Thermal management system
The thermal management system addresses uneven medium distribution by using separate high- and low-temperature circuits with storage chambers and flow control, achieving balanced temperature control for electric vehicle components.
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-02-22
- Publication Date
- 2026-03-13
AI Technical Summary
Conventional heat management systems for electric vehicles face issues with uneven distribution and imbalance of heat transfer medium, leading to inefficiencies and excess medium in reserve tanks, which can cause overheating or underheating of temperature-controlled objects.
A thermal management system with separate high-temperature and low-temperature circuits, including storage chambers and temperature control units, ensures balanced circulation and temperature adjustment of the heat transfer medium, preventing overheating or underheating by using partition walls and flow path switching valves.
The system effectively controls temperature by balancing heat transfer medium distribution, minimizing cost and ensuring consistent heating or cooling of temperature-controlled objects like batteries and vehicle interiors, while reducing the need for additional heat exchangers.
Smart Images

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Abstract
Description
Technical Field
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[0001] The present invention relates to a heat management system that circulates a heat medium to a temperature control target for temperature control.
Background Art
[0002] Conventionally, for example, batteries (cells), driving electric motors, inverters, etc. (hereinafter referred to as temperature control targets) mounted on electric vehicles (electric cars, hybrid cars, etc.) generate heat. Therefore, there are those that circulate a heat medium to a plurality of temperature control targets for temperature control, or those that use a heat pump circuit (refrigerant circuit) for air conditioning in the vehicle interior and use a radiator to dissipate heat of a refrigerant (Freon refrigerant) and absorb heat in an absorber to heat and cool a heat medium (such as water), and circulate this heat medium to the temperature control target through a heat medium circuit to perform temperature control. Heat management systems have been developed (see, for example, Patent Documents 1, 2, and 3). <However, in configurations such as those described in Patent Documents 2 and 3, it is necessary to provide a heat exchanger for the temperature-controlled object in the heat pump circuit, in addition to the heat exchangers for the heater core and cooler core for air conditioning. Therefore, it is conceivable to circulate the heat transfer medium that is circulated to the cooler core and the heat transfer medium that is circulated to the temperature-controlled object as well. However, the amount of heat transfer medium that flows to the temperature-controlled object does not necessarily return to the cooler core side or the heater core side in the same amount that was introduced, which can lead to an imbalance and an excess of one of the heat transfer mediums, causing the reserve tank to become full.
[0005] This invention was made to solve the aforementioned conventional technical problems, and aims to provide a thermal management system that enables inexpensive temperature control of a temperature-controlled object by circulating a heat transfer medium around the object, and also eliminates problems associated with uneven distribution of the heat transfer medium. [Means for solving the problem]
[0006] To solve the above problems, the thermal management system of the present invention is equipped with a thermal medium circuit that controls the temperature of a temperature-controlled object by circulating a thermal medium, and comprises: a temperature control circuit having a circulation unit that circulates the thermal medium to the temperature-controlled object; a high-temperature thermal medium circuit having a heating unit that heats the thermal medium and through which the thermal medium heated by the heating unit is circulated; a low-temperature thermal medium circuit connected to the temperature control circuit and having a cooling unit that cools the thermal medium and through which the thermal medium cooled by the cooling unit is circulated; and a low-temperature thermal medium circuit from the temperature control circuit The device is provided on a path for returning a heat transfer medium to the path and includes a storage section for storing the heat transfer medium, the storage section being characterized by having a high-temperature side storage chamber into which a heat transfer medium flowing in a high-temperature heat transfer medium circuit is introduced and stored and which has a high-temperature side outlet for returning the heat transfer medium to the high-temperature heat transfer medium circuit, a temperature-controlled side storage chamber into which a heat transfer medium circulating in a temperature-controlled circuit is introduced and stored, and a partition wall separating the high-temperature side storage chamber and the temperature-controlled side storage chamber in a state in which the heat transfer medium in the high-temperature side storage chamber and the heat transfer medium in the temperature-controlled side storage chamber have a heat exchange relationship.
[0007] Second inventionThe thermal management system of the above invention is characterized in that the high-temperature side storage chamber consists of a high-temperature side storage chamber for heat exchange in which the heat transfer medium is in contact with the partition wall, and a high-temperature side storage chamber for bypass in which the heat transfer medium is not in contact with the partition wall, and is equipped with a temperature control unit that switches whether to introduce the heat transfer medium flowing through the high-temperature heat transfer medium circuit into the high-temperature side storage chamber for heat exchange or into the high-temperature side storage chamber for bypass.
[0008] Third Invention The thermal management system of the above invention is characterized in that, when the temperature control unit introduces the heat transfer medium flowing through the high-temperature heat transfer medium circuit into the high-temperature heat exchange storage chamber when the temperature of the heat transfer medium is lower than a predetermined value, the heat transfer medium is introduced into the high-temperature heat exchange storage chamber.
[0009] The fourth invention The thermal management system is as described above. The second invention or the third invention The storage section is characterized in that it has a low-temperature storage chamber into which a heat transfer medium flowing through a low-temperature heat transfer medium circuit is introduced and stored, and which has a low-temperature outlet for supplying the heat transfer medium to a temperature control circuit, and the low-temperature storage chamber and the high-temperature storage chamber are in communication with each other at their upper parts.
[0010] The fifth invention The thermal management system of the above invention is characterized by having another temperature control unit that switches whether or not to introduce the heat transfer medium in the low-temperature storage chamber into the temperature control circuit.
[0011] The sixth invention The thermal management system of the above invention is characterized in that, in the other temperature control unit, when the temperature of the heat transfer medium flowing through the temperature control circuit exceeds a predetermined value, the heat transfer medium is introduced from the low-temperature storage chamber into the temperature control circuit.
[0012] The seventh invention The thermal management system is Inventions 2 through 6 The temperature control unit is characterized by having a temperature-sensing unit that senses the temperature of the fluid flowing inside and is a flow path switching valve that switches the flow path of the said fluid.
[0013] The eighth inventionThe thermal management system is characterized in that, in each of the above inventions, the temperature control target is a battery mounted on a vehicle, a vehicle's traction motor, or an inverter that drives said motor.
[0014] The ninth invention The thermal management system is characterized in that, in each of the above inventions, the high-temperature heat transfer medium circuit has a heater core for which a heat transfer medium heated by a heating unit is circulated to heat the interior of the vehicle, and the low-temperature heat transfer medium circuit has a cooler core for which a heat transfer medium cooled by a cooling unit is circulated to cool the interior of the vehicle.
[0015] The 10th Invention The thermal management system of the above invention comprises a heat pump circuit having a compressor for compressing a refrigerant, a heat radiator for releasing heat from the refrigerant discharged from the compressor, a pressure reducing unit for reducing the pressure of the refrigerant released by the heat radiator, and a heat absorber for releasing heat from the refrigerant reduced by the pressure reducing unit, wherein the heat radiator and the heating unit of the high-temperature heat transfer medium circuit are arranged in a heat exchange relationship, and the heat absorber and the cooling unit of the low-temperature heat transfer medium circuit are arranged in a heat exchange relationship. [Effects of the Invention]
[0016] According to the present invention, in a thermal management system that controls the temperature of a temperature-controlled object by circulating a heat transfer medium, the system comprises: a temperature control circuit having a circulation unit for circulating the heat transfer medium to the temperature-controlled object; a high-temperature heat transfer medium circuit having a heating unit for heating the heat transfer medium and through which the heat transfer medium heated by the heating unit is circulated; a low-temperature heat transfer medium circuit connected to the temperature control circuit and having a cooling unit for cooling the heat transfer medium and through which the heat transfer medium cooled by the cooling unit is circulated; and a storage unit for storing the heat transfer medium provided on the path for returning the heat transfer medium from the temperature control circuit to the low-temperature heat transfer medium circuit, wherein the storage unit is high temperature The system has a high-temperature side storage chamber into which the heat transfer medium flowing through the heat transfer medium circuit is introduced and stored, and a high-temperature side outlet that returns the heat transfer medium to the high-temperature heat transfer medium circuit; a temperature-controlled side storage chamber into which the heat transfer medium circulating through the temperature-controlled circuit is introduced and stored; and a partition wall that separates the high-temperature side storage chamber and the temperature-controlled side storage chamber while the heat transfer medium in the high-temperature side storage chamber and the heat transfer medium in the temperature-controlled side storage chamber are in a heat exchange relationship. As a result, the heat transfer medium in the high-temperature side storage chamber of the storage unit heats the heat transfer medium in the temperature-controlled side storage chamber, thereby warming up the temperature-controlled object. Furthermore, by introducing the heat transfer medium from the low-temperature heat transfer medium circuit into the temperature-controlled circuit, the temperature-controlled object can also be cooled, thereby enabling effective temperature control of the temperature-controlled object.
[0017] In this case, since the heat transfer medium is not introduced from the high-temperature heat transfer medium circuit to the temperature control circuit, there is no imbalance in the heat transfer medium between the high-temperature and low-temperature heat transfer medium circuits. In particular, a storage section is provided on the path that returns the heat transfer medium from the temperature control circuit to the low-temperature heat transfer medium circuit, and heat exchange occurs between the heat transfer medium of the high-temperature heat transfer medium circuit and the heat transfer medium of the temperature control circuit in this storage section, so the increase in cost can be kept to a minimum.
[0018] Also, Second inventionAccording to the above invention, in addition to the above, the high-temperature side storage chamber is composed of a high-temperature side storage chamber for heat exchange where the heat medium contacts the partition wall and a high-temperature side storage chamber for bypass where the heat medium does not contact the partition wall. A temperature adjustment unit is provided to switch whether to introduce the heat medium flowing through the high-temperature heat medium circuit into the high-temperature side storage chamber for heat exchange or into the high-temperature side storage chamber for bypass. Therefore, when heating of the temperature control target is required, the temperature adjustment unit causes the heat medium of the high-temperature heat medium circuit to flow into the high-temperature side storage chamber for heat exchange to warm up the temperature control target. When heating is not required, the heat medium of the high-temperature heat medium circuit is caused to flow into the high-temperature side storage chamber for bypass, so that excessive heating of the temperature control target can be prevented.
[0019] In this case, Third Invention if the temperature adjustment unit is configured such that when the temperature of the heat medium flowing through the high-temperature heat medium circuit is lower than a predetermined value, the heat medium is introduced into the high-temperature side storage chamber for heat exchange, the temperature control target can be quickly warmed up.
[0020] Also, The fourth invention as shown in [ ], a low-temperature side storage chamber having a low-temperature side outlet through which the heat medium flowing through the low-temperature heat medium circuit is introduced and stored in the storage unit and the heat medium is allowed to flow into the temperature control circuit is provided. By connecting the low-temperature side storage chamber and the high-temperature side storage chamber to communicate with each other at their upper parts, even when there is a bias in the amount of the heat medium between the low-temperature heat medium circuit and the high-temperature heat medium circuit, the amount of the heat medium can be adjusted between the low-temperature side storage chamber and the high-temperature side storage chamber of the storage unit. [[ID=?]] [[ID=?]]
[0021] [[ID=?]] Also, The fifth invention by providing another temperature adjustment unit for switching whether to introduce the heat medium in the low-temperature side storage chamber into the temperature control circuit as shown in [ ], it becomes possible to accurately cool the temperature control target.
[0022] In this case, The sixth invention if another temperature adjustment unit is configured such that when the temperature of the heat medium flowing through the temperature control circuit becomes a predetermined value or more, the heat medium is introduced from the low-temperature side storage chamber into the temperature control circuit, overheating of the temperature control target can be surely prevented.
[0023] Also, the temperature adjustment unit It should be noted that there seem to be some missing or incorrect references in the original text (e.g., "[ ]" in and ), which may affect the full understanding and accuracy of the translation. This translation is based on the text as provided. The seventh invention As described above, if the system is configured as a flow path switching valve having a temperature-sensing element that senses the temperature of the fluid flowing inside and switches the flow path of the fluid, then electronic control becomes unnecessary, and the cost of the system can be reduced.
[0024] Here, the target of temperature control is The eighth invention Examples include batteries mounted on electric vehicles, electric motors for driving electric vehicles, and inverters that drive said electric motors.
[0025] Furthermore, as a high-temperature heat transfer medium circuit, The ninth invention As shown above, a heater core is provided for heating the vehicle's interior by circulating a heat transfer medium heated by a heating unit. As a low-temperature heat transfer medium circuit, a cooler core is provided for cooling the vehicle's interior by circulating a heat transfer medium cooled by a cooling unit. In that case, The 10th Invention A heat pump circuit is provided, which includes a compressor for compressing a refrigerant, a radiator for releasing heat from the refrigerant discharged from the compressor, a pressure reducing unit for reducing the pressure of the refrigerant released by the radiator, and a heat absorber for releasing heat from the refrigerant reduced by the pressure reducing unit. The radiator and the heating unit of the high-temperature heat transfer medium circuit are arranged in a heat exchange relationship, and the heat absorber and the cooling unit of the low-temperature heat transfer medium circuit are also arranged in a heat exchange relationship.
[0026] This allows for temperature control of the target object using the heat pump circuit, high-temperature heat transfer circuit, and low-temperature heat transfer circuit used for air conditioning the interior of electric vehicles. Furthermore, when there is no need to heat the target object, as mentioned above, the heat transfer fluid flowing through the high-temperature heat transfer circuit will flow through the high-temperature bypass storage chamber of the storage unit, so a higher temperature heat transfer fluid will circulate to the heater core, allowing for uninterrupted heating of the vehicle interior. Moreover, when there is no need to cool the target object, as mentioned above, the heat transfer fluid flowing through the low-temperature heat transfer circuit will not be introduced into the temperature control circuit, so a lower temperature heat transfer fluid will circulate to the cooler core, allowing for uninterrupted cooling of the vehicle interior. [Brief explanation of the drawing]
[0027] [Figure 1] This is a configuration diagram of one embodiment of the thermal management system of the present invention (Embodiment 1. First path state in heating mode). [Figure 2] Figure 1 is a cross-sectional view of a thermovalve as an example of a temperature control section of a thermal management system. [Figure 3] Figure 1 is a diagram showing the temperature control circuit and storage unit of the thermal management system. [Figure 4] Figure 1 is a plan cross-sectional view of the storage section. [Figure 5] This is a diagram showing the temperature control circuit and storage unit extracted from the case of Figure 1. [Figure 6] Figure 1 is a diagram illustrating the configuration of the thermal management system in heating mode, specifically the second path state. [Figure 7] This is a diagram showing the temperature control circuit and storage unit extracted for the case of Figure 6. [Figure 8] Figure 1 shows the configuration of the thermal management system in cooling mode. [Figure 9] This is a diagram showing the temperature control circuit and storage section of a thermal management system according to another embodiment of the present invention (Example 2). [Figure 10] Figure 9 is a cross-sectional view of the storage section. [Modes for carrying out the invention]
[0028] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. [Examples]
[0029] (1) Configuration of Thermal Management System 1 Figure 1 shows the configuration of a thermal management system 1 according to one embodiment of the present invention. The thermal management system 1 of this embodiment is a vehicle air conditioning system that air-conditions the interior of an electric vehicle such as an electric vehicle or a hybrid vehicle, and also controls the temperature of temperature-controlled objects such as the battery 2 discussed in this embodiment, as well as the electric motor for driving and the inverter. It is configured to include a heat pump circuit 3, a heat transfer medium circuit 4, and a control device 6. In this application, the concept of battery includes fuel cells.
[0030] The heat pump circuit 3 of the embodiment includes a compressor 7 that compresses a refrigerant (fluorocarbon refrigerant), a heat sink 8 that dissipates heat from the refrigerant (high-temperature refrigerant) discharged from the compressor 7, an expansion valve 9 that acts as a pressure reducing unit to reduce the pressure of the refrigerant that has been heated by the heat sink 8, a heat absorber 11 that absorbs heat as the refrigerant reduced in pressure by the expansion valve 9 evaporates, and an accumulator 12, all of which are sequentially connected in a ring shape by refrigerant piping. This circuit is usually installed in the so-called engine compartment under the hood of an electric vehicle.
[0031] The heat transfer medium circuit 4 is a circuit through which a heat transfer medium such as water flows. In this embodiment, it comprises a cooling section 13 (heat exchanger), a heating section 14 (heat exchanger), a cooler core 16, a heater core 17, first to third pumps 21 to 23 as a circulation section, a radiator 29, thermovalves 30 and 31 as the temperature control section of the present invention, eight three-way valves 32 to 39, a check valve 41, and a storage section 26 of the present invention which consists of a reserve tank of a predetermined capacity. These are connected by heat transfer medium piping as described later.
[0032] Furthermore, the three-way valves 32-39 in the embodiment are equipped with three connection ports and are valve devices that can switch between a state in which all connection ports are connected and a state in which only two of those connection ports are connected (a total of four states).
[0033] In this case, the outlet of the cooling unit 13 is connected to the first connection port of the three-way valve 32 by heat transfer piping C1, and the second connection port of the three-way valve 32 is connected to the third connection port of the three-way valve 33 by heat transfer piping C2. The first connection port of the three-way valve 33 is connected to the inlet of the cooler core 16 by heat transfer piping C4, and the outlet of the cooler core 16 is connected to the first connection port of the three-way valve 34 by heat transfer piping C5. The second connection port of the three-way valve 34 is connected to the first connection port of the three-way valve 35 by heat transfer piping C6, and the second connection port of the three-way valve 35 is connected to the inlet of the first pump 21 by heat transfer piping C7. The outlet of the first pump 21 is connected to the inlet of the cooling unit 13 by heat transfer piping C8.
[0034] The second connection port of the three-way valve 33 is connected to the upper part of the low-temperature side storage chamber 61 of the storage section 26, which will be described later, by heat transfer piping C10. A low-temperature side outlet 61A (Figure 3) is formed at the bottom of the low-temperature side storage chamber 61, and one end of heat transfer piping C42 is connected to this low-temperature side outlet 61A. The other end of heat transfer piping C42 is connected to the main valve port MV of the thermovalve 30 (temperature control section), which will be described later, and the bypass valve port BV of the thermovalve 30, which will be described later, is connected to the inlet of the check valve 41 by heat transfer piping C11 and C12. The outlet of the check valve 41 is connected to the third connection port of the three-way valve 34 by heat transfer piping C13. The direction of the three-way valve 34 is forward for this check valve 41.
[0035] The mixing water port XV of the thermovalve 30, described later, is connected to the inlet of the third pump 23 by heat transfer piping C41, and the outlet of the third pump 23 is connected to the inlet of the battery 2 (temperature controlled) by heat transfer piping C15. A jacket structure is formed around the battery 2, with an inlet and an outlet through which the heat transfer medium flows, and the battery 2 is configured to exchange heat with the heat transfer medium through this jacket structure. The inlet of the battery 2 is the inlet of this jacket structure, and the outlet of the battery 2, i.e., the outlet of the jacket structure, is connected to the upper part of the temperature-controlled storage chamber 63 of the storage section 26, described later, by heat transfer piping C16. A temperature-controlled outlet 63A (Figure 3) is formed at the bottom of this temperature-controlled storage chamber 63, and this temperature-controlled outlet 63A is connected to the connection point of heat transfer piping C11 and heat transfer piping C12 by heat transfer piping C46.
[0036] The bypass valve port BV of the thermovalve 31, described later, is connected to the upper part of the high-temperature side storage chamber 64 for heat exchange in the storage section 26, described later, via a heat transfer medium pipe C48. A first high-temperature side outlet 64A (Figure 3) is formed at the bottom of this high-temperature side storage chamber 64 for heat exchange, and one end of the heat transfer medium pipe C43 is connected to this first high-temperature side outlet 64A. The main valve port MV of the thermovalve 31, described later, is connected to the upper part of the bypass high-temperature side storage chamber 66 of the storage section 26, described later, via a heat transfer medium pipe C49.
[0037] The bypass high-temperature storage chamber 66 and the aforementioned heat exchange high-temperature storage chamber 64 constitute the high-temperature storage chamber 65 in this invention. A second high-temperature outlet 66A (Figure 3) is formed at the bottom of the bypass high-temperature storage chamber 66, and one end of the heat transfer medium pipe C47 is connected to this second high-temperature outlet 66A. The other end of the heat transfer medium pipe C43 and the other end of the heat transfer medium pipe C47 are connected, and this connection point is connected to the inlet of the heater core 17 by the heat transfer medium pipe C45. In addition, the heat transfer medium pipe C19 is connected to the mixing water port XV of the thermovalve 31, which will be described later.
[0038] The closed loop consisting of the third pump 23, heat transfer piping C15, the jacket structure of the battery 2, heat transfer piping C16, the temperature-controlled storage chamber 63 of the storage unit 26, heat transfer piping C46, heat transfer piping C11, thermovalve 30, and heat transfer piping C41, along with the heat transfer piping C10, the low-temperature storage chamber 61 of the storage unit 26, heat transfer piping C42, heat transfer piping C12, check valve 41, and heat transfer piping C13 constitutes the temperature control circuit 42 in the present invention.
[0039] Furthermore, the cooling unit 13, heat transfer piping C1, three-way valve 32, heat transfer piping C2, three-way valve 33, heat transfer piping C4, cooler core 16, heat transfer piping C5, three-way valve 34, heat transfer piping C6, three-way valve 35, heat transfer piping C7, first pump 21, and heat transfer piping C8 constitute the low-temperature heat transfer circuit 43 in the present invention in the cooling mode described later. Heat transfer piping C10, the low-temperature side storage chamber 61 of the storage unit 26, and heat transfer piping C42 constitute the connection between the low-temperature heat transfer circuit 43 and the temperature control circuit 42 in this case. The thermovalve 30 is connected to the heat transfer piping C42 (connection) and controls the inflow of the heat transfer medium of the low-temperature heat transfer circuit 43 from the low-temperature side storage chamber 61 to the temperature control circuit 42.
[0040] Furthermore, the outlet of the heating section 14 is connected to the third connection port of the three-way valve 36 by heat transfer piping C17. The first connection port of the three-way valve 36 is connected to the mixing water port XV of the thermovalve 31 by heat transfer piping C19 as described above, and the main valve port MV of the thermovalve 31, which will be described later, is connected to the bypass high-temperature side storage chamber 66 of the storage section 26 by heat transfer piping C49 as described above. In addition, the bypass valve port BV of the thermovalve 31, which will be described later, is connected to the heat exchange high-temperature side storage chamber 64 of the storage section 26 by heat transfer piping C48 as described above.
[0041] Furthermore, as mentioned above, the heat transfer piping C45 is connected to the inlet of the heater core 17, and the outlet of the heater core 17 is connected to the first connection port of the three-way valve 38 by the heat transfer piping C20. The second connection port of the three-way valve 38 is connected to the inlet of the second pump 22 by the heat transfer piping C21, and the outlet of the second pump 22 is connected to the inlet of the heating section 14 by the heat transfer piping C22.
[0042] The heating unit 14, heat transfer piping C17, three-way valve 36, heat transfer piping C19, thermovalve 31, heat transfer piping C48, heat transfer piping C49, the high-temperature side storage chamber 64 for heat exchange and the high-temperature side storage chamber 66 for bypass of the storage unit 26, heat transfer piping C43, heat transfer piping C47, heat transfer piping C45, heater core 17, heat transfer piping C20, three-way valve 38, heat transfer piping C21, second pump 22, and heat transfer piping C22 constitute the high-temperature heat transfer circuit 44 in this invention. The thermovalve 31 controls whether to introduce the heat transfer medium of the high-temperature heat transfer circuit 44 into the high-temperature side storage chamber 64 for heat exchange of the storage unit 26 or into the high-temperature side storage chamber 66 for bypass.
[0043] Furthermore, the second connection port of the three-way valve 36 is connected to the first connection port of the three-way valve 37 by heat transfer piping C24, and the third connection port of the three-way valve 37 is connected to the inlet of the radiator 29 by heat transfer piping C25. The outlet of the radiator 29 is connected to the second connection port of the three-way valve 39 by heat transfer piping C26, and the first connection port of the three-way valve 39 is connected to the third connection port of the three-way valve 38 by heat transfer piping C27.
[0044] Furthermore, the second connection port of the three-way valve 37 is connected to the third connection port of the three-way valve 32 by heat transfer piping C28, and the third connection port of the three-way valve 35 is connected to the third connection port of the three-way valve 39 by heat transfer piping C29. The cooling unit 13, heat transfer piping C1, three-way valve 32, heat transfer piping C28, three-way valve 37, heat transfer piping C25, radiator 29, heat transfer piping C26, three-way valve 39, heat transfer piping C29, three-way valve 35, heat transfer piping C7, first pump 21, and heat transfer piping C8 constitute the low-temperature heat transfer circuit 43A in the heating mode of the present invention, which will be described later. In this case, heat transfer piping C2 and C10, the low-temperature side storage chamber 61 of the storage unit 26, and heat transfer piping C42 constitute the connection between the low-temperature heat transfer circuit 43 and the temperature control circuit 42 in this case.
[0045] In Figure 1, 46 is an HVAC unit that supplies air for air conditioning into the passenger compartment of an electric vehicle. It is equipped with an intake switching damper 48 that switches between supplying internal and external air to the internal air passage 47, and an interior fan 49. The aforementioned cooler core 16 and heater core 17 are sequentially arranged within the air passage 47 downstream of the interior fan 49.
[0046] (2) Configuration of the storage section 26 Here, the interior of the storage section 26 is shown in enlarged view in Figures 3 and 4. In the figures, 67 is a partition wall that separates the high-temperature side storage chamber 64 for heat exchange and the temperature-controlled side storage chamber 63. Since the partition wall 67 extends from the bottom to the top of the storage section 26, there is no flow of heat transfer medium between the high-temperature side storage chamber 64 for heat exchange and the temperature-controlled side storage chamber 63. However, the partition wall 67 is made of a material with high thermal conductivity (such as metal), and as a result, the high-temperature side storage chamber 64 for heat exchange and the temperature-controlled side storage chamber 63 of the high-temperature side storage chamber 65 are separated by the partition wall 67 while maintaining a heat exchange relationship.
[0047] In the diagram, 68 is a partition wall separating the low-temperature storage chamber 61 from the temperature-controlled storage chamber 63. Since the partition wall 68 extends from the bottom to the top of the storage section 26, there is no flow of heat transfer medium between the low-temperature storage chamber 61 and the temperature-controlled storage chamber 63. Furthermore, the partition wall 68 is made of an insulating material (such as rigid resin), thereby insulating the temperature-controlled storage chamber 63 from the low-temperature storage chamber 61.
[0048] In the diagram, 69 is a partition wall that divides the high-temperature storage chamber 65 into a high-temperature storage chamber 64 for heat exchange and a high-temperature storage chamber 66 for bypass. This partition wall 69 is made of an insulating material (such as rigid resin) and rises from the bottom of the storage section 26 but does not reach the ceiling. As a result, the high-temperature storage chamber 64 for heat exchange and the high-temperature storage chamber 66 for bypass are insulated, but they are connected at their upper parts. In addition, the high-temperature storage chamber 64 for heat exchange faces the partition wall 67, and the heat transfer medium inside is in contact with the partition wall 67, but the high-temperature storage chamber 66 for bypass does not face the partition wall 67, and the heat transfer medium inside is not in contact with the partition wall 67.
[0049] In this embodiment, the storage section 26 is roughly cylindrical in shape, but the partition wall 67 described above is located in the center of the storage section 26, and the partition wall 68 and the divider wall 69 are arc-shaped and roughly concentric with the storage section 26 (Figure 4). As a result, the temperature-controlled storage chamber 63 and the high-temperature storage chamber 64 for heat exchange are located inside the storage section 26, while the low-temperature storage chamber 61 and the high-temperature bypass storage chamber 66 are located outside of them. Furthermore, the low-temperature storage chamber 61 and the high-temperature bypass storage chamber 66 are separated from each other by divider walls 71 and 72 located on the extension of the partition wall 67. The divider walls 71 and 72 are made of insulating material (such as rigid resin) and rise from the bottom of the storage section 26 but do not reach the ceiling. As a result, the low-temperature storage chamber 61 and the high-temperature storage chamber 65 (the bypass high-temperature storage chamber 66 and the heat exchange high-temperature storage chamber 64) are insulated from each other, but they are in communication at their upper surfaces.
[0050] (3) Configuration of thermovalves (temperature control section) 30, 31 Figure 2 is a cross-sectional view of the thermovalves (temperature control units) 30 and 31 mentioned above. Although thermovalves 30 and 31 have basically the same structure, they are used in different ways. Specifically, thermovalve 30 is connected to the heat transfer piping C42 (the connection point between the temperature control circuit 42 and the low-temperature heat transfer circuits 43 and 43A), and thermovalve 31 is connected to the heat transfer piping C19 (the connection point between the temperature control circuit 42 and the high-temperature heat transfer circuit 44).
[0051] Each unit comprises a housing 51, a main valve 52, a bypass valve 53, a temperature sensing element 54, and springs 56 and 57. The housing 51 has the aforementioned main valve port MV, bypass valve port BV, and mixed water port XV formed therein, and the inside of the housing 51 is also a mixing chamber 58.
[0052] The main valve port MV is connected to the mixing chamber 58 via an opening 59, and the bypass valve port BV is connected to the mixing chamber 58. The main valve 52 opens and closes the opening 59 through the action of a temperature-sensing element 54 and springs 56 and 57, while the bypass valve 53 opens and closes the bypass valve port BV. The mixed water port XV is connected to the mixing chamber 58.
[0053] The temperature-sensing element 54 is connected to the main valve 52 and the bypass valve 53, and has a structure that allows it to expand and contract by incorporating wax (for example, paraffin wax) inside. The temperature-sensing element 54 expands and contracts in response to the temperature of the heat transfer medium in the mixing chamber 58, moving the main valve 52 and the bypass valve 53, and adjusting the opening of the opening 59 and the bypass valve port BV.
[0054] Furthermore, the temperature of the heat transfer medium in the mixing chamber 58 of the thermovalve 31 is the temperature of the heat transfer medium that flows in from the mixing water port XV (the temperature of the heat transfer medium flowing through the high-temperature heat transfer medium circuit 44), as will be described later. Also, the temperature of the heat transfer medium in the mixing chamber 58 of the thermovalve 30 is the temperature of the heat transfer medium that flows in from the bypass valve port BV, as will be described later, or the temperature of the heat transfer medium that is mixed with the heat transfer medium that flows in from the main valve port MV through the opening 59. In either case, the temperature of the heat transfer medium in the mixing chamber 58 is the temperature of the heat transfer medium flowing through the temperature control circuit 42.
[0055] As described above, the main valve port MV of the thermovalve 31 is connected to the heat transfer piping C49, the bypass valve port BV is connected to the heat transfer piping C48, and the mixing water port XV is connected to the heat transfer piping C19. When the temperature of the heat transfer medium in the mixing chamber 58 is lower than a predetermined value T1 (for example, +30°C), the main valve 52 closes the opening 59 and the bypass valve 53 opens the bypass valve port BV. As a result, the thermovalve 31 introduces the heat transfer medium of the high-temperature heat transfer medium circuit 44 into the mixing chamber 58 from the mixing water port XV and flows it through the heat transfer piping C48 from the bypass valve port BV, thereby introducing the high-temperature heat transfer medium of the high-temperature heat transfer medium circuit 44 into the high-temperature storage chamber 64 for heat exchange in the storage section 26.
[0056] Meanwhile, when the temperature of the heat transfer medium in the mixing chamber 58 of the thermovalve 31 reaches a predetermined value T1 or higher, the main valve 52 opens its opening 59 and the bypass valve 53 closes the bypass valve port BV. As a result, the thermovalve 31 causes the heat transfer medium that has flowed in from the mixing water port XV to flow from the opening 59 to the main valve port MV, out into the heat transfer medium piping C49, and introduces the high-temperature heat transfer medium of the high-temperature heat transfer medium circuit 55 into the bypass high-temperature side storage chamber 66 of the storage section 26.
[0057] On the other hand, as mentioned above, the main valve port MV of the thermovalve 30 is connected to the heat transfer medium pipe C42 which is connected to the low-temperature storage chamber 61 of the storage section 26, the bypass valve port BV is connected to the heat transfer medium pipe C11, and the mixing water port XV is connected to the heat transfer medium pipe C41. When the temperature of the heat transfer medium in the mixing chamber 58 is lower than another predetermined value T2 (for example, +40°C) which is higher than the predetermined value T1 mentioned above, the main valve 52 closes its opening 59 and the bypass valve 53 opens its bypass valve port BV. When the temperature of the heat transfer medium in the mixing chamber 58 becomes equal to or higher than the predetermined value T2, the main valve 52 begins to open its opening 59, and the heat transfer medium of the low-temperature heat transfer medium circuit 43 (low-temperature heat transfer medium described later) is introduced into the mixing chamber 58 from the low-temperature storage chamber 61. In addition, the main valve 52 of the thermovalves 30 and 31 is structured so that a small amount of heat transfer medium flows from the main valve port MV into the mixing chamber 58 when the opening 59 is closed.
[0058] The operation of the thermal management system 1 of this embodiment will be explained based on the above configuration. (4) Heating mode and temperature control of Battery 2 (target of temperature control) First, the heating mode controlled by the control device 6 will be explained. Each arrow in Figure 1 indicates the flow of the heat transfer medium in heating mode. In heating mode, the control device 6 is configured such that the three-way valve 32 connects heat transfer medium pipes C1, C28, and C2, and the three-way valve 33 connects only heat transfer medium pipes C2 and C10. Furthermore, the three-way valve 34 connects only heat transfer medium pipes C6 and C13, and the three-way valve 35 connects heat transfer medium pipes C6, C7, and C29. Additionally, the three-way valve 36 connects only heat transfer medium pipes C17 and C19, and the three-way valve 37 connects only heat transfer medium pipes C25 and C28. Furthermore, the three-way valve 39 is set to connect only heat transfer pipes C26 and C29, and the three-way valve 38 is switched to connect only heat transfer pipes C20 and C21.
[0059] Then, the compressor 7, pumps 21, 22, and 23, and the indoor fan 49 are operated. As a result, the heat transfer medium discharged from the first pump 21 is sequentially drawn back into the first pump 21 via the cooling unit 13 and radiator 29, circulating within the low-temperature heat transfer medium circuit 43A. Furthermore, under sub-zero ambient temperature conditions, the temperature of the heat transfer medium flowing into the mixing chamber 58 from the bypass valve port BV of the thermovalve 30 is low (lower than the predetermined value T2). Therefore, the temperature sensing unit 54 closes the opening 59 with the main valve 52 and opens the bypass valve port BV with the bypass valve 3 based on the temperature of the heat transfer medium in the mixing chamber 53. As a result, the heat transfer medium circulates within a closed loop including the temperature-controlled storage chamber 63 of the temperature-controlled circuit 42 (indicated by arrows in Figure 1).
[0060] Furthermore, the heat transfer fluid discharged from the second pump 22 passes through the heating section 14 and reaches the thermovalve 31. Here, under sub-zero ambient temperature conditions, the temperature of the heat transfer fluid flowing into the mixing chamber 58 from the mixing water port XV of the thermovalve 31 is also low (lower than the predetermined value T1). Therefore, the temperature sensing section 54 closes the opening 59 with the main valve 52 and opens the bypass valve port BV with the bypass valve 53 based on the temperature of the heat transfer fluid in the mixing chamber 58. As a result, the heat transfer fluid that reaches the thermovalve 31 is introduced into the high-temperature side storage chamber 64 for heat exchange in the storage section 26 via the heat transfer fluid piping C48 and is temporarily stored there.
[0061] The heat transfer medium in the high-temperature storage chamber 64 for heat exchange in the storage unit 26 exchanges heat with the heat transfer medium in the temperature-controlled storage chamber 63 via the partition wall 67, thereby heating the heat transfer medium in the temperature-controlled storage chamber 63. This heated heat transfer medium is then drawn into the third pump 23 via heat transfer medium piping C46, heat transfer medium piping C11, thermovalve 30, and heat transfer medium piping C41. It is then circulated to the battery 2 via heat transfer medium piping C15 to heat the battery 2. This warms up the battery 2.
[0062] The heat transfer medium in the high-temperature storage chamber 64 for heat exchange in the storage unit 26 flows into the heater core 17 via heat transfer medium piping C43 and C45. The heat transfer medium that flows out of the heater core 17 is then drawn into the second pump 22 and circulated within the high-temperature heat transfer medium circuit 44. The solid arrow in Figure 5 indicates this state, which is referred to as the first path state of the heat transfer medium circuit 4.
[0063] When the compressor 7 is operated, the refrigerant releases heat in the radiator 8 and absorbs heat in the heat absorber 11, so the heat transfer medium flowing through the heating section 14 in the radiator 8 is heated by the high-temperature refrigerant. As mentioned above, this heated heat transfer medium is introduced into the high-temperature heat exchange storage chamber 64 of the storage unit 26, and heats the heat transfer medium in the temperature control storage chamber 63 via the partition wall 67. The heat transfer medium in the temperature control storage chamber 63 is then circulated to the battery 2, so the battery 2 is heated. In addition, the heat transfer medium that has passed through the high-temperature heat exchange storage chamber 64 of the storage unit 26 is then circulated to the heater core 17, so the air supplied to the vehicle interior from the interior fan 49 is heated by the heater core 17, thereby heating the vehicle interior.
[0064] On the other hand, in the heat absorber 11, the heat transfer medium flowing through the cooling section 13 is cooled by the refrigerant. This cooled low-temperature heat transfer medium is circulated to the radiator 29 and warmed by the outside air. In other words, it draws heat from the outside air. This drawn-up heat is transported to the heat radiator 8 by the heat pump circuit 3 and used to heat the battery 2 and the interior of the vehicle.
[0065] After operation begins, the temperature of the heat transfer medium circulating in the high-temperature heat transfer medium circuit 44 rises. When the temperature of the heat transfer medium flowing into the mixing chamber 58 from the mixing water port XV of the thermovalve 31 rises to the predetermined value T1 (+30°C) or higher, the temperature sensing unit 54 moves the bypass valve 53 and the main valve 52 based on the temperature of the heat transfer medium in the mixing chamber 58, closing the bypass valve port BV and opening the opening 59.
[0066] As a result, the heat transfer medium flowing in from the mixing water port XV of the thermovalve 31 passes through the mixing chamber 58 and the opening 59, flows out from the main valve port MV into the heat transfer medium piping C49, and is introduced into the bypass high-temperature side storage chamber 66 of the storage unit 26, where it is temporarily stored. Since the heat transfer medium in the bypass high-temperature side storage chamber 66 of the storage unit 26 is not in contact with the partition wall 67, the heat transfer medium of the high-temperature heat transfer medium circuit 44 bypasses the heat exchange high-temperature side storage chamber 64 and flows through the storage unit 26, and the heating of the heat transfer medium in the temperature control side storage chamber 63 is stopped. This prevents excessive heating of the battery 2.
[0067] The heat transfer medium in the high-temperature bypass storage chamber 66 of the storage unit 26 flows into the heater core 17 via heat transfer medium piping C47 and C45. The heat transfer medium that flows out of the heater core 17 is then drawn into the second pump 22 and circulated within the high-temperature heat transfer medium circuit 44. The solid arrows in Figures 6 and 7 indicate this state, which is referred to as the second path state of the heat transfer medium circuit 4.
[0068] Subsequently, the self-heating of battery 2 causes the temperature of the heat transfer medium circulating within the closed loop of the temperature control circuit 42 to rise. When the temperature of the heat transfer medium flowing into the mixing chamber 58 from the bypass valve port BV of the thermovalve 30 exceeds the predetermined value T2 (+40°C) mentioned above, the temperature sensing unit 54 moves the main valve 52 based on the temperature of the heat transfer medium in the mixing chamber 58, and begins to open the opening 59. As a result, a portion of the low-temperature heat transfer medium flowing through the low-temperature heat transfer medium circuit 43A is diverted by the three-way valve 32, passes through the heat transfer medium piping C2, the three-way valve 33, the heat transfer medium piping C10, the low-temperature storage chamber 61 of the storage unit 26, and the heat transfer medium piping C42, enters the thermovalve 30 from the main valve port MV, and begins to flow into the mixing chamber 58 from the opening 59 (shown by the dashed arrow in Figure 7).
[0069] The heat transfer fluid flowing in through opening 59 is mixed with the heat transfer fluid flowing in through bypass valve port BV in mixing chamber 58, and then flows out through mixing water port XV into heat transfer fluid piping C41. It is then drawn into the third pump 23 and discharged toward battery 2. As a result, the battery 2 is cooled as the cooled heat transfer fluid is circulated through it.
[0070] The heat transfer fluid that flows out through battery 2 into heat transfer fluid piping C16 reaches the temperature-controlled storage chamber 63 of the storage unit 26 and then into heat transfer fluid piping C46. From this heat transfer fluid piping C46, the portion of the heat transfer fluid that originally circulated within the closed loop of the temperature-controlled circuit 42 flows into heat transfer fluid piping C11, and the portion of the heat transfer fluid introduced from the low-temperature heat transfer fluid circuit 43A via heat transfer fluid piping C10 is diverted to heat transfer fluid piping C12, and then returns to the low-temperature heat transfer fluid circuit 43A via check valve 41 and heat transfer fluid piping C13 to the three-way valve 34 (indicated by the dashed arrow in Figure 7). In other words, heat transfer fluid piping C46, heat transfer fluid piping C12, check valve 41, and heat transfer fluid piping C13 form the path for returning the heat transfer fluid from the temperature-controlled circuit 42 to the low-temperature heat transfer fluid circuit 43A, and the storage unit 26 is located on this path. This is referred to as the third path state of the heat transfer fluid circuit 4.
[0071] At this time, the high-temperature bypass storage chamber 66 of the storage section 26 stores the heat transfer medium that flows through the high-temperature heat transfer medium circuit 44. However, since the two chambers 61 and 66 are insulated by partition walls 68, 71, and 72, heat exchange between the heat transfer medium of the high-temperature heat transfer medium circuit 44 and the heat transfer medium of the low-temperature heat transfer medium circuit 43A is prevented or minimized.
[0072] As described above, the battery 2 is cooled by the low-temperature heat transfer medium introduced from the low-temperature heat transfer medium circuit 43A. When the temperature of the heat transfer medium (mixed heat transfer medium) in the mixing chamber 58 of the thermovalve 30 falls below the predetermined value T2 mentioned above, the temperature sensing unit 54 closes the opening 59 with the main valve 52 based on the temperature of the heat transfer medium in the mixing chamber 58. This returns the system to the second path state, and the heat transfer medium returns to circulating within the closed loop of the temperature control circuit 42. In this way, the battery 2 is maintained within the optimal temperature range (for example, a target temperature of +10°C or higher and +40°C or lower).
[0073] Furthermore, as mentioned above, the upper parts of the low-temperature storage chamber 61 and the high-temperature storage chamber 65 (high-temperature storage chamber 64 for heat exchange and high-temperature storage chamber 66 for bypass) within the storage section 26 are connected. Therefore, if an imbalance occurs in the amount of heat transfer medium between the low-temperature heat transfer medium circuit 43A and the high-temperature heat transfer medium circuit 44, and the heat transfer medium in either the low-temperature storage chamber 61 or the high-temperature storage chamber 65 exceeds the partition walls 71 and 72, the heat transfer medium will flow from the chamber that exceeded the limit into the other chamber. This will adjust the amount of heat transfer medium in the high-temperature heat transfer medium circuit 44 and the low-temperature heat transfer medium circuit 43A in the low-temperature storage chamber 61 and the high-temperature storage chamber 65. In addition, neither the low-temperature storage chamber 61 nor the high-temperature storage chamber 65 will ever become completely full.
[0074] Furthermore, the high-temperature storage chamber 64 for heat exchange and the high-temperature storage chamber 66 for bypass are connected at the top, and if the amount of heat transfer medium in either the high-temperature storage chamber 64 or the high-temperature storage chamber 66 for bypass increases and exceeds the partition wall 69, it flows into the other chamber, so neither chamber becomes completely full.
[0075] (5) Cooling mode and temperature control of battery (temperature control target) 2 Next, the cooling mode controlled by the control device 6 will be explained. Each arrow in Figure 8 indicates the flow of the heat transfer medium in the cooling mode. In the cooling mode, the control device 6 is configured such that the three-way valve 32 connects only heat transfer medium pipes C1 and C2, and the three-way valve 33 connects heat transfer medium pipes C2, C4, and C10. In addition, the three-way valve 34 connects heat transfer medium pipes C5, C6, and C13, and the three-way valve 35 connects only heat transfer medium pipes C6 and C7. Furthermore, the three-way valve 36 connects only heat transfer medium pipes C17 and C24, and the three-way valve 37 connects only heat transfer medium pipes C24 and C25. Furthermore, the three-way valve 39 is set to connect only heat transfer pipes C26 and C27, and the three-way valve 38 is switched to connect only heat transfer pipes C27 and C21.
[0076] Then, the compressor 7, pumps 21, 22, and 23, and the indoor fan 49 are operated. As a result, the heat transfer medium discharged from the first pump 21 is circulated within the low-temperature heat transfer medium circuit 43 by passing through the cooling unit 13 and cooler core 47 in sequence before being drawn back into the first pump 21. Similarly, the heat transfer medium discharged from the second pump 22 is circulated by passing through the heating unit 14 and radiator 29 in sequence before being drawn back into the second pump 22.
[0077] On the other hand, when the compressor 7 is operated, the refrigerant dissipates heat in the radiator 8 and absorbs heat in the heat absorber 11, as described above. In the heat absorber 11, the heat transfer medium flowing through the cooling section 13 is cooled by the refrigerant. This cooled low-temperature heat transfer medium is circulated to the cooler core 16, so the air supplied to the passenger compartment from the interior fan 49 is cooled by the cooler core 16, thereby providing air conditioning to the passenger compartment. On the other hand, in the radiator 8, the heat transfer medium flowing through the heating section 14 is heated by the high-temperature refrigerant. This heated high-temperature heat transfer medium is circulated to the radiator 29 and dissipates into the outside air.
[0078] At the start of operation, the temperature of the heat transfer medium circulating within the temperature control circuit 42 is lower than the predetermined value T2 mentioned above. Therefore, the heat transfer medium discharged from the third pump 23 passes through the battery (temperature controlled) 2 to the temperature-controlled storage chamber 63 of the storage unit 26, and from there is drawn back into the third pump 23 via the thermovalve 30, thus circulating within the closed loop of the temperature control circuit 42. In other words, the thermovalve 30 maintains the bypass valve port BV open by the bypass valve 53 and closes the opening 59 by the main valve 52 based on the temperature of the heat transfer medium flowing into the mixing chamber 58 from the bypass valve port BV, so that the heat transfer medium is circulated within the closed loop of the temperature control circuit 42 by the third pump 23. The solid arrow in Figure 8 indicates this state, and this is referred to as the fourth path state of the heat transfer medium circuit 4.
[0079] Subsequently, the self-heating of battery 2 causes the temperature of the heat transfer medium circulating within the closed loop of the temperature control circuit 42 to rise. When the temperature of the heat transfer medium flowing into the mixing chamber 58 from the bypass valve port BV of thermovalve 30 exceeds the predetermined value T2 (+40°C) mentioned above, the temperature sensing unit 54 moves the main valve 52 based on the temperature of the heat transfer medium in the mixing chamber 58, and begins to open the opening 59. As a result, a portion of the low-temperature heat transfer medium flowing through the low-temperature heat transfer medium circuit 43 is diverted by the three-way valve 33 and introduced into the low-temperature side storage chamber 61 of the storage unit 26 via the heat transfer medium piping C10. This low-temperature heat transfer medium in the low-temperature side storage chamber 61 enters the thermovalve 31 from the main valve port MV and begins to flow into the mixing chamber 58 through the opening 59 (indicated by a dashed arrow in Figure 8).
[0080] The heat transfer fluid that flows in through the opening 59 is mixed with the heat transfer fluid that flows in through the bypass valve port BV of the thermovalve 30 in the mixing chamber 58, and then flows out into the heat transfer fluid piping C41 through the mixing water port XV. It is then drawn into the third pump 23 and discharged toward the battery 2. As a result, the battery 2 is cooled as the cooled heat transfer fluid is circulated to it.
[0081] The heat transfer fluid flows out through battery 2 into heat transfer fluid piping C16 and into the temperature-controlled storage chamber 63 of the storage unit 26. From this, the portion of the heat transfer fluid that was originally circulating within the closed loop of the temperature control circuit 42 flows from heat transfer fluid piping C46 to heat transfer fluid piping C11, and the portion of the heat transfer fluid introduced from the low-temperature heat transfer fluid circuit 43 flows through heat transfer fluid piping C10 to heat transfer fluid piping C12, then through check valve 41 and heat transfer fluid piping C13 to the three-way valve 34, and is returned to the low-temperature heat transfer fluid circuit 43 (indicated by the dashed arrow in Figure 8). In other words, heat transfer fluid piping C46, heat transfer fluid piping C12, check valve 41, and heat transfer fluid piping C13 form the path for returning the heat transfer fluid from the temperature control circuit 42 to the low-temperature heat transfer fluid circuit 43, and the storage unit 26 is located on this path. This is referred to as the fifth path state of the heat transfer fluid circuit 4.
[0082] As described above, the battery 2 is cooled by the low-temperature heat transfer medium introduced from the low-temperature heat transfer medium circuit 43. When the temperature of the heat transfer medium (mixed heat transfer medium) in the mixing chamber 58 of the thermovalve 30 falls below the predetermined value T2 mentioned above, the temperature sensing part 54 of the thermovalve 30 closes the opening 59 by the main valve 52 based on the temperature of the heat transfer medium in the mixing chamber 58. This returns the system to the fourth path state, and the heat transfer medium returns to circulating within the closed loop of the temperature control circuit 42. As a result, even in cooling mode, the battery 2 is maintained within the optimal temperature range (for example, a target temperature of +10°C or higher and +40°C or lower).
[0083] Even in this cooling mode, if the amount of heat transfer medium in the low-temperature storage chamber 61 exceeds the amount of the partition walls 71 and 72, it will flow into the high-temperature storage chamber 66, thus preventing the low-temperature storage chamber 61 from becoming completely full. [Examples]
[0084] Next, other embodiments of the storage unit 26 will be described with reference to Figures 9 and 10. In each figure, components indicated by the same reference numerals as in Figures 3 and 4 are assumed to perform the same or similar functions. (6) Configuration of the storage section 26 (Part 2) In this embodiment, the temperature-controlled storage chamber 63 is located within a tank 73 housed in the storage section 26. This tank 73 is made of a material with high thermal conductivity (such as metal), and the constituent walls of this tank 73 constitute the partition wall of the present invention, which separates the high-temperature storage chamber 64 for heat exchange and the temperature-controlled storage chamber 63, while the heat transfer medium in the high-temperature storage chamber 64 for heat exchange and the heat transfer medium in the temperature-controlled storage chamber 63 have a heat exchange relationship. In this case as well, there is no flow of heat transfer medium between the high-temperature storage chamber 64 for heat exchange and the temperature-controlled storage chamber 63.
[0085] In this embodiment, the inside of the roughly cylindrical storage section 26 is similarly divided into an inner and outer section by a partition wall 74 that is concentrically cylindrical and rises from the bottom of the storage section 26. The inside of the partition wall 74 is designated as the high-temperature side storage chamber 64 for heat exchange, and the tank 73 is arranged inside this high-temperature side storage chamber 64 for heat exchange (Figure 10). Furthermore, the outside of the partition wall 74 is divided into two chambers by partition walls 76 and 77, one of which is designated as the high-temperature side storage chamber 66 for bypass, and the other as the low-temperature side storage chamber 61.
[0086] In this configuration, the high-temperature storage chamber 64 for heat exchange faces the tank 73 (partition wall), and the heat transfer medium inside is in contact with the tank 73 (partition wall). However, the high-temperature storage chamber 66 for bypass does not face the tank 73 (partition wall), and the heat transfer medium inside is not in contact with the tank 73 (partition wall). Furthermore, there is no flow of heat transfer medium between the low-temperature storage chamber 61 and the temperature-controlled storage chamber 63.
[0087] Furthermore, partition walls 74, 76, and 77 are made of insulating material (such as rigid resin) and rise from the bottom of the storage section 26 but do not reach the ceiling. As a result, the high-temperature storage chamber 64 for heat exchange and the high-temperature storage chamber 66 for bypass are insulated from each other, but they are connected at their upper ends. Similarly, the low-temperature storage chamber 61 and the high-temperature storage chamber 65 (high-temperature storage chamber 64 for heat exchange and high-temperature storage chamber 66 for bypass) are insulated from each other, but they are connected at their upper ends. In addition, the heat transfer medium piping C16 enters the storage section 26 and is connected to the upper end of the tank 73, and the heat transfer medium piping C46 also enters the storage section 26 and is connected to the lower end of the tank 73. The other configurations are the same as in Figures 3 and 4.
[0088] Even with this storage unit 26, the heat transfer medium in the high-temperature side storage chamber 64 for heat exchange in the storage unit 26 exchanges heat with the heat transfer medium in the temperature-controlled side storage chamber 63 in the tank 73 (partition wall) via the constituent walls of the tank 73, so that the heat transfer medium in the temperature-controlled side storage chamber 63 is heated. Then, as described above, this heated heat transfer medium is drawn into the third pump 23 via the heat transfer medium piping C46, heat transfer medium piping C11, thermo valve 30, and heat transfer medium piping C41, and is circulated to the battery 2 from the heat transfer medium piping C15, so that the battery 2 is heated and warmed up.
[0089] Furthermore, since the heat transfer medium in the bypass high-temperature storage chamber 66 is not in contact with the tank 73 (partition wall), when the heat transfer medium of the high-temperature heat transfer medium circuit 44 flows into the bypass high-temperature storage chamber 66, the heating of the heat transfer medium in the temperature-controlled storage chamber 63 is stopped, preventing excessive heating of the battery 2.
[0090] Furthermore, since the upper parts of the low-temperature storage chamber 61 and the high-temperature storage chamber 65 (high-temperature storage chamber 64 for heat exchange and high-temperature storage chamber 66 for bypass) within the storage section 26 are connected, if the heat transfer medium in either the low-temperature storage chamber 61 or the high-temperature storage chamber 65 exceeds the partition walls 74, 76, or 77, the heat transfer medium will flow from the chamber that exceeded the limit into the other chamber. This will adjust the amount of heat transfer medium in the high-temperature heat transfer medium circuit 44 and the low-temperature heat transfer medium circuit 43A in the low-temperature storage chamber 61 and the high-temperature storage chamber 65. In addition, neither the low-temperature storage chamber 61 nor the high-temperature storage chamber 65 will ever become completely full.
[0091] Furthermore, the high-temperature storage chamber 64 for heat exchange and the high-temperature storage chamber 66 for bypass are also connected at the top, so if the amount of heat transfer medium in either the high-temperature storage chamber 64 or the high-temperature storage chamber 66 for bypass increases and exceeds the partition wall 74, it flows into the other chamber, so neither chamber becomes completely full.
[0092] As described above, according to the present invention, a storage unit 26 for storing heat transfer fluid is provided on the path that returns the heat transfer fluid from the temperature control circuit 42 to the low-temperature heat transfer fluid circuits 43 and 43A. This storage unit 26 has a high-temperature side storage chamber 65 into which the heat transfer fluid flowing through the high-temperature heat transfer fluid circuit 44 is introduced and stored, and which also has high-temperature side outlets 64A and 66A for returning the heat transfer fluid to the high-temperature heat transfer fluid circuit 44. It also has a temperature-controlled side storage chamber 63 into which the heat transfer fluid circulating through the temperature control circuit 42 is introduced and stored. The storage unit 26 has a partition wall 67 (tank 73) that separates the high-temperature side storage chamber 65 and the temperature-controlled side storage chamber 63 in a state where the heat transfer fluid in the high-temperature side storage chamber 65 and the heat transfer fluid in the temperature-controlled side storage chamber 63 are in a heat exchange relationship. As a result, the heat transfer fluid in the high-temperature side storage chamber 65 of the storage unit 26 heats the heat transfer fluid in the temperature-controlled side storage chamber 63, thereby warming up the battery 2. Furthermore, by introducing the heat transfer fluid from the low-temperature heat transfer fluid circuits 43 and 43A into the temperature control circuit 42, the battery 2 can also be cooled, thereby enabling effective temperature control of the battery 2.
[0093] In this case, since the heat transfer medium is not introduced from the high-temperature heat transfer medium circuit 44 to the temperature control circuit 42, there is no imbalance in the heat transfer medium between the high-temperature heat transfer medium circuit 44 and the low-temperature heat transfer medium circuits 43 and 43A. In particular, a storage unit 26 is provided on the path that returns the heat transfer medium from the temperature control circuit 42 to the low-temperature heat transfer medium circuits 43 and 43A, and heat exchange occurs between the heat transfer medium of the high-temperature heat transfer medium circuit 44 and the heat transfer medium of the temperature control circuit 42 in this storage unit 26, so the increase in cost can be kept to a minimum.
[0094] Furthermore, in this embodiment, the high-temperature storage chamber 65 is composed of a high-temperature storage chamber 64 for heat exchange in which the heat transfer medium is in contact with the partition wall 67 (tank 73), and a high-temperature storage chamber 66 for bypass in which the heat transfer medium is not in contact with the partition wall 67 (tank 73). A thermovalve 31 is provided to switch whether the heat transfer medium flowing through the high-temperature heat transfer medium circuit 44 is introduced into the high-temperature storage chamber 64 for heat exchange or into the high-temperature storage chamber 66 for bypass. Therefore, when heating of the battery 22 is necessary, the thermovalve 31 allows the heat transfer medium of the high-temperature heat transfer medium circuit 44 to flow into the high-temperature storage chamber 64 for heat exchange to warm up the battery 2, and when heating is not necessary, the heat transfer medium of the high-temperature storage chamber 44 is allowed to flow into the high-temperature storage chamber 66 for bypass, thereby preventing excessive heating of the battery 2.
[0095] In this embodiment, the thermovalve 31 introduces the heat transfer medium into the high-temperature heat exchange storage chamber 64 when the temperature of the heat transfer medium flowing through the high-temperature heat transfer medium circuit 44 is lower than a predetermined value T1. Here, if the temperature of the heat transfer medium in the high-temperature heat transfer medium circuit 44 is low, the temperature of the heat transfer medium in the temperature control circuit 42 is also low. Therefore, if the heat transfer medium is introduced into the high-temperature heat exchange storage chamber 64 when the temperature of the heat transfer medium flowing through the high-temperature heat transfer medium circuit 44 is lower than a predetermined value T1, as in the embodiment, the battery 2 can be warmed up quickly.
[0096] Furthermore, in this embodiment, the storage section 26 is provided with a low-temperature storage chamber 61 that has a low-temperature outlet 61A into which the heat transfer medium flowing through the low-temperature heat transfer medium circuits 43 and 43A is introduced and stored, and into which the heat transfer medium flows into the temperature control circuit 42. The low-temperature storage chamber 61 and the high-temperature storage chamber 65 are connected to each other at their upper parts. Therefore, even if there is an imbalance in the amount of heat transfer medium between the low-temperature heat transfer medium circuits 43 and 43A and the high-temperature heat transfer medium circuit 44, the amount of heat transfer medium can be adjusted between the low-temperature storage chamber 61 and the high-temperature storage chamber 65 of the storage section 26.
[0097] Furthermore, in this embodiment, a thermovalve 30 is provided to switch whether or not to introduce the heat transfer medium in the low-temperature storage chamber 61 into the temperature control circuit 42, making it possible to cool the battery 2 accurately.
[0098] In this embodiment, the thermovalve 30 introduces the heat transfer medium from the low-temperature storage chamber 61 to the temperature control circuit 42 when the temperature of the heat transfer medium flowing through the temperature control circuit 42 exceeds a predetermined value T2, thereby reliably preventing overheating of the battery 2.
[0099] Furthermore, in this embodiment, the temperature control unit is composed of thermovalves 30 and 31, which are flow path switching valves that have a temperature sensing unit 54 that senses the temperature of the fluid flowing inside and switch the flow path of the fluid. As a result, electronic control is not required, and the cost of the system can be reduced.
[0100] Furthermore, the components that can be controlled for temperature include the battery 2 installed in the electric vehicle, the electric motor used for driving the electric vehicle, and the inverter that drives the electric motor.
[0101] In this embodiment, the high-temperature heat transfer medium circuit 44 has a heater core 17 through which the heat transfer medium heated by the heating unit 14 is circulated to heat the interior of the vehicle. The low-temperature heat transfer medium circuit 43 has a cooler core 16 through which the heat transfer medium cooled by the cooling unit 13 is circulated to cool the interior of the vehicle. A heat pump circuit 3 is provided, which includes a compressor 7, a heat radiator 8, an expansion valve 9, and a heat absorber 11. The heat radiator 8 and the heating unit 14 of the high-temperature heat transfer medium circuit 44 are in a heat exchange relationship, and the heat absorber 11 and the cooling unit 13 of the low-temperature heat transfer medium circuits 43 and 43A are also in a heat exchange relationship.
[0102] This allows the temperature of the battery 2 to be controlled using the heat pump circuit 3, high-temperature heat transfer circuit 44, and low-temperature heat transfer circuits 43 and 43A, which are used to air-condition the interior of the electric vehicle. Furthermore, when there is no need to heat the battery 2, the heat transfer fluid flowing through the high-temperature heat transfer circuit 44 will no longer flow to the temperature control circuit 42, so a higher temperature heat transfer fluid will circulate to the heater core 17, allowing the interior to be heated without any problems. In addition, when there is no need to cool the battery 2, the heat transfer fluid flowing through the low-temperature heat transfer circuit 43 will no longer flow to the battery 42, so a lower temperature heat transfer fluid will circulate to the cooler core 16, allowing the interior to be cooled without any problems.
[0103] It goes without saying that the numerical values and configurations shown in the examples are not limited to those shown and can be modified without departing from the spirit of the present invention. In particular, although the examples show that the thermovalve switches the flow path of the heat transfer medium, in this application the concept includes cases where a small amount flows in both directions without completely switching. Also, although the examples were explained using an air conditioning system for electric vehicles as an example, Inventions other than those described in sections 8-10 However, the present invention is not limited to that; it can be applied to various thermal management systems that circulate a heat transfer medium to control the temperature of an object. [Explanation of symbols]
[0104] 1. Thermal Management System 2. Battery (temperature controlled) 3. Heat pump circuit 4 Heat medium circuit 7 Compressor 8 Heat sink 9. Expansion valve (pressure reducing section) 11 Heat sink 13 Cooling section 14 Heating section 16 Cooler Core 17 Heater core 21 Pump No. 1 22 Pump No. 2 23. Third pump (circulation section) 26 Storage section 30, 31 Thermovalve (temperature control unit) 32-39 Three-way valve 42 Temperature control circuit 43, 43A low temperature heat transfer circuit 44 High temperature heat carrier circuit 61 Low-temperature storage chamber 61A Low temperature side outlet 63 Temperature-controlled storage chamber 64 High-temperature storage chamber for heat exchange 64A, 66A High temperature side outlet 65 High-temperature storage chamber 66 High-temperature storage chamber for bypass 67 Partition Wall 68, 69, 71, 72, 74, 76, 77 Partition walls 73 Tank (partition wall)
Claims
1. A thermal management system equipped with a heat transfer medium circuit that circulates a heat transfer medium around a temperature-controlled object, A temperature control circuit having a circulation unit that circulates the heat transfer medium to the temperature-controlled object, A high-temperature heat transfer medium circuit having a heating unit for heating the heat transfer medium, the heat transfer medium heated by the heating unit is circulated, A low-temperature heat transfer medium circuit is connected to the temperature control circuit and has a cooling unit for cooling the heat transfer medium, and the heat transfer medium cooled by the cooling unit is circulated through the low-temperature heat transfer medium circuit, A storage section is provided on the path for returning the heat transfer medium from the temperature control circuit to the low-temperature heat transfer medium circuit, and is used to store the heat transfer medium. The storage section is, A high-temperature side storage chamber has a high-temperature side outlet into which the heat transfer medium flowing through the high-temperature heat transfer medium circuit is introduced and stored, and into which the heat transfer medium is returned to the high-temperature heat transfer medium circuit. A temperature control side storage chamber into which the heat transfer medium circulating in the temperature control circuit is introduced and the heat transfer medium is stored, A thermal management system characterized by having a partition wall that separates the high-temperature storage chamber and the temperature-controlled storage chamber, such that the heat transfer medium in the high-temperature storage chamber and the heat transfer medium in the temperature-controlled storage chamber are in a heat exchange relationship.
2. The high-temperature storage chamber comprises a high-temperature storage chamber for heat exchange in which the heat transfer medium is in contact with the partition wall, and a high-temperature storage chamber for bypass in which the heat transfer medium is not in contact with the partition wall. The thermal management system according to claim 1, further comprising a temperature control unit that switches whether the heat transfer medium flowing through the high-temperature heat transfer medium circuit is introduced into the high-temperature heat exchange side storage chamber or into the high-temperature bypass side storage chamber.
3. The thermal management system according to claim 2, characterized in that the temperature adjustment unit introduces the heat transfer medium into the high-temperature heat exchange storage chamber when the temperature of the heat transfer medium flowing through the high-temperature heat transfer medium circuit is lower than a predetermined value.
4. The storage unit has a low-temperature side storage chamber into which the heat transfer medium flowing through the low-temperature heat transfer medium circuit is introduced and stored, and which has a low-temperature side outlet that allows the heat transfer medium to flow into the temperature control circuit. The thermal management system according to claim 2 or 3, characterized in that the low-temperature storage chamber and the high-temperature storage chamber are in communication with each other at their upper parts.
5. The thermal management system according to claim 4, further comprising another temperature control unit that switches whether or not to introduce the heat transfer medium in the low-temperature storage chamber into the temperature control circuit.
6. The thermal management system according to claim 5, characterized in that the other temperature control unit introduces the heat transfer medium from the low-temperature storage chamber into the temperature control circuit when the temperature of the heat transfer medium flowing through the temperature control circuit exceeds a predetermined value.
7. The thermal management system according to any one of claims 2 to 6, characterized in that the temperature control unit is a flow path switching valve having a temperature sensing unit that senses the temperature of the fluid flowing inside and switches the flow path of the fluid.
8. The thermal management system according to any one of claims 1 to 7, characterized in that the temperature control target is a battery mounted on a vehicle, a driving motor of the vehicle, or an inverter that drives the motor.
9. The high-temperature heat transfer medium circuit has a heater core through which the heat transfer medium heated by the heating unit is circulated to heat the interior of the vehicle. The thermal management system according to any one of claims 1 to 8, characterized in that the low-temperature heat transfer medium circuit has a cooler core for which the heat transfer medium cooled by the cooling unit is circulated to cool the interior of the vehicle.
10. The heat pump circuit comprises a compressor for compressing a refrigerant, a heat sink for dissipating heat from the refrigerant discharged from the compressor, a pressure reducing unit for reducing the pressure of the refrigerant that has been cooled by the heat sink, and a heat absorber for absorbing heat from the refrigerant that has been reduced in pressure by the pressure reducing unit. The heat exchanger and the heating section of the high-temperature heat transfer medium circuit are arranged in a heat exchange relationship. A thermal management system according to any one of claims 1 to 9, characterized in that the heat absorber and the cooling section of the low-temperature heat transfer medium circuit are arranged in a heat exchange relationship.
Citation Information
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