause sticking to the surface to be cleaned or transfer of the cleaning sheet after peeling, resulting in back contamination. The Tg is measured by the method described below.
[0028] The modified polybenzoxazole according to an embodiment of the present invention preferably has a TG of 350°C or higher at 1% weight loss as determined by TG-DTA analysis. If the TG of the modified polybenzoxazole according to an embodiment of the present invention at 1% weight loss as determined by TG-DTA analysis is within the above range, the modified polybenzoxazole according to an embodiment of the present invention will not undergo thermal decomposition during cleaning, and contamination of the inside of the device due to outgassing can be suppressed. If the TG of the modified polybenzoxazole according to an embodiment of the present invention at 1% weight loss as determined by TG-DTA analysis is too large and outside the above range, thermal decomposition may occur during cleaning, potentially causing contamination of the inside of the device due to outgassing. The TG at 1% weight loss as determined by TG-DTA analysis is measured by the method described below.
[0029] The modified polybenzoxazole according to an embodiment of the present invention preferably has a TG of 400°C or higher, more preferably 420°C or higher, at 5% weight loss as determined by TG-DTA analysis. If the TG of the modified polybenzoxazole according to an embodiment of the present invention at 5% weight loss as determined by TG-DTA analysis is within the above range, the modified polybenzoxazole according to an embodiment of the present invention will not undergo thermal decomposition during cleaning, and contamination of the inside of the device due to outgassing can be suppressed. If the TG of the modified polybenzoxazole according to an embodiment of the present invention at 5% weight loss as determined by TG-DTA analysis is too large and outside the above range, thermal decomposition may occur during cleaning, potentially resulting in contamination of the inside of the device due to outgassing. The TG at 5% weight loss as determined by TG-DTA analysis is measured by the method described below.
[0030] The modified polybenzoxazole according to an embodiment of the present invention preferably has a water absorption rate of 0.1% or less. If the water absorption rate of the modified polybenzoxazole according to an embodiment of the present invention is within the above range, the modified polybenzoxazole according to an embodiment of the present invention will exhibit little change in properties such as elastic modulus and adsorption power during storage, and water-derived outgassing can be suppressed when used as a cleaning sheet in a reduced-pressure environment. If the water absorption rate of the modified polybenzoxazole according to an embodiment of the present invention is too high, outside the above range, there is a risk of changes in elastic modulus and adsorption power due to water absorption, or of water-derived outgassing when used in a reduced-pressure environment. The water absorption rate is measured by the method described below.
[0031] The adsorptive strength of the modified polybenzoxazole according to an embodiment of the present invention at 25°C is preferably -0.8 μN to -0.3 μN, more preferably -0.7 μN to -0.4 μN. If the adsorptive strength of the modified polybenzoxazole according to an embodiment of the present invention at 25°C is within the above range, the modified polybenzoxazole according to an embodiment of the present invention can exhibit superior foreign matter removal performance and superior stain-inhibiting performance, for example, when applied to a cleaning sheet. If the adsorptive strength of the modified polybenzoxazole according to an embodiment of the present invention at 25°C is too small outside the above range, for example, when applied to a cleaning sheet, there is a risk that the stain-inhibiting performance will not be sufficiently exhibited. If the adsorptive strength of the modified polybenzoxazole according to an embodiment of the present invention is too large outside the above range, there is a risk that the foreign matter removal performance will not be sufficiently exhibited, for example, when applied to a cleaning sheet. The adsorptive strength at 25°C is measured by the method described below.
[0032] The modified polybenzoxazole according to an embodiment of the present invention has a benzoxazole ring structure and two or more amide bonds.
[0033] The modified polybenzoxazole according to an embodiment of the present invention preferably has 2 to 4 amide bonds, more preferably 2 to 3 amide bonds, and even more preferably 2 amide bonds.
[0034] The two or more amide bonds contained in the modified polybenzoxazole according to an embodiment of the present invention are preferably amide bonds derived from a polyamine. The term "polyamine" as used herein refers to an amine having two or more amino groups. The amino group may be at least one selected from the group consisting of a primary amino group, a secondary amino group, and a tertiary amino group. In terms of enhancing the effects of the present invention, the amino group is preferably at least one selected from the group consisting of a primary amino group and a secondary amino group, and more preferably a primary amino group.
[0035] The polyamine may be one kind or a mixture of two or more kinds.
[0036] As the polyamine, any appropriate polyamine can be used as long as it has two or more amino groups and does not impair the effects of the present invention. In terms of further exhibiting the effects of the present invention, examples of polyamines that can be used include diamine compounds having a polyether structure (hereinafter sometimes referred to as PE diamine compounds), aliphatic diamines, and aromatic diamines.
[0037] In order to further enhance the effects of the present invention, the polyamine is preferably an aliphatic diamine represented by general formula (1). By using an aliphatic diamine represented by general formula (1) as the aliphatic diamine, the modified polybenzoxazole according to an embodiment of the present invention can have long-chain alkyl groups in the main chain and side chains. The inclusion of long-chain alkyl groups in the main chain and side chains increases the free volume, making it possible to reduce the elastic modulus and contribute to reducing the temperature dependence of the elastic modulus. Furthermore, by having long-chain alkyl groups in the side chains of the modified polybenzoxazole according to an embodiment of the present invention, the side chains can become entangled with other molecular chains to form a pseudo-crosslinked structure, making it possible to increase the Tg and contribute to reducing the temperature dependence of the elastic modulus.
[0038] [ka]
[0039] In the general formula (1), X is a hydrocarbon group having a y-membered ring structure, y is 4 to 8, and -C m H 2m -NH2 group and -C n H 2n -NH2 group is a long-chain alkylamino group bonded to X, m is 6 to 12, n is 6 to 12, -C p H 2p+1 Group and -C q H 2q+1 group is a long-chain alkyl group bonded to X, p is 6 to 12, q is 6 to 12, Y is a long-chain alkyl group having 6 to 12 carbon atoms bonded to X, a is the number of Y's bonded to X, a is 0 to 4, the a Y's may be the same or different long-chain alkyl groups, and Y is -C r H 2r+1 group, where r is 6 to 12. The long-chain alkyl group may contain a branched chain.
[0040] When an aliphatic diamine represented by general formula (1) is used as the polyamine, the aliphatic diamine represented by general formula (1) may be a single type or a mixture of two or more types.
[0041] In order to further exert the effects of the present invention, y in general formula (1) is preferably 5 to 7, and more preferably 6. That is, a preferred embodiment of X in general formula (1) is a hydrocarbon group with a 6-membered ring structure (cyclohexyl group).
[0042] In order to further exert the effects of the present invention, m in general formula (1) is preferably 6 to 10, more preferably 6 to 8, and even more preferably 8.
[0043] In order to further exert the effects of the present invention, n in general formula (1) is preferably 6 to 10, more preferably 6 to 8, and even more preferably 6.
[0044] In order to further exert the effects of the present invention, p in general formula (1) is preferably 6 to 10, more preferably 6 to 8, and even more preferably 8.
[0045] In order to further exert the effects of the present invention, q in general formula (1) is preferably 6 to 10, more preferably 6 to 8, and even more preferably 8.
[0046] In order to further exert the effects of the present invention, r in general formula (1) is preferably 6 to 10, more preferably 6 to 8, and even more preferably 8.
[0047] In order to further exert the effects of the present invention, a in general formula (1) is preferably 0 to 2, and more preferably 0.
[0048] In terms of being able to further exert the effects of the present invention, a preferred embodiment of the aliphatic diamine represented by general formula (1) is one in which X is a hydrocarbon group having a 6-membered ring structure (cyclohexyl group), m is 6 to 8, n is 6 to 8, p is 6 to 8, q is 6 to 8, and a is 0; a more preferred embodiment is one in which X is a hydrocarbon group having a 6-membered ring structure (cyclohexyl group), m is 8, n is 6, p is 8, and q is 8.
[0049] A representative example of the aliphatic diamine represented by the general formula (1) is dimer diamine, and a commercially available product thereof is, for example, "Priamine 1075" manufactured by CRODA.
[0050] The modified polybenzoxazole according to an embodiment of the present invention preferably contains a structural unit represented by general formula (2) and a structural unit represented by general formula (3). When the modified polybenzoxazole according to an embodiment of the present invention contains a structural unit represented by general formula (3), it can have long-chain alkyl groups in the main chain and side chains, which increases the free volume and enables a decrease in elasticity, contributing to reducing the temperature dependence of the elastic modulus. When the side chain has a long-chain alkyl group, the side chain can become entangled with other molecular chains to form a pseudo-crosslinked structure, which enables a increase in Tg and contributes to reducing the temperature dependence of the elastic modulus.
[0051] [ka]
[0052] In general formula (2), R 1 , R 2 are each independently CH2, C(CH3)2, C(CF3)2, O, or a single bond.
[0053] [ka]
[0054] In general formula (3), R 2 is CH2, C(CH3)2, C(CF3)2, O, or a single bond; X is a hydrocarbon group having a y-membered ring structure, y is 4 to 8; C m H 2m is a long alkylene chain, m is 6 to 12, and C n H 2n is a long alkylene chain, n is 6 to 12, and -C p H 2p+1 Group and -C q H 2q+1 The group is a long-chain alkyl group bonded to X, p is 6 to 12, and q is 6 to 12. The long-chain alkylene chain and the long-chain alkyl group may each contain a branched chain.
[0055] The structural unit represented by general formula (2) and the structural unit represented by general formula (3) that can be contained in the modified polybenzoxazole according to an embodiment of the present invention may each be of one type or two or more types.
[0056] In order to further exert the effects of the present invention, y in general formula (3) is preferably 5 to 7, and more preferably 6. That is, a preferred embodiment of X in general formula (3) is a hydrocarbon group with a 6-membered ring structure (cyclohexyl group).
[0057] In order to further exert the effects of the present invention, m in general formula (3) is preferably 6 to 10, more preferably 6 to 8, and even more preferably 8.
[0058] In order to further exert the effects of the present invention, n in general formula (3) is preferably 6 to 10, more preferably 6 to 8, and even more preferably 6.
[0059] In order to further exert the effects of the present invention, p in general formula (3) is preferably 6 to 10, more preferably 6 to 8, and even more preferably 8.
[0060] In terms of being able to more effectively exhibit the effects of the present invention, q in general formula (3) is preferably 6 to 10, more preferably 6 to 8, and even more preferably 8.
[0061] In order to further exert the effects of the present invention, r in general formula (3) is preferably 6 to 10, more preferably 6 to 8, and even more preferably 8.
[0062] In order to further exert the effects of the present invention, a in the general formula (3) is preferably 0 to 2, and more preferably 0.
[0063] In terms of being able to further exert the effects of the present invention, a preferred embodiment of the structural unit represented by general formula (3) is one in which X is a hydrocarbon group having a 6-membered ring structure (cyclohexyl group), m is 6 to 8, n is 6 to 8, p is 6 to 8, q is 6 to 8, and a is 0; a more preferred embodiment is one in which X is a hydrocarbon group having a 6-membered ring structure (cyclohexyl group), m is 8, n is 6, p is 8, and q is 8.
[0064] The modified polybenzoxazole according to the embodiment of the present invention can be produced by any appropriate method as long as the effects of the present invention are not impaired. The modified polybenzoxazole according to the embodiment of the present invention is typically produced by reacting a bis(2-aminophenol) compound represented by general formula (4), a bis(chlorocarbonyl)diphenyl compound represented by general formula (5), and an aliphatic diamine represented by general formula (1).
[0065] [ka]
[0066] In general formula (4), R 1 is CH2, C(CH3)2, C(CF3)2, O, or a single bond.
[0067] [ka]
[0068] In general formula (5), R 2 is CH2, C(CH3)2, C(CF3)2, O, or a single bond.
[0069] When the modified polybenzoxazole according to an embodiment of the present invention is produced by reacting a bis(2-aminophenol) compound represented by general formula (4), a bis(chlorocarbonyl)diphenyl compound represented by general formula (5), and an aliphatic diamine represented by general formula (1), the blending ratio of the aliphatic diamine represented by general formula (1) is, in terms of molar ratio, preferably 6 mol% to 49 mol%, more preferably 7 mol% to 47 mol%, even more preferably 8 mol% to 45 mol%, particularly preferably 9 mol% to 42 mol%, and most preferably 10 mol% to 40 mol%, relative to the total amount of amines, i.e., the total amount of the bis(2-aminophenol) compound represented by general formula (4) and the aliphatic diamine represented by general formula (1) (100 mol%).
[0070] When the modified polybenzoxazole according to the embodiment of the present invention is produced by reacting a bis(2-aminophenol) compound represented by general formula (4), a bis(chlorocarbonyl)diphenyl compound represented by general formula (5), and an aliphatic diamine represented by general formula (1), the ratio of the bis(chlorocarbonyl)diphenyl compound represented by general formula (5) to the total amount of the aliphatic diamine represented by general formula (1) and the bis(2-aminophenol) compound represented by general formula (4), i.e., the total amount of amines, is preferably 70 mol% to 130 mol%, more preferably 80 mol% to 120 mol%, and even more preferably 90 mol% to 110 mol%, of the bis(chlorocarbonyl)diphenyl compound represented by general formula (5) relative to 100 mol% of the total amount of the aliphatic diamine represented by general formula (1) and the bis(2-aminophenol) compound represented by general formula (4).
[0071] 2. Modified polybenzoxazole sheet The modified polybenzoxazole sheet according to an embodiment of the present invention contains the modified polybenzoxazole according to an embodiment of the present invention. The content of the modified polybenzoxazole according to an embodiment of the present invention in the modified polybenzoxazole sheet according to an embodiment of the present invention is preferably 50% by mass to 100% by mass, more preferably 70% by mass to 100% by mass, even more preferably 90% by mass to 100% by mass, particularly preferably 95% by mass to 100% by mass, and most preferably substantially 100% by mass.
[0072] The modified polybenzoxazole sheet according to the embodiment of the present invention may contain any other appropriate components within the scope that does not impair the effects of the present invention, such as heat-resistant resins other than polybenzoxazole, surfactants, plasticizers, antioxidants, conductivity-imparting agents, UV absorbers, and light stabilizers.
[0073] The modified polybenzoxazole sheet according to an embodiment of the present invention is typically a sheet of the modified polybenzoxazole according to an embodiment of the present invention, typically formed by applying a varnish of the modified polybenzoxazole according to an embodiment of the present invention to any suitable substrate and removing the solvent by heating.
[0074] The modified polybenzoxazole sheet according to the embodiment of the present invention may have any appropriate thickness depending on the intended use.
[0075] When the modified polybenzoxazole sheet according to an embodiment of the present invention contains the modified polybenzoxazole according to an embodiment of the present invention as a main component, i.e., when the content of the modified polybenzoxazole according to an embodiment of the present invention in the modified polybenzoxazole sheet according to an embodiment of the present invention is preferably 90% by mass to 100% by mass, more preferably 93% by mass to 100% by mass, even more preferably 95% by mass to 100% by mass, particularly preferably 98% by mass to 100% by mass, and most preferably substantially 100% by mass, the modified polybenzoxazole sheet according to an embodiment of the present invention exhibits similar properties to the modified polybenzoxazole according to an embodiment of the present invention, and preferably exhibits the same storage modulus at 1 Hz in the range of 0°C to 100°C, rate of change of storage modulus at 1 Hz in the range of 0°C to 100°C, rate of change of storage modulus at 25°C in the range of 0.001 Hz to 1 Hz, Tg, TG at 1% weight loss by TG-DTA analysis, TG at 5% weight loss by TG-DTA analysis, water absorption, and adsorption force at 25°C as the modified polybenzoxazole according to an embodiment of the present invention.
[0076] ≪≪3. Cleaning Sheet≫≫ A cleaning sheet according to an embodiment of the present invention is a cleaning sheet comprising a cleaning layer, and the cleaning layer is a modified polybenzoxazole sheet according to an embodiment of the present invention.
[0077] The cleaning sheet according to the embodiment of the present invention includes a cleaning layer. The cleaning sheet according to the embodiment of the present invention may be composed of only the cleaning layer, or may include other layers.
[0078] Fig. 1 is a schematic cross-sectional view showing one embodiment of a cleaning sheet according to an embodiment of the present invention. In Fig. 1, a cleaning sheet 100 has a cleaning layer 10 and a protective film 20. The protective film 20 may be provided for the purpose of protecting the cleaning layer 10, and may be omitted depending on the purpose. In other words, the cleaning sheet of the present invention may be composed of only the cleaning layer 10.
[0079] Fig. 2 is a schematic cross-sectional view showing another embodiment of a cleaning sheet according to an embodiment of the present invention. In Fig. 2, a cleaning sheet 100 has a protective film 20, a cleaning layer 10, and an adhesive layer 30. The protective film 20 can be provided for the purpose of protecting the cleaning layer 10, and may be omitted depending on the purpose.
[0080] Fig. 3 is a schematic cross-sectional view showing yet another embodiment of a cleaning sheet according to an embodiment of the present invention. In Fig. 3, a cleaning sheet 100 has a protective film 20, a cleaning layer 10, a support 40, and an adhesive layer 30. The protective film 20 may be provided for the purpose of protecting the cleaning layer 10, and may be omitted depending on the purpose.
[0081] The cleaning sheet according to the embodiment of the present invention may have any appropriate thickness depending on its configuration (particularly, whether or not it has a support or adhesive layer, and how thick they are).
[0082] The cleaning sheet according to the embodiment of the present invention preferably has excellent heat resistance and can be used sufficiently even in high-temperature environments, preferably at 150°C or higher, more preferably at 200°C or higher, even more preferably at 250°C or higher, even more preferably at 300°C or higher, and particularly preferably at 350°C or higher.
[0083] Since the cleaning layer is a modified polybenzoxazole sheet according to an embodiment of the present invention, it exhibits similar properties to the modified polybenzoxazole sheet according to an embodiment of the present invention, and preferably exhibits the same storage modulus at 1 Hz in the range of 0°C to 100°C, rate of change of storage modulus at 1 Hz in the range of 0°C to 100°C, rate of change of storage modulus at 25°C in the range of 0.001 Hz to 1 Hz, Tg, TG at 1% weight loss by TG-DTA analysis, TG at 5% weight loss by TG-DTA analysis, water absorption, and adsorption force at 25°C as the modified polybenzoxazole sheet according to an embodiment of the present invention.
[0084] The thickness of the cleaning layer is preferably 1 μm to 500 μm, more preferably 3 μm to 100 μm, and even more preferably 5 μm to 50 μm. When the thickness of the cleaning layer is within the above range, a cleaning sheet that can be suitably used for a transport member that transports the substrate into a substrate processing apparatus can be provided.
[0085] The cleaning layer does not have substantial adhesive properties. For example, cleaning layers formed from adhesive substances or by adhering adhesive tape are excluded from the definition of a cleaning layer in the present invention. If the cleaning sheet of the present invention includes a cleaning layer that is substantially adhesive, the contact area between the cleaning layer and, for example, a transport device in a substrate processing apparatus may adhere too strongly and become inseparable. As a result, problems may arise such as inability to transport substrates reliably or damage to the transport device.
[0086] As described above, the cleaning layer has substantially no adhesive force. Specifically, the 180° peel adhesion strength A, as defined by JIS-Z-0237, against the mirror surface of a silicon wafer is preferably less than 0.20 N / 10 mm, and more preferably 0.01 to 0.10 N / 10 mm. When the 180° peel adhesion strength A, as defined by JIS-Z-0237, of the cleaning layer against the mirror surface of a silicon wafer is within this range, the cleaning layer has substantially no adhesive force, and the adhesiveness between the cleaning layer and, for example, a contact portion with a transport device in a substrate processing apparatus can be reduced. As a result, substrates can be transported reliably and the transport device can be less likely to be damaged.
[0087] The cleaning layer has a 180-degree peel adhesion B, as specified in JIS-Z-0237, to the mirror surface of a dummy wafer of preferably 10 N / 10 mm or more, more preferably 15 N / 10 mm or more, even more preferably 20 N / 10 mm or more, particularly preferably 25 N / 10 mm or more, and most preferably 30 N / 10 mm or more. If the 180-degree peel adhesion B, as specified in JIS-Z-0237, of the cleaning layer to the mirror surface of a dummy wafer is within the above range, for example, adhesion between the cleaning layer and a transport member such as a dummy wafer is increased, making the cleaning layer less likely to peel off from the transport member such as a dummy wafer during cleaning.
[0088] The 180-degree peel adhesion B of the cleaning layer to the mirror surface of a dummy wafer, as specified in JIS-Z-0237, can be measured, for example, by forming a cleaning layer on the mirror surface of a silicon wafer as a dummy wafer and measuring it in accordance with JIS-Z-0237.
[0089] Cleaning sheets according to embodiments of the present invention may include a support, which may be a single layer or a multi-layer body.
[0090] The thickness of the support may be any appropriate thickness as long as it does not impair the effects of the present invention, and is preferably 500 μm or less, more preferably 1 μm to 400 μm, even more preferably 1 μm to 300 μm, particularly preferably 1 μm to 200 μm, and most preferably 1 μm to 100 μm.
[0091] Any suitable support may be used as long as it does not impair the effects of the present invention. Examples of such supports include films of plastics, engineering plastics, and super-engineering plastics. Specific examples of plastics, engineering plastics, and super-engineering plastics include polyimide, polyethylene, polyethylene terephthalate, acetyl cellulose, polycarbonate, polypropylene, and polyamide.
[0092] The physical properties of the support material, such as the molecular weight, can be appropriately selected depending on the purpose.
[0093] The method for forming the support can be appropriately selected depending on the purpose.
[0094] The surface of the support may be subjected to a conventional surface treatment, such as a chemical or physical treatment such as chromate treatment, ozone exposure, flame exposure, high-voltage shock exposure or ionizing radiation treatment, or a coating treatment with a primer, in order to improve adhesion and retention of adjacent layers.
[0095] The cleaning sheet according to the embodiment of the present invention may include an adhesive layer. Any suitable material may be used for the adhesive layer as long as it does not impair the effects of the present invention. Examples of the material for the adhesive layer include acrylic adhesives, silicone adhesives, rubber adhesives, and urethane adhesives.
[0096] The adhesive layer is provided for example to adhere to the mirror surface of a dummy wafer, whereby the cleaning sheet of the present invention is adhered to the dummy wafer as a transport member, thereby forming the transport member with cleaning function of the present invention.
[0097] The adhesive layer has a 180-degree peel adhesion C, as specified in JIS-Z-0237, to the mirror surface of a dummy wafer of preferably 10 N / 10 mm or more, more preferably 15 N / 10 mm or more, even more preferably 20 N / 10 mm or more, particularly preferably 25 N / 10 mm or more, and most preferably 30 N / 10 mm or more. If the 180-degree peel adhesion C, as specified in JIS-Z-0237, of the adhesive layer to the mirror surface of a dummy wafer is within the above range, for example, the adhesive strength between the adhesive layer and the dummy wafer is increased, making it difficult for the cleaning sheet to peel off from the dummy wafer during cleaning.
[0098] The thickness of the pressure-sensitive adhesive layer is preferably 1 μm to 200 μm, more preferably 2 μm to 100 μm, even more preferably 3 μm to 80 μm, particularly preferably 4 μm to 60 μm, and most preferably 5 μm to 50 μm.
[0099] The cleaning sheet according to the embodiment of the present invention may have a protective film to protect the cleaning layer, the support, the adhesive layer, etc. The protective film can be peeled off at an appropriate stage.
[0100] Any suitable film may be used as the protective film as long as it does not impair the effects of the present invention. Examples of materials for such films include polyolefins such as polyethylene, polypropylene, polybutene, polybutadiene, and polymethylpentene, polyvinyl chloride, vinyl chloride copolymers, polyethylene terephthalate, polybutylene terephthalate, polyurethane, ethylene-vinyl acetate copolymers, ionomer resins, ethylene-(meth)acrylic acid copolymers, ethylene-(meth)acrylic acid ester copolymers, polystyrene, polycarbonate, polyimide, and fluororesins.
[0101] The protective film may be subjected to any appropriate release treatment as long as the effects of the present invention are not impaired. The release treatment is typically performed using a release agent. Examples of the release agent include silicone-based release agents, long-chain alkyl-based release agents, fluorine-based release agents, fatty acid amide-based release agents, and silica-based release agents.
[0102] The thickness of the protective film is preferably 1 μm to 100 μm.
[0103] The method for forming the protective film is appropriately selected depending on the purpose, and the film can be formed by, for example, injection molding, extrusion molding, blow molding, or the like.
[0104] Any suitable method can be used to produce the cleaning sheet according to an embodiment of the present invention, as long as it does not impair the effects of the present invention. Examples of such production methods include (1) a method in which a varnish solution of the modified polybenzoxazole according to an embodiment of the present invention is cast onto a support, a uniform film is formed using a spin coater or the like, and then heated to form a cleaning layer directly on the support, and (2) a method in which an adhesive film (a label support having a cleaning layer on one side and a conventional adhesive layer on the other side) that will serve as a constituent material for the label and reinforcing part is attached to a release liner to form a laminate consisting of a release liner and an adhesive film, and then the adhesive film of this laminate is punched out into the shapes of the label and / or reinforcing part simultaneously or separately, and the unnecessary adhesive film is peeled off and removed from the release liner, etc.
[0105] ≪≪4. Cleaning function-equipped conveying components≫≫ The cleaning function-equipped transport member according to the embodiment of the present invention includes a cleaning sheet according to the embodiment of the present invention and a transport member.
[0106] Fig. 4 is a schematic cross-sectional view showing one embodiment of a cleaning-function-equipped transport member according to an embodiment of the present invention. In Fig. 4, a cleaning-function-equipped transport member 300 has a cleaning sheet 100 and a transport member 200. When the cleaning sheet 100 has an adhesive layer, the adhesive layer is preferably the outermost layer of the cleaning sheet 100 on the transport member 200 side.
[0107] Any suitable conveying member can be used as the conveying member as long as it does not impair the effects of the present invention. Examples of such conveying members include semiconductor wafers (e.g., silicon wafers), substrates for flat panel displays such as LCDs and PDPs, compact discs, and MR heads. Among these conveying members, when the purpose is to clean a wafer conveying device in a substrate processing apparatus, a semiconductor wafer (e.g., silicon wafer) is typically used. [Example]
[0108] The present invention will be described in more detail below with reference to examples and comparative examples. However, the present invention is not limited to these examples. In the following description, "parts" and "%" are by weight unless otherwise specified.
[0109] <Measurement of storage modulus at 1 Hz in the range of 0°C to 100°C> The storage modulus was measured using a solid viscoelasticity measuring device (Model RSAG-2, manufactured by TA Instruments Japan Co., Ltd.). Specifically, a test piece 30 mm long (measurement length) and 10 mm wide was cut out, and the storage modulus of the test piece was measured using the solid viscoelasticity measuring device (Model RSAG-2, manufactured by TA Instruments Japan Co., Ltd.) in the temperature range of 0°C to 100°C under the following conditions: frequency 1 Hz, heating rate 10°C / min, and chuck distance 10 mm.
[0110] <Measurement of the rate of change in storage modulus at 1 Hz in the range of 0°C to 100°C> In the measurement of the storage elastic modulus at 1 Hz within the range of 0°C to 100°C, the values at 0°C and 100°C were read, and the rate of change was calculated using the following formula. Rate of change (%) = [(Storage elastic modulus at 100°C - Storage elastic modulus at 0°C) / Storage elastic modulus at 0°C] × 100
[0111] <Measurement of the storage elastic modulus at 25°C within the range of 0.001 Hz to 1 Hz> The storage elastic modulus was measured using a solid viscoelasticity measuring device (model RSAG-2, manufactured by TA Instruments Japan Co., Ltd.). Specifically, a test piece with a length of 30 mm (measurement length) and a width of 10 mm was cut out, and using a solid viscoelasticity measuring device (model RSAG-2, manufactured by TA Instruments Japan Co., Ltd.), under the condition of a chuck distance of 10 mm, a frequency-temperature dispersion test was conducted in the temperature range of 0°C to 100°C in 5°C steps and under the condition of a frequency of 0.1 Hz to 10 Hz. Then, using the measurement results, the shift factor was obtained using the WLF equation (in accordance with the experimental equation (13) described in JIS K 6394), and according to this shift factor, the frequency-dependent curve at each measurement temperature was shifted to create a master curve at the reference temperature of 25°C, and the storage elastic modulus within the range of 0.001 Hz to 1 Hz was calculated.
[0112] <Measurement of the rate of change of the storage elastic modulus at 25°C within the range of 0.001 Hz to 1 Hz> In the measurement of the storage elastic modulus at 25°C within the range of 0.001 Hz to 1 Hz, the values at 0.001 Hz and 1 Hz were read, and the rate of change was calculated using the following formula. Rate of change (%) = [(Storage elastic modulus at 0.001 Hz - Storage elastic modulus at 1 Hz) / Storage elastic modulus at 1 Hz] × 100 <Measurement of Tg> The maximum value of tanδ obtained simultaneously with the measurement of the storage elastic modulus at 1 Hz within the range of above 0°C to 100°C was read as Tg.
[0113] <Measurement of TG at 1% weight loss and 5% weight loss by TG-DTA analysis> Measurements were taken using a thermal analyzer (TG-DTA) "Thermo plus TG8120" (manufactured by Rigaku Corporation). The thermal weight loss of a test piece 30 mm long (measurement length) and 10 mm wide was measured in the temperature range of 25°C to 500°C at a heating rate of 10°C / min.
[0114] <Water absorption measurement> The weight of the modified polybenzoxazole sheet (thickness: 20 μm) formed on the entire surface of a wafer (diameter 150 mm / thickness 720 μm) was measured. After that, it was left to stand in an environment of 85°C and 85% RH for 72 hours, and the weight was measured again. The water absorption rate was calculated from the weight change. Water absorption rate (%) = [(weight after water absorption - weight before water absorption) / weight before water absorption] × 100
[0115] <Measurement of adsorption force at 25℃> Measurements were made using a nanoindenter at a frequency of 100 Hz, a pressing depth of 100 nm, a measurement sample size of 1.0 cm × 1.0 cm, and an amplitude of 2 nm. Specifically, measurements were made under the following conditions, and the minimum load on the unloading curve in the resulting load-displacement curve was taken as the chucking force. (Measurement equipment and measurement conditions) Equipment: Tribo Indenter manufactured by Hysitron Inc. Indenter used: Berkovich (triangular pyramid type) Measurement method: Single indentation measurement Indentation depth setting: 100 nm Frequency: 100Hz Amplitude: 2nm Sample size: 1cm x 1cm
[0116] [Example 1] (Production of modified polybenzoxazole varnish) A separable flask equipped with a stirrer was charged with 12.0 g of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol), 8.0 g of pyridine, and 100 g of N-methyl-2-pyrrolidone. The mixture was stirred at room temperature until the 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) and "Priamine 1075" were completely dissolved. Then, 7.5 g of trimethylchlorosilane was added dropwise over 10 minutes, followed by stirring at room temperature for 60 minutes. 2.0 g of polyamine (CRODA, trade name "Priamine 1075", dimer diamine) was added, followed by stirring for 3 minutes. Then, 11.0 g of 4,4'-bis(chlorocarbonyl)diphenyl ether was slowly added over 30 minutes, followed by stirring at room temperature for 2 hours. The obtained synthesis liquid was added dropwise to 2 L of ion-exchanged water, and the obtained precipitate was dried at 100 °C for 24 hours. After drying, the precipitate was redissolved in a four-fold amount of N-methyl-2-pyrrolidone to obtain a varnish of modified polybenzoxazole (1). (Production and evaluation of a cleaning-function-equipped transport member having a cleaning layer) The obtained varnish of modified polybenzoxazole (1) was applied by spin coating onto the mirror surface of an 8-inch silicon wafer, heated at 120°C for 10 minutes to remove N-methyl-2-pyrrolidone, and then heated at 300°C for 2 hours under vacuum to obtain a cleaning function-equipped conveying member (1) having a cleaning layer (1) with a thickness of 20 μm. The results of various evaluations are shown in Table 1.
[0117] [Example 2] The same procedure as in Example 1 was carried out, except that the amount of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) used was changed to 11.0 g and the amount of polyamine (manufactured by CRODA, trade name "Priamine 1075", dimer diamine) used was changed to 4.0 g, to obtain a modified polybenzoxazole (2) and a cleaning function-equipped conveying member (2) having a cleaning layer (2) with a thickness of 20 μm. The results of various evaluations are shown in Table 1.
[0118] [Example 3] The same procedure as in Example 1 was carried out, except that the amount of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) used was changed to 9.5 g and the amount of polyamine (manufactured by CRODA, trade name "Priamine 1075", dimer diamine) used was changed to 6.0 g, to obtain a modified polybenzoxazole (3) and a cleaning function-equipped conveying member (3) having a cleaning layer (3) with a thickness of 20 μm. The results of various evaluations are shown in Table 1.
[0119] [Example 4] The same procedure as in Example 1 was carried out, except that the amount of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) used was changed to 8.0 g, and the amount of polyamine (manufactured by CRODA, trade name "Priamine 1075", dimer diamine) used was changed to 8.0 g, to obtain a modified polybenzoxazole (4) and a cleaning function-equipped conveying member (4) having a cleaning layer (4) with a thickness of 20 μm. The results of various evaluations are shown in Table 1.
[0120] [Example 5] The same procedure as in Example 1 was carried out, except that the amount of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) used was changed to 10.9 g, and polyamine (manufactured by Croda, trade name "Priamine 1075", dimer diamine) was replaced with polyamine (manufactured by Huntsman, trade name "Elastamine RT-1000", PE diamine, H2N-CH(CH3)-CH2-(O-CH(CH3)-CH2)2-(O-CH2CH2CH2CH2)9-(O-CH2-CH(CH3))3-NH2): 7.7 g, to obtain a modified polybenzoxazole (5) and a cleaning-function-equipped conveying member (5) having a cleaning layer (5) with a thickness of 20 μm. The results of various evaluations are shown in Table 1.
[0121] [Comparative Example 1] The same procedure as in Example 1 was carried out, except that the amount of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) used was changed to 8.7 g, and 13.2 g of polyamine (manufactured by HUNTSMAN, product name "ELASTAMINE RT-1000", H2N-CH(CH3)-CH2-(O-CH(CH3)-CH2)2-(O-CH2CH2CH2CH2)9-(O-CH2-CH(CH3))3-NH2) was used instead of polyamine (manufactured by CRODA, product name "Priamine 1075", dimer diamine), to obtain a cleaning function-equipped conveying member (C1) comprising a modified polybenzoxazole (C1) and a cleaning layer (C1) having a thickness of 20 μm. The results of various evaluations are shown in Table 1.
[0122] Comparative Example 2 The same procedure as in Example 1 was carried out, except that the amount of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) used was changed to 11.6 g, and 5.7 g of polyamine (manufactured by HUNTSMAN, product name "ELASTAMINE RT-1000", H2N-CH(CH3)-CH2-(O-CH(CH3)-CH2)2-(O-CH2CH2CH2CH2)9-(O-CH2-CH(CH3))3-NH2) was used instead of polyamine (manufactured by CRODA, product name "Priamine 1075", dimer diamine), to obtain a cleaning function-equipped conveying member (C2) comprising a modified polybenzoxazole (C2) and a cleaning layer (C2) having a thickness of 20 μm. The results of various evaluations are shown in Table 1.
[0123] Comparative Example 3 The same procedure as in Example 1 was carried out, except that the amount of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) used was changed to 13.0 g and the amount of polyamine (manufactured by CRODA, trade name "Priamine 1075", dimer diamine) used was changed to 1.0 g, to obtain a modified polybenzoxazole (C3) and a cleaning function-equipped conveying member (C3) having a cleaning layer (C3) with a thickness of 20 μm. The results of various evaluations are shown in Table 1.
[0124] Comparative Example 4 The same procedure as in Example 1 was carried out, except that the amount of 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) used was changed to 6.5 g and the amount of polyamine (manufactured by CRODA, trade name "Priamine 1075", dimer diamine) used was changed to 9.8 g, to obtain a modified polybenzoxazole (C4) and a cleaning function-equipped conveying member (C4) having a cleaning layer (C4) with a thickness of 20 μm. The results of various evaluations are shown in Table 1.
[0125] Comparative Example 5 The same procedure as in Example 1 was carried out, except that 4,4'-(hexafluoroisopropylidene)bis(2-aminophenol) and trimethylchlorosilane were not used and the amount of polyamine (manufactured by CRODA, trade name "Priamine 1075", dimer diamine) used was changed to 20 g, to obtain a modified polybenzoxazole (C5) and a cleaning function-equipped conveying member (C5) having a cleaning layer (C5) with a thickness of 20 μm. The results of various evaluations are shown in Table 1.
[0126] [Table 1] [Industrial Applicability]
[0127] The cleaning sheet and the transport member with cleaning function of the present invention are suitably used for cleaning substrate processing equipment such as various manufacturing equipment and inspection equipment. [Explanation of symbols]
[0128] Cleaning Sheets 100 Cleaning Layer 10 Protective film 20 Adhesive layer 30 Support 40 Cleaning function-equipped conveying member 300 Conveying member 200
Claims
1. It comprises a modified polybenzoxazole having a benzoxazole ring structure and two or more amide bonds, a storage modulus of 200 MPa to 2000 MPa at 1 Hz in the range of 0°C to 100°C; The rate of change in storage modulus at 1 Hz in the range of 0 ° C to 100 ° C is 50% or less. Modified polybenzoxazole sheet.
2. 2. The modified polybenzoxazole sheet according to claim 1, wherein the rate of change in storage modulus at 25° C. within a frequency range of 0.001 Hz to 1 Hz is 50% or less.
3. 3. The modified polybenzoxazole sheet according to claim 1, wherein the two or more amide bonds are derived from polyamines.
4. 4. The modified polybenzoxazole sheet according to claim 3, wherein the polyamine is at least one selected from the group consisting of diamine compounds having a polyether structure, aliphatic diamines, and aromatic diamines.
5. A cleaning sheet comprising a cleaning layer, the cleaning layer being the modified polybenzoxazole sheet according to any one of claims 1 to 4.
6. The cleaning sheet of claim 5 , comprising an adhesive layer.
7. 7. The cleaning sheet of claim 5 or 6, comprising a support.
8. A conveying member with a cleaning function, comprising the cleaning sheet according to any one of claims 5 to 7 and a conveying member.
Citation Information
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