Method for fabricating high voltage semiconductor devices with improved field suppression

Abstract

To provide methods of fabricating a semiconductor device.SOLUTION: A method includes providing a plurality of semiconductor devices. The method further includes disposing a dielectric dry film on the plurality of semiconductor devices, where the dielectric dry film is patterned such that openings in the patterned dielectric dry film are aligned with conductive pads of each of the semiconductor devices.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The subject matter disclosed herein relates to semiconductor devices, and more particularly to semiconductor devices with improved electric field suppression. [Background technology]

[0002] Power electronics systems, such as power conversion systems, are widely used throughout modern electrical systems to convert electrical power from one form to another for consumption by loads. Many power electronics systems use a variety of semiconductor devices and components, such as thyristors, diodes, and various types of transistors (e.g., metal-oxide-semiconductor field-effect transistors (MOSFETs), junction-gate field-effect transistors (JFETs), insulated-gate bipolar transistors (IGBTs), and other suitable transistors) in this power conversion process. Various semiconductor devices may be included in power electronics systems to control the flow of electrical current in a circuit. Specifically, semiconductor devices such as transistors (e.g., metal-oxide-semiconductor field-effect transistors (MOSFETs) or insulated-gate bipolar transistors (IGBTs)) may be utilized. However, while certain types of transistors or other semiconductor devices are utilized in high-power applications due to the specific benefits offered by such transistor selection, each type of transistor may present several design considerations and challenges to ensure reliable operation.

[0003] A semiconductor device frequently used in power electronics systems is the silicon carbide metal-oxide-semiconductor field-effect transistor (SiC MOSFET). The potential performance benefits of SiC MOSFETs in high-power, high-frequency power switching applications have been well established. For example, SiC enables high critical electric field strengths (2–3 MV / cm) that are roughly 10 times greater than those achievable using semiconductor devices (e.g., transistors) fabricated on silicon (Si) substrates. Therefore, the use of SiC substrates provides devices with high-voltage, high-frequency, and high-efficiency performance, as SiC unipolar devices (JFETs, MOSFETs) offer low losses in the voltage range that Si unipolar devices cannot offer. However, the large electric fields associated with SiC materials under blocking conditions (and the interaction of the electric field with the dielectric system above the SiC surface) complicate the design, fabrication, and testing of SiC MOSFET devices.

[0004] Specifically, the use of SiC as a material for high-voltage output devices presents challenges during fabrication and high-voltage testing in both wafer and die forms in power modules. In both wafer and die forms, the photovoltage termination region is typically covered with a material of low dielectric strength, such as air when the device is in wafer form and silicone gel when the device is in module form. When the device is tested under certain conditions, such as high-voltage reverse bias conditions, an electric field extends out of the semiconductor substrate through the insulating layer fabricated as a passivation layer covering the termination region. The electric field strength can exceed the capabilities of the material above the passivation, resulting in reliability risks or dielectric failure (arcing). Summary of the Invention [Problem to be solved by the invention]

[0005] The embodiments described herein may address one or more of the difficulties mentioned above. [Means for solving the problem]

[0006] In one embodiment, a method of fabricating semiconductor devices is described. The method includes providing a plurality of semiconductor devices. The method further includes disposing a dielectric dry film on the plurality of semiconductor devices, the dielectric dry film being patterned such that openings in the patterned dielectric dry film align with conductive pads on each of the plurality of semiconductor devices.

[0007] In another embodiment, a method of fabricating semiconductor devices is described. The method includes providing a wafer comprising a plurality of semiconductor devices. The method further includes disposing an electric field (E-field) suppression layer on the wafer, the E-field suppression layer comprising openings aligned with the conductive pads of each of the plurality of semiconductor devices. The method further includes functionally testing each of the plurality of semiconductor devices in the wafer over a range of operating parameters.

[0008] In another embodiment, a method of fabricating semiconductor devices is described. The method includes providing a wafer including an electric field (E-field) suppression layer formed across a plurality of semiconductor devices, the E-field suppression layer including openings aligned with conductive pads of each of the plurality of semiconductor devices. The method further includes functionally testing each of the plurality of semiconductor devices in the wafer via the conductive pads over a range of operating parameters to identify known good die. The method also includes singulating each of the plurality of semiconductor devices. Still further, the method includes packaging the known good die.

[0009] These and other features, aspects, and advantages of the present invention will become better understood when the following detailed description is read in conjunction with the accompanying drawings, in which like reference numerals represent like parts throughout the drawings. [Brief explanation of the drawings]

[0010] [Figure 1]FIG. 1 is a block diagram of a power electronics system including a semiconductor device according to an embodiment of the present disclosure. [Figure 2] 1 is a cross-sectional view of a termination region of a silicon carbide (SiC) semiconductor device that may be utilized in a power electronics system. [Figure 3] 1 is a cross-sectional view of a termination region of a silicon carbide (SiC) semiconductor device that may be utilized in a power electronics system according to an embodiment of the present disclosure. [Figure 4] 4A-4C are diagrams of modeling results of electric field strength above the surface of the SiC semiconductor device of FIG. 3 across various materials and temperatures. [Figure 5] FIG. 1 is a diagram of a wafer fabricated with an E-field suppression layer, according to an embodiment of the present invention. [Figure 6A] 1 is a top view of a portion of a SiC semiconductor device fabricated in accordance with an embodiment of the present invention. [Figure 6B] 1 is a side view of a portion of a SiC semiconductor device fabricated in accordance with an embodiment of the present invention. [Figure 7A] FIG. 2 is a top view of a portion of a SiC semiconductor device fabricated in accordance with another embodiment of the present invention. [Figure 7B] FIG. 2 is a side view of a portion of a SiC semiconductor device fabricated in accordance with another embodiment of the present invention. [Figure 8A] FIG. 2 is a top view of a portion of a SiC semiconductor device fabricated in accordance with another embodiment of the present invention. [Figure 8B] FIG. 2 is a side view of a portion of a SiC semiconductor device fabricated in accordance with another embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0011] One or more specific embodiments are described below. In an attempt to provide a concise description of these embodiments, not all features of an actual implementation are described herein. It should be understood that in the development of any such actual implementation, as in any engineering or design project, numerous implementation-specific decisions must be made to achieve the developer's particular goals, such as adherence to system-related and business-related constraints, which may differ from one implementation to another. Moreover, it should be understood that such a development effort is complex and time-consuming, but is a routine undertaking of design, fabrication, and manufacture for those of ordinary skill in the art having the benefit of this disclosure.

[0012] Unless otherwise defined, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. As used herein, terms such as "first," "second," and the like do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Also, when introducing elements of various embodiments of the present disclosure, the articles "a," "an," and "the" are intended to mean that there are one or more of the element. The terms "comprise," "include," and "have" are intended to be inclusive and mean that there may be additional elements other than the listed elements. When ranges are disclosed, the endpoints of all ranges directed to the same component or property are inclusive and independently combinable. The modifier "approximately" used in connection with a quantity is inclusive of the stated value and has the meaning dictated by the context (e.g., including the degree of process variance or error associated with measuring the specific quantity).

[0013] As used herein, the term "layer" refers to a material disposed in a continuous or discontinuous manner on at least a portion of an underlying surface. Furthermore, the term "layer" does not necessarily imply a uniform thickness of the disposed material; the disposed material may have a uniform or varying thickness unless otherwise specified. Furthermore, the term "layer" as used herein refers to a single layer or multiple layers unless the context clearly dictates otherwise. Furthermore, as used herein, the terms "disposed," "sputtered," or "deposited" refer to layers that are directly disposed in contact with each other, or indirectly disposed by having an intervening layer, unless otherwise specified. The term "adjacent" as used herein means that two layers are continuously disposed and in direct contact with each other. Furthermore, the term "on" describes the relative position of layers / regions relative to each other and does not necessarily mean "over," as the relative position of above or below depends on the orientation of the device to the viewer. Additionally, the use of "top," "bottom," "above," "below," "above," "upper," and variations of these terms are done for convenience and do not require any specific orientation of components unless otherwise stated. With this in mind, as used herein, "bottom," "middle," or "bottom" refer to features that are relatively closer to the substrate layer, while the terms "top" or "upper" refer to specific features that are relatively farthest from the substrate layer.

[0014] Various semiconductor devices may be included in the power conversion system. Specifically, semiconductor devices such as transistors (e.g., metal oxide semiconductor field effect transistors (MOSFETs), junction field effect transistors (JFETs), or insulated gate bipolar transistors (IGBTs)) and power diodes may be utilized. While the present embodiments are described herein in the context of metal oxide semiconductor field effect transistors (MOSFETs), it should be understood that portions of the present technology are applicable to other types of semiconductor device structures, such as other types of transistors or other semiconductor devices utilized in high-voltage systems. Furthermore, while the presently described embodiments have been tested to provide particular benefits for silicon carbide-based semiconductor devices (e.g., SiC MOSFETs), the present embodiments may also provide benefits for semiconductor devices employing other substrate materials, such as, for example, silicon (Si), silicon carbide (SiC), germanium (Ge), aluminum nitride (AlN), gallium nitride (GaN), gallium arsenide (GaAs), diamond (C), and the like.

[0015] A technical effect of embodiments of the present invention is to provide a robust semiconductor device that can be utilized in high voltage systems and that can be tested in wafer form to full voltages and ratings temperatures, and in die form to full voltages and ratings temperatures, without special probing techniques for arc suppression (e.g., probing using a removable liquid dielectric layer or the use of a high voltage probing chamber). The present embodiments provide semiconductor devices, such as SiC MOSFET devices, that have specific regions, such as termination regions, covered with a robust, flexible, thick dielectric electric field (E-field) suppression layer that is compatible with commercial fabrication and is sufficient to reduce the fringing field strength below that required for reliable module use (where the device is encapsulated in silicone gel) or below the dielectric strength of air to avoid arcing when probed in wafer or die form, even at rating temperatures.

[0016] More specifically, the E-field suppression layer is patterned and disposed over the device termination region to prevent arcing under high-voltage testing, such as reverse bias at full voltage, and the elevated temperatures of evaluation. In one embodiment, the E-field suppression layer is a dielectric polyimide that can be provided and patterned in roll or sheet form. Metal contact areas on the top surface of the SiC MOSFET are left exposed through the patterned, thick E-field suppression layer for wire bonding or other contact schemes. The E-field suppression layer can be singulated with the die during wafer sawing and remain part of the unpackaged die for individual packaging or use in power modules where the E-field suppression layer provides protection from reliability failures associated with large electric fields. The E-field suppression layer has a thickness sufficient to suppress or prevent electric field arcing that may occur above the surface of the SiC MOSFET during high-voltage testing.

[0017] The technical effects of the present embodiment are that it enables testing of semiconductor devices at all voltages and temperatures of evaluation without the use of specialized test equipment, reducing the risk of damage to the semiconductor device or test equipment. Confidence in producing a "known good die" from wafer probe is increased, reducing reliability risks. Quality issues due to insufficient dielectric strength (i.e., voids across terminations due to fill issues or air bubbles) can be determined at the wafer level before the die are assembled into high-value assemblies, thereby reducing costs associated with scrapped devices after assembly.

[0018] Additionally, the disclosed embodiments mitigate failures that may be associated with defects that may only be detectable via visual inspection, where visual inspection is difficult or not possible during device fabrication. For example, at certain points during the manufacture of a semiconductor device, there may be no ability to visually inspect for quality defects in or through the transparent gel or assembly utilized to fabricate the device. Such visual inspection is typically desirable to locate debris from brazing or welding operations associated with the fabrication of semiconductor devices (e.g., SiC MOSFETs) or to identify other undesirable particles that may affect the operation or reliability of the device. The inability to perform visual inspection at certain points may be due to a lack of visibility (line of sight) to see the die in assembly or the lack of availability of non-destructive testing methods to inspect through the surrounding material (e.g., gel). Advantageously, the semiconductor devices described herein with a thick E-field suppression layer over the termination region mitigate failures that may have been associated with bubbles or particles in previous designs, thereby eliminating the need for visual inspection that may have been beneficial in previous designs to prevent device failures. Thus, this embodiment allows for full voltage rating at the die level providing higher quality and reliable parts. Furthermore, in module construction, the E-field in the gel can remain below the dielectric strength rated material, avoiding reliability concerns that may be associated with particles and bubbles.

[0019] Still further, according to embodiments provided herein, a power overlay (POL) structure is advantageously employed to bond to a SiC MOSFET. As device current densities increase, the total device current may be limited by the allowable current of the wire connection to the source bond (e.g., limited cross-sectional area). This is especially true for smaller dies with a relatively large area of ​​the die used for termination. As provided herein, an E-field suppression layer formed over the termination region can be utilized as a POL dielectric layer in combination with a POL metallization layer to form a POL structure that redistributes the junction area to be larger than the original pad size. The disclosed POL structure incorporating an E-field suppression layer disposed over the termination region can also accommodate remetallization to be compatible with various metal types and various bonding techniques.

[0020] An additional technical effect of the presently disclosed embodiments is that, because the die edge region of a semiconductor device typically generates the largest electric fields in the design, the implementation of an E-field suppression layer in the edge region can reduce electrical requirements and broaden the allowable material properties in subsequent device encapsulation. This allows higher voltage die to be integrated with lower voltage module design features. The E-field suppression layer also provides stress buffering that could otherwise damage devices without such layers, which can enable the use of rigid encapsulation materials to accommodate larger volumetric device sizes or more complex 3D module shapes.

[0021] With the foregoing in mind, FIG. 1 illustrates a block diagram of an embodiment of a power electronics system 10 (e.g., a power conversion system, a switching system, etc.). The power electronics system 10 may include an electric power source 12, an electric load 14, at least one semiconductor device 16 (e.g., a switching device), and a controller 18 (e.g., an electronic control unit). The electric power source 12 may include an alternating current (AC) power source or a direct current (DC) power source. In some embodiments, the electric power source 12 may include a power grid, a generator, a battery, etc. The electric power source 12 is electrically connected to the semiconductor device 16 and may provide current (e.g., AC current or DC current) to the semiconductor device 16. The at least one semiconductor device 16 is also electrically connected to the electric load 14 and may provide current (e.g., AC current or DC current) to the electric load 14. The electric load 14 may include a DC load or an AC load. In certain embodiments, the electric load 14 may be configured to store power and / or use power to perform an operation. For example, the electrical load 14 may include a battery, a computer, an electric motor, and the like.

[0022] The semiconductor device 16 may be in communication with the controller 18 via one or more wired and / or wireless communications. In some embodiments, the controller 18 may comprise one or more processing devices and one or more memory devices (e.g., tangible, non-transitory computer-readable media) that store instructions executable by the one or more processing devices. In particular embodiments, the controller 18 may comprise a logic array and / or control circuitry. The controller 18 may be configured to switch the semiconductor device 16 between a conductive state (e.g., an on state) and a non-conductive state (e.g., an off state). Furthermore, the semiconductor device 16 may be configured to control the flow of current from the power source 12 to the electrical load 14. Specifically, the semiconductor device 16 may allow or enable current to flow from the power source 12 to the electrical load 14 when the semiconductor device 16 is in a conductive state. Additionally, the semiconductor device 16 may block current from flowing from the power source to the electrical load 14 when the semiconductor device 16 is in a non-conductive state. According to one embodiment, semiconductor device 16 comprises a silicon carbide metal oxide semiconductor field effect transistor (SiC MOSFET) fabricated to include a thick dielectric layer patterned over a termination region, as briefly described above and described in more detail below. In some embodiments, controller 18 may be configured to control semiconductor device 16 to convert AC current from power source 12 to DC current.

[0023] FIG. 2 is a cross-sectional view of an embodiment of a portion of a semiconductor device 16 that may be used in the power electronics system 10 of FIG. 1. Specifically, the semiconductor device 16 shown in FIG. 2 is a portion of a planar n-channel silicon carbide metal oxide semiconductor field effect transistor (SiC MOSFET), hereafter referred to as a SiC MOSFET device 20. As previously described, during device operation and testing, the termination region of the SiC MOSFET device 20 may exhibit large electric fields, particularly under certain operating conditions, and is discussed in detail below. Accordingly, the illustrated SiC MOSFET device 20 has been identified and described in combination with experimental data and simulation results provided to demonstrate particular reliability issues that may be associated with SiC MOSFET devices in wafer and die form. Specifically, only the termination region of the SiC MOSFET device 20 is shown to more clearly illustrate the experimental / modeling data and difficulties that may be associated with testing SiC MOSFET devices (and high-voltage devices) over a full voltage and temperature range.

[0024] The illustrated SiC MOSFET device 20 of FIG. 2 includes a semiconductor substrate layer 22, a semiconductor drift layer 24, a blocking junction 26, and a junction termination region 28. In the above embodiments, the semiconductor substrate layer 22 and the semiconductor drift layer 24 may include silicon carbide (SiC). The semiconductor drift layer 24 may be of a first conductivity type (e.g., an n-type drift layer) and may be in direct boundary connection with (i.e., disposed in direct contact with) the underlying SiC substrate layer 22. In some embodiments, the semiconductor substrate layer 22 may have the first conductivity type and may be more heavily doped than the semiconductor drift layer 24 (e.g., an n+ substrate layer). The blocking junction 26 may be formed in an upper portion of the semiconductor drift layer 24 and may be heavily doped with a second conductivity type (e.g., a p+ blocking junction) to provide a PN junction at the interface with the n-type portion of the semiconductor drift layer 24. Junction termination (JTE) region 28 is provided as a termination of the PN junction between blocking junction 26 and semiconductor drift layer 24. JTE region 28 is a region that has a graded doping profile relative to its proximity to blocking junction 26. That is, JTE region 28 may be most heavily doped with a second conductivity type (e.g., p+) at the boundary with blocking junction 26. As JTE region 28 extends laterally farther from the boundary with blocking junction 26, JTE region 28 becomes progressively more lightly doped. This graded doping from heavy to light across JTE region 28 creates a graded distribution of charge and spreads the electric field across the region.

[0025] The JTE region 28 described herein provides an illustrative example of a junction termination, and more specifically, the JTE region 28 described herein depicts an illustrative example of a graded-area JTE. However, in some embodiments, a buried region having a second conductivity type (e.g., p-type), such as a floating region, may additionally or alternatively be implemented to have one or more properties corresponding to another termination and / or junction termination structure. For example, the buried region may be implanted as a single-area JTE, which may include a single buried region in contact with an intermediate well region, and / or as a multi-area JTE, which may include one or more linked buried regions. In some embodiments, two or more linked buried regions may have the same or different properties, and at least one of the two or more linked buried regions may contact an intermediate well region. Additionally, in some embodiments, the buried region may be implemented to form a multi-floating-zone JTE. In such embodiments, the first buried region may contact the intermediate well region, but a set of additional buried regions, such as floating regions having different spacing and / or widths, may be implemented disconnected from the first buried region and from one another. Furthermore, in some embodiments, buried regions (e.g., floating regions) may be implemented to form a floating field ring (FFR) termination. In such embodiments, the floating regions may be implemented disconnected from one another and from the intermediate well region. Additionally or alternatively, buried regions may be implemented to form a spatially modulated JTE, which may include a first buried region in contact with the intermediate well region and disconnected from a set of additional buried regions embedded to form an FFR. It should also be understood that the techniques described herein may be applied to any suitable junction termination, such as a single-band JTE, a multi-band JTE, a graded JTE, a multi-floating-band JTE, an FFR, and / or a spatially modulated JTE, and that the embodiments described herein are intended to be illustrative and not limiting.

[0026] As used herein, terms such as "semiconductor element," "transistor element," "active element," "active device element," "MOSFET element," and the like refer to layers and materials that occupy a portion of a device formed on, in, above, or around semiconductor material. These terms do not include dielectric materials that are disposed across the surface of the device. For example, in the illustrated example, the semiconductor element (transistor element, active element, active device element) of SiC MOSFET device 20 includes a semiconductor substrate layer 22, a semiconductor drift layer 24, a blocking junction 26, and a junction termination region 28. However, the terms do not include overlying dielectric or insulating isolating materials, which are described further below.

[0027] As will be appreciated, SiC MOSFET device 20 may be coated with a number of dielectric and insulating films to provide physical and electrical isolation of the underlying device. For example, SiC MOSFET device 20 may include passivation layer 30 and dielectric layer 32. As described further below, when SiC MOSFET device 20 is in wafer or die form before the device is fully packaged, SiC MOSFET device 20 may be tested in a post-fabrication material or environment 34. That is, element 34 is used herein to designate the test environment when SiC MOSFET device 20 is still in wafer or die form.

[0028] Passivation layer 30 may include one or more thin layers of insulating materials, such as oxides and nitrides, that are used to form passivation layers during typical wafer processing. The thin layers that form passivation layer 30 may be deposited by standard deposition techniques to form a passivation layer 30 having a thickness in the range of, for example, approximately 1 to 10 microns (μm). In one embodiment of MOSFET device 20, described in detail below with respect to simulation testing, passivation layer 30 has a thickness of approximately 1.8 μm. By way of example, TABLE 1 provides a list of glassy films with various film types, dielectric properties, and possible thicknesses that can be used alone or in combination with each other (or similar materials) to form passivation layer 30.

[0029] [Table 1]

[0030] As is evident from TABLE 1, while the dielectric strength of oxides and nitrides is excellent (e.g., in the range of 3.0E6 to 10.0E6 V / cm), the thickness of the material in passivation layer 30 is generally limited to less than 10 μm using standard deposition techniques. Thus, passivation layer 30 provides some electrical isolation of the termination region of SiC MOSFET device 20. However, this electrical isolation may be insufficient to completely isolate the active material during high voltage operation, as described below.

[0031] A dielectric layer 32 may be formed over passivation layer 30 to provide further electrical isolation of the termination region underlying SiC MOSFET device 20. Polyimides (or similar materials) may be deposited alone or in combination with each other to form dielectric layer 32 according to standard deposition techniques used in wafer processing. By way of example, TABLE 2 provides a list of various polyimides that may be considered for termination region coverage on wafers and that may be deposited by standard techniques used in wafer processing.

[0032] [Table 2]

[0033] As is evident from TABLE 2, although the dielectric strength of polyimide materials is good (e.g., in the range of 2.75E6 to 4.7E6 V / cm), the thickness of the material in dielectric layer 32 is generally limited to less than 15 μm using standard deposition techniques. While dielectric layer 32 can provide additional isolation for the termination region of SiC MOSFET device 20, this layer, in combination with passivation layer 30, may not be sufficient to completely isolate the device during high voltage operation.

[0034] When the SiC MOSFET devices 20 are fabricated and still in wafer form, the devices can be electrically probed in the termination region for reliability and functional testing. That is, it is beneficial to test the SiC MOSFET devices 20 in wafer form before the die are singulated and packaged into known-good die. The sooner defects are identified, the less time and material that may ultimately be wasted by further processing equipment. Testing the SiC MOSFET devices 20 in wafer form (and in die form before further packaging) allows for the early identification of known-good die. Therefore, when the SiC MOSFET devices 20 are in wafer form, they are typically probed in a post-fabrication material (environment) 34, such as air or a gel. In particular, for electrical testing to be optimally meaningful, the SiC MOSFET devices 20 should be tested over the full range of possible operating temperatures and electrical limits that the SiC MOSFET devices 20 are rated to perform. However, electrical probing of SiC MOSFET device 20 in wafer form can pose challenges in full power rating and temperature due to the large E-field generated in the thermal domain at high voltages. For example, consider that as-fabricated material 34 can include one of the materials provided in TABLE 3.

[0035] [Table 3]

[0036] In particular, the dielectric strength of dry air is the lowest of any post-fabrication material or test environment 34 at standard temperature and pressure (STP). Therefore, when testing a SiC MOSFET device 20 in wafer form, the SiC MOSFET device 20 should be able to be tested to its highest rated voltage operation in dry air while maintaining a measurable E-field strength at the surface of the SiC MOSFET device 20 at a level of 3.0E4 V / cm or less. Test results of various embodiments of the SiC MOSFET device 20 described above having a glassy film passivation layer 30 having a thickness of less than 10 μm and a polyimide dielectric layer 32 having a thickness of less than 15 μm demonstrate that the design shown in FIG. 2 without additional materials is insufficient to provide complete electrical isolation in typical post-fabrication materials 34. Specifically, simulation results for SiC MOSFET devices 20 tested under reverse bias conditions (1700 V) in air show a measurable electric field strength of approximately 2.7E5 V / cm, which is well above the target maximum E-field strength in air at the surface of 3.0E4 V / cm. That is, the described passivation layer 30 in combination with the dielectric layer 32 does not provide the necessary protection to avoid arcing during testing in wafer or die form without special test equipment at the high temperature rating limits of the MOSFET devices 20 in gel or air (e.g., 175°C-200°C) and at the high voltage rating limits of the MOSFET devices 20 (e.g., 1700 V under full reverse bias conditions).

[0037] To mitigate the possibility of arcing above the material forming across the termination region of the SiC MOSFET device 20 during wafer and die testing, but prior to complete packaging of the SiC MOSFET device 20, an E-field suppression layer (further shown and described below with respect to FIGS. 3-7B ) is disclosed herein in accordance with an embodiment of the present invention. The E-field suppression layer provides further electrical isolation of the termination region of the SiC MOSFET device 20 so that the device can be reliably tested in wafer and die form at all rating temperatures and voltages.

[0038] Certain design considerations were made when selecting the material to be used for the E-field suppression layer, which may be deposited, disposed, or generally formed on the illustrated dielectric layer 32. Because the material for dielectric layer 32 has favorable properties, including high dielectric strength, similar dielectric materials were investigated for use in the E-field suppression layer. As such, simulations were performed to model the results of SiC MOSFET devices 20 having additional dielectric material over passivation layer 30 and dielectric layer 32 to determine appropriate thicknesses of dielectric material having E-field strengths in the range of 2.0E6 to 5.0E6 V / cm and dielectric constants in the range of 2.9 to 3.6 to form the E-field suppression layer and reliably test SiC MOSFET devices 20.

[0039] FIG. 3 illustrates a SiC MOSFET device 20 having an E-field suppression layer 36 formed on a dielectric layer 32. According to embodiments described herein, the E-field suppression layer 36 provides sufficient isolation of the electric field generated across the termination region of the SiC MOSFET device 20 in wafer or die form for full temperature and voltage characterization. As explained with respect to the simulated test results shown in FIG. 4, a sufficient thickness T of the E-field suppression layer 36 when utilizing materials having E-field strengths in the range of 2.0E6 to 5.0E6 V / cm and dielectric constants in the range of 2.9 to 3.6 was found to be in the approximate range of 80 μm to 100 μm, depending on the thicknesses and materials selected for the underlying passivation layer 30 and dielectric layer 32. This range of thickness T of the E-field suppression layer 36 also provides sufficient electrical isolation in the "worst-case" test environment of air. As will be appreciated, the thickness T of the E-field suppression layer 36 can be reduced to less than approximately the 80 μm to 100 μm range if the dielectric strength and / or thickness of the passivation layer 30 or the dielectric layer 32 is increased. In certain embodiments, the thickness T can be greater. For example, in other embodiments, the thickness T can be approximately in the 50 μm to 200 μm range. However, the selection of materials and deposition techniques commonly available in a typical fabrication facility may limit the material selection and thickness capabilities to materials and thicknesses similar to those described with respect to TABLE 1 and TABLE 2. Furthermore, if the test environment (i.e., the post-fabrication material 34) is known to be something other than air (e.g., silicone gel), the thickness of the E-field suppression layer 36 may also be reduced, as described further below with respect to FIG. 4.

[0040] Also as explained above, based on simulation test results showing that the thickness T of the E-field suppression layer 36 is approximately in the range of 80 μm to 100 μm for materials having an E-field strength in the range of 2.0E6 to 5.0E6 V / cm and a dielectric constant in the range of 2.9 to 3.6, many conventional techniques are unable to deposit materials such as those previously listed in TABLE 2 to an appropriate thickness range. Therefore, other forms of materials are disclosed herein as possible materials for the E-field suppression layer 36. For example, polyimide, polybenzoxazole (PBO), or a mixture of the two may be utilized as the E-field suppression layer 36. These materials may be applied to the chip surface as a liquid dielectric that is dispensed, cured, and patterned. The material may be spin-cast, dip-coated, spray-coated, or screen-printed. Liquid resin materials may also be applied additively using additive techniques, which may include screen printing, aerosol jet printing, gravure printing, or liquid dispensing. In one embodiment, The thick dielectric utilized for the E-field suppression layer 36 may be provided as a dry film in sheet or roll form of polyimide (e.g., Kapton brand). While polyimide in sheet form is generally described below as a candidate material for this E-field suppression layer 36 and demonstrated for its experimental validation, other high-temperature dielectric materials are available in sheet form. For example, polyetherimide (Ultem), polyimide, polyetherimide, liquid crystal polymer (LCP), polysulfone, polyetheretherketone (PEEK), polyaryleneetherketone, epoxy, and polybenzoxazole and fluoropolymers or epoxies are also available in 100-500 μm thick sheets and may also be considered.

[0041] Referring to FIG. 4, model results 40 are shown. Specifically, a SiC MOSFET device 20 is modeled having a passivation layer 30 and a dielectric layer 32 with properties similar to those described above with respect to TABLE 1 and TABLE 2, with an E-field suppression layer (e.g., a polyimide material) 36 formed on the dielectric layer 32. Simulated measurements of E-field strength through the simulated polyimide (along y-axis 42) are plotted as a function of distance from the semiconductor to the surface of the SiC MOSFET device 20 (along x-axis 44) to determine the thickness of the polyimide E-field suppression layer 36 to sufficiently suppress the electric field generated under the most severe operating conditions in gel or air (e.g., 1700 V under full reverse bias conditions). That is, the thickness of the polyimide E-field suppression layer 36 can be selected to ensure that the electric field strength of the E-field suppression layer 36 is equal to or greater than the dielectric strength of the test environment (i.e., the as-fabricated material 34). Further consideration may be provided if the dielectric strength of the material 34 after fabrication changes with temperature (such as silicone gel).

[0042] Referring again to TABLE 3, when silicone gel is the as-fabricated material 34, the dielectric strength of silicone gel at room temperature (25°C) is approximately 1.75E5 V / cm and approximately 1.0E5 V / cm at 175°C. The dielectric strength of air is approximately 3.0E4 over the typical operating range of SiC MOSFET device 20. Therefore, the thickness of E-field suppression layer 36 should be selected to reliably suppress the E-field that may be generated above the termination region of SiC MOSFET device 20. Returning again to FIG. 4, simulation test results under these three conditions demonstrate the minimum thickness of E-field suppression layer 36 to ensure reliable testing over the full voltage and temperature range of SiC MOSFET device 20.

[0043] Specifically, curve 46 models the electric field strength through the thickness of the polyimide, and therefore provides a threshold thickness for the E-field suppression layer 36 to provide adequate suppression of the electric field at 1700 V. When the as-fabricated material 34 on which the device is tested is silicone gel and the SiC MOSFET device 20 operates at room temperature, a threshold thickness of approximately 25 μm for the E-field suppression layer reduces the magnitude of the electric field to less than 1.75E5 V / cm, which is sufficient to suppress the maximum E-field that can be generated above the termination region, as indicated by point 48 on curve 46. When the as-fabricated material 34 is silicone gel and the MOSFET device 20 operates at a temperature of 175° C., a threshold thickness of approximately 44 μm for the E-field suppression layer 36 reduces the magnitude of the electric field to less than 1.0E5 V / cm, which is sufficient to suppress the maximum E-field that can be generated above the termination region, as indicated by point 50 on curve 46. When the as-fabricated material 34 is air and the MOSFET device 20 is operated at a given temperature, a threshold thickness of approximately 94 μm for the E-field suppression layer 36 reduces the magnitude of the electric field above this layer to less than 3.0E4 V / cm, which is sufficient to suppress the maximum E-field that can be generated above the termination region, as indicated by point 52 on curve 46. Therefore, to enable a “worst-case” test scenario in which the test environment (i.e., the as-fabricated material 34) is air, a total dielectric thickness of approximately 94 μm should be selected to mitigate reliability risks and / or dielectric failure (arcing) during testing at the voltages and temperatures for which the MOSFET device 20 is rated. That is, the combined thickness of the passivation layer 30, the dielectric layer 32, and the E-field suppression layer 36 should be approximately 94 μm (or greater) to ensure reliable testing. Thus, in an embodiment in which the passivation layer 30 is approximately 1.8 μm thick and the dielectric layer 32 is approximately 12 μm thick, the E-field suppression layer 36 should be approximately 82.2 μm thick or greater.

[0044] FIG. 5 shows a test wafer 60 containing SiC MOSFET devices 20 fabricated according to the present embodiment and tested to provide experimental verification. An enlarged view of a portion 62 of the wafer 60 is provided to better illustrate the SiC MOSFET die 20. According to the present embodiment, each die includes an E-field suppression layer 36. For purposes of testing and verification in wafer form, the passivation layer 30 (not visible) is deposited to a thickness of approximately 1.8 μm. A polyimide Kapton film, available in roll form, is bonded to the wafer to provide the E-field suppression layer 36. The combined thickness of the E-field suppression layer 36 and the underlying dielectric layer 32 is approximately 87 μm. Before the film (E-field suppression layer 36) is aligned and bonded to the wafer, the E-field suppression layer 36 is patterned via laser ablation to expose the gate metal 64 and source pad 66 for the probe. SiC MOSFET device 20 is a SiC device rated at 1200 volts, and SiC devices have been probed at full breakdown voltages at test temperatures ranging from room temperature to 200°C with no arcing observed. In fact, using these materials and thicknesses, E-field suppression layer 36 has been found to reliably prevent arcing when operated up to approximately 1800 volts. In particular, E-field suppression layer 36 can be any material that can be patterned (before or after deposition or placement on a wafer) to expose the underlying contact structure and that provides sufficient suppression of electric fields that may be generated by the semiconductor elements of SiC MOSFET device 20 during normal rated operating conditions (e.g., voltage and temperature).

[0045] 6A and 6B, other features and benefits of embodiments of the present invention are disclosed. Specifically, FIG. 6A illustrates a top view of a single SiC MOSFET device 20, and FIG. 6B illustrates a side view of the SiC MOSFET device 20. As illustrated, the SiC MOSFET device 20 includes an E-field suppression layer 36 patterned to expose a source metal pad 66. As previously described, the E-field suppression layer 36 has a thickness T (e.g., 80 μm to 100 μm) that is sufficient to block the electric field 70 that may be generated in the termination region when the SiC MOSFET device 20 operates at its highest voltage rating (e.g., 1700 V). In addition to the previously described benefits of the E-field suppression layer 36, particles, dirt, or bubbles that may be present on the top surface of the E-field suppression layer 36 do not affect device operation because the electric field 70 is reduced to below levels of concern within the E-field suppression layer 36. Thus, when the SiC MOSFET device 20 is later packaged, thereby eliminating the ability to visually inspect the surface of the device 20 for such debris, the detrimental effects of particles, debris, or air bubbles (in the packaging material) will be mitigated because the particles will not react with the residual electric field due to the reduced electric field 70 in the E-field suppression layer 36. Also shown in FIGS. 6A and 6B is a contact element 72 electrically coupled to the source metal pad 66 to provide an electrical connection to the SiC MOSFET device 20. In one embodiment, the contact element 72 is an aluminum wedge contact element that can electrically couple the SiC MOSFET device 20 to an external element, device, or system. As will be appreciated, other types of contact elements (e.g., wire bonds, straps, etc.) and other conductive metals (e.g., copper, gold, etc.) may be used in certain embodiments.

[0046] 7A and 7B are top and side views, respectively, of an alternative embodiment of a SiC MOSFET device 20 having an improved junction structure utilizing an E-field suppression layer 36. To increase the number of junction elements 72 and provide better current density for the SiC MOSFET device 20, an additional layer of metallization 74 is provided throughout the SiC MOSFET device 20. Advantageously, in addition to the benefits previously described, the E-field suppression layer 36 also provides a dielectric layer as an insulating barrier between the metallization 74 and the underlying active region of the SiC MOSFET device 20. In this embodiment, the E-field suppression layer 36 and the metallization 74 combine to provide a power overlay (POL) structure. The POL structure may be advantageously employed for connecting to the SiC MOSFET device 20. As the current density of the device increases, the total current of the device may be limited by the allowable current of the wire connection to the source bond (e.g., limited cross-sectional area). This is especially true for smaller die with a relatively large area of ​​the die used for termination. As provided herein, the E-field suppression layer 36 formed over the termination region can be utilized as a POL dielectric layer in combination with the POL metallization layer 74 to form a POL structure that redistributes the junction area to be larger than the original pad size (i.e., source metal pad 66) while maintaining electrical isolation from the underlying active region of the SiC MOSFET device 20. The disclosed POL structure incorporating the E-field suppression layer 36 disposed over the termination region can also accommodate remetallization to be compatible with various metal types and various bonding techniques. For example, the metallization 74 can be copper (Cu) with nickel-gold (NiAu) for better bonding. The number of bonding elements 72 can be increased because the size of the metallization 74 is larger than the underlying source metal pad 66. In one embodiment, the bonding elements 72 are aluminum wedge bonding elements. In another embodiment, the bonding elements 72 are copper wedge bonding elements.As will be appreciated, other types of bonding elements (eg, wire bonds, straps, etc.) and other conductive metals may be used in certain embodiments.

[0047] 8A and 8B are top and side views, respectively, of an alternative embodiment of a SiC MOSFET device 20 having an improved junction structure utilizing an E-field suppression layer 36 and a contact element 72 that can reduce the package on-resistance during operation. Similar to the embodiment shown in FIGS. 7A and 7B, the presently shown embodiment includes a POL structure for redistribution of junction area over a large area. The POL structure comprises an E-field suppression layer 36 (POL dielectric) and a metallization layer 74. The metallization 74 may be copper (Cu) with nickel-gold (NiAu) for better bonding. In the illustrated embodiment, the contact element 72 may be, for example, a copper strap or copper clip contact element that can be electrically and physically coupled to the underlying metallization 74 using solder 76. As will be appreciated, other conductive adhesives may be used in place of solder 76. Advantageously, the use of a copper clip contact can reduce the package on-resistance during operation.

[0048] This written description uses examples to disclose the invention, including the best mode, and to enable any person skilled in the art to practice embodiments of the disclosure, including making and using any devices or systems and practicing any incorporated methods. The patentable scope of the invention is defined by the claims, and may include other examples that occur to those skilled in the art. Such other examples are intended to be within the scope of the claims if they have structural elements that do not differ from the literal words of the claims, or if they include equivalent structural elements that have insubstantial differences from the literal words of the claims.

[0049] Further aspects of the present invention are provided by the subject matter of the following sections.

[0050] [Item 1] A method for fabricating semiconductor devices, the method comprising the steps of: providing a plurality of semiconductor devices; and disposing a dielectric dry film on the plurality of semiconductor devices, the dielectric dry film being patterned such that openings in the patterned dielectric dry film are aligned with conductive pads on each of the plurality of semiconductor devices.

[0051] [Item 2] The method of any preceding item, wherein the plurality of semiconductor devices are formed on a wafer, and wherein the step of disposing the dielectric dry film on the plurality of semiconductor devices includes arranging a sheet of the dielectric dry film on the wafer.

[0052] Item 3. The method of any preceding item, wherein the step of disposing the dielectric dry film on the plurality of semiconductor devices includes arranging the plurality of semiconductor devices on a sheet of the dielectric dry film.

[0053] [Item 4] The method of any preceding item, further comprising the step of depositing an adhesive on at least one of a surface of the dielectric dry film or a surface of the wafer before the step of disposing the dielectric dry film on the plurality of semiconductor devices.

[0054] [Item 5] The method of any preceding item, further comprising the step of patterning the adhesive layer.

[0055] [Item 6] The method of any preceding item, further comprising the step of patterning the dielectric dry film before the step of disposing the dielectric dry film on the plurality of semiconductor devices.

[0056] [Item 7] The method of any preceding item, further comprising the steps of disposing the dielectric dry film on the plurality of semiconductor devices and patterning the dielectric dry film after disposing the dielectric dry film on the wafer.

[0057] [Item 8] The method of any preceding item, wherein the dielectric dry film is patterned via laser ablation.

[0058] [Item 9] The method of any preceding item, including depositing a metallization layer over the patterned dielectric dry film and into the openings, such that the metallization layer is electrically coupled to the conductive pads through the openings.

[0059] [Item 10] The method of any preceding item, wherein the dielectric dry film has a thickness such that the electric field strength above the dielectric dry film is less than the dielectric strength of adjacent materials when the semiconductor device is operating at or below a maximum voltage.

[0060] [Item 11] The method of any preceding item, wherein the dielectric dry film has a thickness in the range of approximately 50 μm to 200 μm.

[0061] [Item 12] A method of fabricating semiconductor devices, the method comprising: providing a wafer comprising a plurality of semiconductor devices; disposing an electric field (E-field) suppression layer on the wafer, the E-field suppression layer comprising openings aligned with conductive pads of each of the plurality of semiconductor devices; and functionally testing each of the plurality of semiconductor devices on the wafer over a range of operating parameters.

[0062] [Item 13] The method of any preceding item, wherein the functionally testing step includes functionally testing each of the plurality of semiconductor devices in the wafer when each of the semiconductor devices is operating at or below a maximum voltage.

[0063] [Item 14] The method of any preceding item, wherein the maximum voltage is in the range of 900 volts to 10 KV.

[0064] [Item 15] The method of any preceding item, wherein the functionally testing step includes functionally testing each of the plurality of semiconductor devices in the wafer while each of the semiconductor devices is operating at or below a maximum temperature rating.

[0065] [Item 16] The method of any preceding item, wherein the maximum temperature rating is in the range of 175°C to 200°C.

[0066] [Item 17] The method of any preceding item, wherein functionally testing each of the plurality of semiconductor devices on the wafer includes identifying known good die on the wafer.

[0067] [Item 18] The method of any preceding item, comprising the step of singulating the plurality of semiconductor devices on the wafer.

[0068] [Item 19] The method according to any preceding item, further comprising packaging the individual semiconductor devices.

[0069] [Item 20] A method for fabricating semiconductor devices, the method comprising: providing a wafer having an electric field (E-field) suppression layer formed across a plurality of semiconductor devices, the E-field suppression layer having openings aligned with conductive pads of each of the plurality of semiconductor devices; functionally testing each of the plurality of semiconductor devices on the wafer via the conductive pads over a full range of operating parameters to identify known good die; singulating each of the plurality of semiconductor devices; and packaging the known good die.

[0070] [Item 21] The method of any preceding item, wherein the E-field suppression layer comprises a dielectric dry film.

[0071] [Item 22] The method of any preceding item, wherein the step of providing a wafer includes the steps of fabricating the plurality of semiconductor devices on a substrate, disposing the E-field suppression layer on the plurality of semiconductor devices, and patterning the E-field suppression layer to form the openings.

[0072] [Item 23] The methods of any preceding item, performed in the order recited.

[0073] [Item 24] The method of any preceding item, wherein the step of functionally testing includes functionally testing each of the plurality of semiconductor devices over the full range of voltages and temperatures at which each of the plurality of semiconductor devices is rated to operate.

[0074] Further aspects of the present invention are provided by the subject matter of the following sections.

[0075] [Item 1] A method for fabricating semiconductor devices, the method comprising the steps of: providing a plurality of semiconductor devices; and disposing a dielectric dry film on the plurality of semiconductor devices, the dielectric dry film being patterned such that openings in the patterned dielectric dry film are aligned with conductive pads on each of the plurality of semiconductor devices.

[0076] [Item 2] The method of any preceding item, wherein the plurality of semiconductor devices are formed on a wafer, and wherein the step of disposing the dielectric dry film on the plurality of semiconductor devices includes arranging a sheet of the dielectric dry film on the wafer.

[0077] Item 3. The method of any preceding item, wherein the step of disposing the dielectric dry film on the plurality of semiconductor devices includes arranging the plurality of semiconductor devices on a sheet of the dielectric dry film.

[0078] [Item 4] The method of any preceding item, further comprising the step of depositing an adhesive on at least one of a surface of the dielectric dry film or a surface of the wafer before the step of disposing the dielectric dry film on the plurality of semiconductor devices.

[0079] [Item 5] The method of any preceding item, further comprising the step of patterning the adhesive layer.

[0080] [Item 6] The method of any preceding item, further comprising the step of patterning the dielectric dry film before the step of disposing the dielectric dry film on the plurality of semiconductor devices.

[0081] [Item 7] The method of any preceding item, further comprising the steps of disposing the dielectric dry film on the plurality of semiconductor devices and patterning the dielectric dry film after disposing the dielectric dry film on the wafer.

[0082] [Item 8] The method of any preceding item, wherein the dielectric dry film is patterned via laser ablation.

[0083] [Item 9] The method of any preceding item, including depositing a metallization layer over the patterned dielectric dry film and into the openings, such that the metallization layer is electrically coupled to the conductive pads through the openings.

[0084] [Item 10] The method of any preceding item, wherein the dielectric dry film has a thickness such that the electric field strength above the dielectric dry film is less than the dielectric strength of adjacent materials when the semiconductor device is operating at or below a maximum voltage.

[0085] [Item 11] The method of any preceding item, wherein the dielectric dry film has a thickness in the range of approximately 50 μm to 200 μm.

[0086] [Item 12] A method of fabricating semiconductor devices, the method comprising: providing a wafer comprising a plurality of semiconductor devices; disposing an electric field (E-field) suppression layer on the wafer, the E-field suppression layer comprising openings aligned with conductive pads of each of the plurality of semiconductor devices; and functionally testing each of the plurality of semiconductor devices on the wafer over a range of operating parameters.

[0087] [Item 13] The method of any preceding item, wherein the functionally testing step includes functionally testing each of the plurality of semiconductor devices in the wafer when each of the semiconductor devices is operating at or below a maximum voltage.

[0088] [Item 14] The method of any preceding item, wherein the maximum voltage is in the range of 900 volts to 10 KV.

[0089] [Item 15] The method of any preceding item, wherein the functionally testing step includes functionally testing each of the plurality of semiconductor devices in the wafer while each of the semiconductor devices is operating at or below a maximum temperature rating.

[0090] [Item 16] The method of any preceding item, wherein the maximum temperature rating is in the range of 175°C to 200°C.

[0091] [Item 17] The method of any preceding item, wherein functionally testing each of the plurality of semiconductor devices on the wafer includes identifying known good die on the wafer.

[0092] [Item 18] The method of any preceding item, comprising the step of singulating the plurality of semiconductor devices on the wafer.

[0093] [Item 19] The method according to any preceding item, further comprising packaging the individual semiconductor devices.

[0094] [Item 20] A method for fabricating semiconductor devices, the method comprising: providing a wafer having an electric field (E-field) suppression layer formed across a plurality of semiconductor devices, the E-field suppression layer having openings aligned with conductive pads of each of the plurality of semiconductor devices; functionally testing each of the plurality of semiconductor devices on the wafer via the conductive pads over a full range of operating parameters to identify known good die; singulating each of the plurality of semiconductor devices; and packaging the known good die.

[0095] [Item 21] The method of any preceding item, wherein the E-field suppression layer comprises a dielectric dry film.

[0096] [Item 22] The method of any preceding item, wherein the step of providing a wafer includes the steps of fabricating the plurality of semiconductor devices on a substrate, disposing the E-field suppression layer on the plurality of semiconductor devices, and patterning the E-field suppression layer to form the openings.

[0097] [Item 23] The methods of any preceding item, performed in the order recited.

[0098] [Item 24] The method of any preceding item, wherein the step of functionally testing includes functionally testing each of the plurality of semiconductor devices over the full range of voltages and temperatures at which each of the plurality of semiconductor devices is rated to operate. [Explanation of symbols]

[0099] 10 Power Electronics Systems 12 Power source 14 Electrical Load 16 Semiconductor Devices 18 Control Device 20 n-channel silicon carbide metal oxide semiconductor field effect transistor, SiC MOSFET device, SiC MOSFET die 22 Semiconductor substrate layer, SiC substrate layer 24 Semiconductor drift layer 26 Blocking joint 28 Junction termination area, JTE area 30 Passive layer 32 Dielectric layer 34 Materials, environment, and elements after manufacture 36 E-field suppression layer 40 Model Results 42 y-axis 44 x-axis 46 curve 48, 50, 52 points 60 test wafers 62 A portion of the wafer 60 64 Gate Metal 66 Source metal pad 70 Electric Field 72 Connection Elements 74 Metallization, POL metallization layer T E-field suppression layer thickness

Claims

1. 1. A method of fabricating a semiconductor device, comprising: providing a plurality of semiconductor devices; disposing a dielectric dry film on the plurality of semiconductor devices, the dielectric dry film being patterned such that the dielectric dry film includes openings aligned with the conductive pads of each of the plurality of semiconductor devices; connecting a contact element directly to the conductive pad through one of the openings in the dielectric dry film; depositing a metallization layer over the patterned dielectric dry film and into the openings in the dielectric dry film such that the metallization layer is electrically coupled to the conductive pads through the openings in the dielectric dry film; A method comprising:

2. 10. The method of claim 1, wherein the plurality of semiconductor devices are formed on a wafer, and wherein disposing the dielectric dry film on the plurality of semiconductor devices comprises arranging a sheet of the dielectric dry film over the wafer.

3. The method of claim 1 , wherein disposing the dielectric dry film on the plurality of semiconductor devices comprises arranging the plurality of semiconductor devices on a sheet of the dielectric dry film.

4. 10. The method of claim 1, further comprising depositing an adhesive layer on at least one of a surface of the dielectric dry film or a surface of a wafer prior to placing the dielectric dry film on the plurality of semiconductor devices.

5. The method of claim 4 further comprising the step of patterning the adhesive layer.

6. The method of claim 1 , further comprising the step of patterning the dielectric dry film prior to the step of disposing the dielectric dry film on the plurality of semiconductor devices.

7. disposing the dielectric dry film on the plurality of semiconductor devices; patterning the dielectric dry film after disposing the dielectric dry film on a wafer; The method of claim 1 further comprising:

8. The method of claim 1 , wherein the dielectric dry film is patterned via laser ablation.

9. 10. The method of claim 1, wherein the dielectric dry film has a thickness such that the electric field strength above the dielectric dry film is less than the dielectric strength of adjacent materials when the semiconductor device is operating at or below a maximum voltage.

10. The method of claim 1 , wherein the dielectric dry film has a thickness in the range of 50 μm to 200 μm.

11. 1. A method of fabricating a semiconductor device, comprising: providing a wafer comprising a plurality of semiconductor devices; depositing an electric field (E-field) suppression layer on the wafer, the E-field suppression layer being patterned such that the E-field suppression layer includes openings aligned with conductive pads of each of the plurality of semiconductor devices; connecting a junction element directly to the conductive pad through one of the openings in the E-field suppression layer; functionally testing each of the plurality of semiconductor devices on the wafer over a range of operating parameters; depositing a metallization layer over the patterned E-field suppression layer and into the openings in the E-field suppression layer such that the metallization layer is electrically coupled to the E-field suppression layer through the openings in the E-field suppression layer; A method comprising:

12. 12. The method of claim 11, wherein functionally testing comprises functionally testing each of the plurality of semiconductor devices in the wafer while each of the plurality of semiconductor devices is operating at or below a maximum voltage.

13. 13. The method of claim 12, wherein the maximum voltage is in the range of 900 volts to 10 KV.

14. 12. The method of claim 11, wherein functionally testing comprises functionally testing each of the plurality of semiconductor devices in the wafer while each of the plurality of semiconductor devices is operating at or below a maximum temperature rating.

15. 15. The method of claim 14, wherein the maximum temperature rating is in the range of 175°C to 200°C.

16. 12. The method of claim 11, wherein functionally testing each of the plurality of semiconductor devices on the wafer comprises identifying known good die on the wafer.

17. The method of claim 11 , comprising singulating the plurality of semiconductor devices on the wafer.

18. The method of claim 17 including packaging the singulated semiconductor device.

19. 1. A method of fabricating a semiconductor device, comprising: providing a wafer comprising an electric field (E-field) suppression layer formed across a plurality of semiconductor devices, the electric field (E-field) suppression layer being patterned such that the electric field (E-field) suppression layer comprises openings aligned with conductive pads of each of the plurality of semiconductor devices; connecting a junction element directly to the conductive pad through one of the openings in the E-field suppression layer; depositing a metallization layer over the patterned E-field suppression layer and into the openings in the E-field suppression layer such that the metallization layer is electrically coupled to the E-field suppression layer through the openings in the E-field suppression layer; functionally testing each of the plurality of semiconductor devices on the wafer via the conductive pads over a range of operating parameters to identify known good die; singulating each of the plurality of semiconductor devices; packaging the known good die; A method comprising:

20. 20. The method of claim 19, wherein the electric field (E-field) suppression layer comprises a dielectric dry film.

21. The step of providing a wafer includes: fabricating the plurality of semiconductor devices on a substrate; disposing the electric field (E-field) suppression layer on the plurality of semiconductor devices; patterning the electric field (E-field) suppression layer to form the opening; 20. The method of claim 19, comprising:

22. 22. The method of claim 21, wherein the methods are performed in the order listed.

23. 20. The method of claim 19, wherein functionally testing comprises functionally testing each of the plurality of semiconductor devices over a full range of voltages and temperatures at which each of the plurality of semiconductor devices is rated to operate.

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