Image acquisition module and portable electronic device

Abstract

The present invention provides an image acquisition module for acquiring images and a portable electronic device that uses the image acquisition module. [Solution] The image acquisition module comprises a circuit board 1, an image detection chip 2, and an insulating connection structure 3. The image detection chip is installed in a through-opening 1003 of the circuit board and is electrically connected to the circuit board. The circuit board has a flat enclosure structure near the through-opening that surrounds the through-opening, and the lower surface of the flat enclosure structure and the lower surface of the image detection chip are flush with each other. As a result, during the process of filling the through-opening of the circuit board with the insulating connection structure, the insulating connection structure does not spill out from between the temporary mounting substrate C and the flat enclosure structure, and as a result, overflow or residue of adhesive at the lower end of the circuit board of the image acquisition module is avoided.

Description

Technical Field

[0001] The present invention relates to an image detector, and particularly to an image acquisition module for acquiring an image and a portable electronic device using the image acquisition module.

Background Art

[0002] In the prior art, an image detection chip of an image acquisition module can be disposed at the upper end of a circuit board without an opening by means of wire bonding, or can also be disposed at the lower end of a circuit board having an opening by means of flip-chip bonding. However, there is still room for improvement in the conventional image acquisition module.

Summary of the Invention

Problems to be Solved by the Invention

[0003] The problems to be improved or solved by the present invention are to provide an image acquisition module for acquiring an image and a portable electronic device using the image acquisition module in view of the deficiencies of the prior art.

Means for Solving the Problems

[0004] To improve or solve the above problems, the technical means adopted by the present invention is to provide an image acquisition module including a circuit board, an image detection chip, and an insulating connection structure. The circuit board has an upper surface, a lower surface, and a through-opening connected between the upper surface and the lower surface. The image detection chip is installed in the through-opening of the circuit board and is electrically connected to the circuit board. The insulating connection structure is installed in the through-opening of the circuit board and is connected between the image detection chip and the circuit board. Here, the lower surface of the image detection chip is not covered by the insulating connection structure and is exposed to the outside. The circuit board has a flat surrounding structure surrounding the through-opening near the through-opening, and the lower surface of the flat surrounding structure and the lower surface of the image detection chip are flush with each other.

[0005] To improve or solve the above-mentioned technical problems, another technical means employed by the present invention provides a portable electronic device configured to use an image acquisition module. The image acquisition module comprises a circuit board, an image detection chip, and an insulating connection structure. The circuit board has an upper surface, a lower surface, and a through-opening connected between the upper surface and the lower surface. The image detection chip is installed within the through-opening of the circuit board and is electrically connected to the circuit board. The insulating connection structure is installed within the through-opening of the circuit board and is connected between the image detection chip and the circuit board. Here, the lower surface of the image detection chip is not covered by the insulating connection structure and is exposed to the outside. The circuit board has a flat enclosure structure near the through-opening that surrounds the through-opening, and the lower surface of the flat enclosure structure and the lower surface of the image detection chip are flush with each other.

[0006] One of the beneficial effects of the present invention is that the image acquisition module and portable electronic device provided in the present invention can substantially (or completely) make the lower surface of the flat enclosure structure and the lower surface of the image detection chip flush with each other by the following technical means: "the image detection chip is installed in a through-opening of the circuit board and electrically connected to the circuit board," "the insulating connection structure is installed in a through-opening of the circuit board and connected between the image detection chip and the circuit board," "the lower surface of the image detection chip is not covered by the insulating connection structure and is exposed to the outside," and "the circuit board has a flat enclosure structure that surrounds the through-opening near the through-opening."

[0007] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the invention, however, the drawings provided are for reference and illustrative purposes only and are not intended to limit the invention. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic cross-sectional view of an image acquisition module according to the first embodiment of the present invention (showing the state before the temporary mounting substrate is removed). [Figure 2]A schematic cross-sectional view showing the flat surrounding structure and insulating coating layer combined according to the first embodiment of the present invention, or a schematic cross-sectional view along the II-II cross-sectional line in Figure 1 (showing the state before the temporary mounting substrate is removed). [Figure 3] This is a schematic cross-sectional view of an image acquisition module according to the first embodiment of the present invention (showing the state after the temporary mounting substrate has been removed). [Figure 4] This is a schematic cross-sectional view of the flat surrounding structure and insulating coating layer combined according to the first embodiment of the present invention, or a schematic cross-sectional view along the IV-IV cross-sectional line in Figure 3 (showing the state after the temporary mounting substrate has been removed). [Figure 5] This is a schematic cross-sectional view of an image acquisition module according to a second embodiment of the present invention (showing the state before the temporary mounting substrate is removed). [Figure 6] A schematic cross-sectional view of the flat surrounding structure and insulating coating layer combined according to the second embodiment of the present invention, or a schematic cross-sectional view along the VI-VI cross-sectional line in Figure 5 (showing the state before the temporary mounting substrate is removed). [Figure 7] This is a schematic cross-sectional view of an image acquisition module according to a second embodiment of the present invention (showing the state after the temporary mounting substrate has been removed). [Figure 8] This is a schematic cross-sectional view of the flat surrounding structure and insulating coating layer combined according to the second embodiment of the present invention, or a schematic cross-sectional view along the VIII-VIII cross-sectional line in Figure 7 (showing the state after the temporary mounting substrate has been removed). [Figure 9] This is a schematic cross-sectional view of an image acquisition module according to a third embodiment of the present invention (showing the state before the insulating connection structure is filled). [Figure 10] This is a schematic cross-sectional view of an image acquisition module according to a third embodiment of the present invention (showing the state after the insulating connection structure has been filled). [Figure 11] This is a schematic bottom view of the circuit board of an image acquisition module according to a fourth embodiment of the present invention. [Figure 12] This is a schematic cross-sectional view of an image acquisition module according to a fourth embodiment of the present invention (showing the state before the insulating connection structure is filled). [Figure 13]This is a schematic cross-sectional view of an image acquisition module according to a fourth embodiment of the present invention (showing the state after the insulating connection structure has been filled). [Figure 14] This is a functional block diagram of a portable electronic device using an image acquisition module according to a fifth embodiment of the present invention. [Modes for carrying out the invention]

[0009] The following describes embodiments of the “image acquisition module” and “portable electronic device” disclosed herein by specific examples. Those skilled in the art will be able to understand the advantages and effects of the present invention from the disclosed content. The present invention can be carried out or applied through other different specific embodiments, and the various detailed descriptions herein can be modified and changed in various ways without departing from the spirit of the invention, based on different perspectives and uses. It should also be noted in advance that the drawings of the present invention are for illustrative purposes only and are not based on actual dimensions. The following embodiments will describe the technical content relating to the present invention in more detail, but the disclosed content is not intended to limit the scope of protection of the present invention. Furthermore, the term “or” herein should be understood to include any one or more of the items listed in relation to the actual situation.

[0010] [First Embodiment] As shown in Figures 1 to 4, the first embodiment of the present invention provides an image acquisition module M (or image detection module, image capture module) comprising a circuit board 1, an image detection chip 2, an insulating connection structure 3, and a lens assembly 4. Figure 1 is a schematic front cross-sectional view of the image acquisition module according to the first embodiment of the present invention before the temporary mounting substrate is removed, and Figure 2 is a schematic side cross-sectional view of a part of Figure 1. Furthermore, Figure 3 is a schematic front cross-sectional view of the image acquisition module according to the first embodiment of the present invention after the temporary mounting substrate is removed, and Figure 4 is a schematic side cross-sectional view of a part of Figure 3.

[0011] Furthermore, as shown in Figures 1, 2, and 3, the circuit board 1 may have an upper surface 1001, a lower surface 1002, and a through-opening 1003 (or a through-opening 1003 penetrating the circuit board 1) connected between the upper surface 1001 and the lower surface 1002, and the image detection chip 2 may be installed in the through-opening 1003 of the circuit board 1 and electrically connected to the circuit board 1. Also, the insulating connection structure 3 may be installed in the through-opening 1003 of the circuit board 1 and connected between the image detection chip 2 and the circuit board 1, and the lens assembly 4 may include a lens mounting member 41 provided on the circuit board 1 and a lens module 42 (for example, which may consist of multiple optical lenses) mounted on the lens mounting member 41. For example, the circuit board 1 may have a plurality of substrate conductive pads 10P on its upper surface 1001, and the image detection chip 2 may have an image detection area 20S corresponding to the lens module 42 and a plurality of chip conductive pads 20P on its upper surface 2001. Furthermore, each of the plurality of chip conductive pads 20P in the image detection chip 2 may be electrically connected to each of the plurality of substrate conductive pads 10P in the circuit board 1 via a plurality of metal wires W (which may be any conductive metal material such as gold, silver, or copper). Furthermore, depending on different usage requirements, the image detection chip 2 may be a charge-coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS). However, the above examples are merely possible embodiments and do not limit the present invention.

[0012] Furthermore, as shown in Figures 1 and 2, the circuit board 1 may have a flat surrounding structure 11 near the through-opening 1003 that surrounds the through-opening 1003 (this is schematically shown only in Figures 2 and 4, but not in Figures 1 and 3). Also, the lower surface 2002 of the image detection chip 2 is not covered by the insulating connection structure 3 and is exposed to the outside. Moreover, the lower surface of the flat surrounding structure 11 and the lower surface 2002 of the image detection chip 2 may be substantially (or completely) flush with each other. For example, the circuit board 1 may include a circuit layout layer 101 (e.g., a copper circuit layout layer) provided on the lower surface 1002 of the circuit board 1 and an insulating coating layer 102 (e.g., a solder mask layer or a solder resist layer) for covering the circuit layout layer 101. Furthermore, the circuit layout layer 101 may have a plurality of conductive circuit portions 1010 near the through-opening 1003 that surround the through-opening 1003. Furthermore, the insulating coating layer 102 may include a plurality of first coating portions 102A, a plurality of second coating portions 102B, and a plurality of recessed spaces 102C. The plurality of first coating portions 102A may be provided on the lower surface 1002 of the circuit board 1. The plurality of second coating portions 102B (each second coating portion 102B may have a stepped shape or a recessed shape) may each cover a plurality of conductive circuit portions 1010. Moreover, each recessed space 102C may be located between a corresponding first coating portion 102A and two adjacent second coating portions 102B. Furthermore, the flat surrounding structure 11 on the circuit board 1 may include a plurality of filler material layers 111 (for example, a conductive material that does not produce electrical conductivity with the circuit arrangement layer 101, or a non-conductive material that is the same as or different from the material of the insulating coating layer 102). Furthermore, the multiple filler material layers 111 in the flat surrounding structure 11 may each be filled (completely filled) into the multiple recessed spaces 102C in the insulating coating layer 102. However, the above examples are merely possible embodiments and do not limit the present invention.

[0013] It is worth noting that, for example, as shown in Figures 1 and 2, the lower surfaces 1110 of each filling material layer 111 in the flat enclosure structure 11 and the lower surfaces 1020 of each second coating portion 102B in the insulating coating layer 102 may be substantially (or completely) flush with each other, and the lower surfaces 1110 of each filling material layer 111 in the flat enclosure structure 11 and the lower surface 2002 of the image detection chip 2 may be substantially (or completely) flush with each other. Therefore, when the temporary mounting substrate C (for example, a flexible tape or any type of mounting member) is flatly bonded to the lower surface 1110 of each filling material layer 111 in the flat surrounding structure 11 and to the lower surface 1020 of each second coating portion 102B in the insulating coating layer 102 (as shown in Figure 1, at this time the lower surface 2002 of the image detection chip 2 is also flatly bonded to the temporary mounting substrate C via adhesive), in the process of filling the through-opening 1003 of the circuit board 1, the insulating connection structure 3 is filled into the through-opening 1003 of the circuit board 1. The adhesive is filled only within the opening 1003 and does not overflow to the outside from "between the temporary mounting substrate C and the lower surface 1110 of each filling material layer 111 in the flat surrounding structure 11" or "between the temporary mounting substrate C and the lower surface 1020 of each second covering portion 102B in the insulating coating layer 102" (i.e., no gap is created between the temporary mounting substrate C and the lower surface 1110 of each filling material layer 111 in the flat surrounding structure 11, and no gap is created between the temporary mounting substrate C and the lower surface 1020 of each second covering portion 102B in the insulating coating layer 102). This prevents adhesive overflow / overfill or residual glue from occurring at the lower end (or back) of the circuit board 1 in the image acquisition module M. However, the above example is merely a possible embodiment and does not limit the present invention.

[0014] As a result, as shown in Figures 3 and 4, after the temporary substrate C is detached from the circuit board 1 by "direct irradiation with laser light generated by the laser generator" or "indirect heating by a heat source generated by the heater", the insulating connection structure 3 has an exposed and uncovered lower surrounding surface 3000, and the lower surrounding surface 3000 of the insulating connection structure 3, the lower surface of the flat surrounding structure 11 (i.e., the lower surface 1110 of each filling material layer 111 and the lower surface 1020 of each second covering portion 102B in the insulating coating layer 102), and the lower surface 2002 of the image detection chip 2 may be substantially (or completely) flush with each other. For example, if the temporary substrate C can be peeled off from the circuit board 1 by "direct irradiation with laser light generated by a laser generator" or "indirect heating by a heat source generated by a heater," deformation marks (not shown) of the adhesive will be formed on the lower surrounding surface 3000 of the insulating connection structure 3 "after being heated by a heat source generated by a laser generator or heater." However, the above example is merely a possible embodiment and does not limit the present invention.

[0015] For example, as shown in FIG. 1 or FIG. 3, in one possible embodiment, the thickness of the insulating connection structure 3 may be less than or equal to the thickness of the image detection chip 2, and the thickness of the insulating connection structure 3 may also be less than or equal to the thickness of the circuit board 1. Further, the insulating connection structure 3 may be closely connected between the outer peripheral surface 2000 of the image detection chip 2 and the inner peripheral surface 1004 of the through-hole 1003 in the circuit board 1. Also, in one possible embodiment, when the inner peripheral surface 1004 of the through-hole 1003 in the circuit board 1 is provided as a roughened surrounding surface, the roughened surrounding surface can be used to increase the adhesive force or contact area between the insulating connection structure 3 and the circuit board 1. Additionally, in one possible embodiment, the whole or part of the outer peripheral surface 2000 of the image detection chip 2 may be covered by the insulating connection structure 3. Thereby, the adhesive force or contact area between the insulating connection structure 3 and the image detection chip 2 can be adjusted (that is, the larger the area of the outer peripheral surface 2000 of the image detection chip 2 covered by the insulating connection structure 3, the larger the adhesive force or contact area between the insulating connection structure 3 and the image detection chip 2). However, the above examples are merely possible embodiments and do not limit the present invention.

[0016] For example, in one possible embodiment, the insulating connection structure 3 may have an extended connection portion (not shown) extending to the upper surface 1001 of the circuit board 1. Thereby, the adhesive force or contact area between the insulating connection structure 3 and the circuit board 1 is increased. That is, since the insulating connection structure 3 can be overlapped and connected to the upper surface 1001 of the circuit board 1 by the extended portion of the extended connection portion, the contact area between the insulating connection structure 3 and the circuit board 1 becomes larger (or the insulating connection structure 3 is supported by the circuit board 1). Thereby, the insulating connection structure 3 is not easily peeled off from the through-hole 1003 of the circuit board 1 by an external force (for example, the external force generated when removing the temporary mounting board C from the circuit board 1 as shown in FIG. 4). However, the above examples are merely possible embodiments and do not limit the present invention.

[0017] As a point to note, for example, as shown in FIG. 1 or FIG. 3, the image acquisition module M according to the first embodiment of the present invention further includes a filtering element 5. The filtering element 5 may be supported by a plurality of supports (not numbered) or a surrounding support member (not numbered) and may be installed above the image detection chip 2. Further, the filtering element 5 may be surrounded by a plurality of metal wires W. Further, the height of the filtering element 5 with respect to the image detection chip 2 may be higher or lower than the height of the plurality of metal wires W with respect to the image detection chip 2. However, the above examples are merely possible embodiments and do not limit the present invention.

[0018] [Second Embodiment] As shown in Figures 5 to 8, a second embodiment of the present invention provides an image acquisition module M. As can be seen from the comparison between Figure 6 and Figure 2 and between Figure 8 and Figure 4, the main differences between the second embodiment and the first embodiment of the present invention are as follows. In the second embodiment, the flat enclosure structure 11 of the circuit board 1 includes a plurality of filler material layers 111 and a thickening material layer 112 (or a material thickening layer), and the plurality of filler material layers 111 in the flat enclosure structure 11 (for example, a conductive material that does not produce electrical conductivity with the circuit layout layer 101, or a non-conductive material that is the same as or different from the material of the insulating coating layer 102) may be filled (completely filled) into a plurality of recessed spaces 102C in the insulating coating layer 102, and the thickening material layer 112 may be used to cover the plurality of filler material layers 111 and a plurality of second coating portions 102B. It is worth noting that the thickened material layer 112 in the flat enclosure structure 11 has a flat surface 1120, and the flat surface 1120 of the thickened material layer 112 in the flat enclosure structure 11 and the lower surface 2002 of the image detection chip 2 may be substantially (or completely) flush with each other. Therefore, when the temporary mounting substrate C (for example, a flexible tape or any type of mounting member) is flatly bonded to the flat surface 1120 of the thickened material layer 112 in the flat enclosure structure 11 (as shown in Figure 5, at this time the lower surface 2002 of the image detection chip 2 is also flatly bonded to the temporary mounting substrate C via the adhesive), in the process of filling the through-opening 1003 of the circuit board 1, the insulating connection structure 3 is filled only within the through-opening 1003 of the circuit board 1 and does not overflow to the outside from "between the temporary mounting substrate C and the flat surface 1120 of the thickened material layer 112 in the flat enclosure structure 11" (i.e., no gap is created between the temporary mounting substrate C and the flat surface 1120 of the thickened material layer 112 in the flat enclosure structure 11). This avoids glue overflow / overfill or residual glue from occurring at the lower end (or back) of the circuit board 1 in the image acquisition module M. However, the above examples are merely possible embodiments and do not limit the present invention.

[0019] As a result, as shown in Figures 7 and 8, after the temporary substrate C is detached from the circuit board 1 by "direct irradiation with laser light generated by a laser generator" or "indirect heating by a heat source generated by a heater", the insulating connection structure 3 has an exposed and uncovered lower surrounding surface 3000, and the lower surrounding surface 3000 of the insulating connection structure 3, the lower surface of the flat surrounding structure 11 (i.e., the flat surface 1120 of the thickened material layer 112 in the flat surrounding structure 11), and the lower surface 2002 of the image detection chip 2 may be substantially (or completely) flush with each other. For example, if the temporary substrate C is detachable from the circuit board 1 by "direct irradiation with laser light generated by a laser generator" or "indirect heating by a heat source generated by a heater", deformation marks (not shown) of the adhesive formed "after being heated by a heat source generated by a laser generator or heater" will occur on the lower surrounding surface 3000 of the insulating connection structure 3. However, the above examples are merely possible embodiments and do not limit the present invention.

[0020] [Third Embodiment] As shown in Figures 9 and 10, a third embodiment of the present invention provides an image acquisition module M. The main differences between the third embodiment of the present invention and the first and second embodiments are as follows. In the third embodiment, the insulating connection structure 3 may have a main filling layer 30A (or a first surrounding filling layer) provided in the through-opening 1003 of the circuit board 1, and a surrounding filling layer 30B (or a second surrounding filling layer, the maximum width of which may be any positive integer from 100 μm to 150 μm) connected to the main filling layer 30A so as to surround the main filling layer 30A (for example, connected by integral molding or connected without integral molding). The surrounding filling layer 30B may be provided as a flat surrounding structure 11, and the surrounding filling layer 30B may be provided on the lower surface 1002 of the circuit board 1 to cover a plurality of conductive circuit parts 1010 in the circuit arrangement layer 101. Therefore, when the temporary mounting substrate C (for example, a flexible tape or any type of mounting material) is flatly bonded to the bottom surface of the circuit board 1 (at this time, the lower surface 2002 of the image detection chip 2 is also flatly bonded to the temporary mounting substrate C via adhesive), in the process of filling the through-opening 1003 of the circuit board 1 with the insulating connection structure 3, the insulating connection structure 3 is filled only within the through-opening 1003 of the circuit board 1 and does not overflow to the outside from "between the temporary mounting substrate C and the insulating coating layer 102" (i.e., no gap is created between the temporary mounting substrate C and the insulating coating layer 102). This avoids the occurrence of adhesive overflow / overfill or residual glue at the lower end (or back) of the circuit board 1 in the image acquisition module M. However, the above example is merely a possible embodiment and does not limit the present invention.

[0021] As a result, as shown in Figure 10, after the temporary substrate C is detached from the circuit board 1 by "direct irradiation with laser light generated by a laser generator" or "indirect heating by a heat source generated by a heater," the lower surface 3001 of the main filling layer 30A, the lower surface 3002 of the surrounding filling layer 30B as a flat surrounding structure 11, and the lower surface 2002 of the image detection chip 2 may be substantially (or completely) flush with each other. For example, if the temporary substrate C is detachable from the circuit board 1 by "direct irradiation with laser light generated by a laser generator" or "indirect heating by a heat source generated by a heater," deformation marks (not shown) of the adhesive formed "after being heated by a heat source generated by a laser generator or heater" will occur on the lower surrounding surface 3000 of the insulating connection structure 3 (i.e., the lower surface 3001 of the main filling layer 30A and the lower surface 3002 of the surrounding filling layer 30B). However, the above examples are merely possible embodiments and do not limit the present invention.

[0022] [Fourth embodiment] As shown in Figures 11 to 13, the fourth embodiment of the present invention provides an image acquisition module M. The main differences between the fourth embodiment of the present invention and the first, second, and third embodiments are as follows. In the fourth embodiment, the lower surface 1002 of the circuit board 1 may have a non-circuit placement area 10020 (or a substrate clearance area, the maximum width of which may be any positive integer from 100 μm to 150 μm), the non-circuit placement area 10020 of the circuit board 1 may be surrounded by a circuit placement layer 101 and an insulating coating layer 102, and the non-circuit placement area 10020 of the circuit board 1 may be provided as a flat surrounding structure 11. Therefore, when the temporary mounting substrate C (for example, a flexible tape or any type of mounting material) is flatly bonded to the bottom surface of the circuit board 1 (at this time, the lower surface 2002 of the image detection chip 2 is also flatly bonded to the temporary mounting substrate C via adhesive), in the process of filling the through-opening 1003 of the circuit board 1 with the insulating connection structure 3, the insulating connection structure 3 is filled only within the through-opening 1003 of the circuit board 1 and does not overflow to the outside from "between the temporary mounting substrate C and the non-circuit placement area 10020 of the circuit board 1" (i.e., no gap is created between the temporary mounting substrate C and the non-circuit placement area 10020 of the circuit board 1). This avoids the occurrence of adhesive overflow / overfill or residual glue at the lower end (or back) of the circuit board 1 in the image acquisition module M. However, the above example is merely a possible embodiment and does not limit the present invention.

[0023] As a result, as shown in Figure 13, after the temporary mounting substrate C is detached from the circuit board 1 by "direct irradiation with laser light generated by a laser generator" or "indirect heating by a heat source generated by a heater," the insulating connection structure 3 has an exposed and uncovered lower surrounding surface 3000, and the lower surrounding surface 3000 of the insulating connection structure 3, the non-circuit placement area 10020 of the circuit board 1, and the lower surface 2002 of the image detection chip 2 may be substantially (or completely) flush with each other. For example, if the temporary mounting substrate C is detachable from the circuit board 1 by "direct irradiation with laser light generated by a laser generator" or "indirect heating by a heat source generated by a heater," deformation marks (not shown) of the adhesive formed "after being heated by a heat source generated by a laser generator or heater" will occur on the lower surrounding surface 3000 of the insulating connection structure 3. However, the above example is merely a possible embodiment and does not limit the present invention.

[0024] [Fifth Example] As shown in Figure 14, a fifth embodiment of the present invention provides a portable electronic device P configured to use an image acquisition module M according to any of the first, second, third, or fourth embodiments. For example, the portable electronic device P may be a smartphone, a desktop computer, a notebook computer, a tablet computer, or any other type of electronic device. However, the above examples are merely possible embodiments and do not limit the present invention.

[0025] It is worth noting that, for example, in the first to fifth embodiments of the present invention, the present invention may further provide a method for manufacturing an image acquisition module M. The manufacturing method first involves placing the circuit board 1 on the temporary mounting substrate C by bringing the circuit board 1 and the temporary mounting substrate C close together (or bringing them close enough that they are in complete contact) so that the lower end of the through-opening 1003 of the circuit board 1 is sealed by the temporary mounting substrate C. Next, the image detection chip 2 is housed in the through-opening 1003 of the circuit board 1 and placed on the temporary mounting substrate C. Then, an insulating connection structure 3 is formed in the through-opening 1003 of the circuit board 1 and connected between the image detection chip 2 and the circuit board 1. Subsequently, the temporary mounting substrate C is removed from the circuit board 1. After that, the image detection chip 2 is electrically connected to the circuit board 1 via a plurality of metal conductors W. Finally, the lens assembly 4 is installed on the circuit board 1. Here, the lens assembly 4 comprises a lens mounting member 41 installed on the circuit board 1 and a lens module 42 mounted on the lens mounting member 41. Furthermore, depending on different processing requirements, the temporary mounting substrate C may be removed from the circuit board 1 after the step of "forming the insulating connection structure 3 within the through-opening 1003 of the circuit board 1," or after the step of "electrically connecting the image detection chip 2 to the circuit board 1 via a plurality of metal conductors W," or after the step of "installing the lens assembly 4 on the circuit board 1." However, the above examples are merely possible embodiments and do not limit the present invention.

[0026] Notably, in the first to fifth embodiments of the present invention, the present invention may further provide a method for manufacturing an image acquisition module M. The manufacturing method first involves placing the circuit board 1 on the temporary mounting substrate C by bringing the circuit board 1 and the temporary mounting substrate C close together (or bringing them close enough that they are in complete contact) so that the lower end of the through-opening 1003 of the circuit board 1 is sealed by the temporary mounting substrate C. Next, the image detection chip 2 is placed on the temporary mounting substrate C by housing it in the through-opening 1003 of the circuit board 1 via an adhesive layer (for example, double-sided tape or any type of adhesive layer). Subsequently, the image detection chip 2 is electrically connected to the circuit board 1 via a plurality of metal wires W (or, this may include placing the filtering element 5 above the image detection chip 2 via support from a plurality of supports or surrounding support members). After that, an insulating connection structure 3 is formed in the through-opening 1003 of the circuit board 1 and connected between the image detection chip 2 and the circuit board 1. After that, the temporary mounting substrate C is removed from the circuit board 1. Finally, the lens assembly 4 is installed on the circuit board 1. Here, the lens assembly 4 comprises a lens mounting member 41 installed on the circuit board 1 and a lens module 42 mounted on the lens mounting member 41. It should be noted that, depending on different requirements, the "wire bonding step (or chip electrical connection step)" in which the image detection chip 2 is electrically connected to the circuit board 1 via a plurality of metal wires W, and the "adhesive filling step (chip position regulating step)" in which the insulating connection structure 3 is formed in the through-opening 1003 of the circuit board 1 and connected between the image detection chip 2 and the circuit board 1, may be two steps performed in sequence (i.e., the adhesive filling step is performed first, followed by the wire bonding step) or two steps performed in reverse order (i.e., the wire bonding step is performed first, followed by the adhesive filling step).

[0027] [Beneficial effects from the examples] One of the beneficial effects of the present invention is that the image acquisition module M and portable electronic device P provided in the present invention can substantially (or completely) make the lower surface of the flat enclosure structure 11 and the lower surface 2002 of the image detection chip 2 flush with each other by the following technical means: "the image detection chip 2 is installed in a through-opening 1003 of the circuit board 1 and electrically connected to the circuit board 1", "the insulating connection structure 3 is installed in a through-opening 1003 of the circuit board 1 and connected between the image detection chip 2 and the circuit board 1", "the lower surface 2002 of the image detection chip 2 is not covered by the insulating connection structure 3 and is exposed to the outside", and "the circuit board 1 has a flat enclosure structure 11 near the through-opening 1003 that surrounds the through-opening 1003".

[0028] As a result, during the process in which the insulating connection structure 3 is filled into the through-opening 1003 of the circuit board 1, the insulating connection structure 3 does not overflow out from between the temporary mounting substrate C and the flat surrounding structure 11, and as a result, glue overflow / overfill or residual glue does not occur at the lower end (or back) of the circuit board 1 of the image acquisition module M.

[0029] The information disclosed herein represents only preferred embodiments of the present invention and does not limit the scope of the claims. Accordingly, all equivalent technical modifications made using the specification and drawings of the present invention are included within the scope of the claims. [Explanation of symbols]

[0030] P: Portable electronic devices M: Image acquisition module 1: Circuit board 1001: Upper surface 1002: Lower surface 10020: Non-circuit placement area 1003: Through opening 1004: Inner surface 10P: Conductive pads for circuit boards 101:Circuit placement layer 1010: Conductive circuit section 102: Insulating coating layer 1020: Lower surface 102A: First coating section 102B: Second covering section 102C: Recessed space 11: Flat surrounding structure 111: Filling material layer 1110: Lower surface 112: Thickened material layer 1120: Flat surface 2: Image detection chip 2000: Outer surface 2001: Upper surface 2002: Lower surface 20P: Chip conductive pad 20S: Image detection area 3: Insulated connection structure 3000: Lower surrounding surface 3001: Lower surface 3002: Lower surface 30A: Main packed layer 30B: Surrounding packed layer 4: Lens assembly 41: Lens mounting component 42: Lens Module 5: Filtering element W: Metal conductor wire C: Temporary mounting board

Claims

1. A circuit board having an upper surface, a lower surface, and through-openings connected between the upper surface and the lower surface, An image detection chip is installed in the through-opening of the circuit board and electrically connected to the circuit board, An insulating connection structure is installed within the through-opening of the circuit board and connected between the image detection chip and the circuit board, Equipped with, The lower surface of the image detection chip is not covered by the insulating connection structure and is exposed to the outside. The circuit board has a flat surrounding structure near the through-opening that encloses the through-opening, and the lower surface of the flat surrounding structure and the lower surface of the image detection chip are flush with each other. An image acquisition module characterized by the following features.

2. The circuit board includes a circuit arrangement layer provided on the lower surface of the circuit board and an insulating coating layer for covering the circuit arrangement layer, and the circuit arrangement layer has a plurality of conductive circuit portions near the through-opening that surround the through-opening. The insulating coating layer includes a plurality of first coating portions, a plurality of second coating portions, and a plurality of recessed spaces, wherein the plurality of first coating portions are provided on the lower surface of the circuit board, the plurality of second coating portions each cover a plurality of the conductive circuit portions, and each recessed space is located between a corresponding first coating portion and two adjacent second coating portions. The flat surrounding structure in the circuit board includes a plurality of filler material layers, and each of the plurality of filler material layers in the flat surrounding structure is filled into a plurality of recessed spaces in the insulating coating layer. The lower surfaces of each of the filling material layers in the flat enclosure structure and the lower surfaces of each of the second coating portions in the insulating coating layer are flush with each other, and the lower surfaces of each of the filling material layers in the flat enclosure structure and the lower surfaces of the image detection chip are flush with each other. The insulating connection structure has an externally exposed and uncovered lower surrounding surface, and the lower surrounding surface of the insulating connection structure, the lower surface of the flat surrounding structure, and the lower surface of the image detection chip are flush with each other. The image acquisition module according to claim 1.

3. The circuit board includes a circuit arrangement layer provided on the lower surface of the circuit board and an insulating coating layer for covering the circuit arrangement layer, and the circuit arrangement layer has a plurality of conductive circuit portions near the through-opening that surround the through-opening. The insulating coating layer includes a plurality of first coating portions, a plurality of second coating portions, and a plurality of recessed spaces, wherein the plurality of first coating portions are provided on the lower surface of the circuit board, the plurality of second coating portions each cover a plurality of the conductive circuit portions, and each recessed space is located between a corresponding first coating portion and two adjacent second coating portions. The flat enclosure structure of the circuit board includes a plurality of filler material layers and a thickening material layer, wherein the plurality of filler material layers in the flat enclosure structure are each filled into a plurality of recessed spaces in the insulating coating layer, and the thickening material layer is used to cover the plurality of filler material layers and the plurality of second coating portions. The thickened material layer in the flat enclosure structure has a flat surface, and the flat surface of the thickened material layer in the flat enclosure structure and the lower surface of the image detection chip are flush with each other. The insulating connection structure has an externally exposed and uncovered lower surrounding surface, and the lower surrounding surface of the insulating connection structure, the lower surface of the flat surrounding structure, and the lower surface of the image detection chip are flush with each other. The image acquisition module according to claim 1.

4. The circuit board includes a circuit arrangement layer provided on the lower surface of the circuit board and an insulating coating layer for covering the circuit arrangement layer, and the circuit arrangement layer has a plurality of conductive circuit portions near the through-opening that surround the through-opening. The insulating connection structure comprises a main filling layer provided within the through-opening of the circuit board, and a surrounding filling layer connected to the main filling layer so as to surround the main filling layer, wherein the surrounding filling layer is provided as the flat surrounding structure, and the surrounding filling layer is provided on the lower surface of the circuit board to cover the plurality of conductive circuit portions in the circuit arrangement layer. The lower surface of the main filling layer, the lower surface of the surrounding filling layer as a flat surrounding structure, and the lower surface of the image detection chip are flush with each other. The image acquisition module according to claim 1.

5. The circuit board includes a circuit arrangement layer provided on the lower surface of the circuit board and an insulating coating layer for covering the circuit arrangement layer, and the circuit arrangement layer has a plurality of conductive circuit portions near the through-opening that surround the through-opening. The lower surface of the circuit board has a non-circuit placement area, the non-circuit placement area of ​​the circuit board is surrounded by the circuit placement layer and the insulating coating layer, and the non-circuit placement area of ​​the circuit board is provided as the flat surrounding structure. The non-circuit area on the circuit board has a maximum width of 100 μm to 150 μm. The insulating connection structure has an externally exposed and uncovered lower surrounding surface, and the lower surrounding surface of the insulating connection structure, the non-circuit placement area of ​​the circuit board, and the lower surface of the image detection chip are flush with each other. The circuit board has a plurality of substrate conductive pads on its upper surface, the image detection chip has a plurality of chip conductive pads on its upper surface, and furthermore, each of the plurality of chip conductive pads in the image detection chip is electrically connected to each of the plurality of substrate conductive pads in the circuit board via a plurality of metal wires. The insulating connection structure is closely connected between the outer peripheral surface of the image detection chip and the inner peripheral surface of the through-opening in the circuit board. The inner circumferential surface of the through-opening in the circuit board is provided as a roughened surrounding surface, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board. The entire or a portion of the outer surface of the image detection chip is covered by the insulating connection structure, thereby adjusting the adhesive force or contact area between the insulating connection structure and the image detection chip. The thickness of the insulating connection structure is less than or equal to the thickness of the image detection chip, and the thickness of the insulating connection structure is less than or equal to the thickness of the circuit board. The image acquisition module further comprises a lens assembly, the lens assembly comprising a lens mounting member provided on the circuit board and a lens module mounted on the lens mounting member, and the image detection chip has an image detection area on its upper surface corresponding to the lens module. The image acquisition module further comprises a filtering element, the filtering element being supported by a plurality of supports or surrounding support members, installed above the image detection chip, and surrounded by a plurality of metal wires. The image acquisition module according to claim 1.

6. A portable electronic device configured to use an image acquisition module, The aforementioned image acquisition module is A circuit board having an upper surface, a lower surface, and through-openings connected between the upper surface and the lower surface, An image detection chip is installed in the through-opening of the circuit board and electrically connected to the circuit board, An insulating connection structure is installed within the through-opening of the circuit board and connected between the image detection chip and the circuit board, Equipped with, The lower surface of the image detection chip is not covered by the insulating connection structure and is exposed to the outside. The circuit board has a flat surrounding structure near the through-opening that encloses the through-opening, and the lower surface of the flat surrounding structure and the lower surface of the image detection chip are flush with each other. A portable electronic device characterized by the following features.

7. The circuit board includes a circuit arrangement layer provided on the lower surface of the circuit board and an insulating coating layer for covering the circuit arrangement layer, and the circuit arrangement layer has a plurality of conductive circuit portions near the through-opening that surround the through-opening. The insulating coating layer includes a plurality of first coating portions, a plurality of second coating portions, and a plurality of recessed spaces, wherein the plurality of first coating portions are provided on the lower surface of the circuit board, the plurality of second coating portions each cover a plurality of the conductive circuit portions, and each recessed space is located between a corresponding first coating portion and two adjacent second coating portions. The flat surrounding structure in the circuit board includes a plurality of filler material layers, and each of the plurality of filler material layers in the flat surrounding structure is filled into a plurality of recessed spaces in the insulating coating layer. The lower surfaces of each of the filling material layers in the flat enclosure structure and the lower surfaces of each of the second coating portions in the insulating coating layer are flush with each other, and the lower surfaces of each of the filling material layers in the flat enclosure structure and the lower surfaces of the image detection chip are flush with each other. The insulating connection structure has an externally exposed and uncovered lower surrounding surface, and the lower surrounding surface of the insulating connection structure, the lower surface of the flat surrounding structure, and the lower surface of the image detection chip are flush with each other. The portable electronic device according to claim 6.

8. The circuit board includes a circuit arrangement layer provided on the lower surface of the circuit board and an insulating coating layer for covering the circuit arrangement layer, and the circuit arrangement layer has a plurality of conductive circuit portions near the through-opening that surround the through-opening. The insulating coating layer includes a plurality of first coating portions, a plurality of second coating portions, and a plurality of recessed spaces, wherein the plurality of first coating portions are provided on the lower surface of the circuit board, the plurality of second coating portions each cover a plurality of the conductive circuit portions, and each recessed space is located between a corresponding first coating portion and two adjacent second coating portions. The flat enclosure structure of the circuit board includes a plurality of filler material layers and a thickening material layer, wherein the plurality of filler material layers in the flat enclosure structure are each filled into a plurality of recessed spaces in the insulating coating layer, and the thickening material layer is used to cover the plurality of filler material layers and the plurality of second coating portions. The thickened material layer in the flat enclosure structure has a flat surface, and the flat surface of the thickened material layer in the flat enclosure structure and the lower surface of the image detection chip are flush with each other. The insulating connection structure has an externally exposed and uncovered lower surrounding surface, and the lower surrounding surface of the insulating connection structure, the lower surface of the flat surrounding structure, and the lower surface of the image detection chip are flush with each other. The portable electronic device according to claim 6.

9. The circuit board includes a circuit arrangement layer provided on the lower surface of the circuit board and an insulating coating layer for covering the circuit arrangement layer, and the circuit arrangement layer has a plurality of conductive circuit portions near the through-opening that surround the through-opening. The insulating connection structure comprises a main filling layer provided within the through-opening of the circuit board, and a surrounding filling layer connected to the main filling layer so as to surround the main filling layer, wherein the surrounding filling layer is provided as the flat surrounding structure, and the surrounding filling layer is provided on the lower surface of the circuit board to cover the plurality of conductive circuit portions in the circuit arrangement layer. The lower surface of the main filling layer, the lower surface of the surrounding filling layer as a flat surrounding structure, and the lower surface of the image detection chip are flush with each other. The portable electronic device according to claim 6.

10. The circuit board includes a circuit arrangement layer provided on the lower surface of the circuit board and an insulating coating layer for covering the circuit arrangement layer, and the circuit arrangement layer has a plurality of conductive circuit portions near the through-opening that surround the through-opening. The lower surface of the circuit board has a non-circuit placement area, the non-circuit placement area of ​​the circuit board is surrounded by the circuit placement layer and the insulating coating layer, and the non-circuit placement area of ​​the circuit board is provided as the flat surrounding structure. The non-circuit area on the circuit board has a maximum width of 100 μm to 150 μm. The insulating connection structure has an externally exposed and uncovered lower surrounding surface, and the lower surrounding surface of the insulating connection structure, the non-circuit placement area of ​​the circuit board, and the lower surface of the image detection chip are flush with each other. The circuit board has a plurality of substrate conductive pads on its upper surface, the image detection chip has a plurality of chip conductive pads on its upper surface, and furthermore, each of the plurality of chip conductive pads in the image detection chip is electrically connected to each of the plurality of substrate conductive pads in the circuit board via a plurality of metal wires. The insulating connection structure is closely connected between the outer peripheral surface of the image detection chip and the inner peripheral surface of the through-opening in the circuit board. The inner circumferential surface of the through-opening in the circuit board is provided as a roughened surrounding surface, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board. The entire or a portion of the outer surface of the image detection chip is covered by the insulating connection structure, thereby adjusting the adhesive force or contact area between the insulating connection structure and the image detection chip. The thickness of the insulating connection structure is less than or equal to the thickness of the image detection chip, and the thickness of the insulating connection structure is less than or equal to the thickness of the circuit board. The image acquisition module further comprises a lens assembly, the lens assembly comprising a lens mounting member provided on the circuit board and a lens module mounted on the lens mounting member, and the image detection chip has an image detection area on its upper surface corresponding to the lens module. The image acquisition module further comprises a filtering element, the filtering element being supported by a plurality of supports or surrounding support members, installed above the image detection chip, and surrounded by a plurality of metal wires. The portable electronic device according to claim 6.

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