Method for testing the operation of integrated circuits

Abstract

To provide a control circuit board that can facilitate the external attachment work of analyzers via a group of pads.SOLUTION: A control circuit board 10 includes: a board 12; an integrated circuit 16 provided on one principal surface (front 14) of the board 12 and having a communication interface; and a group of pads 34 that are electrically connected to the communication interface via through holes 26 and 28 formed in the board 12 and densely arranged in one place of the other principal surface (rear 30) of the board 12.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a control circuit board.

Background Art

[0002] For example, with respect to a control circuit board on which an integrated circuit is mounted, test pads may be added on the board so that the operation test of the integrated circuit can be easily performed using an external analysis device.

[0003] FIG. 4 is a diagram illustrating the arrangement of pads in a conventional control circuit board 1. This control circuit board 1 includes a board 2 and a plurality of electronic components 3, 4, 5 provided on the main surface of the board 2. On the main surface of the board 2, a plurality of pads 6 are provided so as to avoid the positions of the plurality of electronic components 3 to 5.

Summary of the Invention

Problems to be Solved by the Invention

[0004] However, in the control circuit board 1 shown in FIG. 4, since the plurality of pads 6 are dispersedly arranged, the work hours for fixing the external connection terminals to the respective pads 6 are increased.

[0005] The present invention has been made in view of such problems, and an object thereof is to provide a control circuit board capable of easily performing the external attachment work of an analysis device via a pad group.

Means for Solving the Problems

[0006] The control circuit board according to the first aspect of the present invention includes a board, an integrated circuit provided on one main surface of the board, and a pad group that is electrically connected to the integrated circuit via a through hole formed in the board and is densely arranged at one location on the other main surface of the board.

[0007] In the control circuit board according to the second aspect of the present invention, a protective film having insulating properties is removably coated on the pad group.

[0008] In the control circuit board according to the third aspect of the present invention, the plurality of pads constituting the pad group extend in one direction and are arranged at equal intervals along a direction perpendicular to the one direction.

[0009] In the control circuit board according to the fourth aspect of the present invention, the integrated circuit is a touch IC that has a communication interface for communicating with an external device and controls the driving of a touch sensor, and the group of pads is used to perform operational tests of the touch IC via the communication interface. [Effects of the Invention]

[0010] According to the present invention, the external attachment of an analysis device via a group of pads can be easily performed. [Brief explanation of the drawing]

[0011] [Figure 1] This is a front view of the control circuit board in one embodiment of the present invention. [Figure 2] This is a partially enlarged view showing the back of the control circuit board in Figure 1. [Figure 3] This diagram shows the state of connecting a flat cable to the control circuit board in Figure 2. [Figure 4] This diagram illustrates the arrangement of pads in a conventional control circuit board. [Modes for carrying out the invention]

[0012] Embodiments of the present invention will be described below with reference to the attached drawings. To facilitate understanding of the description, the same reference numerals are used for the same components in each drawing whenever possible, and redundant explanations are omitted. It should be noted that the present invention is not limited to the following embodiments, and can be freely modified without departing from the spirit of the invention.

[0013] [composition] Figure 1 is a front view of a control circuit board 10 in one embodiment of the present invention. The control circuit board 10 is connected to a capacitive touch sensor (not shown) and is configured to detect the position indicated on the touch surface by the user's finger or stylus. Note that the object to be controlled is not limited to the touch sensor, but may be a sensor of various detection methods, various electronic components, or electronic devices.

[0014] The control circuit board 10 has a roughly rectangular substrate 12 that is elongated in one direction. One main surface of the substrate 12 (hereinafter referred to as the "front surface 14") is provided with an integrated circuit 16, electronic components 18, 20, and connectors 22, 24. The integrated circuit 16 is a touch IC (Integrated Circuit) that has a communication interface for communicating with external devices and performs drive control of the touch sensor and synchronization control of the touch pen through the execution of firmware. Connector 22 is configured to be connectable to the X-axis cable of the touch sensor. Connector 24 is configured to be connectable to the Y-axis cable of the touch sensor.

[0015] Through-holes 26 and 28, with copper plating on their inner walls, are formed at the corners of the substrate 12. The integrated circuit 16 is connected to the through-holes 26 and 28 via printed wiring (not shown). This allows connection to the integrated circuit 16 from the other main surface of the substrate 12 (hereinafter referred to as the "back surface 30").

[0016] Figure 2 is a partially enlarged view showing the back surface 30 of the control circuit board 10 in Figure 1. The back surface 30 of the board 12 is provided with a collection of pads 32 (hereinafter referred to as "pad group 34") and a collection of lead wires connected to one end of each pad 32 (hereinafter referred to as "leader wire group 36").

[0017] The pad group 34 is used to perform operational tests of the integrated circuit 16 via the communication interface of the integrated circuit 16. The pad group 34 is densely arranged in one location on the back surface 30. The multiple pads 32 constituting the pad group 34 extend in the direction of the short side of the substrate 12 and are arranged at equal intervals along the direction of the long side of the substrate 12.

[0018] The other end of each lead wire constituting the lead wire group 36 is connected to the through hole 26 described above. Thereby, the pad group 34 is electrically connected to the integrated circuit 16 via the through hole 26. An insulating protective film 38 is coated on the pad group 34 and the lead wire group 36. This protective film 38 can be removed by physical treatment, chemical treatment, or the like.

[0019] [Operation and Effect] The control circuit board 10 in this embodiment is configured as described above. Subsequently, the operation and effect of the control circuit board 10 will be described while referring to FIG. 3. This operation test may be performed at any of the following timings: [1] during analysis of a product with a defect after shipment, [2] during operation confirmation before product shipment, and [3] during debugging in firmware development.

[0020] FIG. 3 is a diagram showing a state in which a flat cable 40 is connected to the control circuit board 10 of FIG. 2. This flat cable 40 is a flexible connection cable for connecting an analysis device (not shown) to the control circuit board 10. The flat cable 40 has a connection terminal group arranged at the same pitch as the pitch of the pads 32 on its tip side.

[0021] [[ID=J17]]First, the operator removes a part of the protective film 38 provided on the back surface 30 of the control circuit board 10 to expose the pad group 34 to the outside. Then, after positioning the flat cable 40, the operator crimps the connection terminal group of the flat cable 40 to the pad group 34. As a result, the connection terminal group of the flat cable 40 is simultaneously fixed to all the pads 32 constituting the pad group 34, so that it can be easily connected to an external analysis device. Then, by pulling out the flat cable <J40> outside the electronic device while incorporating the control circuit board 10 into the electronic device, the operator can perform an operation test of the integrated circuit 16 in a state close to the actual operation environment of the electronic device.

[0022] Note that the specifications of the pad group 34 (specifically, the number, width, length, pitch, etc. of the pads 32) may vary or be common depending on the type of touch sensor, touch pen, or electronic device. In particular, by standardizing the specifications of the pad group 34, the convenience during testing is enhanced.

[0023] As described above, the control circuit board 10 includes the board 12, the integrated circuit 16 provided on the front surface 14 of the board 12, and the pad group 34 that is electrically connected to the integrated circuit 16 via the through holes 26 and 28 formed in the board 12 and is densely arranged at one location on the back surface 30 of the board 12.

[0024] In this way, by using the back surface 30 with a relatively low integration density compared to the front surface 14 where the integrated circuit 16 is provided and densely arranging a plurality of pads 32 at one location, it becomes easier to simultaneously fix two or more pads 32 to an external connection terminal (in the example of FIG. 3, the flat cable 40). As a result, compared to the case where the pads 32 are dispersedly arranged at multiple locations, the external attachment work of the analysis device via the pad group 34 becomes easier.

[0025] Also, a protective film 38 having insulating properties may be removably coated on the pad group 34. Thereby, malfunctions of the integrated circuit 16, etc., which may occur through contact with conductive components of the electronic device in which the control circuit board 10 is incorporated, are suppressed. Also, by removing the protective film 38 as needed, the pad group 34 can be used in a timely manner.

[0026] Also, the plurality of pads 32 constituting the pad group 34 may extend in one direction (one side direction of the board 12) and be arranged at equal intervals along the direction perpendicular to the one direction (the other side direction of the board 12). Thereby, it is possible to easily connect to an external analysis device via a flat cable 40 having a connection terminal group arranged at the same pitch as the pitch of the pads 32.

[0027] Furthermore, the integrated circuit 16 has a communication interface for communicating with external devices and is a touch IC that controls the drive of the touch sensor. The pad group 34 is used to perform operational tests of the touch IC via the communication interface. This makes it easier to perform operational tests of the touch sensor.

[0028] [Explanation of symbols] 10...Control circuit board, 12...Board, 14...Front (one main side), 16...Integrated circuit, 26, 28...Through-hole, 30...Back (the other main side), 32...Pad, 34...Pad group, 36...Leader wire group, 38...Protective film, 40...Flat cable

Claims

[Claim 1] Regarding an electronic device having a capacitive touch sensor, a method for testing the operation of an integrated circuit mounted on a control circuit board incorporated into the electronic device, The control circuit board comprises a substrate, an integrated circuit provided on one main surface of the substrate and having a communication interface for communicating with an analysis device located outside the electronic device, and for controlling the drive of the touch sensor, and a group of pads electrically connected to the integrated circuit via through-holes formed in the substrate and densely arranged at one location on the other main surface of the substrate. The aforementioned pad group is covered with an insulating protective film that can be removed, extends in one direction, and consists of a plurality of pads arranged at equal intervals along a direction perpendicular to the aforementioned one direction, and is provided to connect a flat cable having a group of connection terminals arranged at the same pitch as the pitch between the pads by crimping, A step of removing the protective film to expose the pad group to the outside, The process of connecting the control circuit board and the flat cable by crimping the aforementioned group of connection terminals onto the aforementioned group of pads, The steps include: pulling the flat cable out to the outside of the electronic device while the control circuit board is incorporated into the electronic device; The process involves performing an operational test of the integrated circuit using the analysis device while the integrated circuit and the analysis device are connected via the flat cable, A method for testing the operation of an integrated circuit, including [specific details omitted].

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