Expansion retaining ring removal tool and expansion retaining ring removal method

Abstract

To provide an expansion retaining ring removal jig and an expansion retaining ring removal method capable of removing an expansion retaining ring from a frame without damaging the expansion retaining ring.SOLUTION: An expansion retaining ring removal jig includes a base member 12 having an annular holding groove 24 for externally retaining an expansion retaining ring 100, and a sheet support surface 26 that is provided inside a holding groove 24 and supports a dicing tape 4 that is in an expanded state by the expansion retaining ring 100, and a sheet pressing member 14 having a sheet pressing surface 34 provided at a position opposite to the sheet support surface 26, and the base member 12 has an annular escape groove 38 for letting a cutter 16 escape to a position inside the holding groove 24 and outside the position where the dicing tape 4 is pressed by the sheet pressing surface 34.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to an expansion retaining ring removal jig and an expansion retaining ring removal method, and more particularly to an expansion retaining ring removal jig and an expansion retaining ring removal method for removing an expansion retaining ring that maintains the expanded state of a dicing tape from a dicing frame. [Background technology]

[0002] Conventionally, in the manufacture of semiconductor chips (hereinafter referred to as chips), a work division device has been known that divides (also referred to as singulation) a semiconductor wafer (hereinafter referred to as wafer), into which a division line has been pre-processed by laser irradiation or the like, into individual chips along the division line (see, for example, Patent Document 1).

[0003] The wafer is attached to a dicing tape, and the dicing tape is fixed at its outer periphery to a dicing frame (hereinafter referred to as the frame). The workpiece dividing device expands the dicing tape with an expanding ring to divide the wafer into individual chips, and then holds the dicing tape in an expanded state with an expanding retaining ring so that the chips can be removed by a die bonder.

[0004] In addition, the expansion retaining ring disclosed in Patent Document 2 has a main ring whose outer diameter is smaller than the inner diameter of the frame and whose inner diameter is larger than the outer diameter of the expand ring, and an elastically deformable resin fitting portion (hereinafter referred to as the lip portion) attached to the outer periphery of the main ring and whose outer diameter is larger than the inner diameter of the frame. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2021-176201 [Patent Document 2] Patent Publication No. 2021-64811 Summary of the Invention [Problem to be solved by the invention]

[0006] After the die bonder completes the chip removal process, the expansion retaining ring is removed from the frame so that it can be reused. This removal process is performed by an operator using a cutting blade such as a knife to cut the dicing tape located between the frame and the lip along the lip. However, this removal process can damage the lip.

[0007] The present invention was made in consideration of such problems, and aims to provide an expansion retaining ring removal tool and an expansion retaining ring removal method that can remove an expansion retaining ring from a frame without damaging the expansion retaining ring. [Means for solving the problem]

[0008] In order to achieve the object of the present invention, the expansion retaining ring removal jig of the present invention is an expansion retaining ring removal jig for removing from a frame an expansion retaining ring that is fitted and attached to the inside of the frame to maintain the expanded state of a sheet attached to the annular frame, and comprises a base member having an annular retaining groove that fits and holds the expansion retaining ring, and a sheet support surface that is located inside the retaining groove and supports the sheet that is in an expanded state by the expansion retaining ring, and a sheet pressing member that has a sheet pressing surface located opposite the sheet support surface, and the base member has an annular escape groove that is located inside the retaining groove and outside the position where the sheet is pressed by the sheet pressing surface to allow a cutting blade used to cut the sheet to escape.

[0009] In one aspect of the present invention, the sheet supporting surface and the sheet pressing surface are preferably formed in an annular shape.

[0010] In one aspect of the present invention, the sheet pressing member is preferably attached to the base member so as to be openable and closable.

[0011] In one aspect of the present invention, the cutting blade is preferably provided on the sheet pressing member.

[0012] In one aspect of the present invention, the sheet pressing member preferably has a cutting blade moving mechanism that moves the cutting blade along the relief groove.

[0013] In one form of the present invention, it is preferable that the cutting blade moving mechanism has a rotating plate that is rotatably mounted on the sheet pressing member and that, when rotated, moves the cutting blade along the escape groove, and a guide member that abuts against the outer periphery of the rotating plate and guides the rotating plate in the rotational direction.

[0014] In order to achieve the object of the present invention, the expansion retaining ring removal method of the present invention is a method for removing an expansion retaining ring from a frame, which is fitted and attached to the inside of the frame to maintain the expanded state of a sheet attached to the frame, and includes a holding step for holding the expansion retaining ring, a fixing step for clamping the sheet located inside the expansion retaining ring to fix the sheet, a cutting step for cutting the sheet located between the expansion retaining ring and the fixed position of the sheet, and a separation step for separating the expansion retaining ring from the frame. [Effects of the Invention]

[0015] The present invention allows the expansion retaining ring to be removed from the frame without damaging the expansion retaining ring. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 2 is a perspective view of the removal jig according to the embodiment, seen from above. [Figure 2] FIG. 2 is a perspective view of the removal jig shown in FIG. 1, as viewed from below. [Figure 3] FIG. 2 is an assembled perspective view of the removal jig shown in FIG. [Figure 4] FIG. 2 is an enlarged cross-sectional view of a main part of the removal jig shown in FIG. [Figure 5] FIG. 1 is a perspective view of an expanded retaining ring. [Figure 6] FIG. 6 is an assembled perspective view of the expansion retaining ring shown in FIG. 5. [Figure 7] 6 is a cross-sectional view of the expansion retaining ring shown in FIG. 5. [Figure 8] FIG. 10 is an explanatory diagram of a wafer unit provided with a dicing tape. [Figure 9] FIG. 2 is an explanatory diagram showing a schematic configuration of a workpiece dividing device. [Figure 10] FIG. 2 is a half cross-sectional view of the removal jig of the embodiment. [Figure 11] FIG. 11 is an enlarged cross-sectional view of part A shown in FIG. [Figure 12] FIG. 11 is an enlarged cross-sectional view of part B shown in FIG. [Figure 13] FIG. 10 is an explanatory diagram showing the expansion retaining ring removed from the frame. [Figure 14] 10 is a flow chart illustrating an example method for removing an expanding retaining ring. DETAILED DESCRIPTION OF THE INVENTION

[0017] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of an expansion retaining ring removal jig and an expansion retaining ring removal method according to the present invention will be described with reference to the accompanying drawings.

[0018] Fig. 1 is a perspective view of an expansion retaining ring removal jig (hereinafter referred to as "removal jig") 10 according to an embodiment, as seen from above. Fig. 2 is a perspective view of the removal jig 10 shown in Fig. 1, as seen from below. Fig. 3 is an assembled perspective view of the removal jig 10 shown in Fig. 1. Fig. 4 is an enlarged cross-sectional view of a main part of the removal jig 10 shown in Fig. 1.

[0019] As shown in FIGS. 1 to 4, a removal jig 10 of the embodiment includes a base member 12, a sheet pressing member 14, a cutter 16, and a cutter moving mechanism 18.

[0020] Here, an example of the expansion retaining ring 100 to be removed by the removal jig 10 shown in Figures 1 to 4 will be described. Figure 5 is an overall perspective view of the expansion retaining ring 100. Figure 6 is an assembled perspective view of the expansion retaining ring 100 shown in Figure 5. Also, Figure 7 is a cross-sectional view of the expansion retaining ring 100 shown in Figure 5.

[0021] 5 to 7, the expansion retaining ring 100 includes a ring body 102 and a ring-shaped lip portion 104. The ring body 102 is made of, for example, a highly rigid resin or metal. The lip portion 104 is attached to an outer peripheral surface 102A of the ring body 102 and protrudes outward from the outer peripheral surface 102A of the ring body 102.

[0022] The lip portion 104 is made of, for example, an elastically deformable resin. One example of the resin material that makes up the lip portion 104 is polypropylene, but it is not limited to polypropylene and any flexible resin material can be used. Note that, while the expandable retaining ring in this example is the expandable retaining ring 100 in which the ring body 102 and the lip portion 104 are configured as separate bodies, the expandable retaining ring is not limited to this and may be an expandable retaining ring in which the ring body 102 and the lip portion 104 are configured as a single body.

[0023] Next, an example of a wafer unit 2 to which the expandable retaining ring 100 is applied will be described. Fig. 8 is an explanatory diagram showing an example of the wafer unit 2, with Fig. 8A being a perspective view of the wafer unit 2 and Fig. 8B being a cross-sectional view of the wafer unit 2. This wafer unit 2 includes a dicing tape 4 that is held in an expanded state by the expandable retaining ring 100 described above.

[0024] As shown in FIG. 8, the wafer unit 2 includes a wafer 1, a film-like adhesive 3, a dicing tape 4, and a frame 5. The wafer 1 is attached to the dicing tape 4, which has a thickness of approximately 100 μm and an adhesive layer formed on its surface, via the film-like adhesive 3. The dicing tape 4 has an outer periphery attached to a rigid, annular frame 5. The dicing tape 4 also has a central region 4A, which is circular in plan view, to which the wafer 1 is attached, and an annular region 4B, which is donut-shaped in plan view, between the outer edge of the central region 4A (the outer edge of the wafer 1) and the inner edge of the frame 5. The wafer 1, in the form of the wafer unit 2, is carried into a work dividing device 70 (see FIG. 9) and divided into individual chips 6 by the work dividing device 70.

[0025] 9 is an explanatory diagram showing a schematic configuration of the workpiece dividing device 70. The chip dividing operation by the workpiece dividing device 70 will be briefly described below.

[0026] First, as shown by IXA in Figure 9, the frame 5 of the wafer unit 2 is fixed to the frame fixing part 72 of the work dividing device 70. Next, the expand ring 74 is raised to push up the annular region 4B of the dicing tape 4 from the back surface of the dicing tape 4 (the surface opposite to the surface to which the wafer 1 is attached). This raising action of the expand ring 74 expands the dicing tape 4, and the wafer 1 is divided into individual chips 6 (see IXB in Figure 9). Note that a roller 76 is rotatably provided on the upper surface of the expand ring 74 that pushes up the annular region 4B to reduce the frictional force between the expand ring 74 and the annular region 4B.

[0027] Next, as shown in IXB of FIG. 9, the expansion retaining ring 100 is raised, and the lip portion 104 is fitted onto the surface 5A of the frame 5 via the annular region 4B (see IXC of FIG. 9). This raising action of the expansion retaining ring 100 holds the dicing tape 4 in an expanded state. Next, as shown in IXC of FIG. 9, the expanding ring 74 is lowered. At this time, the expansion of the dicing tape 4 by the expanding ring 74 is released, but since the expansion retaining ring 100 is fitted and attached inside the frame 5, the dicing tape 4 is held in an expanded state without loosening.

[0028] The wafer unit 2, with the dicing tape 4 held in an expanded state by the expandable retaining ring 100, is removed from the frame fixing portion 72 and carried from the work dividing device 70 to a die bonder (not shown), where the chips 6 are removed from the dicing tape 4 by the die bonder. FIG. 3 shows the wafer unit 2 from which the chips 6 have been removed. In the wafer unit 2 shown in FIG. 3, the expandable retaining ring 100 (see IXC in FIG. 9) is disposed on the back side of the dicing tape 4. This expandable retaining ring 100 is removed from the frame 5 by a removal jig 10 of the embodiment (see FIG. 1, etc.).

[0029] 1 to 4, the removal jig 10 of the embodiment will be further described. The removal jig 10 includes the base member 12, the sheet pressing member 14, the cutter 16, and the cutter moving mechanism 18, as described above.

[0030] Base member 12 is an example of a base member of the present invention, and in this example, has a pedestal 20 and a base body 22 fixed on pedestal 20. Pedestal 20 is a plate-like body that is rectangular in plan view, and has a plurality of openings 20A formed on its surface to reduce weight. Base body 22 is configured in an annular shape, and is fixed on pedestal 20 at a position where the central axis P of base body 22 is aligned with the center of pedestal 20.

[0031] As shown in Fig. 4, the wafer unit 2 shown in Fig. 3 is attached to the base body 22. Fig. 4 shows a state in which the dicing tape 4 of the wafer unit 2 is pressed against the base body 22 by a sheet pressing member 14 (described later), and the dicing tape 4 is cut by a sheet cutting cutter 16 (described later).

[0032] As shown in FIG. 4, the base body 22 is configured such that the outer diameter of the base body 22 is smaller than the inner diameter of the frame 5 of the wafer unit 2. The base body 22 also includes, on its upper surface, a holding groove 24 for fitting and holding the expansion retaining ring 100, and a sheet support surface 26 located inside the holding groove 24 and supporting the dicing tape 4 expanded by the expansion retaining ring 100. The holding groove 24 and the sheet support surface 26 are each formed in an annular shape centered on a central axis P (see FIG. 1). Therefore, when the expansion retaining ring 100 is fitted and held in the holding groove 24, the expansion retaining ring 100 is fitted and held in the holding groove 24 with the central axis of the expansion retaining ring 100 aligned with the central axis P. The holding groove 24 is an example of a holding groove of the present invention, and the sheet support surface 26 is an example of a sheet support surface of the present invention.

[0033] As shown in FIG. 4 , the holding groove 24 is formed on the outer periphery of the base body 22, and is formed at a position lower than the sheet support surface 26 by the thickness T of the expansion holding ring 100 (ring body 102). As a result, when the expansion holding ring 100 is fitted and held in the holding groove 24 with the dicing tape 4 facing up relative to the expansion holding ring 100, the upper surface of the ring body 102 of the expansion holding ring 100 and the sheet support surface 26 are flush with each other, so that the dicing tape 4 is supported flat on the sheet support surface 26. In addition, the step surface 28 formed as the inner wall surface of the holding groove 24 is configured as a tapered surface that expands in diameter downward, and the tapered surface of the inner peripheral surface 103 of the ring body 102 is fitted into this tapered surface. With this configuration, the expansion holding ring 100 is fitted and held in the holding groove 24, and the wafer unit 2 is attached to the base body 22.

[0034] 1 to 4, the sheet retainer member 14 of this example includes a sheet retainer main body 30 and a cover member 32 that supports the sheet retainer main body 30. The sheet retainer main body 30 is disk-shaped. The cover member 32 is rectangular, and has an opening 32A formed in the center of the cover member 32. The cutter movement mechanism 18, which will be described later, is exposed through the opening 32A.

[0035] As shown in Fig. 4, the sheet presser body 30 has an annular sheet presser surface 34 located opposite the sheet support surface 26. This sheet presser surface 34 is formed on the lower surface of a convex portion 36 that protrudes annularly from the outer periphery of the lower surface of the sheet presser body 30. The dicing tape 4 supported on the sheet support surface 26 is pressed against the sheet support surface 26 by the sheet presser surface 34 as the sheet presser surface 34 abuts against the dicing tape 4 from above (the side of the dicing tape 4 opposite the sheet support surface 26). The sheet presser surface 34 is an example of a sheet presser surface of the present invention.

[0036] 4, the upper surface of the base body 22 has an annular escape groove 38 for allowing the cutter 16 to escape. This escape groove 38 is formed in a position more inward than the holding groove 24 and more outward than the position where the dicing tape 4 is held down by the sheet holding surface 34. The escape groove 38 is formed in an annular shape centered on the central axis P. The escape groove 38 is one example of the escape groove of the present invention.

[0037] Fig. 10 is a half cross-sectional view of the removal jig 10. Fig. 11 is an enlarged cross-sectional view of part A shown in Fig. 10. Fig. 12 is an enlarged cross-sectional view of part B shown in Fig. 10. The configurations of the sheet pressing member 14, the cutter 16, and the cutter moving mechanism 18 will be described in detail below with reference to Figs. 10 to 12.

[0038] 10 and 11, the sheet retainer body 30 has a shaft 40 protruding upward from the center of the top surface of the sheet retainer body 30. A rotating plate 42 that constitutes the cutter moving mechanism 18 is attached to this shaft 40 via a bearing 44. This connects the sheet retainer body 30 and the rotating plate 42 so that they can rotate relatively around the shaft 40.

[0039] As shown in FIGS. 10 and 12 , the outer periphery of the rotating plate 42 is slidably engaged with a guide roller 46. The guide roller 46 is journaled on a shaft 48 that protrudes downward from the underside of the cover member 32. Furthermore, guide members 50 each having the guide roller 46 and the shaft 48 are arranged, for example, at three equally spaced locations on a concentric circle centered on the shaft 40. With this configuration, the sheet presser body 30 is supported on the cover member 32 via the bearing 44, the rotating plate 42, and each guide member 50. Furthermore, the rotating plate 42 is supported on the cover member 32 so as to be rotatable relative to the shaft 40. The cutter moving mechanism 18 is an example of a cutting blade moving mechanism of the present invention. The rotating plate 42 is an example of a rotating plate of the present invention. The guide member 50 is an example of a guide member of the present invention.

[0040] As shown in Figures 1 and 2, the cover member 32 is attached to the base 20 via a pair of hinges 52 so as to be able to open and close freely. This allows the sheet retainer member 14 to be opened and closed freely relative to the base member 12. Figures 1 and 2 show the sheet retainer member 14 in an open state (hereinafter referred to as the open state), and Figures 10 to 12 show the sheet retainer member 14 in a closed state (hereinafter referred to as the closed state).

[0041] In the closed state shown in FIGS. 10 to 12, the sheet retaining member 14 is attached to the pedestal 20 at a position where the axis of the shaft 40 coincides with the central axis P of the base main body 22. As a result, in the closed state, the rotating plate 42 rotates about the central axis P. Therefore, in the closed state, the rotating plate 42 rotates about the central axis of the expansion retaining ring 100 relative to the wafer unit 2 attached to the base main body 22. As shown in FIG. 2, legs 54 protrude downward from the underside of the lid member 32. These legs 54 are arranged at four equally spaced locations on a concentric circle centered on the shaft 40. Each leg 54 abuts against the upper surface of the pedestal 20 in the closed state. This allows the sheet retaining member 14 to be stably maintained in the closed state.

[0042] 10 and 12, the cutter 16, which is an example of a cutting blade of the present invention, is attached to the outer periphery of the rotating plate 42. The cutter 16 is attached to the rotating plate 42 at a position where the lower end 16A of the cutter 16 can be inserted into the relief groove 38 of the base body 22 in the closed state. Specifically, the distance from the center of the shaft 40 to the cutter 16 in the radial direction of the rotating plate 42 is set to the distance from the center axis P of the base body 22 in the radial direction to the relief groove 38 (e.g., the center position of the relief groove 38). With this configuration, the cutter 16 moves toward the relief groove 38 as the sheet presser member 14 moves from the open state to the closed state, and the lower end 16A is inserted into the relief groove 38 in the closed state. In other words, as shown in Figure 4, when the expansion retaining ring 100 is fitted and held in the retaining groove 24 of the base main body 22, the dicing tape 4 on the escape groove 38 located inside the expansion retaining ring 100 is broken through by the lower end 16A of the cutter 16.

[0043] As shown in FIG. 12 , the cutter 16 is connected to the operation knob 58 via a cutter support portion 56. The cutter support portion 56 is inserted into a pipe 60 that passes through the opening 42A of the rotary plate 42 and is attached so as to be movable along the axial direction of the pipe 60. The axial direction of the pipe 60 is parallel to the central axis P (see FIG. 1 ). The cutter support portion 56 is supported by the pipe 60 via a coil spring 62 disposed within the pipe 60. The cutter 16 shown in FIG. 12 is shown in a state in which the lower end 16A protrudes downward from the lower opening of the pipe 60 when the operation knob 58 is pressed as indicated by arrow C. However, when the operation knob 58 is not pressed, the entire cutter 16 is housed within the pipe 60 due to the biasing force of the coil spring 62. Therefore, the cutter 16 in this example is inserted into the escape groove 38 when the operation knob 58 is pressed after the sheet retainer member 14 is closed.

[0044] Next, an example of a method for removing an expansion retaining ring using the removal jig 10 configured as described above will be described with reference to the flowchart shown in FIG.

[0045] 1 and 2, the sheet pressing member 14 is opened, and the wafer unit 2 shown in Fig. 3 is attached to the base body 22. That is, as shown in Fig. 4, the expandable retaining ring 100 is fitted and retained in the retaining groove 24 (retaining step: S10).

[0046] Next, the hinge 52 is used to close the sheet retaining member 14 (changing from the open state to the closed state). This action causes the dicing tape 4 located inside the expansion retaining ring 100 to be clamped and fixed between the sheet support surface 26 and the sheet retaining surface 34 (fixing step: S20). As a result, the expansion retaining ring 100 is fixed to the base member 12. Note that in this state, the operation knob 58 has not yet been pressed down, so the cutter 16 is entirely housed within the pipe 60. When the operation knob 58 is subsequently pressed down, the cutter 16 protrudes downward from the lower opening of the pipe 60 against the biasing force of the coil spring 62. As a result, the lower end 16A of the cutter 16 breaks through the dicing tape 4 above the escape groove 38 (see FIGS. 4 and 12).

[0047] Next, while the operation knob 58 is pressed down, the operation knob 58 is rotated around the axis 40 (center axis P) using the cutter movement mechanism 18. At this time, the sheet presser body 30, which presses the dicing tape 4 against the sheet support surface 26, does not rotate, and the rotating plate 42 rotates around the axis 40 (center axis P). As a result, the cutter 16 moves along the escape groove 38 while inserted into the escape groove 38. This movement of the cutter 16 cuts the dicing tape 4 between the expansion retaining ring 100 and the fixed position of the dicing tape 4 (the position of the sheet support surface 26) into a circular shape along the escape groove 38. Then, after the operation knob 58 has rotated one full turn, the rotation of the operation knob 58 is stopped. As a result, the dicing tape 4C (see FIG. 4) located inside the escape groove 38 is cut from the dicing tape 4D (see FIG. 4) located outside the escape groove 38 (cutting step: S30).

[0048] Next, the pressing operation of the operation knob 58 is released to house the entire cutter 16 inside the pipe 60. After that, the sheet pressing member 14 is opened (changed from a closed state to an open state). At this time, the dicing tape 4C located inside the escape groove 38 is adhered to the sheet pressing surface 34, so it is cut upward relative to the dicing tape 4D by opening the sheet pressing member 14. As a result, a circular opening corresponding to the size of the dicing tape 4C is formed in the dicing tape 4D.

[0049] Next, the frame 5, which is in the position shown in FIG. 4, is pushed downward from the position shown in FIG. 4. As a result, as shown in the enlarged cross-sectional view of a main portion in FIG. 13, the dicing tape 4D is pushed downward together with the frame 5, and the dicing tape 4D and the frame 5 are separated from the expansion retaining ring 100. That is, the expansion retaining ring 100 is separated from the frame 5 (separation step: S40). Then, the expansion retaining ring 100, which is fitted and held in the holding groove 24, is removed from the holding groove 24 (removal step: S50). This series of operations allows the expansion retaining ring 100 to be removed from the frame 5. Furthermore, because a configuration is adopted in which the dicing tape 4C located inside the expansion retaining ring 100 is cut by the cutter 16, the expansion retaining ring 100 can be removed from the frame 5 without damaging the expansion retaining ring 100 (particularly the lip portion 104).

[0050] As described above, the removal jig 10 of the embodiment includes the base member 12 and the sheet pressing member 14, and has a configuration in which the base member 12 has an annular escape groove 38 for allowing the cutter 16 to escape, located in a position inside the holding groove 24 and outside the position where the dicing tape 4 is pressed by the sheet pressing surface 34. This allows the expansion retaining ring 100 to be removed from the frame 5 without the cutter 16 damaging the expansion retaining ring 100. In addition, the expansion retaining ring 100 can be removed from the frame 5 without the cutter 16 damaging the frame 5.

[0051] Hereinafter, several modified examples of the removal jig 10 of the embodiment will be described.

[0052] <First Modification> In the removal jig 10 of the embodiment, the sheet support surface and the sheet pressing surface are respectively annularly formed as the sheet support surface 26 and the sheet pressing surface 34, but this is not limited thereto and may be formed, for example, in an arc shape or a straight line shape in a plan view. However, from the viewpoint of reliably pressing the dicing tape 4 between the sheet support surface 26 and the sheet pressing surface 34, it is preferable that the shape of the sheet support surface 26 and the sheet pressing surface 34 are each annular.

[0053] <Second Modification> In the removal jig 10 of the embodiment, the relief groove 38 formed in a circular ring shape has been described as an example, but the relief groove is not limited to this and may be formed in, for example, a polygonal ring shape. Furthermore, the relief groove is not limited to a ring shape (circular ring and polygonal ring) and may be a shape in which part of the ring (one or more parts) is not connected, such as a C-shape.

[0054] <Third Modification> In the removal jig 10 of the embodiment, a configuration in which the sheet holding member 14 is attached to the base member 12 so as to be able to open and close freely has been described as an example, but the present invention is not limited to this, and the sheet holding member 14 and the base member 12 may be configured separately. However, by adopting a configuration in which the sheet holding member 14 is attached to the base member 12 so as to be able to open and close freely, the operation of the sheet holding member 14 to hold down the dicing tape 4 becomes easier.

[0055] <Fourth Modification> In the embodiment of the removal jig 10, a configuration in which the cutter 16 is provided on the sheet holding member 14 has been described as an example, but this is not limited to this, and the sheet holding member 14 and the cutter 16 may be configured separately. However, by adopting a configuration in which the cutter 16 is provided on the sheet holding member 14, the cutter 16 can be handled as a component of the sheet holding member 14, making it easier to handle the cutter 16.

[0056] <Fifth Modification> In the removal jig 10 of the embodiment, a configuration in which the cutter moving mechanism 18 is provided on the sheet holding member 14 has been described as an example, but the present invention is not limited to this, and the cutter 16 may be operated alone to cut the dicing tape 4 without providing a cutter moving mechanism. However, by adopting a configuration in which the cutter moving mechanism 18 is provided on the sheet holding member 14, cutting the dicing tape 4 becomes easier.

[0057] <Sixth Modification> In the removal jig 10 of the embodiment, an annular escape groove 38 for allowing the cutter 16 to escape is provided on the upper surface of the base body 22, but a replaceable annular cutter mat may be provided instead of the escape groove 38. In the sixth modification, even if the dicing tape 4 is so flexible that it escapes into the escape groove 38 when an attempt is made to make a cut with the cutter 16, the cutter mat can prevent the dicing tape 4 from escaping, so that the dicing tape can be easily cut by the cutter 16.

[0058] The above describes an example of an expansion retaining ring removal jig according to the present invention, but the technology of the present invention is not limited to the embodiment, and several improvements or modifications may be made within the scope that does not deviate from the gist of the present invention. [Explanation of symbols]

[0059] 1...wafer, 2...wafer unit, 3...film adhesive, 4...dicing tape, 5...frame, 10...removal jig, 12...base member, 14...sheet pressing member, 16...cutter, 18...cutter moving mechanism, 20...pedestal, 22...base body, 24...holding groove, 26...sheet support surface, 28...step surface, 30...sheet pressing body, 32...lid member, 34...sheet pressing surface, 36...protrusion, 3 8...relief groove, 40...shaft, 42...rotating plate, 44...bearing, 46...guide roller, 48...shaft, 50...guide member, 52...hinge, 54...leg, 56...cutter support portion, 58...operation knob, 60...pipe, 62...coil spring, 70...workpiece dividing device, 72...frame fixing portion, 74...expanding ring, 76...roller, 100...expanding retaining ring, 102...ring body, 104...lip portion

Claims

1. An expansion retaining ring removal tool for removing, from an annular frame, an expansion retaining ring that is fitted and attached to the inside of the frame to maintain an expanded state of a sheet attached to the frame, a base member having an annular retaining groove that fits over the expansion retaining ring, and a seat support surface that is located inside the retaining groove and supports the seat in an expanded state by the expansion retaining ring; a sheet pressing member having a sheet pressing surface provided at a position facing the sheet support surface; Equipped with the base member has an escape groove for escaping a cutting blade for cutting the sheet, the escape groove being located inside the holding groove and outside the position where the sheet is pressed by the sheet pressing surface; Expanding retaining ring removal tool.

2. The sheet support surface, the sheet pressing surface, and the relief groove are formed in an annular shape.

2. The expanding retaining ring removal tool of claim 1.

3. The sheet pressing member is attached to the base member so as to be able to open and close freely.

3. The expansion retaining ring removal tool of claim 1 or 2.

4. The cutting blade is provided on the sheet pressing member. The expansion retaining ring removal tool of any one of claims 1 to 3.

5. The sheet pressing member has a cutting blade moving mechanism that moves the cutting blade along the relief groove.

5. The expandable retaining ring removal tool of claim 4.

6. The cutting blade moving mechanism includes: a rotating plate that is rotatably provided on the sheet pressing member and that moves the cutting blade along the relief groove when rotated; a guide member that contacts an outer periphery of the rotary plate and guides the rotary plate in a rotation direction; having 6. The expandable retaining ring removal tool of claim 5.

7. 1. A method for removing an expansion retaining ring from an annular frame, the expansion retaining ring being fitted and attached to the inside of the frame to maintain an expanded state of a sheet attached to the frame, the method comprising: a retaining step of retaining the expansion retaining ring; a fixing step of clamping the sheet located inside the expansion retaining ring to fix the sheet; a cutting step of cutting the sheet located between the expansion retaining ring and a fixed position of the sheet; separating the expansion retaining ring from the frame; having Extended retaining ring removal instructions.

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