resin composition

Abstract

To provide a resin composition capable of giving a cured product excellent in plating adhesion and suppressing unevenness after lamination.SOLUTION: The resin composition contains (A) a maleimide compound having a sulfur atom and a maleimide group, (B) an epoxy resin, (C) an active ester compound, and (D) an inorganic filler.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a resin composition. [Background technology]

[0002] A known manufacturing technique for printed wiring boards is a build-up method in which insulating layers and conductor layers are alternately stacked. In build-up manufacturing methods, the insulating layers are generally formed from a cured product obtained by curing a resin composition (Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2020-23714 Summary of the Invention [Problem to be solved by the invention]

[0004] The cured product contained in the insulating layer is required to have a low dielectric dissipation factor. One method for obtaining a cured product with a low dielectric dissipation factor is to blend a high concentration of an active ester compound and an inorganic filler into the resin composition. However, when a resin composition blended with a high concentration of an active ester compound and an inorganic filler is used, plating adhesion tends to be poor and unevenness tends to occur in the resin composition layer.

[0005] Specifically, an insulating layer may be formed using a cured product of a resin composition, and a conductor layer may be formed on the insulating layer by plating. However, when a resin composition containing a high concentration of an active ester compound and an inorganic filler is used, the adhesion between the insulating layer and the conductor layer formed by plating tends to be low.

[0006] Furthermore, in the manufacturing process of printed wiring boards, a resin composition layer containing a resin composition is laminated onto an inner layer substrate, and the resin composition layer is cured to form an insulating layer on the inner layer substrate. However, when a resin composition containing a high concentration of an active ester compound and an inorganic filler is used, unevenness may occur in the resin composition layer after lamination. Specifically, depressions may occur along the periphery of the inner layer substrate in the resin composition layer after lamination. Such unevenness reduces the uniformity of the insulating layer, so it is desirable to suppress its occurrence.

[0007] The present invention has been made in view of the above-mentioned problems, and has an object to provide: a resin composition that can give a cured product with excellent plating adhesion and that can suppress unevenness after lamination; a cured product of the resin composition; a sheet-like laminate material containing the resin composition; a resin sheet having a resin composition layer formed from the resin composition; a printed wiring board that includes an insulating layer that includes a cured product of the resin composition; and a semiconductor device that includes the printed wiring board. [Means for solving the problem]

[0008] The present inventors have conducted extensive research to solve the above-mentioned problems, and as a result, have found that the above-mentioned problems can be solved by a resin composition containing, in combination, (A) a maleimide compound having a sulfur atom and a maleimide group, (B) an epoxy resin, (C) an active ester compound, and (D) an inorganic filler, and have thus completed the present invention. That is, the present invention includes the following.

[0009] [1] A resin composition comprising: (A) a maleimide compound having a sulfur atom and a maleimide group; (B) an epoxy resin; (C) an active ester compound; and (D) an inorganic filler. [2] The resin composition according to [1], wherein the content of the (C) component is 10% by mass or more and the content of the (D) component is 60% by mass or more, where the nonvolatile components in the resin composition are 100% by mass. [3] The resin composition according to [1] or [2], wherein the component (A) contains an aromatic ring in the molecule. [4] The component (A) is (a1) a maleimide compound having two or more maleimide groups in one molecule; (a2) a thiol compound having two or more thiol groups in one molecule; The resin composition according to any one of [1] to [3], which is a polymer of a monomer composition comprising: [5] The resin composition according to [4], wherein the component (a1) is represented by the following formula (a1-1): [ka] (In formula (a1-1), R 11 ~R 14 each independently represents at least one selected from the group consisting of a hydrogen atom, an alkyl group, and a halogen atom, and X represents a divalent organic group containing an aromatic ring. [6] The resin composition according to [4] or [5], wherein the component (a2) is represented by the following formula (a2-1) or formula (a2-2): [ka] (In formula (a2-1), Y represents an organic group having a cyclic structure, and R 21 each independently represents a divalent organic group containing a hydrocarbon group, and R 22 each independently represents at least one selected from the group consisting of a hydrogen atom, an alkyl group, and a halogen atom; m1 represents an integer of 2 to 10; and n1 represents an integer of 0 to 8. In formula (a2-2), Z represents an organic group having 1 to 6 carbon atoms, and R 23 each independently represents a divalent organic group containing a hydrocarbon group, and R 24 each independently represents at least one selected from the group consisting of a hydrogen atom, an alkyl group, and a halogen atom, m2 represents an integer of 2 to 6, n2 represents an integer of 0 to 4, and m2+n2 is an integer of 2 to 6. [7] The resin composition according to any one of [4] to [6], wherein the monomer composition further contains (a3) ​​an allyl compound containing one or more aromatic rings and two or more allyl groups in one molecule. [8] The resin composition according to [7], wherein the component (a3) ​​is represented by at least one of the following formulas (a3-1) to (a3-6): [ka] (In formula (a3-6), n3 represents an integer of 1 to 1000.) [9] The resin composition according to any one of [1] to [8], wherein the content of component (A) is 0.1% by mass or more and 10% by mass or less, based on 100% by mass of non-volatile components in the resin composition.

[10] The resin composition according to any one of [1] to [9], comprising one or more curing agents (E) selected from the group consisting of phenolic curing agents and carbodiimide curing agents.

[11] The resin composition according to any one of [1] to

[10] , which contains (F) a curing accelerator.

[12] The resin composition according to any one of [1] to

[11] , which contains (G) a thermoplastic resin.

[13] The resin composition according to any one of [1] to

[12] , which is used to form an insulating layer.

[14] A cured product of the resin composition according to any one of [1] to

[13] .

[15] A sheet-like laminate material containing the resin composition according to any one of [1] to

[13] .

[16] A resin sheet comprising a support and a resin composition layer formed on the support from the resin composition according to any one of [1] to

[13] .

[17] A printed wiring board having an insulating layer containing a cured product of the resin composition according to any one of [1] to

[13] .

[18] A semiconductor device comprising the printed wiring board according to

[17] . [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a resin composition that can give a cured product with excellent plating adhesion and that can suppress unevenness after lamination; a cured product of the resin composition; a sheet-like laminate material containing the resin composition; a resin sheet having a resin composition layer formed from the resin composition; a printed wiring board that includes an insulating layer that includes a cured product of the resin composition; and a semiconductor device that includes the printed wiring board. DETAILED DESCRIPTION OF THE INVENTION

[0011] The present invention will be described below with reference to embodiments and examples. However, the present invention is not limited to the embodiments and examples shown below, and can be implemented with any modifications within the scope of the claims and their equivalents.

[0012] In the following description, the term "(meth)acrylate" includes acrylate, methacrylate, and combinations thereof, unless otherwise specified.

[0013] [1. Overview of Resin Composition] A resin composition according to one embodiment of the present invention comprises a combination of (A) a maleimide compound having a sulfur atom and a maleimide group, (B) an epoxy resin, (C) an activated ester compound, and (D) an inorganic filler. In the following description, the (A) maleimide compound having a sulfur atom and a maleimide group as component (A) may be referred to as the "(A) sulfur-containing maleimide compound." This resin composition can suppress unevenness after lamination and produce a cured product with excellent plating adhesion. Furthermore, the cured product of this resin composition typically has a low dielectric loss tangent. Furthermore, the cured product of this resin composition typically has a low surface roughness after roughening treatment.

[0014] The present inventors speculate that the mechanism by which the cured product of the resin composition according to this embodiment provides the above-described excellent advantages is as follows, although the technical scope of the present invention is not limited by the mechanism described below.

[0015] A cured product of a conventional resin composition containing an epoxy resin, an active ester compound, and an inorganic filler can usually have a low dielectric loss tangent. In particular, when the amounts of the active ester and the inorganic filler are large, the dielectric loss tangent of the cured product can be effectively reduced.

[0016] However, when a resin composition layer containing a resin composition containing an epoxy resin, an active ester compound, and an inorganic filler is laminated to an inner layer substrate, unevenness may occur in the resin composition layer after lamination. Furthermore, when a conductor layer is formed on the cured product by plating, the cured product of the resin composition tends to have poor adhesion to the conductor layer.

[0017] In contrast, the resin composition according to the present embodiment further contains (A) a sulfur-containing maleimide compound in combination with (B) an epoxy resin, (C) an active ester compound, and (D) an inorganic filler. Due to the action of sulfur atoms, (A) the sulfur-containing maleimide compound can have high affinity for both (B) the epoxy resin and (C) the active ester compound. This improves the compatibility of the resin components contained in the resin composition, thereby improving the uniformity of the resin composition and making it possible to suppress unevenness.

[0018] Furthermore, the (A) sulfur-containing maleimide compound contained in the resin composition according to this embodiment can bond to itself through a reaction of the maleimide group during curing of the resin composition. Furthermore, when the (A) sulfur-containing maleimide compound has a thiol group, and when the resin composition contains an appropriate curing agent or curing accelerator capable of promoting the reaction between the maleimide group and the epoxy group, the (A) sulfur-containing maleimide compound can react with the (B) epoxy resin to bond. This bonding results in the formation of a crosslinked structure in the cured product, thereby improving the mechanical strength of the cured product. This increases the resistance of the cured product to stress, thereby suppressing delamination (interlayer peeling) that accompanies the destruction of the cured product, thereby improving the adhesion between the conductor layer and the cured product.

[0019] Furthermore, the reaction between the sulfur-containing maleimide compounds (A) that occurs during curing of the resin composition can be primarily a radical polymerization reaction. This radical polymerization reaction typically does not generate polar groups such as hydroxyl groups. Therefore, even if the resin composition contains the sulfur-containing maleimide compound (A), the cured product can have low polarity. Therefore, the cured product of the resin composition typically has a low dielectric loss tangent.

[0020] Furthermore, as described above, the (A) sulfur-containing maleimide compound can have excellent affinity with the (B) epoxy resin and the (C) active ester compound. Therefore, phase separation of the resin components (A), (B), and (C) in the resin composition is suppressed. If large phase separation occurs in the resin components, large phase domains are formed in the cured product, and detachment of each phase domain occurs during roughening treatment, potentially resulting in increased surface roughness. However, in the resin composition according to this embodiment, phase separation of the resin components is suppressed, thereby suppressing the formation of large phase domains. Therefore, a small surface roughness can usually be achieved after roughening treatment.

[0021] [2. (A) Sulfur-containing maleimide compounds] The resin composition according to the present embodiment includes a sulfur-containing maleimide compound (A) as component (A). The sulfur-containing maleimide compound (A) has a sulfur atom and a maleimide group (i.e., a 2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl group).

[0022] The number of sulfur atoms contained in the (A) sulfur-containing maleimide compound per molecule is usually 1 or more, preferably 2 or more, and more preferably 3 or more. There is no particular upper limit to the number of sulfur atoms contained in the (A) sulfur-containing maleimide compound per molecule, and the number may be, for example, 10 or less. The sulfur atom is preferably contained in the (A) sulfur-containing maleimide compound as part of a thiol group (—SH group) or a thioether group (CSC group).

[0023] The number of maleimide groups contained in (A) sulfur-containing maleimide compound may be 1 or 2 or more. The maleimide group is preferably an aromatic maleimide group in which the nitrogen atom of the maleimide group is bonded to an aromatic ring. In particular, the maleimide group contained in (A) sulfur-containing maleimide compound is preferably in a state in which the nitrogen atom of the maleimide group is directly bonded to a carbon atom of a benzene ring.

[0024] The (A) sulfur-containing maleimide compound preferably contains an aromatic ring in its molecule. The aromatic ring may be either an aromatic hydrocarbon ring or an aromatic heterocycle, but is preferably an aromatic hydrocarbon ring. The aromatic hydrocarbon ring may also be an aromatic condensed ring such as a naphthalene ring, but is preferably a monocyclic aromatic hydrocarbon ring, and is particularly preferably a benzene ring.

[0025] The sulfur-containing maleimide compound (A) may contain a hydroxyl group in its molecule, which is preferably a phenolic hydroxyl group bonded to an aromatic ring.

[0026] The (A) sulfur-containing maleimide compound is preferably a polymer of a monomer composition containing (a1) a maleimide compound having two or more maleimide groups per molecule and (a2) a thiol compound having two or more thiol groups per molecule. In the following description, the (a1) maleimide compound having two or more maleimide groups per molecule may be referred to as the "(a1) polyfunctional maleimide compound." Furthermore, the (a2) thiol compound having two or more thiol groups per molecule may be referred to as the "(a2) polyfunctional thiol compound." There are no limitations on the production method of this polymer, as long as it has a structure obtained by polymerizing a monomer composition containing the (a1) polyfunctional maleimide compound and the (a2) polyfunctional thiol compound. Therefore, the polymer is not limited to one produced by a polymerization reaction between the (a1) polyfunctional maleimide compound and the (a2) polyfunctional thiol compound.

[0027] The (a1) polyfunctional maleimide compound is a compound having two or more maleimide groups in one molecule, and is preferably represented by the following formula (a1-1):

[0028] [ka]

[0029] (In formula (a1-1), R 11 ~R 14 each independently represents at least one selected from the group consisting of a hydrogen atom, an alkyl group, and a halogen atom, and X represents a divalent organic group containing an aromatic ring.

[0030] In formula (a1-1), R 11 ~R 14 each independently represents at least one selected from the group consisting of a hydrogen atom, an alkyl group, and a halogen atom. The number of carbon atoms in the alkyl group is preferably 1 to 6, more preferably 1 to 4, and particularly preferably 1 to 3. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Preferably, R 11 ~R 14 each independently represents at least one selected from the group consisting of a hydrogen atom, a methyl group, an ethyl group, a propyl group, a fluorine atom (fluoro group), a chlorine atom (chloro group), a bromine atom (bromo group), and an iodine atom (iodo group).

[0031] In formula (a1-1), X represents a divalent organic group containing an aromatic ring. The number of aromatic rings contained in X may be 1 or 2 or more. When X contains two or more aromatic rings, the aromatic rings may be bonded to each other via a linking group such as an ether group (-O-), an ester group (-O-CO-), an amide group (-CO-N-), a carbonyl group (-CO-), an azamethylene group (e.g., -NH-), or an alkylene group (e.g., -CH2-), or may be bonded directly. The aromatic ring contained in X may be an aromatic hydrocarbon ring such as a benzene ring, a naphthalene ring, an anthracene ring, or a phenanthrene ring, or may be a heteroaromatic ring.

[0032] Specific examples of X include groups represented by the following formulae (a1-1-1) to (a1-1-6). In formulae (a1-1-1) to (a1-1-6), R 15 each independently represents at least one selected from the group consisting of a hydrogen atom, an alkyl group such as a methyl group, an ethyl group, a propyl group, or a butyl group, and an alkoxy group such as a methoxy group, an ethoxy group, a propoxy group, or a butoxy group. * represents a bond.

[0033] [ka]

[0034] A preferred example of the (a1) polyfunctional maleimide compound is 4,4'-diphenylmethane bismaleimide. The (a1) polyfunctional maleimide compound may be used alone or in combination of two or more.

[0035] The (a2) polyfunctional thiol compound is a compound having two or more thiol groups in one molecule. The (a2) polyfunctional thiol compound is preferably represented by the following formula (a2-1) or (a2-2).

[0036] [ka]

[0037] (In formula (a2-1), Y represents an organic group having a cyclic structure; R 21 each independently represents a divalent organic group containing a hydrocarbon group, R 22 each independently represents at least one selected from the group consisting of a hydrogen atom, an alkyl group, and a halogen atom, m1 represents an integer of 2 to 10; n1 represents an integer from 0 to 8.

[0038] In formula (a2-1), Y represents an organic group having a cyclic structure. The valence of the organic group represented by Y is usually m1+n1. The cyclic structure of the organic group Y may be an alicyclic structure or an aromatic ring structure. Furthermore, the cyclic structure of the organic group Y may be a hydrocarbon ring structure or a heterocyclic structure. Furthermore, the cyclic structure of the organic group Y may be a monocyclic structure or a polycyclic structure.

[0039] Examples of the organic group Y having an aromatic ring structure include groups in which any number of hydrogen atoms have been removed from the structures represented by the following formulae (a2-1-1) to (a2-1-4).

[0040] [ka]

[0041] Examples of the organic group Y having a heterocyclic structure include groups represented by the following formulae (a2-1-5) to (a2-1-6). When the organic group Y has a structure represented by the above formulae (a2-1-5) to (a2-1-6), all of the nitrogen atoms contained in the ring are bonded to (-R 21 -SH) is preferably bonded.

[0042] [ka]

[0043] Examples of the organic group Y having a polycyclic structure include groups represented by the following formulae (a2-1-7) to (a2-1-10): Further examples of the organic group Y having a polycyclic structure include groups having a structure in which 2 to 10 hydrogen atoms have been arbitrarily removed from a spiro compound.

[0044] [ka]

[0045] In formula (a2-1), R 21 each independently represents a divalent organic group containing a hydrocarbon group. 21Examples of the hydrocarbon group contained in the organic group R include a chain aliphatic hydrocarbon group, an aliphatic hydrocarbon group containing a cyclic structure, and an aromatic hydrocarbon group. 21 The organic group R may contain one of the above hydrocarbon groups alone or two or more of them in combination. 21 The multiple hydrocarbon groups contained in may be bonded directly or via a bond selected from the group consisting of an ester bond, an ether bond, an amide bond and a urethane bond.

[0046] organic group R 21 is preferably a straight-chain alkylene group which may contain one or more bonds selected from the group consisting of an ester bond, an ether bond, an amide bond, and a urethane bond. It is also preferred that the ester bond, the ether bond, the amide bond, and the urethane bond are not directly bonded to the nitrogen atom on the isocyanuric ring or the sulfur atom constituting the thiol group.

[0047] organic group R 21 When the organic group R is a linear alkylene group which may contain one or more bonds selected from the group consisting of an ester bond, an ether bond, an amide bond and a urethane bond, the number of carbon atoms in the linear alkylene group is preferably 2 to 12. 21 When the organic group R contains bonds such as ester bonds, ether bonds, amide bonds, and urethane bonds, the carbon atoms forming the ester bonds, amide bonds, and urethane bonds are not included in the number of carbon atoms of the linear alkylene group. 21 is a linear alkylene group having 12 carbon atoms and containing one ester bond, the organic group R 21 The total number of carbon atoms is 13.

[0048] Examples of linear alkylene groups having 2 to 12 carbon atoms include ethylene, propylene, butylene, pentylene, hexylene, heptylene, octylene, nonylene, decylene, undecylene, and dodecylene. Examples of linear alkylene groups that may contain one or more bonds selected from the group consisting of ester bonds, ether bonds, amide bonds, and urethane bonds include those described in JP 2016-74902 A. Among these, the organic group R 21 As the alkyl group, a linear alkylene group having 2 to 12 carbon atoms and containing an ester bond is preferred.

[0049] Among the linear alkylene groups having 2 to 12 carbon atoms containing an ester bond, the organic group R 21 Particularly preferred examples of the alkyl group include a 2-oxa-3-oxopentylene group (-CH2-O-CO-C2H4-), a 3-oxa-4-oxopentylene group (-C2H4-O-CO-CH2-), a 2-oxa-3-oxohexylene group (-CH2-O-CO-n-C3H6-), a 3-oxa-4-oxohexylene group (-C2H4-O-CO-C2H4-), a 2-oxa-3-oxoheptylene group (-CH2-O-CO-n-C4H8-), a 3-oxa-4-oxoheptylene group (-C2H4-O-CO-n-C3H6-), a 2-oxa-3-oxooctylene group (-CH2-O-CO-n-C5H 10 -) and 3-oxo-4-oxooctylene group (-C2H4-O-CO-n-C4H8-).

[0050] In formula (a2-1), R 22 each independently represents at least one selected from the group consisting of a hydrogen atom, an alkyl group, and a halogen atom. The number of carbon atoms in the alkyl group is preferably 1 to 6, more preferably 1 to 4, and even more preferably 1 to 3. Examples of the alkyl group include a methyl group, an ethyl group, a propyl group, a butyl group, a pentyl group, and a hexyl group. Examples of the halogen atom include a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom. Preferably, R 22each independently represents at least one selected from the group consisting of a hydrogen atom, a methyl group, an ethyl group, a propyl group, a fluorine atom, a chlorine atom, a bromine atom, and an iodine atom.

[0051] In formula (a2-1), m1 represents an integer of 2 to 10, and preferably an integer of 2 to 5. Furthermore, n1 represents an integer of 0 to 8.

[0052] Examples of the (a2) polyfunctional thiol compound represented by formula (a2-1) include tris-[(3-mercaptopropionyloxy)-ethyl]-isocyanurate, 1,3,5-tris(mercaptomethyl)benzene, 1,3-bis(mercaptomethyl)benzene, 1,4-bis(mercaptomethyl)benzene, and 1,3,4,6-tetrakis(mercaptoethyl)glycoluril.

[0053] [ka]

[0054] (In formula (a2-2), Z represents an organic group having 1 to 6 carbon atoms; R 23 each independently represents a divalent organic group containing a hydrocarbon group, R 24 each independently represents at least one selected from the group consisting of a hydrogen atom, an alkyl group, and a halogen atom, m2 represents an integer of 2 to 6; n2 represents an integer of 0 to 4, m2+n2 is an integer from 2 to 6.

[0055] In formula (a2-2), Z represents an organic group having 1 to 6 carbon atoms. The valence of the organic group represented by Z is usually m2 + n2. The organic group Z may contain one or more bonds selected from the group consisting of an ester bond, an ether bond, an amide bond, and a urethane bond. The organic group Z is preferably a linear aliphatic hydrocarbon group which may contain one or more bonds selected from the group consisting of an ester bond, an ether bond, an amide bond, and a urethane bond. The linear aliphatic hydrocarbon group preferably has 1 to 4 carbon atoms. The organic group Z is particularly preferably a linear aliphatic hydrocarbon group containing an ether bond, and for example, a group obtained by removing six hydroxymethyl groups (—CH2—OH) from dipentaerythritol (a group represented by formula (a2-2-1) below) is preferred.

[0056] [ka]

[0057] In formula (a2-2), R 23 each independently represents a divalent organic group containing a hydrocarbon group. 23 The range of the organic group R 21 It can be the same as:

[0058] In formula (a2-2), R 24 R each independently represents at least one selected from the group consisting of a hydrogen atom, an alkyl group, and a halogen atom. 24 The range of R in formula (a2-1) 22 It can be the same as:

[0059] In formula (a2-2), m2 represents an integer of 2 to 6. The integer m2 is preferably 3 to 6, more preferably 4 to 6, and particularly preferably 6. In formula (a2-2), n2 represents an integer of 0 to 4, provided that m2+n2 is an integer of 2 to 6.

[0060] Examples of the polyfunctional thiol compound (a2) represented by the above formula (a2-2) include trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptopropionate), tetraethylene glycol bis(3-mercaptopropionate), and dipentaerythritol hexakis(3-mercaptopropionate).

[0061] The (a2) polyfunctional thiol compound may be used alone or in combination of two or more.

[0062] The ratio of the amounts of the (a1) polyfunctional maleimide compound and the (a2) polyfunctional thiol compound contained in the monomer composition is not limited as long as it does not significantly impair the effects of the present invention. Specific ranges include the mass ratio of the (a1) polyfunctional maleimide compound to the (a2) polyfunctional thiol compound ((a2) polyfunctional thiol compound / (a1) polyfunctional maleimide compound) is preferably 1 / 200 or more, more preferably 1 / 160 or more, even more preferably 1 / 100 or more, even more preferably 1 / 80 or more, and particularly preferably 1 / 40 or more, and is preferably less than 1, more preferably 3 / 4 or less, even more preferably 1 / 2 or less, and particularly preferably 1 / 4 or less.

[0063] The monomer composition preferably further comprises (a3) ​​an allyl compound containing one or more aromatic rings and two or more allyl groups in one molecule in combination with (a1) a polyfunctional maleimide compound and (a2) a polyfunctional thiol compound. In the following description, (a3) ​​an allyl compound containing one or more aromatic rings and two or more allyl groups in one molecule may be referred to as "(a3) a polyfunctional allyl compound."

[0064] The aromatic ring contained in the (a3) ​​polyfunctional allyl compound is preferably an aromatic hydrocarbon ring, more preferably a benzene ring. Examples of (a3) ​​polyfunctional allyl compounds containing one or more benzene rings and two or more allyl groups per molecule include diallylated bisphenol compounds such as diallylated bisphenol A, diallylated bisphenol AP, diallylated bisphenol AF, diallylated bisphenol B, diallylated bisphenol BP, diallylated bisphenol C, diallylated bisphenol E, diallylated bisphenol F, diallylated bisphenol G, diallylated bisphenol M, diallylated bisphenol S, diallylated bisphenol P, diallylated bisphenol PH, diallylated bisphenol TM, and diallylated bisphenol Z; benzenepoly(2-6)carboxylic acid poly(2-6) allyl ester; and allylated novolak. Specific examples of (a3) ​​polyfunctional allyl compounds include those described in JP 2016-74902 A.

[0065] Among them, the (a3) ​​polyfunctional allyl compound is preferably one represented by the following formulas (a3-1) to (a3-6). Therefore, the monomer composition preferably contains the (a3) ​​polyfunctional allyl compound represented by at least one of formulas (a3-1) to (a3-6). In the following formula (a3-6), n3 represents an integer of 1 to 1000.

[0066] [ka]

[0067] The (a3) ​​polyfunctional allyl compound may be used alone or in combination of two or more.

[0068] The ratio of the amounts of the (a1) polyfunctional maleimide compound and the (a3) ​​polyfunctional allyl compound contained in the monomer composition is not limited as long as it does not significantly impair the effects of the present invention. Specifically, the mass ratio of the (a1) polyfunctional maleimide compound to the (a3) ​​polyfunctional allyl compound ((a3) polyfunctional allyl compound / (a1) polyfunctional maleimide compound) may be 0 or more, preferably 1 / 10 or more, more preferably 1 / 8 or more, and particularly preferably 1 / 4 or more, and is preferably 2 or less, more preferably 1 or less, and particularly preferably 1 / 2 or less.

[0069] The ratio of the amounts of the (a2) polyfunctional thiol compound and the (a3) ​​polyfunctional allyl compound contained in the monomer composition is not limited as long as it does not significantly impair the effects of the present invention. Specifically, the mass ratio of the (a2) polyfunctional thiol compound and the (a3) ​​polyfunctional allyl compound ((a3) polyfunctional allyl compound / (a2) polyfunctional thiol compound) may be 0 or more, preferably 2 / 3 or more, more preferably 1 or more, and particularly preferably 2 or more, and is preferably 20 or less, more preferably 10 or less.

[0070] In the polymerization of the monomer composition, the monomers (a1) to (a3) ​​contained in the monomer composition can be polymerized. For example, the maleimide group of the (a1) polyfunctional maleimide compound can react with the thiol group of the (a2) polyfunctional thiol compound, resulting in polymerization of the (a1) polyfunctional maleimide compound and the (a2) polyfunctional thiol compound. Furthermore, the maleimide group of the (a1) polyfunctional maleimide compound can react with the allyl group of the (a3) ​​polyfunctional allyl compound, resulting in polymerization of the (a1) polyfunctional maleimide compound and the (a3) ​​polyfunctional allyl compound. Furthermore, the thiol group of the (a2) polyfunctional thiol compound can react with the allyl group of the (a3) ​​polyfunctional allyl compound, resulting in polymerization of the (a2) polyfunctional thiol compound and the (a3) ​​polyfunctional allyl compound. Therefore, the polymer of the monomer composition may contain maleimide groups derived from the (a1) polyfunctional maleimide compound and sulfur atoms derived from the (a2) polyfunctional thiol compound, and thus the polymer can be a sulfur-containing maleimide compound (A). The polymerization can be carried out, for example, by heating the monomer composition in an appropriate environment.

[0071] Commercially available examples of the sulfur-containing maleimide compound (A) include "SA IMIDE 105HG" and "SA IMIDE 1705" manufactured by Sakai Chemical Industry Co., Ltd. The "SA IMIDE 105HG" and "SA IMIDE 1705" are compounds obtained by polymerizing a monomer composition containing a polyfunctional maleimide compound (4,4'-diphenylmethane bismaleimide) (a1) represented by the following formula (a-1), a polyfunctional thiol compound (tris-[(3-mercaptopropyloxy)-ethyl]isocyanurate) (a2) represented by the formula (a-2), and a polyfunctional allyl compound (diallyl bisphenol A) (a3) ​​represented by the formula (a-3).

[0072] [ka]

[0073] The (A) sulfur-containing maleimide compound may be used alone or in combination of two or more.

[0074] From the viewpoint of significantly achieving the desired effects of the present invention, the weight-average molecular weight of the (A) sulfur-containing maleimide compound is preferably at least 500, more preferably at least 800, particularly preferably at least 1000, and is preferably at most 5000, more preferably at most 4000, particularly preferably at most 3000. The weight-average molecular weight of the resin can be measured as a polystyrene-equivalent value by gel permeation chromatography (GPC).

[0075] Mass W of the sulfur-containing maleimide compound (A) in the resin composition A and (B) the mass of the epoxy resin W B Mass ratio W A / W B is preferably 0.01 or more, more preferably 0.05 or more, even more preferably 0.10 or more, particularly preferably 0.15 or more, and is preferably 1.0 or less, more preferably 0.6 or less, even more preferably 0.4 or less, particularly preferably 0.3 or less. A / W B When the content of the acrylic resin is in the above range, it is possible to obtain remarkable effects such as suppression of unevenness after lamination, improvement of plating adhesion of the cured product, reduction of the dielectric loss tangent of the cured product, and reduction of surface roughness after roughening treatment.

[0076] Mass W of the sulfur-containing maleimide compound (A) in the resin composition A and (C) the mass of the active ester compound W C Mass ratio W A / W C is preferably 0.01 or more, more preferably 0.02 or more, even more preferably 0.04 or more, particularly preferably 0.06 or more, and is preferably 1.0 or less, more preferably 0.5 or less, even more preferably 0.2 or less, particularly preferably 0.1 or less. A / W C When the content of the acrylic resin is in the above range, it is possible to obtain remarkable effects such as suppression of unevenness after lamination, improvement of plating adhesion of the cured product, reduction of the dielectric loss tangent of the cured product, and reduction of surface roughness after roughening treatment.

[0077] Mass W of the sulfur-containing maleimide compound (A) in the resin composition A and (B) the mass of the epoxy resin and (C) the total mass W of the active ester compound. B +W C Mass ratio W A / (W B +W C ) is preferably 0.01 or more, more preferably 0.02 or more, even more preferably 0.03 or more, particularly preferably 0.04 or more, and is preferably 1.0 or less, more preferably 0.5 or less, even more preferably 0.2 or less, particularly preferably 0.1 or less. A / (W B +W C ) is within the above range, it is possible to obtain significant effects such as suppression of unevenness after lamination, improvement of plating adhesion of the cured product, reduction of the dielectric loss tangent of the cured product, and reduction of surface roughness after roughening treatment.

[0078] Mass W of the sulfur-containing maleimide compound (A) in the resin composition A and (D) the mass W of the inorganic filler D Mass ratio W A / W D is preferably 0.01 or more, more preferably 0.02 or more, and is preferably 0.1 or less, more preferably 0.05 or less, and particularly preferably 0.03 or less. A / W D When the content of the acrylic resin is in the above range, it is possible to obtain remarkable effects such as suppression of unevenness after lamination, improvement of plating adhesion of the cured product, reduction of the dielectric loss tangent of the cured product, and reduction of surface roughness after roughening treatment.

[0079] The content of the (A) sulfur-containing maleimide compound in the resin composition is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, particularly preferably 1.0% by mass or more, and is preferably 10% by mass or less, more preferably 5% by mass or less, even more preferably 3% by mass or less, particularly preferably 2% by mass or less, based on 100% by mass of the nonvolatile components in the resin composition. When the content of the (A) sulfur-containing maleimide compound is within the above range, significant effects can be obtained, such as suppression of unevenness after lamination, improvement of plating adhesion of the cured product, reduction of the dielectric loss tangent of the cured product, and reduction of surface roughness after roughening treatment.

[0080] The content of the (A) sulfur-containing maleimide compound in the resin composition is preferably 0.1% by mass or more, more preferably 1.0% by mass or more, particularly preferably 2.0% by mass or more, and is preferably 20% by mass or less, more preferably 15% by mass or less, even more preferably 10% by mass or less, particularly preferably 8% by mass or less, based on 100% by mass of the resin components in the resin composition. The resin components of the resin composition refer to the non-volatile components of the resin composition excluding the (D) inorganic filler. When the content of the (A) sulfur-containing maleimide compound is within the above range, significant effects can be obtained, such as suppression of unevenness after lamination, improvement of plating adhesion of the cured product, reduction of the dielectric loss tangent of the cured product, and reduction of surface roughness after roughening treatment.

[0081] [3. (B) Epoxy Resin] The resin composition according to this embodiment contains an epoxy resin (B) as component (B). The epoxy resin (B) can be a curable resin having an epoxy group.

[0082] Examples of (B) epoxy resins include bixylenol-type epoxy resins, bisphenol A-type epoxy resins, bisphenol F-type epoxy resins, bisphenol S-type epoxy resins, bisphenol AF-type epoxy resins, dicyclopentadiene-type epoxy resins, trisphenol-type epoxy resins, naphthol novolac-type epoxy resins, phenol novolac-type epoxy resins, tert-butyl-catechol-type epoxy resins, naphthalene-type epoxy resins, naphthol-type epoxy resins, anthracene-type epoxy resins, glycidylamine-type epoxy resins, glycidyl ester-type epoxy resins, cresol novolac-type epoxy resins, phenol aralkyl-type epoxy resins, biphenyl-type epoxy resins, linear aliphatic epoxy resins, epoxy resins having a butadiene structure, alicyclic epoxy resins, heterocyclic epoxy resins, spiro ring-containing epoxy resins, cyclohexane-type epoxy resins, cyclohexane dimethanol-type epoxy resins, naphthylene ether-type epoxy resins, trimethylol-type epoxy resins, tetraphenylethane-type epoxy resins, isocyanurate-type epoxy resins, and phenolphthalimidine-type epoxy resins. The (B) epoxy resin may be used alone or in combination of two or more.

[0083] From the viewpoint of obtaining a cured product having excellent heat resistance, the (B) epoxy resin preferably contains an epoxy resin containing an aromatic structure. The aromatic structure is a chemical structure generally defined as aromatic, and also includes polycyclic aromatic rings and aromatic heterocycles. Examples of epoxy resins containing an aromatic structure include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol S type epoxy resins, bisphenol AF type epoxy resins, dicyclopentadiene type epoxy resins, trisphenol type epoxy resins, naphthol novolac type epoxy resins, phenol novolac type epoxy resins, tert-butyl-catechol type epoxy resins, naphthalene type epoxy resins, naphthol type epoxy resins, anthracene type epoxy resins, bisxyleneol type epoxy resins, glycidylamine type epoxy resins having an aromatic structure, glycidyl ester type epoxy resins having an aromatic structure, cresol novolac type epoxy resins, biphenyl type epoxy resins, linear aliphatic epoxy resins having an aromatic structure, epoxy resins having a butadiene structure having an aromatic structure, alicyclic epoxy resins having an aromatic structure, heterocyclic epoxy resins, spiro ring-containing epoxy resins having an aromatic structure, cyclohexanedimethanol type epoxy resins having an aromatic structure, naphthylene ether type epoxy resins, trimethylol type epoxy resins having an aromatic structure, and tetraphenylethane type epoxy resins having an aromatic structure.

[0084] The resin composition preferably contains, as the (B) epoxy resin, an epoxy resin having two or more epoxy groups per molecule. The proportion of the epoxy resin having two or more epoxy groups per molecule relative to 100% by mass of the non-volatile components of the (B) epoxy resin is preferably 50% by mass or more, more preferably 60% by mass or more, and particularly preferably 70% by mass or more.

[0085] Epoxy resins include epoxy resins that are liquid at a temperature of 20°C (hereinafter sometimes referred to as "liquid epoxy resins") and epoxy resins that are solid at a temperature of 20°C (hereinafter sometimes referred to as "solid epoxy resins"). The resin composition may contain only a liquid epoxy resin as the epoxy resin, or may contain only a solid epoxy resin, or may contain a combination of a liquid epoxy resin and a solid epoxy resin.

[0086] The liquid epoxy resin is preferably a liquid epoxy resin having two or more epoxy groups in one molecule.

[0087] Preferred liquid epoxy resins include bisphenol A type epoxy resins, bisphenol F type epoxy resins, bisphenol AF type epoxy resins, naphthalene type epoxy resins, glycidyl ester type epoxy resins, glycidyl amine type epoxy resins, phenol novolac type epoxy resins, alicyclic epoxy resins having an ester skeleton, cyclohexane type epoxy resins, cyclohexane dimethanol type epoxy resins, and epoxy resins having a butadiene structure.

[0088] Specific examples of liquid epoxy resins include "HP4032", "HP4032D", and "HP4032SS" (naphthalene type epoxy resins) manufactured by DIC Corporation; "828US", "828EL", "jER828EL", "825", and "Epikote 828EL" (bisphenol A type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER807" and "1750" (bisphenol F type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "jER152" (phenol novolac type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "630", "630LSD", and "604" (glycidylamine type epoxy resins) manufactured by Mitsubishi Chemical Corporation; "ED-523T" (glycyrol type epoxy resin) manufactured by ADEKA Corporation; and "EP-3950L" and "EP-3980S" ( Examples of epoxy resins include glycidylamine epoxy resins, ADEKA's "EP-4088S" (dicyclopentadiene epoxy resin), Nippon Steel Chemical & Material's "ZX1059" (a mixture of bisphenol A and bisphenol F epoxy resins), Nagase ChemteX's "EX-721" (glycidyl ester epoxy resin), Daicel's "Celloxide 2021P" (alicyclic epoxy resin with an ester structure), Daicel's "PB-3600," Nippon Soda's "JP-100" and "JP-200" (epoxy resins with a butadiene structure), and Nippon Steel Chemical & Material's "ZX1658" and "ZX1658GS" (liquid 1,4-glycidylcyclohexane epoxy resin). These may be used alone or in combination.

[0089] As the solid epoxy resin, a solid epoxy resin having three or more epoxy groups in one molecule is preferred, and an aromatic solid epoxy resin having three or more epoxy groups in one molecule is more preferred.

[0090] Preferred solid epoxy resins include bixylenol-type epoxy resins, naphthalene-type epoxy resins, naphthalene-type tetrafunctional epoxy resins, naphthol novolac-type epoxy resins, cresol novolac-type epoxy resins, dicyclopentadiene-type epoxy resins, trisphenol-type epoxy resins, naphthol-type epoxy resins, biphenyl-type epoxy resins, naphthylene ether-type epoxy resins, anthracene-type epoxy resins, bisphenol A-type epoxy resins, bisphenol AF-type epoxy resins, phenol aralkyl-type epoxy resins, tetraphenylethane-type epoxy resins, and phenolphthalimidine-type epoxy resins.

[0091] Specific examples of solid epoxy resins include DIC Corporation's "HP4032H" (naphthalene-type epoxy resin); DIC Corporation's "HP-4700" and "HP-4710" (naphthalene-type tetrafunctional epoxy resins); DIC Corporation's "N-690" (cresol novolac-type epoxy resin); DIC Corporation's "N-695" (cresol novolac-type epoxy resin); DIC Corporation's "HP-7200," "HP-7200HH," "HP-7200H," and "HP-7200L" (dicyclopentadiene-type epoxy resins); and DIC Corporation's "EXA-7311." "EXA-7311-G3", "EXA-7311-G4", "EXA-7311-G4S", "HP6000" (naphthylene ether type epoxy resin); "EPPN-502H" (trisphenol type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC7000L" (naphthol novolac type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "NC3000H", "NC3000", "NC3000L", "NC3000FH", "NC3100" (biphenyl type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.; "ESN475V", "ESN4" manufactured by Nippon Steel Chemical & Material Co., Ltd. 100V" (naphthalene-type epoxy resin); "ESN485" (naphthol-type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "ESN375" (dihydroxynaphthalene-type epoxy resin) manufactured by Nippon Steel Chemical & Material Co., Ltd.; "YX4000H", "YX4000", "YX4000HK", and "YL7890" (bixylenol-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL6121" (biphenyl-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YX8800" (anthracene-type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "Y" manufactured by Mitsubishi Chemical Corporation Examples include "X7700" (phenol aralkyl type epoxy resin); "PG-100" and "CG-500" manufactured by Osaka Gas Chemicals Co., Ltd.; "YL7760" (bisphenol AF type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "YL7800" (fluorene type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1010" (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Corporation; "jER1031S" (tetraphenylethane type epoxy resin) manufactured by Mitsubishi Chemical Corporation; and "WHR991S" (phenolphthalimidine type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.These may be used alone or in combination of two or more.

[0092] When a liquid epoxy resin and a solid epoxy resin are used in combination as the (B) epoxy resin, the mass ratio thereof (liquid epoxy resin:solid epoxy resin) is preferably 20:1 to 1:20, more preferably 10:1 to 1:10, and particularly preferably 7:1 to 1:7.

[0093] The epoxy equivalent of the (B) epoxy resin is preferably 50 g / eq. to 5,000 g / eq., more preferably 60 g / eq. to 3,000 g / eq., even more preferably 80 g / eq. to 2,000 g / eq., and particularly preferably 110 g / eq. to 1,000 g / eq. The epoxy equivalent represents the mass of the resin per equivalent of epoxy groups. This epoxy equivalent can be measured according to JIS K7236.

[0094] The weight average molecular weight (Mw) of the (B) epoxy resin is preferably 100 to 5,000, more preferably 250 to 3,000, and even more preferably 400 to 1,500. The weight average molecular weight of the resin can be measured by gel permeation chromatography (GPC) as a polystyrene-equivalent value.

[0095] The content of the (B) epoxy resin in the resin composition is preferably 1% by mass or more, more preferably 2% by mass or more, particularly preferably 4% by mass or more, and is preferably 20% by mass or less, more preferably 15% by mass or less, particularly preferably 10% by mass or less, based on 100% by mass of the nonvolatile components in the resin composition. When the amount of the (B) epoxy resin is within the above range, significant effects can be achieved, such as suppression of unevenness after lamination, improvement of plating adhesion of the cured product, reduction of the dielectric loss tangent of the cured product, and reduction of surface roughness after roughening treatment.

[0096] The content of the (B) epoxy resin in the resin composition is preferably 5% by mass or more, more preferably 10% by mass or more, and particularly preferably 20% by mass or more, and is preferably 70% by mass or less, more preferably 50% by mass or less, and particularly preferably 30% by mass or less, based on 100% by mass of the resin components in the resin composition. When the amount of the (B) epoxy resin is within the above range, significant effects can be obtained, such as suppression of unevenness after lamination, improvement of plating adhesion of the cured product, reduction of the dielectric loss tangent of the cured product, and reduction of surface roughness after roughening treatment.

[0097] [4. (C) Active Ester Compounds] The resin composition according to the present embodiment includes an active ester compound (C) as component (C). The active ester compound (C) can function as an epoxy resin curing agent that reacts with the epoxy resin (B) to cure the resin composition. The active ester compound (C) may be used alone or in combination of two or more.

[0098] As the (C) active ester compound, compounds having two or more highly reactive ester groups per molecule, such as phenol esters, thiophenol esters, N-hydroxyamine esters, and esters of heterocyclic hydroxy compounds, are generally preferred. The active ester compound is preferably one obtained by a condensation reaction between a carboxylic acid compound and / or a thiocarboxylic acid compound and a hydroxy compound and / or a thiol compound. From the viewpoint of improving heat resistance, active ester compounds obtained from a carboxylic acid compound and a hydroxy compound are preferred, and active ester compounds obtained from a carboxylic acid compound and a phenol compound and / or a naphthol compound are more preferred. Examples of carboxylic acid compounds include benzoic acid, acetic acid, succinic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, and pyromellitic acid. Examples of phenol compounds or naphthol compounds include hydroquinone, resorcinol, bisphenol A, bisphenol F, bisphenol S, phenolphthalene, methylated bisphenol A, methylated bisphenol F, methylated bisphenol S, phenol, o-cresol, m-cresol, p-cresol, catechol, α-naphthol, β-naphthol, 1,5-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 2,6-dihydroxynaphthalene, dihydroxybenzophenone, trihydroxybenzophenone, tetrahydroxybenzophenone, phloroglucin, benzenetriol, dicyclopentadiene-type diphenol compounds, and phenol novolak. Here, "dicyclopentadiene-type diphenol compounds" refers to diphenol compounds obtained by condensing one dicyclopentadiene molecule with two phenol molecules.

[0099] Specifically, the (C) active ester compound is preferably a dicyclopentadiene-type active ester compound, a naphthalene-type active ester compound containing a naphthalene structure, an active ester compound containing an acetylated product of phenol novolac, or an active ester compound containing a benzoylated product of phenol novolac, and among these, at least one selected from a dicyclopentadiene-type active ester compound and a naphthalene-type active ester compound is more preferred. As the dicyclopentadiene-type active ester compound, an active ester compound containing a dicyclopentadiene-type diphenol structure is preferred.

[0100] Commercially available (C) active ester compounds include, for example, active ester compounds containing a dicyclopentadiene-type diphenol structure such as "EXB9451," "EXB9460," "EXB9460S," "EXB-8000L," "EXB-8000L-65M," "EXB-8000L-65TM," "HPC-8000L-65TM," "HPC-8000," "HPC-8000-65T," "HPC-8000H," and "HPC-8000H-65TM" (manufactured by DIC Corporation); and active ester compounds containing a naphthalene structure such as "HP-B-8151-62T," "EXB-8100L-65T," "EXB-8150-60T," and "EXB-81 Examples of such active ester compounds include "EXB-9416-70BK", "HPC-8150-60T", "HPC-8150-62T", and "EXB-8" (manufactured by DIC Corporation); an active ester compound containing phosphorus, such as "EXB9401" (manufactured by DIC Corporation); an active ester compound which is an acetylated product of phenol novolac, such as "DC808" (manufactured by Mitsubishi Chemical Corporation); active ester compounds which are benzoylated products of phenol novolac, such as "YLH1026", "YLH1030", and "YLH1048" (manufactured by Mitsubishi Chemical Corporation); and an active ester compound containing a styryl group and a naphthalene structure, such as "PC1300-02-65MA" (manufactured by Air Water Inc.).

[0101] The active ester group equivalent of the (C) active ester compound is preferably 50 g / eq. to 500 g / eq., more preferably 50 g / eq. to 400 g / eq., and even more preferably 100 g / eq. to 300 g / eq. The active ester group equivalent represents the mass of the active ester compound per equivalent of the active ester group.

[0102] When the number of epoxy groups in the (B) epoxy resin is taken as 1, the number of active ester groups in the (C) active ester compound is preferably 0.1 or more, more preferably 0.5 or more, even more preferably 1.0 or more, and preferably 5.0 or less, more preferably 4.0 or less, and particularly preferably 3.0 or less. The "number of epoxy groups in the (B) epoxy resin" refers to the total value obtained by dividing the mass of the non-volatile components of the (B) epoxy resin present in the resin composition by the epoxy equivalent. Furthermore, the "number of active ester groups in the (C) active ester compound" refers to the total value obtained by dividing the mass of the non-volatile components of the (C) active ester compound present in the resin composition by the active ester group equivalent.

[0103] The content of the (C) active ester compound in the resin composition is preferably 10% by mass or more, more preferably 12% by mass or more, even more preferably 14% by mass or more, particularly preferably 16% by mass or more, and is preferably 35% by mass or less, more preferably 30% by mass or less, even more preferably 25% by mass or less, particularly preferably 20% by mass or less, based on 100% by mass of the nonvolatile components in the resin composition. When the amount of the (C) active ester compound is within the above range, significant effects can be obtained, such as suppression of unevenness after lamination, improvement of plating adhesion of the cured product, reduction of the dielectric loss tangent of the cured product, and reduction of surface roughness after roughening treatment.

[0104] The content of the (C) active ester compound in the resin composition is preferably 25% by mass or more, more preferably 30% by mass or more, even more preferably 40% by mass or more, particularly preferably 50% by mass or more, and is preferably 90% by mass or less, more preferably 80% by mass or less, even more preferably 75% by mass or less, particularly preferably 70% by mass or less, based on 100% by mass of the resin components in the resin composition. When the amount of the (C) active ester compound is within the above range, significant effects can be obtained, such as suppression of unevenness after lamination, improvement of plating adhesion of the cured product, reduction of the dielectric loss tangent of the cured product, and reduction of surface roughness after roughening treatment.

[0105] [5.(D) Inorganic filler] The resin composition according to this embodiment contains (D) an inorganic filler. (D) The inorganic filler is usually contained in the resin composition in the form of particles.

[0106] (D) Inorganic fillers are inorganic compounds. Examples of (D) inorganic filler materials include silica, alumina, glass, cordierite, silicon oxide, barium sulfate, barium carbonate, talc, clay, mica powder, zinc oxide, hydrotalcite, boehmite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, magnesium oxide, boron nitride, aluminum nitride, manganese nitride, aluminum borate, strontium carbonate, strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, zirconium oxide, barium titanate, barium titanate zirconate, barium zirconate, calcium zirconate, zirconium phosphate, and zirconium tungstate phosphate. Among these, silica and alumina are preferred, and silica is particularly preferred. Examples of silica include amorphous silica, fused silica, crystalline silica, synthetic silica, and hollow silica. Spherical silica is preferred. The (D) inorganic filler may be used alone or in combination of two or more.

[0107] (D) Examples of commercially available inorganic fillers include "UFP-30" manufactured by Denka Chemical Industry Co., Ltd.; "SP60-05" and "SP507-05" manufactured by Nippon Steel & Sumikin Materials Co., Ltd.; "YC100C", "YA050C", "YA050C-MJE", and "YA010C" manufactured by Admatechs Co., Ltd.; "UFP-30" manufactured by Denka Company Limited; "Silfil NSS-3N", "Silfil NSS-4N", and "Silfil NSS-5N" manufactured by Tokuyama Corporation; "SC2500SQ", "SO-C4", "SO-C2", and "SO-C1" manufactured by Admatechs Co., Ltd.; and "DAW-03" and "FB-105FD" manufactured by Denka Company Limited.

[0108] From the viewpoint of significantly achieving the desired effects of the present invention, the average particle size of (D) the inorganic filler is preferably 0.01 μm or more, more preferably 0.05 μm or more, even more preferably 0.1 μm or more, particularly preferably 0.2 μm or more, and is preferably 10 μm or less, more preferably 5 μm or less, even more preferably 2 μm or less, particularly preferably 1 μm or less.

[0109] (D) The average particle size of an inorganic filler can be measured by a laser diffraction / scattering method based on Mie scattering theory. Specifically, a volumetric particle size distribution of the inorganic filler is created using a laser diffraction / scattering particle size distribution analyzer, and the median diameter is used as the average particle size. A measurement sample can be prepared by weighing 100 mg of inorganic filler and 10 g of methyl ethyl ketone into a vial and dispersing the mixture ultrasonically for 10 minutes. The volumetric particle size distribution of the inorganic filler is measured using a laser diffraction particle size distribution analyzer with blue and red wavelength light sources using a flow cell system, and the average particle size can be calculated as the median diameter from the particle size distribution obtained. Examples of laser diffraction particle size distribution analyzers include the LA-960 manufactured by Horiba, Ltd.

[0110] The specific surface area of ​​the (D) inorganic filler is preferably 0.1 m from the viewpoint of significantly achieving the desired effects of the present invention. 2 / g or more, more preferably 0.5m 2 / g or more, more preferably 1m 2 / g or more, particularly preferably 3m 2 / g or more, preferably 100m 2 / g or less, more preferably 70m 2 / g or less, more preferably 50m 2 / g or less, particularly preferably 40m 2 The specific surface area of ​​the inorganic filler can be measured in accordance with the BET method by adsorbing nitrogen gas onto the surface of a sample using a specific surface area measuring device (Macsorb HM-1210 manufactured by Mountech Co., Ltd.) and calculating the specific surface area using the BET multipoint method.

[0111] (D) The inorganic filler is preferably treated with a surface treatment agent from the viewpoint of improving moisture resistance and dispersibility. Examples of the surface treatment agent include a fluorine-containing silane coupling agent, an aminosilane coupling agent, an epoxysilane coupling agent, a mercaptosilane coupling agent, a silane coupling agent, an alkoxysilane, an organosilazane compound, and a titanate coupling agent. One type of surface treatment agent may be used alone, or two or more types may be used in any combination.

[0112] Examples of commercially available surface treatment agents include Shin-Etsu Chemical Co., Ltd.'s "KBM403" (3-glycidoxypropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM803" (3-mercaptopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBE903" (3-aminopropyltriethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM573" (N-phenyl-3-aminopropyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "SZ-31" (hexamethyldisilazane), Shin-Etsu Chemical Co., Ltd.'s "KBM103" (phenyltrimethoxysilane), Shin-Etsu Chemical Co., Ltd.'s "KBM-4803" (long-chain epoxy-type silane coupling agent), and Shin-Etsu Chemical Co., Ltd.'s "KBM-7103" (3,3,3-trifluoropropyltrimethoxysilane).

[0113] The degree of surface treatment with the surface treatment agent preferably falls within a specific range from the viewpoint of improving the dispersibility of the inorganic filler. Specifically, 100% by mass of the inorganic filler is preferably surface-treated with 0.2% to 5% by mass of the surface treatment agent, more preferably with 0.2% to 3% by mass of the surface treatment agent, and even more preferably with 0.3% to 2% by mass of the surface treatment agent.

[0114] The degree of surface treatment with the surface treatment agent can be evaluated by the amount of carbon per unit surface area of ​​the inorganic filler. From the viewpoint of improving the dispersibility of the inorganic filler, the amount of carbon per unit surface area of ​​the inorganic filler is set to 0.02 mg / m 2 More than 0.1 mg / m is preferable. 2 More preferably, 0.2 mg / m or more 2 On the other hand, from the viewpoint of preventing an increase in the melt viscosity of the resin composition, it is more preferable that the content be 1.0 mg / m 2 Less than 0.8 mg / m is preferred 2 Less than 0.5 mg / m is more preferable. 2 The following is even more preferred:

[0115] (D) The amount of carbon per unit surface area of ​​the inorganic filler can be measured after the surface-treated inorganic filler is washed with a solvent (e.g., methyl ethyl ketone (MEK)). Specifically, a sufficient amount of MEK as a solvent is added to the inorganic filler that has been surface-treated with a surface treatment agent, and ultrasonic cleaning is performed at 25°C for 5 minutes. After removing the supernatant and drying the solid content, the amount of carbon per unit surface area of ​​the inorganic filler can be measured using a carbon analyzer. An "EMIA-320V" manufactured by Horiba, Ltd., or the like can be used as the carbon analyzer.

[0116] The content of the (D) inorganic filler in the resin composition is preferably 60% by mass or more, more preferably 65% ​​by mass or more, particularly preferably 69% by mass or more, and is preferably 86% by mass or less, more preferably 82% by mass or less, particularly preferably 78% by mass or less, based on 100% by mass of the nonvolatile components in the resin composition. When the amount of the (D) inorganic filler is within the above range, significant effects can be obtained, such as suppression of unevenness after lamination, improvement of plating adhesion of the cured product, reduction of the dielectric loss tangent of the cured product, and reduction of surface roughness after roughening treatment.

[0117] 6. (E) Optional Hardener The resin composition according to this embodiment may further contain an optional curing agent (E) in combination with the above-described components (A) to (D). The optional curing agent (E) as component (E) does not include those corresponding to the above-described components (A) to (D). The optional curing agent (E), like the active ester compound (C) described above, may function as an epoxy resin curing agent that reacts with the epoxy resin (B) to cure the resin composition. The optional curing agent (E) may be used alone or in combination of two or more.

[0118] (E) Examples of optional curing agents include phenolic curing agents, carbodiimide curing agents, acid anhydride curing agents, amine curing agents, benzoxazine curing agents, cyanate ester curing agents, and thiol curing agents. Among these, it is preferable to use one or more curing agents selected from the group consisting of phenolic curing agents and carbodiimide curing agents.

[0119] As the phenolic curing agent, a curing agent having one or more, preferably two or more, hydroxyl groups bonded to an aromatic ring such as a benzene ring or a naphthalene ring per molecule can be used. From the viewpoint of heat resistance and water resistance, a phenolic curing agent having a novolac structure is preferred. From the viewpoint of adhesion, a nitrogen-containing phenolic curing agent is preferred, and a triazine skeleton-containing phenolic curing agent is more preferred. Among them, a triazine skeleton-containing phenolic novolac resin is preferred from the viewpoint of highly satisfying heat resistance, water resistance, and adhesion. Specific examples of phenolic curing agents include "MEH-7700," "MEH-7810," and "MEH-7851" manufactured by Meiwa Chemical Industry Co., Ltd.; "NHN," "CBN," and "GPH" manufactured by Nippon Kayaku Co., Ltd.; "SN-170," "SN-180," "SN-190," "SN-475," "SN-485," "SN-495," "SN-375," and "SN-395" manufactured by Nippon Steel Chemical & Material Co., Ltd.; and "LA-7052," "LA-7054," "LA-3018," "LA-3018-50P," "LA-1356," "TD2090," and "TD-2090-60M" manufactured by DIC Corporation.

[0120] As the carbodiimide curing agent, a curing agent having one or more, preferably two or more, carbodiimide structures in one molecule can be used. Specific examples of the carbodiimide curing agent include aliphatic biscarbodiimides such as tetramethylene-bis(t-butylcarbodiimide) and cyclohexanebis(methylene-t-butylcarbodiimide); aromatic biscarbodiimides such as phenylene-bis(xylylcarbodiimide); aliphatic polycarbodiimides such as polyhexamethylenecarbodiimide, polytrimethylhexamethylenecarbodiimide, polycyclohexylenecarbodiimide, poly(methylenebiscyclohexylenecarbodiimide), and poly(isophoronecarbodiimide); poly(phenylenecarbodiimide), poly( Examples of polycarbodiimides include aromatic polycarbodiimides such as poly(naphthylenecarbodiimide), poly(tolylenecarbodiimide), poly(methyldiisopropylphenylenecarbodiimide), poly(triethylphenylenecarbodiimide), poly(diethylphenylenecarbodiimide), poly(triisopropylphenylenecarbodiimide), poly(diisopropylphenylenecarbodiimide), poly(xylylenecarbodiimide), poly(tetramethylxylylenecarbodiimide), poly(methylenediphenylenecarbodiimide), and poly[methylenebis(methylphenylene)carbodiimide]. Commercially available carbodiimide curing agents include, for example, "Carbodilite V-02B," "Carbodilite V-03," "Carbodilite V-04K," "Carbodilite V-07," and "Carbodilite V-09" manufactured by Nisshinbo Chemical Inc.; and "Stavaxol P," "Stavaxol P400," and "Hykasil 510" manufactured by Rhein Chemie.

[0121] As the acid anhydride curing agent, a curing agent having one or more acid anhydride groups in one molecule can be used, and a curing agent having two or more acid anhydride groups in one molecule is preferred. Specific examples of the acid anhydride curing agent include phthalic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylnadic anhydride, hydrogenated methylnadic anhydride, trialkyltetrahydrophthalic anhydride, dodecenyl succinic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride, trimellitic anhydride, pyromellitic anhydride, and benzophenonetetracarboxylic dianhydride. Examples of suitable anhydrides include anhydrides, biphenyltetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, oxydiphthalic dianhydride, 3,3'-4,4'-diphenylsulfonetetracarboxylic dianhydride, 1,3,3a,4,5,9b-hexahydro-5-(tetrahydro-2,5-dioxo-3-furanyl)-naphtho[1,2-C]furan-1,3-dione, ethylene glycol bis(anhydrotrimellitate), and polymeric anhydrides such as styrene-maleic acid resins, which are copolymers of styrene and maleic acid. Commercially available acid anhydride curing agents include, for example, "HNA-100," "MH-700," "MTA-15," "DDSA," and "OSA" manufactured by New Japan Chemical Co., Ltd.; "YH-306" and "YH-307" manufactured by Mitsubishi Chemical Corporation; "HN-2200" and "HN-5500" manufactured by Hitachi Chemical Co., Ltd.; and "EF-30," "EF-40," "EF-60," and "EF-80" manufactured by Clay Valley.

[0122] As the amine-based curing agent, a curing agent having one or more, preferably two or more, amino groups in one molecule can be used. Examples of the amine-based curing agent include aliphatic amines, polyether amines, alicyclic amines, and aromatic amines, among which aromatic amines are preferred. The amine-based curing agent is preferably a primary amine or a secondary amine, and more preferably a primary amine. Specific examples of amine-based curing agents include 4,4'-methylenebis(2,6-dimethylaniline), 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenyl sulfone, 3,3'-diaminodiphenyl sulfone, m-phenylenediamine, m-xylylenediamine, diethyltoluenediamine, 4,4'-diaminodiphenyl ether, 3,3'-dimethyl-4,4'-diaminobiphenyl, 2,2'-dimethyl-4,4'-diaminobiphenyl, 3,3'-dihydroxybenzidine, and 2,2-bis(3-amino-4-hydroxyphenyl)propane. propane, 3,3-dimethyl-5,5-diethyl-4,4-diphenylmethanediamine, 2,2-bis(4-aminophenyl)propane, 2,2-bis(4-(4-aminophenoxy)phenyl)propane, 1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene, 4,4'-bis(4-aminophenoxy)biphenyl, bis(4-(4-aminophenoxy)phenyl)sulfone, bis(4-(3-aminophenoxy)phenyl)sulfone, and the like. Commercially available amine-based curing agents include, for example, "SEIKACURE-S" manufactured by Seika Corporation; "KAYABOND C-200S," "KAYABOND C-100," "KAYAHARD AA," "KAYAHARD AB," and "KAYAHARD AS" manufactured by Nippon Kayaku Co., Ltd.; "Epicure W" manufactured by Mitsubishi Chemical Corporation; and "DTDA" manufactured by Sumitomo Seika Chemicals Co., Ltd.

[0123] Specific examples of benzoxazine curing agents include "JBZ-OP100D" and "ODA-BOZ" manufactured by JFE Chemical Corporation; "HFB2006M" manufactured by Showa Polymer Co., Ltd.; and "Pd" and "Fa" manufactured by Shikoku Chemicals Corporation.

[0124] Examples of cyanate ester curing agents include bifunctional cyanate resins such as bisphenol A dicyanate, polyphenol cyanate (oligo(3-methylene-1,5-phenylene cyanate)), 4,4'-methylenebis(2,6-dimethylphenyl cyanate), 4,4'-ethylidene diphenyl dicyanate, hexafluorobisphenol A dicyanate, 2,2-bis(4-cyanate)phenylpropane, 1,1-bis(4-cyanatephenylmethane), bis(4-cyanate-3,5-dimethylphenyl)methane, 1,3-bis(4-cyanatephenyl-1-(methylethylidene))benzene, bis(4-cyanatephenyl)thioether, and bis(4-cyanatephenyl)ether; multifunctional cyanate resins derived from phenol novolac and cresol novolac; and prepolymers in which these cyanate resins are partially converted to triazine. Specific examples of cyanate ester curing agents include "PT30" and "PT60" (both phenol novolac type multifunctional cyanate ester resins) manufactured by Lonza Japan Co., Ltd., "BA230" and "BA230S75" (prepolymers in which part or all of bisphenol A dicyanate has been triazine converted to a trimer).

[0125] Examples of thiol-based curing agents include trimethylolpropane tris(3-mercaptopropionate), pentaerythritol tetrakis(3-mercaptobutyrate), and tris(3-mercaptopropyl)isocyanurate.

[0126] The active group equivalent of the (E) optional curing agent is preferably 50 g / eq. to 3000 g / eq., more preferably 100 g / eq. to 1000 g / eq., even more preferably 100 g / eq. to 500 g / eq., and particularly preferably 100 g / eq. to 300 g / eq. The active group equivalent represents the mass of the curing agent per equivalent of the active group.

[0127] The content of the optional curing agent (E) in the resin composition may be 0% by mass or more, and is preferably 0.01% by mass or more, more preferably 0.1% by mass or more, and particularly preferably 1.0% by mass or more, and is preferably 20% by mass or less, more preferably 10% by mass or less, and particularly preferably 5% by mass or less, when the non-volatile components in the resin composition are taken as 100% by mass.

[0128] The content of the optional curing agent (E) in the resin composition may be 0% by mass or more, and is preferably 0.1% by mass or more, more preferably 1.0% by mass or more, and particularly preferably 5.0% by mass or more, and is preferably 50% by mass or less, more preferably 20% by mass or less, and particularly preferably 10% by mass or less, when the resin component in the resin composition is 100% by mass.

[0129] [7. (F) Curing Accelerator] The resin composition according to this embodiment may further contain a curing accelerator (F) as an optional component in combination with the above-described components (A) to (E). The curing accelerator (F) as component (F) does not include components corresponding to the above-described components (A) to (E). The curing accelerator (F) functions as a curing catalyst that accelerates the curing of the epoxy resin (A).

[0130] Examples of the (F) curing accelerator include phosphorus-based curing accelerators, urea-based curing accelerators, guanidine-based curing accelerators, imidazole-based curing accelerators, metal-based curing accelerators, and amine-based curing accelerators. Among these, imidazole-based curing accelerators are preferred. One type of (F) curing accelerator may be used alone, or two or more types may be used in combination.

[0131] Examples of the phosphorus-based curing accelerator include aliphatic phosphonium salts such as tetrabutylphosphonium bromide, tetrabutylphosphonium chloride, tetrabutylphosphonium acetate, tetrabutylphosphonium decanoate, tetrabutylphosphonium laurate, bis(tetrabutylphosphonium)pyromellitate, tetrabutylphosphonium hydrogenhexahydrophthalate, tetrabutylphosphonium 2,6-bis[(2-hydroxy-5-methylphenyl)methyl]-4-methylphenolate, and di-tert-butyldimethylphosphonium tetraphenylborate; methyltriphenylphosphonium bromide, ethyltriphenylphosphonium bromide, propyltriphenylphosphonium bromide, butyltriphenylphosphonium bromide, benzyltriphenylphosphonium chloride, tetraphenylphosphonium bromide, p-tolyltriphenylphosphonium tetra-p-tolylborate, and tetraphenylphosphonium tetra-p-tolylborate. aromatic phosphonium salts such as tetraphenylborate, tetraphenylphosphonium tetra-p-tolylborate, triphenylethylphosphonium tetraphenylborate, tris(3-methylphenyl)ethylphosphonium tetraphenylborate, tris(2-methoxyphenyl)ethylphosphonium tetraphenylborate, (4-methylphenyl)triphenylphosphonium thiocyanate, tetraphenylphosphonium thiocyanate, and butyltriphenylphosphonium thiocyanate; aromatic phosphine-borane complexes such as triphenylphosphine-triphenylborane; aromatic phosphine-quinone adducts such as triphenylphosphine-p-benzoquinone adduct; aliphatic phosphines such as tributylphosphine, tri-tert-butylphosphine, trioctylphosphine, di-tert-butyl(2-butenyl)phosphine, di-tert-butyl(3-methyl-2-butenyl)phosphine, and tricyclohexylphosphine;Dibutylphenylphosphine, di-tert-butylphenylphosphine, methyldiphenylphosphine, ethyldiphenylphosphine, butyldiphenylphosphine, diphenylcyclohexylphosphine, triphenylphosphine, tri-o-tolylphosphine, tri-m-tolylphosphine, tri-p-tolylphosphine, tris(4-ethylphenyl)phosphine, tris(4-propylphenyl)phosphine, tris(4-isopropylphenyl)phosphine, tris(4-butylphenyl)phosphine, tris(4-tert-butylphenyl)phosphine, tris(2,4-dimethylphenyl)phosphine, tris(2,5-dimethylphenyl)phosphine, tris(2,6-dimethylphenyl)phosphine aromatic phosphines such as benzene, tris(3,5-dimethylphenyl)phosphine, tris(2,4,6-trimethylphenyl)phosphine, tris(2,6-dimethyl-4-ethoxyphenyl)phosphine, tris(2-methoxyphenyl)phosphine, tris(4-methoxyphenyl)phosphine, tris(4-ethoxyphenyl)phosphine, tris(4-tert-butoxyphenyl)phosphine, diphenyl-2-pyridylphosphine, 1,2-bis(diphenylphosphino)ethane, 1,3-bis(diphenylphosphino)propane, 1,4-bis(diphenylphosphino)butane, 1,2-bis(diphenylphosphino)acetylene, and 2,2'-bis(diphenylphosphino)diphenyl ether;

[0132] Examples of the urea-based curing accelerator include 1,1-dimethylurea; aliphatic dimethylureas such as 1,1,3-trimethylurea, 3-ethyl-1,1-dimethylurea, 3-cyclohexyl-1,1-dimethylurea, and 3-cyclooctyl-1,1-dimethylurea; 3-phenyl-1,1-dimethylurea, 3-(4-chlorophenyl)-1,1-dimethylurea, 3-(3,4-dichlorophenyl)-1,1-dimethylurea, 3-(3-chloro-4-methylphenyl)-1,1-dimethylurea, 3-(2-methylphenyl)-1,1-dimethylurea, 3-(4-methylphenyl)-1,1-dimethylurea, and 3-(3,4-dimethylphenyl)-1,1-dimethylurea. aromatic dimethylureas such as toluene bis(dimethylurea), 3-(4-isopropylphenyl)-1,1-dimethylurea, 3-(4-methoxyphenyl)-1,1-dimethylurea, 3-(4-nitrophenyl)-1,1-dimethylurea, 3-[4-(4-methoxyphenoxy)phenyl]-1,1-dimethylurea, 3-[4-(4-chlorophenoxy)phenyl]-1,1-dimethylurea, 3-[3-(trifluoromethyl)phenyl]-1,1-dimethylurea, N,N-(1,4-phenylene)bis(N',N'-dimethylurea), and N,N-(4-methyl-1,3-phenylene)bis(N',N'-dimethylurea) [toluene bisdimethylurea].

[0133] Examples of guanidine curing accelerators include dicyandiamide, 1-methylguanidine, 1-ethylguanidine, 1-cyclohexylguanidine, 1-phenylguanidine, 1-(o-tolyl)guanidine, dimethylguanidine, diphenylguanidine, trimethylguanidine, tetramethylguanidine, pentamethylguanidine, 1,5,7-triazabicyclo[4.4.0]dec-5-ene, 7-methyl-1,5,7-triazabicyclo[4.4.0]dec-5-ene, 1-methylbiguanide, 1-ethylbiguanide, 1-n-butylbiguanide, 1-n-octadecylbiguanide, 1,1-dimethylbiguanide, 1,1-diethylbiguanide, 1-cyclohexylbiguanide, 1-allylbiguanide, 1-phenylbiguanide, and 1-(o-tolyl)biguanide.

[0134] Examples of the imidazole curing accelerator include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, and 1-benzyl-2-methylimidazole. Phenylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2'-methylimidazolyl -(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-undecylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-ethyl-4'-methylimidazolyl-(1')]-ethyl-s-triazine, 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine isocyanuric acid adduct, 2-phenylimidazole isocyanuric acid adduct Examples of imidazole compounds include 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,3-dihydro-1H-pyrrolo[1,2-a]benzimidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazoline, and 2-phenylimidazoline, as well as adducts of imidazole compounds with epoxy resins. Commercially available imidazole curing accelerators include "1B2PZ," "2E4MZ," "2MZA-PW," "2MZ-OK," "2MA-OK," "2MA-OK-PW," "2PHZ," "2PHZ-PW," "Cl1Z," "Cl1Z-CN," "Cl1Z-CNS," and "C11Z-A" manufactured by Shikoku Chemicals Corporation; and "P200-H50" manufactured by Mitsubishi Chemical Corporation.

[0135] Examples of metal-based curing accelerators include organometallic complexes or organometallic salts of metals such as cobalt, copper, zinc, iron, nickel, manganese, and tin. Specific examples of organometallic complexes include organic cobalt complexes such as cobalt(II) acetylacetonate and cobalt(III) acetylacetonate, organic copper complexes such as copper(II) acetylacetonate, organic zinc complexes such as zinc(II) acetylacetonate, organic iron complexes such as iron(III) acetylacetonate, organic nickel complexes such as nickel(II) acetylacetonate, and organic manganese complexes such as manganese(II) acetylacetonate. Examples of organometallic salts include zinc octoate, tin octoate, zinc naphthenate, cobalt naphthenate, tin stearate, and zinc stearate.

[0136] Examples of the amine curing accelerator include trialkylamines such as triethylamine and tributylamine, 4-dimethylaminopyridine, benzyldimethylamine, 2,4,6-tris(dimethylaminomethyl)phenol, 1,8-diazabicyclo(5,4,0)-undecene, etc. Commercially available amine curing accelerators may be used, such as "MY-25" manufactured by Ajinomoto Fine-Techno Co., Inc.

[0137] The content of the (F) curing accelerator in the resin composition may be 0% by mass or more, and is preferably 0.01% by mass or more, more preferably 0.02% by mass or more, particularly preferably 0.05% by mass or more, and is preferably 1.0% by mass or less, more preferably 0.5% by mass or less, particularly preferably 0.1% by mass or less, assuming that the non-volatile components in the resin composition are 100% by mass.

[0138] The content of the (F) curing accelerator in the resin composition may be 0% by mass or more, and is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, and particularly preferably 0.10% by mass or more, and is preferably 2.0% by mass or less, more preferably 1.0% by mass or less, and particularly preferably 0.5% by mass or less, when the resin component in the resin composition is taken as 100% by mass.

[0139] [8.(G) Thermoplastic resin] The resin composition according to this embodiment may further contain a (G) thermoplastic resin as an optional component in combination with the above-described (A) to (F) components. The (G) thermoplastic resin as the (G) component does not include those corresponding to the above-described (A) to (F) components.

[0140] Examples of (G) thermoplastic resins include phenoxy resins, polyimide resins, polyvinyl acetal resins, polyolefin resins, polybutadiene resins, polyamideimide resins, polyetherimide resins, polysulfone resins, polyethersulfone resins, polyphenylene ether resins, polycarbonate resins, polyetheretherketone resins, polyester resins, etc. One type of (G) thermoplastic resin may be used alone, or two or more types may be used in combination.

[0141] Examples of phenoxy resins include phenoxy resins having one or more skeletons selected from the group consisting of bisphenol A, bisphenol F, bisphenol S, bisphenolacetophenone, novolac, biphenyl, fluorene, dicyclopentadiene, norbornene, naphthalene, anthracene, adamantane, terpene, and trimethylcyclohexane. The terminal of the phenoxy resin may be any functional group such as a phenolic hydroxyl group or an epoxy group. Specific examples of phenoxy resins include "1256" and "4250" manufactured by Mitsubishi Chemical Corporation (both of which are phenoxy resins containing a bisphenol A skeleton); "YX8100" manufactured by Mitsubishi Chemical Corporation (phenoxy resin containing a bisphenol S skeleton); "YX6954" manufactured by Mitsubishi Chemical Corporation (phenoxy resin containing a bisphenol acetophenone skeleton); "FX280" and "FX293" manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.; and "YL7500BH30," "YX6954BH30," "YX7553," "YX7553BH30," "YL7769BH30," "YL6794," "YL7213," "YL7290," "YL7482," and "YL7891BH30" manufactured by Mitsubishi Chemical Corporation.

[0142] Specific examples of polyimide resins include "SLK-6100" manufactured by Shin-Etsu Chemical Co., Ltd., and "Rikacoat SN20" and "Rikacoat PN20" manufactured by New Japan Chemical Co., Ltd.

[0143] Examples of polyvinyl acetal resins include polyvinyl formal resins and polyvinyl butyral resins, with polyvinyl butyral resins being preferred. Specific examples of polyvinyl acetal resins include Denka Butyral 4000-2, Denka Butyral 5000-A, Denka Butyral 6000-C, and Denka Butyral 6000-EP, manufactured by Denki Kagaku Kogyo Co., Ltd.; and S-LEC BH series, BX series (e.g., BX-5Z), KS series (e.g., KS-1), BL series, and BM series, manufactured by Sekisui Chemical Co., Ltd.

[0144] Examples of polyolefin resins include ethylene copolymer resins such as low-density polyethylene, very low-density polyethylene, high-density polyethylene, ethylene-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, and ethylene-methyl acrylate copolymer; and polyolefin polymers such as polypropylene and ethylene-propylene block copolymer.

[0145] Examples of polybutadiene resins include hydrogenated polybutadiene skeleton-containing resins, hydroxy group-containing polybutadiene resins, phenolic hydroxy group-containing polybutadiene resins, carboxy group-containing polybutadiene resins, acid anhydride group-containing polybutadiene resins, epoxy group-containing polybutadiene resins, isocyanate group-containing polybutadiene resins, urethane group-containing polybutadiene resins, and polyphenylene ether-polybutadiene resins.

[0146] Specific examples of polyamide-imide resins include "Vylomax HR11NN" and "Vylomax HR16NN" manufactured by Toyobo Co., Ltd. Specific examples of polyamide-imide resins also include modified polyamide-imides such as "KS9100" and "KS9300" (polysiloxane skeleton-containing polyamide-imides) manufactured by Hitachi Chemical Co., Ltd.

[0147] A specific example of the polyethersulfone resin is "PES5003P" manufactured by Sumitomo Chemical Co., Ltd.

[0148] Specific examples of polysulfone resins include polysulfones "P1700" and "P3500" manufactured by Solvay Advanced Polymers.

[0149] A specific example of the polyphenylene ether resin is "NORYL SA90" manufactured by SABIC, etc. A specific example of the polyetherimide resin is "Ultem" manufactured by GE, etc.

[0150] Examples of polycarbonate resins include hydroxyl group-containing carbonate resins, phenolic hydroxyl group-containing carbonate resins, carboxyl group-containing carbonate resins, acid anhydride group-containing carbonate resins, isocyanate group-containing carbonate resins, and urethane group-containing carbonate resins. Specific examples of polycarbonate resins include "FPC0220" manufactured by Mitsubishi Gas Chemical Company, Inc., "T6002" and "T6001" (polycarbonate diols) manufactured by Asahi Kasei Chemicals Corporation, and "C-1090," "C-2090," and "C-3090" (polycarbonate diols) manufactured by Kuraray Co., Ltd. Specific examples of polyether ether ketone resins include "Sumiploy K" manufactured by Sumitomo Chemical Co., Ltd.

[0151] Examples of polyester resins include polyethylene terephthalate resin, polyethylene naphthalate resin, polybutylene terephthalate resin, polybutylene naphthalate resin, polytrimethylene terephthalate resin, polytrimethylene naphthalate resin, and polycyclohexane dimethyl terephthalate resin.

[0152] The weight average molecular weight (Mw) of the (G) thermoplastic resin is preferably greater than 5,000, more preferably 8,000 or more, even more preferably 10,000 or more, and particularly preferably 20,000 or more, and is preferably 100,000 or less, more preferably 70,000 or less, even more preferably 60,000 or less, and particularly preferably 50,000 or less.

[0153] The content of the (G) thermoplastic resin in the resin composition may be 0% by mass or more, and is preferably 0.01% by mass or more, more preferably 0.10% by mass or more, and particularly preferably 0.20% by mass or more, and is preferably 5.0% by mass or less, more preferably 2.0% by mass or less, and particularly preferably 1.0% by mass or less, assuming that the non-volatile components in the resin composition are 100% by mass.

[0154] The content of the (G) thermoplastic resin in the resin composition may be 0% by mass or more, and is preferably 0.01% by mass or more, more preferably 0.10% by mass or more, and particularly preferably 0.5% by mass or more, and is preferably 10% by mass or less, more preferably 5.0% by mass or less, and particularly preferably 3.0% by mass or less, assuming that the resin components in the resin composition are 100% by mass.

[0155] [9. (H) Radical Polymerizable Compounds] The resin composition according to this embodiment may further contain (H) an optional radical polymerizable compound in combination with the above-described components (A) to (G). The (H) radical polymerizable compound as component (H) does not include compounds corresponding to the above-described components (A) to (G). The (H) radical polymerizable compound may be used alone or in combination of two or more.

[0156] The (H) radical polymerizable compound may have an ethylenically unsaturated bond. The (H) radical polymerizable compound may have a radical polymerizable group, such as an unsaturated hydrocarbon group such as an allyl group, a 3-cyclohexenyl group, a 3-cyclopentenyl group, a p-vinylphenyl group, a m-vinylphenyl group, or an o-vinylphenyl group; or an α,β-unsaturated carbonyl group such as an acryloyl group, a methacryloyl group, or a maleimide group (2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl group). The (H) radical polymerizable compound preferably has two or more radical polymerizable groups.

[0157] Examples of the (H) radically polymerizable compound include (meth)acrylic radically polymerizable compounds, styrene radically polymerizable compounds, allyl radically polymerizable compounds, and maleimide radically polymerizable compounds.

[0158] The (meth)acrylic radical polymerizable compound is, for example, a compound having one or more, preferably two or more, acryloyl groups and / or methacryloyl groups. Examples of the (meth)acrylic radical polymerizable compound include cyclohexane-1,4-dimethanol di(meth)acrylate, cyclohexane-1,3-dimethanol di(meth)acrylate, tricyclodecane dimethanol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,9-octanediol di(meth)acrylate, 1,6-octanedi ...8-octanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1,8-octanediol di(meth)acrylate, 1 Low molecular weight (molecular weight less than 1000) aliphatic (meth)acrylic acid ester compounds such as nanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, glycerin tri(meth)acrylate, and pentaerythritol tetra(meth)acrylate; dioxane glycol di(meth)acrylate, 3,6-dioxa-1,8-octanediol di(meth)acrylate, Examples of the ether-containing (meth)acrylic acid ester compounds include low molecular weight (molecular weight less than 1000) ether-containing (meth)acrylic acid ester compounds such as bis(meth)acrylate, 3,6,9-trioxaundecane-1,11-diol di(meth)acrylate, polyethylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, 9,9-bis[4-(2-acryloyloxyethoxy)phenyl]fluorene, ethoxylated bisphenol A di(meth)acrylate, and propoxylated bisphenol A di(meth)acrylate; low molecular weight (molecular weight less than 1000) isocyanurate-containing (meth)acrylic acid ester compounds such as tris(3-hydroxypropyl)isocyanurate tri(meth)acrylate, tris(2-hydroxyethyl)isocyanurate tri(meth)acrylate, and ethoxylated isocyanuric acid tri(meth)acrylate; and high molecular weight (molecular weight 1000 or more) acrylic acid ester compounds such as (meth)acrylic-modified polyphenylene ether resins.Examples of commercially available (meth)acrylic radically polymerizable compounds include "A-DOG" (dioxane glycol diacrylate) manufactured by Shin-Nakamura Chemical Co., Ltd., "DCP-A" (tricyclodecane dimethanol diacrylate) and "DCP" (tricyclodecane dimethanol dimethacrylate) manufactured by Kyoeisha Chemical Co., Ltd., "KAYARAD R-684" (tricyclodecane dimethanol diacrylate) and "KAYARAD R-604" (dioxane glycol diacrylate) manufactured by Nippon Kayaku Co., Ltd., and "SA9000" and "SA9000-111" (methacrylic-modified polyphenylene ether) manufactured by SABIC Innovative Plastics.

[0159] The styrene radical polymerizable compound is, for example, a compound having one or more, preferably two or more, vinyl groups directly bonded to an aromatic carbon atom. Examples of the styrene radical polymerizable compound include low molecular weight (molecular weight less than 1000) styrene compounds such as divinylbenzene, 2,4-divinyltoluene, 2,6-divinylnaphthalene, 1,4-divinylnaphthalene, 4,4'-divinylbiphenyl, 1,2-bis(4-vinylphenyl)ethane, 2,2-bis(4-vinylphenyl)propane, and bis(4-vinylphenyl)ether; and high molecular weight (molecular weight 1000 or more) styrene compounds such as vinylbenzyl-modified polyphenylene ether resin and styrene-divinylbenzene copolymer. Examples of commercially available styrene-based radically polymerizable compounds include "ODV-XET(X03)", "ODV-XET(X04)", and "ODV-XET(X05)" (styrene-divinylbenzene copolymers) manufactured by Nippon Steel Chemical & Material Co., Ltd., and "OPE-2St 1200" and "OPE-2St 2200" (vinylbenzyl-modified polyphenylene ether resins) manufactured by Mitsubishi Gas Chemical Company, Inc.

[0160] The allyl radical polymerizable compound is, for example, a compound having one or more, preferably two or more, allyl groups. Examples of allyl radical polymerizable compounds include aromatic carboxylic acid allyl ester compounds such as diallyl diphenate, triallyl trimellitate, diallyl phthalate, diallyl isophthalate, diallyl terephthalate, diallyl 2,6-naphthalenedicarboxylate, and diallyl 2,3-naphthalenecarboxylate; isocyanuric acid allyl ester compounds such as 1,3,5-triallyl isocyanurate and 1,3-diallyl-5-glycidyl isocyanurate; epoxy-containing aromatic allyl compounds such as 2,2-bis[3-allyl-4-(glycidyloxy)phenyl]propane; benzoxazine-containing aromatic allyl compounds such as bis[3-allyl-4-(3,4-dihydro-2H-1,3-benzoxazin-3-yl)phenyl]methane; ether-containing aromatic allyl compounds such as 1,3,5-triallyl ether benzene; and allyl silane compounds such as diallyldiphenylsilane. Commercially available allyl radical polymerizable compounds include "TAIC" (1,3,5-triallyl isocyanurate) manufactured by Nippon Kasei Chemical Industry Co., Ltd., "DAD" (diallyl diphenate) manufactured by Nisshoku Techno Fine Chemical Co., Ltd., "TRIAM-705" (triallyl trimellitate) manufactured by Wako Pure Chemical Industries, Ltd., "DAND" (2,3-naphthalenecarboxylic acid diallyl) manufactured by Nippon Distillation Industry Co., Ltd., "ALP-d" (bis[3-allyl-4-(3,4-dihydro-2H-1,3-benzoxazin-3-yl)phenyl]methane) manufactured by Shikoku Chemical Industry Co., Ltd., "RE-810NM" (2,2-bis[3-allyl-4-(glycidyloxy)phenyl]propane) manufactured by Nippon Kayaku Co., Ltd., and "DA-MGIC" (1,3-diallyl-5-glycidyl isocyanurate) manufactured by Shikoku Chemical Industry Co., Ltd.

[0161] The maleimide radical polymerizable compound is, for example, a compound having one or more, preferably two or more, maleimide groups. The maleimide radical polymerizable compound may be an aliphatic maleimide compound containing an aliphatic amine skeleton, or an aromatic maleimide compound containing an aromatic amine skeleton. Commercially available maleimide radical polymerizable compounds include, for example, "SLK-2600" manufactured by Shin-Etsu Chemical Co., Ltd.; "BMI-1500," "BMI-1700," "BMI-3000J," "BMI-689," and "BMI-2500" (dimer diamine structure-containing maleimide compounds) manufactured by Designer Molecules, Inc.; "BMI-6100" (aromatic maleimide compound) manufactured by Designer Molecules, Inc.; "MIR-5000-60T" and "MIR-3000-70MT" (biphenylaralkyl maleimide compounds) manufactured by Nippon Kayaku Co., Ltd.; "BMI-70" and "BMI-80" manufactured by K.I. Chemical Industry Co., Ltd.; and "BMI-2300" and "BMI-TMH" manufactured by Daiwa Chemical Industry Co., Ltd. Furthermore, as the maleimide-based radical polymerizable compound, a maleimide resin (maleimide compound containing an indane ring skeleton) disclosed in Technical Disclosure No. 2020-500211 of the Japan Institute of Invention and Innovation may be used.

[0162] The ethylenically unsaturated bond equivalent of the radically polymerizable compound (H) is preferably 20 g / eq. to 3000 g / eq., more preferably 50 g / eq. to 2500 g / eq., even more preferably 70 g / eq. to 2000 g / eq., and particularly preferably 90 g / eq. to 1500 g / eq. The ethylenically unsaturated bond equivalent represents the mass of the radically polymerizable compound per equivalent of the ethylenically unsaturated bond.

[0163] The weight average molecular weight (Mw) of the radical polymerizable compound (H) is preferably 40,000 or less, more preferably 10,000 or less, even more preferably 5,000 or less, and particularly preferably 3,000 or less. The lower limit is not particularly limited, but can be, for example, 150 or more.

[0164] The content of the (H) radical polymerizable compound in the resin composition may be 0% by mass or more, and is preferably 0.01% by mass or more, more preferably 0.10% by mass or more, and particularly preferably 0.5% by mass or more, and is preferably 10% by mass or less, more preferably 8% by mass or less, and particularly preferably 6% by mass or less, assuming that the non-volatile components in the resin composition are 100% by mass.

[0165] The content of the (H) radical polymerizable compound in the resin composition may be 0% by mass or more than 0% by mass, and is preferably 0.01% by mass or more, more preferably 0.10% by mass or more, particularly preferably 1.0% by mass or more, and is preferably 20% by mass or less, more preferably 15% by mass or less, particularly preferably 10% by mass or less, when the resin component in the resin composition is 100% by mass.

[0166] 10. (I) Optional Additives The resin composition according to this embodiment may further contain (I) an optional additive as an optional non-volatile component in addition to the above-described components (A) to (H). (I) Examples of optional additives include radical polymerization initiators such as peroxide-based radical polymerization initiators and azo-based radical polymerization initiators; thermosetting resins other than epoxy resins such as epoxy acrylate resins, urethane acrylate resins, urethane resins, cyanate resins, benzoxazine resins, unsaturated polyester resins, phenolic resins, melamine resins, and silicone resins; organic fillers such as rubber particles; organometallic compounds such as organocopper compounds, organozinc compounds, and organocobalt compounds; colorants such as phthalocyanine blue, phthalocyanine green, iodine green, diazo yellow, crystal violet, titanium oxide, and carbon black; polymerization inhibitors such as hydroquinone, catechol, pyrogallol, and phenothiazine; leveling agents such as silicone-based leveling agents and acrylic polymer-based leveling agents; thickeners such as bentone and montmorillonite; and defoamers such as silicone-based defoamers, acrylic-based defoamers, fluorine-based defoamers, and vinyl resin-based defoamers. surfactants such as fluorine-based surfactants and silicone-based surfactants; flame retardants such as phosphorus-based flame retardants (e.g., phosphate ester compounds, phosphazene compounds, phosphinic acid compounds, red phosphorus), nitrogen-based flame retardants (e.g., melamine sulfate), halogen-based flame retardants, and inorganic flame retardants (e.g., antimony trioxide); dispersants such as phosphate ester-based dispersants, polyoxyalkylene-based dispersants, acetylene-based dispersants, silicone-based dispersants, anionic dispersants, and cationic dispersants; and stabilizers such as borate-based stabilizers, titanate-based stabilizers, aluminate-based stabilizers, zirconate-based stabilizers, isocyanate-based stabilizers, carboxylic acid-based stabilizers, and carboxylic acid anhydride-based stabilizers. (I) The optional additives may be used singly or in combination of two or more.

[0167] [11.(J) Solvent] The resin composition according to this embodiment may further contain a (J) solvent as an optional volatile component in addition to the non-volatile components (A) to (I) described above. Typically, an organic solvent is used as the (J) solvent. Examples of the organic solvent include ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, and cyclohexanone; ester-based solvents such as methyl acetate, ethyl acetate, butyl acetate, isobutyl acetate, isoamyl acetate, methyl propionate, ethyl propionate, and γ-butyrolactone; ether-based solvents such as tetrahydropyran, tetrahydrofuran, 1,4-dioxane, diethyl ether, diisopropyl ether, dibutyl ether, diphenyl ether, and anisole; alcohol-based solvents such as methanol, ethanol, propanol, butanol, and ethylene glycol; 2-ethoxyethyl acetate, propylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, ethyl diglycol acetate, γ-butyrolactone, and methyl methoxypropionate. Examples of suitable solvents include ether ester solvents such as ethyl acetate; ester alcohol solvents such as methyl lactate, ethyl lactate, and methyl 2-hydroxyisobutyrate; ether alcohol solvents such as 2-methoxypropanol, 2-methoxyethanol, 2-ethoxyethanol, propylene glycol monomethyl ether, and diethylene glycol monobutyl ether (butyl carbitol); amide solvents such as N,N-dimethylformamide, N,N-dimethylacetamide, and N-methyl-2-pyrrolidone; sulfoxide solvents such as dimethyl sulfoxide; nitrile solvents such as acetonitrile and propionitrile; aliphatic hydrocarbon solvents such as hexane, cyclopentane, cyclohexane, and methylcyclohexane; and aromatic hydrocarbon solvents such as benzene, toluene, xylene, ethylbenzene, and trimethylbenzene. (J) Solvents may be used singly or in combination of two or more.

[0168] The content of (J) solvent is not particularly limited, but when all components in the resin composition are taken as 100% by mass, it may be, for example, 60% by mass or less, 40% by mass or less, 30% by mass or less, 20% by mass or less, 15% by mass or less, 10% by mass or less, or may be 0% by mass.

[0169] [12. Method for producing resin composition] The resin composition according to the present embodiment can be produced, for example, by mixing the above-described components. Some or all of the above-described components may be mixed simultaneously, or they may be mixed sequentially. In the process of mixing each component, the temperature may be appropriately set, and thus heating and / or cooling may be performed temporarily or throughout. Furthermore, stirring or shaking may be performed in the process of mixing each component.

[0170] [13. Physical Properties of Resin Composition] When a resin composition layer containing the resin composition is laminated to an inner layer substrate, the resin composition according to this embodiment can suppress the occurrence of unevenness in the resin composition layer after lamination. For example, when the resin composition layer and the inner layer substrate are laminated under the conditions described in the section "Test Example 2: Evaluation of Unevenness After Lamination" in the Examples section below, the occurrence of unevenness in the form of depressions in the resin along the periphery of the inner layer substrate can be suppressed.

[0171] The resin composition according to this embodiment can provide a cured product with excellent plating adhesion. That is, when a conductor layer is formed on a cured product of the resin composition by plating, high adhesion can be achieved between the conductor layer and the cured product. For example, when the peel strength is measured under the conditions described in the section "Test Example 4: Measurement of Peel Strength" in the Examples section below, the peel strength can be increased. The peel strength represents the magnitude of the force required to peel off the conductor layer formed on the cured product of the resin composition by plating, and the greater this peel strength, the better the plating adhesion. The peel strength is preferably 0.30 kgf / cm or more, more preferably 0.32 kgf / cm or more, and particularly preferably 0.35 kgf / cm or more.

[0172] The resin composition according to this embodiment can usually give a cured product with a low dielectric loss tangent. For example, when the dielectric loss tangent of the cured product is measured under the conditions described in the section "Test Example 1: Measurement of Dielectric Loss Tangent" in the Examples section below, a low dielectric loss tangent can be obtained. The dielectric loss tangent of the cured product is preferably 0.0040 or less, more preferably 0.0030 or less, and particularly preferably 0.0028 or less.

[0173] The cured product of the resin composition according to this embodiment can usually have a small surface roughness when subjected to a roughening treatment. For example, when the arithmetic mean roughness Ra of the cured product after the roughening treatment is measured under the conditions described in the section "Test Example 3: Measurement of Arithmetic Mean Roughness (Ra)" in the Examples section below, a small arithmetic mean roughness Ra can be obtained. The arithmetic mean roughness Ra is preferably 150 nm or less, more preferably 130 nm or less, and particularly preferably 100 nm or less. There is no particular restriction on the lower limit, and it can be 30 nm or more, 40 nm or more, etc.

[0174] [14. Uses of resin compositions] The resin composition according to the present embodiment can be used as a resin composition for insulating purposes, and can be particularly suitably used as a resin composition for forming an insulating layer (a resin composition for forming an insulating layer). For example, the resin composition according to the present embodiment can be used as a resin composition for forming an insulating layer of a printed wiring board, and can be suitably used as a resin composition for forming an interlayer insulating layer (a resin composition for interlayer insulation purposes).

[0175] The resin composition according to the present embodiment may also be used as a resin composition for forming a rewiring formation layer (resin composition for forming a rewiring formation layer). The rewiring formation layer refers to an insulating layer for forming a rewiring layer. The rewiring layer refers to a conductor layer formed on the rewiring formation layer as an insulating layer. For example, when a semiconductor chip package is manufactured through the following steps (1) to (6), the resin composition according to the present embodiment may also be used as a resin composition for forming a rewiring formation layer. When a semiconductor chip package is manufactured through the following steps (1) to (6), a rewiring layer may also be formed on the sealing layer. (1) a step of laminating a temporary fixing film on a substrate; (2) a step of temporarily fixing a semiconductor chip on a temporary fixing film; (3) forming an encapsulation layer on the semiconductor chip; (4) peeling the substrate and the temporary fixing film from the semiconductor chip; (5) forming a rewiring formation layer as an insulating layer on the surface of the semiconductor chip from which the base material and the temporary fixing film have been peeled off; and (6) A step of forming a rewiring layer as a conductor layer on the rewiring formation layer.

[0176] Furthermore, the resin composition according to the present embodiment can be used in a wide range of applications in which resin compositions are used, such as sheet-like laminate materials such as resin sheets and prepregs, solder resists, underfill materials, die bonding materials, semiconductor encapsulating materials, hole filling resins, and component embedding resins.

[0177] [15. Sheet-type laminated materials] The resin composition according to this embodiment may be used by applying it in the form of a varnish, but from an industrial perspective, it is preferable to use it in the form of a sheet-like laminate material containing the resin composition.

[0178] As the sheet-like laminate material, the following resin sheets and prepregs are preferred.

[0179] In one embodiment, the resin sheet includes a support and a resin composition layer provided on the support. The resin composition layer is formed from the resin composition according to the present embodiment. Thus, the resin composition layer typically includes a resin composition, and preferably includes only a resin composition.

[0180] The thickness of the resin composition layer is preferably 50 μm or less, more preferably 40 μm or less, from the viewpoint of reducing the thickness of the printed wiring board and providing a cured product of the resin composition with excellent insulating properties even when the cured product is thin. The lower limit of the thickness of the resin composition layer is not particularly limited, but may be 5 μm or more, 10 μm or more, etc.

[0181] Examples of the support include films made of plastic materials, metal foils, and release papers, with films made of plastic materials and metal foils being preferred.

[0182] When a film made of a plastic material is used as the support, examples of the plastic material include polyesters such as polyethylene terephthalate (hereinafter sometimes abbreviated as "PET") and polyethylene naphthalate (hereinafter sometimes abbreviated as "PEN"), polycarbonate (hereinafter sometimes abbreviated as "PC"), acrylics such as polymethyl methacrylate (PMMA), cyclic polyolefins, triacetyl cellulose (TAC), polyether sulfide (PES), polyether ketone, polyimide, etc. Among these, polyethylene terephthalate and polyethylene naphthalate are preferred, with inexpensive polyethylene terephthalate being particularly preferred.

[0183] When a metal foil is used as the support, examples of the metal foil include copper foil and aluminum foil, with copper foil being preferred. The copper foil may be a foil made of a single metal, copper, or an alloy of copper and another metal (e.g., tin, chromium, silver, magnesium, nickel, zirconium, silicon, titanium, etc.).

[0184] The surface of the support that is to be bonded to the resin composition layer may be subjected to a matte treatment, a corona treatment, or an antistatic treatment.

[0185] The support may be a support with a release layer, which has a release layer on the surface that bonds with the resin composition layer. Examples of the release agent used in the release layer of the support with a release layer include one or more release agents selected from the group consisting of alkyd resins, polyolefin resins, urethane resins, and silicone resins. Commercially available products may be used as the support with a release layer, including, for example, "SK-1," "AL-5," and "AL-7" manufactured by Lintec Corporation, "Lumirror T60" manufactured by Toray Industries, Inc., "Purex" manufactured by Teijin Limited, and "Uni-Peel" manufactured by Unitika Limited, which are PET films having a release layer primarily composed of an alkyd resin-based release agent.

[0186] The thickness of the support is not particularly limited, but is preferably in the range of 5 μm to 75 μm, more preferably 10 μm to 60 μm. When a support with a release layer is used, it is preferable that the thickness of the entire support with a release layer is in the above range.

[0187] In one embodiment, the resin sheet may further include an optional layer as needed. Examples of such optional layers include a protective film conforming to the support and provided on the surface of the resin composition layer that is not bonded to the support (i.e., the surface opposite the support). The thickness of the protective film is not particularly limited, but is, for example, 1 μm to 40 μm. By laminating the protective film, it is possible to prevent dust from adhering to the surface of the resin composition layer and scratches.

[0188] The resin sheet can be produced, for example, by preparing a liquid (varnish) resin composition as is or by dissolving the resin composition in a solvent to prepare a liquid (varnish) resin composition, applying this to a support using a die coater or the like, and then drying it to form a resin composition layer.

[0189] The solvent may be the same as the solvent explained as a component of the resin composition. One type of solvent may be used alone, or two or more types may be used in combination.

[0190] Drying may be carried out by heating, blowing hot air, or the like. Drying conditions are not particularly limited, but drying is usually carried out so that the solvent content in the resin composition layer becomes 10% by mass or less, preferably 5% by mass or less. Although this varies depending on the boiling point of the solvent in the resin composition, for example, when a resin composition containing 30% by mass to 60% by mass of solvent is used, a resin composition layer can be formed by drying at 50°C to 150°C for 3 to 10 minutes.

[0191] The resin sheet can be stored in a rolled state. When the resin sheet has a protective film, it can usually be used by peeling off the protective film.

[0192] In one embodiment, the prepreg is formed by impregnating a sheet-like fiber substrate with the resin composition according to this embodiment.

[0193] The sheet-like fiber substrate used for the prepreg can be, for example, a commonly used prepreg substrate such as glass cloth, aramid nonwoven fabric, or liquid crystal polymer nonwoven fabric. From the viewpoint of thinning the printed wiring board, the thickness of the sheet-like fiber substrate is preferably 50 μm or less, more preferably 40 μm or less, even more preferably 30 μm or less, and particularly preferably 20 μm or less. The lower limit of the thickness of the sheet-like fiber substrate is not particularly limited, and is usually 10 μm or more.

[0194] The prepreg can be produced by a method such as a hot melt method or a solvent method.

[0195] The thickness of the prepreg can be in the same range as that of the resin composition layer in the resin sheet described above.

[0196] The sheet-like laminate material can be suitably used to form an insulating layer of a printed wiring board (for an insulating layer of a printed wiring board), and can be more suitably used to form an interlayer insulating layer of a printed wiring board (for an interlayer insulating layer of a printed wiring board).

[0197] [16. Printed Wiring Boards] A printed wiring board according to one embodiment of the present invention includes an insulating layer containing a cured product obtained by curing the resin composition according to this embodiment. This printed wiring board can be produced, for example, by using the resin sheet described above by a method including the following steps (I) and (II). (I) A step of laminating a resin sheet on an inner layer substrate so that the resin composition layer of the resin sheet is bonded to the inner layer substrate. (II) A step of curing the resin composition layer to form an insulating layer.

[0198] The "inner layer substrate" used in step (I) is a member that will become the substrate of a printed wiring board, and examples thereof include glass epoxy substrates, metal substrates, polyester substrates, polyimide substrates, BT resin substrates, and thermosetting polyphenylene ether substrates. The substrate may have a conductor layer on one or both sides, and this conductor layer may be patterned. An inner layer substrate having a conductor layer (circuit) formed on one or both sides of the substrate is sometimes called an "inner layer circuit board." Furthermore, intermediate products on which an insulating layer and / or a conductor layer is to be further formed during the production of a printed wiring board are also included in the aforementioned "inner layer substrate." When the printed wiring board is a circuit board with built-in components, an inner layer substrate with built-in components may be used.

[0199] The inner layer substrate and the resin sheet can be laminated, for example, by thermocompression bonding the resin sheet to the inner layer substrate from the support side. Examples of a member for thermocompression bonding the resin sheet to the inner layer substrate (hereinafter also referred to as a "thermocompression bonding member") include a heated metal plate (such as a SUS end plate) or a metal roll (SUS roll). Note that rather than pressing the thermocompression bonding member directly onto the resin sheet, it is preferable to press it via an elastic material such as heat-resistant rubber so that the resin sheet can sufficiently conform to the surface irregularities of the inner layer substrate.

[0200] The lamination of the inner layer substrate and the resin sheet may be carried out by a vacuum lamination method. In the vacuum lamination method, the thermocompression temperature is preferably in the range of 60°C to 160°C, more preferably 80°C to 140°C, the thermocompression pressure is preferably in the range of 0.098MPa to 1.77MPa, more preferably 0.29MPa to 1.47MPa, and the thermocompression time is preferably in the range of 20 seconds to 400 seconds, more preferably 30 seconds to 300 seconds. The lamination is preferably carried out under reduced pressure conditions of 26.7hPa or less.

[0201] The lamination can be performed using a commercially available vacuum laminator, such as a vacuum pressure laminator manufactured by Meiki Seisakusho Co., Ltd., a vacuum applicator manufactured by Nikko Materials Co., Ltd., or a batch vacuum pressure laminator.

[0202] After lamination, the laminated resin sheets may be smoothed under normal pressure (atmospheric pressure), for example, by pressing a thermocompression member from the support side. The pressing conditions for the smoothing treatment may be the same as the thermocompression conditions for lamination. The smoothing treatment may be performed using a commercially available laminator. Note that lamination and smoothing treatment may be performed consecutively using the commercially available vacuum laminator.

[0203] The support may be removed between step (I) and step (II), or may be removed after step (II).

[0204] In step (II), the resin composition layer is cured to form an insulating layer made of a cured product of the resin composition. The resin composition layer is usually cured by thermal curing. Specific curing conditions for the resin composition layer may be those typically used when forming an insulating layer for a printed wiring board.

[0205] For example, the thermal curing conditions for the resin composition layer vary depending on the type of resin composition, but in one embodiment, the curing temperature is preferably 120° C. to 240° C., more preferably 150° C. to 220° C., and even more preferably 170° C. to 210° C. The curing time is preferably 5 minutes to 120 minutes, more preferably 10 minutes to 100 minutes, and even more preferably 15 minutes to 100 minutes.

[0206] Before thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature lower than the curing temperature. For example, prior to thermally curing the resin composition layer, the resin composition layer may be preheated at a temperature of 50°C to 150°C, preferably 60°C to 140°C, more preferably 70°C to 130°C for 5 minutes or more, preferably 5 minutes to 150 minutes, more preferably 15 minutes to 120 minutes, and even more preferably 15 minutes to 100 minutes.

[0207] When manufacturing a printed wiring board, the following steps may be further performed: (III) drilling holes in the insulating layer, (IV) roughening the insulating layer, and (V) forming a conductor layer. These steps (III) to (V) may be performed according to various methods known to those skilled in the art and used in manufacturing printed wiring boards. When the support is removed after step (II), the removal of the support may be performed between steps (II) and (III), between steps (III) and (IV), or between steps (IV) and (V). Furthermore, if necessary, the formation of the insulating layer and the conductor layer in steps (I) to (V) may be repeated to form a multilayer wiring board.

[0208] In another embodiment, a printed wiring board can be manufactured using the above-mentioned prepreg. The manufacturing method can be basically the same as when a resin sheet is used.

[0209] Step (III) is a step of drilling holes in the insulating layer, thereby forming holes such as via holes and through holes in the insulating layer. Step (III) may be performed using, for example, a drill, a laser, plasma, or the like, depending on the composition of the resin composition used to form the insulating layer. The dimensions and shape of the holes may be determined appropriately depending on the design of the printed wiring board.

[0210] Step (IV) is a step of roughening the insulating layer. Typically, smear removal is also performed in this step (IV). The roughening treatment procedure and conditions are not particularly limited, and known procedures and conditions commonly used in forming insulating layers for printed wiring boards can be adopted. For example, the insulating layer can be roughened by performing a swelling treatment with a swelling liquid, a roughening treatment with an oxidizing agent, and a neutralization treatment with a neutralizing liquid in this order.

[0211] Examples of swelling liquids used in the roughening treatment include alkaline solutions and surfactant solutions, with alkaline solutions being preferred. Examples of the alkaline solution include sodium hydroxide solution and potassium hydroxide solution. Examples of commercially available swelling liquids include "Swelling Dip Securigance P" and "Swelling Dip Securigance SBU" manufactured by Atotech Japan. Swelling treatment using a swelling liquid can be performed by immersing the insulating layer in the swelling liquid at 30°C to 90°C for 1 to 20 minutes. From the viewpoint of suppressing swelling of the resin in the insulating layer to an appropriate level, it is preferable to immerse the insulating layer in the swelling liquid at 40°C to 80°C for 5 to 15 minutes.

[0212] Examples of oxidizing agents used in the roughening treatment include alkaline permanganate solutions prepared by dissolving potassium permanganate or sodium permanganate in an aqueous solution of sodium hydroxide. Roughening treatment using an oxidizing agent such as alkaline permanganate solution is preferably carried out by immersing the insulating layer in an oxidizing agent solution heated to 60°C to 100°C for 10 to 30 minutes. The concentration of permanganate in the alkaline permanganate solution is preferably 5% by mass to 10% by mass. Commercially available oxidizing agents include alkaline permanganate solutions such as "Concentrate Compact CP" and "Dosing Solution Securigance P" manufactured by Atotech Japan.

[0213] The neutralizing solution used in the roughening treatment is preferably an acidic aqueous solution, and a commercially available product such as "Reduction Solution Securigant P" manufactured by Atotech Japan can be cited. Treatment with a neutralizing solution can be carried out by immersing the surface that has been roughened with an oxidizing agent in a neutralizing solution at 30°C to 80°C for 5 to 30 minutes. From the standpoint of workability, a preferred method is to immerse the object that has been roughened with an oxidizing agent in a neutralizing solution at 40°C to 70°C for 5 to 20 minutes.

[0214] In one embodiment, the arithmetic mean roughness (Ra) of the insulating layer surface after the roughening treatment is preferably 500 nm or less, more preferably 400 nm or less, and even more preferably 300 nm or less. There is no particular limitation on the lower limit and it can be, for example, 1 nm or more, 2 nm or more, etc. Furthermore, the root mean square roughness (Rq) of the insulating layer surface after the roughening treatment is preferably 500 nm or less, more preferably 400 nm or less, and even more preferably 300 nm or less. There is no particular limitation on the lower limit and it can be, for example, 1 nm or more, 2 nm or more, etc. The arithmetic mean roughness (Ra) and root mean square roughness (Rq) of the insulating layer surface can be measured using a non-contact surface roughness meter.

[0215] Step (V) is a step of forming a conductor layer, and the conductor layer is formed on the insulating layer. The conductor material used for the conductor layer is not particularly limited. In a preferred embodiment, the conductor layer contains one or more metals selected from the group consisting of gold, platinum, palladium, silver, copper, aluminum, cobalt, chromium, zinc, nickel, titanium, tungsten, iron, tin, and indium. The conductor layer may be a single metal layer or an alloy layer. Examples of alloy layers include layers formed from alloys of two or more metals selected from the above group (e.g., nickel-chromium alloys, copper-nickel alloys, and copper-titanium alloys). Among these, from the viewpoints of versatility in forming the conductor layer, cost, ease of patterning, etc., a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy, a copper-nickel alloy, or a copper-titanium alloy is preferred, a single metal layer of chromium, nickel, titanium, aluminum, zinc, gold, palladium, silver, or copper, or an alloy layer of a nickel-chromium alloy is more preferred, and a single metal layer of copper is even more preferred.

[0216] The conductor layer may have a single layer structure, or a multi-layer structure in which two or more single metal layers or alloy layers made of different types of metals or alloys are laminated. When the conductor layer has a multi-layer structure, the layer in contact with the insulating layer is preferably a single metal layer of chromium, zinc, or titanium, or an alloy layer of a nickel-chromium alloy.

[0217] The thickness of the conductor layer depends on the desired design of the printed wiring board, but is generally 3 μm to 35 μm, preferably 5 μm to 30 μm.

[0218] In one embodiment, the conductor layer may be formed by plating. For example, a conductor layer having a desired wiring pattern can be formed by plating the surface of the insulating layer using a conventionally known technique such as a semi-additive method or a full-additive method. From the viewpoint of ease of production, the semi-additive method is preferred. An example of forming a conductor layer using a semi-additive method will be described below.

[0219] First, a plating seed layer is formed on the surface of an insulating layer by electroless plating. Next, a mask pattern is formed on the formed plating seed layer, exposing a portion of the plating seed layer corresponding to the desired wiring pattern. After a metal layer is formed on the exposed plating seed layer by electrolytic plating, the mask pattern is removed. Thereafter, unnecessary plating seed layer is removed by etching or the like, thereby forming a conductor layer having the desired wiring pattern.

[0220] In another embodiment, the conductor layer may be formed using a metal foil. When a metal foil is used to form the conductor layer, step (V) is preferably performed between steps (I) and (II). For example, after step (I), the support is removed, and a metal foil is laminated on the exposed surface of the resin composition layer. The lamination of the resin composition layer and the metal foil may be performed by a vacuum lamination method. The lamination conditions may be the same as those described for step (I). Next, step (II) is performed to form an insulating layer. Thereafter, a conductor layer having a desired wiring pattern can be formed using the metal foil on the insulating layer by a conventionally known technique such as a subtractive method or a modified semi-additive method.

[0221] The metal foil can be produced by a known method such as an electrolytic method, a rolling method, etc. Examples of commercially available metal foils include HLP foil and JXUT-III foil manufactured by JX Nippon Mining & Metals Corporation, and 3EC-III foil and TP-III foil manufactured by Mitsui Mining & Smelting Co., Ltd.

[0222] [17. Semiconductor Devices] A semiconductor device according to one embodiment of the present invention includes the printed wiring board. The semiconductor device can be manufactured using the printed wiring board.

[0223] Examples of semiconductor devices include various semiconductor devices used in electrical appliances (for example, computers, mobile phones, digital cameras, and televisions) and vehicles (for example, motorcycles, automobiles, trains, ships, and aircraft). [Example]

[0224] The present invention will be specifically described below with reference to examples. However, the present invention is not limited to these examples. In the following description, "parts" and "%" representing amounts mean "parts by mass" and "% by mass", respectively, unless otherwise specified. Furthermore, unless otherwise specified, the temperature and pressure conditions were room temperature (25°C) and atmospheric pressure (1 atm).

[0225] [Example 1] Eight parts of a biphenyl-type epoxy resin ("NC3000L" manufactured by Nippon Kayaku Co., Ltd., epoxy equivalent weight: approximately 269 g / eq.) and two parts of a naphthalene-type epoxy resin ("HP-4032-SS" manufactured by DIC Corporation, 1,6-bis(glycidyloxy)naphthalene, epoxy equivalent weight: approximately 145 g / eq.) were heated and dissolved in 15 parts of solvent naphtha with stirring. The mixture was cooled to room temperature to prepare a dissolved epoxy resin composition.

[0226] This epoxy resin solution was mixed with 2 parts of a sulfur-containing maleimide compound ("SA-IMIDE 105HG" manufactured by Sakai Chemical Industry Co., Ltd., weight-average molecular weight 1200), 40 parts of an active ester compound ("HPC-8150-62T" manufactured by DIC Corporation, active ester group equivalent weight approximately 220 g / eq., non-volatile content 62% by mass in toluene solution), and spherical silica ("SO-C2" manufactured by Admatechs Co., Ltd., average particle size 0.5 μm, specific surface area 5.8 m) surface-treated with a silane coupling agent ("KBM-573" manufactured by Shin-Etsu Chemical Co., Ltd.). 2 A resin composition was prepared by mixing 100 parts of hydroxybenzoate (100%), 2 parts of a triazine skeleton-containing phenolic curing agent (DIC Corporation's "LA-3018-50P," active group equivalent weight approximately 151 g / eq., 2-methoxypropanol solution with a non-volatile content of 50%), 5 parts of a carbodiimide curing agent (Nisshinbo Chemical Inc.'s "V-03," active group equivalent weight approximately 216 g / eq., toluene solution with a non-volatile content of 50%), 0.1 parts of an imidazole curing accelerator (Shikoku Chemical Industries Co., Ltd.'s "1B2PZ," 1-benzyl-2-phenylimidazole), and 2 parts of a phenoxy resin (Mitsubishi Chemical Corporation's "YX7553BH30," a 1:1 solution of MEK and cyclohexanone with a non-volatile content of 30% by mass). The mixture was uniformly dispersed using a high-speed rotary mixer.

[0227] [Example 2] Instead of 2 parts of a sulfur-containing maleimide compound (Sakai Chemical Industry Co., Ltd.'s "SA-IMIDE 105HG"), 2 parts of a sulfur-containing maleimide (Sakai Chemical Industry Co., Ltd.'s "SA-IMIDE 1705", weight-average molecular weight 2200) were used. Furthermore, instead of 40 parts of an active ester compound (DIC Corporation's "HPC-8150-62T", active ester group equivalent weight approximately 220 g / eq., toluene solution with a non-volatile content of 62% by mass), 40 parts of an active ester compound (DIC Corporation's "HPC-8000-65T", active ester group equivalent weight approximately 223 g / eq., toluene solution with a non-volatile content of 65% by mass) were used. A resin composition was prepared in the same manner as in Example 1, except for the above.

[0228] [Example 3] The amount of sulfur-containing maleimide compound (Sakai Chemical Industry Co., Ltd., "SA-IMIDE 105HG") was changed from 2 parts to 4 parts. Also, instead of the combination of 8 parts of biphenyl-type epoxy resin (Nippon Kayaku Co., Ltd., "NC3000L," epoxy equivalent: approximately 269 g / eq.) and 2 parts of naphthalene-type epoxy resin (DIC Corporation, "HP-4032-SS," 1,6-bis(glycidyloxy)naphthalene, epoxy equivalent: approximately 145 g / eq.), 10 parts of biphenyl-type epoxy resin (Nippon Kayaku Co., Ltd., "NC3000L," epoxy equivalent: approximately 269 g / eq.) was used. Furthermore, spherical silica (Admatechs Co., Ltd., "SO-C2," average particle size: 0.5 μm, specific surface area: 5.8 m) surface-treated with a silane coupling agent (Shin-Etsu Chemical Co., Ltd., "KBM-573") was used. 2 The amount of the hydroxybenzoate (100 parts / g) was changed from 100 parts to 120 parts. Except for the above, a resin composition was prepared in the same manner as in Example 1.

[0229] [Example 4] The amount of sulfur-containing maleimide compound (Sakai Chemical Industry Co., Ltd.'s "SA-IMIDE 105HG") was changed from 2 parts to 1 part. One part of sulfur-containing maleimide compound (Sakai Chemical Industry Co., Ltd.'s "SA-IMIDE 1705") was added to the resin composition. Instead of a combination of 8 parts of biphenyl-type epoxy resin (Nippon Kayaku Co., Ltd.'s "NC3000L," epoxy equivalent: approximately 269 g / eq.) and 2 parts of naphthalene-type epoxy resin (DIC Corporation's "HP-4032-SS," 1,6-bis(glycidyloxy)naphthalene, epoxy equivalent: approximately 145 g / eq.), 10 parts of naphthalene-type epoxy resin (DIC Corporation's "HP-4032-SS," 1,6-bis(glycidyloxy)naphthalene, epoxy equivalent: approximately 145 g / eq.) was used. Except for the above, the resin composition was prepared in the same manner as in Example 1.

[0230] [Example 5] To the resin composition, 2 parts of a biphenylaralkyl novolac maleimide compound ("MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd., a MEK / toluene mixed solution with a non-volatile content of 70%) was added. Except for the above, the resin composition was prepared in the same manner as in Example 1.

[0231] [Example 6] Two parts of methacrylic-modified polyphenylene ether (SA9000-111 manufactured by SABIC Innovative Plastics) were added to the resin composition. Except for the above, the resin composition was prepared in the same manner as in Example 1.

[0232] [Example 7] To the resin composition, 2 parts of vinylbenzyl-modified polyphenylene ether ("OPE-2St 2200" manufactured by Mitsubishi Gas Chemical Co., Inc., a toluene solution with a non-volatile content of 65%) was added. Except for the above, the resin composition was prepared in the same manner as in Example 1.

[0233] [Comparative Example 1] A sulfur-containing maleimide compound (Sakai Chemical Industry Co., Ltd.'s "SA-IMIDE 105HG") was not used. Instead of a combination of 8 parts of a biphenyl-type epoxy resin (Nippon Kayaku Co., Ltd.'s "NC3000L," epoxy equivalent: approximately 269 g / eq.) and 2 parts of a naphthalene-type epoxy resin (DIC Corporation's "HP-4032-SS," 1,6-bis(glycidyloxy)naphthalene, epoxy equivalent: approximately 145 g / eq.), 10 parts of a naphthalene-type epoxy resin (DIC Corporation's "HP-4032-SS," 1,6-bis(glycidyloxy)naphthalene, epoxy equivalent: approximately 145 g / eq.) was used. Furthermore, 40 parts of an active ester compound (DIC Corporation's "HPC-8150-62T," an active ester group equivalent of approximately 220 g / eq., a toluene solution with a non-volatile content of 62% by mass) was replaced with 40 parts of an active ester compound (DIC Corporation's "HPC-8000-65T," an active ester group equivalent of approximately 223 g / eq., a toluene solution with a non-volatile content of 65%.) Except for the above, a resin composition was prepared in the same manner as in Example 1.

[0234] Comparative Example 2 A sulfur-containing maleimide compound (Sakai Chemical Industry Co., Ltd., "SA-IMIDE 105HG") was not used. Also, instead of a combination of 8 parts of biphenyl-type epoxy resin (Nippon Kayaku Co., Ltd., "NC3000L", epoxy equivalent: approximately 269 g / eq.) and 2 parts of naphthalene-type epoxy resin (DIC Corporation, "HP-4032-SS", 1,6-bis(glycidyloxy)naphthalene, epoxy equivalent: approximately 145 g / eq.), 10 parts of biphenyl-type epoxy resin (Nippon Kayaku Co., Ltd., "NC3000L", epoxy equivalent: approximately 269 g / eq.) was used. Furthermore, spherical silica (Admatechs Co., Ltd., "SO-C2", average particle size: 0.5 μm, specific surface area: 5.8 m) surface-treated with a silane coupling agent (Shin-Etsu Chemical Co., Ltd., "KBM-573") was used. 2 The amount of the hydroxybenzoate (100 parts / g) was changed from 100 parts to 120 parts. Except for the above, a resin composition was prepared in the same manner as in Example 1.

[0235] [Test Example 1: Measurement of dielectric loss tangent] (1) Preparation of resin sheet A having a resin composition layer thickness of 40 μm: A polyethylene terephthalate film ("AL5" manufactured by Lintec Corporation, thickness 38 μm) with a release layer was prepared as a support. The resin compositions obtained in the Examples and Comparative Examples were uniformly applied onto the release layer of this support so that the thickness of the resin composition layer after drying would be 40 μm. Thereafter, the resin composition was dried at 80°C to 100°C (average 90°C) for 4 minutes to obtain a resin sheet A including a support and a resin composition layer.

[0236] (2) Preparation of Cured Product B for Evaluation: Resin sheet A was heated in an oven at 190°C for 90 minutes to cure the resin composition layer. Resin sheet A was removed from the oven, and the support was peeled off to obtain a cured product of the resin composition layer. This cured product was cut into a length of 80 mm and a width of 2 mm to obtain a cured product B for evaluation.

[0237] (3) Measurement of relative permittivity and dielectric loss tangent: The dielectric loss tangent (Df value) of the cured evaluation material B was measured by the cavity resonance perturbation method using an Agilent Technologies HP8362B at a measurement frequency of 5.8 GHz and a measurement temperature of 23°C. Measurements were performed on two test pieces, and the average was calculated.

[0238] [Test Example 2: Evaluation of unevenness after lamination] (1) Preparation of inner layer board: A glass cloth-based epoxy resin double-sided copper-clad laminate (copper foil thickness 18 μm, substrate thickness 0.4 mm, Panasonic "R1515A") was prepared as an inner layer substrate having a copper layer on the surface and an inner layer circuit formed thereon. Both sides of this inner layer substrate were etched 1 μm deep with a microetching agent (MEC "CZ8101") to roughen the copper surface.

[0239] (2) Lamination of resin sheet A: Using a batch-type vacuum pressure laminator (Nikko Materials Co., Ltd., two-stage build-up laminator "CVP700"), the resin sheet A obtained in step (1) of Test Example 1 was laminated onto both sides of the inner layer substrate so that the resin composition layer was in contact with the inner layer substrate. Lamination was performed by reducing the pressure for 30 seconds to 13 hPa or less, followed by pressure bonding at 120°C and a pressure of 0.74 MPa for 30 seconds. Next, a heat press was performed at 100°C and a pressure of 0.5 MPa for 60 seconds.

[0240] (3) Evaluation of unevenness after lamination: After lamination, the resin composition layer was observed and evaluated for unevenness. When recesses in the resin were observed along the periphery of the inner layer substrate, the unevenness was evaluated as "present," and when no recesses were observed, the unevenness was evaluated as "absent."

[0241] [Test Example 3: Measurement of arithmetic mean roughness (Ra)] (1) Thermal curing of the resin composition layer: The inner layer substrate laminated with resin sheet A in step (2) of Test Example 2 was placed in an oven at 130°C and heated for 30 minutes, then transferred to an oven at 170°C and heated for 30 minutes to thermally cure the resin composition layer and form an insulating layer. The support was then peeled off to obtain cured substrate A having the insulating layer, inner layer substrate, and insulating layer in this order.

[0242] (2) Roughening treatment: A desmear treatment as a roughening treatment was performed on the cured substrate A. The desmear treatment was the following wet desmear treatment. (wet desmear treatment) Cured Substrate A was immersed in a swelling solution (Atotech Japan's "Swelling Dip Securigant P," an aqueous solution of diethylene glycol monobutyl ether and sodium hydroxide) at 60°C for 5 minutes, then in an oxidizing solution (Atotech Japan's "Concentrate Compact CP," an aqueous solution of potassium permanganate approximately 6% and sodium hydroxide approximately 4%) at 80°C for 20 minutes, then in a neutralizing solution (Atotech Japan's "Reduction Solution Securigant P," an aqueous sulfuric acid solution) at 40°C for 5 minutes, and then dried at 80°C for 15 minutes.

[0243] (3) Measurement of the arithmetic mean roughness (Ra) of the insulating layer surface after roughening treatment: The arithmetic mean roughness (Ra) of the insulating layer surface after roughening treatment was determined using a non-contact surface roughness meter (WYKO NT3300 manufactured by Bruker) in VSI mode with a 50x lens and a measurement range of 121 μm × 92 μm. Measurements were taken at 10 points, and the average value was calculated.

[0244] [Test Example 4: Measurement of Peel Strength] (1) Formation of the conductor layer: A conductor layer was formed on the roughened surface of the insulating layer of cured substrate A, which had been roughened in step (2) of Test Example 3, using a semi-additive process. Specifically, the roughened cured substrate A was immersed in an electroless plating solution containing PdCl2 at 40°C for 5 minutes, and then in an electroless copper plating solution at 25°C for 20 minutes. Next, an annealing treatment was performed by heating at 150°C for 30 minutes, after which an etching resist was formed and a pattern was formed by etching. Subsequently, a conductor layer with a thickness of 25 μm was formed by copper sulfate electroplating, and an annealing treatment was performed at 190°C for 60 minutes. The resulting substrate is referred to as "evaluation substrate B."

[0245] (2) Measurement of peel strength of plated conductor layer: The peel strength of the insulating layer and conductor layer was measured in accordance with the Japanese Industrial Standard (JIS C6481). Specifically, a cut was made in the conductor layer of evaluation board B, enclosing an area 10 mm wide and 100 mm long. One end of this area was peeled off and gripped with a gripping tool. At room temperature (25°C), the board was pulled vertically at a rate of 50 mm / min, and the load (kgf / cm) when 35 mm was peeled off was measured as the peel strength. A tensile tester (TSE "AC-50C-SL") was used for the measurement.

[0246] [result] The results of the above-mentioned Examples and Comparative Examples are shown in the table below.

[0247] [Table 1]

[0248] In the examples, it was confirmed that even when components (E) to (H) were not contained, the same results as in the above examples were obtained, although to a different extent.

Claims

1. (A) a maleimide compound having a sulfur atom and a maleimide group, (B) an epoxy resin, (C) an activated ester compound, and (D) an inorganic filler, A polymer of a monomer composition in which the component (A) comprises: (a1) a maleimide compound having two or more maleimide groups in one molecule; (a2) a thiol compound having two or more thiol groups in one molecule; and (a3) ​​an allyl compound having one or more aromatic rings and two or more allyl groups in one molecule, wherein the component (a1) is represented by formula (a1-1), the component (a2) is represented by formula (a2-1) or formula (a2-2), and the component (a3) ​​is represented by at least any one of formulas (a3-1) to (a3-6), A resin composition comprising, when the nonvolatile components in the resin composition are taken as 100 mass%, 0.1 mass% to 10 mass% of component (A), 1 mass% to 20 mass% of component (B), 10 mass% to 35 mass% of component (C), and 60 mass% to 86 mass% of component (D), wherein the mass ratio W A / (W B +W C ) of the mass W A of component (A) to the total mass W B +W C of components (B) and (C) is 0.01 to 1.

0. 【Chemistry 1】 (In formula (a1-1), R 11 to R 14 each independently represent at least one selected from the group consisting of a hydrogen atom, an alkyl group, and a halogen atom, and X represents a divalent organic group containing an aromatic ring.) 【Chemistry 2】 (In formula (a2-1), Y represents an organic group having a cyclic structure; each R 21 independently represents a divalent organic group containing a hydrocarbon group; each R 22 independently represents at least one selected from the group consisting of a hydrogen atom, an alkyl group, and a halogen atom; m1 represents an integer of 2 to 10; and n1 represents an integer of 0 to 8. In formula (a2-2), Z represents an organic group having 1 to 6 carbon atoms, each R 23 independently represents a divalent organic group containing a hydrocarbon group, each R 24 independently represents at least one selected from the group consisting of a hydrogen atom, an alkyl group, and a halogen atom, m2 represents an integer of 2 to 6, n2 represents an integer of 0 to 4, and m2+n2 is an integer of 2 to 6. 【Transformation 3】 (In formula (a3-6), n3 represents an integer of 1 to 1000.) 2. The resin composition according to claim 1, wherein the mass ratio W A / W D of the mass W A of the component (A) to the mass W D of the component (D) is 0.01 or more and 0.1 or less.

3. The resin composition according to claim 1 or 2, further comprising one or more curing agents (E) selected from the group consisting of phenolic curing agents and carbodiimide curing agents.

4. The resin composition according to any one of claims 1 to 3, further comprising (F) a curing accelerator.

5. The resin composition according to any one of claims 1 to 4, further comprising (G) a thermoplastic resin.

6. The resin composition according to any one of claims 1 to 5, which is used to form an insulating layer.

7. A cured product of the resin composition according to any one of claims 1 to 6.

8. A sheet-like laminate material comprising the resin composition according to any one of claims 1 to 6.

9. A resin sheet comprising a support and a resin composition layer formed on the support from the resin composition according to any one of claims 1 to 6.

10. A printed wiring board comprising an insulating layer containing a cured product of the resin composition according to any one of claims 1 to 6.

11. A semiconductor device comprising the printed wiring board according to claim 10.

Images