Foreign object removal device

Abstract

To provide a foreign substance removal device which prevents foreign substances from being scattered toward a downstream side while conveying a conveyed object and removing the foreign substance.SOLUTION: The present invention relates to a foreign substance removal device 1 for removing foreign substances deposited on conveyed objects 100. The foreign substance removal device comprises a conveyance section 10, a first injection section 20, a second injection section 30, and a suction section including a suction tube 42. The conveyance section 10 conveys the conveyed objects 100 along a predetermined conveyance path 10a. The first injection section 20 injects a fluid to the conveyed objects 100, which are conveyed by the conveyance section 10, and blows up the foreign substances. The second injection section 30 injects a fluid from a downstream side of the first injection section 20 in the conveyance path 10a toward the conveyed object 100 so as to prevent the blown-up foreign substance from being scattered toward the downstream side. The suction section sucks the blown-up foreign substances together with the fluid.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a foreign matter removal device, and more particularly to a foreign matter removal device that removes foreign matter adhering to a transported object. [Background technology]

[0002] A conventional foreign matter removal device has been proposed that removes foreign matter adhering to a transported object by supplying a fluid such as air into an enclosed space in which the transported object is placed. For example, the technology disclosed in Patent Document 1 can be referred to for such a foreign matter removal device. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-118219 DISCLOSURE OF THE INVENTION [Problem to be solved by the invention]

[0004] However, conventional foreign matter removal devices required the transported object to be set up each time foreign matter was removed, and then removed after the foreign matter was removed, making it difficult to efficiently manufacture transported objects. For this reason, there was a need to develop a technology that could remove foreign matter while the transported object was being transported. In addition, when foreign matter on the transported object was removed by supplying a fluid, the scattering of foreign matter downstream of the transport path was also pointed out as a problem.

[0005] The present invention has been made in consideration of the above circumstances, and aims to provide a foreign matter removal device that can remove foreign matter while transporting the transported object and prevent the foreign matter from scattering downstream. [Means for solving the problem]

[0006] In order to solve the above problems, the foreign matter removal device of the present invention is a foreign matter removal device for removing foreign matter attached to a transported object, and has a conveying unit, a first spraying unit, a second spraying unit, and a suction unit, wherein the conveying unit transports the transported object along a predetermined transport path, the first spraying unit sprays a fluid onto the transported object transported by the conveying unit to kick up the foreign matter, the second spraying unit sprays a fluid from the downstream side of the first spraying unit on the transport path towards the transported object to prevent the kicked up foreign matter from scattering downstream, and the suction unit sucks up the foreign matter kicked up together with the fluid.

[0007] According to the present invention, while the transported object is transported by the transport section, the first injection section lifts up and removes the foreign matter, and the second injection section sprays fluid to prevent the foreign matter from scattering downstream.

[0008] The second ejection section may eject the fluid in a direction inclined with respect to the transport path while being set so as to be directed from the downstream side to the upstream side of the transport path.

[0009] By making the angle of the injection direction of the first injection part larger than the angle of the injection direction of the second injection part, it is possible to reduce the interference with the kick-up of foreign matter by the first injection part due to the injection of fluid from the second injection part.

[0010] By setting the direction in which the first ejection section ejects the fluid to be perpendicular to the transport path, the effect of the first ejection section in stirring up foreign matter can be further increased.

[0011] By making the diameter of the nozzle in the first injection section larger than the diameter of the nozzle in the second injection section and making the injection pressure of the first injection section larger than the injection pressure of the second injection section, it is possible to further reduce the interference with the effect of the first injection section in stirring up foreign matter due to the injection of fluid from the second injection section.

[0012] The ratio of the injection pressure of the first injection part to the injection pressure of the second injection part is preferably 1.5 to 5.0.

[0013] A first line passing through the center of the nozzle of the first spray section and along the spray direction, and a second line passing through the center of the nozzle of the second spray section and along the spray direction, intersect below the object being transported along the transport path and do not intersect above the object.This reduces the interference of the spray of fluid from the second spray section with the effect of the first spray section of lifting up foreign objects, and also reduces the interference of the spray of fluid from the first spray section with the effect of the second spray section of preventing foreign objects from scattering downstream.

[0014] A partition wall separates the space around the first injection unit from the space around the second injection unit at a predetermined distance, the first injection unit and the second injection unit are provided above the conveying path, and the second injection unit is provided in the space outside the partition wall. The position of the injection port in the first injection unit from which the fluid is injected is located above the position of the lower end of the partition wall, and the second line in the second injection unit passes below the lower end of the partition wall, thereby reliably forming a space in which foreign matter is stirred up while the fluid injected from the first injection unit is guided downward through the partition wall, and furthermore, the fluid injected from the second injection unit can also be reliably supplied.

[0015] The second injection units are provided in multiple locations along a direction horizontally perpendicular to the conveying path, and the area where the multiple second injection units are provided, which is along a direction horizontally perpendicular to the conveying path, is set to include the area where the first injection units are provided, which is along a direction horizontally perpendicular to the conveying path.This makes it possible for the area where the second injection units are provided to cover the area where foreign matter is kicked up, and reliably prevents foreign matter from scattering downstream.

[0016] The suction section has a suction port that sucks in foreign matter that is kicked up along with the fluid, and the suction port is positioned above the injection port of the first injection section, thereby reducing the interference of the suction section with the first injection section kicking up foreign matter.

[0017] A guide plate can be provided to guide foreign matter that is stirred up with the fluid to the suction part, which reduces the deterioration of the suction part's ability to suck in foreign matter even when the suction port of the suction part is located above the injection port of the first injection part.

[0018] The transported object may be an electronic component, and the electronic component may be a semiconductor module. [Effects of the Invention]

[0019] According to the present invention, foreign matter can be removed while transporting an object, and scattering of the foreign matter downstream can be prevented. [Brief explanation of the drawings]

[0020] [Figure 1] 1 is a right side view showing the configuration of a foreign matter removal device according to an embodiment of the present invention. [Figure 2] FIG. 2 is an enlarged right side view showing a part of the configuration of the foreign matter removal device. [Figure 3] 2 is a front cross-sectional view taken along the line AA in FIG. 1, showing the configuration of the foreign matter removal device. [Figure 4] 4 is an enlarged front cross-sectional view of FIG. 3 showing the configuration of the foreign matter removal device in an enlarged scale. [Figure 5] FIG. 2 is a side view showing the configuration of a slide plate of the foreign matter removal device. [Figure 6] 4 is a flowchart illustrating a method for removing foreign matter using the foreign matter removal device. DETAILED DESCRIPTION OF THE INVENTION

[0021] An embodiment of the present invention will be described in detail below with reference to the drawings. Fig. 1 is a right side view showing the configuration of a foreign matter removal device according to an embodiment of the present invention. Fig. 2 is an enlarged right side view showing a portion of the configuration of the foreign matter removal device. Fig. 3 is a front sectional view taken along line AA in Fig. 1 showing the configuration of the foreign matter removal device. Fig. 4 is an enlarged front sectional view of Fig. 3 showing the configuration of the foreign matter removal device. Fig. 5 is a side view showing the configuration of a slide plate of the foreign matter removal device. In the following description, the upstream side of the conveying path 10a of the conveying unit 10 in the foreign matter removal device 1 is referred to as the left side, the downstream side of the conveying path 10a is referred to as the right side, the side where the upstream side of the conveying path 10a is viewed from the left to the downstream side of the conveying path 10a is viewed from the right is referred to as the front side (front side), the opposite side is referred to as the back side (rear side), and the side where the spraying units 20, 30 and the suction unit 40 are located across the conveyed object 100 being conveyed is referred to as the upper side, and the side where the conveying unit 10 is located is referred to as the lower side. In the following description, the front-rear direction is defined as a direction that is horizontally perpendicular to the transport path 10a.

[0022] 1 to 5, the foreign matter removal apparatus 1 of the present invention will be outlined. The foreign matter removal apparatus 1 is an apparatus for removing foreign matter adhering to a transported object 100, and includes a transport unit 10, a first spray unit 20, a second spray unit 30, and a suction unit 40. The transported object 100 (transported object 100) transported by the transport unit 10 may be an electronic component, and the electronic component may be a semiconductor module. The foreign matter removal apparatus 1 is an apparatus that is particularly effective for removing foreign matter on the order of microns adhering to electronic components such as semiconductor modules.

[0023] The foreign matter removal device 1 has a configuration in which a conveying unit 10, a first ejecting unit 20, a second ejecting unit 30, and a suction unit 40 are provided in a casing 2.

[0024] The casing 2 has a top wall 2a, a front wall 2b, a rear wall 2c, a left side wall 2d, and a right side wall 2e. The internal space enclosed by the walls 2a-2e of the casing 2 forms a space 3 for removing foreign matter adhering to the transported object 100 (hereinafter, the space 3 is referred to as the foreign matter removal space 3). The right side wall 2e of the casing 2 also functions as a partition wall 35 that separates the space around the first ejection unit 20 from the space around the second ejection unit 30, and the left side wall 2d of the casing 2 also functions as a guide plate 43 for guiding foreign matter to the suction port 41c of the dust collection case 41. The partition wall 35 and the guide plate 43 each include sliding plates 35a and 43a that are slidable in the vertical direction. This allows the vertical positions of the partition wall 35 and the guide plate 43 (the positions of the lower ends 35' and 43') to be adjusted. The slide plates 35a, 43a are provided with a plurality of elongated holes 35a1, 43a1 extending in the vertical direction. The positions of the slide plates 35a, 43a in the vertical direction can be adjusted by inserting fasteners 35a2, 43a2 such as bolts into the elongated holes 35a1, 43a1 and sliding the slide plates 35a, 43a.

[0025] The conveying unit 10 is provided to convey the object 100 along the lower end 2f side of the casing 2 from left to right in Fig. 1. The lower side of the lower end 2f of the casing 2 forms a conveying path 10a for the object 100, and the conveying unit 10 can continuously convey the object 100 along the conveying path 10a. The left and right walls 2d and 2e of the casing 2 close off the foreign object removal space 3 only on the upper side, and the lower side forms openings 2d1 and 2e1 that are opened at predetermined positions.

[0026] That is, the conveying unit 10 has a predetermined belt-shaped conveying belt 11 for conveying the conveyed object 100, and a driving device 12 such as a motor for driving the conveying belt 11. A conveying path 10a of the conveying unit 10 is set on the surface (upper surface) 11a of the conveying belt 1. The conveying path 10a of the conveying unit 10 is set to pass sequentially through an external space 1a on the left side of the foreign matter removal device 1 in FIG. 1, an opening 2d1 in the left side wall 2d, the foreign matter removal space 3, an opening 2e1 in the right side wall 2e, and an external space 1b on the right side of the foreign matter removal device 1 in FIG. 1. The conveyed object 100 conveyed along the conveying path 10a of the conveying unit 10 has foreign matters removed in the foreign matter removal space 3, and then is conveyed further downstream, and is sent to the next process, for example, a wire bonding process, in the manufacture of a semiconductor module or the like. A semiconductor module as an electronic component, which is an example of the transported object 100, is configured, for example, to include a substrate 102 having a semiconductor chip 101 mounted on a surface (top surface) 102a thereof, in a case 103, with terminals 104 protruding upward from the case 103. In semiconductor modules, foreign matter often occurs on the surface (top surface) 102a of the substrate 102, and this has been pointed out as a manufacturing problem.

[0027] The first spray unit 20 is provided above the conveying path 10a. The first spray unit 20 is provided to penetrate the upper wall 2a of the casing 2. The first spray unit 20 is a pipe-shaped nozzle extending linearly in the vertical direction, and is provided with a spray port 22 from which a fluid is sprayed at the lower end 21 side. The spray port 22 may be, for example, a circular hole. The vertical position of the spray port 22 is located above the vertical position of the lower end 35' of the partition wall 35. The spray port 22 is directed toward the conveying path 10a, and the first spray unit 20 can spray fluid from the spray port 22 onto the conveyed object 100 conveyed by the conveying unit 10 to raise up foreign matter. As described above, the partition wall 35 has a sliding plate 35a, and by sliding the sliding plate 35a in the vertical direction, the relative relationship between the vertical position of the injection port 22 of the first injection section 20 and the vertical position of the lower end 35' of the partition wall 35 can be changed.

[0028] The injection direction 20a of the first injection unit 20, in which the fluid is injected, is perpendicular to the conveyance path 10a. That is, the first injection unit 20 is configured such that a line L1 (first line L1) passing through the center 22a of the injection port 22 of the first injection unit 20 (the center of the circular hole if the injection port 22 is a circular hole), more specifically the center of gravity 22a (the center of gravity of the circular hole if the injection port 22 is a circular hole), and along the injection direction 20a, is perpendicular to the conveyance path 10a, so that the fluid can be injected from directly above the conveyed object 100. By setting the injection direction 20a of the first injection unit 20 perpendicular to the conveyance path 10a, the effect of the first injection unit 20 in kicking up foreign matter can be further enhanced. A configuration in which the injection direction 20a of the first injection unit 20 is perpendicular to the conveyance path 10a is particularly effective for kicking up foreign matter on the conveyed object 100, more specifically, on electronic components such as semiconductor modules.

[0029] The angle of the spray direction 20a of the first spray unit 20 relative to the conveying path 10a is larger than the angle of the spray direction 30a of the second spray unit 30. By making the angle of the spray direction 20a of the first spray unit 20 larger than the angle of the spray direction 30a of the second spray unit 30, it is possible to reduce the interference of the spray of fluid from the second spray unit 30 with the kicking up of foreign matter by the first spray unit 20.

[0030] The first spraying units 20 are provided at multiple locations, more specifically at two locations, along the front-rear direction (along the direction horizontally perpendicular to the transport path 10a). The multiple first spraying units 20 are provided within an area of ​​width A1 when viewed from the side of the foreign matter removal device 1.

[0031] The first jetting unit 20 is provided with a first pressure regulating valve 23 for adjusting the pressure of the fluid jetted from the jet nozzle 22. The first pressure regulating valve 23 is provided for each of the multiple first jetting units 20, making it possible to adjust the pressure of each of the first jetting units 20. The foreign matter removal device 1 has a first supply source 24 for supplying fluid to the first jetting units 20. The fluid supplied from the first supply source 24 is branched into two, and the pressures of the two fluids are adjusted by the first pressure regulating valves 23 before being sent to the respective first jetting units 20. The fluid jetted by the first jetting units 20 may be, for example, air.

[0032] The second spray unit 30 is provided above the conveying path 10a. The second spray unit 30 is provided in the space 1b on the right side of the foreign matter removal space 3 via the right side wall 2e of the casing 2, i.e., the partition wall 35. In other words, the second spray unit 30 is provided downstream of the first spray unit 20 on the conveying path 10a. The second spray unit 30 is provided on the outer surface 2e2 side of the right side wall 2e of the casing 2 via the support body 36.

[0033] The second spray unit 30 is a pipe-shaped nozzle that extends linearly while inclining at an acute angle with respect to the conveying path 10a, and is provided with a spray nozzle 32 at its lower end 31 through which the fluid is sprayed. The spray nozzle 32 may be, for example, a circular hole. The spray nozzle 32 is directed toward the conveying path 10a, and the second spray unit 20 sprays the fluid toward the conveyed object 100 from the downstream side of the first spray unit 20 on the conveying path 10a, thereby preventing the scattering of any foreign matter that has been kicked up downstream.

[0034] That is, the second spray unit 30 is provided such that the spray direction 30a for spraying the fluid is set from the downstream side to the upstream side of the conveying path 10a, and the interior angle is inclined at an acute angle with respect to the conveying path 10a. The second spray unit 30 is set such that a line L2 (second line L2) that passes through a center 32' of the spray nozzle 32 of the second spray unit 30 (the center of the circular hole if the spray nozzle 32 is a circular hole), more specifically, through the center of gravity 32' (the center of gravity of the circular hole if the spray nozzle 32 is a circular hole), and that runs along the spray direction 30a, forms an acute interior angle with respect to the conveying path 10a.

[0035] The second line L2 is set to pass below the lower end 35' of the partition wall 35. In other words, as described above, the vertical position of the injection port 22 of the first injection unit 20 is set to a position above the vertical position of the lower end 35' of the partition wall 35, and the second line L2 of the second injection unit 30 is configured to pass below the lower end 35' of the partition wall 35. This makes it possible to reliably form a space that stirs up foreign matter while guiding the fluid injected from the first injection unit 20 downward through the partition wall 35, and further makes it possible to reliably supply the fluid injected from the second injection unit 30.

[0036] The second line L2 in the second injection section and the first line L1 in the first injection section 20 intersect below the transported object 100 transported along the transport path 10a, more specifically below the surface (top surface) 102a of the substrate 102 on which foreign matter of the transported object 100, which is a semiconductor module, occurs, and do not intersect above the transported object 100 transported along the transport path 10a, more specifically above the surface (top surface) 102a of the substrate 102 on which foreign matter of the transported object 100, which is a semiconductor module, occurs. By intersecting the second line L2 and the first line L1 below the transported object 100 transported along the transport path 10a, more specifically below the surface (upper surface) 102a of the substrate 102 where foreign matter is generated, and not intersecting them above the transported object 100 transported along the transport path 10a, more specifically above the surface (upper surface) 102a of the substrate 102 where foreign matter is generated, the effect of the first spray unit 20 to lift up foreign matter can be reduced from being hindered by the spray of fluid from the second spray unit 30, and the effect of the second spray unit 30 to prevent foreign matter from scattering downstream can also be reduced from being hindered by the spray of fluid from the first spray unit 20.

[0037] The second spray unit 30 is mounted on the support 36 via an inclination angle adjustment mechanism 37, allowing the inclination angle to be adjusted. This allows the second spray unit 30 to adjust the inclination angle of the second line L2 with respect to the conveying path 10a, making it possible to adjust the position where the second line L2 intersects with the first line L1. In other words, even when conveyed objects 100 of various dimensions are conveyed by the conveying unit 10, the inclination angle adjustment mechanism 37 allows the intersecting position of the second line L2 and the first line L1 to be adjusted according to the height dimension of the conveyed object 100.

[0038] The second spraying units 30 are provided at a plurality of locations, more specifically, at three locations, along the front-rear direction (along a direction horizontally orthogonal to the conveying path 10a). On each of the lower ends 31 of the three second spraying units 30, there are further provided a row of spray ports 32a-32i that spray fluid at a plurality of locations, more specifically, nine locations, along the front-rear direction (along a direction horizontally orthogonal to the conveying path 10a).

[0039] The plurality of second jetting units 30 are provided within an area of ​​width A2 when viewed from the side of the foreign matter removal device 1. The area of ​​width A2 in which the plurality of second jetting units 30 are provided is set to include the area of ​​width A1 in which the first jetting units 20 are provided. In this way, by setting the area of ​​width A2 in which the plurality of second jetting units 30 are provided to include the area of ​​width A1 in which the first jetting units 20 are provided, the area in which the second jetting units 30 are provided can cover the area in which foreign matter is stirred up like an air curtain, and it is possible to reliably prevent the foreign matter from scattering downstream.

[0040] The second jetting unit 30 is provided with a second pressure regulating valve 33 for adjusting the pressure of the fluid jetted from the jetting ports 32a-32i. The foreign matter removal device 1 has a second supply source 34 for supplying fluid to the second jetting unit 30. The fluid supplied from the second supply source 34 is branched into three, and the pressures of the fluid are adjusted by the second pressure regulating valves 33 before being sent to the respective second jetting units 30. The second pressure regulating valves 33 are provided in each of the multiple second jetting units 30, making it possible to adjust the pressure of each second jetting unit 30. The three branched fluids are further branched and jetted in nine directions via nine jetting ports 32a-32i in each second jetting unit 30 (fluid is supplied to the nine jetting ports 32a-32i via branch pipes 32a', respectively). Like the fluid jetted by the first jetting unit 20, the fluid jetted by the second jetting unit 30 can be air.

[0041] Here, the diameter X1 of the injection port 22 in the first injection part 20 is larger than the diameter X2 of the injection port 32 in the second injection part 30. Furthermore, the injection pressure Y1 of the first injection part 20 is larger than the injection pressure Y2 of the second injection part 30.

[0042] By making the diameter X1 of the nozzle 22 in the first injection section 20 larger than the diameter X2 of the nozzle 32 in the second injection section 30 and by making the injection pressure Y1 of the first injection section 20 larger than the injection pressure Y2 of the second injection section 30, it is possible to reduce the interference with the effect of the first injection section 20 of kicking up foreign matter due to the injection of fluid from the second injection section 30.

[0043] Furthermore, even if the diameter X1 of the nozzle 22 in the first injection unit 20 is set to be larger than the diameter X2 of the nozzle 32 in the second injection unit 30 and the injection pressure Y1 of the first injection unit 20 is set to be larger than the injection pressure Y2 of the second injection unit 30, by making the first line L1 and the second line L2 intersect below the transported object 100 transported along the transport path 10a, more specifically below the surface (upper surface) 102a of the substrate 102 where foreign matter is generated, as described above, and not intersect above the transported object 100 transported along the transport path 10a, more specifically above the surface (upper surface) 102a of the substrate 102 where foreign matter is generated, the effect of the second injection unit 30 in preventing foreign matter from scattering downstream can be reduced from being hindered by the injection of fluid from the first injection unit 20. A configuration in which the first line L1 and the second line L2 intersect below the transported object 100 transported along the transport path 10a, more specifically below the surface (upper surface) 102a of the substrate 102 where foreign matter is generated, and do not intersect above the transported object 100 transported along the transport path 10a, more specifically above the surface (upper surface) 102a of the substrate 102 where foreign matter is generated, is a particularly effective configuration from the perspective of preventing micron-order foreign matter from scattering downstream in electronic components (transported object 100) such as semiconductor modules.

[0044] Furthermore, even if the diameter X1 of the injection port 22 in the first injection section 20 is set to be larger than the diameter X2 of the injection port 32 in the second injection section 30 and the injection pressure Y1 of the first injection section 20 is set to be larger than the injection pressure Y2 of the second injection section 30, by setting the vertical position of the injection port 22 in the first injection section 20 to be higher than the vertical position of the lower end 35' of the partition 35 as described above and configuring the second line L2 in the second injection section 30 to pass below the lower end 35' of the partition 35, it is possible to reduce the interference with the injection of fluid from the first injection section 20 of the effect of the second injection section 30 in preventing foreign matter from scattering downstream. A configuration in which the vertical position of the lower end 35' of the partition 35 is lower than the vertical position of the injection port 22 of the first injection section 20, and the second line L2 of the second injection section 30 passes below the lower end 35' of the partition 35, is also particularly effective from the perspective of preventing micron-order foreign matter from being scattered downstream in electronic components (transported object 100) such as semiconductor modules.

[0045] Here, the ratio Z of the injection pressure Y1 of the first injection part 20 to the injection pressure Y2 of the second injection part 30 shown in Equation 1 is preferably set to 1.5 to 5.0. That is, if the ratio Z is made larger than 5.0, the effect of the first spraying unit 20 in stirring up foreign matter will be further increased, but the effect of the second spraying unit 30 in preventing foreign matter from scattering will be impaired, and if the ratio Z is made smaller than 1.5, the effect of the second spraying unit 30 in preventing foreign matter from scattering will be increased, but the effect of the first spraying unit 20 in stirring up foreign matter will be impaired. For this reason, it is preferable that the ratio Z is set to 1.5 to 5.0. [Number 1] Z=Y1 / Y2

[0046] The suction unit 40 is provided above the conveying path 10a. The suction unit 40 is provided upstream of the conveying path 10a from the first spraying unit 20. The suction unit 40 can suck in foreign matter that is stirred up together with the fluid by the first spraying unit 20.

[0047] The suction unit 40 has a dust collection case 41, a suction pipe 42, and a guide plate 43. The dust collection case 41 is box-shaped and has a hollow rectangular parallelepiped shape. A filter is provided inside the hollow dust collection case 41, and the filter can collect foreign matter stirred up by the first jetting unit 20. The filter can be, for example, a bag filter.

[0048] A plurality of suction ports 41c are provided in the bottom wall 41b of the dust collection case 41, and the suction ports 41c can suck in foreign matter that has been stirred up together with the fluid by the first jetting unit 20. The vertical position of the suction ports 41c is higher than the vertical position of the jetting port 22 of the first jetting unit 20. By positioning the suction ports 41c higher than the vertical position of the jetting port 22 of the first jetting unit 20, it is possible to reduce the interference of the suction unit 40 with the first jetting unit 20 from stirring up foreign matter.

[0049] The suction pipe 42 is connected to the upper wall 41a of the dust collection case 41. A suction fan 42c is provided at the end 42b of the suction pipe 42. By activating the suction fan 42c, a suction path for foreign matter can be formed that runs from the foreign matter removal space 3, the suction port 41c, the hollow interior of the dust collection case 41, and the suction pipe 42.

[0050] The guide plate 43 can guide foreign matter stirred up together with the fluid by the first jetting unit 20 to the suction port 41c. The guide plate 43 is formed to extend downward from the lower end 41d' of the left side wall 41d of the dust collection case 41, and the vertical position of the lower end 43' of the guide plate 43 is set to be lower than the vertical position of the jetting port 22 of the first jetting unit 20 and higher than the position of the upper end of the transported object 100. As described above, the guide plate 43 has the slide plate 43a, and the position of the lower end 43' can be adjusted according to the height of the transported object 100. The guide plate 43 also serves as the left side wall 2d of the casing 2. That is, the guide plate 43 is arranged parallel to the partition wall 35, and the space from the guide plate 43 to the partition wall 35 forms the foreign matter removal space 3 described above.

[0051] By providing the guide plate 43 in this manner, even if the vertical position of the suction port 41c of the suction unit 40 is set higher than the vertical position of the injection port 22 of the first injection unit 20, foreign matter can be reliably guided to the suction port 41c together with the fluid, thereby minimizing the reduction in the suction performance of the suction unit 40 for foreign matter.

[0052] The method for removing foreign matter using the foreign matter removal device 1 configured as above will be explained below with reference to the flow chart of FIG.

[0053] First, in step 1, the transporting unit 10 continuously transports the transported objects 100 to the foreign matter removal space 3. Next, in step 2, the suction fan 42c of the suction unit 40 is started. By starting the suction fan 42c, a suction path for foreign matter is formed, which extends from the foreign matter removal space 3, the suction port 41c, the hollow interior of the dust collection case 41, and the suction pipe 42.

[0054] Next, in step 3, a fluid is sprayed from the first spray unit 20 toward the foreign matter removal space 3. That is, the spray pressure Y1 of the fluid from the first spray unit 20 is set to a predetermined value, and the spray direction 20a of the fluid is set to be perpendicular to the transport path 10a.

[0055] Next, in step 4, the fluid is sprayed from the second spray unit 30 toward the foreign matter removal space 3. That is, the fluid spray pressure Y2 of the second spray unit 30 is set to a predetermined value, and the fluid spray direction 30a of the second spray unit 30 is set so that it is directed from the downstream side to the upstream side of the transport path 10a and so that the interior angle is inclined acutely with respect to the transport path 10a. The ratio Z of the spray pressure Y1 of the first spray unit 20 to the spray pressure Y2 of the second spray unit 30 is set to be in the range of 1.5 to 5.0. In addition, the first line L1 of the first ejection section 20 and the second line L2 of the second ejection section 30 are set to intersect below the object 100 being transported along the transport path 10a, more specifically below the surface (upper surface) 102a of the substrate 102 where foreign matter is generated, and not intersect above the object 100 being transported along the transport path 10a, more specifically above the surface (upper surface) 102a of the substrate 102 where foreign matter is generated. This method of removing foreign matter makes it possible to prevent the foreign matter adhering to the transported object 100 from scattering downstream while rolling up the foreign matter. If the transported object 100 from which the foreign matter has been removed is an electronic component such as a semiconductor module, it is sent by the transport unit 10 to the next process, which is a wire bonding process.

[0056] As described above, the foreign matter removal device 1 of the present invention can transport the transported object 100 using the transport unit 10, while the first jetting unit 20 kicks up the foreign matter and removes it, and at the same time, spraying fluid from the second jetting unit 30 prevents the foreign matter from scattering downstream. The configuration in which the second jetting unit 30 sprays fluid from the downstream side of the transport path 10a of the first jetting unit 20 toward the transported object 100 to prevent the kicked-up foreign matter from scattering downstream is a particularly effective configuration from the perspective of preventing the transported object 100, and more specifically, preventing micron-order foreign matter from electronic components such as semiconductor modules from scattering downstream.

[0057] It should be noted that the present invention is not limited to the above-described embodiment, and various modifications and applications are possible within the scope of the invention as defined in the claims.

[0058] For example, in the above-described embodiment, the transported object 100 is an electronic component such as a semiconductor module, but the present invention can be applied to the removal of foreign matter from various other items. However, the foreign matter removal device 1 of the present invention is suitable for removing foreign matter on the order of microns, and is particularly preferably used for removing foreign matter from electronic components such as semiconductor modules.

[0059] In the above-described embodiment, the fluid injected from the injection units 20 and 30 is air, but other fluids may be used. For example, a configuration is possible in which other highly reactive fluids are injected from the injection units 20 and 30 to remove foreign matter from the transported object 100 while causing a predetermined reaction.

[0060] Furthermore, in the above-described embodiment, the angle of the spray direction 20a of the first spray unit 20 is set to be larger than the angle of the spray direction 30a of the second spray unit 30, and the spray direction 20a of the first spray unit 20 for spraying the fluid is set to be perpendicular to the conveying path 10a, and further, the spray direction 30a of the second spray unit 30 for spraying the fluid is set to be from the downstream side to the upstream side of the conveying path 10a, and is set to be a direction inclined at an acute interior angle with respect to the conveying path 10a. However, other configurations may be used as long as the first spray unit 20 sprays fluid onto the transported object 100 transported by the transport unit 10 to kick up foreign matter, and the second spray unit 30 sprays fluid from the downstream side of the first spray unit 20 on the conveying path 10a toward the transported object 100, thereby preventing the kicked-up foreign matter from scattering downstream.

[0061] However, from the viewpoint of removing micron-order foreign matter in electronic components such as semiconductor modules, it is particularly preferable to set the angle of the spray direction 20a of the first spray unit 20 to be larger than the angle of the spray direction 30a of the second spray unit 30, and further set the spray direction 20a of the first spray unit 20 in a direction perpendicular to the conveying path 10a, and further set the spray direction 30a of the second spray unit 30 in a direction from the downstream side to the upstream side of the conveying path 10a while forming an acute interior angle with respect to the conveying path 10a.

[0062] Furthermore, in the above-described embodiment, the diameter X1 of the injection port 22 in the first injection section 20 is set to be larger than the diameter X2 of the injection port 32 in the second injection section 30, and the injection pressure Y1 of the first injection section 20 is set to be larger than the injection pressure Y2 of the second injection section 30, but the present invention is not limited to such a configuration as long as it achieves the object of the present invention.

[0063] However, from the viewpoint of removing micron-order foreign matter in electronic components such as semiconductor modules, it is particularly preferable to set the diameter X1 of the injection port 22 in the first injection section 20 to be larger than the diameter X2 of the injection port 32 in the second injection section 30, and to set the injection pressure Y1 of the first injection section 20 to be larger than the injection pressure Y2 of the second injection section 30.

[0064] Furthermore, in the above-described embodiment, the first line L1 passing through the center 22a of the nozzle 22 in the first spray section 20 and along the spray direction 20a and the second line L2 passing through the center 32a of the nozzle 32 in the second spray section 30 and along the spray direction 30a intersect below the object 100 being transported along the transport path 10a, more specifically below the surface (top surface) 102a of the substrate 102 where foreign matter occurs, and do not intersect above the object 100 being transported along the transport path 10a, more specifically above the surface (top surface) 102a of the substrate 102 where foreign matter occurs, but this configuration is not limited to this as long as it achieves the object of the present invention.

[0065] However, the first line L1 passing through the center 22a of the nozzle 22 in the first spray section 20 and along the spray direction 20a and the second line L2 passing through the center 32a of the nozzle 32 in the second spray section 30 and along the spray direction 30a intersect below the transported object 100 transported along the transport path 10a, more specifically below the surface (top surface) 102a of the substrate 102 where foreign matter occurs, and do not intersect above the transported object 100 transported along the transport path 10a, more specifically above the surface (top surface) 102a of the substrate 102 where foreign matter occurs, which is a particularly preferred embodiment from the perspective of removing micron-order foreign matter in electronic components such as semiconductor modules. Furthermore, by setting the intersection position of the first line L1 and the second line L2 based on the conveying path 10a (in the above embodiment, the intersection position of the first line L1 and the second line L2 is set based on the surface (top surface) 102a of the substrate 102), and by making them intersect on the lower side of the conveying path 10a set on the surface (top surface) 11a of the conveying belt 11 and not intersect on the upper side of the conveying path 10a, the intersection position of the first line L1 and the second line L2 can be fixed and set regardless of the dimensions of the conveyed object 100.

[0066] In addition, in the above-described embodiment, there is a partition wall 35 that separates the space around the first spray unit 20 from the space around the second spray unit 30 at a predetermined distance, the first spray unit 20 and the second spray unit 30 are provided above the conveying path 10a, and the second spray unit 30 is provided in the space outside the partition wall 35, the vertical position of the spray port 22 from which the fluid in the first spray unit 20 is sprayed is above the vertical position of the lower end 35' of the partition wall 35, and the second line L2 in the second spray unit 30 passes below the lower end 35' of the partition wall 35, but this configuration is not limited to this as long as it achieves the object of the present invention.

[0067] However, a partition wall 35 is provided to separate the space around the first spray unit 20 from the space around the second spray unit 30 at a predetermined distance, the first spray unit 20 and the second spray unit 30 are provided above the conveying path 10a, and the second spray unit 30 is provided in the space outside the partition wall 35, the vertical position of the spray port 22 from which the fluid in the first spray unit 20 is sprayed is located above the vertical position of the lower end 35' of the partition wall 35, and the second line L2 of the second spray unit 30 passes below the lower end 35' of the partition wall 35. This is a particularly preferred embodiment from the perspective of removing micron-order foreign matter in electronic components such as semiconductor modules.

[0068] Furthermore, in the above-described embodiment, the second ejection units 30 are provided in multiple numbers along a direction perpendicular to the horizontal direction relative to the conveying path 10a, and the area where the multiple second ejection units 30 are provided and along a direction perpendicular to the horizontal direction relative to the conveying path 10a is set to include the area where the first ejection units 20 are provided and along a direction perpendicular to the horizontal direction relative to the conveying path 10a, but the present invention is not limited to such a configuration as long as it achieves the object of the present invention.

[0069] However, a configuration in which multiple second ejection units 30 are provided along a direction horizontally perpendicular to the conveying path 10a, and the area in which multiple second ejection units 30 are provided and along a direction horizontally perpendicular to the conveying path 10a includes the area in which first ejection units 20 are provided and along a direction horizontally perpendicular to the conveying path 10a, is a particularly preferred embodiment from the perspective of removing micron-order foreign matter from electronic components such as semiconductor modules.

[0070] Furthermore, in the above-described embodiment, the suction section 40 has a suction section 40 that sucks up foreign matter that has been stirred up along with the fluid, and the suction section 40 has a suction port 41c that sucks up foreign matter that has been stirred up along with the fluid, and the vertical position of the suction port 41c is set to be higher than the vertical position of the injection port 32 in the first injection section 30, but the configuration is not limited to this as long as it achieves the object of the present invention.

[0071] However, a configuration having a suction section 40 that sucks up foreign matter that has been stirred up along with the fluid, and in which the suction section 40 has a suction port 41c that sucks up foreign matter that has been stirred up along with the fluid, and in which the vertical position of the suction port 41c is located above the vertical position of the injection port 32 in the first injection section 30, is a particularly preferred embodiment from the perspective of removing foreign matter on the order of microns from electronic components such as semiconductor modules.

[0072] Furthermore, in the above-described embodiment, a guide plate 43 is provided to guide foreign matter that is stirred up together with the fluid to the suction port 41c, but the present invention is not limited to such a configuration as long as it achieves the object of the present invention.

[0073] However, a configuration in which a guide plate 43 is provided to guide foreign matter that is stirred up together with the fluid to the suction port 41c is a particularly preferable embodiment from the viewpoint of improving suction performance. [Explanation of symbols]

[0074] A1: Width dimension A2: Width dimension L1: First line L2: Second line X1: Caliber X2: Caliber Y1: Injection pressure Y2: Injection pressure Z: Ratio of the injection pressure of the first injection part to the injection pressure of the second injection part 1: Foreign matter removal device 1a: External space on the left 1b: Right side exterior space 2: Casing 2a: Upper wall 2b: Front wall 2c: Back wall 2d: Left side wall 2d1: opening 2e: Right side wall 2e1: opening 2e2: Exterior 2f: Bottom end 3: Foreign matter removal space 10: Transport unit 10a: Transport route 11: Conveyor belt 11a: Surface (top surface) 12: Drive unit 20: First injection section 20a: Injection direction 21: Bottom edge 22: Nozzle 22a: Center (center of gravity) 23: First pressure regulating valve 24: Primary Source 30: Second injection section 30a: Injection direction 31: Bottom edge 32: Nozzle 32a~32i: Injection port 32´: Center (center of gravity) 32a´: Branch pipe 33: Second pressure regulating valve 34: Secondary Source 35: Bulkhead 35a: Slide board 35a1: Long hole 35a2: Fasteners 35´: Bottom end 36:Support 37: Tilt angle adjustment mechanism 40:Suction part 41: Dust collection case 41a: Upper wall 41b: Lower wall 41c: Suction port 41d: Left side wall 41d´: Bottom edge 42:Suction tube 42b: Termination 42c: Suction fan 43: Information board 43a: Slide board 43a1: Long hole 43a2: Fasteners 43´: Bottom edge 100: Transported object 101: Semiconductor chip 102: Circuit board 102a: Surface (top surface) 103: Case 104: Terminal

Claims

1. A foreign matter removal device for removing foreign matter adhering to a transported object, The apparatus includes a conveying unit, a first ejection unit, a second ejection unit, and a suction unit, the conveying unit conveys the object along a predetermined conveying path, the first ejection unit ejects a fluid onto the object being transported by the transport unit to raise the foreign matter; The second spray section sprays a fluid toward the transported object from the downstream side of the first spray section on the transport path, thereby preventing the kicked-up foreign matter from scattering downstream.

2. 2. The foreign matter removal device according to claim 1, wherein the second ejection unit ejects the fluid in a direction inclined with respect to the transport path while being set so as to be directed from the downstream side to the upstream side of the transport path.

3. 2. The foreign matter removal device according to claim 1, wherein an angle of the jetting direction of the first jetting unit with respect to the transport path is larger than an angle of the jetting direction of the second jetting unit with respect to the transport path.

4. The ejection direction of the first ejection unit is perpendicular to the transport path.

2. The foreign matter removal device according to claim 1, wherein:

5. 2. The foreign matter removal device according to claim 1, wherein the diameter of the injection port of the first injection unit is larger than the diameter of the injection port of the second injection unit, and the injection pressure of the first injection unit is larger than the injection pressure of the second injection unit.

6. 6. The foreign matter removal device according to claim 5, wherein the ratio of the injection pressure of the first injection part to the injection pressure of the second injection part is set to 1.5 to 5.

0.

7. 2. The foreign matter removal device according to claim 1, wherein a first line passing through the center of the injection port of the first injection section and along the injection direction and a second line passing through the center of the injection port of the second injection section and along the injection direction intersect below the object being transported along the transport path and do not intersect above the object.

8. a partition wall that separates a space around the first ejection portion from a space around the second ejection portion by a predetermined distance; the first ejection unit and the second ejection unit are provided above the transport path, and the second ejection unit is provided in a space outside the partition wall; 2. The foreign matter removal device according to claim 1, wherein the position of the injection port of the first injection unit from which the fluid is injected is located above the position of the lower end of the partition wall, and the second line of the second injection unit passes below the lower end of the partition wall.

9. The foreign matter removal device according to claim 1, characterized in that the second ejection units are provided in a plurality along a direction perpendicular to the horizontal direction of the transport path, and the region in which the plurality of second ejection units are provided and along a direction perpendicular to the horizontal direction of the transport path is set to include the region in which the first ejection units are provided and along a direction perpendicular to the horizontal direction of the transport path.

10. 2. The foreign matter removal device according to claim 1, further comprising a suction section that sucks up the foreign matter stirred up together with the fluid, the suction section having a suction port that sucks up the foreign matter stirred up together with the fluid, and the suction port is positioned above the injection port of the first injection section.

11. 2. The foreign matter removal device according to claim 1, further comprising a guide plate for guiding the foreign matter stirred up together with the fluid to a suction port.

12. 2. The foreign matter removal apparatus according to claim 1, wherein the transported object is an electronic component.

13. 13. The foreign matter removal device according to claim 12, wherein the electronic component is a semiconductor module.

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