Substrate Cleaning Equipment

Abstract

The present disclosure provides a substrate cleaning device that can shorten the cleaning time required to remove materials adhering to the cleaning surface of a substrate. The substrate cleaning device (71) includes an internal confluence nozzle (25) having a gas storage space (S25) therein. Within the gas storage space (S25), the mist gas output port (15a) of the mist gas supply pipe (15) and the air gas output port (16a) of the air gas supply pipe (16) are disposed opposite each other across a collision area (80), and the gas output surface (F25) of the internal confluence nozzle (25) is located below the collision area (80). Cleaning mist gas (MG1) and air gas (AG1) collide and merge in the collision area (80), thereby producing a substrate supply gas (MG3) within the gas storage space (S25).

Description

[Technical Field]

[0001] The present disclosure relates to a substrate cleaning device that cleans a substrate, for example, a substrate cleaning device that cleans a substrate used in a plating processing device that forms a metal film in the manufacture of electronic components, etc. [Background technology]

[0002] Conventional cleaning devices for cleaning substrates and the like used in plating processing devices that form metal films in the manufacture of electronic components and the like include, for example, the sealed cleaning device disclosed in Patent Document 1, the substrate liquid processing device disclosed in Patent Document 2, the substrate cleaning device disclosed in Patent Document 3, the cleaning device disclosed in Patent Document 4, and the cleaning device disclosed in Patent Document 5.

[0003] The cleaning devices disclosed in Patent Documents 1 to 3 basically spray a cleaning liquid directly onto the object to clean it. The cleaning device disclosed in Patent Document 4 performs cleaning in a mist atmosphere. The cleaning device disclosed in Patent Document 5 performs cleaning by spraying a cleaning liquid directly onto the object to be cleaned, which is placed in a mist atmosphere.

[0004] Fig. 10 is an explanatory diagram showing a schematic configuration of a conventional substrate cleaning apparatus 78. Fig. 10 shows an XYZ Cartesian coordinate system. Note that the substrate cleaning apparatus 78 uses mist gas, similar to the cleaning apparatus disclosed in Patent Document 5.

[0005] As shown in the figure, ultrasonic atomizer 11 applies ultrasonic waves to the cleaning liquid contained therein to generate cleaning liquid mist MT. Carrier gas TG is supplied to ultrasonic atomizer 11 via carrier gas supply pipe 13.

[0006] Therefore, the cleaning liquid mist MT generated in the ultrasonic atomizer 11 is transported by the carrier gas TG to become a cleaning mist gas MG9. This cleaning mist gas MG9 is supplied to the mist nozzle 61 via the mist supply pipe 62. In this way, the cleaning mist gas MG9 containing the cleaning liquid mist MT generated in the ultrasonic atomizer 11 is supplied to the mist nozzle 61 via the mist supply pipe 62.

[0007] The mist nozzle 61 is arranged above the transport path along the substrate transport direction T1 of the substrate 1, and the mist nozzle 61 supplies cleaning mist gas MG9 downward from, for example, a slit-shaped mist outlet (not shown) provided on the bottom surface.

[0008] Therefore, by supplying cleaning mist gas MG9 containing cleaning liquid mist MT to the surface 1s of the substrate 1, which is the cleaning surface, the objects to be removed, etc. attached to the surface 1s of the substrate 1 are removed or decomposed, and as a result, the objects to be removed, etc. that are to be cleaned are cleaned. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] Japanese Patent Application Publication No. 11-76962 [Patent Document 2] International Publication No. 2018 / 501665 [Patent Document 3] Japanese Patent Application Laid-Open No. 2009-136742 [Patent Document 4] Japanese Patent Publication No. 2020-18993 [Patent Document 5] Japanese Patent Application Laid-Open No. 2007-33730 Summary of the Invention [Problem to be solved by the invention]

[0010] In a conventional substrate cleaning apparatus 78, cleaning mist gas MG9 is supplied locally from a mist nozzle 61 in a fixed direction toward the surface 1s of the substrate 1. Fig. 10 shows the case where the supply direction of cleaning mist gas MG9 is the -Z direction.

[0011] On the other hand, in a conventional substrate cleaning device 78, as shown in FIG. 10, the substrate 1 to be cleaned is transported along a substrate transport direction T1 (X direction) perpendicular to the supply direction (-Z direction) of the cleaning mist gas MG9.

[0012] As a result, the supply area of ​​the cleaning mist gas MG9 to the surface 1s of the substrate 1 becomes narrow, resulting in a first problem in that the cleaning time required to remove the materials adhering to the entire surface 1s of the substrate 1 becomes relatively long.

[0013] Furthermore, consider a case where a plurality of concave-convex regions 18 are provided on the surface 1s of the substrate 1, as shown in Figure 10. Each of the plurality of concave-convex regions 18 is formed by a combination of recesses 1a and protrusions 1b, and each is formed to extend in the Y direction. The plurality of concave-convex regions 18 are provided along the X direction. That is, the concave-convex formation direction D18, which is the direction in which each of the plurality of concave-convex regions 18 is formed, is the Y direction, and the arrangement direction of the plurality of concave-convex regions 18 is the X direction.

[0014] When a substrate 1 having a plurality of uneven regions 18 on its surface 1s is cleaned by the substrate cleaning device 78, the plurality of uneven regions 18 become obstacles, and as a result, there is a relatively high possibility that the cleaning mist gas MG9 cannot be supplied to the entire surface 1s to be cleaned of the substrate 1. This possibility is particularly high when the unevenness formation direction D18 of each of the plurality of uneven regions 18 and the substrate transport direction T1 of the substrate 1 are orthogonal to each other, as shown in FIG.

[0015] As described above, the conventional substrate cleaning device 78, which supplies cleaning mist gas MG9 from one direction to the surface 1s, which is the cleaning surface of the substrate 1, also had a second problem in that it was not possible to remove all of the materials to be removed that had adhered to the surface 1s of the substrate 1 without missing any.

[0016] The present disclosure aims to provide a substrate cleaning device that can solve at least the first of the first and second problems described above and shorten the cleaning time required to remove materials adhering to the cleaning surface of a substrate. [Means for solving the problem]

[0017] The substrate cleaning apparatus according to the present disclosure includes: a mist gas supply unit that supplies cleaning mist gas containing a cleaning liquid mist formed by misting a cleaning liquid in order to clean the cleaning surface of the substrate; an air gas supply unit that supplies air gas; and an internal confluence nozzle that has a gas storage space that stores the cleaning mist gas and the air gas, and that, when the cleaning mist gas and the air gas are supplied into the gas storage space, merges the cleaning mist gas with the air gas to generate a substrate supply gas, and outputs the substrate supply gas from an opening on a gas output surface that faces the cleaning surface of the substrate. [Effects of the Invention]

[0018] The internal confluence nozzle in the substrate cleaning apparatus of the present disclosure outputs substrate supply gas from an opening on the gas output surface facing the cleaning surface of the substrate, thereby making it possible to supply substrate supply gas all at once to a relatively wide area facing the cleaning surface of the substrate.

[0019] As a result, the substrate cleaning device of the present disclosure can shorten the cleaning time required to remove the substances adhering to the cleaning surface of the substrate.

[0020] The objects, features, aspects, and advantages of the present disclosure will become more apparent from the following detailed description and the accompanying drawings. [Brief explanation of the drawings]

[0021] [Figure 1] FIG. 1 is an explanatory diagram schematically illustrating the configuration of a substrate cleaning device according to a first embodiment. [Figure 2] 2 is an explanatory diagram schematically showing a cross-sectional structure of a gas storage space in the internal confluence nozzle shown in FIG. 1. FIG. [Figure 3]FIG. 1 is an explanatory diagram schematically illustrating a basic aspect of a substrate cleaning device according to a first embodiment. [Figure 4] FIG. 2 is a cross-sectional view schematically showing the structure of a rotation mechanism. [Figure 5] FIG. 2 is an explanatory diagram showing the planar structure of the injection plate of the first embodiment. [Figure 6] FIG. 10 is an explanatory view showing the planar structure of the injection plate of the second embodiment. [Figure 7] FIG. 10 is an explanatory view showing the planar structure of an injection plate according to a third embodiment. [Figure 8] FIG. 10 is an explanatory view showing the planar structure of an injection plate according to a fourth embodiment. [Figure 9] FIG. 10 is an explanatory diagram schematically illustrating the configuration of a substrate cleaning device according to a second embodiment. [Figure 10] FIG. 1 is an explanatory diagram schematically illustrating the configuration of a conventional substrate cleaning device. DETAILED DESCRIPTION OF THE INVENTION

[0022] <First Embodiment> 1 is an explanatory diagram schematically illustrating the configuration of a substrate cleaning apparatus 71 according to a first embodiment of the present disclosure, which is an XYZ Cartesian coordinate system.

[0023] As shown in the figure, the substrate cleaning device 71 of the first embodiment includes, as main components, a mist gas supply unit, an air gas supply unit, and a rotation mechanism 30 (not shown in FIG. 1) described later.

[0024] The mist gas supply unit includes an ultrasonic atomizer 11, a carrier gas supply pipe 13, and a mist gas supply pipe 15 as main components, and the air gas supply unit includes an air gas supply pipe 16.

[0025] The ultrasonic atomizer 11 applies ultrasonic waves to the cleaning liquid contained therein to generate a cleaning liquid mist MT. A carrier gas TG is supplied to the ultrasonic atomizer 11 via a carrier gas supply pipe 13.

[0026] Therefore, the cleaning liquid mist MT generated in the ultrasonic atomizer 11 is transported by the carrier gas TG to become a cleaning mist gas MG1. This cleaning mist gas MG1 is supplied to the internal junction nozzle 25 via the mist gas supply pipe 15. The mist gas supply pipe 15 is provided so as to extend from the outside of the internal junction nozzle 25, penetrate the upper surface of the internal junction nozzle 25, and into the gas storage space S25, which will be described later.

[0027] In this way, the cleaning mist gas MG1 containing the cleaning liquid mist MT generated in the ultrasonic atomizer 11 is supplied into the gas containing space S25 of the internal confluence nozzle 25 via the mist gas supply pipe 15.

[0028] The air gas supply pipe 16 is provided so as to extend into the gas accommodating space S25 from the outside of the internal junction nozzle 25, penetrating the upper surface of the internal junction nozzle 25. Therefore, the air gas AG1 is supplied into the gas accommodating space S25 of the internal junction nozzle 25 via the air gas supply pipe 16.

[0029] 2 is an explanatory diagram that schematically shows the cross-sectional structure of the gas containing space S25, which is the internal space of the internal confluence nozzle 25. An XYZ Cartesian coordinate system is shown in the drawing.

[0030] The internal confluence nozzle 25 has a cylindrical (columnar) structure and has a gas storage space S25 therein. As shown in Fig. 2, the mist gas supply pipe 15 is provided extending from the outside through the upper surface of the internal confluence nozzle 25 into the gas storage space S25, and supplies cleaning mist gas MG1 into the gas storage space S25. The mist gas supply pipe 15 is provided extending in the -Z direction within the gas storage space S25 and bent at the midpoint so that its tip region extends in the +X direction.

[0031] On the other hand, the air gas supply pipe 16 is provided so as to extend from the outside through the upper surface of the internal confluence nozzle 25 into the gas storage space S25, and supplies air gas AG1 into the gas storage space S25. The air gas supply pipe 16 is provided so as to extend in the −Z direction in the gas storage space S25 and bend at the midpoint with its tip region extending in the −X direction.

[0032] The mist gas supply pipe 15 outputs a cleaning mist gas MG1 from a mist gas output port 15a along the +X direction, and the air gas supply pipe 16 outputs an air gas AG1 from an air gas output port 16a along the -X direction.

[0033] The mist gas output port 15a and the air gas output port 16a are arranged opposite each other across a collision area 80 in the gas storage space S25, and the gas output surface F25, which is the bottom surface of the internal confluence nozzle 25, is located below the collision area 80.

[0034] Therefore, when cleaning mist gas MG1 is supplied into the gas storage space S25 via the mist gas supply pipe 15 and air gas AG1 is supplied into the gas storage space S25 via the air gas supply pipe 16, the cleaning mist gas MG1 and the air gas AG1 collide and merge in the collision area 80, and a substrate supply gas MG3 is obtained which is a mixture of the cleaning mist gas MG1 and the air gas AG1.

[0035] The distance between the mist gas output port 15a and the collision area 80, the distance between the air gas output port 16a and the collision area 80, the flow velocity VA1 of the air gas AG1, and the flow velocity VM1 of the cleaning mist gas MG1 are set so that the cleaning mist gas MG1 and the air gas AG1 always collide in the collision area 80. The flow velocity VM1 of the cleaning mist gas MG1 is determined by the flow velocity of the carrier gas TG.

[0036] The substrate supply gas MG3 diffuses along the diffusion direction DR3 as it travels downward from the collision region 80, and is supplied toward the surface 1s of the substrate 1 located below through an opening (not shown in Figure 2) provided in the gas output surface F25.

[0037] As described above, the internal confluence nozzle 25 in the substrate cleaning apparatus 71 of the first embodiment has a gas storage space S25 that stores the cleaning mist gas MG1 and the air gas AG1, and when the cleaning mist gas MG1 and the air gas AG1 are supplied into the gas storage space S25, the cleaning mist gas MG1 is merged with the air gas AG1 to generate the substrate supply gas MG3. The internal confluence nozzle 25 outputs the substrate supply gas MG3 from an opening in the gas output surface F25 that faces the surface 1s to be cleaned of the substrate 1.

[0038] Therefore, the substrate supply gas MG3 diffused within the gas containing space S25 of the internal confluence nozzle 25 can be output to a relatively wide area of ​​the surface 1s of the substrate 1 from the opening of the gas output surface F25.

[0039] For example, by setting the shape of the opening of the gas output surface F25 to be the same as the shape of the surface 1s of the substrate 1, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1.

[0040] 3 is an explanatory diagram that schematically shows a basic aspect of the substrate cleaning device 71 of the first embodiment, including the internal confluence nozzle 25 having the injection plate 40. An XYZ Cartesian coordinate system is shown in the drawing.

[0041] As shown in the figure, the internal confluence nozzle 25 has an injection plate 40 as a gas output surface F25, and a plurality of injection holes 50 are provided as openings in the injection plate 40. The plurality of injection holes 50, each having a circular shape, are provided discretely from one another over the entire injection plate 40.

[0042] Therefore, the basic aspect of the substrate cleaning device 71 of embodiment 1 is that the substrate supply gas MG3 diffused within the gas storage space S25 of the internal confluence nozzle 25 can be output from multiple ejection holes 50 to a relatively wide area of ​​the surface 1s of the substrate 1.

[0043] For example, by setting the shape of the plurality of ejection holes 50 to the same shape as the shape of the surface 1s of the substrate 1, it is possible to supply the substrate supply gas MG3 to the entire surface 1s of the substrate 1. The shape of the plurality of ejection holes 50 is a substantially circular shape with the circumference defined by a line connecting a predetermined number of ejection holes 50 that are present at the outermost periphery among the plurality of ejection holes 50.

[0044] The substrate 1 is rotated in a rotation direction R1 or R2 by the rotational operation of a rotation mechanism 30, which will be described later. The surface 1s of the substrate 1 becomes the cleaning surface. The rotation direction R1 is the first rotation direction, and the rotation direction R2 is the second rotation direction opposite to the rotation direction R1.

[0045] 4 is a cross-sectional view that schematically shows the structure of a rotation mechanism 30 that rotates the substrate 1 in the rotation direction R1 or R2, and an XYZ orthogonal coordinate system is shown in the drawing.

[0046] As shown in the figure, the rotation mechanism 30 includes as its main components a mounting stage 31, multiple vibration absorbing members 32, a rotation stage 33, a vibration motor 34, a rotation motor 35, and a motor control unit 36. The multiple vibration absorbing members 32 are preferably arranged at equal intervals in relatively outer regions of the substrate mounting portion 31a and the support surface 33a. Note that Fig. 4 shows two vibration absorbing members 32 as the multiple vibration absorbing members 32.

[0047] The mounting stage 31 has a substrate mounting section 31a and a vibration transmission section 31b, the substrate mounting section 31a has a surface for supporting the substrate 1 from the backside, and the vibration transmission section 31b is provided extending downward from the center of the backside of the substrate mounting section 31a. The mounting stage 31 stably supports the substrate 1 from the backside on the surface of the substrate mounting section 31a.

[0048] The rotating stage 33 has a support surface 33a, a motor housing portion 33b, and a rotating shaft member 33c, and the vibration motor 34 and most of the vibration transmission portion 31b are housed in the motor housing portion 33b. The rotating shaft member 33c is provided at the bottom of the vibration transmission portion 31b, and the rotating stage 33 is configured to be rotatable around the rotating shaft member 33c as the rotation axis.

[0049] The vibration motor 34 is connected to the lower side of the vibration transmission section 31b, and performs a stage vibration operation to impart vibration to the substrate mounting section 31a and the substrate 1 via the vibration transmission section 31b.

[0050] The substrate mounting portion 31a of the mounting stage 31 and the support surface 33a of the rotation stage 33 are connected via a plurality of vibration absorbing members 32. The plurality of vibration absorbing members 32 rotatably connect the mounting stage 31 and the vibration absorbing members 32 to each other and have a vibration absorbing function. The vibration absorbing members 32 may be, for example, spring members such as springs.

[0051] The rotation motor 35 is provided below the rotation stage 33 and is connected to the rotation shaft member 33c, and performs a stage rotation operation to rotate the rotation stage 33 around the rotation shaft member 33c as the center of rotation.

[0052] The motor control unit 36 ​​controls the stage rotation operation performed by the rotation motor 35. When the rotation motor 35 is caused to perform the stage rotation operation under the control of the motor control unit 36, the rotation stage 33 rotates, and the mounting stage 31 connected to the rotation stage 33 via a plurality of vibration absorbing members 32 rotates in conjunction with the rotation of the rotation stage 33 with the substrate 1 mounted thereon.

[0053] In this way, when the stage rotation operation is performed, the mounting stage 31 connected to the rotation stage 33 via the plurality of vibration absorbing members 32 rotates with the substrate 1 mounted thereon.

[0054] 1 and 3, the rotation direction of the substrate 1 includes rotation directions R1 and R2 that are opposite to each other. The rotation directions R1 and R2 are first and second rotation directions.

[0055] The motor control unit 36, which functions as a motor rotation control unit, executes a stage rotation operation. The stage rotation operation includes a rotation direction control process and a rotation speed control process. The rotation direction control process and the rotation speed control process are processes that can be executed during the execution period of the stage rotation operation.

[0056] The rotation direction control process is a process for switching the rotation direction between rotation directions R1 and R2. The rotation speed control process is a process for changing the rotation speed along the rotation direction (rotation direction R1 or rotation direction R2).

[0057] The vibration motor 34 performs a stage vibration operation that applies vibration to the substrate mounting portion 31 a via the vibration transmission portion 31 b. The motor control portion 36 also functions as a motor vibration control portion that controls the stage vibration operation performed by the vibration motor 34.

[0058] The motor control unit 36, which also functions as a motor vibration control unit, controls the rotation motor 35 and the vibration motor 34 together so that the above-mentioned stage vibration operation is performed in parallel with the stage rotation operation. Note that the stage vibration operation includes a vibration frequency change process that changes the vibration frequency per unit time applied to the substrate 1.

[0059] In this way, the motor control unit 36 ​​serves both as a motor rotation control unit and a motor vibration control unit, and controls the execution of the stage rotation operation by the rotation motor 35 and the stage vibration operation by the vibration motor 34.

[0060] The substrate cleaning device 71 configured as described above performs a substrate cleaning process to clean the surface 1s of the substrate 1 to be cleaned as follows.

[0061] The mist gas supply unit supplies a cleaning mist gas MG1 from a mist gas supply pipe 15 to the internal confluence nozzle 25, and the air gas supply unit supplies an air gas AG1 from an air gas supply pipe 16 to the internal confluence nozzle 25.

[0062] The internal confluence nozzle 25 generates a substrate supply gas MG3 by confluence of the cleaning mist gas MG1 with the air gas AG1 within the gas storage space S25, and outputs the substrate supply gas MG3 from multiple ejection holes 50 (openings) in the ejection plate 40 (gas output surface F25) facing the surface 1s to be cleaned of the substrate 1.

[0063] As a result, the cleaning mist gas MG1 and the air gas AG1 join together to form a substrate-supplying gas MG3, which is supplied to the surface 1s of the substrate 1.

[0064] Meanwhile, the rotation mechanism 30 causes the rotation motor 35 to perform a stage rotation operation under the control of a motor control unit 36 ​​functioning as a motor rotation control unit, thereby rotating the substrate 1 in a rotation direction R1 or a rotation direction R2.

[0065] In this manner, while the stage rotation operation by the rotation mechanism 30 is being performed, the substrate supply gas MG3 obtained in the gas containing space S25 of the internal confluence nozzle 25 is supplied to the surface 1s of the substrate 1 that will be the cleaning surface.

[0066] The motor control unit 36 ​​causes the rotation motor 35 to perform the stage rotation operation including the rotation direction control process and rotation speed control process described above.

[0067] For example, during the period in which the substrate supply gas MG3 is supplied to the surface 1s of the substrate 1, the rotation direction of the substrate 1 can be changed sequentially from rotation direction R1 to rotation direction R2, rotation direction R1 and rotation direction R2, and the rotation speed can also be changed.

[0068] Furthermore, the rotation mechanism 30 can cause the vibration motor 34 to perform a stage vibration operation under the control of a motor control unit 36 ​​that functions as a motor vibration control unit, thereby vibrating the substrate 1. In this way, the rotation mechanism 30 has a vibration function that applies vibrations to the substrate 1 in an undefined direction.

[0069] Therefore, the substrate cleaning apparatus 71 of this embodiment can concurrently perform the supply process of the substrate supply gas MG3 to the surface 1s of the substrate 1, the stage rotation operation, and the stage vibration operation. Furthermore, the stage rotation operation includes a rotation direction control process and a rotation speed control process, and the stage vibration operation includes a vibration frequency change process that changes the vibration frequency per unit time applied to the substrate 1.

[0070] In addition, the substrate mounting portion 31a of the mounting stage 31 and the support surface 33a of the rotating stage 33 are connected via multiple vibration absorbing members 32, and each of the multiple vibration absorbing members 32 has a vibration absorbing function, so that the vibration of the substrate mounting portion 31a caused by the stage vibration operation can be absorbed by the multiple vibration absorbing members 32.

[0071] Therefore, the multiple vibration absorbing members 32 effectively suppress the transmission of vibration from the substrate mounting portion 31a of the mounting stage 31 to the support surface 33a of the rotating stage 33, so that the stage vibration operation does not affect the stage rotation operation.

[0072] (effect) The internal confluence nozzle 25 in the basic configuration of the substrate cleaning apparatus 71 of embodiment 1 outputs the substrate supply gas MG3 from multiple ejection holes 50 (openings) of the ejection plate 40 (gas output surface F25) facing the surface 1s of the substrate 1, which is the cleaning surface of the substrate 1, thereby enabling the substrate supply gas MG3 to be supplied all at once to a relatively wide area facing the surface 1s of the substrate 1.

[0073] As a result, the substrate cleaning apparatus 71 of the first embodiment can shorten the cleaning time required to remove the substances to be removed adhering to the surface 1s of the substrate 1.

[0074] In the substrate cleaning apparatus 71 of embodiment 1, the mist gas output port 15a of the mist gas supply pipe 15 and the air gas output port 16a of the air gas supply pipe 16 are arranged opposite each other across the collision area 80 in the gas storage space S25.

[0075] Therefore, when cleaning mist gas MG1 and air gas AG1 are supplied into the gas storage space S25, the cleaning mist gas MG1 output from the mist gas output port 15a and the air gas AG1 output from the air gas output port 16a collide in the collision area 80 and merge to obtain substrate supply gas MG3.

[0076] The base material supply gas MG3 diffuses downward in a state where the cleaning mist gas MG1 and the air gas AG1 are mixed together.

[0077] Then, from multiple ejection holes 50 (openings) in the ejection plate 40 (gas output surface F25) located below the collision area 80, a substrate supply gas MG3, which is a mixture of cleaning mist gas MG1 and air gas AG1 and is in a diffused state, is supplied toward the surface 1s, which is the cleaning surface of the substrate 1.

[0078] Therefore, in the substrate cleaning apparatus 71 of embodiment 1, when cleaning mist gas MG1 is supplied from the mist gas supply pipe 15, the substrate supply gas MG3 containing the cleaning mist gas MG1 can be supplied to a relatively wide area on the surface 1s of the substrate 1.

[0079] Furthermore, since the substrate cleaning apparatus 71 of embodiment 1 rotates the substrate 1 by the rotational action of the rotation mechanism 30, even if an uneven area 18 exists on the surface 1s of the substrate 1, it is possible to effectively suppress blind spots of mist where the substrate supply gas MG3 is not supplied, and to accurately supply the substrate supply gas MG3 over the entire surface 1s.

[0080] As a result, the substrate cleaning apparatus 71 of the first embodiment can improve the cleaning efficiency of the substances to be removed adhering to the surface 1s of the substrate 1.

[0081] (Injection plate configuration) (First aspect) 5 is an explanatory diagram showing the planar structure of the injection plate 41 of the first aspect. An XYZ Cartesian coordinate system is shown in the figure. The first aspect of the substrate cleaning apparatus 71 of the first embodiment has the injection plate 41 as the gas output surface F25 of the internal confluence nozzle 25.

[0082] 5, the injection plate 41, which becomes the gas output surface F25, has a circular shape in the XY plane. The injection plate 41 has a plurality of injection holes 51 as openings of the gas output surface F25. The plurality of injection holes 51 become at least three first-type injection holes, each of which has a circular shape.

[0083] 5, the ejection holes 51a to 51c are not on the same straight line on the ejection plate 41. That is, the ejection holes 51a to 51c are not on the same straight line in a plan view.

[0084] In this way, the plurality of ejection holes 51 include at least three first-type ejection holes (for example, ejection holes 51a to 51c) that are not on the same straight line when viewed from above on the ejection plate 41.

[0085] The first aspect of the substrate cleaning apparatus 71 of embodiment 1 outputs substrate supply gas MG3 from a plurality of ejection holes 51 including at least three first-type ejection holes, thereby enabling the substrate supply gas MG3 to be supplied to the surface 1s of the substrate 1 over a relatively wide area including a plane with at least three first-type ejection holes as vertices.

[0086] As a result, the first aspect of the substrate cleaning apparatus 71 of the first embodiment can supply the substrate-supply gas MG3 to a relatively wide area on the surface 1s of the substrate 1.

[0087] For example, by setting the shape of the plurality of ejection holes 51 to the same shape as the shape of the surface 1s of the substrate 1, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1.

[0088] 5, the shape of the plurality of ejection holes 51 is a substantially circular shape with the circumference defined by a line connecting a predetermined number of ejection holes 50 that are present at the outermost periphery of the plurality of ejection holes 51. In this case, it is desirable that the surface 1s of the substrate 1 be circular.

[0089] (Second aspect) 6 is an explanatory diagram showing the planar structure of the injection plate 42 of the second aspect. An XYZ Cartesian coordinate system is shown in the figure. The second aspect of the substrate cleaning apparatus 71 of the first embodiment has the injection plate 42 as the gas output surface F25 of the internal confluence nozzle 25.

[0090] 6, the injection plate 42, which becomes the gas output surface F25, has a circular shape in the XY plane. The injection plate 42 has a plurality of injection holes 52 as openings of the gas output surface F25. The plurality of injection holes 52 become a plurality of second-type injection holes, each of which has a vertically elongated rectangular slit shape with its longitudinal direction in a predetermined direction.

[0091] The plurality of ejection holes 52, which become the plurality of second-type ejection holes, are arranged radially from the center point C42 of the ejection plate 42 in such a manner that their respective predetermined directions (longitudinal directions) coincide with the radial direction from the center point C42 of the ejection plate 42. Furthermore, the plurality of ejection holes 52 are evenly arranged in the circumferential direction around the center point C42. Figure 6 shows a state in which eight ejection holes 52 are arranged radially at equal intervals in the circumferential direction.

[0092] In the second aspect of the substrate cleaning device 71 of embodiment 1, the substrate supply gas MG3 is output collectively onto the surface 1s of the substrate 1 from a plurality of radially arranged ejection holes 52, each of which is slit-shaped.

[0093] Therefore, the second aspect of the substrate cleaning apparatus 71 of the first embodiment can supply the substrate supply gas MG3 to a relatively wide area on the surface 1s of the substrate 1.

[0094] For example, by setting the shape of the plurality of ejection holes 52 to the same shape as the shape of the surface 1s of the substrate 1, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1.

[0095] 6, the shape of the plurality of ejection holes 52 is substantially circular with the center point C42 as the center by arranging the plurality of ejection holes 52 at relatively close intervals. In this case, it is desirable that the surface 1s of the substrate 1 be circular.

[0096] (Third aspect) 7 is an explanatory diagram showing the planar structure of the injection plate 43 of the third aspect. An XYZ Cartesian coordinate system is shown in the figure. The third aspect of the substrate cleaning apparatus 71 of the first embodiment has the injection plate 43 as the gas output surface F25 of the internal confluence nozzle 25.

[0097] As shown in Fig. 7, the injection plate 43, which becomes the gas output surface F25, has a circular shape on the XY plane. The injection plate 43 has a plurality of ejection holes 51 and a plurality of ejection holes 52 as openings of the gas output surface F25. The plurality of ejection holes 51 become a plurality of first-type ejection holes, each of which has a circular shape. The plurality of ejection holes 52 become a plurality of second-type ejection holes, each of which has a slit-like shape with a predetermined direction as its longitudinal direction.

[0098] The plurality of ejection holes 51 that become the plurality of first type ejection holes are classified into a predetermined number of groups that differ every predetermined number. In the structure shown in Fig. 7, the plurality of ejection holes 51 are classified into eight groups (predetermined number) every three holes (predetermined number).

[0099] A predetermined number of ejection holes 51 for each of a predetermined number of groups are arranged in a radial direction from the center point C43 of the injection plate 43 in a planar view on the same straight line, and the multiple ejection holes 51 are arranged radially from the center point C43 in units of a predetermined number of groups.

[0100] In the structure shown in Figure 7, three ejection holes 51 in the same group are arranged on the same straight line in a planar view along the radial direction from the center point C43, and are evenly arranged radially in eight group units centered on the center point C43.

[0101] On the other hand, the plurality of ejection holes 52 that become the plurality of second-type ejection holes are arranged radially from the center point C43 of the ejection plate 43 in such a manner that their respective predetermined directions (longitudinal directions) coincide with the radial direction from the center point C43 of the ejection plate 43. Furthermore, the plurality of ejection holes 52 are arranged evenly in the circumferential direction centered on the center point C42. Figure 7 shows a state in which eight ejection holes 52 are arranged at equal intervals in the circumferential direction.

[0102] Furthermore, as shown in Figure 7, among the multiple ejection holes 51 and multiple ejection holes 52, three ejection holes 51 and one ejection hole 52 that are on the same straight line in a planar view and are classified into eight groups are arranged alternately along the circumferential direction.

[0103] The third aspect of the substrate cleaning apparatus 71 of embodiment 1 outputs substrate supply gas MG3 from a plurality of radially arranged ejection holes 51 in a predetermined number of groups provided on an ejection plate 43 and a plurality of radially arranged ejection holes 52, so that substrate supply gas MG3 can be output collectively from the plurality of ejection holes 52 and the plurality of ejection holes 52 to the surface 1s of the substrate 1.

[0104] As a result, the third aspect of the substrate cleaning apparatus 71 of the first embodiment can supply the substrate supply gas MG3 to a relatively wide area on the surface 1s of the substrate 1.

[0105] For example, by setting the combined shape of the plurality of ejection holes 51 and the plurality of ejection holes 52 to the same shape as the shape of the surface 1s of the substrate 1, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1.

[0106] 7, the combined shape is a substantially circular shape centered on a central point C43 by arranging the plurality of ejection holes 51 and the plurality of ejection holes 52 at relatively close intervals. In this case, it is desirable that the surface 1s of the substrate 1 be circular.

[0107] (Fourth aspect) 8 is an explanatory diagram showing the planar structure of the injection plate 44 of the fourth aspect. An XYZ Cartesian coordinate system is shown in the figure. The fourth aspect of the substrate cleaning apparatus 71 of the first embodiment has an injection plate 44 as the gas output surface F25 of the internal confluence nozzle 25.

[0108] 8, the injection plate 44, which becomes the gas output surface F25, has a circular shape in the XY plane. The injection plate 44 has a plurality of injection holes 53 as openings of the gas output surface F25.

[0109] The plurality of ejection holes 53 that become the plurality of third type ejection holes each have an annular shape, and the sizes (radii) of the plurality of ejection holes 53 differ from one another.

[0110] The plurality of ejection holes 53, which become the plurality of third type ejection holes, are arranged in such a manner that the center of each of the plurality of ejection holes 53 coincides with the center of the center point C44 of the injection plate 44. In the structure shown in Fig. 8, three ejection holes 53 are provided without overlapping with each other, centered on the center point C44.

[0111] In the fourth aspect of the substrate cleaning apparatus 71 of embodiment 1, the substrate supply gas MG3 is outputted collectively onto the surface 1s of the substrate 1 from a plurality of annular ejection holes 53 arranged with their centers aligned with each other.

[0112] As a result, the fourth aspect of the substrate cleaning apparatus 71 of the first embodiment can supply the substrate supply gas MG3 to a relatively wide area on the surface 1s of the substrate 1.

[0113] For example, by setting the shape of the plurality of ejection holes 53 to the same shape as the shape of the surface 1s of the substrate 1, the substrate supply gas MG3 can be supplied to the entire surface 1s of the substrate 1.

[0114] 8, the shape of the plurality of ejection holes 53 is substantially circular with the center point C44 as the center by arranging the plurality of ejection holes 53 at relatively close intervals. In this case, it is desirable that the surface 1s of the substrate 1 be circular.

[0115] <Embodiment 2> 9 is an explanatory diagram that schematically illustrates the configuration of a substrate cleaning apparatus 72 according to a second embodiment of the present disclosure, which is an XYZ orthogonal coordinate system.

[0116] As shown in the figure, the substrate cleaning device 72 of the second embodiment includes, as main components, a mist gas supply unit, an air gas supply unit, and a rotation mechanism 30 (not shown) described below.

[0117] The mist gas supply unit includes an ultrasonic atomizer 11, a carrier gas supply pipe 13, a mist gas supply pipe 15, and a flow regulator 5 as its main components, and the air gas supply unit includes an air gas supply pipe 16 and a flow regulator 6 as its main components.

[0118] Hereinafter, the same components as those in the substrate cleaning apparatus 71 of the first embodiment shown in FIGS. 1 to 8 are denoted by the same reference numerals, and the description thereof will be omitted as appropriate, and the features of the substrate cleaning apparatus 72 of the second embodiment will be mainly described.

[0119] The ultrasonic atomizer 11 applies ultrasonic waves to the cleaning liquid contained therein to generate a cleaning liquid mist MT. The carrier gas TG is supplied to the ultrasonic atomizer 11 via the flow rate regulator 5 and the carrier gas supply pipe 13.

[0120] The flow rate adjuster 5, which functions as a mist gas supply control unit, has the function of adjusting the flow rate of the carrier gas TG within the range of "0" to a first maximum adjustment value (>0). Therefore, the flow rate of the carrier gas TG, i.e., the flow velocity VM1 of the cleaning mist gas MG1, is adjusted by the flow rate adjuster 5.

[0121] The flow rate adjuster 5, which is a mist gas supply control section, adjusts the flow rate of the carrier gas TG to "0" or a significant flow rate other than "0", thereby executing a mist gas activation control process that controls whether or not the cleaning mist gas MG1 is supplied to the internal junction nozzle 25. That is, when the flow rate adjuster 5 sets the flow rate to "0", the supply of the cleaning mist gas MG1 to the internal junction nozzle 25 is cut off, and when a significant flow rate other than "0" is set, the supply of the cleaning mist gas MG1 to the internal junction nozzle 25 is executed.

[0122] Therefore, when the flow rate regulator 5 sets the flow rate of the carrier gas TG to a significant flow rate other than "0", the cleaning liquid mist MT generated in the ultrasonic atomizer 11 becomes a cleaning mist gas MG1 by being transported by the carrier gas TG.

[0123] This cleaning mist gas MG1 is supplied into the gas containing space S25 of the internal confluence nozzle 25 via the mist gas supply pipe 15.

[0124] The flow rate regulator 6, which functions as an air gas supply control unit, has the function of adjusting the flow rate of the air gas AG1 within a range of "0" to a second maximum flow rate value (>0). Therefore, the flow rate of the air gas AG1, i.e., the flow velocity VA1 of the air gas AG1, is adjusted by the flow rate regulator 6.

[0125] The flow rate regulator 6, which is an air gas supply control unit, adjusts the flow rate of the air gas AG1 to "0" or a significant flow rate other than "0", thereby executing an air gas activation control process that controls whether or not the air gas AG1 is supplied to the internal junction nozzle 25. That is, when the flow rate regulator 6 sets the flow rate to "0", the supply of the air gas AG1 to the internal junction nozzle 25 is cut off, and when a significant flow rate other than "0" is set, the supply of the air gas AG1 to the internal junction nozzle 25 is executed.

[0126] Therefore, when the flow rate regulator 6 sets the flow rate of the air gas AG1 to a significant flow rate other than “0”, the air gas AG1 is supplied into the gas storage space S25 of the internal confluence nozzle 25 via the air gas supply pipe 16.

[0127] The substrate cleaning apparatus 72 of the second embodiment configured as described above has the following advantages in addition to the advantages of the substrate cleaning apparatus 71 of the first embodiment.

[0128] The substrate cleaning apparatus 72 of the second embodiment can execute a mist gas activation control process by the flow rate regulator 5, which is a mist gas supply control unit, and an air gas activation control process by the flow rate regulator 6, which is an air gas supply control unit.

[0129] Therefore, by the mist gas activation control process and the air gas activation control process, the substrate supply gas MG3 generated in the gas storage space S25 of the internal confluence nozzle 25 can be set to three gas types: a combination of cleaning mist gas and air gas, cleaning mist gas only, or air gas only.

[0130] Therefore, the substrate cleaning apparatus 72 of embodiment 2 can supply either a mixed gas obtained by the joining of the cleaning mist gas MG1 and the air gas AG1, or only the cleaning mist gas MG1, or only the air gas AG1, to the surface 1s of the substrate 1 as the substrate supply gas MG3.

[0131] For example, when applying a chemical agent to the surface 1s of the substrate 1 to be cleaned and dissolving and removing a coating on the surface 1s to be cleaned by a chemical reaction with the chemical agent, it is desirable to supply a substrate supply gas MG3 consisting only of the cleaning mist gas MG1 to the surface 1s of the substrate 1. For this reason, the mist gas activation control process of the flow regulator 5 sets the supply of the cleaning mist gas MG1 to be enabled, and the air gas activation control process of the flow regulator 6 sets the supply of the air gas AG1 to be disabled.

[0132] Furthermore, when removing oil, minute particulate deposits, rust, and the like adhering to the surface 1s of the substrate 1, it is desirable to supply a substrate supply gas MG3, which is a gas species that becomes a mixed gas obtained by merging the cleaning mist gas MG1 and the air gas AG1, to the surface 1s of the substrate 1. For this reason, the supply of the cleaning mist gas MG1 is set to be enabled by the mist gas enablement control process of the flow regulator 5, and the supply of the air gas AG1 is set to be enabled by the air gas enablement control process of the flow regulator 6.

[0133] Furthermore, when performing a cleaning object drying process after cleaning the surface 1s of the substrate 1 to be cleaned, it is desirable to supply a substrate supply gas MG3 containing only the gas species of air gas AG1 to the surface 1s of the substrate 1. For this reason, the mist gas activation control process of the flow rate regulator 5 sets the supply of cleaning mist gas MG1 to be disabled, and the air gas activation control process of the flow rate regulator 6 sets the supply of air gas AG1 to be enabled.

[0134] In this way, the substrate cleaning apparatus 72 of embodiment 2 can select one of three types of gas to output as the substrate supply gas MG3, and therefore can use different substrate supply gases MG3 depending on the cleaning application.

[0135] When both the supply of cleaning mist gas MG1 by the mist gas validation control process and the supply of air gas AG1 by the air gas validation control process are set to be valid, the substrate cleaning apparatus 72 of the second embodiment has the following additional effect.

[0136] That is, embodiment 2 has the additional effect of adjusting the flow rate VM1 of the cleaning mist gas MG1 using the flow rate regulator 5 and adjusting the flow rate VA1 of the air gas AG1 using the flow rate regulator 6, so that the substrate supply gas MG3 can be adjusted to be output from the entire opening of the gas output surface F25.

[0137] As a first modified example of the mist gas supply control unit, a first on-off valve may be used instead of the flow rate regulator 5. In the first modified example, by setting the first on-off valve to the "open" or "closed" state, it is possible to execute a mist gas activation control process that controls whether or not the cleaning mist gas MG1 is supplied to the internal confluence nozzle 25.

[0138] Similarly, as a second modified example of the air gas supply control unit, a second on-off valve may be used instead of the flow rate regulator 6. In the case of the second modified example, by setting the second on-off valve to the "open" or "closed" state, it is possible to execute an air gas activation control process that controls whether or not the air gas AG1 is supplied to the internal confluence nozzle 25.

[0139] <Other> In the above-described embodiment, an ultrasonic atomizer 11 that uses ultrasonic vibrations is shown as an atomizer for generating cleaning mist gas MG1, but other atomizers that generate cleaning mist gas MG1 from cleaning liquid using methods other than ultrasonic vibrations may be used in place of the ultrasonic atomizer 11.

[0140] In the above-described embodiment, the internal junction nozzle 25 has a cylindrical structure, but the internal junction nozzle may also have a conical structure with a circular bottom (gas output surface F25) and a pyramidal top, a prismatic structure with polygonal top and bottom, or a pyramidal structure with a polygonal bottom and a pyramidal top, provided that the following requirements for generating the base material supply gas MG3 are met.

[0141] Generation requirements: When cleaning mist gas MG1 and air gas AG1 are supplied together, they collide and merge in the gas storage space, and the cleaning mist gas MG1 and air gas AG1 are mixed together to form substrate supply gas MG3, which diffuses downward.

[0142] When the internal confluence nozzle is configured with a conical structure or a pyramidal structure, the mist gas supply pipe 15 and the mist gas supply pipe 15 must be arranged to penetrate the side of the internal confluence nozzle and extend into the gas storage space.

[0143] Furthermore, although the injection plates 41 to 44 of the first to fourth embodiments shown in Figures 5 to 8 each have a circular shape, they may also have a hemispherical or conical recessed three-dimensional structure. A hemispherically recessed three-dimensional structure refers to a hemispherical structure that is circular in plan view and has its center point at the top end on the +Z direction side. A conically recessed structure refers to a conical structure that is circular in plan view and has its center point at the top end on the +Z direction side.

[0144] In this way, injection plates having a hemispherically recessed three-dimensional structure or a conically recessed three-dimensional structure that are circular in plan view may be used instead of the injection plates 41 to 44 that are actually circular in shape. That is, the injection plates having a hemispherically recessed three-dimensional structure and a conically recessed three-dimensional structure have the same characteristic as the injection plates 41 to 44 in that they are circular in plan view.

[0145] In addition, although the planar shape in the above-described modified example is circular, the planar shape may be changed to a polygonal shape, and a pyramidal recessed three-dimensional structure may be used. A pyramidal recessed three-dimensional structure refers to a pyramidal structure that is polygonal in plan view and has a center point at the topmost point on the +Z direction side.

[0146] In addition, in the above-described embodiment, the substrate 1 is rotated by the rotation mechanism 30, but the substrate supply gas MG3 may be supplied from the internal confluence nozzle 25 while the substrate 1 to be cleaned is kept stationary.

[0147] Although the present disclosure has been described in detail, the above description is illustrative in all respects and does not limit the present disclosure to the above. It is understood that countless variations not illustrated can be envisioned without departing from the scope of the present disclosure. [Explanation of symbols]

[0148] 1 Base material 11 Ultrasonic atomizer 13 Carrier gas supply piping 15 Mist gas supply piping 15a Mist gas output port 16 Air gas supply piping 16a Air gas outlet 25 Internal confluence nozzle 30 Rotation mechanism 40~44 Spray plate 50~53 Spout hole F25 gas output surface S25 Gas storage space

Claims

1. a mist gas supply unit that supplies a cleaning mist gas containing a cleaning liquid mist obtained by misting a cleaning liquid to clean the cleaning surface of the substrate; an air gas supply unit that supplies air gas; an internal confluence nozzle having a gas storage space for storing the cleaning mist gas and the air gas, which, when the cleaning mist gas and the air gas are supplied into the gas storage space, confluences the cleaning mist gas with the air gas to generate a substrate supply gas, and outputs the substrate supply gas from an opening on a gas output surface facing the cleaning surface of the substrate; the mist gas supply unit is provided extending from the outside of the internal confluence nozzle into the gas storage space and includes a mist gas supply pipe for supplying the cleaning mist gas into the gas storage space, the air gas supply unit includes an air gas supply pipe extending from the outside of the internal confluence nozzle into the gas accommodating space and supplying the air gas into the gas accommodating space; Substrate cleaning equipment.

2. The substrate cleaning device according to claim 1, the mist gas supply pipe outputs the cleaning mist gas from a mist gas output port, The air gas supply pipe outputs the air gas from an air gas output port, the mist gas output port and the air gas output port are arranged to face each other across a collision region in the gas storage space, the gas output surface is located below the impingement region; Substrate cleaning equipment.

3. The substrate cleaning device according to claim 1 or 2, the gas output surface has at least three first-type ejection holes, each of which has a circular shape, and an opening of the gas output surface includes the at least three first-type ejection holes; the at least three first type ejection holes are not on the same line in plan view; Substrate cleaning equipment.

4. The substrate cleaning device according to claim 1 or 2, The gas output surface is circular in plan view, the gas output surface has a plurality of second-type ejection holes, each of the plurality of second-type ejection holes having a slit shape with a predetermined direction as a longitudinal direction, and an opening of the gas output surface includes the plurality of second-type ejection holes, the plurality of second-type ejection holes are arranged radially from the center of the gas output surface in a manner that the predetermined direction of each of the plurality of second-type ejection holes coincides with a radial direction from the center of the gas output surface. Substrate cleaning equipment.

5. The substrate cleaning device according to claim 1 or 2, The gas output surface is circular in plan view, the gas output surface has a plurality of first-type ejection holes and a plurality of second-type ejection holes, and an opening of the gas output surface includes the plurality of first-type ejection holes and the plurality of second-type ejection holes, The plurality of first type ejection holes each have a circular shape and are classified into a predetermined number of groups, each group having a predetermined number of different first type ejection holes, each of the plurality of second-type ejection holes has a slit shape with a predetermined direction as a longitudinal direction; an aspect in which the predetermined number of first type ejection holes for each of the predetermined number of groups are arranged on the same straight line in a plan view along a radial direction from the center of the gas output surface, the plurality of first type ejection holes being arranged radially from the center of the gas output surface in units of the predetermined number of groups, the plurality of second-type ejection holes are arranged radially from the center of the gas output surface in a manner that the predetermined direction of each of the plurality of second-type ejection holes coincides with a radial direction from the center of the gas output surface. Substrate cleaning equipment.

6. The substrate cleaning device according to claim 1 or 2, The gas output surface is circular in plan view, the gas output surface has a plurality of third-type ejection holes, each of the plurality of third-type ejection holes having an annular shape and different sizes among the plurality of third-type ejection holes, and an opening of the gas output surface includes the plurality of third-type ejection holes; the plurality of third type ejection holes are arranged in such a manner that the center of each of the plurality of third type ejection holes coincides with the center of the gas output surface. Substrate cleaning equipment.

7. The substrate cleaning device according to claim 1 or 2, the mist gas supply unit includes a mist gas supply control unit that executes a mist gas activation control process that controls whether or not the cleaning mist gas is supplied to the internal confluence nozzle, The air gas supply unit includes an air gas supply control unit that executes an air gas activation control process to control whether or not the air gas is supplied to the internal confluence nozzle. Substrate cleaning equipment.

8. The substrate cleaning device according to claim 1 or 2, Further comprising a rotation mechanism that performs a rotation operation to rotate the substrate along a rotation direction. Substrate cleaning equipment.

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