Laminate for detection plates

Abstract

To provide a laminate for detection plates with which, when detecting dielectric particles by a phase difference observation method, it is possible to improve the accuracy of detecting dielectric particles.SOLUTION: A laminate 1 for detection plates is used in a detection plate 20 for detecting dielectric particles by a phase difference observation method. The laminate 1 for detection plates comprises a substrate 3 and a conductive layer 5 in order heading toward one side in the thickness direction. The laminate 1 for detection plates includes an air interface 10 on the most other side in the thickness direction. The air interface 10 is located 130 μm or more apart, from the other face in the thickness direction of the conductive layer 5 toward the other side in the thickness direction.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a laminate for a detection plate, and more particularly to a laminate for a detection plate used for a detection plate for detecting dielectric particles by a phase difference observation method.

Background Art

[0002] Conventionally, in the food manufacturing process, a method for detecting microorganisms is known from the viewpoint of hygiene management.

[0003] As an apparatus used in such a method, for example, an inspection system provided with an inspection chip has been proposed (see, for example, Patent Document 1).

[0004] According to this inspection system, dielectric particles (for example, microorganisms, microplastics) in an inspection liquid can be inspected by a phase difference observation method.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] The inspection chip of Patent Document 1 includes a transparent film substrate and an electrode in this order toward one side in the thickness direction. On the other hand, on the other side in the thickness direction of the transparent film substrate in the inspection chip, scratches may occur in processes such as during the manufacture and storage of the inspection chip.

[0007] In such a case, when detecting dielectric particles by a phase difference observation method using this inspection chip, noise derived from scratches is detected together with the dielectric particles. Then, there is a problem that the detection accuracy of the dielectric particles is reduced.

[0008] Furthermore, in the manufacturing of inspection chips, from the viewpoint of improving production efficiency, it is being considered to form surface irregularities on the other side in the thickness direction of the transparent film substrate in order to impart antiblocking properties. As methods for forming surface irregularities, a method of forming irregularities on the transparent film substrate or the curable resin provided on its surface using a nanoimprint method, and a method of providing a curable resin layer containing antiblocking particles are being considered.

[0009] However, after the inspection chip is manufactured, the surface irregularities described above remain on the chip. In such cases, when using this inspection chip to detect dielectric particles using the phase difference observation method, noise originating from the surface irregularities is detected along with the dielectric particles. This results in a problem where the detection accuracy of dielectric particles decreases.

[0010] The present invention provides a laminate for a detection plate that can improve the detection accuracy of dielectric particles when detecting dielectric particles by phase difference observation. [Means for solving the problem]

[0011] The present invention [1] is a detection plate laminate used in a detection plate for detecting dielectric particles by phase difference observation, comprising a substrate and a conductive layer in order toward one side in the thickness direction, wherein the detection plate laminate has an air interface on the far other side in the thickness direction, and the air interface is located at a distance of 130 μm or more toward the other side in the thickness direction from the other surface of the conductive layer in the thickness direction.

[0012] The present invention [2] includes the laminate for detection plate described in [1] above, wherein the air interface has an uneven portion.

[0013] The present invention [3] comprises a cured resin layer on the other side of the substrate in the thickness direction, The laminate for detection plates described in [1] above includes the other surface in the thickness direction of the cured resin layer having an uneven portion, and the air interface being the other surface in the thickness direction of the cured resin layer.

[0014] The present invention [4] provides that the cured resin layer comprises antiblocking particles, The uneven portion includes the laminate for the detection plate described in [3] above, which is caused by the antiblocking particles.

[0015] The present invention [5] includes a laminate for a detection plate as described in [1] above, wherein a cured resin layer and an embedded layer are provided sequentially toward the other side in the thickness direction of the substrate, the other side in the thickness direction of the cured resin layer has an uneven portion, the embedded layer embeds the uneven portion on one side in the thickness direction, and the air interface is the other side in the thickness direction of the embedded layer.

[0016] The present invention [6] comprises a laminate for a detection plate as described in [5] above, wherein the cured resin layer contains antiblocking particles, and the uneven portion is due to the antiblocking particles.

[0017] The present invention [7] includes the detection plate laminate described in [1] above, wherein the other surface of the substrate in the thickness direction has an uneven portion, and the air interface is the other surface of the substrate in the thickness direction.

[0018] The present invention [8] includes a laminate for a detection plate as described in [1] above, wherein the substrate has an embedded layer on the other side in the thickness direction, the other surface of the substrate in the thickness direction has an uneven portion, the embedded layer embeds the uneven portion on one surface in the thickness direction, and the air interface is the other surface of the embedded layer in the thickness direction.

[0019] The present invention [9] provides that at least the substrate and the conductive layer constitute a transport laminate, The laminate for the transporter includes the detection plate laminate described in any one of the above [1] to [8], wherein the thickness of the transporter laminate is 300 μm or less.

Advantages of the Invention

[0020] In the laminate for a detection plate of the present invention, the air interface is located 130 μm or more away from the other surface in the thickness direction of the conductive layer, toward the other side in the thickness direction. Therefore, when detecting dielectric particles by the phase difference observation method, it is possible to suppress the detection of noise derived from the air interface and improve the detection accuracy of the dielectric particles.

Brief Description of the Drawings

[0021] [Figure 1] FIG. 1 shows a cross-sectional view of the first embodiment of the laminate for a detection plate of the present invention. [Figure 2] FIGS. 2A to 2D show a method for manufacturing the laminate for a detection plate of the first embodiment. FIG. 2A shows a base material preparation step of preparing a base material. FIG. 2B shows a first cured resin layer arrangement step of arranging a first cured resin layer on the other surface in the thickness direction of the base material. FIG. 2C shows a second cured resin layer arrangement step of arranging a second cured resin layer on one surface in the thickness direction of the base material. FIG. 2D shows a conductive layer arrangement step of arranging a conductive layer on one surface in the thickness direction of the second cured resin layer. [Figure 3] FIG. 3 shows a cross-sectional view of the second embodiment of the laminate for a detection plate of the present invention. [Figure 4] FIGS. 4A to 4E show a method for manufacturing the laminate for a detection plate of the second embodiment. FIG. 4A shows a base material preparation step of preparing a base material. FIG. 4B shows a first cured resin layer arrangement step of arranging a first cured resin layer on the other surface in the thickness direction of the base material. FIG. 4C shows a second cured resin layer arrangement step of arranging a second cured resin layer on one surface in the thickness direction of the base material. FIG. 4D shows a conductive layer arrangement step of arranging a conductive layer on one surface in the thickness direction of the second cured resin layer. FIG. 4E shows an embedded layer arrangement step of arranging an embedded layer on the other surface in the thickness direction of the first cured resin layer. [Figure 5] FIG. 5 shows a cross-sectional view of the third embodiment of the laminate for a detection plate of the present invention. [Figure 6]Figures 6A to 6C show a method for manufacturing a laminate for a detection plate according to the third embodiment. Figure 6A shows a substrate preparation step for preparing the substrate. Figure 6B shows a second cured resin layer placement step for placing a second cured resin layer on one side in the thickness direction of the substrate. Figure 6C shows a conductive layer placement step for placing a conductive layer on one side in the thickness direction of the second cured resin layer. [Figure 7] Figure 7 shows a cross-sectional view of one embodiment of a detection plate obtained using a detection plate laminate. [Figure 8] Figures 8A and 8B show schematic diagrams of a method for detecting dielectric particles using a detection plate and phase difference observation. Figure 8A shows a schematic diagram of the method when the air interface is located less than 130 μm away from the other side in the thickness direction of the conductive layer. Figure 8B shows a schematic diagram of the method when the air interface is located 130 μm or more away from the other side in the thickness direction of the conductive layer. [Figure 9] Figure 9 shows a cross-sectional view of a substrate equipped with an easy-adhesion layer. [Figure 10] Figure 10 shows a laminate for detection plates in which the support layer in the buried layer is a glass stage. [Figure 11] Figure 11 shows the results of the inspection accuracy test for Example 1. [Figure 12] Figure 12 shows the results of the inspection accuracy test for Example 2. [Figure 13] Figure 13 shows the results of the inspection accuracy test for Example 3. [Figure 14] Figure 14 shows the results of the inspection accuracy test for Example 4. [Figure 15] Figure 15 shows the results of the inspection accuracy test for Example 5. [Figure 16] Figure 16 shows the results of the inspection accuracy test for Comparative Example 1. [Modes for carrying out the invention]

[0022] The detection plate laminate of the present invention comprises a substrate and a conductive layer in order toward one side in the thickness direction. The detection plate laminate also has an air interface on the far other side in the thickness direction. Furthermore, the air interface is located at a distance of 130 μm or more toward the other side in the thickness direction from the other side in the thickness direction of the conductive layer.

[0023] In the detection plate laminate of the present invention, the other surface in the thickness direction of the layer located furthest to the other side in the thickness direction constitutes an air interface. More specifically, the air interface is the interface in which the other surface in the thickness direction of the layer located furthest to the other side in the thickness direction of the detection plate laminate comes into contact with air in the atmosphere. Below, the detection plate laminates will be classified and described in detail according to the type of air interface. Specifically, the first embodiment in which the air interface is the other surface in the thickness direction of the cured resin layer, the second embodiment in which the air interface is the other surface in the thickness direction of the embedded layer (described later), and the third embodiment in which the air interface is the other surface in the thickness direction of the substrate will be described in detail.

[0024] 1. First Embodiment <Laminate for detection plate> The first embodiment will be described with reference to Figure 1.

[0025] In Figure 1, the vertical direction of the paper is the vertical direction (thickness direction). The upper side of the paper is the upper side (one side in the thickness direction). The lower side of the paper is the lower side (the other side in the thickness direction). The horizontal direction and depth direction of the paper are plane directions perpendicular to the vertical direction. Specifically, these correspond to the directional arrows in each figure.

[0026] The detection plate laminate 1 has a film shape (including a sheet shape) with a predetermined thickness. The detection plate laminate 1 extends in a planar direction perpendicular to the thickness direction.

[0027] As shown in Figure 1, the detection plate laminate 1 comprises a first cured resin layer 2 as a cured resin layer, a base material 3, a second cured resin layer 4, and a conductive layer 5, arranged in order toward one side in the thickness direction.

[0028] Specifically, the detection plate laminate 1 comprises a first cured resin layer 2, a base material 3 placed on the upper surface (one side in the thickness direction) of the first cured resin layer 2, a second cured resin layer 4 placed on the upper surface (one side in the thickness direction) of the base material 3, and a conductive layer 5 placed on the upper surface (one side in the thickness direction) of the second cured resin layer 4.

[0029] Furthermore, the detection plate laminate 1 has an air interface 10 on the far other side in the thickness direction. As will be described in more detail later, in the detection plate laminate 1, the air interface 10 is the other side in the thickness direction of the first cured resin layer 2.

[0030] The thickness of the detection plate laminate 1 is, for example, 130 μm or more, preferably 160 μm or more, preferably 180 μm or more, and also, for example, 2000 μm or less.

[0031] Furthermore, as will be explained in more detail later, a detection plate (described later) can be manufactured by patterning the conductive layer 5 in the detection plate laminate 1. In other words, the detection plate laminate 1 is distributed independently as a raw material for the detection plate (described later).

[0032] <First cured resin layer> The first cured resin layer 2 is an anti-blocking layer that improves transportability in the manufacturing of the detection plate laminate 1.

[0033] The first cured resin layer 2 has a film shape.

[0034] Furthermore, the first cured resin layer 2 is the bottommost layer of the detection plate laminate 1. In other words, in the detection plate laminate 1, the first cured resin layer 2 is located on the far other side in the thickness direction. Therefore, the air interface 10 is the other side in the thickness direction of the first cured resin layer 2.

[0035] Furthermore, the other surface in the thickness direction of the first cured resin layer 2 has an uneven portion 11 caused by antiblocking particles (described later). Specifically, the uneven portion 11 is formed when antiblocking particles (described later) in the first cured resin layer 2 protrude from the other surface in the thickness direction of the first cured resin layer 2. Therefore, the air interface 10 has the uneven portion 11.

[0036] The uneven portion 11 is inevitably detectable by the phase difference observation method. Specifically, if the air interface 10 does not have the uneven portion 11, the air interface 10 is flat, and even if there is a refractive index difference between the first cured resin layer 2 and the air, no phase difference due to that refractive index difference occurs, and no noise is observed. However, if the air interface 10 has the uneven portion 11, a phase difference occurs due to the refractive index difference between the first cured resin layer 2 (uneven portion 11) and the air, the uneven portion 11 becomes noise, and is inevitably detectable by the phase difference observation method. Specifically, such an uneven portion 11 has a refractive index difference of, for example, 0.3 or more with respect to air, and has a protrusion height of, for example, 10 nm or more, preferably 40 nm or more, at the air interface 10 (air interface 10 that does not include the uneven portion 11).

[0037] The height of the protrusion can be measured by cross-sectional SEM observation using a focused ion beam scanning electron microscope (the same applies hereafter).

[0038] The first cured resin layer 2 is formed, for example, from the first cured resin composition.

[0039] The first cured resin composition contains resin (uncured) and antiblocking particles. In other words, the first cured resin layer 2 contains resin (cured) and antiblocking particles. In the following description, the cured resin composition is described as containing resin (uncured), and the cured resin layer is described as containing resin (cured).

[0040] Examples of resins include thermoplastic resins and curable resins. Examples of thermoplastic resins include polyolefin resins.

[0041] Examples of curable resins include active energy ray curable resins that harden upon irradiation with active energy rays (e.g., ultraviolet rays and electron beams), and thermosetting resins that harden upon heating. Preferably, active energy ray curable resins are used as curable resins.

[0042] Examples of active energy ray-curable resins include acrylic resins (preferably urethane acrylates), epoxy resins, urethane resins, melamine resins, alkyd resins, siloxane polymers, and organic silane condensates. Acrylic resins are preferred as the active energy ray-curable resin.

[0043] Furthermore, the resin may contain, for example, a reactive diluent as described in Japanese Patent Publication No. 2008-88309.

[0044] The resins can be used individually or in combination of two or more types.

[0045] Examples of antiblocking particles include inorganic oxide fine particles and organic fine particles. Examples of inorganic oxide fine particles include silica, alumina, titania, zirconia, calcium oxide, tin oxide, indium oxide, cadmium oxide, and antimony oxide. Examples of organic fine particles include acrylic resin particles, silicone, polystyrene, polyurethane, acrylic-styrene copolymer, benzoguanamine, melamine, and polycarbonate. Preferably, inorganic oxide fine particles are used as antiblocking particles. More preferably, silica is used as an antiblocking particle.

[0046] From the viewpoint of improving transportability, the average particle diameter of the antiblocking particles is, for example, 1 nm or more, preferably 10 nm or more, and for example, 5000 nm or less, preferably 100 nm or less, and more preferably 50 nm or less.

[0047] The average particle size of antiblocking particles is the average particle size (D50) of the particle size distribution based on volume, and can be measured, for example, by optical diffraction and scattering in a solution in which particles are dispersed in water (the same applies below).

[0048] The proportion of antiblocking particles is, for example, 0.01 parts by mass or more, preferably 1 part by mass or more, more preferably 3 parts by mass or more, and also, for example, 200 parts by mass or less, preferably 50 parts by mass or less, more preferably 20 parts by mass or less, per 100 parts by mass of resin.

[0049] Antiblocking particles can be used alone or in combination of two or more types.

[0050] Furthermore, the first curing resin composition may contain additives (e.g., thixotropy imparting agents (e.g., organic clay), photopolymerization initiators, fillers, and leveling agents) in appropriate proportions as needed. The first curing resin composition may also be diluted with known solvents.

[0051] As will be explained in more detail later, the first cured resin layer 2 is formed by applying a varnish of the first cured resin composition to the other surface of the substrate 3 in the thickness direction and curing it.

[0052] The thickness of the first cured resin layer 2 is, for example, 0.1 μm or more, preferably 0.5 μm or more, and for example, 5 μm or less, preferably 3 μm or less.

[0053] <Base material> The base material 3 is a base material for ensuring the mechanical strength of the detection plate laminate 1.

[0054] The base material 3 has a film shape. The base material 3 is placed over the entire upper surface of the first cured resin layer 2 so as to be in contact with the upper surface of the first cured resin layer 2.

[0055] Examples of the base material 3 include polymer films.

[0056] Examples of polymer film materials include polyester resin, (meth)acrylic resin, olefin resin, polycarbonate resin, polyethersulfone resin, polyarylate resin, melamine resin, polyamide resin, polyimide resin, cellulose resin, and polystyrene resin. Examples of polyester resins include polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate. Examples of (meth)acrylic resins include polymethyl methacrylate. Examples of olefin resins include polyethylene, polypropylene, and cycloolefin polymers. Examples of cellulose resins include triacetylcellulose.

[0057] Preferably, polyester resin is used as the material for the polymer film. More preferably, polyethylene terephthalate is used as the material for the polymer film.

[0058] The thickness of the base material 3 is, for example, 130 μm or more, preferably 150 μm or more, and also, for example, 2000 μm or less, preferably 1000 μm or less, and more preferably 300 μm or less.

[0059] The thickness of base material 3 can be measured using a dial gauge (PEACOCK, "DG-205") (the same applies hereafter).

[0060] Furthermore, the substrate 3 is preferably transparent. Specifically, the total light transmittance (JIS K 7375-2008) of the substrate 3 is, for example, 80% or more, preferably 85% or more.

[0061] <Second cured resin layer> The second cured resin layer 4 is, for example, a hard coat layer.

[0062] The second cured resin layer 4 has a film shape. The second cured resin layer 4 is arranged over the entire upper surface of the substrate 3 so as to be in contact with the upper surface of the substrate 3.

[0063] The second cured resin layer 4 is formed, for example, from the second cured resin composition.

[0064] The second cured resin composition comprises a resin and, if necessary, particles. In other words, the second cured resin layer 4 comprises a resin and, if necessary, particles.

[0065] Examples of resins include those listed in the first cured resin composition. Preferably, the resin is an active energy ray curable resin. More preferably, the resin is an acrylic resin. The resins can be used individually or in combination of two or more.

[0066] Examples of particles include those similar to the antiblocking particles mentioned in the first cured resin composition. Preferably, inorganic oxide fine particles are used. More preferably, zirconia is used as the particle.

[0067] The average particle diameter of the particles is, for example, 1 nm or more, preferably 20 nm or more, and for example, 500 nm or less, preferably 100 nm or less, and more preferably 60 nm or less.

[0068] The particle blending ratio is, for example, 1 part by mass or more, preferably 5 parts by mass or more, more preferably 10 parts by mass or more, and also, for example, 500 parts by mass or less, preferably 400 parts by mass or less, more preferably 300 parts by mass or less, per 100 parts by mass of resin.

[0069] The particles can be used individually or in combination of two or more types.

[0070] Furthermore, the second curing resin composition may contain additives (for example, the additives listed for the first curing resin composition) in appropriate proportions as needed. The second curing resin composition may also be diluted with a known solvent.

[0071] As will be explained in more detail later, the second cured resin layer 4 is formed by applying a varnish of the second cured resin composition to one side in the thickness direction of the substrate 3 and curing it.

[0072] The thickness of the second cured resin layer 4 is, for example, 0.1 μm or more, preferably 0.5 μm or more, and for example, 5 μm or less, preferably 3 μm or less.

[0073] <Conductive layer> The conductive layer 5, as will be described in more detail later, is a layer formed in a desired pattern to form electrodes.

[0074] The conductive layer 5 has a film shape. The conductive layer 5 is positioned over the entire upper surface of the second cured resin layer 4 so as to be in contact with the upper surface of the second cured resin layer 4. The conductive layer 5 is the uppermost layer of the detection plate laminate 1.

[0075] Examples of materials for the conductive layer 5 include metals, metal oxides, and conductive resin compositions. Examples of metals include copper, nickel, chromium, iron, titanium, or alloys thereof. Examples of metal oxides include indium-containing oxides. Examples of conductive resin compositions include metal nanowire-containing resin compositions. Preferably, metals are used as the material for the conductive layer 5. More preferably, copper is used as the material for the conductive layer 5.

[0076] The conductive layer 5 is conductive. Specifically, the resistivity of the conductive layer 5 is, for example, 1 × 10⁻⁶. -3 Less than or equal to Ω·cm, and for example, 1 × 10 -8 It is greater than or equal to Ω·cm.

[0077] The resistivity can be calculated by multiplying the surface resistance value, measured using the four-terminal method in accordance with JIS K7194, by the thickness of the conductive layer 5.

[0078] As will be explained in more detail later, the conductive layer 5 is formed, for example, by a sputtering method.

[0079] The thickness of the conductive layer 5 is, for example, 10 nm or more, preferably 50 nm or more, and also, for example, 500 nm or less, preferably 300 nm or less.

[0080] <Air interface> As described above, the detection plate laminate 1 has an air interface 10 on the far other side in the thickness direction. In the detection plate laminate 1, the air interface 10 is the other side in the thickness direction of the first cured resin layer 2. The air interface 10 also has an uneven portion 11.

[0081] Furthermore, the air interface 10 is located at a distance of 130 μm or more from the other surface in the thickness direction of the conductive layer 5, toward the other side in the thickness direction. In other words, the distance from the air interface 10 to the other surface in the thickness direction of the conductive layer 5 is 130 μm or more.

[0082] In other words, the distance from the air interface 10 to the other surface in the thickness direction of the conductive layer 5 is the total thickness of the layers other than the conductive layer 5 in the detection plate laminate 1 (specifically, the first cured resin layer 2, the substrate 3, and the second cured resin layer 4).

[0083] The distance from the air interface 10 to the other surface in the thickness direction of the conductive layer 5 is 130 μm or more, preferably 140 μm or more, more preferably 160 μm or more, even more preferably 200 μm or more, and for example, 2000 μm or less.

[0084] If the air interface 10 is located at a distance of 130 μm or more from another surface in the thickness direction of the conductive layer 5 toward the other side in the thickness direction (i.e., if the above distance is 130 μm or more), then when detecting dielectric particles by the phase difference observation method, the detection of noise originating from the air interface 10 (specifically, black haze originating from uneven areas 11, black haze originating from defects such as foreign matter contamination, and black haze originating from scratches) can be suppressed. As a result, the detection accuracy of dielectric particles can be improved.

[0085] On the other hand, if the air interface 10 is located less than 130 μm away from the other side in the thickness direction of the conductive layer 5 (i.e., the above distance is less than 130 μm), and the air interface 10 has an uneven portion 11, then the detection of the above noise cannot be suppressed when detecting dielectric particles by the phase difference observation method. In that case, the detection accuracy of dielectric particles will decrease.

[0086] Furthermore, the above distance can be adjusted to a predetermined value or higher, for example, by adjusting the thickness of the layers other than the conductive layer 5 in the detection plate laminate 1. Preferably, from the viewpoint of simplicity, the above distance can be adjusted to a predetermined value or higher by increasing the thickness of the base material 3.

[0087] <Method for manufacturing a laminate for detection plates> The manufacturing method for the detection plate laminate 1 comprises a substrate preparation step of preparing a substrate 3, a first cured resin layer placement step of placing a first cured resin layer 2 on the other side of the substrate 3 in the thickness direction, a second cured resin layer placement step of placing a second cured resin layer 4 on one side of the substrate 3 in the thickness direction, and a conductive layer placement step of placing a conductive layer 5 on one side of the second cured resin layer 4 in the thickness direction. In this manufacturing method, each layer is placed sequentially, for example, using a roll-to-roll method.

[0088] [Base material preparation process] In the substrate preparation process, the substrate 3 is prepared as shown in Figure 2A.

[0089] [First cured resin layer placement process] In the first cured resin layer placement step, as shown in Figure 2B, the first cured resin layer 2 is placed on the other side of the substrate 3 in the thickness direction.

[0090] To place the first cured resin layer 2 on the other surface of the substrate 3 in the thickness direction, a varnish of the first cured resin composition is applied to the other surface of the substrate 3 in the thickness direction, and after drying, the first cured resin composition is cured by ultraviolet irradiation and / or heating. This places the first cured resin layer 2 on the other surface of the substrate 3 in the thickness direction. In particular, if the first cured resin layer 2 is an anti-blocking layer, the transportability in the roll-to-roll method is improved in the second cured resin layer placement step and the conductive layer placement step.

[0091] [Second cured resin layer placement process] In the second cured resin layer placement step, as shown in Figure 2C, the second cured resin layer 4 is placed on one side of the substrate 3 in the thickness direction.

[0092] To place the second cured resin layer 4 on one side of the substrate 3 in the thickness direction, a varnish of the second cured resin composition is applied to one side of the substrate 3 in the thickness direction, and after drying, the second cured resin composition is cured by ultraviolet irradiation and / or heating. This places the second cured resin layer 4 on one side of the substrate 3 in the thickness direction.

[0093] [Conductive layer placement process] In the conductive layer placement process, as shown in Figure 2D, the conductive layer 5 is placed on one side in the thickness direction of the second cured resin layer 4.

[0094] Methods for arranging the conductive layer 5 on one side in the thickness direction of the second cured resin layer 4 include, for example, vacuum deposition, sputtering, and CVD. Of the above methods, sputtering is preferred.

[0095] In the sputtering method, a target (material for the conductive layer 5) and a second curing resin layer 4 are placed facing each other in a vacuum chamber of a sputtering deposition apparatus. Next, sputtering gas is supplied and a voltage is applied from a power supply to accelerate gas ions, which are then irradiated onto the target, ejecting the target material from the target surface. This target material is then deposited on the surface (one side in the thickness direction) of the second curing resin layer 4 to form the conductive layer 5.

[0096] Examples of sputtering gases include noble gases (e.g., argon gas). Additionally, a reactive gas (e.g., oxygen gas) can be used in combination with a noble gas as the sputtering gas.

[0097] The power supply may be, for example, a DC power supply, an AC power supply, an MF power supply, or an RF power supply. A combination of these may also be used.

[0098] The discharge output is, for example, 1 kW or more, and for example, 100 kW or less, preferably 10 kW or less.

[0099] The film formation temperature (the temperature of the substrate 3 on which the second cured resin layer 4 is placed) is, for example, 30°C or higher, and for example, 60°C or lower.

[0100] This arranges the conductive layer 5 on one side in the thickness direction of the second cured resin layer 4.

[0101] Based on the above, the laminated body 1 for the detection plate is manufactured.

[0102] 2. Second Embodiment <Laminate for detection plate> A second embodiment will be described with reference to Figure 3.

[0103] In the second embodiment, the same reference numerals are used for components and processes as in the first embodiment, and their detailed descriptions are omitted. Furthermore, the second embodiment can achieve the same effects and advantages as the first embodiment, unless otherwise specified. Moreover, the first embodiment and its modified forms can be combined as appropriate.

[0104] As shown in Figure 3, the detection plate laminate 1 comprises, in order toward one side in the thickness direction, an embedded layer 6, a first cured resin layer 2 as a cured resin layer, a base material 3, a second cured resin layer 4, and a conductive layer 5.

[0105] Specifically, the detection plate laminate 1 comprises an embedded layer 6, a first cured resin layer 2 disposed on the upper surface (one side in the thickness direction) of the embedded layer 6, a base material 3 disposed on the upper surface (one side in the thickness direction) of the first cured resin layer 2, a second cured resin layer 4 disposed on the upper surface (one side in the thickness direction) of the base material 3, and a conductive layer 5 disposed on the upper surface (one side in the thickness direction) of the second cured resin layer 4.

[0106] Furthermore, the detection plate laminate 1 has an air interface 10 on the far other side in the thickness direction. As will be described in more detail later, in the detection plate laminate 1, the air interface 10 is the other side in the thickness direction of the embedded layer 6.

[0107] The thickness of the detection plate laminate 1 is the same as the thickness of the detection plate laminate 1 described in the first embodiment above.

[0108] <Buried layer> The embedded layer 6 is a layer for embedding the uneven portions 11 (described later) on other surfaces in the thickness direction of the first hardened resin layer 2.

[0109] Furthermore, although the buried layer 6 is in the form of a sheet in Figure 3, the shape of the buried layer 6 (specifically, the supporting layer 7 (described later)) is not particularly limited.

[0110] Furthermore, the buried layer 6 is the bottommost layer of the detection plate laminate 1. In other words, in the detection plate laminate 1, the buried layer 6 is located on the far other side in the thickness direction. Therefore, the air interface 10 is the other side in the thickness direction of the buried layer 6.

[0111] The buried layer 6 comprises a support layer 7 and an adhesive layer 8, arranged sequentially on one side in the thickness direction.

[0112] The support layer 7 is a layer that ensures the mechanical strength of the detection plate laminate 1.

[0113] Examples of the support layer 7 include a transport support layer and a non-transport support layer.

[0114] The transport support layer is a transportable support layer in a roll-to-roll system, and examples include the base material 3 and the cured resin layer mentioned in the first embodiment above.

[0115] Preferably, the base material 3 mentioned in the first embodiment above is a polyester resin and an olefin resin. More preferably, the base material 3 mentioned in the first embodiment above is a base material made of polyethylene terephthalate and a base material made of a cycloolefin polymer (cycloolefin polymer film).

[0116] Examples of cured resin layers include an antiblocking layer (for example, an antiblocking layer formed from the first cured resin composition) and a hard coat layer (for example, a hard coat layer formed from the second cured resin composition). Preferably, the cured resin layer is an antiblocking layer.

[0117] A non-transportable support layer is a support layer that cannot be transported in a roll-to-roll system, and an example of this is glass.

[0118] The support layer 7 can be used alone or in combination of two or more types. Preferred support layers 7 include the use of a polyester film or cycloolefin polymer film alone, the use of a polyester film or cycloolefin polymer film in combination with an antiblocking layer (specifically, a support layer 7 having an antiblocking layer and a polyester film or cycloolefin polymer film sequentially on one side in the thickness direction), and the use of glass alone.

[0119] The thickness of the support layer 7 is, for example, 120 μm or more, preferably 160 μm or more, and for example, 2000 μm or less.

[0120] The adhesive layer 8 is a layer that adheres the support layer 7 to the first cured resin layer 2 and also fills in the uneven portions 11 (described later) on the other side in the thickness direction of the first cured resin layer 2. In other words, the filling layer 6 fills in the uneven portions 11 on one side in the thickness direction.

[0121] Furthermore, the adhesive layer 8 has a film shape. The adhesive layer 8 is arranged across the entire upper surface of the support layer 7 so as to be in contact with the upper surface of the support layer 7.

[0122] The adhesive layer 8 is formed from a known adhesive.

[0123] The thickness of the adhesive layer 8 is, for example, 10 μm or more, and for example, 100 μm or less, preferably 50 μm or less.

[0124] <First cured resin layer> The first cured resin layer 2 is an anti-blocking layer that improves transportability in the manufacturing of the detection plate laminate 1.

[0125] The first cured resin layer 2 has a film shape. The first cured resin layer 2 is positioned over the entire upper surface of the embedded layer 6 so as to be in contact with the upper surface of the embedded layer 6.

[0126] Furthermore, other surfaces in the thickness direction of the first cured resin layer 2 have uneven portions 11 caused by antiblocking particles. On the other hand, as described above, the uneven portions 11 are embedded by the embedded layer 6 and therefore cannot be detected by the phase difference observation method. Specifically, because the difference between the refractive index of the first cured resin layer 2 (uneven portions 11) and the refractive index of the embedded layer 6 (refractive index of the first cured resin layer 2 (uneven portions 11) - refractive index of the embedded layer 6) is small (specifically, 0.3 or less), no phase difference caused by the uneven portions 11 occurs, and the uneven portions 11 are difficult to detect by the phase difference observation method.

[0127] The first cured resin layer 2 is formed, for example, from the first cured resin composition mentioned in the first embodiment (specifically, the first cured resin composition comprising a resin, antiblocking particles, and additives which are added as needed).

[0128] The thickness of the first cured resin layer 2 is the same as the thickness of the first cured resin layer 2 described in the first embodiment above.

[0129] <Base material> The base material 3 is a base material for ensuring the mechanical strength of the detection plate laminate 1.

[0130] The base material 3 has a film shape. The base material 3 is placed over the entire upper surface of the first cured resin layer 2 so as to be in contact with the upper surface of the first cured resin layer 2.

[0131] Examples of the base material 3 include the base material mentioned in the first embodiment above.

[0132] The thickness of the base material 3 can be made thinner than the thickness of the base material 3 described in the first embodiment. Specifically, in the second embodiment, since the detection plate laminate 1 includes an embedded layer 6, the distance from the air interface 10 to the other surface in the thickness direction of the conductive layer 5 can be increased by the thickness of the embedded layer 6. Therefore, the thickness of the base material 3 can be made thinner compared to the first embodiment, which does not include an embedded layer 6.

[0133] The thickness of the base material 3 is, for example, 10 μm or more, preferably 100 μm or more, and for example, 2000 μm or less, preferably 1000 μm or less, and more preferably 300 μm or less.

[0134] Furthermore, the substrate 3 is preferably transparent. The total light transmittance of the substrate 3 (JIS K 7375-2008) is the same as the total light transmittance of the substrate 3 described in the first embodiment above.

[0135] <Second cured resin layer> The second cured resin layer 4 is, for example, a hard coat layer.

[0136] The second cured resin layer 4 has a film shape. The second cured resin layer 4 is arranged over the entire upper surface of the substrate 3 so as to be in contact with the upper surface of the substrate 3.

[0137] The second cured resin layer 4 is formed, for example, from the second cured resin composition mentioned in the first embodiment (specifically, a second cured resin composition comprising a resin, particles, and additives as needed).

[0138] The thickness of the second cured resin layer 4 is the same as the thickness of the second cured resin layer 4 described in the first embodiment above.

[0139] <Conductive layer> The conductive layer 5, as will be described in more detail later, is a layer formed in a desired pattern to form electrodes.

[0140] The conductive layer 5 has a film shape. The conductive layer 5 is positioned over the entire upper surface of the second cured resin layer 4 so as to be in contact with the upper surface of the second cured resin layer 4. The conductive layer 5 is the uppermost layer of the detection plate laminate 1.

[0141] Examples of materials for the conductive layer 5 include the conductive layer 5 materials mentioned in the first embodiment above.

[0142] The conductive layer 5 is conductive. More specifically, the resistivity of the conductive layer 5 is the same as that of the conductive layer 5 described in the first embodiment above.

[0143] The thickness of the conductive layer 5 is the same as the thickness of the conductive layer 5 described in the first embodiment above.

[0144] <Air interface> As described above, the detection plate laminate 1 has an air interface 10 on the far other side in the thickness direction. In the detection plate laminate 1, the air interface 10 is on the other side in the thickness direction of the embedded layer 6.

[0145] Furthermore, the air interface 10 is located at a distance of 130 μm or more from the other surface in the thickness direction of the conductive layer 5, toward the other side in the thickness direction. In other words, the distance from the air interface 10 to the other surface in the thickness direction of the conductive layer 5 is 130 μm or more.

[0146] In other words, the distance from the air interface 10 to the other surface in the thickness direction of the conductive layer 5 is the total thickness of the layers other than the conductive layer 5 in the detection plate laminate 1 (specifically, the embedded layer 6, the first cured resin layer 2, the base material 3, and the second cured resin layer 4).

[0147] The distance from the air interface 10 to the other surface in the thickness direction of the conductive layer 5 is the same as the distance from the air interface 10 to the other surface in the thickness direction of the conductive layer 5 as described in the first embodiment above.

[0148] If the air interface 10 is located at a distance of 130 μm or more from another surface in the thickness direction of the conductive layer 5 toward the other side in the thickness direction (i.e., if the above distance is 130 μm or more), then when detecting dielectric particles by phase difference observation, the detection of noise originating from the air interface 10 (for example, black haze originating from scratches on other surfaces in the thickness direction of the embedded layer 6, black haze originating from defects such as foreign matter contamination, and black haze originating from scratches) can be suppressed. As a result, the detection accuracy of dielectric particles can be improved.

[0149] On the other hand, if the air interface 10 is located less than 130 μm away from the other side in the thickness direction of the conductive layer 5 (the above distance is less than 130 μm), and the air interface 10 has an uneven portion 11 (an uneven portion 11 resulting from a scratch on the other side in the thickness direction of the embedded layer 6), then the detection of the above noise cannot be suppressed when detecting dielectric particles by the phase difference observation method. In that case, the detection accuracy of dielectric particles will decrease.

[0150] Furthermore, the above distance can be adjusted to a predetermined value or higher by, for example, adjusting the thickness of the layers other than the conductive layer 5 in the detection plate laminate 1. Preferably, from the viewpoint of simplicity, the above distance can be adjusted to a predetermined value or higher by increasing the thickness of the embedded layer 6 and / or the base material 3.

[0151] Furthermore, as described above, the other surface in the thickness direction of the first cured resin layer 2 has an uneven portion 11 caused by antiblocking particles. However, since the uneven portion 11 is embedded by the embedded layer 6, it cannot be detected by the phase difference observation method. Therefore, the detection of noise originating from the uneven portion 11 can be suppressed. As a result, the detection accuracy of dielectric particles can be improved.

[0152] <Method for manufacturing a laminate for detection plates> The manufacturing method for the detection plate laminate 1 comprises a base material preparation step of preparing a base material 3, a first cured resin layer placement step of placing a first cured resin layer 2 on the other side in the thickness direction of the base material 3, a second cured resin layer placement step of placing a second cured resin layer 4 on one side in the thickness direction of the base material 3, a conductive layer placement step of placing a conductive layer 5 on one side in the thickness direction of the second cured resin layer 4, and a buried layer placement step of placing a buried layer 6 on the other side in the thickness direction of the first cured resin layer 2.

[0153] Furthermore, in this manufacturing method, especially when the support layer 7 in the buried layer 6 is a transport support layer, each layer is arranged sequentially, for example, using a roll-to-roll method. The following description will detail the case in which each layer is arranged sequentially using a roll-to-roll method.

[0154] [Base material preparation process] In the substrate preparation process, the substrate 3 is prepared as shown in Figure 4A.

[0155] [First cured resin layer placement process] In the first cured resin layer placement step, as shown in Figure 4B, the first cured resin layer 2 is placed on the other side of the substrate 3 in the thickness direction, using the same procedure as the first cured resin layer placement step detailed in the first embodiment described above. In particular, if the first cured resin layer 2 is an antiblocking layer, the transportability in the roll-to-roll method is improved in the second cured resin layer placement step and the conductive layer placement step.

[0156] [Second cured resin layer placement process] In the second cured resin layer placement step, as shown in Figure 4C, the second cured resin layer 4 is placed on one side in the thickness direction of the substrate 3 using the same procedure as the second cured resin layer placement step detailed in the first embodiment described above.

[0157] [Conductive layer placement process] In the conductive layer placement process, as shown in Figure 4D, the conductive layer 5 is placed on one side in the thickness direction of the second cured resin layer 4 using the same procedure as the conductive layer placement process detailed in the first embodiment described above.

[0158] [Buried layer placement process] In the buried layer placement process, as shown in Figure 4E, the buried layer 6 is placed on the other side of the thickness direction of the first cured resin layer 2.

[0159] To place the embedded layer 6 on the other side in the thickness direction of the first cured resin layer 2, for example, the embedded layer 6 is attached to the other side in the thickness direction of the first cured resin layer 2 via an adhesive layer 8.

[0160] Based on the above, the laminated body 1 for the detection plate is manufactured.

[0161] 3. Third Embodiment <Laminate for detection plate> A third embodiment will be described with reference to Figure 5.

[0162] In the third embodiment, the same reference numerals are used for components and processes as in the first embodiment, and their detailed descriptions are omitted. Furthermore, the third embodiment can achieve the same effects and advantages as the first embodiment, unless otherwise specified. In addition, the first embodiment, the second embodiment, and their modified forms can be combined as appropriate.

[0163] As shown in Figure 5, the detection plate laminate 1 comprises a base material 3, a second cured resin layer 4, and a conductive layer 5 in order toward one side in the thickness direction.

[0164] Specifically, the detection plate laminate 1 comprises a base material 3, a second cured resin layer 4 disposed on the upper surface (one side in the thickness direction) of the base material 3, and a conductive layer 5 disposed on the upper surface (one side in the thickness direction) of the second cured resin layer 4.

[0165] Furthermore, the detection plate laminate 1 has an air interface 10 on the far other side in the thickness direction. As will be described in more detail later, in the detection plate laminate 1, the air interface 10 is the other side in the thickness direction of the base material 3.

[0166] The thickness of the detection plate laminate 1 is the same as the thickness of the detection plate laminate 1 described in the first embodiment above.

[0167] <Base material> The base material 3 is a base material for ensuring the mechanical strength of the detection plate laminate 1.

[0168] The base material 3 has a film shape. The base material 3 is the bottom layer of the detection plate laminate 1. In other words, in the detection plate laminate 1, the base material 3 is located on the far other side in the thickness direction. Therefore, the air interface 10 is the other side of the base material 3 in the thickness direction.

[0169] Furthermore, other surfaces of the substrate 3 in the thickness direction have uneven portions 11 that can inevitably be detected by the phase difference observation method. Therefore, the air interface 10 has these uneven portions 11.

[0170] The uneven portion 11 originates, for example, from scratches on other surfaces in the thickness direction of the base material 3. The uneven portion 11 (the air interface 10 excluding the uneven portion 11) has a refractive index difference of, for example, 0.3 or more with respect to air, and the air interface 10 has a protrusion height of, for example, 10 nm or more, preferably 40 nm or more.

[0171] Examples of the base material 3 include the base material mentioned in the first embodiment above.

[0172] The thickness of the base material 3 is, for example, 130 μm or more, preferably 150 μm or more, and also, for example, 2000 μm or less, preferably 1000 μm or less, and more preferably 300 μm or less.

[0173] Furthermore, the substrate 3 is preferably transparent. The total light transmittance of the substrate 3 (JIS K 7375-2008) is the same as the total light transmittance of the substrate 3 described in the first embodiment above.

[0174] <Second cured resin layer> The second cured resin layer 4 is, for example, a hard coat layer.

[0175] The second cured resin layer 4 has a film shape. The second cured resin layer 4 is arranged over the entire upper surface of the substrate 3 so as to be in contact with the upper surface of the substrate 3.

[0176] The second cured resin layer 4 is formed, for example, from the second cured resin composition mentioned in the first embodiment (specifically, a second cured resin composition comprising a resin, particles, and additives as needed).

[0177] The thickness of the second cured resin layer 4 is the same as the thickness of the second cured resin layer 4 described in the first embodiment above.

[0178] <Conductive layer> The conductive layer 5, as will be described in more detail later, is a layer formed in a desired pattern to form electrodes.

[0179] The conductive layer 5 has a film shape. The conductive layer 5 is positioned over the entire upper surface of the second cured resin layer 4 so as to be in contact with the upper surface of the second cured resin layer 4. The conductive layer 5 is the uppermost layer of the detection plate laminate 1.

[0180] Examples of materials for the conductive layer 5 include the conductive layer 5 materials mentioned in the first embodiment above.

[0181] The conductive layer 5 is conductive. More specifically, the resistivity of the conductive layer 5 is the same as that of the conductive layer 5 described in the first embodiment above.

[0182] The thickness of the conductive layer 5 is the same as the thickness of the conductive layer 5 described in the first embodiment above.

[0183] <Air interface> As described above, the detection plate laminate 1 has an air interface 10 on the far other side in the thickness direction. In the detection plate laminate 1, the air interface 10 is the other side in the thickness direction of the base material 3.

[0184] Furthermore, the air interface 10 is located at a distance of 130 μm or more from the other surface in the thickness direction of the conductive layer 5, toward the other side in the thickness direction. In other words, the distance from the air interface 10 to the other surface in the thickness direction of the conductive layer 5 is 130 μm or more.

[0185] In other words, the distance from the air interface 10 to the other surface in the thickness direction of the conductive layer 5 is the total thickness of the layers other than the conductive layer 5 in the detection plate laminate 1 (specifically, the substrate 3 and the second cured resin layer 4).

[0186] The distance from the air interface 10 to the other surface in the thickness direction of the conductive layer 5 is the same as the distance from the air interface 10 to the other surface in the thickness direction of the conductive layer 5 as described in the first embodiment above.

[0187] If the air interface 10 is located at a distance of 130 μm or more from another surface in the thickness direction of the conductive layer 5 toward the other side in the thickness direction (i.e., if the above distance is 130 μm or more), then when detecting dielectric particles by phase difference observation, the detection of noise originating from the air interface 10 (specifically, black haze originating from uneven portions 11, black haze originating from defects such as foreign matter contamination, black haze originating from scratches, and black haze originating from voids caused by the substrate 3) can be suppressed. As a result, the detection accuracy of dielectric particles can be improved.

[0188] On the other hand, if the air interface 10 is located less than 130 μm away from the other side in the thickness direction of the conductive layer 5 (i.e., the above distance is less than 130 μm), and the air interface 10 has an uneven portion 11, then the detection of the above noise cannot be suppressed when detecting dielectric particles by the phase difference observation method. In that case, the detection accuracy of dielectric particles will decrease.

[0189] Furthermore, the above distance can be adjusted to a predetermined value or higher, for example, by adjusting the thickness of the layers other than the conductive layer 5 in the detection plate laminate 1. Preferably, from the viewpoint of simplicity, the above distance can be adjusted to a predetermined value or higher by increasing the thickness of the base material 3.

[0190] <Method for manufacturing a laminate for detection plates> The manufacturing method for the detection plate laminate 1 comprises a base material preparation step of preparing a base material 3, a second cured resin layer placement step of placing a second cured resin layer 4 on one side of the base material 3 in the thickness direction, and a conductive layer placement step of placing a conductive layer 5 on one side of the second cured resin layer 4 in the thickness direction. In this manufacturing method, each layer is placed sequentially, for example, using a roll-to-roll method.

[0191] [Base material preparation process] In the substrate preparation step, the substrate 3 is prepared as shown in Figure 6A.

[0192] [Second cured resin layer placement process] In the second cured resin layer placement step, as shown in Figure 6B, the second cured resin layer 4 is placed on one side in the thickness direction of the substrate 3 using the same procedure as the second cured resin layer placement step detailed in the first embodiment described above.

[0193] [Conductive layer placement process] In the conductive layer placement process, as shown in Figure 6C, the conductive layer 5 is placed on one side in the thickness direction of the second cured resin layer 4 using the same procedure as the conductive layer placement process detailed in the first embodiment described above.

[0194] Based on the above, the laminated body 1 for the detection plate is manufactured.

[0195] 4. Laminate for transport The conveying laminate is a laminate that can be conveyed using a roll-to-roll method.

[0196] Such a transport laminate comprises at least a base material 3 and a conductive layer 5.

[0197] In detail, in the first embodiment, the transport laminate comprises a first cured resin layer 2, a base material 3, a second cured resin layer 4, and a conductive layer 5, arranged in order toward one side in the thickness direction.

[0198] In the second embodiment, the transport laminate comprises a transport support layer, a first cured resin layer 2, a base material 3, a second cured resin layer 4, and a conductive layer 5, arranged in order toward one side in the thickness direction.

[0199] In the third embodiment, the transport laminate comprises a base material 3, a second cured resin layer 4, and a conductive layer 5, arranged in order toward one side in the thickness direction.

[0200] The thickness of the conveying laminate is, for example, 1000 μm or less, preferably 300 μm or less, more preferably 250 μm or less, from the viewpoint of handling, and also, for example, 100 μm or more, preferably 130 μm or more.

[0201] 5. Inspection plate The inspection plate 20 will be described with reference to Figure 7. In the following description, the inspection plate 20 obtained using the detection plate laminate 1 of the first embodiment will be described in detail.

[0202] The detection plate laminate 1 is used in the manufacture of the inspection plate 20. Specifically, the detection plate 20 is obtained by patterning the conductive layer 5 in the detection plate laminate 1 by a known method. Specifically, two electrodes 21 facing each other with a gap between them are formed as a pattern on the conductive layer 5.

[0203] In other words, the inspection plate 20 is provided with a first cured resin layer 2, a substrate 3, a second cured resin layer 4, and two electrodes 21 in order toward one side in the thickness direction.

[0204] The detection plate 20 is then used to detect dielectric particles using the phase difference observation method. The method for detecting dielectric particles using the phase difference observation method with the detection plate 20 will be described in detail below.

[0205] In this method, first, a test solution is delivered between two electrodes 21. The test solution contains dielectric particles. Examples of dielectric particles include bacteria and microorganisms.

[0206] Next, a voltage is applied to the detection plate 20 to cause electrophoresis of the dielectric particles contained in the test solution. The electrophoretically dispersed dielectric particles gradually localize near the electrodes (electrophoretic concentration). Then, the test solution is pumped until the dielectric particles reach a predetermined amount.

[0207] Dielectric particles are typically about 1 μm in size, making them difficult to observe with an optical microscope (phase contrast observation method). However, by using this method to concentrate the dielectric particles by electrophoresis to a predetermined amount, the dielectric particles can be observed even with an optical microscope (phase contrast observation method).

[0208] Subsequently, the dielectric particles are observed using the phase difference observation method.

[0209] 6. Effects In the detection plate laminate 1, the air interface 10 is located at a distance of 130 μm or more from the other side in the thickness direction of the conductive layer 5. Therefore, when detecting dielectric particles using the phase difference observation method, the detection of noise originating from the air interface 10 can be suppressed, and the detection accuracy of dielectric particles can be improved.

[0210] More specifically, when detecting dielectric particles using the phase difference observation method, noise originating from the air interface 10 may be detected (specifically, black haze originating from scratches, black haze originating from antiblocking particles, black haze originating from defects such as foreign matter contamination, black haze originating from scratches, and black haze originating from voids caused by the substrate 3).

[0211] Specifically, to detect dielectric particles using phase contrast observation, the objective lens 22 of the optical microscope is focused on the space 23 between the two electrodes 21, as shown in Figure 8A.

[0212] In this case, the field of view of the optical microscope extends from the focal point to the other side in the thickness direction (in Figure 8A, the field of view of the optical microscope is shown by a dashed line). If the air interface 10 is located less than 130 μm from the other side in the thickness direction of the conductive layer 5 toward the other side in the thickness direction, the air interface 10 is included within the field of view of the optical microscope. Consequently, when detecting dielectric particles using phase contrast observation, noise originating from the air interface 10 is detected. As a result, the detection accuracy of dielectric particles decreases.

[0213] On the other hand, as shown in Figure 8B, in the detection plate laminate 1, the air interface 10 is located at a distance of 130 μm or more from the other side in the thickness direction of the conductive layer 5. As a result, the air interface 10 is not included in the field of view of the optical microscope (dashed line portion in Figure 8B). This makes it possible to suppress the detection of noise originating from the air interface 10 when detecting dielectric particles using the phase contrast observation method. Consequently, the detection accuracy of dielectric particles can be improved.

[0214] In particular, when detecting dielectric particles using the phase contrast observation method, the detection accuracy of dielectric particles can be further improved at the typical microscope magnification (observation magnification) of 200x.

[0215] 7. Variations In the modified examples, the same reference numerals are used for components and processes as in the first to third embodiments, and their detailed descriptions are omitted. Furthermore, the modified examples can achieve the same effects and advantages as the first to third embodiments, unless otherwise specified. Moreover, the first to third embodiments and their modified examples can be combined as appropriate.

[0216] As shown in Figure 9, the substrate 3 may also be provided with an easy-adhesion layer 24 on one side in the thickness direction and / or the other side in the thickness direction, from the viewpoint of improving adhesion.

[0217] The easy-adhesion layer 24 contains a matrix resin and particles.

[0218] Examples of matrix resins include hydrophilic cellulose derivatives, polyvinyl alcohol compounds, hydrophilic polyester compounds, polyvinyl compounds, (meth)acrylic acid compounds, epoxy compounds, polyurethane compounds, and natural polymer compounds.

[0219] Examples of particles include those similar to the antiblocking particles mentioned in the first curing resin composition.

[0220] The thickness of the easy-adhesion layer 24 is, for example, 0.01 μm or more, preferably 0.05 μm or more, and for example, 5 μm or less, preferably 1 μm or less.

[0221] In the first to third embodiments, the detection plate laminate 1 includes a second cured resin layer 4, but the detection plate laminate 1 may also be provided without the second cured resin layer 4. In such cases, the detection plate laminate 1 of the first embodiment comprises a first cured resin layer 2, a base material 3, and a conductive layer 5 in order toward one side in the thickness direction. The detection plate laminate 1 of the second embodiment comprises an embedded layer 6, a first cured resin layer 2, a base material 3, and a conductive layer 5 in order toward one side in the thickness direction. The detection plate laminate 1 of the third embodiment comprises a base material 3 and a conductive layer 5 in order toward one side in the thickness direction.

[0222] In the second embodiment, the case in which the support layer 7 in the buried layer 6 is a transport support layer and each layer is arranged sequentially in a roll-to-roll manner was described in detail. However, when the support layer 7 in the buried layer 6 is a non-transport support layer, the layers other than the buried layer 6 are arranged in a roll-to-roll manner to manufacture a transport laminate (specifically, a transport laminate (roll-shaped) having the first cured resin layer 2, the base material 3, the second cured resin layer 4, and the conductive layer 5 arranged sequentially toward one side in the thickness direction), and after this transport laminate is unwound, the buried layer 6 is arranged.

[0223] Furthermore, in such cases, the timing of placing the buried layer 6 is not particularly limited as long as it is after the transport laminate has been manufactured. For example, the buried layer 6 may be placed when the dielectric particles are detected by phase difference observation after the transport laminate has been manufactured.

[0224] Furthermore, when detecting dielectric particles using the phase difference observation method, if the embedded layer 6 is to be placed, the workbench used for the phase difference observation method (specifically, a glass stage) can be used as the support layer 7 for the embedded layer 6, as shown in Figure 10. In such cases, a semi-solid or liquid material such as grease or water can also be used as a substitute for the adhesive layer 8.

[0225] Furthermore, even if the support layer 7 in the buried layer 6 is a transport support layer, it is also possible to use a roll-to-roll method to place layers other than the buried layer 6, manufacture a laminate with layers other than the buried layer 6, and then unwind the roll-shaped laminate to place the buried layer 6.

[0226] Furthermore, in the second embodiment, the uneven portions 11 on other surfaces in the thickness direction of the first cured resin layer 2 are embedded by the embedding layer 6, so that the detection of noise originating from the uneven portions 11 can be suppressed, and as a result, the detection accuracy of dielectric particles can be improved.

[0227] Therefore, the position of the other surface in the thickness direction of the first cured resin layer 2 in the detection plate laminate 1 is not particularly limited. Specifically, the other surface in the thickness direction of the first cured resin layer 2 may be located at a distance of 130 μm or more from the other surface in the thickness direction of the conductive layer 5 toward the other side in the thickness direction, or it may be located at a distance of less than 130 μm from the other surface in the thickness direction of the conductive layer 5 toward the other side in the thickness direction.

[0228] Furthermore, in the detection plate laminate 1 of the first to third embodiments, by interposing another layer (for example, a substrate of the same type as the substrate 3) between the conductive layer 5 and the bottom layer (the layer that becomes the air interface 10), the distance from the air interface 10 to the other surface in the thickness direction of the conductive layer 5 can be adjusted to 130 μm or more.

[0229] In the third embodiment, the base material 3, the second cured resin layer 4, and the conductive layer 5 are arranged in order toward one side in the thickness direction, but an embedded layer 6 may also be provided on the other side in the thickness direction of the base material 3 (fourth embodiment).

[0230] In other words, in the fourth embodiment, the detection plate laminate 1 comprises an embedded layer 6, a base material 3, a second cured resin layer 4, and a conductive layer 5 in order toward one side in the thickness direction. The air interface 10 is the other side in the thickness direction of the embedded layer 6.

[0231] Furthermore, the embedded layer 6 embeds the uneven portions of the base material 3 on the other side in the thickness direction on one side in the thickness direction.

[0232] Furthermore, the thickness of the base material 3 can be made thinner than the thickness of the base material 3 described in the first embodiment. Specifically, in the fourth embodiment, since the detection plate laminate 1 includes an embedded layer 6, the distance from the air interface 10 to the other surface in the thickness direction of the conductive layer 5 can be increased by the thickness of the embedded layer 6. Therefore, it can be made thinner than the thickness of the base material 3 compared to the first embodiment which does not include an embedded layer 6.

[0233] The thickness of the base material 3 is, for example, 10 μm or more, preferably 100 μm or more, and for example, 2000 μm or less, preferably 1000 μm or less, and more preferably 300 μm or less.

[0234] According to this fourth embodiment, similar to the second embodiment, when detecting dielectric particles by the phase difference observation method, the detection of noise originating from the air interface 10 can be suppressed. As a result, the detection accuracy of dielectric particles can be improved.

[0235] In the first and second embodiments, the first cured resin layer 2 contains antiblocking particles, and the uneven portions 11 are caused by the antiblocking particles. However, the first cured resin layer 2 does not necessarily have to contain antiblocking particles. In such cases, the uneven portions 11 are caused by defects such as foreign matter contamination and scratches on other surfaces in the thickness direction of the first cured resin layer 2.

[0236] In the second embodiment, the embedding layer placement step is performed after the second cured resin layer placement step and the conductive layer placement step, but the embedding layer placement step may also be performed before the second cured resin layer placement step and / or the conductive layer placement step.

[0237] Preferably, in the second cured resin layer placement step and the conductive layer placement step, the embedded layer placement step is carried out after the second cured resin layer placement step and the conductive layer placement step, from the viewpoint of requiring transportability.

[0238] Furthermore, the above description details the cases where the air interface 10 is on another surface in the thickness direction of the first cured resin layer 2 (first embodiment), where the air interface 10 is on another surface in the thickness direction of the embedded layer 6 (second embodiment), and where the air interface 10 is on another surface in the thickness direction of the substrate 3 (third embodiment), but is not limited to these. Specifically, in the detection plate laminate 1, the layers constituting the air interface 10 are not limited as long as the air interface 10 is located at a distance of 130 μm or more from another surface in the thickness direction of the conductive layer 5 toward the other side in the thickness direction. [Examples]

[0239] The present invention will be further described below with reference to examples and comparative examples. However, the present invention is not limited in any way to the examples and comparative examples. Furthermore, specific numerical values ​​such as blending ratios (content ratios), physical properties, and parameters used in the following description may be replaced with the corresponding upper limits (numerical values ​​defined as "less than or equal to" or "less than") or lower limits (numerical values ​​defined as "greater than or equal to" or "greater than or equal to") of the blending ratios (content ratios), physical properties, and parameters described in the "Modes for Carrying Out the Invention" above.

[0240] <Manufacturing of laminates for detection plates> Example 1 Each layer was arranged sequentially using a roll-to-roll method. [Base material preparation process] As a base material, a polyethylene terephthalate (PET) film (149 μm thick, with an easy-adhesion layer on one side and the other side in the thickness direction, manufactured by Toray) was prepared.

[0241] [First cured resin layer placement process] A methyl isobutyl ketone solution of the first cured resin composition varnish (87 parts by mass of UV-curable acrylic urethane resin composition (product name "Aica Aitron Z844-22-HL", manufactured by Aica Kogyo) and 13 parts by mass of silica particles with an average particle size (D50) of 30 nm (product name "CSZ9281", manufactured by CIK Nanotech)) was applied to the other surface in the thickness direction of the substrate and dried to obtain a coating film. Next, the coating film was cured by irradiating it with ultraviolet light in an atmospheric environment. As a result, a first cured resin layer (thickness 1 μm) was placed on the other surface in the thickness direction of the substrate.

[0242] [Second cured resin layer placement process] A second curing resin composition (an ultraviolet-curable resin composition solution containing urethane acrylate in which pentaerythritol tetraacrylate-derived units are modified by isophorone diisocyanate, and zirconia particles with an average particle size (D50) of 40 nm (66% by mass of non-volatile components)) was applied to one side of the substrate in the thickness direction and dried to obtain a coating film. Next, the coating film was cured by irradiating it with ultraviolet light in an atmospheric environment. As a result, a second curing resin layer (thickness 1 μm) was formed on one side of the substrate in the thickness direction.

[0243] [Conductive layer placement process] A conductive layer was placed on one side in the thickness direction of the second cured resin layer using the sputtering method.

[0244] Specifically, a roll-to-roll sputtering system (a winding-type DC magnetron sputtering system) is used. After evacuating the deposition chamber of the sputtering system, argon gas is introduced into the deposition chamber as the sputtering gas, and the atmospheric pressure inside the deposition chamber is set to 3.0 × 10⁻⁶. -3 The Torr value was set to 2.0 m / min. A copper target was used as the target material. A DC power supply was used to apply voltage to the target. The output of the DC power supply was set to 3.7 kW. The film deposition temperature (temperature of the substrate on which the second curing resin layer is placed) was set to 40°C.

[0245] As a result, a conductive layer (copper layer, 100 nm) was placed on one side in the thickness direction of the second cured resin layer. The laminate for the detection plate was then manufactured.

[0246] Example 2 A laminate for the detection plate was manufactured based on the same procedure as in Example 1. However, in the substrate preparation step, a polyethylene terephthalate (PET) film (188 μm thick, with an easy-adhesion layer on one side in the thickness direction and the other side in the thickness direction, manufactured by Toray) was prepared as the substrate.

[0247] Example 3 Each layer was arranged sequentially using a roll-to-roll method. [Base material preparation process] As a base material, a polyethylene terephthalate (PET) film (125 μm thick, with an easy-adhesion layer on one side in the thickness direction and the other side in the thickness direction, manufactured by Toray) was prepared.

[0248] [First cured resin layer placement process] A first cured resin layer (1 μm thick) was placed on the other side of the substrate in the thickness direction, following the same procedure as in Example 1.

[0249] [Second cured resin layer placement process] A second cured resin layer (1 μm thick) was placed on one side of the substrate in the thickness direction, following the same procedure as in Example 1.

[0250] [Conductive layer placement process] A conductive layer (copper layer, 100 nm) was placed on one side in the thickness direction of the second cured resin layer, following the same procedure as in Example 1.

[0251] [Buried layer placement process] An embedded layer was prepared by sequentially arranging a cycloolefin polymer film (100 μm, manufactured by Zeon Corporation) and an adhesive layer (25 μm) toward one side in the thickness direction. Next, the embedded layer was attached to the other side in the thickness direction of the first cured resin layer via the adhesive layer. A laminate for detection plates was then manufactured.

[0252] Example 4 A laminate for detection plates was manufactured based on the same procedure as in Example 1. However, in the embedded layer placement process, an embedded layer was used which consisted of an antiblocking layer (1 μm), a cycloolefin polymer film (100 μm, manufactured by Zeon Corporation), and an adhesive layer (25 μm) arranged sequentially on one side in the thickness direction. The antiblocking layer was formed by applying a methyl isobutyl ketone solution of 87 parts by mass of an ultraviolet-curable acrylic urethane resin composition (product name "Aica Aitron Z844-22-HL", manufactured by Aica Kogyo Co., Ltd.) and 13 parts by mass of silica particles with an average particle size (D50) of 30 nm (product name "CSZ9281", manufactured by CIK Nanotech Co., Ltd.) to the other side in the thickness direction of the cycloolefin polymer film, drying it to obtain a coating film, and then curing the coating film by irradiating it with ultraviolet light in an atmospheric environment.

[0253] Example 5 A laminate for the detection plate was manufactured based on the same procedure as in Example 1. However, in the embedded layer placement step, an embedded layer was used which consisted of a microscope slide glass (1.2 mm) and an adhesive layer (25 μm) arranged sequentially on one side in the thickness direction.

[0254] Comparative Example 1 A laminate for the detection plate was manufactured based on the same procedure as in Example 1. However, in the substrate preparation step, a polyethylene terephthalate (PET) film (125 μm thick, with an easy-adhesion layer on one side in the thickness direction and the other side in the thickness direction, manufactured by Toray) was prepared as the substrate.

[0255] <Distance from the air interface to the other surface in the thickness direction of the conductive layer> The distance from the air interface to other surfaces in the thickness direction of the conductive layer was calculated as the total thickness of the layers other than the conductive layer. The results are shown in Table 1. <Test accuracy testing> For each example and comparative example, the conductive layer was removed from the laminated body used for the detection plate, and a test specimen was prepared.

[0256] For the test piece, using a microscope capable of phase difference observation (product name: "BX51", manufactured by Olympus), the image was observed by the phase difference observation method with the focus adjusted to one side in the thickness direction of the second cured resin layer.

[0257] The magnification of the microscope (observation magnification) was set to 200 times. As the objective lens in the microscope, a phase difference objective lens (20x magnification) with a phase difference plate was used. The results are shown in FIGS. 11 to 16.

[0258] Also, regarding the inspection accuracy, evaluation was performed based on the following criteria. The results are shown in Table 1. (Criteria) ◎: No black haze was observed. 〇: A slight amount of black haze was observed. ×: Clear black haze was observed.

[0259] <Discussion> In Examples 1 to 5 where the distance from the air interface to the other side in the thickness direction of the conductive layer is 130 μm or more, in the inspection accuracy test, photos where no black haze was observed or photos where a slight amount of black haze was observed were obtained. From such photos, it can be seen that when detecting dielectric particles by the phase difference observation method, the detection accuracy of the dielectric particles is not excessively reduced.

[0260] On the other hand, in Comparative Example 1 where the distance from the air interface to the other side in the thickness direction of the conductive layer is less than 130 μm, in the inspection accuracy test, a photo where clear black haze was observed was obtained. From such a photo, it can be seen that when detecting dielectric particles by the phase difference observation method, the detection accuracy of the dielectric particles is excessively reduced.

Table 1

Explanation of Reference Signs

[0261] 1 Laminated body for detection plate 2 First cured resin layer 3 Base material 5 Conductive layer 6. Buried layer 10 Air interface 11 Uneven part 20 detection plates

Claims

1. A laminate for a detection plate used in a detection plate for detecting dielectric particles by phase difference observation method, The substrate and the conductive layer are arranged sequentially toward one side in the thickness direction. The laminate for the detection plate has an air interface on the far other side in the thickness direction, The air interface is located at a distance of 130 μm or more from the other surface in the thickness direction of the conductive layer toward the other side in the thickness direction. The substrate is provided with a cured resin layer on the other side in the thickness direction, The other surface in the thickness direction of the cured resin layer has an uneven portion, The air interface is the other surface in the thickness direction of the cured resin layer, in the laminate for the detection plate.

2. The cured resin layer contains antiblocking particles, The aforementioned uneven portion is due to the antiblocking particles, as described in claim 1 for the detection plate laminate.

3. A laminate for a detection plate used in a detection plate for detecting dielectric particles by phase difference observation method, The substrate and the conductive layer are arranged sequentially toward one side in the thickness direction. The laminate for the detection plate has an air interface on the far other side in the thickness direction, The air interface is located at a distance of 130 μm or more from the other surface in the thickness direction of the conductive layer toward the other side in the thickness direction. On the other side of the substrate in the thickness direction, a cured resin layer and an embedded layer are provided in order toward the other side in the thickness direction. The other surface in the thickness direction of the cured resin layer has an uneven portion, The aforementioned buried layer buries the uneven portion on one side in the thickness direction, The aforementioned air interface is the other surface in the thickness direction of the embedded layer, in the laminate for the detection plate.

4. The cured resin layer contains antiblocking particles, The aforementioned uneven portion is due to the antiblocking particles, as described in claim 3 for the laminated detection plate.

5. At least the substrate and the conductive layer constitute a transport laminate, The laminate for detection plates according to any one of claims 1 to 4, wherein the thickness of the conveying laminate is 300 μm or less.

Images